WO2017102213A1 - Pipette for equipping a circuit card - Google Patents

Pipette for equipping a circuit card Download PDF

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Publication number
WO2017102213A1
WO2017102213A1 PCT/EP2016/077727 EP2016077727W WO2017102213A1 WO 2017102213 A1 WO2017102213 A1 WO 2017102213A1 EP 2016077727 W EP2016077727 W EP 2016077727W WO 2017102213 A1 WO2017102213 A1 WO 2017102213A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
piston
pipette
punched
tubular body
Prior art date
Application number
PCT/EP2016/077727
Other languages
German (de)
French (fr)
Inventor
Christoph Hippin
Robert Müller
Mario Leonhardt
Original Assignee
Endress+Hauser Gmbh+Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress+Hauser Gmbh+Co. Kg filed Critical Endress+Hauser Gmbh+Co. Kg
Priority to CH00761/18A priority Critical patent/CH713419B1/en
Publication of WO2017102213A1 publication Critical patent/WO2017102213A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0405—Solder foil, tape or wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Definitions

  • the invention relates to a pipette for loading a printed circuit board with solder paste.
  • the dosing material adheresive, solder paste
  • stamping tools A direct dispensing station provides a reservoir of dosing material. Dosing is achieved via various process parameters such as the layer thickness of the material reservoir and the shape of the stamping tool. In such a method, the dosing results are influenced untargeted and uncontrolled.
  • the invention has for its object to provide a device for populating a printed circuit board with solder paste, in which the solder paste is precisely metered.
  • the invention relates to a pipette for loading a printed circuit board with solder paste, comprising a rohrformigen body for cutting out a defined portion of the solder paste from a Lotpastendepot, a piston which abuts so to an inner wall of the rohrformigen body, that the tubular body is hermetically sealed, and Means for varying the pressure between the piston and the punched out portion of the solder paste.
  • the means for varying the pressure between the piston and the punched-out part of the solder paste comprises a membrane, which forms an end face of the piston.
  • the means for varying the pressure between the piston and the punched-out part of the solder paste comprises means for moving the piston in the tubular body.
  • the invention likewise provides a method for equipping a printed circuit board with solder paste, in particular by means of a pipette according to one of preceding claims, comprising the steps of cutting out a defined portion of a solder paste from a solder paste deposit,
  • the cutting out of a defined part of a solder paste from a solder paste depot is done by means of the tubular body.
  • the extrusion and / or suction of the punched out part of the solder paste by means of the means for varying the pressure between the piston and the punched-out part of the solder paste happens.
  • the means for varying the pressure between the piston and the punched-out part of the solder paste comprises a membrane which forms an end face of the piston.
  • the means for varying the pressure between the piston and the punched-out part of the solder paste a device for moving the piston in the tubular body.
  • FIGS. 1A-J each show a longitudinal section of a pipette which prunes out a defined part of a solder paste from a solder paste depot (FIGS. 1A-E) and placed on a printed circuit board (FIG. 1 F-J).
  • the pipette has a rohrformigen body 4 for cutting out a defined portion of the solder paste 3 from the Lotpastendepot 5.
  • a piston 6, is so close to one
  • Pipette 1 comprises the following steps. In a first step, the pipette 1 is placed on the surface of a solder paste deposit 5 with the tip ahead (FIG. 1B). The membrane 8 forms the tip of the pipette 1 and is deflected outwards.
  • a second step the tubular body 4 is moved in the direction of the solder paste depot 5 until the solder paste depot 5 is completely pierced (FIG. 1C).
  • the membrane 8 is deflected either mechanically or by means of negative pressure to the inside, so as to generate a negative pressure between the membrane 8 and the surface of the solder paste depot 5 (FIG. 1 D).
  • the pipette 1 is moved in a direction opposite to the solder paste depot 5, so that the pipette 1 stamps out a defined part of the solder paste 3 from the solder paste depot 5 (FIG. 1 E).
  • the pipette 1 is placed tip-first on a surface of a circuit board 2 (Fig. 1F). This is the defined part the solder paste 3 on a solder paste to be covered part of the printed circuit board 2 (Fig. 1 G).
  • FIGS. 2A-H show a longitudinal section of a pipette with a movable piston.
  • a first step the pipette 1 is placed tip-first on a solder paste depot 5 (FIG. 2A).
  • the rohrformige body 4 is moved out until a portion of the solder paste 3 is cut out.
  • a third step the piston 6 is moved in a direction opposite to the part of the solder paste 3 (FIG. 2C). In this way creates a negative pressure between the piston 6 and the part of the solder paste 3. This negative pressure causes the part of the solder paste 3 from the
  • Lotpastendepot 5 dissolves and is received by the pipette 1 (Fig. 2D).

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)

Abstract

The invention relates to a pipette for equipping a circuit card (2) with solder paste (3), said pipette comprising a tubular body (4) for digging out a defined portion of the solder paste (3) from a solder paste supply (5), a plunger (6) which rests against an inner wall (7) of the tubular body (4) in such a way that the tubular body (4) is air-tightly sealed, and means for varying the pressure between the plunger (6) and the dug-out portion of the solder paste (3).

Description

Pipette zum Bestücken einer Leiterkarte  Pipette for loading a printed circuit board
Die Erfindung bezieht sich auf eine Pipette zum Bestücken einer Leiterkarte mit Lotpaste. The invention relates to a pipette for loading a printed circuit board with solder paste.
Beim Pin-Transfer wird das Dosiermaterial (Kleber, Lotpaste) mithilfe von Stempelwerkzeugen aufgetragen. Eine Direkt-Dispens-Station stellt ein Reservoir des Dosiermaterials bereit. Eine Dosierung wird über verschiedene Prozessparameter wie die Schichtdicke des Materialreservoirs und die Form des Stempelwerkzeugs erreicht. Bei solch einem Verfahren werden die Dosierergebnisse ungezielt und unkontrolliert beeinflusst. In the case of pin transfer, the dosing material (adhesive, solder paste) is applied using stamping tools. A direct dispensing station provides a reservoir of dosing material. Dosing is achieved via various process parameters such as the layer thickness of the material reservoir and the shape of the stamping tool. In such a method, the dosing results are influenced untargeted and uncontrolled.
Der Erfindung liegt die Aufgabe zugrunde, eine Vorrichtung zum Bestücken einer Leiterkarte mit Lotpaste bereitzustellen, bei der die Lotpaste genau dosierbar ist. The invention has for its object to provide a device for populating a printed circuit board with solder paste, in which the solder paste is precisely metered.
Die Aufgabe wird durch den Gegenstand der Erfindung gelöst. Gegenstand der Erfindung ist eine Pipette zum Bestücken einer Leiterkarte mit Lotpaste, umfassend einen rohrformigen Körper zum Ausstechen eines definierten Teils der Lotpaste aus einem Lotpastendepot, einen Kolben, welcher dermaßen an eine Innenwandung des rohrformigen Körpers anliegt, dass der rohrförmige Körper luftdicht verschlossen ist, und Mittel zum Variieren des Drucks zwischen dem Kolben und des ausgestochenen Teils der Lotpaste. Gemäß einer vorteilhaften Weiterbildung umfasst das Mittel zum Variieren des Drucks zwischen dem Kolben und dem ausgestochenen Teil der Lotpaste eine Membran, welche eine Stirnfläche des Kolbens bildet. The object is achieved by the subject matter of the invention. The invention relates to a pipette for loading a printed circuit board with solder paste, comprising a rohrformigen body for cutting out a defined portion of the solder paste from a Lotpastendepot, a piston which abuts so to an inner wall of the rohrformigen body, that the tubular body is hermetically sealed, and Means for varying the pressure between the piston and the punched out portion of the solder paste. According to an advantageous development, the means for varying the pressure between the piston and the punched-out part of the solder paste comprises a membrane, which forms an end face of the piston.
Gemäß einer vorteilhaften Variante umfasst das Mittel zum Variieren des Drucks zwischen dem Kolben und dem ausgestochenen Teil der Lotpaste, eine Vorrichtung zum Bewegen des Kolbens in dem rohrformigen Körper. According to an advantageous variant, the means for varying the pressure between the piston and the punched-out part of the solder paste comprises means for moving the piston in the tubular body.
Gegenstand der Erfindung ist ebenfalls ein Verfahren zum Bestücken einer Leiterkarte mit Lotpaste, insbesondere mittels einer Pipette nach einem der vorhergehenden Ansprüche, umfassend die Schritte, Ausstechen eines definierten Teils einer Lotpaste aus einem Lotpastendepot, The invention likewise provides a method for equipping a printed circuit board with solder paste, in particular by means of a pipette according to one of preceding claims, comprising the steps of cutting out a defined portion of a solder paste from a solder paste deposit,
Ansaugen des ausgestochenen Teils der Lotpaste, Platzieren des Aspirate the punched out portion of the solder paste, placing the
ausgestochenen Teils der Lotpaste auf einer Leiterkarte, Auspressen des ausgestochenen Teils der Lotpaste, bis der ausgestochene Teil der Lotpaste an der Leiterkarte anhaftet. punched out part of the solder paste on a printed circuit board, pressing out the punched out part of the solder paste until the punched out part of the solder paste adheres to the printed circuit board.
Gemäß einer vorteilhaften Ausführungsform geschieht das Ausstechen eines definierten Teils einer Lotpaste aus einem Lotpastendepot mittels des rohrförmigen Körpers. According to an advantageous embodiment, the cutting out of a defined part of a solder paste from a solder paste depot is done by means of the tubular body.
Gemäß einer vorteilhaften Ausgestaltung geschieht das Auspressen und/oder Ansaugen des ausgestochenen Teils der Lotpaste mittels der Mittel zum Variieren des Drucks zwischen dem Kolben und des ausgestochenen Teils der Lotpaste. According to an advantageous embodiment, the extrusion and / or suction of the punched out part of the solder paste by means of the means for varying the pressure between the piston and the punched-out part of the solder paste happens.
Gemäß einer günstigen Weiterbildung umfasst das Mittel zum Variieren des Drucks zwischen dem Kolben und dem ausgestochenen Teil der Lotpaste eine Membran, welche eine Stirnfläche des Kolbens bildet. According to a favorable development, the means for varying the pressure between the piston and the punched-out part of the solder paste comprises a membrane which forms an end face of the piston.
Gemäß einer günstigen Variante umfasst das Mittel zum Variieren des Drucks zwischen dem Kolben und dem ausgestochenen Teil der Lotpaste, eine Vorrichtung zum Bewegen des Kolbens in dem rohrförmigen Körper. According to a favorable variant, the means for varying the pressure between the piston and the punched-out part of the solder paste, a device for moving the piston in the tubular body.
Die Erfindung wird anhand der nachfolgenden Zeichnungen näher erläutert. Es zeigt: The invention will be explained in more detail with reference to the following drawings. It shows:
Fig. 1 A - J: einen Längsschnitt einer Pipette mit einer Membran als Stirnfläche des Kolbens, die einen definierten Teil einer Lotpaste aus einem 1 A - J: a longitudinal section of a pipette with a membrane as the end face of the piston, the one defined part of a solder paste from a
Lotpastendepot aussticht und auf einer Leiterkarte platziert, und Fig. 2A - H: einen Längsschnitt einer Pipette mit einem beweglichen Kolben, die einen definierten Teil einer Lotpaste aus einem Lotpastendepot aussticht und auf einer Leiterkarte platziert. Stamped out solder paste deposit and placed on a circuit board, and 2A-H: a longitudinal section of a pipette with a movable piston, the punched out a defined part of a solder paste from a Lotpastendepot and placed on a printed circuit board.
Fig. 1 A - J zeigen jeweils einen Längsschnitt einer Pipette, die einen definierten Teil einer Lotpaste aus einem Lotpastendepot aussticht (Fig. 1A - E) und auf einer Leiterkarte platziert (Fig. 1 F - J). Die Pipette weist einen rohrformigen Körper 4 zum Ausstechen eines definierten Teils der Lotpaste 3 aus dem Lotpastendepot 5 auf. Ein Kolben 6, liegt dermaßen an eine FIGS. 1A-J each show a longitudinal section of a pipette which prunes out a defined part of a solder paste from a solder paste depot (FIGS. 1A-E) and placed on a printed circuit board (FIG. 1 F-J). The pipette has a rohrformigen body 4 for cutting out a defined portion of the solder paste 3 from the Lotpastendepot 5. A piston 6, is so close to one
Innenwandung 7 des rohrformigen Körpers 4 an, dass der rohrformige Körper 4 luftdicht verschlossen ist. Eine Membran 8 bildet eine Stirnfläche des Kolbens 6 (Fig. 1A). Das Verfahren zum Bestücken der Leiterkarte 2 mit Lotpaste 3 mittels der Inner wall 7 of the rohrformigen body 4 that the rohrformige body 4 is hermetically sealed. A diaphragm 8 forms an end face of the piston 6 (FIG. 1A). The method for loading the circuit board 2 with solder paste 3 by means of
Pipette 1 umfasst die nachfolgenden Schritte. In einem ersten Schritt wird die Pipette 1 auf der Oberfläche eines Lotpastendepots 5 mit der Spitze voran platziert (Fig. 1 B). Die Membran 8 bildet die Spitze der Pipette 1 und ist nach Außen ausgelenkt. Pipette 1 comprises the following steps. In a first step, the pipette 1 is placed on the surface of a solder paste deposit 5 with the tip ahead (FIG. 1B). The membrane 8 forms the tip of the pipette 1 and is deflected outwards.
In einem zweiten Schritt wird der rohrformigen Körper 4 in Richtung des Lotpastendepots 5 gefahren, bis das Lotpastendepot 5 ganz durchstochen ist (Fig. 1 C). In einem dritten Schritt wird die Membran 8 entweder mechanisch oder mittels Unterdruck nach Innen ausgelenkt, um so einen Unterdruck zwischen der Membran 8 und der Oberfläche des Lotpastendepots 5 zu erzeugen (Fig. 1 D). In a second step, the tubular body 4 is moved in the direction of the solder paste depot 5 until the solder paste depot 5 is completely pierced (FIG. 1C). In a third step, the membrane 8 is deflected either mechanically or by means of negative pressure to the inside, so as to generate a negative pressure between the membrane 8 and the surface of the solder paste depot 5 (FIG. 1 D).
In einem vierten Schritt wird die Pipette 1 in einer dem Lotpastendepot 5 entgegengesetzten Richtung bewegt, so dass die Pipette 1 einen definierten Teil der Lotpaste 3 von dem Lotpastendepot 5 aussticht (Fig. 1 E). In a fourth step, the pipette 1 is moved in a direction opposite to the solder paste depot 5, so that the pipette 1 stamps out a defined part of the solder paste 3 from the solder paste depot 5 (FIG. 1 E).
In einem fünften Schritt wird die Pipette 1 mit der Spitze voran auf einer Oberfläche einer Leiterkarte 2 platziert (Fig. 1 F). Dabei liegt das definierte Teil der Lotpaste 3 an einem mit Lotpaste zu bedeckenden Teil der Leiterkarte 2 (Fig. 1 G). In a fifth step, the pipette 1 is placed tip-first on a surface of a circuit board 2 (Fig. 1F). This is the defined part the solder paste 3 on a solder paste to be covered part of the printed circuit board 2 (Fig. 1 G).
Fig. 2A - H zeigen ein Längsschnitt einer Pipette mit einem beweglichen Kolben. FIGS. 2A-H show a longitudinal section of a pipette with a movable piston.
In einem ersten Schritt wird die Pipette 1 mit der Spitze voran auf einem Lotpastendepot 5 platziert (Fig. 2A). In einem zweiten Schritt wird der rohrformige Körper 4 herausgefahren, bis ein Teil der Lotpaste 3 herausgestochen ist. In a first step, the pipette 1 is placed tip-first on a solder paste depot 5 (FIG. 2A). In a second step, the rohrformige body 4 is moved out until a portion of the solder paste 3 is cut out.
In einem dritten Schritt wird der Kolben 6 in einer dem Teil der Lotpaste 3 entgegengesetzten Richtung bewegt (Fig. 2C). Auf diese Weise entsteht ein Unterdruck zwischen dem Kolben 6 und dem Teil der der Lotpaste 3. Dieser Unterdruck führt dazu, dass das Teil der Lotpaste 3 sich von dem In a third step, the piston 6 is moved in a direction opposite to the part of the solder paste 3 (FIG. 2C). In this way creates a negative pressure between the piston 6 and the part of the solder paste 3. This negative pressure causes the part of the solder paste 3 from the
Lotpastendepot 5 löst und von der Pipette 1 aufgenommen wird (Fig. 2D). Lotpastendepot 5 dissolves and is received by the pipette 1 (Fig. 2D).
In einem vierten Schritt wird die Pipette 1 mit der Spitze voran auf eine In a fourth step, the pipette 1 is headed with the tip on one
Leiterkarte 2 platziert (Fig. 2E und F). In einem fünften Schritt wird der Kolben 6 in Richtung des Teils der Lotpaste 3 bewegt, bis ein Überdruck zwischen dem Kolben 6 und dem Teil der Lotpaste 3 entsteht. Dieser Überdruck führt dazu, dass das Teil der Lotpaste 3 von der Pipette 1 gelöst wird und gegen die Leiterkarte 2 gepresst wird, bis die Lotpaste 3 an der Leiterkarte 2 anhaftet. PCB 2 (Figures 2E and F). In a fifth step, the piston 6 is moved in the direction of the part of the solder paste 3 until an overpressure arises between the piston 6 and the part of the solder paste 3. This overpressure causes the part of the solder paste 3 is released from the pipette 1 and is pressed against the circuit board 2 until the solder paste 3 adheres to the circuit board 2.
Bezugszeichenliste Pipette List of Reference Pipette
Leiterkarte PCB
Lotpaste solder paste
Körper body
Lotpastendepot solder paste
Kolben piston
Innenwandung inner wall
Membran membrane

Claims

Patentansprüche claims
1 . Pipette zum Bestücken einer Leiterkarte (2) mit Lotpaste (3), umfassend einen rohrförmigen Körper (4) zum Ausstechen eines definierten Teils der Lotpaste (3) aus einem Lotpastendepot (5), 1 . Pipette for loading a printed circuit board (2) with solder paste (3), comprising a tubular body (4) for cutting out a defined part of the solder paste (3) from a solder paste depot (5),
einen Kolben (6), welcher dermaßen an eine Innenwandung (7) des rohrförmigen Körpers (4) anliegt, dass der rohrförmige Körper (4) luftdicht verschlossen ist,  a piston (6) which abuts against an inner wall (7) of the tubular body (4) in such a way that the tubular body (4) is hermetically sealed,
Mittel zum Variieren des Drucks zwischen dem Kolben (6) und des ausgestochenen Teils der Lotpaste (3).  Means for varying the pressure between the piston (6) and the punched out portion of the solder paste (3).
2. Pipette nach Anspruch 1 , wobei das Mittel zum Variieren des Drucks zwischen dem Kolben (6) und dem ausgestochenen Teil der Lotpaste (3) eine Membran (8) umfasst, welche eine Stirnfläche des Kolbens (6) bildet. 2. A pipette according to claim 1, wherein the means for varying the pressure between the piston (6) and the punched out portion of the solder paste (3) comprises a membrane (8) which forms an end face of the piston (6).
3. Pipette nach Anspruch 1 , wobei das Mittel zum Variieren des Drucks zwischen dem Kolben (6) und dem ausgestochenen Teil der Lotpaste (3), eine Vorrichtung zum Bewegen des Kolbens (6) in dem rohrförmigen Körper (4) umfasst. A pipette according to claim 1, wherein the means for varying the pressure between the plunger (6) and the punched out portion of the solder paste (3) comprises means for moving the plunger (6) in the tubular body (4).
4. Verfahren zum Bestücken einer Leiterkarte (2) mit Lotpaste (3), 4. Method for equipping a printed circuit board (2) with solder paste (3),
insbesondere mittels einer Pipette (1 ) nach einem der vorhergehenden in particular by means of a pipette (1) according to one of the preceding
Ansprüche, umfassend die Schritte, Claims comprising the steps of
Ausstechen eines definierten Teils einer Lotpaste (3) aus einem  Cutout of a defined part of a solder paste (3) from a
Lotpastendepot (5), Lot paste deposit (5),
Ansaugen des ausgestochenen Teils der Lotpaste (3),  Sucking the punched-out part of the solder paste (3),
Platzieren des ausgestochenen Teils der Lotpaste (3) auf einer Leiterkarte (2), Auspressen des ausgestochenen Teils der Lotpaste (3), bis der Placing the punched out part of the solder paste (3) on a printed circuit board (2), pressing out the punched out part of the solder paste (3) until the
ausgestochene Teil der Lotpaste (3) an der Leiterkarte (2) anhaftet. punched part of the solder paste (3) adheres to the printed circuit board (2).
5. Verfahren nach Anspruch 4, wobei das Ausstechen eines definierten Teils einer Lotpaste (3) aus einem Lotpastendepot (5) mittels des rohrförmigen Körpers (4) geschieht. 5. The method of claim 4, wherein the cutting out of a defined part of a solder paste (3) from a Lotpastendepot (5) by means of the tubular body (4).
6. Verfahren nach Anspruch 4 oder 5, wobei das Auspressen und/oder Ansaugen des ausgestochenen Teils der Lotpaste (3) mittels der Mittel zum Variieren des Drucks zwischen dem Kolben (6) und des ausgestochenen Teils der Lotpaste (3) geschieht. 6. The method of claim 4 or 5, wherein the extrusion and / or suction of the punched-out portion of the solder paste (3) by means of the means for varying the pressure between the piston (6) and the punched-out portion of the solder paste (3).
7. Verfahren nach Anspruch 6, wobei das Mittel zum Variieren des Drucks zwischen dem Kolben (6) und dem ausgestochenen Teil der Lotpaste (3) eine Membran (8) umfasst, welche eine Stirnfläche des Kolbens (6) bildet. A method according to claim 6, wherein the means for varying the pressure between the piston (6) and the punched out portion of the solder paste (3) comprises a diaphragm (8) forming an end face of the piston (6).
8. Verfahren nach Anspruch 6, wobei das Mittel zum Variieren des Drucks zwischen dem Kolben (6) und dem ausgestochenen Teil der Lotpaste (3), eine Vorrichtung zum Bewegen des Kolbens (6) in dem rohrförmigen Körper (4) umfasst. A method according to claim 6, wherein the means for varying the pressure between the piston (6) and the punched out portion of the solder paste (3) comprises means for moving the piston (6) in the tubular body (4).
PCT/EP2016/077727 2015-12-16 2016-11-15 Pipette for equipping a circuit card WO2017102213A1 (en)

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CH00761/18A CH713419B1 (en) 2015-12-16 2016-11-15 Pipette and method for populating a circuit board with solder paste.

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DE102015122011.3A DE102015122011A1 (en) 2015-12-16 2015-12-16 Pipette for loading a printed circuit board
DE102015122011.3 2015-12-16

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US20200367367A1 (en) * 2019-05-15 2020-11-19 Jabil Inc. Method and Apparatus for Stacking Printed Circuit Board Assemblies with Single Reflow

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DE102015122011A1 (en) 2017-06-22

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