WO2017082082A1 - Electric tool - Google Patents

Electric tool Download PDF

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Publication number
WO2017082082A1
WO2017082082A1 PCT/JP2016/082058 JP2016082058W WO2017082082A1 WO 2017082082 A1 WO2017082082 A1 WO 2017082082A1 JP 2016082058 W JP2016082058 W JP 2016082058W WO 2017082082 A1 WO2017082082 A1 WO 2017082082A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
circuit
board
case
motor
Prior art date
Application number
PCT/JP2016/082058
Other languages
French (fr)
Japanese (ja)
Inventor
拓家 吉成
俊彰 小泉
一彦 船橋
祐貴 武田
Original Assignee
日立工機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立工機株式会社 filed Critical 日立工機株式会社
Publication of WO2017082082A1 publication Critical patent/WO2017082082A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B23/00Portable grinding machines, e.g. hand-guided; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25FCOMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F5/00Details or components of portable power-driven tools not particularly related to the operations performed and not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25FCOMBINATION OR MULTI-PURPOSE TOOLS NOT OTHERWISE PROVIDED FOR; DETAILS OR COMPONENTS OF PORTABLE POWER-DRIVEN TOOLS NOT PARTICULARLY RELATED TO THE OPERATIONS PERFORMED AND NOT OTHERWISE PROVIDED FOR
    • B25F5/00Details or components of portable power-driven tools not particularly related to the operations performed and not otherwise provided for
    • B25F5/02Construction of casings, bodies or handles

Definitions

  • the present invention relates to a power tool driven by a motor, and more particularly to a device for mounting a control circuit and an inverter circuit.
  • Patent Document 1 a brushless motor is accommodated coaxially with a cylindrical housing.
  • a stator having a coil is arranged on the outer peripheral side, and on the inner peripheral side, a rotor core that is rotated by a rotating shaft and holds a permanent magnet is provided.
  • the rotating shaft is pivotally supported by a bearing on the front side and the rear side of the motor, and a cylindrical sensor magnet for detecting the rotational position of the rotor is provided behind the rear side bearing.
  • a position sensor such as a Hall IC that detects the position of the sensor magnet, an inverter circuit having a switching element, a microcomputer, a power supply circuit that controls the motor, and the like. Is done.
  • Patent Document 1 an inverter circuit, a microcomputer, and the like are mounted on a circuit board that extends in a direction perpendicular to the longitudinal direction of the housing, so that the size of the mounted element is limited due to the limitation of the outer shape of the housing.
  • power tools are required to be small but have a large output, so switching elements used for inverter circuits, capacitors for countermeasures against peak voltage, etc. become large, and the problem to be solved is that the power tools become large was there.
  • the present invention has been made in view of the above background, and its purpose is to provide an electric tool that improves the mounting efficiency by devising the arrangement of the circuit board accommodated in the housing and suppresses the enlargement of the main body size. There is to do.
  • Another object of the present invention is to provide an electric motor that uses a large-capacity IGBT (Insulated Gate Bipolar Transistor) as a switching element to improve the degree of freedom of the installation position while increasing the output while improving the cooling efficiency of the heating element. To provide a tool.
  • IGBT Insulated Gate Bipolar Transistor
  • Still another object of the present invention is to provide a circuit board on which a switching element such as an IGBT is mounted and a circuit board on which a control circuit is mounted in a board case, and these are hardened with resin, thereby improving reliability and durability. It is to provide a power tool that is greatly enhanced.
  • a driving circuit for driving a brushless motor a first circuit board on which the driving circuit is mounted, a control circuit for controlling the driving circuit, and a second circuit on which at least a part of the control circuit is mounted.
  • a power tool having a circuit board, a board case for housing a first circuit board and a second circuit board and having an opening surface on one side, and a housing for housing a brushless motor and the board case, the board case A first circuit board and a second circuit board were accommodated therein.
  • the first circuit board and the second circuit board are arranged in a direction perpendicular to the opening surface, and the first circuit board and the second circuit board extend in a direction parallel to the opening surface. did.
  • the first circuit board is disposed on the side close to the opening surface, and the switching element included in the drive circuit is mounted on the opening surface side of the first circuit board. Further, an element (such as a microcomputer) constituting the control circuit was mounted on the surface of the second circuit board opposite to the first circuit board.
  • the plurality of switching elements are arranged such that the longitudinal direction thereof is orthogonal to the first circuit board, and a part of the switching elements is mounted so as to protrude from the opening surface of the board case.
  • the first circuit board is further mounted with a rectifier circuit for converting commercial AC power into DC, and the rectifier circuit includes a smoothing capacitor.
  • the capacitor is mounted on the first circuit board so as to be partially exposed from the opening surface.
  • the first circuit board and the second circuit board are immersed in the resin by allowing the curable resin to flow and harden in the substrate case.
  • the control circuit includes a microcomputer that controls the inverter circuit by the switching element, and the microcomputer is mounted on the second circuit board.
  • the first circuit board and the second circuit board are electrically connected by a connector (for example, a pin header).
  • the substrate case is narrowed so that the two parallel wall portions extending orthogonally from the opening surface and the width dimension from the parallel wall portion to the side opposite to the opening portion become smaller. It is the container shape which formed the bottom part by.
  • the first circuit board is formed with a width smaller than that of the second circuit board and is larger than the width of the bottom portion.
  • the second circuit board has a size smaller than the width of the first circuit board and a size larger than the width of the bottom portion.
  • a cylindrical motor housing that houses a brushless motor, and a cylindrical rear cover that is attached to one of the motor housings and houses a substrate case
  • the outer diameter of the rear cover is The outer diameter of the motor housing was made smaller than the outer diameter.
  • an output shaft that is rotated by the rotational force of the brushless motor, a power transmission mechanism that transmits the rotational force of the brushless motor to the output shaft, and a gear case that is attached to the other of the motor housing and accommodates the power transmission mechanism,
  • the shaft protrudes from the gear case, and the opening of the substrate case is configured to open in the same direction as the protruding direction of the output shaft from the gear case.
  • a large switching element can be used by effectively utilizing space, so that a high output This makes it possible to perform stable motor control.
  • the cooling efficiency can be improved by arranging the switching element so as to be exposed to the outside from the opening.
  • the electronic device mounted on the circuit board is covered with resin, and the circuit board is disposed separately from the cooling air flow path generated by the rotation of the cooling fan, so that moisture that has entered from the outside enters the electronic element. Adhesion can be suppressed and the life of the power tool can be extended.
  • FIG. 6 is a perspective view of electronic elements mounted on a substrate case 40 before being incorporated in the motor housing 2 when viewed from the opening surface side.
  • FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1 (except for the rear cover 3).
  • FIG. 2 is a cross-sectional perspective view taken along line AA in FIG. 1.
  • 2 is a block diagram illustrating a circuit configuration of a drive control system of the electric tool 1.
  • FIG. It is a perspective view which shows the single-piece
  • FIG. 5 is a view for explaining a housing state of the first circuit board 50 in the board case 40 of FIG. 1 and an arrangement state of the pin headers 56 to 58; 4 is a side view of the pin header 58.
  • FIG. 1 is a top view of a power tool 1 according to an embodiment of the present invention.
  • a disc grinder is shown in which a spindle 24 that rotates in a direction orthogonal to the rotation shaft 6 of the motor 5 is provided, and a tip tool connected to the spindle 24 is a circular grindstone 30.
  • a housing (outer frame or casing) of the electric power tool 1 is attached to the rear of the motor housing 2 and a gear case 21 that houses a power transmission mechanism, a cylindrically-shaped integrally formed motor housing 2 that houses a motor 5, and an electric tool. It is composed of three main parts of a cylindrical rear cover 3 that accommodates equipment.
  • the method of forming the housing is arbitrary, and it may be configured by three parts in the front-rear direction as in the present embodiment, the motor housing 2 and the rear cover 3 may be configured integrally, or other divisions. It may be formed in a shape.
  • the motor housing 2 is made of resin or metal and has a substantially cylindrical shape having an opening 2a on the front side and an opening 2b on the rear side.
  • the inner diameter of the motor housing 2 has a diameter slightly larger than the outer diameter of the stator core 9 of the motor 5, and the outer surface side of the motor housing 2 constitutes a portion (gripping part) that the operator grips with one hand.
  • An opening 3 a of the rear cover 3 is attached to the rear opening 2 b of the motor housing 2.
  • the outer diameter of the rear cover 3 is substantially equal to or slightly smaller than the outer diameter of the motor housing 2.
  • the motor 5 has a rotation shaft 6 disposed along the central axis direction (front-rear direction) of the motor housing 2, and the calculation unit determines the rotation position of the rotor core 7 from rotation position detection elements 49a to 49c (in the drawing). 49b only), and the inverter circuit 60 composed of a plurality of switching elements Q1 to Q6 (only Q4 to Q6 is visible in the figure) is controlled to drive sequentially to a predetermined coil 12 of the motor 5. By supplying electric power, a rotating magnetic field is formed to rotate the rotor.
  • the motor 5 is a three-phase brushless DC motor, and the rotor rotates in the inner circumferential space of the stator core 9 having a substantially cylindrical shape.
  • the stator core 9 is manufactured by a laminated structure of annular thin iron plates. Six teeth (not shown) are formed on the inner peripheral side of the stator core 9, and resin-made insulators 10 and 11 are mounted in the longitudinal direction of each tooth, and the teeth are sandwiched between the insulators 10 and 11.
  • a coil 12 is formed by winding a copper wire in an elliptical shape.
  • the coil 12 is preferably a star connection having three phases of U, V, and W phases, and three lead wires for U, V, and W phases for supplying driving power to the coil 12 are used. (Not shown) is connected to the first circuit board 50.
  • the rotor core 7 is fixed to the rotating shaft 6.
  • the rotor core 7 is formed by laminating a large number of annular thin steel plates in the axial direction, and a flat permanent magnet 8 having N poles and S poles is inserted into a slot portion having a rectangular cross-sectional shape.
  • the rotary shaft 6 includes a rear-side bearing (first bearing) 14 a fixed to the motor housing 2 and a front-side bearing (second bearing) fixed in the vicinity of the connection portion between the gear case 21 and the motor housing 2. 14b and is held rotatably.
  • a cooling fan 15 is provided between the bearing 14 b and the motor 5 when viewed in the axial direction of the rotary shaft 6.
  • the cooling fan 15 is, for example, a plastic centrifugal fan. When the motor 5 rotates, the cooling fan 15 rotates in synchronization with the rotating shaft 6, so that the motor 5, the control circuit, etc. A wind flow (cooling air) for cooling the air is generated.
  • the cooling air is sucked from suction ports 3d and 3e provided on the upper and lower and left and right side walls of the rear cover 3 in the vicinity of the rear end of the first circuit board 50, and accommodates the first circuit board 50 and the second circuit board 70. It flows from the rear to the front side around the case 40, passes through the bearing holder portion 20 of the motor housing 2, and flows into the accommodation space of the motor 5.
  • the bearing holder portion 20 is formed with a plurality of columns (not shown) from the cylindrical portion holding the outer ring portion of the bearing 14a (see FIG. 1) toward the outside, and is hollow at locations other than the columns.
  • the cooling air flows from the space in which the substrate case 40 is accommodated to the space in which the motor 5 is accommodated.
  • Cooling air that has flowed into the housing space of the motor 5 is sucked by the cooling fan 15 through the gap between the outer periphery of the stator core 9 and the motor housing 2 (see the black arrow in the figure) and the inner space of the stator core 9. Then, the air is discharged from the through hole 21 b of the gear case 21 to the front side through the through hole of the fan cover 16 or forward from the lower hole 21 c of the fan cover 16.
  • the bearings 14b are arranged in series (on a straight line) in the axial direction.
  • the air windows such as the suction ports 3d and 3e for sucking outside air are arranged around the first circuit board 50 and behind the elements that generate large amounts of heat, particularly the switching elements Q1 to Q6 (see FIG. 2 described later). Is done.
  • the element that generates heat when the cooling air flows so as to substantially contact the entire outer peripheral surface from the rear side to the front side of the housing is effectively cooled.
  • the cooling air is configured to flow evenly so as to be substantially in contact with the entire inner peripheral surface of the housing.
  • the cooling air is configured to concentrate on a specific portion from the opening. The cooling air may be concentrated on the switching elements Q1 to Q6 and the diode bridge (described later in FIG. 2).
  • the gear case 21 is formed by integrally molding a metal such as aluminum, for example, and accommodates a power transmission mechanism including a pair of bevel gears (22, 23), and rotatably holds a spindle 24 serving as an output shaft. .
  • the spindle 24 is disposed so as to extend in a direction substantially orthogonal to the axial direction (here, the front-rear direction) of the rotating shaft of the motor 5, and the first bevel gear 22 is disposed at the front end portion of the rotating shaft 6.
  • the first bevel gear 22 meshes with a second bevel gear 23 attached to the upper end portion of the spindle 24, and this power transmission means acts as a speed reduction mechanism.
  • the upper end side of the spindle 24 is rotatably supported by a gear case 21 by a cylindrical metal 25, and is supported by a bearing 26 by a ball bearing near the center.
  • the bearing 26 is fixed to the gear case 21 via a spindle cover 27.
  • a mounting base 28 is provided at the tip of the spindle 24, and a tip tool such as a grindstone 30 is attached by a washer nut 31.
  • the grindstone 30 is, for example, a resinoid flexible toy, flexible toy, resinoid toy, sanding disk, etc. having a diameter of 100 mm. Depending on the type of abrasive used, surface grinding and curved surface grinding of metals, synthetic resins, marble, concrete, etc. are possible. is there.
  • the wheel guard 32 covers the radially outer side and upper side of the rear side of the grindstone 30.
  • worn not only the grindstone 30 but other tools, such as a bevel wire brush, a nonwoven fabric brush, and a diamond wheel, can be attached similarly.
  • the sensor magnet 18 is a thin cylindrical permanent magnet that is attached to detect the rotational position of the rotor core 7, and an N pole and an S pole are formed in order by 90 degrees in the circumferential direction.
  • a substantially semicircular sensor substrate 48 arranged in a direction perpendicular to the rotation shaft 6 is provided behind the sensor magnet 18 and inside the substrate case 40, and the position of the sensor magnet 18 is set on the sensor substrate 48. Rotation position detecting elements 49a to 49b for detecting are provided.
  • the rotational position detecting elements 49a to 49b detect the rotational position of the rotor core 7 by detecting a change in the magnetic field of the rotating sensor magnet 18, and each rotational position detecting element 49a to 49b is detected at a predetermined angle in the rotational direction. Provided.
  • the interior of the rear cover 3 formed in a substantially cylindrical shape is supplied by a calculation unit (described later) that controls the rotation of the motor 5, an inverter circuit 60 that is a circuit for driving the motor 5, and a power cord (not shown) from the outside.
  • a power supply circuit 65 for converting the alternating current to direct current is accommodated.
  • these circuits are mounted on a common first circuit board 50.
  • the first circuit board 50 is disposed so as to be parallel to the longitudinal center axis (coaxial with the rotating shaft 6 of the motor 5) of the electric power tool 1.
  • the front and back surfaces of the first circuit board 50 and the second circuit board 70 are arranged to extend in the front-rear and left-right directions.
  • the first circuit board 50 is disposed inside a container-like substrate case 40 having an opening surface, and is entirely covered with a curable resin that is hardened by being cured from a liquid state.
  • the plurality of switching elements Q ⁇ b> 1 are arranged so that the opening surface of the substrate case 40 faces downward.
  • To Q6 are arranged to extend downward from the first circuit board 50.
  • the electric power tool 1 according to an embodiment of the present invention is a tool mainly for working by grinding and grinding a workpiece by rotating a grindstone 30 attached to a spindle 24. And dust is generated.
  • the worker keeps the workpiece as low as possible so that dust or the like does not fall on himself / herself. Therefore, normally, the operator works with the spindle 24 not facing up, preferably with the spindle 24 facing down rather than in the left-right direction.
  • the opening direction of the opening surface 40a of the substrate case 40 is the same as the direction of the spindle 24 (the protruding direction from the gear case 21).
  • the opening direction of the opening surface 40a is generally directed downward, and even if dust generated during processing enters the interior of the rear cover 3 from the wind window, accumulation in the substrate case 40 is suppressed.
  • the power tool 1 when the worker completes the work, the power tool 1 is placed on a place such as the ground, but if there are no special circumstances, the power tool 1 is placed in the direction it is held. . That is, the electric tool 1 is placed with the spindle 24 facing downward. For this reason, even if dust or the like enters the substrate case 40 due to the influence of cooling air, for example, the dust in the substrate case 40 is removed due to the influence of gravity or the like when placed.
  • a large-capacity output transistor such as an FET (field effect transistor) or IGBT is used as the switching elements Q1 to Q6. Since these switching elements Q1 to Q6 generate a large amount of heat, a heat dissipating structure for improving the cooling effect is considered.
  • a cooling metal plate is further attached to the heat dissipating plates of the switching elements Q1 to Q6. Since the heat radiating plate and the metal plate are arranged on the leeward side (motor side) from the wind window (not shown) serving as the suction port, they are directly exposed to the cooling air indicated by the black arrows.
  • a power supply circuit 65 is provided on the rear side of the switching elements Q1 to Q6.
  • the power supply circuit 65 of the present embodiment includes a rectifier circuit that converts commercial power (AC) supplied from the outside into DC.
  • the power supply circuit 65 is located on the rear side of the substrate case 40 so as to be close to a power cord (not shown) wired so as to extend from the rear end surface of the rear cover 3 to the outside from the efficiency of wiring, and the switching elements Q1 to Q6. It is mounted on the rear side (the non-motor side far from the motor 5).
  • a sensor substrate 48 on which the rotational position detecting elements 49a to 49b are mounted is provided in the space defined by the substrate case 40 (inside the container), in addition to the first circuit substrate 50.
  • the sensor substrate 48 is disposed so as to be orthogonal to the rotation axis direction of the motor 5.
  • a power cord holding portion 43 and an abutting portion 44 that abuts against the inner wall surface of the rear cover 3 are formed.
  • FIG. 2 is a perspective view of the substrate case 40 before being assembled in the motor housing 2 as seen from the opening surface side.
  • a power circuit 65 and an inverter circuit 60 including six switching elements Q1 to Q6 are mainly mounted on the first circuit board 50 (see FIG. 1) inside the substrate case 40.
  • the power supply circuit 65 is disposed on the rear side of the first circuit board 50 in view of the wiring advantage of being close to the input and output points and the flow of the cooling air. It is arranged on the front side of the circuit board.
  • IGBTs insulated gate bipolar transistors
  • the IGBT used here is housed in a flat cubic ceramic package, and three terminals of the gate, collector, and emitter extend in parallel from one surface (bottom surface) and are adjacent to the surface from which the three terminals extend.
  • a heat radiating plate is embedded in the back surface (one of flat and wide surfaces).
  • a screw hole for attaching to a heat radiating means prepared separately is formed in a part of the heat radiating plate.
  • the three terminals of the switching elements Q1 to Q6 are soldered to the first circuit board 50, and the front face on which the model number and the like are printed is arranged so as to be orthogonal to the first circuit board 50.
  • the front and back surfaces of the switching elements Q1 to Q3 are arranged side by side so as to be parallel to one side wall surface 41c of the substrate case 40, and the front and back surfaces of the switching elements Q4 to Q6 are the other side wall surface 41d of the substrate case 40. Are arranged side by side in parallel. Between the switching elements Q4 to Q6 and the side wall surface 41d of the substrate case 40, three connectors 55a to 55c for connecting to the coil 12 of the motor 5 are provided. As can be understood from this figure, the switching elements Q1 to Q6 mounted on the first circuit board 50 are large-sized elements that occupy more than half of the internal space of the substrate case 40 when viewed in the front-rear direction.
  • Elements constituting the power supply circuit 65 are mounted in the space behind the switching elements Q1 to Q6.
  • a diode bridge 66 is mounted at the center
  • a choke coil 69 and a capacitor 68a are mounted next to the diode bridge 66
  • a film capacitor 67 and a capacitor 68b are mounted on the rear side thereof.
  • the capacitors 68a and 68b are mounted on the first circuit board 50 so as to be partially exposed from the opening surface.
  • the choke coil 69 and the film capacitor 67 function as a noise filter that removes noise flowing from the commercial AC power supply 100 and noise of the entire circuit generated by switching control and the like.
  • a semiconductor element is enclosed in a substantially rectangular parallelepiped package such as ceramic, and three metal terminals extend from the lower side of the package.
  • a metal heat sink is provided on the back side of the package.
  • the heat radiating plate is planar, and the switching elements Q1 to Q6 are arranged so that the spreading direction of the heat radiating plate is horizontal and orthogonal to the longitudinal direction of the first circuit board 50 (the front-rear direction in FIG. 2).
  • heat radiating metal plates 81 to 86 are fixed to the heat radiating plate on the back of the package. Normally, the collector terminal of the IGBT is electrically connected to the heat sink on the back side of the package.
  • the collector terminal when the collector terminal is commonly connected, a common metal plate is fixed to the plurality of switching elements Q1 to Q3. Also good.
  • the remaining three switching elements Q4 to Q6 of the inverter circuit 60 are arranged in a line and arranged in parallel with the switching elements Q1 to Q3.
  • the heat dissipation plate on the back of the package of switching elements Q4 to Q6 is provided with a metal plate for heat dissipation, but these collector terminals are not connected in common (between different polarities), so they must be made independent of each other. Don't be.
  • FIG. 3 is a cross-sectional view taken along a line AA in FIG.
  • the legs of the switching elements Q2, Q5 are fixed to the first circuit board 50 by soldering.
  • the first circuit board 50 is a single-layer or multilayer printed board, and a multilayer glass composite board is used here.
  • heat radiating metal plates 82 and 85 are fixed by screws 87b and 87e.
  • the metal plates 82 and 85 are small pieces of aluminum alloy thick plates.
  • An electronic switch 51 that operates in conjunction with a trigger lever (not shown) is mounted between the switching element Q2 and the side wall surface 41c.
  • the electronic switch 51 is for switching the motor 5 on and off, and is mounted on the first circuit board 50 at a position accessible from the opening surface 40a side.
  • a metal arm 51a that can swing in a cantilever manner is provided on the top of the electronic switch 51, and is operated by a slide switch (not shown) provided so as to be partially exposed to the outside of the housing. When the slide switch moves, the plunger (not shown) of the electronic switch 51 is moved by pressing the metal arm 51a, and the switch is turned on.
  • Connectors 55a to 55c for transmitting the outputs of the switching elements Q1 to Q6 to the coil 12 of the motor 5 are provided between the switching element Q5 and the side wall surface 41d.
  • the second circuit board 70 On the bottom surface 41g side of the first circuit board 50, the second circuit board 70 is disposed in a state of being separated from the first circuit board 50 by a predetermined distance.
  • the second circuit board 70 is also a single-layer or multilayer printed board, and a multilayer glass composite board is used here.
  • two circuit boards are formed using pin headers 56 and 58. Connected.
  • the pin headers 56 and 58 thin members extending in the vertical direction are metal pins, and are held in a prismatic case.
  • the configuration of the pin header will be described with reference to FIG.
  • FIG. 8 is a side view of a plurality of connected pin headers 58.
  • the pin header 58 is provided with a synthetic resin case 58b in the vicinity of the middle in the longitudinal direction of a thin metal pin 58a extending in the vertical direction.
  • Each case 58b is connected by a relatively thin connecting portion 58c made of resin, and the user cuts the connecting portion 58c as necessary to adjust the number of connected pins 58a. To do.
  • the distance P (pitch) between the pins is about 1 to 10 mm, which is 2 mm.
  • a 6-pin header is shown as an example, but the number of connections is changed as appropriate according to the specifications of the board, and the pin header 58 of this embodiment has 13 pins (described later in FIG. 7).
  • the pin header 56 uses the same components, and the pin header 56 has two pins (described later in FIG. 7).
  • L the distance (predetermined distance) between adjacent substrates can be arbitrarily set.
  • L about 5 mm.
  • the first circuit board 50 is supported by stepped portions 45a and 45c formed on the side surface inside the substrate case 40, and fixed to the circuit board with screws described later.
  • the second circuit board 70 is fixed to the first circuit board 50 by pin headers 56 to 58.
  • the first circuit board 50 and the second circuit board 70 are electrically connected by the pin headers 56 to 58 so that they cannot be moved relative to each other.
  • the first circuit board 50 and the second circuit board 70 are arranged so as to be overlapped in a direction perpendicular to the opening surface 40a, and the opening surface
  • the surface of 40a, the 1st circuit board 50, and the 2nd circuit board 70 is arrange
  • electronic elements for forming a control circuit for example, a microcomputer, a capacitor, a resistor, and the like are mounted.
  • a low voltage constant voltage power supply circuit (described later) for the microcomputer is also mounted on the bottom surface side of the second circuit board 70.
  • the electronic device arrangement space in the substrate case 40 is on the opening surface 40a side of the first circuit board 50, on the bottom surface 41g side of the second circuit board, or between the first circuit board 50 and the second circuit board 70. , Narrow in this order. Therefore, in this embodiment, an IGBT, a diode bridge 66, a noise filter film capacitor 67 and a choke coil 69, and smoothing capacitors 68a and 68b, which are relatively large electronic elements, are arranged on the opening surface 40a side of the first circuit board 50.
  • the arithmetic unit 71 microcomputer
  • the capacitor 74, and the like which are relatively small electronic elements, are arranged on the bottom surface 41g side of the second circuit board.
  • the internal space of the substrate case 40 is filled with resin from the bottom surface 41 g to the position indicated by the arrow 90.
  • the resin (not shown) is placed so that the opening surface 40a of the substrate case 40 is on the upper side, and the substrate case 40 is filled with a resin in a liquid form and then cured, and the switching elements Q1 to Q6 are liquid crystals. About half of the vertical position is immersed from the surface, and the upper portions of the capacitors 68a and 68b and the diode bridge 66 on the rear side are exposed. Since all the parts from the bottom 41g part to the liquid level (broken line 90) are filled with the resin in the substrate case 40, the first circuit board 50 and the second circuit board 70 are firmly fixed with the resin and do not rattle.
  • the first circuit board 50 and the second circuit board 70 are accommodated in the container-like substrate case 40, and the resin is filled therein so that the first circuit board 50 and the second circuit board 70 are completely or Since it is almost completely immersed, the waterproofness and dustproofness of the first circuit board 50 can be remarkably enhanced.
  • FIGS. 4 is a cross-sectional perspective view taken along the line AA in FIG. 1.
  • the electric tool 1 is turned upside down, and the opening surface 40a of the substrate case 40 is shown in the drawing. It is shown so as to face upward. Also, illustration of the resin is omitted.
  • cross-sectional shape cross-sectional shape in FIG.
  • the outer shape of the substrate case 40 is substantially along the inner wall shape of the cylindrical rear cover 3, and the inner wall portion of the rear cover 3
  • the substrate case 40 is positioned with respect to the rear cover 3 by the edges of the opening surface 40a of the substrate case 40 coming into contact with the ribs 3c formed on both sides and continuing in the same direction as the axial direction A1.
  • the board case 40 is fixed to the motor housing 2 by screws 88a and 88b via screw bosses 42a and 42b.
  • the rear cover 3 is attached to the rear of the motor housing 2 while accommodating the substrate case 40, and the rear cover 3 is fixed to the substrate case 40 with screws 39.
  • the rear cover 3 is fixed to the motor housing 2 via the substrate case 40.
  • the substrate case 40 has a container shape having an opening surface 40a and is formed so as not to spill even when liquid is put into the internal space.
  • the first circuit board 50 and the housing of the electric tool 1 are provided in the housing.
  • the second circuit board 70 is accommodated, mounting is performed such that the switching elements Q1 to Q6 are inverted, that is, the opening surface 40a of the board case 40 is opened downward.
  • the normal direction of the opening surface 40a is arranged in a state in which it faces downward (the direction in which the spindle 24 protrudes from the gear case 21).
  • the switching elements Q1 to Q6 (only Q2 and Q5 are visible in the figure) have a part on the upper end side (here, about half of the length protruding from the substrate) protruding from the opening surface 40a of the substrate case 40 to the outside of the case. Therefore, it can be directly exposed to the cooling air passage. Furthermore, since the metal plates 82 and 85 for heat dissipation are provided inside the switching elements Q2 and Q5, the cooling effect is further improved.
  • the durability of the switching elements Q1 to Q6 and the like can be improved. It was. In particular, iron powder or the like accumulated between the switching elements Q1 to Q6 is likely to cause dust and water droplets to fall on the lower surface inside the rear cover 3 due to the impact when the electric tool 1 is used or placed in the direction of FIG. Become.
  • the metal arm 51a of the electronic switch 51 protrudes from the opening surface 40a to the outside of the case, and a contact portion (not shown) of a switch lever (not shown) contacts or separates from the protruding portion.
  • Connectors 55a to 55c are arranged between the switching element Q5 and the side wall surface 41d of the substrate case 40, and are supplied to the U phase, V phase, and W phase of the coil 12 of the motor 5 above the connectors 55a to 55c.
  • Lead wires 13a to 13c are arranged for this purpose.
  • the substrate case 40 has two screw bosses on the front side, and is fixed to the motor housing 2 by screws 88a and 88b.
  • the power supply circuit 65 includes a diode bridge 66, a choke coil 69, a film capacitor 67, an electrolytic capacitor 68a, and the like.
  • the diode bridge 66 performs full-wave rectification on the AC input from the commercial AC power supply 100.
  • a smoothing capacitor 68 a is connected to the output side of the power supply circuit 65 and the inverter circuit 60.
  • the inverter circuit 60 includes six switching elements Q1 to Q6, and the switching operation is controlled by the gate signals H1 to H6 supplied from the arithmetic unit 71.
  • IGBTs are used here as the switching elements Q1 to Q6.
  • the switching element is not limited to the IGBT but may be an FET (field effect transistor) or other element.
  • the output of the inverter circuit 60 is connected to the U phase, V phase, and W phase of the coil 12 of the motor 5.
  • a constant voltage power supply circuit 72 is connected to the output side of the power supply circuit 65.
  • the power supply circuit 65, the inverter circuit 60, and the electronic switch 51 are mounted on the opening surface 40 a side of the first circuit board 50.
  • a sensor magnet 18 for position detection is connected to the rotation shaft 6 of the rotor, and the calculation unit 71 detects the position of the sensor magnet 18 by rotation position detection elements 49a to 49c such as Hall ICs, whereby the calculation unit 71 rotates the rotation position of the motor 5. Can be detected.
  • the computing unit 71 is a control means for performing on / off and rotation control of the motor, and is mainly configured by using a microcomputer (not shown).
  • the computing unit 71 is mainly mounted on the second circuit board 70, and the microcomputer is mounted on the side facing the bottom surface of the second circuit board 70, that is, on the side opposite to the opening surface 40a (on the side opposite to the opening).
  • the calculation unit 71 controls the rotation of the motor 5 based on the start signal input in accordance with the operation of the electronic switch 51 and the speed set by a transmission means (not shown), and the energization time to the coils U, V, W Control drive voltage.
  • An output signal (drive control signal) from the calculation unit 71 is connected to the gates of the six switching elements Q1 to Q6 of the inverter circuit 60, and drive signals H1 to H1 for turning on / off the switching elements Q1 to Q6.
  • Supply H6 The collectors or emitters of the six switching elements Q1 to Q6 of the inverter circuit 60 are connected to the U phase, V phase, and W phase of the star-connected coil 12.
  • the switching elements Q1 to Q6 perform a switching operation based on the drive signals H1 to H6 input from the arithmetic unit 71, and the DC voltage supplied from the commercial AC power supply 100 via the power supply circuit 65 is converted into three phases (U phase, V-phase and W-phase) voltages Vu, Vv, and Vw are supplied to the motor 5.
  • the magnitude of the current supplied to the motor 5 is detected by the computing unit 71 by detecting the voltage value across the current detecting shunt resistor 54 connected between the power supply circuit 65 and the inverter circuit 60. .
  • the constant voltage power supply circuit 72 is connected to the output side of the diode bridge 66 and supplies a stabilized reference voltage (low voltage) direct current to the arithmetic unit 71 configured by a microcomputer or the like.
  • the constant voltage power circuit 72 includes a diode 52, a capacitor 68b, an IPD circuit 73, a capacitor 74, and a regulator 75.
  • the IPD circuit 73, the capacitor 74, and the regulator 75 are mounted on the second circuit board 70.
  • FIG. 6 is a perspective view showing the opening surface 40a facing upward.
  • the board case 40 serves as an attachment base for fixing the first circuit board 50 and the second circuit board 70 in the housing of the electric tool 1, and the board case 40 formed in a container shape has an opening surface. Adjacent to 40a, it has four walls, a front surface 41a, a rear surface 41b, and side wall surfaces 41c and 41d. The side walls 41c and 41d and the bottom surface 41g are connected to each other by inclined slope portions 41e and 41f formed obliquely.
  • the bottom surface portion has a shape that is narrowed down along the shape of the rear cover 3 so that the width dimension decreases from the parallel wall portions (41c, 41d) toward the side opposite to the opening.
  • the second circuit board 70 has a shape in which a space necessary for an electronic element (such as a microcomputer) for a control circuit is secured on the back surface (side facing the bottom surface 41g), and a curved surface is formed at the center of the bottom surface 41g. The part which protrudes in the shape of the opening surface 40a side is formed. This raised portion is provided to reduce the amount of resin to be filled and reduce the weight, and to provide a space between the rear cover 3 and the substrate case 40 for allowing a screw to pass through the screw boss.
  • a cylindrical tube portion 42 (see FIG. 2) is formed on the outer portion of the front surface 41a.
  • the cylindrical portion 42 is a recessed portion for accommodating the sensor magnet 18 therein, and the sensor substrate 48 is disposed on the inner side of the substrate case 40 with the front surface 41a as viewed from the sensor magnet 18.
  • the sensor substrate 48 is disposed on the substrate case 40 so as to extend in a direction perpendicular to the opening surface 40a.
  • the cylindrical tube portion 42 is formed with protruding portions (screw bosses 42a) protruding in the radial direction, and screw holes are respectively formed therein.
  • Step portions 45a and 45b for supporting and aligning the first circuit board 50 are formed on the side wall surface 41c inside the substrate case 40, and a screw boss 46a is formed. Step portions (not visible in FIG. 6) and screw bosses for aligning the first circuit board 50 are also formed on the inner wall portion of the side wall surface 41d in the same manner.
  • a power cord holding portion 43 and an abutting portion 44 for abutting and fixing to the inner wall surface of the rear cover 3 are formed on the outer side of the rear surface 41b of the substrate case 40.
  • the resin is poured into the substrate case 40 with the opening surface 40a facing upward as shown in FIG.
  • a curable resin that is cured from a liquid state for example, a urethane resin
  • an amount of the resin in which the fixed first circuit board 50 is completely immersed is poured.
  • the liquid level of the resin is about halfway along the vertical position of the package of the switching elements Q1 to Q6 mounted on the surface of the first circuit board 50 (see the dotted line 90 in FIG. 3).
  • the second circuit board 70 is not fixed to the board case 40 by screws or the like, but is indirectly fixed to the board case 40 so as to be fixed to the first circuit board 50.
  • the second circuit board 70 is formed to have a width smaller than that of the first circuit board 50 and larger than the width of the bottom portion (bottom surface 41g).
  • the assembly of the first circuit board 50 and the second circuit board 70 to the board case 40 is arbitrary, and the second circuit board 70 side is screwed to the board case so that the first circuit is fixed.
  • the substrate 50 may be completely immersed in the resin without being fixed to the substrate case 40, or the first circuit substrate 50 and the second circuit substrate 70 may be fastened together with the substrate case 40 with a common screw. It may be fixed.
  • FIG. 7 is a view of the substrate case 40 as viewed from the outside in the normal direction of the opening surface 40a. Only the positions of the pin headers 56 to 57 and the electronic switch 51 are shown, and the remaining elements are not shown.
  • the shape of the first circuit board 50 accommodated in the substrate case 40 is formed with an outer contour substantially equivalent to the inner shape (width W, length L) of the substrate case 40.
  • the second circuit board 70 (not shown) is made smaller than the width W of the first circuit board 50 and the length thereof is also shortened.
  • a 13-pin pin header 58 and a 3-pin pin header 56 and a 3-pin pin header 57 are attached to a right side portion of the first circuit board 50 opposite to the opening surface 40a (a surface close to the bottom surface 41g), and a left side portion.
  • the pin headers 56 and 57 are provided on the left side at positions separated in the front-rear direction, the first circuit board 50 and the second circuit board 70 are well fixed by the three groups of pin headers 56 to 57, and the first A plurality of wirings can be connected between the one circuit board 50 and the second circuit board 70.
  • the first circuit board 50 is fixed by a screw 59c at one of the rear corners.
  • the front side of the substrate case 40 is held by fixing the fixing member 89 with screws 59a and 59b.
  • An arm portion extending in the left-right direction is formed at a portion of the fixing member 89 that contacts the first circuit board 50, and screw holes are formed at both ends of the arm portion.
  • the fixing member 89 is formed with a pressing piece 89a so as to extend forward from the first circuit board 50, and the sensor board 48 is held by the pressing piece 89a so as not to drop off from the guide rail portion 47.
  • the first circuit board 50 and the sensor board 48 are easily mounted on the board case 40 by screwing the fixing member 89 after mounting the first circuit board 50 and the sensor board 48 in the board case 40. .
  • the first circuit board 50 and the second circuit board 70 are stacked and accommodated in the substrate case, and are fixed by the curable resin.
  • the IGBT could be accommodated, and a compact electric tool could be realized with improved mounting efficiency.
  • the switching elements Q1 to Q6 and the heat radiating metal plate attached to the switching elements Q1 to Q6 can be directly exposed to the cooling air by arranging them on the mounting surface on the opening surface 40a side of the first circuit board. Can be increased.
  • the resin is filled in the substrate case 40 and the switching elements Q1 to Q6 and the metal plate for heat radiation attached thereto are exposed from the resin, the electronic elements immersed in the resin are protected from dust such as iron powder.
  • rectifying diode bridge 66 and the smoothing capacitor 68a are also partially exposed from the resin and exposed to the cooling air, these elements can be efficiently cooled.
  • the substrate case 40 is partially formed in a substantially cylindrical shape along the inner wall of the rear cover 3, the use of the internal space of the housing efficiently suppresses the enlargement of the main body, and the compact electric tool 1 can be used. realizable.
  • the dimension of the second circuit board 70 in the left-right direction is made smaller than that of the first circuit board 50, and the bottom of the board case 40 (the bottom surface 41g in the board case 40) is smaller than the dimension of the opening surface 40a in the left-right direction. Since the housing space of the substrate case 40 can be used efficiently, the mounting area of the electronic device can be increased.
  • first circuit board 50 and the second circuit board are fixed by pin headers that can be fixed while being electrically connected, if one circuit board is fixed to the board case 40, the other circuit board can be fixed. It can be realized at the same time and it is easy to assemble.
  • a relatively large electronic element including a choke coil 69 and a film capacitor 67 serving as a noise filter is disposed on the opening surface 40a side of the first circuit board 50, and other small electronic elements are disposed on the bottom surface of the first circuit board 50.
  • a limited electronic element mounting surface can be used efficiently.
  • the assembly becomes easy.
  • the cooling air passes through the opening surface 40a side of the substrate case 40, the electronic elements exposed from the resin can be effectively cooled by being exposed to the cooling air.
  • the main circuit board accommodated in the substrate case 40 is distributed and accommodated in two sheets of the first circuit board 50 and the second circuit board 70.
  • each may be accommodated in the substrate case in a state of being connected by a pin header or other connector.
  • the substrate case opening direction is the same as the spindle protruding direction. However, the substrate case opening direction is directed downward when the electric tool is in a mounted state or a used state.
  • the opening direction of the opening surface may not be directly below, and the normal line direction of the opening surface 40a may be arranged obliquely downward or laterally.
  • the example of mounting the circuit board used in the grinder as an example of the electric tool 1 has been described.
  • the present invention is not limited to the grinder and can be applied to other electric tools in the same manner, for example, a saver saw, a multi-cutter,
  • the present invention can be similarly applied to mounting of a circuit board such as a hand driver or an impact driver having a cylindrical housing.
  • SYMBOLS 1 Electric tool, 2 ... Motor housing, 2a, 2b ... Opening, 3 ... Rear cover, 3a ... Opening, 3c ... Rib, 3d, 3e ... Inlet, 5 ... Motor, 6 ... Rotating shaft, 7 ... Rotor core, 8 ... Permanent magnet, 9 ... stator core, 10, 11 ... insulator, 12 ... coil, 13a-13c ... lead wire, 14a, 14b ... bearing, 15 ... cooling fan, 16 ... fan cover, 18 ... sensor magnet, 20 ... bearing holder part 21 ... Gear case, 21b ... Through hole, 21c ... Hole, 22, 23 ... Bevel gear, 24 ... Spindle, 25 ... Metal, 26 ...

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Portable Power Tools In General (AREA)

Abstract

Provided is an electric tool for which, by devising the arrangement of circuit boards so as to be filled with resin, mounting efficiency is increased and output is increased while size reduction is achieved. A board case (40) is disposed inside a cylindrical housing (2, 3) for housing a brushless motor, and a first circuit board (50) for driving a motor (5) and a second circuit board (70) on which a control circuit is installed are housed inside the board case. The boards (50, 70) are stacked inside the board case in the direction that is perpendicular to the open face thereof and are disposed so as to extend in directions that are parallel to the open face. The boards (50, 70) are stacked so as to be parallel using a pin header and only the first circuit board (50) is screwed to the board case. Then, a curable resin that hardens from a liquid state is filled inside the board case (40) and is cured with the boards (50, 70) completely immersed therein.

Description

電動工具Electric tool
本発明はモータによって駆動される電動工具に関し、特に、制御回路とインバータ回路の実装上の工夫に関するものである。 The present invention relates to a power tool driven by a motor, and more particularly to a device for mounting a control circuit and an inverter circuit.
ブラシレスモータを用い、マイコン等のコントローラによってモータの回転制御を高精度におこなう電動工具が知られている。ブラシレスモータは、磁気センサを用いてロータの回転位置を検出し、コントローラによってモータの巻線に供給される駆動電流を制御する。このようなブラシレスモータを用いた電動工具の一例(グラインダ)として特許文献1の技術が知られている。特許文献1では、筒状のハウジングと同軸上にブラシレスモータを収容する。モータは外周側にコイルを有するステータが配置され、内周側には回転軸によって回転するもので永久磁石を保持するロータコアが設けられる。回転軸は、モータの前方側と後方側において軸受によって軸支され、後方側軸受の後方にロータの回転位置を検出するための円筒形のセンサ磁石が設けられる。ハウジングの後方側の内部にはセンサ磁石の位置を検出するホールIC等の位置センサ、スイッチング素子を有するインバータ回路、マイコン、モータの制御を行う電源回路等を搭載するための2枚の基板が収容される。 There is known an electric tool that uses a brushless motor and performs high-precision motor rotation control by a controller such as a microcomputer. The brushless motor detects the rotational position of the rotor using a magnetic sensor, and controls the drive current supplied to the motor windings by the controller. As an example (grinder) of an electric tool using such a brushless motor, the technique of Patent Document 1 is known. In Patent Document 1, a brushless motor is accommodated coaxially with a cylindrical housing. In the motor, a stator having a coil is arranged on the outer peripheral side, and on the inner peripheral side, a rotor core that is rotated by a rotating shaft and holds a permanent magnet is provided. The rotating shaft is pivotally supported by a bearing on the front side and the rear side of the motor, and a cylindrical sensor magnet for detecting the rotational position of the rotor is provided behind the rear side bearing. Housed on the rear side of the housing are two substrates for mounting a position sensor such as a Hall IC that detects the position of the sensor magnet, an inverter circuit having a switching element, a microcomputer, a power supply circuit that controls the motor, and the like. Is done.
特開2010-269409号公報JP 2010-269409 A
特許文献1の技術では、インバータ回路とマイコン等をハウジングの長手方向と直交する方向に延びる回路基板に搭載しているので、ハウジングの外形の制限から搭載する素子の大きさが制限されてしまう。近年、電動工具は小型でありながら出力の大きなものが求められるため、インバータ回路等に用いるスイッチング素子や、ピーク電圧対策としてのコンデンサなどが大きくなり、電動工具が大型化してしまうという解決すべき課題があった。また、電動工具の出力を大きくすると、交流電源を直流に変換する電源回路や、FET(電界効果トランジスタ)等のスイッチング素子が大型化するため、それらを実装する回路基板が大きくなってしまい、電動工具の小型化を阻害する。 In the technique of Patent Document 1, an inverter circuit, a microcomputer, and the like are mounted on a circuit board that extends in a direction perpendicular to the longitudinal direction of the housing, so that the size of the mounted element is limited due to the limitation of the outer shape of the housing. In recent years, power tools are required to be small but have a large output, so switching elements used for inverter circuits, capacitors for countermeasures against peak voltage, etc. become large, and the problem to be solved is that the power tools become large was there. In addition, when the output of the power tool is increased, the power supply circuit that converts AC power into DC and the switching elements such as FETs (field effect transistors) become larger, so the circuit board on which they are mounted becomes larger, This hinders the downsizing of tools.
本発明は上記背景に鑑みてなされたもので、その目的は、ハウジングの内部に収容される回路基板の配置を工夫することで実装効率を高め、本体サイズの大型化を抑制した電動工具を提供することにある。本発明の他の目的は、スイッチング素子として大容量のIGBT(絶縁ゲートバイポーラトランジスタ)を用いて高出力化を図りながら設置位置の自由度を向上させると共に、発熱素子の冷却効率を向上させた電動工具を提供することにある。 本発明のさらに他の目的は、IGBT等のスイッチング素子を搭載する回路基板と制御回路を搭載する回路基板を基板ケース内に配置し、これらを樹脂にて固めることにより、信頼性及び耐久性を大幅に高めた電動工具を提供することにある。 The present invention has been made in view of the above background, and its purpose is to provide an electric tool that improves the mounting efficiency by devising the arrangement of the circuit board accommodated in the housing and suppresses the enlargement of the main body size. There is to do. Another object of the present invention is to provide an electric motor that uses a large-capacity IGBT (Insulated Gate Bipolar Transistor) as a switching element to improve the degree of freedom of the installation position while increasing the output while improving the cooling efficiency of the heating element. To provide a tool. Still another object of the present invention is to provide a circuit board on which a switching element such as an IGBT is mounted and a circuit board on which a control circuit is mounted in a board case, and these are hardened with resin, thereby improving reliability and durability. It is to provide a power tool that is greatly enhanced.
本願において開示される発明のうち、代表的なものの特徴を説明すれば、次の通りである。本発明の一つの特徴によれば、ブラシレスモータを駆動させる駆動回路と、駆動回路を搭載する第一回路基板と、駆動回路を制御する制御回路と、制御回路の少なくとも一部を搭載する第二回路基板と、第一回路基板と第二回路基板を収容するものであって一面が開口した開口面を有する基板ケースと、ブラシレスモータと基板ケースとを収容するハウジングを有する電動工具において、基板ケース内に第一回路基板と第二回路基板を収容した。基板ケース内では、開口面と垂直な方向に第一回路基板と第二回路基板を重ねて配置し、且つ、第一回路基板と第二回路基板が開口面と平行な方向に延びるように配置した。第一回路基板は開口面に近い側に配置され、駆動回路に含まれるスイッチング素子は第一回路基板の開口面側に搭載される。また、制御回路を構成する素子(マイクロコンピュータ等)を、第二回路基板の第一回路基板とは反対側の面に搭載した。 Of the inventions disclosed in the present application, typical features will be described as follows. According to one aspect of the present invention, a driving circuit for driving a brushless motor, a first circuit board on which the driving circuit is mounted, a control circuit for controlling the driving circuit, and a second circuit on which at least a part of the control circuit is mounted. In a power tool having a circuit board, a board case for housing a first circuit board and a second circuit board and having an opening surface on one side, and a housing for housing a brushless motor and the board case, the board case A first circuit board and a second circuit board were accommodated therein. In the board case, the first circuit board and the second circuit board are arranged in a direction perpendicular to the opening surface, and the first circuit board and the second circuit board extend in a direction parallel to the opening surface. did. The first circuit board is disposed on the side close to the opening surface, and the switching element included in the drive circuit is mounted on the opening surface side of the first circuit board. Further, an element (such as a microcomputer) constituting the control circuit was mounted on the surface of the second circuit board opposite to the first circuit board.
本発明の他の特徴によれば、複数のスイッチング素子はその長手方向が第一回路基板と直交するように配置され、スイッチング素子の一部が基板ケースの開口面から突出させるように搭載される。第一回路基板にはさらに商用交流電源を直流に変換する整流回路が搭載され、整流回路には平滑用のコンデンサが含まれる。このコンデンサは第一回路基板において開口面から部分的に外部に露出するように搭載される。また、基板ケース内に硬化性の樹脂を流して固められていることにより、第一回路基板と第二回路基板が樹脂に浸るように構成した。制御回路は、スイッチング素子によるインバータ回路を制御するマイコンを含み、マイコンは第二回路基板に搭載される。第一回路基板と第二回路基板とは、コネクタ(例えばピンヘッダ)によって電気的に接続される。 According to another aspect of the present invention, the plurality of switching elements are arranged such that the longitudinal direction thereof is orthogonal to the first circuit board, and a part of the switching elements is mounted so as to protrude from the opening surface of the board case. . The first circuit board is further mounted with a rectifier circuit for converting commercial AC power into DC, and the rectifier circuit includes a smoothing capacitor. The capacitor is mounted on the first circuit board so as to be partially exposed from the opening surface. In addition, the first circuit board and the second circuit board are immersed in the resin by allowing the curable resin to flow and harden in the substrate case. The control circuit includes a microcomputer that controls the inverter circuit by the switching element, and the microcomputer is mounted on the second circuit board. The first circuit board and the second circuit board are electrically connected by a connector (for example, a pin header).
本発明のさらに他の特徴によれば、基板ケースは、開口面から直交するように延びる2つの平行壁部と、平行壁部から反開口部側に向けて幅寸法が小さくなるように絞ることにより底部を形成した容器状である。第一回路基板は第二回路基板より幅が小さく形成され、底部の幅よりも大きい寸法とされる。また、第二回路基板は第一回路基板の幅よりも小さい寸法とされ、底部の幅よりも大きい寸法とされる。 According to still another feature of the present invention, the substrate case is narrowed so that the two parallel wall portions extending orthogonally from the opening surface and the width dimension from the parallel wall portion to the side opposite to the opening portion become smaller. It is the container shape which formed the bottom part by. The first circuit board is formed with a width smaller than that of the second circuit board and is larger than the width of the bottom portion. The second circuit board has a size smaller than the width of the first circuit board and a size larger than the width of the bottom portion.
本発明のさらに他の特徴によれば、ブラシレスモータを収容する筒形状のモータハウジングと、モータハウジングの一方に取り付けられ、基板ケースを収容する筒状のリヤカバーを有し、リヤカバーの外径は、モータハウジングの外径以下とした。また、ブラシレスモータの回転力によって回転する出力軸と、ブラシレスモータの回転力を出力軸に伝達する動力伝達機構と、モータハウジングの他方に取り付けられ、動力伝達機構を収容するギヤケースを有し、出力軸は、ギヤケースから突出し、基板ケースの開口部は、出力軸のギヤケースからの突出方向と同方向に開口するように構成した。 According to still another feature of the present invention, a cylindrical motor housing that houses a brushless motor, and a cylindrical rear cover that is attached to one of the motor housings and houses a substrate case, the outer diameter of the rear cover is The outer diameter of the motor housing was made smaller than the outer diameter. In addition, an output shaft that is rotated by the rotational force of the brushless motor, a power transmission mechanism that transmits the rotational force of the brushless motor to the output shaft, and a gear case that is attached to the other of the motor housing and accommodates the power transmission mechanism, The shaft protrudes from the gear case, and the opening of the substrate case is configured to open in the same direction as the protruding direction of the output shaft from the gear case.
本発明によれば、駆動回路用の基板と制御回路用の基板を、ピンヘッダ等の基板間コネクタ接続にすることにより、スペースを有効活用して大きめのスイッチング素子を用いることができるので、高出力で安定したモータ制御を行うことが可能となった。また、スイッチング素子を開口部から外側に露出するように配置することで冷却効率を向上することができる。さらに、回路基板に搭載される電子素子を樹脂にて覆うようにし、回路基板を冷却ファンの回転により発生する冷却風の風路と隔離して配置したので、外部より進入した水分が電子素子に付着することを抑制でき、電動工具の長寿命化を図ることができる。 According to the present invention, since a board for a drive circuit and a board for a control circuit are connected to each other by a board-to-board connector such as a pin header, a large switching element can be used by effectively utilizing space, so that a high output This makes it possible to perform stable motor control. Further, the cooling efficiency can be improved by arranging the switching element so as to be exposed to the outside from the opening. In addition, the electronic device mounted on the circuit board is covered with resin, and the circuit board is disposed separately from the cooling air flow path generated by the rotation of the cooling fan, so that moisture that has entered from the outside enters the electronic element. Adhesion can be suppressed and the life of the power tool can be extended.
本発明の実施例に係る電動工具1の全体構造を示す縦断面図であり、黒矢印はトリガスイッチをオンにした状態における冷却風の流れを示す。It is a longitudinal cross-sectional view which shows the whole structure of the electric tool 1 which concerns on the Example of this invention, and the black arrow shows the flow of the cooling wind in the state which turned on the trigger switch. モータハウジング2に組み込む前の基板ケース40に搭載された電子素子類を開口面側から見た斜視図である。FIG. 6 is a perspective view of electronic elements mounted on a substrate case 40 before being incorporated in the motor housing 2 when viewed from the opening surface side. 図1のA-A部の断面図である(リヤカバー3の図示を除く)。FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1 (except for the rear cover 3). 図1のA-A部の断面斜視図である。FIG. 2 is a cross-sectional perspective view taken along line AA in FIG. 1. 電動工具1の駆動制御系の回路構成を示すブロック図である。2 is a block diagram illustrating a circuit configuration of a drive control system of the electric tool 1. FIG. 図1の基板ケース40の単体形状を示す斜視図である。It is a perspective view which shows the single-piece | unit shape of the substrate case 40 of FIG. 図1の基板ケース40内への第一回路基板50の収容状態とピンヘッダ56~58の配置状態を説明するための図である。FIG. 5 is a view for explaining a housing state of the first circuit board 50 in the board case 40 of FIG. 1 and an arrangement state of the pin headers 56 to 58; ピンヘッダ58の側面図である。4 is a side view of the pin header 58. FIG.
以下、本発明の実施例を図面に基づいて説明する。尚、以下の図において、同一の機能を有する部分には同一の符号を付し、繰り返しの説明は省略する。また、本明細書においては、前後左右、上下の方向は図中に示す方向であるとして説明する。 Embodiments of the present invention will be described below with reference to the drawings. In the following drawings, parts having the same function are denoted by the same reference numerals, and repeated description is omitted. Further, in this specification, description will be made assuming that the front, rear, left, right, and up and down directions are directions shown in the drawing.
図1は、本発明の実施例に係る電動工具1の上面図である。ここでは電動工具1の一例として、モータ5の回転軸6と直交方向に回転するスピンドル24を設け、スピンドル24に接続される先端工具が円形の砥石30であるディスクグラインダを示している。電動工具1のハウジング(外枠又は筐体)は、動力伝達機構を収容するギヤケース21と、モータ5を収容する筒形状の一体成形されたモータハウジング2と、モータハウジング2の後方に取り付けられ電気機器類を収容する円筒形状のリヤカバー3の3つの主要部品により構成される。ハウジングの形成の仕方は任意であり、本実施例のように前後方向に3つの部分により構成しても良いし、モータハウジング2とリヤカバー3を一体的に構成しても良いし、その他の分割形状で形成しても良い。モータハウジング2は樹脂又は金属製であって、前方側に開口2aを有し、後方側に開口2bを有する略円筒形に構成される。モータハウジング2の内径はモータ5のステータコア9の外径よりも僅かに大きい径を有し、モータハウジング2の外面側は作業者が片手で把持する部分(把持部)を構成する。モータハウジング2の後方側の開口2bには、リヤカバー3の開口3aが取り付けられる。リヤカバー3の外径はモータハウジング2の外径と比較して、ほぼ同等もしくは僅かに小さい外径となっている。 FIG. 1 is a top view of a power tool 1 according to an embodiment of the present invention. Here, as an example of the electric power tool 1, a disc grinder is shown in which a spindle 24 that rotates in a direction orthogonal to the rotation shaft 6 of the motor 5 is provided, and a tip tool connected to the spindle 24 is a circular grindstone 30. A housing (outer frame or casing) of the electric power tool 1 is attached to the rear of the motor housing 2 and a gear case 21 that houses a power transmission mechanism, a cylindrically-shaped integrally formed motor housing 2 that houses a motor 5, and an electric tool. It is composed of three main parts of a cylindrical rear cover 3 that accommodates equipment. The method of forming the housing is arbitrary, and it may be configured by three parts in the front-rear direction as in the present embodiment, the motor housing 2 and the rear cover 3 may be configured integrally, or other divisions. It may be formed in a shape. The motor housing 2 is made of resin or metal and has a substantially cylindrical shape having an opening 2a on the front side and an opening 2b on the rear side. The inner diameter of the motor housing 2 has a diameter slightly larger than the outer diameter of the stator core 9 of the motor 5, and the outer surface side of the motor housing 2 constitutes a portion (gripping part) that the operator grips with one hand. An opening 3 a of the rear cover 3 is attached to the rear opening 2 b of the motor housing 2. The outer diameter of the rear cover 3 is substantially equal to or slightly smaller than the outer diameter of the motor housing 2.
モータ5はモータハウジング2の中心軸方向(前後方向)に沿うように回転軸6が配置され、演算部がロータコア7の回転位置をホールICから構成される回転位置検出素子49a~49c(図では49bしか見えない)にて検出し、複数のスイッチング素子Q1~Q6(図ではQ4~Q6しか見えない)で構成されるインバータ回路60を制御することにより、モータ5の所定のコイル12に順次駆動電力を供給することにより回転磁界を形成してロータを回転させる。モータ5は3相ブラシレスDCモータであり、略円筒状の形状をもつステータコア9の内周側空間内にてロータが回転する。ステータコア9は、円環状の薄い鉄板の積層構造で製造される。ステータコア9の内周側には6つのティース(図示せず)が形成され、各ティースの軸方向前後方向には、樹脂製のインシュレータ10、11が装着され、インシュレータ10、11間にティースを挟んだ形で銅線が巻かれてコイル12が形成される。本実施例では、コイル12をU、V、W相の3相を有するスター結線とすることが好ましく、コイル12へ駆動電力を供給するためのU、V、W相用の3本のリード線(図示せず)が第一回路基板50に接続される。ステータコア9の内周側では、回転軸6にロータコア7が固定される。ロータコア7は円環状の薄い鉄板を軸方向に多数枚積層したもので、断面形状が長方形のスロット部分にN極およびS極を有する平板状の永久磁石8が挿入される。 The motor 5 has a rotation shaft 6 disposed along the central axis direction (front-rear direction) of the motor housing 2, and the calculation unit determines the rotation position of the rotor core 7 from rotation position detection elements 49a to 49c (in the drawing). 49b only), and the inverter circuit 60 composed of a plurality of switching elements Q1 to Q6 (only Q4 to Q6 is visible in the figure) is controlled to drive sequentially to a predetermined coil 12 of the motor 5. By supplying electric power, a rotating magnetic field is formed to rotate the rotor. The motor 5 is a three-phase brushless DC motor, and the rotor rotates in the inner circumferential space of the stator core 9 having a substantially cylindrical shape. The stator core 9 is manufactured by a laminated structure of annular thin iron plates. Six teeth (not shown) are formed on the inner peripheral side of the stator core 9, and resin-made insulators 10 and 11 are mounted in the longitudinal direction of each tooth, and the teeth are sandwiched between the insulators 10 and 11. A coil 12 is formed by winding a copper wire in an elliptical shape. In this embodiment, the coil 12 is preferably a star connection having three phases of U, V, and W phases, and three lead wires for U, V, and W phases for supplying driving power to the coil 12 are used. (Not shown) is connected to the first circuit board 50. On the inner peripheral side of the stator core 9, the rotor core 7 is fixed to the rotating shaft 6. The rotor core 7 is formed by laminating a large number of annular thin steel plates in the axial direction, and a flat permanent magnet 8 having N poles and S poles is inserted into a slot portion having a rectangular cross-sectional shape.
回転軸6は、モータハウジング2に固定される後方側の軸受(第一の軸受)14aと、ギヤケース21とモータハウジング2との接続部付近で固定される前方側の軸受(第二の軸受)14bとにより回転可能に保持される。回転軸6の軸方向に見て軸受14bとモータ5の間には冷却ファン15が設けられる。冷却ファン15は例えばプラスチック製の遠心ファンであって、モータ5が回転すると回転軸6と同期して回転することにより、ハウジングの内部において複数の黒矢印で示す方向に、モータ5や制御回路等を冷却するための風の流れ(冷却風)を発生させる。冷却風は、第一回路基板50の後端付近においてリヤカバー3の上下及び左右側壁面に設けられた吸入口3d、3eから吸引され、第一回路基板50、第二回路基板70を収容する基板ケース40の周囲を後方から前方側に流れて、モータハウジング2の軸受ホルダ部20を通過して、モータ5の収容空間内に流入する。軸受ホルダ部20は、軸受14a(図1参照)の外輪部分を保持する円筒部分から外側に向けて複数の支柱(図示せず)が形成され、支柱以外の場所では空洞となっているので、基板ケース40が収容される空間からモータ5が収容される空間側へ冷却風が流れる構造となっている。 The rotary shaft 6 includes a rear-side bearing (first bearing) 14 a fixed to the motor housing 2 and a front-side bearing (second bearing) fixed in the vicinity of the connection portion between the gear case 21 and the motor housing 2. 14b and is held rotatably. A cooling fan 15 is provided between the bearing 14 b and the motor 5 when viewed in the axial direction of the rotary shaft 6. The cooling fan 15 is, for example, a plastic centrifugal fan. When the motor 5 rotates, the cooling fan 15 rotates in synchronization with the rotating shaft 6, so that the motor 5, the control circuit, etc. A wind flow (cooling air) for cooling the air is generated. The cooling air is sucked from suction ports 3d and 3e provided on the upper and lower and left and right side walls of the rear cover 3 in the vicinity of the rear end of the first circuit board 50, and accommodates the first circuit board 50 and the second circuit board 70. It flows from the rear to the front side around the case 40, passes through the bearing holder portion 20 of the motor housing 2, and flows into the accommodation space of the motor 5. The bearing holder portion 20 is formed with a plurality of columns (not shown) from the cylindrical portion holding the outer ring portion of the bearing 14a (see FIG. 1) toward the outside, and is hollow at locations other than the columns. The cooling air flows from the space in which the substrate case 40 is accommodated to the space in which the motor 5 is accommodated.
モータ5の収容空間に流入した冷却風は、ステータコア9の外周側であってモータハウジング2との間の隙間(図中の黒矢印参照)やステータコア9の内側空間を通って冷却ファン15によって吸引され、ファンカバー16の貫通穴を通ってギヤケース21の貫通穴21bから前方側に、又はファンカバー16の下側の穴21cから前方に排出される。本実施例では、モータ5の回転軸6の軸線上に見て、後方(風上側)から前方側にかけて、第一回路基板50、センサ磁石18、軸受14a、モータ5、冷却ファン15、及び、軸受14bが軸方向に直列(一直線上)に配置される。そして、外気を吸入する吸入口3d、3e等の風窓は、第一回路基板50の周囲であって発熱の大きい素子、特にスイッチング素子Q1~Q6(後述する図2参照)よりも後方側に配置される。このように、本実施例ではモータ5の回転軸方向にみて、ハウジングの後方側から前方側の全外周面にほぼ接するようにして冷却風が流れることにより発熱する素子を効果的に冷却することができる。尚、ここではハウジングの全内周面にほぼ接するように冷却風がまんべんなく流れるよう構成したが、リヤカバー3の収容部分においては開口部から特定の部分に集中して冷却風が流れるように構成して、スイッチング素子Q1~Q6やダイオードブリッジ(図2で後述)に集中して冷却風を当てるように構成しても良い。 Cooling air that has flowed into the housing space of the motor 5 is sucked by the cooling fan 15 through the gap between the outer periphery of the stator core 9 and the motor housing 2 (see the black arrow in the figure) and the inner space of the stator core 9. Then, the air is discharged from the through hole 21 b of the gear case 21 to the front side through the through hole of the fan cover 16 or forward from the lower hole 21 c of the fan cover 16. In this embodiment, the first circuit board 50, the sensor magnet 18, the bearing 14a, the motor 5, the cooling fan 15, and the rear circuit (windward side) to the front side as viewed on the axis of the rotating shaft 6 of the motor 5, The bearings 14b are arranged in series (on a straight line) in the axial direction. The air windows such as the suction ports 3d and 3e for sucking outside air are arranged around the first circuit board 50 and behind the elements that generate large amounts of heat, particularly the switching elements Q1 to Q6 (see FIG. 2 described later). Is done. As described above, in this embodiment, as viewed in the direction of the rotation axis of the motor 5, the element that generates heat when the cooling air flows so as to substantially contact the entire outer peripheral surface from the rear side to the front side of the housing is effectively cooled. Can do. Here, the cooling air is configured to flow evenly so as to be substantially in contact with the entire inner peripheral surface of the housing. However, in the housing portion of the rear cover 3, the cooling air is configured to concentrate on a specific portion from the opening. The cooling air may be concentrated on the switching elements Q1 to Q6 and the diode bridge (described later in FIG. 2).
ギヤケース21は、例えばアルミニウム等の金属の一体成形により作成され、1組の傘歯車(22、23)で構成される動力伝達機構を収容すると共に、出力軸となるスピンドル24を回転可能に保持する。スピンドル24は、モータ5の回転軸の軸線方向(ここでは前後方向)とは略直交方向(ここでは上下方向)に延びるように配置され、回転軸6の前端部分には第1の傘歯車22が設けられ、第1の傘歯車22はスピンドル24の上側端部に取り付けられた第2の傘歯車23に噛合し、この動力伝達手段は減速機構として作用する。スピンドル24の上端側は円筒状のメタル25によって回転可能にギヤケース21に軸支され、中央付近にはボールベアリングによる軸受26によって軸支される。軸受26はスピンドルカバー27を介してギヤケース21に固定される。 The gear case 21 is formed by integrally molding a metal such as aluminum, for example, and accommodates a power transmission mechanism including a pair of bevel gears (22, 23), and rotatably holds a spindle 24 serving as an output shaft. . The spindle 24 is disposed so as to extend in a direction substantially orthogonal to the axial direction (here, the front-rear direction) of the rotating shaft of the motor 5, and the first bevel gear 22 is disposed at the front end portion of the rotating shaft 6. The first bevel gear 22 meshes with a second bevel gear 23 attached to the upper end portion of the spindle 24, and this power transmission means acts as a speed reduction mechanism. The upper end side of the spindle 24 is rotatably supported by a gear case 21 by a cylindrical metal 25, and is supported by a bearing 26 by a ball bearing near the center. The bearing 26 is fixed to the gear case 21 via a spindle cover 27.
スピンドル24の先端には取付ベース28が設けられ、ワッシャナット31によって砥石30等の先端工具が装着される。砥石30は、例えば直径100mmのレジノイドフレキシブルトイシ、フレキシブルトイシ、レジノイドトイシ、サンディングディスク等であり、用いる砥粒の種類の選択により金属、合成樹脂、大理石、コンクリートなどの表面研磨、曲面研磨が可能である。砥石30の後方側の径方向外側及び上側はホイールガード32にて覆われる。尚、電動工具1に装着される先端工具としては、砥石30だけに限られず、ベベルワイヤブラシ、不織布ブラシ、ダイヤモンドホイール等のその他の工具も同様に取り付け可能である。 A mounting base 28 is provided at the tip of the spindle 24, and a tip tool such as a grindstone 30 is attached by a washer nut 31. The grindstone 30 is, for example, a resinoid flexible toy, flexible toy, resinoid toy, sanding disk, etc. having a diameter of 100 mm. Depending on the type of abrasive used, surface grinding and curved surface grinding of metals, synthetic resins, marble, concrete, etc. are possible. is there. The wheel guard 32 covers the radially outer side and upper side of the rear side of the grindstone 30. In addition, as a front-end tool with which the electric tool 1 is mounted | worn, not only the grindstone 30 but other tools, such as a bevel wire brush, a nonwoven fabric brush, and a diamond wheel, can be attached similarly.
モータ5の回転軸6の後端には、回転方向に磁極が異なる磁性体であるセンサ磁石18が取り付けられる。センサ磁石18はロータコア7の回転位置の検出のために取り付けられる薄い円柱形の永久磁石であって、周方向に90度ずつN極とS極が順に形成される。センサ磁石18の後ろ側であって基板ケース40の内側部分には、回転軸6と垂直方向に配置される略半円形のセンサ基板48が設けられ、センサ基板48にはセンサ磁石18の位置を検出する回転位置検出素子49a~49bが設けられる。回転位置検出素子49a~49bは、回転するセンサ磁石18の磁界の変化を検出することにより、ロータコア7の回転位置を検出するものであり、回転方向に所定角度毎、ここでは60°毎に3つ設けられる。 A sensor magnet 18, which is a magnetic body having different magnetic poles in the rotation direction, is attached to the rear end of the rotation shaft 6 of the motor 5. The sensor magnet 18 is a thin cylindrical permanent magnet that is attached to detect the rotational position of the rotor core 7, and an N pole and an S pole are formed in order by 90 degrees in the circumferential direction. A substantially semicircular sensor substrate 48 arranged in a direction perpendicular to the rotation shaft 6 is provided behind the sensor magnet 18 and inside the substrate case 40, and the position of the sensor magnet 18 is set on the sensor substrate 48. Rotation position detecting elements 49a to 49b for detecting are provided. The rotational position detecting elements 49a to 49b detect the rotational position of the rotor core 7 by detecting a change in the magnetic field of the rotating sensor magnet 18, and each rotational position detecting element 49a to 49b is detected at a predetermined angle in the rotational direction. Provided.
略円筒形に形成されるリヤカバー3の内部には、モータ5の回転制御を行う演算部(後述)と、モータ5を駆動させる回路であるインバータ回路60と、外部から図示しない電源コードにて供給される交流を直流に変換するための電源回路65が収容される。本実施例では、これらの回路は共通する第一回路基板50に搭載している。第一回路基板50は電動工具1の長手方向中心軸(モータ5の回転軸6と同軸)に対して平行になるように配置される。ここでは、第一回路基板50と第二回路基板70の表面及び裏面が、前後及び左右方向に延びるように配置される。第一回路基板50は、開口面を有する容器状の基板ケース40の内部に配置され、液体状の状態から硬化させることにより固める硬化性樹脂によって全体が覆われる。ここでは電動工具1の砥石30が下になる時(図1の向きの時)に、基板ケース40の開口面が下側を向くように配置され、インバータ回路60に含まれる複数のスイッチング素子Q1~Q6が、第一回路基板50から下側に延びるように配置される。ここで、本発明の実施例である電動工具1は、スピンドル24に取り付けられた砥石30を回転させて加工材を研磨・研削して加工する作業を主とする工具であり、加工時には切粉や粉塵が発生する。このため作業者は、できる限り加工材を自分より下に位置させることで粉塵などが自分に降りかからないようにする。従って通常であれば、作業者はスピンドル24を上には向けず、好ましくはスピンドル24を左右方向よりも下を向くようにして作業する。このとき、本発明を適用した電動工具1(グラインダ)においては、基板ケース40の開口面40aの開口方向がスピンドル24の向き(ギヤケース21からの突出方向)と同方向としているため、作業時の開口面40aの開口方向は概ね下を向くことになり、加工時に発生する粉塵が風窓からリヤカバー3の内部に侵入したとしても基板ケース40内に溜まっていくことが抑制される。また作業者は、作業を完了した際には持っている電動工具1を地面等の載置箇所に載置するが、特別な事情が無ければ持ったままの向きで電動工具1を載置する。すなわちスピンドル24が下向きの状態で、電動工具1を載置する。このため、例えば冷却風の影響によって基板ケース40内に粉塵等が入り込んだとしても、載置時には重力等の影響で基板ケース40内の粉塵が除去される。 The interior of the rear cover 3 formed in a substantially cylindrical shape is supplied by a calculation unit (described later) that controls the rotation of the motor 5, an inverter circuit 60 that is a circuit for driving the motor 5, and a power cord (not shown) from the outside. A power supply circuit 65 for converting the alternating current to direct current is accommodated. In this embodiment, these circuits are mounted on a common first circuit board 50. The first circuit board 50 is disposed so as to be parallel to the longitudinal center axis (coaxial with the rotating shaft 6 of the motor 5) of the electric power tool 1. Here, the front and back surfaces of the first circuit board 50 and the second circuit board 70 are arranged to extend in the front-rear and left-right directions. The first circuit board 50 is disposed inside a container-like substrate case 40 having an opening surface, and is entirely covered with a curable resin that is hardened by being cured from a liquid state. Here, when the grindstone 30 of the electric power tool 1 is down (in the direction of FIG. 1), the plurality of switching elements Q <b> 1 are arranged so that the opening surface of the substrate case 40 faces downward. To Q6 are arranged to extend downward from the first circuit board 50. Here, the electric power tool 1 according to an embodiment of the present invention is a tool mainly for working by grinding and grinding a workpiece by rotating a grindstone 30 attached to a spindle 24. And dust is generated. For this reason, the worker keeps the workpiece as low as possible so that dust or the like does not fall on himself / herself. Therefore, normally, the operator works with the spindle 24 not facing up, preferably with the spindle 24 facing down rather than in the left-right direction. At this time, in the electric tool 1 (grinder) to which the present invention is applied, the opening direction of the opening surface 40a of the substrate case 40 is the same as the direction of the spindle 24 (the protruding direction from the gear case 21). The opening direction of the opening surface 40a is generally directed downward, and even if dust generated during processing enters the interior of the rear cover 3 from the wind window, accumulation in the substrate case 40 is suppressed. Further, when the worker completes the work, the power tool 1 is placed on a place such as the ground, but if there are no special circumstances, the power tool 1 is placed in the direction it is held. . That is, the electric tool 1 is placed with the spindle 24 facing downward. For this reason, even if dust or the like enters the substrate case 40 due to the influence of cooling air, for example, the dust in the substrate case 40 is removed due to the influence of gravity or the like when placed.
インバータ回路60は、コイル12に大駆動電流を通電する必要があるため、スイッチング素子Q1~Q6として、例えばFET(電界効果トランジスタ)やIGBTのような大容量の出力トランジスタが用いられる。これらスイッチング素子Q1~Q6は発熱が大きいので冷却効果を向上させるための放熱構造が考慮され、本実施例ではスイッチング素子Q1~Q6の放熱板に冷却用の金属板が更に取り付けられる。放熱板と金属板は、吸入口となる図示しない風窓よりも風下側(モータ側)に配置されるので、黒矢印で示す冷却風に直接晒されることになる。スイッチング素子Q1~Q6の後方側には電源回路65が設けられる。本実施例の電源回路65は、外部から供給される商用電源(交流)を直流に変換する整流回路を含んで構成される。電源回路65は配線の効率性から、リヤカバー3の後端面から外部に伸びるように配線される電源コード(図示せず)に近いように基板ケース40の後方側であって、スイッチング素子Q1~Q6よりも後方側(モータ5から遠い反モータ側)に搭載される。 Since the inverter circuit 60 needs to pass a large drive current through the coil 12, a large-capacity output transistor such as an FET (field effect transistor) or IGBT is used as the switching elements Q1 to Q6. Since these switching elements Q1 to Q6 generate a large amount of heat, a heat dissipating structure for improving the cooling effect is considered. In this embodiment, a cooling metal plate is further attached to the heat dissipating plates of the switching elements Q1 to Q6. Since the heat radiating plate and the metal plate are arranged on the leeward side (motor side) from the wind window (not shown) serving as the suction port, they are directly exposed to the cooling air indicated by the black arrows. A power supply circuit 65 is provided on the rear side of the switching elements Q1 to Q6. The power supply circuit 65 of the present embodiment includes a rectifier circuit that converts commercial power (AC) supplied from the outside into DC. The power supply circuit 65 is located on the rear side of the substrate case 40 so as to be close to a power cord (not shown) wired so as to extend from the rear end surface of the rear cover 3 to the outside from the efficiency of wiring, and the switching elements Q1 to Q6. It is mounted on the rear side (the non-motor side far from the motor 5).
基板ケース40により画定される空間内(容器内)には、第一回路基板50に加えてさらに、回転位置検出素子49a~49bを搭載するセンサ基板48が設けられる。センサ基板48はモータ5の回転軸方向と直交するように配置される。基板ケース40の後方側には電源コード保持部43とリヤカバー3の内壁面と突き当てる突当部44が形成される。 In the space defined by the substrate case 40 (inside the container), in addition to the first circuit substrate 50, a sensor substrate 48 on which the rotational position detecting elements 49a to 49b are mounted is provided. The sensor substrate 48 is disposed so as to be orthogonal to the rotation axis direction of the motor 5. On the rear side of the substrate case 40, a power cord holding portion 43 and an abutting portion 44 that abuts against the inner wall surface of the rear cover 3 are formed.
図2はモータハウジング2に組み込む前の基板ケース40を開口面側から見た斜視図である。基板ケース40の内部であって、第一回路基板50(図1参照)には、主に、電源回路65と、6個のスイッチング素子Q1~Q6を含むインバータ回路60が搭載される。第一回路基板50においては、入力及び出力点に近いという配線上の利点と、冷却風の流れに沿う点から、電源回路65が第一回路基板50の後方側に配置され、インバータ回路60が回路基板の前方側に配置される。本実施例ではモータ5の出力増大のために大電流の駆動電流が流れるように、スイッチング素子Q1~Q6としてIGBT(絶縁ゲートバイポーラトランジスタ)を用いている。ここで用いられるIGBTは、偏平状の立方体のセラミックパッケージ内に収容され、1つの面(底面)からゲート、コレクタ、エミッタの3本の端子が平行に延び、3本の端子が延びる面と隣接する背面(偏平状の広い面積を有する面の一つ)には、放熱板が埋め込まれている。放熱板の一部には別途準備される放熱手段に取り付けるためのネジ穴が形成される。ここでは、スイッチング素子Q1~Q6の3つの端子が第一回路基板50に半田付けされ、型式番号等が印字される正面が第一回路基板50に対して直交するように配置される。 FIG. 2 is a perspective view of the substrate case 40 before being assembled in the motor housing 2 as seen from the opening surface side. A power circuit 65 and an inverter circuit 60 including six switching elements Q1 to Q6 are mainly mounted on the first circuit board 50 (see FIG. 1) inside the substrate case 40. In the first circuit board 50, the power supply circuit 65 is disposed on the rear side of the first circuit board 50 in view of the wiring advantage of being close to the input and output points and the flow of the cooling air. It is arranged on the front side of the circuit board. In the present embodiment, IGBTs (insulated gate bipolar transistors) are used as the switching elements Q1 to Q6 so that a large drive current flows in order to increase the output of the motor 5. The IGBT used here is housed in a flat cubic ceramic package, and three terminals of the gate, collector, and emitter extend in parallel from one surface (bottom surface) and are adjacent to the surface from which the three terminals extend. A heat radiating plate is embedded in the back surface (one of flat and wide surfaces). A screw hole for attaching to a heat radiating means prepared separately is formed in a part of the heat radiating plate. Here, the three terminals of the switching elements Q1 to Q6 are soldered to the first circuit board 50, and the front face on which the model number and the like are printed is arranged so as to be orthogonal to the first circuit board 50.
スイッチング素子Q1~Q3の正面及び背面は、基板ケース40の一方の側壁面41cと平行になるように並べて配置され、スイッチング素子Q4~Q6の正面及び背面は、基板ケース40の他方の側壁面41dと平行になるように並べて配置される。スイッチング素子Q4~Q6と基板ケース40の側壁面41dとの間には、モータ5のコイル12に接続するための3つのコネクタ55a~55cが設けられる。この図から理解できるように、第一回路基板50に搭載されるスイッチング素子Q1~Q6は、基板ケース40の内部空間のうち前後方向に見て半分以上を占める大型のものである。スイッチング素子Q1~Q6の後方側の空間には電源回路65を構成する素子類が搭載される。ここでは中央にダイオードブリッジ66、その隣にチョークコイル69と、コンデンサ68a、これらの後方側にフィルムコンデンサ67とコンデンサ68bが搭載される。この際、コンデンサ68a、68bは第一回路基板50において開口面から部分的に外部に露出するように搭載される。チョークコイル69とフィルムコンデンサ67は、商用交流電源100から流入するノイズ及びスイッチング制御等によって発生する回路全体のノイズを除去するノイズフィルタとして働く。 The front and back surfaces of the switching elements Q1 to Q3 are arranged side by side so as to be parallel to one side wall surface 41c of the substrate case 40, and the front and back surfaces of the switching elements Q4 to Q6 are the other side wall surface 41d of the substrate case 40. Are arranged side by side in parallel. Between the switching elements Q4 to Q6 and the side wall surface 41d of the substrate case 40, three connectors 55a to 55c for connecting to the coil 12 of the motor 5 are provided. As can be understood from this figure, the switching elements Q1 to Q6 mounted on the first circuit board 50 are large-sized elements that occupy more than half of the internal space of the substrate case 40 when viewed in the front-rear direction. Elements constituting the power supply circuit 65 are mounted in the space behind the switching elements Q1 to Q6. Here, a diode bridge 66 is mounted at the center, a choke coil 69 and a capacitor 68a are mounted next to the diode bridge 66, and a film capacitor 67 and a capacitor 68b are mounted on the rear side thereof. At this time, the capacitors 68a and 68b are mounted on the first circuit board 50 so as to be partially exposed from the opening surface. The choke coil 69 and the film capacitor 67 function as a noise filter that removes noise flowing from the commercial AC power supply 100 and noise of the entire circuit generated by switching control and the like.
スイッチング素子Q1~Q6は、半導体素子がセラミック等の略直方体のパッケージに封入され、3本の金属端子がパッケージの下側から延びるものであって、パッケージの背面側には金属製の放熱板が埋め込まれる。この放熱板は面状であって面の広がり方向が、第一回路基板50の長手方向(図2では前後方向)と水平かつ直交方向となるようにスイッチング素子Q1~Q6が配置される。また、パッケージ背面の放熱板には、放熱用の金属板81~86が固定される。通常、IGBTのコレクタ端子はパッケージ背面側の放熱板と導通されているので、回路構成上、コレクタ端子が共通接続の場合には、複数のスイッチング素子Q1~Q3に共通の金属板を固定しても良い。他方、インバータ回路60の残りの3個のスイッチング素子Q4~Q6は一列に並ぶように配置され、かつ、スイッチング素子Q1~Q3と平行になるように配置される。スイッチング素子Q4~Q6のパッケージ背面の放熱板には、放熱用の金属板が設けられるが、これらのコレクタ端子は共通接続ではない(異極間である)ため、互いに独立した金属板としなければならない。 In the switching elements Q1 to Q6, a semiconductor element is enclosed in a substantially rectangular parallelepiped package such as ceramic, and three metal terminals extend from the lower side of the package. A metal heat sink is provided on the back side of the package. Embedded. The heat radiating plate is planar, and the switching elements Q1 to Q6 are arranged so that the spreading direction of the heat radiating plate is horizontal and orthogonal to the longitudinal direction of the first circuit board 50 (the front-rear direction in FIG. 2). In addition, heat radiating metal plates 81 to 86 are fixed to the heat radiating plate on the back of the package. Normally, the collector terminal of the IGBT is electrically connected to the heat sink on the back side of the package. Therefore, when the collector terminal is commonly connected, a common metal plate is fixed to the plurality of switching elements Q1 to Q3. Also good. On the other hand, the remaining three switching elements Q4 to Q6 of the inverter circuit 60 are arranged in a line and arranged in parallel with the switching elements Q1 to Q3. The heat dissipation plate on the back of the package of switching elements Q4 to Q6 is provided with a metal plate for heat dissipation, but these collector terminals are not connected in common (between different polarities), so they must be made independent of each other. Don't be.
図3は、図1のA-A部の断面図である。スイッチング素子Q2、Q5の脚部は第一回路基板50に半田付けによって固定される。第一回路基板50は、単層又は多層のプリント基板であって、ここでは多層のガラスコンポジット基板が用いられる。スイッチング素子Q2、Q5の背面側(型番等の印字面とは反対側の面)には、放熱用の金属板82、85がネジ87b、87eによって固定される。金属板82、85はアルミ合金の厚板の小片である。スイッチング素子Q2と側壁面41cの間には、図示しないトリガレバーと連動して動作する電子スイッチ51が搭載される。電子スイッチ51は、モータ5のオン又はオフを切り替えるためのもので、第一回路基板50上であって開口面40a側からアクセスできる位置に搭載する。電子スイッチ51の上部には片持ち式で揺動可能な金属アーム51aが設けられ、ハウジングの外部に部分的に露出するように設けられる図示しないスライドスイッチにより操作される。スライドスイッチが移動すると、金属アーム51aが押されることにより電子スイッチ51のプランジャ(図示せず)が移動してスイッチがオンになる。スイッチング素子Q5と側壁面41dの間には、スイッチング素子Q1~Q6の出力をモータ5のコイル12に伝えるためのコネクタ55a~55cが設けられる。 3 is a cross-sectional view taken along a line AA in FIG. The legs of the switching elements Q2, Q5 are fixed to the first circuit board 50 by soldering. The first circuit board 50 is a single-layer or multilayer printed board, and a multilayer glass composite board is used here. On the back side of the switching elements Q2 and Q5 (surface opposite to the print surface of the model number or the like), heat radiating metal plates 82 and 85 are fixed by screws 87b and 87e. The metal plates 82 and 85 are small pieces of aluminum alloy thick plates. An electronic switch 51 that operates in conjunction with a trigger lever (not shown) is mounted between the switching element Q2 and the side wall surface 41c. The electronic switch 51 is for switching the motor 5 on and off, and is mounted on the first circuit board 50 at a position accessible from the opening surface 40a side. A metal arm 51a that can swing in a cantilever manner is provided on the top of the electronic switch 51, and is operated by a slide switch (not shown) provided so as to be partially exposed to the outside of the housing. When the slide switch moves, the plunger (not shown) of the electronic switch 51 is moved by pressing the metal arm 51a, and the switch is turned on. Connectors 55a to 55c for transmitting the outputs of the switching elements Q1 to Q6 to the coil 12 of the motor 5 are provided between the switching element Q5 and the side wall surface 41d.
第一回路基板50の底面41g側には、第二回路基板70が第一回路基板50と所定の距離を隔てた状態で配置される。第二回路基板70も、単層又は多層のプリント基板であって、ここでは多層のガラスコンポジット基板が用いられる。この第一回路基板50と第二回路基板70を所定の距離を隔てた状態で保持するためと、必要な配線を行うために、本実施例ではピンヘッダ56、58を用いて2つの回路基板が連結される。ピンヘッダ56、58は、上下方向に延びる細い部材が金属のピンとなっており、角柱状のケースに保持される。ここでピンヘッダの構成を図8を用いて説明する。 On the bottom surface 41g side of the first circuit board 50, the second circuit board 70 is disposed in a state of being separated from the first circuit board 50 by a predetermined distance. The second circuit board 70 is also a single-layer or multilayer printed board, and a multilayer glass composite board is used here. In order to hold the first circuit board 50 and the second circuit board 70 at a predetermined distance and to perform necessary wiring, in this embodiment, two circuit boards are formed using pin headers 56 and 58. Connected. In the pin headers 56 and 58, thin members extending in the vertical direction are metal pins, and are held in a prismatic case. Here, the configuration of the pin header will be described with reference to FIG.
図8は連結された複数のピンヘッダ58の側面図である。ピンヘッダ58は上下方向に延びる細い金属のピン58aの長手方向中間付近に、合成樹脂製のケース58bを設けたものである。各ケース58bの間は、樹脂製で比較的肉薄の連結部58cによって連結されており、使用者は必要に応じて連結部58cを切断して、連結されたピン58aの数を調整して使用する。ピン同士の間隔P(ピッチ)は、1~10mm程度のものが使いやすく、ここでは2mmのものを使用している。図8では、一例として6ピンヘッダを示しているが、連結数は基板の仕様に合わせ適宜変更し、本実施例のピンヘッダ58は13ピンとされる(図7にて後述)。ピンヘッダ56も同様の部品を用いており、ピンヘッダ56は2ピンとされる(図7にて後述)。ケース58bの軸方向長さLを選択することにより隣接する基板間の距離(所定の距離)を任意に設定することができる。ここでは、L=5mm程度としている。このように第一回路基板50と第二回路基板70をピンヘッダ56~58を用いて固定するようにすれば、第一回路基板50側と第二回路基板70側の銅箔などの導電体による回路配線を電気的に接続するとともに、物理的に第一回路基板50と第二回路基板70を連結することが可能となる。再び図3に戻る。 FIG. 8 is a side view of a plurality of connected pin headers 58. The pin header 58 is provided with a synthetic resin case 58b in the vicinity of the middle in the longitudinal direction of a thin metal pin 58a extending in the vertical direction. Each case 58b is connected by a relatively thin connecting portion 58c made of resin, and the user cuts the connecting portion 58c as necessary to adjust the number of connected pins 58a. To do. The distance P (pitch) between the pins is about 1 to 10 mm, which is 2 mm. In FIG. 8, a 6-pin header is shown as an example, but the number of connections is changed as appropriate according to the specifications of the board, and the pin header 58 of this embodiment has 13 pins (described later in FIG. 7). The pin header 56 uses the same components, and the pin header 56 has two pins (described later in FIG. 7). By selecting the axial length L of the case 58b, the distance (predetermined distance) between adjacent substrates can be arbitrarily set. Here, L = about 5 mm. Thus, if the first circuit board 50 and the second circuit board 70 are fixed using the pin headers 56 to 58, the first circuit board 50 and the second circuit board 70 are made of a conductor such as a copper foil. The circuit wiring can be electrically connected and the first circuit board 50 and the second circuit board 70 can be physically coupled. Returning again to FIG.
第一回路基板50は、基板ケース40の内部であって側面に形成された段差部45a、45cにて支持し、後述するネジによって回路基板に固定する。一方、第二回路基板70は第一回路基板50にピンヘッダ56~58によって固定される。換言すれば、第一回路基板50と第二回路基板70とは、ピンヘッダ56~58によって相対移動不能なように電気的に接続される。このように一面が開口した開口面40aを有する基板ケース40内において、第一回路基板50と第二回路基板70は、開口面40aと垂直な方向に向けて重ねて配置され、且つ、開口面40aと第一回路基板50と第二回路基板70の面が平行な方向に延びるように配置される。第二回路基板70の底面側には、制御回路を形成するための電子素子、例えばマイコンや、コンデンサ、抵抗器などが搭載される。さらに、本実施例ではマイコン用の低電圧の定電圧電源回路(後述)も第二回路基板70の底面側に搭載される。基板ケース40内の電子素子配置空間は、第一回路基板50の開口面40a側か、第二回路基板の底面41g側か、第一回路基板50と第二回路基板70との間になるが、この順に狭くなっている。故に本実施例では、比較的大きな電子素子である、IGBTやダイオードブリッジ66、ノイズフィルタ用のフィルムコンデンサ67とチョークコイル69、平滑用のコンデンサ68a、68bを第一回路基板50の開口面40a側に配置し、比較的小さな電子素子である演算部71(マイコン)やコンデンサ74等を第二回路基板の底面41g側に配置した。これにより、略円筒状である基板ケース40内の空間を効率よく利用し、電子素子の実装効率を高めている。 The first circuit board 50 is supported by stepped portions 45a and 45c formed on the side surface inside the substrate case 40, and fixed to the circuit board with screws described later. On the other hand, the second circuit board 70 is fixed to the first circuit board 50 by pin headers 56 to 58. In other words, the first circuit board 50 and the second circuit board 70 are electrically connected by the pin headers 56 to 58 so that they cannot be moved relative to each other. Thus, in the substrate case 40 having the opening surface 40a with one surface opened, the first circuit board 50 and the second circuit board 70 are arranged so as to be overlapped in a direction perpendicular to the opening surface 40a, and the opening surface The surface of 40a, the 1st circuit board 50, and the 2nd circuit board 70 is arrange | positioned so that it may extend in a parallel direction. On the bottom surface side of the second circuit board 70, electronic elements for forming a control circuit, for example, a microcomputer, a capacitor, a resistor, and the like are mounted. Furthermore, in this embodiment, a low voltage constant voltage power supply circuit (described later) for the microcomputer is also mounted on the bottom surface side of the second circuit board 70. The electronic device arrangement space in the substrate case 40 is on the opening surface 40a side of the first circuit board 50, on the bottom surface 41g side of the second circuit board, or between the first circuit board 50 and the second circuit board 70. , Narrow in this order. Therefore, in this embodiment, an IGBT, a diode bridge 66, a noise filter film capacitor 67 and a choke coil 69, and smoothing capacitors 68a and 68b, which are relatively large electronic elements, are arranged on the opening surface 40a side of the first circuit board 50. The arithmetic unit 71 (microcomputer), the capacitor 74, and the like, which are relatively small electronic elements, are arranged on the bottom surface 41g side of the second circuit board. Thereby, the space in the substantially cylindrical case 40 is efficiently used, and the mounting efficiency of the electronic element is increased.
基板ケース40の内部空間は、底面41gから矢印90に示す位置まで樹脂にて満たされる。図示しない樹脂は、基板ケース40の開口面40aが上側になるように載置して、基板ケース40の内部に液体状にある樹脂を満たした後に硬化させるもので、スイッチング素子Q1~Q6は液面から上下位置の半分程度が浸ることになり、後方側のコンデンサ68a、68bやダイオードブリッジ66等は上部が露出することになる。基板ケース40内は底面41g部分から液面(破線90)まで全ての部分が樹脂で満たされるため、第一回路基板50と第二回路基板70は樹脂で強固に固定され、がたつくことが無い。このように、第一回路基板50と第二回路基板70を容器状の基板ケース40内に収容し、その中に樹脂を充填して第一回路基板50と第二回路基板70が完全に又はほぼ完全に浸漬するようにしたので、第一回路基板50の防水性、防塵性を著しく高めることができる。 The internal space of the substrate case 40 is filled with resin from the bottom surface 41 g to the position indicated by the arrow 90. The resin (not shown) is placed so that the opening surface 40a of the substrate case 40 is on the upper side, and the substrate case 40 is filled with a resin in a liquid form and then cured, and the switching elements Q1 to Q6 are liquid crystals. About half of the vertical position is immersed from the surface, and the upper portions of the capacitors 68a and 68b and the diode bridge 66 on the rear side are exposed. Since all the parts from the bottom 41g part to the liquid level (broken line 90) are filled with the resin in the substrate case 40, the first circuit board 50 and the second circuit board 70 are firmly fixed with the resin and do not rattle. Thus, the first circuit board 50 and the second circuit board 70 are accommodated in the container-like substrate case 40, and the resin is filled therein so that the first circuit board 50 and the second circuit board 70 are completely or Since it is almost completely immersed, the waterproofness and dustproofness of the first circuit board 50 can be remarkably enhanced.
次にハウジング(モータハウジング2及びリヤカバー3)と基板ケース40との取付構造を、図1と図4を用いて説明する。図4は、図1のA-A部の断面斜視図であるが、ここでは図2、図3と同様に電動工具1の上下を逆にして、基板ケース40の開口面40aが図中で上向きとなるように図示している。また、樹脂の図示は省略している。長手方向(軸方向A1)に垂直な断面形状(図4の断面形状)においては、基板ケース40の外形は円筒形のリヤカバー3の内壁形状にほぼ沿った形とされ、リヤカバー3の内壁部分の両側に形成された、軸方向A1と同方向に連続したリブ3cに基板ケース40の開口面40aの縁部が当接することで、基板ケース40がリヤカバー3に対して位置決めされる。この状態でネジボス42a、42bを介して基板ケース40モータハウジング2にネジ88a、88bによって固定する。そして基板ケース40を収容しながらリヤカバー3をモータハウジング2の後方に取り付け、ネジ39によって基板ケース40に対してリヤカバー3を固定する。こうしてリヤカバー3は基板ケース40を介してモータハウジング2に固定される。 Next, a mounting structure between the housing (the motor housing 2 and the rear cover 3) and the substrate case 40 will be described with reference to FIGS. 4 is a cross-sectional perspective view taken along the line AA in FIG. 1. Here, as in FIGS. 2 and 3, the electric tool 1 is turned upside down, and the opening surface 40a of the substrate case 40 is shown in the drawing. It is shown so as to face upward. Also, illustration of the resin is omitted. In a cross-sectional shape (cross-sectional shape in FIG. 4) perpendicular to the longitudinal direction (axial direction A1), the outer shape of the substrate case 40 is substantially along the inner wall shape of the cylindrical rear cover 3, and the inner wall portion of the rear cover 3 The substrate case 40 is positioned with respect to the rear cover 3 by the edges of the opening surface 40a of the substrate case 40 coming into contact with the ribs 3c formed on both sides and continuing in the same direction as the axial direction A1. In this state, the board case 40 is fixed to the motor housing 2 by screws 88a and 88b via screw bosses 42a and 42b. Then, the rear cover 3 is attached to the rear of the motor housing 2 while accommodating the substrate case 40, and the rear cover 3 is fixed to the substrate case 40 with screws 39. Thus, the rear cover 3 is fixed to the motor housing 2 via the substrate case 40.
基板ケース40は開口面40aを有する容器状であって、内部空間に液体を入れてもこぼれないように形成されるが、前述したように、電動工具1のハウジング内に第一回路基板50及び第二回路基板70を収容する際に、スイッチング素子Q1~Q6が倒立するように、つまり基板ケース40の開口面40aが下側に開口するように配置した実装した。これにより開口面40aの法線方向が下側(スピンドル24のギヤケース21からの突出方向)を向くように状態で配置される。また、スイッチング素子Q1~Q6(図ではQ2、Q5しか見えない)は、上端側の一部(ここでは基板から突出する長さの約半分)が基板ケース40の開口面40aからケース外に突出するように配置されるので、冷却風路内に直接晒すことができる。さらに、スイッチング素子Q2、Q5の内側には、放熱用の金属板82、85が設けられるので、一層冷却効果が向上する。 The substrate case 40 has a container shape having an opening surface 40a and is formed so as not to spill even when liquid is put into the internal space. As described above, the first circuit board 50 and the housing of the electric tool 1 are provided in the housing. When the second circuit board 70 is accommodated, mounting is performed such that the switching elements Q1 to Q6 are inverted, that is, the opening surface 40a of the board case 40 is opened downward. As a result, the normal direction of the opening surface 40a is arranged in a state in which it faces downward (the direction in which the spindle 24 protrudes from the gear case 21). Further, the switching elements Q1 to Q6 (only Q2 and Q5 are visible in the figure) have a part on the upper end side (here, about half of the length protruding from the substrate) protruding from the opening surface 40a of the substrate case 40 to the outside of the case. Therefore, it can be directly exposed to the cooling air passage. Furthermore, since the metal plates 82 and 85 for heat dissipation are provided inside the switching elements Q2 and Q5, the cooling effect is further improved.
以上のように開口面40aを下にするよう倒立した状態で容器状の基板ケース40を電動工具のハウジング内に配置することで、スイッチング素子Q1~Q6等の耐久性を高めることが可能となった。特に、スイッチング素子Q1~Q6の間にたまった鉄粉等が、電動工具1の使用時や図1の方向への載置時に、その衝撃によってゴミや水滴がリヤカバー3の内部の下面に落ちやすくなる。 As described above, by placing the container-like substrate case 40 in the electric tool housing in an inverted state with the opening surface 40a facing down, the durability of the switching elements Q1 to Q6 and the like can be improved. It was. In particular, iron powder or the like accumulated between the switching elements Q1 to Q6 is likely to cause dust and water droplets to fall on the lower surface inside the rear cover 3 due to the impact when the electric tool 1 is used or placed in the direction of FIG. Become.
電子スイッチ51の金属アーム51aは、開口面40aからケース外に突出し、突出した部分に図示しないスイッチレバーの当接部(図示せず)が接触または離間する。スイッチング素子Q5と基板ケース40の側壁面41dとの間には、コネクタ55a~55cが配置され、コネクタ55a~55cの上部にはモータ5のコイル12のU相、V相、W相へ供給されるためのリード線13a~13cが配置される。基板ケース40は前方側に2つのネジボスを有し、ネジ88a、88bによってモータハウジング2に固定される。 The metal arm 51a of the electronic switch 51 protrudes from the opening surface 40a to the outside of the case, and a contact portion (not shown) of a switch lever (not shown) contacts or separates from the protruding portion. Connectors 55a to 55c are arranged between the switching element Q5 and the side wall surface 41d of the substrate case 40, and are supplied to the U phase, V phase, and W phase of the coil 12 of the motor 5 above the connectors 55a to 55c. Lead wires 13a to 13c are arranged for this purpose. The substrate case 40 has two screw bosses on the front side, and is fixed to the motor housing 2 by screws 88a and 88b.
次に図5を用いてモータ5の駆動制御系の回路構成を説明する。電源回路65にはダイオードブリッジ66、チョークコイル69、フィルムコンデンサ67、電解コンデンサ68a等によって構成される。ダイオードブリッジ66は、商用交流電源100から入力される交流を全波整流する。電源回路65の出力側であって、インバータ回路60との間には平滑用のコンデンサ68aが接続される。インバータ回路60は6つのスイッチング素子Q1~Q6を含んで構成され、演算部71から供給されるゲート信号H1~H6によってスイッチング動作が制御される。電動工具1がディスクグラインダの場合は、他の電動工具(例えばインパクトドライバ等)に比較して大きな出力が必要となることから、ここではスイッチング素子Q1~Q6としてIGBTが用いられる。しかしながら、スイッチング素子はIGBTだけでなく、FET(電界効果トランジスタ)やその他の素子を用いるようにしても良い。インバータ回路60の出力は、モータ5のコイル12のU相、V相、W相に接続される。電源回路65の出力側には定電圧電源回路72が接続される。ここでは、電源回路65、インバータ回路60、電子スイッチ51の回路は第一回路基板50の開口面40a側に搭載される。 Next, the circuit configuration of the drive control system of the motor 5 will be described with reference to FIG. The power supply circuit 65 includes a diode bridge 66, a choke coil 69, a film capacitor 67, an electrolytic capacitor 68a, and the like. The diode bridge 66 performs full-wave rectification on the AC input from the commercial AC power supply 100. A smoothing capacitor 68 a is connected to the output side of the power supply circuit 65 and the inverter circuit 60. The inverter circuit 60 includes six switching elements Q1 to Q6, and the switching operation is controlled by the gate signals H1 to H6 supplied from the arithmetic unit 71. When the electric power tool 1 is a disc grinder, a larger output is required as compared with other electric power tools (for example, impact driver or the like). Therefore, IGBTs are used here as the switching elements Q1 to Q6. However, the switching element is not limited to the IGBT but may be an FET (field effect transistor) or other element. The output of the inverter circuit 60 is connected to the U phase, V phase, and W phase of the coil 12 of the motor 5. A constant voltage power supply circuit 72 is connected to the output side of the power supply circuit 65. Here, the power supply circuit 65, the inverter circuit 60, and the electronic switch 51 are mounted on the opening surface 40 a side of the first circuit board 50.
モータ5のステータコア9の内側では、永久磁石8を有するロータが回転する。ロータの回転軸6には位置検出用のセンサ磁石18が接続され、センサ磁石18の位置をホールIC等の回転位置検出素子49a~49cにて検出することにより演算部71はモータ5の回転位置を検出することができる。 Inside the stator core 9 of the motor 5, the rotor having the permanent magnet 8 rotates. A sensor magnet 18 for position detection is connected to the rotation shaft 6 of the rotor, and the calculation unit 71 detects the position of the sensor magnet 18 by rotation position detection elements 49a to 49c such as Hall ICs, whereby the calculation unit 71 rotates the rotation position of the motor 5. Can be detected.
演算部71は、モータのオン・オフ及び回転制御を行うための制御手段であって、図示しないマイクロコンピュータ(マイコン)を用いて主に構成される。演算部71は主に第二回路基板70に搭載され、マイコンは第二回路基板70の底面に面した側、即ち開口面40aとは反対側(反開口部側)に搭載される。演算部71は、電子スイッチ51の操作に伴い入力される起動信号と、図示しない変速手段によって設定された速度に基づき、モータ5の回転を制御し、コイルU、V、Wへの通電時間と駆動電圧を制御する。演算部71からの出力信号(駆動制御信号)は、インバータ回路60の6個のスイッチング素子Q1~Q6の各ゲートに接続され、各スイッチング素子Q1~Q6をオン・オフするための駆動信号H1~H6を供給する。インバータ回路60の6個のスイッチング素子Q1~Q6の各コレクタ又は各エミッタは、スター接続されたコイル12のU相、V相、W相に接続される。 The computing unit 71 is a control means for performing on / off and rotation control of the motor, and is mainly configured by using a microcomputer (not shown). The computing unit 71 is mainly mounted on the second circuit board 70, and the microcomputer is mounted on the side facing the bottom surface of the second circuit board 70, that is, on the side opposite to the opening surface 40a (on the side opposite to the opening). The calculation unit 71 controls the rotation of the motor 5 based on the start signal input in accordance with the operation of the electronic switch 51 and the speed set by a transmission means (not shown), and the energization time to the coils U, V, W Control drive voltage. An output signal (drive control signal) from the calculation unit 71 is connected to the gates of the six switching elements Q1 to Q6 of the inverter circuit 60, and drive signals H1 to H1 for turning on / off the switching elements Q1 to Q6. Supply H6. The collectors or emitters of the six switching elements Q1 to Q6 of the inverter circuit 60 are connected to the U phase, V phase, and W phase of the star-connected coil 12.
スイッチング素子Q1~Q6は、演算部71から入力される駆動信号H1~H6に基づきスイッチング動作を行い、商用交流電源100から電源回路65を介して供給された直流電圧を、3相(U相、V相、W相)電圧Vu、Vv、Vwとして、モータ5に供給する。モータ5に供給される電流の大きさは、電源回路65とインバータ回路60との間に接続された電流検出用のシャント抵抗54の両端の電圧値を検出することにより演算部71によって検出される。 The switching elements Q1 to Q6 perform a switching operation based on the drive signals H1 to H6 input from the arithmetic unit 71, and the DC voltage supplied from the commercial AC power supply 100 via the power supply circuit 65 is converted into three phases (U phase, V-phase and W-phase) voltages Vu, Vv, and Vw are supplied to the motor 5. The magnitude of the current supplied to the motor 5 is detected by the computing unit 71 by detecting the voltage value across the current detecting shunt resistor 54 connected between the power supply circuit 65 and the inverter circuit 60. .
定電圧電源回路72は、ダイオードブリッジ66の出力側に接続され、マイコン等により構成される演算部71への安定化した基準電圧(低電圧)の直流を供給する。定電圧電源回路72は、ダイオード52、コンデンサ68b、IPD回路73、コンデンサ74及びレギュレータ75を含んで構成される。定電圧電源回路72のうちIPD回路73、コンデンサ74及びレギュレータ75は第二回路基板70に搭載される。 The constant voltage power supply circuit 72 is connected to the output side of the diode bridge 66 and supplies a stabilized reference voltage (low voltage) direct current to the arithmetic unit 71 configured by a microcomputer or the like. The constant voltage power circuit 72 includes a diode 52, a capacitor 68b, an IPD circuit 73, a capacitor 74, and a regulator 75. Of the constant voltage power supply circuit 72, the IPD circuit 73, the capacitor 74, and the regulator 75 are mounted on the second circuit board 70.
次に図6を用いて基板ケース40の形状を説明する。基板ケース40は非導電材料により製造され、例えばプラスチック等の合成樹脂の一体成形で製造される。図6では開口面40aが上向きになるように示した斜視図である。基板ケース40は第一回路基板50及び第二回路基板70を電動工具1のハウジング内に固定するための取り付け基台の役割を果たすもので、容器状に形成される基板ケース40は、開口面40aに隣接して前面41a、後面41b、側壁面41c、41dの四方の壁を有する。側壁面41c、41dから底面41gは、斜めに形成された絞り斜面部41e、41fにより接続される。底面部分はリヤカバー3の形状に沿って平行壁部(41c、41d)から反開口部側に向けて幅寸法が小さくなるように絞りこまれた形状とされる。ここでは、第二回路基板70の裏面(底面41gに面する側)に制御回路用の電子素子(マイコン等)に必要な空間を確保したような形状とされ、底面41gの中央部には曲面状に開口面40a側に隆起する部分が形成される。この隆起する部分は、充填される樹脂の量を減らして軽量化を図るためであるとともに、ネジボスにネジを通すための空間をリヤカバー3と基板ケース40の間に作るために設けられる。 Next, the shape of the substrate case 40 will be described with reference to FIG. The substrate case 40 is manufactured from a non-conductive material, and is manufactured by integral molding of a synthetic resin such as plastic. FIG. 6 is a perspective view showing the opening surface 40a facing upward. The board case 40 serves as an attachment base for fixing the first circuit board 50 and the second circuit board 70 in the housing of the electric tool 1, and the board case 40 formed in a container shape has an opening surface. Adjacent to 40a, it has four walls, a front surface 41a, a rear surface 41b, and side wall surfaces 41c and 41d. The side walls 41c and 41d and the bottom surface 41g are connected to each other by inclined slope portions 41e and 41f formed obliquely. The bottom surface portion has a shape that is narrowed down along the shape of the rear cover 3 so that the width dimension decreases from the parallel wall portions (41c, 41d) toward the side opposite to the opening. Here, the second circuit board 70 has a shape in which a space necessary for an electronic element (such as a microcomputer) for a control circuit is secured on the back surface (side facing the bottom surface 41g), and a curved surface is formed at the center of the bottom surface 41g. The part which protrudes in the shape of the opening surface 40a side is formed. This raised portion is provided to reduce the amount of resin to be filled and reduce the weight, and to provide a space between the rear cover 3 and the substrate case 40 for allowing a screw to pass through the screw boss.
前面41aの外側部分には、円筒形の筒部42(図2参照)が形成される。筒部42は内部にセンサ磁石18を収容させるための窪み部分であって、センサ磁石18から見て前面41aを隔てた基板ケース40の内部側にセンサ基板48が配置されることになる。換言すれば、センサ基板48は開口面40aに対して垂直な方向に延びるようにして基板ケース40に配置される。円筒形の筒部42には径方向に突出する突出部分(ネジボス42a)が形成され、そこにそれぞれネジ穴が形成される。基板ケース40の内部であって側壁面41cには、第一回路基板50を支持すると共に位置合わせをするための段差部45a、45bが形成され、ネジボス46aが形成される。側壁面41dの内壁部分にも、同様にして第一回路基板50の位置合わせをするための段差部(図6では見えない)とネジボスが形成される。基板ケース40の後面41bの外側には、電源コード保持部43とリヤカバー3の内壁面へ突き当てて固定するための突当部44が形成される。 A cylindrical tube portion 42 (see FIG. 2) is formed on the outer portion of the front surface 41a. The cylindrical portion 42 is a recessed portion for accommodating the sensor magnet 18 therein, and the sensor substrate 48 is disposed on the inner side of the substrate case 40 with the front surface 41a as viewed from the sensor magnet 18. In other words, the sensor substrate 48 is disposed on the substrate case 40 so as to extend in a direction perpendicular to the opening surface 40a. The cylindrical tube portion 42 is formed with protruding portions (screw bosses 42a) protruding in the radial direction, and screw holes are respectively formed therein. Step portions 45a and 45b for supporting and aligning the first circuit board 50 are formed on the side wall surface 41c inside the substrate case 40, and a screw boss 46a is formed. Step portions (not visible in FIG. 6) and screw bosses for aligning the first circuit board 50 are also formed on the inner wall portion of the side wall surface 41d in the same manner. On the outer side of the rear surface 41b of the substrate case 40, a power cord holding portion 43 and an abutting portion 44 for abutting and fixing to the inner wall surface of the rear cover 3 are formed.
次に、基板ケース40の組立方法を説明する。まず、図3で示したように第一回路基板50と第二回路基板70に必要な電子素子を搭載し、ピンヘッダ56~57を用いて第一回路基板50と第二回路基板70を連結させて、必要な電子素子が搭載された組立体とする。ここまでの電子素子の搭載順序や、ピンヘッダ56~57の組立順序は任意である。次に、これら組立体を第二回路基板70が底面41g側になるように向けて基板ケース40の中に収容し、後述するネジ59a~59c(図7参照)により第一回路基板50を基板ケース40にネジ止めする。この際、図示しないリード線にて第二回路基板70側に配線されたセンサ基板48(図1参照)も基板ケース40の前面41aの内側に形成された案内レール部47にはめ込まれる。 Next, a method for assembling the substrate case 40 will be described. First, as shown in FIG. 3, necessary electronic elements are mounted on the first circuit board 50 and the second circuit board 70, and the first circuit board 50 and the second circuit board 70 are connected using the pin headers 56 to 57. Thus, an assembly in which necessary electronic elements are mounted is assumed. The mounting order of the electronic elements so far and the assembly order of the pin headers 56 to 57 are arbitrary. Next, these assemblies are accommodated in the substrate case 40 so that the second circuit board 70 faces the bottom surface 41g, and the first circuit board 50 is mounted on the board by screws 59a to 59c (see FIG. 7) described later. Screw on the case 40. At this time, the sensor board 48 (see FIG. 1) wired to the second circuit board 70 side by a lead wire (not shown) is also fitted into the guide rail portion 47 formed inside the front surface 41a of the board case 40.
次に、基板ケース40を図3のように開口面40aを上向きにしたまま、基板ケース40の内部に樹脂を流し込む。流し込む樹脂は、液体状態から硬化する硬化性樹脂、例えばウレタン樹脂を用い、固定された第一回路基板50が完全に浸漬する量の樹脂が流し込まれる。ここで樹脂を開口面40aの面位置と同一になるまで満たすことも可能であるが、必要最小限に留めることで軽量化及び低コスト化を図っている。本実施例では第一回路基板50の表面に搭載されるスイッチング素子Q1~Q6のパッケージの上下方向位置の途中くらいに樹脂の液面がなる程度とした(図3の点線90参照)。このようにして第二回路基板70は基板ケース40にネジ止め等によって固定されるのでは無く、第一回路基板50に固定されるようにして基板ケース40へは間接的に固定される。この固定方法を実現するために、第二回路基板70は第一回路基板50より幅が小さく形成され、且つ、底部(底面41g)の幅よりも大きい寸法とされる。尚、第一回路基板50と第二回路基板70の組立体の基板ケース40への固定の仕方は任意であり、第二回路基板70側を基板ケースにネジ止めするようにして、第一回路基板50は基板ケース40への固定せずに樹脂にて完全に浸漬させるようにしても良いし、第一回路基板50と第二回路基板70を共通のネジによって基板ケース40に共締めして固定しても良い。 Next, the resin is poured into the substrate case 40 with the opening surface 40a facing upward as shown in FIG. As the resin to be poured, a curable resin that is cured from a liquid state, for example, a urethane resin, is used, and an amount of the resin in which the fixed first circuit board 50 is completely immersed is poured. Here, it is possible to fill the resin until it is the same as the surface position of the opening surface 40a, but the weight is reduced and the cost is reduced by keeping it to the minimum necessary. In this embodiment, the liquid level of the resin is about halfway along the vertical position of the package of the switching elements Q1 to Q6 mounted on the surface of the first circuit board 50 (see the dotted line 90 in FIG. 3). Thus, the second circuit board 70 is not fixed to the board case 40 by screws or the like, but is indirectly fixed to the board case 40 so as to be fixed to the first circuit board 50. In order to realize this fixing method, the second circuit board 70 is formed to have a width smaller than that of the first circuit board 50 and larger than the width of the bottom portion (bottom surface 41g). The assembly of the first circuit board 50 and the second circuit board 70 to the board case 40 is arbitrary, and the second circuit board 70 side is screwed to the board case so that the first circuit is fixed. The substrate 50 may be completely immersed in the resin without being fixed to the substrate case 40, or the first circuit substrate 50 and the second circuit substrate 70 may be fastened together with the substrate case 40 with a common screw. It may be fixed.
次に図7を用いて、基板ケース40に固定される第一回路基板50とピンヘッダ56~57の取り付け状況を説明する。図7は基板ケース40を開口面40aの法線方向外側から見た図であり、ピンヘッダ56~57と電子スイッチ51の位置だけを示し、残りの素子の記載は省略している。基板ケース40の内部に収容される第一回路基板50の形状は、基板ケース40の内形(幅W、長さL)とほぼ同等の外側輪郭をもって形成される。図示しない第二回路基板70は、第一回路基板50の幅Wよりは小さくし、長さも短くする。第一回路基板50の、開口面40aとは反対側(底面41gに近い面)の右側部分に13ピンのピンヘッダ58、左側部分には2ピンのピンヘッダ56と3ピンのピンヘッダ57が取り付けられる。ここでは左側にピンヘッダ56と57が前後方向に離れた位置に設けられるため、3つのグループのピンヘッダ56~57により第一回路基板50と第二回路基板70が良好に固定される上に、第一回路基板50と第二回路基板70間において複数の配線を接続可能となる。 Next, with reference to FIG. 7, the mounting state of the first circuit board 50 fixed to the board case 40 and the pin headers 56 to 57 will be described. FIG. 7 is a view of the substrate case 40 as viewed from the outside in the normal direction of the opening surface 40a. Only the positions of the pin headers 56 to 57 and the electronic switch 51 are shown, and the remaining elements are not shown. The shape of the first circuit board 50 accommodated in the substrate case 40 is formed with an outer contour substantially equivalent to the inner shape (width W, length L) of the substrate case 40. The second circuit board 70 (not shown) is made smaller than the width W of the first circuit board 50 and the length thereof is also shortened. A 13-pin pin header 58 and a 3-pin pin header 56 and a 3-pin pin header 57 are attached to a right side portion of the first circuit board 50 opposite to the opening surface 40a (a surface close to the bottom surface 41g), and a left side portion. Here, since the pin headers 56 and 57 are provided on the left side at positions separated in the front-rear direction, the first circuit board 50 and the second circuit board 70 are well fixed by the three groups of pin headers 56 to 57, and the first A plurality of wirings can be connected between the one circuit board 50 and the second circuit board 70.
第一回路基板50は後方側の角部の一つでネジ59cによって固定される。また、前方側においては、固定部材89をネジ59a、59bにより固定することによって基板ケース40の前方側が保持される。固定部材89の第一回路基板50と接する部分には、左右方向に延びるアーム部が形成され、アーム部の両端部にはネジ穴が形成される。固定部材89は第一回路基板50から前方側に延びるように、押さえ片89aが形成され、押さえ片89aによってセンサ基板48が案内レール部47から脱落しないように保持される。このように固定部材89を第一回路基板50及びセンサ基板48の基板ケース40内への装着後にネジ止めすることによって、第一回路基板50及びセンサ基板48は基板ケース40に容易に実装される。 The first circuit board 50 is fixed by a screw 59c at one of the rear corners. On the front side, the front side of the substrate case 40 is held by fixing the fixing member 89 with screws 59a and 59b. An arm portion extending in the left-right direction is formed at a portion of the fixing member 89 that contacts the first circuit board 50, and screw holes are formed at both ends of the arm portion. The fixing member 89 is formed with a pressing piece 89a so as to extend forward from the first circuit board 50, and the sensor board 48 is held by the pressing piece 89a so as not to drop off from the guide rail portion 47. Thus, the first circuit board 50 and the sensor board 48 are easily mounted on the board case 40 by screwing the fixing member 89 after mounting the first circuit board 50 and the sensor board 48 in the board case 40. .
以上、本実施例によれば、基板ケース内に第一回路基板50と第二回路基板70を積層させて収容し、それらを硬化性の樹脂によって固定するので、限られた空間内に大型のIGBTを収容することができ、実装効率を高めて小型化した電動工具を実現できた。しかも、スイッチング素子Q1~Q6及びそれに取り付けられる放熱用の金属板を第一回路基板の開口面40a側の載置面に配置することで、これらを冷却風に直接晒すことが可能となり、冷却効果を高めることができる。また、基板ケース40内に樹脂を充填し、スイッチング素子Q1~Q6及びそれに取り付けられる放熱用の金属板を樹脂から露出させるようにしたので、樹脂に浸された電子素子は鉄粉等の塵埃から保護されると共に、スイッチング素子に対する冷却効果を維持できる。また、第一回路基板50と離れた側の第二回路基板70にマイコンなどの別の回路素子が配置されるため、基板ケース40内の空間を有効活用した無駄のない素子配置とすることができる。さらに、液体状の樹脂を流し込んで硬化させるので、ジェル状の樹脂を塗布する作業に比べて塗りムラが発生する恐れがなく、樹脂で覆われている電子素子は鉄粉等の塵埃から保護される。 As described above, according to the present embodiment, the first circuit board 50 and the second circuit board 70 are stacked and accommodated in the substrate case, and are fixed by the curable resin. The IGBT could be accommodated, and a compact electric tool could be realized with improved mounting efficiency. Moreover, the switching elements Q1 to Q6 and the heat radiating metal plate attached to the switching elements Q1 to Q6 can be directly exposed to the cooling air by arranging them on the mounting surface on the opening surface 40a side of the first circuit board. Can be increased. Further, since the resin is filled in the substrate case 40 and the switching elements Q1 to Q6 and the metal plate for heat radiation attached thereto are exposed from the resin, the electronic elements immersed in the resin are protected from dust such as iron powder. While being protected, the cooling effect with respect to a switching element can be maintained. In addition, since another circuit element such as a microcomputer is arranged on the second circuit board 70 on the side away from the first circuit board 50, it is possible to make a wasteful element arrangement that effectively uses the space in the board case 40. it can. In addition, since liquid resin is poured and cured, there is no risk of uneven coating compared to the operation of applying gel resin, and the electronic elements covered with resin are protected from dust such as iron powder. The
また、整流用のダイオードブリッジ66や、平滑用のコンデンサ68aも樹脂から部分的に露出させて冷却風にさらされるようにしたので、これらの素子も効率良く冷却することができる。 Further, since the rectifying diode bridge 66 and the smoothing capacitor 68a are also partially exposed from the resin and exposed to the cooling air, these elements can be efficiently cooled.
また、基板ケース40をリヤカバー3の内壁に沿うように、部分的に略円筒形状にしたので、ハウジングの内部空間を効率よく利用することで本体の大型化を抑制し、コンパクトな電動工具1を実現できる。 Further, since the substrate case 40 is partially formed in a substantially cylindrical shape along the inner wall of the rear cover 3, the use of the internal space of the housing efficiently suppresses the enlargement of the main body, and the compact electric tool 1 can be used. realizable.
また、第二回路基板70の左右方向の寸法を第一回路基板50よりも小さくし、開口面40aの左右方向寸法よりも小さい寸法である基板ケース40内の底部(基板ケース40内の底面41g側)に配置したので、基板ケース40の収容空間を効率的に用いて電子素子の実装面積を増やすことができる。 Further, the dimension of the second circuit board 70 in the left-right direction is made smaller than that of the first circuit board 50, and the bottom of the board case 40 (the bottom surface 41g in the board case 40) is smaller than the dimension of the opening surface 40a in the left-right direction. Since the housing space of the substrate case 40 can be used efficiently, the mounting area of the electronic device can be increased.
また、第一回路基板50と第二回路基板とを、電気的に接続しつつ固定可能なピンヘッダにて固定したので、一方の回路基板を基板ケース40に固定すれば他方の回路基板の固定も同時に実現でき、組み立てが容易となる。 Since the first circuit board 50 and the second circuit board are fixed by pin headers that can be fixed while being electrically connected, if one circuit board is fixed to the board case 40, the other circuit board can be fixed. It can be realized at the same time and it is easy to assemble.
また、ノイズフィルタとして働くチョークコイル69やフィルムコンデンサ67を含め、比較的大きな電子素子を第一回路基板50の開口面40a側に配置し、それ以外の小さな電子素子を第一回路基板50の底面41g側、もしくは第二回路基板70に実装することで、限られた電子素子実装面を効率よく利用できる。 In addition, a relatively large electronic element including a choke coil 69 and a film capacitor 67 serving as a noise filter is disposed on the opening surface 40a side of the first circuit board 50, and other small electronic elements are disposed on the bottom surface of the first circuit board 50. By mounting on the 41g side or the second circuit board 70, a limited electronic element mounting surface can be used efficiently.
また、センサ基板48を基板ケース40の内部に配置し、モータ5を制御するための電子素子を基板ケース40に集約できたので、組み立てが容易になる。 Further, since the sensor substrate 48 is arranged inside the substrate case 40 and the electronic elements for controlling the motor 5 can be integrated into the substrate case 40, the assembly becomes easy.
また、冷却風が基板ケース40の開口面40a側を通るように構成したので、樹脂から露出した電子素子を冷却風にさらして効果的に冷却することができる。 Further, since the cooling air passes through the opening surface 40a side of the substrate case 40, the electronic elements exposed from the resin can be effectively cooled by being exposed to the cooling air.
以上、本発明を実施例に基づいて説明したが、本発明は上述の実施例に限定されるものではなく、その趣旨を逸脱しない範囲内で種々の変更が可能である。例えば、上述の実施例においては、基板ケース40内に収容する主な回路基板を、第一回路基板50と第二回路基板70の2枚に分散させて収容したが、これらを3枚またはそれ以上に分けて、それぞれをピンヘッダやその他のコネクタにて接続した状態で、基板ケース内に収容しても良い。また、上述の実施例においては、基板ケース開口方向をスピンドルの突出方向と同方向としたが、電動工具が載置状態または使用状態にあるときに基板ケース開口方向が下方向を向くような構成であれば、開口面の開口方向が真下でなくてもよく、開口面40aの法線方向が斜め下、又は横側に向くように配置しても良い。さらに、上述の実施例においては電動工具1の例としてグラインダに用いられる回路基板の搭載例で説明したが、グラインダだけに限られずその他の電動工具においても同様に適用でき、例えばセーバソーやマルチカッタ、筒状のハウジングを有するハンドドライバやインパクトドライバなどの回路基板の実装にも同様に適用できる。 As mentioned above, although this invention was demonstrated based on the Example, this invention is not limited to the above-mentioned Example, A various change is possible within the range which does not deviate from the meaning. For example, in the above-described embodiment, the main circuit board accommodated in the substrate case 40 is distributed and accommodated in two sheets of the first circuit board 50 and the second circuit board 70. In addition to the above, each may be accommodated in the substrate case in a state of being connected by a pin header or other connector. In the above-described embodiment, the substrate case opening direction is the same as the spindle protruding direction. However, the substrate case opening direction is directed downward when the electric tool is in a mounted state or a used state. If so, the opening direction of the opening surface may not be directly below, and the normal line direction of the opening surface 40a may be arranged obliquely downward or laterally. Furthermore, in the above-mentioned embodiment, the example of mounting the circuit board used in the grinder as an example of the electric tool 1 has been described. However, the present invention is not limited to the grinder and can be applied to other electric tools in the same manner, for example, a saver saw, a multi-cutter, The present invention can be similarly applied to mounting of a circuit board such as a hand driver or an impact driver having a cylindrical housing.
1…電動工具、2…モータハウジング、2a,2b…開口、3…リヤカバー、3a…開口、3c…リブ、3d、3e…吸入口、5…モータ、6…回転軸、7…ロータコア、8…永久磁石、9…ステータコア、10,11…インシュレータ、12…コイル、13a~13c…リード線、14a,14b…軸受、15…冷却ファン、16…ファンカバー、18…センサ磁石、20…軸受ホルダ部、21…ギヤケース、21b…貫通穴、21c…穴、22,23…傘歯車、24…スピンドル、25…メタル、26…軸受、27…スピンドルカバー、28…取付ベース、30…砥石、31…ワッシャナット、32…ホイールガード、39…ネジ、40…基板ケース、40a…開口面、41a…前面、41b…後面、41c,41d…側壁面、41e,41f…斜面部、41g…底面、42…筒部、42a,42b…ネジボス、43…電源コード保持部、44…突当部、45a~45b…段差部、46a…ネジボス、47…案内レール部、48…センサ基板、49a~49c…回転位置検出素子、50…第一回路基板、51…電子スイッチ、51a…金属アーム、52…ダイオード、54…シャント抵抗、55a~55c…コネクタ、56~58…ピンヘッダ、58a…ピン、58b…ケース、58c…連結部、59a~59c…ネジ、60…インバータ回路、65…電源回路、66…ダイオードブリッジ、67…フィルムコンデンサ、68a…コンデンサ、68b…コンデンサ、69…チョークコイル、70…第二回路基板、71…演算部、72…定電圧電源回路、73…回路、74…コンデンサ、75…レギュレータ、81~86…金属板、87b,87e…ネジ、88a,88b…ネジ、89…固定部材、89a…押さえ片、90…樹脂の上面、100…商用交流電源 DESCRIPTION OF SYMBOLS 1 ... Electric tool, 2 ... Motor housing, 2a, 2b ... Opening, 3 ... Rear cover, 3a ... Opening, 3c ... Rib, 3d, 3e ... Inlet, 5 ... Motor, 6 ... Rotating shaft, 7 ... Rotor core, 8 ... Permanent magnet, 9 ... stator core, 10, 11 ... insulator, 12 ... coil, 13a-13c ... lead wire, 14a, 14b ... bearing, 15 ... cooling fan, 16 ... fan cover, 18 ... sensor magnet, 20 ... bearing holder part 21 ... Gear case, 21b ... Through hole, 21c ... Hole, 22, 23 ... Bevel gear, 24 ... Spindle, 25 ... Metal, 26 ... Bearing, 27 ... Spindle cover, 28 ... Mounting base, 30 ... Grinding wheel, 31 ... Washer Nut, 32 ... wheel guard, 39 ... screw, 40 ... substrate case, 40a ... opening surface, 41a ... front surface, 41b ... rear surface, 41c, 41d ... side wall surface, 41e, 1f ... slope part, 41g ... bottom face, 42 ... cylinder part, 42a, 42b ... screw boss, 43 ... power cord holding part, 44 ... abutting part, 45a to 45b ... step part, 46a ... screw boss, 47 ... guide rail part, 48 ... sensor board, 49a to 49c ... rotational position detecting element, 50 ... first circuit board, 51 ... electronic switch, 51a ... metal arm, 52 ... diode, 54 ... shunt resistor, 55a to 55c ... connector, 56 to 58 ... Pin header, 58a ... pin, 58b ... case, 58c ... connecting portion, 59a to 59c ... screw, 60 ... inverter circuit, 65 ... power supply circuit, 66 ... diode bridge, 67 ... film capacitor, 68a ... capacitor, 68b ... capacitor, 69 ... choke coil, 70 ... second circuit board, 71 ... calculation unit, 72 ... constant voltage power supply circuit, 73 ... circuit, 74 ... con Capacitors, 75 ... regulator, 81-86 ... metal plate, 87b, 87e ... screws, 88a, 88b ... screw, 89 ... fixing member, 89a ... pressing piece 90 ... resin top surface, 100 ... commercial AC power source

Claims (16)

  1. 先端工具を駆動するためのブラシレスモータと、前記ブラシレスモータを駆動させる駆動回路と、前記駆動回路を搭載する第一回路基板と、前記駆動回路を制御する制御回路と、前記制御回路の少なくとも一部を搭載する第二回路基板と、前記第一回路基板と前記第二回路基板を収容するものであって一面が開口した開口面を有する基板ケースと、前記ブラシレスモータと前記基板ケースとを収容するハウジングと、前記ブラシレスモータによって駆動し、前記ハウジング内に冷却風を生成するファンと、を有し、前記基板ケース内において、前記第一回路基板と前記第二回路基板は、前記開口面と垂直な方向に重ねて配置され、且つ前記開口面と平行な方向に延びるように配置されることを特徴とする電動工具。 A brushless motor for driving a tip tool, a drive circuit for driving the brushless motor, a first circuit board on which the drive circuit is mounted, a control circuit for controlling the drive circuit, and at least a part of the control circuit A second circuit board on which the first circuit board and the second circuit board are accommodated, and a substrate case having an open surface on one side, the brushless motor, and the substrate case are accommodated. A housing, and a fan that is driven by the brushless motor and generates cooling air in the housing. In the substrate case, the first circuit board and the second circuit board are perpendicular to the opening surface. An electric power tool, wherein the electric tool is arranged so as to overlap in any direction and extends in a direction parallel to the opening surface.
  2. 前記駆動回路は複数のスイッチング素子を含み、前記第一回路基板は前記開口面に近い側に配置され、前記スイッチング素子は前記第一回路基板の前記開口面側に搭載され、前記制御回路を構成する素子を、前記第二回路基板の前記第一回路基板とは反対側の面に搭載したことを特徴とする請求項1に記載の電動工具。 The drive circuit includes a plurality of switching elements, the first circuit board is disposed on a side close to the opening surface, and the switching element is mounted on the opening surface side of the first circuit board to constitute the control circuit. The power tool according to claim 1, wherein an element to be mounted is mounted on a surface of the second circuit board opposite to the first circuit board.
  3. 前記複数のスイッチング素子は長手方向が前記第一回路基板と直交するように配置され、前記スイッチング素子の一部が前記基板ケースの前記開口面から突出させるように搭載されることを特徴とする請求項2に記載の電動工具。 The plurality of switching elements are arranged so that a longitudinal direction thereof is orthogonal to the first circuit board, and a part of the switching elements is mounted so as to protrude from the opening surface of the board case. Item 3. The electric tool according to Item 2.
  4. 前記第一回路基板にはさらに商用電源を直流に変換する整流回路を搭載することを特徴とする請求項1から3のいずれか一項に記載の電動工具。 The electric power tool according to any one of claims 1 to 3, wherein a rectifier circuit that converts commercial power into direct current is further mounted on the first circuit board.
  5. 前記整流回路には平滑用のコンデンサが含まれ、前記コンデンサは前記第一回路基板において前記開口面から部分的に外部に露出するように搭載されることを特徴とする請求項4に記載の電動工具。 5. The electric motor according to claim 4, wherein the rectifier circuit includes a smoothing capacitor, and the capacitor is mounted on the first circuit board so as to be partially exposed to the outside from the opening surface. tool.
  6. 前記基板ケース内に硬化性の樹脂を流して固められていることにより、前記第一回路基板と前記第二回路基板が前記樹脂に浸っていることを特徴とする請求項1から5のいずれか一項に記載の電動工具。 6. The first circuit board and the second circuit board are immersed in the resin by flowing and hardening a curable resin in the substrate case. The electric tool according to one item.
  7. 前記制御回路は、スイッチング素子によるインバータ回路を制御するマイコンを含み、前記マイコンは前記第二回路基板に搭載されることを特徴とする請求項1から6のいずれか一項に記載の電動工具。 The power tool according to any one of claims 1 to 6, wherein the control circuit includes a microcomputer that controls an inverter circuit using a switching element, and the microcomputer is mounted on the second circuit board.
  8. 前記第一回路基板と前記第二回路基板とは、相対移動不能なようにコネクタによって電気的に接続されていることを特徴とする請求項1から7のいずれか一項に記載の電動工具。 The power tool according to any one of claims 1 to 7, wherein the first circuit board and the second circuit board are electrically connected by a connector so as not to be relatively movable.
  9. 前記コネクタは、複数のピンヘッダであることを特徴とする請求項8に記載の電動工具。 The power tool according to claim 8, wherein the connector is a plurality of pin headers.
  10. 前記基板ケースは、前記開口面から直交するように延びる2つの平行壁部と、平行壁部から反開口部側に向けて幅寸法が小さくなるように絞ることにより底部を形成した容器状であって、前記第一回路基板は第二回路基板より幅が小さく形成され、前記底部の幅よりも大きい寸法であることを特徴とする請求項1から9のいずれか一項に記載の電動工具。 The substrate case has a container shape in which two parallel wall portions extending orthogonally from the opening surface and a bottom portion are formed by narrowing the width dimension from the parallel wall portion toward the opposite opening side. The power tool according to any one of claims 1 to 9, wherein the first circuit board is formed to have a width smaller than that of the second circuit board and is larger than the width of the bottom portion.
  11. 前記第二回路基板は前記第一回路基板の幅よりも小さい寸法とされ、前記底部の幅よりも大きい寸法であることを特徴とする請求項10に記載の電動工具。 The power tool according to claim 10, wherein the second circuit board has a size smaller than a width of the first circuit board and a size larger than a width of the bottom portion.
  12. 前記ブラシレスモータを収容する筒形状のモータハウジングと、前記モータハウジングの一方に取り付けられ、前記基板ケースを収容する筒状のリヤカバーと、を有し、前記リヤカバーの外径は、前記モータハウジングの外径以下であることを特徴とする請求項1から11のいずれか一項に記載の電動工具。 A cylindrical motor housing that accommodates the brushless motor; and a cylindrical rear cover that is attached to one of the motor housings and that accommodates the board case. The outer diameter of the rear cover is the outer diameter of the motor housing. The power tool according to any one of claims 1 to 11, wherein the power tool has a diameter or less.
  13. 前記ブラシレスモータの回転力によって回転する出力軸と、前記ブラシレスモータの回転力を前記出力軸に伝達する動力伝達機構と、前記モータハウジングの他方に取り付けられ、前記動力伝達機構を収容するギヤケースと、を有し、前記出力軸は、前記ギヤケースから突出し、前記基板ケースの開口部は、前記出力軸の前記ギヤケースからの突出方向と同方向に開口していることを特徴とする請求項12に記載の電動工具。 An output shaft that rotates by the rotational force of the brushless motor; a power transmission mechanism that transmits the rotational force of the brushless motor to the output shaft; and a gear case that is attached to the other of the motor housing and houses the power transmission mechanism; The output shaft projects from the gear case, and the opening of the substrate case opens in the same direction as the projecting direction of the output shaft from the gear case. Power tools.
  14. 先端工具を駆動するためのブラシレスモータと、前記ブラシレスモータを駆動させる駆動回路と、前記駆動回路を搭載する第一回路基板と、前記駆動回路を制御する制御回路と、前記制御回路の少なくとも一部を搭載する第二回路基板と、前記第一回路基板と前記第二回路基板を収容するものであって一面が開口した容器状の基板ケースと、前記ブラシレスモータと前記基板ケースとを収容するハウジングを有する電動工具において、前記基板ケース内において、前記第一回路基板と前記第二回路基板を所定の距離を隔てて平行に配置し、一方の回路基板を前記基板ケースに固定し、他方の回路基板はコネクタを介して前記一方の回路基板に固定し、これらの固定した状態で前記基板ケース内に硬化性樹脂が注入して前記第一回路基板と前記第二回路基板が浸るような状態で固められており、前記第一回路基板の上に搭載された発熱素子の一部が前記硬化性樹脂から露出するように配置されていることを特徴とする電動工具。 A brushless motor for driving a tip tool, a drive circuit for driving the brushless motor, a first circuit board on which the drive circuit is mounted, a control circuit for controlling the drive circuit, and at least a part of the control circuit A second circuit board, a container-like board case that contains the first circuit board and the second circuit board, and is open on one side, and a housing that houses the brushless motor and the board case In the electric power tool, the first circuit board and the second circuit board are arranged in parallel at a predetermined distance in the board case, one circuit board is fixed to the board case, and the other circuit The board is fixed to the one circuit board through a connector, and in the fixed state, a curable resin is injected into the board case, and the first circuit board and the board The electric circuit characterized in that the two circuit boards are solidified so as to be immersed, and a part of the heating element mounted on the first circuit board is disposed so as to be exposed from the curable resin. tool.
  15. 前記第一回路基板と前記第二回路基板のそれぞれの搭載面が、前記開口の面と平行するように配置され、前記第一回路基板と前記第二回路基板は、複数のピンヘッダによって固定されることを特徴とする請求項14に記載の電動工具。 The mounting surfaces of the first circuit board and the second circuit board are arranged so as to be parallel to the surface of the opening, and the first circuit board and the second circuit board are fixed by a plurality of pin headers. The power tool according to claim 14.
  16. 前記ブラシレスモータの回転軸と直交する方向に延びるスピンドルと、前記スピンドルに前記ブラシレスモータの回転力を伝達する動力伝達機構と、を有するグラインダであることを特徴とする請求項1から15のいずれか一項に記載の電動工具。 16. A grinder comprising: a spindle extending in a direction orthogonal to a rotation axis of the brushless motor; and a power transmission mechanism for transmitting a rotational force of the brushless motor to the spindle. The electric tool according to one item.
PCT/JP2016/082058 2015-11-13 2016-10-28 Electric tool WO2017082082A1 (en)

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