WO2017077638A1

WO2017077638A1 - Endoscope and optical transmission module

Info

Publication number: WO2017077638A1
Application number: PCT/JP2015/081310
Authority: WO
Inventors: 弘典河原; 洋志祝迫
Original assignee: オリンパス株式会社
Priority date: 2015-11-06
Filing date: 2015-11-06
Publication date: 2017-05-11
Also published as: JPWO2017077638A1

Abstract

An optical transmission module 1 is provided with: an optical waveguide plate 10, which guides a first optical signal L1 inputted from an upper surface 10SA, and which outputs, from the upper surface 10SA, a second optical signal L2 that has been guided; a light emitting element 20 that generates the first optical signal L1; a light receiving element 30 that receives the second optical signal L2; and a wiring board 40 wherein the light emitting element 20 and the light receiving element 30 are mounted on a first main surface 40SA, and a second main surface 40SB is disposed on the upper surface 10SA of the optical waveguide plate 10, said wiring board being formed of a light transmissive material. A light blocking wall 49 that blocks light that has been guided in the wiring board 40 is formed between an input section 42 to which the first optical signal L1 is inputted, and an output section 44 from which the second optical signal L2 is outputted, said input section and output section being parts of the wiring board 40.

Description

Endoscope and light transmission module

The present invention provides an optical transmission module comprising a wiring board made of a light-transmitting material on which a light emitting element and a light receiving element are mounted, and an optical waveguide board on which the wiring board is disposed on the upper surface. An optical transmission module comprising: an endoscope having a wiring board made of a light-transmitting material on which a light emitting element and a light receiving element are mounted; and an optical waveguide plate on which the wiring board is disposed. .

The electronic endoscope has an image sensor such as a CCD at the distal end of the elongated insertion portion. In recent years, use of an imaging device having a high pixel number for an endoscope has been advanced. When an image sensor with a large number of pixels is used, the signal amount of the image signal transmitted from the image sensor to the signal processing device (processor) increases, so a thin optical fiber is used instead of electric signal transmission via metal wiring. Optical signal transmission via is preferred.

Further, by utilizing the bidirectional optical communication technology, it is possible to transmit not only the image pickup signal but also the control signal from the signal processing device to the image pickup device by one optical fiber. In bidirectional optical communication, for example, the first optical signal generated by the light emitting element and the second optical signal received by the light receiving element are multiplexed / demultiplexed in the optical transmission module.

Japanese Unexamined Patent Application Publication No. 2013-228467 discloses an opto-electric hybrid flexible wiring board that includes a wiring board having a light emitting element and a light receiving element mounted on the main surface, and an optical waveguide board.

In a wiring board in which a light emitting element and a light receiving element are arranged, a part of the light generated by the light emitting element is guided as stray light through the wiring board and received by the light receiving element, so that transmission quality deteriorates. There was a fear.

Japanese Laid-Open Patent Publication No. 2013-41922 discloses a light receiving device that blocks infrared rays entering through a hole in a wiring board. A hole formed for wiring is filled with a resin having a predetermined configuration that transmits visible light and blocks only infrared light.

The light receiving device can block light entering from the hole, but cannot block stray light guided through the inside of the wiring board.

JP 2013-228467 A JP 2013-41922 A

Embodiments of the present invention include an endoscope having an endoscope module in which transmission quality does not deteriorate due to stray light guided through a wiring board, and transmission by stray light guided through the wiring board. An object of the present invention is to provide an endoscope module in which the quality does not deteriorate.

An endoscope according to an embodiment of the present invention guides an incident first optical signal and emits an optical waveguide plate that emits the guided second optical signal, and light emission that generates the first optical signal. An element, a light receiving element that receives the second optical signal, a light emitting element and the light receiving element mounted on a first main surface, and a second main surface facing the first main surface is the light guide The waveguide plate is disposed on a surface where the first optical signal is incident and the second optical signal is emitted, and the wall surface connecting the first main surface and the second main surface is conductive. A wiring board made of a light transmissive material in which a conduction hole covered with the material is formed; and an optical transmission module that generates an imaging signal that is converted into the first optical signal, and An image sensor that operates in accordance with a drive signal converted from the second optical signal. An endoscope provided at a distal end of the wiring board, wherein the interior of the wiring board is disposed between an incident part of the wiring board on which the first optical signal is incident and an emitting part from which the second optical signal is emitted. The light shielding wall which blocks the light guided is formed, and the light shielding hole constituting the light shielding wall has the same configuration as the conduction hole.

An optical transmission module according to another embodiment of the present invention guides an incident first optical signal, emits the guided second optical signal, and the first optical signal. A light emitting element that generates light, a light receiving element that receives the second optical signal, and a second main surface that is mounted on the first main surface and that faces the first main surface. Is an optical transmission module comprising a wiring board made of a light-transmitting material and disposed on a surface of the optical waveguide plate on which the first optical signal is incident and the second optical signal is emitted. A light shielding wall that blocks light guided through the wiring board between the incident part where the first optical signal is incident on the wiring board and the emitting part from which the second optical signal is emitted. Is formed.

According to the embodiment of the present invention, an endoscope having an endoscope module in which transmission quality is not likely to deteriorate due to stray light guided through the wiring board, and stray light guided through the wiring board. Thus, it is possible to provide an endoscope module in which the transmission quality does not deteriorate.

It is a disassembled perspective view of the optical transmission module of 1st Embodiment. It is sectional drawing of the optical transmission module of 1st Embodiment. It is a top view of the optical transmission module of a 1st embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 1 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 2 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 3 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 4 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 5 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 6 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 7 of 1st Embodiment. It is a top view of the light shielding hole of the optical transmission module of the modification 8 of 1st Embodiment. It is a top view of the light transmission module of 2nd Embodiment. It is sectional drawing of the optical transmission module of 2nd Embodiment. It is a top view of the optical transmission module of the modification 1 of 2nd Embodiment. It is sectional drawing of the optical transmission module of the modification 1 of 2nd Embodiment. It is sectional drawing of the optical transmission module of the modification 2 of 2nd Embodiment. It is an endoscope perspective view of a 3rd embodiment.

<First Embodiment>
The optical transmission module 1 of 1st Embodiment is demonstrated using FIGS. 1-3. In the following description, the drawings based on each embodiment are schematic, and the relationship between the thickness and width of each part, the thickness ratio of each part, and the like are different from the actual ones. It should be noted that the drawings may include portions having different dimensional relationships and ratios between the drawings. In addition, illustration of some components may be omitted.

The light transmission module 1 includes a light emitting element 20, a light receiving element 30, an optical waveguide plate 10, a wiring board 40, and

optical fibers

51 and 52. On the upper surface 10SA of the optical waveguide plate 10, a wiring board 40 on which the light emitting element 20 and the light receiving element 30 are mounted is disposed via an adhesive layer (not shown).

Optical fibers

51 and 52 are respectively disposed on the side surfaces 10SS1 and 10SS2 of the optical waveguide plate 10 so as to be optically coupled.

In the optical transmission module 1, the first optical signal L 1 generated by the light emitting element 20 is guided through the optical fiber 51. The light receiving element 30 receives the second optical signal L2 guided through the optical fiber 52. For example, the multimode type

optical fibers

51 and 52 having a diameter of 125 μm include a core having a cross section of 50 μmφ for transmitting light and a clad covering the outer periphery of the core. The

optical fibers

51 and 52 may be covered with an outer skin made of resin.

The light emitting element 20 is, for example, a vertical cavity surface emitting laser (VCSEL: VerticalVerCavity Surface Emitting LASER), and is vertically downward (Z-axis) with respect to the light emitting surface (XY plane) in accordance with an input drive electric signal. Direction) to emit the first optical signal L1. For example, the ultra-small light emitting element 20 having a size in plan view of 250 μm × 300 μm includes a light emitting unit 21 having a diameter of 20 μm and a connection terminal 22 that is electrically connected to the light emitting unit 21 and supplies a drive electric signal. , On the light emitting surface.

The light receiving element 30 is, for example, a photodiode (PD), and converts the second optical signal L2 incident from the direction perpendicular to the light receiving surface into an electric signal and outputs it. For example, the microscopic light receiving element 30 having a size in plan view of 350 μm × 300 μm includes a light receiving unit 31 having a diameter of 50 μm, a connection terminal 32 for outputting a reception electric signal electrically connected to the light receiving unit 31, On the light receiving surface.

The optical waveguide plate 10 is a polymer type in which a clad 12 (12A, 12B) surrounds an elongated rectangular parallelepiped core 11, which is an optical waveguide whose longitudinal direction is the X-axis direction for guiding an optical signal. The core 11 which is an optical waveguide is made of a first resin, and the clad 12 is made of a second resin having a refractive index smaller than that of the first resin. For efficient optical transmission, the difference between the refractive index of the core 11 and the refractive index of the cladding 12 is preferably 0.01 or more. The core 11 constitutes an optical waveguide that is an optical path for guiding an optical signal.

For example, the core 11 and the clad 12 are made of a fluorinated polyimide resin having a refractive index of 1.50 to 1.60, which is excellent in heat resistance, transparency, and isotropic properties. The polymer type optical waveguide plate 10 in which the core 11 and the clad 12 are made of resin is easier to process and more flexible than the optical waveguide plate made of an inorganic material such as quartz.

A first reflection surface 13 and a second reflection surface 14 are formed on the core 11 of the optical waveguide plate 10. The 1st reflective surface 13 and the 2nd reflective surface 14 are the inclined surfaces of the groove | channel formed from the lower surface side using the dicing blade. Although not shown, the groove is filled with resin.

The first reflecting surface 13 reflects the first optical signal L1 incident on the core 11 from the vertical direction (Z-axis direction) by 90 degrees and guides it in the longitudinal direction (X-axis direction) of the core 11. The second reflecting surface 14 reflects the second optical signal L2 guided in the longitudinal direction (X-axis direction) of the core 11 by 90 degrees and emits it in the vertical direction (Z-axis direction).

The first reflective surface 13 and the second reflective surface 14 may be formed with a reflective film made of a metal such as gold in order to increase the reflectance, and the inside of the groove is made of resin. It may be filled. In addition, a prism may be disposed as a reflecting surface inside the groove.

The wiring board 40 having the first main surface 40SA and the second main surface facing the first main surface 40SA is made of a light transmissive material such as polyimide or polyethylene terephthalate (PET). On the first main surface 40SA of the wiring board 40, an electrode pad 41 to which the connection terminal 22 of the light emitting element 20 is bonded and an electrode pad 43 to which the connection terminal 32 of the light receiving element 30 is bonded are arranged. Yes.

If the wiring board 40 is a material having a light transmittance of 75% or more for the wavelengths of the first optical signal L1 and the second optical signal L2 at a thickness of 50 μm, the transmittance of light of other wavelengths is used. May be made of a low material. The wiring board 40 is preferably a flexible wiring board because it can be easily bonded to the optical waveguide board 10 and the like.

The light emitting element 20 generates a first optical signal L1 based on a first electric signal (for example, an imaging signal) received through the electrode pad 41 of the wiring board 40. And the 1st optical signal L1 which injected from the entrance part 42 of 1st main surface 40SA of the wiring board 40 permeate | transmits the inside of the wiring board 40, is radiate | emitted from 2nd main surface 40SB, and is upper surface 10SA. The light enters the optical waveguide plate 10 from the incident portion 15 and enters the optical fiber 51 disposed on the side surface 10SS1 via the first reflecting surface 13 and the core 11.

On the other hand, the second optical signal L2 guided by the optical fiber 52 enters from the side surface 10SS2 of the optical waveguide plate 10, and exits from the upper surface 10SA of the optical waveguide plate 10 via the core 11 and the second reflecting surface 14. 16 is emitted. The second optical signal L2 is incident from the second main surface 40SB of the wiring board 40, passes through the inside of the wiring board 40, is emitted from the emitting portion 44 of the first main surface 40SA, and is received by the light receiving portion 31 of the light receiving element 30. Is incident on. A second electric signal (for example, a control signal) output from the light receiving element 30 is transmitted via the electrode pad 43 to an imaging element or the like (not shown) connected to the wiring board 40.

The incident portion 15 of the optical waveguide plate 10 is a region directly below the light emitting portion 21, but the region is not clearly distinguished from the surroundings. Similarly, the emitting portion 16 is a region immediately below the light receiving portion 31, but the region is not clearly distinguished from the surroundings.

Here, a part of the first optical signal L1 generated by the light emitting element 20 may be guided inside the wiring board 40 as stray light L1A. When the stray light L1A is received by the light receiving element 30, it becomes noise and the quality of the second optical signal L2 is lowered.

In the light transmission module 1, a light shielding wall 49 that blocks light guided through the inside of the wiring board 40 is formed by a light shielding hole between the incident part 42 and the emitting part 44 of the wiring board 40. The light shielding wall 49 is a wall surface of a groove-shaped light shielding hole that penetrates the wiring board 40 and is covered with, for example, a plating film. As shown in FIG. 3, the light shielding wall 49 is disposed on a line CL connecting the center of the incident portion 42 and the center of the emitting portion 44 of the wiring board 40.

The light shielding hole constituting the light shielding wall 49 is a through hole penetrating the wiring board 40, but becomes a light shielding via with a bottom after being bonded to the optical waveguide plate 10. Further, the light shielding hole may not penetrate through the wiring board 40 as long as stray light can be sufficiently blocked.

Furthermore, as long as at least the wall surface is covered with a conductor, the inside of the light shielding hole may be filled with a conductor such as copper by a via fill plating method.

In the optical transmission module 1, since the stray light L1A is blocked by the light shielding wall 49, there is no possibility that the transmission quality of the optical signal is deteriorated.

<Modification of First Embodiment>
Next, optical transmission modules 1A to 1H according to modifications of the first embodiment will be described. Since the optical transmission modules 1A to 1H are similar to the optical transmission module 1 and have the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.

<Variation 1 of the first embodiment>
In the optical transmission module 1A of Modification Example 1 shown in FIG. 4, the light shielding wall 49A of the wiring board 40A includes a light shielding hole H49A having a triangular cross section. The inner wall of the through hole H49A is covered with a plating film 49A1. The inside of the light shielding hole H49A is hollow, but may be filled with resin or the like.

The stray light reflected by the light shielding wall 49A has a phase different from that of the first optical signal L1, and if mixed into the first optical signal L1, there is a possibility that it becomes noise. However, the cross section of the light shielding wall 49A is a substantially isosceles triangle, and its apex is arranged on the center line CL so as to face the incident portion 15. For this reason, since the stray light incident from the direction of the incident portion 15 is reflected in a direction different from the incident direction when reflected by the light shielding wall 49A, the reflected stray light causes the noise of the first optical signal L1. There is no risk of becoming.

In the optical transmission module 1A, the quality of the first optical signal L1 does not deteriorate due to the reflected stray light.

<Modification 2 of the first embodiment>
In the optical transmission module 1B of Modification 2 shown in FIG. 4B, the light shielding wall 49B of the wiring board 40B is a light shielding hole having an oval cross section filled with a light absorbing material.

The light absorbing material is made of, for example, a resin mixed with carbon fine particles.

The incident stray light is not reflected on the light shielding wall 49B formed by the light shielding holes filled with the light absorbing material.

In the optical transmission module 1B, the quality of the first optical signal L1 does not deteriorate due to the reflected stray light.

<Modification 3 of the first embodiment>
In the optical transmission module 1C of Modification 3 shown in FIG. 5A, the light shielding wall 49C of the wiring board 40C includes six light shielding holes 49C1 and light shielding holes 49C2. That is, the light shielding wall 49C is configured by a plurality of light shielding holes.

The light shielding hole 49C1 having a rectangular cross section is arranged on the center line CL. The interiors of the light shielding hole 49C1 and the light shielding hole 49C2 are filled with a plating film.

<Modification 4 of the first embodiment>
In the optical transmission module 1D of Modification 4 shown in FIG. 5B, the light shielding wall 49D of the wiring board 40D includes six light shielding holes 49D1 and light shielding holes 49D2. The cylindrical light shielding hole 49D2 is arranged on the center line CL.

<Modification 5 of the first embodiment>
In the optical transmission module 1E of Modification 5 shown in FIG. 5C, the light shielding wall 49E of the wiring board 40E includes eight light shielding holes 49E1 and light shielding holes 49E2. The light shielding hole 49E2 having a T-shaped cross section is disposed on the center line CL.

<Modification 6 of the first embodiment>
In the optical transmission module 1F of Modification 6 shown in FIG. 5D, the light shielding wall 49F of the wiring board 40F includes two light shielding holes 49F1 and 49F2. The vertex of the light shielding hole 49F2 having a triangular cross section is disposed on the center line CL.

Therefore, the stray light reflected by the light shielding wall 49F does not become noise of the first optical signal L1, and does not deteriorate the quality of the first optical signal L1.

<Modification 7 of First Embodiment>
In the optical transmission module 1G of Modification 7 shown in FIG. 5E, the light shielding wall 49G of the wiring board 40G includes six light shielding holes 49G1. The six light shielding holes 49G1 having a triangular cross section are arranged so that the light blocking rate is maximized on the center line CL. The vertex of the light shielding hole 49G1 having a triangular cross section is disposed on the center line CL.

For this reason, the stray light reflected by the light shielding wall 49G does not become noise of the first optical signal L1, and does not deteriorate the quality of the first optical signal L1.

<Modification 8 of the first embodiment>
In the optical transmission module 1H of Modification 8 shown in FIG. 5F, the light shielding wall 49H of the wiring board 40H includes 15 light shielding holes 49H1. The fifteen light shielding holes 49H1 having a circular cross section are arranged so that the light blocking rate is maximized on the center line CL.

As described above, the cross-sectional shape of the light shielding hole is not limited to a circle or a rectangle, and the wall surface may be covered with a light shielding material, or the inside may be filled with a light absorbing material. Further, the light shielding wall may be constituted by a plurality of light shielding holes. When the light shielding wall is constituted by a plurality of light shielding holes, the plurality of light shielding holes may be arranged so that the light shielding rate is maximized on a line connecting the center of the incident portion and the center of the emission portion. preferable.

Second Embodiment
Next, the optical transmission module 1I according to the second embodiment will be described with reference to FIGS. The optical transmission module 1I is similar to the optical transmission module 1 and has the same effect.

In the optical transmission module 1I, the wiring board 40I is disposed on the upper surface 10SA of the optical waveguide board 10I via the adhesive layer 19 made of a transparent resin. A plurality of conduction holes 48I that connect the first main surface 40SA and the second main surface 40SB are formed in the wiring board 40I. The conductive hole 48I whose wall surface is covered with a conductive material is thickened by a known method, for example, by depositing a base copper plating film on the inner wall of a through hole formed by a laser by an electroless plating method and then by an electroplating method. It is produced by forming a copper plating film.

For example, the wiring 45 extending from the electrode pad 41 to which the connection terminal 22 of the light emitting element 20 is bonded is electrically connected to the wiring 45 of the second main surface 40SB through the conduction hole 48I.

Since the wiring board 40I is a double-sided wiring board in which the

wirings

45 and 43 are disposed on the first main surface 40SA and the second main surface 40SB, the design is easy. The wiring board 40I may be a multilayer wiring board as long as it has the conduction hole 48I, or an electronic component may be mounted on the first main surface 40SA.

The light shielding wall 49I of the wiring board 40I includes 15 light shielding holes 49I1. The fifteen light shielding holes 49I1 having a circular cross section are arranged so that the light blocking rate is maximized on the center line CL.

In the optical transmission module 1I, since the stray light L1A is blocked by the light shielding wall 49I, the transmission quality of the optical signal does not deteriorate.

In the optical transmission module 1I, the light blocking hole 49I1 has the same configuration as the conduction hole 48I. That is, the light shielding hole 49I1 is simultaneously manufactured by the same method when the conduction hole 48I is manufactured.

Since the diameter of the conduction hole 48I is as small as 5 μm to 50 μm, for example, it is not easy to sufficiently block stray light with one light shielding hole 49I1 having the same size. However, since the light shielding wall 49I of the light transmission module 1I is configured by the plurality of light shielding holes 49I1, stray light can be sufficiently blocked. Further, since the plurality of light blocking holes 49I1 are arranged so that the light blocking rate is maximized on the line CL connecting the center of the incident portion and the center of the emission portion, stray light can be blocked more reliably.

<Modification of Second Embodiment>
Next,

optical transmission modules

1J and 1K according to modifications of the second embodiment will be described with reference to FIGS. Since the

optical transmission modules

1J and 1K are similar to the optical transmission module 1I and have the same effect, the same components are denoted by the same reference numerals and description thereof is omitted.

<Modification Example 1 of Second Embodiment>
In the optical transmission module 1J of the first modification of the second embodiment, an optical signal is bidirectionally transmitted. That is, the wavelength λ1 of the first optical signal L1 generated by the light emitting element 20 is different from the wavelength λ2 of the second optical signal L2 received by the light receiving element 30. As shown in FIG. 9, the single optical fiber 50 guides the third optical signal obtained by combining the first optical signal L1 and the second optical signal L2. For example, the first wavelength λ1 is 850 nm, and the second wavelength λ2 is 1300 nm.

The optical waveguide plate 10J has a function of multiplexing and demultiplexing the first optical signal L1 and the second optical signal L2. The second optical signal L2 incident from the side surface 10SS2 is the first optical signal L1 generated by the light emitting element 20 incident on the light receiving portion 31 of the light receiving element 30 by the second reflecting surface 14J formed on the core 11. The first reflection surface 13 enters the core 11, passes through the second reflection surface 14, and enters the optical fiber 50. That is, the second reflecting surface 14J is made of a prism that transmits the first optical signal L1 and reflects the second optical signal L2, for example, a prism having a dielectric multilayer film disposed on the surface thereof.

Since the optical transmission module 1J guides the first optical signal L1 and the second optical signal L2 with one optical fiber 50, the light guide path has a small diameter.

<Modification 2 of the second embodiment>
As shown in FIG. 10, in the optical transmission module 1K according to the second modification of the second embodiment, the wiring board 40K includes the first through hole H48 and the second optical signal that serve as the optical path of the first optical signal L1. There is a second through hole H49 serving as an optical path of L2. The first through hole H48 is formed immediately above the incident portion 15 of the optical waveguide plate 10J. The second through hole H49 is formed immediately above the emitting portion 16 of the optical waveguide plate 10J.

In the optical transmission module 1K, no through hole is formed in the adhesive layer 19, but when the adhesive layer has a low light transmittance, the adhesive layer 19 may also be formed with a through hole serving as an optical path.

The optical transmission module 1K has the effect of the optical transmission module 1J, and furthermore, since the through holes H48 and H49 serving as optical paths are formed in the wiring board 40K, light attenuation is small and transmission efficiency is good.

In the optical transmission modules 1 to 1J, as long as the first through hole H48 serving as the optical path of the first optical signal L1 and the second through hole H49 serving as the optical path of the second optical signal L2 are formed. Needless to say, the optical transmission module 1K has the same effect.

<Third Embodiment>
Next, the endoscope 9 according to the third embodiment will be described.

As shown in FIG. 11, the endoscope 9 includes an insertion portion 9B in which the optical transmission module 1 is disposed at the distal end portion 9A, an operation portion 9C disposed on the proximal end side of the insertion portion 9B, and an operation portion. A universal cord 9D extending from 9C and a connector 9E connected to a signal processing device (not shown) and the like are provided. The first optical signal L1 transmitted from the optical transmission module 1 disposed at the distal end portion 9A and guided by the optical fiber 50 (51, 52) inserted through the insertion portion 9B is disposed in the operation portion 9C. It is converted into an electric signal by the optical transmission module 1X. The second optical signal L2 transmitted from the optical transmission module 1X disposed in the operation unit 9C and guided by the optical fiber 52 inserted through the insertion unit 9B is the optical transmission module disposed in the distal end 9A. 1 is converted into an electric signal.

Since the endoscope 9 has a small optical transmission module 1, the distal end portion 9A has a small diameter. Further, in the optical transmission module 1, since the stray light L1A is blocked by the light shielding wall 49, there is no possibility that the transmission quality of the optical signal is deteriorated.

Note that the endoscope 9 having the light transmission modules 1A to 1K further has the effects of the respective light transmission modules 1A to 1K.

For example, an endoscope according to an embodiment guides an incident first optical signal, emits a guided second optical signal, and a light emitting element that generates the first optical signal. A light receiving element that receives the second optical signal, the light emitting element and the light receiving element are mounted on a first main surface, and a second main surface facing the first main surface is the optical waveguide. A wall surface is disposed on a surface of the plate on which the first optical signal is incident and the second optical signal is emitted, and the wall surface connecting the first main surface and the second main surface is a conductive material. An optical transmission module comprising a wiring board made of a light-transmitting material and having a conduction hole covered with an optical signal; and generating an imaging signal converted into the first optical signal; and An image sensor that operates in accordance with a drive signal converted from the optical signal 2 of FIG. An endoscope provided at a distal end of the wiring board, wherein the interior of the wiring board is disposed between an incident part of the wiring board on which the first optical signal is incident and an emitting part from which the second optical signal is emitted. The light shielding wall which blocks the light guided is formed, and the light shielding hole constituting the light shielding wall has the same configuration as the conduction hole.

The present invention is not limited to the above-described embodiments and modifications, and various modifications, combinations, and applications are possible without departing from the spirit of the invention.

DESCRIPTION OF

SYMBOLS

1, 1A-1K ... Optical transmission module 9 ... Endoscope 10 ... Optical waveguide board 11 ... Core 12 ... Cladding 13 ... First reflective surface 14 ... Second Reflective surface 20 ... light emitting element 21 ... light emitting part 22 ... connecting terminal 30 ... light receiving element 31 ... light receiving part 32 ... connecting terminal 40 ... wiring board 40SA ... first First main surface 40SB ... second main surface 42 ... incident part 44 ... outgoing part 48I ... conduction holes 49, 49A to 49I ...

light shielding walls

50, 51, 52 ... light Fiber L1 ... First optical signal L1A ... Stray light L2 ... Second optical signal

Claims

An optical waveguide plate for guiding the incident first optical signal and emitting the guided second optical signal;
A light emitting element for generating the first optical signal;
A light receiving element for receiving the second optical signal;
The light emitting element and the light receiving element are mounted on a first main surface, and the second main surface opposite to the first main surface is incident on the second optical surface while the first optical signal is incident on the optical waveguide plate. Is disposed on the surface from which the optical signal is emitted, and is connected to the first main surface and the second main surface, and is formed with a conduction hole whose wall surface is covered with a conductive material. An optical transmission module comprising a wiring board made of a conductive material;
An endoscope that generates an imaging signal converted into the first optical signal and has an imaging element that operates in accordance with a drive signal converted from the second optical signal at a distal end portion of the insertion portion. There,
A light shielding wall that blocks light guided through the inside of the wiring board is formed between the incident part where the first optical signal is incident on the wiring board and the emission part from which the second optical signal is emitted. Has been
The endoscope characterized in that a light shielding hole constituting the light shielding wall has the same configuration as the conduction hole.
An optical waveguide plate for guiding the incident first optical signal and emitting the guided second optical signal;
A light emitting element for generating the first optical signal;
A light receiving element for receiving the second optical signal;
The light emitting element and the light receiving element are mounted on a first main surface, and the second main surface opposite to the first main surface is incident on the second optical surface while the first optical signal is incident on the optical waveguide plate. An optical transmission module comprising a wiring board made of a light-transmitting material, disposed on a surface from which the optical signal is emitted,
A light shielding wall that blocks light guided through the inside of the wiring board is formed between the incident part where the first optical signal is incident on the wiring board and the emission part from which the second optical signal is emitted. An optical transmission module characterized in that
The light transmission module according to claim 2, wherein the light shielding wall is covered with a light shielding material.
3. The optical transmission module according to claim 2, wherein the interior surrounded by the light shielding wall is filled with a light absorbing material.
The optical transmission module according to any one of claims 2 to 4, wherein the light shielding wall includes a plurality of light shielding holes.
6. The optical transmission according to claim 5, wherein the plurality of light blocking holes are arranged so that a light blocking rate is maximized on a line connecting the center of the incident portion and the center of the emission portion. module.
A conductive hole in which a wall surface is covered with a conductive material is formed to connect the first main surface and the second main surface to the wiring board,
The optical transmission module according to claim 5, wherein the light shielding hole has the same configuration as the conduction hole.
8. The wiring board according to claim 2, wherein the wiring board has a first through-hole serving as an optical path for the first optical signal and a second through-hole serving as an optical path for the second optical signal. The optical transmission module according to any one of the above.
The first optical signal and the second optical signal have the same different wavelength;
The optical waveguide plate multiplexes / demultiplexes the first optical signal and the second optical signal;
9. The optical transmission module according to claim 2, further comprising a single optical fiber that transmits the first optical signal and the second optical signal. 10.