WO2017073884A1

WO2017073884A1 - Fluid accelerating device

Info

Publication number: WO2017073884A1
Application number: PCT/KR2016/007772
Authority: WO
Inventors: 정유엽
Original assignee: 정유엽
Priority date: 2015-10-27
Filing date: 2016-07-18
Publication date: 2017-05-04
Also published as: KR101599200B1

Abstract

The present invention relates to a fluid accelerating device wherein: the same is installed in flow piping of a fluid, in which a vacuum pump is installed, for example, and ejects a gas at a high pressure in the flow direction of the fluid such that, by accelerating the flow of the fluid, the inside-tube clogging phenomenon can be reduced efficiently; a negative pressure is formed on the rear end of a dry pump, and the inside-tube clogging phenomenon is simultaneously reduced such that, by reducing the load on the dry pump, the service life of the dry pump is increased; the amount of use of hot purge nitrogen gas is reduced such that the process load and the process cost can be reduced as a whole; and the load on the rear end of the dry pump is reduced such that the amount of consumed energy (power) can be reduced effectively.

Description

Fluid accelerator

The present invention relates to a fluid acceleration device, and more particularly, for example, installed in a fluid flow pipe provided with a dry pump to form an orifice and at the same time to inject a gas at a high pressure in the flow direction of the fluid to accelerate the flow of the fluid It relates to a fluid acceleration device.

In general, in the manufacture of a panel display, such as a semiconductor, LCD, OLED, and other electronic components, an etching process or a thin film deposition process is essentially included. In the PVD process, such as a thin film etching process, there is an exhaust line, and a dry pump is connected to the exhaust line. Dry pumps are used in the exhaust lines of various fields, as well as in the process sector.

Usually, the etching process is largely divided into dry etching and wet etching. In recent years, as the degree of integration of semiconductors and panel displays increases, dry etching showing anisotropic characteristics is mainly performed as compared with wet etching showing isotropic characteristics. Such dry etching includes plasma etching, ion beam milling, reactive ion etching (RIE), and the like.

Among the facilities for dry etching, a plasma etching apparatus that uses a plasma to perform ultrafine processing requires ultra-high vacuum that is completely cut off from the outside when the process is performed using various elements such as gas and high frequency power in a process chamber.

In a manufacturing apparatus that performs plasma etching using gas and high frequency power in such a process chamber, the process gas is converted into a plasma state and reacts with a portion exposed from the mask pattern on the substrate. In such PVD processes, such as etching and sputtering, dry pumps are usefully used to form exhaust lines of harmful gases after reaction.

In addition, the thin film deposition process is a process of forming a thin film of a predetermined thickness on the substrate is largely divided into physical vapor deposition method and chemical vapor deposition method. Here, in the case of chemical vapor deposition, a process of forming a thin film on a substrate by chemical reaction after decomposing a gaseous compound has been widely used in recent years.

The chemical vapor deposition method again includes AP CVD (Atmospheric Pressure Chemical Vapor Deposition) where chemical vapor deposition is performed at atmospheric pressure according to reaction pressure, reaction temperature, and energy injected, and LP CVD (Low Pressure Chemical Vapor) where chemical vapor deposition is performed at low pressure. Deposition) and PE CVD (Plasma Enhanced Chemical Vapor Deposition) where chemical vapor deposition is performed by plasma in a low pressure state.

Exhaust gas containing a large amount of harmful substances and toxic substances is discharged from the manufacturing process equipment of semiconductors, panel displays, or other electronic components, which are subjected to the above-described etching process and thin film deposition process. This exhaust gas is transferred to the scrubber by the exhaust line, cleaned and purified in the scrubber, and finally discharged to the outside.

On the exhaust line connecting the manufacturing process equipment and the scrubber is typically installed a dry pump capable of forcing the exhaust gas discharged from the manufacturing process equipment to the scrubber.

The part of the exhaust line between the manufacturing process equipment and the dry pump is a kind of vacuum line formed by the dry pump, and as the flow of the exhaust gas flows smoothly, the clogging in the tube where dust generated by the chemical reaction of the exhaust gas adheres to the inner wall of the tube. Although the phenomenon rarely occurs, the portion between the dry pump and the scrubber in the exhaust line is formed as a normal line under atmospheric pressure, and as the transfer pressure and feed rate of the exhaust gas decrease, the dust generated by the chemical reaction of the exhaust gas forms the inner wall of the tube. Intraductal clogging phenomenon that occurs is caused.

In this case, the clogging phenomenon in the pipe is severe, and the exhaust gas is flowed back to the manufacturing process equipment, and process defects occur as well as the load of the dry pump has a problem of deterioration in performance.

As a part of solving the above-mentioned problems, Korean Patent Registration Publication No. 10-0285581 (registered on Jan. 4, 2001) includes a pump installed in a pumping line adjacent to the main equipment among pumping lines connecting between the main equipment and the vacuum pump. 1 heating means, a second heating means installed in an exhaust line adjacent to the pump among the pump exhaust lines connected between the pump and the scrubber, and a gas in the pumping line installed in the pumping line adjacent to the vacuum pump among the pumping lines. A first temperature detection sensor for sensing a temperature, a second temperature detection sensor installed in a pump exhaust line adjacent to the scrubber among the pump exhaust lines, and the first temperature according to detected temperatures of the first and second temperature detection sensors; And a control means for controlling the operation of the second heating means, so that the pumping and exhaust line is provided through a direct heating method in which a heating means is installed in the line. The powder produced prevention device, characterized in that so that it can be prevented that the powder produced is disclosed in.

In addition, Korean Patent Publication No. 10-2011-0054675 (published on May 25, 2011) discloses that the reaction gases used in the manufacturing process of semiconductor, LCD, and LED devices are prevented from being exploded in the process of being transferred to the gas treatment apparatus. In addition, a nitrogen gas supply system for preventing the generation of condensable by-products in the transfer pipe is disclosed.

However, in the prior art as described above, since the exhaust line must be heated through a heating means, a considerable process cost is incurred and at the same time, the process load is increased due to the excessive use of hot purge nitrogen gas, and the process cost is increased. .

The present invention has been made to solve the above-mentioned problems of the prior art, for example, installed in a fluid flow pipe with a dry pump is installed in the pipe as it accelerates the flow of the fluid by injecting gas at a high pressure in the flow direction of the fluid It is an object of the present invention to provide a fluid acceleration device capable of efficiently reducing clogging phenomenon.

In addition, the present invention, for example, is installed in the fluid flow pipe installed with the dry pump to form a negative pressure at the rear end of the dry pump at the same time to reduce the clogging phenomenon in the pipe to reduce the load of the dry pump to increase the service life of the dry pump At the same time, the purpose of the present invention is to provide a fluid acceleration device that reduces the amount of hot purge nitrogen gas and reduces the overall process load and process cost.

In the fluid acceleration device according to the present invention for realizing the object as described above, the bypass flow passage is coupled to the fluid flow pipe, the first orifice flow passage is formed in the center and the first orifice flow passage in the inner side. A body formed; A release valve coupled to a downstream center of the main body to open and close the first orifice flow path; And a gas supply pipe having one end connected to the bypass flow path of the main body and allowing gas to be injected at a high pressure in the flow direction of the fluid through the bypass flow path, and the bypass flow path of the main body connected to the gas supply pipe. It includes a first branch flow path, characterized in that the positive pressure gauge is installed between the first branch flow path and the gas supply pipe.

According to a preferred feature of the present invention, the bypass passage of the main body includes a first branch passage connected to the gas supply pipe, and a positive pressure gauge is installed between the first branch passage and the gas supply pipe.

According to a preferred feature of the present invention, the bypass passage of the main body further includes a second branch passage upstream of the branch point of the first branch passage, and the negative pressure gauge is provided at the end of the second branch passage.

According to a preferred feature of the invention, an insert having a second orifice flow path is inserted into the first branch flow path.

According to a preferred feature of the present invention, the inlet side outer peripheral surface of the insert is formed with a cut portion at a predetermined angle interval and the cut portion is formed with a side inlet hole to allow gas to flow into the second orifice flow path from the side of the insert.

According to a preferred feature of the present invention, the fluid acceleration device further includes a safety unit, one end of which is connected to the main body and the other end of which is connected to the gas supply pipe to prevent excessive movement of the gas supply pipe.

According to a preferred feature of the invention, the body is installed downstream of the dry pump on the fluid flow piping.

According to a preferred feature of the invention, the gas supply pipe is branched to the nitrogen gas supply pipe for providing nitrogen gas to the dry pump.

According to a preferred feature of the invention, the gas supply pipe is connected to the compressor tank.

According to the fluid acceleration device according to the present invention, for example, it is installed in a fluid flow pipe provided with a dry pump to spray the gas at a high pressure in the flow direction of the fluid to accelerate the flow of the fluid, thereby effectively reducing the clogging phenomenon in the tube There is an advantage to this,

In addition, according to the fluid acceleration device according to the present invention, for example, the dry pump is installed in the fluid flow pipe is installed to form a negative pressure at the rear end of the dry pump and at the same time reduce the clogging phenomenon in the pipe to reduce the load of the dry pump Increasing the service life of the dry pump and at the same time reducing the amount of hot purge nitrogen gas has the advantage that the overall process load and process cost can be reduced.

In addition, according to the fluid acceleration device according to the present invention, the clogging phenomenon is reduced and smoothly exhausted exhaust flow, the exhaust hole is formed on the rear end of the exhaust pipe (in front of the device), thereby increasing the efficiency of creating a vacuum generated during the initial exhaust drive, The load can be reduced. As a result, power consumption can be significantly reduced by up to 58%.

1 is a schematic structural diagram showing operation during normal operation of a fluid acceleration device according to an embodiment of the present invention.

Figure 2 is a schematic structural diagram showing the operation during the exhaust operation of the fluid accelerator according to an embodiment of the present invention.

Figure 3 is a schematic structural diagram showing the operation during normal operation of the fluid acceleration device according to an embodiment of the present invention including an insert.

4 is an installation structure diagram of a fluid acceleration device according to an embodiment of the present invention applied to a fluid flow pipe corresponding to an exhaust line of a manufacturing process facility for a semiconductor, panel display, or other electronic component.

5 is a perspective view of a fluid acceleration device according to an embodiment of the present invention.

The best form for the implementation of the fluid acceleration device of the present invention, the body is coupled to the fluid flow pipe, the first orifice flow passage is formed in the center and the inner side is formed by the bypass flow path bypassing the first orifice flow passage; A release valve coupled to a downstream center of the main body to open and close the first orifice flow path; And a gas supply pipe having one end connected to the bypass flow path of the main body and allowing gas to be injected at a high pressure in the flow direction of the fluid through the bypass flow path, and the bypass flow path of the main body connected to the gas supply pipe. It includes a first branch flow path, characterized in that the positive pressure gauge is installed between the first branch flow path and the gas supply pipe.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the configuration and operation of the preferred embodiment of the present invention.

Fluid acceleration device 1 according to an embodiment of the present invention, for example, is installed in the fluid flow pipe 3 is provided with a dry pump (5) to form an orifice and at the same time the gas in the flow direction of the fluid at high pressure 1 to 5 to accelerate the flow of the fluid, as shown in Figures 1 to 5, is coupled on the fluid flow pipe 3, the first orifice flow passage 11 is formed in the center and the first side in one side A main body 10 in which a bypass flow passage 13 bypassing the orifice flow passage 11 is formed, and a release valve 20 coupled to a downstream center of the main body 10 to open and close the first orifice flow passage 11. And a gas supply pipe 30 connected to the bypass passage 13 of the main body 10 and allowing the gas to be injected at a high pressure in the flow direction of the fluid through the bypass passage 13.

Here, the main body 10 is to form a specific flow path on the fluid flow pipe 3 and at the same time to form a housing of the fluid acceleration device 1 according to an embodiment of the present invention, on the fluid flow pipe 3 Combined.

The main body 10 preferably has a structure formed by dividing the semi-circular body portion as schematically shown in FIG. 6 so that the main body 10 can be easily coupled onto the fluid flow pipe 3.

In this case, the opposite sides of the two semi-circular body portions are hinged to each other so as to be rotatable with each other, while the opposite sides of the two semi-circular body portions to each other are provided with fastening members for close and detachable close contact with each other. It may be formed into a structure.

A first orifice flow passage 11 is formed in the center of the main body 10. The first orifice flow passage 11 is formed by, for example, a load lock after the operation stop-initial vacuum of the manufacturing process equipment is removed. It is closed during normal operation when the dry pump 5 is not operated due to the idle state until the opening, and a large amount of exhaust gas flows due to the operation of the manufacturing process equipment, for example. It opens only during the exhaust operation (driving pump 5 operation) flowing through the pipe 3, and serves to accelerate the flow of the exhaust gas by inducing the exhaust gas to flow through at a relatively high speed.

In addition, a bypass passage 13 for bypassing the first orifice passage 11 is formed at one inner side of the main body 10, and the bypass passage 13 is a kind of orifice passage for bypassing the first orifice passage 11. Correspondingly, it always remains open regardless of the normal operation in which the dry pump 5 is not operated or in the exhaust operation in which the dry pump 5 is operated.

As shown in FIG. 1, the bypass flow path 13 is maintained in an open state during normal operation in which the dry pump 5 is not operated, for example, by the operation stop of the manufacturing process equipment. Use of the dry pump 5 by inducing a residual pressure at the rear end to flow through at a relatively high speed so that a negative pressure is formed at the rear end of the dry pump 5, thereby minimizing a load acting on the dry pump 5 later. Increase the service life. At this time, the fluid acceleration device according to the present embodiment is not limited to a dry pump, it turns out that it can be utilized also in the rear end of the exhaust device using a gas that does not react with air.

Also, as shown in FIG. 2, the bypass flow path 13 may be configured to provide a large amount of exhaust gas through the operation of a manufacturing process facility (including an exhaust device that does not use gas that reacts with air). The exhaust gas flowed through the bypass flow path 13 at high speed in the fluid flow direction by the exhaust gas flowing through the first orifice flow passage 11 to the exhaust gas flowing through the first orifice flow passage 11. As it serves to further accelerate the flow of the dust, in particular, the dust generated by the chemical reaction of the exhaust gas serves to reduce the clogging phenomenon in the tube adhered to the inner wall of the fluid flow pipe (3).

The bypass passage 13 also includes a first branch passage 13a connected to the gas supply pipe 30 to be described later, and the negative pressure gauge to be described later on the upstream side of the branch point of the first branch passage 13a. It further comprises a second branch passage (13b) connected to 50).

In addition, the main body 10 further includes a packing ring 15 in close contact with the corresponding flange portion of the fluid flow pipe 3 on both sides so as to be hermetically coupled to the fluid flow pipe 3.

As shown in FIG. 4, the main body 10 is a dry pump 5 on an exhaust line (corresponding to the fluid flow path 3) of a manufacturing process facility such as a panel display such as a semiconductor, an LCD, an OLED, or other electronic components. It is preferred to be installed downstream of.

In addition, the main body 10 may be integrated and installed in the dry pump 5 according to the embodiment. In this case, the main body 10 is preferably located downstream of the rotor of the dry pump 5.

The release valve 20 is coupled to the center of the downstream side of the above-described main body 10. The release valve 20 is elastically deflected in a reverse direction with respect to the fluid flow direction during normal operation in which the dry pump 5 is stopped. By closing the rear end of the first orifice flow passage 11 by its elastic force, the fluid located at the rear end of the dry pump 5 is induced to flow through the bypass flow passage 13 at a relatively high speed so that the dry pump 5 In the exhaust operation in which the negative pressure is formed at the rear end and the dry pump 5 is operated, the exhaust gas is discharged by opening the rear end of the first orifice flow path 11 while being pushed in the fluid flow direction by the exhaust pressure exceeding its own elastic force. 1 Reversely induces flow through the orifice flow passage 11 at a relatively high speed and at the same time allows a portion of the exhaust gas to bypass the bypass flow passage 13 to be injected at high speed in the fluid flow direction. Do it.

The release valve 20 includes a valve housing 21 coupled to a downstream center of the main body 10, a coil spring 23 accommodated in the valve housing 21 to provide an elastic force, and the coil spring 23. It has a structure including a valve body 25 for opening and closing the rear end of the first orifice flow path 11 while elastically biased in the reverse direction of the fluid flow direction.

The valve housing 21 has a front ring body 21a and a rear ring body 21b connected by a plurality of, in particular three connecting supports 21c, as shown schematically in Figs. 1 to 3 and the rear ring body 21b. A through hole 21b 'is formed in the center of the valve body 25, and a spring through member 25a is inserted into the coil spring 23 and then penetrated into the through hole 21b'. It is preferable.

The gas supply pipe 30 is connected to the first branch passage 13a of the bypass passage 13 of the main body 10, which is a bypass passage through the first branch passage 13a. The gas is supplied to (13) so that the gas is injected at a high pressure in the flow direction of the fluid together with some of the fluid flowing through the bypass flow path (13), thereby further accelerating the flow of the exhaust gas, in particular exhaust gas The dust generated by the chemical reaction of the serves to significantly reduce the clogging phenomenon in the tube adhered to the inner wall of the fluid flow pipe (3).

As shown in FIG. 4, the gas supply pipe 30 is connected to the compressor body tank 7 filled with an inert gas such as nitrogen or argon gas or a gas such as air at a high pressure, so that nitrogen and argon gas may flow in the flow direction of the fluid. Inert gas such as or gas such as air may be formed to be injected at high speed.

In addition, although not shown, the gas supply pipe 30 is connected to the nitrogen gas supply pipe 9 which provides nitrogen gas (hot purge gas) to the dry pump 5 so that the nitrogen gas (hot purge gas) flows in the fluid direction. May be formed to be injected at a high speed.

Preferably, a positive pressure gauge 40 is interposed between the first branch passage 13a of the bypass passage 13 of the main body 10 and the gas supply pipe 30, and the positive pressure gauge 40 is a gas. By measuring and displaying the internal pressure of the first branch flow passage 13a of the bypass flow passage 13 by the supply pipe 30 or by providing a corresponding signal to the controller, it is determined whether the fluid flow phase is abnormal due to the bypass flow passage 13. To be directed.

The negative pressure gauge 50 is installed at the end of the second branch passage 13b of the bypass passage 13 of the main body 10, and the negative pressure gauge 40 is part of the fluid to the bypass passage 13. When the bypass flows through, the sound pressure generated in the second branch flow passage 13b is measured and displayed, or the corresponding signal is provided to the controller so that an abnormality in the fluid flow due to the bypass flow passage 13 can be indicated. Play a role.

When the fluid flow by the bypass channel 13 is normally performed, the positive pressure gauge 40 is instructed to positive pressure and the negative pressure gauge 50 is instructed to negative pressure. Therefore, when a negative pressure is indicated on the positive pressure gauge 40 or a positive pressure is indicated on the negative pressure gauge 50, it is considered that there is an abnormality in the fluid flow by the bypass flow path 13, and the operator may have a positive pressure gauge 40 or a negative pressure. By looking at the scale of the gauge 50, it is determined whether or not the abnormality is to take immediate action.

In the first branch passage 13a of the bypass passage 13 of the main body 10 described above, an insert 60 having a second orifice passage 61 is preferably inserted in the center thereof. As the second orifice flow passage 61 is formed in the first branch flow passage 13a, the gas flowing through the gas supply pipe 30 flows at a higher speed to double the clogging reduction effect. This results in shorter bypass distances and less air flow to enhance the flow rate.

In addition, the cutout portion 63 is formed on the inlet side outer circumferential surface of the insert 60 at a predetermined angular interval, and at the same time, a side inlet hole 65 is formed in communication with the second orifice flow passage 61. In this case, the gas flows into the second orifice flow passage 61 from the side of the insert 60 so that a vortex may be formed in the flow of gas flowing through the second orifice flow passage 61. The clogging reduction effect can be further doubled. The cutout portion 63 is preferably formed on the inlet side outer circumferential surface of the insert (60) having a hollow cylinder shape three full sets at an angle of 120 degrees, the entire insert 60 on the inlet side of the insert (60) It is preferable that only a predetermined length of the length is cut off and formed.

One end of the safety unit 70 is connected to the above-described main body 10, and the safety unit 70 is connected to the other end of the gas supply pipe 30. The gas supply pipe 30 is excessively moved by the supply pressure, and serves to prevent injury or damage to people. The other end of the safety unit 70 is preferably provided with a fixing ring 71 surrounding the outer circumferential surface of a certain point of the gas supply pipe 30 in close contact. Safety unit 170 is shown in the form of a chain, but is not limited to this, it is possible if the structure that provides the function to perform the above-described safety role.

Hereinafter, as shown in FIG. 4, the fluid acceleration device 1 according to an exemplary embodiment of the present invention is an exhaust line (fluid flow pipe) of a manufacturing process facility of a panel display such as a semiconductor, an LCD, an OLED, or other electronic components. 3) on the basis of the state installed on the downstream of the dry pump 5, the overall operation of the fluid acceleration device 1 according to an embodiment of the present invention will be described as follows.

The dry pump 5 is stopped only during normal operation during which manufacturing process equipment such as semiconductors, panel displays, and other electronic parts are stopped. In this case, the first orifice flow passage 11 is closed by the release valve 20. And only the bypass passage 13 remains open.

Therefore, the fluid located at the rear end of the dry pump 5 flows through the bypass passage 13 at a relatively high speed as shown in FIGS. 1 and 3, and a negative pressure is formed at the rear end of the dry pump 5. At this time, as the gas is mixed into the bypass passage 13 through the gas supply pipe 30 and injected at a high speed in the fluid flow direction, the dust is further accelerated by the flow of the fluid forced out by the dry pump 5. Intra-tube clogging phenomenon that adheres to the inner wall of the fluid flow pipe 3 can be reduced.

The dry pump 5 is operated during exhaust operation in which manufacturing process equipment such as semiconductors, panel displays, and other electronic components are operating. In this case, the valve body 25 of the release valve 20 is applied to the exhaust pressure of the exhaust gas. The first orifice flow passage 11 is opened and the bypass flow passage 13 remains open as it is pushed by.

Exhaust gas forcibly exhausted by the dry pump 5 flows through the first orifice flow passage 11 at a relatively high speed as shown in FIG. 2, and a part of the exhaust gas flows relatively through the bypass flow passage 13. It flows through the gas at a high speed, and at this time, the gas is mixed into the bypass flow path 13 through the gas supply pipe 30 and injected at a high speed in the flow direction of the exhaust gas, forcing exhaust gas by the dry pump 5. By further accelerating the flow of the in-line clogging phenomenon that dust adheres to the inner wall of the fluid flow pipe 3 can be significantly reduced.

This reduction in tube clogging phenomenon facilitates the exhaust gas exhaust and reduces the load of the dry pump 5 to increase the service life of the dry pump 5 and at the same time reduce the amount of hot purge nitrogen gas to be used. Load and process costs can be reduced.

In addition, the fluid acceleration device 1 according to an embodiment of the present invention is a dry pump on the exhaust line (corresponding to the fluid flow path 3) of the manufacturing process equipment, such as a panel display, such as a semiconductor, LCD, OLED, etc. When installed downstream of (5), as the negative pressure is formed at the rear end of the dry pump 5, the load of the dry pump 5 is reduced to increase the service life of the dry pump 5.

The fluid acceleration device according to an embodiment of the present invention as described above may be used not only for the discharge port of the dry pump, but also for the external exhaust pipe of all the exhaust pipes through which the non-gas reacting with the air is discharged. It will be appreciated that the fluid acceleration device according to the present embodiment can be installed in, for example, a vehicle exhaust pipe.

That is, in the present embodiment, the fluid acceleration device is described as being installed downstream of the dry pump, but the scope of the present invention is not limited thereto and may be installed in the lower portion of a normal gas discharge pipe.

In addition, although the nitrogen supply pipe for supplying nitrogen is branched to the mechanical supply pipe of the present embodiment, it is not necessary to supply nitrogen, and it is clear that nitrogen is only one gas that can be used.

That is, the fluid accelerator according to the present embodiment can obtain a sufficient effect by using only compressed air (currently applicable amount of 5 to 8 slm) without using nitrogen, thereby reducing the amount of power used by the pump during the use of the fluid accelerator. In addition, the effect of reducing the amount of nitrogen used may be secondary.

As described above, the present invention is not limited to the above-described embodiments, and modifications apparent by those skilled in the art to which the present invention pertains may be made without departing from the technical spirit of the present invention claimed in the claims. It is possible that such modifications are within the scope of the present invention.

The present invention relates to a fluid acceleration device installed in a fluid flow pipe provided with a dry pump to form an orifice and inject gas at a high pressure in the flow direction of the fluid to accelerate the flow of the fluid. Invention.

Claims

The main body 10 is coupled to the fluid flow pipe 3, the first orifice flow passage 11 is formed in the center and the bypass 10 to bypass the first orifice flow passage 11 is formed on one side of the main body (10) ;

A release valve 20 coupled to a downstream center of the main body 10 to open and close the first orifice flow passage 11; And

One end is connected to the bypass passage 13 of the main body 10 and comprises a gas supply pipe 30 through which the gas is injected in a high pressure flow direction through the bypass passage 13,

The bypass passage 13 of the main body 10 includes a first branch passage 13a connected to the gas supply pipe 30, and between the first branch passage 13a and the gas supply pipe 30. Fluid acceleration device, characterized in that the positive pressure gauge 40 is installed.
The method according to claim 1,

The bypass passage 13 of the main body 10 further includes a second branch passage 13b upstream of the branch point of the first branch passage 13a, and an end portion of the second branch passage 13b. Fluid acceleration device, characterized in that the negative pressure gauge (50) is installed.
The method according to claim 1,

A fluid acceleration device according to claim 1, wherein an insert (60) having a second orifice flow passage (61) is inserted into the first branch flow passage (13a).
The method according to claim 3,

The inlet side outer peripheral surface of the insert 60 is formed with a cutout portion 63 at a predetermined angular interval, and the cutout portion 63 allows gas to flow into the second orifice flow passage 61 from the side of the insert 60. Fluid acceleration device, characterized in that the side inlet hole (65) is formed.
The method according to claim 1,

One end is further connected to the main body 10 and the other end is connected to the gas supply pipe 30 further comprises a safety unit 70 for supporting so as not to move excessively at any departure of the gas supply pipe (30) Fluid acceleration device.
The method according to any one of claims 1 to 5,

The body (10) is a fluid acceleration device, characterized in that installed on the fluid flow pipe (3) downstream of the dry pump (5).
The method according to claim 6,

The gas supply pipe 30 is a fluid acceleration device, characterized in that the compressor body tank (7) is connected.
The method according to claim 7,

The gas supply pipe (30) is a fluid acceleration device characterized in that the nitrogen gas supply pipe (9) for supplying nitrogen gas to the dry pump (5) is branched.