WO2017073867A1 - Stamper for injection molding having pattern for thermal insulation, and injection mold comprising same - Google Patents

Stamper for injection molding having pattern for thermal insulation, and injection mold comprising same Download PDF

Info

Publication number
WO2017073867A1
WO2017073867A1 PCT/KR2016/005060 KR2016005060W WO2017073867A1 WO 2017073867 A1 WO2017073867 A1 WO 2017073867A1 KR 2016005060 W KR2016005060 W KR 2016005060W WO 2017073867 A1 WO2017073867 A1 WO 2017073867A1
Authority
WO
WIPO (PCT)
Prior art keywords
stamper
core
injection molding
pattern
injection
Prior art date
Application number
PCT/KR2016/005060
Other languages
French (fr)
Korean (ko)
Inventor
홍석관
강정진
Original Assignee
한국생산기술연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국생산기술연구원 filed Critical 한국생산기술연구원
Publication of WO2017073867A1 publication Critical patent/WO2017073867A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings

Definitions

  • the present invention relates to a stamper for injection molding, and more particularly, to an injection molding stamper having an excellent heat insulating effect and at the same time having an excellent strength and an injection mold having the same.
  • Injection molding is a method of injecting molten resin into a cavity of a mold having a predetermined shape, filling the same, and cooling the same to form a product having the same shape as the cavity, and is generally used to mass produce plastic products.
  • injection molding is used as a method for producing a plastic structure in which fine patterns of several tens of nanometers to several tens of micrometers exist on the surface.
  • a plate-shaped stamper having a pattern corresponding to the fine pattern of the product is formed in one surface of the cavity to perform injection molding.
  • a heat insulating plate is generally interposed between the stamper and the core of the mold for heat insulation.
  • a non-metallic material such as a rubber plate or an epoxy hardened plate having a low heat transfer coefficient is generally used. Is used.
  • a conventional non-metallic insulation plate has a problem that it is easily damaged due to its low strength because it is vulnerable to repeated high temperature / high pressure injection molding environments.
  • Japanese Patent Laid-Open No. 2006-120230 discloses a technique of using an insulating stamper having an intermediate portion having a lower thermal conductivity than the top, and in Japanese Patent Laid-Open No. 10-2012-0115617. A technique using an adhesive layer having a low thermal conductivity for thermal insulation is described, and Japanese Patent Laid-Open No. 2008-221783 describes a technique for forming a thermal barrier region layer having a low thermal conductivity in the middle of a stamper for thermal insulation.
  • Patent Publication No. 10-2011-0067731 discloses a technique using an insulating board for the insulation of the stamper.
  • An object of the present invention is to provide an injection molding stamper excellent in both strength and thermal insulation and an injection mold having the same.
  • Another object of the present invention is to provide an injection molding stamper and an injection mold having the same, the contact thermal resistance coefficient (TCR) of which is adjusted according to the shape of the pattern.
  • TCR contact thermal resistance coefficient
  • An injection molding stamper comprising: a molding pattern 112 formed on a first surface 111; And a heat insulating pattern 114 formed on the second surface 113 opposite to the first surface.
  • the insulation pattern may have a sawtooth shape formed by repeating the peaks and valleys.
  • the material of the said heat insulation pattern is a metal.
  • the injection molding stamper is provided with an injection mold, characterized in that the injection molding stamper described above.
  • the injection molding stamper is installed such that the insulating pattern is in contact with the first core.
  • the injection molding stamper according to the present invention has a heat insulating pattern formed on the surface in contact with the core of the mold, since the material is not limited, a material having sufficient strength can be used, thereby providing strength and heat insulating properties. This is all excellent.
  • the insulation pattern formed on the stamper can adjust the contact thermal resistance coefficient when changing the height and the slope.
  • FIG. 1 is a view schematically showing an injection molding process using a stamper according to an embodiment of the present invention.
  • FIG. 2 is an enlarged view of a portion A of FIG. 1.
  • FIG 3 is a graph showing a change in the contact heat transfer coefficient between the stamper and the core according to the height and the slope (pitch) of the heat insulating pattern of the stamper according to the present invention.
  • FIG. 4 is a view showing a change in cycle time according to the stamper thickness.
  • FIGS. 1 and 2 are views schematically showing an injection molding process using a stamper according to an embodiment of the present invention
  • Figure 2 is an enlarged portion A of FIG.
  • the injection mold 200 includes a first mold part 210, a second mold part 220 which is combined with the first mold part 210 to form a cavity C, and a cavity.
  • a stamper 100 installed in (C).
  • the first mold part 210 includes a first core 211 positioned at an upper portion of the drawing and positioned at a surface facing the corresponding second mold part 220.
  • the first core 211 has a flat contact surface 212 facing the second mold portion 220.
  • One surface of the stamper 100 is in contact with the contact surface 121.
  • a cooling channel is formed in the first core 221.
  • the second mold part 220 is positioned below the drawing and corresponds to the first mold part 210.
  • the second mold part 220 includes a second core 221 corresponding to the first core 211 provided in the first mold part 210.
  • a cavity C for forming is formed.
  • a cooling channel is formed in the second core 221.
  • the stamper 100 is a flat plate-like member and is made of a material (eg, metal) having a sufficiently strong strength used in a conventional injection molding stamper.
  • the stamper 100 is installed on the first core 211 to be in contact with the contact surface 212 of the first core 211.
  • the first core 211 is spaced apart from the second core to face the first surface 111 and the second surface that is in contact with the contact surface 212 of the first core 211 as an opposite surface of the first surface 111 ( 113).
  • a cavity C in which the molten resin M is filled is formed between the first surface 111 of the stamper 100 and the second core 221.
  • Molding pattern 112 is made of a conventional configuration used in the injection molding stamper, so a detailed description thereof will be omitted.
  • the heat insulation pattern 114 is formed on the second surface 113 of the stamper 100 in contact with the contact surface 212 of the first core 211.
  • the heat insulation pattern 114 is a structure in which the peak and the valley are repeated in the form of sawtooth.
  • the pointed end of the heat insulating pattern 114 is in contact with the contact surface 212 of the first core 211, the stamper 100 itself has a sufficient heat insulating effect. Therefore, the problem of the prior art by using a heat insulating plate of low strength, such as a rubber plate or an epoxy hardened plate can be solved.
  • the left graph of FIG. 3 shows a change in the contact heat transfer coefficient between the stamper and the core according to the height of the heat insulation pattern in the same slope of the heat insulation pattern
  • the right graph of FIG. 3 shows the same height of the heat insulation pattern. Shows the change of the contact heat transfer coefficient between the stamper and the core according to the slope of the insulation pattern.
  • h c means solid contact conductance
  • h g means gas filled gap conductance. It is confirmed from FIG. 3 that the contact thermal resistance coefficient TCR can be controlled by adjusting the shape of the pattern.
  • the graph of FIG. 4 shows the change in cycle time (the time taken for the center temperature of the molten resin to decrease from the initial temperature to 90 ° C) with the stamper thickness. It is confirmed from FIG. 4 that the cycle time can be controlled by adjusting the thickness of the stamper.
  • the insulation pattern has been described as having a sawtooth shape in which the peaks and valleys are repeated as shown in FIG. 2, but the present invention is not limited thereto. Any form can be used as long as it reduces the area of the stamper in contact with the core, and all such patterns are included in the present invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The present invention relates to a stamper for molding. The present invention provides a stamper for injection molding comprising: a molding pattern (112) which is formed on a first surface (111); and a thermal insulation pattern (114) which is formed on a second surface (113) which is the opposite surface to the first surface.

Description

단열을 위한 패턴이 형성된 사출성형용 스탬퍼 및 이를 구비하는 사출 금형Injection molding stamper with a pattern for insulation and an injection mold having the same
본 발명은 사출성형용 스탬퍼에 관한 것으로서, 더욱 상세하게는 단열 효과가 뛰어나면서 동시에 우수한 강도를 갖는 사출 성형용 스탬퍼 및 이를 구비하는 사출 금형에 관한 것이다.The present invention relates to a stamper for injection molding, and more particularly, to an injection molding stamper having an excellent heat insulating effect and at the same time having an excellent strength and an injection mold having the same.
사출성형은 일정한 형상을 가진 금형의 캐비티 내부로 용융된 수지를 유입시켜서 충진하고, 이를 냉각하여 캐비티의 형상과 동일한 제품을 형성하는 방법으로서, 플라스틱 제품을 대량으로 생산하는데 일반적으로 이용된다.Injection molding is a method of injecting molten resin into a cavity of a mold having a predetermined shape, filling the same, and cooling the same to form a product having the same shape as the cavity, and is generally used to mass produce plastic products.
최근에는 일반적인 가정용 플라스틱 제품뿐만 아니라, 우주 항공분야나 정밀광학기기 분야에 사용되는 플라스틱 제품을 생산하는데 있어서도 사출성형방법이 이용되고 있으며, 특히, 미세하고도 정밀한 패턴이 요구되는 제품의 제조에도 이용되고 있다. 즉, 표면에 수십 나노 내지 수십 마이크로미터 크기의 미세 패턴이 존재하는 플라스틱 구조물을 생산하기 위한 방법으로 사출성형이 이용되는 것이다. 이 경우, 제품의 미세 패턴에 대응하는 패턴이 일면에 형성된 판상의 스탬퍼를 캐비티 내에 설치하여 사출성형을 하게 된다. 이러한 스탬퍼를 이용한 사출성형에서 단열을 위하여 일반적으로 스탬퍼와 금형의 코어 사이에 단열판이 개재되는데, 단열을 위해 사용되는 종래의 단열판은 일반적으로 열전달계수가 낮은 고무판이나 에폭시경화판과 같이 비금속류의 재질인 것이 사용된다. 하지만, 이러한 종래의 비금속류 재질의 단열판은 강도가 낮기 때문에 반복되는 고온/고압의 사출성형 환경에 취약하여 쉽게 손상된다는 문제가 있다.Recently, the injection molding method has been used to produce not only general household plastic products but also plastic products used in aerospace or precision optical devices, and especially for the manufacture of products requiring fine and precise patterns. have. In other words, injection molding is used as a method for producing a plastic structure in which fine patterns of several tens of nanometers to several tens of micrometers exist on the surface. In this case, a plate-shaped stamper having a pattern corresponding to the fine pattern of the product is formed in one surface of the cavity to perform injection molding. In the injection molding using such a stamper, a heat insulating plate is generally interposed between the stamper and the core of the mold for heat insulation. In the conventional heat insulating plate used for heat insulation, a non-metallic material such as a rubber plate or an epoxy hardened plate having a low heat transfer coefficient is generally used. Is used. However, such a conventional non-metallic insulation plate has a problem that it is easily damaged due to its low strength because it is vulnerable to repeated high temperature / high pressure injection molding environments.
본 발명과 관련된 기술분야의 선행특허문헌으로서 일본공개특허 특개2006-120230호에는 최상부보다 낮은 열전도율을 갖는 중간부를 갖는 단열 스탬퍼를 사용하는 기술이 기재되어 있으며, 공개특허 제10-2012-0115617호에는 단열을 위해 열전도율이 낮은 접착층을 이용하는 기술이 기재되어 있고, 일본공개특허 특개2008-221783호에는 단열을 위해 스탬퍼의 중간에 열 전도도가 낮은 열 차단성 영역층을 형성한 기술이 스탬퍼가 기재되어 있으며, 공개특허 제10-2011-0067731호에는 스탬퍼의 단열을 위해 단열보드를 이용하는 기술이 기재되어 있다.As a prior patent document in the technical field related to the present invention, Japanese Patent Laid-Open No. 2006-120230 discloses a technique of using an insulating stamper having an intermediate portion having a lower thermal conductivity than the top, and in Japanese Patent Laid-Open No. 10-2012-0115617. A technique using an adhesive layer having a low thermal conductivity for thermal insulation is described, and Japanese Patent Laid-Open No. 2008-221783 describes a technique for forming a thermal barrier region layer having a low thermal conductivity in the middle of a stamper for thermal insulation. , Patent Publication No. 10-2011-0067731 discloses a technique using an insulating board for the insulation of the stamper.
본 발명의 목적은 강도와 단열성이 모두 우수한 사출성형용 스탬퍼 및 이를 구비하는 사출 금형을 제공하는 것이다.An object of the present invention is to provide an injection molding stamper excellent in both strength and thermal insulation and an injection mold having the same.
본 발명의 다른 목적은 패턴의 형상에 따라 접촉열저항계수(TCR)가 조절되는 사출성형용 스탬퍼 및 이를 구비하는 사출 금형을 제공하는 것이다.Another object of the present invention is to provide an injection molding stamper and an injection mold having the same, the contact thermal resistance coefficient (TCR) of which is adjusted according to the shape of the pattern.
상기한 본 발명의 목적을 달성하기 위하여, 본 발명의 일 측면에 따르면,In order to achieve the above object of the present invention, according to an aspect of the present invention,
사출성형용 스탬퍼로서, 제1 면(111)에 형성된 성형용 패턴(112); 및 상기 제1 면의 반대면인 제2 면(113)에 형성된 단열용 패턴(114)을 포함하는 것을 특징으로 하는 사출성형용 스탬퍼가 제공된다.An injection molding stamper, comprising: a molding pattern 112 formed on a first surface 111; And a heat insulating pattern 114 formed on the second surface 113 opposite to the first surface.
상기 단열용 패턴은 산부와 골부가 반복되어서 형성되는 톱니 형태일 수 있다.The insulation pattern may have a sawtooth shape formed by repeating the peaks and valleys.
상기 단열용 패턴의 재질은 금속인 것이 바람직하다.It is preferable that the material of the said heat insulation pattern is a metal.
상기한 본 발명의 목적을 달성하기 위하여, 본 발명의 다른 측면에 따르면,In order to achieve the above object of the present invention, according to another aspect of the present invention,
제1 코어(211)를 구비하는 제1 금형부(210); 상기 제1 코어와 대응하는 제2 코어(221)를 구비하는 제2 금형부(220); 및 상기 제1 코어와 상기 제2 코어의 사이에 형성되는 공간에 상기 제1 코어와 접하도록 설치되어서 상기 제2 코어와의 사이에 캐비티(C)를 형성하는 사출성형용 스탬퍼(100)를 포함하며, 상기 사출성형용 스탬퍼는 위에 기재된 사출성형용 스탬퍼인 것을 특징으로 하는 사출 금형이 제공된다.A first mold part 210 having a first core 211; A second mold part 220 having a second core 221 corresponding to the first core; And an injection molding stamper 100 installed in contact with the first core in a space formed between the first core and the second core to form a cavity C between the second core. And, the injection molding stamper is provided with an injection mold, characterized in that the injection molding stamper described above.
상기 사출성형용 스탬퍼는 상기 단열용 패턴이 상기 제1 코어와 접하도록 설치된다.The injection molding stamper is installed such that the insulating pattern is in contact with the first core.
본 발명에 의하면 앞서서 기재한 본 발명의 목적을 모두 달성할 수 있다. 구체적으로는, 본 발명에 따른 사출성형용 스탬퍼는 금형의 코어와 접촉하는 면에 단열용 패턴이 형성되어 있으므로, 재질의 제한을 받지 않기 때문에, 충분한 강도를 갖는 재질이 사용될 수 있어서, 강도와 단열성이 모두 우수하다.According to the present invention, all the objects of the present invention described above can be achieved. Specifically, since the injection molding stamper according to the present invention has a heat insulating pattern formed on the surface in contact with the core of the mold, since the material is not limited, a material having sufficient strength can be used, thereby providing strength and heat insulating properties. This is all excellent.
또한, 스탬퍼에 형성된 단열용 패턴은 높이와 기울기를 변화시킬 경우 접촉열저항계수를 조절할 수 있게 된다.In addition, the insulation pattern formed on the stamper can adjust the contact thermal resistance coefficient when changing the height and the slope.
도 1은 본 발명의 일 실시예에 따른 스탬퍼를 이용한 사출성형 공정을 개략적으로 도시한 도면이다.1 is a view schematically showing an injection molding process using a stamper according to an embodiment of the present invention.
도 2는 도 1의 A 부분을 확대하여 도시한 도면이다.FIG. 2 is an enlarged view of a portion A of FIG. 1.
도 3은 본 발명에 따른 스탬퍼의 단열용 패턴의 높이와 기울기(피치)에 따른 스탬퍼와 코어 사이의 접촉 열전달 계수의 변화를 보여주는 그래프이다.3 is a graph showing a change in the contact heat transfer coefficient between the stamper and the core according to the height and the slope (pitch) of the heat insulating pattern of the stamper according to the present invention.
도 4는 스탬퍼 두께에 따른 사이클 타임의 변화를 보여주는 도면이다.4 is a view showing a change in cycle time according to the stamper thickness.
이하, 도면을 참조하여 본 발명의 실시예를 상세하게 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
도 1에는 본 발명의 일 실시예에 따른 스탬퍼를 이용한 사출성형 공정을 개략적으로 도시한 도면이 도시되어 있고, 도 2에는 도 1의 A 부분이 확대되어 도시되어 있다. 도 1과 도 2를 참조하면, 사출 금형(200)은 제1 금형부(210)와, 제1 금형부(210)와 합쳐져서 캐비티(C)를 형성하는 제2 금형부(220)와, 캐비티(C) 내에 설치되는 스탬퍼(100)를 포함한다.1 is a view schematically showing an injection molding process using a stamper according to an embodiment of the present invention, Figure 2 is an enlarged portion A of FIG. Referring to FIGS. 1 and 2, the injection mold 200 includes a first mold part 210, a second mold part 220 which is combined with the first mold part 210 to form a cavity C, and a cavity. And a stamper 100 installed in (C).
제1 금형부(210)는 도면 상 상부에 위치하며 대응하는 제2 금형부(220)를 대향하는 면에 위치하는 제1 코어(211)를 구비한다. 제1 코어(211)는 제2 금형부(220)와 대향하는 편평한 접촉면(212)을 구비한다. 접촉면(121)에 스탬퍼(100)의 일면이 접한다. 도시되지는 않았으나, 제1 코어(221)에는 냉각 채널이 형성된다.The first mold part 210 includes a first core 211 positioned at an upper portion of the drawing and positioned at a surface facing the corresponding second mold part 220. The first core 211 has a flat contact surface 212 facing the second mold portion 220. One surface of the stamper 100 is in contact with the contact surface 121. Although not shown, a cooling channel is formed in the first core 221.
제2 금형부(220)는 도면 상 하부에 위치하며 제1 금형부(210)와 대응한다. 제2 금형부(220)는 제1 금형부(210)에 구비되는 제1 코어(211)에 대응하는 제2 코어(221)를 구비한다. 제2 코어(221)는 제1 코어(211)와 합형되었을 때, 성형을 위한 캐비티(C)가 형성된다. 도시되지는 않았으나 제2 코어(221)에는 냉각 채널이 형성된다.The second mold part 220 is positioned below the drawing and corresponds to the first mold part 210. The second mold part 220 includes a second core 221 corresponding to the first core 211 provided in the first mold part 210. When the second core 221 is integrated with the first core 211, a cavity C for forming is formed. Although not shown, a cooling channel is formed in the second core 221.
스탬퍼(100)는 편평한 판상의 부재로서, 통상적인 사출성형용 스탬퍼에서 사용되는 충분히 강한 강도를 갖는 재질(예를 들면, 금속)로 이루어진다. 스탬퍼(100)는 제1 코어(211)의 접촉면(212)과 접하도록 제1 코어(211)에 설치된다. 제1 코어(211)는 제2 코어와 이격되어서 대향하는 제1 면(111)과, 제1 면(111)의 반대면으로서 제1 코어(211)의 접촉면(212)과 접하는 제2 면(113)을 구비한다. 스탬퍼(100)의 제1 면(111)과 제2 코어(221)의 사이에는 용융 수지(M)가 채워지는 캐비티(C)가 형성된다. 스탬퍼(100)의 제1 면(111)에는 용융 수지(M)에 의한 사출물에 패턴을 형성하기 위한 성형용 패턴(112)이 형성된다. 성형용 패턴(112)은 사출성형용 스탬퍼에서 사용되는 통상적인 구성으로 이루어지므로 이에 대한 상세한 설명은 생략한다.The stamper 100 is a flat plate-like member and is made of a material (eg, metal) having a sufficiently strong strength used in a conventional injection molding stamper. The stamper 100 is installed on the first core 211 to be in contact with the contact surface 212 of the first core 211. The first core 211 is spaced apart from the second core to face the first surface 111 and the second surface that is in contact with the contact surface 212 of the first core 211 as an opposite surface of the first surface 111 ( 113). A cavity C in which the molten resin M is filled is formed between the first surface 111 of the stamper 100 and the second core 221. On the first surface 111 of the stamper 100, a molding pattern 112 for forming a pattern on the injection molded product by the molten resin M is formed. Molding pattern 112 is made of a conventional configuration used in the injection molding stamper, so a detailed description thereof will be omitted.
제1 코어(211)의 접촉면(212)과 접하는 스탬퍼(100)의 제2 면(113)에는 단열용 패턴(114)이 형성된다. 단열용 패턴(114)는 톱니 형태로 산부와 골부가 반복되는 구조이다. 단열용 패턴(114)의 뾰족한 끝단이 제1 코어(211)의 접촉면(212)과 접함으로써, 스탬퍼(100) 자체가 충분한 단열 효과를 갖게 된다. 따라서, 고무판이나 에폭시경화판과 같이 강도가 낮은 단열판을 별도로 사용함에 따른 종래의 기술의 문제점이 해결될 수 있다.The heat insulation pattern 114 is formed on the second surface 113 of the stamper 100 in contact with the contact surface 212 of the first core 211. The heat insulation pattern 114 is a structure in which the peak and the valley are repeated in the form of sawtooth. The pointed end of the heat insulating pattern 114 is in contact with the contact surface 212 of the first core 211, the stamper 100 itself has a sufficient heat insulating effect. Therefore, the problem of the prior art by using a heat insulating plate of low strength, such as a rubber plate or an epoxy hardened plate can be solved.
도 3의 좌측 그래프는 단열용 패턴의 기울기가 동일한 상태에서 단열용 패턴의 높이에 따른 스탬퍼와 코어 사이의 접촉열전달계수의 변화를 보여주며, 도 3의 우측 그래프는 단열용 패턴의 높이가 동일한 상태에서 단열용 패턴의 기울기에 따른 스탬퍼와 코어 사이의 접촉열전달계수의 변화를 보여준다. 도 3에서 hc는 solid contact conductance를 의미하며, hg는 gas filled gap conductance를 의미한다. 도 3으로부터 패턴의 형상을 조절함으로써 접촉열저항계수(TCR)이 제어될 수 있음이 확인된다.The left graph of FIG. 3 shows a change in the contact heat transfer coefficient between the stamper and the core according to the height of the heat insulation pattern in the same slope of the heat insulation pattern, and the right graph of FIG. 3 shows the same height of the heat insulation pattern. Shows the change of the contact heat transfer coefficient between the stamper and the core according to the slope of the insulation pattern. In FIG. 3, h c means solid contact conductance and h g means gas filled gap conductance. It is confirmed from FIG. 3 that the contact thermal resistance coefficient TCR can be controlled by adjusting the shape of the pattern.
도 4의 그래프는 스탬퍼 두께에 따른 사이클 타임(용융 수지의 중심 온도가 초기 온도로부터 90℃까지 감소하는데 걸리는 시간)의 변화를 보여준다. 도 4로부터 스탬퍼의 두께를 조절함으로써 사이클 타임이 제어될 수 있음이 확인된다.The graph of FIG. 4 shows the change in cycle time (the time taken for the center temperature of the molten resin to decrease from the initial temperature to 90 ° C) with the stamper thickness. It is confirmed from FIG. 4 that the cycle time can be controlled by adjusting the thickness of the stamper.
상기 실시예에서는 단열용 패턴이 도 2에 도시된 바와 같은 산부와 골부가 반복되는 톱니 형태인 것으로 설명하였으나 본 발명은 이에 제한되는 것은 아니다. 코어와 접촉하는 스탬퍼의 면적을 줄여주는 형태라면 모두 가능하며, 이러한 모든 패턴을 본 발명은 포함한다.In the above embodiment, the insulation pattern has been described as having a sawtooth shape in which the peaks and valleys are repeated as shown in FIG. 2, but the present invention is not limited thereto. Any form can be used as long as it reduces the area of the stamper in contact with the core, and all such patterns are included in the present invention.
이상 실시예를 통해 본 발명을 설명하였으나, 본 발명은 이에 제한되는 것은 아니다. 상기 실시예는 본 발명의 취지 및 범위를 벗어나지 않고 수정되거나 변경될 수 있으며, 본 기술분야의 통상의 기술자는 이러한 수정과 변경도 본 발명에 속하는 것임을 알 수 있을 것이다.Although the present invention has been described through the above embodiments, the present invention is not limited thereto. The above embodiments may be modified or changed without departing from the spirit and scope of the present invention, and those skilled in the art will recognize that such modifications and changes also belong to the present invention.

Claims (5)

  1. 사출성형용 스탬퍼로서,As a stamper for injection molding,
    제1 면(111)에 형성된 성형용 패턴(112); 및A molding pattern 112 formed on the first surface 111; And
    상기 제1 면의 반대면인 제2 면(113)에 형성된 단열용 패턴(114)을 포함하는 것을 특징으로 하는 사출성형용 스탬퍼.Injection molding stamper, characterized in that it comprises a heat insulating pattern (114) formed on the second surface (113) opposite the first surface.
  2. 청구항 1에 있어서,The method according to claim 1,
    상기 단열용 패턴은 산부와 골부가 반복되어서 형성되는 톱니 형태인 것을 특징으로 하는 사출성형용 스탬퍼.The insulating pattern is injection molding stamper, characterized in that the sawtooth shape is formed by repeating the peaks and valleys.
  3. 청구항 1에 있어서,The method according to claim 1,
    상기 단열용 패턴의 재질은 금속인 것을 특징으로 하는 사출성형용 스탬퍼.Injection molding stamper, characterized in that the material of the insulation pattern is a metal.
  4. 제1 코어(211)를 구비하는 제1 금형부(210);A first mold part 210 having a first core 211;
    상기 제1 코어와 대응하는 제2 코어(221)를 구비하는 제2 금형부(220); 및A second mold part 220 having a second core 221 corresponding to the first core; And
    상기 제1 코어와 상기 제2 코어의 사이에 형성되는 공간에 상기 제1 코어와 접하도록 설치되어서 상기 제2 코어와의 사이에 캐비티(C)를 형성하는 사출성형용 스탬퍼(100)를 포함하며,An injection molding stamper 100 installed in contact with the first core in a space formed between the first core and the second core to form a cavity C between the second core and ,
    상기 사출성형용 스탬퍼는 청구항 1 내지 청구항 3 중 어느 하나의 청구항에 기재된 사출성형용 스탬퍼인 것을 특징으로 하는 사출 금형.The injection molding stamper is an injection molding stamper according to any one of claims 1 to 3, wherein the injection mold.
  5. 청구항 4에 있어서,The method according to claim 4,
    상기 사출성형용 스탬퍼는 상기 단열용 패턴이 상기 제1 코어와 접하도록 설치되는 것을 특징으로 하는 사출 금형.The injection molding stamper is an injection mold, characterized in that the heat insulating pattern is installed in contact with the first core.
PCT/KR2016/005060 2015-10-30 2016-05-13 Stamper for injection molding having pattern for thermal insulation, and injection mold comprising same WO2017073867A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150151773A KR20170050342A (en) 2015-10-30 2015-10-30 Stamper for injection molding with pattern for insulation and injection mold with the same
KR10-2015-0151773 2015-10-30

Publications (1)

Publication Number Publication Date
WO2017073867A1 true WO2017073867A1 (en) 2017-05-04

Family

ID=58630972

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/005060 WO2017073867A1 (en) 2015-10-30 2016-05-13 Stamper for injection molding having pattern for thermal insulation, and injection mold comprising same

Country Status (2)

Country Link
KR (1) KR20170050342A (en)
WO (1) WO2017073867A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000135718A (en) * 1998-11-02 2000-05-16 Asahi Chem Ind Co Ltd Composite stamper
JP2001310358A (en) * 2000-04-26 2001-11-06 Hitachi Ltd Mold for molding disk substrate
JP2002092981A (en) * 2000-09-13 2002-03-29 Nippon Columbia Co Ltd Method for producing stamper and method for producing optical recording medium
KR20060029599A (en) * 2003-06-24 2006-04-06 티디케이가부시기가이샤 Optical disc mold having insulating layer and diamond-like carbonaceous layer on stamper-holding surface and a molding method using the same
JP2008036964A (en) * 2006-08-07 2008-02-21 Ricoh Co Ltd Heat-insulating stamper, and its manufacturing method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000135718A (en) * 1998-11-02 2000-05-16 Asahi Chem Ind Co Ltd Composite stamper
JP2001310358A (en) * 2000-04-26 2001-11-06 Hitachi Ltd Mold for molding disk substrate
JP2002092981A (en) * 2000-09-13 2002-03-29 Nippon Columbia Co Ltd Method for producing stamper and method for producing optical recording medium
KR20060029599A (en) * 2003-06-24 2006-04-06 티디케이가부시기가이샤 Optical disc mold having insulating layer and diamond-like carbonaceous layer on stamper-holding surface and a molding method using the same
JP2008036964A (en) * 2006-08-07 2008-02-21 Ricoh Co Ltd Heat-insulating stamper, and its manufacturing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HONG, S. ET AL.: "Correlation between Thermal Contact Resistance and Filling Behavior of a Polymer Melt into Multiscale Cavities in Injection Molding", INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, vol. 87, August 2015 (2015-08-01), pages 222 - 236, XP029240196 *

Also Published As

Publication number Publication date
KR20170050342A (en) 2017-05-11

Similar Documents

Publication Publication Date Title
JP6020826B2 (en) Fiber-reinforced composite material molding method and fiber-reinforced composite material molding apparatus
Chen et al. Effect of decoration film on mold surface temperature during in-mold decoration injection molding process
TW200722267A (en) Mold, mold temperature regulation method, mold temperature regulation device, injection molding method, injection molding machine, and thermoplastic resin sheet
CN105431280A (en) Thermally conductive plastics components having increased thermal conduction in the direction of thickness
WO2017073867A1 (en) Stamper for injection molding having pattern for thermal insulation, and injection mold comprising same
KR101417621B1 (en) Injection mold having rapid heating and cooling flow path
CN104802421B (en) The forming method and shaped device of fiber reinforced composite material
CN106335171B (en) Die for extrusion molding and extrusion molding method using same
CN106541562A (en) The preparation method of thermoplastic material product and its corresponding product
JP2016064579A (en) Method for manufacturing injection molding
WO2013035443A1 (en) Method for producing resin composite molded body and resin composite molded body
JP5519868B2 (en) Mold and mold manufacturing method
CN103108522A (en) Radiating fins and radiating device and manufacturing method thereof
WO2013035625A1 (en) Mold
CN208500742U (en) The lower heating thermal-field device of model solid glass apparatus for continuous formation
KR20170026945A (en) Mould assembly and method for improving thermal conduction
CN102441966A (en) Mould structure for controlling warping of plastic injection product and product thereof
WO2018174534A1 (en) Device for simultaneously molding/manufacturing shoe components using induction heater
CN101786306B (en) Mould for foot pad of bionic wetness-absorption wall-climbing robot
KR20190081799A (en) Die for manufacturing vehicle parts
CN209971397U (en) Hot runner heat preservation system
US10011062B1 (en) System, method, and apparatus for molding precision parts
CN218019989U (en) Double-sided independent temperature control heating plate
CN110406134B (en) Method for forming carbon fiber reinforced thermoplastic composite material part
CN110451784A (en) The lower heating thermal-field device of model solid glass apparatus for continuous formation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16860051

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16860051

Country of ref document: EP

Kind code of ref document: A1