WO2017069382A1 - Silicone adhesive composition - Google Patents

Silicone adhesive composition Download PDF

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Publication number
WO2017069382A1
WO2017069382A1 PCT/KR2016/007451 KR2016007451W WO2017069382A1 WO 2017069382 A1 WO2017069382 A1 WO 2017069382A1 KR 2016007451 W KR2016007451 W KR 2016007451W WO 2017069382 A1 WO2017069382 A1 WO 2017069382A1
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WIPO (PCT)
Prior art keywords
group
formula
sensitive adhesive
adhesive composition
silicone pressure
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PCT/KR2016/007451
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French (fr)
Korean (ko)
Inventor
최한영
유병묵
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동우 화인켐 주식회사
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Publication of WO2017069382A1 publication Critical patent/WO2017069382A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers

Definitions

  • the present invention relates to a silicone pressure-sensitive adhesive composition, more specifically organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It relates to a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
  • An adhesive is one kind of adhesive, and is often used in the form of an adhesive tape, an adhesive label, etc. which apply
  • These articles are used for various purposes, such as used for labels for identifying articles, for packing bags, or for connecting a plurality of things together.
  • Rubber-based pressure-sensitive adhesives are a general-purpose base material that has been used for a long time, and are used for products such as general-purpose tapes with low cost.
  • the acrylic pressure sensitive adhesive uses polyacrylate as a base, and can be applied to pressure sensitive adhesive products having a higher function than rubber in that chemical properties and the like are superior to rubber.
  • the silicone pressure sensitive adhesive includes high viscosity silicone raw rubber (gum) and silicone resin, and has various excellent characteristics in that the main chain has a plurality of siloxane bonds, and specifically, heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, etc. Can be mentioned.
  • the silicone pressure-sensitive adhesive is used for high-performance tapes for industrial use such as heat-resistant tapes, process masking tapes, and mica tapes having flame retardancy by utilizing the excellent properties as described above. It is used.
  • silicone adhesives are rapidly expanding, and the cause thereof is the expansion of the product market employing a touch panel mounted on a smartphone, a tablet terminal, or the like.
  • the touch panel is bonded to a screen protection film in order to prevent contamination or scratches of the display since it is directly operated by a human finger.
  • Most of the silicone pressure sensitive adhesives used in the pressure-sensitive adhesive layer of the screen protective film are made of the characteristics of wettability and rework property of the excellent adherend of the silicone pressure sensitive adhesive.
  • the base material used for a screen protection film is a plastic film, and many polyester films, such as PET, which have transparency are used.
  • the plastic film is considered to be inferior to adhesiveness with an adhesive compared with a paper base material. This is considered to be because the plastic film has a flat surface and a weak anchoring effect in which the adhesive penetrates into the substrate as compared with paper having a large unevenness.
  • adhesiveness is bad, a problem may arise that an adhesive layer transfers to a to-be-adhered body when peeling after a time passes by adhering to a back surface or adhering to a to-be-adhered body when winding up with a roll.
  • Conventional silicone pressure-sensitive adhesive composition improved the cohesive force by using the MQ resin, thereby improving the cohesive force.
  • the elastic modulus is increased to harden the silicone pressure-sensitive adhesive composition, and thus, when the substrate to which the silicone pressure-sensitive adhesive composition is applied is bent, cracks may occur.
  • an object of the present invention is to provide a silicone pressure-sensitive adhesive composition excellent in adhesive strength by improving the softness and adhesion while low elastic modulus to solve the above problems.
  • an object of this invention is to provide the silicone adhesive composition excellent in peeling resistance.
  • the present invention is an organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It provides a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
  • the present invention provides a silicone pressure-sensitive adhesive prepared from the silicone pressure-sensitive adhesive composition of the present invention.
  • the present invention provides a film coated with the silicone pressure-sensitive adhesive.
  • the silicone pressure-sensitive adhesive composition of the present invention has a low elastic modulus and excellent adhesive force.
  • the silicone pressure-sensitive adhesive composition of the present invention has an effect of excellent adhesion to the substrate.
  • FIG. 1 is a view showing a mechanism in which the silicone pressure-sensitive adhesive composition of the present invention is bonded to a substrate.
  • FIG. 2 is a view showing a folding characteristic evaluation method of a substrate on which a silicone pressure-sensitive adhesive composition is applied.
  • the present invention is an organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It relates to a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
  • Conventional silicone pressure-sensitive adhesive composition has increased the adhesive strength with the substrate by increasing the elastic modulus, and in order to increase the elastic modulus, MQ resin is added to the silicone pressure-sensitive adhesive composition or a technique of improving the crosslinking density is used.
  • the composition when the elastic modulus is high, the composition is hardened, so that a crack occurs when the silicone pressure-sensitive adhesive composition is applied to the substrate and the substrate is bent.
  • the present invention was to provide a silicone adhesive composition having a low elastic modulus and excellent adhesion to solve the above problems, for this purpose, without adding a MQ resin or using a technique for increasing the crosslinking density, while suppressing the increase in the elastic modulus Adhesion enhancers were used to enhance adhesion.
  • the adhesion promoter is a compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule.
  • coated is a board
  • a cycloolefin polymer (CycloOlefinPolymer, COP) having a carboxyl group introduced on the surface by corona treatment or triacetate cellulose (TAC) having a hydroxyl group on the surface may be used as a substrate.
  • CycloOlefinPolymer COP
  • TAC triacetate cellulose
  • the organopolysiloxane including the vinylsilane group serves as a main body of the silicone pressure sensitive adhesive composition, and the organopolysiloxane including the hydrosilyl group serves as a crosslinking agent of the silicone pressure sensitive adhesive composition.
  • addition reaction catalyst Due to the addition reaction catalyst, addition reaction of the organopolysiloxane including the hydrosilyl group and the organopolysiloxane including the vinylsilane group occurs.
  • the vinyl group of the organopolysiloxane including the hydrosilyl group and the adhesion enhancer of the low modulus of elasticity may be cross-linked to form an adhesive layer of the silicone pressure-sensitive adhesive composition.
  • At least one member selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group and an amino group of the adhesion modifier of the low elastic modulus is connected by reacting with a carboxyl group or a hydroxyl group of the substrate (FIG. 1), so that the elastic modulus is low and the adhesion force with the substrate is low.
  • This very excellent silicone adhesive composition can be provided.
  • silicone pressure-sensitive adhesive composition of the present invention will be described in detail for each component.
  • the organopolysiloxane including the vinylsilane group which is one component of the silicone pressure sensitive adhesive composition of the present invention is a component that serves as a main component of the silicone pressure sensitive adhesive composition.
  • the organopolysiloxane including the vinylsilane group may preferably include one or more selected from the group consisting of the following Chemical Formulas 1 to 3.
  • N, m, p, q and r are each independently an integer of 1 to 1000,
  • the ratio of the p unit and m unit is 100: 1 to 10: 1,
  • the ratio of the q unit and the r unit is 100: 1 to 10: 1.
  • the vinylsilane group of the organopolysiloxane including the vinylsilane group may cause an addition reaction with the organopolysiloxane (B) including the hydrosilyl group due to the addition reaction catalyst (D) described later to connect the two compounds.
  • the organopolysiloxane including the vinylsilane group is included in 50 to 90% by weight, preferably 60 to 80% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
  • organopolysiloxane including the vinylsilane group is included in the range of 50 to 90% by weight, low elastic modulus and high adhesion may be expressed.
  • the organopolysiloxane including a hydrosilyl group as one component of the silicone pressure sensitive adhesive composition of the present invention is a component that serves as a crosslinking agent of the silicone pressure sensitive adhesive composition.
  • the type of organopolysiloxane including the hydrosilyl group (Si-H) is not particularly limited, but may preferably include one or more selected from the group consisting of the following Chemical Formulas 4 to 7.
  • X, a, b, c, d, e and f are each independently an integer of 1 to 1000,
  • the ratio of the a unit and b unit is 100: 1 to 10: 1,
  • the ratio of the c unit and d unit is 100: 1 to 10: 1,
  • the ratio of the e unit and f unit is 100: 1 to 10: 1.
  • the ratio of the a unit, the c unit and the e unit in the ratio of the a unit and the b unit, the ratio of the c unit and the d unit and the ratio of the e unit and the f unit is less than 10, the crosslinking degree is excessively increased to increase the elastic modulus. This makes it difficult to secure folding characteristics.
  • the ratio of a unit, c unit, and e unit exceeds 100, the hydrosilyl group has a small farm, and it is difficult to fix the adhesion enhancer, and thus it is difficult to expect the effect of improving adhesion.
  • the organopolysiloxane including the hydrosilyl group may be reacted with the organopolysiloxane (A) including the vinylsilane group described above due to the addition reaction catalyst (D) described below to connect the two compounds.
  • a vinyl group and a vinyl group of a compound (C) containing at least one member selected from the group consisting of an epoxy group, an isocyanate group, a hydroxy group and an amino group in a molecule to be described later, which is a low elastic modulus adhesion promoter, react with the compound. Can be connected.
  • the organopolysiloxane including the hydrosilyl group includes at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule of the organopolysiloxane (A) including a vinylsilane group. It may be linked with compound (C).
  • the organopolysiloxane including the hydrosilyl group is included in 5 to 40% by weight, preferably 15 to 25% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
  • the organopolysiloxane including the hydrosilyl group is included in the range of 5 to 40% by weight, the elastic modulus is low and the adhesive force is easily expressed.
  • the effect of improving the adhesive force is insufficient due to the decrease in the concentration of the hydrosilyl group, when the content exceeds 40% by weight may cause a problem that the release peel force is increased.
  • (C) A compound containing at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule
  • Compounds containing at least one member selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group, and an amino group in one molecule of the silicone adhesive composition of the present invention serve as a low modulus adhesion enhancer of the silicone adhesive composition.
  • the vinyl group of the compound is connected by reaction with an organopolysiloxane including the hydrosilyl group, and at least one selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group and an amino group of the compound reacts with a carboxyl group or a hydroxy group on the substrate surface. Connected.
  • the silicone adhesive composition excellent in the adhesive force can be obtained.
  • the compound containing at least one member selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group in the molecule is not particularly limited, but preferably from the group consisting of the following Chemical Formulas 8 to 14 It includes one or more selected.
  • the compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group in the molecule is included in an amount of 1 to 15% by weight, based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention. Preferably 5 to 10% by weight.
  • the elastic modulus is low, and the adhesive force is easily expressed.
  • the hydrogen bonding or covalent bonds with the substrate lacks the ability to improve the adhesion, if included in more than 15% by weight, the lowering of the adhesion by dissolution of the uncured additive This may be a concern.
  • the addition reaction catalyst which is one component of the silicone pressure-sensitive adhesive composition of the present invention is a catalyst causing the addition reaction of the organopolysiloxane (A) including the vinylsilane group and the organopolysiloxane (B) including the hydrosilyl group.
  • the addition reaction catalyst is a platinum group metal catalyst, and is selected from the group consisting of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), osmium (Os), and ruthenium (Ru) as a central metal. It contains the above, Preferably it contains platinum (Pt).
  • the addition reaction catalyst is included in 0.01 to 1% by weight, preferably 0.05 to 0.5% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
  • the silicone pressure-sensitive adhesive composition of the present invention may further include a solvent, and the silicone pressure-sensitive adhesive composition may be dissolved in the solvent, the solution may be applied to a substrate, heated and dried to form a silicone pressure-sensitive adhesive layer.
  • An aromatic hydrocarbon type an aliphatic hydrocarbon type, a ketone type solvent, etc. can be used for the said solvent, Preferably, toluene is used also in an aromatic hydrocarbon type.
  • the present invention provides a silicone pressure-sensitive adhesive prepared from the silicone pressure-sensitive adhesive composition of the present invention.
  • the silicone pressure-sensitive adhesive composition of the present invention has a low elastic modulus and excellent adhesion, it can be said that the silicone pressure-sensitive adhesive of the present invention has the same characteristics as described above.
  • the silicone pressure-sensitive adhesive of the present invention is applied to a substrate containing a carboxyl group or a hydroxyl group on the surface, and a vinyl group, an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule which is one of the components of the silicone pressure-sensitive adhesive composition of the present invention.
  • Silicone adhesives can be provided.
  • the present invention may provide a film to which the silicone pressure-sensitive adhesive of the present invention is applied, and the film has an effect of not causing cracks when bent.
  • the silicone adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 6 were coated (optically clear adhesive, OCA), and dried at 120 ° C. for 3 minutes to adhere the silicone. A layer was formed.
  • the release film was removed. Using a double-sided pressure-sensitive adhesive on the top of the release film was bonded a saponified TAC (TriAcetyl Cellulose) film fixed on the glass.
  • TAC TriAcetyl Cellulose
  • the bonded sample (TAC / OCA / PI) was left at room temperature for 24 hours, and then peeled at 180 ° using an autograph to measure the peel force, and the results are shown in Table 2 below.
  • Example 1 9N Not Occurred Not Occurred
  • Example 2 13N 150,000 times Not Occurred
  • Example 3 11N Not Occurred Not Occurred
  • Example 4 5N Not Occurred 180,000 times
  • Example 5 5N Not Occurred 150,000 times
  • Example 6 8N 150,000 times 200,000 times
  • Example 7 6N Not Occurred 170,000 times
  • Example 8 4N Not Occurred 130,000 times
  • Example 9 11N Not Occurred Not Occurred
  • Example 10 13N 180,000 times Not Occurred
  • Example 11 9N Not Occurred Not Occurred
  • Example 12 11N Not Occurred Not Occurred Comparative Example 1 1.5N Not Occurred 10,000 times Comparative Example 2 2.7 N 130,000 times 30,000 times Comparative Example 3 2.3N Not Occurred 20,000 times Comparative Example 4 2.9N Not Occurred 40,000 times Comparative Example 5 3.1N Not Occurred 50,000 times Comparative Example 6 1.8N Not O
  • the silicone pressure-sensitive adhesive composition of Comparative Examples 1 to 6 was relatively excellent in the occurrence of cracks, the adhesion was very weak, it was confirmed that the peeling easily occurs.
  • the silicone pressure-sensitive adhesive composition of the present invention is very excellent in adhesion, thereby exhibiting excellent peeling resistance, has a low elastic modulus has the effect of preventing the occurrence of cracking of the substrate.

Abstract

The present invention relates to a silicone adhesive composition containing: an organopolysiloxane comprising a vinyl silane group; an organopolysiloxane comprising a hydrosilyl group; a compound containing, within one molecule, a vinyl group and one or more selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group and an amino group; and an addition reaction catalyst, and the silicone adhesive composition of the present invention has a low modulus of elasticity and excellent adhesive strength.

Description

실리콘 점착제 조성물Silicone adhesive composition
본 발명은 실리콘 점착제 조성물에 관한 것으로, 보다 자세하게는 비닐실란기를 포함하는 오르가노폴리실록산; 히드로실릴기를 포함하는 오르가노폴리실록산; 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물; 및 부가반응 촉매;를 포함하는 실리콘 점착제 조성물에 관한 것이다.The present invention relates to a silicone pressure-sensitive adhesive composition, more specifically organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It relates to a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
점착제란 접착제의 1종이며, 기재에 점착제를 도공하여 경화시킨 점착 테이프나 점착 라벨 등의 형태로 사용되는 경우가 많고, 우리들이 평소 보는 점착제를 사용한 물품의 대표적인 것이다. 이들 물품은, 물건을 식별하기 위한 라벨에 사용되거나 짐의 곤포를 위해서 사용되거나 또는 복수의 것을 서로 연결시키기 위해서 등 다양한 용도로 사용되고 있다.An adhesive is one kind of adhesive, and is often used in the form of an adhesive tape, an adhesive label, etc. which apply | coated an adhesive to the base material, and is a typical thing of the article using the adhesive which we usually see. These articles are used for various purposes, such as used for labels for identifying articles, for packing bags, or for connecting a plurality of things together.
점착제를 구성하기 위한 베이스 재료는 몇 가지 종류가 있고, 고무계, 아크릴계 및 실리콘계 등으로 크게 구별된다. There are several kinds of base materials for constituting the pressure-sensitive adhesive, and largely divided into rubber, acrylic, silicone, and the like.
고무계 점착제는 오래전부터 사용되고 있는 범용적인 베이스 재료이고, 가격이 저렴하고 범용의 테이프 등의 제품에 사용된다. Rubber-based pressure-sensitive adhesives are a general-purpose base material that has been used for a long time, and are used for products such as general-purpose tapes with low cost.
아크릴계 점착제는 폴리아크릴레이트를 베이스로서 이용한 것으로, 화학적 특성 등은 고무계보다도 우수하다는 점에서 고무계보다도 고기능의 점착 제품에도 적용할 수 있다. The acrylic pressure sensitive adhesive uses polyacrylate as a base, and can be applied to pressure sensitive adhesive products having a higher function than rubber in that chemical properties and the like are superior to rubber.
실리콘계 점착제는 고점도의 실리콘 생고무(검)와 실리콘 레진을 포함하고, 주쇄가 다수의 실록산 결합을 갖는다는 점에서 여러 우수한 특징을 갖고 있고, 구체적으로는 내열성, 내한성, 내후성, 내약품성 및 전기 절연성 등을 들 수 있다.The silicone pressure sensitive adhesive includes high viscosity silicone raw rubber (gum) and silicone resin, and has various excellent characteristics in that the main chain has a plurality of siloxane bonds, and specifically, heat resistance, cold resistance, weather resistance, chemical resistance, electrical insulation, etc. Can be mentioned.
상기 실리콘 점착제는 상술한 바와 같은 우수한 특성을 살려 내열 테이프나 공정용의 마스킹 테이프, 난연성을 갖는 마이카 테이프 등 산업용의 고기능의 테이프에 사용되고 있고, 사용 조건이 엄격한 환경하에서도 특성을 발휘할 수 있는 경우에서 사용되고 있다. The silicone pressure-sensitive adhesive is used for high-performance tapes for industrial use such as heat-resistant tapes, process masking tapes, and mica tapes having flame retardancy by utilizing the excellent properties as described above. It is used.
그러나, 최근 들어 실리콘 점착제의 수요는 급확대되고 있고, 그의 요인이 되는 것은 스마트폰이나 태블릿 단말기 등에 탑재되어 있는 터치 패널을 채용하는 제품 시장의 확대이다. 터치 패널은 대부분의 경우, 사람의 손가락으로 직접 조작을 한다는 점에서 디스플레이의 오염이나 흠집 등을 방지하기 위해서 화면 보호 필름을 접합하여 사용한다. 이 화면 보호 필름의 점착층에 사용되고 있는 대부분이 실리콘 점착제이고, 이는 실리콘 점착제의 우수한 피착체에 대한 습윤성이나 리워크성이라는 특징을 이용한 것이다.However, in recent years, the demand of silicone adhesives is rapidly expanding, and the cause thereof is the expansion of the product market employing a touch panel mounted on a smartphone, a tablet terminal, or the like. In most cases, the touch panel is bonded to a screen protection film in order to prevent contamination or scratches of the display since it is directly operated by a human finger. Most of the silicone pressure sensitive adhesives used in the pressure-sensitive adhesive layer of the screen protective film are made of the characteristics of wettability and rework property of the excellent adherend of the silicone pressure sensitive adhesive.
화면 보호 필름에 이용되는 기재는 플라스틱제 필름이고, 투명성을 갖는 PET 등의 폴리에스테르 필름이 많이 사용된다. 그러나, 플라스틱 필름은 종이 기재와 비교하여 점착제와의 밀착성이 나쁘다고 여겨지고 있다. 이는 플라스틱 필름 쪽이 표면이 평탄하고, 요철이 큰 종이와 비교하여 점착제가 기재에 파고 들어가는 앵커 효과가 약하기 때문이라고 여겨지고 있다. 밀착성이 나쁘면, 롤로 권취하였을 때에 뒷면에 묻거나 피착체에 부착하여 시간이 경과하고 나서 박리할 때에 피착체에 점착층이 이행하는 등의 문제가 발생하는 경우가 있다.The base material used for a screen protection film is a plastic film, and many polyester films, such as PET, which have transparency are used. However, the plastic film is considered to be inferior to adhesiveness with an adhesive compared with a paper base material. This is considered to be because the plastic film has a flat surface and a weak anchoring effect in which the adhesive penetrates into the substrate as compared with paper having a large unevenness. When adhesiveness is bad, a problem may arise that an adhesive layer transfers to a to-be-adhered body when peeling after a time passes by adhering to a back surface or adhering to a to-be-adhered body when winding up with a roll.
이전부터 이 밀착성의 개선을 위해서 여러 대책이 취해지고 있고, 밀착성이 좋은 기재를 사용하거나 기재를 코로나 처리하는 등의 방법이 있다. 또한, 프라이머 처리도 널리 행해지고 있는 방법이고, 실리콘 점착제용 프라이머 조성물에 대해서도 개발이 진행되고 있다. 프라이머 처리는 매우 효과적이지만, 코팅의 공정이 1개 증가하는 것이 최대의 결점이고, 비용이나 생산성이 문제가 된다. 유효한 대책으로서는, 실리콘 점착제에 밀착성이 향상되는 성분을 첨가하고, 1회의 코팅으로 밀착성을 확보하는 방법이 고려된다. 그러한 첨가제도 존재하지만, 한층 더 밀착성의 개선이 요구되고 있다. 또한, 일본 특허 제3324166호에서는 유기 수지에 선택적으로 접착하는 첨가제에 대하여 기재가 있지만, 대상은 실리콘 고무 조성물이며, 실리콘 점착제까지는 언급하고 있지 않다.In order to improve this adhesiveness, various measures have been taken before, and there exist methods, such as using a base material with good adhesiveness, or corona-treating a base material. Moreover, the primer process is also widely performed, and development is progressing also about the primer composition for silicone pressure sensitive adhesives. Although primer treatment is very effective, one increase in the number of coating processes is a major drawback, and cost and productivity are a problem. As an effective countermeasure, the method of adding the component which improves adhesiveness to a silicone adhesive and ensuring adhesiveness by one coating is considered. Although such additives exist, the improvement of adhesiveness is calculated | required further. In addition, Japanese Patent No. 3324166 describes an additive that selectively adheres to an organic resin, but the object is a silicone rubber composition, and no silicone adhesive is mentioned.
종래의 실리콘 점착제 조성물은 MQ 레진을 사용하여 응집력을 향상시킴으로써, 점착력을 향상시켰다. 그러나 응집력이 향상되면 탄성률이 높아져 실리콘 점착제 조성물이 단단해져서 상기 실리콘 점착제 조성물이 도포된 기판을 구부리면 크랙(crack)이 발생하는 등의 문제가 있다. Conventional silicone pressure-sensitive adhesive composition improved the cohesive force by using the MQ resin, thereby improving the cohesive force. However, when the cohesive force is improved, the elastic modulus is increased to harden the silicone pressure-sensitive adhesive composition, and thus, when the substrate to which the silicone pressure-sensitive adhesive composition is applied is bent, cracks may occur.
따라서, 본 발명에서는 상기의 문제점을 해결하고자 탄성률이 낮아 부드러우면서도 밀착력을 향상시킴으로써, 점착력이 우수한 실리콘 점착제 조성물을 제공하는 것을 목적으로 한다.Therefore, an object of the present invention is to provide a silicone pressure-sensitive adhesive composition excellent in adhesive strength by improving the softness and adhesion while low elastic modulus to solve the above problems.
또한, 본 발명은 내박리성이 우수한 실리콘 점착제 조성물을 제공하는 것을 목적으로 한다.Moreover, an object of this invention is to provide the silicone adhesive composition excellent in peeling resistance.
상기 목적을 달성하기 위하여,In order to achieve the above object,
본 발명은 비닐실란기를 포함하는 오르가노폴리실록산; 히드로실릴기를 포함하는 오르가노폴리실록산; 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물; 및 부가반응 촉매;를 포함하는 실리콘 점착제 조성물을 제공한다.The present invention is an organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It provides a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
또한, 본 발명은 상기 본 발명의 실리콘 점착제 조성물로 제조된 실리콘 점착제를 제공한다.In addition, the present invention provides a silicone pressure-sensitive adhesive prepared from the silicone pressure-sensitive adhesive composition of the present invention.
또한, 본 발명은 상기 실리콘 점착제가 도포된 필름을 제공한다.In addition, the present invention provides a film coated with the silicone pressure-sensitive adhesive.
본 발명의 실리콘 점착제 조성물은 탄성률은 낮고, 점착력이 우수한 특성을 지니고 있다.The silicone pressure-sensitive adhesive composition of the present invention has a low elastic modulus and excellent adhesive force.
따라서, 본 발명의 실리콘 점착제 조성물을 기판에 도포하고, 상기 기판을 구부렸을때 크랙(crack)이 발생하지 않으며, 내박리성이 우수한 효과를 지니고 있다.Therefore, when the silicone pressure-sensitive adhesive composition of the present invention is applied to a substrate and the substrate is bent, cracks do not occur, and the peeling resistance is excellent.
또한, 본 발명의 실리콘 점착제 조성물은 기판과의 밀착성이 우수한 효과를 지니고 있다.In addition, the silicone pressure-sensitive adhesive composition of the present invention has an effect of excellent adhesion to the substrate.
도 1은 본 발명의 실리콘 점착제 조성물이 기판과 결합하는 메커니즘을 나타낸 도면이다.1 is a view showing a mechanism in which the silicone pressure-sensitive adhesive composition of the present invention is bonded to a substrate.
도 2는 실리콘 점착제 조성물이 도포된 기판의 폴딩(folding) 특성 평가 방법을 나타낸 도면이다.2 is a view showing a folding characteristic evaluation method of a substrate on which a silicone pressure-sensitive adhesive composition is applied.
이하, 본 발명을 보다 자세히 설명한다.Hereinafter, the present invention will be described in more detail.
본 발명은 비닐실란기를 포함하는 오르가노폴리실록산; 히드로실릴기를 포함하는 오르가노폴리실록산; 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물; 및 부가반응 촉매;를 포함하는 실리콘 점착제 조성물에 관한 것이다.The present invention is an organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; It relates to a silicone pressure-sensitive adhesive composition comprising; and an addition reaction catalyst.
탄성률이 증가하면 응집력이 높아져 그에 따라 점착력이 상승한다.Increasing the modulus of elasticity increases cohesion, thereby increasing the cohesion.
종래의 실리콘 점착제 조성물은 탄성률을 높임으로써 기판과의 점착력을 상승시켰으며, 탄성률을 높이기 위하여 실리콘 점착제 조성물로 MQ 레진을 첨가하거나, 가교밀도를 향상시키는 기술을 사용하였다.Conventional silicone pressure-sensitive adhesive composition has increased the adhesive strength with the substrate by increasing the elastic modulus, and in order to increase the elastic modulus, MQ resin is added to the silicone pressure-sensitive adhesive composition or a technique of improving the crosslinking density is used.
그러나 탄성률이 높으면 조성물이 단단해지므로, 실리콘 점착제 조성물을 기판에 도포하고 기판을 구부렸을 때 크랙(crack)이 발생하는 문제가 생긴다.However, when the elastic modulus is high, the composition is hardened, so that a crack occurs when the silicone pressure-sensitive adhesive composition is applied to the substrate and the substrate is bent.
따라서, 본 발명에서는 상기의 문제를 해결하고자 탄성률은 낮으면서 밀착력은 우수한 실리콘 점착제 조성물을 제공하고자 하였으며, 이를 위하여 MQ 레진을 첨가하거나, 가교밀도를 높이는 기술을 사용하지 않고, 탄성률의 상승을 억제하면서 점착력을 증진시키기 위해서 밀착력 증강제를 사용하였다.Therefore, the present invention was to provide a silicone adhesive composition having a low elastic modulus and excellent adhesion to solve the above problems, for this purpose, without adding a MQ resin or using a technique for increasing the crosslinking density, while suppressing the increase in the elastic modulus Adhesion enhancers were used to enhance adhesion.
본 발명에서 상기 밀착력 증강제는 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물이 사용되었다.In the present invention, the adhesion promoter is a compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule.
본 발명의 실리콘 점착제 조성물이 도포되는 기판은 표면에 카르복실기 또는 히드록시기를 포함하는 기판이다.The board | substrate to which the silicone adhesive composition of this invention is apply | coated is a board | substrate containing a carboxyl group or a hydroxyl group on the surface.
바람직하게는 코로나 처리하여 표면에 카르복실기가 도입된 시클로올레핀폴리머(CycloOlefinPolymer, COP) 또는 검화처리하여 표면에 히드록시기가 있는 트리아세테이트 셀룰로오스(TriAcetylCellulose, TAC)가 기판으로 사용될 수 있다.Preferably, a cycloolefin polymer (CycloOlefinPolymer, COP) having a carboxyl group introduced on the surface by corona treatment or triacetate cellulose (TAC) having a hydroxyl group on the surface may be used as a substrate.
상기 비닐실란기를 포함하는 오르가노폴리실록산은 실리콘 점착제 조성물의 주재 역할을 하며, 상기 히드로실릴기를 포함하는 오르가노폴리실록산은 실리콘 점착제 조성물의 가교제 역할을 한다.The organopolysiloxane including the vinylsilane group serves as a main body of the silicone pressure sensitive adhesive composition, and the organopolysiloxane including the hydrosilyl group serves as a crosslinking agent of the silicone pressure sensitive adhesive composition.
부가반응 촉매로 인하여 상기 히드로실릴기를 포함하는 오르가노폴리실록산과 상기 비닐실란기를 포함하는 오르가노폴리실록산의 비닐기가 부가반응이 일어난다.Due to the addition reaction catalyst, addition reaction of the organopolysiloxane including the hydrosilyl group and the organopolysiloxane including the vinylsilane group occurs.
또한, 상기 히드로실릴기를 포함하는 오르가노폴리실록산과 상기 저탄성률의 밀착력 증강제의 비닐기가 가교 반응이 일어나 실리콘 점착제 조성물의 점착층을 구성할 수 있다.In addition, the vinyl group of the organopolysiloxane including the hydrosilyl group and the adhesion enhancer of the low modulus of elasticity may be cross-linked to form an adhesive layer of the silicone pressure-sensitive adhesive composition.
또한, 상기 저탄성률의 밀착력 증강제의 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상은 기판의 카르복실기 또는 히드록시기와 반응하여 연결됨으로써(도 1), 탄성률이 낮고, 기판과의 밀착력이 매우 우수한 실리콘 점착제 조성물을 제공할 수 있다.In addition, at least one member selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group and an amino group of the adhesion modifier of the low elastic modulus is connected by reacting with a carboxyl group or a hydroxyl group of the substrate (FIG. 1), so that the elastic modulus is low and the adhesion force with the substrate is low. This very excellent silicone adhesive composition can be provided.
이하, 본 발명의 실리콘 점착제 조성물을 각 성분 별로 자세히 설명한다.Hereinafter, the silicone pressure-sensitive adhesive composition of the present invention will be described in detail for each component.
(A)비닐실란기를 포함하는 오르가노폴리실록산(A) organopolysiloxane containing vinylsilane group
본 발명의 실리콘 점착제 조성물의 한 성분인 비닐실란기를 포함하는 오르가노폴리실록산은 실리콘 점착제 조성물의 주재 역할을 하는 성분이다.The organopolysiloxane including the vinylsilane group which is one component of the silicone pressure sensitive adhesive composition of the present invention is a component that serves as a main component of the silicone pressure sensitive adhesive composition.
비닐실란기(CH2=CH-Si)는 오르가노폴리실록산의 말단 또는 분자 내에 포함될 수 있으며, 비닐실란기의 위치 및 비닐실란기를 포함하는 오르가노폴리실록산의 종류는 특별히 한정되는 것은 아니다.The vinylsilane group (CH 2 = CH-Si) may be included in the terminal or molecule of the organopolysiloxane, and the position of the vinylsilane group and the type of organopolysiloxane including the vinylsilane group are not particularly limited.
그러나 상기 비닐실란기를 포함하는 오르가노폴리실록산은 바람직하게는 하기 화학식 1 내지 3으로 이루어진 군으로부터 선택되는 1종 이상을 포함할 수 있다.However, the organopolysiloxane including the vinylsilane group may preferably include one or more selected from the group consisting of the following Chemical Formulas 1 to 3.
[화학식 1][Formula 1]
Figure PCTKR2016007451-appb-I000001
Figure PCTKR2016007451-appb-I000001
[화학식 2][Formula 2]
Figure PCTKR2016007451-appb-I000002
Figure PCTKR2016007451-appb-I000002
[화학식 3][Formula 3]
Figure PCTKR2016007451-appb-I000003
Figure PCTKR2016007451-appb-I000003
상기 n, m, p, q 및 r은 각각 독립적으로 1 내지 1000의 정수이고,N, m, p, q and r are each independently an integer of 1 to 1000,
상기 p단위 및 m단위의 비율은 100:1 내지 10:1 이고,The ratio of the p unit and m unit is 100: 1 to 10: 1,
상기 q단위 및 r단위의 비율은 100:1 내지 10:1 이다.The ratio of the q unit and the r unit is 100: 1 to 10: 1.
상기 p단위 및 m단위의 비율에서 m단위의 비율이 상기 범위를 초과하면, 폴리머의 유리전이온도(Tg)가 증가하여 점착층의 탄성률이 지나치게 높아지게 되어 기판의 크랙 억제성이 부족해지는 문제가 발생한다.When the ratio of m unit in the ratio of p unit and m unit exceeds the above range, the glass transition temperature (Tg) of the polymer increases, the elastic modulus of the adhesive layer becomes excessively high, resulting in a problem of insufficient crack suppression of the substrate. do.
또한, 상기 q단위 및 r단위의 비율에서 r단위의 비율이 상기 범위를 초과하면 가교도가 증가하여 점착층의 탄성률이 지나치게 높아지게 되어 기판의 크랙 억제성이 부족해지는 문제가 발생한다.In addition, when the ratio of the r unit in the ratio of the q unit and the r unit exceeds the above range, the degree of crosslinking increases, the elastic modulus of the pressure-sensitive adhesive layer becomes too high, resulting in a problem that the crack suppressibility of the substrate is insufficient.
상기 비닐실란기를 포함하는 오르가노폴리실록산의 비닐실란기는 후술하는 부가반응 촉매(D)로 인하여 히드로실릴기를 포함하는 오르가노폴리실록산(B)과 부가반응이 일어나 상기 두 화합물이 연결될 수 있다.The vinylsilane group of the organopolysiloxane including the vinylsilane group may cause an addition reaction with the organopolysiloxane (B) including the hydrosilyl group due to the addition reaction catalyst (D) described later to connect the two compounds.
또한, 상기 비닐실란기를 포함하는 오르가노폴리실록산은 본 발명의 실리콘 점착제 조성물 총 중량에 대하여 50 내지 90 중량%로 포함되며, 바람직하게는 60 내지 80 중량%로 포함된다.In addition, the organopolysiloxane including the vinylsilane group is included in 50 to 90% by weight, preferably 60 to 80% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
상기 비닐실란기를 포함하는 오르가노폴리실록산이 50 내지 90 중량%의 범위로 포함되면 저탄성률과 고점착력을 발현할 수 있다.When the organopolysiloxane including the vinylsilane group is included in the range of 50 to 90% by weight, low elastic modulus and high adhesion may be expressed.
(B)히드로실릴기를 포함하는 오르가노폴리실록산(B) organopolysiloxane containing a hydrosilyl group
본 발명의 실리콘 점착제 조성물의 한 성분인 히드로실릴기를 포함하는 오르가노폴리실록산은 실리콘 점착제 조성물의 가교제 역할을 하는 성분이다.The organopolysiloxane including a hydrosilyl group as one component of the silicone pressure sensitive adhesive composition of the present invention is a component that serves as a crosslinking agent of the silicone pressure sensitive adhesive composition.
본 발명에서 상기 히드로실릴기(Si-H)를 포함하는 오르가노폴리실록산의 종류를 특별히 한정하지는 않으나, 바람직하게는 하기 화학식 4 내지 7로 이루어진 군으로부터 선택되는 1종 이상을 포함할 수 있다.In the present invention, the type of organopolysiloxane including the hydrosilyl group (Si-H) is not particularly limited, but may preferably include one or more selected from the group consisting of the following Chemical Formulas 4 to 7.
[화학식 4][Formula 4]
Figure PCTKR2016007451-appb-I000004
Figure PCTKR2016007451-appb-I000004
[화학식 5][Formula 5]
Figure PCTKR2016007451-appb-I000005
Figure PCTKR2016007451-appb-I000005
[화학식 6][Formula 6]
[화학식 7][Formula 7]
Figure PCTKR2016007451-appb-I000007
Figure PCTKR2016007451-appb-I000007
상기 x, a, b, c, d, e 및 f는 각각 독립적으로 1 내지 1000의 정수이고,X, a, b, c, d, e and f are each independently an integer of 1 to 1000,
상기 a단위 및 b단위의 비율은 100:1 내지 10:1 이고,The ratio of the a unit and b unit is 100: 1 to 10: 1,
상기 c단위 및 d단위의 비율은 100:1 내지 10:1 이고,The ratio of the c unit and d unit is 100: 1 to 10: 1,
상기 e단위 및 f단위의 비율은 100:1 내지 10:1 이다.The ratio of the e unit and f unit is 100: 1 to 10: 1.
상기 a단위 및 b단위의 비율, 상기 c단위 및 d단위의 비율 및 상기 e단위 및 f단위의 비율에서 a단위, c단위 및 e단위의 비율이 10 이만이면, 가교도가 지나치게 증가하여 탄성률이 상승하여 폴딩특성 확보가 어려워지는 문제가 발생한다. 또한, a단위, c단위 및 e단위의 비율이 100을 초과하면, 히드로실릴기의 농가가 작아서 접착증강제의 고정화가 곤란하여 점착력 향상 효과를 기대하기 어렵다.If the ratio of the a unit, the c unit and the e unit in the ratio of the a unit and the b unit, the ratio of the c unit and the d unit and the ratio of the e unit and the f unit is less than 10, the crosslinking degree is excessively increased to increase the elastic modulus. This makes it difficult to secure folding characteristics. In addition, when the ratio of a unit, c unit, and e unit exceeds 100, the hydrosilyl group has a small farm, and it is difficult to fix the adhesion enhancer, and thus it is difficult to expect the effect of improving adhesion.
상기 히드로실릴기를 포함하는 오르가노폴리실록산은 후술하는 부가반응 촉매(D)로 인하여 상술한 비닐실란기를 포함하는 오르가노폴리실록산(A)과 부가반응이 일어나 상기 두 화합물이 연결될 수 있다.The organopolysiloxane including the hydrosilyl group may be reacted with the organopolysiloxane (A) including the vinylsilane group described above due to the addition reaction catalyst (D) described below to connect the two compounds.
또한, 저탄성률의 밀착력 증강제인 후술하는 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물(C)의 비닐기와 반응이 일어나 상기 화합물과 연결될 수 있다.In addition, a vinyl group and a vinyl group of a compound (C) containing at least one member selected from the group consisting of an epoxy group, an isocyanate group, a hydroxy group and an amino group in a molecule to be described later, which is a low elastic modulus adhesion promoter, react with the compound. Can be connected.
즉, 상기 히드로실릴기를 포함하는 오르가노폴리실록산은 비닐실란기를 포함하는 오르가노폴리실록산(A) 및 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물(C)과 연결될 수 있다.That is, the organopolysiloxane including the hydrosilyl group includes at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule of the organopolysiloxane (A) including a vinylsilane group. It may be linked with compound (C).
또한, 상기 히드로실릴기를 포함하는 오르가노폴리실록산은 본 발명의 실리콘 점착제 조성물 총 중량에 대하여 5 내지 40 중량%로 포함되며, 바람직하게는 15 내지 25 중량%로 포함된다.In addition, the organopolysiloxane including the hydrosilyl group is included in 5 to 40% by weight, preferably 15 to 25% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
상기 히드로실릴기를 포함하는 오르가노폴리실록산이 5 내지 40 중량%의 범위로 포함되면 탄성률이 낮고, 점착력이 높은 특성 발현이 용이하다. When the organopolysiloxane including the hydrosilyl group is included in the range of 5 to 40% by weight, the elastic modulus is low and the adhesive force is easily expressed.
또한, 5 중량% 미만으로 포함되면 히드로실릴기의 농도 저하로 인하여 점착력 향상 효과가 부족해지고, 40 중량%를 초과하면 이형 박리력이 상승되는 문제가 발생할 수 있다.In addition, when included in less than 5% by weight, the effect of improving the adhesive force is insufficient due to the decrease in the concentration of the hydrosilyl group, when the content exceeds 40% by weight may cause a problem that the release peel force is increased.
(C)한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물(C) A compound containing at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule
본 발명의 실리콘 점착제 조성물의 한 성분인 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물은 실리콘 점착제 조성물의 저탄성률 밀착력 증강제 역할을 하는 성분이다.Compounds containing at least one member selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group, and an amino group in one molecule of the silicone adhesive composition of the present invention serve as a low modulus adhesion enhancer of the silicone adhesive composition. Ingredient.
즉, 상기 화합물을 사용함으로써, 탄성률은 낮고, 밀착력은 우수한 실리콘 점착제 조성물을 제공할 수 있다.That is, by using the compound, it is possible to provide a silicone pressure-sensitive adhesive composition having a low elastic modulus and excellent adhesion.
상기 화합물의 비닐기는 상기 히드로실릴기를 포함하는 오르가노폴리실록산과 반응하여 연결되며, 상기 화합물의 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상은 기판 표면의 카르복실기 또는 히드록시기와 반응하여 연결된다.The vinyl group of the compound is connected by reaction with an organopolysiloxane including the hydrosilyl group, and at least one selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group and an amino group of the compound reacts with a carboxyl group or a hydroxy group on the substrate surface. Connected.
기판의 히드록시기 또는 카르복실기와 연결됨으로써, 밀착력이 우수한 실리콘 점착제 조성물을 얻을 수 있다.By connecting with the hydroxyl group or carboxyl group of a board | substrate, the silicone adhesive composition excellent in the adhesive force can be obtained.
상기 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물은 그 종류를 특별히 한정하지는 않으나, 바람직하게는 하기 화학식 8 내지 14로 이루어진 군으로부터 선택되는 1종 이상을 포함한다.The compound containing at least one member selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group in the molecule is not particularly limited, but preferably from the group consisting of the following Chemical Formulas 8 to 14 It includes one or more selected.
[화학식 8][Formula 8]
Figure PCTKR2016007451-appb-I000008
Figure PCTKR2016007451-appb-I000008
[화학식 9][Formula 9]
Figure PCTKR2016007451-appb-I000009
Figure PCTKR2016007451-appb-I000009
[화학식 10][Formula 10]
Figure PCTKR2016007451-appb-I000010
Figure PCTKR2016007451-appb-I000010
[화학식 11][Formula 11]
Figure PCTKR2016007451-appb-I000011
Figure PCTKR2016007451-appb-I000011
[화학식 12][Formula 12]
Figure PCTKR2016007451-appb-I000012
Figure PCTKR2016007451-appb-I000012
[화학식 13][Formula 13]
Figure PCTKR2016007451-appb-I000013
Figure PCTKR2016007451-appb-I000013
[화학식 14][Formula 14]
Figure PCTKR2016007451-appb-I000014
Figure PCTKR2016007451-appb-I000014
상기 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물은 본 발명의 실리콘 점착제 조성물 총 중량에 대하여 1 내지 15 중량%로 포함되며, 바람직하게는 5 내지 10 중량%로 포함된다.The compound containing at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group and an amino group in the molecule is included in an amount of 1 to 15% by weight, based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention. Preferably 5 to 10% by weight.
상기 화합물이 1 내지 15 중량%의 범위로 포함되면 탄성률이 낮고, 점착력이 높은 특성발현이 용이하다. When the compound is included in the range of 1 to 15% by weight, the elastic modulus is low, and the adhesive force is easily expressed.
상기 화합물이 1 중량% 미만으로 포함되면, 기판과의 수소결합 또는 공유결합 능력이 부족하여 점착력 향상이 부족할 수 있고, 15 중량%를 초과하여 포함되면, 미경화 첨가제의 용출에 의해 점착력의 저하가 우려될 수 있다.If the compound is contained in less than 1% by weight, the hydrogen bonding or covalent bonds with the substrate lacks the ability to improve the adhesion, if included in more than 15% by weight, the lowering of the adhesion by dissolution of the uncured additive This may be a concern.
(D)부가반응 촉매(D) addition reaction catalyst
본 발명의 실리콘 점착제 조성물의 한 성분인 부가반응 촉매는 전술한 비닐실란기를 포함하는 오르가노폴리실록산(A) 및 히드로실릴기를 포함하는 오르가노폴리실록산(B)의 부가반응을 일으키는 촉매이다.The addition reaction catalyst which is one component of the silicone pressure-sensitive adhesive composition of the present invention is a catalyst causing the addition reaction of the organopolysiloxane (A) including the vinylsilane group and the organopolysiloxane (B) including the hydrosilyl group.
상기 부가반응 촉매는 백금족 금속계 촉매로, 중심 금속으로 백금(Pt), 팔라듐(Pd), 이리듐(Ir), 로듐(Rh), 오스뮴(Os) 및 루테늄(Ru)으로 이루어진 군으로부터 선택되는 1종 이상을 포함하며, 바람직하게는 백금(Pt)를 포함한다.The addition reaction catalyst is a platinum group metal catalyst, and is selected from the group consisting of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), osmium (Os), and ruthenium (Ru) as a central metal. It contains the above, Preferably it contains platinum (Pt).
상기 부가반응 촉매는 본 발명의 실리콘 점착제 조성물 총 중량에 대하여 0.01 내지 1 중량%로 포함되며, 바람직하게는 0.05 내지 0.5 중량%로 포함된다.The addition reaction catalyst is included in 0.01 to 1% by weight, preferably 0.05 to 0.5% by weight based on the total weight of the silicone pressure-sensitive adhesive composition of the present invention.
상기 화합물이 0.01 중량% 미만으로 포함되면, 점착층의 경화도가 저하되거나, 경화온도를 지나치게 높여야 하는 우려가 있고, 1 중량%를 초과하여 포함되면, 조성물의 경시변화가 커서 코팅 공정 중에 겔(gel)화될 우려가 있다.When the compound is contained in less than 0.01% by weight, there is a fear that the degree of curing of the adhesive layer is lowered, or the curing temperature is excessively increased, and when the compound is included in an amount of more than 1% by weight, the time-dependent change of the composition is large, resulting in a gel (gel) during the coating process. There is a risk of becoming).
또한, 본 발명의 실리콘 점착제 조성물은 추가로 용제를 포함할 수 있으며, 상기 용제에 실리콘 점착제 조성물을 용해하고, 그 용액을 기판에 도포하고 가열 및 건조하여 실리콘 점착층을 형성할 수 있다.In addition, the silicone pressure-sensitive adhesive composition of the present invention may further include a solvent, and the silicone pressure-sensitive adhesive composition may be dissolved in the solvent, the solution may be applied to a substrate, heated and dried to form a silicone pressure-sensitive adhesive layer.
상기 용제는 방향족 탄화수소계, 지방족 탄화수소계 및 케톤계 용제 등이 사용 가능하며, 바람직하게는 방향족 탄화수소계 중에서도 톨루엔을 사용한다.An aromatic hydrocarbon type, an aliphatic hydrocarbon type, a ketone type solvent, etc. can be used for the said solvent, Preferably, toluene is used also in an aromatic hydrocarbon type.
또한, 본 발명은 상기 본 발명의 실리콘 점착제 조성물로 제조된 실리콘 점착제를 제공한다.In addition, the present invention provides a silicone pressure-sensitive adhesive prepared from the silicone pressure-sensitive adhesive composition of the present invention.
본 발명의 실리콘 점착제 조성물은 탄성률이 낮으면서 점착력이 우수하므로, 상기 본 발명의 실리콘 점착제도 상기와 같은 특성을 지니고 있다고 할 수 있다.Since the silicone pressure-sensitive adhesive composition of the present invention has a low elastic modulus and excellent adhesion, it can be said that the silicone pressure-sensitive adhesive of the present invention has the same characteristics as described above.
또한, 상기 본 발명의 실리콘 점착제는 표면에 카르복실기 또는 히드록시기를 포함하는 기판에 도포되며, 상기 본 발명의 실리콘 점착제 조성물의 성분 중 하나인 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물의 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상이 기판 표면의 카르복실기 또는 히드록시기와 반응하여 기판과 밀착력이 매우 우수하여 점착력이 우수한 실리콘 점착제를 제공할 수 있다.In addition, the silicone pressure-sensitive adhesive of the present invention is applied to a substrate containing a carboxyl group or a hydroxyl group on the surface, and a vinyl group, an epoxy group, an isocyanate group, a hydroxyl group and an amino group in one molecule which is one of the components of the silicone pressure-sensitive adhesive composition of the present invention. At least one selected from the group consisting of an epoxy group, an isocyanate group, a hydroxyl group, and an amino group of a compound including at least one member selected from the group consisting of reacts with a carboxyl group or a hydroxyl group on the surface of the substrate and has excellent adhesion to the substrate, thereby providing excellent adhesion. Silicone adhesives can be provided.
또한, 본 발명은 상기 본 발명의 실리콘 점착제가 도포된 필름을 제공할 수 있으며, 상기 필름은 구부렸을 때, 크랙이 발생하지 않는 효과를 지니고 있다.In addition, the present invention may provide a film to which the silicone pressure-sensitive adhesive of the present invention is applied, and the film has an effect of not causing cracks when bent.
이하, 본 발명을 구체적으로 설명하기 위해 실시예를 들어 상세하게 설명하기로 한다. 그러나, 본 발명에 따른 실시예는 여러 가지 다른 형태로 변형될수 있으며, 본 발명의 범위가 아래에서 상술하는 실시예에 한정되는 것으로 해석되어서는 안 된다. 본 발명의 실시예는 당업계에서 평균적인 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위해서 제공되는 것이다.Hereinafter, the present invention will be described in detail with reference to Examples. However, embodiments according to the present invention can be modified in many different forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.
<실리콘 점착제 조성물 제조><Silicone Adhesive Composition Preparation>
실시예Example 1 내지 12 및  1 to 12 and 비교예Comparative example 1 내지 6. 1 to 6.
하기 표 1의 조성으로 1시간 동안 교반하여, 실시예 1 내지 12 및 비교예 1 내지 6의 실리콘 점착제 조성물을 제조하였다.By stirring for 1 hour to the composition of Table 1, to prepare a silicone pressure-sensitive adhesive composition of Examples 1 to 12 and Comparative Examples 1 to 6.
(단위 : g)(Unit: g)
구분division 비닐실란기를 포함하는 오르가노폴리실록산Organopolysiloxanes containing vinylsilane groups 히드로실릴기를 포함하는 오르가노폴리실록산Organopolysiloxanes containing hydrosilyl groups 밀착력 증강제Adhesion Enhancer 부가반응 촉매Addition reaction catalyst 톨루엔toluene 실라놀기를 포함하는 오르가노폴리실록산Organopolysiloxanes containing silanol groups
종류Kinds 함량content 종류Kinds 함량content 종류Kinds 함량content 함량content 함량content 종류Kinds 함량content
실시예 1Example 1 화학식 1Formula 1 100100 화학식 4Formula 4 3030 화학식 8Formula 8 1010 0.50.5 200200 -- --
실시예 2Example 2 화학식 2Formula 2 100100 화학식 4Formula 4 3030 화학식 8Formula 8 1010 0.50.5 200200 -- --
실시예 3Example 3 화학식 3Formula 3 100100 화학식 4Formula 4 3030 화학식 8Formula 8 1010 0.50.5 200200 -- --
실시예 4Example 4 화학식 1Formula 1 100100 화학식 4Formula 4 3030 화학식 10Formula 10 1010 0.50.5 200200 -- --
실시예 5Example 5 화학식 1Formula 1 100100 화학식 4Formula 4 3030 화학식 11Formula 11 1010 0.50.5 200200 -- --
실시예 6Example 6 화학식 2Formula 2 100100 화학식 4Formula 4 3030 화학식 11Formula 11 1010 0.50.5 200200 -- --
실시예 7Example 7 화학식 3Formula 3 100100 화학식 4Formula 4 3030 화학식 11Formula 11 1010 0.50.5 200200 -- --
실시예 8Example 8 화학식 1Formula 1 100100 화학식 4Formula 4 3030 화학식 13Formula 13 1010 0.50.5 200200 -- --
실시예 9Example 9 화학식 1Formula 1 100100 화학식 5Formula 5 3030 화학식 8Formula 8 1010 0.50.5 200200 -- --
실시예 10Example 10 화학식 1Formula 1 100100 화학식 7Formula 7 3030 화학식 8Formula 8 1010 0.50.5 200200 -- --
실시예 11Example 11 화학식 1Formula 1 100100 화학식 5Formula 5 3030 화학식 11Formula 11 1010 0.50.5 200200 -- --
실시예 12Example 12 화학식 1Formula 1 100100 화학식 7Formula 7 3030 화학식 11Formula 11 1010 0.50.5 200200 -- --
비교예 1Comparative Example 1 화학식 1Formula 1 100100 화학식 4Formula 4 3030 -- -- 0.50.5 200200 -- --
비교예2Comparative Example 2 화학식 2Formula 2 100100 화학식 4Formula 4 3030 -- -- 0.50.5 200200 -- --
비교예 3Comparative Example 3 화학식 3Formula 3 100100 화학식 4Formula 4 3030 -- -- 0.50.5 200200 -- --
비교예4Comparative Example 4 화학식 1Formula 1 100100 화학식 5Formula 5 3030 -- -- 0.50.5 200200 -- --
비교예5Comparative Example 5 화학식 1Formula 1 100100 화학식 7Formula 7 3030 -- -- 0.50.5 200200 -- --
비교예 6Comparative Example 6 -- -- -- -- 화학식 8Formula 8 1010 -- 200200 화학식 15Formula 15 130130
[화학식 1] (gelist사제, DMS-V05)Formula 1 (manufactured by gelist, DMS-V05)
Figure PCTKR2016007451-appb-I000015
Figure PCTKR2016007451-appb-I000015
[화학식 2] (gelist사제, PDV-0331)Formula 2 (manufactured by gelist, PDV-0331)
Figure PCTKR2016007451-appb-I000016
Figure PCTKR2016007451-appb-I000016
[화학식 3] (gelist사제, VDT-131)Formula 3 (manufactured by gelist, VDT-131)
Figure PCTKR2016007451-appb-I000017
Figure PCTKR2016007451-appb-I000017
히드로실릴기를 포함하는 오르가노폴리실록산 :Organopolysiloxanes containing hydrosilyl groups:
[화학식 4] (gelist사제, HMS-H11)[Formula 4] (manufactured by gelist, HMS-H11)
Figure PCTKR2016007451-appb-I000018
Figure PCTKR2016007451-appb-I000018
[화학식 5] (gelist사제, HMS-031)[Formula 5] (manufactured by gelist, HMS-031)
Figure PCTKR2016007451-appb-I000019
Figure PCTKR2016007451-appb-I000019
[화학식 7] (gelist사제 HDP-111) [Formula 7] (HDP-111 manufactured by gelist)
Figure PCTKR2016007451-appb-I000020
Figure PCTKR2016007451-appb-I000020
밀착력 증강제 :Adhesion Enhancer:
[화학식 8][Formula 8]
Figure PCTKR2016007451-appb-I000021
Figure PCTKR2016007451-appb-I000021
[화학식 10][Formula 10]
Figure PCTKR2016007451-appb-I000022
Figure PCTKR2016007451-appb-I000022
[화학식 11][Formula 11]
Figure PCTKR2016007451-appb-I000023
Figure PCTKR2016007451-appb-I000023
[화학식 13][Formula 13]
Figure PCTKR2016007451-appb-I000024
Figure PCTKR2016007451-appb-I000024
부가반응 촉매 : PLATINUM - DIVINYLTETRAMETHYLDISILOXANE COMPLEX (SIP6830.3)Addition Catalyst: PLATINUM-DIVINYLTETRAMETHYLDISILOXANE COMPLEX (SIP6830.3)
실라놀기를 포함하는 오르가노폴리실록산 :Organopolysiloxanes containing silanol groups:
[화학식 15] (gelist사제, DMS-S15)[Formula 15] (manufactured by gelist, DMS-S15)
Figure PCTKR2016007451-appb-I000025
Figure PCTKR2016007451-appb-I000025
실험예Experimental Example 1.  One. 박리력Peel force 측정 Measure
50μm 두께의 폴리이미드(polyimide, PI) 기판 상부에, 상기 실시예 1 내지 12 및 비교예 1 내지 6의 실리콘 점착제 조성물을 코팅(optically clear adhesive, OCA)하고, 120℃에서 3분간 건조하여 실리콘 점착층을 형성하였다.On the polyimide (PI) substrate having a thickness of 50 μm, the silicone adhesive compositions of Examples 1 to 12 and Comparative Examples 1 to 6 were coated (optically clear adhesive, OCA), and dried at 120 ° C. for 3 minutes to adhere the silicone. A layer was formed.
상기 실리콘 점착층 상부에 불소계 이형필름을 접합하고, 상온에서 24시간 동안 방치하였다.Bonding the fluorine-based release film on the silicon adhesive layer, and left for 24 hours at room temperature.
상기 샘플을 25mm 폭으로 절단한 뒤, 이형 필름을 제거하였다. 상기 이형 필름 상부에 양면 점착제를 이용하여 글라스 위에 고정화된 검화된 TAC(TriAcetylCellulose)필름을 접합시켰다.After cutting the sample to 25 mm width, the release film was removed. Using a double-sided pressure-sensitive adhesive on the top of the release film was bonded a saponified TAC (TriAcetyl Cellulose) film fixed on the glass.
접합된 샘플(TAC/OCA/PI)을 상온에서 24시간 동안 방치한 뒤, 오토그라프를 이용하여 180°로 박리하여 박리력을 측정하였으며, 결과를 하기 표 2에 나타내었다.The bonded sample (TAC / OCA / PI) was left at room temperature for 24 hours, and then peeled at 180 ° using an autograph to measure the peel force, and the results are shown in Table 2 below.
실험예Experimental Example 2.  2. 폴딩Folding (folding) 특성 측정(folding) properties
상기 실험예 1에서 제조한 샘플(TAC/OCA/PI)을 TAC 필름 방향으로 0° 및 180°의 각도로 폴딩(folding)하여(도 2), 1만회마다 PI의 크랙(crack)과 점착제의 박리를 현미경으로 관찰하였다.By folding the sample prepared in Experimental Example 1 (TAC / OCA / PI) at an angle of 0 ° and 180 ° in the direction of the TAC film (FIG. 2), cracks and adhesives of PI every 10,000 times Peeling was observed under a microscope.
각, 크랙과 박리가 발생하는 폴딩 횟수를 측정하여 내크랙성과 내박리성을 평가하였으며, 결과를 하기 표 2에 나타내었다.Each, cracking and peeling were measured by measuring the number of folding occurs, and crack resistance and peeling resistance were evaluated, and the results are shown in Table 2 below.
점착력adhesiveness 크랙 발생Crack 박리발생Peeling occurrence
실시예 1Example 1 9N9N 미발생Not Occurred 미발생Not Occurred
실시예 2Example 2 13N13N 15만회150,000 times 미발생Not Occurred
실시예 3Example 3 11N11N 미발생Not Occurred 미발생Not Occurred
실시예 4Example 4 5N5N 미발생Not Occurred 18만회180,000 times
실시예 5Example 5 5N5N 미발생Not Occurred 15만회150,000 times
실시예 6Example 6 8N8N 15만회150,000 times 20만회200,000 times
실시예 7Example 7 6N6N 미발생Not Occurred 17만회170,000 times
실시예 8Example 8 4N4N 미발생Not Occurred 13만회130,000 times
실시예 9Example 9 11N11N 미발생Not Occurred 미발생Not Occurred
실시예 10Example 10 13N13N 18만회180,000 times 미발생Not Occurred
실시예 11Example 11 9N9N 미발생Not Occurred 미발생Not Occurred
실시예 12Example 12 11N11N 미발생Not Occurred 미발생Not Occurred
비교예 1Comparative Example 1 1.5N1.5N 미발생Not Occurred 1만회10,000 times
비교예 2Comparative Example 2 2.7N2.7 N 13만회130,000 times 3만회30,000 times
비교예 3Comparative Example 3 2.3N2.3N 미발생 Not Occurred 2만회20,000 times
비교예 4Comparative Example 4 2.9N2.9N 미발생Not Occurred 4만회40,000 times
비교예 5Comparative Example 5 3.1N3.1N 미발생Not Occurred 5만회50,000 times
비교예 6Comparative Example 6 1.8N1.8N 미발생Not Occurred 1만회10,000 times
상기 표 2의 결과에서, 본 발명의 실리콘 점착제 조성물인 실시예 1 내지 12는 비교예 1 내지 6과 비교하였을 때, 점착력이 매우 우수한 결과를 보였다.In the results of Table 2, Examples 1 to 12 of the silicone pressure-sensitive adhesive composition of the present invention, when compared with Comparative Examples 1 to 6, showed a very excellent adhesive force.
또한, 실시예 2, 6 및 10에서 크랙이 발생한 것을 제외하고는 크랙이 발생하지 않았으며, 박리 발생도 양호한 결과를 보였다.In addition, no crack was generated except that cracks were generated in Examples 2, 6, and 10, and peeling was also satisfactory.
반면, 비교예 1 내지 6의 실리콘 점착제 조성물은 크랙 발생 결과는 비교적 우수하였으나, 점착력이 매우 약했으며, 박리도 쉽게 발생하는 것을 확인할 수 있었다. On the other hand, the silicone pressure-sensitive adhesive composition of Comparative Examples 1 to 6 was relatively excellent in the occurrence of cracks, the adhesion was very weak, it was confirmed that the peeling easily occurs.
따라서, 본 발명의 실리콘 점착제 조성물은 점착력이 매우 우수하며, 그에 따라 내박리성이 우수한 특성을 나타내며, 탄성률이 낮아 기판의 크랙 발생을 방지하는 효과를 지니고 있다.Therefore, the silicone pressure-sensitive adhesive composition of the present invention is very excellent in adhesion, thereby exhibiting excellent peeling resistance, has a low elastic modulus has the effect of preventing the occurrence of cracking of the substrate.

Claims (10)

  1. 비닐실란기를 포함하는 오르가노폴리실록산; 히드로실릴기를 포함하는 오르가노폴리실록산; 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물; 및 부가반응 촉매;를 포함하는 실리콘 점착제 조성물.Organopolysiloxane comprising a vinylsilane group; Organopolysiloxanes including hydrosilyl groups; A compound comprising at least one member selected from the group consisting of a vinyl group and an epoxy group, an isocyanate group, a hydroxy group and an amino group in one molecule; And an addition reaction catalyst.
  2. 청구항 1에 있어서, 상기 비닐실란기를 포함하는 오르가노폴리실록산은 하기 화학식 1 내지 3으로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 것을 특징으로 하는 실리콘 점착제 조성물.The silicone pressure-sensitive adhesive composition of claim 1, wherein the organopolysiloxane including the vinylsilane group includes at least one member selected from the group consisting of the following Chemical Formulas 1 to 3.
    [화학식 1][Formula 1]
    Figure PCTKR2016007451-appb-I000026
    Figure PCTKR2016007451-appb-I000026
    [화학식 2][Formula 2]
    Figure PCTKR2016007451-appb-I000027
    Figure PCTKR2016007451-appb-I000027
    [화학식 3][Formula 3]
    Figure PCTKR2016007451-appb-I000028
    Figure PCTKR2016007451-appb-I000028
    상기 n, m, p, q 및 r은 각각 독립적으로 1 내지 1000의 정수이고,N, m, p, q and r are each independently an integer of 1 to 1000,
    상기 p단위 및 m단위의 비율은 100:1 내지 10:1 이고,The ratio of the p unit and m unit is 100: 1 to 10: 1,
    상기 q단위 및 r단위의 비율은 100:1 내지 10:1 이다.The ratio of the q unit and the r unit is 100: 1 to 10: 1.
  3. 청구항 1에 있어서, 상기 히드로실릴기를 포함하는 오르가노폴리실록산은 하기 화학식 4 내지 7로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 것을 특징으로 하는 실리콘 점착제 조성물.The silicone pressure-sensitive adhesive composition of claim 1, wherein the organopolysiloxane including the hydrosilyl group comprises at least one member selected from the group consisting of Formulas 4 to 7.
    [화학식 4][Formula 4]
    Figure PCTKR2016007451-appb-I000029
    Figure PCTKR2016007451-appb-I000029
    [화학식 5][Formula 5]
    Figure PCTKR2016007451-appb-I000030
    Figure PCTKR2016007451-appb-I000030
    [화학식 6][Formula 6]
    Figure PCTKR2016007451-appb-I000031
    Figure PCTKR2016007451-appb-I000031
    [화학식 7][Formula 7]
    Figure PCTKR2016007451-appb-I000032
    Figure PCTKR2016007451-appb-I000032
    상기 x, a, b, c, d, e 및 f는 각각 독립적으로 1 내지 1000의 정수이고,X, a, b, c, d, e and f are each independently an integer of 1 to 1000,
    상기 a단위 및 b단위의 비율은 100:1 내지 10:1 이고,The ratio of the a unit and b unit is 100: 1 to 10: 1,
    상기 c단위 및 d단위의 비율은 100:1 내지 10:1 이고,The ratio of the c unit and d unit is 100: 1 to 10: 1,
    상기 e단위 및 f단위의 비율은 100:1 내지 10:1 이다.The ratio of the e unit and f unit is 100: 1 to 10: 1.
  4. 청구항 1에 있어서, 상기 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물은 하기 화학식 8 내지 14로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 것을 특징으로 하는 실리콘 점착제 조성물.The compound according to claim 1, wherein the compound including at least one selected from the group consisting of a vinyl group, an epoxy group, an isocyanate group, a hydroxy group, and an amino group in one molecule thereof is selected from the group consisting of the following Chemical Formulas 8 to 14 Silicone pressure-sensitive adhesive composition comprising a.
    [화학식 8][Formula 8]
    Figure PCTKR2016007451-appb-I000033
    Figure PCTKR2016007451-appb-I000033
    [화학식 9][Formula 9]
    Figure PCTKR2016007451-appb-I000034
    Figure PCTKR2016007451-appb-I000034
    [화학식 10][Formula 10]
    Figure PCTKR2016007451-appb-I000035
    Figure PCTKR2016007451-appb-I000035
    [화학식 11][Formula 11]
    Figure PCTKR2016007451-appb-I000036
    Figure PCTKR2016007451-appb-I000036
    [화학식 12][Formula 12]
    Figure PCTKR2016007451-appb-I000037
    Figure PCTKR2016007451-appb-I000037
    [화학식 13][Formula 13]
    Figure PCTKR2016007451-appb-I000038
    Figure PCTKR2016007451-appb-I000038
    [화학식 14][Formula 14]
    Figure PCTKR2016007451-appb-I000039
    Figure PCTKR2016007451-appb-I000039
  5. 청구항 1에 있어서, 상기 부가반응 촉매는 백금족 금속계 촉매로, 중심 금속으로 백금, 팔라듐, 이리듐, 로듐, 오스뮴 및 루테늄으로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 것을 특징으로 하는 실리콘 점착제 조성물.The silicone pressure-sensitive adhesive composition of claim 1, wherein the addition reaction catalyst is a platinum group metal catalyst, and includes at least one selected from the group consisting of platinum, palladium, iridium, rhodium, osmium, and ruthenium as a center metal.
  6. 청구항 1에 있어서, 상기 실리콘 점착제 조성물 총 중량에 대하여, 비닐실란기를 포함하는 오르가노폴리실록산 50 내지 90 중량%, 히드로실릴기를 포함하는 오르가노폴리실록산 5 내지 40 중량%, 한 분자 내에 비닐기 및, 에폭시기, 이소시아네이트기, 히드록시기 및 아미노기로 이루어진 군으로부터 선택되는 1종 이상을 포함하는 화합물 1 내지 15 중량% 및 부가반응 촉매 0.01 내지 1 중량%로 포함되는 것을 특징으로 하는 실리콘 점착제 조성물.The method according to claim 1, 50 to 90% by weight of the organopolysiloxane including a vinylsilane group, 5 to 40% by weight of the organopolysiloxane including a hydrosilyl group, vinyl group and epoxy group in one molecule , 1 to 15% by weight of a compound comprising at least one selected from the group consisting of an isocyanate group, a hydroxyl group and an amino group and 0.01 to 1% by weight of an addition reaction catalyst.
  7. 청구항 1에 있어서, 상기 실리콘 점착제 조성물은 표면에 카르복실기 또는 히드록시기를 포함하는 기판에 도포되는 것을 특징으로 하는 실리콘 점착제 조성물.The silicone pressure sensitive adhesive composition of claim 1, wherein the silicone pressure sensitive adhesive composition is applied to a substrate including a carboxyl group or a hydroxyl group on a surface thereof.
  8. 청구항 1의 실리콘 점착제 조성물로 제조된 실리콘 점착제.Silicone pressure-sensitive adhesive prepared by the silicone pressure-sensitive adhesive composition of claim 1.
  9. 청구항 8에 있어서, 상기 실리콘 점착제는 표면에 카르복실기 또는 히드록시기를 포함하는 기판에 도포되는 것을 특징으로 하는 실리콘 점착제.The silicone pressure sensitive adhesive of claim 8, wherein the silicone pressure sensitive adhesive is applied to a substrate including a carboxyl group or a hydroxyl group on a surface thereof.
  10. 청구항 8의 실리콘 점착제가 도포된 필름.The film to which the silicone adhesive of Claim 8 was apply | coated.
PCT/KR2016/007451 2015-10-23 2016-07-08 Silicone adhesive composition WO2017069382A1 (en)

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KR20090082868A (en) * 2008-01-28 2009-07-31 신에쓰 가가꾸 고교 가부시끼가이샤 Diglycidyl isocyanuryl modified organopolysiloxane and composition containing the same
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KR20080104279A (en) * 2006-02-24 2008-12-02 다우 코닝 코포레이션 Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
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JP2013216827A (en) * 2012-04-11 2013-10-24 Kaneka Corp Polysiloxane composition
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