WO2017040105A1 - Enceinte en deux parties - Google Patents

Enceinte en deux parties Download PDF

Info

Publication number
WO2017040105A1
WO2017040105A1 PCT/US2016/048152 US2016048152W WO2017040105A1 WO 2017040105 A1 WO2017040105 A1 WO 2017040105A1 US 2016048152 W US2016048152 W US 2016048152W WO 2017040105 A1 WO2017040105 A1 WO 2017040105A1
Authority
WO
WIPO (PCT)
Prior art keywords
segment
glass
end surface
article
based segment
Prior art date
Application number
PCT/US2016/048152
Other languages
English (en)
Inventor
Charles Michael Darcangelo
Stephan Lvovich Logunov
Mark Alejandro Quesada
Butchi Reddy Vaddi
Original Assignee
Corning Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Incorporated filed Critical Corning Incorporated
Publication of WO2017040105A1 publication Critical patent/WO2017040105A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/046—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of metals, metal oxides or metal salts only
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/08—Joining glass to glass by processes other than fusing with the aid of intervening metal

Definitions

  • the present disclosure relates generally to a two-piece bonded enclosure.
  • Tubular glass shapes with circular or non-circular, such as oval or square, cross sections are of particular interest as they have applications in a number of fields, for example as the exterior structure of food storage containers and electronic devices, such as telephones, and electronic pads or other handhelds.
  • Conventional multi-component structures are sealed together using frit-based sealants, for example, including glass materials ground to a particle size ranging from 2 to 150 microns, a negative CTE material, and an organic solvent or binder.
  • a glass frit layer can be applied to sealing surfaces on one or both of the substrates by spin-coating or screen printing.
  • the glass frit materials typically have a glass transition temperature greater than 450°C and thus require processing at elevated temperatures to form the sealing layer.
  • conventional multi-component structures are susceptible to breakage and bond failure when mishandled by a user.
  • conventional single piece structures are difficult to manufacture by forming processes and to achieve flat surfaces.
  • a two-piece glass article comprises a first glass-based segment and a second segment.
  • the first glass-based segment comprises a top surface opposite a bottom surface, and a first end surface opposite a second end surface.
  • the second end surface of the first glass-based segment includes a light absorbing film.
  • the second segment comprises a top surface opposite a bottom surface, and a first end surface opposite a second end surface.
  • the second end surface of the second segment includes a light absorbing film.
  • the second end surface of the first glass-based segment is bonded to the bottom surface of the second segment at a first junction by a first laser-induced bond.
  • the second end surface of the second segment is bonded to the bottom surface of the first glass-based segment at a second junction by a second laser-induced bond.
  • a two- piece glass-based article comprises a first L-shaped glass-based segment and a second L-shaped glass- based segment.
  • the first L-shaped glass-based segment comprises a top surface opposite a bottom surface, and a first end surface opposite a second end surface.
  • the top surface of the first L-shaped glass-based segment includes a first portion and a second portion separated by a convexly rounded portion.
  • the first portion of the top surface of the first L-shaped glass-based segment is substantially orthogonal to the second portion of the top surface of the first L-shaped glass-based segment.
  • the second end surface of the first L- shaped glass-based segment includes a laser light absorbing film.
  • the second L-shaped glass-based segment comprises a top surface opposite a bottom surface, and a first end surface opposite a second end surface.
  • the top surface of the second L-shaped glass-based segment includes a first portion and a second portion separated by a convexly rounded portion.
  • the first portion of the top surface of the second L-shaped glass-based segment is substantially orthogonal to the second portion of the top surface of the second L-shaped glass- based segment.
  • the second end surface of the second L-shaped glass-based segment includes a laser light absorbing film.
  • the second end surface of the first L-shaped glass-based segment is bonded to the bottom surface of the second L-shaped glass-based segment by a first laser-induced transparent bond. In embodiments, the second end surface of the second L-shaped glass-based segment is bonded to the bottom surface of the first L-shaped glass-based segment by a second laser-induced transparent bond.
  • a method of forming a two-piece glass-based article comprises arranging a first glass-based segment relative to a second segment and bonding the first glass-based segment to the second segment.
  • a first light absorbing film on a second end surface of the first glass-based segment contacts the bottom surface of the second segment at a first junction.
  • a second light absorbing film on a second end surface of the second segment contacts the bottom surface of the first glass-based segment at a second junction.
  • bonding the first glass-based segment to a second segment at the first and second junctions includes locally heating the light absorbing films with laser radiation having a predetermined wavelength.
  • the light absorbing film is transmissive at about 440 nm to about 750 nm.
  • FIG. 1 is transparent, exploded view of a two-piece enclosure according to an exemplary embodiment.
  • FIG. 2 is an assembled, transparent, perspective view of the two- piece enclosure shown in FIG. 1.
  • FIG. 3 is a transparent, perspective view of an assembled two-piece enclosure according to an exemplary embodiment.
  • FIG. 4 is a plan view of the two-piece enclosure shown in FIG. 3.
  • FIG. 5 is a perspective, assembled view of a two-piece enclosure according to an exemplary embodiment.
  • FIG. 6 is a photographic image of a laser weld (as viewed along line 2 or 4 provided in FIG. 4) between the segments of an enclosure according to an exemplary embodiment.
  • the present disclosure is directed to a two-piece article 50 for enclosing an electronic device or acting as a food storage container.
  • the electronic device may be a computer, an integrated circuit chip, electronic circuitry, a media device, a computing device, a telecommunications device, an image display device, or the like.
  • the two-piece article 50 of the present disclosure may be configured to house and protect an electronic device therein and to enable a user to use and manipulate (e.g., though touch screen functionality, fingerprint analysis capabilities, buttons, etc.) the electronic device via the two-piece article 50.
  • the article 50 may also be configured to allow wireless communication there through with the electronic device therein.
  • two-piece article 50 forms the main body, "sleeve", or integral tube within which the electronic device or perishables (e.g., food) are housed.
  • the article 50 may act as a hermetically sealed casing for the electronic device therein.
  • article 50 may act as a moisture and air barrier for food storage.
  • the assembled article 50, including the electronic device therein, may be a LCD or an OLED television, a portable mobile device, a cellphone, an electronic tablet, a touchscreen tablet, or similar devise requiring a glass display for user manipulation.
  • the assembled article 50 may be fully transparent, partially transparent, or translucent.
  • the assembled article 50 with the electronic device may also be a handheld electronic device.
  • Two-piece article 50 includes a first segment 100 and a second segment 200 (also called “substrates” or “pieces” herein).
  • segments 100, 200 may include the same materials, same lateral dimensions, same coefficients of thermal expansion (CTE), same optical transmissions, and/or same thicknesses.
  • first segment 100 and second segment 200 may comprise different materials, different lateral dimensions, different coefficients of thermal expansion (CTE), different optical transmissions, different thicknesses, and combinations thereof.
  • segment 100 and/or segment 200 may be a glass, a glass-based material, a glass-ceramic, a ceramic, or a metal.
  • segment 100 and/or segment 200 may be opaque, transparent, or colored material.
  • segment 100 may be a transparent or colored glass while segment 200 may be a transparent non-colored glass, and vice versa.
  • segment 100 may be an opaque glass ceramic (or metal) while segment 200 may be a transparent non-colored glass.
  • segments 100, 200 may be soda lime glass, strengthened and unstrengthened glasses, chemically strengthened glass, tempered glass, ion-exchanged glass, aluminosilicate glass, borosilicate glass, alkaline earth bo ro-alumino silicate glass, fused silica, LotusTM glass, WillowTM glass, Eagle XG® glass Eagle 2000® glass, Gorilla® glass, etc.
  • Colored glasses may be formed by conventional techniques of adding transition metals to their compositions (e.g., cobalt for blue glass, manganese for red glass, etc.). Opaque glasses may be formed using conventional methods such as adding copper or other elements. Segments 100, 200 may also include anti-reflective coatings, antibacterial coatings, anti-scratch coatings, and combinations thereof. All combinations of these glass compositions for segments 100, 200 are according to embodiments of the present disclosure. The material selected may depend on the desired characteristics of article 50 such as electrical conductivity, thermal conductivity, transparency, toxicity, surface finish, weight, etc.
  • Exemplary substrates can have any suitable dimensions.
  • Substrates can have real (length and width) dimensions that independently range from 1 cm to 5 m (e.g., 0.1, 1, 2, 3, 4 or 5 m) and a thickness dimension that can range from about 0.5 mm to 2 mm (e.g., 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.2, 1.5 or 2 mm).
  • a substrate thickness can range from about 0.05 mm to 0.5 mm (e.g., 0.05, 0.1, 0.2, 0.3, 0.4 or 0.5 mm).
  • a glass substrate thickness can range from about 2 mm to 10 mm (e.g., 2, 3, 4, 5, 6, 7, 8, 9 or 10 mm). Lateral dimensions and thicknesses of segments 100, 200 making up article 50 provide a light, ridged structure.
  • segment 100 includes a top surface
  • top surface 106 and/or bottom surface 108 may include near optical-quality to optical-quality surfaces.
  • top surface 106 and/or bottom surface 108 may include index-matching materials or coatings.
  • Segment 100 may also include an electrical device (e.g., a sensor) therein between top surface 106 and bottom surface 108.
  • Segment 100 further includes a first side surface 110 opposite a second side surface 112.
  • Segment 100 may be L-shaped, U-shaped, or C-shaped when viewing the lateral profile of top surface 102 via side surfaces 1 10, 112.
  • glass segment 100 top surface 102 includes a first portion 101 and a second portion 109 separated by a third convexly rounded portion 103. Portions 101, 109 of top surface 102 may be substantially flat across their lateral dimensions. Portion 101 may be substantially orthogonal to portion 109. Further, portion 101 may be adjacent end surface 106 and convexly rounded portion
  • glass segment 100 bottom surface 104 includes a first portion 105 and a second portion 111 separated by a third concavely rounded portion 107. Portions 105, 111 of bottom surface 104 may be substantially flat across their lateral dimensions. Portion 105 may be substantially orthogonal to portion 111. Further, potion 105 may be adjacent surface 106 and a concavely rounded portion 107 may be adjacent end surface 108.
  • second segment 200 comprises a top surface 202 opposite a bottom surface 204, and a first end surface 206 opposite a second end surface 208.
  • top surface 206 and/or bottom surface 208 may include near optical-quality to optical-quality surfaces.
  • top surface 206 and/or bottom surface 208 may include index- matching materials or coatings.
  • Segment 200 may also include an electrical device (e.g., a sensor) therein between top surface 206 and bottom surface 208.
  • Segment 200 further includes a first side surface 210 opposite a second side surface 212.
  • side surface 1 10 of segment 100 is level with side surface 210 of segment 200.
  • side surface 112 of segment 100 is level with side surface 212 of segment 200.
  • Segment 200 may be L-shaped, U-shaped, or C-shaped when viewing the lateral profile of top surface 202 via side surfaces 210, 212.
  • glass segment 200 top surface 202 includes a first portion 201 and a second portion 209 separated by a third convexly rounded portion 203.
  • Portions 201 , 209 of top surface 202 may be substantially flat across their lateral dimensions.
  • Portion 201 may be substantially orthogonal to portion 209. Further, portion 201 may be adjacent end surface 206 and convexly rounded portion 203 may be adjacent end surface 208.
  • glass segment 200 bottom surface 204 includes a first portion 205 and a second portion 21 1 separated by a third concavely rounded portion 207.
  • Portions 205, 211 of bottom surface 204 may be substantially flat across their lateral dimensions.
  • Portion 205 may be substantially orthogonal to portion 21 1 .
  • potion 205 may be adjacent surface 206 and a concavely rounded portion 207 may be adjacent end surface 208.
  • end surfaces 108, 208 include a low melting film.
  • End surfaces 106, 206 may also include the low melting film.
  • bottom surfaces 104, 204 may include the low melting film.
  • the low melting film is typically applied to a surface acting as an interface boundary between the two segments, but may be applied to the entire surface of segments 100, 200.
  • the low melting film may be the same or a different material on each of segments 100, 200 surfaces.
  • the low melting film of the present disclosure is used to bond segments 100 and 200 together to form article 50.
  • the low melting film is also used to locally define and effectuate a sealing interface between the two segments.
  • the low melting film of the present disclosure may be used to create a laser weld at the interfacial boundary between segment 100 and 200.
  • the low melting film may be a low melting glass, for example, used for temperature induced absorption or color center absorption in the glass.
  • the low melting film of the present disclosure may be a laser light absorbing material, an ultraviolet (UV) light absorbing material, a near-infrared (NIR) absorbing material, an infrared (IR) absorbing material, or another film that absorbs, melts at an incidental light wavelength within the electromagnetic spectrum.
  • Light absorbing film 1 16 may also be an inorganic film.
  • the composition of the inorganic films of the present disclosure may comprise Sn0 2 , Ti0 2 , TiO, Zn, Ti, Ce, Pb, Fe, Va, Cr, Mn, Mg, Ge, SnF 2 , ZnF 2 , NbO, Nb0 2 , Nb 2 0 5 , TaO, Ta0 2 , Ta 2 Os, and combinations thereof.
  • Inorganic films of the present disclosure may also include Niobium and Tantalum based compounds including other elements including fluoride, chloride, bromide, sulfide, and tellurides, for example.
  • the composition of the inorganic film can be selected to lower the activation energy for inducing creep flow of the first substrate, the second substrate, or both the first and second substrates.
  • the composition of the inorganic film can be a laser absorbing low liquidus temperature material with a liquidus temperature less than or equal to about 1000°C, less than or equal to about 600°C, or less than or equal to about 400°C.
  • the composition of the inorganic film comprises 20-100 mol% SnO, 0-50 mol% SnF2, and 0-30 mol% P 2 Os or B 2 C>3.
  • the inorganic film and the substrates have a combined internal transmission of more than 80% at approximately 420 nm to approximately 750 nm.
  • a total thickness of an exemplary film can range from about 100 nm to 10 microns.
  • a thickness of the film can be less than 10 microns, e.g., less than 10, 5, 2, 1, 0.5 or 0.2 microns.
  • Exemplary glass sealing film thicknesses include 0.1, 0.2, 0.5, 1, 2, 5 or 10 microns.
  • Light absorbing film 116 may be applied to various surfaces of segments 100, 200 by vapor deposition, 3-D printing, sputtering from a sputtering target, dip coating, spray coating, spin coating, blading, brushing, printing processes, or roll-to-roll processes, or other commonly known methods.
  • the thickness of light absorbing film 1 16 may range from about 1 micron to 1 mm, or from about 10 nm to about 100 micrometers.
  • FIG. 2 provides an example, transparent assembled article 50. Segments 100, 200 from FIG. 1 are arranged relative to one another in FIG. 2.
  • light absorbing film 116 on end surface 108 of glass segment 100 contacts the bottom surface 204 of the second glass segment 200 at a junction 302.
  • light absorbing film 1 16 on end surface 208 of the second glass segment 200 contacts the bottom surface 104 of the first glass segment 100 at a junction 304.
  • end surfaces 108, 208 are pressed onto bottom surfaces 204, 104 at junctions 302, 304, respectively, including light absorbing film 116.
  • Junctions 302, 304 are shown as shaded areas in FIG. 2.
  • Light absorbing film 116 may cover all or a portion of junctions 302, 304.
  • residual members 306 and 308 may exist and may need to be removed after bonding segments 100, 200.
  • Residual members 306, 308 may act as grip points or stabilizing members while bonding segments 100, 200 to form article 50.
  • the configuration of segment 100 and segment 200 relative to each other, as shown in FIG. 2, only necessitates a compressive force (orthogonal the top surfaces 102, 202 of segments 100, 200) to keep the segments stationary for bonding and later processing. Further, once assembled, compressive forces do not exhibit strain on seals, bonds, or welds within junctions 302, 304. In comparison, conventional structures often require several vectors to support the individual substrates for bonding and later processing. The bonds of conventional structures are also typically strained by a compressive force (orthogonal the top surfaces 102, 202 of segments 100, 200) in FIG. 2.
  • segments 100, 200 are brought into a mating configuration and cooperate to define an interior volume or cavity 300.
  • Cavity 300 is between bottom surface 104 of segment 100 and bottom surface 204 of segment 200.
  • Cavity 300 is configured to contain and surround the electronic device to be enclosed or protected by article 50.
  • Cavity 300 may also be configured to contain food or other similar perishable consumer products.
  • bottom surface 104 is separated from bottom surface 204 by a distance DS of about 0.1 millimeters to about 30 centimeters, or about 2 millimeters to about 5 millimeters.
  • the electronic device may be positioned within cavity 300 before, during, or after laser-induced bonding of segment 100 to segment 200.
  • An exemplary method of bonding segments 100, 200 together starts by directing a laser at an interface of the two glass sheets with suitably chosen parameters to initiate a welding process.
  • the interface is along junctions 302, 304 at a location including light absorbing film 1 16.
  • a focused laser beam from a laser can be used to locally heat and melt the light absorbing film 116 and adjacent glass substrate materials (e.g., segments 100, 200) to form a sealed interface within junctions 302, 304.
  • the laser can be focused through segment 100 to junction 304 and then translated (scanned) across junction 304 at the sealing surface to locally heat the light absorbing film 1 16.
  • the laser can be focused through segment 200 to junction 302 and then translated (scanned) across junction 302 at the sealing surface to locally heat the light absorbing film 1 16.
  • the process of welding along junctions 302 and 304 can be applied in parallel areas to form redundant seals between segment 100 and segment 200.
  • the laser beam contacts segments 100, 200 substantially orthogonal to top surfaces 102, 202, respectively.
  • light absorbing film 1 16 absorbs the laser processing wavelength.
  • a low melting film may be used to absorb sufficient energy from the incident laser to induce welding.
  • the glass substrates can be initially transparent (e.g., at least 50%, 70%, 80% or 90% transparent) at the laser processing wavelength.
  • article 50 has a minimal number of bonding sites (i.e., 2 junctions 303 and 304) for bonding segments 100, 200. Also, the bonds may be at positioned opposite article 50 to minimize bond failure in the event of a localized force along the periphery of article 50.
  • Methods and examples of laser bonding various substrates together (such as segments 100, 200) to form a bonded article is provided in U.S. Patent Publication No. 2015/0027168A1, the entire contents of which is incorporated herein by reference.
  • the optimum welding can be a function of three mechanisms, namely, absorption by an exemplary film and/or substrate of laser radiation and the heating effect based of this absorption process, increase of the film and substrate absorption due to the heating effects (band gap shift to the longer wavelength) which can be transient and depends upon the processing conditions, and defect or impurity absorption or color center absorption generated by UV radiation.
  • strong, hermetic, transparent bonds can be achieved using embodiments of the present disclosure by an exemplary low melting film or another film that absorbs/melts at an incident wavelength, color center formation in the film and glass, and temperature induced absorption in the film and glass substrates.
  • the color center formation can be reversible if transparent seals are desired.
  • a hermetic seal is an area (e.g., cavity 300) which, for practical purposes, is considered substantially airtight and substantially impervious to moisture and/or oxygen.
  • the hermetic seal can be configured to limit the transpiration (diffusion) of oxygen to less than about 10 "2 cm 3 /m 2 /day (e.g., less than about 10 "3 cm 3 /m 2 /day), and limit the transpiration (diffusion) of water to about 10 "2 g/m 2 /day (e.g., less than about 10 "3 , 10 "4 , 10 "5 or 10 "6 g/m 2 /day).
  • the hermetic seal substantially inhibits air and water from contacting a protected workpiece (e.g., an electronic device within cavity 300).
  • the laser can have any suitable output to affect sealing.
  • An exemplary laser can be a UV laser such as, but not limited to, a 355 run laser, which lies in the range of transparency for common display glasses.
  • a suitable laser power can range from about 0.51 W to about 10 W.
  • the width of the sealed region between segments 100, 200, which can be proportional to the laser spot size, can be about 0.04 to 2 mm, e.g., 0.06, 0.1 , 0.2, 0.5, 1 , 1.5 or 2 mm.
  • a translation rate of the laser (i.e., sealing rate) can range from about 1 mm/sec to 400 mm/sec or even to 1 m/sec or greater, such as 1 , 2, 5, 10, 20, 50, 100, 200, or 400 mm/sec, 600 mm/sec, 800 mm/sec, 1 m/sec.
  • the laser spot size (diameter) can be about 0.02 to 2 mm.
  • the laser weld dimension was found to be slightly less than the dimensions of the incident beam (approximately 500 microns less).
  • Suitable glass substrates exhibit significant induced absorption during sealing.
  • the segment 100 can be a transparent glass plate like those manufactured and marketed by Corning Incorporated.
  • segment 100 can be any transparent glass plate such as those manufactured and marketed by Asahi Glass Co. (e.g., AN100 glass), Nippon Electric Glass Co., (e.g., OA-10 glass or OA-21 glass), or Corning Precision Materials.
  • segment 200 can be the same glass material as segment 100, or a non- transparent substrate such as, but not limited to, a ceramic substrate or a metal substrate.
  • Exemplary glass substrates can have a coefficient of thermal expansion of less than about 150xlO "7 /°C, e.g., less than 50xlO "7 /°C, 20xlO "7 /°C or 10xlO "7 /°C.
  • the segment 100 can be a ceramic, metal or other material substrate, patterned or continuous, as provided above.
  • the step of bonding together the segments can create a bond having an integrated bond strength greater than an integrated bond strength of a residual stress field in segment 100, segment 200 or both segments 100, 200.
  • the laser- induced bonds between segment 100 and segment 200 may have strengths from about 5 MPa to about 120 MPa, or even from about 10 MPa to about 100 MPa. In some exemplary embodiments, such a bond will fail only by cohesive failure.
  • the step of bonding further comprises welding article 50 between the first and second segments 100, 200 as a function of the composition of impurities in the first segment 100 or second segment 200 and as a function of the composition of the inorganic film though the local heating of the inorganic film with laser radiation having a predetermined wavelength.
  • the predetermined wavelength of the laser radiation is based on or compatible with the absorption spectrum of the low melting film, the material of segment 100, and/or the material of segment 200 to effectuate local inter-migration of there between.
  • Exemplary impurities in the first or second substrates can be, but are not limited to, As, Fe, Ga, K, Mn, Na, P, Sb, Ti, Zn, Sn and combinations thereof.
  • a microscopic photograph of the laser weld bond between segments 100, 200 comprised of Eagle XG® glass is provided in FIG. 6.
  • the view of the weld location in FIG. 6 at junction 302, 304 is provided by dashed lines 2 and 4 in FIG. 4.
  • FIG. 2 illustrates example cutting lines 6 and 8 that may be used to remove residual members 306 and 308.
  • end surface 106 of segment 100 is adjacent top surface 202 of segment 200.
  • end surface 206 of segment 200 is adjacent top surface 201 of segment 100.
  • FIG. 3 is a transparent, perceptive view of an example assembled article 50 without residual members 306 and 308.
  • the laser-induced weld, seal or bond between segment 100 and segment 200 is at a location within junctions 302 and 304.
  • the width D of the weld, seal or bond lines can be varied by modification of the spot size at the interface of the respective substrates.
  • weld 216 has a width D of 80 microns.
  • Another weld may be placed next to weld 216 in exemplary embodiments to redundancy in weld strength and sealing.
  • the width D of the weld, seal or bond may also be from about 5 microns to about 200 microns.
  • width D w of the sealed region which can be proportional to the laser spot size, can be about 0.05 to 2 mm, e.g., 0.05, 0.1, 0.2, 0.5, 1 , 1.5 or 2 mm.
  • end surface 108 of segment 100 is bonded to bottom surface 204 of segment 200 at junction 302 by laser-induced bond.
  • second end surface 208 of segment 200 is bonded to bottom surface 104 of segment 100 at junction 304 by another laser-induced bond.
  • the laser- induced bond may be at any location along junctions 302 and 304.
  • Two-piece article 50 creates an enclosure for an electronic device or a container for food that is simpler to form compared to conventional single piece articles manufactured using forming processes, and multi-piece articles bonded together using glass frit.
  • segments 100, 200 may also include edges 351, 350, respectively (shown in FIG. 4). Edges 350, 351 together or individually may assist a user grasping article 50 and when manipulating the electronic device therein. That is, edges 350, 351 may act as friction areas where the user is able to more easily grasp article 50 than other smooth surfaces around its periphery.
  • edges 50 are identical to edges 50.
  • edges 350 and 351 may be round beveled to create a continually rounded circumference around article 50.
  • edges 350 and 351 may be flat beveled to create a one flat-edge embodiment, or two flat-edge embodiment.
  • two-piece bonded article 50 may be annealed to improve overall strength.
  • two piece bonded article 50 may be thermally or chemically tempered for added strength for use of the sleeve in portable electronic applications. Techniques for chemical tempering, or ion exchange, are well known in the art - e.g., U.S. Pat. Nos. 3,410,673 and 8,561,429 - both of which are herein incorporated by reference in their entireties.
  • top member 310 and a bottom member 321 may be attached to article 50 to fully enclose cavity 300.
  • top member 320 may be connected to first side surfaces 1 10 and 210 of segment 100 and segment 200, respectively.
  • bottom member 321 may be connected to second side surfaces 1 12 and 212 of segment 100 and segment 200, respectively.
  • Article 50 together with top member 320 and bottom member 321 would fully enclose cavity 300 and the electronic device or food storage area therein.
  • Top member 320 and bottom member 320 may be sealed, bonded, or welded to article 50 accordingly to the methods disclosed herein, or using conventional methods.
  • Top member 320 may be directly or indirectly coextensive or joined with bottom member 321.
  • top member 320 and bottom member 321 may each have a rounded bottom with sides extending up and terminating in a plane to attach to the sides of segments 100, 200.
  • Top member 320 and bottom member 321 may also have cavities therein that adjoin with and expand cavity 300 for holding the electronic device.
  • the electronic device may be a quantum dot, a display, a light emitting diode, or an organic light emitting display.
  • Top member 320 and bottom member 321 may also be removable such that cavity 300 can act as a food storage area.
  • Ranges can be expressed herein as from “about” one particular value, and/or to "about” another particular value. When such a range is expressed, examples include from the one particular value and/or to the other particular value. Similarly, when values are expressed as approximations, by use of the antecedent "about,” it will be understood that the particular value forms another aspect. It will be further understood that the endpoints of each of the ranges are significant both in relation to the other endpoint, and independently of the other endpoint.
  • references herein refer to a component of the present invention being “configured” or “adapted to” function in a particular way.
  • a component is “configured” or “adapted to” embody a particular property, or function in a particular manner, where such recitations are structural recitations as opposed to recitations of intended use.
  • the references herein to the manner in which a component is “configured” or “adapted to” denotes an existing physical condition of the component and, as such, is to be taken as a definite recitation of the structural characteristics of the component.

Abstract

L'invention concerne un article en deux parties servant à enfermer un dispositif électronique ou à stocker des aliments et ses procédés de fabrication. L'enceinte en deux parties comprend un film absorbant la lumière à l'interface entre les deux segments. Les deux segments sont joints l'un à l'autre par une liaison. L'enceinte résultante comprend une partie en verre à résistance à la traction élevée.
PCT/US2016/048152 2015-08-31 2016-08-23 Enceinte en deux parties WO2017040105A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562212115P 2015-08-31 2015-08-31
US62/212,115 2015-08-31
US201562212833P 2015-09-01 2015-09-01
US62/212,833 2015-09-01

Publications (1)

Publication Number Publication Date
WO2017040105A1 true WO2017040105A1 (fr) 2017-03-09

Family

ID=57045383

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2016/048152 WO2017040105A1 (fr) 2015-08-31 2016-08-23 Enceinte en deux parties

Country Status (1)

Country Link
WO (1) WO2017040105A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10837804B2 (en) 2018-06-28 2020-11-17 Corning Incorporated Enhanced microbend sensor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410673A (en) 1964-01-31 1968-11-12 Corning Glass Works Double ion exchange method for making glass article
US5489321A (en) * 1994-07-14 1996-02-06 Midwest Research Institute Welding/sealing glass-enclosed space in a vacuum
US20090242017A1 (en) * 2008-03-31 2009-10-01 Koito Manufacturing Co., Ltd. Dye-sensitized solar cell
US20130134396A1 (en) * 2011-11-28 2013-05-30 Semiconductor Energy Laboratory Co., Ltd. Glass Pattern and Method for Forming the Same, Sealed Body and Method for Manufacturing the Same, and Light-Emitting Device
US8561429B2 (en) 2008-07-11 2013-10-22 Corning Incorporated Glass with compressive surface for consumer applications
US20150027168A1 (en) 2013-05-10 2015-01-29 Corning Incorporated Laser welding transparent glass sheets using low melting glass or thin absorbing films

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410673A (en) 1964-01-31 1968-11-12 Corning Glass Works Double ion exchange method for making glass article
US5489321A (en) * 1994-07-14 1996-02-06 Midwest Research Institute Welding/sealing glass-enclosed space in a vacuum
US20090242017A1 (en) * 2008-03-31 2009-10-01 Koito Manufacturing Co., Ltd. Dye-sensitized solar cell
US8561429B2 (en) 2008-07-11 2013-10-22 Corning Incorporated Glass with compressive surface for consumer applications
US20130134396A1 (en) * 2011-11-28 2013-05-30 Semiconductor Energy Laboratory Co., Ltd. Glass Pattern and Method for Forming the Same, Sealed Body and Method for Manufacturing the Same, and Light-Emitting Device
US20150027168A1 (en) 2013-05-10 2015-01-29 Corning Incorporated Laser welding transparent glass sheets using low melting glass or thin absorbing films

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10837804B2 (en) 2018-06-28 2020-11-17 Corning Incorporated Enhanced microbend sensor

Similar Documents

Publication Publication Date Title
US20230329033A1 (en) Sealed devices comprising transparent laser weld regions
TWI696591B (zh) 雷射焊接玻璃包裝件及製作其之方法
US20190047902A1 (en) Sealed devices comprising uv-absorbing films
JP2021183561A (ja) 低放射率コーティングを使用する、レーザ溶接用の透明な板ガラス
US11426989B2 (en) Laser bonded transparent glass-based articles and methods of making the same
WO2017040105A1 (fr) Enceinte en deux parties
US20200238437A1 (en) Laser sealed housing for electronic device
WO2017156048A1 (fr) Dispositifs fermés hermétiquement comprenant des régions transparentes soudées au laser

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16775008

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16775008

Country of ref document: EP

Kind code of ref document: A1