WO2017007075A1

WO2017007075A1 - End-fire antenna using via and method for manufacturing same

Info

Publication number: WO2017007075A1
Application number: PCT/KR2015/011869
Authority: WO
Inventors: 감동근; 박상욱
Original assignee: 아주대학교 산학협력단
Priority date: 2015-07-03
Filing date: 2015-11-05
Publication date: 2017-01-12
Also published as: KR20170004634A; KR101712868B1

Abstract

An embodiment of the present invention provides an end-fire antenna using a via and a method for manufacturing the same, which can improve electrical performance while having a simple manufacturing process and a simple structure by implementing a patch antenna having an end-fire radiation pattern on the same substrate as that of a feeding circuit. A method for manufacturing an end-fire antenna using a via according to an embodiment of the present invention comprises the steps of: forming at least one first elongated hole through a substrate; plating the inner wall of the first elongated hole; and cutting a substrate part, through which the elongated hole is formed, such that the plated part is exposed to the outside and thus serves as a patch antenna.

Description

End-Fire Antenna Using Vias and Manufacturing Method Thereof

Embodiments of the present invention relate to an end-fired antenna using a via and a method of manufacturing the same.

Modern wireless communication systems require antennas to transmit and receive signals. Antennas may be required to produce a well-defined beamwidth and carefully tailored radiation pattern with azimuth and elevation, while operating over broadband and maintaining high gain characteristics.

In particular, in fixed wireless access systems, customer premises equipment can be installed in a direction determined for communication with the base station, and the antenna minimizes interference to neighboring systems and reduces path loss to the base station. It may be desirable to produce a radiation pattern that yields a beam having directional characteristics that are well defined and having a predictive orientation for the antenna structure to facilitate installation of the equipment. . In addition, antennas generally require low manufacturing costs and small size.

On the other hand, various applications in the millimeter band require a plurality of array antennas to increase antenna gain and enable beam steering. This is usually implemented with a patch antenna having a radiation pattern in the z-axis direction.

Such patch antennas are generally a type of antenna that can be used in a wireless communication system, for example in a user equipment terminal or base station, such as customer premises equipment. Patch antennas generally include a metal sheet, known as a patch emitter, disposed substantially parallel to the ground plane.

Depending on the application, if a radiation pattern in the x- or y-axis direction (end-fire) is required, the patch antenna is typically fabricated on a separate board from the feeder circuit and then connected via a connector.

However, fabricating the patch antenna on a separate board from the feeder and connecting it to the connector is complicated to implement, and the feed line is longer and the electrical loss is increased as the connector is included. Accordingly, there is a need for a technology capable of implementing a plurality of patch antennas having an end-fire radiation pattern on a substrate such as a power feeding circuit. In addition, there is a demand for a technology capable of improving electrical performance while having a simple process and structure by manufacturing a module including an antenna as a single substrate (PCB).

One embodiment of the present invention is an end-fire antenna using a via that can improve the electrical performance while having a simple manufacturing process and structure by implementing a patch antenna having an end-fire radiation pattern on a substrate such as a feeder circuit and its manufacture Provide a method.

An end-fired antenna manufacturing method using a via according to an embodiment of the present invention comprises the steps of forming at least one first hole in the substrate; Plating the inner wall of the first long hole; And cutting the substrate in the portion where the first long hole is formed so that the plating is exposed to the outside to function as a patch antenna.

An end-fired antenna manufacturing method using a via according to an embodiment of the present invention comprises the steps of forming at least one first hole in the substrate; Plating the inner wall of the first long hole; And filling the first long hole with a material for forming a patch antenna or emptying the first long hole to form the patch antenna.

The method of manufacturing an end-fired antenna using a via according to an embodiment of the present invention may further include forming a feed line on the substrate to be electrically connected to the patch antenna.

The forming of the feed line may include forming the feed line in a direction crossing the line on the substrate on which the first long hole is formed.

An end-fired antenna manufacturing method using vias according to an embodiment of the present invention includes forming at least one second hole or at least one via on both sides of the substrate with respect to the feed line; And plating the second long hole or the inner wall of the via to form a reflector for reflecting the beam emitted from the patch antenna.

Forming at least one first long hole in the substrate may include forming the first long hole by drilling a plurality of vias in the direction to overlap each other in one direction.

Plating the inner wall of the first long hole may include copper plating the inner wall of the first long hole.

The forming of the patch antenna may include filling the first long hole with copper to form the patch antenna.

An end-fire antenna device using vias according to an embodiment of the present invention includes a substrate; And at least one patch antenna formed by cutting the at least one first long hole in which the plating is formed on the inner wall, and the plating is exposed to the outside from the side of the substrate.

An end-fire antenna device using vias according to an embodiment of the present invention includes a substrate; At least one plating part formed by plating an inner wall of each of the at least one first long hole formed in the substrate; And at least one patch antenna formed in the at least one first hole through filling of a material for forming a patch antenna or by emptying the first hole.

An end-fired antenna device using vias according to an embodiment of the present invention may further include a feed line formed on the substrate to be electrically connected to the patch antenna.

An end-fired antenna device using vias according to an embodiment of the present invention is formed by plating the inner wall of at least one second long hole provided on both sides of the substrate with respect to the feed line, thereby radiating a beam radiated from the patch antenna. It may further include a reflector for reflecting.

An end-fired antenna device using vias according to an embodiment of the present invention is formed by plating at least one via wall provided on both sides of the substrate with respect to the feed line, thereby reflecting a beam emitted from the patch antenna. It may further include a reflector.

An end-fire antenna device using a via according to an embodiment of the present invention is a first parasitic patch formed by plating on the inner wall of the third long hole provided between the patch antenna formed in the first hole and the front edge of the substrate ; And a first patch part formed by plating an inner wall of a fourth long hole provided between the first parasitic patch and the front edge of the substrate, and a second patch part formed by filling a dielectric material in the fourth long hole. It may further include a second parasitic patch.

An end-fired antenna device using a via according to an embodiment of the present invention is formed in the form of a hole between the patch antenna formed in the first hole and the front edge of the substrate, or a dielectric material in the fifth hole of the hole form It may further include a dielectric formed by filling.

According to an embodiment of the present invention, by implementing a patch antenna having an end-fire radiation pattern on a substrate such as a feeder circuit, it is possible to improve electrical performance while having a simple manufacturing process and structure.

1 to 6 are manufacturing process diagrams for explaining an end-fire antenna manufacturing method using a via according to an embodiment of the present invention.

7 to 12 are manufacturing process diagrams for explaining an end-fire antenna manufacturing method using vias according to another embodiment of the present invention.

13 to 17 are manufacturing process diagrams illustrating a method for manufacturing an end-fire antenna using vias according to another embodiment of the present invention.

18 to 23 are manufacturing process diagrams for explaining an end-fired antenna manufacturing method using vias according to another embodiment of the present invention.

24 to 28 are diagrams illustrating a patch antenna using a general superstrate structure and a radiation pattern before and after using the superstrate structure.

29 and 30 are diagrams illustrating an end-fired antenna using a superstrate structure having a parasitic patch according to an embodiment of the present invention.

31 and 32 are diagrams illustrating an end-fired antenna using a superstrate structure without parasitic patches in an embodiment of the present invention.

Advantages and / or features of the present invention and methods for achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the present invention;

The term 'patch antenna', which is continuously used in embodiments of the present invention, refers to a wide antenna. For example, when the horizontal length is twice the height, the patch antenna may be viewed as a patch antenna (width 3mm, height 1.5mm). The ratio of the width to height of the patch antenna may vary depending on the operating frequency and the material of the substrate.

First, referring to FIG. 1, a first long hole 110, which is a long hole formed in the substrate 100, is formed.

In this case, the first long hole 110 may be formed near one edge of the substrate 100 and may have a long oval shape. The first long hole 110 may be formed through a milling machine.

Next, referring to FIG. 2, after plating the inner wall of the first long hole 110, the substrate 100 of the portion where the first long hole 110 is formed is cut along the cutting line 120. As a result, the plating is exposed to the outside to function as the patch antenna 130.

At this time, the inner wall of the first long hole 110 is preferably copper (copper) plating, and may be plated by putting an additive such as platinum with copper plating.

Next, referring to FIG. 2, a feed line 140 is formed on the substrate 100 to be electrically connected to the patch antenna 130.

In this case, the feed line 140 may be formed in a direction crossing the line, that is, the cutting line 120, on the substrate 100 on which the first long hole 110 is formed. The feed line 140 may be connected to a feed unit (not shown) for supplying power to supply power to the patch antenna 130.

The feed line 140 may be implemented using a microstrip, and may be implemented using a stripline or coplanar waveguide (CPW) structure, depending on the design.

Next, referring to FIG. 3, second long holes 150 are formed one by one on both sides of the substrate 100 with respect to the feed line 140. That is, two second long holes 150 are formed on the substrate 100.

Next, referring to FIGS. 4 and 5, the inner wall of the second long hole 150 is plated to form a reflector 160 for reflecting the beam radiated from the patch antenna 130. . In this case, the reflector 160 may be formed in a hollow plate shape having a length equal to the thickness of the substrate 100.

On the other hand, as shown in FIG. 6 as another embodiment, after forming a plurality of vias on both sides of the substrate 100 centering on the feed line 140, and plating the inner wall of the via to the patch antenna Reflector 170 may be formed to reflect the beam emitted from 130. In this case, the reflector 170 may have a hollow cylindrical rod shape having a length equal to the thickness of the substrate 100.

First, referring to FIG. 7, one first long hole 210, which is a long hole formed in the substrate 200, is formed.

That is, the first long hole 210 may be formed by drilling a plurality of vias on the substrate 200 to overlap each other in one direction (the cutting line 220 direction). Therefore, the inner circumferential surface of the first long hole 210 may have a wavy shape.

Next, referring to FIG. 8, after plating the inner wall of the first long hole 210, the substrate 200 of the portion where the first long hole 210 is formed is cut along the cutting line 220. As a result, the plating is exposed to the outside to function as the patch antenna 230.

At this time, the inner wall of the first long hole 210 is preferably copper (copper) plating, and may be plated by putting an additive such as platinum with copper plating.

Next, referring to FIG. 8, a feed line 240 is formed on the substrate 200 to be electrically connected to the patch antenna 230.

In this case, the feed line 240 may be formed in a direction crossing the line on the substrate 200 on which the first long hole 210 is formed, that is, the cutting line 220. The feed line 240 may be connected to a feed unit (not shown) for supplying power to supply power to the patch antenna 230.

The feed line 240 may be implemented using a microstrip, and may be implemented using a stripline or coplanar waveguide (CPW) structure, depending on the design.

Next, referring to FIG. 9, second long holes 250 are formed one by one on both sides of the substrate 200 with respect to the feed line 240. That is, two second long holes 250 are formed on the substrate 200.

Next, referring to FIGS. 10 and 11, the inner wall of the second long hole 250 is plated to form a reflector 260 for reflecting the beam radiated from the patch antenna 230. . In this case, the reflector 260 may be formed in a hollow plate shape having a length equal to the thickness of the substrate 100.

On the other hand, as shown in FIG. 12 as another embodiment, after forming a plurality of vias on both sides of the substrate 200 centering on the feed line 240, the patch antenna by plating on the inner wall of the via Reflector 270 may be formed to reflect the beam emitted from 230. In this case, the reflector 270 may have a hollow cylindrical rod shape having a length equal to the thickness of the substrate 100.

First, referring to FIG. 13, a plurality of first long holes 310, which are long holes formed in the substrate 300, are formed. For example, as shown in the drawing, four first long holes 310 may be formed in the substrate 300 at regular intervals.

In this case, the first long hole 310 may be formed near one side edge of the substrate 300, and may have a long oval shape. The first long hole 310 may be formed through a milling machine.

In this case, the first long hole 310 may be formed by drilling in one room through the milling machine, or alternatively, may be formed by drilling a plurality of vias (holes) several times to overlap each other in one direction (see FIG. 7). "210").

Next, referring to FIG. 14, after plating the inner wall of the first long hole 310, the substrate 300 of the portion where the first long hole 310 is formed is cut along the cutting line 320. As a result, the plating is exposed to the outside to function as the patch antenna 330.

In this case, it is preferable to perform copper plating on the inner wall of the first long hole 310, and may be plated by adding an additive such as platinum together with copper plating.

Next, referring to FIG. 14, a feed line 340 is formed on the substrate 300 to be electrically connected to the patch antenna 330.

In this case, the feed line 340 may be formed in a direction crossing the line, that is, the cutting line 320, on the substrate 300 on which the first long hole 310 is formed. In other words, the feed line 340 may be formed on the substrate 300 in the direction crossing the cutting line 320, the same number as the number of the patch antennas 330 (for example, four). have.

The feed line 340 may be connected to a feed unit (not shown) for supplying power to supply power to the patch antenna 330.

The feed line 340 may be implemented using a microstrip, and may be implemented using a stripline or coplanar waveguide (CPW) structure, depending on the design.

Next, referring to FIG. 15, second long holes 350 are formed one by one on both sides of the substrate 300 with respect to the feed line 340. That is, as shown in the drawing, five second long holes 350 are formed on the substrate 300.

Next, referring to FIGS. 16 and 17, the inner wall of the second long hole 350 is plated to form a reflector 360 for reflecting the beam radiated from the patch antenna 330. . In this case, the reflector 360 may be formed in a hollow plate shape having a length equal to the thickness of the substrate 100.

On the other hand, although not shown in the drawing as another embodiment, after forming a plurality of vias on both sides of the substrate 300 centering on the feed line 340, the patch antenna 330 by plating the inner wall of the via Reflector for reflecting the beam emitted from the < RTI ID = 0.0 > In this case, the reflector may have a hollow cylindrical rod shape having a length equal to the thickness of the substrate 100.

First, referring to FIG. 18, one first long hole 410, which is a long hole formed in the substrate 400, is formed. However, the present invention is not limited thereto, and a plurality of first long holes 410 may be formed on the substrate 400. For example, as shown in FIG. 18, four first long holes 410 may be formed in the substrate 400 at predetermined intervals.

In this case, the first long hole 410 may be formed near one side edge of the substrate 400, and may have a long oval shape. The first long hole 410 may be formed through a milling machine.

In this case, the first long hole 410 may be formed by drilling in one room through the milling machine as shown in the drawing, and alternatively, may be formed by drilling a plurality of vias (holes) several times to overlap each other in one direction. It may be possible (see "210" in FIG. 7).

Next, referring to FIG. 19, after the plating part 420 is formed by plating the inner wall of the first long hole 410, the copper for forming the patch antenna 425 in the first long hole 410 is formed. The patch antenna 425 is formed by filling a back material.

In this case, copper plating may be performed on the inner wall of the first long hole 410, and plating may be performed by putting an additive such as platinum together with copper plating.

Alternatively, the patch antenna may be formed by emptying the first long hole 410.

Next, referring to FIG. 19, a feed line 430 is formed on the substrate 400 to be electrically connected to the patch antenna 425.

The feed line 430 may be connected to a feed unit (not shown) for supplying power to supply power to the patch antenna 425. In addition, the feed line 430 may be implemented using a microstrip, and may be implemented using a stripline or coplanar waveguide (CPW) structure, depending on the design.

Next, referring to FIG. 20, second long holes 440 are formed one by one on both sides of the substrate 400 around the feed line 430. That is, as shown in the drawing, two second long holes 440 are formed on the substrate 400.

Next, referring to FIGS. 21 and 22, copper plating is performed on the inner wall of the second long hole 440 to form a reflector 450 for reflecting the beam radiated from the patch antenna 425. . In this case, the reflector 450 may be formed in a hollow plate shape having a length equal to the thickness of the substrate 400.

Meanwhile, as shown in FIG. 23, as shown in FIG. 23, a plurality of vias are formed on both sides of the substrate 400 around the feed line 430, and copper plating is performed on the inner walls of the vias to form the patch antenna. A reflector 460 may be formed to reflect the beam emitted from 425. In this case, the reflector 460 may have a hollow cylindrical rod shape having a length equal to the thickness of the substrate 400.

Hereinafter, an end-fired antenna manufactured by the manufacturing method of the present invention will be described.

As shown in FIG. 5, an end-fire antenna manufactured by a manufacturing method according to an exemplary embodiment of the present invention may include a substrate 100 and a first long hole (see “110” of FIG. 1) having plating formed on an inner wall thereof. Through cutting, the patch antenna 130 is formed by exposing the plating to the outside on the side of the substrate 100, the feed line is formed to be electrically connected to the patch antenna 130 on the substrate 100 140 and plated on inner walls of at least one second long hole (refer to “150” in FIG. 3) formed on both sides of the substrate 100 with respect to the feed line 140. And a reflector 160 that reflects the beam emitted from 130.

As shown in FIG. 11, the end-fire antenna manufactured by the manufacturing method according to another exemplary embodiment of the present invention has a substrate 200 and a wavy first hole having a plating formed on an inner wall thereof (“210” in FIG. 7). By cutting), the patch antenna 230 is formed to be exposed to the outside from the side of the substrate 200, on the substrate 200, is formed to be electrically connected to the patch antenna 230 The feed line 240 and the second antenna (see “250” in FIG. 9) formed on both sides of the substrate 200 around the feed line 240 are plated to form the patch antenna ( And a reflector 260 that reflects the beam emitted from 230.

As shown in FIG. 17, the end-fire antenna manufactured by the manufacturing method according to another embodiment of the present invention includes a substrate 300 and a plurality of first holes ("310" in FIG. 13) having plating formed on an inner wall thereof. By cutting), a plurality of patch antennas 330 formed on the side surface of the substrate 300 to be exposed to the outside, and electrically connected to the patch antenna 330 on the substrate 300 A plurality of feed line 340 is formed to be formed, and is formed by plating on the inner wall of the second long hole (see "350" in FIG. 15) formed on both sides of the substrate 300 around the feed line 340, It may be configured to include a reflector 360 for reflecting the beam emitted from the patch antenna 330.

As shown in FIG. 22, the end-fire antenna manufactured by the manufacturing method according to another exemplary embodiment of the present invention includes a substrate 400 and a first long hole formed in the substrate 400 (“410 in FIG. 18”). Plated portion 420 plated on an inner wall, a patch antenna 425 formed by filling a material such as copper in the first hole, and the patch antenna on the substrate 400 A plurality of feed lines 430 formed to be electrically connected to the 425, and second holes formed on both sides of the substrate 400 around the feed lines 430 (see “440” in FIG. 20) It may be configured to include a reflector 450 is formed by being plated on the inner wall reflecting the beam emitted from the patch antenna 425.

24 to 28 illustrate a patch antenna using a general superstrate structure and radiation patterns before and after use of the superstrate structure.

As shown in FIG. 24, a patch antenna 510 may be formed of copper (copper) on a substrate 500 of a dielectric to form a basic patch antenna, and layers of

dielectrics

520 and 530 may be stacked on the structure of FIG. 24. It is possible to create patch antennas of the general superstrate structure such as Here, the

layers

520 and 530 may be implemented as dielectrics having different dielectric constants. In addition, a parasitic patch 540 made of copper may be added to the structure of FIG. 25 to form a patch antenna having a general superstrate structure as shown in FIG. 26.

The basic patch antenna without the superstrate structure as shown in FIG. 24 has the radiation pattern as shown in FIG. 27. On the other hand, the patch antenna using the superstrate structure as shown in FIGS. 25 and 26 has a radiation pattern having a higher gain than in FIG. 27 as shown in FIG. 28 (the darker the red, the larger the gain). That is, a radiation pattern having a large gain in the z-axis direction in which the

layers

520 and 530 are stacked can be obtained.

However, since the patch antenna using the general superstrate structure is designed in consideration of the number, type, and height of each layer, it is difficult to optimize because of many parameters and limitations. Accordingly, an embodiment of the present invention proposes an antenna having a superstrate structure that is advantageous than the structure of FIGS. 24 to 26 in terms of cost and process without requiring an additional layer. Hereinafter, an antenna having the proposed superstrate structure will be described in detail with reference to FIGS. 29 to 30 and 31 to 32.

29 and 30 are diagrams illustrating an end-fired antenna using a parasitic patched superstrate structure in one embodiment of the present invention, and FIGS. 31 and 32 are superstrates without a parasitic patch in an embodiment of the present invention. The figure shows an end-fire antenna using the structure.

First, as shown in FIGS. 29 and 30, the end-fire antenna 600 includes a substrate 610, a plating portion 620, a patch antenna 625, a reflector 630, a feed line 640, and a first line. Parasitic patches 650, and second

parasitic patches

660 and 665. Here, the substrate 610, the plating part 620, the patch antenna 625, the reflector 630, and the feed line 640 may correspond to the

components

400, 420, 425, 450, and 430 of FIG. 22, respectively. Correspondingly, in the present embodiment, description thereof will be omitted.

The first parasitic patch 650 of the third long hole 655 provided between the patch antenna 625 formed in the first long hole (see "410" of FIG. 18) and the front edge of the substrate 610. It may be formed by plating on the inner wall.

The second

parasitic patches

660 and 665 are formed by plating a metal (eg, copper) on an inner wall of a fourth long hole provided between the first parasitic patch 650 and the front edge of the substrate 610. The first patch 660 and the second patch 665 may be formed by filling a dielectric material in the fourth long hole.

The first and second

parasitic patches

650, 660 and 665 may be disposed side by side and spaced apart in the radial direction of the patch antenna 625, wherein the first and second

parasitic patches

650, 660 and 665 The patch antenna 625 may act as a dielectric having a different dielectric constant, thereby obtaining a radiation pattern having a large gain, thereby contributing to the gain improvement of the antenna.

In addition, in order to implement the first and second

parasitic patches

650, 660, and 665, the layers should be stacked in the radial direction of the antenna as shown in FIGS. 24 to 26. Since only the holes (third and fourth holes) need to be drilled with equipment such as a milling machine, it is advantageous compared to the conventional one in terms of cost and process. At this time, the size of the hole can be adjusted by the equipment as described above, it is also possible to adjust the thickness of each layer (dielectric) by adjusting the size of the hole.

Meanwhile, as another embodiment, as shown in FIGS. 31 and 32, the end-fire antenna 600 includes a dielectric 670 instead of the first and second

parasitic patches

650, 660, 665. can do.

The dielectric 670 may be formed in the form of a long hole between the patch antenna 625 formed in the first long hole and the front edge of the substrate 610, and as shown in the drawing, the fifth long hole in the long hole shape It may be formed by filling the dielectric material.

That is, the dielectric 670 may be arranged side by side spaced apart in the radial direction of the patch antenna 625, wherein the dielectric 670 and the patch antenna 625 each act as a dielectric having a different dielectric constant A large gain radiation pattern can be obtained to contribute to the gain improvement of the antenna.

In addition, in order to implement the first and second

parasitic patches

650, 660, and 665, the layers should be stacked in the radial direction of the antenna as shown in FIGS. 24 to 26. It is more advantageous than the conventional one in terms of cost and process because only the holes (chapter 5) need to be drilled with equipment such as a milling machine. At this time, the size of the hole can be adjusted by the equipment as described above, it is also possible to adjust the thickness of each layer (dielectric) by adjusting the size of the hole.

Here, the inner wall of the fifth long hole is not copper plated, and in the present invention, when the inner wall of the long hole is copper plated, a parasitic patch is defined as a structure; otherwise, a parasitic patch is not defined. do. Thus, FIGS. 29 and 30 are parasitic patches, and FIGS. 31 and 32 are parasitic patches.

For reference, in FIGS. 29 and 30, and 31 and 32, the substrate 610 is a base between the patch antenna 625 and the reflector 630, and the left region M is made of metal and is right. Region D may be made of a dielectric. In other words, as shown in FIGS. 29 and 30, the reflector 630 is disposed in the metal region M on the left side, and the patch antenna 625, the plating part 620, in the dielectric region D on the right side. First and second

parasitic patches

650, 660, and 665 may be disposed, and in the case of FIGS. 31 and 32, the reflector 630 is disposed in the metal region M on the left side and the dielectric region on the right side. The patch antenna 625, the plating part 620, and the dielectric 670 may be disposed in (D).

While specific embodiments of the present invention have been described so far, various modifications are possible without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the claims below, but also by the equivalents of the claims.

As described above, the present invention has been described by way of limited embodiments and drawings, but the present invention is not limited to the above-described embodiments, which can be variously modified and modified by those skilled in the art to which the present invention pertains. Modifications are possible. Accordingly, the spirit of the present invention should be understood only by the claims set forth below, and all equivalent or equivalent modifications thereof will belong to the scope of the present invention.

Claims

Forming at least one first long hole in the substrate;

Plating the inner wall of the first long hole; And

Cutting the substrate of the portion where the first long hole is formed so that the plating is exposed to the outside to function as a patch antenna

End-fire antenna manufacturing method using a via comprising a.
Forming at least one first long hole in the substrate;

Plating the inner wall of the first long hole; And

Filling the first long hole with a material for forming a patch antenna or emptying the first long hole to form the patch antenna

End-fire antenna manufacturing method using a via comprising a.
The method according to claim 1 or 2,

Forming a feed line on the substrate to be electrically connected to the patch antenna

End-fire antenna manufacturing method using a via, characterized in that it further comprises.
The method of claim 3,

Forming the feed line is

Forming the feed line in a direction crossing the line on the substrate on which the first long hole is formed

End-fire antenna manufacturing method using a via comprising a.
The method of claim 4, wherein

Forming at least one second long hole or at least one via on both sides of the substrate around the feed line; And

Plating the second long hole or the inner wall of the via to form a reflector for reflecting the beam emitted from the patch antenna

End-fire antenna manufacturing method using a via, characterized in that it further comprises.
The method according to claim 1 or 2,

Forming at least one first long hole in the substrate

Forming a plurality of vias on the substrate to overlap each other in one direction to form the first long hole;

End-fire antenna manufacturing method using a via comprising a.
The method according to claim 1 or 2,

Plating the inner wall of the first long hole

Copper plating the inner wall of the first long hole

End-fire antenna manufacturing method using a via comprising a.
The method of claim 2,

Forming the patch antenna

Filling the first long hole with copper to form the patch antenna

End-fire antenna manufacturing method using a via comprising a.
Board; And

At least one patch antenna formed by cutting at least one first long hole in which an inner wall is formed with the plating exposed to the outside from the side of the substrate

End-fire antenna comprising a.
Board;

At least one plating part formed by plating an inner wall of each of the at least one first long hole formed in the substrate; And

At least one patch antenna formed in the at least one first hole by filling a material for forming a patch antenna or by hollowing the first hole

End-fire antenna comprising a.
The method of claim 9 or 10,

A feed line formed on the substrate to be electrically connected to the patch antenna

End-fire antenna, characterized in that it further comprises.
The method of claim 11,

The reflector reflects the beam radiated from the patch antenna by being plated and formed on at least one second long hole inner wall provided at both sides of the substrate with respect to the feed line.

End-fire antenna, characterized in that it further comprises.
The method of claim 11,

The reflector reflects the beam radiated from the patch antenna by being plated and formed on at least one via inner wall provided at both sides of the substrate with respect to the feed line.

End-fire antenna, characterized in that it further comprises.
The method of claim 10,

A first parasitic patch plated on an inner wall of the third long hole provided between the patch antenna formed in the first long hole and the front edge of the substrate; And

And a first patch part formed by plating an inner wall of a fourth long hole provided between the first parasitic patch and the front edge of the substrate, and a second patch part formed by filling a dielectric material in the fourth long hole. Parasitic patch

End-fire antenna, characterized in that it further comprises.
The method of claim 10,

A dielectric formed in the form of a long hole between the patch antenna formed in the first hole and the front edge of the substrate, or the dielectric material is filled in the fifth hole of the long hole form

End-fire antenna, characterized in that it further comprises.