WO2016192136A1 - Memory daughter card, motherboard and chassis - Google Patents

Memory daughter card, motherboard and chassis Download PDF

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Publication number
WO2016192136A1
WO2016192136A1 PCT/CN2015/081718 CN2015081718W WO2016192136A1 WO 2016192136 A1 WO2016192136 A1 WO 2016192136A1 CN 2015081718 W CN2015081718 W CN 2015081718W WO 2016192136 A1 WO2016192136 A1 WO 2016192136A1
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Prior art keywords
memory
dimm
chassis
daughter card
disposed
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PCT/CN2015/081718
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French (fr)
Chinese (zh)
Inventor
王雪松
陈长发
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苏州中太服务器有限公司
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Publication of WO2016192136A1 publication Critical patent/WO2016192136A1/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements

Definitions

  • the present invention relates to the field of computer hardware, and in particular, to a memory daughter card, a motherboard, and a chassis.
  • CDIMM is a specially designed memory module, can not be inserted into the general DIMM memory socket, this kind of memory stick in addition to memory particles, also installed a MEMORY BUFFER chip) design.
  • the first two design methods can not effectively integrate a large number of memory modules on the board, occupying more board space.
  • the 2U server integrates more hard disks and PCIE expansion cards in the device space.
  • the third design method has high integration, but the memory cannot use general-purpose memory. It needs to be produced separately, and various specifications and goods are prepared in advance. The utilization rate is low, and because it is not universal, the production cost is high when the production test is dedicated.
  • the current design has low integration and poor versatility, and can not meet the requirements of 2U chassis (U is the height unit of the chassis, 1U is 4.445cm, 2U is 2 times of 1U is 8.89cm), high complexity, high integration.
  • the technical problem to be solved by the embodiments of the present invention is to provide a memory daughter card, a motherboard, and a chassis, so as to meet the requirements of high complexity, high integration, and high versatility in the 2U chassis.
  • the embodiment of the present invention provides a memory daughter card, which includes a substrate, a plurality of DIMM memory slots disposed on the substrate, and is disposed on the substrate and electrically connected to a portion of the DIMM memory slots. At least two BUFFER chips.
  • the BUFFER chip can also be called MEMORY BUFFER chip.
  • both ends of the same side edge of the substrate are provided with connectors respectively connected to the BUFFER chip of the corresponding end.
  • the DIMM memory slot is a surface mount DIMM strip socket.
  • the BUFFER chip and the DIMM memory slot are disposed on one or both sides of the substrate, and the BUFFER chip is disposed between one end and two ends of the DIMM memory slot or between the DIMM memory slots.
  • the DIMM memory slots are 4 to 16.
  • the embodiment of the present invention further provides a motherboard, which includes a board body and a memory daughter card as described above disposed on the board body.
  • the memory daughter card is mounted on the board through a connector.
  • an embodiment of the present invention further provides a chassis, wherein the chassis is a 2U chassis, and the motherboard is provided with the motherboard as described above.
  • the memory daughter card, the main board, and the chassis of the embodiment of the present invention are configured to provide at least two BUFFER chips electrically connected to the partially parallel DIMM memory slots on the substrate, thereby not only meeting the high complexity in the height range of the 2U chassis.
  • FIG. 1 is a schematic diagram showing the planar structure of a memory daughter card according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a connection structure of a motherboard according to an embodiment of the present invention.
  • the present invention is an embodiment that greatly reduces the POWER-based
  • the memory space in the device developed by the CPU platform increases the memory capacity under the same volume to save space to increase other functions of the device, such as more hard disks and PCIE expansion cards, which can save a hard disk expansion box and SAS.
  • a memory daughter card mainly includes a substrate and at least two BUFFER chips and a plurality of DIMM memory slots 5 disposed on the substrate.
  • two BUFFER chips (the BUFFER chip 3 and the BUFFER chip 4) are taken as an example for description.
  • a plurality of DIMM memory slots 5 are disposed in parallel on the same side of the substrate. In other embodiments, the plurality of DIMM memory slots 5 may also be disposed on different faces of the substrate.
  • the BUFFER chip 3 and the BUFFER chip 4 are disposed on the same surface of the substrate, are disposed on the TOP layer of the substrate, and are located at both ends of the DIMM memory slot 5, and are electrically connected to the partial DIMM memory slots 5, respectively.
  • the BUFFER chip 3 and the BUFFER chip 4 may be disposed on different sides of the substrate, and may be disposed between one end and two ends of the DIMM memory slot or between the DIMM memory slots 5.
  • the DIMM memory slot 5 is a surface-mounted DIMM strip socket, which does not cause a smaller wiring space on the board than the in-line DIMM socket, and satisfies the requirement of the memory strip.
  • the DIMM memory slot 5 has a length of 165 mm, which improves shock resistance and structural reliability with respect to the 163 mm DIMM memory slot 5.
  • the DIMM memory slots 5 are 4 to 16, and half of the DIMM memory slots 5 are electrically connected to half of the BUFFER chips. In this embodiment, the DIMM memory slots 5 are eight, and the adjacent four DIMM memory slots 5 are electrically connected to one BUFFER chip.
  • the signal on each BUFFER chip needs 107 pins.
  • the two BUFFER chips need a total of 214 pins.
  • the small power supply of the BUFFER chip requires 20 pins, for a total of 234 pins.
  • an additional guide pin or a connector with a positioning guide pin is used.
  • a connector of a BUFFER chip respectively connected to a corresponding end is provided at both ends of the same side edge of the substrate, wherein the BUFFER chip 3 is connected to the connector 1, and the BUFFER chip 4 is connected to the connector 2.
  • the BUFFER chip and/or the connector are symmetrically distributed at two ends of the DIMM memory slot, wherein the corresponding axis of symmetry is a straight line passing through the midpoint of the long side of the substrate, that is, two BUFFER chips or two
  • the connectors are symmetrically distributed with respect to a center line corresponding to the long side of the substrate, or both BUFFER chips and the two connectors are distributed symmetrically with respect to a center line corresponding to the long side of the substrate.
  • the number of stitches of the connector may be selected according to requirements, such as 50 pins, 60 pins, etc., preferably, the connector is a 85 ⁇ differential impedance with a guide pin, and a connector with a maximum signal rate of 25.0 Gbps (preferably Shi company corresponding model connector).
  • an embodiment of the present invention further provides a motherboard, which includes a board body and a memory daughter card as described above disposed on the board body.
  • two BUFFER chips CENTAUR1 and CENTAUR2
  • CENTAUR1 and CENTAUR2 can convert the CPU's DMI bus interface into a standard memory DDR interface;
  • the BUFFER chip and the DIMM memory slot 5 are connected through the internal wiring of the PCB;
  • each BUFFER chip has four DIMM strips under it, and
  • CENTAUR1 has DIMM0-A, DIMM0-B, DIMM0-C and DIMM0-D
  • CENTAUR2 DIMM1-A, DIMM1-B, DIMM1-C, and DIMM1-D are attached.
  • the CENTAUR is not directly connected to the DMI bus interface of the CPU through the connector.
  • the memory daughter card is installed through the connector 1 and the connector 2 On the board body, the board body is provided with a connector structure matched with the connector with the 85 ⁇ differential impedance of the guide pin and the maximum signal rate of 25.0 Gbps.
  • the embodiment of the invention further provides a chassis, wherein the chassis is a 2U chassis, and the motherboard is provided with the motherboard as described above.
  • the chassis is a server chassis; for the entire server, there is only one of the motherboards, and the others are daughter cards, so the memory card is referred to as a memory daughter card in the specification of the present invention.
  • the embodiment of the invention completes the design of the double BUFFER chip and the eight DIMM strips in a limited space, and the height is required to meet the requirements of the 2U chassis, and the length is the shortest and the thickness is the thinnest.
  • the overall design of the inside card and PCB The layout design can meet the above requirements.
  • the embodiment of the invention can make a 2-way POWER CPU (typically like POWER8)
  • the motherboard of the CPU or CP1H based on CPU8 CPU can be installed in a 2U chassis, providing a larger amount of memory (such as 32 DIMM sockets), and ensuring that the chassis still has space to install a sufficient number of hard disks (for example, 12 3.5inch hard drives or 24 2.5inch hard drives) and enough fans (ensure that all hard drives, all CPUs, all memory, and all PCI-E slots are fully populated with PCI-E cards)
  • the stocking pressure is small, the capital utilization is high, and the product reliability is strong.

Abstract

A memory daughter card, motherboard and chassis, the memory daughter card comprising a base board, a plurality of DIMM memory slots (5) disposed on the base board, and at least two buffer chips (3, 4) respectively in electrical connection with part of the DIMM memory slot and disposed on the base board. Thereby, the demands of high complexity, high density and high capacity can be met within the height range of a 2U chassis, and an existing DIMM module on the market can be flexibly modified. The memory capacity of the system can be changed at any time, achieving low stocking pressures, high capital utilization and high product reliability.

Description

内存子卡、主板及机箱Memory daughter card, motherboard and chassis 技术领域Technical field
本发明涉及计算机硬件领域，尤其涉及一种内存子卡、主板及机箱。  The present invention relates to the field of computer hardware, and in particular, to a memory daughter card, a motherboard, and a chassis.
背景技术Background technique
目前基于POWER CPU的计算机主板的的内存有三种设计方式：There are currently three ways to design memory for a POWER CPU-based computer motherboard:
1、内存子卡的设计：通过在计算机主板上设置连接器，并在计算机主板的连接器上插入设计的内存子卡，在内存子卡上设置可用于安装内存条的DIMM插座。所述插座通过单个MEMORY BUFFER芯片与计算机主板的连接器相连。1. Design of the memory daughter card: By setting the connector on the computer motherboard and inserting the designed memory daughter card on the connector of the computer motherboard, a DIMM socket for installing the memory module is set on the memory daughter card. The socket passes through a single MEMORY The BUFFER chip is connected to the connector of the computer motherboard.
2、在计算机主板上直接设置DIMM插座的设计。2. Set the design of the DIMM socket directly on the computer motherboard.
3、采用CDIMM（CDIMM为一种专门设计的内存条，不能插入通用的DIMM内存插座，该种内存条上除内存颗粒外，还安装了一个MEMORY BUFFER芯片）的设计。3, using CDIMM (CDIMM is a specially designed memory module, can not be inserted into the general DIMM memory socket, this kind of memory stick in addition to memory particles, also installed a MEMORY BUFFER chip) design.
然而，前两种设计方式不能有效地高度集成板上大量的内存模块，占用了较多的板上空间，为保证足够的内存数量（比如在2路服务器安装32个DIMM插座），就无法在2U服务器的的设备空间内集成更多的硬盘、PCIE扩展卡等；第三种设计方式虽然集成度较高，但内存不能采用通用内存，需要单独生产，提前备齐各种规格的货、资金利用率低，由于不通用，生产测试时专用造成生产成本高。However, the first two design methods can not effectively integrate a large number of memory modules on the board, occupying more board space. To ensure sufficient memory (for example, installing 32 DIMM sockets on a 2-way server), The 2U server integrates more hard disks and PCIE expansion cards in the device space. The third design method has high integration, but the memory cannot use general-purpose memory. It needs to be produced separately, and various specifications and goods are prepared in advance. The utilization rate is low, and because it is not universal, the production cost is high when the production test is dedicated.
目前的设计存在集成度低，通用性差，不能满足2U机箱(U为机箱的高度单位，1U为4.445cm，2U则是1U的2倍为8.89cm)中高复杂度、高集成度的需求。The current design has low integration and poor versatility, and can not meet the requirements of 2U chassis (U is the height unit of the chassis, 1U is 4.445cm, 2U is 2 times of 1U is 8.89cm), high complexity, high integration.
技术问题technical problem
本发明实施例所要解决的技术问题在于，提供一种内存子卡、主板及机箱，以能满足2U机箱中高复杂度、高集成度及高通用性的需求。The technical problem to be solved by the embodiments of the present invention is to provide a memory daughter card, a motherboard, and a chassis, so as to meet the requirements of high complexity, high integration, and high versatility in the 2U chassis.
技术解决方案Technical solution
为了解决上述技术问题，本发明实施例提出了一种内存子卡，包括基板、设于基板上的多个DIMM内存插槽，及设置于所述基板上并分别与部分DIMM内存插槽电连接的至少两个BUFFER芯片。所述BUFFER芯片也可称为MEMORY BUFFER芯片。In order to solve the above technical problem, the embodiment of the present invention provides a memory daughter card, which includes a substrate, a plurality of DIMM memory slots disposed on the substrate, and is disposed on the substrate and electrically connected to a portion of the DIMM memory slots. At least two BUFFER chips. The BUFFER chip can also be called MEMORY BUFFER chip.
作为本发明实施例的进一步改进，基板的同一侧缘的两端设有分别连接于对应端的BUFFER芯片的连接器。As a further improvement of the embodiment of the present invention, both ends of the same side edge of the substrate are provided with connectors respectively connected to the BUFFER chip of the corresponding end.
作为本发明实施例的进一步改进， 所述DIMM内存插槽为表贴式安装的DIMM条插座。As a further improvement of the embodiment of the present invention, the DIMM memory slot is a surface mount DIMM strip socket.
作为本发明实施例的进一步改进， 所述BUFFER芯片和所述DIMM内存插槽设于基板的一面或两面，且所述BUFFER芯片对应设于所述DIMM内存插槽的一端、两端或所述DIMM内存插槽之间。As a further improvement of the embodiment of the present invention, The BUFFER chip and the DIMM memory slot are disposed on one or both sides of the substrate, and the BUFFER chip is disposed between one end and two ends of the DIMM memory slot or between the DIMM memory slots.
作为本发明实施例的进一步改进， 所述DIMM内存插槽为4个至16个。As a further improvement of the embodiment of the present invention, the DIMM memory slots are 4 to 16.
此外，本发明实施例还提出了一种主板，所述主板包括板体及设于板体上的如上所述的内存子卡。In addition, the embodiment of the present invention further provides a motherboard, which includes a board body and a memory daughter card as described above disposed on the board body.
进一步地，所述内存子卡通过连接器安装于板体上。Further, the memory daughter card is mounted on the board through a connector.
另外，本发明实施例还提出了一种机箱，所述机箱为2U机箱，机箱内设有如上所述的主板。In addition, an embodiment of the present invention further provides a chassis, wherein the chassis is a 2U chassis, and the motherboard is provided with the motherboard as described above.
有益效果Beneficial effect
本发明实施例的内存子卡、主板及机箱，通过在基板上设置分别与部分并行的DIMM内存插槽电连接的至少两个BUFFER芯片，从而不仅能够在2U机箱的高度范围内满足对于高复杂度、高密度及高容量的需求，且能够灵活更换市场上现有的DIMM条，随时更改系统内存容量，备货压力较小、资金利用高，产品可靠性强。The memory daughter card, the main board, and the chassis of the embodiment of the present invention are configured to provide at least two BUFFER chips electrically connected to the partially parallel DIMM memory slots on the substrate, thereby not only meeting the high complexity in the height range of the 2U chassis. The demand for degree, high density and high capacity, and the ability to flexibly replace the existing DIMM strips on the market, changing the system memory capacity at any time, with low stocking pressure, high capital utilization, and high product reliability.
附图说明DRAWINGS
图1是本发明实施例的内存子卡的平面结构示意图。FIG. 1 is a schematic diagram showing the planar structure of a memory daughter card according to an embodiment of the present invention.
图2是本发明实施例的主板的连接结构示意图。FIG. 2 is a schematic diagram of a connection structure of a motherboard according to an embodiment of the present invention.
本发明的实施方式Embodiments of the invention
下面结合附图，对本发明实施例进行详细说明。The embodiments of the present invention are described in detail below with reference to the accompanying drawings.
本发明是实施例大大减小了基于POWER CPU平台所开发的设备中内存的空间，提高同体积下内存的容量，以节约出空间来增加设备的其他功能，例如更多的硬盘、PCIE扩展卡，这样可以节省出一个硬盘扩展箱、SAS Switch；使用双BUFFER芯片的高密度内存子卡设计，能够丰富设备的接口，扩展存储容量，使得设备的功能更加多样化。The present invention is an embodiment that greatly reduces the POWER-based The memory space in the device developed by the CPU platform increases the memory capacity under the same volume to save space to increase other functions of the device, such as more hard disks and PCIE expansion cards, which can save a hard disk expansion box and SAS. Switch; high-density memory daughter card design using dual BUFFER chips, which can enrich the interface of the device and expand the storage capacity, making the device more diverse.
请参照图1，本发明实施例的内存子卡主要包括基板及设置于基板上的至少两个BUFFER芯片及多个DIMM内存插槽5。本发明实施例以两个BUFFER芯片(BUFFER芯片3和BUFFER芯片4)为例进行说明。Referring to FIG. 1 , a memory daughter card according to an embodiment of the invention mainly includes a substrate and at least two BUFFER chips and a plurality of DIMM memory slots 5 disposed on the substrate. In the embodiment of the present invention, two BUFFER chips (the BUFFER chip 3 and the BUFFER chip 4) are taken as an example for description.
本发明实施例中，多个DIMM内存插槽5并行设于基板同一面上。在其他实施方式中，所述多个DIMM内存插槽5也可设于基板的不同面上。In the embodiment of the present invention, a plurality of DIMM memory slots 5 are disposed in parallel on the same side of the substrate. In other embodiments, the plurality of DIMM memory slots 5 may also be disposed on different faces of the substrate.
BUFFER芯片3和BUFFER芯片4设于基板的所述同一面上，设置于所述基板的TOP层且位于DIMM内存插槽5的两端，并分别与部分DIMM内存插槽5电连接。其他实施方式中，所述BUFFER芯片3和BUFFER芯片4也可设于基板的不同面上，还可设于所述DIMM内存插槽的一端、两端或所述DIMM内存插槽5之间。The BUFFER chip 3 and the BUFFER chip 4 are disposed on the same surface of the substrate, are disposed on the TOP layer of the substrate, and are located at both ends of the DIMM memory slot 5, and are electrically connected to the partial DIMM memory slots 5, respectively. In other embodiments, the BUFFER chip 3 and the BUFFER chip 4 may be disposed on different sides of the substrate, and may be disposed between one end and two ends of the DIMM memory slot or between the DIMM memory slots 5.
优选地，所述DIMM内存插槽5为表贴式安装的DIMM条插座，相对于直插的DIMM插座，不会导致板上布线空间变小，满足了内存条出线要求。优选地，所述DIMM内存插槽5长度为165毫米，相对于163毫米的DIMM内存插槽5，提高了抗震性和结构可靠性。所述DIMM内存插槽5为4个至16个，一半的DIMM内存插槽5分别与一半的BUFFER芯片匹配电连接。本实施方式中，所述DIMM内存插槽5为8个，相邻的4个DIMM内存插槽5电连接于1个BUFFER芯片。Preferably, the DIMM memory slot 5 is a surface-mounted DIMM strip socket, which does not cause a smaller wiring space on the board than the in-line DIMM socket, and satisfies the requirement of the memory strip. Preferably, the DIMM memory slot 5 has a length of 165 mm, which improves shock resistance and structural reliability with respect to the 163 mm DIMM memory slot 5. The DIMM memory slots 5 are 4 to 16, and half of the DIMM memory slots 5 are electrically connected to half of the BUFFER chips. In this embodiment, the DIMM memory slots 5 are eight, and the adjacent four DIMM memory slots 5 are electrically connected to one BUFFER chip.
具体地，作为一种实施方式，1) 每一个BUFFER芯片上的信号需要107pin，两个BUFFER芯片共计需要信号pin214根，此外BUFFER芯片的小电源需要20pin，共计234pin；2) 由于内存子卡与主板之间为垂直拔插，且没有导轨帮助定位导向，额外配备有导向销或者使用带定位导向销的连接器。Specifically, as an embodiment, 1) The signal on each BUFFER chip needs 107 pins. The two BUFFER chips need a total of 214 pins. In addition, the small power supply of the BUFFER chip requires 20 pins, for a total of 234 pins. 2) Since the memory daughter card is vertically inserted and unplugged from the main board, and there is no guide rail to help position the guide, an additional guide pin or a connector with a positioning guide pin is used.
作为一种实施方式，基板的同一侧缘的两端设有分别连接于对应端的BUFFER芯片的连接器，其中，BUFFER芯片3连接于连接器1，BUFFER芯片4连接于连接器2。优选地，所述BUFFER芯片和/或连接器轴对称地分布于DIMM内存插槽的两端，其中，对应的对称轴为通过基板的长边中点的直线，也即两个BUFFER芯片或者两个连接器相对于基板长边对应的中心线呈对称性分布，或者，两个BUFFER芯片和两个连接器都分布相对于基板长边对应的中心线呈对称性分布。所述连接器的针数可以根据需要选择50针、60针等不同针数，优选地，所述连接器为带导向销的85Ω差分阻抗、最大信号速率为25.0Gbps的连接器（优选选择莫仕公司对应型号连接器）。As an embodiment, a connector of a BUFFER chip respectively connected to a corresponding end is provided at both ends of the same side edge of the substrate, wherein the BUFFER chip 3 is connected to the connector 1, and the BUFFER chip 4 is connected to the connector 2. Preferably, the BUFFER chip and/or the connector are symmetrically distributed at two ends of the DIMM memory slot, wherein the corresponding axis of symmetry is a straight line passing through the midpoint of the long side of the substrate, that is, two BUFFER chips or two The connectors are symmetrically distributed with respect to a center line corresponding to the long side of the substrate, or both BUFFER chips and the two connectors are distributed symmetrically with respect to a center line corresponding to the long side of the substrate. The number of stitches of the connector may be selected according to requirements, such as 50 pins, 60 pins, etc., preferably, the connector is a 85Ω differential impedance with a guide pin, and a connector with a maximum signal rate of 25.0 Gbps (preferably Shi company corresponding model connector).
请参照图2，本发明实施例还提供了一种主板，所述主板包括板体及设于板体上的如上所述的内存子卡。其中，两个BUFFER芯片即CENTAUR1和CENTAUR2，可将CPU的DMI总线接口转换为标准的内存DDR接口； BUFFER芯片与DIMM内存插槽5之间通过PCB内部走线相连接；每个BUFFER芯片下挂4个DIMM条，CENTAUR1下挂有DIMM0-A、DIMM0-B、DIMM0-C和DIMM0-D，CENTAUR2下挂有DIMM1-A、DIMM1-B、DIMM1-C和DIMM1-D。Referring to FIG. 2, an embodiment of the present invention further provides a motherboard, which includes a board body and a memory daughter card as described above disposed on the board body. Among them, two BUFFER chips, CENTAUR1 and CENTAUR2, can convert the CPU's DMI bus interface into a standard memory DDR interface; The BUFFER chip and the DIMM memory slot 5 are connected through the internal wiring of the PCB; each BUFFER chip has four DIMM strips under it, and CENTAUR1 has DIMM0-A, DIMM0-B, DIMM0-C and DIMM0-D, CENTAUR2 DIMM1-A, DIMM1-B, DIMM1-C, and DIMM1-D are attached.
作为一种实施方式，CENTAUR不通过连接器直接与CPU的DMI总线接口相连，作为另一种实施方式，与上述实施方式不同的是，所述内存子卡通过连接器1和连接器2安装于板体上，板体上设有与所述带导向销的85Ω差分阻抗、最大信号速率为25.0Gbps的连接器相匹配连接的连接器结构。As an embodiment, the CENTAUR is not directly connected to the DMI bus interface of the CPU through the connector. As another implementation manner, unlike the above embodiment, the memory daughter card is installed through the connector 1 and the connector 2 On the board body, the board body is provided with a connector structure matched with the connector with the 85Ω differential impedance of the guide pin and the maximum signal rate of 25.0 Gbps.
本发明实施例还提供了一种机箱，所述机箱为2U机箱，机箱内设有如上所述的主板。优选地，所述机箱为服务器机箱；对于整个服务器而言，只有一块所述主板，其它的都是子卡，因此本发明说明书中将内存卡称作内存子卡。The embodiment of the invention further provides a chassis, wherein the chassis is a 2U chassis, and the motherboard is provided with the motherboard as described above. Preferably, the chassis is a server chassis; for the entire server, there is only one of the motherboards, and the others are daughter cards, so the memory card is referred to as a memory daughter card in the specification of the present invention.
本发明实施例在有限的空间内完成双BUFFER芯片以及挂八个DIMM条的设计，既要做到高度满足2U机箱的要求，又要做到长度最短，厚度最薄。同时要满足高速信号完整性的要求以及散热要求，内侧卡的整体设计以及PCB layout设计都能满足上述要求。本发明实施例可以使采用2路POWER CPU（典型的如POWER8 CPU或基于POWER8CPU开发的中国产的CPU与CP1H）的主板可以安装在2U的机箱内，提供较多数量的内存（如32个DIMM插座），并保证机箱仍有空间可以安装足够数量的硬盘（比如12个3.5inch的硬盘或24个2.5inch的硬盘）以及足够的风扇（确保在安装全部硬盘，以及全部CPU、全部的内存、全部的PCI-E插槽均插满PCI-E卡的情况下仍可以有足够的散热能力以确保服务器可以连续不断的工作）以保证2U服务器的性能与配置；并且在这种情况下，能够灵活使用市场上现有的DIMM内存条，随时更改系统内存容量，备货压力较小、资金利用高，产品可靠性强。 The embodiment of the invention completes the design of the double BUFFER chip and the eight DIMM strips in a limited space, and the height is required to meet the requirements of the 2U chassis, and the length is the shortest and the thickness is the thinnest. At the same time to meet the requirements of high-speed signal integrity and thermal requirements, the overall design of the inside card and PCB The layout design can meet the above requirements. The embodiment of the invention can make a 2-way POWER CPU (typically like POWER8) The motherboard of the CPU or CP1H based on CPU8 CPU can be installed in a 2U chassis, providing a larger amount of memory (such as 32 DIMM sockets), and ensuring that the chassis still has space to install a sufficient number of hard disks ( For example, 12 3.5inch hard drives or 24 2.5inch hard drives) and enough fans (ensure that all hard drives, all CPUs, all memory, and all PCI-E slots are fully populated with PCI-E cards) There is still enough cooling capacity to ensure that the server can work continuously to ensure the performance and configuration of the 2U server; and in this case, the existing DIMM memory on the market can be flexibly used to change the system memory capacity at any time. The stocking pressure is small, the capital utilization is high, and the product reliability is strong.
以上所述是本发明的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。The above is a specific embodiment of the present invention, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present invention. These improvements and retouchings are also considered. It is the scope of protection of the present invention.

Claims (8)

  1. 一种内存子卡，其特征在于，所述内存子卡包括基板、设于基板上的多个DIMM内存插槽，及设置于所述基板上并分别与部分DIMM内存插槽电连接的至少两个BUFFER芯片。A memory daughter card, comprising: a substrate; a plurality of DIMM memory slots disposed on the substrate; and at least two disposed on the substrate and electrically connected to the partial DIMM memory slots respectively BUFFER chips.
  2. 如权利要求1所述的内存子卡，其特征在于，基板的同一侧缘的两端设有分别连接于对应端的BUFFER芯片的连接器。The memory daughter card according to claim 1, wherein both ends of the same side edge of the substrate are provided with connectors respectively connected to the BUFFER chip of the corresponding end.
  3. 如权利要求1所述的内存子卡，其特征在于，所述DIMM内存插槽为表贴式安装的DIMM条插座。The memory daughter card of claim 1 wherein said DIMM memory slot is a surface mount DIMM strip socket.
  4. 如权利要求1所述的内存子卡，其特征在于，所述BUFFER芯片和所述DIMM内存插槽设于基板的一面或两面，且所述BUFFER芯片对应设于所述DIMM内存插槽的一端、两端或所述DIMM内存插槽之间。The memory card according to claim 1, wherein the BUFFER chip and the DIMM memory slot are disposed on one or both sides of the substrate, and the BUFFER chip is disposed at one end of the DIMM memory slot. , between the ends or between the DIMM memory slots.
  5. 如权利要求1所述的内存子卡，其特征在于，所述DIMM内存插槽为4个至16个。The memory daughter card of claim 1 wherein said DIMM memory slots are from 4 to 16.
  6. 一种主板，其特征在于，所述主板包括板体及设于板体上的如权利要求1至5中任一项所述的内存子卡。 A main board, comprising: a board body; and the memory subcard according to any one of claims 1 to 5, which is disposed on the board body.
  7. 如权利要求6所述的主板，其特征在于，所述内存子卡通过连接器安装于板体上。 The motherboard of claim 6, wherein the memory daughter card is mounted to the board by a connector.
  8. 一种机箱，其特征在于，所述机箱为2U机箱，机箱内设有如权利要求6所述的主板。  A chassis is characterized in that the chassis is a 2U chassis, and the motherboard according to claim 6 is provided in the chassis.
PCT/CN2015/081718 2015-05-29 2015-06-17 Memory daughter card, motherboard and chassis WO2016192136A1 (en)

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CN114442753B (en) * 2021-12-24 2023-06-23 苏州浪潮智能科技有限公司 Unified inserting mechanism for pseudo memory of server

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