WO2016188109A1 - 一种光学处理装置及终端 - Google Patents

一种光学处理装置及终端 Download PDF

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Publication number
WO2016188109A1
WO2016188109A1 PCT/CN2015/099503 CN2015099503W WO2016188109A1 WO 2016188109 A1 WO2016188109 A1 WO 2016188109A1 CN 2015099503 W CN2015099503 W CN 2015099503W WO 2016188109 A1 WO2016188109 A1 WO 2016188109A1
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Prior art keywords
optical
component
optical processing
beam splitting
processing apparatus
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PCT/CN2015/099503
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English (en)
French (fr)
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陈辉
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中兴通讯股份有限公司
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Publication of WO2016188109A1 publication Critical patent/WO2016188109A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/48—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus
    • G03B17/54—Details of cameras or camera bodies; Accessories therefor adapted for combination with other photographic or optical apparatus with projector
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details

Definitions

  • This application relates to, but is not limited to, the field of optics of smart terminals.
  • the hardware structure size of various functional modules has higher and higher requirements.
  • the camera function and projection function are currently integrated into the device or terminal as two independent modules. As the size of the terminal is reduced, the camera module and the projection module are combined into one module, and the structure size is further reduced. Certain difficulties are due to the following reasons:
  • the camera module and the micro projection module have two independent optical modules, each having its own optical path.
  • the sensor chip of the camera module is a device that receives light
  • the projection chip of the projection module is a light-emitting device. Combining the two in one optical module creates a conflict between light reception and light emission.
  • Embodiments of the present invention provide an optical processing apparatus and a terminal, which can simply integrate an incident optical module and an outgoing optical module into one device, and reduce the volume of the optical module or the terminal.
  • the embodiment provides an optical processing apparatus including a lens group and a light receiving component.
  • the optical processing apparatus further includes an optical emitting component and a beam splitting component, wherein the optical emitting component, the beam splitting component, and the lens group are sequentially arranged along the same optical axis.
  • the light receiving component is located on a focal plane within a focal length of one lens group of the beam splitting assembly.
  • connection between the light receiving component and the beam splitting component is perpendicular to the optical axis.
  • the beam splitting component receives external incident light from the lens group, refracts the external incident light to an angle and transmits the light to the light receiving component; or receives the emitted light of the optical emitting component and emits the light.
  • the optical emitting component is a digital light processing DLP projection component
  • the beam splitting component is a beam splitting prism
  • the optical processing device further includes a heat sink, the heat sink is adhered to a sidewall of the DLP projection assembly by a heat conductive material.
  • the beam splitting assembly comprises two right angle prisms, and the two right angle prism glues are combined into a beam splitting prism.
  • the beam splitting prism comprises a plated oxide dielectric film on the slope of the two right angle prisms.
  • the plated oxide dielectric film is a titanium dioxide film.
  • the light receiving component is a charge coupled device CCD chip or a complementary metal oxide semiconductor CMOS chip.
  • This embodiment also discloses a terminal, which includes the above optical processing device.
  • the embodiment of the invention provides an optical processing device and a terminal; the optical processing device only needs to design a set of lenses, so that when the different functions are turned on, the two incident light beams required for photographing and the two diffracted rays required for projection are realized.
  • the function can also achieve a certain degree of miniaturization in terms of structural size, and at the same time, the cost reduction is also greatly improved.
  • a transflective prism is used as a beam splitting component in the optical path, which is fixed in the entire optical path without mechanical movement or rotation, thereby reducing the structural size and avoiding the operational complexity and reliability caused by the mechanical structure. And other issues.
  • FIG 1 is an overall structural view of an optical processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional structural view of an optical processing apparatus according to an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of an optical path of a first function (a photographing function is taken as an example) of an optical processing apparatus according to an embodiment of the present invention
  • FIG. 4 is a schematic diagram of a second function (projection function) optical path of an optical processing apparatus according to an embodiment of the present invention.
  • an optical processing device is provided in the embodiment of the present invention.
  • the front end of the optical processing device is provided with a lens 101.
  • the first optical function the camera function is an example
  • the external incident light is concentrated.
  • the second optical function the projection function is taken as an example
  • the emitted light emitted from the internal components of the optical second functional module is diverged through the lens 101.
  • the lens 101 adopts a zoom lens
  • the optical processing device further includes a focus wheel 102.
  • the focus wheel 102 is closely attached to the lens of the zoom lens 101 and the lens 101, and the focus wheel 102 and the zoom lens 101 are combined.
  • Lens group By adjusting the focus wheel 102, the position of the lens inside the lens 101 can be changed, so that the optical focal length of the lens 101 can be changed to achieve the effect of making the optical first function or the optical second function appear clear.
  • the lens group can be replaced with a fixed focus lens.
  • the first optical function module is a camera module
  • the second optical function module is a projection module.
  • the projection module is completed by the optical emitting component 105.
  • it may be a digital light processing DLP projection component.
  • the optical processing device further includes a light splitting device 106, wherein the optical emitting component 105, the light splitting device 106 and the lens 101 are along The same optical axis is sequentially arranged, the light receiving component 107 is located at one side of the optical axis, and the external incident light received by the lens 101 passes through the beam splitting component 106 to the light receiving component 107, or receives through the The optical emitting component 105 of the beam splitting assembly 106 emits light and emits it.
  • connection between the light receiving component 107 and the beam splitting component 106 is perpendicular to the optical axis.
  • the camera module and the projection module share a single lens, which plays a very important role in miniaturization of the optical processing device.
  • the optical processing device further includes a heat sink 103, an optical emitting component 105 and a dispersion
  • the heat chip 103 is connected, and the light source inside the optical emitting component 105 is a Light Emitting Diode (LED) light source or a laser light source.
  • LED Light Emitting Diode
  • the DLP projection component When the projection module is in operation, the DLP projection component generates a large amount of heat, and the heat sink 103 will project the projection module. The heat generated during work is dissipated.
  • the optical processing device further includes a Flexible Printed Circuit (FPC) and a connector 104.
  • the optical processing device is connected to the intelligent terminal board through the connector 104 to provide power to the module and exchange data. information.
  • FPC Flexible Printed Circuit
  • FIG. 2 is a cross-sectional structural view of an optical processing apparatus according to an embodiment of the present invention, the internal structure of which can be divided into:
  • the front end of the optical processing device includes an optical zoom lens 101.
  • the optical zoom lens 101 is composed of a lens group.
  • the optical processing device front end may further include a focusing device 102 for changing the distance of the lens optical center to the plane of the film, or the focal length of the projection.
  • the projection module portion of the optical emission component 105 (in this embodiment, the optical emission component 105 is a DLP projection component), the projection function application is turned on, and the optical emission component 105 presses the RGB light according to different angles or video data.
  • the sinks are combined and emitted; when the optical transmitting component 105 is in operation, the heat generated by itself is large, and the heat sink 103 is adhered to the sidewall of the projection component through the thermal conductive adhesive, so that the heat dissipation can be achieved.
  • the light receiving component 107 may employ a photosensitive chip, a charge coupled device CCD chip or a complementary metal oxide semiconductor CMOS chip, which is located on one side of the optical axis, on a focal plane within the focal length of the lens.
  • the light receiving component 107 is like a visual nerve of a human eye in a photographing imaging system, can receive an externally transmitted optical signal, and converts the optical signal into an electrical signal transmission to perform image information data processing in the background.
  • the beam splitting assembly 106 can employ a transflective prism.
  • the beam splitting assembly 106 is glued from two right-angle prisms, for example, to form a cube.
  • the metal or metal oxide is ionized by an optical coating process such as vacuum magnetron sputtering, and a nano-scale oxide dielectric film is plated, and the entire film layer is evenly distributed. 45° slope on a right angle prism.
  • the film layer contains a precious metal film with high reflection properties (such as Titanium dioxide film with enhanced transmission properties such as chromium, titanium, platinum, etc. (different requirements for the mold system are adjusted accordingly).
  • the resulting beam splitting assembly 106 having an optical transflective property, that is, a transflective prism.
  • a mirror effect is formed without a backlight inside the module, and is used as a mirror. Since the incident light is at 45° to the inclined surface of the transflective prism 106, the incident light to the prism and the outgoing light are reflected at exactly 90°, and in the case of a backlight inside the module, the translucent and semi-reverse splitting is possible.
  • the prism 106 emits light in a straight line direction. Therefore, the transflective prism 106 can perform a 90° splitting effect in the entire optical path.
  • the optical zoom lens 101, the transflective prism 106, and the DLP projection assembly 105 are sequentially arranged along the same optical axis from front to back, and the light receiving component 107 and the beam splitting component 106 are located on the same plane and are located in the same plane.
  • the optical axis is perpendicular to the direction.
  • the light receiving component 107 is a CCD/CMOS light receiving component, located above the transflective prism 106, and the DLP projection component 105. Place in a 90° direction.
  • the component distance dimension of each component depends on the product specifications of the different optical zoom lens, DLP projection component, and CCD/CMOS light receiving component.
  • the basic parameters depend on the back focal length of the optical zoom lens, that is, the CCD/CMOS light receiving component needs to be placed on any focal plane within the focal length of the optical zoom lens, and the distance between the DLP projection component and the optical zoom lens needs to be guaranteed at the focal length.
  • the focal length of the optical zoom lens is 5-20 mm
  • the distance between the CCD/CMOS light receiving component and the lens should be controlled between 5 and 20 mm
  • the optical path distance between the DLP projection component and the lens needs to be controlled.
  • Position within 5 to 20 mm In this way, by adjusting the zoom lens, the CCD/CMOS light receiving component can be controlled at the focal plane of the lens, and the DLP projection component can be controlled to be within the focal length.
  • the two implement their respective functions according to different imaging principles.
  • the center of the module uses a transflective prism as the hub of the single-lens group optical path, splitting the optical path, and dividing the optical path of one lens into two optical paths.
  • the rear end of the module, the CCD/CMOS light receiving component and the DLP projection component are placed at 90° at the rear and upper ends of the transflective prism, respectively.
  • the DLP projection component at another position inside the module utilizes the light emitted by the DMD (Digital Micromirror Device) wafer, and transmits the light through the transmission performance of the transflective prism.
  • the optical lens group diverges and projects the image On the curtain.
  • FIG. 3 is a schematic diagram of an optical principle of a module photographing function according to an embodiment of the present invention.
  • the projected portion does not operate, that is, the DLP projection assembly 105 is in a closed state, which does not generate a backlight inside the module.
  • the light of the external scene is concentrated by the optical zoom lens 101 having the convexity property, and enters the inside of the device.
  • the light enters the transflective prism 106 the light incident horizontally is perpendicular to the horizontal light.
  • the direction of the axis, reflected upwards, and the light is captured by the CCD/CMOS light receiving component 107 placed above the transflective prism 106, converting the optical information into electrical signals for transmission to the background for image processing. Thereby achieving the entire function of camera photo imaging.
  • Figure 4 is a schematic diagram of the optical principle of the entire module projection function.
  • the light of the internal light source of the DLP projection component 105 is reflected by the DMD wafer inside the DLP projection component, that is, the projected light is emitted outward, and the light is linearly transmitted out of the beam splitting component 106 along the main optical axis direction, and then passes through the optical zoom lens 101. The light is diverged and projected onto the curtain or wall to image.
  • the DLP projection assembly 105 When using the projection function, the DLP projection assembly 105 produces a high-brightness backlight and reflects RGB mixed light with image information through the internal DMD wafer. Since the illuminance of the light outside the whole device is relatively low, the light emitted by the DLP projection component 105 can pass through the transflective prism 106 directly, and can directly pass through the optical axis of the main optical axis, and then pass through the optical zoom lens at the front end of the module. 101 diverges and the light is projected onto the curtain or front to form a clear image.
  • the embodiment of the invention provides an optical processing device and a terminal; the optical processing device only needs to design a set of lenses, so that when the different functions are turned on, the two incident light beams required for photographing and the two diffracted rays required for projection are realized.
  • the function can also achieve a certain degree of miniaturization in terms of structural size, and at the same time, the cost reduction is also greatly improved.
  • a transflective prism is used as a beam splitting component in the optical path, which is fixed in the entire optical path without mechanical movement or rotation, and reduces the structural size and avoids the complicated and reliable operation caused by the mechanical structure. Sex and other issues. Therefore, changing the optical path of the optical structure from the optical structure and combining them into a single optical module with dual functions can not only reduce the material cost, but also achieve the best miniaturization effect by reducing the overall structure. .

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Abstract

一种光学处理装置及终端，该光学处理装置包括透镜组和光接收组件（107），光学处理装置还包括光学发射组件（105）和分光组件（106），其中光学发射组件（105）、分光组件（106）和透镜组沿同一光轴依次排列，光接收组件（107）位于分光组件（106）的一侧透镜组焦距范围内的焦平面上。还提供了一终端包括上述光学处理装置。

Description

一种光学处理装置及终端 技术领域
本申请涉及但不限于智能终端的光学领域。
背景技术
对于智能手机这种便携性移动终端来说，各种功能模块的硬件结构尺寸有越来越高的要求。拍照功能、投影功能目前是作为两个独立的模块集成在设备或终端，随着终端尺寸减小的需求，拍照模块和投影模块想要合并成为一个模块，实现在结构尺寸上也进一步缩减，存在一定的困难，原因如下：
对摄像头模块、微型投影模块作为两个独立的光学器件模块，分别拥有各自的光路。相机模块的感光芯片是接收光线的器件，而投影模块的投影芯片为发光器件。让二者合并在一个光学模块中，会产生光线接收和光线发射的冲突。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本发明实施例提供一种光学处理装置及终端，能够简单地实现将入射光学模块及出射光学模块集成在一个装置中，减小光学模块或终端的体积。
本实施例提供一种光学处理装置，包括透镜组和光接收组件，所述光学处理装置还包括光学发射组件和分光组件，其中所述光学发射组件、分光组件和透镜组沿同一光轴依次排列，所述光接收组件位于所述分光组件的一侧透镜组焦距范围内的焦平面上。
可选地，所述光接收组件和所述分光组件的连线同所述光轴垂直。
可选地，所述分光组件接收来自透镜组的外部入射光线，将所述外部入射光线折射一角度后发送给所述光接收组件；或者，接收光学发射组件的发射光线并发射出去。
可选地，所述光学发射组件为数字光处理DLP投影组件，所述分光组件为分光棱镜。
可选地，所述光学处理装置还包括散热片，所述散热片通过导热材料与DLP投影组件的一侧壁粘连。
可选地，所述分光组件包括两个直角棱镜，所述两个直角棱镜胶合成一分光棱镜。
可选地，所述分光棱镜在两个直角棱镜胶合的斜面包括镀制氧化物介质膜。
可选地，所述镀制氧化物介质膜为二氧化钛膜。
可选地，所述光接收组件为电荷耦合元件CCD芯片或者互补金属氧化物半导体CMOS芯片。
本实施例还公开一种终端，所述终端包括上述光学处理装置。
本发明实施例提供了一种光学处理装置及终端；光学处理装置内部只需设计一组镜头，即可分别在不同功能开启时，实现拍照所需入射汇聚光线和投影所需发射发散光线的两种功能，在结构尺寸方面也能够实现一定程度的微型化，同时对于成本的降低也有很大的提升。另外，光路中采用了半透半反分光棱镜作为分光组件，其固定在整个光路中无需通过机械方式进行移动或转动，在减少结构尺寸的同时，也避免了机械结构造成的操作复杂和可靠性等问题。
因此，从光学结构上改变二者的光路，使其合二为一，成为一个具有双功能的单一光学模块，不但可以降低材料成本，更能够通过减小整体结构，达到微型化的最佳效果。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
图1本发明实施例光学处理装置整体结构图；
图2本发明实施例光学处理装置的剖面结构图；
图3本发明实施例一光学处理装置第一功能(拍照功能为例)光路原理图；
图4本发明实施例一光学处理装置第二功能(投影功能)光路原理图。
本发明的实施方式
下面将结合附图对本发明的实施方式进行描述。
如图1及图2所示，本发明实施例提供的光学处理装置，所述光学处理装置前端设置有镜头101，在第一光学功能(拍照功能为例)模块开启时，汇聚外部入射光线，在第二光学功能(投影功能为例)模块开启时，光学第二功能模块内部组件发射的出射光线会透过所述镜头101发散出去。
该实施例中，镜头101采用变焦镜头，所述光学处理装置还包括调焦轮102，调焦轮102紧贴变焦镜头101与镜头101中的镜片连接，调焦轮102和变焦镜头101共同组成透镜组。可以通过调节所述调焦轮102，改变镜头101内部镜片的位置，以至于达到改变镜头101的光学焦距，以达到使光学第一功能或光学第二功能呈现画面效果清晰的效果。
可替代的，透镜组还可以替换成一个定焦镜头。
该实施例中，第一光学功能模块为照相模块，第二光学功能模块为投影模块。其中，投影模块由光学发射组件105完成，本实施例中可以是数字光处理DLP投影组件，所述光学处理装置还包括分光装置106，其中所述光学发射组件105、分光装置106和镜头101沿同一光轴依次排列，所述光接收组件107位于所述光轴的一侧，所述镜头101接收的外部入射光线，经过所述分光组件106到达光接收组件107，或者，接收穿过所述分光组件106的光学发射组件105发射光线并发射出去。
本实施例中，所述光接收组件107和所述分光组件106的连线同所述光轴垂直。
照相模块和投影模块共用一个镜头，对光学处理装置的微型化起到了非常重要的作用。
该实施例中，光学处理装置还包括散热片103，光学发射组件105和散 热片103相连，光学发射组件105内部的光源为发光二极管(Light Emitting Diode，LED)光源或激光光源，投影模块在工作时，DLP投影组件产生较大的热量，所述散热片103将投影模块工作时产生的热量散发出去。
该实施例中，所述光学处理装置还包括柔性线路板(Flexible Printed Circuit，FPC)及连接器104，所述光学处理装置通过连接器104与智能终端主板相连，给模块提供电源并交换传递数据信息。
图2为本发明实施例光学处理装置的剖面结构图，其内部结构可分为：
光学处理装置前端，包括光学变焦镜头101，光学变焦镜头101由透镜组构成，在拍照功能时，汇聚外界入射光线；而在投影功能时，对内部发射出的光线向外发散并成像的作用；该实施例中，光学处理装置前端还可以包括调焦装置102，用于改变镜头光心到底片平面的距离，或者投影的焦距。
光学发射组件105(本实施例中，该光学发射组件105为DLP投影组件)组成的投影模块部分，开启投影功能应用，光学发射组件105根据播放的不同图片或视频数据，将RGB光线按不同角度汇合并发射出来；光学发射组件105在工作时，自身产生的热量较大，散热片103通过导热胶与投影组件的侧壁粘连，可以达到热量消散的作用。
光接收组件107可以采用感光芯片，选择电荷耦合元件CCD芯片或者互补金属氧化物半导体CMOS芯片，所述光接收组件107位于所述光轴的一侧，镜头焦距范围内的焦平面上。
光接收组件107在拍照成像系统中就像人眼睛的视觉神经，可以接收外界传入的光信号，并且将光信号转换为电信号传输向后台进行图像信息数据处理。
图3，4所示的实施例中，分光组件106可采用半透半反分光棱镜，该实施例中，分光组件106由两个直角棱镜胶合而成，例如组成一个正方体。在两个直角棱镜胶合的45°斜面上，通过真空磁控溅射等光学镀膜工艺，将金属或金属氧化物打成离子态，镀制纳米级的氧化物介质膜，整个膜层均匀分布在直角棱镜的45°斜面上。膜层包含具有高反射性能的贵重金属膜(如 铬、钛、铂等贵重金属)和增强透射性能的二氧化钛膜(不同需求对模系做相应调整)。最终制成的具有光学半透半反性质的分光组件106，也即半透半反分光棱镜。在整个模块内部没有背光源的情况下形成镜面效果，作为反射镜使用。由于入射光线与半透半反分光棱镜106的斜面成45°，则对于棱镜的入射光线与出射光线正好成90°反射；而在模块内部有背光源的情况下，可透过半透半反分光棱镜106延直线方向出射光线。所以此半透半反分光棱镜106可以在整个光路中起到90°分光作用。
本发明实施例中，光学变焦镜头101、半透半反分光棱镜106、DLP投影组件105三者从前至后，沿同一光轴依次排列，光接收组件107和分光组件106位于同一平面并且位于与所述光轴垂直的方向，本图3、4所示的实施例中，所述光接收组件107为CCD/CMOS光接收组件，位于半透半反分光棱镜106的上方，与DLP投影组件105成90°方向放置。每个部件的组成距离尺寸，需要根据选用的不同光学变焦镜头、DLP投影组件以及CCD/CMOS光接收组件的产品规格而定。基本参数依据光学变焦镜头的后焦距而定，即CCD/CMOS光接收组件需要放置在光学变焦镜头焦距范围内的任意焦平面上，而DLP投影组件与光学变焦镜头之间的距离需要保证在焦距以内。例如：光学变焦镜头的焦距为5～20mm，则CCD/CMOS光接收组件与镜头之间的整个光路距离应控制在5～20mm之间，而DLP投影组件与镜头之间的光路距离需要控制在5～20mm以内的位置。这样通过调节变焦镜头，即可控制CCD/CMOS光接收组件处于镜头焦平面处，也可以控制DLP投影组件位于焦距以内。二者根据不同的成像原理，分别实现各自的功能。
模块的中心采用半透半反分光棱镜作为单镜头组光路的枢纽，分割光路，将一个镜头的光路分为两个光路。模块的后端，CCD/CMOS光接收组件和DLP投影组件分别在半透半反分光棱镜的后端和上端，成90°放置。当拍照功能执行时，外界光线透过光学透镜组汇聚进来，通过半透半反分光棱镜将光线反射90°至CCD/CMOS芯片上进行感光，达到拍照功能效果。当投影功能执行时，模块内部另一位置的DLP投影组件利用DMD(Digital Micromirror Device，数据微镜装置)晶片出射的光线，借由半透半反分光棱镜的透射性能，直线透射通过，再透过光学透镜组发散出去，将影像投射在 幕布上。
图3为本发明实施例模块拍照功能光学原理示意图。当使用光学处理装置的拍照功能时，投影部分不工作，即DLP投影组件105处于关闭状态，其在模块内部不产生背光。此时，外界景物的光线通过具有凸透性能的光学变焦镜头101汇聚，进入装置内部，当光线在进入半透半反分光棱镜106时，由其反光特性将水平入射的光线以垂直于水平光轴的方向，向上反射，并且由置于半透半反分光棱镜106上方的CCD/CMOS光接收组件107捕获光线，将光信息转化为电信号传输达出至后台进行图像处理。从而实现相机拍照成像的整个功能。
图4为整个模块投影功能光学原理示意图。
DLP投影组件105内部光源的光线，经由DLP投影组件内部的DMD晶片反射，即形成了投影的光线向外射出，光线沿主光轴方向直线透射出分光组件106，再穿过光学变焦镜头101，将光线发散出去，投射到幕布或墙面上成像。
当使用投影功能时，DLP投影组件105产生高亮背光，并通过内部的DMD晶片反射出具有图像信息的RGB混合光线。由于整个装置外部的光线照度相对较低，所以DLP投影组件105发射出的光线在经过半透半反分光棱镜106时，可直接沿主光轴方向直线透过，再通过模块前端的光学变焦镜头101发散出去，光线投射在幕布或前面上，形成清晰的图像。
工业实用性
本发明实施例提供了一种光学处理装置及终端；光学处理装置内部只需设计一组镜头，即可分别在不同功能开启时，实现拍照所需入射汇聚光线和投影所需发射发散光线的两种功能，在结构尺寸方面也能够实现一定程度的微型化，同时对于成本的降低也有很大的提升。另外，光路中采用了半透半反分光棱镜作为分光组件，其固定在整个光路中无需通过机械方式进行移动或转动，在减少结构尺寸的同时，也避免了机械结构造成的操作复杂和可靠 性等问题。因此，从光学结构上改变二者的光路，使其合二为一，成为一个具有双功能的单一光学模块，不但可以降低材料成本，更能够通过减小整体结构，达到微型化的最佳效果。

Claims (10)

  1. 一种光学处理装置，包括透镜组和光接收组件，
    所述光学处理装置还包括光学发射组件和分光组件，其中所述光学发射组件、分光组件和透镜组沿同一光轴依次排列，所述光接收组件位于所述分光组件的一侧透镜组焦距范围内的焦平面上。
  2. 根据权利要求1所述的光学处理装置，其中，所述光接收组件和所述分光组件的连线同所述光轴垂直。
  3. 根据权利要求1所述的光学处理装置，其中，所述分光组件接收来自透镜组的外部入射光线，将所述外部入射光线折射一角度后发送给所述光接收组件；或者，接收光学发射组件的发射光线并发射出去。
  4. 根据权利要求1所述的光学处理装置，其中，所述光学发射组件为数字光处理DLP投影组件，所述分光组件为分光棱镜。
  5. 根据权利要求2所述的光学处理装置，其中，所述光学处理装置还包括散热片，所述散热片通过导热材料与DLP投影组件的一侧壁粘连。
  6. 根据权利要求2所述的光学处理装置，其中，所述分光组件包括两个直角棱镜，所述两个直角棱镜胶合成一分光棱镜。
  7. 根据权利要求6所述的光学处理装置，其中，所述分光棱镜在两个直角棱镜胶合的斜面包括镀制氧化物介质膜。
  8. 根据权利要求7所述的光学处理装置，其中，所述镀制氧化物介质膜为二氧化钛膜。
  9. 根据权利要求1至8任一项所述的光学处理装置，其中，所述光接收组件为电荷耦合元件CCD芯片或者互补金属氧化物半导体CMOS芯片。
  10. 一种终端，包括权利要求1至9任一项所述的光学处理装置。
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