WO2016181502A1

WO2016181502A1 - Solder ball supply device

Info

Publication number: WO2016181502A1
Application number: PCT/JP2015/063646
Authority: WO
Inventors: 博充岡
Original assignee: 富士機械製造株式会社
Priority date: 2015-05-12
Filing date: 2015-05-12
Publication date: 2016-11-17
Also published as: JP6538161B2; JPWO2016181502A1

Abstract

A solder ball supply device 21 is provided with: (a) a stage 34 having a plurality of disposition holes for disposing solder balls, respectively, said disposition holes being formed in the upper surface; (b) a container 38, which stores the solder balls therein, and has an opening 86 in the bottom portion; and (c) a relatively moving mechanism 40 that relatively moves the container and the stage, in a state wherein the opening and the upper surface of the stage are facing each other, so that the solder balls stored in the container are disposed in the disposition holes in the stage via the opening. The size of the opening can be changed by, for instance, providing an opening size changing mechanism 98 for automatically changing the size of the opening. Usefulness of the solder ball supply device is improved by enabling the size of the opening to be changed corresponding to, for instance, the quantity of the stored solder balls, and the diameter of the solder balls.

Description

Solder ball feeder

The present invention relates to a solder ball supply device for supplying solder balls.

As the solder ball supply device, for example, the following patent document has been proposed. The solder ball supply device described in the patent document is, as can be understood from the description of the embodiment of the document, a container that stores the solder ball (referred to as “squeegee 76” in the document), A stage (referred to as “ball alignment plate 70” in this document) is relatively moved in a certain direction to form a plurality of arrangement holes (“ball holes 72” in this document) formed on the upper surface of the stage. It is comprised so that it may arrange | position. Incidentally, the container has an opening facing the upper surface of the stage at the lower part, and the placement of the solder balls is performed through the opening.

JP 2013-229428 A

Problems to be Solved by the Invention

The solder ball supply device as described in the above patent document is still under development, and it is possible to improve the practicality of such a solder ball supply device by making some improvements. This invention is made | formed in view of such a situation, and makes it a subject to provide a highly practical solder ball supply apparatus.

In order to solve the above-mentioned problems, a solder ball supply device of the present invention includes (a) a stage having a plurality of arrangement holes in which one solder ball is arranged on each of the upper sides, and (b) a plurality of solder balls. A container having an opening in the lower part, and (c) the solder ball accommodated in the container is arranged in the plurality of arrangement holes of the stage through the opening. A solder ball supply device including a relative movement mechanism for moving the container and the stage relative to each other with the upper surface of the stage facing each other, wherein the size of the opening can be changed.

According to the solder ball supply device of the present invention, since the size of the opening can be changed, change of the diameter of the solder ball, the remaining amount of the solder ball in the container, the pattern of the arrangement hole formed in the stage, etc. Therefore, a highly practical solder ball supply device can be realized.

It is a perspective view which shows the component mounting system by which the solder ball supply apparatus of this invention was arrange | positioned. It is a perspective view which shows the principal part of the solder ball supply apparatus of this invention in the state which removed the cover. It is a perspective view which shows the principal part of the solder ball supply apparatus of this invention in the state cut | disconnected virtually. It is sectional drawing which shows the solder ball supply apparatus of this invention in the state in which the solder ball was accommodated in the container which is a container. It is a perspective view which shows the principal part of the solder ball supply apparatus of this invention with which the adapter was attached to the container in the state cut | disconnected virtually.

Hereinafter, typical embodiments of the present invention will be described in detail with reference to the drawings as examples. It should be noted that the present invention can be carried out in various modes in which various modifications and improvements are made based on the knowledge of those skilled in the art, in addition to the following examples.

[A] Component Mounting System Provided with Solder Ball Supply Device The solder ball supply device according to the embodiment is provided in a component mounting system as shown in FIG. 1, for example. The system includes a system base 10 and two component placement machines 12 arranged side by side on the system base 10 as main components.

The component mounting machine 12 includes a main body that includes a base 14 and a frame 16 disposed on the base 14. A pair of conveyor devices 18 are arranged side by side at the center in the front-rear direction on the base 14 in order to transport the substrate left and right in two front and rear lanes. The conveyor device 18 functions as a substrate transport fixing device that transports the substrate S and fixes the substrate S at a predetermined position. In the component mounting machine 12 on the back side, a plurality of component feeders 20 each functioning as a component supply device are arranged side by side in the left-right direction. On the other hand, in the component mounting machine 12 on the right side (near side), the solder ball supply device 21 of the embodiment is disposed instead of the component feeder 20. In addition, the component mounting device 22 is supported on the frame 16. The component mounting apparatus 22 includes a mounting head 24 having a suction nozzle that is a component holding device, and a head moving device 26 that moves the mounting head 24 forward, backward, left, and right.

In this system, the solder ball is handled as one of the components, and the component mounting operation is performed by the head moving device 26, and the mounting head 24 is fixed by the component feeder 20 or the solder ball supply device 21 and the conveyor device 18. It is performed while being moved between. Specifically, the mounting head 24 holds a component supplied by the component feeder 20 or a solder ball supplied by the solder ball supply device 21 in the suction nozzle attached to the lower end portion of the mounting head 24. The held parts and solder balls are mounted on, or placed on, the substrate S fixed by the conveyor device 18. Control of the conveyor device 18, the component feeder 20, the component mounting device 22, and the like in the component mounting operation is performed by a control device 28 in which an operation panel is integrated.

[B] Configuration of Solder Ball Supply Device Referring to FIGS. 2 and 3, the solder ball supply device 21 includes a base 30 and a beam 32 disposed on the base 30 and extending rearward. A movable stage 34 movably provided back and forth along the beam 32, a stage moving mechanism 36 for moving the stage 34 in the front and rear direction, and a solder ball provided movably back and forth above the beam 32. And a container moving mechanism 40 for moving the container 38 in the front-rear direction, as main components.

The stage 34 includes a base plate 42, a slider 44 attached to the lower portion of the base plate 42, a template 46 placed on the base plate 42, and a frame 48 for fixing the template 46 to the base plate 42. It is comprised including. On the other hand, a guide rail 50 is laid on the upper surface of the beam 32 so as to extend in the front-rear direction. Since the slider 44 is engaged with the guide rail 50, the stage 34 is attached to the guide rail 50. It is possible to move in the front-rear direction along the beam 32. The stage moving mechanism 36 is disposed inside the beam 32, and includes a ball screw mechanism, an electric motor, and the like that are not shown. The figure shows a state where the stage 34 is located at one end (front side end) in the movement range, and in a state where the stage 34 is located at the other end (rear side end) in the movement range. Is positioned at the rear end of the beam 32.

In the template 46, a plurality of arrangement holes H in which solder balls are arranged one by one are formed in a rectangular arrangement region R so as to be arranged in a matrix. Incidentally, illustration is abbreviate | omitted in FIG. The diameter of each of the plurality of arrangement holes H and the pitch (interval) of the plurality of arrangement holes H are in accordance with the diameter of the solder balls to be arranged. The template 46 can be replaced, and can be selected from various hole diameters, pitches, and arrangement regions R according to the diameter of the solder balls, and the selected one can be placed on the base plate 42. Has been. Each of the plurality of arrangement holes H is formed to such a depth that when the solder balls are arranged, the solder balls hardly protrude above the upper surface of the template 46.

A table 52 is disposed on the upper surface of the beam 32, and a container 38 is held above the table 52. The container 38 is mainly composed of a container main body 54. The container main body 54 has a shape that can be considered as a box having no side wall on the front side and an upper side, and a square hole is generally present on the rear side as a portion having no bottom wall. Above the bottom wall of the container main body 54, an inclined plate 56 is disposed between the left and right side walls so as to incline downward.

The container 38 is supported by two support plates 58 standing on the table 52 so as to be movable in the front-rear direction on both the left and right sides. Specifically, guide rails 60 are laid on the outer sides of the left and right side walls of the container main body 54, and each of the two support plates 58 slidably holds the corresponding guide rails 60, whereby the container 38 is movable along the beam 32, that is, along the table 52 in the front-rear direction.

On the other hand, in front of the table 52, a slide 62 is supported by the beam 32 so as to be movable in the front-rear direction. The front end of the container main body 54 of the container 38 is fixed to the slide 62, and the container 38 moves in the front-rear direction as the slide 62 moves. Inside the beam 32, a slide moving mechanism 64 constituted by a ball screw mechanism, an electric motor, etc. (not shown) is disposed, and the container 38 is moved in the front-rear direction by the slide moving mechanism 64. That is, the container moving mechanism 40 is configured as a relative moving mechanism that includes the slide 62 and the slide moving mechanism 64 and relatively moves the container 38 and the stage 34 in the front-rear direction. 2 and 3 show a state in which the container 38 is located in the middle of one end (front end) and the other end (rear end) in the moving range.

The container 38 will be described in more detail with reference to FIG. 4A. The solder ball B is present in the above-described generally square hole (the portion without the bottom wall on the rear side) provided in the container body 54. In addition, on both sides before and after the hole, regulating

bodies

66 and 68 for regulating the movement of the solder ball B accompanying the movement of the container 38 are provided.

The rear-side restricting body 66 is fixed to the rear side wall of the container main body 54, and a resin base body 70, a plurality of brushes 72 planted under the base body 70, and the rear side of the brushes 72. A rubber blade 74 hanging from the base body 70 and a cover plate 78 covering the upper side and the front side of the base body 70 and having a lower end portion functioning as a skirt 76 are configured. Incidentally, the plurality of brushes 72 are arranged in three rows extending in the left-right direction in a staggered manner.

The front-side regulating body 68 is fixed to a lower portion of the rear end portion of the inclined plate 56 via a spacer 80 having a wedge-shaped cross section, and is embedded in a resin base 82 and a lower portion of the base 82. A plurality of brushes 72 (similar to and arranged in the same manner as the brushes 72 of the rear side regulation body 66), and a rubber blade 74 (rear side regulation) hanging from the base 82 on the front side of the brushes 72 And a cover plate 84 which covers the upper side and the rear side of the base body 82 and whose lower end functions as a skirt 76.

The space surrounded by the left and right side walls of the container body 54 and the

cover plates

78 and 84 can be considered as an opening 86 of the container 38. The opening 86 constitutes at least a part of the accommodation space of the solder ball B.

As can be seen from FIGS. 3 and 4A, the upper surface of the stage 34 and the upper surface of the table 52 are in a flush state (a state located in one plane), and the stage 34 is at one end in the movement range. In the state located at the (front end), there is no space between the upper surface of the stage 34 and the upper surface of the table 52. On the other hand, the container 38 includes a lower end of the rear side wall of the container main body 54, a lower end of the left and right side walls, a lower end of the rear end portion of the bottom wall, and a lower end of the two blades 74, respectively. It is located at a position that is hardly separated from the upper surface of 52. Therefore, the solder balls B accommodated in the container 38 do not protrude from the opening 86 to the front, rear, left and right.

As described above, the container 38 shown in FIGS. 2 to 4 has the container 38 positioned at an intermediate position between one end (front end) and the other end (rear side end) in the moving range. The opening 86 is located at the front side end of the arrangement region R of the arrangement hole H provided in 34. When the container 38 is located at one end (front end) in the movement range, the opening 86 is located at a position where the entire portion thereof is located on the table 52, and the container 38 is located at the other end (rear side end). ) Is located at a position where at least a part of the opening 86 protrudes rearward from the arrangement region R of the stage 34.

[C] Operation of Solder Ball Supply Device, etc. The operation of the solder ball supply device 21, specifically the operations of the stage moving mechanism 36 and the container moving mechanism 40, is controlled by the control device 88 (see FIG. 1). Incidentally, the control device 88 can communicate with the control device 28 of the component mounting machine 12, and the control of the operation of the solder ball supply device 21 by the control device 88 is executed under the control of the control device 28. . The basic state in operation is a state in which the stage 34 is positioned at the front end by the stage moving mechanism 36 and the container 38 is positioned at the front end by the container moving mechanism 40.

The solder balls are supplied to the container 38 by opening the opening / closing lid 90 (see FIG. 1) on the upper surface of the solder ball supply device 21 in a state where the container 38 is positioned at the front side end, and supplying an appropriate amount of the solder balls B to the container 38. This is done by placing on 38 inclined plates 56. The solder ball B rolls along the inclination of the inclined plate 56 and is accommodated so as to accumulate in the opening 86 as shown in FIG. The state shown in FIG. 4A is a state in which all the solder balls B are present in the openings 86. For example, a part of the solder balls B overflows the upper surface of the inclined plate 56. Also good.

The supply of the solder balls B onto the stage 34, that is, the arrangement into the arrangement hole H formed in the stage 34 is performed by the container moving mechanism 40 from the above-described basic state to the opening 86 of the container 38 and the upper surface of the stage 34. The container 38 is moved from the front side end to the rear side end, and then moved from the rear side end to the front side end to return to the basic state. As a result of the movement, the assembly of solder balls B in the opening 86 moves together with the container 38 so as to slide on the table 52 and the stage 34, and one solder hole B is formed in each of the arrangement holes H formed in the stage 34. Each solder ball B is arranged. Incidentally, the solder ball supply device 21 is configured to move the container 38 and place the solder ball B in the placement hole H, but employs a relative movement mechanism that moves the stage relative to the container. The solder balls B in the container may be arranged in the arrangement holes H.

The distance between the lower ends of the skirts 76 of the rear side restricting body 66 and the front side restricting body 68 and the upper surfaces of the stage 34 and the table 52 is such that the solder balls B can pass through. There is almost no gap between the tip and the upper surface of the stage 34. For this reason, the brush 72 functions to ensure the reliable placement of the solder balls B in the respective placement holes H, and in a state in which the placement holes H are completely formed on the upper surface of the stage 34 after the opening 86 has passed. It functions to prevent the solder balls B that are not arranged from remaining. More specifically, when moving toward the rear of the container 38, the brush 72 of the front side regulating body 68 is used, and when moving toward the front of the container 38, the brush 72 of the rear side regulating body 66 is respectively moved. It fulfills the above functions.

After the placement of the solder ball B in the placement hole H of the stage 34 is completed, the stage 34 is moved to the rear side end by the stage moving mechanism 36 from the basic state, and the solder ball supply device 21 is a component mounting device. The solder balls B are supplied to the 22. When there is no solder ball B arranged on the stage 34, the stage 34 is moved to the front side end by the stage moving mechanism 36, that is, returned to the basic state. The operation for placement in the placement hole H is repeated.

[D] Dimensional change of opening of container of solder ball supply device i) Dimensional change of opening according to quantity of solder ball As can be understood from the operation of arranging the solder ball B on the stage 34, the container 38 includes A certain amount of solder balls B must be accommodated. As the supply of the solder balls B progresses, the solder balls B accommodated in the container 38 are reduced. When the solder balls B are reduced to some extent, the assembly height of the solder balls B accommodated in the openings 86 is reduced. In other words, for example, the solder ball B may not reach the entire surface of the opening 86 due to the movement of the solder ball B in the opening 86 accompanying the movement of the container 38. From such a phenomenon, when the solder ball B does not exist so as to have a certain height in the opening 86, the possibility that the solder ball B is not arranged in some arrangement holes H formed in the arrangement region R increases. In other words, the possibility of occurrence of a placement defect increases.

In order to deal with the arrangement defect due to the decrease of the solder balls B, in the present solder ball supply device 21, the size of the opening 86, specifically, the moving direction of the container 38 (the relative moving direction of the container 38 and the stage 34). A mechanism for changing the dimension in the front-rear direction is provided. Specifically, the inclined plate 56 of the container 38 is supported so as to be movable in the front-rear direction with respect to the container main body 54, and a mechanism for moving the inclined plate 56 relative to the container main body 54 is provided. Specifically, as shown in FIG. 2, a nut (not shown) is fixed inside the inclined plate 56, and the screw rod 92 is attached to the slide 62 so as to be screwed into the nut. It is held rotatably. On the other hand, the slide 62 is provided with an electric motor 94 and a transmission mechanism 96 for transmitting the rotation of the electric motor 94 to the screw rod 92, and the control device 88 controls the electric motor 94. The dimension of the opening 86 in the front-rear direction is changed. That is, the solder ball supply device 21 includes the screw rod 92, the electric motor 94, and the transmission mechanism 96, and is provided with an opening size changing mechanism 98 for changing the size of the opening 86 in the front-rear direction. .

Incidentally, FIG. 4A shows a state where the dimension of the opening 86 in the front-rear direction is the largest (widest state), and FIG. 4B shows a state where the dimension has been reduced to some extent from that state, that is, The state where the opening 86 is narrowed is shown.

As can be seen from FIG. 2, the container 38 is provided with a light source 100 and a light receiving sensor 102, and the light source 100 that passes through a pair of transparent resin windows 104 provided on the left and right side walls of the container body 54. When the light receiving sensor 102 detects this light, the control device 88 determines that the solder ball B accommodated in the container 38 has decreased to some extent. Based on the determination, the control device 88 controls the opening size changing mechanism 98 to change the size of the opening 86 in the front-rear direction by a set distance. That is, in the present solder ball supply device 21, the opening size changing mechanism 98 automatically changes the size of the opening 86 in the front-rear direction according to the amount of the solder ball B in the container 38. .

It should be noted that the concept of “changing the size of the opening” in the solder ball supply device 21 is that the solder ball B is accommodated in the opening 86, and as a result, “changing the amount of solder balls that can be accommodated”. It can be considered equivalent.

ii) Changing the size of the opening in accordance with the diameter of the solder ball There are various types of solder balls. In the component mounting system, solder balls having various diameters can be placed on the substrate. Therefore, the solder balls having various diameters are also accommodated in the container 38. In consideration of the possibility of the above-described arrangement defect, it is desirable to increase the amount of solder balls accommodated, that is, the height of the solder ball aggregate in the opening 86 as the diameter of the solder balls increases. On the other hand, when the diameter of the solder ball is small, when the opening 86 having the same size as that of the solder ball having a large diameter is secured, the amount of solder balls, specifically, the number of solder balls is considerably increased. In other words, an excessive amount of solder balls is accommodated. This excessive amount of solder balls accommodated becomes a problem when foreign matter is mixed in the solder ball assembly, or when a problem occurs in the solder balls themselves. More specifically, in these cases, since all of the solder balls contained in the container 38 are discarded, a considerable amount of solder balls is expected to be discarded. That is, it is not desirable to increase the size of the opening 86 more than necessary.

In order to deal with the above problem, in the present solder ball supply device 21, the size of the opening 86 is changed according to the diameter of the solder ball accommodated in the container 38. More specifically, the type of solder ball placed on the board is ascertained by the control device 28 of the component mounting machine 12 from the component mounting work program, and the solder ball is communicated from the control device 28. The control device 88 of the supply device 21 grasps the diameter of the solder ball to be accommodated in the container 38. Based on the grasp, the control device 88 controls the opening size changing mechanism 98 so that the size of the opening 86 in the front-rear direction is generally large when the diameter of the solder ball to be accommodated is large, and the solder ball to be accommodated. If the diameter is small, it is reduced. In other words, in the present solder ball supply device 21, the opening size changing mechanism 98 automatically changes the size of the opening 86 in the front-rear direction according to the diameter of the solder ball accommodated in the container 38. is there.

iii) Changing the size of the opening in accordance with the width of the pattern In the component mounting system, it is desired that the number of solder balls supplied from the solder ball supply device 21 at one time be an appropriate number, and the arrangement is as follows. It is desirable that the pattern of the arrangement holes H formed in the region R be an appropriate pattern. In the present solder ball supply device 21, the size of the arrangement region R of the arrangement hole H formed on the upper surface of the stage 34 and the pattern of the arrangement hole H can be arbitrarily changed by the template 46 to be attached. At that time, since the width in the left-right direction of the arrangement region R can also change, it is desirable to change the dimension in the left-right direction of the opening 86 of the container 38 according to the width.

In consideration of the above, as shown in FIG. 5, in this solder ball supply device 21, adapters 106 of various thicknesses (thickness dimensions in the left-right direction) are attached according to the width of the arrangement region R. Is possible. By attaching the adapter 106, the solder ball supply device 21 changes the dimension of the opening 86 of the container 38 in the left-right direction, that is, the dimension of the opening 86 in the direction perpendicular to the direction of relative movement between the container 38 and the stage 34. It is possible.

When the adapter 106 is attached, the opening dimension changing mechanism 98 cannot change the dimension of the opening 86 in the front-rear direction, but the opening dimension changing mechanism 98 can change the dimension of the opening 86 in the front-rear direction. It is also possible to attach an adapter to be used.

[E] Modification In the solder ball supply device 21 of the above embodiment, the size of the opening 86 in the front-rear direction is automatically changed by the opening size changing mechanism 98. However, the size is changed manually. It is also possible to adopt a simple mechanism. Moreover, the dimension of the front-back direction of the opening 86 may be changed by attaching an adapter as described above.

In the solder ball supply apparatus 21 of the embodiment, the change in the horizontal dimension of the opening 86 is performed by attaching the adapter 106. However, a mechanism such as the above-described opening dimension changing mechanism 98 is used. It may be changed automatically, and a mechanism for changing manually may be employed.

12: Component mounting machine 21: Solder ball supply device 30: Base 32: Beam 34: Stage 36: Stage moving mechanism 38: Container [container] 40: Container moving mechanism [relative moving mechanism] 46: Template 52: Table 54: Container body 56: Inclined plate 62: Slide 64: Slide moving mechanism 66: Back side restricting body 68: Front side restricting body 86: Opening 88: Control device 98: Opening dimension changing mechanism 106: Adapter S: Substrate R: Arrangement area H : Arrangement hole B: Solder ball

Claims

A stage in which a plurality of arrangement holes each having one solder ball arranged thereon are formed on the upper surface;
A container having a plurality of solder balls accommodated therein and having an opening at the bottom;
In order to place the solder balls accommodated in the container in the plurality of arrangement holes of the stage through the opening, the container and the stage are relatively moved with the opening and the upper surface of the stage facing each other. A solder ball supply device including a relative movement mechanism,
A solder ball supply device, wherein the size of the opening is changeable.
The solder ball supply device according to claim 1, wherein the size of the opening in the direction of relative movement can be changed.
The solder ball supply device according to claim 1 or 2, wherein a dimension of the opening in a direction perpendicular to the direction of the relative movement can be changed.
The solder ball supply device according to any one of claims 1 to 3, further comprising an opening size changing mechanism for changing the size of the opening.
The opening size changing mechanism automatically changes the size of the opening of the container according to at least one of the amount of solder balls in the container and the diameter of the solder balls in the container. The solder ball supply device according to claim 4 configured.
The solder ball supply device according to any one of claims 1 to 5, wherein a pattern of a plurality of arrangement holes formed on the upper surface of the stage is changeable.