WO2016161617A1 - Encapsulated electrical device and method of fabrication - Google Patents
Encapsulated electrical device and method of fabrication Download PDFInfo
- Publication number
- WO2016161617A1 WO2016161617A1 PCT/CN2015/076260 CN2015076260W WO2016161617A1 WO 2016161617 A1 WO2016161617 A1 WO 2016161617A1 CN 2015076260 W CN2015076260 W CN 2015076260W WO 2016161617 A1 WO2016161617 A1 WO 2016161617A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- inner shell
- cte
- outer shell
- shell
- electrical assembly
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
Abstract
Description
Claims (20)
- A device, comprising:an electrical assembly having at least one electrical component;an inner shell comprising a first polymeric material disposed around the electrical assembly and in contact with the electrical assembly, the inner shell comprising a first mechanical strength; andan outer shell comprising a second polymeric material conformally disposed around the inner shell and in contact with the inner shell, the outer shell comprising a second mechanical strength greater than the first mechanical strength,wherein the electrical component comprises a first coefficient of thermal expansion (CTE) , the inner shell comprises a second CTE, and the outer shell comprises a third CTE, and wherein a difference between the first CTE and second CTE is less than a difference between the first CTE and third CTE.
- The device of claim 1 wherein the electrical assembly has a first outer surface defining a first outer shape, the inner shell comprises a second outer surface defining a second outer shape different than the first outer shape; and wherein the outer shell comprises a third outer surface defining a third outer shape different than the first outer shape.
- The device of claim 1, wherein the inner shell comprises a thermoset material and the outer shell comprises a thermoplastic material.
- The device of claim 1, wherein the electrical assembly comprises a printed circuit board (PCB) and at least one electrical component disposed thereon.
- The device of claim 1, wherein the inner shell and outer shell are configured to operate over a temperature range of -50℃ to 150℃.
- The device of claim 2, wherein the second outer surface of the inner shell comprises a sealing rib assembly configured to increase sealing between the inner shell and outer shell by mechanically coupling to the outer shell.
- The device of claim 2, wherein the third outer shape is different than the second outer shape.
- The device of claim 1, wherein the inner shell comprises a post portion configured to couple to the outer shell.
- The device of claim 1, the outer shell comprising a second mechanical strength greater than the first mechanical strength.
- A method of forming an electrical device, comprising:providing an electrical assembly having at least one electrical component;forming an inner shell comprising a first polymeric material around the electrical assembly, the inner shell being in contact with the electrical assembly; andforming an outer shell comprising a second polymeric material around the inner shell and in contact with the inner shell,wherein the electrical assembly comprises a first coefficient of thermal expansion (CTE) , the inner shell comprises a second CTE, and the outer shell comprises a third CTE, and wherein a difference between the second CTE and first CTE is less than a difference between the third CTE and first CTE.
- The method of claim 10, wherein the forming the inner shell comprises:providing the electrical assembly in a first mold;dispensing a first liquid precursor of the inner shell into the first mold; andperforming a first injection molding process on the first liquid precursor and electrical component at a first temperature and a first pressure, wherein a singly encapsulated device is formed comprising the inner shell and electrical assembly.
- The method of claim 11, wherein the forming the outer shell comprises:providing the singly encapsulated device in a second mold;dispensing a second liquid precursor of the second polymeric material into the second mold; andperforming a second injection molding process on the singly encapsulated device at a second temperature and a second pressure greater than the first pressure.
- The method of claim 12, wherein the second temperature is higher than the first temperature.
- The method of claim 10, wherein the inner shell comprises a thermoset material, and wherein the outer shell comprises a thermoplastic material.
- The method of claim 12, wherein the first temperature is between 150℃ and 200℃ and the first pressure is between 20 kgf/cm2 and 100 kgf/cm2.
- The method of claim 12, wherein the second temperature is between 275 and 315℃ and the second pressure is between 700 kgf/cm2 and 1100 kgf/cm2.
- A sensor device, comprising:a printed circuit board;at least one sensor attached to the printed circuit board;an inner shell comprising a first polymeric material disposed around the printed circuit board and at least one electrical device, and in contact with the printed circuit board and at least one electrical device; andan outer shell comprising a second polymeric material disposed around the inner shell and in contact with the inner shell,wherein the printed circuit board comprises a first coefficient of thermal expansion (CTE) , the inner shell comprises a second CTE, and the outer shell comprises a third CTE, and wherein a difference between the first CTE and second CTE is less than a difference between the first CTE and third CTE.
- The device of claim 17, wherein the inner shell comprises a thermoset material and the outer shell comprises a thermoplastic material.
- The sensor device of claim 17, wherein the inner shell and outer shell are configured to operate over a temperature range of -50℃ to 150℃.
- The sensor device of claim 17, wherein the inner shell comprises:a sealing rib assembly configured to increase sealing between the inner shell and outer shell by mechanically coupling to the outer shell; anda post portion configured to couple to the outer shell.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017553073A JP6533594B2 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of manufacture |
CN201580078408.3A CN107532926B (en) | 2015-04-10 | 2015-04-10 | Packaged electrical device and method of manufacturing the same |
US15/565,234 US10362692B2 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of fabrication |
KR1020177028076A KR102076961B1 (en) | 2015-04-10 | 2015-04-10 | Encapsulated Electrical Device and Manufacturing Method |
EP15888174.8A EP3280979A4 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of fabrication |
PCT/CN2015/076260 WO2016161617A1 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of fabrication |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2015/076260 WO2016161617A1 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016161617A1 true WO2016161617A1 (en) | 2016-10-13 |
Family
ID=57073026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2015/076260 WO2016161617A1 (en) | 2015-04-10 | 2015-04-10 | Encapsulated electrical device and method of fabrication |
Country Status (6)
Country | Link |
---|---|
US (1) | US10362692B2 (en) |
EP (1) | EP3280979A4 (en) |
JP (1) | JP6533594B2 (en) |
KR (1) | KR102076961B1 (en) |
CN (1) | CN107532926B (en) |
WO (1) | WO2016161617A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11395414B1 (en) * | 2020-04-09 | 2022-07-19 | General Atomics | Method to manufacture potted electronic assemblies for extreme mechanical and thermal environments |
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US6307749B1 (en) | 2000-10-23 | 2001-10-23 | Delphi Technologies, Inc. | Overmolded electronic module with underfilled surface-mount components |
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2015
- 2015-04-10 KR KR1020177028076A patent/KR102076961B1/en active IP Right Grant
- 2015-04-10 JP JP2017553073A patent/JP6533594B2/en active Active
- 2015-04-10 EP EP15888174.8A patent/EP3280979A4/en not_active Withdrawn
- 2015-04-10 CN CN201580078408.3A patent/CN107532926B/en active Active
- 2015-04-10 WO PCT/CN2015/076260 patent/WO2016161617A1/en active Application Filing
- 2015-04-10 US US15/565,234 patent/US10362692B2/en active Active
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CN1508516A (en) * | 2002-12-18 | 2004-06-30 | ��ʽ�����װ | Sensor with resin moulded casing and its producing method |
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Title |
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See also references of EP3280979A4 |
Also Published As
Publication number | Publication date |
---|---|
CN107532926B (en) | 2021-03-30 |
KR102076961B1 (en) | 2020-02-13 |
CN107532926A (en) | 2018-01-02 |
JP2018512592A (en) | 2018-05-17 |
EP3280979A4 (en) | 2018-12-05 |
JP6533594B2 (en) | 2019-06-19 |
US10362692B2 (en) | 2019-07-23 |
US20180084657A1 (en) | 2018-03-22 |
KR20170135852A (en) | 2017-12-08 |
EP3280979A1 (en) | 2018-02-14 |
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