WO2016125544A1

WO2016125544A1 - Circuit structure

Info

Publication number: WO2016125544A1
Application number: PCT/JP2016/050752
Authority: WO
Inventors: 有延中村; 陳　登
Original assignee: 株式会社オートネットワーク技術研究所; 住友電装株式会社; 住友電気工業株式会社
Priority date: 2015-02-03
Filing date: 2016-01-13
Publication date: 2016-08-11

Abstract

In order to provide an circuit structure that makes mounting (electrical connection of terminals) of electronic components easier, a circuit structure 1 is provided that comprises: a substrate having a conductive pattern formed on one surface 10a thereof; a conductive member 20 fixed to the other surface 10b of the substrate; and an electronic component 30 having first-type terminals 32, 33, being some among a plurality of terminals, electrically connected to the conductive member 20 and having second-type terminals 34, being others among the plurality of terminals, electrically connected to the conductive pattern formed on the substrate 10. The conductive member 20 has a shape so as to not overlap at least some of the second-type terminals 34 in the electronic component 30.

Description

Circuit structure

The present invention relates to a circuit structure including a substrate and a conductive member.

A circuit structure in which a conductive member that constitutes a circuit for conducting a relatively large current is fixed to a substrate on which a conductive pattern that constitutes a circuit that conducts a relatively small current is formed is known (for example, See Patent Document 1 below).

JP 2003-164040 A

In the circuit configuration described in Patent Document 1, a body part of an electronic component (FET) is placed on a conductive member, some terminals are connected to the conductive member, and some other terminals are connected to the substrate. (See, for example, FIG. 4 of Patent Document 1). Since there is a height difference (step) corresponding to the thickness of the substrate between the substrate surface and the conductive member surface, it is necessary to bend one of the terminals. Moreover, if the terminal is short, it may not be possible to cope with such bending, and connection may be difficult.

The problem to be solved by the present invention is to provide a circuit structure that facilitates mounting of electronic components (electrical connection of terminals).

In order to solve the above problems, a circuit structure according to the present invention includes a substrate having a conductive pattern formed on one surface thereof, a conductive member fixed to the other surface of the substrate, and an electrically conductive member connected to the conductive member. An electronic component having a first terminal to be connected and a second terminal electrically connected to a conductive pattern formed on the substrate, wherein the conductive member is the second terminal of the electronic component. It is the shape which does not overlap at least one part of.

A first terminal connection portion is provided on the other surface of the substrate so as not to overlap the conductive member, and the second terminal of the electronic component is connected to the conductive pattern via the first terminal connection portion. It is good to be electrically connected to.

A first lead member for electrically connecting the second terminal of the electronic component and the terminal connection portion may be provided.

A second terminal connection portion is provided between one surface of the substrate and the other surface so as not to overlap the conductive member, and the second terminal of the electronic component is connected to the second terminal connection portion. It may be electrically connected to the conductive pattern via

A second lead member for electrically connecting the second terminal of the electronic component and the second terminal connection portion may be provided.

The second terminal connection portion is formed along an inner peripheral surface of a through hole formed in the substrate, and the second lead member is inserted into the through hole on one side thereof and the second terminal member is inserted into the second hole. It is good to have a contact terminal part which contacts a terminal connection part.

It is preferable that an opening is formed in the substrate, and the electronic component is placed on the conductive member through the opening.

The circuit structure according to the present invention has such a shape that the conductive member does not overlap at least a part of the second terminal of the electronic component. Therefore, the electrical connection between the second terminal and the conductive pattern formed on the substrate can be performed from the conductive member side, and the electrical connection (connection operation) between the second terminal and the conductive pattern formed on the substrate is easy. It is.

If the first terminal connection portion, to which the second terminal is electrically connected, is provided on the other surface of the substrate so as not to overlap the conductive member, the first terminal connection portion is used to A substrate (circuit) can be electrically connected.

Using the fact that the conductive members do not overlap, the second terminal and the first terminal connecting portion can be connected by the first lead member.

If the second terminal connection portion to which the second terminal is electrically connected is provided so as not to overlap the conductive member between one surface and the other surface of the substrate, the second terminal connection portion is used. Thus, the second terminal and the substrate (circuit) can be electrically connected.

Using the fact that the conductive members do not overlap, the second terminal and the second terminal connecting portion can be connected by the second lead member.

When the second terminal connection portion is formed along the inner peripheral surface of the through hole formed in the substrate, the second lead having a contact terminal portion that is inserted into the through hole and contacts the second terminal connection portion If a member is used, the operation | work which electrically connects a 2nd terminal and a board | substrate (circuit) will become easy.

If the structure is such that the electronic component is placed on the conductive member, it is easy to connect the first terminal and the conductive member (connection work).

1 is an external view of a circuit structure according to an embodiment of the present invention, and is an enlarged view of a portion where an electronic component (transistor) is mounted. It is a top view (figure seen from the board | substrate side) of the part in which the electronic component in the circuit structure was mounted. It is a bottom view (figure seen from the electrically-conductive member side) of the part in which the electronic component in the circuit structure was mounted. It is a perspective view (partial sectional view) for explaining a connection structure via a first lead member. It is sectional drawing (sectional drawing cut | disconnected by the plane which passes along a 2nd terminal and a 1st lead member) of the part by which the electronic component in the circuit structure was mounted. It is sectional drawing of the circuit structure concerning a 1st modification. It is a bottom view (figure seen from the electrically-conductive member side) of the part by which the electronic component in the circuit structure concerning a 2nd modification was mounted. It is sectional drawing of the circuit structure concerning a 2nd modification. It is an external view of the lead member used for the circuit structure concerning a 2nd modification. It is a bottom view (figure seen from the electroconductive member side) of the part in which the electronic component in the circuit structure concerning a 3rd modification was mounted, and is a figure showing the state where the tip side part of a lead member was inserted. . It is a bottom view (figure seen from the electrically-conductive member side) of the part in which the electronic component in the circuit structure concerning a 3rd modification was mounted, Comprising: By rotating after inserting the front end side part of a lead member It is the figure which showed the state which the terminal contact part contacted the terminal connection part. It is an external view of the lead member used for the circuit structure concerning a 3rd modification.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Unless otherwise specified, the plane direction in the following description refers to the plane direction of the substrate 10 and the conductive member 20, and the height direction (vertical direction) is a direction perpendicular to the plane direction (electrons on the substrate 10). The surface on which the component 30 is mounted is the upper side). These directions do not limit the installation direction of the circuit structure 1.

1 to 5 includes a circuit board 10, a conductive member 20, and an electronic component 30 according to an embodiment of the present invention. The substrate 10 has a conductive pattern 101 on one surface 10a (upper surface) (only a portion (a portion to which a first lead member 40 described later is connected) shown in FIGS. 2 and 5 is shown for easy understanding) (Omitted in other figures) is formed. The conductive path constituted by the conductive pattern 101 constitutes a control circuit, and the current flowing through the conductive path constituted by the conductive member 20 is relatively small.

The conductive member 20 is a plate-like portion fixed to the other surface 10 b (lower surface) of the substrate 10. The conductive member 20 is formed in a predetermined shape by press working or the like, and constitutes a conductive path for power, which is a portion through which a relatively large current (larger than the conductive path constituted by the conductive pattern 101) flows. Note that the description and illustration of the specific configuration of the conductive path are omitted. The conductive member 20 is also referred to as a bus bar (bus bar plate) or the like. The conductive member 20 is fixed to the other surface 10b of the substrate 10 via, for example, an insulating adhesive or an adhesive sheet. Thereby, the board | substrate 10 and the electrically-conductive member 20 are integrated. A heat radiating member (for example, a plate on which fins are formed) may be fixed to the lower side of the conductive member 20 (the side opposite to the substrate 10 side). When the heat radiating member is formed of a conductive material, the conductive member 20 and the heat radiating member are insulated. Instead of providing a heat dissipation member, at least a part of the conductive member 20 may be exposed to the outside, and the conductive member 20 itself may exhibit a heat dissipation function.

The electronic component 30 is an element mounted on the substrate 10 and has a main body 31 and a terminal. The terminals of the electronic component 30 in this embodiment can be classified into those that are electrically connected to the conductive member 20 and those that are electrically connected to the conductive pattern 101 formed on the substrate 10. Hereinafter, what is electrically connected to the conductive member 20 may be referred to as a first terminal, and what is electrically connected to the conductive pattern 101 formed on the substrate 10 may be referred to as a second terminal. An example of the electronic component 30 is a transistor (FET). In this case, the drain terminal 32 and the source terminal 33 correspond to the first terminal, and the gate terminal 34 corresponds to the second terminal. In the following description, the circuit structure 1 will be described by taking a transistor (FET) as an example of the electronic component 30. However, for easy understanding, the transistor includes a drain terminal 32, a source terminal 33, and a gate terminal 34. Suppose you have one by one. However, each terminal may not be one. In addition, electronic components (elements) other than transistors may be mounted on the substrate 10.

The drain terminal 32 which is the first terminal is located on one side of the main body 31. The source terminal 33 which is the first terminal is located on the other side of the main body 31 (the side opposite to the side where the drain terminal 32 is located). The gate terminal 34 as the second terminal is located on the same side as the source terminal 33. Each terminal is located below the main body 31. Specifically, a part of the terminal is exposed on the bottom surface of the main body 31.

In the conductive member 20, in order to prevent a short circuit between the drain terminal 32 and the source terminal 33, the portion to which the drain terminal 32 is connected (hereinafter also referred to as the first portion 21) and the source terminal 33 are connected. The portion (sometimes referred to as the second portion 22) is divided. An opening 11 through which the electronic component 30 can pass is formed in the substrate 10. The electronic component 30 (main body portion 31) in the present embodiment is placed on the conductive member 20 through the opening 11. Since the drain terminal 32 is located on one side of the main body 31 and the source terminal 33 is located on the other side of the main body 31, the electronic component 30 (main body 31) is connected to the first portion 21 of the conductive member 20 and the second portion 21. Placed on the conductive member 20 so as to straddle the portion 22 (so that a space between the first portion 21 and the second portion 22 is located between the drain terminal 32 and the source terminal 33 and the gate terminal 34). Is done. The drain terminal 32 is connected to the first portion 21 and the source terminal 33 is connected to the second portion 22 by soldering or the like. Since any connection structure between the drain terminal 32 or the source terminal 33 and the conductive member 20 may be used, detailed description thereof is omitted.

The gate terminal 34 is located on the same side as the source terminal 33 (the other side of the main body 31). In the present embodiment, the second portion 22 of the conductive member 20 has a shape that is partially cut out, and the cut-out portion (hereinafter also referred to as a cut-out portion 221). And the gate terminal 34 overlap in the height direction. Specifically, the first portion 21 and the second portion 22 are arranged such that the side edges facing each other are positioned substantially parallel to each other, but a part of the second portion 22 is separated from the first portion 21. It is notched so as to be far away (having a concave shape in plan view), and the notched portion and the gate terminal 34 overlap. That is, the conductive member 20 (second portion 22) has a shape that does not overlap the gate terminal 34 in the height direction, and the gate terminal 34 is exposed without being covered by the conductive member 20 (FIGS. 2 and 3). Etc.). In the present embodiment, the conductive member 20 has a shape that does not overlap the entire gate terminal 34, but may have a shape that overlaps part of the gate terminal 34 and does not overlap other parts. As will be described later, since the gate terminal 34 is electrically connected to the first terminal connection portion 12, at least the first terminal connection portion 12 side of the gate terminal 34 may have a structure that does not overlap the conductive member 20. . In the case of such a configuration, a part of the gate terminal 34 and the conductive member 20 (second portion 22) overlapping therewith are insulated from each other so as not to be short-circuited.

Further, on the other surface 10 b of the substrate 10, a first terminal connection portion 12 made of a conductive material (the “first” of the first terminal connection portion is distinguished from the second terminal connection portion 13 described later). (It is only a formal one attached to (1)) (see FIGS. 3 to 5 etc.). The first terminal connection portion 12 is electrically connected to the conductive pattern 101 formed on the one surface 10 a of the substrate 10. The connection structure between the first terminal connection portion 12 and the conductive pattern 101 may be any type. For example, both may be connected by a conductive member passed through a through hole penetrating the substrate 10.

The first terminal connection portion 12 in the present embodiment overlaps with the notch portion 221 formed in the second portion 22 of the conductive member 20 in the height direction. That is, the conductive member 20 (second portion 22) has a shape that does not overlap not only the gate terminal 34 but also the first terminal connection portion 12 in the height direction. Therefore, the 1st terminal connection part 12 is exposed without being covered with the electrically-conductive member 20 (refer FIG. 3 etc.). In the present embodiment, the gate terminal 34 and the first terminal connection portion 12 are set so as to be aligned along the direction along the other edge of the main body portion 31, and block between the gate terminal 34 and the first terminal connection portion 12. There is nothing. That is, the conductive member 20 (second portion 22) does not exist between the gate terminal 34 and the first terminal connection portion 12.

In the present embodiment, the gate terminal 34 and the first terminal connecting portion 12 are formed of a first lead member 40 formed of a conductive material (the “first” of the first lead member is distinguished from the second lead member described later). (It is only a formal one attached to the network) (see FIGS. 3 to 5 etc.). That is, the gate terminal 34 and the first terminal connecting portion 12 are electrically connected by the first lead member 40. More specifically, since the first terminal connection portion 12 and the conductive pattern 101 (circuit) formed on the one surface 10a of the substrate 10 are electrically connected, the gate terminal 34 connects the first terminal connection portion 12 with each other. It is electrically connected to the conductive pattern 101 formed on the one surface 10a of the substrate 10 via.

Thus, since the conductive member 20 has a shape that does not overlap the gate terminal 34 and the first terminal connecting portion 12 and does not block between the two, the both sides of the conductive member 20 are left as they are on the other surface 10b side of the substrate 10. By providing the first lead member 40 so as to be bridged (one end of the first lead member 40 is connected to the gate terminal 34 and the other end is connected to the first terminal connection portion 12), both can be electrically connected. it can. As a connection method of the first lead member 40, so-called wire bonding or the like can be exemplified. By applying a conductive member such as solder so as to bridge the two, the two may be electrically connected (the solder or the like may function as the first lead member 40).

Hereinafter, although it overlaps with said description partially, the suitable manufacturing method of the circuit structure 1 concerning this embodiment is demonstrated.

First, the other side of the substrate 10 on which the conductive pattern 101, the opening 11 for placing the electronic component 30 on the conductive member 20, and the first terminal connection portion 12 electrically connected to the conductive pattern 101 are formed. The conductive member 20 in which the notch 221 is formed is joined to the surface 10b (first step). Thereby, the substrate 10 and the conductive member 20 set are obtained. The bonding material for bonding the substrate and the conductive member 20 is to electrically insulate between the two. In addition, when performing the said 1st process, the 1st part 21 and the 2nd part 22 of the electrically-conductive member 20 are connected via the extra length part. The surplus portion is cut after this step. The cutting timing is not particularly limited.

Next, various elements such as the electronic component 30 are mounted on the substrate 10 and the conductive member 20 set obtained in the first process (second process). The mounting method (a method such as soldering) may be any method. In the electronic component 30 (transistor) described above, the drain terminal 32 is connected to the first portion 21 of the conductive member 20 and the source terminal 33 is connected to the second portion 22 of the conductive member 20 in this step. That is, the first terminal of the electronic component 30 is connected to the conductive member 20. It can be said that the electronic component 30 (main body portion 31) is mechanically joined to the conductive member 20 (the substrate 10 and the conductive member 20 set) by this step.

Next, the gate terminal 34 (second terminal) of the electronic component 30 and the first terminal connection portion 12 are electrically connected by the first lead member 40 (third step). Thereby, the gate terminal 34 is electrically connected to the conductive pattern 101, and the circuit structure 1 according to the present embodiment is obtained. Steps other than these first step to third step, for example, a step of joining a heat radiating member to the conductive member 20 (in the case of a circuit structure including a heat radiating member) may be included.

As described above, the circuit configuration body 1 according to the present embodiment has a shape in which the conductive member 20 does not overlap at least a part of the gate terminal 34 (second terminal) of the electronic component 30 and the first terminal connection portion 12. It has become. Therefore, the electrical connection between the gate terminal 34 and the first terminal connection portion 12 can be made from the conductive member 20 side (downward), and the electrical connection (connection) between the second terminal and the conductive pattern 101 formed on the substrate 10. Work) is easy. It is not necessary to absorb a step generated between the one surface 10a of the substrate 10 and the surface of the conductive member 20 on the substrate 10 side by bending the terminal as in the prior art. Moreover, even if the length of the terminal is short, connection does not become difficult.

For example, the following configuration can be considered as a modification of the circuit configuration body 1. The modification (first modification) shown in FIG. 6 is different from the circuit configuration body 1 according to the above-described embodiment in that the first terminal connection portion 12 is not provided on the other surface 10 b of the substrate 10. That is, for example, the conductive pattern 101 in which the portion (land) to which the gate terminal 34 is to be connected is formed on the side edge on the gate terminal 34 side (second terminal side) on the one surface 10 a of the substrate 10. 34 and the conductive pattern 101 may be connected via the first lead member 40 or directly. Even in such a case, since at least a part of the gate terminal 34 does not overlap the conductive member 20 (second portion 22), the conductive pattern 101 and the conductive pattern 101 are used by utilizing the portion not overlapping the conductive member 20. Can be easily connected. That is, if the first terminal connection portion 12 as described above is provided on the other surface 10b of the substrate 10, the gate terminal 34 and the conductive pattern 101 can be easily electrically connected. Even if the connecting portion 12 is not provided, the gate terminal 34 and the conductive pattern 101 (circuit) formed on the substrate 10 are compared to the conventional case because the gate terminal 34 is exposed without being covered with the conductive member 20. Easy electrical connection.

In the configuration shown in FIG. 6, the first terminal connection portion 12 to which the gate terminal 34 is electrically connected is assumed to be provided on one surface 10 a of the substrate 10 (the gate terminal 34 should be connected). The portion (land) can be regarded as the first terminal connection portion 12). The first terminal connection portion 12 may be provided on the end surface (side surface) of the substrate 10 on the gate terminal 34 side.

Further, as another modified example (second modified example), configurations shown in FIGS. 7 and 8 are conceivable. In this example, between the one surface 10a and the other surface 10b of the substrate 10, the second terminal connection portion 13 (the “second” of the second terminal connection portion 13 is the same as the first terminal connection portion 12 described above. It is only a formal one attached to distinguish). Specifically, a second terminal connection portion 13 that is electrically connected to the conductive pattern 101 formed on one surface 10 a of the substrate 10 is provided along the inner peripheral surface of the through hole formed in the substrate 10. It has been. For example, the second terminal connection portion 13 can be constructed by fixing a so-called through hole to the substrate 10. That is, the cylindrical portion of the through hole can be the second terminal connection portion 13. However, a general through hole is used to electrically connect one surface 10a and the other surface 10b of the substrate 10, but does not need to extend to the other surface 10b. That is, the conductive pattern 101 formed on the one surface 10a may have a structure extending to at least the inner peripheral surface of the through hole formed in the substrate 10.

The second terminal connection portion 13 is provided so as not to overlap the conductive member 20. That is, the second terminal connection portion 13 overlaps the notch portion 221 formed in the conductive member 20. In other words, the opening on the other surface 10 b side of the through hole in which the second terminal connection portion 13 is formed is exposed without being covered by the conductive member 20.

In this example, the gate terminal 34 and the second terminal connecting portion 13 are formed of a second lead member 50 formed of a conductive material (the “second” of the second lead member 50 is distinguished from the first lead member 40 described above). Only the formal ones attached to it). That is, the gate terminal 34 and the second terminal connection portion 13 are electrically connected by the second lead member 50. More specifically, since the second terminal connection portion 13 and the conductive pattern 101 (circuit) formed on the one surface 10a of the substrate 10 are electrically connected, the gate terminal 34 connects the second terminal connection portion 13 with each other. It is electrically connected to the conductive pattern 101 formed on the one surface 10a of the substrate 10 via.

The second lead member 50 (refer to FIG. 9 for details) has a contact terminal portion 521 that contacts the second terminal connection portion 13. The contact terminal portion 521 is provided on one side of the second lead member 50. Specifically, the second lead member 50 has a portion along the plane direction (hereinafter referred to as a proximal end portion 51) and a portion along the height direction (hereinafter referred to as a distal end portion 52). The contact terminal portion 521 is formed on the distal end side portion 52 in an “L” shape. The contact terminal portion 521 in this example is a portion having a substantially “O” shape that swells outward. The width of the portion is set to be slightly larger than the inner diameter of the through hole (second terminal connection portion 13). Therefore, when the distal end side portion 52 is inserted into the through hole, the contact terminal portion 521 is pushed by the second terminal connecting portion 13 and elastically deformed. That is, the contact terminal portion 521 is pressed against the second terminal connecting portion 13 by the elasticity of the contact terminal portion 521.

The proximal end portion 51 of the second lead member 50 is connected to the gate terminal 34 by solder or the like. As a result, the gate terminal 34 and the second terminal connection portion 13 are electrically connected.

As described above, the gate terminal 34 and the conductive pattern 101 can be electrically connected through the second terminal connection portion 13 provided between the one surface 10a and the other surface 10b of the substrate 10. The second terminal connection portion 13 can be formed along the inner peripheral surface of the through hole of the substrate 10. By using the second lead member 50 having the contact terminal portion 521 that comes into contact with the second terminal connection portion 13 with a predetermined pressure by being inserted into the through hole, an operation for achieving electrical connection is facilitated.

The electrical connection structure between the second terminal connection portion and the second lead member can be as follows (third modification). As shown in FIGS. 10 and 11, the second terminal connecting portion 13a (the inner peripheral surface of the through hole) has a shape whose distance from the central axis is not constant. For example, the size in a certain direction is relatively large (hereinafter, the portion is referred to as a long portion), and the size in a direction orthogonal to the certain direction is relatively small (hereinafter, the portion is referred to as a short portion). ) Shape. In other words, the cross-sectional shape is elongated. In this example, the cross section is elliptical.

The contact terminal portion 521a provided on the second lead member 50a (see FIG. 12 for details) is a protrusion protruding from the tip end portion 52a (a protrusion protruding so as to intersect the longitudinal direction of the tip end portion 52a). The length is shorter than the long portion of the second terminal connection portion 13a and longer than the short portion.

The second lead member 50a is electrically connected to the second terminal connection portion 13a as follows. The contact terminal portion 521a (tip side portion 52a) of the second lead member 50a is inserted inside the second terminal connection portion 13a (through hole). At this time, the longitudinal direction of the contact terminal portion 521a is made to coincide with the longitudinal portion of the second terminal connection portion 13a. Since the length of the contact terminal portion 521a is smaller than the length of the longitudinal portion of the second terminal connection portion 13a, the contact terminal portion 521a is smoothly inserted into the second terminal connection portion 13a (through hole) (see FIG. 10).

After the contact terminal portion 521a is inserted inside the second terminal connection portion 13a (through hole), the second lead member 50a is rotated around the tip end side portion 52a. Then, since the length of the contact terminal part 521a is smaller than the length of the short part of the second terminal connection part 13a, the contact terminal part 521a is pressed inside the short part of the second terminal connection part 13a. It becomes. That is, the second lead member 50a and the second terminal connection portion 13a are electrically connected. Further, when the second lead member 50a is rotated in this way, the base end side portion 51a moves to the gate terminal 34 side, so that the base end side portion 51a and the gate terminal 34 are easily connected (for example, soldering). (Easy) positional relationship (see FIG. 11).

In addition, although the said 2nd modification and a 3rd modification show the electrical connection structure of the gate terminal 34 and the conductive pattern 101 which are different from the circuit structure 1 concerning the said embodiment, this 2nd modification is shown. It is good also as a circuit structure body which the connection structure demonstrated in the modification and the 3rd modification, and the connection structure demonstrated in the said embodiment were combined (mixed).

As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment at all, A various change is possible in the range which does not deviate from the summary of this invention.

For example, although it has been described that the electronic component 30 (transistor) in the above embodiment is one in which the main body 31 is placed on the conductive member 20, the same technology is applied to those placed on the substrate 10. The idea is applicable. However, the structure in which the main body 31 is placed on the conductive member 20 is a terminal other than the second terminal (gate terminal 34) to be electrically connected to the conductive pattern 101 formed on the substrate 10. The operation of connecting certain first terminals (drain terminal 32, source terminal 33) to the conductive member 20 is facilitated, and the reliability of electrical connection between the first terminal and the conductive member 20 is improved. Further, if the main body 31 is placed on the conductive member 20, the difference between the height direction position of the second terminal and the height direction position of the other surface 10b of the substrate 10 is reduced, so When providing the 1st terminal connection part 12 or the 2nd terminal connection part 13 (13a) in the surface 10b, the connection operation of a 2nd terminal and the 1st terminal connection part 12, or the 2nd terminal and the 2nd terminal connection part 13 (13a) There is an advantage that the connection work becomes easy.

Moreover, in the said embodiment, the conductive member 20 does not overlap with at least one part of a 2nd terminal (gate terminal 34) by forming the notch part 221 in the conductive member 20 (2nd part 22). However, the configuration (shape) for preventing at least a part of the second terminal and the conductive member 20 from overlapping is not limited to the formation of the notch 221. By forming a through hole in the conductive member 20, at least a part of the second terminal and the conductive member 20 may not overlap. The same applies to the method of preventing the first terminal connection portion 12 and the second terminal connection portion 13 (13a) from overlapping the conductive member 20.

In the above embodiment, a transistor is described as an example of the electronic component 30. However, a part of the plurality of terminals is electrically connected to the conductive member 20 and the other part is formed on the substrate 10. The electronic component 30 is not limited to a transistor as long as it is electrically connected to the pattern 101.

Claims

A substrate having a conductive pattern formed on one surface;
A conductive member fixed to the other surface of the substrate;
An electronic component having a first terminal electrically connected to the conductive member and a second terminal electrically connected to a conductive pattern formed on the substrate;
With
The circuit structure according to claim 1, wherein the conductive member has a shape that does not overlap at least a part of the second terminal of the electronic component.
On the other surface of the substrate, the first terminal connection portion is provided so as not to overlap the conductive member,
The circuit structure according to claim 1, wherein the second terminal of the electronic component is electrically connected to the conductive pattern via the first terminal connection portion.
3. The circuit structure according to claim 2, further comprising a first lead member that electrically connects the second terminal of the electronic component and the first terminal connection portion.
Between one surface of the substrate and the other surface, a second terminal connection portion is provided so as not to overlap the conductive member,
4. The device according to claim 1, wherein the second terminal of the electronic component is electrically connected to the conductive pattern through the second terminal connection portion. 5. Circuit construct.
The circuit structure according to claim 4, further comprising a second lead member that electrically connects the second terminal of the electronic component and the second terminal connection portion.
The second terminal connection portion is formed along an inner peripheral surface of a through hole formed in the substrate,
The circuit structure according to claim 5, wherein the second lead member has a contact terminal portion that is inserted into the through hole and contacts the second terminal connection portion on one side thereof.
The circuit configuration according to claim 1, wherein an opening is formed in the substrate, and the electronic component is placed on the conductive member through the opening. body.