WO2016117486A1

WO2016117486A1 - Porous structure and manufacturing method thereof

Info

Publication number: WO2016117486A1
Application number: PCT/JP2016/051220
Authority: WO
Inventors: 萬壽　優; 直樹河原; 近藤　孝志; 誠治神波
Original assignee: 株式会社村田製作所
Priority date: 2015-01-19
Filing date: 2016-01-18
Publication date: 2016-07-28
Also published as: JP6540715B2; JPWO2016117486A1

Abstract

A membranous porous structure having a first main surface and a second main surface that face each other, wherein the porous structure is provided with a membranous first layer including the first main surface and having multiple first void portions penetrating in the normal direction to the first main surface, and a membranous second layer including the second main surface and having multiple second void portions penetrating in the normal direction to the second main surface, the first layer and the second layer being directly or indirectly bonded to each other, each of the multiple first void portions overlapping two or more of the multiple second void portions in a planar view seen from the normal direction to the first main surface, each of the multiple second void portions overlapping two or more of the multiple first void portions in a planar view seen from the normal direction to the second main surface, and through-holes penetrating the first main surface and the second main surface being present in portions in which the multiple first void portions and the multiple second void portions overlap each other.

Description

Porous structure and method for producing the same

The present invention relates to a porous structure and a method for producing the same.

As a method for measuring the amount of the target object (object to be measured) in the sample, the target object in the sample is collected in the porous structure using a porous structure having a plurality of pores as a filter. A method of using a porous structure in which an object is collected for measurement is known.

Here, when the target object is a minute object contained in a fluid (specimen) such as PM2.5 existing in the atmosphere or an endoplasmic reticulum contained in blood, in order to collect the minute object, A porous (mesh-like) structure having pores smaller than those of the object is required.

However, there is a technical limit to the refinement of holes. Even if the hole size is manufacturable, the smaller the hole size (for example, 1 μm or less), the higher the manufacturing cost due to the decrease in yield rate, the complexity of the manufacturing process and equipment, etc. Problem arises.

Patent Document 1 (International Publication No. 2014/192919), paragraph [0047] and FIG. 8, and Patent Document 2 (Japanese Utility Model Laid-Open No. 59-10879) have two through holes (voids). Disclosed is a porous structure formed by laminating a single void arrangement structure so that one of the void portions of one void arrangement structure partially overlaps only one of the void portions of the other void arrangement structure Has been. By producing the filter in this way, a filter having a minute gap can be produced relatively easily.

In Patent Document 3 (Japanese Patent Laid-Open No. 2010-42349) and Patent Document 4 (Japanese Patent Laid-Open No. 11-276820), two layers of wire rods arranged in parallel are laminated so that their directions are different from each other by 90 °. A filter (porous structure) in which a smaller network is formed by laminating a plurality of network structures so that the positions of the meshes are shifted from each other is disclosed. Yes.

International Publication No. 2014/192929 Japanese Utility Model Publication No.59-10879 JP 2010-42349 A Japanese Patent Laid-Open No. 11-276820

When two void arrangement structures are stacked like the porous structures disclosed in

Patent Documents

1 and 2, voids smaller than the voids of the individual void arrangement structures can be formed. However, since the aperture ratio is greatly reduced as compared with the gaps of the individual gap arrangement structures, there is a problem that the efficiency of filtration or the efficiency of electromagnetic wave measurement is lowered.

Further, the porous structures disclosed in Patent Documents 3 and 4 are laminates of wire rods arranged in parallel, and the wires constituting the wire rods are not joined to each other in each layer. The strength is low with respect to the force from the lateral direction of the wire in the direction parallel to the surface. Moreover, since the porous structure disclosed in Patent Document 3 does not join the wires between the layers, positional displacement is likely to occur with respect to the force from the same direction. Therefore, when these porous structures are used as sieves, there has been a problem that the wire is easily deformed by stress due to the object, impurities, fluid, etc., and the strength of the porous structure is not sufficient.

In view of the above circumstances, an object of the present invention is to provide a porous structure having a small opening and a high opening ratio and sufficient strength, and a method for manufacturing the same.

The present invention is a membrane-like porous structure having a first main surface and a second main surface facing each other,
A film-like first layer that includes the first main surface and has a plurality of first voids penetrating in the normal direction of the first main surface;
A film-like second layer including a plurality of second voids including the second main surface and penetrating in a normal direction of the second main surface;
The first layer and the second layer are bonded directly or indirectly,
In a plan view seen from the normal direction of the first main surface, each of the plurality of first gaps overlaps two or more of the plurality of second gaps,
In a plan view seen from the normal direction of the second main surface, each of the plurality of second voids overlaps two or more of the plurality of first voids,
The present invention relates to a porous structure having a through hole penetrating the first main surface and the second main surface in a portion where the plurality of first void portions and the plurality of second void portions overlap. .

It is preferable that the first layer and the second layer are separated from each other, and the first layer and the second layer are indirectly bonded via a connecting portion.

It is preferable that a projection projecting from the surface of the second layer to the first layer side is provided inside at least one of the plurality of second gap portions of the second layer.

Further, the present invention is a method for producing a membrane-like porous structure having a first main surface and a second main surface facing each other,
A first layer forming step of forming, on the first main surface side, a film-shaped first layer having a plurality of first voids penetrating in a normal direction of the main surface;
A film-like second layer having a plurality of second voids penetrating in the normal direction of the main surface is formed on the second main surface side of the first layer, and the first layer, the second layer, A second layer forming step of obtaining the porous structure by directly or indirectly bonding
In the second layer forming step,
In a plan view seen from the normal direction of the first main surface, each of the plurality of first gap portions overlaps two or more of the plurality of second gap portions,
In a plan view seen from the normal direction of the second main surface, each of the plurality of second gaps overlaps two or more of the plurality of first gaps,
In the portion where the plurality of first gap portions and the plurality of second gap portions overlap, the second layer is formed such that a through-hole penetrating the first main surface and the second main surface is formed. The present invention relates to a method for manufacturing a porous structure.

Further, the present invention is a membrane-like porous structure having a first main surface and a second main surface facing each other,
A film-like first layer including at least one first void including the first principal surface and penetrating in a normal direction of the first principal surface;
A film-like second layer including at least one second void portion including the second main surface and penetrating in a normal direction of the second main surface;
The first layer and the second layer are separated from each other, and the first layer and the second layer are indirectly coupled via a connecting portion;
In the plan view seen from the normal direction of the first main surface, not all of the at least one first gap portion overlaps the at least one second gap portion,
The porous structure which has a through-hole which penetrates the said 1st main surface and the said 2nd main surface.

According to the present invention, it is possible to provide a porous structure having a high opening ratio and sufficient strength while having a minute opening, and a method for manufacturing the same.

2 is a schematic diagram illustrating a structure of a porous structure according to Embodiment 1. FIG. (A) is a perspective view, (b) is a plan view. FIG. 3 is a schematic diagram showing structures of a first layer and a second layer that constitute the porous structure of Embodiment 1. (A) is a perspective view, (b) is a plan view. FIG. 5 is a schematic diagram for explaining one of the advantages of the first embodiment. (A) is a perspective view, (b) is a plan view. It is a schematic diagram as a comparison for demonstrating one of the advantages of Embodiment 1. FIG. (A) is a perspective view, (b) is a plan view. 6 is a plan view showing a structure of a modified example of the porous structure according to Embodiment 1. FIG. 6 is a plan view showing a structure of another modified example of the porous structure according to Embodiment 1. FIG. 6 is a plan view showing a structure of still another modified example of the porous structure according to Embodiment 1. FIG. 6 is a perspective view showing a structure of a porous structure according to Embodiment 2. FIG. 6 is a perspective view showing a structure of a modification of the porous structure according to Embodiment 2. FIG. (A) And (b) shows the same porous structure, and only a viewpoint differs. 6 is a perspective view showing a structure of another modified example of the porous structure according to Embodiment 2. FIG. (A) And (b) shows the same porous structure, and only a viewpoint differs. 6 is a perspective view showing a structure of a porous structure according to Embodiment 3. FIG. FIG. 3 is a cross-sectional view for explaining the method for manufacturing the porous structure according to the first embodiment. 6 is a cross-sectional view for explaining a method for producing a porous structure according to Embodiment 2. FIG. 6 is a perspective view for explaining a method for producing a porous structure according to Embodiment 2. FIG. 6 is a schematic diagram illustrating a structure of a porous structure according to Embodiment 4. FIG. (A) is the perspective view seen from the 2nd layer side, (b) is the perspective view seen from the 1st layer side, (c) is the figure which added the 2nd metal film to (a). . 6 is a cross-sectional view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 6 is a cross-sectional view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 10 is a perspective view for explaining an example of a method for producing a porous structure according to Embodiment 4. FIG. 6 is a perspective view showing a structure of a porous structure according to Embodiment 4. FIG. FIG. 6 is a perspective view showing structures of a first layer and a second layer that constitute a porous structure according to a fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment. FIG. 10 is a perspective view for explaining another example of the method for producing a porous structure according to the fourth embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same reference numerals represent the same or corresponding parts. In addition, dimensional relationships such as length, width, thickness, and depth are changed as appropriate for clarity and simplification of the drawings, and do not represent actual dimensional relationships.

Each embodiment is an exemplification, and it is needless to say that partial replacement or combination of configurations shown in different embodiments is possible. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

[Embodiment 1]
(Porous structure)
Referring to FIG. 1, the porous structure of the present embodiment is a film-like porous structure having a first main surface 11a and a second main surface 12a facing each other, and is a film-like first layer. 11 and a film-like second layer 12.

The first layer 11 includes a first main surface 11a and has a plurality of first gap portions 101 penetrating in the normal direction of the first main surface 11a. The second layer 12 includes a second main surface 12a and has a plurality of second gap portions 102 penetrating in the normal direction of the second main surface 12a.

As shown in FIG. 1, the first layer 11 and the second layer 12 are directly coupled to each other at a portion 12 b where they overlap each other.

And in the planar view seen from the normal line direction of the first main surface, each of the plurality of first gap portions 101 overlaps two or more of the plurality of second gap portions 102. Moreover, in the planar view seen from the normal line direction of the 2nd main surface, each of several 2nd space | gap part has overlapped with 2 or more of several 1st space | gap parts.

In a portion where the plurality of first gap portions 101 and the plurality of second gap portions 102 overlap with each other, a through hole 103 penetrating the first main surface 11a and the second main surface 12a is provided. One through-hole 103 includes a part of one first gap part 101 and a part of one second gap part 102.

In the porous structure of the present embodiment, through-holes 103 having a size smaller than that of the first gap 101 and the second gap 102 are formed by such a configuration. For example, as shown in FIG. 1B, the hole size (D shown in FIG. 2B) of the first gap portion 101 and the second gap portion 102 is 1.0 μm, and the width of the crosspiece portion (FIG. 2B). When w) shown in b) is 0.4 μm and the pitch (total of hole size and crosspiece width: P shown in FIG. 2B) is 1.4 μm, the hole size of the through hole 103 is 0.3 μm. Thus, the pitch is 0.7 μm.

The crosspiece is a portion of the first layer 11 (second layer 12) other than the first gap portion 101 (second gap portion 102) when viewed from the normal direction of the first main surface 11a. This is a portion excluding the portion constituting the entire outer edge of the first layer (second layer). At least one of the first layer and the second layer of the present embodiment has a branch at the crosspiece.

(First layer and second layer)
With reference to FIG. 2, the first layer 11 and the second layer 12 constituting the porous structure of the present embodiment have a pair of main surfaces facing each other, and a plurality of voids penetrating both main surfaces. have. For example, the plurality of gaps are periodically arranged in at least one direction on the first major surface 11a (second major surface 12a) of the first layer 11 (second layer 12). However, all of the gaps may be periodically arranged, and within a range that does not impair the effects of the present invention, some of the gaps are periodically arranged and other gaps are non-periodically. It may be arranged.

The first layer 11 (second layer 12) is preferably a quasi-periodic structure or a periodic structure. A quasi-periodic structure is a structure that does not have translational symmetry but is maintained in order. Examples of the quasi-periodic structure include a Penrose structure as a two-dimensional quasi-periodic structure. The term “periodic structure” refers to a structure having spatial symmetry as represented by translational symmetry, and is preferably a two-dimensional periodic structure. Examples of the two-dimensional periodic structure include a mesh filter and a two-dimensional diffraction grating.

As the two-dimensional periodic structure, for example, a film-like structure (lattice-like structure) in which voids are arranged at regular intervals in a matrix shape as shown in FIG. The first layer 11 (second layer 12) shown in FIG. 2A has a square first gap portion 101 (second gap portion 102) as viewed from the first main surface 11a (second main surface 12a) side. These are film-like structures provided at equal intervals in two arrangement directions (vertical direction and horizontal direction in the drawing) parallel to each side of the square.

The first layer 11 (second layer 12) preferably includes at least a part including the surface thereof, and more preferably the entire porous structure is formed of a conductor. Here, the conductor is an object (material) that conducts electricity, and includes not only metals but also semiconductors.

As the metal, a metal that can be bonded to a functional group of a compound having a functional group such as a hydroxy group, a thiol group, or a carboxyl group, a metal that can coat a functional group such as a hydroxy group or an amino group on the surface, and these An alloy of these metals can be mentioned. Specifically, nickel, gold, silver, copper, platinum, iron, chromium, silicon, germanium and the like can be mentioned, preferably nickel, gold, silver, copper, platinum and chromium, and more preferably nickel and gold. Can be mentioned.

Examples of semiconductors include group IV semiconductors (Si, Ge, etc.), group II-VI semiconductors (ZnSe, CdS, ZnO, etc.), group III-V semiconductors (GaAs, InP, GaN, etc.), group IV compounds, and the like. Compound semiconductors such as semiconductors (SiC, SiGe, etc.), I-III-VI group semiconductors (CuInSe ₂ etc.), and organic semiconductors can be mentioned.

In addition, the combination of the material of the 1st layer 11 and the 2nd layer 12 is not specifically limited, However, From a viewpoint of obtaining a uniform characteristic as the whole porous structure, it is preferable that it is a combination of the same kind of material.

Further, it is preferable that the first layer 11 and the second layer 12 have the same size, shape, pitch, and the like of the voids. In this case, through-holes having a uniform size can be regularly arranged in the porous structure. As a result, strict sieving can be performed as a filter, and measurement with high accuracy can be performed as a measurement device.

However, special characteristics may be imparted to the porous structure by changing the material of the first layer 11 and the second layer 12 and the size, shape, pitch, etc. of the voids. For example, the pitch of the first layer 11 and the second layer 12 may be the same, and the width of the crosspieces of the first layer 11 and the second layer 12 may be different. By making the widths of the crosspieces of the first layer 11 and the second layer 12 different, the hole size of the through-hole 103 can be changed, whereby a porous structure having a finer and uniform pore diameter can be obtained. It is also possible to provide. Further, when the width of one of the first layer 11 and the second layer 12 is increased, the strength of the porous structure can be increased while increasing the aperture ratio. The strength of the porous structure can be increased by reducing the opening ratio of one of the first layer 11 and the second layer 12 with the same width.

(filter)
The porous structure of the present embodiment can be used as a filter (sieving) for collecting a target contained in a fluid (specimen).

The fluid is, for example, a gas or a liquid. Examples of the target substance include inorganic substances, organic substances or composites thereof contained in a fluid, or microorganisms or cells. In addition, the target object should just have a shape in the state which exists in the fluid, and may be not only solid but liquid, sol, or gel.

Examples of the inorganic substance, organic substance, or composite thereof in the gas include PM (Particle Matter) 2.5, SPM (Suspended Particulate Matter), PM10, and pollen in the atmosphere. PM2.5 is a particulate substance floating in the atmosphere, and has a particle diameter of approximately 2.5 μm or less.

In addition to the above-described target object, for example, the porous structure of the present embodiment can be applied to collection of the following target object.

In order to filter cells in the liquid (for example, a total amount of 1 mL of PBS solution containing 5 × 10 ⁴ substantially spherical HL60 having a diameter of 9 μm), the porous structure of the above embodiment can be applied.

Also, as a new test method for cancer, research for quantifying exosomes (endoplasmic reticulum) derived from cancer cells in blood is underway. The size of exosome is about several hundred nanometers, and the porous structure of the above embodiment is applied to collect (filter and concentrate) only exosomes from blood samples from which leukocytes, erythrocytes and other blood cells have been removed. can do.

In addition, since norovirus cannot be cultured, a considerable amount of time has passed since the onset of the disease, and there is a problem that inspection cannot be performed unless the number of viruses increases. However, a trace amount of virus is collected with a porous structure (filtration and concentration). If possible, rapid inspection is possible without culturing. For this reason, the porous structure of the said embodiment can also be applied to such selective collection of viruses.

“Catching” the target object means, for example, that the target object is physically held in the pores of the filter, or that the target object is directly or indirectly applied to the surface of the filter modified so that the target object is easily adsorbed. It means to attach an object.

The size of the through-hole 103 of the porous structure used as a filter is not particularly limited as long as the target can be collected. For example, the size of the target cannot physically pass or is difficult to pass. It is preferable. Here, the “size that the target object is difficult to pass” means that the target object can be partially deformed (eg, nucleated cells), and is smaller than the size of the part where the target object is not deformable. Means. When the entire target object is deformed, the size of the through-hole 103 is preferably less than 1/20 of the target object. When the porous structure is used as a filter, the size of the through hole 103 of the porous structure corresponds to the size of the filter hole.

The aperture ratio (the ratio of the total area of the through holes 103 to the area of the main surface of the porous structure including the first void 101 or the second void 102) is a viewpoint of increasing the flow velocity of the fluid passing through the porous structure. To 3% or more, more preferably 10% or more.

In the porous structure according to the present embodiment, each of the plurality of first voids overlaps two or more of the plurality of second voids in a plan view viewed from the normal direction of the first main surface. . Moreover, in the planar view seen from the normal line direction of the 2nd main surface, each of several 2nd space | gap part has overlapped with 2 or more of several 1st space | gap parts. And in the part which the some 1st space | gap part and the some 2nd space | gap part have overlapped, it has a through-hole which penetrates a 1st main surface and a 2nd main surface.

Thereby, like the porous structure disclosed in

Patent Documents

1 and 2, one of the voids of one void arrangement structure partially overlaps only one of the voids of the other void arrangement structure. Compared with the case where it has, it becomes easy to raise the ratio of the part which comprises a through-hole among space | gap parts. Therefore, the porous structure of the present embodiment suppresses the decrease in the aperture ratio and reduces the filtration efficiency, electromagnetic wave measurement efficiency, and the like, as compared with the porous structures disclosed in

Patent Documents

1 and 2. Can be suppressed.

In addition, from the viewpoint of ensuring the strength of the porous structure, the opening ratio is preferably 80% or less, and more preferably 60% or less.

The aperture ratio is, for example, adjusting the opening size of the void portion indicated by D in FIG. 2B and the lattice spacing (pitch) of the void portion indicated by P in the first layer 11 and the second layer 12, It can be controlled by adjusting the arrangement of the first layer 11 and the second layer 12.

The thickness of the porous structure is preferably thin as long as the necessary mechanical strength can be maintained. When the thickness of the porous structure is increased, generally the pressure loss when the fluid is passed increases. This is because when the pressure loss of the porous structure increases, the flow rate becomes slow and it becomes difficult to flow the fluid, so that there is a problem that the processing efficiency is lowered.

In addition, since the porous structure disclosed in Patent Documents 3 and 4 described above is a laminated body of wire groups arranged in parallel, in order to form a mesh smaller than a mesh composed of two layers, It is necessary to laminate at least four layers of wire rods. Such a laminate (porous structure) has a problem that the thickness is increased.

On the other hand, the porous structure of the present embodiment can form minute through holes with half the number of layers. Therefore, the porous structure and the manufacturing method thereof according to the present embodiment are advantageous in obtaining a porous structure having a minute through hole and a small thickness.

The thicknesses of the first layer 11 and the second layer 12 are not particularly limited, but when the size of the gap is small, it is preferably 0.5 μm to 10 μm from the viewpoint of workability.

The surface of the porous structure used as a filter may be modified so that the target product is easily adsorbed. As long as the target can be chemically collected by this surface modification, the size of the through-hole 103 of the porous structure may be such that the target can physically pass therethrough. .

Examples of the modification such that the target product is easily adsorbed include coating with a substance having a high affinity for the target product. In addition, a modification that binds a host molecule to the surface of the porous structure may be performed so that the target substance is bound to the host molecule. Here, the host molecule is a molecule that can specifically bind the target substance. Examples of the combination of the host molecule and the target substance include an antigen and an antibody, a sugar chain and a protein, a lipid and a protein, Examples include molecular compounds (ligands) and proteins, proteins and proteins, single-stranded DNA and single-stranded DNA, and the like.

The porous structure of the present embodiment has an advantage that clogging is less likely to occur when used as a filter than a planar void arrangement structure as shown in FIG. This will be described below with reference to FIG. 3 and FIG. 4 as a comparison.

FIG. 3 shows a state where the target object 9 is collected using the porous structure of the present embodiment (see FIG. 1). FIG. 3 shows a closed portion 103 a that is blocked by the object 9 and an opening portion 103 b that is not blocked by the object 9 among the openings of the through-hole 103.

One advantage of the porous structure of the present embodiment is that the size of the first void portion 101 of the first layer 11 and the second void portion 102 of the second layer 12 is a small size that cannot be collected. The point is that the through-hole 103 is used to collect an object. Therefore, the size of the object 9 here is smaller than the size of the first gap portion 101 and the second gap portion 102 and larger than the size of the through hole 103.

For comparison, FIG. 4 uses a single-layer void arrangement structure (see FIG. 2) having a through hole 109 having the same size as the through hole 103 in FIG. The state which collected the thing 9 is shown. In FIG. 4, a closed portion 109 a that is blocked by the object 9 and an opening portion 109 b that is not blocked by the object 9 among the openings of the through hole 109 are shown.

As is clear from a comparison between FIG. 3 and FIG. 4, in the case of the porous structure of the present embodiment (FIG. 3), it can be seen that the relatively large opening 103b is maintained. Further, in the case of FIG. 3, since the opening of the through hole 103 is maintained not only in the plan view as shown in FIGS. 3B and 4B but also in the side surface direction in FIG. It can be seen that the fluid easily passes through the through hole 103 as compared with FIG.

As described above, in the porous structure of the present embodiment, the three-dimensional structure around the through-hole 103 makes it easier to maintain the opening of the through-hole 103 than in the single-layer structure with a void arrangement. It has the advantage that it does not occur easily.

(Measurement device)
Moreover, it can be used as a measurement device for irradiating a porous structure (filter) collecting the target object with electromagnetic waves and measuring the amount or characteristic of the target object using the electromagnetic wave characteristics of the porous structure.

Various known mechanisms can be used as a measurement method using the electromagnetic wave characteristics of the porous structure. For example, infrared spectroscopy such as FT-IR (Fourier transform infrared spectroscopy), terahertz time domain spectroscopy, and the like. Method (THz-TDS).

The electromagnetic wave used for the measurement is, for example, an electromagnetic wave that can cause scattering according to the structure of the filter, and specifically includes radio waves, infrared rays, visible rays, ultraviolet rays, X-rays, gamma rays, and the like. The frequency of the electromagnetic wave is not particularly limited, but is preferably 1 GHz to 1 PHz, and more preferably 20 GHz to 200 THz (terahertz wave).

As the electromagnetic wave, for example, a linearly polarized electromagnetic wave (linearly polarized wave) having a predetermined polarization direction or an unpolarized electromagnetic wave (nonpolarized wave) can be used. As linearly polarized electromagnetic waves, for example, a terahertz wave generated by the optical rectification effect of an electro-optic crystal such as ZnTe using a short light pulse laser as a light source, visible light emitted from a semiconductor laser, or emitted from a photoconductive antenna An electromagnetic wave etc. are mentioned. Non-polarized electromagnetic waves include infrared light emitted from a high-pressure mercury lamp or a ceramic lamp.

5 to 7 show modified examples of the porous structure of the present embodiment. In the modification shown in FIG. 5, the first layer 11 and the second layer 12 have a honeycomb structure having regular hexagonal voids. In the modification shown in FIG. 6, the first layer 11 and the second layer 12 have a honeycomb structure having a circular gap. In these modified examples, two layers are laminated so that one void portion of one layer overlaps three void portions of the other layer.

Note that the porous structure of the present embodiment is not limited to the above-mentioned shape, and may be composed of a first layer 11 and a second layer 12 having a void such as a regular triangle or a regular octagon. .

In the modification shown in FIG. 7, the structure of the first layer 11 and the second layer 12 is the same as that of the above embodiment, but one void portion of one layer overlaps two void portions of the other layer. Two layers are laminated. In the porous structure according to the embodiment shown in FIG. 1, two layers are laminated so that one void portion of one layer overlaps four void portions of the other layer.

(Method for producing porous structure)
The manufacturing method of the porous structure of the present embodiment is basically:
A first layer forming step of forming the first layer 11 on the first main surface 11a side which is one main surface of the porous structure;
By forming the second layer 12 on the second main surface 12a side which is the other main surface of the porous structure, and simultaneously bonding the first layer 11 and the second layer 12 together, the porous structure And a second layer forming step for obtaining a body.

Hereinafter, each step will be described with reference to FIG.
(First layer forming step)
In this step, the first layer 11 is formed on the first metal film 31 by a predetermined patterning by a predetermined method.

First, referring to FIG. 12A, a substrate 2 is prepared. Although the board | substrate 2 is not specifically limited, For example, it consists of Si.

Next, referring to FIG. 12B, a Ti film and a Cu film are formed in this order on the substrate 2 by sputtering, and a laminated film (first metal film 31) composed of the Ti film and the Cu film is formed. Form. The first metal film 31 is a layer that is removed by etching in a later step, but also functions as a seed layer for Ni plating when the first layer is formed.

The thickness of the first metal film 31 is not particularly limited, but is preferably as thin as possible within the range in which the porous structure of the present embodiment can be obtained because it is partially removed in a later step. Specifically, for example, the thickness of the first metal film 31 is preferably 100 to 600 nm. For example, the thickness of the Ti film may be about 20 nm, and the thickness of the Cu film may be about 200 nm to 500 nm.

Next, referring to FIG. 12C, a first resist 41 is formed on the first metal film 31. For example, the first resist 41 can be formed by a photolithography method. The first resist 41 is patterned so as to have an opening at a position corresponding to a portion where the first layer is formed, and a film-shaped first resist 41 having a plurality of first gap portions 101 penetrating in the normal direction of the main surface. Patterning is performed so that one layer 11 is formed.

Next, referring to FIG. 12D, the first layer 11 (Ni film) is formed on the surface of the first metal film 31 exposed in the opening of the first resist 41 by a plating method. In this way, a film-like first layer 11 having a plurality of first gap portions 101 penetrating in the normal direction of the main surface is formed.

(Second layer forming step)
In this step, the second layer 12 is formed on the first layer 11 by a deposition method by a predetermined patterning to obtain a porous structure.

First, referring to FIG. 12 (e), similarly to the first metal film 31, a laminated film (second metal film 32) made of a Ti film and a Cu film is formed on the first resist 41. The second metal film 32 is a layer that is partially removed by etching in a later step, but also functions as a seed layer for Ni plating when the second layer is formed.

Next, referring to FIG. 12 (f), a second resist 42 is formed on the second metal film 32. The second resist 42 is patterned so as to have an opening at a position corresponding to a portion where the second layer is formed, and is a film-like second having a plurality of second void portions penetrating in the normal direction of the main surface. Patterned to form a layer.

Further, in the patterning, in the plan view seen from the normal direction of the first main surface, each of the plurality of first gap portions 101 overlaps two or more of the plurality of second gap portions 102, and the second Each of the plurality of second gaps 102 is designed to overlap two or more of the plurality of first gaps 101 in a plan view viewed from the normal direction of the main surface 12a. Thereby, the through-hole 103 which penetrates the 1st main surface 11a and the 2nd main surface 12a is formed in the part which the some 1st space | gap part 101 and the some 2nd space | gap part 102 have overlapped.

In the present embodiment, the second resist 42 has the same shape as the first resist 41, and only the position where it is arranged is different from the first resist 41.

Next, referring to FIG. 12G, the second layer 12 (Ni film) is formed on the surface of the second metal film 32 exposed in the opening of the second resist 42 by a plating method.

Next, referring to FIG. 12H, the second resist 42 is removed by a peeling method (dissolution peeling).

Next, referring to FIG. 12I, the second metal film 32 is partially removed by etching. Examples of the etching method include a method of immersing the precursor of the porous structure obtained in the above step in an etching solution for dissolving a metal film. Note that the etching solution is washed by, for example, rinsing with pure water, and then dried.

Next, referring to FIG. 12J, the first resist 41 is removed by a peeling method.
By the above steps, as shown in FIG. 12 (k), a porous structure composed of the first layer 11 and the second layer 12 (including the remainder of the second metal film 32) can be obtained.

[Embodiment 2]
Referring to FIG. 8, in the porous structure of the present embodiment, the first layer 11 and the second layer 12 are separated from each other, and the first layer 11 and the second layer 12 are connected via the connecting portion 13. It is different from the first embodiment in that it is indirectly coupled.

In this way, the first layer 11 and the second layer 12 are indirectly coupled via the connecting portion 13, so that not only the through-hole 103 communicated in the direction perpendicular to the main surface of the porous structure. A communication hole 104 communicating in a direction parallel to the main surface of the porous structure is formed. Therefore, the fluid can flow not only in a direction perpendicular to the main surface of the porous structure but also in a parallel direction. Thereby, the porous structure of the present embodiment has an advantage that clogging is less likely to occur than in the first embodiment.

In the porous structure according to the present embodiment, the connecting portion 13 is an integrated body composed of the first layer 11 and the second layer 12. The porous structure of the present embodiment is preferably formed by integrally forming the connecting portion 13 and the second layer 12 on the first layer 11 after forming the first layer 11. However, it is not limited to this, For example, after forming the 1st layer 11, you may form the connection part 13 on the 1st layer 11, and may form the 2nd layer 12 on the connection part 13 after that.

Referring to FIG. 13, the porous structure manufacturing method of the present embodiment is performed in that the first layer 11 is formed thinner than the thickness of the first resist 41 as shown in FIG. Different from Form 1. As a result, a recess 13a is formed as shown in FIG.

In the portion where the recess 13a intersects the recess 13b formed by the second resist 42 (see FIGS. 13 (f) and 14 (f)), the connecting portion 13 is formed in the plating step shown in FIG. 13 (g). Will be.

14D to 14F correspond to FIGS. 13D to 13F. 13D to 13F correspond to the A-A ′ cross section of FIGS. 14D to 14F.

9 and 10 show a modification of the porous structure of the present embodiment. In the modification shown in FIG. 9, the first layer 11 and the second layer 12 have a honeycomb structure having regular hexagonal voids. Further, in the modification shown in FIG. 10, the first layer 11 and the second layer 12 have a honeycomb structure having a circular gap. In these modified examples, the first layer 11 and the second layer 12 are indirectly coupled via the connecting portion 13.

[Embodiment 3]
Referring to FIG. 11, the porous structure according to the present embodiment protrudes from the surface of the second layer 12 toward the first layer 11 inside at least one of the plurality of first gap portions 101 of the first layer 11. The second embodiment is different from the second embodiment in that the protrusion 14 is provided.

By having such protrusions 14, even when a large foreign object or the like that cannot pass through the through hole 103 stagnate, it is possible to create a state in which a minute object or fluid can easily pass through the through hole 103.

The porous structure of the present embodiment can be manufactured in the same manner as the porous structure manufacturing method of Embodiment 2, and the second layer 12 is formed in the step (f) in FIG. By patterning the second resist 42 for forming the protrusions 14, the protrusions 14 can be formed on the surface of the second layer 12.

[Embodiment 4]
The porous structure of the present embodiment will be described with reference to FIGS. 15, 30, and 31. FIG. 15 is an enlarged view corresponding to only the portion corresponding to the region R surrounded by the dotted line in FIG.

In the porous structure of the present embodiment, as in the second embodiment, the first layer 11 and the second layer 12 are separated from each other and are indirectly coupled via the connecting portion 13. The second layer 12 is composed of a plurality of rectangular separation parts 121, and has one grid-like second gap part 102 located between the plurality of separation parts 121. However, the porous structure of the present embodiment is mainly because the first gap 101 does not entirely overlap with the second gap 102 in a plan view viewed from the normal direction of the first major surface 11a. This is different from the first embodiment.

And in this embodiment, the connection part 13 is provided in a part of part which the 1st space | gap part 101 and the 2nd space | gap part 102 have not overlapped in planar view seen from the normal line direction of the 1st main surface 11a. ing. Thereby, the porous structure of this embodiment has the communication hole 104 for connecting the 1st space | gap part 101 and the 2nd space | gap part 102 in the direction parallel to the 1st main surface 11a. As described above, the porous structure according to the present embodiment includes a through hole (a through hole including the first gap 101, the communication hole 104, and the second gap 102) that penetrates the first main surface 11a and the second main surface 12a. )have.

In this embodiment, since the through-hole 103 communicated in a direction perpendicular to the main surface of the porous structure as in the second embodiment is not provided, the fluid is always parallel to the main surface of the porous structure. It passes through the communication hole 104 communicating in the direction. For this reason, by adjusting the size of the communication hole 104, it is possible to filter an object having a desired size in the fluid. Here, since the thickness of the connecting portion 13 can be adjusted relatively easily with high accuracy, the length of the communication layer 104 in the stacking direction of the first layer 11 and the second layer 12 can be finely adjusted. . Therefore, in the present embodiment, by adjusting the length of the communication hole 104 in the stacking direction, it becomes possible to filter a finer target object.

(Method 1 for producing porous structure)
As an example of a method for manufacturing the porous structure according to the present embodiment, after the first layer 11 is formed by a deposition method, the connecting portion 13 and the second layer 12 are integrally formed on the first layer 11. A description will be given mainly with reference to FIGS. 16 and 17. FIG. 16 is a schematic diagram corresponding to the cross section AA ′ shown in FIGS. The diagram in the left column of FIG. 17 is a schematic diagram corresponding to the AA ′ cross section shown in FIGS. 21 and 23, and the diagram in the right column is a schematic diagram corresponding to the BB ′ cross section shown in FIG. is there.

First, referring to FIG. 16A, the substrate 2 is prepared. Although the board | substrate 2 is not specifically limited, For example, it consists of Si. A conductive film (such as a Cu film) (not shown) is laminated on the surface of the substrate 2 (the upper surface in the drawing). This conductive film is a layer that is removed by etching in a later step, but also functions as a seed layer for Ni plating when the first layer is formed.

Next, with reference to FIGS. 16B and 18, a first metal film 31 made of Cu is formed on the substrate 2 by sputtering. The first metal film 31 is a film that is finally removed by etching.

Next, referring to FIG. 16C and FIG. 19, a first resist 41 is formed on the first metal film 31. For example, the first resist 41 can be formed by a photolithography method. The first resist 41 is patterned so as to have an opening at a position corresponding to a portion where the first layer is formed, and a film-shaped first resist 41 having a plurality of first gap portions 101 penetrating in the normal direction of the main surface. Patterning is performed so that one layer 11 is formed.

Next, with reference to FIGS. 16D and 20, the first metal film 31 exposed in the opening of the first resist 41 is partially removed by etching. The etching method is the same as in the first embodiment.

Next, referring to FIG. 16 (e), a first layer 11 (Ni film) is formed on the surface of the substrate 2 (conductive film) exposed in the opening of the first resist 41 by a plating method. In this way, a film-like first layer 11 having a plurality of first gap portions 101 penetrating in the normal direction of the main surface is formed. In addition, the 1st space | gap part does not need to be plural but at least one is sufficient. Thereafter, with reference to FIG. 16F and FIG. 21, the first resist 41 is removed by a peeling method (dissolution peeling).

Next, with reference to FIG. 16G and FIG. 22, a second metal film 32 made of Cu is formed on the first layer 11 and the first metal film 31 in the same manner as the first metal film 31. The second metal film 32 is a layer that is partially removed by etching in a later step, but also functions as a seed layer for Ni plating when the second layer is formed.

Next, referring to FIGS. 17 (h), (h2) and FIG. 23, a second resist 42 is formed on the second metal film 32. The second resist 42 is patterned so as to have an opening at a position corresponding to the shape of the second gap portion 102 and the connecting portion 13 of the second layer 12 combined.

Next, referring to FIGS. 17 (i), (i2) and FIG. 24, the second metal film 32 is removed by etching. Thereafter, referring to FIGS. 17J, 17J, and 25, the second resist 42 is removed.

Next, with reference to FIG. 17K and FIG. 26, a third resist 43 is formed on the second metal film 32. The third resist 43 is patterned into the same shape as the second gap portion 102 of the second layer 12. In the present embodiment, the second layer 12 has one grid-like second gap portion 102, but may have a plurality of second gap portions.

Next, referring to FIG. 17L and FIG. 27, a Ni film is formed on the surface of the second metal film 32 and the first layer 11 exposed in the opening of the third resist 43 by a plating method. Thereby, the connection part 13 and the 2nd layer 12 which consist of Ni are formed simultaneously (refer FIG. 30). Thereafter, referring to FIG. 17 (m) and FIG. 28, the third resist 43 is removed.

Next, referring to FIG. 17 (n) and FIG. 29, the second metal film 32 and the first metal film are removed by etching. Further, by removing the conductive film on the surface of the substrate 2 by etching, the porous structure according to the present embodiment as shown in FIG. 17 (o) and FIG. 30 can be obtained (structure of the first layer). (See the exploded perspective view of FIG. 31).

(Method 2 for producing porous structure)
Furthermore, as another method for manufacturing the porous structure according to the present embodiment, after the first layer 11 is formed by a deposition method, the connecting portion 13 and the second layer 12 are integrally formed on the first layer 11. Another example of the method will be described mainly with reference to FIGS.

First, the steps described with reference to FIGS. 16 (a) to 16 (f) and FIGS. 18 to 21 are performed in the same manner as in the above-mentioned “porous structure manufacturing method 1”.

Next, referring to FIG. 32, a second resist 42 is formed on the first layer 11 and the first metal film 31 in the state shown in FIG.

Next, referring to FIG. 33, a second metal film 32 made of Cu is formed on the first layer 11, the first metal film 31, and the second resist 42 in the same manner as the first metal film 31. Thereafter, referring to FIG. 34, the second resist 42 is peeled off (lifted off).

Next, referring to FIG. 35, a third resist 43 is formed on the second metal film 32. The third resist 43 is patterned in the same shape as the plurality of second gap portions 102 (see FIG. 37) of the second layer 12.

Next, referring to FIG. 36, a Ni film is formed by plating on the surfaces of second metal film 32 and first layer 11 exposed in the opening of third resist 43. Thereby, the connection part 13 and the 2nd layer 12 which consist of Ni are formed simultaneously (refer FIG. 37). Thereafter, referring to FIG. 37, the third resist 43 is removed.

Thereafter, referring to FIG. 37, the third resist 43 is removed. The second layer 12 is composed of a plurality of rectangular separation portions 122 having openings, and a second lattice-shaped second gap portion 102 a located between the plurality of separation portions 122 and the separation portion 122. And a plurality of second gap portions 102b corresponding to the openings.

Next, referring to FIG. 38, a second metal film 32 made of Cu is formed on the second layer 12 in the same manner as the first metal film 31.

Next, referring to FIG. 39, a Ni plating film is formed using a resist in the same manner as the second layer 12. Thereby, the third layer 13 made of Ni and the connecting portion 13a are formed simultaneously. Further, the lid portion 15 made of Ni is formed using a resist.

Thereafter, the second metal film 32 and the first metal film 31 are removed. Furthermore, the porous structure can be obtained by removing the conductive film on the surface of the substrate 2 by etching.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

101, first gap, 102, 102a, 102b, second gap, 103, 109 through-hole, 104 communication hole, 11 first layer, 11a first main surface, 12 second layer, 12a second main surface, 121, 122 Separation part, 13, 13a connection part, 14 protrusions, 15 lid part, 2 substrate, 31 first metal film, 32 second metal film, 33 third metal film, 41 first resist, 42 second resist, 9 purpose object.

Claims

A membranous porous structure having a first main surface and a second main surface facing each other,
A film-like first layer that includes the first main surface and has a plurality of first voids penetrating in the normal direction of the first main surface;
A film-like second layer including a plurality of second voids including the second main surface and penetrating in a normal direction of the second main surface;
The first layer and the second layer are bonded directly or indirectly,
In a plan view seen from the normal direction of the first main surface, each of the plurality of first gaps overlaps two or more of the plurality of second gaps,
In a plan view seen from the normal direction of the second main surface, each of the plurality of second voids overlaps two or more of the plurality of first voids,
A porous structure having a through hole penetrating the first main surface and the second main surface in a portion where the plurality of first void portions and the plurality of second void portions overlap.
2. The porous structure according to claim 1, wherein the first layer and the second layer are separated from each other, and the first layer and the second layer are indirectly bonded via a connecting portion. .
3. The porous structure according to claim 1, further comprising a protrusion protruding from the surface of the second layer toward the first layer inside at least one of the plurality of second void portions of the second layer. .
A method for producing a membranous porous structure having a first main surface and a second main surface facing each other,
A first layer forming step of forming, on the first main surface side, a film-shaped first layer having a plurality of first voids penetrating in a normal direction of the main surface;
A film-like second layer having a plurality of second voids penetrating in the normal direction of the main surface is formed on the second main surface side of the first layer, and the first layer, the second layer, A second layer forming step of obtaining the porous structure by directly or indirectly bonding
In the second layer forming step,
In a plan view seen from the normal direction of the first main surface, each of the plurality of first gap portions overlaps two or more of the plurality of second gap portions,
In a plan view seen from the normal direction of the second main surface, each of the plurality of second gaps overlaps two or more of the plurality of first gaps,
In the portion where the plurality of first gap portions and the plurality of second gap portions overlap, the second layer is formed such that a through-hole penetrating the first main surface and the second main surface is formed. The manufacturing method of the porous structure which forms.
A membranous porous structure having a first main surface and a second main surface facing each other,
A film-like first layer including at least one first void including the first principal surface and penetrating in a normal direction of the first principal surface;
A film-like second layer including at least one second void portion including the second main surface and penetrating in a normal direction of the second main surface;
The first layer and the second layer are separated from each other, and the first layer and the second layer are indirectly coupled via a connecting portion;
In the plan view seen from the normal direction of the first main surface, not all of the at least one first gap portion overlaps the at least one second gap portion,
The porous structure which has a through-hole which penetrates the said 1st main surface and the said 2nd main surface.
A method for filtering cells using the porous structure according to any one of claims 1 to 3 or claim 5.