WO2016104415A1 - Ultrasonic sensor - Google Patents
Ultrasonic sensor Download PDFInfo
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- WO2016104415A1 WO2016104415A1 PCT/JP2015/085653 JP2015085653W WO2016104415A1 WO 2016104415 A1 WO2016104415 A1 WO 2016104415A1 JP 2015085653 W JP2015085653 W JP 2015085653W WO 2016104415 A1 WO2016104415 A1 WO 2016104415A1
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- WIPO (PCT)
- Prior art keywords
- case
- ultrasonic sensor
- piezoelectric element
- bottom plate
- rough surface
- Prior art date
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/521—Constructional features
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Definitions
- the present invention relates to an ultrasonic sensor.
- An ultrasonic sensor may be used to measure the presence or absence of an object and the distance to the object.
- An example of an ultrasonic sensor based on the prior art is described in International Publication WO2013 / 051525A1 (Patent Document 1).
- a piezoelectric element is arranged inside a bottomed cylindrical case.
- the piezoelectric element has a flat plate shape and is disposed on the bottom surface of the case. Wiring is provided so that a voltage can be applied to both surfaces of the piezoelectric element.
- This type of ultrasonic sensor can transmit and receive ultrasonic waves.
- a pause time is provided after a certain transmission time, and reception is performed during this time. That is, after the piezoelectric element is continuously vibrated by applying a potential change to the piezoelectric element for a certain time, the potential change is stopped, and thereafter, the vibration generated in the piezoelectric element by reception is electrically detected.
- the vibration generated from the piezoelectric element during transmission not only vibrates the bottom plate of the case, but also vibrates the side wall of the case at the same time. Even after the supply of the potential change to the piezoelectric element is stopped, the side wall of the case may continue to vibrate. Such vibration remaining in the case is also referred to as “reverberation vibration”.
- reverberation time The time that the reverberation continues continues is also called “reverberation time”.
- reverberation time When measuring with an ultrasonic sensor in a state where the distance to the object is short, since the ultrasonic wave emitted from the ultrasonic sensor and reflected by the object returns to the ultrasonic sensor at an early stage, reverberation Reception may occur before the time expires.
- vibration generated in the bottom plate due to the ultrasonic wave reflected by the object hereinafter referred to as “reflected wave”.
- reflected wave When reaching the bottom plate, the vibration caused by the reflected wave is buried in the reverberation vibration that was originally there. In this case, the detection characteristics of the ultrasonic sensor deteriorate, and in the worst case, the reflected wave cannot be detected.
- an object of the present invention is to provide an ultrasonic sensor in which reverberation time is shortened while maintaining sensitivity.
- an ultrasonic sensor includes a bottomed cylindrical case having a bottom plate and a side wall, a piezoelectric element disposed on the bottom plate in the case, and the above-described case in the case.
- a filling resin filled in at least a part of the case so as to cover the piezoelectric element, and at least a surface of the case in contact with the filling resin is a rough surface.
- the inner surface of the side wall is preferably a rough surface.
- the entire surface of the inner surface of the bottom plate and the inner surface of the side wall is a rough surface.
- an ultrasonic sensor with a shorter reverberation time can be realized.
- the surface roughness Ra of the rough surface is preferably 1.3 ⁇ m or more and 2.2 ⁇ m or less.
- the rough surface is preferably formed by sandblasting. Thereby, a desired rough surface can be easily formed in a case.
- the case is made of an aluminum alloy.
- a case becomes easy to process and a desired rough surface can be formed easily.
- the weight of the ultrasonic sensor as a whole can be reduced.
- Embodiment 1 With reference to FIG. 1, the ultrasonic sensor in Embodiment 1 based on this invention is demonstrated.
- the vertical relationship in FIG. 1 will be described as a reference, but the term “upper and lower” here does not mean absolute upper and lower, but is merely for convenience of explanation, and in the posture shown in FIG. It is up and down.
- the ultrasonic sensor 101 in the present embodiment includes a case 2, a piezoelectric element 3, a sound absorbing material 4, a reinforcing material 5, a damper 7, a filling resin 8, a flexible substrate 9, a terminal holding member 10, Pin terminals 11 and 11 and lead wires 12 and 12 are provided.
- Case 2 is made of, for example, lightweight aluminum with a high elastic modulus. Case 2 is formed by forging, for example.
- the case 2 has a bottomed cylindrical shape in which one end face is closed and the other end face is opened.
- the outer shape of the case 2 has a bottom surface with a diameter of 15.5 mm and a height of 9.0 mm.
- the case 2 has, for example, a disk-shaped bottom plate 2a and a cylindrical side wall 2b.
- the opening of the case 2 is circular when viewed in plan, for example.
- Side wall 2b includes a thin portion and a thick portion. The portion on the opening side of the side wall 2b is thin, and the portion on the bottom plate 2a side is thick.
- the inner diameter (diameter 12.0 mm) of the portion of the side wall 2b on the bottom plate 2a side is smaller than the inner diameter (diameter 14.5 mm) of the portion on the opening side of the side wall 2b.
- the bottom plate 2a has a recess in the vicinity of the center. The depth of the recess is, for example, 0.49 mm.
- the material of the case 2 is not limited to a conductive material such as aluminum, and may be an insulating material. Fine irregularities are formed on the inner surface of the bottom plate 2a of the case 2 and the inner surface of the side wall 2b of the case so as to be a rough surface having a larger surface roughness than the outer surface of the side wall of the case. Of the inner surface of the case, at least the surface in contact with the filling resin is a rough surface.
- the piezoelectric element 3 is made of, for example, lead zirconate titanate ceramic.
- the piezoelectric element 3 has a disk-shaped piezoelectric body and a pair of electrodes provided on the principal surfaces of the piezoelectric body facing away from each other.
- the piezoelectric element 3 has a flat plate shape, and “spreads and vibrates” in the in-plane direction when a driving voltage is applied to a pair of electrodes.
- the piezoelectric element 3 is disposed in the recess of the case 2 and joined to the bottom plate 2a. Specifically, the piezoelectric element 3 is joined to the case 2 so that one of the pair of electrodes is in contact with the bottom surface of the recess.
- the piezoelectric element 3 and the bottom plate 2a are joined together to form a bimorph vibrator.
- This bimorph vibrator is bent and vibrated by the spreading vibration of the piezoelectric element 3. Therefore, the bottom plate 2 a becomes the main vibration region of the case 2.
- the sound absorbing material 4 is made of, for example, polyester felt.
- the sound absorbing material 4 has a flat plate shape, for example.
- the sound absorbing material 4 is provided so as to cover the piezoelectric element 3.
- the sound absorbing material 4 is provided to absorb unnecessary sound waves emitted from the piezoelectric element 3 to the opening side of the case 2.
- the reinforcing material 5 is a ring-shaped member having an opening at the center, and has high acoustic impedance.
- the reinforcing material 5 is made of a material having a higher density and higher rigidity than the material constituting the case 2 and functions as a weight.
- the material of the reinforcing material 5 may be stainless steel or zinc, for example.
- the reinforcing material 5 may be made of the same material (aluminum) as the case 2 by adjusting the size such as thickness.
- the reinforcing material 5 is provided above the sound absorbing material 4 so as to be separated from the sound absorbing material 4.
- the reinforcing material 5 is held by a step provided on the inner surface of the case 2.
- the reinforcing material 5 is disposed in contact with the inner surface of the thick portion of the side wall 2b.
- the reinforcing material 5 is disposed in contact with the inner surface of the thick portion of the side wall 2b.
- the damper 7 is a cup-shaped member made of an elastic body such as silicone rubber or urethane resin.
- the damper 7 has a convex portion that engages with the opening of the reinforcing member 5 and an opening that extends upward from the convex portion and engages with the terminal holding member 10.
- each of the lead wires 12 and 12 is connected to a flexible substrate 9 to be described later, and is inserted into the damper 7 and disposed in the opening of the case 2.
- the other ends of the lead wires 12 and 12 are arranged outside the case 2 and connected to the terminal holding member 10.
- the terminal holding member 10 is an L-shaped member made of a resin such as polybutylene terephthalate (PBT). Two through holes into which the pin terminals 11 and 11 are inserted are provided in the center portion of the terminal holding member 10.
- PBT polybutylene terephthalate
- the pin terminals 11 and 11 are metal linear pins to which the driving voltage of the piezoelectric element 3 is applied, and are held by the terminal holding member 10. Specifically, the pin terminals 11 and 11 are inserted into the through holes of the terminal holding member 10 and connected to the lead wires 12 and 12, respectively.
- the flexible substrate 9 has a wide band shape, and electrically connects the lead wires 12 and 12 and the piezoelectric element 3.
- the flexible substrate 9 has a first end and a second end. The first end is connected to the lead wires 12 and 12. The second end is connected to the electrode of the piezoelectric element 3 by a conductive adhesive.
- the flexible substrate 9 is bent and disposed in the opening of the case 2.
- the filling resin 8 is made of an elastic body such as silicone resin or urethane resin.
- the filling resin 8 is filled in at least a part of the case 2 so as to cover the piezoelectric element 3 inside the case 2. Specifically, the filling resin 8 is filled in the entire space above the reinforcing material 5 in the internal space of the case 2.
- the filling resin 8 seals the reinforcing material 5, the damper 7, one end of the lead wires 12, 12 and the flexible substrate 9 disposed in the opening of the case 2.
- the filling resin 8 has a function of suppressing vibration of the side wall 2b of the case 2 and also has a function of preventing the lead wires 12, 12 and the damper 7 from being detached from the case 2.
- the damper 7 is more suitable if it is difficult to propagate vibration.
- the filling resin 8 is more preferable as long as it suppresses (vibrates) the vibration of the side wall 2a of the case 2.
- the damper 7 preferably has a lower elastic modulus than the filled resin 8. More specifically, the elastic modulus includes a storage elastic modulus and a loss elastic modulus. It is preferable that the damper 7 has a small storage elastic modulus and the filling resin 8 has a large loss elastic modulus.
- the damper 7 is preferably made of a silicone resin (silicone rubber).
- the filling resin 8 is preferably made of a urethane resin.
- the ultrasonic sensor with the reverberation time shortened while maintaining the sensitivity of the ultrasonic sensor. Can be realized.
- the following experiment was conducted as Experiment 1.
- a rough surface was formed by sandblasting under different conditions on the inner surface of the bottom plate of the case of condition numbers 2 to 6 and the inner surface of the side wall of the case (hereinafter simply referred to as “inner surface of the case”).
- Table 1 shows the sandblast conditions for the case and the surface roughness Ra for each condition number.
- the surface roughness referred to here is the roughness of the inner surface of the case.
- the surface roughness Ra of Condition No. 1 was 1.0 ⁇ m.
- the surface roughness Ra under condition numbers 2 to 6 were 1.3 ⁇ m, 1.6 ⁇ m, 2.0 ⁇ m, 2.2 ⁇ m, and 2.5 ⁇ m, respectively.
- FIG. 2 shows a surface roughness profile with respect to the position of the inner surface of the bottom plate of the case of condition number 1.
- FIG. 3 shows a surface roughness profile with respect to the position of the inner surface of the bottom plate of the case of condition number 5.
- the horizontal axis represents the distance T1 of the inner surface of the bottom plate of the case.
- the left end of T1 in FIG. 1 corresponds to the position 0 ⁇ m, and the right end of T1 in FIG. 1 corresponds to the position 1200 ⁇ m. Comparing FIG. 2 and FIG. 3, it can be seen that condition number 5 subjected to sandblasting has a narrower width of unevenness on the inner surface of the bottom plate of the case and larger variation in unevenness depth than condition number 1. .
- an ultrasonic sensor (condition numbers 1 to 6) having the same configuration as the ultrasonic sensor of the first embodiment was assembled using the above-described case. These ultrasonic sensors were driven at a frequency of 40.0 kHz, for example, and the reverberation time was measured with an oscilloscope.
- the ultrasonic sensors of condition numbers 1 to 6 are the same for members other than the case. The measurement conditions are all the same.
- the reverberation times for condition numbers 1 to 6 were 1.77 msec, 1.71 msec, 1.63 msec, 1.60 msec, 1.57 msec, and 1.52 msec, respectively. Therefore, it has been found that the reverberation time becomes shorter as the surface roughness Ra of the inner surface of the case increases.
- the reverberation time is shortened in the ultrasonic sensor in which the inner surface of the case 2 is roughened compared to the case in which the inner surface of the case 2 is not roughened. It is considered that the vibration contact property in the case 2 is improved and the reverberation can be suppressed at an early stage because the surface of the inner surface of the case 2 that is in contact with the filling resin 8 is a rough surface. Therefore, the ultrasonic sensor in the present embodiment is an ultrasonic sensor with a reverberation time shortened.
- Example 2 The inventor examined the resonance frequency at each surface roughness as Experiment 2 using the sample of Experiment 1.
- the reference resonance frequency is the resonance frequency of condition number 1.
- the fluctuation values from the reference of the resonance frequency of condition numbers 2 to 6 were ⁇ 0.10 kHz, ⁇ 0.28 kHz, ⁇ 0.36 kHz, ⁇ 0.50 kHz, and ⁇ 1.03 kHz, respectively.
- the inventor has found that the resonance frequency fluctuates outside the original value of 40.0 kHz in the sample with the increased surface roughness Ra. As shown in FIG. 6, it was found that the resonance frequency decreases as the surface roughness Ra increases.
- the sample having a surface roughness Ra larger than 2.2 ⁇ m, for example, the surface roughness Ra compared to a sample having a surface roughness Ra of 2.2 ⁇ m or less.
- the resonance frequency was particularly greatly varied and decreased.
- the resonance frequency is reduced, the sensitivity is lowered, so that even if the reverberation characteristics are improved, the characteristics of the ultrasonic sensor as a whole are deteriorated.
- the surface roughness Ra of the inner surface of the case 2 may be increased in order to shorten the reverberation time.
- the surface roughness Ra is increased. If too much, it can be seen that the adverse effect of increasing the fluctuation range of the resonance frequency is brought about. Therefore, in order to realize an ultrasonic sensor with a reverberation time shortened while maintaining the sensitivity of the ultrasonic sensor, the surface roughness Ra of the rough surface is preferably 1.3 ⁇ m or more and 2.2 ⁇ m or less.
- Embodiment 2 With reference to FIG. 5, the ultrasonic sensor in Embodiment 2 based on this invention is demonstrated.
- the configuration of the ultrasonic sensor 102 in the present embodiment is basically the same as the configuration of the ultrasonic sensor 101 described in the first embodiment, but differs in the following points.
- the sound absorbing material 4, the reinforcing material 5, and the damper 7 are not arranged inside the case 2. Further, the cavity 13 is not provided inside the case 2.
- Filling resin 8 is filled so as to cover the piezoelectric element 3 disposed so as to be in contact with the bottom plate 2 a inside the case 2.
- the inner surface of the case 2 at least the surface in contact with the filling resin 8 is a rough surface. Therefore, in the present embodiment, at least almost all of the inner surface of the case 2 is a rough surface.
- the inner surface of the bottom plate 2a and the inner surface of the side wall 2b are rough.
- an ultrasonic sensor having a reverberation time shorter than that in the first embodiment can be realized.
- the rough surface is preferably formed by sandblasting. This is because, as already shown in the experiment of the first embodiment, when sandblasting is employed, a rough surface can be easily formed on the inner surface of the case 2.
- Case 2 is preferably formed of an aluminum alloy. By adopting this configuration, the case 2 is easy to process, and a desired rough surface is easily formed. Further, by forming the case 2 with such a material, the weight of the ultrasonic sensor as a whole can be reduced.
- the electrical lead-out from the case 2 is performed by the lead wire 12, the pin terminal 11, and the like has been described.
- the electrical lead-out may be realized by other configurations. .
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Abstract
Description
図1を参照して、本発明に基づく実施の形態1における超音波センサについて説明する。以下では図1における上下関係を基準に説明するが、ここでいう上下は絶対的な上下を意味するものではなく、あくまで説明の便宜のためのものであり、図1に示した姿勢の中での上下である。 (Embodiment 1)
With reference to FIG. 1, the ultrasonic sensor in
実験1としては、粗面形成の有無および程度による効果を確認する。以下に、本実験で用いた試料である条件番号1~6の超音波センサについて詳述する。 (Experiment 1)
In
発明者は、実験1の試料を利用して、実験2として各表面粗さにおける共振周波数を調べた。なお、基準となる共振周波数は条件番号1の共振周波数である。その結果、ケース2の内面に設ける粗面の表面粗さと共振周波数との関係は、図6に示すようになった。条件番号2~6の共振周波数の基準からの変動値は、それぞれ、順に-0.10kHz、-0.28kHz、-0.36kHz、-0.50kHz、-1.03kHzであった。発明者は、表面粗さRaを大きくした試料においては、共振周波数が本来の値である40.0kHzから外れて変動していることを見出した。図6に示すように、表面粗さRaを大きくすればするほど共振周波数は小さくなることがわかった。また、表面粗さRaを順に上げていったときに表面粗さRaが2.2μm以下の試料に比べて、表面粗さRaが2.2μmより大きくなっている試料、たとえば表面粗さRaが2.5μmである試料においては、共振周波数が特に大幅に変動して小さくなっていることがわかった。共振周波数が小さくなると、感度が低下するので、残響特性が向上したとしても、超音波センサ全体としての特性は劣化してしまう。 (Experiment 2)
The inventor examined the resonance frequency at each surface roughness as
図5を参照して、本発明に基づく実施の形態2における超音波センサについて説明する。本実施の形態における超音波センサ102の構成は、基本的には実施の形態1で説明した超音波センサ101の構成と同様であるが、以下の点で異なる。 (Embodiment 2)
With reference to FIG. 5, the ultrasonic sensor in
なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。 In addition, you may employ | adopt combining suitably two or more among the said embodiment.
In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
Claims (6)
- 底板および側壁を有する有底筒状のケースと、
前記ケース内で前記底板上に配置されている圧電素子と、
前記ケース内で前記圧電素子を覆うように前記ケース内の少なくとも一部に充填されている充填樹脂とを備え、
前記ケースの内面のうち少なくとも前記充填樹脂が接している面が粗面となっている、超音波センサ。 A bottomed cylindrical case having a bottom plate and side walls;
A piezoelectric element disposed on the bottom plate in the case;
A filling resin filled in at least a part of the case so as to cover the piezoelectric element in the case;
An ultrasonic sensor in which at least a surface of the inner surface of the case that is in contact with the filling resin is a rough surface. - 前記側壁の内面が粗面となっている、請求項1に記載の超音波センサ。 The ultrasonic sensor according to claim 1, wherein an inner surface of the side wall is a rough surface.
- 前記底板の内面が粗面となっている、請求項2に記載の超音波センサ。 The ultrasonic sensor according to claim 2, wherein an inner surface of the bottom plate is a rough surface.
- 前記粗面の表面粗さRaは1.3μm以上2.2μm以下である、請求項1から3のいずれかに記載の超音波センサ。 The ultrasonic sensor according to any one of claims 1 to 3, wherein a surface roughness Ra of the rough surface is 1.3 µm or more and 2.2 µm or less.
- 前記粗面はサンドブラスト加工によって形成されている、請求項1から4のいずれかに記載の超音波センサ。 The ultrasonic sensor according to any one of claims 1 to 4, wherein the rough surface is formed by sandblasting.
- 前記ケースはアルミニウム合金によって形成されている、請求項1から5のいずれかに記載の超音波センサ。 The ultrasonic sensor according to any one of claims 1 to 5, wherein the case is formed of an aluminum alloy.
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JP2016566342A JP6493415B2 (en) | 2014-12-26 | 2015-12-21 | Ultrasonic sensor |
KR1020177016566A KR101935784B1 (en) | 2014-12-26 | 2015-12-21 | Ultrasonic sensor |
CN201580070327.9A CN107113511B (en) | 2014-12-26 | 2015-12-21 | Ultrasonic sensor |
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JP2014-264565 | 2014-12-26 | ||
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KR (1) | KR101935784B1 (en) |
CN (1) | CN107113511B (en) |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020153099A1 (en) * | 2019-01-23 | 2020-07-30 | 株式会社村田製作所 | Ultrasound sensor |
US20220260712A1 (en) * | 2019-06-04 | 2022-08-18 | Tdk Electronics Ag | Ultrasonic Transducer and Method for Producing an Ultrasonic Transducer |
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---|---|---|---|---|
CN111133772A (en) * | 2017-09-21 | 2020-05-08 | 株式会社村田制作所 | Ultrasonic sensor |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001232294A (en) * | 2000-02-24 | 2001-08-28 | Matsushita Electric Works Ltd | Ultrasonic vibrator |
JP2007318742A (en) * | 2006-04-28 | 2007-12-06 | Murata Mfg Co Ltd | Ultrasonic sensor |
WO2008047743A1 (en) * | 2006-10-20 | 2008-04-24 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
JP2010050963A (en) * | 2008-07-25 | 2010-03-04 | Sumitomo Chemical Co Ltd | Ultrasonic sensor case and ultrasonic sensor |
JP2012060369A (en) * | 2010-09-08 | 2012-03-22 | Murata Mfg Co Ltd | Ultrasonic transducer |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140157894A1 (en) * | 2012-12-12 | 2014-06-12 | Tung Thih Electronic Co., Ltd. | Transducer Case |
-
2015
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- 2015-12-21 WO PCT/JP2015/085653 patent/WO2016104415A1/en active Application Filing
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001232294A (en) * | 2000-02-24 | 2001-08-28 | Matsushita Electric Works Ltd | Ultrasonic vibrator |
JP2007318742A (en) * | 2006-04-28 | 2007-12-06 | Murata Mfg Co Ltd | Ultrasonic sensor |
WO2008047743A1 (en) * | 2006-10-20 | 2008-04-24 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
JP2010050963A (en) * | 2008-07-25 | 2010-03-04 | Sumitomo Chemical Co Ltd | Ultrasonic sensor case and ultrasonic sensor |
JP2012060369A (en) * | 2010-09-08 | 2012-03-22 | Murata Mfg Co Ltd | Ultrasonic transducer |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020153099A1 (en) * | 2019-01-23 | 2020-07-30 | 株式会社村田製作所 | Ultrasound sensor |
CN113228709A (en) * | 2019-01-23 | 2021-08-06 | 株式会社村田制作所 | Ultrasonic sensor |
CN113228709B (en) * | 2019-01-23 | 2023-09-12 | 株式会社村田制作所 | ultrasonic sensor |
US11835663B2 (en) | 2019-01-23 | 2023-12-05 | Murata Manufacturing Co., Ltd. | Ultrasonic sensor |
US20220260712A1 (en) * | 2019-06-04 | 2022-08-18 | Tdk Electronics Ag | Ultrasonic Transducer and Method for Producing an Ultrasonic Transducer |
Also Published As
Publication number | Publication date |
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CN107113511A (en) | 2017-08-29 |
KR20170085104A (en) | 2017-07-21 |
JP6493415B2 (en) | 2019-04-03 |
CN107113511B (en) | 2019-10-15 |
JPWO2016104415A1 (en) | 2017-09-14 |
KR101935784B1 (en) | 2019-01-07 |
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