WO2016101483A1 - 点胶治具 - Google Patents

点胶治具 Download PDF

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Publication number
WO2016101483A1
WO2016101483A1 PCT/CN2015/078105 CN2015078105W WO2016101483A1 WO 2016101483 A1 WO2016101483 A1 WO 2016101483A1 CN 2015078105 W CN2015078105 W CN 2015078105W WO 2016101483 A1 WO2016101483 A1 WO 2016101483A1
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WO
WIPO (PCT)
Prior art keywords
bonding surface
dispensing
colloid
fixture
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2015/078105
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English (en)
French (fr)
Inventor
韩高才
高原
许多
孙信华
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Xiaomi Inc
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Xiaomi Inc
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Filing date
Publication date
Application filed by Xiaomi Inc filed Critical Xiaomi Inc
Priority to RU2015130477A priority Critical patent/RU2630804C2/ru
Priority to JP2016565544A priority patent/JP2017507022A/ja
Priority to MX2015008845A priority patent/MX358896B/es
Priority to BR112015017139A priority patent/BR112015017139A2/pt
Priority to KR1020157020117A priority patent/KR101727057B1/ko
Priority to US14/977,081 priority patent/US9662870B2/en
Publication of WO2016101483A1 publication Critical patent/WO2016101483A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
    • F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/004—Preventing sticking together, e.g. of some areas of the parts to be joined
    • B29C66/0042—Preventing sticking together, e.g. of some areas of the parts to be joined of the joining tool and the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints

Definitions

  • the present disclosure relates to the field of jig technology, and in particular to a dispensing jig.
  • a glue jig is usually used to position one of the objects to facilitate bonding the other object to the object by dispensing.
  • the ideal effect of dispensing is that the points are neat and beautiful, but when using the current dispensing fixture for dispensing, the colloid will overflow a lot from between the two objects, the overflowing glue is difficult to control, and the spilled colloid will stick to the point gel. With the glue, the glue and the glue fixture stick together, which is not easy to separate.
  • the embodiments of the present disclosure provide a dispensing jig for achieving adhesion of the colloid that avoids spillage to the dispensing fixture.
  • a dispensing jig including a jig body, and the jig body is provided with a limiting space for fixing a position of a first bonding surface of the first object,
  • the first bonding surface is a surface on the first object for bonding with the second bonding surface of the second object; wherein the limiting space faces the opening periphery of the second bonding surface
  • a release layer is disposed on the inner sidewall of the surface and the periphery of the opening.
  • the plane of the opening of the limiting space is parallel to the first bonding surface and the second bonding surface.
  • the plane of the opening of the limiting space is the first between the second bonding surface bonded to the first bonding surface by a colloid of a predetermined thickness The distance is equal to or less than the preset value.
  • the plane of the opening of the limiting space is higher than the first bonding surface by a second distance, and the second distance is equal to the difference between the preset thickness and the first distance.
  • the preset value is equal to or less than 0.5 mm.
  • the predetermined value is equal to 0.2 mm, 0.15 mm, or 0.1 mm.
  • the release layer comprises a release coating or a release coating.
  • the dispensing jig provided by the embodiment of the present disclosure is provided with an anti-adhesion layer at a position where the overflow colloid is in contact with the dispensing jig, so as to prevent the colloidal colloid from sticking to the dispensing jig, and the colloid colloid is easily
  • the glue jig is separated for user convenience.
  • FIG. 1 is a structural diagram of a dispensing jig according to an exemplary embodiment.
  • FIG. 2 is a schematic diagram showing the effect of a dispensing jig according to an exemplary embodiment.
  • FIG. 3 is a schematic diagram showing the effect of another dispensing jig according to an exemplary embodiment.
  • the embodiment of the present disclosure provides a dispensing jig, as shown in FIG. 1 , including a jig body 1 , and the jig body 1 is provided with a limit for fixing the position of the first bonding surface 20 of the first object 2 .
  • a space 3 the first bonding surface 20 is a surface on the first object 2 for bonding with the second bonding surface 40 of the second object 4;
  • the release layer 5 is provided on the upper surface 31 of the opening space 3 facing the opening periphery of the second bonding surface 40 and the inner side wall 32 of the opening periphery.
  • the release layer can be implemented as a release coating or a release coating.
  • the 0.5mm gap can then be reduced to the part of 0.2, 0.15, 0.1.
  • the anti-adhesive coating When the anti-adhesive coating is not needed, it is necessary to make this gap large to prevent the jig from sticking together. When the gap is made larger, the glue will overflow, it is very irregular, and the gap can be made very small after the fixture is coated with anti-adhesive coating. In this way, the jig can be used to limit the overflow. Make the overflow even. This type of fixture can also be used if it is desired to evenly surround the adherend.
  • the first object 1 is placed in the limiting space 3, and the spatial shape of the limiting space 3 is adapted to the first object 2, so that the position of the first object 2 can be restricted, so that the first object 2 is first
  • the position of the bonding surface 20 is solid set;
  • the second bonding surface 40 of the second object 4 is covered onto the first bonding surface 20 coated with the colloid 6, and the first bonding surface 20 and the second bonding surface 40 are bonded by appropriate pressing. Together, at the same time, a part of the colloid will overflow onto the upper surface 31 and the inner side wall 32. Since the upper surface 31 and the inner side wall 32 are provided with a release layer, the overflowed colloid does not adhere to the glue jig. It is easy to separate the spilled gel from the dispensing fixture.
  • the dispensing jig provided by the embodiment of the present disclosure has an anti-adhesive layer disposed at a position where the overflow colloid is in contact with the dispensing jig, so as to prevent the colloidal colloid from sticking to the dispensing jig, and it is easy to overflow.
  • the colloid is separated from the dispensing fixture for user convenience.
  • the plane 33 of the opening of the limiting space 3 and the first bonding surface 20 and the second bonding surface 40 may be parallel to each other, so that the colloids overflowing on both sides are equivalent. And the anti-adhesion layer can still prevent the spilled colloid from sticking to the glue jig.
  • the above-mentioned dispensing jig can still prevent the colloids overflowing on both sides from sticking together with the dispensing jig.
  • the first distance between the plane 33 of the opening of the limiting space 3 and the second bonding surface 40 bonded to the first bonding surface 20 by the colloid 6 of the predetermined thickness H D1 is equal to or less than the preset value.
  • the first distance D1 is actually the thickness of the overflowing colloid, that is, the thickness of the overflowed colloid is controlled within a preset value, and the preset value can be set as needed.
  • the height of the limit space in the glue jig can be designed according to the size of the preset thickness and the height of the first object, so that the thickness of the overflow colloid is equal to or less than a preset value, so as to avoid excessive colloid overflow. Affect the appearance.
  • the plane 33 of the opening of the limiting space 3 is higher than the first bonding surface 20 by a second distance D2, and the second distance D2 is equal to the preset thickness H and the first The difference between the distances D1, so that a part of the colloid is accommodated inside the limiting space, and it is convenient to control the thickness of the overflowing colloid to be equal to or less than a preset value, which is convenient for the user to implement.
  • the above preset value is equal to or less than 0.5 mm.
  • the preset value is equal to a value within 0.2 mm such as 0.2 mm, 0.15 mm, 0.1 mm, etc., so that not only the bonding effect is ensured, but also the spilled colloid is less and more beautiful.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Coating Apparatus (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
  • Laminated Bodies (AREA)
  • Media Introduction/Drainage Providing Device (AREA)

Abstract

一种用以避免溢出的胶体粘到点胶治具上的点胶治具，包括治具本体（1），所述治具本体上设置有用于将第一物体（2）的第一粘接面（20）的位置固定的限位空间（3），所述第一粘接面是第一物体上用于与第二物体（4）的第二粘接面（40）相粘接的表面；其中，所述限位空间的朝向所述第二粘接面的开口周缘的上表面（31）和所述开口周缘的内侧壁（32）上设置有防粘层（5）。上述点胶治具在溢出胶体与点胶治具接触的位置设置有防粘层，可避免溢出的胶体与点胶治具粘接在一起，很容易将溢出的胶体与点胶治具分离，方便用户使用。

Description

点胶治具
本申请基于申请号为2014108321725、申请日为2014/12/26的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及治具技术领域，尤其涉及点胶治具。
背景技术
目前，在将两个物体粘接到一起的时候，通常会用到点胶治具对其中一个物体进行定位，以方便通过点胶将另一物体与该物体粘接到一起。点胶的理想效果是点的整齐漂亮，但是使用目前的点胶治具进行点胶时，胶体会从两个物体之间溢出很多，溢胶难以控制，且溢出的胶体会粘到点胶治具上，胶体跟点胶治具粘到一起，不好分离。
发明内容
为克服相关技术中存在的问题，本公开实施例提供点胶治具，用以实现避免溢出的胶体粘到点胶治具上。
根据本公开实施例的第一方面，提供一种点胶治具，包括治具本体，所述治具本体上设置有用于将第一物体的第一粘接面的位置固定的限位空间，所述第一粘接面是第一物体上用于与第二物体的第二粘接面相粘接的表面；其中，所述限位空间的朝向所述第二粘接面的开口周缘的上表面和所述开口周缘的内侧壁上设置有防粘层。
在一个实施例中，所述限位空间的所述开口所在平面与所述第一粘接面、所述第二粘接面平行。
在一个实施例中，所述限位空间的所述开口所在平面，到通过预设厚度的胶体与所述第一粘接面粘接在一起的所述第二粘接面之间的第一距离等于或小于预设值。
在一个实施例中，所述限位空间的所述开口所在平面比第一粘接面高第二距离，所述第二距离等于所述预设厚度与所述第一距离之间的差值。
在一个实施例中，所述预设值等于或小于0.5毫米。
在一个实施例中，所述预设值等于0.2毫米、0.15毫米或者0.1毫米。
在一个实施例中，所述防粘层包括防粘涂层或者防粘镀层。
本公开的实施例提供的技术方案可以包括以下有益效果：
本公开实施例提供的点胶治具，在溢出胶体与点胶治具接触的位置设置有防粘层，可避免溢出的胶体与点胶治具粘接在一起，很容易将溢出的胶体与点胶治具分离，方便用户使用。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是根据一示例性实施例示出的一种点胶治具的结构图。
图2是根据一示例性实施例示出的一种点胶治具的效果示意图。
图3是根据一示例性实施例示出的另一种点胶治具的效果示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
本公开实施例提供了一种点胶治具，如图1所示，包括治具本体1，治具本体1上设置有用于将第一物体2的第一粘接面20的位置固定的限位空间3，第一粘接面20是第一物体2上用于与第二物体4的第二粘接面40相粘接的表面；
其中，限位空间3的朝向第二粘接面40的开口周缘的上表面31和上述开口周缘的内侧壁32上设置有防粘层5。
在一个实施例中，防粘层可以实施为防粘涂层或者防粘镀层。其中，有关0.5mm间隙，然后可以缩小到0.2,0.15,0.1的那个部分。
不用防粘接涂层的时候，需要将这个间隙要做的很大，防止治具和胶粘到一起。间隙做的大了，胶就会溢出来，很不规则，治具用了防粘接涂层以后，这个间隙可以做的很小。这样可以利用治具对溢胶起到限位的作用。使得溢胶均匀。如果需要溢胶均匀的围绕在被粘物的周围，也可以采用这个方式的治具。
参考图2所示，上述点胶治具的工作原理如下：
将第一物体1放置于限位空间3内，限位空间3的空间形状与第一物体2适配，因而可以限制住第一物体2的位置不动，从而将第一物体2的第一粘接面20的位置固 定；
在第一物体2的第一粘接面20上涂覆胶体6；
将第二物体4的第二粘接面40覆盖至涂覆有胶体6的第一粘接面20上，通过适当的挤压，将第一粘接面20和第二粘接面40粘接在一起，同时一部分胶体会溢出到上表面31和内侧壁32上，由于上表面31和内侧壁32上设置有防粘层，因此，溢出的胶体不会与点胶治具粘接在一起，很容易将溢出的胶体与点胶治具分离。
可见，本公开实施例提供的点胶治具，在溢出胶体与点胶治具接触的位置设置有防粘层，可避免溢出的胶体与点胶治具粘接在一起，很容易将溢出的胶体与点胶治具分离，方便用户使用。
在一个实施例中，如图2所示，限位空间3的上述开口所在平面33与第一粘接面20、第二粘接面40可相互平行，这样，可使得两侧溢出的胶体相当，且防粘层依然能避免溢出的胶体与点胶治具粘接在一起。另外，对于一些应用场合，如需要将第一粘接面20和第二粘接面40非平行地粘接在一起时，即限位空间3的上述开口所在平面33与第一粘接面20平行、但与第二粘接面40不平行时，如图3所示，上述点胶治具依然可以避免两侧溢出的胶体与点胶治具粘接在一起。
在一个实施例中，限位空间3的上述开口所在平面33，到通过预设厚度H的胶体6与第一粘接面20粘接在一起的第二粘接面40之间的第一距离D1等于或小于预设值。其中，第一距离D1实际上就是溢出的胶体的厚度，也就是说要把溢出的胶体的厚度控制在预设值以内，预设值可根据需要来设置。实际操作时，可根据预设厚度的大小、第一物体的高度来设计点胶治具中限位空间的高度，使得溢出的胶体的厚度等于或小于预设值，避免溢出的胶体过多，影响美观。
在一个实施例中，如图2所示，限位空间3的上述开口所在平面33比第一粘接面20高第二距离D2，该第二距离D2等于上述预设厚度H与上述第一距离D1之间的差值，这样可以使得胶体有一部分容纳于限位空间内部，方便控制上述溢出的胶体的厚度等于或小于预设值，方便用户实施。
在一个实施例中，上述预设值等于或小于0.5毫米。例如，预设值等于0.2毫米、0.15毫米、0.1毫米等0.2毫米以内的值，这样不仅可保证粘接效果，而且可使得溢出的胶体较少，更加美观。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和 精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (7)

  1. 一种点胶治具，包括治具本体，所述治具本体上设置有用于将第一物体的第一粘接面的位置固定的限位空间，所述第一粘接面是第一物体上用于与第二物体的第二粘接面相粘接的表面；其特征在于，
    所述限位空间的朝向所述第二粘接面的开口周缘的上表面和所述开口周缘的内侧壁上设置有防粘层。
  2. 如权利要求1所述的点胶治具，其特征在于，
    所述限位空间的所述开口所在平面与所述第一粘接面、所述第二粘接面平行。
  3. 如权利要求2所述的点胶治具，其特征在于，
    所述限位空间的所述开口所在平面，到通过预设厚度的胶体与所述第一粘接面粘接在一起的所述第二粘接面之间的第一距离等于或小于预设值。
  4. 如权利要求3所述的点胶治具，其特征在于，
    所述限位空间的所述开口所在平面比第一粘接面高第二距离，所述第二距离等于所述预设厚度与所述第一距离之间的差值。
  5. 如权利要求3或4所述的点胶治具，其特征在于，
    所述预设值等于或小于0.5毫米。
  6. 如权利要求5所述的点胶治具，其特征在于，
    所述预设值等于0.2毫米、0.15毫米或者0.1毫米。
  7. 如权利要求1所述的点胶治具，其特征在于，所述防粘层包括防粘涂层或者防粘镀层。
PCT/CN2015/078105 2014-12-26 2015-04-30 点胶治具 Ceased WO2016101483A1 (zh)

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JP2016565544A JP2017507022A (ja) 2014-12-26 2015-04-30 接着剤滴下装置
MX2015008845A MX358896B (es) 2014-12-26 2015-04-30 Plantilla surtidora.
BR112015017139A BR112015017139A2 (pt) 2014-12-26 2015-04-30 equipamento de dispensação
KR1020157020117A KR101727057B1 (ko) 2014-12-26 2015-04-30 디스펜싱 지그
US14/977,081 US9662870B2 (en) 2014-12-26 2015-12-21 Dispensing jig and devices including same

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CN110016768A (zh) * 2019-04-22 2019-07-16 厦门华联电子股份有限公司 一种点胶工装
CN113399206B (zh) * 2021-06-29 2023-11-17 深圳市优景观复光电有限公司 Smt贴片炉前点胶工艺及点胶设备
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US9662870B2 (en) 2017-05-30
BR112015017139A2 (pt) 2017-07-11

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