WO2016099994A1

WO2016099994A1 - Photovoltaic devices with direct bonded connector bodies

Info

Publication number: WO2016099994A1
Application number: PCT/US2015/064384
Authority: WO
Inventors: Ankur KHARE; Ryan S. Gaston
Original assignee: Dow Global Technologies Llc
Priority date: 2014-12-18
Filing date: 2015-12-08
Publication date: 2016-06-23

Abstract

A photovoltaic device comprising: a photovoltaic laminate comprising: one or more photovoltaic cells that include one or more electric circuit assemblies; one or more connector assemblies comprising: (i) one or more terminals, (ii) one or more connector bodies disposed about the one or more terminals, and (iii) one or more encapsulant layers that are disposed at least partially about the one or more connector bodies and the one or more terminals; wherein the one or more connector assemblies are in electrical communication with the one or more electric circuit assemblies and the one or more electric circuit assemblies are at least partially encased in the photovoltaic laminate; and wherein a surface treatment is applied to the one or more connector bodies so that a joint forms a fixed connection between the one or more connector bodies and the one or more encapsulant layers.

Description

Photovoltaic Devices with Direct Bonded Connector Bodies

FIELD

[001] The present teachings relate to an improved connector and electronic circuit assembly for improved wet insulation resistance, adhesion of components, and structural integrity of the assembly, and more particularly an encapsulant layer that is directly bonded to a connector body.

BACKGROUND

[002] Building Integrated Photovoltaic Products (also known as BIPV) are exposed to significant variations in environmental loadings. They are preferably located in direct sunlight where they are subject to additional temperature loadings (beyond daily and seasonal ambient swings) due to radiant cooling and heating and may be exposed to various environmental conditions, such as rain and wind, snow and ice, and other stressful environmental conditions. Such conditions can impact the ability of the systems to function as desired if certain parts are not protected from these environmental conditions for the lifetime of the product. The BIPV system design needs to address the impacts of these environmental conditions including ensuring good electrical contacts within and among components of the system.

[003] Various testing protocols (e.g. UL 1703 Wet Insulation Resistance test ("Wet Hi- pot")) are used to determine the product's capability to handle these temperature variations. Similarly, the environment in which the photovoltaic devices are mounted to may change as a function of temperature, humidity, or as the structure settles with time. In cases where the photovoltaic devices have integral connectors and may not be connected with wires or flexible members there is a probability of leakage paths at these integral device to device connections if not properly designed or installed. Thermal expansion of the various components in the photovoltaic modules, connector assemblies, or both may affect the fluid resistance of connector assembly, the photovoltaic module, or both. An example of available solutions is illustrated in commonly owned patent application WO 2012/044762 in which a connector and electronic circuit assembly at least partially encased in a polymeric frame and including at least a connector assembly, the contents of which are incorporated herein by reference in its entirety.

[004] What is needed is a connector assembly that maintains its integrity and position during repeated thermal cycling so that the connector assembly is substantially impervious to fluid penetration, current leakage, or both. It is desirable that such assemblies and devices provide sealing about the electronic systems to prevent degradation of the system's ability to transmit electrical current, enhanced adhesion between the various components and enhanced structural stability and integrity. What is further needed is a device that includes a direct bond between a connector housing and an encapsulating layer without the need for any intervening interfacial layers. It would be attractive to have a connector assembly that is not subject to reflow during a heating process and does not require any additional components to maintain the shape and integrity of the components of the connector assembly.

SUM MARY

[005] The present teachings are directed to photovoltaic devices containing connector assemblies and connector electronic circuit assemblies having enhanced sealing about electronic components, enhanced adhesion between components of dissimilar materials, enhanced structural integrity and strength, and resistance to movement, fluid penetration, current leakage, or a combination thereof due to changes in temperature. The present teachings directly bond together a connector body and an encapsulant layer without any interfacial materials located between the connector body and the encapsulant layer.

[006] In one aspect the teachings relate to: a photovoltaic device comprising: a photovoltaic device comprising: a photovoltaic laminate comprising: one or more photovoltaic cells that include one or more electric circuit assemblies; one or more connector assemblies comprising: (i) one or more terminals, (ii) one or more connector bodies disposed about the one or more terminals, and (iii) one or more encapsulant layers that are disposed at least partially about the one or more connector bodies and the one or more terminals; wherein the one or more connector assemblies are in electrical communication with the one or more electric circuit assemblies and the one or more electric circuit assemblies are at least partially encased in the photovoltaic laminate; and wherein a surface treatment is applied to the one or more connector bodies so that a joint forms a fixed connection between the one or more connector bodies and the one or more encapsulant layers.

[007] The present teachings provide: a method of forming a photovoltaic laminate comprising: (a) connecting a protective layer to a first side of an electric circuit assembly with a bonding layer; (b) connecting a barrier layer to a second side of an electric circuit assembly with a bonding layer; (c) connecting a connector to opposing sides of the electric circuit assembly; (d) applying a surface treatment to all or a portion of a connector body of each of the connectors; and (e) forming a joint by applying one or more encapsulant layers to each of the connector bodies.

[008] The present teachings provide a connector assembly that maintains its integrity and position during repeated thermal cycling so that the connector assembly is substantially impervious to fluid penetration, current leakage, or both. The present teachings provide assemblies and devices that provide sealing about the electronic systems to prevent degradation of the system's ability to transmit electrical current, enhanced adhesion between the various components and enhanced structural stability and integrity. The present teachings provide a device that includes a direct bond between a connector housing and an encapsulating layer without the need for any intervening interfacial layers. The present teachings provide a connector assembly that is not subject to reflow during a heating process and does not require any additional components to maintain the shape and integrity of the components of the connector assembly.

DESCRIPTION OF THE DRAWINGS

[001] Fig. 1 illustrates a top view of an example of a photovoltaic array including a plurality of photovoltaic modules;

[002] Fig. 2 illustrates an exploded view of a photovoltaic module;

[003] Fig. 3 is an example of the electric circuit assembly of a photovoltaic module;

[004] Fig. 4 illustrates a cross-sectional view of a terminal of Fig. 3;

[005] Fig. 5 illustrates a close-up view of a joint with the connector body;

[006] Fig. 6 illustrates an exploded view of a photovoltaic module;

[007] Fig. 7 illustrates a close-up view of the connector of Fig. 6; and

[008] Fig. 8 illustrates graph demonstrating joint strength.

DETAILED DESCRIPTION

[009] The explanations and illustrations presented herein are intended to acquaint others skilled in the art with the teachings, its principles, and its practical application. Those skilled in the art may adapt and apply the teachings in its numerous forms, as may be best suited to the requirements of a particular use. Accordingly, the specific embodiments of the present teachings as set forth are not intended as being exhaustive or limiting of the teachings. The scope of the teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are incorporated by reference for all purposes. Other combinations are also possible as will be gleaned from the following claims, which are also hereby incorporated by reference into this written description.

[0010] A plurality of photovoltaic modules and/or photovoltaic components (i.e., solar components) of the teachings herein are combined together to form a photovoltaic array (also sometimes referred to as a solar array). The photovoltaic array collects sunlight and converts the sunlight to electricity. Generally, each of the photovoltaic modules may be individually placed in a structure that houses all of the photovoltaic modules forming all or a portion of a photovoltaic array. The photovoltaic modules of the teachings herein may be used with a housing that contains all of the individual photovoltaic modules that make up a photovoltaic array. Preferably, the photovoltaic array taught herein is free of a separate structure that houses all of the photovoltaic modules that make up a photovoltaic array. More preferably, each individual photovoltaic module may be connected directly to a structure and each of the individual photovoltaic modules is electrically connected together so that a photovoltaic array is formed (i.e., a building integrated photovoltaic (BIPV)). Each of the photovoltaic components, and preferably each row of photovoltaic components in the photovoltaic array may be adjacent to each other in a first direction. For example, if a photovoltaic array includes three rows of photovoltaic components and each row includes 5 photovoltaic components, each of the rows and each of the 5 photovoltaic components within the rows may extend along a first direction. The first direction may be aligned with the slope of a roof. Preferably, the first direction is a transverse direction (i.e., perpendicular to the slope of the roof). A portion of each of the photovoltaic modules may overlap a portion of one or more adjacent photovoltaic modules, an adjacent photovoltaic component, or both forming a shingle configuration and/or a double overlap configuration on a support structure (i.e., a support portion) so that the photovoltaic modules may be used as roofing shingles. Preferably, at least a portion of one photovoltaic component is in contact with one or more adjacent photovoltaic components so that a contiguous surface is formed, the photovoltaic components are interconnected, or both. The photovoltaic modules of each row are offset with respect to the photovoltaic module of the next adjacent row so that a number of photovoltaic modules contact two photovoltaic modules of the next adjacent row. An array may further comprise edge components (e.g., an integrated flashing piece) along the vertical edge of an array so as to provide a more aesthetically pleasing arrangement that are even vertical edges of the array where the photovoltaic modules are offset.

[0011] The edge components may also function to connect adjacent rows electronically. Such edge components and arrays are disclosed in US Patent Application No. 2011/0100436 and International Patent Application No. WO 2009/137,352 incorporated herein by reference in their entirety. The edge components may extend between ends of two adjacent rows of photovoltaic components so that the rows of photovoltaic components are electrically connected, physically connected, or both. The edge components may allow power from one row to be transferred through an adjacent row in route to the inverter. The edge components (i.e., integrated flashing pieces) may be free of any photoactive areas.

[0012] The photovoltaic components of the photovoltaic array function to collect sunlight to generate electricity, transfer power generated throughout the photovoltaic array, or both. The photovoltaic components may be a photovoltaic module, any component that assists in generating energy from sunlight, an integrated flashing piece, an inverter connection, an inverter, a connector, or a combination thereof. Preferably, the photovoltaic components are a photovoltaic module, an integrated flashing piece, or both. More preferably, at least one of two or more photovoltaic components is a photovoltaic module. The photovoltaic components may include a laminate assembly (e.g., be a photovoltaic laminate assembly), an electric circuit assembly, a photovoltaic housing, or a combination thereof. The photovoltaic components may be connected together by a connector component that is discrete from each photovoltaic component, integrally connected to one photovoltaic component and separate from another photovoltaic component, partially integrally connected to each photovoltaic component, or a combination thereof. Preferably, the photovoltaic components each include one or more connectors so that two or more adjacent and/or juxtaposed photovoltaic components may be electrically connected together. For example, the two adjacent photovoltaic components may be located in close proximity to each other (i.e., a spacer, gap, shim, or the like may be located between the two adjacent photovoltaic components) so that a connector may span between and electrically connect the two adjacent photovoltaic components.

[0013] The connector may be a separate component that extends into an integral connector assembly and/or terminal of a photovoltaic device. For example, each photovoltaic module may include a female connector on each side and a male connector may extend into each female connector forming an electrical and mechanical connection between two adjacent photovoltaic devices or vice versa. As discussed herein the connector may be part of the photovoltaic devices that extends between two adjacent photovoltaic devices to assist in forming a connection. The connector may be an integral part of a photovoltaic device. The connector may be discrete from the photovoltaic devices. For example, the connector may include two opposing male portions that project from the photovoltaic device and the male portions may form the connection between the adjacent photovoltaic devices. The connector may be a two sided device that extends between and forms a connection between connectors of two adjacent photovoltaic components. The photovoltaic components, adjacent photovoltaic components, or both may be the same components, different components, or combinations of photovoltaic components of the teachings herein located next to each other, side by side, juxtaposed, in a partially overlapping relationship, or a combination thereof. As discussed herein, an adjacent photovoltaic component may be any component taught herein that assists in creating a photovoltaic array so that power is generated from sunlight. The solar array may include a plurality of photovoltaic components. Preferably, at least some of the plurality of photovoltaic components are photovoltaic modules. A majority of the photovoltaic components and/or adjacent photovoltaic components in the photovoltaic array may be photovoltaic modules such that 50 percent or more, 60 percent or more, 70 percent or more, or even about 85 percent or more of the photovoltaic components are photovoltaic modules. As discussed herein a photovoltaic component and an adjacent photovoltaic component may be the same type of component just located side by side. The photovoltaic components when located side by side may form a mating connection, a physical connection, an electrical connection, or a combination thereof.

[0014] The mating connection, the physical connection, or both may be formed by one or more mating features, the connectors of the teachings herein, or both. The mating connection may be any connection where two or more photovoltaic modules are physically connected together. The mating connection may be only an electrical connection, only a physical connection, or both. The mating connection may be formed by a male portion, a female portion, or both. The male portion may be any feature and/or device that extends from one photovoltaic component to an adjacent photovoltaic component (whether the male portion be an integral part or a discrete part that is connected). The female portion may be any feature and/or device that receives a portion that extends from an adjacent photovoltaic component (e.g., a male portion). The mating features may be any feature that aligns the photovoltaic components, edges of the photovoltaic components, or both.

[0015] The present teachings are directed to an improved connector and electric circuit assembly of a photovoltaic laminate. The improved connector, electric circuit assembly (e.g., circuitry within the cells), or both may be at least partially encased in a photovoltaic module, an integrated flashing piece, photovoltaic laminate, or a combination thereof. The improved connector, electric circuit assembly, or both may be part of a self-contained sealed laminate that is discrete from a housing, frame, molded member, or a combination thereof of the photovoltaic module, integrated flashing piece, or both. The present teachings may include an improved connector and electronic circuit assembly that is part of a photovoltaic device ("PV device"), for example as described in PCT Patent Application No. PCT/US2009/042523. Preferably, the photovoltaic devices are a photovoltaic module, an integrated flashing piece, or both. The photovoltaic devices may include an active portion, be free of an active portion, or a combination of both. For example, an integrated flashing piece may be free of an active portion for receiving sunlight and converting the sunlight to power and a photovoltaic module may include an active portion for generating power. The photovoltaic module may comprise a multilayer laminate structure (e.g., pv laminate) that is at least partially encased in and/or secured to a polymeric frame, polymeric housing, or both.

[0016] The polymeric frame, polymeric housing, base plate, or a combination thereof may function to support the photovoltaic laminate, connect the photovoltaic laminate to a support structure, support one or more adjacent photovoltaic components, or a combination thereof. The polymeric frame may be formed about the photovoltaic laminate, photovoltaic cell or cells, or both via an over-molding process, a lamination process, or a combination of both. The polymeric frame, base plate, or both may extend only behind the photovoltaic cells, around one or more sides of the photovoltaic cells, around one or more edges of the photovoltaic cells, may form a layer that supports the photovoltaic cells, extends from the cells and forms the support portion, or a combination thereof. The polymeric frame, the base plate, or both may extend along one or more edges of the active portion, one or more sides of the active portion, behind the active portion, from an edge of the active portion and form an inactive portion, or a combination thereof. The frame may extend around a periphery of the active portion. For example, a pv laminate may be located on the base plate and form an active portion of a photovoltaic laminate. The active portion (i.e., the portion that attaches to the pv laminate) of the base plate may be located adjacent to a support portion of the base plate. The support portion may be a portion of the photovoltaic component that is fully and/or partially covered by one or more adjacent photovoltaic components. The support portion may support one or more adjacent photovoltaic components so that a shingle affect is created. The frame may support the photovoltaic cells, the electric circuit assembly, or both (i.e., forming an active portion). The photovoltaic laminate may be discretely formed and then placed on and connected to the polymeric housing and/or base plate to form a photovoltaic module and/or an active portion of a photovoltaic module. The improved connector and electronic circuit assembly is electrically connected to one or more of the photovoltaic cells, the electric circuit assembly, or both. The photovoltaic modules are preferably designed to look like standard roofing materials and can be disposed on the same structure as standard roofing materials. Preferably the photovoltaic modules can be attached to a structure in the same manner as standard roofing materials. For instance the photovoltaic modules can have the appearance of roofing shingles or tiles and can be attached to a structure in the same manner. When the photovoltaic modules are designed to function in the same manner as shingles, such devices can be attached directly to a roof or sheathing element over a roof using standard fastening systems such as nails, screws, staples, adhesives, the like, or a combination thereof. The frame may be a compilation of components/assemblies, but is preferably generally a polymeric article that is formed by a fabrication technique that facilitates forming a structure that achieves the recited functions. The frame can be formed by injection molding, compression molding, reaction injection molding, resin transfer molding, thermal forming, and the like. Preferably the polymeric frame can be formed by injecting a polymer (or polymer blend) into a mold (with or without inserts such as the multi-layer laminate structure or the other component(s), for example as disclosed in WO 2009/137,348, incorporated herein by reference.

[0017] The shingle like structure of the base plate, the photovoltaic module, or both provides an active portion and inactive portion (i.e., a support portion). The active portion comprises the portion of the device having the photovoltaic cells disposed thereon and in use this portion may be uncovered so as to be exposed to solar light. The inactive portion typically comprises the portion of the device that may be affixed to a structure using standard fastening systems. The active portion of the photovoltaic devices may include an electric circuit assembly, a pv laminate, or both. Preferably, the photovoltaic modules and more preferably the pv laminate comprise electronic circuit assemblies adapted to collect electrical energy generated by the photovoltaic cells and to transmit the electrical energy through the photovoltaic module. The electronic circuit assembly is connected to and/or includes connector assemblies which are adapted to connect the photovoltaic module with external devices, such as adjacent photovoltaic modules, edge sections or an electrical system adapted to transmit electrical energy for use (inverter). The electronic circuit assembly comprises conductors (e.g., ribbons, bus bars, or both) in contact with photovoltaic cells to collect and/or transport the electrical energy converted from solar energy. Preferably such conductive collectors are applied to the surface of the photovoltaic cells in a pattern. Where the photovoltaic modules comprise more than one photovoltaic cell the devices further comprise conductive connectors (e.g., ribbons) that connect the conductive collectors so as to transmit the electrical energy through the device. The electrical connector assemblies and/or connectors may be in the form of bus bars, traces, conductive foil or mesh, ribbons, electrical conductors, the like, or a combination thereof. Exemplary electronic circuit assemblies are disclosed in WO 2012/033657 and WO 2012/037191 incorporated herein by reference.

[0018] The frame and/or base plate have a coefficient of linear thermal expansion (CLTE) and the CLTE of the frame may closely match one or more parts of the photovoltaic devices. Preferably, the CLTE of the frame composition closely matches the CLTE of other layers of the system for instance the environmental protective layer (or in some cases of the entire structure). Preferably the compositions that make up the frame exhibit a CLTE of about 0.5 x10-6 mm/mm °C to about 140 x10-6 mm/mm °C, preferably of about 3 x10-6 mm/mm °C to about 50 x10-6 mm/mm °C, more preferably from about 5 x10-6 mm/mm °C to about 30 x10-6 mm/mm °C, and most preferably from about 7 x10-6 mm/mm °C to about 25 x10-6 mm/mm °C. Preferably the CLTE of the composition making up the frame disclosed herein are also characterized by a CLTE that is within factor of 20, more preferably within a factor of 15, still more preferably within a factor of 10, even more preferably within a factor of 5, and most preferably within a factor of 2 of the CLTE of the protective layer (or entire structure). For example, if the environmental protective layer has a CLTE of 9 x10-6 mm/mm °C, then the CLTE of the polymeric frame composition is preferably from 180 x10-6 mm/mm °C to 0.45 x10-6 mm/mm °C (a factor of 20); more preferably from 135 x10-6 mm/mm °C to 0.6 x10-6 mm/mm °C (a factor of 15); still more preferably from 90 x10-6 mm/mm °C to 0.9 x10-6 mm/mm °C (a factor of 10); even more preferably from 45 x10-6 mm/mm °C to 1.8 x10-6 mm/mm °C (a factor of 5) and most preferably from 18 x10-6 mm/mm °C to 4.5 x10-6 mm/mm °C (a factor of 2). The photovoltaic module may be free of a frame. The photovoltaic module may include a base plate that supports a photovoltaic laminate.

[0019] The frame, base plate, or both may comprise a filled or unfilled moldable polymeric material. Exemplary polymeric materials include polyolefins, styrene acrylonitrile (SAN) (acrylonitrile butadiene styrene, hydrogenated styrene butadiene rubbers, polyester amides, polyether imide, polysulfone, acetel, acrylic, polyvinyl chloride, nylon, polyethylene terephthalate, polycarbonate, thermoplastic and thermoset polyurethanes, synthetic and natural rubbers, epoxies, acrylics, polystyrene, or any combination thereof. Fillers (preferably up to about 50% by weight) may include one or more of the following: colorants, fire retardant (FR) or ignition resistant (IR) materials, reinforcing materials, such as glass or mineral fibers, surface modifiers. The polymeric materials may also include anti-oxidants, release agents, blowing agents, and other common plastic additives. In a preferred embodiment, glass fiber filler is used. The glass fiber preferably has a fiber length (after molding) ranging from about 0.1 mm to about 2.5mm with an average glass length ranging from about 0.7mm to 1.2mm.

[0020] The materials of the polymeric frame, base plate, or both may exhibit a melt flow rate of about 5 g/10 minutes or more, more preferably about 10 g/10 minutes or more. The melt flow rate is preferably 100 g/10 minutes or less, more preferably about 50 g/10 minutes or less and most preferably about than 30 g/10 minutes or less. The melt flow rate of compositions or discussed herein can be determined by test method ASTM D1238-04, "REV C Standard Test Method for Melt Flow Rates of Thermoplastics by Extrusion Plastometer", 2004 Condition L (230 "C/2.16 Kg.

[0021] The materials of the frame, base plate, or both may exhibit a flexural moduli of about 500 MPa or greater, more preferably about 600 MPa or greater, and most preferably about 700 MPa or greater. Where the multi-layer laminate structure (i.e., pv laminate) includes a glass layer, the flexural modulus is preferably about 1000 MPa or greater and about 7000 MPa or less. The flexural modulus may be about 1500 MPa or less, more preferably about 1200 MPa or less, most preferably about 1000 MPa or less. The flexural modulus of material of the frame, base plate, or both may be determined by test method ASTM D790-07 (2007) using a test speed of 2 mm/min. Preferably the materials of the frame, base plate, or both exhibit a coefficient of linear expansion ("body CLTE") of about 25x10-6 mm/mm °C to 70x10-6 mm/mm °C, more preferably of about 27x10-6 mm/mm °C to 60x10-6 mm/mm °C, and most preferably from about 30x10-6 mm/mm °C to 40x10-6 mm/mm C. The material of the frame, base plate, or both may also be characterized as exhibiting a Young's Modulus at -40 °C = 7600 MPa +/-20%; at 23 °C= 4200 MPa +/-20%; and at 85 °C= 2100 MPa+/-20%.

[0022] The materials of the frame, base plate, or both may be characterized as having both an RTI Electrical, an RTI Mechanical Strength, and an RTI Mechanical Impact rating, each of which is about 85 °C or greater, preferably about 90 °C or greater, more preferably about 95 °C or greater, still more preferably about 100 °C or greater, and most preferably about 105 °C or greater. RTI (Relative Thermal Index) is determined by the test procedure detailed in UL 746B (Nov. 29, 2000). Because RTI is an expensive and time-consuming test, a useful proxy for guiding the skilled artisan in selecting useful compositions is the melting point, as determined by differential scanning calorimetry (DSC). It is preferred that for the compositions set forth as useful herein, no melting point is seen at temperatures less than 160 °C in differential scanning calorimetry for a significant portion of the composition and preferably no melting point is seen under 160 °C for the entire composition. The Differential Scanning Calorimetry profiles may be determined by test method ASTM D7426-08 (2008) with a heating rate of 10 °C/min. If a significant fraction of the injection molding composition melts at temperatures below 160 °C, it is unlikely that the composition will pass the UL RTI tests 746B for Electrical, Mechanical Strength, Flammability, and Mechanical Impact with a high enough rating to adequately function when used in the photovoltaic device 1000.

[0023] The frame, base plate, or both may comprise any shapes and size that facilitates it performing its recited function. For example, the frame, base plate, or both may be square, rectangular, triangular, oval, circular or any combination thereof. The frame, base plate, or both may extend along one or more sides or edges of the photovoltaic devices, pv laminates, or both. Preferably, the frame, base plate, or both extends along one or more sides of a photovoltaic module, and more preferably around one or more sides of a pv laminate. The frame, base plate, or both may be integrally connected to the support portion, may extend from the support portion, may be connected to the support portion and extend under the active portion, or a combination thereof. The frame may extend around one or more sides of the active portion of a photovoltaic module.

[0024] In a preferred embodiment the photovoltaic modules of the teachings comprise a multilayer laminate structure (i.e., a photovoltaic laminate (hereinafter pv laminate)). The multilayer laminate structure, may include a plurality of individual layers (e.g. first layer, second layer, third layer, or more) which are at least partially bonded together to form the multi-layer laminate structure. In the assembled multi-layer laminate structure, any given layer may at least partially interact/interface with more than just its adjacent layer (e.g. first layer may interact/interface at least partially with the third layer). Each individual layer may be defined as having a height, length and width, and thus a volume. Each layer may also have a profile that is consistent along its height, length or width or may be variable therein. Each layer may have top, bottom, and interposed side surfaces. Each individual layer may be monolithic in nature or may itself be a multi-layer construction or an assembly of constituent components. Various layer construction/compositions embodiments are discussed below. Any layer of the multi-layer laminate structure may contain any or none of the materials or assemblies discussed herein. In other words, any particular layer may be part of any of the layers of the multi-layer laminate structure.

[0025] The pv laminate may include one or more layers that function to protect the pv laminate, a layer within the pv laminate, or both. One or more of the layers may function as an environmental shield ("protective layer"), for the multi-layer laminate structure generally, and more particularly as an environmental protective layer for the successive layers. This layer may function to protect one or more of the other layers from exposure to the elements or any material that can damage other layers or interfere in the other layers ability to function as desired. This layer is preferably constructed of a transparent or translucent material that allows light energy to pass through to at least one underlying layer. This material may be flexible (e.g. a thin polymeric film, a multi-layer film, glass, or glass composite) or be rigid (e.g. a thick glass or Plexiglas™ such as polycarbonate, an alkali-aluminosilicate, or both). The material may also be characterized by being resistant to moisture/particle penetration or build up. The environmental shield layer may also function to filter certain wavelengths of light such that preferred wavelengths may readily reach the opposite side of that layer, e.g. photovoltaic cells below the shield layer. The environmental shield layer may also function as a dielectric layer to provide electrical insulation between the electrically active materials contained within the multilayer laminate structure and the environment so as to provide protection to both the electrically active materials and externally interfacing elements. In a preferred embodiment, the environmental shield layer (first) layer material will also range in thickness from about 0.05 mm to 10 mm, more preferably from about 0.5 mm to 5 mm, and most preferably from about 3 mm to 4 mm. Other physical characteristics, at least in the case of a film, may include: a tensile strength of greater than 20MPa (as measured by JIS K7127: JSA JIS K 7127 Testing Method for Tensile Properties of Plastic Films and Sheets published in 1989); tensile elongation of 1 % or greater (as measured by JIS K7127); and water absorption (23°C, 24hours) of 0.05% or less (as measured per ASTM D570 -98(2005)).

[0026] For some embodiments of the photovoltaic modules, the pv laminate, or both disclosed herein, the environmental shield layer may comprise a glass barrier layer. If the photovoltaic modules, pv laminate, or both include a glass layer, the CLTE of the polymeric frame composition is preferably less than 80 x10-6 mm/mm °C, more preferably less than 70 x10-6 mm/mm °C, still more preferably less than 50 x10-6 mm/mm °C, and most preferably less than 30 x10-6 mm/mm °C. Preferably, the CLTE of the polymeric frame composition is greater than 5 x10-6 mm/mm °C.

[0027] In a preferred embodiment, one or more of the layers may serve as a bonding mechanism (bonding layer), helping hold some or all of any adjacent layers together. The one or more bonding layers may function to bond two or more adjacent layers together. In some case (although not always), it should also allow the transmission of a desirous amount and type of light energy to reach adjacent layers. The one or more bonding layers may bond all or a portion of the protective layer to the cells, the electric circuitry, or both. The one or more bonding layers may bond all or a portion of a barrier layer to the cells, the electric circuitry, or both. The one or more bonding layers may bond a second environmental protection layer to a barrier layer, cells, electric circuitry, or a combination thereof. The one or more bonding layers may bond all of the pv laminate layers together so that a pv laminate is formed. The one or more bonding layers may also function to compensate for irregularities in geometry of the adjoining layers or translated through those layers (e.g. thickness changes). The one or more bonding layers also may serve to allow flexure and movement between layers due to temperature change and physical movement and bending. In a preferred embodiment, the one or more bonding layers may comprise an adhesive film or mesh, preferably an olefin (especially functionalized olefins such as silane grafted olefins), EVA (ethylene-vinyl-acetate), silicone, PVB (poly-vinyl-butyral), PU (polyurethanes) similar material, or a combination thereof. The preferred thickness of this layer range from about 0.1 mm to about 1.0 mm, more preferably from about 0.2 mm to about 0.8 mm, and most preferably from about 0.25 mm to about 0.5 mm.

[0028] One or more of the layers may serve as a second environmental protection layer (back sheet layers). The one or more back sheet layers are optional such that the barrier layer may form the rear layer of a pv laminate. The one or more back layer sheets, for example, may be to keep out moisture and/or particulate matter from the layers above (or below if there are additional layers). The one or more back layers may be constructed of a flexible material (e.g. a thin polymeric film, a metal foil, a multi-layer film, a rubber sheet, or a combination thereof). In a preferred embodiment, the back sheet material may be moisture impermeable and also range in thickness from about 0.05 mm to 10.0 mm, more preferably from about 0.1 mm to 4.0 mm, and most preferably from about 0.2 mm to 0.8 mm. Other physical characteristics may include: an elongation break of about 20% or greater (as measured by ASTM D882-09); tensile strength of about 25 MPa or greater (as measured by ASTM D882-09); and tear strength of about 70 kN/m or greater (as measured with the Graves Method). Examples of preferred materials include glass plate, PET, aluminum foil, Tedlar® (a trademark of DuPont) or a combination thereof.

[0029] One or more of the layers may function as dielectric layers. These layers may be integrated into other layers or exist as independent layers. The function of these layers may be to provide electrical separation between the electrically active materials contained within the multi-layer laminate system and other electrically active materials also within the multi-layer laminate system, or elements outside of the multi-layer laminate system. These dielectric layers may also reduce the requirements of other materials in the photovoltaic module, such as the polymeric frame, first environmental barrier, or second environmental protection layer. In the preferred embodiment, these layers have a RTI (Relative Thermal Index) as determined by the test procedure detailed in UL 746B. These dielectric layers may be constructed of materials such as nylon, polycarbonate, phenolic, polyetheretherketone, polyethylene terephthalate other known dielectrics, or a combination thereof. [0030] One or more of the layers may act as an additional barrier layer (supplemental barrier layer), protecting the adjoining layers above from environmental conditions and from physical damage that may be caused by any features of the structure on which the multi-layer laminate structure is subjected to (e.g. for example, irregularities in a roof deck, protruding objects or the like). The pv laminate may be free of a supplemental barrier layer. For example, the base plate may act as a barrier layer that protects the pv laminate from damage. A supplemental barrier layer may provide other functions, such as thermal barriers, thermal conductors, adhesive function, dielectric layer, the like, or a combination thereof. The supplemental barrier layer may be a single material or a combination of several materials, for example, the supplemental barrier layer may include a scrim or a reinforcing material. Preferably, the supplemental barrier layer may be at least partially moisture impermeable and also range in thickness from about 0.25 mm to 10.0 mm, more preferably from about 0.5 mm to 2.0 mm, and most preferably from about 0.8 mm to 1.2 mm. It is preferred that this layer exhibit elongation at break of about 20% or greater (as measured by ASTM D882-09); tensile strength or about 10 MPa or greater (as measured by ASTM D882-09); and tear strength of about 35 kN/m or greater (as measured with the Graves Method). Examples of preferred barrier layer materials include thermoplastic polyolefin ("TPO"), thermoplastic elastomer, olefin block copolymers ("OBC"), natural rubbers, synthetic rubbers, polyvinyl chloride, and other elastomeric and plastomeric materials. Alternately the protective layer could be comprised of more rigid materials so as to provide additional structural and environmental protection. Additional rigidity may be desirable so as to improve the coefficient of thermal expansion of the multi-layer laminate structure and maintain the desired dimensions during temperature fluctuations. Examples of protective layer materials for structural properties include polymeric materials such polyolefins, polyester amides, polysulfone, acetel, acrylic, polyvinyl chloride, nylon, polycarbonate, phenolic, polyetheretherketone, polyethylene terephthalate, epoxies, including glass and mineral filled composites, or any combination thereof.

[0031] One or more of the layers may be constructed of any number of photovoltaic cells or connected cell assemblies. The photovoltaic cell and/or cell assemblies may be made of any material that functions to convert solar energy to electrical energy. The electronic circuit assembly (i.e., electrical circuitry) is part of this layer of the multi-laminate structure and is further described in following sections of this disclosure. The electronic circuit assembly is connected to the connector assembly so as to facilitate transfer of the electrical energy generated by the photovoltaic cells to other components of the system, for instance other photovoltaic modules, edge elements, wiring adapted for transporting the electrical energy to an inverter, or a combination thereof.

[0032] Each of the individual photovoltaic components may be electrically connected to an adjacent photovoltaic component such as a photovoltaic module by electrical circuitry. The electrical circuitry may function to transfer power through a photovoltaic component, from one photovoltaic component to another photovoltaic component, to an inverter, or a combination thereof. The electrical circuitry may function to transfer power from the cells of the pv laminate to the return electrically conducting element and out of the photovoltaic module. The electrical circuitry may function to direct power from the cells towards the inverter. The electrical circuitry may be and/or include a ribbon, a bus, a positive polarity, a negative polarity, a connector, an integrated flashing piece, an electrically conducting element, a return electrically conducting element, a cell electrically conducting element, or a combination thereof. Preferably, the electrical circuitry includes a plurality of electrically conducting elements. More preferably, the electrically conducting elements are a return electrically conducting element (e.g., a return bus or return electrode) and a cell electrically conducting element (e.g., a cell bus or cell electrode). The electrically conducting elements may have different polarities (i.e., one positive and one negative). The electrical circuitry may include one or more diodes, one or more diode bars, or both.

[0033] The one or more diodes may be part of a flexible diode strip that may have one or more diodes connected in parallel with one or more of the photovoltaic cells. The diode strips may include one or more metallic strips, one or more insulating strips, or both connected together. The diodes may be connected in series with one another by attaching a metallic conductor to the anode of one diode and the cathode of a subsequent or previous diode. An insulating strip may be sandwiched between the first side of the metallic strips (e.g., cell electrically conducting element) and the photovoltaic cells. A second insulating strip may be sandwiched between the second side of the metallic strips and the photovoltaic backsheet. The diode strip may mitigate power loss when a subset of the panel or the entire panel is operating under shaded conditions, but when some remainder of the panel or array is fully illuminated by diverting current through the metallic strips and diode(s), thereby bypassing the reverse biased cell(s). The metallic strips may be made from copper, tin plated copper, aluminum, a conductive material, or a combination thereof. The insulating strips can be made from polyethylene terephthalate (PET), Polyimide such as Kapton, or other plastic insulating material. The bypass diodes may be a bare silicon die, a pre-packaged discrete device, an integrated circuit, or a combination thereof. The bypass diodes may be part of an electrically conducting element (e.g., a bus or an electrode).

[0034] The electrically conducting elements may be made of any material that conducts power, electricity, or both. The electrically conducting elements may include copper, silver, tin, indium, gold, steel, iron, or a mixture thereof. Preferably, the electrically conducting elements are made of oxygen free copper, electrolytic tough pitched copper, or both. The electrically conducting elements may be coated with a metal that has a lower melting temperature than the base material. For example, the electrically conducting elements may be iron and coated with silver. The electrically conducting elements may be coated with a material that prevents oxidation and/or corrosion. For example, the electrically conducting elements may be a copper material that is coated with tin or indium. The electrically conducting elements and the terminals of the connector may be made of the same material, a different material, or a combination of both. An electrically conducting element of one material may be connected with a terminal of a different material. Preferably, the electrical circuitry includes electrically conducting elements that are joined to a connector of a photovoltaic component (e.g., a pv laminate connector) and a connector attaches to the connector of the photovoltaic component and extends between two or more adjacent photovoltaic components electrically and mechanically connecting the two or more adjacent photovoltaic components. The electrical circuitry may be connected to a terminal of a connector by soldering, welding, thermo-compression welding, or a combination thereof. The electrical circuitry and the terminal of the connector may be connected using any device and method taught herein and especially using the device and method of U.S. Provisional Patent Application Publication No. 61/971 ,572, filed on March 28, 2014, the contents of which are incorporated herein for all purposes and especially the teachings in Paragraph Nos. 0005- 0007, 0023-0041 , 0046-0049, and 0051-0054; and figure Nos. 3-4 and 6-9 as examples of possible methods and devices to form joints between an electrically conducting element and a terminal. The electrical circuitry may connect and/or be in integrated into part of the cells of the pv laminate.

[0035] Photovoltaic cells or cell assemblies function to convert light energy into electrical energy and transfer the energy to and from the device via connector assemblies. The photoactive portion of the photovoltaic cells may comprise material which converts light energy to electrical energy. Examples of such material includes crystalline silicon, amorphous silicon, CdTe, GaAs, dye-sensitized solar cells (so-called Gratezel cells), organic/polymer solar cells, or any other material that converts sunlight into electricity via the photoelectric effect. Preferably the photoactive layer comprises IB-IIIA-chalcogenide, such as IB-IIIA-selenides, IB-IIIA-sulfides, or IB-II IA-selenide sulfides. More specific examples include copper indium selenides, copper indium gallium selenides, copper gallium selenides, copper indium sulfides, copper indium gallium sulfides, copper gallium selenides, copper indium sulfide selenides, copper gallium sulfide selenides, and copper indium gallium sulfide selenides (all of which are referred to herein as CIGSS). These can also be represented by the formula Culn(1-x)GaxSe(2-y)Sy where x is 0 to 1 and y is 0 to 2. The copper indium selenides and copper indium gallium selenides are preferred. Additional electroactive layers such as one or more of emitter (buffer) layers, conductive layers (e.g. transparent conductive layers) and the like as is known in the art to be useful in CIGSS based cells are also contemplated herein. These cells may be flexible or rigid and come in a variety of shapes and sizes, but generally are fragile and subject to environmental degradation. The photovoltaic cell assembly is a cell that can bend without substantial cracking and/or without significant loss of functionality. Exemplary photovoltaic cells are taught and described in a number of patents and publications, including US3767471 , US4465575, US2005001 1550A1 , EP841706A2, US20070256734A1 , EP1032051 A2, JP2216874, JP2143468, and JP10189924A, all of which are incorporated by reference herein in their entirety for all purposes. The photovoltaic devices comprise one or more connector assemblies (discussed herein as "connector assembly"). Preferably, the electrical circuitry includes one or more connector assemblies that function to transfer electricity from one photovoltaic component to another photovoltaic component.

[0036] The connector assemblies may function as the conduit/bridge for electricity to move to and from the photovoltaic modules. The connector assemblies may be a female part, a male part, or both. The connector assemblies may be located adjacent to the active portion. Preferably, the connector assembly is electrically connected to a component in the active portion (e.g., a pv laminate). The one or more and preferably two or more connector assemblies may extend from the pv laminate. The connector assemblies may be flush with a side and/or edge of the photovoltaic device in which it is located. The connector assemblies may be located within a frame. The connector assemblies may be located adjacent to a frame. The connector assemblies may extend above or below the frame (e.g., base plate). The connector assembly may extend beyond an edge of the frame. The connector assemblies may extend from and/or towards a support portion from an active portion. The connector assemblies may be part of the electric circuit assembly. The connector assemblies may be electrically connected, mechanically connected, or both to the electric circuit assembly. A connector assembly on one photovoltaic device may directly connect with a connector assembly on an adjacent photovoltaic device. A connector assembly on one photovoltaic device may indirectly connect with a connector assembly on an adjacent photovoltaic device. For example, a connector may extend between the two adjacent photovoltaic devices and connect to each of the respective connector assemblies. The connector assemblies may include one or more exposed electrical components such as ribbons, bus bars, electrodes, electrical conductors, terminals, or a combination thereof. All or a portion of the photovoltaic modules may be connected in series, in parallel, or a combination thereof. The connector assemblies may be used to form such connections. Preferably the connector assemblies are disposed or encased in the vertical edges of the photovoltaic modules, the integrated flashing pieces, or both. The connector assembly may be laminated, injection molded, or both within the photovoltaic devices. The encased connector assemblies may connect to the encased connector assemblies of adjacent photovoltaic modules. Alternatively a separate connection element may be used to connect the connector assemblies of adjacent connector assemblies. Such arrangement can comprise a male connector or a female connector. Each photovoltaic module can have two of the same type of connectors, male or female, or one of each. The one or more exposed electrical components may form a terminal and the terminal may be electrically sealed, fluidly sealed, or both by one or more sealants, one or more barrier elements, or both.

[0037] The one or more terminals may be formed to create an electrical connection between one or more adjacent components so that power may be transferred from one photovoltaic device to another photovoltaic device. The terminal may be a portion of the electric circuitry (e.g., a ribbon or a bus) that extends to an outer location of the photovoltaic devices and is exposed so that the electric circuitry may be connected to another device. The terminal may be an exposed portion of the electrical circuitry. The terminal may be one or more exposed bus bars, one or more exposed ribbons, or both. The terminals may be exposed within and covered by the connector body. At least a portion of the terminal is located within a connector body.

[0038] The connector body may function to support the terminals, seal the terminals, prevent current leakage of the connector assemblies, prevent fluid penetration into the terminals, or a combination thereof. The connector body may substantially surround a portion of the terminals. The connector body may surround a portion of the terminals and a portion of the terminals may extend beyond and/or with the connector body and be exposed for making a connection. The connector body may form a rigid support piece that provides cantilever support for the terminals and provides a barrier so that fluid, current, or both are prevented from ingress and/or egress through the connector body. The connector body may be pre-formed and the terminals may be extended through the connector body. The connector body may be formed around the terminals so that the terminals are sealed within the connector body.

[0039] The connector body may function to protect one or more terminals located within the connector body. The connector body may be made of thermoplastics, thermosets, metals, ceramics, composites, or a combination thereof. The connector body may preferably be constructed of electrically non-conductive materials (having dielectric properties) and the terminal of electrically conductive materials. Preferred non-conductive materials may be organic or inorganic materials. Examples of preferred polymeric materials include thermoplastic and thermosetting materials such as, for example, filled or unfilled olefins, styrenics, polypropylene, polycarbonate, acrylonitrile butadiene styrene, polybutylene terephthalate, polyphenylene oxide, polyphenylene ether, polyphthalamide, polyphenylene sulfide, polyamide, polyarylamide, polymeric elastomers, natural or synthetic rubber, ceramic, or any combination thereof. Preferred conductive materials include plated or un-plated metals (e.g. silver, tin, steel, gold, aluminum, copper, brass, or any combination thereof) and/or conductive polymers.

[0040] The connector body may further comprise a locating element adapted to align the connector assemblies with an external connector or device. The connector body may further comprise a securing system for holding the connector assembly and consequently the photovoltaic device to an external connector or device. Such securing system can comprise any securing system (retention aid) that performs the function of aligning an external connector or device with the connector assembly guide portion, for example grooves, ribs, snap fits, mating holes and protrusions, the like, or a combination thereof. The securing system, the guide portion, or both may function to align two or more connectors together to form a fixed connection so that the terminals of the connector assembly are aligned so that electricity may be transferred through the terminals.

[0041] At least one terminal functions to conduct electricity through the connector body from the electronic circuit assembly to an external device, photovoltaic component, or both. The terminal in the inboard portion overlaps and is functionally electrically connected to the electronic circuit assembly at a connection zone. The connection zone could be a single point or a span ranging from a few millimeters to a few centimeters. The electrical connection between the connector assemblies (e.g., terminal) and the electronic circuit assembly may be facilitated by welding; soldering; crimping; the use of conductive adhesives, the like, or a combination thereof. The one or more connector assemblies may include one or more sealant layers that cover all or a portion of the connector, the terminal, the connector body, or a combination thereof. The connector body may be free of a sealant layer, contact with a sealant layer, or both. All or a portion of the connector body, terminals, or both may be in contact with, surrounded by, bonded to, one or more encapsulant layers, encapsulant material, or both.

[0042] The encapsulant may function to form a barrier that prevents fluid from penetrating into the photovoltaic components, the connector assemblies, or both. The encapsulant may be directly connected to the connector body, the terminals, or both. The encapsulant may connect to both the frame and/or base plate and the connector body. The encapsulant may form a seal all of the way around the connector body. The encapsulant may be a layer of material. The encapsulant may be shaped and formed to match a specific area and/or region. The encapsulant may prevent fluid from entering the photovoltaic components at a location proximate to the connector bodies. The encapsulant may have a melting point that is about 250°C or less, about 200°C or less, or about 175°C or less. The encapsulant may have a melting point of about 100°C or more, about 115°C or more, or about 130°C or more. The encapsulant may be a low surface energy material (e.g., about 40 dyne/cm or less, about 30 dyne/cm or less, or even about 20 dyne/cm or less). The encapsulant may have an elongation at yield when measured at 23°C that is about 50 percent or more, preferably about 60 percent or more, or more preferably about 65 percent or more measured using ASTM D882-12. The encapsulant may have an elongation at yield when measured at 23°C that is about 150 percent or less, about 120 percent or less, or about 100 percent or less (e.g., between about 67 percent and about 91 percent) measured using ASTM D882-12. The encapsulant may have an elongation at yield when measured at -40°C of about 100 or more, preferably about 1 10 percent or more, more preferably about 120 percent or more, or most preferably about 130 percent or more measured using ASTM D882-12. The encapsulant may have an elongation at yield when measured at -40°C of about 250 percent or less, about 225 percent or less, about 200 percent or less, or about 180 percent or less (e.g., between about 130 percent and about 180 percent) measured using ASTM D882-12. The encapsulant may be a thermoplastic. The encapsulant may be a polyolefin, silicones, polyvinyl butyal, ethylene vinyl acetate (EVA), an ionomer, a polyurethane, a modified polyolefin, a silane grafted polyolefin, ethylene propylene diene monomer, or both. Preferably, the encapsulant is a polyolefin or a silane modified polyolefin. One example, of a polyolefin containing silane is available from Dia Nippon Printing under DNP Z68. The encapsulant may be bonded directly to the connector body by a surface treatment being applied to the connector body.

[0043] The surface treatment may function to change the surface energy of the connector body, the encapsulant, or both so that a connection may be formed between the connector body and the encapsulant. The surface treatment may function to assist in forming a direct connection (i.e., a joint) between the encapsulant and the connector body. The surface treatment may be applied at virtually any time before a bond is formed. The surface treatment may be applied before the connector header and encapsulant are moved into contact, for the connector header is moved into a pv laminate, into a frame, into a lamination assembly, or a combination thereof. Preferably, the joint is free of any interfacial materials that are located between the connector header and the encapsulant. The surface treatment may be applied before the pv laminate is laminated, the encapsulant layer is applied, the encapsulant layer is moved into contact with the connector body, or a combination thereof. The surface treatment may form chemical groups at the surface that react with chemical groups of the material being bonded (e.g., the encapsulant, the connector body, or both). The surface treatment may create reaction groups on a first surface that bond with chemical groups on a second surface so that the first surface and a second surface bond together. The surface treatment may be a chemical treatment, a physical treatment, or both. The encapsulant may be bonded to the connector header through the lamination process where the encapsulant flows around the connector header and forms a seal.

[0044] The physical treatment may function to increase the surface energy of the encapsulant, the connector body, or both so that the encapsulant and the connector body may be connected together. The physical treatment may be an application of energy, flame treatment, atmospheric plasma, corona, laser, or a combination thereof to the surface of the encapsulant, the connector body, or both. The physical treatment may be an application of an ionized gas or an electrically neutral medium of positive and/or negative particles to the surface of the encapsulant, the connector body, or both. The physical treatment may be a heat treatment (e.g., a flame treatment). The physical treatment may be a corona treatment. The physical treatment may change the surface energy of the encapsulant, the connector body, or both by about 1.5X or more, about 2X more, or even about 2.5X or more with X being the surface energy without the physical treatment (and/or chemical treatment). The physical treatment may change the surface energy of the encapsulant, the connector header, or both by about 10 dyne/cm or more, about 15 dyne/cm or more, preferably about 20 dyne/cm or more, more preferably about 25 dyne/cm or more, or even more preferably about 30 dyne/cm or more. The physical treatment may be applied by atmospheric treatment, vacuum treatment, flame treatment ora combination thereof. The physical treatment may be applied in a vacuum, in atmospheric pressure, in an inert environment, or a combination thereof. The physical treatment may be used in leiu of, in addition to, or may be replaced by a chemical treatment.

[0045] The chemical treatment may function to increase the surface energy of or functionalize the surface of the encapsulant, the connector body, or both to levels discussed here as to thephysical treatment (i.e., a change in surface energy) so that the encapsulant and the connector body may be connected together. The chemical treatment may be an additive that is applied to the surface of the connector body, the encapsulant, or both. The chemical treatment may be a liquid that is applied to a surface of the connector body, the encapsulant, or both. The chemical treatment may be part of a waterborne system that is applied to the connector body, the encapsulant, or both by spraying, painting, dabbing, rolling, pouring, dipping, or a combination thereof. The chemical treatment may be applied in a liquid that evaporates so that the chemical treatment remains on the connector body, the encapsulant, or both. The chemical treatment may penetrate a thin layer of the surface of the encapsulant, the connector body, or both. The chemical treatment may be a primer. The chemical treatment may be a chlorinated polyolefin. The cholorinated polyolefin may be present in the liquid in a concentration of about 10 percent solids by weight percent, about 20 percent solids by weight percent, about 25 percent solids by weight percent, or even about 30 percent solids by weight percent. An example of one chemical treatment (e.g., primer) that may be used is sold under the trade name Primer 94 and is available from 3M™. The chemical treatment, physical surface treatment, or both function to assist in forming a bond between a connector body and an encapsulant.

[0046] The one or more joints may function to prevent current leakage (hereinafter joint). The joint may function to prevent fluids from penetrating into the connector, the photovoltaic component, or both. The joint may be free of any interfacial materials located between the one or more connector bodies and the one or more encapsulant layers. The joint may be a direct connection between the connector bodies and the encapsulant layers. The joint may be substantially fluid impenetrable (i.e., fluid cannot penetrate all of the way through a joint and into the connector). For example, fluid may penetrate about 50 percent or less, about 40 percent or less, about 20 percent or less, or even about 10 percent of the way or less through the joint. The joint may be sufficiently strong so that during thermal expansion the joint does not crack, fail, leak fluids, leak current, or a combination thereof. The joint may be monitored for current leakage to determine whether the joint has failed, cracked, leaks, or a combination thereof. An absence of cracking in the joint may be measured by monitoring current leaking using a wet insulation resistance test post thermal cycling measured using UL 1703 Wet Insulation Resistance test. A proper joint may result in the entire pv laminate having a current leakage of about 5 μΑ or less, about 1 μΑ or less, about 10 pA or less, or about 0 pA. More preferably, the joint is free of any current leakage. The joint may have a shear strength of about 4 MPa or more, about 7 MPa or more, preferably about 9 MPa or more, or even about 10 MPa or more measured using ASTM D3163 at -40°C. The shear strength may be measured using single lap joint specimens.

[0047] The connector body, the encapsulant, or both may be free of a sealant layer, a surrounding sealant layer, or both. For example, the connector body may be free of a butyl rubber desiccant filled polymer sealant (ADCO) wrapped around the connector header to seal the connector header and a surrounding layer (e.g., the frame or a barrier layer).

[0048] The one or more photovoltaic components may be constructed using a method as is taught herein. The method may include any of the steps taught herein performed in virtually any order unless expressly stated otherwise. Connecting one or more protective layers to one or both sides of an electric circuit assembly. Connecting one or more barrier layers to one or both sides of an electric circuit assembly. Connecting one or more bonding layers to one or both sides of an electric circuit assembly. Connecting the one or more protective layers, one or more barrier layers, or both to the electric circuit assembly using one or more bonding layers. Connecting a protective layer to an opposite side of the electric circuit assembly as the barrier layer. Inserting a connector, a connector assembly, a connector body, or a combination thereof between one or more of the layers. Attaching a connector, a connector assembly, a connector body, or a combination thereof to the electric circuit assembly. Applying a surface treatment to a connector body, an encapsulant layer, or both. Placing the encapsulant in communication with the connector body. Heating the connector body and encapsulant layer, the layers of the PV laminate, or both. Applying pressure to at least a portion of the connector (e.g., the terminals). Connecting the pv laminate to a base plate. Overmolding a frame to the pv laminate.

[0049] Figure 1 illustrates a perspective view of a photovoltaic array 2. The photovoltaic array 2 includes a plurality of photovoltaic modules 10 aligned in rows. The rows of adjacent photovoltaic modules 10 are connected by integrated flashing pieces 8.

[0050] Figure 2 illustrates an exploded view of a photovoltaic module 10. The photovoltaic module 10 includes a frame 16 including a support portion 12 and an active portion 14. The support portion 12 includes cutouts 40 for the connectors 18 to extend through. The active portion 14 includes a photovoltaic laminate 30. The photovoltaic laminate 30 includes a plurality of layers that include a protective layer 32 on the top, a bonding layer 34 located between the protective layer 32 and an electric circuit assembly 17, and a bonding layer 34 located between the electric circuit assembly 17 and a barrier layer 38 that forms a bottom layer. The electric circuit assembly 17 is comprised of a plurality of cells 36 that are connected by electrical conducting elements that are shown as ribbons 22. The ribbons 22 are connected to larger electrical conducting elements that are shown as bus bars 20. The bus bars 20 are connected to terminals 24 that extend out of connector body 26 of the connector 18.

[0051] Figure 3 illustrates a top view of the electric circuit assembly 17. The electric circuit assembly 17 includes a plurality of cells 36 located side by side and connected by ribbons 22. The ribbons 22 connect to and feed electricity to bus bars 20 that are connected to terminals 24 extending from the connector 18.

[0052] Figure 4 illustrates a cross-section of the connector 18 of Figure 4. The connector 18 includes a connector body 26 that includes a treated surface 44 so that a bond is formed between the connector body 26 and the encapsulant layer 42. The encapsulant layer 42 extends around the terminals 24 and seals the terminals 24 within the connector body 26. The encapsulant layer 42 includes a barrier layer 38 on each side that assist in protecting the encapsulant layer 42 and the connector body 26.

[0053] Figure 5 illustrates a close-up view of a connector 18. The connector 18 includes a connector body 26 that is connected to and includes terminals 24 extending therethrough. The connector body 26 includes a treated surface 44 so that an encapsulant layer 42 forms a connection with the connector body 26. The encapsulant layer 42 and the connector body 26 are directly connected together.

[0054] Figure 6 illustrates an exploded view of a photovoltaic module 10. The photovoltaic module 10 includes a base plate 12 that has a half that includes a support portion 12 for supporting one or more adjacent photovoltaic modules (not shown) and an active portion 14 that forms a connection surface for holding a photovoltaic laminate 30. The photovoltaic laminate 30 is connected to the base plate 12 by a plurality of connection devices 50. The photovoltaic laminate 30 includes a pair of opposing connectors 18 that extend substantially in a same direction.

[0055] Figure 7 illustrates a connector 18 having a connector body 26 that covers terminals (not shown) of the connector. The connector body is in communication with barrier layers 38 that cover encapsulant (not shown). The connector body 26 includes a surface treatment 44 so that encapsulant connects to the connector body 26.

[0056] Figure 8 illustrates a graph of a lap shear test illustrating two treated surfaces versus a non-treated control surface. The control is an encapsulant layer connected directly to a connector body with no treatment. The second point illustrates a joint that is formed with a physical treatment (as illustrated the physical treatment is a plasma treatment) applied on the connector body and when the connector body is treated, the connection provides about four times the shear strength as the control. The third point illustrates a joint formed with a chlorinated polyolefin primed surface of the connector body that provides about two times the shear strength as the control.

[0057] Unless stated otherwise, dimensions and geometries of the various structures depicted herein are not intended to be restrictive of the teachings, and other dimensions or geometries are possible. In addition, while a feature of the present teachings may have been described in the context of only one of the illustrated embodiments, such feature may be combined with one or more other features of other embodiments, for any given application. It will also be appreciated from the above that the fabrication of the unique structures herein and the operation thereof also constitute methods in accordance with the present teachings. Therefore, the following claims should be studied to determine the true scope and content of the teachings. Unless otherwise stated, all ranges include both endpoints and all numbers between the endpoints. The use of "about" in connection with a range applies to both ends of the range.

[0058] The disclosures of all articles and references, including patent applications and publications, are incorporated by reference for all purposes. The use of the terms "comprising" or "including" to describe combinations of elements, ingredients, components or steps herein also contemplates embodiments that consist essentially of the elements, ingredients, components or steps. Plural elements, ingredients, components or steps can be provided by a single integrated element, ingredient, component or step. Alternatively, a single integrated element, ingredient, component or step might be divided into separate plural elements, ingredients, components or steps. The disclosure of "a" or "one" to describe an element, ingredient, component or step is not intended to foreclose additional elements, ingredients, components or steps.

Claims

What is claimed is:

We Claim:

1) . A photovoltaic device comprising:

a photovoltaic laminate comprising:

one or more photovoltaic cells that include one or more electric circuit assemblies;

one or more connector assemblies comprising: i) one or more terminals, ii) one or more connector bodies disposed about the one or more terminals, and iii) one or more encapsulant layers that are disposed at least partially about the one or more connector bodies and the one or more terminals; wherein the one or more connector assemblies are in electrical communication with the one or more electric circuit assemblies and the one or more electric circuit assemblies are at least partially encased in the photovoltaic laminate; and wherein a surface treatment is applied to the one or more connector bodies so that a joint forms a fixed connection between the one or more connector bodies and the one or more encapsulant layers.

2) The photovoltaic device of claim 1 , wherein the surface treatment is a physical treatment that is applied only to the one or more connector bodies.

3) The photovoltaic device of claim 1 , wherein the surface treatment is a chemical treatment that is applied only to the one or more connector bodies.

4) The photovoltaic device of any of the preceding claims, wherein the joint has a shear strength of about 4 M Pa or more at -40 °C measured using ASTM D3163.

5) The photovoltaic device of any of the preceding claims, wherein the joint has a shear strength of about 9 M Pa or more at -40 °C measured using ASTM D3163.

6) The photovoltaic device of any of the preceding claims, wherein the joint is free of any interfacial materials located between the one or more connector bodies and the one or more encapsulant layers. 7) The photovoltaic device of any of the preceding claims, wherein the joint is substantially fluid impenetrable.

8) The photovoltaic device of any of the preceding claims, wherein the joint during thermal cycling is resistant to cracking as indicated by absence of current leakage in a wet insulation resistance test post thermal cycling measured using UL 1703 Wet Insulation Resistance test ..

9) The photovoltaic device of any of the preceding claims, wherein one or more connector bodies are made of polybutylene terephthalate and the encapsulant layer is a silane modified polyolefin.

10) The photovoltaic device of any of the preceding claims, wherein the photovoltaic device is a photovoltaic module.

1 1) A method of forming a photovoltaic laminate comprising:

a. connecting a protective layer to a first side of an electric circuit assembly with a bonding layer;

b. connecting a barrier layer to a second side of an electric circuit assembly with a bonding layer;

c. connecting a connector to opposing sides of the electric circuit assembly;

d. applying a surface treatment to all or a portion of a connector body of each of the connectors; and

e. forming a joint by applying one or more encapsulant layers to each of the connector bodies.

12) The method of claim 11 , wherein the photovoltaic laminate is heated so that the one or more encapsulant layers bond to each of the connector bodies.

13) The method of any of claims 11 through 12, wherein the surface treatment is a physical treatment that is applied only to the one or more connector bodies.

14) The method of any of claims 11 through 12, wherein the surface treatment is a chemical treatment that is applied only to the one or more connector bodies.

15) The method of any of claims 1 1 through 14, wherein the joint has a shear strength of about 4 MPa or more at -40 °C measured using ASTM D3163.