WO2016090823A1 - 耳机插座、耳机插头、耳机和电子设备 - Google Patents

耳机插座、耳机插头、耳机和电子设备 Download PDF

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Publication number
WO2016090823A1
WO2016090823A1 PCT/CN2015/077880 CN2015077880W WO2016090823A1 WO 2016090823 A1 WO2016090823 A1 WO 2016090823A1 CN 2015077880 W CN2015077880 W CN 2015077880W WO 2016090823 A1 WO2016090823 A1 WO 2016090823A1
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WO
WIPO (PCT)
Prior art keywords
earphone
plug
jack
grounding
terminals
Prior art date
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PCT/CN2015/077880
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English (en)
French (fr)
Inventor
李晖
孙伟
范杰
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小米科技有限责任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 小米科技有限责任公司 filed Critical 小米科技有限责任公司
Priority to KR1020157017077A priority Critical patent/KR101776624B1/ko
Priority to JP2016563235A priority patent/JP6262374B2/ja
Priority to BR112015018754A priority patent/BR112015018754A2/pt
Priority to MX2015009127A priority patent/MX354971B/es
Priority to RU2015129516A priority patent/RU2618512C2/ru
Priority to US14/799,286 priority patent/US9537271B2/en
Publication of WO2016090823A1 publication Critical patent/WO2016090823A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth pin, blade or socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H01R13/17—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member on the pin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H01R13/187—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member in the socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/58—Contacts spaced along longitudinal axis of engagement

Definitions

  • the present disclosure relates to the field of earphone technology, and in particular to a headphone jack, a headphone plug, an earphone, and an electronic device.
  • the headphone crosstalk may be caused by various reasons; in the related art, the left and right channels are often reduced by increasing the isolation of the left and right channels of the earphone. Direct crosstalk between them, but this leads to the design difficulty and production cost of the headphones is greatly improved, obviously not a reasonable solution.
  • the present disclosure provides a headphone jack, a headphone jack, an earphone, and an electronic device to solve the technical problem of headphone crosstalk in the related art.
  • a headset jack including:
  • socket body wherein the socket body forms a headphone jack
  • a plurality of grounding terminals are disposed in the earphone jack, and are in contact with the grounding segment on the earphone plug when the earphone plug is inserted into the earphone jack.
  • the plurality of ground terminals are equal in distance between the insertion direction of the earphone plug and the end of the earphone jack.
  • the plurality of ground terminals are evenly arranged along a circumferential direction of the earphone jack.
  • each of the ground terminals includes:
  • a common ground structure disposed on an inner wall of the earphone jack, a head connectable to the earphone plug when the earphone plug is inserted into the earphone jack, and a common ground structure and a head disposed Flexible mechanism between the two.
  • the head of the grounding terminal is a spherical metal structure.
  • each of the ground terminals is an elastic sheet structure.
  • an earphone plug comprising:
  • a plurality of grounding terminals, the grounding portion disposed on the plug body, can be in contact with a common grounding area on the inner wall of the earphone jack when the plug body is inserted into the earphone jack.
  • the plurality of ground terminals are equal in distance from the end of the earphone plug in the insertion direction of the earphone plug.
  • the plurality of ground terminals are evenly arranged along a circumferential direction of the earphone plug.
  • each of the ground terminals includes:
  • a common ground structure disposed on the plug body, a head contactable with the common ground area when the earphone plug is inserted into the earphone jack, and a head disposed between the common ground structure and the head Flexible mechanism.
  • an axial accommodating space is formed in the plug body, and the common grounding structure is located in the axial accommodating space; and the plug body is further provided with the axial accommodating space.
  • a plurality of radial openings are connected, and the ground terminals are located in the plurality of radial openings in a one-to-one correspondence.
  • the head of the grounding terminal is a spherical metal structure.
  • a headphone jack that matches the headphone plug of any of the above embodiments; the headphone jack includes:
  • socket body wherein the socket body forms a headphone jack
  • the common grounding area is disposed on the inner wall of the earphone jack, and is in contact with the plurality of grounding terminals of the grounding section on the earphone plug when the earphone plug is inserted into the earphone jack.
  • the common grounding area is an annular metal structure.
  • an earphone comprising: the earphone plug of any of the above embodiments.
  • an electronic device comprising: the earphone jack of any of the above embodiments.
  • the present disclosure contacts the grounding segment on the earphone plug through a plurality of grounding terminals, thereby increasing the contact area of the grounding terminal between the earphone plug and the earphone socket, thereby helping to reduce the contact resistance between the earphone plug and the earphone socket, and thereby Reduce the crosstalk caused by the motherboard side of devices such as smart terminals.
  • FIG. 1 is a schematic diagram of impedance formed when an earphone is connected to an electronic device.
  • FIG. 2 is a schematic axial cross-sectional view of the related art in which the earphone plug is mated with the earphone socket.
  • 3-4 are schematic axial cross-sectional views of the earphone plug when mated with the earphone jack, according to an exemplary embodiment.
  • FIG. 5 is a schematic cross-sectional view of a headphone plug when mated with a headphone jack, according to an exemplary embodiment.
  • 6-7 are schematic axial cross-sectional views of the earphone plug when mated with the earphone jack, according to another exemplary embodiment.
  • FIG. 8 is a schematic perspective structural view of a headphone plug according to an exemplary embodiment.
  • FIG. 9 is a schematic cross-sectional view of a ground terminal, according to an exemplary embodiment.
  • FIG. 10 is a schematic radial cross-sectional view showing a headphone plug mated with an earphone jack, according to another exemplary embodiment.
  • FIG. 1 is a schematic diagram of impedance formed when an earphone is connected to an electronic device.
  • R l_Trance , R g_Trance , and R r_Trance are line impedances caused by traces inside the electronic device.
  • R l_Conduct , R g_Conduct , and R r_Conduct are the contact impedances generated between the headphone jack and the headphone jack, R l1 and R l2 , R r1 and R r2 represent the impedance introduced by the left and right ear canal connections, respectively, and R left and R right are the impedances of the left and right channels.
  • the impedance that actually causes the crosstalk of the headphones is R g_Trance and R g_Conduct
  • the corresponding earphone crosstalk can be calculated by the following formula (1):
  • the headphone crosstalk can be reduced by reducing R g_Trance and R g_Conduct as much as possible.
  • R g_Trance is the impedance introduced by the internal wiring of the electronic device, and the crosstalk caused by the impedance can be reduced by shortening the length of the trace, increasing the area of the trace, and introducing a feedback signal; however, the related art has been properly wired. It has been possible to reduce R g_Trance to the m ⁇ level, and the space for further optimization is already small; however, the optimization processing of R g_Conduct is not mentioned in the related art.
  • R g_Conduct is actually a contact impedance generated when the earphone plug and the earphone socket are mated, for example, in the axial cross-sectional schematic diagram of the earphone plug and the earphone socket in the related art shown in FIG. 2, the spring piece setting In the earphone jack in the earphone socket, when the earphone plug is inserted into the earphone jack, the shrapnel can be in contact with the GND end of the earphone plug to generate a corresponding impedance Rg_Conduct .
  • the present disclosure proposes an improvement to a headphone jack.
  • 3 is a schematic axial cross-sectional view of the earphone plug and the earphone socket according to an exemplary embodiment, as shown in FIG. include:
  • a socket body 11 a socket jack 111 is formed in the socket body 11;
  • a plurality of grounding terminals 12 are disposed in the earphone jack 111, and are in contact with the grounding segment 20 on the earphone plug 2 when the earphone plug 2 is inserted into the earphone jack 111.
  • the grounding segment 20 is the GND end of the earphone plug 2 (as shown in FIG. 2).
  • the impedance R g_Conduct described above can be generated.
  • the elastic piece corresponding to a ground terminal
  • the crosstalk of the headphones can be reduced. Can be used to meet the user's high requirements for sound quality.
  • the earphone plug includes four segments, which are: a first segment corresponding to the left channel signal, a second segment corresponding to the right channel signal, and a corresponding to the GND signal.
  • the third segment corresponds to the fourth segment of the MIC (Microphone) signal.
  • this is only one configuration of the earphone plug, such as in another earphone plug configuration, a third segment corresponding to the GND signal and a fourth segment corresponding to the MIC signal; or, the earphone plug may only contain The first segment of the left channel signal, the second segment corresponding to the right channel signal, and the third segment corresponding to the GND signal.
  • the present disclosure is only described by taking the earphone plug structure shown in FIG. 2 as an example, and does not limit the type of the earphone plug; those skilled in the art should understand that the technical solution of the present disclosure is applicable to all the structures of the earphone.
  • the plug can use multiple grounding terminals 12 in the earphone socket, thereby increasing the contact area with the earphone plug. Small corresponding contact impedance, and ultimately reduce headphone crosstalk for better sound quality.
  • each of the grounding terminals 12 of the earphone may include:
  • a common ground structure 121 disposed on an inner wall of the earphone jack 111, a head 122 connectable to the earphone plug 2 when the earphone plug 2 is inserted into the earphone jack 111, and a common ground structure
  • the head 122 of the grounding terminal 12 may be a spherical metal structure to achieve reliable contact.
  • the elastic piece structure Comparing with the structure of the elastic piece shown in FIG. 2, the elastic piece structure generates elastic force only by its own mechanical deformation, and its elastic force is weak; and in the grounding terminal 12 shown in FIG. 4, it passes through a separate elastic mechanism 123 (such as a spring).
  • the structure can provide greater pressure so that the head of the ground terminal 12 contacts the grounding section of the earphone plug 2 by greater pressure, which helps to further reduce the resulting contact impedance, thereby reducing headphone crosstalk.
  • grounding section 20 is a small section on the earphone plug 2, in order to ensure that all the grounding terminals 12 can be in accurate contact with the grounding section 20, a plurality of grounding terminals 12 can be made in the insertion direction of the earphone plug 1 with the earphones.
  • the distance between the ends (inlet or bottom, not shown) of the jack 111 is equal.
  • FIG. 5 is a schematic radial cross-sectional view showing the cooperation between the plurality of grounding terminals 12 and the grounding section 20 when the earphone plug 2 is inserted into the earphone jack 111.
  • the common ground structure 121 may be an annular metal structure disposed on the inner wall of the earphone jack 111, the inner side of which is connected to the elastic structure 123, and the outer side is connected to the main board (not shown) of the electronic device. .
  • all of the grounding terminals 12 can be evenly arranged along the circumferential direction of the earphone jack 111, thereby forming a "surrounding" of the earphone plug 2, ensuring that all of the grounding terminals 12 can come into contact with the grounding section 20, and the contact pressure is equivalent.
  • the present disclosure does not limit the structure of the ground terminal 12.
  • the elastic sheet structure of the related art ie, the elastic piece shown in FIG. 2 can be used.
  • a plurality of grounding terminals 12 of an elastic sheet structure on the inner wall of the earphone jack 111, when the earphone plug 2 is inserted into the earphone jack 111, a plurality of grounding terminals 12 are provided.
  • the grounding section 20 on the earphone plug 2 is simultaneously contacted under the elastic force generated by its own mechanical deformation, and the corresponding contact resistance is reduced by the increased contact area, thereby reducing the generated earphone crosstalk.
  • FIG. 8 is a schematic perspective structural view of a headphone plug according to an exemplary embodiment.
  • the headphone plug 3 may include:
  • the plurality of grounding terminals 32 can simultaneously contact the common grounding area of the earphone jack, thereby increasing the GND of the earphone plug 3.
  • the contact area between the end and the common ground area of the headphone jack reduces the corresponding contact impedance to reduce the resulting headphone crosstalk.
  • the earphone plug 3 needs to realize various signal transmission between the earphone plug 3 and the earphone socket after being inserted into the earphone jack, the area of the common grounding area is limited, and the plurality of grounding terminals 32 can be made at the earphone plug 3.
  • the distance between the end portions of the earphone plugs 3 in the insertion direction is equal, ensuring that all of the ground terminals 32 can be accurately brought into contact with the common ground area.
  • FIG. 9 is a schematic cross-sectional view of a ground terminal according to an exemplary embodiment. As shown in FIG. 9, each ground terminal 32 may include:
  • the head 322 of the grounding terminal 32 may be a spherical metal structure to achieve reliable contact; or, of course, other structures may be employed.
  • an axial accommodating space is formed in the plug body 31, and the common grounding structure 321 is located in the axial accommodating space (not shown); and the plug body 31 is further provided.
  • all of the grounding terminals 32 can be evenly arranged along the circumferential direction of the earphone plug 3, so that when the earphone plug 3 is inserted into the earphone jack 41, the common grounding area 40 can "surround" all of the grounding terminals 32, ensuring all grounding terminals.
  • Each of 32 is capable of coming into contact with the common grounding area 40, and the contact pressure is equivalent.
  • a matching earphone jack 4 which includes:
  • socket body (not shown), the socket body forms a headphone jack 41;
  • a common grounding area 40 is disposed on the inner wall of the earphone jack 41, and when the earphone plug 3 (shown in FIG. 8) is inserted into the earphone jack 41, and the grounding section 30 on the earphone plug 3 The plurality of ground terminals 32 are in contact.
  • the common ground region 40 may be an annular metal structure.
  • a corresponding earphone is also proposed, which may include the earphone plug of any of the above embodiments.
  • a corresponding electronic device may also be proposed, which may include a headphone jack according to any of the above embodiments; for example, the electronic device may be a smart phone, a music player, a tablet computer or the like.

Abstract

一种耳机插座、耳机插头、耳机和电子设备，该耳机插座（1）包括：插座本体（11），所述插座本体（11）内形成耳机插孔（111）；多个接地端子（12），设置于所述耳机插孔（111）内，可在耳机插头（2）插入所述耳机插孔（111）时，均与所述耳机插头（2）上的接地段（20）接触。所述电子设备包括所述耳机插座（1）；所述耳机包括所述耳机插头（2）。由于存在多个接地端，可以降低耳机串扰，提升音质。

Description

耳机插座、耳机插头、耳机和电子设备
本申请基于申请号为201410746572.4、申请日为2014年12月08日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本公开涉及耳机技术领域，尤其涉及耳机插座、耳机插头、耳机和电子设备。
背景技术
随着对声音质量的要求越来越高，用户不再满足于自己的智能终端等设备仅能够“发出声音”，还希望尽可能地消除耳机串扰(CrossTalk)导致的音质降低问题。
当用户通过耳机来收听来自智能终端等设备的声音时，耳机串扰可能由多种原因导致；而在相关技术中，往往通过增大耳机左右声道的隔离度的方式，来减少左右声道之间的直接串扰，但这导致耳机的设计难度和生产成本极大地提升，显然并非合理的解决方式。
发明内容
本公开提供耳机插座、耳机插头、耳机和电子设备，以解决相关技术中的耳机串扰的技术问题。
根据本公开实施例的第一方面，提供一种耳机插座，包括：
插座本体，所述插座本体内形成耳机插孔；
多个接地端子，设置于所述耳机插孔内，可在耳机插头插入所述耳机插孔时，均与所述耳机插头上的接地段接触。
可选的，所述多个接地端子在所述耳机插头的插入方向上与所述耳机插孔的端部之间的距离相等。
可选的，所述多个接地端子沿所述耳机插孔的周向均匀排布。
可选的，每个所述接地端子包括：
设置于所述耳机插孔的内壁上的公共接地结构、可在所述耳机插头插入所述耳机插孔时与所述耳机插头接触的头部、以及设置于所述公共接地结构和头部之间的弹性机构。
可选的，所述接地端子的头部为球状金属结构。
可选的，每个所述接地端子为弹性片状结构。
根据本公开实施例的第二方面，提供一种耳机插头，包括：
插头本体；
多个接地端子，设置于所述插头本体上的接地段，可在所述插头本体插入耳机插孔时，与所述耳机插孔内壁上的公共接地区域接触。
可选的，所述多个接地端子在所述耳机插头的插入方向上与所述耳机插头的端部之间的距离相等。
可选的，所述多个接地端子沿所述耳机插头的周向均匀排布。
可选的，每个所述接地端子包括：
设置于所述插头本体上的公共接地结构、可在所述耳机插头插入所述耳机插孔时与所述公共接地区域接触的头部、以及设置于所述公共接地结构和头部之间的弹性机构。
可选的，所述插头本体内部形成一轴向容置空间，且所述公共接地结构位于该轴向容置空间内；以及，所述插头本体上还设有与所述轴向容置空间连通的多个径向开孔，且所述接地端子一一对应地位于该多个径向开孔内。
可选的，所述接地端子的头部为球状金属结构。
根据本公开实施例的第三方面，提供一种耳机插座，与上述任一实施例的耳机插头相匹配；该耳机插座包括：
插座本体，所述插座本体内形成耳机插孔；
公共接地区域，设置于所述耳机插孔的内壁，可在所述耳机插头插入所述耳机插孔时，与所述耳机插头上的接地段的多个接地端子接触。
可选的，所述公共接地区域为环状金属结构。
根据本公开实施例的第四方面，提供一种耳机，包括：如上述任一实施例的耳机插头。
根据本公开实施例的第五方面，提供一种电子设备，包括：如上述任一实施例的耳机插座。
本公开的实施例提供的技术方案可以包括以下有益效果：
本公开通过多个接地端子与耳机插头上的接地段接触，增加了耳机插头与耳机插座之间的接地端的接触面积，从而有助于降低耳机插头与耳机插座之间的接触阻抗，并由此减小智能终端等设备的主板侧带来的耳机串扰。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性和解释性的，并不能限制本公开。
附图说明
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本公开的实施例，并与说明书一起用于解释本公开的原理。
图1是耳机连接至电子设备时形成的阻抗示意图。
图2是相关技术中的耳机插头与耳机插座进行配合时的轴向截面示意图。
图3-4是根据一示例性实施例示出的耳机插头与耳机插座进行配合时的轴向截面示意图。
图5是根据一示例性实施例示出的耳机插头与耳机插座进行配合时的径向截面示意图。
图6-7是根据另一示例性实施例示出的耳机插头与耳机插座进行配合时的轴向截面示意图。
图8是根据一示例性实施例示出的耳机插头的立体结构示意图。
图9是根据一示例性实施例示出的接地端子的截面示意图。
图10是根据另一示例性实施例示出的耳机插头与耳机插座进行配合时的径向截面示意图。
具体实施方式
这里将详细地对示例性实施例进行说明，其示例表示在附图中。下面的描述涉及附图时，除非另有表示，不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本公开相一致的所有实施方式。相反，它们仅是与如所附权利要求书中所详述的、本公开的一些方面相一致的装置和方法的例子。
图1是耳机连接至电子设备时形成的阻抗示意图。如图1所示，Rl_Trance、Rg_Trance和Rr_Trance是电子设备内部的走线引起的线路阻抗，Rl_Conduct、Rg_Conduct和Rr_Conduct是耳机插座与耳机插头之间产生的接触阻抗，Rl1和Rl2、Rr1和Rr2分别表示左右耳道连线引入的阻抗，而Rleft和Rright为左右声道的阻抗。在上述阻抗中，真正造成耳机串扰的阻抗为Rg_Trance和Rg_Conduct，其对应产生的耳机串扰可以通过下述公式(1)计算得到：
Figure PCTCN2015077880-appb-000001
由公式(1)可知：通过尽可能地减小Rg_Trance和Rg_Conduct，即可减小耳机串扰。其中，Rg_Trance为电子设备内部走线引入的阻抗，可以通过缩短走线长度、增大走线面积、引入反馈信号等方式来降低该阻抗引起的耳机串扰；然而，相关技术中已经通过合理布线，已经可以使得Rg_Trance降至mΩ水平，进一步优化的空间已经很小；但相关技术中并未提及对Rg_Conduct的优化处理。
Rg_Conduct实际上是由耳机插头与耳机插座之间在配合时，产生的接触阻抗，比如在图2示出的相关技术中的耳机插头与耳机插座进行配合时的轴向截面示意图中，弹片设置于耳机插座内的耳机插孔中，当耳机插头插入该耳机插孔后，该弹片即可与耳机插头上的GND端接触，产生对应的阻抗Rg_Conduct。
因此，通过本公开的技术方案，提出了新的耳机插座、耳机插头、耳机和电子设备的结构，以降低上述的阻抗Rg_Conduct。为了结合实施例，对本公开的技术方案进行进一步描述。
一、耳机插座
在一实施例中，本公开提出了对耳机插座的改进。相应地，图3是根据一示例性实施例示出的耳机插头与耳机插座进行配合时的轴向截面示意图，如图3所示，耳机插座1包 括：
插座本体11，所述插座本体11内形成耳机插孔111；
多个接地端子12，设置于所述耳机插孔111内，可在耳机插头2插入所述耳机插孔111时，均与所述耳机插头2上的接地段20接触。
在本实施例中，接地段20即耳机插头2上的GND端(如图2所示)，当接地端子12与接地段20接触时，即可产生上述的阻抗Rg_Conduct。其中，在图2所示的相关技术中，只需要确保弹片(相当于一个接地端子)与GND端接触以实现接地即可；而在本公开的上述技术方案中，通过设置多个接地端子12同时与接地段20接触，使得对应的接触面积增加至相关技术的数倍，而由此产生的接触阻抗Rg_Conduct则相应地减小为图2所示情况的1/N(N为接地端子12的数量)。
针对图3所示的采用多个接地端子12的实施例，可以结合公式(1)计算出对应的接触阻抗；其中，由于耳机的左右声道的阻抗通常为相同阻值，即Rleft＝Rright＝R，并且由于可以通过合理布线而将Rg_Trance降低至可忽略的数量级，则公式(1)可以简化为：
Figure PCTCN2015077880-appb-000002
进一步地，由于R>>(远大于)Rg_Conduct，则上式可以进一步简化为：
Crosstalk(dB)＝20×log(Rg_conduct)-20×log(R)
比如当接地端子12的数量为8个时，可使耳机串扰降低
Figure PCTCN2015077880-appb-000003
能够用于满足用户对音质的高要求。
需要说明的是：
(1)图2所示的耳机插头结构中，耳机插头包含四段，依次为：对应于左声道信号的第一段、对应于右声道信号的第二段、对应于GND信号的第三段和对应于MIC(Microphone，麦克风)信号的第四段。然而，这仅为耳机插头的一种结构，比如在另一种耳机插头结构中，对应于GND信号的第三段和对应于MIC信号的第四段；或者，耳机插头还可能仅包含对应于左声道信号的第一段、对应于右声道信号的第二段、对应于GND信号的第三段。
实际上，本公开仅以图2所示的耳机插头结构为例进行说明，而并不对耳机插头的类型进行限制；本领域技术人员应该理解的是：本公开的技术方案适用于所有结构的耳机插头，均可以在耳机插座中采用多个接地端子12，从而通过增加与耳机插头的接触面积，减 小对应的接触阻抗，并最终减小耳机串扰，实现更优的音质。
(2)接地端子的结构
实施方式一
如图4所示，在耳机插头2插入耳机插孔111之后，多个接地端子12均分别与耳机插头2上的接地段20接触，其中，耳机每个接地端子12可以包括：
设置于所述耳机插孔111的内壁上的公共接地结构121、可在所述耳机插头2插入所述耳机插孔111时与所述耳机插头2接触的头部122、以及设置于公共接地结构121和头部122之间的弹性机构123。其中，接地端子12的头部122可以为球状金属结构，以实现可靠的接触。
通过与图2所示的弹片结构比较可知：弹片结构仅通过自身的机械形变来产生弹力，其弹力较弱；而在图4所示的接地端子12中，通过独立的弹性机构123(比如弹簧等结构)可以提供更大的压力，使得接地端子12的头部通过更大的压力与耳机插头2的接地段接触，有助于进一步降低由此产生的接触阻抗，从而减小耳机串扰。
由于接地段20为耳机插头2上的一小段，为了确保所有的接地端子12均能够与接地段20准确接触，可以使多个接地端子12在所述耳机插头1的插入方向上与所述耳机插孔111的端部(入口或底面，图中未标示)之间的距离相等。
图5示出了耳机插头2插入耳机插孔111时，多个接地端子12与接地段20之间进行配合的径向截面示意图。如图5所示，公共接地结构121可以为设置于耳机插孔111的内壁上的环状金属结构，其内侧与弹性结构123相连，而外侧与电子设备的主板(图中未示出)相连。
此外，所有的接地端子12可以沿耳机插孔111的周向均匀排布，从而对耳机插头2形成“包围”，确保所有接地端子12均能够与接地段20发生接触，且接触压力相当。
实施方式二
本领域技术人员应当理解的是，本公开并不对接地端子12的结构进行限制，比如除了图4所示结构外，仍然可以采用相关技术中的弹性片状结构(即图2所示的弹片)
如图6所示，在一示例性实施方式中，通过在耳机插孔111内壁设置多个弹性片状结构的接地端子12，则当耳机插头2插入耳机插孔111时，多个接地端子12可以如图7所示：同时在自身的机械形变产生的弹力下接触耳机插头2上的接地段20，通过由此增加的接触面积，降低对应的接触阻抗，减小产生的耳机串扰。
二、耳机插头和耳机插座
(一)耳机插头
在一实施例中，本公开提出了对耳机插头以及耳机插座的同时改进。相应地，图8是根据一示例性实施例示出的耳机插头的立体结构示意图，如图8所示，该耳机插头3可以包括：
插头本体31；
多个接地端子32，设置于所述插头本体31上的接地段30，可在所述插头本体31插入耳机插孔(图中未示出)时，与所述耳机插孔内壁上的公共接地区域接触。
在上述实施例中，通过在耳机插头3的插头本体31上设置多个接地端子32，使得多个接地端子32能够同时与耳机插孔的公共接地区域接触，从而通过增大耳机插头3的GND端与耳机插孔的公共接地区域之间的接触面积，降低对应的接触阻抗，以减小产生的耳机串扰。
由于耳机插头3在插入耳机插孔之后，需要在耳机插头3与耳机插座之间实现多种信号传输，则公共接地区域的面积有限，可以通过使多个接地端子32在所述耳机插头3的插入方向上与所述耳机插头3的端部之间的距离相等，确保所有接地端子32均可以准确地与公共接地区域发生接触。
图9是根据一示例性实施例示出的接地端子的截面示意图，如图9所示，每个接地端子32可以包括：
设置于所述插头本体31上的公共接地结构321、可在所述耳机插头3插入所述耳机插孔时与所述公共接地区域接触的头部322、以及设置于公共接地结构321和头部322之间的弹性机构323。其中，接地端子32的头部322可以为球状金属结构，以实现可靠的接触；或者，当然也可以采用其他结构。
在该实施例中，与图4所示的接地端子12相类似的，通过采用独立的弹性机构323(比如弹簧等)，可以为接地端子32提供更大的接触压力，有助于降低接触阻抗、减小耳机串扰。
如图10所示，插头本体31内部形成一轴向容置空间，且所述公共接地结构321位于该轴向容置空间(图中未标示)内；以及，所述插头本体31上还设有与所述轴向容置空间连通的多个径向开孔(图中未标示)，且所述接地端子32一一对应地位于该多个径向开孔内。
其中，由图10可知：当耳机插头3插入耳机插座4内形成的耳机插孔41时，耳机插头3上的多个接地端子32均可以与耳机插孔41内壁上的公共接地区域40发生接触，以增加接触面积，降低接触阻抗。
此外，所有的接地端子32可以沿耳机插头3的周向均匀排布，从而使得耳机插头3插入耳机插孔41时，公共接地区域40可以对所有接地端子32形成“包围”，确保所有接地端子32均能够与公共接地区域40发生接触，且接触压力相当。
(二)耳机插座
如图10所示，对应于上述的(一)耳机插头3的结构，本公开提出了相匹配的耳机插座4，该耳机插座4包括：
插座本体(图中未示出)，所述插座本体内形成耳机插孔41；
公共接地区域40，设置于所述耳机插孔41的内壁，可在所述耳机插头3(如图8所示)插入所述耳机插孔41时，与所述耳机插头3上的接地段30的多个接地端子32接触。
可选的，公共接地区域40可以为环状金属结构。
基于本公开的技术方案，还提出了相应的耳机，可以包括如上述任一实施例的耳机插头。
基于本公开的技术方案，还提出了相应的电子设备，可以包括如上述任一实施例的耳机插座；比如该电子设备可以为智能手机、音乐播放器、平板电脑等。
本领域技术人员在考虑说明书及实践这里公开的公开后，将容易想到本公开的其它实施方案。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由下面的权利要求指出。
应当理解的是，本公开并不局限于上面已经描述并在附图中示出的精确结构，并且可以在不脱离其范围进行各种修改和改变。本公开的范围仅由所附的权利要求来限制。

Claims (16)

  1. 一种耳机插座，其特征在于，包括：
    插座本体，所述插座本体内形成耳机插孔；
    多个接地端子，设置于所述耳机插孔内，可在耳机插头插入所述耳机插孔时，均与所述耳机插头上的接地段接触。
  2. 根据权利要求1所述的耳机插座，其特征在于，所述多个接地端子在所述耳机插头的插入方向上与所述耳机插孔的端部之间的距离相等。
  3. 根据权利要求2所述的耳机插座，其特征在于，所述多个接地端子沿所述耳机插孔的周向均匀排布。
  4. 根据权利要求1所述的耳机插座，其特征在于，每个所述接地端子包括：
    设置于所述耳机插孔的内壁上的公共接地结构、可在所述耳机插头插入所述耳机插孔时与所述耳机插头接触的头部、以及设置于所述公共接地结构和头部之间的弹性机构。
  5. 根据权利要求4所述的耳机插座，其特征在于，所述接地端子的头部为球状金属结构。
  6. 根据权利要求1所述的耳机插座，其特征在于，每个所述接地端子为弹性片状结构。
  7. 一种耳机插头，其特征在于，包括：
    插头本体；
    多个接地端子，设置于所述插头本体上的接地段，可在所述插头本体插入耳机插孔时，与所述耳机插孔内壁上的公共接地区域接触。
  8. 根据权利要求7所述的耳机插头，其特征在于，所述多个接地端子在所述耳机插头的插入方向上与所述耳机插头的端部之间的距离相等。
  9. 根据权利要求8所述的耳机插头，其特征在于，所述多个接地端子沿所述耳机插头的周向均匀排布。
  10. 根据权利要求7所述的耳机插头，其特征在于，每个所述接地端子包括：
    设置于所述插头本体上的公共接地结构、可在所述耳机插头插入所述耳机插孔时与所述公共接地区域接触的头部、以及设置于所述公共接地结构和头部之间的弹性机构。
  11. 根据权利要求10所述的耳机插头，其特征在于，所述插头本体内部形成一轴向容置空间，且所述公共接地结构位于该轴向容置空间内；以及，所述插头本体上还设有与所述轴向容置空间连通的多个径向开孔，且所述接地端子一一对应地位于该多个径向开孔内。
  12. 根据权利要求10所述的耳机插头，其特征在于，所述接地端子的头部为球状金属结构。
  13. 一种耳机插座，其特征在于，与权利要求7-12中任一项所述的耳机插头相匹配；该耳机插座包括：
    插座本体，所述插座本体内形成耳机插孔；
    公共接地区域，设置于所述耳机插孔的内壁，可在所述耳机插头插入所述耳机插孔时，与所述耳机插头上的接地段的多个接地端子接触。
  14. 根据权利要求13所述的耳机插座，其特征在于，所述公共接地区域为环状金属结构。
  15. 一种耳机，其特征在于，包括：如权利要求7至12中任一项所述的耳机插头。
  16. 一种电子设备，其特征在于，包括：如权利要求1至6中任一项、或权利要求13或14所述的耳机插座。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056602A (en) * 1998-06-25 2000-05-02 Hon Hai Precision Ind. Co., Ltd. Electrical jack
CN200972982Y (zh) * 2006-10-31 2007-11-07 富士康(昆山)电脑接插件有限公司 电连接器
CN201238132Y (zh) * 2008-07-18 2009-05-13 杭州日月电器股份有限公司 小型音频插口
CN201436735U (zh) * 2009-05-15 2010-04-07 富港电子（东莞）有限公司 音频插头
US7824230B1 (en) * 2009-11-12 2010-11-02 Cheng Uei Precision Industry Co., Ltd. Audio plug
CN104466544A (zh) * 2014-12-08 2015-03-25 小米科技有限责任公司 耳机插座、耳机插头、耳机和电子设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6533617B1 (en) * 2000-01-07 2003-03-18 J. D'addario & Company, Inc. Electrical plug connectors
FR2860349B1 (fr) * 2003-09-25 2005-12-23 Andre Jean Jolly Dispositif de connexion pour panneaux conducteurs d'electricite
TWM294114U (en) * 2005-11-25 2006-07-11 Advanced Connectek Inc Audio frequency socket connector
DE102007031401A1 (de) * 2007-07-05 2009-01-08 Hirschmann Automotive Gmbh Steckverbinder, augebildet zur Kontaktierung mit einer Glühkerze, bei dem ein Lamellenkontakt über einen Vorsprung verprägt ist
CN101577389B (zh) * 2008-05-06 2011-05-04 方彩菊 耳机插座
CN101630802B (zh) * 2008-07-15 2013-06-05 深圳富泰宏精密工业有限公司 耳机插孔结构
CN101841588B (zh) * 2009-03-17 2014-04-30 深圳富泰宏精密工业有限公司 音频接口装置及使用该音频接口装置的电子装置
US7942705B2 (en) * 2009-03-20 2011-05-17 Apple Inc. Audio jack with pogo pins for conductive contacts
US8118617B2 (en) * 2009-09-30 2012-02-21 Apple Inc. Jack assemblies with cylindrical contacts
KR101113592B1 (ko) * 2010-12-06 2012-02-22 암페놀커머셜인터커넥트코리아(주) 이어폰 잭
CN102647644A (zh) * 2012-04-06 2012-08-22 惠州Tcl移动通信有限公司 电子装置及其蓝牙耳机、蓝牙手镯
KR20140033916A (ko) * 2012-09-11 2014-03-19 삼성전자주식회사 외부 오디오 출력 장치의 삽입을 감지하는 방법 및 장치
TWM455308U (zh) * 2013-01-09 2013-06-11 Conary Entpr Co Ltd 音頻插頭結構改良

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6056602A (en) * 1998-06-25 2000-05-02 Hon Hai Precision Ind. Co., Ltd. Electrical jack
CN200972982Y (zh) * 2006-10-31 2007-11-07 富士康(昆山)电脑接插件有限公司 电连接器
CN201238132Y (zh) * 2008-07-18 2009-05-13 杭州日月电器股份有限公司 小型音频插口
CN201436735U (zh) * 2009-05-15 2010-04-07 富港电子（东莞）有限公司 音频插头
US7824230B1 (en) * 2009-11-12 2010-11-02 Cheng Uei Precision Industry Co., Ltd. Audio plug
CN104466544A (zh) * 2014-12-08 2015-03-25 小米科技有限责任公司 耳机插座、耳机插头、耳机和电子设备

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