WO2016090512A1 - Chemical composition for coating metal surfaces - Google Patents

Chemical composition for coating metal surfaces Download PDF

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Publication number
WO2016090512A1
WO2016090512A1 PCT/CL2015/000064 CL2015000064W WO2016090512A1 WO 2016090512 A1 WO2016090512 A1 WO 2016090512A1 CL 2015000064 W CL2015000064 W CL 2015000064W WO 2016090512 A1 WO2016090512 A1 WO 2016090512A1
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Prior art keywords
weight
composition
composition according
agent
treated
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PCT/CL2015/000064
Other languages
Spanish (es)
French (fr)
Inventor
Nelson Roberto OSSES LEYTON
Eugenio Ovidio LIZAMA MORENO
Original Assignee
Osses Leyton Nelson Roberto
Lizama Moreno Eugenio Ovidio
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Application filed by Osses Leyton Nelson Roberto, Lizama Moreno Eugenio Ovidio filed Critical Osses Leyton Nelson Roberto
Publication of WO2016090512A1 publication Critical patent/WO2016090512A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Definitions

  • the present invention consists of a cyanide-free chemical composition used to coat copper or other metal electrical contacts in situ in order to improve their electrical transmission.
  • electrolytic processes are preferred which use electric current to reduce metal cations dissolved in a chemical bath so that they form a coherent metal coating on an electrode.
  • the deposited silver is free of organic matter and especially sulfur-free, this is because a part of the organic additives used as polishing agents is occluded inside the tank, altering its properties especially in terms of hardness, resistance to corrosion and conductivity electric
  • invention CL 2949-2012 proposes a solution to the above problem that consists of a gel-phase electrolyte free of organic matter and sulfur that allows the coating of all types of metals selectively and in situ, where its formula consists of dioxide of colloidal silicon agent 'gelling, silver cyanide and potassium cyanide.
  • the objective of the present invention is to overcome the drawbacks present in the state of the art associated with the coating of electrical conductors with in situ and cyanide-free application, proposing a chemical composition which allows the deposition of a layer of silver or Silver alloy on a metal surface in both auto catalytic and electrolytic manner.
  • the silver deposit resulting from the application of this composition is agent free pollutants such as brightener additives or reducing agents and sulfur-free coveralls that decrease their electrical conductivity qualities.
  • the present invention consists of a cyanide-free chemical composition used to coat copper or other metal electrical contacts in situ in order to improve the electrical transmission thereof, which comprises a metallic agent (supplier of ions of silver or other metals), a thickening agent, a complexing agent, an alkalizing agent, a solvent where the above components and water are dissolved.
  • the metal agent of the composition acts as a donor of metal ions.
  • silver nitrate is used as a metallic agent because it is easy to obtain and because no effluents or important residues are produced during it. It is also very soluble in water and hydro alcoholic solutions.
  • the composition may also include other silver salts such as chlorides and sulfates.
  • the composition uses a thickening agent to allow its application in specific areas ⁇ of a surface, this being preferably colloidal Silicon Dioxide because it is chemically inert in this composition and does not provide organic matter.
  • the composition comprises the use of a complete agent that acts as a retarder of the reduction of the metal ion, allowing to regulate the speed and leveling of the deposit.
  • EDTA disodium ethyldiaminetetraacetic acid
  • it is not toxic by contact or by ingestion, also because it is very abundant and easily obtained by belonging to the food product line.
  • the composition uses an alkalizing agent, preferably Sodium Bicarbonate because it allows alkalizing the solution at pH 8 in order to prevent the premature reduction of the silver ion to metallic silver.
  • the composition also includes a solvent in order to form the silver amine ion [Ag (NH3) 2] 03.
  • Ammonia is used, with which it is possible to obtain the silver ion that allows it to be electrolyzed efficiently , very stable, regardless of the influence of light.
  • the composition includes the components described above in the following weight ranges:
  • Silver nitrate 0.01 - 10.0% Preferably, the ranges for Colloidal Silicon are from 2 to 10%, more preferably from 4 to 5%.
  • the ranges of disodium EDTA are preferably between 2 to 15%, more preferably between 4 and 10%.
  • the ammonia is preferably in a range between 2 and 15%, more preferably between 4 and 10%.
  • sodium bicarbonate is preferably in a range between 2 and 20%, more preferably between 4 and 10%.
  • Silver Nitrate is in a range between 0.01 and 5%, preferably between 0.01 and 1%, more preferably between 0.01 and 0.1%.
  • the composition can be applied as a coating on metallic surfaces in a self-catalytic manner, that is, a metallic deposit is obtained by the topical application of an electrolyte, without the use of an electric current.
  • the composition preferably comprises by weight:
  • the composition can be applied as a coating on metallic surfaces electrolytically, that is, a metallic deposit is obtained by the topical application of an electrolyte with the use of a direct electric current.
  • the composition preferably comprises by weight:
  • the invention consists of a method for applying the composition described above in an autocatalytic manner which consists of the following steps: a) Clean the surface to be treated by eliminating fats and oxides, which can be carried out by means of specialized products and instruments for this. b) Add the composition on the surface to be treated using an application medium such as a spatula, a sponge, a brush or brush until the desired thickness is achieved.
  • the invention also consists of a method for applying the above described composition in an electrolytic manner which is composed of the following steps: a) Clean the surface to be treated by eliminating fats and oxides, which can be performed through specialized products and instruments for this.
  • the surface was connected to the negative pole of a DC power source using 1.5 V and 0.5 A, provided by a DC power source.
  • the positive electrode was a stainless steel plate 3/16 quality of 1x2 centimeters with a thickness of 0.5 millimeters.
  • the negative pole of the source was connected to a piece of silver of lxl centimeters.
  • the surface of the contact was coated in situ, achieving a thickness of 8 microns.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The invention relates to a cyanide-free chemical composition and method for application thereof, the composition being used for in situ coating of electrical contacts made of copper or other metal in order to improve the electric transmission of same. The composition comprises: a metal agent; a thickener; a complexing agent; an alkalising agent; a solvent; and water.

Description

COMPOSICIÓN QUÍMICA PARA RECUBRIR SUPERFICIES METÁLICAS CHEMICAL COMPOSITION TO COVER METAL SURFACES
MEMORIA DESCRIPTIVA DESCRIPTIVE MEMORY
CAMPO DE LA INVENCION La presente invención consiste en una composición química libre de cianuros utilizada para recubrir de manera in situ contactos eléctricos de cobre u otro metal con el fin de mejorar la transmisión eléctrica de los mismos. FIELD OF THE INVENTION The present invention consists of a cyanide-free chemical composition used to coat copper or other metal electrical contacts in situ in order to improve their electrical transmission.
ANTECEDENTES DE LA INVENCION BACKGROUND OF THE INVENTION
El tratamiento de superficies en la industria eléctrica en general, resulta de suma importancia cuando lo que se busca es aumentar la conductividad eléctrica de contactos metálicos. The treatment of surfaces in the electrical industry in general is very important when what is sought is to increase the electrical conductivity of metal contacts.
Se sabe que el recubrir superficies metálicas con una capa de plata disminuye la resistencia eléctrica del contacto, sin embargo, para que la plata mantenga' sus propiedades de alta conductividad es muy importante que esté libre de aditivos abrillantadores, contaminaciones metálicas u orgánicas y sobretodo libre de azufre. Uno de los procesos utilizados en la industria para el recubrimiento de superficies metálicas es el plateado por inmersión, sin embargo, se ha evidenciado 1.a poca adherencia que provee esta técnica. También se cuenta actualmente con una serie de aditivos y agentes reductores que permiten obtener depósitos brillantes y de mayor dureza, como es el caso de los plateados con fines decorativos. Is known to coat metal surfaces with a silver layer decreases the electrical contact resistance, however, that silver hold 'its properties of high conductivity is very important to be free of brighteners additives, metallic or organic contamination and free especially Sulfur One of the processes used in the industry for the coating of metal surfaces is immersion plating, however, it has been evidenced the low adhesion provided by this technique. There is also a series currently of additives and reducing agents that make it possible to obtain shiny and harder deposits, such as silver plating for decorative purposes.
En el área del plateado de contactos eléctricos se prefieren los procesos electrolíticos los cuales utilizan la corriente eléctrica para reducir cationes metálicos disueltos en un baño químico de manera que formen un revestimiento de metal coherente sobre un electrodo. Aquí se requiere que. la plata depositada esté exenta de materia orgánica y sobretodo exenta de azufre, esto se debe a que una parte de los aditivos orgánicos utilizado como agentes abrillantadores queda ocluida dentro del depósito, alterando sus propiedades sobretodo en cuanto a dureza, resistencia a la corrosión y conductividad eléctrica. In the area of electrical contact plating, electrolytic processes are preferred which use electric current to reduce metal cations dissolved in a chemical bath so that they form a coherent metal coating on an electrode. Here it is required that. The deposited silver is free of organic matter and especially sulfur-free, this is because a part of the organic additives used as polishing agents is occluded inside the tank, altering its properties especially in terms of hardness, resistance to corrosion and conductivity electric
Sin embargo, estos sistemas de plateado no pueden ser utilizados en lugares que no sean plantas de galvanoplastia, debido a los problemas asociados al derrame o arrastre de electrolito, por lo cual las piezas deben ser trasladadas desde su lugar de uso hacia estas plantas, situación que en muchos caso resulta inviable ya sea por el tamaño de las piezas o por los costos asociados a esta operación. However, these silver plating systems cannot be used in places other than electroplating plants, due to the problems associated with the electrolyte spilling or dragging, so the pieces must be moved from their place of use to these plants, situation which in many cases is unfeasible either because of the size of the pieces or the costs associated with this operation.
La solicitud de patente de invención CL 2949-2012 propone una solución al problema anteriormente planteado que consiste en un electrolito en fase gel libre de materia orgánica y azufre que permite el recubrimiento de todo tipo de metales de manera selectiva e in situ, donde su fórmula consiste en dióxido de silicio coloidal como agente ' gelificante, cianuro de plata y cianuro de potasio. The patent application of invention CL 2949-2012 proposes a solution to the above problem that consists of a gel-phase electrolyte free of organic matter and sulfur that allows the coating of all types of metals selectively and in situ, where its formula consists of dioxide of colloidal silicon agent 'gelling, silver cyanide and potassium cyanide.
Si bien la solicitud CL 2949-2012 soluciona algunos inconvenientes del proceso de plateado en baños electrolíticos, aún existe el inconveniente asociado a la presencia de cianuro en su composición, el cual a pesar de que presenta una gran foto estabilidad y facilidad de operación, posee elevados índices de toxicidad, lo cual dificulta su aplicación por' ejemplo en la industria minera, conocida por exigir altos estándares de seguridad. Although application CL 2949-2012 solves some inconveniences of the plating process in electrolytic baths, there is still the inconvenience associated with the presence of cyanide in its composition, which although it has a great photo stability and ease of operation, it has high levels of toxicity, which hinders its application for 'example in the mining industry, known to require high safety standards.
Si bien en el estado del estado del arte se dan a conocer soluciones que proponen eliminar el uso de cianuro en los procesos de recubrimiento de- superficies metálicas, como por ejemplo lo divulgado por los documentos WO 2014026806 o EP 2431502, estas no hacen referencia a soluciones que puedan ser aplicadas in situ, por ejemplo en fase gel como lo divulgado por la solicitud CL 2949-2012. Although solutions that propose eliminating the use of cyanide in metal surface coating processes are disclosed in the state of the art, such as those disclosed in WO 2014026806 or EP 2431502, these do not refer to solutions that can be applied in situ, for example in gel phase as disclosed by application CL 2949-2012.
Por lo tanto, el objetivo de la presente invención es superar los inconvenientes presentes en el estado del arte asociados al recubrimiento de conductores eléctricos con aplicación in situ y libre de cianuros, proponiendo una composición química la cual permite la depositación de una capa de plata o aleación de plata sobre una superficie metálica de manera tanto auto catalítica como electrolítica. El depósito de plata resultante de la aplicación de esta composición esta libre de agentes contaminantes como aditivos abrillantadores o agentes reductores y sobretodo libre de azufre que disminuyan sus cualidades de conductividad eléctrica. Therefore, the objective of the present invention is to overcome the drawbacks present in the state of the art associated with the coating of electrical conductors with in situ and cyanide-free application, proposing a chemical composition which allows the deposition of a layer of silver or Silver alloy on a metal surface in both auto catalytic and electrolytic manner. The silver deposit resulting from the application of this composition is agent free pollutants such as brightener additives or reducing agents and sulfur-free coveralls that decrease their electrical conductivity qualities.
DESCRIPCION DE LA INVENCION La presente invención consiste en una composición química libre de cianuros utilizada para recubrir de manera in situ contactos eléctricos de cobre u otro metal con el fin de mejorar la transmisión eléctrica de los mismos, la cual comprende un agente metálico (proveedor de iones de plata u otros metales), un agente espesante, un agente complejante, un agente alcalinizante , un solvente donde están disueltos los anteriores componentes y agua. DESCRIPTION OF THE INVENTION The present invention consists of a cyanide-free chemical composition used to coat copper or other metal electrical contacts in situ in order to improve the electrical transmission thereof, which comprises a metallic agent (supplier of ions of silver or other metals), a thickening agent, a complexing agent, an alkalizing agent, a solvent where the above components and water are dissolved.
En primer lugar, el agente metálico de la composición actúa como donante de iones metálicos. De preferencia, se utiliza como agente metálico nitrato de plata debido a que es de fácil obtención y a que durante la misma no se producen efluentes ni residuos de importancia. Además es muy soluble en agua y soluciones hidro alcohólicas. Alternativamente, la composición también puede incluir otras sales de plata como cloruros y sulfatos . First, the metal agent of the composition acts as a donor of metal ions. Preferably, silver nitrate is used as a metallic agent because it is easy to obtain and because no effluents or important residues are produced during it. It is also very soluble in water and hydro alcoholic solutions. Alternatively, the composition may also include other silver salts such as chlorides and sulfates.
En segundo lugar, la composición utiliza un agente espesante para permitir su aplicación en zonas ■ puntuales de una superficie, siendo este preferentemente Dióxido de Silicio coloidal debido a que es químicamente inerte en esta composición y no aporta materia orgánica. En tercer lugar, la composición comprende la utilización de un agente comple ante que actúa como retardante de la reducción del ión metálico, permitiendo regular la velocidad y nivelación del depósito. De preferencia, se utiliza Ácido etildiaminotetraacético (EDTA) disódico debido a que no es tóxico por contacto ni por ingestión, además porque es muy abundante y de fácil obtención al pertenecer a la linea de productos alimenticios. Secondly, the composition uses a thickening agent to allow its application in specific areas ■ of a surface, this being preferably colloidal Silicon Dioxide because it is chemically inert in this composition and does not provide organic matter. Thirdly, the composition comprises the use of a complete agent that acts as a retarder of the reduction of the metal ion, allowing to regulate the speed and leveling of the deposit. Preferably, disodium ethyldiaminetetraacetic acid (EDTA) is used because it is not toxic by contact or by ingestion, also because it is very abundant and easily obtained by belonging to the food product line.
En cuarto lugar, la composición utiliza un agente alcalinizante , preferentemente Bicarbonato de Sodio debido a que permite alcalinizar la solución a pH 8 con el fin de impedir la prematura reducción del ion de plata a plata metálica. Finalmente, la composición también incluye un solvente con el fin de formar el ión amina de plata [Ag (NH3 ) 2 ] 03. Preferentemente, se utiliza Amoniaco, con el cual se logra obtener el ión de plata que permite ser electrolizado de modo eficiente, muy estable, no importando la influencia de la luz. Fourth, the composition uses an alkalizing agent, preferably Sodium Bicarbonate because it allows alkalizing the solution at pH 8 in order to prevent the premature reduction of the silver ion to metallic silver. Finally, the composition also includes a solvent in order to form the silver amine ion [Ag (NH3) 2] 03. Preferably, Ammonia is used, with which it is possible to obtain the silver ion that allows it to be electrolyzed efficiently , very stable, regardless of the influence of light.
De acuerdo a ciertas modalidades de la invención, la composición incluye los componentes descritos anteriormente en los siguientes rangos en peso: According to certain embodiments of the invention, the composition includes the components described above in the following weight ranges:
Dióxido de Silicio coloidal 1,0 - 20,0% Colloidal Silicon Dioxide 1.0 - 20.0%
EDTA disódico 1,0 - 30,0%  Disodium EDTA 1.0 - 30.0%
Amoniaco 1,0 - 20,0%  Ammonia 1.0 - 20.0%
Agua csp 100% (p/p)  100% water csp (p / p)
Bicarbonato de Sodio 1,0 - 35,0%  Sodium Bicarbonate 1.0 - 35.0%
Nitrato de plata 0,01 - 10,0% De preferencia, los rangos para el Silicio Coloidal son de un 2 a 10%, más preferentemente de un 4 a 5%. Por su parte, los rangos del EDTA disódico se encuentran preferentemente entre un 2 a 15%, más preferentemente entre un 4 y 10%. Similarmente , el amoniaco se encuentra preferentemente en un rango entre 2 y 15%, más preferentemente entre un 4 y 10%. Por su parte, el Bicarbonato de sodio se encuentra preferentemente en un rango entre un 2 y 20%, más preferentemente entre un 4 y 10%. Finalmente, el Nitrato de Plata se encuentra en un rango entre un 0,01 y 5%, preferentemente entre un 0,01 y 1%, más preferente entre un 0,01 y 0,1%. Silver nitrate 0.01 - 10.0% Preferably, the ranges for Colloidal Silicon are from 2 to 10%, more preferably from 4 to 5%. On the other hand, the ranges of disodium EDTA are preferably between 2 to 15%, more preferably between 4 and 10%. Similarly, the ammonia is preferably in a range between 2 and 15%, more preferably between 4 and 10%. On the other hand, sodium bicarbonate is preferably in a range between 2 and 20%, more preferably between 4 and 10%. Finally, Silver Nitrate is in a range between 0.01 and 5%, preferably between 0.01 and 1%, more preferably between 0.01 and 0.1%.
De acuerdo a una primera modalidad de la invención, la composición puede ser aplicada como recubrimiento en superficies metálicas de manera auto catalítica, es decir, se obtiene un depósito metálico mediante la aplicación tópica de un electrolito, sin el uso de una corriente eléctrica. De acuerdo a esta modalidad, la composición comprende preferentemente en peso: According to a first embodiment of the invention, the composition can be applied as a coating on metallic surfaces in a self-catalytic manner, that is, a metallic deposit is obtained by the topical application of an electrolyte, without the use of an electric current. According to this embodiment, the composition preferably comprises by weight:
Dióxido de Silicio coloidal 5,0% 5.0% Colloidal Silicon Dioxide
EDTA disódico 10,0%  Disodium EDTA 10.0%
Amoníaco .9/0%  Ammonia .9 / 0%
Agua csp 100%  100% csp water
Bicarbonato de Sodio 30,0%  Sodium Bicarbonate 30.0%
Nitrato de Plata.: 0,06% De acuerdo a una segunda modalidad -de la invención, la composición puede ser aplicada como recubrimiento en superficies metálicas de manera electrolítica, es decir, se obtiene un depósito metálico mediante la aplicación tópica de un electrolito con el uso de una corriente eléctrica directa. De acuerdo a esta modalidad, la composición comprende en peso preferentemente: Silver Nitrate: 0.06% According to a second embodiment - of the invention, the composition can be applied as a coating on metallic surfaces electrolytically, that is, a metallic deposit is obtained by the topical application of an electrolyte with the use of a direct electric current. According to this embodiment, the composition preferably comprises by weight:
Dióxido de Silicio coloidal 5,0% 5.0% Colloidal Silicon Dioxide
EDTA disódico 30, 0%  Disodium EDTA 30.0%
Amoníaco 10,0%  Ammonia 10.0%
Agua csp 100%  100% csp water
Bicarbonato de Sodio 10,0%  Sodium Bicarbonate 10.0%
Nitrato de plata 0,1% Luego de que la composición ha sido debidamente mezclada y envasada, se encuentra lista para ser usada como composición utilizada para recubrir de manera in situ contactos eléctricos de cobre u otro metal, de acuerdo al método que se describe a continuación. De acuerdo a una primera modalidad, la invención consiste en un método para aplicar la composición antes descrita de manera autocatalítica la cual consiste en los siguientes pasos: a) Limpiar la superficie a tratar eliminando las grasas y óxidos, lo cual puede ser realizado por medio de productos e instrumentos especializados para ello. b) Agregar la composición en la superficie a tratar utilizando un medio de aplicación tal como una espátula, una esponja, un pincel o brocha hasta conseguir el espesor deseado. c) Frotar la composición sobre la superficie a tratar utilizando un paño u otro medio adecuado por un tiempo comprendido en el intervalo de 0.5 a 2 minutos, preferentemente por un tiempo de 1 minuto. d) Limpiar el remanente de la composición con un paño absorbente para secar u otro medio adecuado. Mediante este método y considerando que la superficie de metal a recubrir se encuentra lo suficientemente limpia, se logra depositar 2 a 4 mieras de plata sobre una superficie de 4 centímetros cuadrados en 0.5 minutos y utilizando 0,2 gramos de la composición. De acuerdo a una segunda modalidad, la invención también consiste en un método para aplicar la composición antes descrita de manera electrolítica la cual se compone de los siguientes pasos : a) Limpiar la superficie a tratar eliminando las grasas y óxidos, lo cual puede ser realizado por medio de productos e instrumentos especializados para ello. b) Agregar de 0,2 a 0,5 gramos por centímetro cuadrado de la composición en la superficie a tratar utilizando un medio de aplicación tal como una espátula, esponja, pincel o brocha hasta conseguir el espesor deseado. c) Conectar la superficie a tratar al polo negativo de una fuente de poder de corriente continua. d) Conectar el polo positivo de la fuente de poder a una pieza metálica, preferentemente de acero inoxidable y de dimensiones similares a las de la superficie a tratar. e) Inmediatamente después de aplicada la composición sobre la superficie a tratar, se contacta esta última con la pieza conectada al polo positivo por el tiempo necesario para obtener la terminación deseada. 0.1% Silver Nitrate After the composition has been properly mixed and packaged, it is ready to be used as a composition used to coat copper or other metal electrical contacts in situ, according to the method described in continuation. According to a first embodiment, the invention consists of a method for applying the composition described above in an autocatalytic manner which consists of the following steps: a) Clean the surface to be treated by eliminating fats and oxides, which can be carried out by means of specialized products and instruments for this. b) Add the composition on the surface to be treated using an application medium such as a spatula, a sponge, a brush or brush until the desired thickness is achieved. c) Rub the composition on the surface to be treated using a cloth or other suitable means for a time in the range of 0.5 to 2 minutes, preferably for a time of 1 minute. d) Clean the remainder of the composition with an absorbent cloth to dry or other suitable means. Using this method and considering that the metal surface to be coated is clean enough, it is possible to deposit 2 to 4 silver microns on a surface of 4 square centimeters in 0.5 minutes and using 0.2 grams of the composition. According to a second embodiment, the invention also consists of a method for applying the above described composition in an electrolytic manner which is composed of the following steps: a) Clean the surface to be treated by eliminating fats and oxides, which can be performed through specialized products and instruments for this. b) Add 0.2 to 0.5 grams per square centimeter of the composition on the surface to be treated using a medium of application such as a spatula, sponge, brush or brush until the desired thickness is achieved. c) Connect the surface to be treated to the negative pole of a DC power source. d) Connect the positive pole of the power source to a metal part, preferably of stainless steel and of dimensions similar to those of the surface to be treated. e) Immediately after applying the composition on the surface to be treated, the latter is contacted with the part connected to the positive pole for the time necessary to obtain the desired termination.
Mediante esta modalidad del método y considerando que la superficie de metal a recubrir se encuentra lo suficientemente limpia, se logra depositar 4 a 10 mieras de plata sobre una superficie de 4 centímetros cuadrados en 0.5 minutos y utilizando 0,8 gramos de la composición. Using this method of the method and considering that the metal surface to be coated is clean enough, it is possible to deposit 4 to 10 silver microns on a surface of 4 square centimeters in 0.5 minutes and using 0.8 grams of the composition.
Las personas versadas en la materia comprenderán que la invención no sólo se limita a los medios de aplicación y limpieza antes indicados, pudiendo ser utilizado cualquier elemento apropiado ya sea de uso manual, mecánico y/o automatizado . Persons skilled in the art will understand that the invention is not only limited to the means of application and cleaning indicated above, and any appropriate element may be used, whether for manual, mechanical and / or automated use.
EJEMPLO DE APLICACIÓN Se utilizó un contacto eléctrico del tipo barra de soporte de cátodo usada en electro obtención de cobre con una superficie de 2 cm la cual presentaba sulfatación producto de la corrosión por niebla ácida y residuos de extractante orgánico. Para el plateado en forma autocatalitica se fabricó 1 kg de composición agregándose en un recipiente de 3 litros los siguientes componentes y agitando la mezcla por un minuto entre cada incorporación: APPLICATION EXAMPLE An electrical contact of the cathode support rod type used in electro-copper obtaining with a surface of 2 cm was used which presented sulphation due to acid mist corrosion and organic extractant residues. For autocatalytic plating, 1 kg of composition was manufactured by adding the following components in a 3-liter container and stirring the mixture for one minute between each incorporation:
- 0,6 gramos de nitrato de plata - 90 gramos de Amoniaco - 0.6 grams of silver nitrate - 90 grams of Ammonia
- 100 gramos de EDTA disódico - 100 grams of disodium EDTA
- 459,4 gramos de agua destilada - 459.4 grams of distilled water
- 300 gramos de Bicarbonato de Sodio - 300 grams of Baking Soda
- 50 gramos de Dióxido de Silicio Coloidal Una vez obtenida la composición final se aplicó a la superficie a tratar 0,2 gr de la composición utilizando un pincel n° 8 y luego se frotó por 1 minuto utilizando un paño. - 50 grams of Colloidal Silicon Dioxide Once the final composition was obtained, 0.2 g of the composition was applied to the surface to be treated using a brush n ° 8 and then rubbed for 1 minute using a cloth.
Finalmente se retiró el remanente con un paño absorbente. Finally, the remnant was removed with an absorbent cloth.
Por medio de la aplicación en modo auto catalítico se logró recubrir in situ la superficie del contacto, lográndose un espesor de 4 mieras. Análogamente, para el uso de la composición en modo electrolítico se utilizó una superficie idéntica a la descrita en la modalidad anterior para lo cual se fabricó 1 kg de composición agregándose en un recipiente de 3 litros los siguientes componentes y agitando la mezcla por un minuto entre cada incorporación: By means of the application in auto catalytic mode it was possible to cover the surface of the contact in situ, achieving a thickness of 4 microns. Similarly, for the use of the composition in electrolytic mode a surface identical to that described in the previous mode was used for which 1 kg of composition was made by adding the following components in a 3-liter container and stirring the mixture for one minute between each incorporation:
- 1 gramo de nitrato de Plata - 1 gram of silver nitrate
- 100 gramos de Amoniaco - 100 grams of Ammonia
- 300 gramos de EDTA disódico - 449 gramos de agua destilada - 300 grams of disodium EDTA - 449 grams of distilled water
- 100 gramos de Bicarbonato de Sodio - 100 grams of sodium bicarbonate
- 50 gramos de Dióxido de Silicio coloidal - 50 grams of Colloidal Silicon Dioxide
Una vez obtenida la composición final se conectó la superficie al polo negativo de una fuente de poder de corriente continua utilizando 1,5 V y 0,5 A, proporcionado por una fuente de poder de corriente continua. El electrodo positivo fue una placa de acero inoxidable calidad 3/16 de 1x2 centímetros con un espesor de 0,5 milímetros. Once the final composition was obtained, the surface was connected to the negative pole of a DC power source using 1.5 V and 0.5 A, provided by a DC power source. The positive electrode was a stainless steel plate 3/16 quality of 1x2 centimeters with a thickness of 0.5 millimeters.
Por su parte, el polo negativo de la fuente se conectó a una pieza a platear de lxl centímetros. For its part, the negative pole of the source was connected to a piece of silver of lxl centimeters.
Finalmente se aplicó a la superficie a tratar- 0.2 gr de la composición utilizando una brocha e inmediatamente después se encendió la fuente de poder y se contactó la superficie con la pieza conectada al polo positivo en donde con el movimiento de esta se esparció la composición a través de toda la superficie a recubrir . Finally, 0.2 g of the composition was applied to the surface to be treated using a brush and immediately after the power source was turned on and the surface was contacted with the piece connected to the positive pole where, with its movement, the composition spread throughout the entire surface to be coated.
Por medio de la aplicación en modo electrolítico se logró recubrir in situ la superficie del contacto, lográndose un espesor de 8 mieras. By means of the application in electrolytic mode, the surface of the contact was coated in situ, achieving a thickness of 8 microns.

Claims

REIVINDICACIONES
1. Composición química libre de cianuros para recubrir de manera in situ superficies metálicas, CARACTERIZADA porque comprende un agente metálico en un rango de 0,01 a 10,0% en peso seleccionado de Nitrato de Plata, comprende un agente espesante en un rango de 1,0 a 20,0% en peso seleccionado de Dióxido de Silicio coloidal, comprende además un agente complejante en un rango de 1 a 30% en peso seleccionado de Ácido etildiaminotetraacético (EDTA) disódico, comprende también un agente alcalinizante en un rango de 0,1 a 30% en peso seleccionado de Bicarbonato de Sodio, comprende además un solvente seleccionado de Amoníaco y agua. 1. Cyanide-free chemical composition for coating metal surfaces in situ, CHARACTERIZED because it comprises a metal agent in a range of 0.01 to 10.0% by weight selected from Silver Nitrate, comprises a thickening agent in a range of 1.0 to 20.0% by weight selected from Colloidal Silicon Dioxide, further comprises a complexing agent in a range of 1 to 30% by weight selected from disodium ethyldiaminetetraacetic acid (EDTA), also comprises an alkalizing agent in a range of 0.1 to 30% by weight selected from Sodium Bicarbonate, further comprises a solvent selected from Ammonia and water.
2. Composición de acuerdo a la reivindicación CARACTERIZADA porque preferentemente, el . agente metálico encuentra en un 0,06% en peso. 2. Composition according to claim CHARACTERIZED because preferably, the. metallic agent found in 0.06% by weight.
3. Composición de acuerdo a la reivindicación CARACTERIZADA porque preferentemente, el agente metálico encuentra en un 0,1% en peso. 3. Composition according to claim CHARACTERIZED because preferably, the metal agent is 0.1% by weight.
4. Composición de acuerdo a la reivindicación 1,4. Composition according to claim 1,
CARACTERIZADA porque preferentemente, el agente espesante se encuentra en un 5,0% en peso. CHARACTERIZED because preferably, the thickening agent is 5.0% by weight.
5. Composición de acuerdo a la reivindicación 1,5. Composition according to claim 1,
CARACTERIZADA porque preferentemente, el agente completante se encuentra en un 10,0% en peso. CHARACTERIZED because preferably, the complete agent is 10.0% by weight.
6. Composición de acuerdo a la reivindicación 1, CARACTERIZADA porque preferentemente, el agente comple jante se encuentra en un 30,0% en peso. 6. Composition according to claim 1, CHARACTERIZED because preferably, the complementing agent is 30.0% by weight.
7. Composición de acuerdo a la reivindicación 1, CARACTERIZADA porque preferentemente, el agente alcalinizante se encuentra en un 30,0% en peso. 7. Composition according to claim 1, CHARACTERIZED because preferably, the alkalizing agent is 30.0% by weight.
8. Composición de acuerdo a la reivindicación 1, CARACTERIZADA porque preferentemente, el agente alcalinizante se encuentra en un 10,0% en peso. 8. Composition according to claim 1, CHARACTERIZED because preferably, the alkalizing agent is 10.0% by weight.
9. Composición de acuerdo a la reivindicación 1, CARACTERIZADA porque el solvente se encuentra en un rango de 1,0 a 20,0% en peso . 9. Composition according to claim 1, CHARACTERIZED in that the solvent is in the range of 1.0 to 20.0% by weight.
10. Composición de acuerdo a la reivindicación 9,10. Composition according to claim 9,
CARACTERIZADA porque preferentemente, el solvente se encuentra en un 9,0% en peso. CHARACTERIZED because preferably, the solvent is 9.0% by weight.
11. Composición de acuerdo a la reivindicación 9,11. Composition according to claim 9,
CARACTERIZADA porque preferentemente, el solvente se encuentra en un 10,0% en peso. CHARACTERIZED because preferably, the solvent is 10.0% by weight.
12. Método para recubrir de manera in situ superficies metálicas de manera autocatalitica, CARACTERIZADO porque comprende los pasos de : a) Limpiar la superficie a tratar eliminando las grasas y óxidos ; b) Agregar en la superficie a tratar una composición de acuerdo a cualquiera de las reivindicaciones 1 a 11; c) Frotar la composición sobre la superficie a tratar por un tiempo comprendido en el intervalo de 0.5 a 2 minutos utilizando un paño; d) Limpiar el remanente de la composición con un paño■ absorbente para secar. 12. Method for coating metal surfaces in situ in an autocatalytic manner, CHARACTERIZED because it comprises the steps of: a) Clean the surface to be treated by eliminating fats and oxides; b) Add on the surface to be treated a composition according to any of claims 1 to 11; c) Rub the composition on the surface to be treated for a time in the range of 0.5 to 2 minutes using a cloth; d) Clear the remaining composition with a cloth ■ absorbent to dry.
13. Método de acuerdo a la reivindicación 12, CARACTERIZADO porque el medio de aplicación es una espátula, esponja, pincel o brocha . 13. Method according to claim 12, CHARACTERIZED because the application means is a spatula, sponge, brush or brush.
14. Método de acuerdo a cualquiera de las reivindicaciones14. Method according to any of the claims
12 a 13, CARACTERIZADO porque la composición se frota preferentemente por un tiempo de 1 minuto. 12 to 13, CHARACTERIZED because the composition is preferably rubbed for a time of 1 minute.
15. Método para para recubrir de manera in situ superficies metálicas de manera electrolítica, CARACTERIZADO porque comprende los pasos de: a) Limpiar la superficie a tratar eliminando las grasas y óxidos ; b) Agregar en la superficie a tratar una composición de acuerdo a cualquiera de las reivindicaciones 1 a 11 utilizando un medio de aplicación; c) Conectar la superficie a tratar al polo negativo de una fuente de poder de corriente continua. d) Conectar el polo positivo de la fuente de poder a una pieza metálica; e) Inmediatamente después de aplicada la composición sobre la superficie a tratar, se contacta esta última con la pieza conectada al polo positivo por el tiempo necesario para obtener la terminación deseada. 15. Method for electrically coating metal surfaces in situ, CHARACTERIZED because it comprises the steps of: a) Clean the surface to be treated by eliminating fats and oxides; b) Add on the surface to be treated a composition according to any of claims 1 to 11 using an application means; c) Connect the surface to be treated to the negative pole of a DC power source. d) Connect the positive pole of the power source to a metal part; e) Immediately after applying the composition on the surface to be treated, the latter is contacted with the piece connected to the positive pole for the time necessary to obtain the desired termination.
16. Método de acuerdo a la reivindicación 15, CARACTERIZADO porque el medio de aplicación es una espátula, esponja, pincel o brocha . 16. Method according to claim 15, CHARACTERIZED because the application means is a spatula, sponge, brush or brush.
17. Método de acuerdo a la reivindicación 15 ó 16, CARACTERIZADO porque la pieza metálica conectada al polo positivo de la fuente es de acero inoxidable. 17. Method according to claim 15 or 16, CHARACTERIZED because the metal part connected to the positive pole of the source is stainless steel.
PCT/CL2015/000064 2014-12-12 2015-12-11 Chemical composition for coating metal surfaces WO2016090512A1 (en)

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Citations (8)

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Publication number Priority date Publication date Assignee Title
US4944985A (en) * 1988-04-11 1990-07-31 Leach & Garner Method for electroless plating of ultrafine or colloidal particles and products produced thereby
US5036031A (en) * 1989-05-16 1991-07-30 Patterson James A Metal plated microsphere catalyst
WO1993001330A1 (en) * 1991-07-01 1993-01-21 Monsanto Company Viscous electroless plating solutions
US5945158A (en) * 1996-01-16 1999-08-31 N.V. Union Miniere S.A. Process for the production of silver coated particles
US6319543B1 (en) * 1999-03-31 2001-11-20 Alpha Metals, Inc. Process for silver plating in printed circuit board manufacture
WO2004027113A2 (en) * 2002-09-20 2004-04-01 Noble Fiber Technologies Improved silver plating method and articles made therefrom
CL2012002949A1 (en) * 2012-10-22 2013-05-17 Moreno Eugenio Lizama Gel solution for metallic electrolytic coatings, which allows the deposit of metals containing colloidal silicon dioxide as a gelling agent, silver cyanide and potassium cyanide.
CA2831402C (en) * 2011-03-29 2014-04-15 Nippon Steel & Sumitomo Metal Corporation Surface-treated steel sheet and method of manufacturing the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4944985A (en) * 1988-04-11 1990-07-31 Leach & Garner Method for electroless plating of ultrafine or colloidal particles and products produced thereby
US5036031A (en) * 1989-05-16 1991-07-30 Patterson James A Metal plated microsphere catalyst
WO1993001330A1 (en) * 1991-07-01 1993-01-21 Monsanto Company Viscous electroless plating solutions
US5945158A (en) * 1996-01-16 1999-08-31 N.V. Union Miniere S.A. Process for the production of silver coated particles
US6319543B1 (en) * 1999-03-31 2001-11-20 Alpha Metals, Inc. Process for silver plating in printed circuit board manufacture
WO2004027113A2 (en) * 2002-09-20 2004-04-01 Noble Fiber Technologies Improved silver plating method and articles made therefrom
CA2831402C (en) * 2011-03-29 2014-04-15 Nippon Steel & Sumitomo Metal Corporation Surface-treated steel sheet and method of manufacturing the same
CL2012002949A1 (en) * 2012-10-22 2013-05-17 Moreno Eugenio Lizama Gel solution for metallic electrolytic coatings, which allows the deposit of metals containing colloidal silicon dioxide as a gelling agent, silver cyanide and potassium cyanide.

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