WO2016088908A1

WO2016088908A1 - Optical semiconductor lighting device

Info

Publication number: WO2016088908A1
Application number: PCT/KR2014/011656
Authority: WO
Inventors: 이수운; 박현규; 김상혁; 김정화
Original assignee: 주식회사 포스코엘이디
Priority date: 2014-12-02
Filing date: 2014-12-02
Publication date: 2016-06-09

Abstract

The present invention relates to an optical semiconductor lighting device comprising: a first light emitting block provided with at least one first light emitting module; a junction box formed on one side surface of the first light emitting block and fastened to the end of a support; and at least one second light emitting block disposed on the other side surface of the first light emitting block and provided with at least one second light emitting module. The optical semiconductor lighting device is characterized in that: at least one semiconductor optical element is formed on one side of the first light emitting module and the second light emitting module; a plurality of heat dissipating fins are formed on the other side of the first light emitting module and the second light emitting module; the plurality of heat dissipating fins are housed in the first light emitting block and the second light emitting block; and the plurality of heat dissipating fins are formed along a direction in which the second light emitting block is coupled to the first light emitting block. The optical semiconductor lighting device not only has good drainage and is convenient to assemble and fasten, but also has good heat dissipating efficiency and enables luminous flux to be freely adjusted.

Description

Optical semiconductor lighting device

The present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus that allows excellent control of luminous flux while excellent in drainage, easy assembly and fastening, and excellent heat dissipation efficiency.

Optical semiconductors such as LEDs or LEDs are one of the components that are widely used for lighting recently due to their low power consumption, long service life, excellent durability, and much higher brightness than incandescent and fluorescent lamps.

In particular, the above-described type of optical semiconductor does not use harmful substances to the environment compared to products such as fluorescent lamps and mercury lamps which are manufactured by injecting mercury harmful to the human body together with argon gas into the glass tube, thereby making it possible to produce environment-friendly products. will be.

In particular, the lighting device using the optical semiconductor as a light source has recently been used for outdoor landscape lighting and security, etc. Since the assembly and construction of the product should be convenient, and the product is exposed to the atmosphere and used, Another consideration is the consideration of drainage so that components are not directly affected but still discharged.

In addition, the lighting device using the optical semiconductor as a light source should be a structure that can be replaced and repaired immediately in case of failure and malfunction.

The present invention has been made in view of the above, it is an object of the present invention to provide an optical semiconductor lighting device that is excellent in drainage, easy to assemble and fasten, as well as excellent heat dissipation efficiency and free control of the luminous flux.

In order to achieve the above object, the present invention, a first light emitting block having at least one first light emitting module; A junction box formed on one side of the first light emitting block and fastened to an end of the support; At least one second light emitting block disposed on the other side of the first light emitting block and having at least one second light emitting module, and at least one semiconductor light source on one side of the first light emitting module and the second light emitting module; Self-formed, a plurality of heat radiation fins are formed on the other side of the first light emitting module and the second light emitting module, the plurality of heat radiation fins are accommodated in the first light emitting block and the second light emitting block, the plurality of heat radiation fins The optical semiconductor lighting apparatus may be formed along the direction in which the second light emitting block is coupled to the first light emitting block.

Here, the end of the support is characterized in that it is disposed inclined at a predetermined angle with respect to the support.

In this case, the direction in which the second light emitting block is coupled and the direction in which the end of the pillar is formed are parallel.

The first light emitting block may include a pair of first sidewalls facing each other and a first cover connecting the pair of upper end portions of the pair of first sidewalls facing each other. It is done.

The first light emitting module may be disposed between the pair of first sidewalls.

The optical semiconductor lighting apparatus may include a first rib step projecting at a predetermined height toward the first light emitting module along both edges of the first cover, and an arc cut in a central portion of the first rib step. It further comprises a notch groove, characterized in that the wiring is arranged through the first notch groove.

The optical semiconductor lighting apparatus may further include a plurality of first vent slots that penetrate both sides of the first cover and are disposed at predetermined intervals.

The direction in which the plurality of first vent slots are formed is orthogonal to the direction in which the plurality of heat dissipation fins are formed.

The optical semiconductor lighting apparatus may include at least two first regions through which the plurality of first vent slots penetrate through the first cover, and are disposed on the other side of the first light emitting module and electrically connected to the first light emitting module. And at least one cable gland connected to the cable gland, wherein the cable gland is disposed facing the inner surface of the first cover between the first zones.

The optical semiconductor lighting apparatus may include one first region including a plurality of first vent slots penetrating through the first cover, and the other side of the first light emitting module. And at least one cable gland connected to the cable gland, wherein the cable gland is disposed facing the inner surface of the first cover except for the first zone.

The optical semiconductor lighting apparatus may further include a first support plate disposed on a bottom surface of the first light emitting block and having a first fastening slot through which the first light emitting module is fixed.

And, the first fastening slot is characterized in that one or a plurality of penetrating through the first support plate.

The second light emitting block may include a pair of second sidewalls facing each other and a second cover connecting upper ends of the pair of second sidewalls to be disposed in a line with both sides of the first light emitting block. It is characterized by.

The second light emitting module may be disposed between the pair of second sidewalls.

The optical semiconductor lighting device may further include a second rib step projecting at a predetermined height toward the second light emitting module along both edges of the second cover, and an arc cut in an arc shape at the center of the second rib step. It further comprises a notch groove, characterized in that the wiring is arranged through the second notch groove.

The optical semiconductor lighting apparatus may further include a plurality of second vent slots that penetrate both sides of the second cover and are disposed at predetermined intervals.

The direction in which the plurality of second vent slots are formed is orthogonal to the direction in which the plurality of heat dissipation fins are formed.

The optical semiconductor lighting device may include at least two or more second zones through which the plurality of second vent slots penetrate through the second cover, and are disposed on the other side of the second light emitting module and electrically connected to the second light emitting module. And at least one cable gland connected to the cable gland, wherein the cable gland is disposed facing the inner surface of the second cover between the second zones.

The optical semiconductor lighting apparatus may include one second region including a plurality of second vent slots penetrating through the second cover, and a second region disposed on the other side of the second light emitting module and electrically connected to the second light emitting module. And at least one cable gland connected to the cable gland, wherein the cable gland is disposed facing the inner surface of the second cover except for the second zone.

The optical semiconductor lighting apparatus may further include a second support plate disposed on a bottom surface of the second light emitting block and having a second fastening slot through which the second light emitting module is fixed.

And, the second fastening slot is characterized in that one or a plurality of penetrating through the second support plate.

The optical semiconductor lighting apparatus may further include a fixing unit configured to fix a through hole penetrating through one side of the junction box and an outer peripheral surface of the end portion of the post inserted through the through hole.

On the other hand, the present invention includes a light emitting block having a light emitting module having one or more semiconductor optical device is formed on one side, a plurality of heat radiation fins on the other side, the light emitting block, a pair of facing sidewalls; A cover connecting the pair of upper end portions of the side walls; And a plurality of vent slots penetrating at both sides of the cover and arranged at regular intervals, wherein the cover includes a plurality of slot forming regions in which the plurality of vent slots penetrates from the cover and the other side of the light emitting module. And at least one cable gland electrically connected to the light emitting module, wherein the cable gland is disposed facing the inner surface of the cover between the slot forming regions. It is also possible to provide a device.

Here, the direction in which the plurality of vent slots are formed may be perpendicular to the direction in which the plurality of heat dissipation fins are formed.

At this time, the direction in which the plurality of vent slots are formed is characterized in that orthogonal to the direction in which the plurality of heat radiation fins are formed.

According to the present invention having the above configuration, the following effects can be achieved.

First, the present invention provides a light emitting device comprising: a first light emitting block coupled to one side of a junction box, a second light emitting block mountable on at least one side of the first light emitting block, and first and second lights embedded in the first and second light emitting blocks. 2 From the structure in which the plurality of heat radiation fins are formed in one direction on the upper surface of the light emitting module, the direction of formation of the heat radiation fins is formed along the direction in which the second light emitting block is coupled, thereby improving drainage and malfunctioning and leakage of the lighting device Electric shock can be prevented beforehand.

In addition, the present invention may be easily assembled and fastened by mounting at least one or more first and second light emitting blocks on one side of the junction box.

Further, according to the present invention, since the first light emitting module and the second light emitting module can be arranged in an appropriate number of first light emitting blocks and second light emitting blocks, respectively, the light flux can be freely adjusted.

1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention, which is viewed from the bottom of a junction box which is a main part of the present invention.

2 is a plan view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention as viewed from the point A of FIG.

Figure 3 is an exploded perspective view showing the overall structure of the first and second light emitting blocks that are the main part of the optical semiconductor lighting apparatus according to an embodiment of the present invention

4 is a cross-sectional conceptual view illustrating a state in which the first and second light emitting modules, which are the main parts of the present invention, are fastened to the first and second support plates as viewed from the point B of FIG. 1.

FIG. 5 is a perspective view illustrating various embodiments in which the first and second light emitting modules, which are the main parts of the present invention, are viewed from a point C of FIG. 1.

FIG. 6 is a partial cross-sectional conceptual view illustrating a state in which an end of a support is coupled to a junction box, which is a main part of the present invention, as viewed from a point B of FIG.

Advantages and features of the present invention, and methods for achieving them will be apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings.

However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms.

In this specification, the embodiments are provided so that the disclosure of the present invention may be completed and the scope of the present invention may be completely provided to those skilled in the art.

And the present invention is only defined by the scope of the claims.

Thus, in some embodiments, well known components, well known operations and well known techniques are not described in detail in order to avoid obscuring the present invention.

In addition, the same reference numerals throughout the specification refer to the same components, and the terminology (discussed) used herein is for the purpose of describing the embodiments are not intended to limit the invention.

As used herein, the singular forms "a", "an" and "the" include plural unless the context clearly dictates otherwise, and the elements and acts referred to as 'comprises' or 'do' not exclude the presence or addition of one or more other components and acts. .

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art.

In addition, the terms defined in the commonly used dictionary are not ideally or excessively interpreted unless they are defined.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention.

1 is a perspective view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention, which is viewed from the bottom of a junction box, which is a main part of the present invention, and FIG. 2 is viewed from the viewpoint A of FIG. A plan view showing the overall structure of an optical semiconductor lighting apparatus according to an embodiment of the present invention.

3 is an exploded perspective view showing the overall structure of the first and second light emitting blocks, which are main parts of the optical semiconductor lighting apparatus according to the embodiment of the present invention.

4 is a cross-sectional conceptual view illustrating a state in which the first and second light emitting modules, which are main parts of the present invention, are fastened to the first and second support plates, as viewed from the point B of FIG. 1, and FIG. As seen from the point of view C, it is a bottom conceptual view showing various embodiments in which the first and second light emitting modules, which are main parts of the present invention, are arranged.

FIG. 6 is a partial cross-sectional conceptual view illustrating a state in which end portions of struts are coupled to a junction box, which is a main part of the present invention, as viewed from a point B of FIG. 1.

For reference, in FIG. 1, reference numeral 390 denotes an opening and closing piece that can be opened and closed for internal inspection.

The first light emitting block B1 includes one or more first light emitting modules 100, and the first light emitting module 100 functions as a light source unit.

Junction box (J) is disposed on one side of the first light emitting block (B1), is fastened to the end 410 of the support (400), it is connected to the power source.

At least one second light emitting block B2 is disposed on the other side of the first light emitting block B1, and includes at least one second light emitting module 200, and includes a second light emitting module 100 together with the first light emitting module 100. The light emitting module 200 functions as a light source unit.

Here, at least one semiconductor optical device 600 is formed on one side of the first light emitting module 100 and the second light emitting module 200, and on the other side of the first light emitting module 100 and the second light emitting module 200. A plurality of heat radiation fins 510 are formed.

In this case, the plurality of heat radiating fins 510 are accommodated in the first light emitting block B1 and the second light emitting block B2.

In addition, the plurality of heat dissipation fins 510 are formed along the direction in which the second light emitting block B2 is coupled to the first light emitting block B1, such as rain or snow, for example, the first and second

light emitting modules

100 and 200. Even if it is introduced into it will be able to flow smoothly between the plurality of heat radiation fins (510).

The present invention can be applied to the embodiment of the configuration as described above, it is also possible to apply various embodiments as follows.

As described above, the plurality of heat dissipation fins 510 may be formed along the direction in which the second light emitting blocks B2 are coupled to increase drainage efficiency. For this purpose, the end portion 410 of the support 400 may be formed in the support 400. It is preferable to be inclined at a predetermined angle with respect to.

That is, the direction in which the second light emitting block B2 is coupled and the direction in which the end portion 410 of the support 400 is formed are parallel to each other.

Therefore, water and moisture or foreign substances introduced from the outside of the first and second light emitting blocks B1 and B2 are discharged through the outer circumferential surface of the support 400 through the outer circumferential surface of the end 410 of the support 400.

In addition, the second light emitting block B2 is spaced apart from the first light emitting block B1 by a predetermined distance d so as to further increase the effect of smoothly discharging water, moisture, and foreign substances, and to increase the heat dissipation effect. It is preferable to arrange.

In addition, when the plurality of second light emitting blocks B2 are mounted on the first light emitting block B1, the plurality of second light emitting blocks B2 may be provided with the drainage structure to further increase the smooth discharge effect of water, moisture, and foreign substances, and to increase the heat radiation effect. Among the second light emitting blocks B2, the second light emitting block B2 and the second light emitting block B2 adjacent to each other may be disposed to be spaced apart from each other.

Meanwhile, the first light emitting block B1 is disposed in line with both sides of the junction box J as shown in FIG. 1, and faces a pair of first sidewalls B11 and a pair of first sidewalls B11. It can be seen that the structure including a first cover (B12) connecting the upper end.

The first cover B12 is to protect the parts embedded from the external shock and to fundamentally block the inflow of moisture, dust, and foreign matter.

Here, the first light emitting module 100 may also be disposed between the pair of first sidewalls B11.

In this case, the present invention further includes a first rib step B121 and a first cutout groove B122 as shown in FIG. 3 for convenience of detachable coupling and wiring arrangement between the first light emitting block B1 and the junction box J. FIG. It is preferable to provide.

That is, the first rib step B121 protrudes at a predetermined height toward the first light emitting module 100 along both edges of the first cover B12.

The first notch groove B122 is cut in an arc shape at the center of the first rib step B121.

Therefore, a wiring (not shown) may be disposed through the first cutout groove B122.

Meanwhile, the first light emitting block B1 may induce external discharge of heat generated from the semiconductor optical device 600 by natural convection or forced convection in order to solve the internal heat generation problem caused by the first light emitting module 100. It is preferable to further include a plurality of first vent slots 710 which penetrate both sides of the first cover B12 and are arranged at regular intervals.

Specifically, the first cover B12 covers an upper surface of the first light emitting module 100, that is, an upper portion of the plurality of heat dissipation fins 510, and each of the plurality of first vent slots 710 has a first cover B12. It is formed in the shape of a long hole which is penetrated at positions spaced apart from each other by a predetermined distance from both edges of).

The direction in which the first vent slot 710 is formed (see arrows Y-Y in FIGS. 2 and 3) is orthogonal to the direction in which the plurality of heat sink fins 510 are formed (see arrows X-X in FIGS. 2 and 3).

The arrangement of the first vent slot 710 may be referred to as minimizing moisture infiltration and further improving waterproof and airtight performance while realizing existing heat dissipation performance.

Here, the present invention is disposed on the other side of the first light emitting module 100 for wiring connection and waterproof airtightness, at least one or more cable glands 900, through which wiring is electrically connected to the first light emitting module 100 cable gland).

In this case, in the first cover B12, when the area where the plurality of first vent slots 710 penetrates is set as the first zone S1 (see FIG. 3), the cable gland 900 may include the first zone ( By being arranged between S1), since it is not directly exposed to free-falling water such as rainwater and snow, it is possible to use a stable lighting device.

Meanwhile, the present invention preferably further includes a first support plate 310 as shown in FIGS. 3 and 4 so that the number of first light emitting modules 100 can be appropriately added or subtracted so that the luminous flux can be freely adjusted.

The first supporting plate 310 is disposed on the bottom surface of the first light emitting block B1 and is a member through which the first fastening slot 311 through which the first light emitting module 100 is fixed is penetrated.

One or more of the first fastening slots 311 penetrate the first support plate 310 as shown in FIG. 5, so that the luminous flux can be freely adjusted by appropriately arranging the first light emitting module 100 by a desired number. Will be.

Meanwhile, referring to FIG. 1 again, the second light emitting block B2 is disposed in line with both sides of the first light emitting block B1, and has a pair of second sidewalls B21 facing each other and a pair of first light emitting blocks B2. It can be seen that the structure includes a second cover B22 connecting the upper end of the second sidewall B21.

The second cover B22 is to protect the parts embedded from the external shock and to fundamentally block the inflow of moisture, dust, and foreign matter.

Here, the second light emitting module 200 may also be disposed between the pair of second sidewalls B21.

At this time, in the present invention, referring to FIG. 3 again for convenience of detachable coupling and wiring arrangement of the second light emitting block B2 and the junction box J, the second rib step B221 and the second cutout groove B222 are provided. It is preferable to further provide).

The second rib step B221 protrudes at a predetermined height toward the second light emitting module 200 along both edges of the second cover B22.

The second notch groove B222 is cut in an arc shape at the center of the second rib step B221.

Therefore, the wiring may be arranged through the second notch groove B222.

Meanwhile, the second light emitting block B2 may induce external discharge of heat generated from the semiconductor optical device 600 by natural convection or forced convection in order to solve the internal heat generation problem caused by the second light emitting module 200. It is preferable to further include a plurality of second vent slots 720 which penetrate both sides of the second cover B22 and are arranged at regular intervals.

In detail, the second cover B22 covers an upper surface of the second light emitting module 200, that is, an upper portion of the plurality of heat dissipation fins 510, and the plurality of second vent slots 720 respectively cover the second cover B22. It is formed in the shape of a long hole which is penetrated at positions spaced apart from each other by a predetermined distance from both edges of).

The direction in which the second vent slot 720 is formed (see arrows Y-Y in FIGS. 2 and 3) is perpendicular to the direction in which the plurality of heat dissipation fins 510 are formed (see arrows X-X in FIGS. 2 and 3).

The arrangement of the second vent slot 720 may be said to minimize moisture penetration and further improve waterproof and airtight performance while realizing existing heat dissipation performance.

Here, the present invention is disposed on the other side of the second light emitting module 200 for wiring connection and waterproof airtightness, at least one or more cable glands 900 through which a wire electrically connected to the second light emitting module 200 passes. It is preferable to further provide.

In this case, in the second cover B22, when the area where the plurality of second vent slots 720 penetrates is set as the second zone S2 (see FIG. 3), the cable gland 900 may be configured as the second zone ( By being arranged between S2), since it is not directly exposed to free-falling water such as rainwater and snow, it is possible to use a stable lighting device.

Meanwhile, the present invention preferably further includes a second support plate 320 with reference to FIGS. 3 and 4 so that the number of second light emitting modules 200 may be appropriately added or subtracted so as to freely adjust the luminous flux.

The second support plate 320 is a member disposed on the bottom surface of the second light emitting block B2, and the second fastening slot 321 through which the second light emitting module 200 is fixed is penetrated.

Referring to FIG. 5 again, the second fastening slot 321 penetrates one or more through the second supporting plate 320 and freely adjusts the luminous flux by arranging the first light emitting module 100 appropriately. It will be adjustable.

The second support plate 320 is disposed parallel to the first support plate 310 at a predetermined distance (d, see FIG. 1) to implement drainage and heat dissipation functions.

Therefore, the luminous flux of the entire lighting apparatus can be adjusted by mounting the first and second

light emitting modules

100 and 200 by the corresponding number corresponding to the number of the first and

second fastening slots

311 and 321 as described above.

Meanwhile, referring to FIG. 6 along with FIG. 1, the present invention includes a through hole 301 penetrated through one side of the junction box J, and an outer circumferential surface of the end 410 of the support 400 inserted through the through hole 301. It may be applied to an embodiment further comprising a fixing unit 350 for fixing the.

That is, the fixing unit 350 is to securely secure the end 410 of the support 400 having different diameters and cross-sectional shapes, and is connected to one side edge of the through hole 301 to the junction box J. And a first fixing part 351 formed at the one end and supporting one side of the outer circumferential surface of the end 410, and coupled to both sides of the first fixing part 351, and the other side of the outer circumferential surface of the end 410 of the support 400. It may include a second fixing part 352 for supporting.

Here, the first fixing part 351 includes a seating groove 351g recessed convexly upward from the top surface of the junction box J to correspond to a part of the outer circumferential surface of the circular column, and the second fixing part 352 is seated. It is coupled to the outer side of both edges of the groove 351g.

In this case, the second fixing part 352 may include at least one fixing protrusion 352p protruding along both outer edges of the first fixing part 351, and a pair of fastening pieces coupled to the fixing protrusion 352p ( 352c and a contact piece 352t connected to both edges of the pair of fastening pieces 352c to be in contact with the other side of the outer circumferential surface of the end portion 410 of the support 400.

In addition, the second fixing part 352 is fastened orthogonally to the outer circumferential surface of the end portion 410 of the support 400 and the fastening hole 352h penetrating parallel to the fastening piece 352c along both sides of the contact piece 352t. The embodiment of the present invention further includes a plurality of stud bolts 352s screwed to the holes 352h and fixing the outer circumferential surface of the end 410 of the support 400.

The plurality of stud bolts 352s are technical means for increasing the fastening force by increasing the contact and fixing points and the area of the outer circumferential surface of the end 410 of the support 400 fixed between the first and second fixing

parts

351 and 352. can do.

As described above, it can be seen that the present invention has as its basic technical idea to provide an optical semiconductor lighting device which is excellent in drainage, easy to assemble and fasten, and has excellent heat dissipation efficiency while allowing free control of the luminous flux.

In addition, many modifications and applications are possible to those skilled in the art within the scope of the basic technical idea of the present invention.

Claims

A first light emitting block having at least one first light emitting module;

A junction box formed on one side of the first light emitting block and fastened to an end of the support;

At least one second light emitting block disposed on the other side of the first light emitting block and having at least one second light emitting module;

One or more semiconductor optical devices are formed on one side of the first light emitting module and the second light emitting module, and a plurality of heat dissipation fins are formed on the other side of the first light emitting module and the second light emitting module,

The plurality of heat sink fins are accommodated in the first light emitting block and the second light emitting block,

The plurality of heat dissipation fins are formed along the direction in which the second light emitting block is coupled to the first light emitting block.
The method according to claim 1,

An end of the support is inclined at an angle with respect to the support is disposed optical semiconductor lighting device.
The method according to claim 1,

And the direction in which the second light emitting block is coupled to the direction in which the end of the post is formed is parallel.
The method according to claim 1,

The first light emitting block,

A pair of first sidewalls disposed in line with both sides of the junction box and facing each other;

And a first cover connecting the upper ends of the pair of first sidewalls.
The method according to claim 4,

And the first light emitting module is disposed between the pair of first sidewalls.
The method according to claim 4,

The optical semiconductor lighting device,

First rib steps protruding at a predetermined height toward both sides of the first light emitting module along edges of the first cover;

Further comprising a first notched groove which is cut in an arc shape in the center of the first rib stepped,

An optical semiconductor lighting device, characterized in that the wiring is arranged through the first notch groove.
The method according to claim 4,

The optical semiconductor lighting device,

And a plurality of first vent slots penetrating through both sides of the first cover and disposed at a predetermined interval.
The method according to claim 7,

The direction in which the plurality of first vent slots are formed is orthogonal to the direction in which the plurality of heat dissipation fins are formed.
The method according to claim 7,

The optical semiconductor lighting device,

At least two first zones through which the plurality of first vent slots pass through the first cover;

At least one cable gland disposed on the other side of the first light emitting module and electrically connected to the first light emitting module,

And the cable gland is disposed to face an inner surface of the first cover between the first zones.
The method according to claim 4,

The optical semiconductor lighting device,

One first zone comprising a plurality of first vent slots pierced through the first cover;

At least one cable gland disposed on the other side of the first light emitting module and electrically connected to the first light emitting module,

And the cable gland is disposed to face an inner surface of the first cover except for the first zone.
The method according to claim 1,

The optical semiconductor lighting device,

And a first support plate disposed on a bottom surface of the first light emitting block and having a first fastening slot through which the first light emitting module is fixed.
The method according to claim 11,

And the first fastening slot penetrates one or more of the first support plates.
The method according to claim 1,

The second light emitting block,

A pair of second sidewalls disposed in line with both sides of the first light emitting block and facing each other;

And a second cover connecting the upper ends of the pair of second sidewalls.
The method according to claim 13,

And the second light emitting module is disposed between the pair of second sidewalls.
The method according to claim 13,

The optical semiconductor lighting device,

Second rib steps protruding at a predetermined height toward the second light emitting module along both edges of the second cover;

Further comprising a second notched groove cut in the shape of an arc at the center of the second rib step,

An optical semiconductor lighting device, characterized in that the wiring is arranged through the second notch groove.
The method according to claim 12,

The optical semiconductor lighting device,

And a plurality of second vent slots that penetrate both sides of the second cover and are disposed at predetermined intervals.
The method according to claim 16,

And a direction in which the plurality of second vent slots is formed is orthogonal to a direction in which the plurality of heat dissipation fins are formed.
The method according to claim 16,

The optical semiconductor lighting device,

At least two or more second zones through which the plurality of second vent slots pass through the second cover;

At least one cable gland disposed on the other side of the second light emitting module and electrically connected to the second light emitting module,

And the cable gland is disposed facing an inner surface of the second cover between the second zones.
The method according to claim 13,

The optical semiconductor lighting device,

One second zone including a plurality of second vent slots penetrated through the second cover;

At least one cable gland disposed on the other side of the second light emitting module and electrically connected to the second light emitting module,

And the cable gland is disposed to face an inner surface of the second cover except the second zone.
The method according to claim 1,

The optical semiconductor lighting device,

And a second support plate disposed on a bottom surface of the second light emitting block and having a second fastening slot through which the second light emitting module is fixed.
The method of claim 20,

And the second fastening slot penetrates one or more of the second support plates.
The method according to claim 1,

The optical semiconductor lighting device,

A through hole penetrated through one side of the junction box,

And a fixing unit for fixing an outer peripheral surface of the end portion of the post inserted through the through hole.
At least one semiconductor optical device is formed on one side, including a light emitting block having a light emitting module formed with a plurality of heat radiation fins on the other side,

The light emitting block,

A pair of opposite sidewalls;

A cover connecting the pair of upper end portions of the side walls; And

It includes a plurality of vent slots penetrating both sides of the cover are arranged at regular intervals,

The cover,

A plurality of slot forming regions through which the plurality of vent slots pass through the cover;

At least one cable gland disposed on the other side of the light emitting module and electrically connected to the light emitting module,

And the cable gland is disposed to face an inner surface of the cover between the slot forming regions.
The method according to claim 23,

And a direction in which the plurality of vent slots are formed is perpendicular to a direction in which the plurality of heat dissipation fins are formed.
The method according to claim 23,

The plurality of vent slots are disposed on the other side of the light emitting module.