WO2016078462A1 - Backplane system, centralized exchange equipment and method for backplane connection and fixation - Google Patents

Backplane system, centralized exchange equipment and method for backplane connection and fixation Download PDF

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Publication number
WO2016078462A1
WO2016078462A1 PCT/CN2015/088060 CN2015088060W WO2016078462A1 WO 2016078462 A1 WO2016078462 A1 WO 2016078462A1 CN 2015088060 W CN2015088060 W CN 2015088060W WO 2016078462 A1 WO2016078462 A1 WO 2016078462A1
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WO
WIPO (PCT)
Prior art keywords
engaging mechanism
back plate
limiting groove
backplane
positioning hole
Prior art date
Application number
PCT/CN2015/088060
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French (fr)
Chinese (zh)
Inventor
马德征
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中兴通讯股份有限公司
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Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2016078462A1 publication Critical patent/WO2016078462A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00Data switching networks
    • H04L12/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack

Definitions

  • the present invention relates to the field of communications, and in particular, to a backplane system, a centralized switching device, and a backplane connection and fixing method in the communication field.
  • Centralized switching/crossing equipment is mainly used in the fields of OTN, PTN, and IP. With the rapid development of the Internet and 3G ⁇ 4G services, the market has more and more demand for the scheduling capacity of switching equipment.
  • centralized switching/crossing devices mainly implement high-speed channel interconnection through backplane wiring. The larger the backplane size, the greater the number of wires, and the greater the number of cards, the greater the scheduling capacity of the device.
  • the PCB manufacturer's processing capacity is limited, and the PCB cannot be oversized. Many manufacturers in the industry have adopted multiple backplane separation processing and finally assembled into the rack structure. FIG.
  • FIG. 1 shows a single-sided device structure composed of two back plates, and the two back plates are named as an upper back plate 1 and a lower back plate 2, respectively.
  • the capacity is doubled, and the structure of the other side is basically the same as that in FIG. 1.
  • a single side is taken as an example for brief introduction.
  • the switch/crossover boards In order for the line cards on the two separate backplanes to communicate with each other, the switch/crossover boards must be bridged across the two backplanes, and the switch/crossboards are vertically inserted into the backplane.
  • Figure 2 shows the basic outline structure of the switch/cross board 3.
  • the switch/cross board 3 is a single PCB structure, and the connector position is guaranteed in a vertical direction.
  • the relative position is mainly limited by the structural positioning accuracy, and the connector of the exchange/cross-board 3 interconnection cannot be completely in a vertical direction, which may cause assembly errors.
  • FIG. 3 there is an error in the horizontal direction after assembly; as shown in FIG. 4, there is an error in the vertical direction after assembly, and there are cases where there are assembly errors in both the horizontal and vertical directions.
  • the switch/cross card 3 is plugged and unplugged on the device to be assembled, it is easy to accurately align the switch/cross-board connector 3 and the backplane connector, causing damage to the connector pins and sockets, resulting in device function. Damage, in production, will also greatly affect product yield, reduce production efficiency, and increase production costs.
  • One of the main factors for the above error is that there is no direct connection between the upper back plate 1 and the lower back plate 2 and the upper and lower back plates 2 are fixed by respective positioning pins; resulting in assembly errors easily after assembly.
  • the main technical problem to be solved by the embodiments of the present invention is to provide a backplane system, a centralized switching device, and a backplane connection and fixing method, which solves the problem that assembly is prone to assembly errors due to no connection between the existing backplanes.
  • an embodiment of the present invention provides a backplane system, including an upper backboard and a lower backplane, wherein a lower end of the upper backplane is provided with a first engaging mechanism, and an upper end of the lower backboard is provided with a first
  • the second bite mechanism, the upper back plate and the lower back plate are snap-fit connected by the first engaging mechanism and the second engaging mechanism.
  • the first engaging mechanism includes a first limiting groove, the groove depth of the first limiting groove is smaller than the thickness of the upper back plate; and the second engaging mechanism The first protruding position corresponding to the first limiting groove is disposed; the first protruding portion is fastened into the first limiting groove to realize the first engaging mechanism and the second a nip joint of the occlusion mechanism; and/or, the second occlusion mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than a thickness of the lower back plate; the first occlusion mechanism a second boss having a position and a size corresponding to the second limiting groove, the second boss being fastened into the second limiting groove to realize the first engaging mechanism and the second engaging The bite connection of the mechanism.
  • the first engaging mechanism when the first engaging mechanism includes a first limiting groove, the first limiting groove is disposed on a front surface of the upper back plate; and the second engaging mechanism comprises The first boss is disposed on the front surface of the lower back plate; when the second engaging mechanism includes the second limiting groove, the second limiting groove is disposed on the front surface of the lower back plate; The second boss included in the first engaging mechanism is disposed on the front surface of the upper back plate.
  • the thickness of the first boss included in the second engaging mechanism is less than or equal to the thickness of the first limiting groove. Depth; when the second engaging mechanism includes the second limiting groove, the thickness of the second boss included in the first engaging mechanism is less than or equal to the depth of the second limiting groove.
  • the first engaging mechanism when the first engaging mechanism includes only the first limiting groove, the first limiting groove width is equal to the upper back plate width; the second engaging mechanism corresponds to Included only in the first boss, the width of the first boss is equal to the width of the lower back plate; when the second meshing mechanism includes only the second limiting groove, the second limit groove width And corresponding to the width of the lower back plate; the first engaging mechanism correspondingly includes only the second boss, and the width of the second boss is equal to the width of the upper back plate.
  • the groove depth of the first limiting groove is one-half of the thickness of the upper back plate;
  • the groove depth of the second limiting groove is one-half of the thickness of the lower back plate.
  • an embodiment of the present invention further provides a centralized switching device, including a rack, a positioning member, and a backplane system as described above, wherein the first engaging mechanism and the second engaging mechanism are respectively configured And a second positioning hole corresponding to the first positioning hole and the second positioning hole; the positioning member is in the After the upper back plate and the lower back plate are snap-fitted by the first engaging mechanism and the second engaging mechanism, pass through the first positioning hole, the second positioning hole, and the third on the frame A positioning hole fit secures the upper back plate and the lower back plate to the frame.
  • an embodiment of the present invention further provides a backplane connection method, including: providing a first occlusion mechanism at a lower end of the upper back panel, and a second occlusion mechanism at an upper end of the lower back panel; And the lower back plate is snap-connected by the first engaging mechanism and the second engaging mechanism.
  • the first engaging mechanism includes a first limiting groove, the groove depth of the first limiting groove is smaller than the thickness of the upper back plate; and the second engaging mechanism The first protruding position corresponding to the first limiting groove is disposed; the first protruding portion is fastened into the first limiting groove to realize the first engaging mechanism and the second a nip joint of the occlusion mechanism; and/or, the second occlusion mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than a thickness of the lower back plate; the first occlusion mechanism a second boss having a position and a size corresponding to the second limiting groove, the second boss being fastened into the second limiting groove to realize the first engaging mechanism and the second engaging The bite connection of the mechanism.
  • an embodiment of the present invention further provides a method for fixing a backboard, comprising: providing a first engaging mechanism at a lower end of the upper back panel, and a second engaging mechanism at an upper end of the lower back panel, respectively a first positioning hole and a second positioning hole corresponding to a position on a second engaging mechanism; a third positioning hole corresponding to the first positioning hole and the second positioning hole in the frame Providing a positioning member; the positioning member passes through the first positioning hole and the second after the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism Positioning the holes and cooperating with a third positioning hole on the frame to fix the upper back plate and the lower back plate to the frame.
  • the backplane system, the centralized switching device, and the backplane connection and fixing method provided by the embodiments of the present invention have a first engaging mechanism at a lower end of the upper backboard, and a second engaging mechanism, an upper backboard and an upper back of the lower backboard.
  • the lower back plate is engaged by the first engaging mechanism and the second engaging mechanism; when the back plate is assembled, the positioning holes corresponding to the positions are further disposed on the first engaging structure and the second engaging structure, and then the same positioning member is simultaneously
  • the upper back plate and the lower back plate are fixed to the frame through positioning holes on the upper back plate and the lower back plate.
  • the upper back board and the lower back board in the embodiment of the present invention can be connected to each other through the same positioning member after being connected by the mutually configured engaging mechanism, thereby reducing assembly errors and avoiding exchange/cross board connection.
  • the connector on the backplane and the backplane cannot be precisely aligned to cause damage to the connector pins and sockets, which may result in damage to the function of the device, which can greatly improve the product qualification rate, improve production efficiency, and reduce production cost in production.
  • Figure 1 is a schematic view showing an ideal assembly structure of a single-sided and a lower back plate
  • FIG. 2 is a schematic structural diagram of an exchange (cross) board
  • Figure 3 is a schematic diagram 1 showing the error after assembly of the upper and lower back plates
  • Figure 4 is a schematic diagram 2 showing the error after assembly of the upper and lower back plates
  • FIG. 5 is a schematic structural diagram 1 of an upper and a lower back board according to Embodiment 1 of the present invention.
  • FIG. 6 is a schematic structural view 2 of the upper and lower back plates according to Embodiment 1 of the present invention.
  • FIG. 7 is a schematic structural view 3 of the upper and lower back plates according to Embodiment 1 of the present invention.
  • FIG. 8 is a schematic view showing the assembly of the upper and lower back plates according to the first embodiment of the present invention.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the backplane system provided in this embodiment includes an upper back board and a lower back board that cooperate with each other; wherein the lower end of the upper back board is connected to the upper end of the lower back board.
  • the lower end of the upper back plate is provided with a first engaging mechanism
  • the upper end of the lower back plate is provided with a second engaging mechanism
  • the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism.
  • the embodiment further provides a corresponding position on the first engaging mechanism and the second engaging mechanism (the first positioning hole and the second positioning hole are arranged to have an overlap in the vertical space for the positioning member to pass through after assembly).
  • a first positioning hole and a second positioning hole of the area, and a third positioning hole corresponding to the first positioning hole and the second positioning hole is disposed on the frame of the centralized switching device; the positioning member is on the upper back plate and the lower positioning hole After the backplane is snap-fitted by the first engaging mechanism and the second engaging mechanism, the backplane and the lower backplane are fixed to the rack through the first positioning hole, the second positioning hole, and the third positioning hole on the frame. on.
  • the positioning member and the third positioning hole may be configured to pass through the third positioning hole.
  • one end of the positioning member passing through the third positioning hole is provided with an external thread, and the third positioning hole is transmitted to cooperate with the corresponding nut;
  • the positioning member and the third positioning hole may also be configured to stay in the third positioning hole.
  • the sidewall of the third positioning hole is provided with an internal thread, and the positioning member passes through one end of the first positioning hole and the second positioning hole.
  • the external thread is provided, and the end penetrates the first positioning hole and the second positioning hole, and then enters the third positioning hole and cooperates with the internal thread in the third positioning hole.
  • the upper back board and the lower back board in the embodiment can be connected to each other through the locating mechanism disposed in the mutual arrangement and then fixed on the frame through the same positioning member, thereby reducing the installation precision of the back board and the reliability of the product, and reducing
  • the damage rate of the exchange/cross-board connector can greatly improve the product qualification rate, increase production efficiency and reduce production cost in production.
  • first occlusion mechanism and the second occlusion mechanism in this embodiment may be specifically selected according to actual application scenarios.
  • the following description will be made in conjunction with several exemplary ways shown in the drawings.
  • the first engaging mechanism disposed at the lower end of the upper back plate 1 includes a first limiting groove 11 having a groove depth smaller than the thickness of the upper back plate 1. (That is, the groove does not penetrate the upper back plate in the thickness direction of the upper back plate 11).
  • the second engaging mechanism disposed at the upper end of the lower back plate 2 includes a first boss 21 having a position and a size corresponding to the first limiting groove 11; at the time of assembly, the first boss 21 of the lower back plate 2 is fastened to A snap connection is achieved in the first limiting slot 11 of the upper back panel 1 .
  • the first limiting recess 11 of the upper back panel 1 and the first protruding bracket 21 of the lower back panel 2 are disposed on the same surface.
  • the first limiting recess 11 is disposed on the front surface of the upper back panel 1 .
  • a corresponding first boss 21 is also provided on the front side of the lower back panel 2.
  • the thickness of the first boss 21 of the lower back plate 2 is less than or equal to the depth of the first limiting groove 11 of the upper back plate 1; After the first boss 21 of the lower back panel 2 is fastened into the first limiting slot 11 of the upper back panel 1, the first boss 21 is flush with the upper and lower backplanes.
  • the depth of the first limiting groove 11 of the upper back plate 1 is taken as one-half of the thickness of the upper back plate 1; the thickness of the first protruding portion 21 of the lower back plate 2 is equal to the upper back plate. The depth of the first limit groove 11 of 1.
  • the size of the upper back plate 1 in FIG. 5 can still adopt the size of the existing upper back plate; the lower back plate 2 is on the existing lower back.
  • a first boss 21 of a certain length is extended at the upper end, so that the upper back plate 1 and the lower back plate 2 are buckled and lapped to be the same size as the existing upper and lower back plates.
  • a first positioning hole 111 is disposed at the bottom of the first limiting groove 11, the first positioning hole 111 penetrates the back plate 1; and the second position of the first protrusion 21 is provided with a second position.
  • the positioning hole 211 and the second positioning hole 211 penetrate the first boss 21 .
  • the first positioning hole 111 and the second positioning hole 211 may completely coincide (or at least partially overlap) after assembly, so that the positioning member (specifically, the positioning pin) passes through the upper and lower back plates to be fixed on the frame.
  • the structure shown in FIG. 5 and the structure shown in FIG. 5 are reversely provided with a second limiting groove 22 on the lower back plate 2 , and the groove depth of the second limiting groove 22 is smaller than that. a thickness of the back plate 2; a second boss 12 having a position and a size corresponding to the second limiting groove 22 is disposed at a lower end of the upper back plate 1, and the second boss 12 of the upper back plate 1 is engaged at the time of assembly A snap connection is achieved in the second limiting slot 22 of the lower back panel 2.
  • the second boss 12 of the upper back panel 1 and the second limiting recess 22 of the lower back panel 2 are disposed on the same surface.
  • the second boss 12 is disposed on the front surface of the upper back panel 1 , corresponding to The second limiting groove 22 is also disposed on the front surface of the lower back plate 2.
  • the thickness of the second boss 12 of the upper back panel 1 is less than or equal to the depth of the second limiting recess 22 of the lower back panel 2 to ensure that the second boss 12 of the upper back panel 1 is fastened to the lower back.
  • the second boss 12 of the second limiting slot 22 of the board 2 is flush with the upper and lower backplanes.
  • the depth of the second limiting groove 22 of the lower back plate 2 in the embodiment is taken as one-half of the thickness of the lower back plate 2; the thickness of the second boss 12 of the upper back plate 2 is equal to the lower back plate.
  • the size of the lower back plate 2 in FIG. 6 can still adopt the size of the existing upper back plate; the upper back plate 1 is on the existing upper back.
  • a second boss 12 of a certain length is extended at the lower end, so that the upper back plate 1 and the lower back plate 2 are folded and lapped to be the same size as the existing upper and lower back plates.
  • a second positioning hole 221 is disposed at the bottom of the second limiting groove 22 , and the second positioning hole 221 extends through the back plate 2 ;
  • the positioning hole 121 and the second positioning hole 121 penetrate the second boss 12 .
  • the first positioning hole 121 and the second positioning hole 221 may completely coincide (or at least partially overlap) after assembly, so that the positioning member (specifically, the positioning pin) passes through the upper and lower back plates to be fixed on the frame.
  • FIG. 7 the figure shows an example of combining the two connection structures of FIG. 5 and FIG. 6 .
  • the first limiting groove 11 and the second protrusion 12 are disposed at the lower end of the upper back plate 1 ;
  • the upper end of the plate 2 is correspondingly provided with a first boss 21 and a second limiting groove 22; the upper back plate 1 and the lower back plate 2 are engaged with the first boss 21 by the first limiting groove 11 and the second convex portion
  • the table 12 and the second limiting groove 22 are engaged with each other to achieve connection.
  • the number of the first limiting groove 11, the first boss 21, and the number of the second limiting groove 22 and the second boss 12 can be selected according to specific applications. . The more the number is set, the better the reliability of the connection.
  • the first limiting groove 11 and the second boss 12 are simultaneously disposed on the upper back plate 1, the first limiting groove 11 and The second boss 12 is disposed on the same surface; the first boss 21 and the second limiting groove 22 on the corresponding lower back plate 2 are also disposed on the corresponding same surface.
  • the positioning holes may be provided on each pair of the engaging mechanisms, or the positioning holes may be provided on the selected at least one pair of engaging mechanisms.
  • the first engaging mechanism of the embodiment may include only the first limiting groove, and the width of the first limiting groove is equal to the width of the upper back plate, that is, the first limiting concave.
  • the width of the groove extends transversely through the lower end of the upper back plate; the width of the first boss on the lower back plate is equal to the width of the lower back plate; at this time, the first limit groove and the first boss are engaged and overlapped, up and down
  • a side view of the back plate is shown in FIG. 8.
  • the first limiting groove 11 at the lower end of the upper back plate 1 receives the first protrusions 21 at the upper end of the lower back plate 2 to achieve mutual engagement and overlapping.
  • the second engaging mechanism may only include a second limiting groove, the second limiting groove width is equal to the width of the lower back plate; the first engaging mechanism correspondingly only includes the second protruding portion, and the width of the second protruding portion is equal to The width of the upper back panel.
  • the second limiting groove on the lower back plate receives the second protrusion of the lower end of the upper back plate to achieve mutual engagement and overlapping.
  • the protrusions and recesses on the upper back plate and the lower back plate in this embodiment can be formed by first obtaining a complete PCB board and then milling the corresponding length and thickness of the PCB board in the corresponding area.
  • the upper back board and the lower back board in this embodiment may be a single-sided PCB board or a double-sided PCB board.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • connection mechanism shown in FIG. 8 is taken as an example, combined with a specific size of the upper and lower back plates, and the limit plate and the corresponding groove are formed by milling the PCB board of the corresponding length and thickness.
  • the method of the protrusion is taken as an example to further explain the embodiment of the present invention.
  • the thickness of the upper and lower back plates are both 6.5 mm, and the widths of the upper and lower back plates are the same; in order to ensure the versatility of the size, the present embodiment is additionally based on the existing upper and lower back plates.
  • the extension extends 7 mm, and the 7 mm that grows are respectively at the lower end of the upper back panel and the upper end of the lower back panel (ie, the junction of the upper and lower back panels).
  • a PCB having a length of 14 mm and a thickness of half of the PCB (ie, 3.25 mm) is milled on the front surface of the lower back plate to form a first limit groove having a groove depth of 3.25 mm at the lower end of the upper back plate, and
  • the bottom of a limiting slot forms at least one first positioning hole (or first mounting hole) penetrating the upper backing plate.
  • the positional accuracy of the PCB positioning hole can reach 0.0508mm, and the large-sized back plate can reach 0.254mm, which is much higher than the processing precision of the frame.
  • the mounting alignment of the upper and lower back plates can effectively improve the accuracy in both the horizontal direction and the vertical direction, thereby avoiding damage to the cross board connector and the back board when the switching/cross board is inserted into the back board.
  • Connector socket Increased production efficiency and product reliability, reducing production costs and maintenance costs.
  • the upper back plate and the lower back plate can be connected to each other through the locating mechanism disposed at the same time and then fixed to the frame by the same positioning member, thereby reducing assembly errors and avoiding exchange.
  • the connector on the cross-board connector and the backplane cannot be precisely aligned, causing damage to the connector pins and sockets, which may result in damage to the function of the device, which can greatly improve the product qualification rate and improve the production efficiency in production. reduce manufacturing cost.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Of Plates (AREA)

Abstract

Disclosed in the present invention are a backplane system, centralized exchange equipment and a method for backplane connection and fixation. A first engagement mechanism is arranged on the lower end of an upper backplane, a second engagement mechanism is arranged on the upper end of a lower backplane, the upper backplane and the lower backplane are engaged and connected with each other through the first engagement mechanism and the second engagement mechanism; during assembly, locating holes having corresponding locations are further formed on the first engagement mechanism and the second engagement mechanism, and then identical locating members are used to penetrate through the locating holes on the upper backplane and the lower backplane at the same time to fix the upper backplane and the lower backplane on a frame. During assembly, the upper backplane and the lower backplane in the backplane system of the present invention can be connected with each other through the mutually configured engagement mechanisms and then fixed on the frame through the same locating members; thus errors in assembly can be reduced, the problem is avoided that a card connector and a connector on the backplane cannot be perfectly aligned during exchange/intersection, so as to cause damages to pins and sockets of the connectors and further to equipment functions; the qualified rate of products is greatly raised during production, production efficiency is improved, and production cost is lowered.

Description

背板系统、集中交换设备及背板连接和固定方法Backplane system, centralized switching device and backplane connection and fixing method 技术领域Technical field
本发明涉及通信领域,具体涉及通信领域中的一种背板系统、集中交换设备及背板连接和固定方法。The present invention relates to the field of communications, and in particular, to a backplane system, a centralized switching device, and a backplane connection and fixing method in the communication field.
背景技术Background technique
集中交换/交叉设备主要应用于基于OTN、PTN、IP领域,随着互联网及3G\4G业务的迅猛发展,市场对交换设备的调度容量需求越来越大。目前,集中交换/交叉设备主要是通过背板布线实现高速通道的互联。背板尺寸越大、布线数量越多、插卡数量越多,设备的调度容量越大。但PCB厂家的加工能力有限,PCB不可能做到超大,业界许多厂家采取了多块背板分离加工,最后组装到机架中的架构。图1所示为一个由两块背板构成的单面的设备结构,两块背板分别命名为上背板1、下背板2。对于双面背板则容量翻倍,另一面的结构和图1中基本一致,这里以单面为例简要介绍。为了两块分离背板上的线卡能够相互通信,需要交换/交叉板卡必须跨接在两块背板上,而且交换/交叉板是垂直插入背板上的。图2所示为交换/交叉板卡3的基本外形结构,交换/交叉板卡3为单PCB结构,连接器位置可保证在一个垂直方向。但两块分离背板装配到机架后,相对位置主要受限于结构定位精度,和交换/交叉板卡3互联的连接器不可能完全处于一个垂直方向,会导致出现装配误差。具体的,请参见图3所示,在水平方向在装配后存在误差;请参见图4所示,垂直方向在装配后存在误差,当然也存在水平和垂直方向都存在装配误差的情况。若在此装配的设备上插拔交换/交叉板卡3,很容易因为交换/交叉板卡3连接器和背板连接器不能精确对准,引起连接器插针、插座损坏,进而导致设备功能受损,在生产中也会极大影响产品合格率,降低生产效率,提高生产成本。存在上述误差的一个主要因素是上背板1和下背板2之间并无直接连接且上、下背板2通过各自的定位销固定;导致在装配后易出现装配误差。Centralized switching/crossing equipment is mainly used in the fields of OTN, PTN, and IP. With the rapid development of the Internet and 3G\4G services, the market has more and more demand for the scheduling capacity of switching equipment. At present, centralized switching/crossing devices mainly implement high-speed channel interconnection through backplane wiring. The larger the backplane size, the greater the number of wires, and the greater the number of cards, the greater the scheduling capacity of the device. However, the PCB manufacturer's processing capacity is limited, and the PCB cannot be oversized. Many manufacturers in the industry have adopted multiple backplane separation processing and finally assembled into the rack structure. FIG. 1 shows a single-sided device structure composed of two back plates, and the two back plates are named as an upper back plate 1 and a lower back plate 2, respectively. For the double-sided backboard, the capacity is doubled, and the structure of the other side is basically the same as that in FIG. 1. Here, a single side is taken as an example for brief introduction. In order for the line cards on the two separate backplanes to communicate with each other, the switch/crossover boards must be bridged across the two backplanes, and the switch/crossboards are vertically inserted into the backplane. Figure 2 shows the basic outline structure of the switch/cross board 3. The switch/cross board 3 is a single PCB structure, and the connector position is guaranteed in a vertical direction. However, after the two separate backplanes are assembled to the frame, the relative position is mainly limited by the structural positioning accuracy, and the connector of the exchange/cross-board 3 interconnection cannot be completely in a vertical direction, which may cause assembly errors. Specifically, as shown in FIG. 3, there is an error in the horizontal direction after assembly; as shown in FIG. 4, there is an error in the vertical direction after assembly, and there are cases where there are assembly errors in both the horizontal and vertical directions. If the switch/cross card 3 is plugged and unplugged on the device to be assembled, it is easy to accurately align the switch/cross-board connector 3 and the backplane connector, causing damage to the connector pins and sockets, resulting in device function. Damage, in production, will also greatly affect product yield, reduce production efficiency, and increase production costs. One of the main factors for the above error is that there is no direct connection between the upper back plate 1 and the lower back plate 2 and the upper and lower back plates 2 are fixed by respective positioning pins; resulting in assembly errors easily after assembly.
发明内容Summary of the invention
本发明实施例要解决的主要技术问题是,提供一种背板系统、集中交换设备及背板连接和固定方法,解决现有背板之间无连接导致装配易出现装配误差的问题。The main technical problem to be solved by the embodiments of the present invention is to provide a backplane system, a centralized switching device, and a backplane connection and fixing method, which solves the problem that assembly is prone to assembly errors due to no connection between the existing backplanes.
为解决上述技术问题,本发明实施例提供一种背板系统,包括上背板和下背板,所述上背板的下端设有第一咬合机构,所述下背板的上端设有第二咬合机构,所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接。 In order to solve the above technical problem, an embodiment of the present invention provides a backplane system, including an upper backboard and a lower backplane, wherein a lower end of the upper backplane is provided with a first engaging mechanism, and an upper end of the lower backboard is provided with a first The second bite mechanism, the upper back plate and the lower back plate are snap-fit connected by the first engaging mechanism and the second engaging mechanism.
在本发明的一种实施例中,所述第一咬合机构包括第一限位凹槽,所述第一限位凹槽的槽深度小于所述上背板的厚度;所述第二咬合机构包括设置位置和尺寸与所述第一限位凹槽对应的第一凸台;所述第一凸台扣合到所述第一限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接;和/或,所述第二咬合机构包括第二限位凹槽,所述第二限位凹槽的槽深度小于所述下背板的厚度;所述第一咬合机构包括位置和尺寸与所述第二限位凹槽对应的第二凸台,所述第二凸台扣合到所述第二限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接。In an embodiment of the present invention, the first engaging mechanism includes a first limiting groove, the groove depth of the first limiting groove is smaller than the thickness of the upper back plate; and the second engaging mechanism The first protruding position corresponding to the first limiting groove is disposed; the first protruding portion is fastened into the first limiting groove to realize the first engaging mechanism and the second a nip joint of the occlusion mechanism; and/or, the second occlusion mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than a thickness of the lower back plate; the first occlusion mechanism a second boss having a position and a size corresponding to the second limiting groove, the second boss being fastened into the second limiting groove to realize the first engaging mechanism and the second engaging The bite connection of the mechanism.
在本发明的一种实施例中,所述第一咬合机构包括第一限位凹槽时,所述第一限位凹槽设置在所述上背板的正面;所述第二咬合机构包括的第一凸台对应设置在所述下背板的正面;所述第二咬合机构包括第二限位凹槽时,所述第二限位凹槽设置在所述下背板的正面;所述第一咬合机构包括的第二凸台对应设置在所述上背板的正面。In an embodiment of the invention, when the first engaging mechanism includes a first limiting groove, the first limiting groove is disposed on a front surface of the upper back plate; and the second engaging mechanism comprises The first boss is disposed on the front surface of the lower back plate; when the second engaging mechanism includes the second limiting groove, the second limiting groove is disposed on the front surface of the lower back plate; The second boss included in the first engaging mechanism is disposed on the front surface of the upper back plate.
在本发明的一种实施例中,所述第一咬合机构包括第一限位凹槽时,所述第二咬合机构包括的第一凸台的厚度小于等于所述第一限位凹槽的深度;所述第二咬合机构包括第二限位凹槽时,所述第一咬合机构包括的第二凸台的厚度小于等于所述第二限位凹槽的深度。In an embodiment of the present invention, when the first engaging mechanism includes the first limiting groove, the thickness of the first boss included in the second engaging mechanism is less than or equal to the thickness of the first limiting groove. Depth; when the second engaging mechanism includes the second limiting groove, the thickness of the second boss included in the first engaging mechanism is less than or equal to the depth of the second limiting groove.
在本发明的一种实施例中,所述第一咬合机构仅包括第一限位凹槽时,所述第一限位凹槽宽度等于所述上背板宽度;所述第二咬合机构对应的仅包括第一凸台,所述第一凸台的宽度等于所述下背板的宽度;所述第二咬合机构仅包括第二限位凹槽时,所述第二限位凹槽宽度等于所述下背板宽度;所述第一咬合机构对应的仅包括第二凸台,所述第二凸台的宽度等于所述上背板的宽度。In an embodiment of the present invention, when the first engaging mechanism includes only the first limiting groove, the first limiting groove width is equal to the upper back plate width; the second engaging mechanism corresponds to Included only in the first boss, the width of the first boss is equal to the width of the lower back plate; when the second meshing mechanism includes only the second limiting groove, the second limit groove width And corresponding to the width of the lower back plate; the first engaging mechanism correspondingly includes only the second boss, and the width of the second boss is equal to the width of the upper back plate.
在本发明的一种实施例中,所述第一咬合机构包括第一限位凹槽时,所述第一限位凹槽的槽深度为所述上背板厚度的二分之一;所述第二咬合机构包括第二限位凹槽时,所述第二限位凹槽的槽深度为所述下背板厚度的二分之一。In an embodiment of the present invention, when the first engaging mechanism includes the first limiting groove, the groove depth of the first limiting groove is one-half of the thickness of the upper back plate; When the second engaging mechanism includes the second limiting groove, the groove depth of the second limiting groove is one-half of the thickness of the lower back plate.
为了解决上述问题,本发明实施例还提供了一种集中交换设备,包括机架、定位件以及如上所述的背板系统,所述第一咬合机构和所述第二咬合机构上还分别设有位置相对应的第一定位孔和第二定位孔,所述机架上设有位置与所述第一定位孔和第二定位孔相对应的第三定位孔;所述定位件在所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接后,穿过所述第一定位孔、第二定位孔并与所述机架上的第三定位孔配合将所述上背板和所述下背板固定在所述机架上。In order to solve the above problems, an embodiment of the present invention further provides a centralized switching device, including a rack, a positioning member, and a backplane system as described above, wherein the first engaging mechanism and the second engaging mechanism are respectively configured And a second positioning hole corresponding to the first positioning hole and the second positioning hole; the positioning member is in the After the upper back plate and the lower back plate are snap-fitted by the first engaging mechanism and the second engaging mechanism, pass through the first positioning hole, the second positioning hole, and the third on the frame A positioning hole fit secures the upper back plate and the lower back plate to the frame.
为了解决上述问题,本发明实施例还提供了一种背板连接方法,包括:在上背板的下端设置第一咬合机构,在下背板的上端设置第二咬合机构;将所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接。 In order to solve the above problems, an embodiment of the present invention further provides a backplane connection method, including: providing a first occlusion mechanism at a lower end of the upper back panel, and a second occlusion mechanism at an upper end of the lower back panel; And the lower back plate is snap-connected by the first engaging mechanism and the second engaging mechanism.
在本发明的一种实施例中,所述第一咬合机构包括第一限位凹槽,所述第一限位凹槽的槽深度小于所述上背板的厚度;所述第二咬合机构包括设置位置和尺寸与所述第一限位凹槽对应的第一凸台;所述第一凸台扣合到所述第一限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接;和/或,所述第二咬合机构包括第二限位凹槽,所述第二限位凹槽的槽深度小于所述下背板的厚度;所述第一咬合机构包括位置和尺寸与所述第二限位凹槽对应的第二凸台,所述第二凸台扣合到所述第二限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接。In an embodiment of the present invention, the first engaging mechanism includes a first limiting groove, the groove depth of the first limiting groove is smaller than the thickness of the upper back plate; and the second engaging mechanism The first protruding position corresponding to the first limiting groove is disposed; the first protruding portion is fastened into the first limiting groove to realize the first engaging mechanism and the second a nip joint of the occlusion mechanism; and/or, the second occlusion mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than a thickness of the lower back plate; the first occlusion mechanism a second boss having a position and a size corresponding to the second limiting groove, the second boss being fastened into the second limiting groove to realize the first engaging mechanism and the second engaging The bite connection of the mechanism.
为了解决上述问题,本发明实施例还提供了一种背板固定方法,包括:在上背板的下端设置第一咬合机构,在下背板的上端设置第二咬合机构,并分别在所述第一咬合机构和所述第二咬合机构上设置位置相对应的第一定位孔和第二定位孔;在机架上位置与所述第一定位孔和第二定位孔相对应的第三定位孔;设置定位件;所述定位件在所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接后,穿过所述第一定位孔、第二定位孔并与所述机架上的第三定位孔配合将所述上背板和所述下背板固定在所述机架上。In order to solve the above problem, an embodiment of the present invention further provides a method for fixing a backboard, comprising: providing a first engaging mechanism at a lower end of the upper back panel, and a second engaging mechanism at an upper end of the lower back panel, respectively a first positioning hole and a second positioning hole corresponding to a position on a second engaging mechanism; a third positioning hole corresponding to the first positioning hole and the second positioning hole in the frame Providing a positioning member; the positioning member passes through the first positioning hole and the second after the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism Positioning the holes and cooperating with a third positioning hole on the frame to fix the upper back plate and the lower back plate to the frame.
本发明实施例的有益效果是:The beneficial effects of the embodiments of the present invention are:
本发明实施例提供的背板系统、集中交换设备及背板连接和固定方法,在上背板的下端设有第一咬合机构,下背板的上端设有第二咬合机构,上背板和下背板通过第一咬合机构和第二咬合机构咬合连接;在装配背板时,在第一咬合结构和第二咬合结构上还设有位置相对应的定位孔,然后通过相同的定位件同时穿过上背板和下背板上的定位孔将上背板和下背板固定在机架上。可见,本发明实施例中的上背板和下背板在装配时可通过相互配置的咬合机构连接后再通过同一定位件固定在机架上,可以降低装配误差,避免交换/交叉板卡连接器和背板上的连接器不能精确对准引起连接器插针、插座损坏,进而导致设备功能受损的问题,可在生产中极大提升产品合格率,提高生产效率,降低生产成本。The backplane system, the centralized switching device, and the backplane connection and fixing method provided by the embodiments of the present invention have a first engaging mechanism at a lower end of the upper backboard, and a second engaging mechanism, an upper backboard and an upper back of the lower backboard. The lower back plate is engaged by the first engaging mechanism and the second engaging mechanism; when the back plate is assembled, the positioning holes corresponding to the positions are further disposed on the first engaging structure and the second engaging structure, and then the same positioning member is simultaneously The upper back plate and the lower back plate are fixed to the frame through positioning holes on the upper back plate and the lower back plate. It can be seen that the upper back board and the lower back board in the embodiment of the present invention can be connected to each other through the same positioning member after being connected by the mutually configured engaging mechanism, thereby reducing assembly errors and avoiding exchange/cross board connection. The connector on the backplane and the backplane cannot be precisely aligned to cause damage to the connector pins and sockets, which may result in damage to the function of the device, which can greatly improve the product qualification rate, improve production efficiency, and reduce production cost in production.
附图说明DRAWINGS
图1为单面上、下背板理想装配结构示意图;Figure 1 is a schematic view showing an ideal assembly structure of a single-sided and a lower back plate;
图2为交换(交叉)板卡结构示意图;2 is a schematic structural diagram of an exchange (cross) board;
图3为上、下背板装配后存在误差的示意图一;Figure 3 is a schematic diagram 1 showing the error after assembly of the upper and lower back plates;
图4为上、下背板装配后存在误差的示意图二;Figure 4 is a schematic diagram 2 showing the error after assembly of the upper and lower back plates;
图5为本发明实施例一提供的上、下背板结构示意图一;FIG. 5 is a schematic structural diagram 1 of an upper and a lower back board according to Embodiment 1 of the present invention; FIG.
图6为本发明实施例一提供的上、下背板结构示意图二; 6 is a schematic structural view 2 of the upper and lower back plates according to Embodiment 1 of the present invention;
图7为本发明实施例一提供的上、下背板结构示意图三;7 is a schematic structural view 3 of the upper and lower back plates according to Embodiment 1 of the present invention;
图8为本发明实施例一提供的上、下背板装配示意图。FIG. 8 is a schematic view showing the assembly of the upper and lower back plates according to the first embodiment of the present invention.
具体实施方式detailed description
下面通过具体实施方式结合附图对本发明作进一步详细说明。The present invention will be further described in detail below with reference to the accompanying drawings.
实施例一:Embodiment 1:
本实施例提供的背板系统包括相互配合的上背板和下背板;其中上背板的下端与下背板的上端连接。具体的,上背板的下端设有第一咬合机构,下背板的上端设有第二咬合机构,上背板和下背板通过第一咬合机构和第二咬合机构咬合连接。通过该连接结构连接后,可以尽可能降低上背板和下背板在装配过程中在水平和垂直方向上产生装配误差。The backplane system provided in this embodiment includes an upper back board and a lower back board that cooperate with each other; wherein the lower end of the upper back board is connected to the upper end of the lower back board. Specifically, the lower end of the upper back plate is provided with a first engaging mechanism, and the upper end of the lower back plate is provided with a second engaging mechanism, and the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism. After the connection is connected by the connection structure, the assembly error of the upper back plate and the lower back plate in the horizontal and vertical directions during assembly can be reduced as much as possible.
本实施例还进一步在第一咬合机构和第二咬合机构上分别设有位置相对应(设置的第一定位孔和第二定位孔在装配后在垂直空间上需有供定位件穿过的重叠区域)的第一定位孔和第二定位孔,在集中交换设备的机架上设有位置与第一定位孔和第二定位孔相对应的第三定位孔;定位件在上背板和下背板通过第一咬合机构和第二咬合机构咬合连接后,穿过第一定位孔、第二定位孔并与机架上的第三定位孔配合将上背板和下背板固定在机架上。定位件与第三定位孔配合具体可以是穿过该第三定位孔,例如定位件穿过该第三定位孔的一端设有外螺纹,传出第三定位孔后与对应的螺帽配合;定位件与第三定位孔配合也可以是最终停留在该第三定位孔内,例如第三定位孔的侧壁设有内螺纹,定位件穿过该第一定位孔和第二定位孔的一端设有外螺纹,该端穿出第一定位孔和第二定位孔后进入第三定位孔与第三定位孔内的内螺纹配合。The embodiment further provides a corresponding position on the first engaging mechanism and the second engaging mechanism (the first positioning hole and the second positioning hole are arranged to have an overlap in the vertical space for the positioning member to pass through after assembly). a first positioning hole and a second positioning hole of the area, and a third positioning hole corresponding to the first positioning hole and the second positioning hole is disposed on the frame of the centralized switching device; the positioning member is on the upper back plate and the lower positioning hole After the backplane is snap-fitted by the first engaging mechanism and the second engaging mechanism, the backplane and the lower backplane are fixed to the rack through the first positioning hole, the second positioning hole, and the third positioning hole on the frame. on. The positioning member and the third positioning hole may be configured to pass through the third positioning hole. For example, one end of the positioning member passing through the third positioning hole is provided with an external thread, and the third positioning hole is transmitted to cooperate with the corresponding nut; The positioning member and the third positioning hole may also be configured to stay in the third positioning hole. For example, the sidewall of the third positioning hole is provided with an internal thread, and the positioning member passes through one end of the first positioning hole and the second positioning hole. The external thread is provided, and the end penetrates the first positioning hole and the second positioning hole, and then enters the third positioning hole and cooperates with the internal thread in the third positioning hole.
可见本实施例中的上背板和下背板在装配时可通过相互配置的咬合机构连接后再通过同一定位件固定在机架上,可以降低背板的安装精度和产品的可靠性,降低交换/交叉板卡连接器的损坏率,可在生产中极大提升产品合格率,提高生产效率,降低生产成本。It can be seen that the upper back board and the lower back board in the embodiment can be connected to each other through the locating mechanism disposed in the mutual arrangement and then fixed on the frame through the same positioning member, thereby reducing the installation precision of the back board and the reliability of the product, and reducing The damage rate of the exchange/cross-board connector can greatly improve the product qualification rate, increase production efficiency and reduce production cost in production.
本实施例中的第一咬合机构和第二咬合机构所采用的具体结构可根据实际应用场景具体选择设置。下面结合附图所示的几种示例方式进行说明。The specific structures adopted by the first occlusion mechanism and the second occlusion mechanism in this embodiment may be specifically selected according to actual application scenarios. The following description will be made in conjunction with several exemplary ways shown in the drawings.
请参见图5所示,该图所示的上背板1的下端设置的第一咬合机构包括第一限位凹槽11,该第一限位凹槽的槽深度小于上背板1的厚度(也即该凹槽并未在上背板11的厚度方向贯穿上背板)。下背板2的上端设置的第二咬合机构包括位置和尺寸与第一限位凹槽11对应的第一凸台21;在装配时,将下背板2的第一凸台21扣合到上背板1的第一限位槽11中实现咬合连接。Referring to FIG. 5, the first engaging mechanism disposed at the lower end of the upper back plate 1 includes a first limiting groove 11 having a groove depth smaller than the thickness of the upper back plate 1. (That is, the groove does not penetrate the upper back plate in the thickness direction of the upper back plate 11). The second engaging mechanism disposed at the upper end of the lower back plate 2 includes a first boss 21 having a position and a size corresponding to the first limiting groove 11; at the time of assembly, the first boss 21 of the lower back plate 2 is fastened to A snap connection is achieved in the first limiting slot 11 of the upper back panel 1 .
本实施例中的上背板1的第一限位凹槽11和下背板2的第一凸台21设置在同一面上,例如上背板1的正面设置第一限位凹槽11,对应的第一凸台21也设置在下背板2的正面。The first limiting recess 11 of the upper back panel 1 and the first protruding bracket 21 of the lower back panel 2 are disposed on the same surface. For example, the first limiting recess 11 is disposed on the front surface of the upper back panel 1 . A corresponding first boss 21 is also provided on the front side of the lower back panel 2.
本实施例中下背板2的第一凸台21的厚度小于等于上背板1的第一限位凹槽11的深度; 以保证下背板2的第一凸台21扣合到上背板1的第一限位槽11中后该第一凸台21与上、下背板齐平。优选的,本实施例中上背板1的第一限位凹槽11的深度取为上背板1厚度的二分之一;下背板2的第一凸台21的厚度等于上背板1的第一限位凹槽11的深度。In this embodiment, the thickness of the first boss 21 of the lower back plate 2 is less than or equal to the depth of the first limiting groove 11 of the upper back plate 1; After the first boss 21 of the lower back panel 2 is fastened into the first limiting slot 11 of the upper back panel 1, the first boss 21 is flush with the upper and lower backplanes. Preferably, in the embodiment, the depth of the first limiting groove 11 of the upper back plate 1 is taken as one-half of the thickness of the upper back plate 1; the thickness of the first protruding portion 21 of the lower back plate 2 is equal to the upper back plate. The depth of the first limit groove 11 of 1.
在本实施例中,为了保证新旧产品的承接性以及产品的通用性,图5中的上背板1的尺寸仍可采用现有上背板的尺寸;下背板2则在现有下背板的基础上在上端延伸出一定长度的第一凸台21,这样上背板1和下背板2扣合搭接后与现有上、下背板装配后的尺寸相同。In this embodiment, in order to ensure the acceptability of the new and old products and the versatility of the product, the size of the upper back plate 1 in FIG. 5 can still adopt the size of the existing upper back plate; the lower back plate 2 is on the existing lower back. On the basis of the plate, a first boss 21 of a certain length is extended at the upper end, so that the upper back plate 1 and the lower back plate 2 are buckled and lapped to be the same size as the existing upper and lower back plates.
另外,请参见图5所示,在第一限位凹槽11的底部设有第一定位孔111,第一定位孔111贯穿背板1;在第一凸台21的对应位置设有第二定位孔211,第二定位孔211贯穿第一凸台21。第一定位孔111和第二定位孔211在装配后可以完全重合(或至少部分重合),以供定位件(具体可以是定位销)穿过将上、下背板固定在机架上。In addition, as shown in FIG. 5, a first positioning hole 111 is disposed at the bottom of the first limiting groove 11, the first positioning hole 111 penetrates the back plate 1; and the second position of the first protrusion 21 is provided with a second position. The positioning hole 211 and the second positioning hole 211 penetrate the first boss 21 . The first positioning hole 111 and the second positioning hole 211 may completely coincide (or at least partially overlap) after assembly, so that the positioning member (specifically, the positioning pin) passes through the upper and lower back plates to be fixed on the frame.
请参见图6所示,该图所示的结构与图5所示的结构在于反过来在下背板2上设置第二限位凹槽22,该第二限位凹槽22的槽深度小于下背板2的厚度;在上背板1的下端设置位置和尺寸与第二限位凹槽22对应的第二凸台12,在装配时,将上背板1的第二凸台12扣合到下背板2的第二限位槽22中实现咬合连接。Referring to FIG. 6 , the structure shown in FIG. 5 and the structure shown in FIG. 5 are reversely provided with a second limiting groove 22 on the lower back plate 2 , and the groove depth of the second limiting groove 22 is smaller than that. a thickness of the back plate 2; a second boss 12 having a position and a size corresponding to the second limiting groove 22 is disposed at a lower end of the upper back plate 1, and the second boss 12 of the upper back plate 1 is engaged at the time of assembly A snap connection is achieved in the second limiting slot 22 of the lower back panel 2.
本实施例中的上背板1的第二凸台12和下背板2的第二限位凹槽22设置在同一面上,例如上背板1的正面设置第二凸台12,对应的第二限位凹槽22也设置在下背板2的正面。The second boss 12 of the upper back panel 1 and the second limiting recess 22 of the lower back panel 2 are disposed on the same surface. For example, the second boss 12 is disposed on the front surface of the upper back panel 1 , corresponding to The second limiting groove 22 is also disposed on the front surface of the lower back plate 2.
本实施例中上背板1的第二凸台12的厚度小于等于下背板2的第二限位凹槽22的深度;以保证上背板1的第二凸台12扣合到下背板2的第二限位槽22中后该第二凸台12与上、下背板齐平。优选的,本实施例中下背板2的第二限位凹槽22的深度取为下背板2厚度的二分之一;上背板2的第二凸台12的厚度等于下背板2的第二限位凹槽22的深度。In this embodiment, the thickness of the second boss 12 of the upper back panel 1 is less than or equal to the depth of the second limiting recess 22 of the lower back panel 2 to ensure that the second boss 12 of the upper back panel 1 is fastened to the lower back. The second boss 12 of the second limiting slot 22 of the board 2 is flush with the upper and lower backplanes. Preferably, the depth of the second limiting groove 22 of the lower back plate 2 in the embodiment is taken as one-half of the thickness of the lower back plate 2; the thickness of the second boss 12 of the upper back plate 2 is equal to the lower back plate. The depth of the second limit groove 22 of 2.
在本实施例中,为了保证新旧产品的承接性以及产品的通用性,图6中的下背板2的尺寸仍可采用现有上背板的尺寸;上背板1则在现有上背板的基础上在下端延伸出一定长度的第二凸台12,这样上背板1和下背板2扣合搭接后与现有上、下背板装配后的尺寸相同。In this embodiment, in order to ensure the acceptability of the new and old products and the versatility of the product, the size of the lower back plate 2 in FIG. 6 can still adopt the size of the existing upper back plate; the upper back plate 1 is on the existing upper back. On the basis of the plate, a second boss 12 of a certain length is extended at the lower end, so that the upper back plate 1 and the lower back plate 2 are folded and lapped to be the same size as the existing upper and lower back plates.
另外,请参见图6所示,在第二限位凹槽22的底部设有第二定位孔221,第二定位孔221贯穿背板2;在第二凸台12的对应位置设有第一定位孔121,第二定位孔121贯穿第二凸台12。第一定位孔121和第二定位孔221在装配后可以完全重合(或至少部分重合),以供定位件(具体可以是定位销)穿过将上、下背板固定在机架上。In addition, as shown in FIG. 6 , a second positioning hole 221 is disposed at the bottom of the second limiting groove 22 , and the second positioning hole 221 extends through the back plate 2 ; The positioning hole 121 and the second positioning hole 121 penetrate the second boss 12 . The first positioning hole 121 and the second positioning hole 221 may completely coincide (or at least partially overlap) after assembly, so that the positioning member (specifically, the positioning pin) passes through the upper and lower back plates to be fixed on the frame.
请参见图7所示,该图所示为结合图5和图6两种连接结构的示例,在上背板1的下端设有第一限位凹槽11和第二凸台12;在下背板2的上端对应设有第一凸台21和第二限位凹槽22;上背板1和下背板2通过第一限位凹槽11与第一凸台21相互咬合以及第二凸台12与第二限位凹槽22相互咬合实现连接。Referring to FIG. 7 , the figure shows an example of combining the two connection structures of FIG. 5 and FIG. 6 . The first limiting groove 11 and the second protrusion 12 are disposed at the lower end of the upper back plate 1 ; The upper end of the plate 2 is correspondingly provided with a first boss 21 and a second limiting groove 22; the upper back plate 1 and the lower back plate 2 are engaged with the first boss 21 by the first limiting groove 11 and the second convex portion The table 12 and the second limiting groove 22 are engaged with each other to achieve connection.
应当理解的是,本实施例中第一限位凹槽11、第一凸台21的个数,以及第二限位凹槽22、第二凸台12的个数可以根据具体应用选择设定。个数设置的越多,其连接的可靠性相对越好。本实施例中当在上背板1上同时设有第一限位凹槽11和第二凸台12时,第一限位凹槽11和 第二凸台12设置在同一面上;对应的下背板2上的第一凸台21和第二限位凹槽22也设置在对应的同一面上。当设置对多咬合机构时,可以在每对咬合机构上设置定位孔,也可以在选定的至少一对咬合机构上设置定位孔。It should be understood that, in this embodiment, the number of the first limiting groove 11, the first boss 21, and the number of the second limiting groove 22 and the second boss 12 can be selected according to specific applications. . The more the number is set, the better the reliability of the connection. In this embodiment, when the first limiting groove 11 and the second boss 12 are simultaneously disposed on the upper back plate 1, the first limiting groove 11 and The second boss 12 is disposed on the same surface; the first boss 21 and the second limiting groove 22 on the corresponding lower back plate 2 are also disposed on the corresponding same surface. When the multi-engagement mechanism is provided, the positioning holes may be provided on each pair of the engaging mechanisms, or the positioning holes may be provided on the selected at least one pair of engaging mechanisms.
除了图5-7所示的连接机构外,本实施例的第一咬合机构可仅包括第一限位凹槽,第一限位凹槽宽度等于上背板宽度,也即第一限位凹槽的宽度横向贯穿上背板的下端;下背板上端的第一凸台的宽度等于下背板的宽度;此时第一限位凹槽和第一凸台咬合搭接后,上、下背板的侧视图如图8所示,上背板1下端的第一限位凹槽11内容纳有下背板2上端的第一凸起21实现相互咬合搭接。In addition to the connecting mechanism shown in FIG. 5-7, the first engaging mechanism of the embodiment may include only the first limiting groove, and the width of the first limiting groove is equal to the width of the upper back plate, that is, the first limiting concave. The width of the groove extends transversely through the lower end of the upper back plate; the width of the first boss on the lower back plate is equal to the width of the lower back plate; at this time, the first limit groove and the first boss are engaged and overlapped, up and down A side view of the back plate is shown in FIG. 8. The first limiting groove 11 at the lower end of the upper back plate 1 receives the first protrusions 21 at the upper end of the lower back plate 2 to achieve mutual engagement and overlapping.
对应的,第二咬合机构可仅包括第二限位凹槽,第二限位凹槽宽度等于下背板宽度;第一咬合机构对应的仅包括第二凸台,第二凸台的宽度等于上背板的宽度。装配后,下背板上端的第二限位凹槽内容纳有上背板下端的第二凸起实现相互咬合搭接。Correspondingly, the second engaging mechanism may only include a second limiting groove, the second limiting groove width is equal to the width of the lower back plate; the first engaging mechanism correspondingly only includes the second protruding portion, and the width of the second protruding portion is equal to The width of the upper back panel. After assembly, the second limiting groove on the lower back plate receives the second protrusion of the lower end of the upper back plate to achieve mutual engagement and overlapping.
应当理解的是,本实施例中上背板和下背板上的各凸起和凹槽可以通过先得到一块完整的PCB板,然后在对应的区域铣掉相应长度和厚度的PCB板形成。应当理解的是,本实施例中的上背板和下背板可以采用单面PCB板,也可以采用双面PCB板。It should be understood that the protrusions and recesses on the upper back plate and the lower back plate in this embodiment can be formed by first obtaining a complete PCB board and then milling the corresponding length and thickness of the PCB board in the corresponding area. It should be understood that the upper back board and the lower back board in this embodiment may be a single-sided PCB board or a double-sided PCB board.
实施例二:Embodiment 2:
为了更好的理解本发明实施例,下面以图8所示的连接机构为例,结合一个具体尺寸的上、下背板,通过铣掉相应长度和厚度的PCB板形成限位凹槽和对应凸起的方式为例,对本发明实施例做进一步的说明。In order to better understand the embodiment of the present invention, the connection mechanism shown in FIG. 8 is taken as an example, combined with a specific size of the upper and lower back plates, and the limit plate and the corresponding groove are formed by milling the PCB board of the corresponding length and thickness. The method of the protrusion is taken as an example to further explain the embodiment of the present invention.
具体的,本实施例中上、下背板的厚度为均为6.5mm,上下背板的宽度相同;为了保证尺寸的通用性,本实施例中在现有上、下背板的基础上额外延伸出长出7mm,长出的7mm分别在上背板的下端和下背板的上端(也即上、下背板的连接处)。然后在上背板下端的正面铣掉长为14mm、厚度为PCB厚度一半(即3.25mm)PCB使得在上背板的下端形成一个槽深度为3.25mm的第一限位凹槽,并在第一限位槽的底部形成至少一个贯穿上背板的第一定位孔(或者叫第一安装孔)。在下背板上端的背面铣掉长为14mm、厚度为PCB厚度一半(即3.25mm)PCB使得在下背板的上端正面形成一个厚度为3.25mm的第一凸起;并在第一凸起上形成与上背板上的第一安装孔位置相对应的、且贯穿第一凸起的第二定位孔(或者叫第二安装孔)。装配时,下背板上的第一凸起搭接在上背板的第一限位凹槽内实现上背板和下背板的咬合连接,然后通过同一个定位销穿过上、下背板上的定位孔固定在机架上。之后再将交换/交叉板卡插入上、下背板。Specifically, in the embodiment, the thickness of the upper and lower back plates are both 6.5 mm, and the widths of the upper and lower back plates are the same; in order to ensure the versatility of the size, the present embodiment is additionally based on the existing upper and lower back plates. The extension extends 7 mm, and the 7 mm that grows are respectively at the lower end of the upper back panel and the upper end of the lower back panel (ie, the junction of the upper and lower back panels). Then, a PCB having a length of 14 mm and a thickness of half of the PCB (ie, 3.25 mm) is milled on the front surface of the lower back plate to form a first limit groove having a groove depth of 3.25 mm at the lower end of the upper back plate, and The bottom of a limiting slot forms at least one first positioning hole (or first mounting hole) penetrating the upper backing plate. Cutting a PCB having a length of 14 mm and a thickness of half of the PCB (ie, 3.25 mm) on the back surface of the lower back plate surface to form a first protrusion having a thickness of 3.25 mm on the front surface of the upper end of the lower back plate; and forming on the first protrusion a second positioning hole (or a second mounting hole) corresponding to the position of the first mounting hole on the upper back plate and extending through the first protrusion. During assembly, the first protrusion on the lower back plate overlaps the first limiting groove of the upper back plate to realize the snap connection of the upper back plate and the lower back plate, and then passes through the upper and lower back through the same positioning pin. The positioning holes on the board are fixed to the rack. Then insert the swap/cross board into the upper and lower backplanes.
目前PCB定位孔的位置加工精度可以达到0.0508mm,而大尺寸的背板可以达到0.254mm,此精度远远高于机架的加工精度要求。这样通过本发明实施例的方案,上、下背板的安装对齐无论是在水平方向还是垂直方向都可有效提高精度,从而避免交换/交叉板卡插入背板时损坏交叉板连接器和背板连接器插座。提高了生产效率和产品的可靠性,降低了生产成本和维修成本。 At present, the positional accuracy of the PCB positioning hole can reach 0.0508mm, and the large-sized back plate can reach 0.254mm, which is much higher than the processing precision of the frame. Thus, through the solution of the embodiment of the present invention, the mounting alignment of the upper and lower back plates can effectively improve the accuracy in both the horizontal direction and the vertical direction, thereby avoiding damage to the cross board connector and the back board when the switching/cross board is inserted into the back board. Connector socket. Increased production efficiency and product reliability, reducing production costs and maintenance costs.
以上内容是结合具体的实施方式对本发明所作的进一步详细说明,不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本发明的保护范围。The above is a further detailed description of the present invention in connection with the specific embodiments, and the specific embodiments of the present invention are not limited to the description. It will be apparent to those skilled in the art that the present invention may be made without departing from the spirit and scope of the invention.
工业实用性Industrial applicability
如上所述,通过上述实施例及优选实施方式,上背板和下背板在装配时可通过相互配置的咬合机构连接后再通过同一定位件固定在机架上,可以降低装配误差,避免交换/交叉板卡连接器和背板上的连接器不能精确对准引起连接器插针、插座损坏,进而导致设备功能受损的问题,可在生产中极大提升产品合格率,提高生产效率,降低生产成本。 As described above, according to the above embodiments and the preferred embodiment, the upper back plate and the lower back plate can be connected to each other through the locating mechanism disposed at the same time and then fixed to the frame by the same positioning member, thereby reducing assembly errors and avoiding exchange. /The connector on the cross-board connector and the backplane cannot be precisely aligned, causing damage to the connector pins and sockets, which may result in damage to the function of the device, which can greatly improve the product qualification rate and improve the production efficiency in production. reduce manufacturing cost.

Claims (10)

  1. 一种背板系统,包括上背板和下背板,所述上背板的下端设有第一咬合机构,所述下背板的上端设有第二咬合机构,所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接。A backplane system includes an upper backboard and a lower backboard, wherein a lower end of the upper backboard is provided with a first engaging mechanism, and an upper end of the lower backboard is provided with a second engaging mechanism, the upper backboard and the The back plate is coupled by the first engaging mechanism and the second engaging mechanism.
  2. 如权利要求1所述的背板系统,其中,所述第一咬合机构包括第一限位凹槽,所述第一限位凹槽的槽深度小于所述上背板的厚度;所述第二咬合机构包括设置位置和尺寸与所述第一限位凹槽对应的第一凸台;所述第一凸台扣合到所述第一限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接;The backplane system according to claim 1, wherein the first engaging mechanism comprises a first limiting groove, the groove depth of the first limiting groove is smaller than a thickness of the upper back plate; The second engaging mechanism includes a first boss that is disposed at a position and a size corresponding to the first limiting groove; the first boss is fastened into the first limiting slot to implement the first engaging mechanism and the a bite connection of the second bite mechanism;
    和/或,and / or,
    所述第二咬合机构包括第二限位凹槽,所述第二限位凹槽的槽深度小于所述下背板的厚度;所述第一咬合机构包括位置和尺寸与所述第二限位凹槽对应的第二凸台,所述第二凸台扣合到所述第二限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接。The second engaging mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than the thickness of the lower back plate; the first engaging mechanism includes a position and a size and the second limit a second boss corresponding to the groove, the second boss being fastened into the second limiting groove to realize a snap connection of the first engaging mechanism and the second engaging mechanism.
  3. 如权利要求2所述的背板系统,其中,所述第一咬合机构包括第一限位凹槽时,所述第一限位凹槽设置在所述上背板的正面;所述第二咬合机构包括的第一凸台对应设置在所述下背板的正面;The backplane system according to claim 2, wherein when the first engaging mechanism includes a first limiting groove, the first limiting groove is disposed at a front surface of the upper back plate; The first boss included in the occlusion mechanism is correspondingly disposed on a front surface of the lower back plate;
    所述第二咬合机构包括第二限位凹槽时,所述第二限位凹槽设置在所述下背板的正面;所述第一咬合机构包括的第二凸台对应设置在所述上背板的正面。When the second engaging mechanism includes the second limiting groove, the second limiting groove is disposed on a front surface of the lower back plate; the second protruding portion of the first engaging mechanism is correspondingly disposed on the The front of the upper back panel.
  4. 如权利要求2或3所述的背板系统,其中,所述第一咬合机构包括第一限位凹槽时,所述第二咬合机构包括的第一凸台的厚度小于等于所述第一限位凹槽的深度;The backplane system according to claim 2 or 3, wherein when the first engaging mechanism includes the first limiting groove, the thickness of the first boss included in the second engaging mechanism is less than or equal to the first The depth of the limit groove;
    所述第二咬合机构包括第二限位凹槽时,所述第一咬合机构包括的第二凸台的厚度小于等于所述第二限位凹槽的深度。When the second engaging mechanism includes the second limiting groove, the thickness of the second boss included in the first engaging mechanism is less than or equal to the depth of the second limiting groove.
  5. 如权利要求2或3所述的背板系统,其中,所述第一咬合机构仅包括第一限位凹槽时,所述第一限位凹槽宽度等于所述上背板宽度;所述第二咬合机构对应的仅包括第一凸台,所述第一凸台的宽度等于所述下背板的宽度;The backplane system according to claim 2 or 3, wherein when the first engaging mechanism includes only the first limiting groove, the first limiting groove width is equal to the upper backing plate width; The second engaging mechanism correspondingly includes only the first boss, and the width of the first boss is equal to the width of the lower back plate;
    所述第二咬合机构仅包括第二限位凹槽时,所述第二限位凹槽宽度等于所述下背板宽度;所述第一咬合机构对应的仅包括第二凸台,所述第二凸台的宽度等于所述上背板的宽度。When the second engaging mechanism includes only the second limiting groove, the second limiting groove width is equal to the lower back plate width; the first engaging mechanism correspondingly includes only the second protruding portion, The width of the second boss is equal to the width of the upper back plate.
  6. 如权利要求4所述的背板系统,其中,所述第一咬合机构包括第一限位凹槽时,所述第一限位凹槽的槽深度为所述上背板厚度的二分之一;The backplane system according to claim 4, wherein when the first engaging mechanism comprises the first limiting groove, the groove depth of the first limiting groove is two-half of the thickness of the upper back plate One;
    所述第二咬合机构包括第二限位凹槽时,所述第二限位凹槽的槽深度为所述下背板厚度的二分之一。When the second engaging mechanism includes the second limiting groove, the groove depth of the second limiting groove is one-half of the thickness of the lower back plate.
  7. 一种集中交换设备,包括机架、定位件以及如权利要求1-6任一项所述的背板系统,所述 第一咬合机构和所述第二咬合机构上还分别设有位置相对应的第一定位孔和第二定位孔,所述机架上设有位置与所述第一定位孔和第二定位孔相对应的第三定位孔;所述定位件在所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接后,穿过所述第一定位孔、第二定位孔并与所述机架上的第三定位孔配合将所述上背板和所述下背板固定在所述机架上。A centralized switching device, comprising a rack, a positioning member, and the backplane system according to any one of claims 1-6, The first engaging mechanism and the second engaging mechanism are respectively provided with a first positioning hole and a second positioning hole corresponding to the position, and the frame is provided with a position and the first positioning hole and the second positioning hole Corresponding third positioning holes; the positioning member passes through the first positioning hole after the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism And a second positioning hole and cooperates with a third positioning hole on the frame to fix the upper back plate and the lower back plate on the frame.
  8. 一种背板连接方法,包括:A backplane connection method includes:
    在上背板的下端设置第一咬合机构,在下背板的上端设置第二咬合机构;a first engaging mechanism is disposed at a lower end of the upper back plate, and a second engaging mechanism is disposed at an upper end of the lower back plate;
    将所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接。The upper back plate and the lower back plate are snap-fit connected by the first engaging mechanism and the second engaging mechanism.
  9. 如权利要求8所述的背板连接方法,其中,所述第一咬合机构包括第一限位凹槽,所述第一限位凹槽的槽深度小于所述上背板的厚度;所述第二咬合机构包括设置位置和尺寸与所述第一限位凹槽对应的第一凸台;所述第一凸台扣合到所述第一限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接;The backplane connection method according to claim 8, wherein the first engaging mechanism comprises a first limiting groove, the groove depth of the first limiting groove is smaller than a thickness of the upper back plate; The second engaging mechanism includes a first boss that is disposed at a position and a size corresponding to the first limiting groove; the first boss is fastened into the first limiting slot to implement the first engaging mechanism and a snap connection of the second engaging mechanism;
    和/或,and / or,
    所述第二咬合机构包括第二限位凹槽,所述第二限位凹槽的槽深度小于所述下背板的厚度;所述第一咬合机构包括位置和尺寸与所述第二限位凹槽对应的第二凸台,所述第二凸台扣合到所述第二限位槽中实现所述第一咬合机构和所述第二咬合机构的咬合连接。The second engaging mechanism includes a second limiting groove, the groove depth of the second limiting groove is smaller than the thickness of the lower back plate; the first engaging mechanism includes a position and a size and the second limit a second boss corresponding to the groove, the second boss being fastened into the second limiting groove to realize a snap connection of the first engaging mechanism and the second engaging mechanism.
  10. 一种背板固定方法,包括:A method for fixing a backboard, comprising:
    在上背板的下端设置第一咬合机构,在下背板的上端设置第二咬合机构,并分别在所述第一咬合机构和所述第二咬合机构上设置位置相对应的第一定位孔和第二定位孔;在机架上位置与所述第一定位孔和第二定位孔相对应的第三定位孔;设置定位件;a first engaging mechanism is disposed at a lower end of the upper back plate, a second engaging mechanism is disposed at an upper end of the lower back plate, and a first positioning hole corresponding to the position is disposed on the first engaging mechanism and the second engaging mechanism, respectively a second positioning hole; a third positioning hole corresponding to the first positioning hole and the second positioning hole on the frame; and a positioning member;
    所述定位件在所述上背板和所述下背板通过所述第一咬合机构和所述第二咬合机构咬合连接后,穿过所述第一定位孔、第二定位孔并与所述机架上的第三定位孔配合将所述上背板和所述下背板固定在所述机架上。 The positioning member passes through the first positioning hole, the second positioning hole and the ground after the upper back plate and the lower back plate are engaged by the first engaging mechanism and the second engaging mechanism. A third positioning hole on the frame cooperates to fix the upper back plate and the lower back plate to the frame.
PCT/CN2015/088060 2014-11-19 2015-08-25 Backplane system, centralized exchange equipment and method for backplane connection and fixation WO2016078462A1 (en)

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CN201410665611.8A CN105682352A (en) 2014-11-19 2014-11-19 Backplate system, concentrated switching device and backplate connection and fixing methods

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US20100157546A1 (en) * 2008-12-22 2010-06-24 Reimund James A Connecting a Plurality of Chassis Using a Rigid Connection
CN201699722U (en) * 2010-06-13 2011-01-05 中兴通讯股份有限公司 Splicing back plate
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