WO2016047988A1 - Surface modified boron nitride, composition having same dispersed therein, and wire coated with the composition - Google Patents

Abstract

Provided are a multiple surface modified boron nitride, a composition having same dispersed therein, and a wire coated with the composition. The multiple surface modified boron nitride is provided with: boron nitride particles; a first surface modifier binding to the surface of the boron nitride particles and containing an aromatic group at an end; and a second surface modifier binding to the surface of the boron nitride particles and containing an amine group or an epoxy group at an end.

Description

Surface-modified boron nitride, the composition in which the particles are dispersed, and the wire coated with the composition

The present invention relates to surface modified inorganic particles, and more particularly, to surface modified boron nitride particles, a composition in which the particles are dispersed, and a wire coated with the composition.

Thermally conductive materials are showing an increasing trend in their range of use and usage due to the higher integration of electronic components and products and increased power consumption. Thermally conductive materials, including existing metals, have made great efforts to replace metal composites using materials having high formability and productivity due to low formability and productivity. Therefore, in order to increase the thermal conductivity and injection moldability, it is used to replace a certain portion of the metal by using a composite made of a thermal conductive filler such as ceramic, carbon, and a polymer.

Heat transfer from ceramics to electrical insulators is caused primarily by lattice vibrations by phonons instead of free electrons, and the phonon scattering is induced by thermal resistance, which is related to the presence of a thermal barrier between the matrix and the filler. Therefore, research is being conducted to increase the mobility of phonons by suppressing scattering.

In order to improve the thermal conductivity of nanocomposite-containing polymer composites, the thermally conductive fillers in the matrix can be formed to form a continuous network or large particles can be used to reduce the number of thermal resistance bonds between adjacent filler particles. In order to facilitate the contact between the thermally conductive fillers and the matrix, a filler may be used or a type of filler that reduces the thermal contact resistance between the thermally conductive fillers.

Most polymer materials have low thermal conductivity values of 0.1 ~ 0.3 W / mK, and high crystalline polymers exhibit higher thermal conductivity values than amorphous polymers. Therefore, it is advantageous to select a crystalline polymer as a matrix when manufacturing a thermally conductive composite material, but processing conditions are more difficult than those of an amorphous polymer.

In addition to the above, selecting fillers with various particle size distributions and using polymers with low melt viscosity to improve interfacial adhesion and wettability of the filler and polymer matrix reduces the possibility of void formation in the polymer composites. Although effective in improving the thermal conductivity, there is a problem that is not applied when the compatibility between the polymer and the filler is not good.

Boron nitride having a layered structure is excellent in thermal conductivity, but due to its plate shape, there is a problem that aggregation can occur well with each other, so it is difficult to use as a thermally conductive material.

The problem to be solved by the present invention is to provide a surface-modified boron nitride to improve the dispersibility.

Another object of the present invention is to provide a coating composition containing a surface-modified boron nitride.

Another problem to be solved by the present invention is to provide an electronic component having a coating layer containing a surface-modified boron nitride.

One aspect of the present invention to achieve the above object provides a multi-surface modified boron nitride. It comprises boron nitride particles, a first surface modifier bonded to the surface of the boron nitride particles and containing an aromatic group at the terminal, and a second surface modifier bonded to the surface of the boron nitride particles and containing an amine group or an epoxy group at the terminal. do.

The surface modifiers are silane compounds and may be bonded to the surface of the boron nitride particles by siloxane bonds. The boron nitride particles may be a plate-shaped hexagonal boron nitride.

The aromatic group of the first surface modifier is a phenyl group, an anilinyl group, a benzoyl group, a phenoxy group, a biphenyl group, or a naphthalenyl group. Can be. The first surface modifier is trimethoxyphenylsilane, N- [3- (trimethoxysilyl) propyl] aniline, allylphenyldichlorosilane, aminophenyltrimethoxysilane, t-butylphenyldichlorosilane, p- (t -Butyl) phenethyltrichlorosilane, 3,5-dimethoxyphenyltriethoxysilane, diphenyldiethoxysilane, diphenyldimethoxysilane, diphenylmethylethoxysilane, 3- (p-methoxyphenyl) propyl Trichlorosilane, p-methoxyphenyltrimethoxysilane, phenethylmethyldichlorosilane, phenethyltrimethoxysilane, 3-phenoxypropyldimethylchlorosilane, 3-phenoxypropylmethyldichlorosilane, 3-phenoxypropyltrichloro Rosilane, phenyldimethylchlorosilane, phenyldimethylethoxysilane, phenylethyldichlorosilane, phenylmethyldichlorosilane, 1-phenyl-1- (methyldichlorosilyl) butane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, ( 3-phenylpropyl) trichlorosilane, phenyltrichlorosilane, Phenyltriethoxysilane, phenyltrimethoxysilane, triphenylchlorosilane, triphenylethoxysilane, (triphenylmethyl) methyldichlorosilane, and combinations thereof. The first surface modifier may be N- [3- (trimethoxysilyl) propyl] aniline having an anilinyl group at its terminal.

The amine group of the second surface modifier may be a primary amine group, a secondary amine group, a tertiary amine group, or a diamine group. The second surface modifier is 3- [2- (2-aminoethylamino) ethylamino] propyltrimethoxysilane, N- [3- (trimethoxysilyl) propyl] ethylenediamine, (3-aminopropyl) tri Methoxysilane, and combinations thereof. The second surface modifier may be N- [3- (trimethoxysilyl) propyl] ethylenediamine having a diamine group at its terminal.

The epoxy of the second surface modifier may be an epoxide group, glycidyl group, or glycidyloxy group. The second surface modifier is 3-epoxypropyltrimethoxysilane, 3-epoxypropyltriethoxysilane, 4-epoxybutyltrimethoxysilane, 4-epoxybutyltriethoxysilane, 3-glycidyloxypropyltri Methoxysilane, and combinations thereof. The second surface modifier may be 3-glycidyloxypropyltrimethoxysilane having a glycidyloxy group at the terminal.

A third surface modifier containing an alkyl group at the terminal may be further bonded to the surface of the boron nitride particles.

Another aspect of the present invention to achieve the above object provides a coating composition. The coating composition includes 100 parts by weight of the polymer or polymer precursor, 1 to 80 parts by weight of the multi-surface modified boron nitride as described above, and the balance of the solvent. The polymer precursor is epoxy resin, phenol resin, polyester, polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocyanuate triacrylate) -polyesterimide, polyether It may be selected from the group consisting of mid, polyamide, polyamideimide, polyimide, polyurethane, polyvinyl formal, and combinations thereof.

Another aspect of the present invention to achieve the above object provides a wire. It comprises a conductive wire and a thermally conductive film formed on the conductive wire. The thermally conductive film contains a polymer matrix and a multi-surface modified boron nitride as described above dispersed in the polymer matrix.

The polymer matrix is polyester, polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocyanuate triacrylate) -polyesterimide, polyetherimide, polyamide, poly Amideimide, polyimide, polyurethane, polyvinyl formal, epoxy resin, phenol resin, and combinations thereof.

Between the conductive wire and the thermally conductive film, an internal insulating discharge layer including an organic insulating polymer matrix and an inorganic nanofiller dispersed in the organic insulating polymer matrix may be disposed. The inorganic nanofiller may be selected from the group consisting of silica, titania, alumina, zirconia, yttria, chromium oxide, zinc oxide, iron oxide, clay, and combinations thereof.

The boron nitride particles are plate-shaped particles, and the plate-like surface of the boron nitride particles may face the conductive wire. The plate-like surface of the boron nitride particles and the surface of the conductive wire may be parallel. An angle between the plate surface of the boron nitride particles and the surface of the conductive wire may be smaller than an angle between the plate surface of the boron nitride particles and the waterline perpendicular to the surface of the conductive wire.

According to embodiments of the present invention, the surface modifier occupies the surface of the boron nitride by modifying the surface of the boron nitride by using a surface modifier having an aromatic group at the terminal and a surface modifier having an amine group or an epoxy group at the terminal. By greatly improving the surface occupancy, dispersibility can be greatly improved in the polymer solution or the polymer matrix. In addition, the aromatic group and the amine group or the epoxy group may exhibit strong interaction with the polymer and the solvent in the polymer solution and the polymer in the polymer matrix, and thus dispersibility may be maintained.

1 is a schematic view showing a surface-modified boron nitride according to one embodiment of the present invention.

2A is a schematic view showing a cross section of a wire according to an embodiment of the present invention, and FIG. 2B is an enlarged cross-sectional view of part B of FIG. 2A.

Figure 3a is a photograph of the fracture surface of the boron nitride (20 wt%)-PAI complex according to Experimental Example 1, Figure 3b is a boron nitride (20 wt%)-PAI complex of Comparative Example 2 A photograph of the fracture surface observed with a scanning microscope.

Figure 4a is a photograph of the fracture surface of the boron nitride-epoxy composite according to Experimental Example 2 with a scanning electron microscope, Figure 4b is a photograph of a fracture surface of the boron nitride-epoxy composite according to Comparative Example 7 with a scanning microscope .

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to describe the present invention in more detail. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Like numbers refer to like elements throughout.

In this specification, the fact that a layer is located on another layer may mean that not only are these layers directly in contact, but also another layer (s) between these layers.

Example 1 Boron Nitride Surface-Modified with Multiple Silanes

1 is a schematic view showing a surface-modified boron nitride according to one embodiment of the present invention.

Referring to FIG. 1, the boron nitride particles BN may be amorphous boron nitride, crystalline boron nitride, or a complex thereof. As an example, boron nitride (BN) may be hexagonal boron nitride (hexagonal BN) having a crystal structure similar to graphite. In other words, boron nitride (BN) may have a structure in which hexagonal mesh layers are stacked in multiple layers, or may be made of a single layer, and may be plate-shaped particles. Such plate-like boron nitride (BN) may have a particle diameter of about 0.1 to about 20 μm, specifically 0.3 to about 5 μm, more specifically 0.3 to about 1 μm, and also about 1 nm to about 3 μm, or It may have a particle thickness of about 10 nm to about 500 nm, or about 10 nm to about 200 nm, or about 10 nm to about 100 nm, or about 10 nm to about 30 nm. The particle diameter or the particle thickness may be an average value of several particles. In addition, the plate-like boron nitride (BN) may have a ratio of particle diameter to thickness, that is, an aspect ratio of 1: 10 to 1: 100, specifically 1: 30 to 1: 70. Thus, when using boron nitride (BN) having a large particle diameter with respect to the thickness as a coating layer of the wire to be described later can be more effectively increased thermal conductivity.

In addition, the plate-like boron nitride (BN) has a large surface energy (surface energy) in the side compared to the upper and lower surfaces, that is, the plate-like surface corresponding to the surface of the mesh layer may be low in stability. In other words, such plate-like boron nitride (BN) may have more reaction sites on the side, that is, hydroxyl groups, than the upper and lower sides.

Meanwhile, first and second surface modifiers S ₁ and S ₂ may be provided. In addition, a third surface modifier S ₃ may additionally be provided. The surface modifiers S ₁ , S ₂ , and S ₃ may include a head group, a terminal functional group, and a tail portion connecting the head group and the terminal functional group to the boron nitride. part). The tail portion may be an alkyl group of C1 to C10 (C1, C2, C3, C4, C5, C6, C7, C8, C9, C10), specifically C1 to C6, more specifically C1 to C4. In one embodiment, one or more -CH ₂ -of the alkyl group may be substituted with -NH-. However, the present invention is not limited thereto, and the tail portion may be omitted, particularly when the terminal functional group is an alkyl group.

The surface modifiers S ₁ , S ₂ , S ₃ may each be a silane having a silane group substituted with a silane group, specifically, 1, 2 or 3 substituents as a head group. The substituent (s) of the silane group may be a hydroxyl group, an alkoxy group, a halo group, or a combination thereof. More specifically, the surface modifiers (S ₁ , S ₂ , S ₃ ) are each a headalkoxy silane group, dialkoxy silane group, alkoxy silane group, dialkoxyhalo silane group, alkoxydihalo silane as head group. A group, a trihalo silane group, a dihalosilane group, and a halosilane group can be provided. Here, the alkoxy group may be a methoxy group or an ethoxy group, and the halo group may be a chloro group. Such silane groups react with reaction sites, for example, hydroxyl groups, on the sides rather than on the upper and lower sides of the plate-like boron nitride (BN) to bond with boron nitride (BN), for example, to siloxane bonds. Can be combined.

Each surface modifier (S ₁ , S ₂ , S ₃ ) may have different terminal functional groups.

Specifically, the first surface modifier S ₁ may include an aromatic group R ₁ as a terminal functional group. The aromatic group may be substituted or unsubstituted, and may be a phenyl group, an anilinyl group, a benzoyl group, a phenoxy group, a biphenyl group, or a naphthalene group ( naphthalenyl group). Substituents for the aromatic groups may be C1, C2, C3 or C4 alkyl groups, C1, C2, or C3 alkoxy groups, C2, or C3 allyl groups, amine groups, hydroxyl groups, or halogen groups. In one example, the aromatic group of the first surface modifier (S ₁ ) may be a substituted or unsubstituted ananilinyl group, and further may be an unsubstituted anilinyl group.

The first surface modifier (S ₁ ) having an aromatic group as a terminal functional group is trimethoxyphenylsilane, N- [3- (trimethoxysilyl) propyl] aniline (N- [3- (trimethoxysilyl) propyl aniline), allylphenyldichlorosilane, aminophenyltrimethoxysilane, t-butylphenyldichlorosilane, p- (t-butyl) phenethyltrichlorosilane (p- ( t-butyl) phenethyltrichlorosilane), 3,5-dimethoxyphenyltriethoxysilane, diphenyldiethoxysilane, diphenyldimethoxysilane, diphenylmethylethoxysilane (diphenylmethylethoxysilane), 3- (p-methoxyphenyl) propyltrichlorosilane, 3- (pmethoxyphenyl) propyltrichlorosilane, p-methoxyphenyltrimethoxysilane, phenethylmethyldichlorosilane, Phenethyl tree Methoxysilane (phenethyltrimethoxysilane), 3-phenoxypropyldimethylchlorosilane, 3-phenoxypropylmethyldichlorosilane, 3-phenoxypropyltrichlorosilane, 3-phenoxypropyltrichlorosilane, phenyl Dimethylchlorosilane, phenyldimethylethoxysilane, phenylethyldichlorosilane, phenylmethyldichlorosilane, 1-phenyl-1- (methyldichlorosilyl) butane (1-phenyl-1 -(methyldichlorosilyl) butane), phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, (3-phenylpropyl) trichlorosilane ((3-phenylpropyl) trichlorosilane), phenyltrichlorosilane , Phenyltriethoxysilane, phenyltrimethoxysilane, triphenylchloro Is (triphenylchlorosilane), may be selected from the triphenyl silane (triphenylethoxysilane), (triphenylmethyl) methyl dichlorosilane ((triphenylmethyl) methyldichlorosilane), and the group consisting of the combination of the two.

The second surface modifier (S ₂ ) may have an amine group or an epoxy group (R ₂ ) as the terminal functional group. The amine group (R ₂ ) may be substituted or unsubstituted, but may be a primary amine group, a secondary amine group, a tertiary amine group, or a diamine group, but is not limited thereto. The diamine group may be ethylenediamine, propanediamine, or butanediamine. The second surface modifier (S ₂ ) having an amine group (R ₂ ) is 3- [2- (2-aminoethylamino) ethylamino] propyltrimethoxysilane, N- [3- (trimethoxysilyl) propyl ] Ethylenediamine, (3-aminopropyl) trimethoxysilane, and combinations thereof, but is not limited thereto.

On the other hand, the epoxy group (R ₂ ) may be an epoxide group, glycidyl group, or glycidyloxy group. A first surface modifying agent having an epoxy group such a (R ₂₎ group as a terminal functional (S ₂₎ is, in particular, 3-epoxy-trimethoxysilane, 3-in-epoxypropyl triethoxysilane, 4-epoxy-butyl trimethoxysilane Methoxysilane, 4-epoxybutyltriethoxysilane, 3-glycidyloxypropyltrimethoxysilane, and combinations thereof.

The third surface modifier S ₃ may have an alkyl group R ₃ as a terminal functional group. As described above, in this case, the tail portion may be omitted. The alkyl group (R ₃ ) may be an alkyl group of 1 to C10 (C1, C2, C3, C4, C5, C6, C7, C8, C9, C10), specifically C1 to C6, more specifically C1 to C4 have. Specifically, the third surface modifier (S ₃ ) is ethyltrimethoxysilane, methoxytrimethylsilane, ethoxytrimethylsilane, triethylchlorosilane, trimethylchlorosilane ), Heptyltrimethoxysilane, and combinations thereof.

The surface-modified specifically silane surface-modified boron nitride 35 may include the first to third surface modifiers S ₁ , S ₂ , and S ₃ , that is, the first silane, the second silane, and the third silane. Additional surface modifiers For example, silanes may be chemically bonded to the surface of the boron nitride (BN), but is not limited thereto. The surface-modified boron nitride 35 may be powder, gel, or liquid, but is not limited thereto.

The surface of an aromatic group (R ₁₎ in the modified boron nitride (35) at least a first surface modifier of the pair comprising a group-terminal function (S ₁₎ an amine group or between the epoxy group (R ₂₎ to the terminal functional group At least one second surface modifier (S ₂ ) provided as may be disposed. In addition, the first surface-modifying agent (S ₁₎ and the second surface modifier third surface modifying agent (S ₃₎ having an alkyl group (R ₃₎ between (S ₂₎ as the group terminal function may be disposed. The terminal functional groups are smaller in order of aromatic group, amine group or epoxy group, and alkyl group. As such, surface modifiers having relatively small terminal functional groups may be disposed between surface modifiers having relatively large terminal functional groups.

The method of surface modifying boron nitride using a multiple surface modifier may be as follows.

First, the boron nitride powder may be mixed in a solvent to form a mixed solution. Ultrasonic waves may be added to the mixed solution. In this case, the boron nitride (BN) can be peeled off, i.e., layered, to have a thinner thickness, and can also generate more reaction sites (ex. -OH) on the surface, especially the side, of the boron nitride (BN). .

Thereafter, after the first silane (S ₁ ) containing the aromatic group (R ₁ ) is added to the mixed solution, ultrasonic waves may be added thereto. In this process, the boron nitride (BN) may be further exfoliated and may have more reaction sites, and at the same time, may be bonded to the first silane (S ₁ ) by a siloxane bond. As a result, boron nitride (BN) surface-modified by the first silane (S ₁ ) can be obtained.

In the dispersion in which the boron nitride (BN) surface-modified by the first silane (S ₁ ) is dispersed, a second silane (S ₂ ) containing an amine group or an epoxy group (R ₂ ) may be added and ultrasonic waves may be added. In this process as well, the boron nitride (BN) may be further peeled off and may have more reaction sites, and may be bonded to the second silane (S ₂ ) by siloxane bonds. As a result, the boron nitride 35 surface-modified by the first silane S ₁ and the second silane S ₂ may be obtained.

When the third silane (S ₃ ) is added to the same process again, the boron nitride 35 surface-modified by the first to third silanes (S ₁ , S ₂ , S ₃ ) can be obtained.

Thereafter, the surface-modified boron nitride 35 dispersed in the solvent may be filtered and washed to remove the unreacted silane. In addition, the washed solid may be dried to obtain a boron nitride powder surface modified by multiple silanes. However, the present invention is not limited thereto, and the silane surface-modified boron nitride 35 may be obtained in a sol form, a gel form, or a liquid phase dispersed in a solvent phase.

On the other hand, the terminal functional group of the first silane (S ₁ ), that is, the aromatic group (R ₁ ) is larger than the terminal functional group of the second silane (S ₂ ), that is, the amine group or the epoxy group (R ₂ ). Thus, the first silane (S ₁ ) on the surface of the boron nitride may be somewhat sparsely coupled. Then, the first silane to the second silane (S ₂₎ having a small terminal features compared to (S _1), the first can be easily accessed and coupled to remaining reactive sites between the silane of (S _1). Likewise, the terminal functional group of the third silane (S ₃ ), that is, the alkyl group (R ₃ ) is smaller than those of the first silane (S ₁ ) and the second silane (S ₂ ) (R ₁ , R ₂ ). . Thus, the third silane S ₃ can be easily accessed and coupled to the remaining reaction site between the first silanes S ₁ and the second silane S ₂ . As such, different types of silanes having different sized terminal functional groups are used, but silanes having larger sized functional groups are first reacted with boron nitride or at the same time having smaller sized functional groups. to the silane reacted with the boron nitride as a boron nitride-modified surface, at least a pair of a first silane having an aromatic group (R ₁₎ as the group terminal function in the surface-modified boron nitride (35) (s ₁ At least one second silane (S ₂ ) having an amine group or an epoxy group (R ₂ ) as a terminal functional group may be disposed between the). In addition, a third silane (S ₃ ) having an alkyl group (R ₃ ) as a terminal functional group may be disposed between the first silane (S ₁ ) and the second silane (S ₂ ). in this case, The surface coverage occupied by silane on the surface of boron nitride can be greatly improved. As such, boron nitride having an improved surface occupancy by silane may exhibit greatly improved dispersibility with respect to a polymer solution or a polymer matrix described later.

The solvent may be a polar solvent, for example, toluene, xylene, ethanol, methanol, cresol, water, acetone, cyclohexane, phenol, N-methylpyrolidone (NMP), glycol ether, N, N-dimethylformamide (N, N-Dimethylformamide, DMF), and combinations thereof may be included, but is not limited thereto.

The process of irradiating the ultrasonic wave, that is, the ultrasonic wave treatment, may have an advantage of shortening the time required compared to the surface treatment process performed using only the heat and the solvent of the prior art, but is not limited thereto. For example, the surface treatment time required to secure surface coverage showing satisfactory dispersibility with respect to the polymer solution or the polymer matrix can be shortened through the sonication. For example, if the conventional heat treatment takes about 9 days, the bath ultrasonic treatment may take about 3 days, and in the case of horn ultrasonic treatment, the surface treatment may be performed. The time required can be dramatically shortened to about 3.5 hours.

Second Embodiment A coating composition in which boron nitride is surface-modified with multiple silanes

According to another embodiment of the present invention, the coating composition in which the surface-modified boron nitride is dispersed in multiple silanes may include 100 parts by weight of a polymer or polymer precursor, 1 to 200 parts by weight of surface-modified boron nitride, and the balance of It may include a solvent. The boron nitride may be surface-modified with the first and second silanes, additionally with the third silane, as described in the first embodiment. For example, 1 to 80 parts by weight, 10 to 70 parts by weight, and 10 to 50 parts by weight. 20 to 30 parts by weight, 20 to 60 parts by weight, or 30 to 50 parts by weight.

The polymer precursor may be a polymerizable material and may be a monomer, an oligomer having a few to several tens of monomers, or a prepolymer. As an example, the polymer precursor may be a prepolymer, wherein the prepolymer is polyester (ex. Polyethylene terephthalate), polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocy Anuate triacrylate) -polyesterimide, polyetherimide, polyamide, polyamideimide, polyimide, polyurethane, polyvinyl formal, epoxy resin, phenolic resin, and combinations thereof It may include, but is not limited thereto. The polymer precursor may include an aromatic group, an epoxy group, or a combination thereof in the main chain thereof.

In one example, the prepolymer may be a polyesterimide represented by the following formula (1).

 [Formula 1]

In Formula 1, n is 2 to 99, m is an integer of 1 to 4.

In one example, the prepolymer may be a polyamideimide represented by the following formula (2).

 [Formula 2]

In Formula 2, n is an integer of 2 to 99.

The solvent is a group consisting of toluene, xylene, ethanol, methanol, cresol, water, acetone, cyclohexane, phenol, N-methylpyrrolidone, glycol ether, N, N-dimethylformamide, and combinations thereof. It may include, but is not limited to selected from. For example, the solvent may further include, but is not limited to, a diluent used to dilute the composition.

The mixture of the polymer precursor and the solvent may be a varnish. 'Varnish' means a paint forming a coating film.

For example, the method of preparing the composition may be formed by adding the surface-modified boron nitride to the mixture of the polymer precursor and the solvent, and additionally irradiating ultrasonic waves.

In such compositions, boron nitride surface modified with the first and second silanes, additionally with the third silane, may exhibit high dispersibility in the composition due to the high surface occupancy of the silane modifiers. In addition, the aromatic group, which is the terminal functional group of the first silane, may exhibit strong interaction with the polymer precursor, particularly the polymer precursor having the aromatic group, and also due to the amine group, which is the terminal functional group of the second silane, the solvent, for example, N- Strong interactions can also be shown for solvents with amine groups such as methylpyrrolidone. As a result, the dispersibility of the boron nitride surface-modified with the multiple silanes in the composition can be further improved.

multiple With silane  surface Modified Boron nitride  Enameled wire with dispersed polymer coating layer

2A is a schematic view showing a cross section of a wire according to an embodiment of the present invention, and FIG. 2B is an enlarged cross-sectional view of part B of FIG. 2A. Such wires may also be called enameled wires.

2A and 2B, a conductive wire 10 is provided. The conductive wire 10 may be, for example, one selected from the group consisting of copper, aluminum, nickel, gold, silver, and combinations thereof, but is not limited thereto. The conductive wire 10 may have a circular cross section, a rectangular type, or a flat type, but is not limited thereto.

An internally dischargeable layer 20 that is resistant to partial discharge may be coated on the conductive wire 10. The internally dischargeable layer 20 may be an organic insulating polymer layer or may include an organic insulating polymer matrix and an inorganic nanofiller 25 dispersed therein.

The organic insulating polymer is polyester, polyester imide, polyester amide, polyester amide imide, (tri (2-hydroxy ethyl) isocyanuate triacrylate)-polyester imide, poly ether imide, polyamide , Polyamideimide, polyimide, polyurethane, polyvinyl formal, and combinations thereof may be included, but is not limited thereto.

The inorganic nanofiller 25 may include one selected from the group consisting of silica, titania, alumina, zirconia, yttria, chromium oxide, zinc oxide, iron oxide, clay, and combinations thereof, but is not limited thereto. It is not. For example, the silica may be fumed silica, but may be fused silica, precipitated silica, silica prepared by a sol-gel method, or colloidal silica, but is not limited thereto. For example, the titania may be fumed titania, but may be molten titania, precipitated titania, titania produced by the sol-gel method, or colloidal titania, but is not limited thereto. For example, the alumina may be fumed alumina, fused alumina, precipitated alumina, alumina prepared by the sol-gel method, or colloidal alumina, but is not limited thereto.

The inorganic nanofiller 25 may also be surface modified by a silane modifier. Specifically, the surface of the inorganic nanofiller 25 is a surface-modified chemical bond between the first silane containing an aromatic group as the terminal functional group and the second silane containing an amine group as the terminal functional group. Can be. The first silane containing an aromatic group and the second silane containing an amine group may be similar to those described in the first embodiment.

The content of the inorganic nanofiller 25 surface-modified with silane in the internal discharge layer 20 is about 0.1 wt% to about 30 wt%, about 0.1 wt% to about 5 wt%, about 0.1 wt% to about 10 Wt%, about 0.1 wt% to about 20 wt%, about 0.1 wt% to about 30 wt%, about 5 wt% to about 10 wt%, about 5 wt% to about 20 wt%, about 5 wt% to about 30 Weight percent, about 10 weight percent to about 20 weight percent, about 10 weight percent to about 30 weight percent, or about 20 weight percent to about 30 weight percent.

The thickness of the internal discharge layer 20 may be 10 μm to 45 μm. However, the present invention is not limited thereto, and all thicknesses commonly applied in the art may be applied.

The thermal conductive layer 30 may be disposed on the internally discharged conductive layer 20. However, the present invention is not limited thereto, and in this case, the internal discharge layer 20 may be omitted. When the thermal conductive layer 30 is disposed on the internally conductive discharge layer 20, the thickness of the thermal conductive layer 30 may be 5 to 10 μm. However, when the internally discharged conductive layer 20 is omitted, the thickness of the thermally conductive layer 30 may be 20 to 50 μm.

The thermal conductive layer 30 is composed of the composition described in the second embodiment, that is, the boron nitride 35 surface-modified with the first and second silanes described in the first embodiment, additionally with the third silane, the polymer precursor, And it can be prepared by coating a composition comprising the remainder of the solvent on the conductive wire 10, then drying and curing. In the coating process, after applying the composition on the conductive wire 10, the composition is uniformly coated on the conductive wire 10 by using a die (hollow cylindrical tool, dies). can do.

The thermal conductive layer 30 may include a polymer matrix cured by the polymer precursor in the curing process and boron nitride 35 surface-modified by multiple silanes dispersed in the polymer matrix. The drying and curing steps may be performed at the same time. Specifically, rapid drying of the solvent and the curing may be simultaneously performed by applying strong heat of about 350 ° C to about 550 ° C. However, it is not limited thereto.

The polymer matrix is polyester, polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocyanuate triacrylate) -polyesterimide, polyetherimide, polyamide, poly Amideimide, polyimide, polyurethane, polyvinyl formal, epoxy resin, phenolic resin, and combinations thereof may be included, but is not limited thereto.

The surface-modified boron nitride 35 has a surface modified by two or more silanes, and the first silane includes a first silane containing an aromatic group as a terminal functional group and a second containing an amine group or an epoxy group as a terminal functional group. The chemical bond with the silane may be specifically surface modified by a siloxane bond. The first silane containing an aromatic group and the second silane containing an amine group or an epoxy group may be similar to those described in the first embodiment. With regard to the surface-modified boron nitride 35, reference is made to the first embodiment.

The content of boron nitride surface-modified with multiple silanes in the thermally conductive layer 30 is about 0.1 wt% to about 60 wt%, about 0.1 wt% to about 30 wt%, about 0.1 wt% to about 5 wt% , About 0.1 wt% to about 10 wt%, about 0.1 wt% to about 20 wt%, about 0.1 wt% to about 30 wt%, about 5 wt% to about 10 wt%, about 5 wt% to about 20 wt% , About 5 wt% to about 30 wt%, about 10 wt% to about 20 wt%, about 10 wt% to about 30 wt%, or about 20 wt% to about 30 wt%, but is not limited thereto. .

The thickness of the thermal conductive layer 30 may be larger than the thickness of the boron nitride 35. As described above, the boron nitride 35 may have a hexagonal mesh layer or a structure in which a plurality of mesh layers are stacked. In other words, the boron nitride 35 may be a plate-shaped particle having one or two or more laminated plates, one of the upper and lower surfaces corresponding to the surface of the mesh layer of the boron nitride 35 being the conductive wire 10. It may be arranged to look at the surface of). In other words, the angle θ ₁ of the plate-like surface of the boron nitride 35 with the surface of the conductive wire 10 is such that the plate-shaped surface of the boron nitride 35 is perpendicular to the surface of the conductive wire 10. It may be smaller than the angle θ ₂ with the waterline. In this case, the boron nitride 35 may have an arrangement lying in the thermal conductive layer 30, so that the overlap between the boron nitrides 35 may be improved, thereby increasing thermal conductivity. Furthermore, the plate-like surface of the boron nitride 35 may be disposed in parallel with the surface of the conductive wire 10.

On the other hand, in the step of drying and curing the coating layer, the dispersibility of the boron nitride 35 may be reduced by the rapid thermal movement around the heat generated by the heat, but the boron nitride 35 surface-modified by multiple silane is As described above, since the aromatic group is retained on its surface, the polymer matrix having the aromatic group can be strongly interacted by π-π interaction, so that high dispersibility can be maintained even in this case.

enamel wire  coil

As described above, the coil may be manufactured by winding the wire on which the internal discharge layer 20, the thermal conductive layer 30, or the thermal conductive layer 30 are formed on a bobbin.

The coil may then be heat treated, for example at a temperature of about 150 ° C. to 250 ° C. At this time, the surfaces of the wire may be fused to each other to remove the air layer between the wires. Specifically, in the heat treatment process, the polymer matrix in the thermal conductive layer 30 may be wound and fused to each other between adjacent wires. To this end, the melting point of the polymer matrix may be selected to adjust the heat treatment temperature or to select a polymer constituting the polymer matrix to have a lower value than the heat treatment temperature.

Hereinafter, preferred examples are provided to aid the understanding of the present invention. However, the following experimental examples are only for helping understanding of the present invention, and the present invention is not limited to the following experimental examples.

[Experimental Examples; Examples]

Silane  surface Modified Boron nitride and  Polyamideimide Composite Preparation

Experimental Example 1 Preparation of Boron Nitride and PAI Composite Surface-Modified with PN and DN

In a 1 L glass bottle, 600 ml of N, N-dimethylformamide (N, N-Dimethylmethanamide, hereinafter referred to as 'DMF') and 30 g of hexagonal boron nitride are placed and a stirrer is used at a temperature of 25 ° C. bar) to form a mixture for 30 minutes. Thereafter, the mixed solution was placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 25 ° C. for 2 hours to remove hexagonal boron nitride.

Thereafter, 3.21 g of N- [3- (trimethoxysilyl) propyl] aniline (hereinafter referred to as 'PN') was added to the mixed solution in a mixed sonicator. Positioning and applying 200 watts of ultrasonic waves at a temperature of 70 ° C. for 3 hours to obtain a PN surface modified hexagonal boron nitride-DMF mixture.

3.084 g of N- [3- (trimethoxysilyl) propyl] ethylenediamine (hereinafter referred to as 'DN') was added thereto, placed in a horn sonicator at 70 ° C. An ultrasonic wave of 200 watts was applied under the temperature for 3 hours to obtain a hexagonal boron nitride-DMF mixed solution surface-modified with PN and DN.

The resultant was poured into a glass filter funnel and the solids on the filter were sprayed three or more times with DMF and N-methyl-2-pyrrolidone (hereinafter referred to as 'NMP') to wash the solids. Unreacted silane was removed. The washed solid was placed in a hot air oven and dried at 120 ° C. for 24 hours to obtain a powder of hexagonal boron nitride surface-modified with PN and DN.

Subsequently, in a NMP solution in which polyamideimide (hereinafter referred to as 'PAI') is dispersed at 33 wt%, hexagonal boron nitride surface-modified with PN and DN is compared with the sum of the weights of PAI and hexagonal boron nitride surface-modified. The surface-modified hexagonal boron nitride was added to have a content of 20wt% or 60wt% (25 parts by weight or 150 parts by weight of surface-modified hexagonal boron nitride relative to 100 parts by weight of PAI). Thereafter, placed in a bath sonicator and applied 100 watts of ultrasonic waves for 30 minutes, Molded in a teflon mold. The molded mixture was cured in a hot air oven at 240 ° C. for 240 minutes to obtain a composite of boron nitride and polyamideimide surface-modified with pellet PN and DN.

Comparative Example 1: Preparation of PAI Sample without Boron Nitride

The NMP solution in which PAI was dispersed at 33wt% was molded in a Teflon mold, and then cured in a hot air oven at 240 ° C. for 240 minutes to obtain PAI pellets.

Comparative Example 2 Preparation of Surface-Mounted Boron Nitride and PAI Composite

20 wt% or 60 wt% of hexagonal boron nitride with respect to the sum of the weights of PAI and hexagonal boron nitride in an NMP solution in which surface-modified hexagonal boron nitride is dispersed in 33 wt% of PAI (with respect to 100 parts by weight of PAI Hexagonal boron nitride was added to have 25 parts by weight or 150 parts by weight) and then molded in a Teflon mold. The molded mixture was cured in a hot air oven at 240 ° C. for 240 minutes to obtain a composite of surface-modified boron nitride and PAI in pellet form.

Comparative Example 3 Preparation of Boron Nitride and PAI Composite Surface-Modified with TE

600 ml of DMF and 30 g of hexagonal boron nitride were placed in a 1 L glass bottle, and a mixed solution was formed for 30 minutes using a stub bar at a temperature of 25 ° C. Thereafter, the mixed solution was placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 25 ° C. for 2 hours to remove boron nitride boron nitride. Thereafter, 3.21 g of TE was added to the mixed solution, placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 70 ° C. for 3 hours to obtain a hexagonal boron nitride-DMF mixture surface-modified with TE.

The resultant was poured into a glass filter funnel and then the solids on the filter were sprayed three or more times with DMF and NMP to wash the solids, thereby removing unreacted silane. The washed solid was placed in a hot air oven and dried at 120 ° C. for 24 hours to obtain a powder of hexagonal boron nitride surface-modified with TE.

Subsequently, 20 wt% or 60 wt% of the hexagonal boron nitride surface-modified with TE was added to the NMP solution in which PAI was dispersed at 33 wt%, and the surface-modified hexagonal boron nitride was compared with the sum of the weights of PAI and the surface-modified hexagonal boron nitride. It was added to have a content of% (25 parts by weight or 150 parts by weight of hexagonal boron nitride surface-modified relative to 100 parts by weight of PAI). After that, it was placed in the bath sonicator and the ultrasonic wave of 100 watts was applied for 30 minutes, Molded in a teflon mold. The molded mixture was cured in a hot air oven at 240 ° C. for 240 minutes to obtain a composite of boron nitride and polyamideimide surface-modified with TE in pellet form.

Comparative Example 4 Preparation of Boron Nitride and PAI Composite Surface-Modified with PN

Except for using 3.21 g of PN instead of TE, using the same method as in Comparative Example 3 to obtain a composite of the surface-modified boron nitride and PAI with PN in the form of pellets.

Comparative Example 5 Preparation of Boron Nitride and PAI Composite Modified with DN>

Except for using 3.21 g of DN instead of TE, using the same method as in Comparative Example 3, a complex of boron nitride and PAI surface-modified with DN in the form of pellets was obtained.

Table 1 below shows the thermal conductivity of boron nitride-PAI composite pellets or PAI pellets according to Experimental Examples 1 and Comparative Examples 1 to 5. At this time, the thermal conductivity was measured using a laser flash method.

	Contains boron nitride	Boron Nitride Surface Modifier Type	Thermal conductivity (W / mK), (Boron nitride content: 20wt%)	Thermal Conductivity (W / mK), (Boron Nitride Content: 60wt%)
Experimental Example 1	○	PN & DN	0.64	2.56
Comparative Example 1	-		0.30
Comparative Example 2	○	-	0.44	0.99
Comparative Example 3	○	TE	0.57	1.97
Comparative Example 4	○	PN	0.57	2.10
Comparative Example 5	○	DN	0.61	2.17
PN: N- [3-trimethoxysilyl) propyl] anilineTE: (3-glycidyloxypropyl) trimethoxysilaneDN: N- [3- (trimethoxysilyl) propyl] ethylenediaminePAI: Polyamide-imide

Referring to Table 1 above, specifically, the boron nitride-PAI complex according to Experimental Example 1, which is surface modified with silane (DN) having an amine group as a terminal functional group and silane (PN) having a phenyl group as a terminal functional group, It does not contain boron nitride (Comparative Example 1), boron nitride is not surface modified (Comparative Example 2), or boron nitride is modified with one type of silane (Comparative Example 3, Comparative Example 4, Comparative Example 5). It can be seen that the increase in thermal conductivity is superior to the case.

3a is a photograph of the fracture surface of the boron nitride-PAI complex according to Experimental Example 1, and FIG. 3b is a photograph of the fracture surface of the boron nitride-PAI complex according to Comparative Example 2 .

3A and 3B, the boron nitride-PAI composite containing the surface-modified boron nitride (Comparative Example 2, FIG. 3B) is a PAI resin with voids between boron nitrides as boron nitride is not completely dispersed. It can be seen that it is not filled by. On the other hand, the boron nitride-PAI composite (FIG. 3A) according to Experimental Example 1 surface-modified with a silane (DN) having an amine group as a terminal functional group and a silane (PN) having a phenyl group as a terminal functional group (FIG. 3A) has almost no porosity. It can be seen that.

From the results according to FIGS. 3A and 3B and Table 1, boron nitride surface-modified with a silane (DN) having an amine group as a terminal functional group and a silane (PN) having a phenyl group as a terminal functional group is present in the PAI matrix. It can be seen that the degree of dispersion is better than the other cases.

Silane  surface Modified Boron nitride and  Epoxy Resin Composite

Experimental Example 2 Preparation of Boron Nitride and Epoxy Composite Modified with PN and DN

600 ml of DMF and 30 g of hexagonal boron nitride were placed in a 1 L glass bottle, and a mixed solution was formed for 30 minutes using a stirrer bar at a temperature of 25 ° C. Thereafter, the mixed solution was placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 25 ° C. for 2 hours to remove hexagonal boron nitride. Thereafter, 3.21 g of PN was added to the mixed solution, placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 70 ° C. for 3 hours to obtain a PN surface-modified hexagonal boron nitride-DMF mixed solution.

In addition, 3.084 g of DN was added and placed in the horn sonicator, and the temperature was 200 watts at 70 ° C. Ultrasonic waves were added for 3 hours to obtain hexagonal boron nitride-DMF mixtures surface-modified with PN and DN.

The resultant was poured into a glass filter funnel and then the solids on the filter were sprayed three or more times with DMF and NMP to wash the solids, thereby removing unreacted silane. The washed solid was placed in a hot air oven and dried at 120 ° C. for 24 hours to obtain a powder of hexagonal boron nitride surface-modified with PN and DN.

Thereafter, YD-128 epoxy (Kukdo Chemical Co., Ltd.) and Jeffoxy (Huntsman Co., Ltd.), a polyoxyalkyleneamine-based curing agent, were mixed at a ratio of 5: 3, and then 20wt of hexagonal boron nitride surface-modified with PN and DN. The mixture was added at a concentration of% (25 parts by weight of surface-modified hexagonal boron nitride with respect to 100 parts by weight of the weight of YD-128 epoxy and zephamine) and mixed evenly. The mixture was poured into a Teflon mold and cured in a hot air oven for 130 ° C. for 60 minutes to obtain a composite of boron nitride and epoxy surface-modified with PN and DN in pellet form.

Comparative Example 6: Preparation of Epoxy Sample Without Boron Nitride

A mixture of YD-128 epoxy (Kukdo Chemical Co., Ltd.) and Jeffamine (Huntsman Co., Ltd.) in a ratio of 5: 3 was molded in a Teflon mold, and then cured in a hot air oven at 130 ° C. for 60 minutes to obtain epoxy pellets. .

Comparative Example 7: Preparation of Surface Modified Boron Nitride and Epoxy Composite

20wt% concentration (YD-128 epoxy and Jeff) in a mixed solution of unmodified hexagonal boron nitride and YD-128 epoxy (Kukdo Chemical Co., Ltd.) and Jeffamine (Huntsman Co., Ltd.) in a ratio of 5: 3. 25 parts by weight of hexagonal boron nitride) was added to 100 parts by weight of the amine, followed by molding in a Teflon mold. The molded mixture was cured in a hot air oven at 130 ° C. for 60 minutes to obtain a surface-modified boron nitride and epoxy composite in pellet form.

Comparative Example 8 Preparation of Boron Nitride and Epoxy Composite Modified with PN

 600 ml of DMF and 30 g of hexagonal boron nitride were placed in a 1 L glass bottle, and a mixed solution was formed for 30 minutes using a stub bar at a temperature of 25 ° C. Thereafter, the mixed solution was placed in a horn sonicator, and 200 watts of ultrasonic waves were applied at a temperature of 25 ° C. for 2 hours to remove hexagonal boron nitride. Thereafter, 3.21 g of PN was added to the mixed solution, placed in a horn sonicator, and 200 watts of ultrasonic waves were applied for 3 hours at a temperature of 70 ° C. to obtain a hexagonal boron nitride-DMF mixture surface-modified with PN.

The resultant was poured into a glass filter funnel and then the solids on the filter were sprayed three or more times with DMF and NMP to wash the solids, thereby removing unreacted silane. The washed solid was placed in a hot air oven and dried at 120 ° C. for 24 hours to obtain a powder of hexagonal boron nitride surface-modified with PN.

Thereafter, a concentration of 20wt% (YD-) was added to a mixed solution of hexagonal boron nitride surface-modified with PN and YD-128 epoxy (Kukdo Chemical Co., Ltd.) and Jeffamine (Huntsman Co., Ltd.) in a ratio of 5: 3. 128 parts by weight of a surface modified hexagonal boron nitride) was added to 100 parts by weight of the epoxy and zephamine), and then molded in a Teflon mold. The molded mixture was cured in a hot air oven at 130 ° C. for 60 minutes to obtain a composite of boron nitride and epoxy surface-modified with PN in pellet form.

Table 2 below shows the thermal conductivity of boron nitride-epoxy composite pellets or epoxy pellets according to Experimental Example 2 and Comparative Examples 6 to 8. At this time, the thermal conductivity was measured using a laser flash method.

	Contains boron nitride	Boron Nitride Surface Modifier Type	Thermal conductivity (W / mK), (Boron nitride content: 20wt%)
Experimental Example 2	○	PN & DN	0.48
Comparative Example 6	-	-	0.21
Comparative Example 7	○	-	0.42
Comparative Example 8	○	PN	0.46
PN: N- [3-trimethoxysilyl) propyl] anilineDN: N- [3- (trimethoxysilyl) propyl] ethylenediamine

Referring to Table 2 above, the boron nitride-epoxy complex according to Experimental Example 2, which is surface-modified with silane (DN) having an amine group as a terminal functional group and a silane (PN) having a phenyl group as a terminal functional group, The increase in thermal conductivity compared to the case of not containing boron nitride (Comparative Example 6), boron nitride not surface modified (Comparative Example 7), or boron nitride modified with one type of silane (Comparative Example 8) It can be seen that it is excellent.

Figure 4a is a photograph of the fracture surface of the boron nitride-epoxy composite according to Experimental Example 2 with a scanning electron microscope, Figure 4b is a photograph of a fracture surface of the boron nitride-epoxy composite according to Comparative Example 7 with a scanning microscope .

4A and 4B, the boron nitride-epoxy composite containing the surface-modified boron nitride (Comparative Example 7, FIG. 4B) has an epoxy resin with voids between the boron nitrides as boron nitride is not completely dispersed. It can be seen that it is not filled by. On the other hand, the boron nitride-epoxy composite according to Experimental Example 2 surface-modified with a silane (DN) having an amine group as a terminal functional group and a silane (PN) having a phenyl group as a terminal functional group (FIG. 4A) has a fracture surface with little voids. It can be seen that.

From the results according to FIGS. 4A and 4B and Table 2, boron nitride surface-modified with a silane (DN) having an amine group as a terminal functional group and a silane (PN) having a phenyl group as a terminal functional group is obtained in the epoxy matrix. It can be seen that the degree of dispersion is better than the other cases.

In the above, the present invention has been described in detail with reference to preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications and changes by those skilled in the art within the spirit and scope of the present invention. This is possible.

Claims (23)

1. Boron nitride particles;

   A first surface modifier bonded to the surface of the boron nitride particles and containing an aromatic group at the terminal; And

   A multi-surface modified boron nitride bonded to the surface of the boron nitride particles and comprising a second surface modifier containing an amine group or an epoxy group at the terminal.
2. The method of claim 1,

   And the surface modifiers are silane compounds, the multi-surface modified boron nitride bonded to the surface of the boron nitride particles by siloxane bonds.
3. The method of claim 1,

   The boron nitride particles are plate-shaped hexagonal boron nitride multi-surface modified boron nitride.
4. The method of claim 1,

   The aromatic group of the first surface modifier is a phenyl group, an anilinyl group, a benzoyl group, a phenoxy group, a biphenyl group, or a naphthalenyl group. Multi-surface modified boron nitride.
5. The method of claim 4, wherein

   The first surface modifier is trimethoxyphenylsilane, N- [3- (trimethoxysilyl) propyl] aniline, allylphenyldichlorosilane, aminophenyltrimethoxysilane, t-butylphenyldichlorosilane, p- (t -Butyl) phenethyltrichlorosilane, 3,5-dimethoxyphenyltriethoxysilane, diphenyldiethoxysilane, diphenyldimethoxysilane, diphenylmethylethoxysilane, 3- (p-methoxyphenyl) propyl Trichlorosilane, p-methoxyphenyltrimethoxysilane, phenethylmethyldichlorosilane, phenethyltrimethoxysilane, 3-phenoxypropyldimethylchlorosilane, 3-phenoxypropylmethyldichlorosilane, 3-phenoxypropyltrichloro Rosilane, phenyldimethylchlorosilane, phenyldimethylethoxysilane, phenylethyldichlorosilane, phenylmethyldichlorosilane, 1-phenyl-1- (methyldichlorosilyl) butane, phenylmethyldimethoxysilane, phenylmethyldiethoxysilane, ( 3-phenylpropyl) trichlorosilane, phenyltrichlorosilane, Multi-surface modified nitrides selected from the group consisting of phenyltriethoxysilane, phenyltrimethoxysilane, triphenylchlorosilane, triphenylethoxysilane, (triphenylmethyl) methyldichlorosilane, and combinations thereof boron.
6. The method of claim 1,

   Wherein said first surface modifier is N- [3- (trimethoxysilyl) propyl] aniline having an anilinyl group at its terminus.
7. The method of claim 1,

   Wherein the amine group of the second surface modifier is a primary amine group, a secondary amine group, a tertiary amine group, or a diamine group.
8. The method of claim 7, wherein

   The second surface modifier is 3- [2- (2-aminoethylamino) ethylamino] propyltrimethoxysilane, N- [3- (trimethoxysilyl) propyl] ethylenediamine, (3-aminopropyl) tri The multi-surface modified boron nitride selected from the group consisting of methoxysilane, and combinations thereof.
9. The method of claim 1,

   Wherein said second surface modifier is N- [3- (trimethoxysilyl) propyl] ethylenediamine having a diamine group at its end.
10. The method of claim 1,

    And the epoxy of the second surface modifier is an epoxide group, glycidyl group, or glycidyloxy group.
11. The method of claim 10,

    The second surface modifier is 3-epoxypropyltrimethoxysilane, 3-epoxypropyltriethoxysilane, 4-epoxybutyltrimethoxysilane, 4-epoxybutyltriethoxysilane, 3-glycidyloxypropyltrimeth The multi-surface modified boron nitride selected from the group consisting of oxysilane, and combinations thereof.
12. The method of claim 11,

    Wherein said second surface modifier is 3-glycidyloxypropyltrimethoxysilane having a glycidyloxy group at its terminus.
13. The method of claim 1,

    The multi-surface modified boron nitride further comprises a third surface modifier bonded to the surface of the boron nitride particles and containing an alkyl group at the end.
14. A coating composition comprising 100 parts by weight of a polymer precursor, 1 to 80 parts by weight of the multi-surface modified boron nitride according to any one of claims 1 to 13, and a balance of a solvent.
15. The method of claim 14,

    The polymer precursor is polyester, polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocyanuate triacrylate) -polyesterimide, polyetherimide, polyamide, poly A coating composition selected from the group consisting of amideimide, polyimide, polyurethane, polyvinyl formal, epoxy resin, phenol resin, and combinations thereof.
16. Conductive wires; And

    A thermally conductive film formed on the conductive wire and containing a polymer matrix and a multi-surface modified boron nitride dispersed in the polymer matrix,

    The multi-surface modified boron nitride is

    Boron nitride particles; A first surface modifier bonded to the surface of the boron nitride particles and containing an aromatic group at the terminal; And a second surface modifier bonded to the surface of the boron nitride particles and containing an amine group or an epoxy group at an end thereof.
17. The method of claim 16,

    The polymer matrix is polyester, polyesterimide, polyesteramide, polyesteramideimide, (tri (2-hydroxyethyl) isocyanuate triacrylate) -polyesterimide, polyetherimide, polyamide, poly Wire selected from the group consisting of amideimide, polyimide, polyurethane, polyvinyl formal, epoxy resin and combinations thereof.
18. The method of claim 16,

    Between the conductive wire and the thermal conductive film,

    A wire further comprising an internal discharge layer comprising an organic insulating polymer.
19. The method of claim 18,

    The internally dischargeable layer further includes an inorganic nanofiller dispersed in the organic insulating polymer.
20. The method of claim 19,

    Wherein said inorganic nanofiller is selected from the group consisting of silica, titania, alumina, zirconia, yttria, chromium oxide, zinc oxide, iron oxide, clay, and combinations thereof.
21. The method of claim 16,

    The boron nitride particles are plate-shaped particles,

    The plate surface of the boron nitride particles is a wire facing the conductive wire.
22. The method of claim 21,

    The plate surface of the boron nitride particles and the surface of the conductive wire is parallel wire.
23. The method of claim 21,

    The angle at which the plate-shaped surface of the boron nitride particles forms with the surface of the conductive wire is smaller than the angle at which the plate-shaped surface of the boron nitride particles forms a perpendicular line to the surface of the conductive wire.

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