WO2016024749A3 - Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device - Google Patents
Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device Download PDFInfo
- Publication number
- WO2016024749A3 WO2016024749A3 PCT/KR2015/008180 KR2015008180W WO2016024749A3 WO 2016024749 A3 WO2016024749 A3 WO 2016024749A3 KR 2015008180 W KR2015008180 W KR 2015008180W WO 2016024749 A3 WO2016024749 A3 WO 2016024749A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive
- conductive powder
- conductive pattern
- pattern formation
- spray device
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The purpose of the present invention is to provide a conductive pattern formation method for forming a conductive pattern by spraying conductive powder at a wide range of objects, a conductive powder spray device for a conductive pattern, and conductive powder to be used in the method and the spray device. According to the present invention, the method for forming a conductive pattern on an object comprises spraying conductive powder at the object with predetermined pressure. According to the present invention, the conductive powder spray device for forming a conductive pattern on an object comprises: a nozzle for spraying conductive powder; and a collection pipe conduit for collecting the conductive powder repulsed from the object after being sprayed from the nozzle. The conductive powder according to the present invention is nanosized.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2014-0105089 | 2014-08-13 | ||
KR1020140105089A KR101721898B1 (en) | 2014-08-13 | 2014-08-13 | Metal powder spraying apparatus for forming metal pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2016024749A2 WO2016024749A2 (en) | 2016-02-18 |
WO2016024749A3 true WO2016024749A3 (en) | 2016-03-31 |
Family
ID=55304724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2015/008180 WO2016024749A2 (en) | 2014-08-13 | 2015-08-05 | Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101721898B1 (en) |
WO (1) | WO2016024749A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7008166B2 (en) * | 2020-02-26 | 2022-02-10 | タツタ電線株式会社 | Solid phase particle recovery system |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005111316A (en) * | 2003-10-03 | 2005-04-28 | Nippon Paint Co Ltd | Coating booth and coating method |
JP2009164410A (en) * | 2008-01-08 | 2009-07-23 | Bridgestone Corp | Electromagnetic shielding member and its production process |
KR20090094282A (en) * | 2006-11-16 | 2009-09-04 | 후지필름 디마틱스, 인크. | Printing, depositing, or coating on flowable substrates |
JP4335576B2 (en) * | 2003-05-12 | 2009-09-30 | 株式会社ケミトロン | Method and apparatus for forming fine circuit on printed circuit board |
KR20100004475A (en) * | 2008-07-04 | 2010-01-13 | 재단법인서울대학교산학협력재단 | Manufacturing method and apparatus for insulation circuit using cross printing method |
JP2011042856A (en) * | 2009-08-24 | 2011-03-03 | Fujitsu Ltd | Film deposition device and film deposition method |
-
2014
- 2014-08-13 KR KR1020140105089A patent/KR101721898B1/en active IP Right Grant
-
2015
- 2015-08-05 WO PCT/KR2015/008180 patent/WO2016024749A2/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4335576B2 (en) * | 2003-05-12 | 2009-09-30 | 株式会社ケミトロン | Method and apparatus for forming fine circuit on printed circuit board |
JP2005111316A (en) * | 2003-10-03 | 2005-04-28 | Nippon Paint Co Ltd | Coating booth and coating method |
KR20090094282A (en) * | 2006-11-16 | 2009-09-04 | 후지필름 디마틱스, 인크. | Printing, depositing, or coating on flowable substrates |
JP2009164410A (en) * | 2008-01-08 | 2009-07-23 | Bridgestone Corp | Electromagnetic shielding member and its production process |
KR20100004475A (en) * | 2008-07-04 | 2010-01-13 | 재단법인서울대학교산학협력재단 | Manufacturing method and apparatus for insulation circuit using cross printing method |
JP2011042856A (en) * | 2009-08-24 | 2011-03-03 | Fujitsu Ltd | Film deposition device and film deposition method |
Also Published As
Publication number | Publication date |
---|---|
KR101721898B1 (en) | 2017-03-31 |
WO2016024749A2 (en) | 2016-02-18 |
KR20160020128A (en) | 2016-02-23 |
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