WO2016024749A3 - Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device - Google Patents

Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device Download PDF

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Publication number
WO2016024749A3
WO2016024749A3 PCT/KR2015/008180 KR2015008180W WO2016024749A3 WO 2016024749 A3 WO2016024749 A3 WO 2016024749A3 KR 2015008180 W KR2015008180 W KR 2015008180W WO 2016024749 A3 WO2016024749 A3 WO 2016024749A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
conductive powder
conductive pattern
pattern formation
spray device
Prior art date
Application number
PCT/KR2015/008180
Other languages
French (fr)
Korean (ko)
Other versions
WO2016024749A2 (en
Inventor
성원모
조영민
Original Assignee
주식회사 이엠따블유
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 이엠따블유 filed Critical 주식회사 이엠따블유
Publication of WO2016024749A2 publication Critical patent/WO2016024749A2/en
Publication of WO2016024749A3 publication Critical patent/WO2016024749A3/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The purpose of the present invention is to provide a conductive pattern formation method for forming a conductive pattern by spraying conductive powder at a wide range of objects, a conductive powder spray device for a conductive pattern, and conductive powder to be used in the method and the spray device. According to the present invention, the method for forming a conductive pattern on an object comprises spraying conductive powder at the object with predetermined pressure. According to the present invention, the conductive powder spray device for forming a conductive pattern on an object comprises: a nozzle for spraying conductive powder; and a collection pipe conduit for collecting the conductive powder repulsed from the object after being sprayed from the nozzle. The conductive powder according to the present invention is nanosized.
PCT/KR2015/008180 2014-08-13 2015-08-05 Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device WO2016024749A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0105089 2014-08-13
KR1020140105089A KR101721898B1 (en) 2014-08-13 2014-08-13 Metal powder spraying apparatus for forming metal pattern

Publications (2)

Publication Number Publication Date
WO2016024749A2 WO2016024749A2 (en) 2016-02-18
WO2016024749A3 true WO2016024749A3 (en) 2016-03-31

Family

ID=55304724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2015/008180 WO2016024749A2 (en) 2014-08-13 2015-08-05 Conductive pattern formation method, conductive powder spray device for conductive pattern formation, and conductive powder to be used in method or device

Country Status (2)

Country Link
KR (1) KR101721898B1 (en)
WO (1) WO2016024749A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7008166B2 (en) * 2020-02-26 2022-02-10 タツタ電線株式会社 Solid phase particle recovery system

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005111316A (en) * 2003-10-03 2005-04-28 Nippon Paint Co Ltd Coating booth and coating method
JP2009164410A (en) * 2008-01-08 2009-07-23 Bridgestone Corp Electromagnetic shielding member and its production process
KR20090094282A (en) * 2006-11-16 2009-09-04 후지필름 디마틱스, 인크. Printing, depositing, or coating on flowable substrates
JP4335576B2 (en) * 2003-05-12 2009-09-30 株式会社ケミトロン Method and apparatus for forming fine circuit on printed circuit board
KR20100004475A (en) * 2008-07-04 2010-01-13 재단법인서울대학교산학협력재단 Manufacturing method and apparatus for insulation circuit using cross printing method
JP2011042856A (en) * 2009-08-24 2011-03-03 Fujitsu Ltd Film deposition device and film deposition method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4335576B2 (en) * 2003-05-12 2009-09-30 株式会社ケミトロン Method and apparatus for forming fine circuit on printed circuit board
JP2005111316A (en) * 2003-10-03 2005-04-28 Nippon Paint Co Ltd Coating booth and coating method
KR20090094282A (en) * 2006-11-16 2009-09-04 후지필름 디마틱스, 인크. Printing, depositing, or coating on flowable substrates
JP2009164410A (en) * 2008-01-08 2009-07-23 Bridgestone Corp Electromagnetic shielding member and its production process
KR20100004475A (en) * 2008-07-04 2010-01-13 재단법인서울대학교산학협력재단 Manufacturing method and apparatus for insulation circuit using cross printing method
JP2011042856A (en) * 2009-08-24 2011-03-03 Fujitsu Ltd Film deposition device and film deposition method

Also Published As

Publication number Publication date
KR101721898B1 (en) 2017-03-31
WO2016024749A2 (en) 2016-02-18
KR20160020128A (en) 2016-02-23

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