WO2016024478A1

WO2016024478A1 - Cooling device

Info

Publication number: WO2016024478A1
Application number: PCT/JP2015/071610
Authority: WO
Inventors: 隈元匡章
Original assignee: 株式会社テイエルブイ
Priority date: 2014-08-11
Filing date: 2015-07-30
Publication date: 2016-02-18
Also published as: JPWO2016024478A1; JP5989932B2

Abstract

Provided is a cooling device having improved temperature controllability. A cooling device 1 is provided with: a vacuum generating unit 30 having a water tank 31; an ejector 34, a suction port of which is connected to a heat exchange container 20; and a circulation pipe 32 through which the water in the tank 31 circulates between the tank 31 and the ejector 34. The vacuum generating unit 30 feeds the water in the tank 31 to the heat exchange container 20. The cooling device 1 cools a heat exchange surface 22 within the heat exchange container 20 by means of evaporation of the water fed from the vacuum generating unit 30 to the heat exchange container 20. The cooling device 1 is further provided with a controller 40 that controls the water temperature in the tank 31 so that the water temperature in the tank 31 becomes equal to a target temperature of the heat exchange surface 22.

Description

Cooling system

This application relates to a cooling device that vaporizes and cools with water.

For example, as disclosed in Patent Document 1, a cooling device that evaporates and cools an object by latent heat of water evaporation is known. This cooling device is provided with a pump mechanism (suction means) that supplies cooling water into the heat exchange container and places the heat exchange container in a predetermined reduced pressure state (for example, a vacuum state below atmospheric pressure) by suction. Yes. In this cooling device, the cooling water supplied into the heat exchange vessel evaporates, and the heat exchange surface in the heat exchange vessel is cooled (vaporization cooling). Thus, in the above cooling device, the heat exchange surface is maintained at a predetermined temperature.

Japanese Patent No. 5384236

By the way, in the cooling device as described above, generally, the temperature of the heat exchange surface in the heat exchange vessel is measured (detected), and the supply temperature of the cooling water is controlled so that the measured temperature (detected temperature) becomes a predetermined value. Is done. However, in this temperature control method, there is a possibility that the measured temperature of the heat exchange surface may vary, and there is a problem that controllability is poor.

The technology disclosed in the present application has been made in view of such circumstances, and an object thereof is to provide a cooling device capable of improving temperature controllability.

The technology disclosed in the present application includes a water tank, an ejector having a suction port connected to a heat exchange container, and a circulation pipe through which water in the tank circulates between the ejector and the water in the tank. It is premised on a cooling device that includes a pump mechanism that supplies the heat exchange vessel and cools the heat exchange surface in the heat exchange vessel by evaporation of water supplied from the pump mechanism to the heat exchange vessel. And the cooling device of this application is provided with the control part which controls the temperature of the water of the said tank so that the temperature of the water of the said tank may become the same temperature as the target temperature of the said heat exchange surface.

As described above, according to the cooling device of the present application, the water in the tank circulates between the ejector and the suction port of the ejector becomes a saturated pressure (temperature equivalent saturated pressure) corresponding to the water temperature of the tank. Then, the internal pressure of the heat exchange container connected to the suction port of the ejector also becomes a saturation pressure corresponding to the water temperature of the tank. And the water of a tank is supplied to a heat exchange container, and it evaporates and the internal temperature of a heat exchange container becomes the same temperature as the water temperature of a tank. Here, in the cooling device of the present application, the water temperature of the tank is controlled so that the water temperature of the tank becomes the same temperature as the target temperature of the heat exchange surface. Therefore, the internal pressure of the heat exchange vessel can be set to a saturation pressure corresponding to the target temperature of the heat exchange surface. Thereby, the internal temperature of the heat exchange container can be maintained at the same temperature as the target temperature of the heat exchange surface, and the temperature of the heat exchange surface can be maintained to be cooled to the target temperature. As described above, the temperature control is performed on the water temperature of the tank that is less likely to vary than the temperature of the heat exchange surface, so that the temperature controllability can be improved.

FIG. 1 is a piping system diagram illustrating a schematic configuration of a cooling device according to an embodiment.

Hereinafter, embodiments of the present application will be described with reference to the drawings. Note that the following embodiments are essentially preferable examples, and are not intended to limit the scope of the technology disclosed in the present application, applications thereof, or uses thereof.

As shown in FIG. 1, the cooling device 1 of the present embodiment supplies water (cooling water), which is a cooling source, into the heat exchange vessel 20 and evaporates it to target the heat exchange surface 22 of the heat exchange vessel 20. It is a vaporization cooling device that cools to a temperature (set temperature).

The cooling device 1 includes a fluid circuit 10 for water and steam. The fluid circuit 10 includes a supply rod 11, a discharge pipe 12, a heat exchange container 20, a vacuum generation unit 30, and a control unit 40.

The heat exchange container 20 is formed in a cylindrical shape, for example, and the lower surface of a flat plate provided at the upper end is a heat exchange surface 22. The supply rod 11 has one end (outflow end) connected to the lower surface of the heat exchange container 20 and the other end (inflow end) connected to the vacuum generation unit 30. In the supply tank 11, water (cooling water) is supplied from the vacuum generation unit 30 to the heat exchange container 20. Although not shown, a spray nozzle for spraying water into the container interior 21 of the heat exchange container 20 is provided at one end of the supply rod 11. In the heat exchange container 20, the water supplied from the supply tank 11 to the container inside 21 exchanges heat with the heat exchange surface 22 and evaporates (vaporizes), and the heat exchange surface 22 is cooled. That is, the heat exchange surface 22 of the heat exchange vessel 20 is cooled (vaporized and cooled) by the heat (latent heat of water evaporation) being taken away by water.

The discharge pipe 12 has one end (inflow end) connected to the top of the heat exchange vessel 20 and the other end (outflow end) connected to the vacuum generation unit 30. The discharge pipe 12 discharges steam generated by evaporation of water in the container interior 21 (including water that could not be evaporated in the container interior 21; the same applies hereinafter).

The vacuum generation unit 30 includes a tank 31, a circulation pipe 32, a pump 33, and an ejector 34, and constitutes a pump mechanism according to the claims of the present application. The tank 31 stores water (cooling water) to be supplied to the heat exchange container 20 and water for driving the ejector 34, and constitutes an open tank. The circulation pipe 32 is connected to the tank 31. That is, one end (inflow end) of the circulation pipe 32 is connected to the lower part of the tank 31, and the other end (outflow end) is connected to the upper part of the tank 31. The circulation pipe 32 is provided with a pump 33 and an ejector 34 in order from the upstream side (inflow end side). In the vacuum generation unit 30, the discharge pipe 12 is connected to the suction port of the ejector 34, and the supply rod 11 is connected between the outlet of the pump 33 and the inlet of the ejector 34 in the circulation pipe 32. That is, the suction port of the ejector 34 is connected to the heat exchange container 20 via the discharge pipe 12.

In the vacuum generation unit 30, the water in the tank 31 is circulated through the circulation pipe 32 by the pump 33. That is, the circulation pipe 32 circulates the water in the tank 31 with the ejector 34. The vacuum generation unit 30 is configured such that a suction action is generated at the suction port of the ejector 34 when water in the tank 31 is supplied to the inlet of the ejector 34 by the pump 33 and discharged from the outlet of the ejector 34. ing. That is, the ejector 34 is driven as the water in the tank 31 circulates between the ejector 34 and the water. By the suction action of the ejector 34, the vapor inside the container 21 is discharged to the discharge pipe 12. That is, the ejector 34 sucks the vapor (including water that could not be evaporated; the same applies hereinafter) inside the container 21 through the discharge pipe 12. In the vacuum generation unit 30, a part of the water flowing through the circulation pipe 32 is supplied to the heat exchange container 20 through the supply tank 11. As described above, the vacuum generation unit 30 is configured to supply the water in the tank 31 to the container inside 21 of the heat exchange container 20 and suck the vapor generated by the evaporation of water in the container inside 21.

The tank 31 is connected to a supply pipe 13 for water (cooling water). The supply pipe 13 is provided with a supply valve 14 (flow rate adjustment valve) capable of adjusting the amount of water supplied to the tank 31. The tank 31 is supplied with water at a predetermined temperature (for example, room temperature) through the supply pipe 13. The tank 31 is provided with a temperature sensor 35 that detects (measures) the temperature of the stored water.

In the cooling device 1 configured as described above, a cooling operation is performed in which the water (cooling water) in the tank 31 is supplied to the heat exchange vessel 20 to cool the heat exchange surface 22 to the target temperature. Specifically, in this cooling operation, when the pump 33 is driven, water in the tank 31 is supplied to the ejector 34 by the pump 33 and also supplied to the container inside 21 of the heat exchange container 20 through the supply tank 11. The inside 21 of the container is brought into a predetermined vacuum decompression state (for example, a vacuum state below atmospheric pressure) by the suction action of the ejector 34, the water supplied to the inside 21 of the container evaporates, and the heat exchange surface 22 is cooled to the target temperature. (Vaporization cooling). Steam generated by evaporation of water inside the container 21 is sucked into the ejector 34 through the discharge pipe 12 and stored in the tank 31.

Then, in the cooling operation, the control unit 40 of the present embodiment performs a vacuum so that the temperature detected by the temperature sensor 35 (hereinafter also referred to as the water temperature of the tank 31) becomes the target temperature (for example, 90 ° C.). The generation unit 30 is controlled. Specifically, the control unit 40 is configured to control the opening degree of the supply valve 14. The target temperature of the water temperature of the tank 31 is set to the same value as the target temperature (90 ° C.) of the heat exchange surface 22.

Here, the pressure state in the fluid circuit 10 will be described. The internal pressure of the tank 31 (hereinafter also referred to as tank internal pressure) is atmospheric pressure, and the pressure between the discharge port of the pump 33 and the inlet of the ejector 34 in the circulation pipe 32 and the supply rod 11 is positive pressure. The pressure at the suction port of the ejector 34 (hereinafter also referred to as suction port pressure), the pressure at the discharge pipe 12, and the pressure inside the container 21 (hereinafter also referred to as container internal pressure) are in the same vacuum decompression state. Specifically, in the ejector 34, the suction port pressure becomes a saturation pressure (temperature equivalent saturation pressure) corresponding to the temperature of the water flowing into the inlet (that is, the water temperature of the tank 31). Therefore, the internal pressure of the container also becomes a saturation pressure corresponding to the water temperature of the tank 31.

In the present embodiment, during the cooling operation, the controller 40 controls the water temperature of the tank 31 to the same target temperature as the target temperature of the heat exchange surface 22, so that the suction port pressure of the ejector 34 is saturated corresponding to the target temperature. Pressure (temperature equivalent saturation pressure). The water temperature of the tank 31 changes according to the amount of water supplied from the supply pipe 13. For example, when the opening degree of the supply valve 14 is set to a large opening degree, the amount of water supplied from the supply pipe 13 to the tank 31 increases, and the water temperature of the tank 31 decreases. Further, when the opening of the refill valve 14 is set to a small opening, the amount of water supplied from the refill pipe 13 to the tank 31 decreases, and the water temperature of the tank 31 rises.

Thus, when the suction port pressure of the ejector 34 reaches a saturation pressure corresponding to the target temperature, the internal pressure of the container also becomes the same saturation pressure as the suction port pressure of the ejector 34. That is, the internal pressure of the container becomes a saturation pressure (temperature equivalent saturation pressure) corresponding to the target temperature of the heat exchange surface 22. On the other hand, water at the target temperature of the water temperature of the tank 31 (that is, the target temperature of the heat exchange surface 22) is supplied from the tank 31 through the supply tank 11 to the container interior 21. In the container interior 21, the water supplied from the tank 31 evaporates and becomes steam having the same temperature as the target temperature of the heat exchange surface 22. As a result, the temperature inside the container 21 (hereinafter also referred to as container internal temperature) is maintained at the same temperature as the target temperature of the heat exchange surface 22. As a result, the temperature of the heat exchange surface 22 is cooled and maintained at the target temperature.

As described above, according to the embodiment, the water temperature of the tank 31 is detected (measured) instead of the temperature of the heat exchange surface 22, and the detected temperature (measured temperature) is the same temperature as the target temperature of the heat exchange surface 22. I tried to become. Thereby, the heat exchange surface 22 can be cooled to the target temperature. Since the water temperature of the tank 31 is less likely to vary than the temperature of the heat exchange surface 22, the controllability of the water temperature of the tank 31 is easy, and as a result, the temperature controllability of the heat exchange surface 22 is improved. .

The technique disclosed in the present application is useful for a cooling device that evaporates and cools an object by evaporation of water.

1 Cooling Device 13 Supply Pipe 14 Supply Valve (Flow Control Valve)
20 Heat exchange vessel 22 Heat exchange surface 30 Vacuum generation unit (pump mechanism)
31 Tank 32 Circulating Piping 34 Ejector 40 Control Unit

Claims

A water tank, an ejector whose suction port is connected to the heat exchange container, and a circulation pipe through which water in the tank circulates between the ejector and supplying water from the tank to the heat exchange container A cooling device comprising a pump mechanism, wherein the heat exchange surface in the heat exchange vessel is cooled by evaporation of water supplied from the pump mechanism to the heat exchange vessel,
A cooling device comprising a control unit for controlling the temperature of the water in the tank so that the temperature of the water in the tank is the same as the target temperature of the heat exchange surface.
The cooling device according to claim 1, wherein
A supply pipe connected to the tank and supplied with the water;
A flow rate adjustment valve provided in the supply pipe,
The said control part is comprised so that the temperature of the water of the said tank may control the said flow regulating valve so that it may become the same temperature as the target temperature of the said heat exchange surface, The cooling device characterized by the above-mentioned.