WO2016021898A1 - Composition for forming conductive pattern and resin structure having conductive pattern - Google Patents

Abstract

The present invention relates to a composition for forming a conductive pattern and a resin structure having a conductive pattern, wherein, without modifying various types of polymer resin products or resin layers, a micro conductive pattern can be formed on the polymer resin products or resin layers through a simplified process, and demands of the relevant industry, such as implementation of various colors, can be satisfied more effectively.

Description

 【Specification】

 [Name of invention]

 Resin structure which has composition for electroconductive pattern formation and electroconductive pattern [cross-reference with related application (s)]

 This application claims the benefit of priority based on Korean Patent Application No. 10-2014-0100040 dated August 4, 2014 and Korean Patent Application No. 10-2015-0109125 dated July 31, 2015. All content disclosed in the literature is included as part of this specification.

 Technical Field

 The present invention enables to form a fine conductive pattern in a simplified process on the polymer resin product or resin layer without deformation of various polymer resin products or resin layers, and more effectively meet the needs of the art, such as various colors It relates to a resin structure having a composition for forming a conductive pattern and a conductive pattern.

 Background Art

 In recent years, with the development of fine electronic technology, the demand for structures having a fine conductive pattern formed on the surface of polymer resin substrates (or products) such as various resin products or resin layers is increasing. The conductive pattern on the surface of the polymer resin substrate may be applied to form various objects such as an antenna, various sensors, a MEMS structure, or an RFID tag integrated in an electronic device case.

 As such, as the interest in the technology of forming the conductive pattern on the surface of the polymer resin substrate increases, some techniques related thereto have been proposed. However, there is no proposal to use such technology more effectively.

For example, according to a known technique, a method of forming a conductive pattern by forming a metal layer on the surface of the polymer resin substrate and then applying photolithography or printing a conductive paste may be considered. However, in the case of forming a conductive pattern according to this technique, The disadvantage is that the equipment becomes too complicated or difficult to form good and fine conductive patterns.

 Therefore, the development of a technology that can more effectively form a fine conductive pattern on the surface of the polymer resin substrate in a simplified process has been required before. As one of technologies capable of satisfying the needs of the art, a polymer resin substrate is prepared by including a special inorganic additive in a resin, irradiating electromagnetic waves such as a laser to a portion to form a conductive pattern, and plating such electromagnetic wave irradiation region. It is known to simply form a conductive pattern on the surface.

 However, in the method of forming the conductive pattern, those previously proposed as inorganic additives have problems such as poor polymer properties or poor physical properties of the resin layer obtained by influencing the physical properties of the resin, or various black colors. . Accordingly, there is a need for the development of various kinds of inorganic additives that can meet various needs of the art such as various colors without causing denaturation of the resin.

 [Content of invention]

 [Problem to solve]

 The present invention enables to form a fine conductive pattern in a simplified process on the polymer resin product or resin layer without deformation of various polymer resin products or resin layers, and more effectively meet the needs of the art, such as the implementation of various colors It is to provide a composition for forming a conductive pattern.

 The present invention also provides a resin structure having a conductive pattern formed through the conductive pattern forming method from the composition for forming a conductive pattern.

 [Measures of problem]

 According to one embodiment of the invention, a polymer resin; And a non-conductive metal compound including a compound represented by the following Chemical Formula 1, and a composition for forming a conductive pattern by electromagnetic wave irradiation, wherein a metal nucleus is formed from the non-conductive metal compound by electromagnetic wave irradiation, is provided.

[Formula 1]

 In Chemical Formula 1,

M is one selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt, Mg, Ca, Sr 맟 Au The metal is the above, and x is a ratio of more than 0 to less than 3 _ Such a non-conductive metal compound has a triclinic structure and may belong to the ^P1 space group. More specifically, the non-conductive metal compound is Cu0 ₄ or M0 ₄ of the rectangular plane type; Cu0 ₅ or M0 ₅ of trigonal bipyramids; And tetrahedron Ρ0 ₄ may have a three-dimensional structure that is connected three-dimensionally while sharing oxygen.

 On the other hand, in the composition for forming a conductive pattern, the polymer resin may be a thermosetting resin or a thermoplastic resin, more specific examples thereof, ABS (Acryloniti le poly-butadiene styrene) resin, polyalkylene terephthalate resin, And at least one selected from the group consisting of polycarbonate resins, polypropylene resins, and polyphthalamide resins.

 In the composition for forming a conductive pattern, the nonconductive metal compound may be included in an amount of about 0.1 to 15 wt% based on the total composition.

 In addition, the composition for forming a conductive pattern may further include at least one additive selected from the group consisting of flame retardants, heat stabilizers, UV stabilizers, lubricants, antioxidants, inorganic layering agents, color additives, impact modifiers, and functional reinforcing agents. .

 On the other hand, according to another embodiment of the invention, there is provided a resin structure in which a conductive metal layer (conductive pattern) is formed on the surface of a polymer resin substrate using the above-described composition for forming a conductive pattern. The resin structure having such a conductive pattern is a polymer resin substrate; A non-conductive metal compound dispersed in a polymer resin substrate and including a compound represented by the following general formula (1); An adhesive active surface comprising a metal nucleus exposed to the surface of the polymer resin substrate in a predetermined region; And it may include a conductive metal layer formed on the adhesive active surface.

 [Formula 1]

Cu3-xMxP ₂ 0 ₈ In Chemical Formula 1,

 M is one selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, kg, Ta, W, Pt, Mg, Ca, Sr and Au The metal is the above, and x is a ratio of 0 or more and less than 3.

 In the resin structure having the conductive pattern, a predetermined region in which the adhesive active surface and the conductive metal layer are formed may correspond to a region in which electromagnetic waves are irradiated onto the polymer resin substrate.

 【Effects of the Invention】

 According to the present invention, a composition for forming a conductive pattern capable of forming a fine conductive pattern on a polymer resin substrate such as various polymer resin products or resin layers, by a very simplified process of irradiating electromagnetic waves such as a laser, and from therefrom A resin structure having a formed conductive pattern is provided.

 In particular, the use of the composition for forming the conductive pattern does not cause modification of the resin structure (various polymer resin products or resin layers, etc.), and more effectively meets the needs of the art to realize various colors, such a resin structure A good conductive pattern can be easily formed on it.

 Therefore, by using such a composition for forming a conductive pattern, conductive patterns on various resin products such as mobile phones and tablet PC cases, RFID tags, various sensors, MEMS structures, and the like can be formed very effectively.

 [Brief Description of Drawings]

1 is a view schematically showing a structure of Cu ₃ P ₂ 0 ₈ included in the composition for forming a conductive pattern according to an embodiment of the present invention.

2 is a graph showing absorbance according to the wavelength (nm) of Cu ₃ P ₂ 0 ₈ included in the composition for forming a conductive pattern according to the exemplary embodiment of the present invention. Absorbance is calculated as (1-R% * 0.01) ² /(2R%*0.01) according to Kubelka-Munk equation, where 1 »is diffuse reflectance that can be immediately estimated by Uv-Visible spectroscopy.

 3 is a view briefly showing an example of a method of forming a conductive pattern using a composition according to an embodiment of the present invention in process steps.

4 is an XRD pattern of a non-conductive metal compound used in Examples 1 and 2; It is a figure which shows.

5 is a graph comparing XRD patterns of Cu ₃ P ₂ O ₈ and CLu.sZm.sPsOs.

Figure 6 is a graph showing the absorbance according to the wavelength (nm) of Sb doped Sn0 ₂ coated on Cu ₃ P ₂ 0 ₈ and mica.

 [Specific contents to carry out invention]

 Hereinafter, a composition for forming a conductive pattern and a resin structure having a conductive pattern formed therefrom according to a specific embodiment of the present invention will be described. According to one embodiment of the invention, a polymer resin; And a non-conductive metal compound including a compound represented by the following Chemical Formula 1, and a composition for forming a conductive pattern by electromagnetic wave irradiation, wherein a metal nucleus is formed from the non-conductive metal compound by electromagnetic wave irradiation, is provided.

 [Formula 1]

 In Chemical Formula 1,

 M is Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt,

At least one metal selected from the group consisting of Mg, Ca, Sr and Au, x is a ratio of 0 or more and less than 3.

 In one embodiment, the composition for forming a conductive pattern includes a specific nonconductive metal compound represented by Chemical Formula 1.

 The specific nonconductive metal compound represented by Chemical Formula 1 may have a triclinic system structure having the least symmetry among 7 crystal systems. In the triclinic structure, not only are all three vectors forming the unit cell different (a ≠ b ≠ c), but also the angles formed by the vectors are different and the right angle is pT.

(Α ≠ β ≠ γ ≠ 90). In addition, the non-conductive metal compound may belong to a ^ri space group. 1, the triclinic system structure of such a nonelectroconductive metal compound is shown typically.

Referring to FIG. 1, in the non-conductive metal compound having a triclinic structure, Cu and M may be positioned at two sites. Specifically, in the non-conductive metal compound, one Cu or M is coordinated by four oxygens to form a square plane or Ml site, which forms the local symmetry of square pl anar, and M2 site, where 1 Cu or M is coordinated by 5 oxygen to form local symmetry of the trigonal bipyramid. It can be located at In addition, the non-conductive metal compound may include a tetrahedron of P0 ₄ in which one P is coordinated by four oxygen to form local symmetry. Such local symmetric parts may be connected in three dimensions while sharing oxygen as shown in FIG. 1 to form a triclinic system. Specifically, the non-conductive metal compound is Cu0 ₄ black silver M0 ₄ of the square plane type as shown in FIG. Cu0 ₅ black of trigonal bipyramid is M0 ₅ ; And it may have a three-dimensional structure in which the tetrahedron P0 ₄ is three-dimensionally connected while sharing oxygen.

 As will be described in more detail below, after molding a polymer resin product or a resin layer using a composition for forming a conductive pattern containing such a non-conductive metal compound, and irradiating electromagnetic waves such as a laser to a predetermined region, the metal from the non-conductive metal compound Nuclei can form. The non-conductive metal compound is chemically stable in a general environment, but the metal core may be more easily formed in an area exposed to electromagnetic waves such as near infrared wavelengths.

 More specifically, the non-conductive metal compound represented by Chemical Formula 1 is

2, the absorptivity of the visible region (about 300 nm to 700 nm) is low, and high absorbance is shown in the near infrared to infrared region (about 700 nm to 3000 nm), such as 2 (horizontal axis: wavelength (nm), ^' vertical axis: absorbance). The non cause strong absorption of near-infrared region of the non-conductive metal compounds is due to the local symmetry of teurigo Cu0 ₅ forming the edge by a pyramid (tr igonal bypyramid). For this reason, firstly, Cu ²⁺ in the center of the trigonal bipyramid is located in a non-cent rosymmetr icsi te, so that the laforte permissible transition in the d-orbital of Cu ²⁺ ( Laporte al lowed transit ion is possible. Secondly, the transition between the energy levels resulting from this crystal structure contains less visible light region (about 300 nm to 700 nm) and considerably includes near infrared to infrared region (about 700 nm to 3000 nm). Therefore, the non-conductive metal compound has low absorbance in the visible light region and high absorbance in the near infrared to infrared region, and has a bright color. In response to the stimulation of electromagnetic waves in the near infrared wavelength, it is possible to form metal nuclei for Cu-electroless plating.

The metal core thus formed may be selectively exposed in a predetermined region irradiated with electromagnetic waves to form an adhesive active surface of the polymer resin substrate surface. Subsequently, when the metal nucleus or the like is chemically reduced or electroless plated with a plating solution containing conductive metal ions or the like as _see d, the conductive metal layer may be formed on the adhesive active surface including the metal nucleus. In particular, as described above, when the non-conductive metal compound is irradiated with electromagnetic waves having a near infrared wavelength, the metal core can be easily formed even with low electromagnetic wave power. In addition, the metal core can easily form a conductive pattern by a reduction or plating method, for example, Cu-electroless plating.

 On the other hand, in the composition of the embodiment, the non-conductive metal compound not only exhibits non-conductivity prior to electromagnetic wave irradiation in the near infrared region, but also has excellent compatibility with the polymer resin, and is also used in the solution used for the reduction or plating treatment. It is stable and has a characteristic of maintaining non-conductivity.

 Therefore, such a non-conductive metal compound may remain chemically stable in a state uniformly dispersed in the polymer resin substrate in the region where electromagnetic waves are not irradiated, thereby exhibiting non-conductivity. On the other hand, in a predetermined region irradiated with electromagnetic waves of the near infrared wavelength, metal nuclei can be easily formed from the non-conductive metal compound based on the principle described above, and thus a fine conductive pattern can be easily formed.

 Therefore, by using the composition of the embodiment described above, it is possible to form a fine conductive pattern in a very simplified process of irradiating electromagnetic waves, such as a laser, on various polymer resin products or polymer resin substrates such as resin layers, in particular, Since the metal nucleus which promotes the formation of the conductive pattern can be formed very easily, a better conductive pattern can be formed more easily than the composition of the same kind previously known.

In addition, compounds such as CuCr ₂ O ₄ having a spinel structure are dark black. bl ack), a composition comprising such a non-conductive metal compound may not be suitable for realizing polymer resin products or resinous resins of various colors. In contrast, Cu ₃ P ₂ O ₈ , which is one of the compounds represented by Formula 1, may exhibit a relatively bright color because the absorption of the visible light region (about 300 nm to 700 nm) is low as shown in FIG. 2. Accordingly, Cu ₃ P ₂ 0 ₈ may hardly color the colors of various polymer resin products or resin layers. Therefore, the use of the composition of one embodiment comprising the same can more effectively meet the needs of the art to implement a variety of colors, such as various polymer resin products with the addition of a relatively small color additive. In addition, a part of Cu in Cu ₃ P ₂ 0 ₈ may be transferred to other transition metals (Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt , Mg, Ca, Sr, Au and the like) can be obtained. In particular, when a part of Cu is replaced with Zn, the color becomes brighter than Cu ₃ P ₂ O ₈ .

 On the other hand, in the composition for forming a conductive pattern of the above-described embodiment, as the polymer resin, any thermosetting resin or thermoplastic resin capable of forming various polymer resin products or resin layers may be used without particular limitation. In particular, the specific non-conductive metal compound described above may exhibit excellent compatibility and uniform dispersibility with various polymer resins, and the composition of one embodiment may be molded into various resin products or resin layers including various polymer resins. . Specific examples of such polymer resins include polyalkylene terephthalate resins, polycarbonate resins, polypropylene resins or poly (ABS) such as ABS (Acryloni tile poly-butadiene styrene) resins, polybutylene terephthalate resins or polyethylene terephthalate resins. A phthalamide resin etc. can be mentioned, In addition, various polymeric resins can be included.

In addition, in the composition for forming a conductive pattern, the non-conductive metal compound including the compound represented by Formula 1 may be included in about 0.1 to 15% by weight, or about 1 to 10% by weight based on the total composition, the rest Content of polymeric resin may be included. According to this content range, while maintaining the basic physical properties such as the mechanical properties of the polymer resin product or resin layer formed from the composition, while forming a conductive pattern in a predetermined region by electromagnetic wave irradiation The characteristic can be preferably represented.

Further, for the conductive pattern forming composition described above high molecular _resin, and in addition to a predetermined non-conductive metal compounds, the group consisting of flame retardants, thermal stabilizers, UV stabilizers, lubricants, antioxidants, inorganic fillers, color additives, cheunggyeok reinforcing agents and functionality adjuvant It may further comprise one or more additives selected from. With the addition of such additives, the physical properties of the resin structure obtained from the composition of one embodiment can be appropriately reinforced. Among these additives, in the case of the color additives, for example, pigments, etc., they may be included in an amount of about 0.1 to 10% by weight to give a desired color to the resin structure.

Representative examples of color additives such as pigments, ZnO, ZnS, Talc, Ti0 ₂ ,

There are white pigments such as Sn0 ₂ or BaS0 ₄ , and of course, color additives such as pigments of various kinds and colors known to be usable in the polymer resin composition may be used.

The flame retardant may include phosphorus-based flame retardant and inorganic flame retardant. More specifically, the phosphorus-based flame retardant may include triphenyl phosphate (TPP), trixylenyl phosphate (TXP), tricresyl phosphate (TCP), or triisophenyl phosphate. phosphate ester flame retardants, including phosphate, RE0F0S); Aromatic polyphosphate-based flame retardants; Polyphosphate flame retardants; Alternatively, red phosphorus-based flame retardants may be used, and various phosphorus-based flame retardants known to be usable in the resin composition may be used without any particular limitation. In addition, the inorganic flame retardant includes aluminum hydroxide, magnesium hydroxide, zinc borate, molybdenum oxide (Mo0 ₃ ); Molybdenum peroxide salt (Mo ₂ 0 ₇ ² —), chamomile-zinc-molybdate, antimony trioxide (Sb ₂ 0 ₃ ), antimony pentoxide (Sb ₂ 0 ₅ ), and the like. However, examples of the inorganic flame retardant are not limited thereto, and various inorganic flame retardants known to be usable in other resin compositions may be used without any particular limitation.

In addition, in the case of a layer reinforcing agent, heat stabilizer, UV stabilizer, lubricant or antioxidant, it is included in an amount of about 0.01 to 5% by weight, or about 0.05 to 3% by weight. Desired physical properties can be appropriately expressed in the resin structure.

 Meanwhile, hereinafter, a method of forming a conductive pattern by direct irradiation of electromagnetic waves on a polymer resin substrate such as a resin product or a resin layer using the composition for forming a conductive pattern according to the above-described embodiment will be described in detail. . Such a method of forming a conductive pattern may include forming a resin layer by molding the above-described composition for forming a conductive pattern into a resin product or by applying it to another product; Irradiating electromagnetic waves to a predetermined region of the resin product or the resin layer to generate metal nuclei from non-conductive metal compound particles including the compound represented by Chemical Formula 1; And chemically reducing or plating the region generating the metal nucleus to form a conductive metal layer.

 Referring to the accompanying drawings, a method of forming the conductive pattern is described in each step as follows. For reference, in FIG. 3, an example of the method of forming the conductive pattern is shown in a simplified step by step.

 In the said conductive pattern formation method, the above-mentioned composition for conductive pattern formation can be shape | molded by a resin product, or can be apply | coated to another product and can form a resin layer. In molding such a resin product or forming a resin layer, a product molding method or a resin layer forming method using a conventional polymer resin composition can be applied without particular limitation. For example, in molding a resin product using the composition, the composition for forming the conductive pattern is extruded and engraved, and then formed into pellets or particles, and then injection molded into a desired form to prepare various polymer resin products. Can be.

 The polymer resin product or the resin layer thus formed may have a form in which the specific non-conductive metal compound described above is uniformly dispersed on the resin substrate formed from the polymer resin. In particular, the non-conductive metal compound including the compound of Formula 1 has excellent compatibility and chemical stability with various polymer resins, it can be uniformly dispersed throughout the entire area on the resin substrate can be maintained in a non-conductive state .

After the polymer resin product or the resin layer is formed, as shown in the first drawing of FIG. 3, the resin product to form the conductive pattern or Electromagnetic waves such as a laser can be irradiated to a predetermined region of the resin layer. When irradiated with such electromagnetic waves, the metal or its ions may be released from the non-conductive metal compound, and a metal nucleus including the same may be generated (see the second drawing of FIG. 3).

 More specifically, when the metal nucleus generation step by the electromagnetic wave irradiation proceeds, a portion of the non-conductive metal compound including the compound of Formula 1 is exposed to the surface of the predetermined region of the resin product or the resin layer to generate a metal nucleus therefrom. And the adhesion-activated surface activated to have higher adhesion. Since the adhesion-activated surface is selectively formed only in a predetermined region irradiated with electromagnetic waves, when the plating step described below is performed, chemical reduction of the metal core and the conductive metal ions included in the adhesion-activated surface, and / or By chemically reducing the conductive metal ions by electroless plating, the conductive metal layer may be selectively formed on the polymer resin substrate in a predetermined region. More specifically, in the electroless plating, when the metal nucleus acts as a kind of seed, when the conductive metal ions contained in the plating solution are chemically reduced, strong bonds may be formed. As a result, the conductive metal layer can be selectively formed more easily.

 On the other hand, in the above-described metal nucleation step, among the electromagnetic waves, laser electromagnetic waves can be irradiated, for example, laser electromagnetic waves having a wavelength in the near infrared (NIR) region of about 755 nm, about 1064 nm, about 1550 nm or about 2940 nm. Can be investigated. In another example, laser electromagnetic waves having a wavelength in the infrared (IR) region may be irradiated. In addition, the laser electromagnetic wave can be irradiated under normal conditions or power.

By irradiation of such a laser, metal nuclei can be generated from a non-conductive metal compound including the compound represented by Chemical Formula 1 more effectively, and the adhesion-activated surface including the same can be selectively generated and exposed to a predetermined region. On the other hand, after the above-described metal nucleus generation step, as shown in the third drawing of FIG. 3, the step of forming a conductive metal layer by chemically reducing or plating the region that generated the metal nucleus may proceed. . Such reduction or As a result of the plating step, the conductive metal layer may be selectively formed in a predetermined region where the metal nucleus and the adhesive active surface are exposed, and in the remaining regions, the chemically stable non-conductive metal compound may maintain the non-conductivity. Accordingly, a fine conductive pattern may be selectively formed only in a predetermined region on the polymer resin substrate.

 More specifically, the forming of the conductive metal layer may be performed by electroless plating, and thus a good conductive metal layer may be formed on the adhesively active surface. In particular, the adhesion-activated surface formed from the non-conductive metal compound including the compound represented by Formula 1 may effectively form a fine conductive pattern by Cu-electroless plating.

In one example, in such a reduction or plating step can process the ^"resin products or resin layer given that caused the metal nucleus region with an acidic or basic solution containing a reducing agent, such a solution as the reducing agent, formaldehyde, hypophosphite , and a dimethylamino borane (DMAB), diethylamino borane (DEAB) and hydrazine one or more selected from the group consisting of may ^contain. In the reducing or plating step, the conductive metal layer may be formed by the electroless plating by treating with the above-described reducing agent and the electroless plating solution including the conductive metal ions.

 As the reduction or plating step proceeds, the conductive metal silver contained in the electroless plating solution is chemically reduced by using the seed as a seed in the region where the metal nucleus is formed, and a good conductive pattern may be selectively formed in a predetermined region. . In this case, the metal nucleus and the adhesion-activated surface may form strong bonds with the chemically reduced conductive metal ions, and as a result, a conductive pattern may be more easily formed in a predetermined region.

 In addition, in the remaining region where the conductive pattern is not formed, the non-conductive metal compound including the compound represented by Chemical Formula 1 is uniformly dispersed in the resin structure.

On the other hand, according to another embodiment of the invention, the resin structure having a conductive pattern obtained by the above-described composition for forming a conductive pattern and the conductive pattern forming method Is provided. Such a resin structure includes a polymer resin substrate; A non-conductive metal compound dispersed in a polymer resin substrate and including a compound represented by Chemical Formula 1; An adhesion-activated surface comprising a metal nucleus containing copper metal or copper ions exposed to the surface of the polymer resin substrate in a predetermined region; And it may include a conductive metal layer formed on the adhesive active surface.

 In such a resin structure, a predetermined region in which the adhesive active surface and the conductive metal layer are formed may be defined in a region in which electromagnetic waves are irradiated onto the polymer resin substrate. In addition, the metal or its ions contained in the metal nucleus of the adhesion-activated surface may be derived from a non-conductive metal compound including the compound represented by the formula (1). On the other hand, the conductive metal layer may be derived from the metal contained in the non-conductive metal compound including the compound represented by the formula (1), or may be derived from the conductive metal ions contained in the electroless plating solution.

 In addition, the resin structure may further include a residue derived from the non-conductive metal compound. Such a residue may have a structure in which at least some of the metals included in the non-conductive metal compound are released, and vacancy is formed in at least a portion of the site.

 The resin structure described above may be various resin products or resin layers, such as a mobile phone or tablet PC case having a conductive pattern for an antenna, or various resin products or resin layers having conductive patterns, such as other RFID tags, various sensors, or MEMS structures. have.

As described above, according to embodiments of the present invention, it is possible to easily and easily form various resin products having various fine conductive patterns by a very simplified method of irradiating, reducing or plating electromagnetic waves such as a laser. Hereinafter, the operation and effects of the invention will be described in more detail with reference to specific examples. However, this is presented as an example of the invention, whereby the scope of the invention is not limited in any sense. Example 1 Cu ₃ P ₂ 0 ₈ having a triclinic structure was synthesized by a solid phase reaction method in which CuO and (NH ₄ ) ₂ HP0 ₄ were mixed at a molar ratio of 3: 2 by heat treatment at 1000 ^° C. for 10 hours. And, the X-ray diffraction (XRD) pattern showing the crystal characteristic is shown in FIG.

Polycarbonate resin, which is a basic resin, and Cu ₃ P ₂ 0 ₈ prepared above as a non-conductive metal compound, and additives for process and stabilization were used together to prepare a composition for forming a conductive pattern by electromagnetic wave irradiation.

 As these additives, heat stabilizers (IR1076, PEP36), UV stabilizers (UV329), lubricants (EP184), and impact modifiers (S2001) were used.

90% by weight of the polycarbonate resin, ¾0 1 _{3 8} 5% by weight, and other additives

The composition was mixed by 5% by weight, which was extruded through an extruder at a temperature of 260 to 280 ^° C. The composition in the form of extruded pellets was injection molded at about 260 to 270 ^° C. in the form of a substrate having a diameter of 100 mm, a thickness of 2 mm and an izod bar of ASTM standard. The injection molded specimen was irradiated with a laser of 1064 nm wavelength under 40 kHz and 7 W conditions to activate the surface, and the electroless plating process was performed as follows.

The plating solution (hereinafter PA solution) was prepared by dissolving 3 _g of copper sulfate, 14 _g of loxal salt, and 4 g of sodium hydroxide in 100 ml of deionized water. To 40 ml of the prepared PA solution, 1.6 ml of formaldehyde was added as a reducing agent. The resin structure whose surface was activated with a laser was immersed in the plating solution for 4 to 5 hours, and then washed with distilled water.

 The resin structure irradiated with the laser power of 7 W formed a good conductive pattern (copper metal) on the surface of the adhesively active surface containing the metal nucleus through Cu-electroless plating. Example 2

A resin structure having a conductive pattern was formed in the same manner as in Example 1 except that 5 wt% of Ti0 ₂ was further added as a pigment to the composition for forming a conductive pattern of Example 1. In Example 2, a resin structure of a lighter color than in Example 1 is formed, and similarly to Example 1, a good conductive pattern (copper Metal layer) was formed. Example 3

CuO; Ζηθ; And Q.sZr.si ^ Os having a triclinic structure were synthesized through a solid phase reaction method in which the mixed mixture of (NH ₄ ) ₂ HP0 ₄ at a molar ratio of 1.5: 1.5: 2 was heat treated at 95 CTC for 10 hours. An XRD (X-ray Diffraction) pattern showing crystal characteristics is shown in FIG. 5. As shown in FIG. 5, Ci. SZ .sP ^ has three vectors of the unit cells and their angles changed due to the substitution of Zn, but the peak shift is observed. XRD is similar to the XRD pattern of Cu ₃ P ₂ 0 ₈ . Looks pattern. It is confirmed from the XRD pattern that Ci.sZnuPsOs also has a ^ri space group of triclinic structure.

A resin structure in which a conductive pattern was formed in the same manner as in Example 1, except that CuuZ .s Os was used instead of Cu ₃ P ₂ O ₈ as the non-conductive metal compound in Example 1. Comparative Example 1

Except for using the non-conductive metal compound in Cu ₂ P ₂ 0 ₈ instead of Sb doped Sn0 ₂ coated with mica in Example 2, to prepare a composition for forming a conductive pattern in the same manner as in Example 2, using To prepare an injection molded specimen under the same conditions as in Example 2.

 However, even when the injection molded specimen was irradiated with the laser under the same condition as in Example 2, the metal core or the adhesive active surface was not well formed in the area exposed to the laser. As a result, the adhesion of the conductive pattern formed through the Cu-electroless plating was not good.

As shown in FIG. 6, the absorbance of Sb doped Sn¾ coated on the mica used in Comparative Example 1 was lower than that of Cu ₃ P ₂ 0 ₈ used in Examples 1 and 2, and in Comparative Example 1, it was more easily compared to Example. It is expected that no adhesively active surface is formed.

Accordingly, the surface of the injection molded specimen by irradiating a laser of 13W It was activated and electroless plating process was performed similarly to Example 1. From these results, it is confirmed that, in the case of the non-conductive metal compound according to the embodiment of the present invention having high absorbance, the formation of a metal core or an adhesive active surface including copper metal or copper ions is effective even at low laser irradiation power. Comparative Example 2

A resin structure in which a conductive pattern was formed in the same manner as in Example 1, except that Cu ₂ (0H) P0 ₄ was used instead of Cu ₃ P ₂ 0 ₈ as the non-conductive metal compound in Example 1. Test Example

 In order to confirm whether the non-conductive metal compound used in Examples and Comparative Examples affects the stability of the polymer resin, the melt index of the polycarbonate resin substrate to which the non-conductive metal compound is not added and prepared in Examples and Comparative Examples The melt index of one resin structure was compared.

Specifically, the melt index (MI: mel t index) was measured under a temperature of 300 ^° C. and a load of 2.16 kg according to ASTM D1238.

 Table 1

Referring to Table 1, the resin structure of Example 1 exhibited a melt index very close to the melt index of the polycarbonate resin substrate to which the non-conductive metal compound was not added. Thereby, it is confirmed that the nonelectroconductive metal compound used in Example 1 does not cause denaturation of a polymer resin. Accordingly, in Example 1, it is confirmed that a resin structure having excellent thermal stability can be provided using another non-conductive metal compound in one embodiment of the present invention. On the other hand, the resin structures of Comparative Examples 1 and 2 exhibited a very high melt index compared to the polycarbonate resin substrate without the addition of the non-conductive metal compound. In other words, Sb doped Sn0 ₂ coated on mi ca used in Comparative Example 1 and Cu ₂ (0H) P0 ₄ used in Comparative Example 2 resulted in the denaturation of the resin, and thus exhibited poor thermal stability when the resin structure was prepared using them. This is confirmed.

Claims

Claims Claim 1 Polymeric resins; And a non-conductive metal compound including a compound represented by the following Chemical Formula 1, and a composition for forming a conductive pattern by electromagnetic wave irradiation wherein a metal nucleus is formed from the non-conductive metal compound by electromagnetic wave irradiation:

 [Formula 1]

 In Chemical Formula 1,

 M is one selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt, Mg, Ca, Sr and Au The metal is the above, and x is a ratio of 0 or more and less than 3.

[Claim 2]

The composition for forming a conductive pattern of claim 1, wherein the non-conductive metal compound has a triclinic structure and belongs to a ^P1 space group.

[Claim 3]

The method of claim 1, wherein the non-conductive metal compound is Cu0 ₄ or

M0 ₄ ; Cu0 ₅ or M0 ₅ of trigonal bipyramid; And a composition for forming a conductive pattern by electromagnetic wave irradiation having a three-dimensional structure in which tetrahedron P0 ₄ is three-dimensionally connected while sharing oxygen.

[Claim 4] ^"

 The composition of claim 1, wherein the polymer resin comprises a thermosetting resin or a thermoplastic resin.

[Claim 5] The method of claim 4, wherein the polymer resin is conductive pattern formation by electromagnetic wave radiation containing one or more selected from the group consisting of ABS resin, polyalkylene terephthalate resin, polycarbonate resin, polypropylene resin and polyphthalamide resin Composition.

[Claim 6]

 The composition of claim 1, wherein the nonconductive metal compound is present in an amount of 0.1 to 15 wt% based on the total composition.

[Claim 7]

 The conductive pattern is formed by electromagnetic radiation according to claim 1, further comprising at least one additive selected from the group consisting of flame retardants, heat stabilizers, UV stabilizers, lubricants, antioxidants, inorganic fillers, color additives, layer reinforcing agents and functional reinforcing agents. Composition.

[Claim 8]

A polymer resin substrate; _¾

It is dispersed in a polymer resin base ^material, and, to a non-conductive metal compounds, including compounds represented by formula (1);

 An adhesive active surface comprising a metal nucleus exposed to the surface of the polymer resin substrate in a predetermined region; And

 Resin structure having a conductive pattern comprising a conductive metal layer formed on the adhesive active surface:

 [Formula 1]

Cu _3-具 P ₂ 0 ₈

 In Chemical Formula 1,

M is one selected from the group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Y, Zn, Nb, Mo, Tc, Pd, Ag, Ta, W, Pt, Mg, Ca, Sr and Au The metal is the above, and x is a ratio of more than 0 to less than 3 [Claim 9]

 The resin structure according to claim 8, wherein the predetermined region on which the adhesion-active surface and the conductive metal layer are formed has a conductive pattern on the region of the polymer resin substrate to which electromagnetic waves are irradiated.