WO2016020392A3 - Sandwich of electric conductor, carbon comprising adhesion promoter and electrically insulating thermal conductor - Google Patents

Sandwich of electric conductor, carbon comprising adhesion promoter and electrically insulating thermal conductor Download PDF

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Publication number
WO2016020392A3
WO2016020392A3 PCT/EP2015/067973 EP2015067973W WO2016020392A3 WO 2016020392 A3 WO2016020392 A3 WO 2016020392A3 EP 2015067973 W EP2015067973 W EP 2015067973W WO 2016020392 A3 WO2016020392 A3 WO 2016020392A3
Authority
WO
WIPO (PCT)
Prior art keywords
carbon
electrically insulating
sandwich
conductor
adhesion promoter
Prior art date
Application number
PCT/EP2015/067973
Other languages
French (fr)
Other versions
WO2016020392A2 (en
Inventor
Elisabeth KREUTZWIESNER
Gernot SCHULZ
Original Assignee
At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At & S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At & S Austria Technologie & Systemtechnik Aktiengesellschaft
Publication of WO2016020392A2 publication Critical patent/WO2016020392A2/en
Publication of WO2016020392A3 publication Critical patent/WO2016020392A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Mounting device (100) for mounting electronic components, wherein the mounting device (100) comprises an electrically conductive structure (102), an adhesion promoting structure (104), which comprises carbon,on the electrically conductive structure (102), and a thermally conductive and electrically insulating structure (106) on the adhesion promoting structure (104).
PCT/EP2015/067973 2014-08-05 2015-08-04 Sandwich of electric conductor, carbon comprising adhesion promoter and electrically insulating thermal conductor WO2016020392A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014111135.4 2014-08-05
DE102014111135 2014-08-05

Publications (2)

Publication Number Publication Date
WO2016020392A2 WO2016020392A2 (en) 2016-02-11
WO2016020392A3 true WO2016020392A3 (en) 2016-04-14

Family

ID=53783230

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/067973 WO2016020392A2 (en) 2014-08-05 2015-08-04 Sandwich of electric conductor, carbon comprising adhesion promoter and electrically insulating thermal conductor

Country Status (1)

Country Link
WO (1) WO2016020392A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853888A (en) * 1997-04-25 1998-12-29 The United States Of America As Represented By The Secretary Of The Navy Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging
WO2001031082A1 (en) * 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components
US20110149521A1 (en) * 2009-12-23 2011-06-23 Industrial Technology Research Institute Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same
US20120288698A1 (en) * 2011-03-23 2012-11-15 Advanced Diamond Technology, Inc Method of fabrication, device structure and submount comprising diamond on metal substrate for thermal dissipation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5853888A (en) * 1997-04-25 1998-12-29 The United States Of America As Represented By The Secretary Of The Navy Surface modification of synthetic diamond for producing adherent thick and thin film metallizations for electronic packaging
WO2001031082A1 (en) * 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components
US20110149521A1 (en) * 2009-12-23 2011-06-23 Industrial Technology Research Institute Thermally conductive, electrically insulating composite film and stack chip package structure utilizing the same
US20120288698A1 (en) * 2011-03-23 2012-11-15 Advanced Diamond Technology, Inc Method of fabrication, device structure and submount comprising diamond on metal substrate for thermal dissipation

Also Published As

Publication number Publication date
WO2016020392A2 (en) 2016-02-11

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