WO2016013762A1

WO2016013762A1 - Apparatus and method for encapsulating flexible display substrate

Info

Publication number: WO2016013762A1
Application number: PCT/KR2015/006017
Authority: WO
Inventors: 이승광; 조창현; 김영준
Original assignee: 이에스엠주식회사
Priority date: 2014-07-23
Filing date: 2015-06-15
Publication date: 2016-01-28
Also published as: CN106537635B; KR101455117B1; CN106537635A

Abstract

An apparatus and a method for encapsulating a flexible display substrate are disclosed. The apparatus for encapsulating a flexible display substrate comprises: a jig on which a flexible substrate is to be placed; a first spray unit for spraying an inorganic material at the surface of the flexible substrate; a second spray unit for spraying an organic material at the surface of the flexible substrate; an ion beam generation unit for emitting an ion beam, generated by accelerating ions, at the surface of the flexible substrate at which the inorganic material and the organic material are sprayed; and a differential vacuum chamber for differently setting a vacuum degree of the ion beam generation unit and a vacuum degree of a space in which the first spray unit, the second spray unit, and the jig are formed. The ion beam generation unit can generate the ion beam having ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is put into the surface of the flexible substrate with the inorganic material and organic material to be sprayed.

Description

[Correction 14.08.2015 by Rule 26] 장치 Encapsulation Processing Apparatus and Method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for encapsulation of a flexible display substrate, and more particularly, to an organic, inorganic and ions encapsulated inside a surface of a substrate, thereby improving the performance of the flexible display substrate while maintaining the flexibility of the flexible substrate. A processing apparatus and method.

In general, organic light emitting diodes (OLEDs) have high visibility for self-luminous and do not require back light, which is essential for liquid crystal displays (LCDs), and therefore are optimal for reducing the thickness of the light emitting device. to be. Moreover, OLED's unlimited viewing angle offers additional advantages. Because of these advantages, light emitting devices using OLEDs are attracting attention as display devices replacing CRTs or LCDs.

OLEDs include an organic light emitting layer containing an organic compound (organic light emitting material), an anode and a cathode. The organic light emitting layer causes light emission (electroluminescence) by applying an electric field across the anode and the cathode.

Such light emitting devices are expected to be used in a variety of applications. In particular, such light emitting devices are desirable for application in portable equipment because of their thin thickness and hence the potential for weight reduction. For this purpose, attempts have been made to form OLEDs on substrates, such as flexible plastic films. Thus, the formation of OLED on a substrate is desirable not only in thin thickness and light weight, but also in its usefulness for displays with curved surfaces, show windows and the like. Thus, its application range is extremely wide and is not limited to portable equipment.

However, substrates made of plastic or the like are generally susceptible to moisture or oxygen passing through, and since the deterioration of the organic light emitting layer is accelerated by moisture and oxygen, the lifetime of the light emitting device tends to be shortened by the penetration of moisture or oxygen. . In order to solve this problem, the surface of the substrate is coated by various methods such as a wet coating sol-gel method, dry coating plasma chemical vapor deposition (PECVD), sputtering, evaporation. However, the sol-gel method has a problem such as environmental pollution, solvent recovery problems, long drying line due to the use of a solvent, the situation is mainly developed a dry method.

In general, the plastic film and the inorganic thin film to be coated have a large elastic modulus of the material itself, so that various mechanical motions such as bending, stretching, twisting, etc. during the coating process of the plastic film or the use of the product and Thermal expansion and contraction according to the difference in thermal expansion coefficient are subjected to a large stress at the interface between the plastic film and the inorganic thin film having a large elastic modulus difference, which causes the inorganic thin film to peel off from the surface of the plastic film.

In addition, the flexible display substrate structure currently has a barrier coating on both sides of the substrate (for example, a polymer film), and prevents heat penetration and gas penetration such as moisture and oxygen while maintaining flexibility of the substrate. shall. Current barrier coatings alternately deposit organic and inorganic materials in order to block oxygen and hydrogen exposure while maintaining the flexibility of the film.However, in the case of simply stacking inorganic and organic materials alternately, the film is rolled up repeatedly. When the crack occurs in the coating layer (crack) there was a problem that can not function as a flexible display.

SUMMARY OF THE INVENTION An object of the present invention is to provide an encapsulation processing apparatus for a flexible display substrate in which an organic material, an inorganic material, and ions are injected into a surface of a flexible substrate to substitute or bond with atoms of a substrate surface, thereby improving performance while maintaining flexibility of the flexible substrate. To provide.

Another problem to be solved by the present invention is a method of encapsulating a flexible display substrate in which an organic material, an inorganic material and ions are injected into a surface of a flexible substrate to be substituted or combined with a substrate surface atom to improve performance while maintaining flexibility of the flexible substrate. To provide.

According to an aspect of the present invention, there is provided an apparatus for encapsulating a flexible display substrate. The apparatus for encapsulating a flexible display substrate includes: a jig in which a flexible substrate is mounted; a first spraying part for spraying inorganic materials onto a surface of the flexible substrate; A second injection unit for spraying the surface of the ion beam, an ion beam generation unit for irradiating the ion beam generated by accelerating ions to the surface of the flexible substrate on which the inorganic and organic materials are sprayed, and a vacuum degree of the ion beam generation unit, and the first injection unit, the It may be provided with a differential vacuum chamber for differently setting the degree of vacuum of the second injection portion and the space in which the jig is formed. The ion beam generator may generate the ion beam having ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is injected into the surface of the flexible substrate together with the sprayed inorganic material and organic material.

The differential vacuum chamber is connected to a first vacuum pump, a vacuum part in which the first injection part, the second injection part and the jig are formed, and a second vacuum pump is connected to the inside of the ion beam generation part. A differential vacuum unit connected to an inside and a diameter different from the vacuum unit and the differential vacuum unit may be provided, and a connection part connecting the inside of the vacuum unit and the differential vacuum unit may be provided.

The difference between the first vacuum degree and the second vacuum degree may be determined by at least one of suction force of each of the vacuum pumps, diameter of the connection part, length of the connection part, and volume of the differential vacuum part.

The ion beam generation unit, an atom separation unit for separating atoms from a reference material, an ionization unit for passing the ionized separated ion through the heated filament and then transferred to the acceleration electrode and a voltage between the first voltage and the second voltage is applied An ion accelerator may be provided to pass the ions through the accelerating electrode to generate an ion beam having ion beam energy between the first threshold value and the second threshold value.

The jig may control a direction in which the surface of the flexible substrate to which the inorganic material, the organic material, and the ions are directed is directed.

According to another aspect of the present invention, there is provided an apparatus for encapsulating a flexible display substrate. The apparatus for encapsulating a flexible display substrate may include: a jig, an inorganic material, or an organic material on which the flexible substrate is mounted; A differential vacuum chamber for setting the vacuum degree of the ion beam generating unit and the ion beam generating unit for irradiating the generated ion beam to the surface of the flexible substrate to which the inorganic or organic material is sprayed and the degree of vacuum of the space in which the spraying unit and the jig are formed It can be provided. The ion beam generator may generate the ion beam having an ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is injected into the surface of the flexible substrate together with the sprayed inorganic or organic material.

According to another aspect of the present invention, there is provided a method of encapsulating a flexible display substrate, the method comprising: spraying an inorganic material onto a surface of a flexible substrate, spraying an organic material on a surface of the flexible substrate, and an ion beam Accelerating ions to be implanted into a surface of the flexible substrate to generate the ion beam having ion beam energy between a first threshold value and a second threshold value, the vacuum degree of the space for generating the ion beam using a differential vacuum chamber, and Setting different degrees of vacuum of the space where the organic material, the inorganic material and the ion beam are provided to the surface of the flexible substrate, and irradiating the generated ion beam to the surface of the substrate to which the inorganic material and the organic material are sprayed, thereby spraying the ion beam with the inorganic material. And inside the surface of the flexible substrate together with the organic material. It may comprise.

The generating of the ion beam may include separating an atom from a reference material, ionizing the separated atom through a heated filament, and applying an ion to an acceleration electrode to which a voltage between a first voltage and a second voltage is applied. Passing through may generate an ion beam having ion beam energy between the first threshold value and the second threshold value.

According to an embodiment of the inventive concept, an apparatus and method for encapsulating a flexible display substrate may be formed by simultaneously injecting organic materials, inorganic materials, and ions into the flexible substrate without using a conventional simple adsorption and multilayer coating method. Can be treated to change mechanical, electrical and optical properties, improve hardness, abrasion resistance, corrosion resistance, fatigue resistance and maintain transparency while preventing antibacterial, moisture and gas permeation, antistatic, UV / IR, and electromagnetic shielding There is an advantage that can display various characteristics at the same time. In the case of treating the flexible substrate by the above method, it is possible to fundamentally solve the problem of cracking on the surface deposited on the conventional substrate, thereby easily manufacturing the flexible substrate, and using a simple process without chemical treatment. It can reduce the cost by improving the quality and yield of the product, there is an advantage that does not cause environmental problems because waste water and dust does not occur.

In addition, the conventional sputter process requires several times of chemical pretreatment cleaning of the surface of the material before the process and requires a device for raising and cooling the temperature of the material to form a film during the process. It can be cleaned and deposited at low temperatures due to the impact of the ion beam, eliminating the need to raise or cool the material. Therefore, when the present invention is used, the chemical pretreatment washing process and the temperature control process are unnecessary, so that the process time can be shortened, and the density and adhesion of the film and the refractive index of the coating layer are superior to the existing deposition process.

In the flexible substrate treated using the present invention, inorganic, organic and ions are injected into the surface of the film to change the characteristics of the substrate itself. Therefore, when the inorganic and organic materials are simply laminated, the film is cracked in the coating layer. It is possible to fundamentally solve the problem of (crack), does not occur peeling phenomenon between the inorganic thin film and the film surface, which is a conventional problem, high gas permeability and high gas blocking degree to block the penetration of gas such as moisture and oxygen There are advantages to it.

In addition, in the case of using the apparatus for encapsulating the flexible display substrate according to another exemplary embodiment of the inventive concept, when only inorganic or organic matter is injected into the flexible substrate together with ions to obtain a desired effect, an inorganic material may be obtained. Alternatively, by injecting only organic material together with ions into the flexible substrate, the above-described effects may be obtained while simplifying the process.

BRIEF DESCRIPTION OF THE DRAWINGS In order to better understand the drawings cited in the detailed description of the invention, a brief description of each drawing is provided.

1 is a conceptual diagram of an encapsulation processing apparatus of a flexible display substrate according to an exemplary embodiment of the inventive concept.

FIG. 2 is a diagram illustrating an embodiment of an encapsulation processing apparatus of the flexible display substrate of FIG. 1.

FIG. 3 is a flowchart of a method of processing the flexible substrate using the apparatus for encapsulating the flexible display substrate of FIG. 1.

4 is a view illustrating a flexible substrate before inorganic, organic and ions are implanted.

FIG. 5 is a view illustrating a flexible substrate in which inorganic material, organic material and ions are implanted.

6 is a block diagram of an encapsulation processing apparatus of a flexible display substrate according to another exemplary embodiment of the inventive concept.

FIG. 7 is a view illustrating a flexible substrate before an inorganic material or an organic material and ions are implanted.

FIG. 8 illustrates a flexible substrate in which an inorganic material or an organic material and ions are implanted.

DETAILED DESCRIPTION In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the drawings.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a conceptual diagram of an encapsulation processing apparatus 100 of a flexible display substrate according to an embodiment of the inventive concept, and FIG. 2 illustrates an embodiment of the encapsulation processing apparatus 100 of the flexible display substrate of FIG. 1. Figure is shown.

1 and 2, the encapsulation processing apparatus 100 of the flexible display substrate may include an ion beam generation unit 110, a first injection unit 120, a second injection unit 130, a differential vacuum chamber 160, and A jig 140 on which the flexible substrate 170 is mounted may be provided. The flexible substrate 170 may be a polymer film, and may be, for example, plastic such as polyimide, or fiber reinforced plastic (FRP). However, the flexible substrate 170 is not limited to the above case and may be other various materials having flexibility.

The first sprayer 120 may spray the inorganic material onto the surface of the flexible substrate 170, and the second sprayer 130 may spray the organic material onto the surface of the flexible substrate 170. In the present invention, the inorganic and organic materials are sprayed in order to encapsulate the flexible substrate 170. However, the first sprayer 120 and the second sprayer 130 may have different materials. You can also spray.

The ion beam generator 110 may generate an ion beam by accelerating ions, and irradiate the generated ion beam onto the surface of the flexible substrate 170 to which the inorganic material and the organic material are sprayed. More specifically, the ion beam generation unit 110 has an ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is injected into the surface of the flexible substrate 170 together with the sprayed inorganic and organic materials. The ion beam may be generated. The first threshold may be a value corresponding to the minimum ion beam energy capable of injecting the ion beam into the flexible substrate 170, and the second threshold may be the maximum such that the ion beam does not penetrate the flexible substrate 170. It may be a value corresponding to the ion beam energy of. The first threshold value and the second threshold value may have different values depending on the type of the flexible substrate 170.

The ion beam generation unit 110 may include an atomic separation unit 111, an ionization unit 115, and an ion acceleration unit 117. The atomic separation unit 111 may separate atoms from the reference material 113, for example, may use a sputtering process. For example, when a voltage is applied to the reference material 113, atoms are ejected from the reference material 113, and the atom may be separated from the reference material 113 by using such a method. The reference material 113 may be a metal, but the present invention is not limited thereto, and various materials may be selected according to characteristics of the flexible substrate 170 to be changed. For example, the metal may be selected as the reference material 113 to improve the function of blocking infrared rays and radiation, and silver or aluminum may be selected as the reference material 113 to increase the reflectance.

The ionization unit 115 may ionize the separated atoms. For example, as illustrated in FIG. 2, the ionization unit 115 may ionize the separated atoms using the filament 210. For example, the ionizer 115 may ionize the separated atom through the heated filament 210 connected to a power source (POW). In addition, as illustrated in FIG. 2, the ionization unit 115 may further include an arc electrode 220. As shown in FIG. 2, a power supply (POW) to the arc electrode 220 formed to surround the filament 210. May be applied to increase the degree of ionization. 2 is a cross-sectional view briefly showing an embodiment of the ionization unit 115, the filament 210 and the arc electrode 220 may be a hollow cylinder, the separated atoms pass through the interior of the cylinder Can be ionized.

The ion accelerator 117 may generate an ion beam having ion beam energy between the first threshold value and the second threshold value by passing ions transferred from the ionizer 115. For example, the ion accelerator 117 may include

acceleration electrodes

230 and 240, as shown in FIG. 2, and the

acceleration electrodes

230 and 240 may include a voltage between the first voltage and the second voltage. An ion beam having ion beam energy between the first threshold value and the second threshold value may be generated while V) is applied and ions transferred from the ionizer 115 pass through the

acceleration electrodes

230 and 240. For example, as shown in FIG. 2, the

acceleration electrodes

230 and 240 are electrodes 240 to which ground is connected, and electrodes 230 to which a voltage V between the first voltage and the second voltage is applied. It may include. The voltage V between the first voltage and the second voltage should be a voltage capable of accelerating the ions so that the ions can have ion beam energy that can be implanted into the flexible substrate 170. For example, the first voltage may be 500 [V] and the second voltage may be 5000 [V]. However, the first voltage and the second voltage of the present invention are not necessarily the same, and may have different voltages depending on the type of the flexible substrate 170 or the degree of desired ion beam energy.

As such, the ion beam generated by the ion beam generator 110 may be injected into the surface of the flexible substrate 170 together with the inorganic and organic substances that are irradiated onto the surface of the flexible substrate 170 and sprayed onto the surface of the flexible substrate 170. have. The flexible substrate 170 may be mounted on the jig 140, and the jig 140 may adjust the direction in which the surface of the flexible substrate 170 into which the inorganic material, the organic material, and the ions are injected is directed. have. For example, in FIG. 2, the jig 140 is adjusted such that the surface of the flexible substrate 170 faces the direction of the second injector 130 more, but the present invention is not limited thereto. The surface of the flexible substrate 170 may be oriented in various directions by adjusting. In addition, the jig 140 forms rollers on both sides of the flexible substrate 170 on which the flexible substrate 170 is mounted, and rotates the roller in one direction to wind the flexible substrate 170 on the flexible substrate 170. Minerals, organics and ions can be implanted.

The differential vacuum chamber 160 may include a vacuum of the ion beam generating unit 110, which is a space in which the ion beam is generated, and a first injection unit 120, which is a space in which the organic material, the inorganic material, and the ion beam are provided on the surface of the flexible substrate 170. ), The vacuum degree of the space in which the second injection unit 130 and the jig 140 are formed may be set differently. For example, the differential vacuum chamber 160 may include a vacuum part 161, a connection part 165, and a differential vacuum part 167, as shown in FIGS. 1 and 2. The vacuum unit 161 may be connected to the first vacuum pump 150_1, and the first injection unit 120, the second injection unit 130, and the jig 140 may be formed therein. The differential vacuum unit 167 may be connected to the second vacuum pump 150_2, and may be connected to the ion beam generation unit 110. The connection part 165 may be different in diameter from the vacuum part 161 and the differential vacuum part 167, and may connect the inside of the vacuum part 161 and the inside of the differential vacuum part 167.

The vacuum inside the vacuum unit 161 and the vacuum inside the ion beam generation unit 110 may be set differently using the differential vacuum chamber 160 having such a structure. If the vacuum unit 161 connected to the vacuum pump without the differential vacuum unit 167 and the connection unit 165 is connected to the ion beam generating unit 110 as it is, the inside of the ion beam generating unit 110 and the vacuum unit 161 are used. The degree of vacuum inside is inevitably the same. However, as shown in the embodiment of the present invention, between the vacuum unit 161 and the ion beam generation unit 110, the connection unit 165 having a different diameter from the vacuum unit 161 is provided, and the second vacuum pump 150_2 and the connection unit are provided. By using the differential vacuum chamber 160 having the differential vacuum unit 167 connected between the 165 and the ion beam generating unit 110, the interior of the vacuum unit 161 and the inside of the ion beam generating unit 110 It can have different degrees of vacuum. For example, as shown in FIGS. 1 and 2, the vacuum unit 161 has a larger volume than the ion beam generating unit 110, and the diameter of the connection unit 165 is the vacuum unit 161 and the differential vacuum unit 167. May be less than). However, the differential vacuum chamber 160 of the present invention does not necessarily have to be formed as shown in FIGS. 1 and 2, and may adjust the degree of vacuum by adjusting size and position as necessary.

The difference between the vacuum degree of the ion beam generating unit 110 and the vacuum degree of the vacuum unit 161 is the suction force of each of the first and second vacuum pumps 150_1 and 150_2, the diameter of the connection unit 165, the length and the differential of the connection unit 165. It may be determined by at least one of the volume of the vacuum unit 167. For example, the difference in suction force between the first vacuum pump 150_1 and the second vacuum pump 150_2 may be reduced, the diameter of the connection part 165 may be increased, the length of the connection part may be shortened, or the volume of the differential vacuum part 167 may be reduced. In order to increase the difference between the vacuum degree of the ion beam generating unit 110 and the vacuum degree of the vacuum unit 161, the difference between the suction force of the first vacuum pump 150_1 and the second vacuum pump 150_2 or the connection portion is increased. The difference between the vacuum of the ion beam generating unit 110 and the vacuum of the vacuum unit 161 can be increased by decreasing the diameter of 165, increasing the length of the connecting unit, or decreasing the volume of the differential vacuum unit 167.

3 is a flowchart illustrating a method of processing the flexible substrate using the encapsulation processing apparatus 100 of the flexible display substrate of FIG. 1.

Hereinafter, a method of processing a flexible substrate will be described with reference to FIGS. 1 to 3. The first sprayer 120 may spray the inorganic material onto the surface of the flexible substrate 170 (S310), and the second sprayer 130 may spray the organic material onto the surface of the flexible substrate 170 (S320). ). The ionization generator 110 may accelerate the ions to generate an ion beam having ion beam energy between the first threshold value and the second threshold value (S330). The ionization unit 110 may generate an ion beam having ion beam energy that may be injected into the surface of the flexible substrate 170 by separating atoms from the reference material, ionizing the separated atoms, and then accelerating them. Since it was described in detail in Figures 1 and 2 duplicated description will be omitted.

In addition, the ionization unit 110 irradiates the generated ion beam to the surface of the flexible substrate 170 onto which the inorganic and organic materials are injected, where the ion beam has ion beam energy that can be injected into the flexible substrate 170. Injected into the surface of the flexible substrate 170 (S340). As such, the sprayed organic material and the inorganic material which are positioned outside the surface of the flexible substrate 170 in the process of injecting the ion beam from the outside of the surface of the flexible substrate 170 to the inside of the surface of the flexible substrate 170 together with the ion beam. To be injected into.

Through such a process, the inorganic material and the organic material are not simply deposited on the surface of the flexible substrate 170, but are injected into the inside of the flexible substrate 170 together with the ions to change the characteristics of the flexible substrate 170. The flexible substrate 170 may be formed. Steps S310 to S330 may not be performed sequentially, but may occur at the same time. As described with reference to FIGS. 1 and 2, the vacuum degree of the space for generating the ion beam and the organic, inorganic, and ion beams may be formed on the surface of the flexible substrate. The vacuum degree of the space provided by may be set differently. The method of setting the vacuum degree differently has been described in detail with reference to FIGS. 1 and 2, and thus redundant descriptions thereof will be omitted.

4 illustrates a flexible substrate 400 before inorganic, organic and ions are implanted, and FIG. 5 illustrates a flexible substrate 500 in which inorganic, organic and ions are implanted.

1 to 5, the flexible substrate 400 before the inorganic, organic and ions are implanted has a unique molecular structure, but according to the present invention, the inorganic 510, the organic 520, and the ions 530 are provided. When injected into the surface of the flexible substrate 400, an inorganic material 510, an organic material 520, and an ion 530 are formed between molecular structures inherent in the flexible substrate 500, such as the flexible substrate 500 of FIG. 5. ) Is injected to have a completely different structure. Therefore, when the flexible substrate is processed in this manner, unlike the case of alternately depositing organic and inorganic materials on the surface, no crack is generated and no separation occurs between the deposited film and the substrate. It is also possible to increase the effect of blocking gas penetration.

As shown in FIG. 5, an inorganic material, an organic material, and ions are injected into the surface of the substrate 500 using the encapsulation processing apparatus 100 of the flexible display substrate to form a mixed layer a, and then an inorganic material 510 on the surface. The coating layer (b) coated with a) may be formed. As described above, when the coating layer (b) is to be formed, the coating layer (b) may be formed of the inorganic material 510 by operating only the first injection unit 110.

In the above, the case where the inorganic substance, the organic substance, and the ion are inject | poured into the flexible substrate was demonstrated. However, in the case of using the apparatus and method for encapsulating the flexible display substrate according to the exemplary embodiment of the inventive concept, the inorganic substrate, the organic material, and the ions may not be injected together into the flexible substrate. Only one of the sprayer 120 and the second sprayer 130 may be operated to inject only one of the inorganic material and the organic material together with the ions. Alternatively, the ion beam energy of the ion beam may be adjusted to be equal to or less than the first threshold value, thereby depositing at least one of an inorganic material and an organic material on the surface of the substrate without injecting at least one of an inorganic material and an organic material into the inside of the substrate. That is, in the case of using the apparatus and method for encapsulating the flexible display substrate according to the exemplary embodiment of the inventive concept, as described above, at least one material of an inorganic material and an organic material may be formed inside the substrate by using an ion beam. In the present invention, at least one material of an inorganic material and an organic material may be deposited on the outside of the substrate using an ion beam as in the prior art.

6 is a conceptual diagram of an encapsulation processing apparatus 600 of a flexible display substrate according to another exemplary embodiment of the inventive concept.

1, 2, and 6, the encapsulation processing apparatus 600 of the flexible display substrate is mounted with an ion beam generation unit 610, an injection unit 620, a differential vacuum chamber 660, and a flexible substrate 670. The jig 640 and the plurality of vacuum pumps 650_1 and 650_2 may be provided. That is, the encapsulation processing apparatus 600 of the flexible display substrate of FIG. 6 relates to an apparatus for injecting an inorganic material or an organic material into the flexible substrate 670 together with an ion beam, except that one injection unit 620 is included. 1 and 2 are the same as the encapsulation processing apparatus 100 of the flexible display substrate. That is, the ion beam generation unit 610 of FIG. 6, the differential vacuum chamber 660, the jig 640 on which the flexible substrate 670 is mounted, and the plurality of vacuum pumps 650_1 and 650_2 are respectively formed in the ion beam generation unit of FIG. 1. 110, the differential vacuum chamber 160, the jig 140 on which the flexible substrate 170 is mounted, and the plurality of vacuum pumps 150_1 and 150_2 are similar to each other, and thus, specific operations and configurations thereof are related to FIGS. 1 to 5. Replace with a description. The injection unit 620 operates similarly to the first injection unit 120 of FIGS. 1 and 2 when injecting an inorganic material, and similarly to the second injection unit 130 of FIG. 1 when injecting an organic material. The description of the specific operation and configuration of the injection unit 620 is also replaced with the description related to FIGS. 1 to 5.

FIG. 7 is a view illustrating the flexible substrate 700 before the inorganic or organic material and the ions are implanted, and FIG. 8 is a view illustrating the flexible substrate 800 where the inorganic or organic material and the ions are implanted.

1 to 8, the flexible substrate 700 has a unique molecular structure before the inorganic or organic material and the ions are injected, but the first and

second injection units

120 and 130 of FIG. Only one of the 810 inorganic or organic material is injected into the flexible substrate 800 together with the ions 820, or the injection unit 620 of FIG. 6 is operated so that the 810 inorganic or organic material is mixed with the ions 820. 600, the coating layer may be formed of an inorganic material or an organic material on the surface of the flexible substrate 800 as described with reference to FIG. 5.

As described above, optimal embodiments have been disclosed in the drawings and the specification. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not intended to limit the scope of the invention as defined in the claims or the claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims

A jig in which the flexible substrate is mounted;

A first spraying unit spraying an inorganic material onto a surface of the flexible substrate;

A second spraying unit spraying an organic material on a surface of the flexible substrate;

An ion beam generation unit for irradiating an ion beam generated by accelerating ions onto a surface of the flexible substrate on which the inorganic material and the organic material are injected; And

And a differential vacuum chamber for differently setting a vacuum degree of the ion beam generation unit and a vacuum degree of a space in which the first injection unit, the second injection unit, and the jig are formed.

The ion beam generation unit,

Generating the ion beam having ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is injected into the surface of the flexible substrate together with the sprayed inorganic and organic materials. Bag processing device.
The method of claim 1, wherein the differential vacuum chamber,

A vacuum part connected to a first vacuum pump and having the first injection part, the second injection part, and the jig formed therein;

A differential vacuum part connected to a second vacuum pump and connected to an inside of the ion beam generation part; And

And a connecting portion connecting the inside of the vacuum portion to the inside of the differential vacuum portion, the diameter being different from the vacuum portion and the differential vacuum portion.
The method of claim 2,

The difference between the first vacuum degree and the second vacuum degree,

And a suction force of each of the vacuum pumps, a diameter of the connection part, a length of the connection part, and a volume of the differential vacuum part.
The method of claim 1, wherein the ion beam generating unit,

An atomic separation unit for separating atoms from the reference material;

An ionization unit passing the separated atoms through a heated filament and ionizing them, and then transferring the separated atoms to an acceleration electrode; And

And an ion accelerator for generating an ion beam having ion beam energy between the first threshold value and the second threshold value by passing the ions through the acceleration electrode to which the voltage between the first voltage and the second voltage is applied. An apparatus for sealing a flexible display substrate.
The method of claim 4, wherein

And the first voltage is 500 [V] and the second voltage is 5000 [V].
The method of claim 4, wherein the atomic separation unit,

An apparatus for treating a flexible display substrate, the method comprising: separating a metal ion from a metal material as the reference material using a sputtering process.
The method of claim 1, wherein the jig,

The apparatus for processing a sealing of a flexible display substrate, wherein the direction of the surface of the flexible substrate into which the inorganic material, the organic material, and the ions are directed can be adjusted.
Spraying an inorganic material onto the surface of the flexible substrate;

Spraying an organic material on a surface of the flexible substrate;

Accelerating ions such that an ion beam is implanted into a surface of the flexible substrate to produce the ion beam having ion beam energy between a first threshold value and a second threshold value;

Setting a vacuum degree of a space in which the ion beam is generated using a differential vacuum chamber and a vacuum degree of a space in which the organic material, the inorganic material, and the ion beam are provided to the surface of the flexible substrate; And

And irradiating the generated ion beam onto a surface of the substrate to which the inorganic and organic materials are injected, and injecting the ion beam into the surface of the flexible substrate together with the inorganic and organic materials to be sprayed. Bag disposal method.
The method of claim 8, wherein the generating of the ion beam comprises:

Separating atoms from the reference material;

Ionizing the separated atoms through a heated filament;

Passing the ions through an acceleration electrode to which a voltage between a first voltage and a second voltage is applied to produce an ion beam having ion beam energy between the first threshold value and the second threshold value. Encapsulation processing method of a flexible display substrate.
A jig in which the flexible substrate is mounted;

An injection unit spraying an inorganic material or an organic material onto a surface of the flexible substrate;

An ion beam generation unit for irradiating an ion beam generated by accelerating ions onto a surface of the flexible substrate on which the inorganic or organic material is injected; And

And a differential vacuum chamber for differently setting the vacuum degree of the ion beam generation unit and the vacuum degree of the space in which the injection unit and the jig are formed.

The ion beam generation unit,

Generating the ion beam having ion beam energy between a first threshold value and a second threshold value such that the accelerated ion beam is injected into the surface of the flexible substrate together with the sprayed inorganic or organic material. Bag processing device.
The method of claim 10, wherein the differential vacuum chamber,

A vacuum unit connected to a first vacuum pump and having the injection unit and the jig formed therein;

A differential vacuum part connected to a second vacuum pump and connected to an inside of the ion beam generation part; And

And a connecting portion connecting the inside of the vacuum portion to the inside of the differential vacuum portion, the diameter being different from the vacuum portion and the differential vacuum portion.
The method of claim 11,

The difference between the first vacuum degree and the second vacuum degree,

And a suction force of each of the vacuum pumps, a diameter of the connection part, a length of the connection part, and a volume of the differential vacuum part.
The method of claim 10, wherein the ion beam generating unit,

An atomic separation unit for separating atoms from the reference material;

An ionization unit passing the separated atoms through a heated filament and ionizing them, and then transferring the separated atoms to an acceleration electrode; And

And an ion accelerator for generating an ion beam having ion beam energy between the first threshold value and the second threshold value by passing the ions through the acceleration electrode to which the voltage between the first voltage and the second voltage is applied. An apparatus for sealing a flexible display substrate.