WO2016001992A1

WO2016001992A1 - Device for bonding thin board-like member and method for bonding thin board-like member

Info

Publication number: WO2016001992A1
Application number: PCT/JP2014/067446
Authority: WO
Inventors: 直之森宮; 村田　等; 庸男歳桃; 宏和田林; 尚樹岡本; 直哉吉田; 西村　公男
Original assignee: 日産自動車株式会社
Priority date: 2014-06-30
Filing date: 2014-06-30
Publication date: 2016-01-07
Also published as: JPWO2016001992A1; JP6187695B2

Abstract

Provided is a device for bonding thin board-like members, said device being capable of eliminating a bonding failure at the time of annularly bonding the thin board-like members to each other by laminating the thin board-like members. A device (100) for bonding thin board-like members has a holding section (110) and a bonding section (120). The holding section holds one thin-board like member and other thin board-like member in a laminated state. The bonding section bonds to each other at least an annular bonding portion that is provided to the one thin board-like member, and an annular bonding portion that is provided to the other thin board-like member. The holding section is provided with a first holding section and a second holding section. The first holding section holds, in the lamination direction, a first end section of the one thin board-like member, said first end section being positioned along the bonding portion of the one thin board-like member, and a first end section of the other thin board-like member, said first end section being positioned along the bonding portion of the other thin board-like member. The second holding section sandwiches and holds, in the lamination direction, a second end section of the one thin board-like member, said second end section being positioned further toward the inside than the first end section of the one thin board-like member, and a second end section of the other thin board-like member, said second end section being positioned further toward the inside than the first end section of the other thin board-like member.

Description

Thin plate-like member joining apparatus and thin plate-like member joining method

The present invention relates to a thin plate member joining apparatus and a thin plate member joining method.

Conventionally, there is a technique for joining thin plate-like members such as plates with distortion and warpage by welding. In particular, there is a technique for continuously joining such thin plate-like members in an annular shape without a joint (see, for example, Patent Document 1).

JP 2011-161450 A

However, in the configuration as described in Patent Document 1, when the thin plate-like members are stacked and joined to each other in an annular shape, the members cannot always be sufficiently retained. If the thin plate-like substrate cannot be sufficiently held, there is a possibility that poor bonding occurs when the thin plate-like members are joined.

The present invention has been made in order to solve the above-described problems, and a thin plate-like member joining method capable of preventing poor joining when thin plate-like members are stacked and joined in an annular shape, and the joining thereof. It is an object of the present invention to provide a thin plate member joining apparatus embodying the method.

The thin plate-like member joining apparatus according to the present invention that achieves the above object has a holding part and a joining part. The holding unit holds one thin plate member and another thin plate member in a stacked state. The joining portion joins at least an annular joining portion provided in one thin plate member and an annular joining portion provided in another thin plate member. Here, the holding unit includes a first holding unit and a second holding unit. A 1st holding part hold | maintains the 1st end part located along the junction part of one thin plate-shaped member, and the 1st end part located along the junction part of another thin plate-shaped member along a lamination direction. To do. The second holding portion includes a second end portion located inward of the first end portion of one thin plate-like member and a second end portion located inward of the first end portion of the other thin plate-like member. Are held in the stacking direction.

The thin film-like member joining method according to the present invention that achieves the above object includes a holding step and a joining step. The holding step includes a first end located along an annular joint portion provided in one thin plate-like member and a first end located along an annular joint portion provided in another thin plate-like member. Hold along the stacking direction. In addition, the holding step includes a second end portion located inward of the first end portion of one thin plate-like member and a second end portion located inward of the first end portion of the other thin plate-like member. Are held in the stacking direction. In the joining step, at least a joining portion of one thin plate member and a joining portion of another thin plate member are joined to each other.

It is a perspective view which shows the joining apparatus of the thin plate-shaped member which concerns on 1st Embodiment. It is an end view which shows typically a part of joining apparatus of FIG. It is an end elevation which shows the state which mounted the metal separator unit in the holding | maintenance part of the joining apparatus of FIG. 1 and FIG. FIG. 4 is an end view showing a state in which the positioning member is inserted into the positioning hole on the side surface of the metal separator unit following FIG. 3. It is an end elevation which shows the state which pressed the press member from upper direction with respect to the center part of a metal separator unit following FIG. FIG. 6 is an end view showing a state in which the upper clamping member is urged from above with respect to the outer peripheral edge of the metal separator unit following FIG. 5. FIG. 7 is an end view showing a state in which the outer peripheral edge of the metal separator unit is welded by a laser oscillator following FIG. 6. It is a perspective view which shows the joining apparatus of the thin plate-shaped member which concerns on 2nd Embodiment. It is an end view which shows typically a part of joining apparatus of FIG. It is an end elevation which shows the state which mounted the metal separator unit in the holding | maintenance part of the joining apparatus of FIG. 8 and FIG. FIG. 11 is an end view showing a state in which the positioning member is inserted into the positioning hole on the side surface of the metal separator unit following FIG. 10. FIG. 12 is an end view showing a state in which the pressing member is pressed from above with respect to the central portion of the metal separator unit following FIG. 11. FIG. 13 is an end view showing a state in which the upper clamping member is urged from above with respect to the outer peripheral edge of the metal separator unit following FIG. 12. FIG. 14 is an end view showing a state in which the outer peripheral edge of the metal separator unit is welded by a laser oscillator following FIG. 13.

Hereinafter, first and second embodiments according to the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. In all the drawings from FIG. 1 to FIG. 14, an arrow composed of X, Y, and Z is shown. An arrow represented by X indicates a short direction X of a thin plate member (for example, a metal separator). The arrow represented by Y indicates the longitudinal direction Y of the metal separator. The arrow indicated by Z indicates the stacking direction Z of the metal separator. The sizes and ratios of the members in the drawings are exaggerated for convenience of explanation and may be different from the actual sizes and ratios.

(First embodiment)
A method for joining thin plate-like members according to a first embodiment and a joining apparatus 100 embodying the method will be described with reference to FIGS.

The thin plate member will be described as an anode side metal separator 11 and a cathode side metal separator 12 as an example. The anode-side metal separator 11 and the cathode-side metal separator 12 are joined to each other at the outer peripheral edge by the joining device 100 to constitute the metal separator unit 10.

The joining apparatus 100 includes a control unit 130 in addition to the holding unit 110 and the joining unit 120. The holding unit 110 corresponds to an example of a configuration that embodies the holding process. The joining unit 120 corresponds to an example of a configuration that embodies a joining process. Hereinafter, the bonding method will be described in order for each component of the bonding apparatus 100.

First, the configuration of the bonding apparatus 100 will be specifically described with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing a joining device 100 for a thin plate member (for example, a metal separator unit 10 comprising an anode side metal separator 11 and a cathode side metal separator 12). FIG. 2 is an end view schematically showing a part of the bonding apparatus 100 of FIG.

The holding unit 110 holds one thin plate member (anode side metal separator 11) and another thin plate member (cathode side metal separator 12) in a stacked state.

As shown in FIGS. 1 and 2, the holding unit 110 includes a first holding unit (supporting member 111), a clamping unit (a lower clamping member 112 and an upper clamping member 113), and a movable positioning pin 115 (a positioning member). It has. Further, the holding unit 110 includes a positioning pin 114, a pressing plate 116 (pressing member), a movable plate 117, a spring 118, and a fixed pin 119 (fixing member). Hereinafter, each structure of the holding | maintenance part 110 is demonstrated in order.

A first end portion 11m positioned along the outer peripheral edge 11g of the anode side metal separator 11 and a outer peripheral edge 12g of the cathode side metal separator 12 are positioned by the support member 111 and the outer peripheral edge holding member 113P of the upper holding member 113. The first end portion 12m is clamped along the stacking direction Z. As an example, the support member 111 is made of metal, is formed in a rectangular shape, and includes an opening that accommodates the lower holding member 112 in a separated state. The support member 111 may be integrally formed so as to be joined to the lower holding member 112 at the lower portion. As an example, the outer periphery clamping member 113P is made of metal and has a rectangular shape. The outer periphery clamping member 113P has a frame shape with a large opening at the central portion, and is formed so that the central portion 10t of the metal separator unit 10 is exposed. The outer periphery holding member 113P is disposed to face the outer periphery of the lower holding member 112. The outer periphery holding member 113P includes a plurality of through holes 113a through which the fixing pins 119 are inserted.

By means of the inner peripheral edge clamping member 113Q of the lower clamping member 112 and the upper clamping member 113, for example, the second end 11n positioned inward of the first end 11m of the anode side metal separator 11 and the cathode side metal separator 12 The second end portion 12n positioned inward of the first end portion 12m is sandwiched along the stacking direction Z. For example, the lower clamping member 112 is made of metal and has a rectangular parallelepiped shape. The lower clamping member 112 is accommodated in the opening of the support member 111. The height of the lower clamping member 112 along the stacking direction Z is equal to the height of the support member 111. The lower clamping member 112 includes screw holes 112a for screwing the fixing pins 119 on both sides along the longitudinal direction Y thereof. As an example, the inner periphery clamping member 113Q is made of metal and is formed in a rectangular shape. The inner peripheral edge clamping member 113Q is formed to be slightly larger than the manifold holes formed at the four corners of the metal separator unit 10. The four inner peripheral edge clamping members 113Q independently cover the manifold holes at the four corners of the metal separator unit 10 respectively. The inner peripheral edge clamping member 113Q includes one through hole 113a through which the fixing pin 119 is inserted.

The positioning member (positioning pin 114) is erected on the left side of the lower clamping member 112 in FIG. The positioning pin 114 is fitted in a state where the positioning hole 10c of the metal separator unit 10 is inserted.

The positioning member (movable positioning pin 115) is positioned in contact with the anode side metal separator 11 and the cathode side metal separator 12 from the side crossing the stacking direction Z. The movable positioning pin 115 is disposed so as to be freely accessible and away from the side surface of the anode side metal separator 11 and the side surface of the cathode side metal separator 12. The movable positioning pin 115 is erected so as to be movable to the right of the lower clamping member 112 in FIG. The movable positioning pin 115 moves along the longitudinal direction Y and fits into the positioning hole 10 d of the metal separator unit 10. The metal separator unit 10 is positioned by the positioning pin 114 and the movable positioning pin 115.

The pressing member (pressing plate 116) presses the central portion (active area) of the anode side metal separator 11 and the central portion (active area) of the cathode side metal separator 12 along the stacking direction Z. The pressing plate 116 includes a plurality of through grooves 116 h for allowing the laser light L <b> 1 of the laser oscillator 121 to pass therethrough. The push plate 116 has insertion holes 116b at four corners, and allows the inner peripheral edge clamping member 113Q to be inserted therethrough. The pressing by the pressing plate 116 is performed before the lower clamping member 112 and the upper clamping member 113 clamp the second end portion 11n of the anode side metal separator 11 and the second end portion 12n of the cathode side metal separator 12. The pressing plate 116 is made of, for example, metal and is formed in a rectangular shape. A movable plate 117 is provided below the push plate 116. The movable plate 117 is movable up and down along the stacking direction Z by a spring 118 provided below. The movable plate 117 and the spring 118 are accommodated in the lower clamping member 112.

The fixing member (fixing pin 119) temporarily fixes the anode side metal separator 11 and the cathode side metal separator 12 via the lower holding member 112 and the upper holding member 113. The fixing pins 119 are respectively inserted into the through holes 113a opened in the upper clamping member 113 (the outer peripheral clamping member 113P and the inner peripheral clamping member 113Q), and screwed into the screw holes 112a opened in the lower clamping member 112, respectively. Specifically, the fixing member uses a retractable clamping mechanism. The fixing pin 119 is inserted into the upper holding member 113 (the outer peripheral holding member 113P and the inner peripheral holding member 113Q) and the lower holding member 112, and is inserted into an actuator provided at the lower part of the lower holding member 112. The fixing pin 119 is automatically fixed by the actuator. The operator handles the fixing pin 119 without requiring a special tool. Therefore, even when the fixing operation is repeated a plurality of times, the upper clamping member 113 and the lower clamping member 112 can always be reliably fixed with a constant stress. The fixing member may be a tightening clamp mechanism using a nut runner. In this case, the nut can be easily fixed to the thread groove of the lower clamping member 112, and the holding force can be made constant.

The discharge unit discharges and discharges gas to the dust generated from the joint portion with the laser beam L1 through the exhaust hole 112h provided in the lower holding member 112 and the exhaust hole 113h provided in the upper holding member 113, Or suck and discharge dust. For example, an inert gas such as nitrogen (N) or argon (Ar), dry air, or assist gas such as air is injected through the exhaust hole 112h and the exhaust hole 113h, and the laser is discharged to the outside while discharging the dust. The ambient atmosphere irradiated with the light L1 is stabilized. The support member 211, the lower clamping member 112, and the upper clamping member 113 are coated with a material M that inhibits the adhesion of dust generated from the joint portion with welding by the laser beam L <b> 1. As the material M, a material having heat resistance, wear resistance, or slipperiness is used.

The joining portion 120 joins at least the annular joining portion (outer peripheral edge 11g) provided in the anode side metal separator 11 and the annular joining portion (outer peripheral edge 12g) provided in the cathode side metal separator 12.

The junction 120 includes a laser oscillator 121, a reflection mirror 122, and a drive stage 123, as shown in FIG. For example, the laser oscillator 121 irradiates the outer peripheral edge 11g of the anode-side metal separator 11 or the outer peripheral edge 12g of the cathode-side metal separator 12 with laser light L1, and thereby the outer peripheral edge 11g of the anode-side metal separator 11 and the cathode-side metal separator 12 are irradiated. Are welded to each other. The part to be welded by irradiating the laser beam L1 is a part located between the first end 10m and the second end 10n in the outer peripheral edge 10g of the metal separator unit 10. The reflection mirror 122 reflects the laser beam L1 derived from the laser oscillator 121 along the longitudinal direction Y and folds it downward in the stacking direction Z. The drive stage 123 corresponds to, for example, a biaxial rectilinear stage. The drive stage 123 scans the holding unit 110 in the short direction X and the long direction Y in order to weld the outer peripheral edge 10g of the metal separator unit 10 in an annular shape with the laser beam L1 whose irradiation position is fixed. The pair of reflection mirrors 122 may scan the laser light L1 along the short direction X and the long direction Y, and weld the outer peripheral edge 10g of the metal separator unit 10 in an annular shape without using the drive stage 123. .

The control unit 130 controls the holding unit 110 and the joining unit 120, respectively.

The control unit 130 includes a controller 131 as shown in FIG. The controller 131 includes a ROM, a CPU, and a RAM. A ROM (Read Only Memory) stores a control program related to the bonding apparatus 100. The control program controls the upper clamping member 113 (the outer peripheral clamping member 113P and the inner peripheral clamping member 113Q) of the holding unit 110, the movable positioning pin 115 and the pressing plate 116, and the laser oscillator 121 and the drive stage 123 of the joint 120. Includes things about. A CPU (Central Processing Unit) of the control unit 130 controls the operation of each component of the joining apparatus 100 based on the control program. A RAM (Random Access Memory) temporarily stores various data related to each component of the joining apparatus 100 under control. The data relates to the output of the laser oscillator 121, for example.

Next, the operation of the bonding apparatus 100 will be specifically described with reference to FIGS.

FIG. 3 is an end view showing a state in which the metal separator unit 10 is placed on the holding unit 110 of the joining apparatus 100 shown in FIGS. 1 and 2. FIG. 3 is an end view showing a state in which the positioning member (movable positioning pin 115) is inserted into the positioning hole 10d on the side surface of the metal separator unit 10 following FIG. FIG. 5 is an end view showing a state in which the pressing member (the pressing plate 116) is pressed from above with respect to the central portion 10t of the metal separator unit 10 following FIG. FIG. 6 is an end view showing a state in which the upper clamping member 113 is urged from above with respect to the outer peripheral edge 10g of the metal separator unit 10 following FIG. FIG. 7 is an end view showing a state in which the outer peripheral edge 10 g of the metal separator unit 10 is welded by the laser oscillator 121 following FIG. 6.

As shown in FIG. 3, in the joining apparatus 100, the metal separator unit 10 is lowered along the stacking direction Z and placed on the movable plate 117 or the like of the holding unit 110. The metal separator unit 10 includes an anode side metal separator 11 and a cathode side metal separator 12. The positioning member (positioning pin 114) erected to the left in FIG. 1 of the lower clamping member 112 is fitted in a state of being inserted into the positioning hole 10c on the left side of the metal separator unit 10 in the drawing. The metal separator unit 10 is conveyed automatically by a robot hand or the like, or manually by an operator.

As shown in FIG. 4, the positioning member (movable positioning pin 115) is inserted from the side into the positioning hole 10d on the right side of FIG. To fit. The metal separator unit 10 is positioned by the positioning pin 114 and the movable positioning pin 115. As shown in FIG. 4, the anode-side metal separator 11 and the cathode-side metal separator 12 are aligned at the ends and the like. When a relatively strong stress is applied, the movable positioning pin 115 itself moves along the longitudinal direction Y so as to relieve the stress.

As shown in FIG. 5, continuing from the state of FIG. 4, the pressing member (pressing plate 116) is slightly lowered while pressing against the central portion 10 t of the metal separator unit 10 from above. The stress applied to the metal separator unit 10 by the pressing plate 116 is alleviated by the downward movement of the movable plate 117 on which the metal separator unit 10 is placed. A central portion 10t of the metal separator unit 10 corresponds to an active area region. Since the active area is formed by forming a plurality of fine uneven shapes along the longitudinal direction Y, it is difficult to keep the shape constant. That is, the active area is often distorted. As shown in FIG. 5, the pressing plate 116 presses against the active area of the central portion 10 t of the metal separator unit 10 to remove the distortion. When relatively strong stress is applied to the movable positioning pin 115 as the distortion of the active area is removed, the movable positioning pin 115 moves so as to retreat so as to relieve the stress. That is, the metal separator unit 10 is positioned by the positioning pin 114 and the movable positioning pin 115 in a state where the distortion of the active area is removed.

As shown in FIG. 6, the upper clamping member 113 (the outer circumferential edge clamping member 113P and the inner circumferential edge clamping member 113Q) is attached to the outer circumferential edge 10g and the manifold hole of the metal separator unit 10 from above from the state shown in FIG. Rush. The first end portion 10m is clamped by the support member 111 and the outer periphery clamping member 113P. The second end 10n is clamped by the lower clamping member 112 and the inner peripheral clamping member 113Q. Further, the supporting member 111 and the outer peripheral holding member 113P, and the lower holding member 112 and the inner peripheral holding member 113Q are fixed by the fixing members (fixing pins 119), respectively. The position of the metal separator unit 10 including the anode side metal separator 11 and the cathode side metal separator 12 is forcibly fixed. That is, the anode side metal separator 11 and the cathode side metal separator 12 are not displaced from each other in the positions of the outer peripheral edge, the manifold hole, the active area, and the like.

As shown in FIG. 7, the drive stage shown in FIG. 1 is continued from the state of FIG. 6 while irradiating the outer peripheral edge 10 g of the metal separator unit 10 with laser light L1 from the laser oscillator 121 at the joint 120. 123 is scanned in the lateral direction X and the longitudinal direction Y, and the outer peripheral edge 10g of the metal separator unit 10 is welded in an annular shape. The part to be joined by irradiating the laser beam L1 is a part located between the first end 10m and the second end 10n in the outer peripheral edge 10g of the metal separator unit 10. As shown in FIG. 7, nitrogen dust is generated from the joint portion by welding with the laser beam L <b> 1 through the exhaust holes 112 h provided in the lower holding member 112 and the exhaust holes 113 h provided in the upper holding member 113. An inert gas such as (N) or argon (Ar), dry air, air or the like is jetted, and the dust is discharged.

As shown in FIG. 7, the laser oscillator 121 irradiates and welds the laser light L1 to the active area of the central portion 10t of the metal separator unit 10 through the through groove 116h of the push plate 116. In the active area of the anode-side metal separator 11 and the active area of the cathode-side metal separator 12, the portions in contact with each other are partially joined along the longitudinal direction Y. If it joins in this way, it will be easy to maintain the active area of the metal separator unit 10 flat. Further, even when a cooling medium is circulated in the active area of the metal separator unit 10, the gap between the anode side metal separator 11 and the cathode side metal separator 12 can be prevented from expanding. The inner peripheral edge of the manifold hole of the metal separator unit 10 can be irradiated with laser light L1 through a gap between the outer peripheral edge holding member 113P and the inner peripheral edge holding member 113Q, and the inner peripheral edge can be joined in an annular shape.

According to the first embodiment described above, the following effects are obtained.

The thin plate member joining apparatus 100 includes a holding part 110 and a joining part 120. The holding unit 110 holds one thin plate member (anode side metal separator 11) and another thin plate member (cathode side metal separator 12) in a stacked state. The joint 120 joins at least the annular joint portion (the outer peripheral edge 11g) provided in the anode side metal separator 11 and the annular joint portion (the outer peripheral edge 12g) provided in the cathode side metal separator 12. Here, the holding unit includes a first holding unit and a second holding unit. The first holding portion includes a first end portion 11m located along the joining portion of the anode side metal separator 11 and a first end portion located along the joining portion of the cathode side metal separator 12 along the stacking direction Z. Hold. The second holding portion is a second end portion 11n positioned inward from the first end portion 11m of the anode side metal separator 11 and a second end portion positioned inward from the first end portion 12m of the cathode side metal separator 12. The two end portions 12n are sandwiched and held along the stacking direction Z.

The thin plate-like member joining method includes a holding step and a joining step. The holding step includes a first end portion 11m positioned along the annular joint portion (outer peripheral edge 11g) provided in the anode side metal separator 11, and an annular joint portion (outer peripheral edge 11g) provided in the cathode side metal separator 12. The first end portion 12m located along the stacking direction Z is held. In addition, the holding step includes a second end portion 11n positioned inward from the first end portion 11m of the anode side metal separator 11 and a first end portion 12m positioned inward from the first end portion 12m of the cathode side metal separator 12. The two end portions 12n are sandwiched and held along the stacking direction Z. In the joining step, at least the annular joining part (outer peripheral edge 11g) provided in the anode side metal separator 11 and the annular joining part (outer peripheral edge 12g) provided in the cathode side metal separator 12 are joined together.

According to such a configuration, the joining apparatus 100 and the joining method hold the first ends of the anode-side metal separator 11 and the cathode-side metal separator 12 in an annular shape, and the anode-side metal separator 11 and the cathode-side metal. The second ends of the separators 12 are joined together in a state where the second ends are held in an annular shape. That is, when the anode-side metal separator 11 and the cathode-side metal separator 12 are joined in an annular shape, the joining portion can be sufficiently held from the outside and the inside while removing warping and distortion. Therefore, the joining apparatus 100 and the joining method can prevent joining failure when the anode side metal separator 11 and the cathode side metal separator 12 are stacked and joined in an annular shape.

Furthermore, the first holding part can be configured to sandwich the first end part 11m of the anode side metal separator 11 and the first end part 12m of the cathode side metal separator 12 along the stacking direction. Here, the holding unit 110 includes a positioning member (movable positioning pin 115) that contacts and positions the anode side metal separator 11 and the cathode side metal separator 12 from the side intersecting the stacking direction Z. The positioning member (movable positioning pin 115) is disposed so as to be able to approach and separate from the side surface of the anode-side metal separator 11 and the side surface of the cathode-side metal separator 12.

According to such a configuration, in addition to the first end portion 11m of the anode side metal separator 11 and the first end portion 12m of the cathode side metal separator 12, the second end portion 11n of the anode side metal separator 11 and the cathode side metal. The second end 12n of the separator 12 is also sandwiched. Further, for example, the movable positioning pin 115 is brought close to the placed anode-side metal separator 11 and the anode-side metal separator 11 to position them. Therefore, the joining apparatus 100 eliminates the positioning error when laminating thin plate-like members such as the metal separator unit 10 including the anode side metal separator 11 and the cathode side metal separator 12 and joining them in an annular shape. In addition, highly reliable joining can be performed. Furthermore, by making the movable positioning pin 115 approach and separate, deformation of the metal separator unit 10 during extraction can be suppressed.

Furthermore, according to such a configuration, since the joint portion of the annular shape is continuously joined so that no seam is generated at the joined portion, the quality related to the joining of the metal separator unit 10 is improved.

Furthermore, since the joining of the metal separator unit 10 can be carried out continuously in one process, the equipment required for joining the metal separator unit 10 is simplified compared to the case where the joining is carried out intermittently through a plurality of different processes. And man-hours required for the joining can be reduced. In particular, if the holding method of holding unit 110 using fixing pin 119 is a pull-in method using a spring or an axial force fastening mechanism using a nut runner, even if electric power from the outside is temporarily or continuously interrupted, the holding unit A certain holding force can be maintained without being affected by 110.

In addition, the holding unit 110 is configured so that the lower holding member 112 and the upper holding member 113 hold the anode-side metal before holding the second end 11n of the anode-side metal separator 11 and the second end 12n of the cathode-side metal separator 12. A configuration in which a pressing member (pressing plate 116) that presses the central portion (active area) of the separator 11 and the central portion (active area) of the cathode-side metal separator 12 along the stacking direction Z can be employed.

According to such a configuration, the pressing plate 116 can sufficiently remove the distortion of the central portion 10t of the metal separator unit 10. The pressing plate 116 can remove distortion very effectively, particularly when the central portion 10t of the metal separator unit 10 corresponds to an active area region. That is, since the active area is generally formed by forming a plurality of fine uneven shapes along the longitudinal direction Y, it is difficult to keep the shape constant and is often distorted. . The pressing plate 116 can press against such an active area and sufficiently remove the distortion. It is good also as a structure which presses a manifold hole with the press plate 116, and removes curvature and distortion.

Furthermore, the holding part 110 includes a fixing member (fixing pin 119) for temporarily fixing the anode side metal separator 11 and the cathode side metal separator 12 via at least either the lower holding member 112 or the upper holding member 113. Can be configured.

According to such a configuration, when the anode side metal separator 11 and the cathode side metal separator 12 are joined, the positions can be firmly fixed. Therefore, it can join reliably, without the position of a junction part shifting. Here, as the fixing member, for example, a retractable clamping mechanism can be used. Such a fixing pin 119 is automatically fixed by the actuator. The operator can handle the fixing pin 119 without requiring a special tool. Therefore, even when the fixing operation of the anode-side metal separator 11 and the cathode-side metal separator 12 is repeated a plurality of times, the anode-side metal separator 11 and the cathode-side metal separator 12 can always be reliably fixed with a constant stress. The fixing member may be a tightening clamp mechanism using a nut runner. If a nut runner is used, it can be easily fixed to the thread groove of the lower clamping member 112 and the holding force can be made constant.

Further, the joint 120 irradiates the outer peripheral edge 11g of the anode-side metal separator 11 or the outer peripheral edge 12g of the cathode-side metal separator 12 with laser light L1, so that the outer peripheral edge 11g of the anode-side metal separator 11 and the cathode-side metal separator 12 are irradiated. A laser oscillator 121 that welds the outer peripheral edges 12g of each other can be used.

According to such a configuration, it is possible to apply simple joining using the laser oscillator 121 which is inexpensive and extremely versatile. Unlike a cutting blade having a predetermined size, the laser beam L1 can easily prevent interference with the constituent members of the holding unit 110. Furthermore, the laser beam L1 can join a joining portion having an arbitrary shape, unlike a cutting blade having a fixed shape.

Furthermore, the holding unit 110 may be configured to include a discharge unit that discharges gas by discharging gas to the dust generated from the joint portion with welding by the laser beam L1 or sucks and discharges dust.

According to such a configuration, dust related to sputtering generated when the metal separator unit 10 is joined can be quickly discharged from the holding unit 110. Therefore, it is possible to prevent the dust from adhering to and contaminating the metal separator unit 10 in a state where the dust stays in the holding unit 110. Furthermore, since dust does not accumulate in the holding part 110, it is possible to prevent the laser light L1 from being shielded by dust and missing the joining region. Furthermore, the surrounding atmosphere where the laser beam L1 is irradiated can be stabilized.

Furthermore, the holding part 110 can be configured to be coated with a material M that obstructs the adhesion of dust generated from the joint portion with welding by the laser beam L1.

According to such a configuration, it is possible to prevent dust related to sputtering generated when the metal separator unit 10 is joined from adhering to the holding unit 110. Therefore, it is possible to prevent the dust from falling on the metal separator unit 10 and being contaminated after the dust adheres to the holding unit 110 and stays there.

Furthermore, the holding unit 110 may be configured to hold an anode side metal separator 11 made of an anode side metal separator and a cathode side metal separator 12 made of a cathode side metal separator.

Such a configuration is particularly applicable to metal separators that are thin and easily distorted and that require strong bonding so that the medium does not leak.

Further, the joint 120 is configured to join the outer peripheral edge of the metal separator (the metal separator unit 10 including the anode-side metal separator 11 and the cathode-side metal separator 12), the periphery of the manifold hole, or the joining portion of the active area. be able to.

According to such a configuration, in particular, a member having a thin layer thickness that is easily distorted, such as a metal separator, which has a wide variety of joining points, and easily expands when the medium is circulated therein. Even if it is a member, those junction parts can fully be joined.

(Second Embodiment)
A thin plate-like member joining method according to a second embodiment and a joining apparatus 200 embodying the method will be described with reference to FIGS.

The joining apparatus 200 according to the second embodiment has a configuration in which the first separator 10m to the second end 10n of the metal separator unit 10 are joined at least in a state of being elastically deformed, according to the first embodiment described above. Different from the configuration of the bonding apparatus 100. In the second embodiment, the same reference numerals are used for components having the same configuration as in the first embodiment described above, and the above description is omitted.

First, the configuration of the bonding apparatus 200 will be specifically described with reference to FIGS. 8 and 9.

FIG. 8 is a perspective view showing a joining device 200 for a thin plate member (for example, a metal separator unit 10 including an anode side metal separator 11 and a cathode side metal separator 12). FIG. 9 is an end view schematically showing a part of the bonding apparatus 200 of FIG.

The holding unit 210 holds one thin plate member (anode side metal separator 11) and another thin plate member (cathode side metal separator 12) in a stacked state.

8 and 9, the holding unit 210 includes a first holding unit (supporting member 211), a clamping unit (the lower clamping member 112 and the upper clamping member 213), and an adjustment unit. Further, the holding unit 210 includes a positioning pin 114, a movable positioning pin 115 (positioning member), a pressing plate 216 (pressing member), a movable plate 117, a spring 118, and a fixed pin 119 (fixing member). . Hereinafter, each structure of the holding | maintenance part 210 is demonstrated in order.

The support member 211 has a first end portion 11m positioned along the outer peripheral edge 11g of the anode side metal separator 11 and a first end portion 12m positioned along the outer peripheral edge 12g of the cathode side metal separator 12 in the stacking direction Z. Support from one side along. For example, the support member 211 is made of metal, is formed in a rectangular shape, and includes an opening that accommodates the lower holding member 112 in a separated state. The support member 211 may be integrally formed so as to be joined to the lower holding member 112 at the lower portion.

The lower clamping member 112 and the upper clamping member 213 include a second end portion 11n positioned inward of the first end portion 11m of the anode side metal separator 11 and an inner side of the first end portion 12m of the cathode side metal separator 12. The second end 12n positioned in the direction is sandwiched along the stacking direction Z. For example, the lower clamping member 112 is made of metal and has a rectangular parallelepiped shape. The lower clamping member 112 is accommodated in the opening of the support member 211. The height H1 along the stacking direction Z of the lower clamping member 112 is slightly lower than the height H2 of the support member 211. The lower clamping member 112 includes screw holes 112a for screwing the fixing pins 119 on both sides along the longitudinal direction Y thereof.

The upper clamping member 213 is made of metal, for example, and has a rectangular shape. The upper clamping member 213 is disposed to face the lower clamping member 112. The upper clamping member 213 is a guide hole that annularly surrounds a joint portion located inward of the outer peripheral edge 11g of the anode side metal separator 11 and a joint portion located inward of the outer peripheral edge 12g of the cathode side metal separator 12. 213b. Similarly, the upper clamping member 213 is formed so that the central portion is opened largely and the central portion 10t of the metal separator unit 10 is exposed. The upper clamping member 213 includes through holes 213a through which the fixing pins 119 are inserted at both ends along the longitudinal direction Y thereof.

The adjustment unit includes a position where the support member 211 supports the anode-side metal separator 11 and the cathode-side metal separator 12, and a position where the lower holding member 112 and the upper holding member 213 hold the anode-side metal separator 11 and the cathode-side metal separator 12. Are different along the stacking direction Z.

When the holding unit 210 is configured by the first holding unit (supporting member 211) and the second holding unit (the lower holding member 112 and the upper holding member 213) described above, the adjusting unit has the supporting member 211, the lower holding member 112, and The upper clamping member 213 itself corresponds to the adjustment unit.

On the other hand, the adjustment unit can be configured as follows. That is, in the stage where the metal separator unit 10 is placed, the lower clamping member 112 has the same height along the stacking direction Z as the support member 211 or higher than the support member 211 along the stacking direction Z. Keep it. Next, the upper holding member 213 is lowered along the stacking direction Z, and the metal separator unit 10 is held by the lower holding member 112 and the upper holding member 213. Next, the support member 211 is raised along the stacking direction Z, and the support member 211 is pressed against the outer peripheral edge 10 g of the metal separator unit 10. When the adjustment unit is configured in this way, when the outer peripheral edge 10g of the metal separator unit 10 is pressed by the support member 211, the inside of the metal separator unit 10 held by the lower holding member 112 and the upper holding member 213 is Not affected by external forces. Further, after the metal separator unit 10 is sandwiched between the lower sandwiching member 112 and the upper sandwiching member 213, the lower sandwiching member 112 and the upper sandwiching member 213 are lowered along the stacking direction Z, so that the support member 211 is moved to the metal separator unit. You may press against 10 outer periphery 10g.

Next, the operation of the bonding apparatus 200 will be specifically described with reference to FIGS.

FIG. 10 is an end view showing a state in which the metal separator unit 10 is placed on the holding unit 210 of the joining apparatus 200 of FIGS. 8 and 9. FIG. 11 is an end view showing a state in which the positioning member (movable positioning pin 115) is inserted into the positioning hole 10d on the side surface of the metal separator unit 10 following FIG. FIG. 12 is an end view showing a state in which the pressing member (the pressing plate 216) is pressed from above with respect to the central portion 10t of the metal separator unit 10 following FIG. FIG. 13 is an end view showing a state in which the upper clamping member 213 is urged from above with respect to the outer peripheral edge 10g of the metal separator unit 10 following FIG. 14 is an end view showing a state in which the outer peripheral edge 10g of the metal separator unit 10 is welded by the laser oscillator 121 following FIG.

As shown in FIG. 10, in the joining apparatus 200, the metal separator unit 10 is lowered along the stacking direction Z and placed on the movable plate 117 or the like of the holding unit 210. The positioning member (positioning pin 114) erected on the left side of FIG. 8 of the lower clamping member 112 is fitted in a state of being inserted into the positioning hole 10c on the left side of the metal separator unit 10 in the figure.

As shown in FIG. 11, the positioning member (movable positioning pin 115) is inserted from the side into the positioning hole 10d on the right side of FIG. 8 of the metal separator unit 10 from the state of FIG. To fit. The metal separator unit 10 is positioned by the positioning pin 114 and the movable positioning pin 115. As shown in FIG. 11, the anode-side metal separator 11 and the cathode-side metal separator 12 are aligned at the ends and the like.

As shown in FIG. 12, the pressing member (pressing plate 216) is lowered slightly while pressing from the upper side against the central portion 10 t of the metal separator unit 10 continuously from the state of FIG. 11. The stress applied to the metal separator unit 10 by the pressing plate 216 is alleviated by the downward movement of the movable plate 117 on which the metal separator unit 10 is placed. A central portion 10t of the metal separator unit 10 corresponds to an active area region. As shown in FIG. 12, the pressing plate 216 presses against the active area of the central portion 10 t of the metal separator unit 10 to remove the distortion.

As shown in FIG. 13, the upper clamping member 213 urges the outer peripheral edge 10g of the metal separator unit 10 from above from the state shown in FIG. In this state, the lower end member 112 and the upper end member 213 hold the second end portion 10n. Furthermore, the upper clamping member 213 and the lower clamping member 112 are fixed by a fixing member (fixing pin 119). The position of the metal separator unit 10 including the anode side metal separator 11 and the cathode side metal separator 12 is forcibly fixed.

13, the holding of the metal separator unit 10 by the holding unit 210 is completed, and the metal separator unit 10 can be joined by the joining unit 120. The support member 211 supports the first end portion 11m of the anode side metal separator 11 and the first end portion 12m of the cathode side metal separator 12 along the stacking direction Z. The lower clamping member 112 and the upper clamping member 213 include a second end portion 11n positioned inward of the first end portion 11m of the anode side metal separator 11 and an inner side of the first end portion 12m of the cathode side metal separator 12. The second end 12n positioned in the direction is sandwiched along the stacking direction.

As shown in FIG. 14, the drive stage 123 shown in FIG. Scanning in the lateral direction X and the longitudinal direction Y, the outer peripheral edge 10g of the metal separator unit 10 is welded in an annular shape. The part to be joined by irradiating the laser beam L1 is, for example, a part located between the first end part 10m and the second end part 10n in the outer peripheral edge 10g of the metal separator unit 10. A configuration in which the outer peripheral edge 10g of the metal separator unit 10 is welded in an annular shape without using the drive stage 123 by scanning the laser light L1 along the short direction X and the long direction Y by the pair of reflection mirrors 122. Also good. Here, the gap (lateral width) along the longitudinal direction Y of the support member 211 and the lower holding member 112 is narrow, and the difference in height along the stacking direction Z of the support member 211 and the lower holding member 112 is larger, The metal separator unit 10 can be satisfactorily bonded by the laser beam L1. As shown in FIG. 14, nitrogen dust is generated from the joint portion by welding with the laser beam L <b> 1 through the exhaust holes 112 h provided in the lower holding member 112 and the exhaust holes 213 h provided in the upper holding member 213. An inert gas such as (N) or argon (Ar), dry air, air or the like is jetted, and the dust is discharged.

As shown in FIG. 14, the laser oscillator 121 irradiates and welds the laser light L1 to the active area of the central portion 10t of the metal separator unit 10 through the through groove 216h of the push plate 216. In the active area of the anode-side metal separator 11 and the active area of the cathode-side metal separator 12, the portions in contact with each other are partially joined along the longitudinal direction Y. It is also possible to irradiate the inner peripheral edge of the manifold hole of the metal separator unit 10 along the inner periphery of the guide hole 213b of the upper clamping member 213 with laser light L1, and join the inner peripheral edge in an annular shape.

According to the second embodiment described above, the following effects are obtained.

The first holding part supports the first end part 11m of the anode side metal separator 11 and the first end part 12m of the cathode side metal separator 12 from one side along the stacking direction Z. The holding unit further includes an adjustment unit. The adjustment unit includes a position where the support member 211 supports the anode-side metal separator 11 and the cathode-side metal separator 12, and a position where the lower holding member 112 and the upper holding member 213 hold the anode-side metal separator 11 and the cathode-side metal separator 12. Are different along the stacking direction Z.

According to such a configuration, the first holding portion supports the first end portion 11m and the like of the anode side metal separator 11 from only one side along the stacking direction Z, and thus is positioned on the other side. Can be fully opened. Therefore, it is possible to easily discharge the dust generated with the joining to the outside. That is, it is possible to prevent a bonding failure from occurring due to the accumulation of dust at the bonding site. Furthermore, since a sufficient open space can be secured, the cutting member can be prevented from interfering with surrounding structures.

Further, according to such a configuration, for example, the first separator 10m and the second end 10n of the metal separator unit 10 are joined in a state of being elastically deformed at least, so that the joining parts are sufficiently adhered to each other. It will be in the state. Therefore, the joining apparatus 200 eliminates the influence of distortion when laminating thin plate-like members such as the metal separator unit 10 including the anode side metal separator 11 and the cathode side metal separator 12 and joining them in an annular shape. Can perform very reliable bonding.

Furthermore, since the joining of the metal separator unit 10 can be carried out continuously in one process, the equipment required for joining the metal separator unit 10 is simplified compared to the case where the joining is carried out intermittently through a plurality of different processes. And man-hours required for the joining can be reduced.

The preferred first and second embodiments of the present invention have been described above. However, these are examples for explaining the present invention, and the scope of the present invention is not limited to these embodiments. Therefore, the present invention can be implemented in various modes different from the above-described embodiments without departing from the scope of the invention. That is, the present invention can be variously modified based on the configuration described in the claims, and these are also within the scope of the present invention.

For example, in the first and second embodiments, the configuration in which two thin plate-like members are joined has been described, but the configuration is not limited to such a configuration. It is good also as a structure which joins 3 or more thin plate-shaped members.

In the first and second embodiments, the configuration has been described in which the outer peripheral edges of two thin plate-like members having similar shapes are joined, but the present invention is not limited to such a configuration. For example, it is good also as a structure which joins the outer periphery of the thin plate-shaped member from which an internal shape differs completely.

In the second embodiment, the outer peripheral edges of the thin plate-like members have been described as being temporarily elastically deformed and joined, but the present invention is not limited to such a configuration. For example, the outer peripheral edges of the thin plate members may be plastically deformed and joined.

10 Metal separator unit,
11 Anode side metal separator (thin plate member),
12 Cathode side metal separator (thin plate member),
10c, 10d positioning holes,
10g outer periphery (joining part),
10m first end,
10n second end,
10t center,
11g, 12g outer periphery,
11m, 12m first end,
11n, 12n second end,
100,200 joining device,
110, 210 holding part,
111, 211 support members,
112 Lower clamping member,
112a screw hole,
112h exhaust hole,
113,213 upper clamping member,
113P outer periphery clamping member,
113Q inner periphery clamping member,
113a, 213a through hole,
213b guide holes,
113h, 213h exhaust holes,
114 Positioning pin,
115 movable positioning pin (positioning member),
116, 216 pressing plate (pressing member),
116b insertion hole,
116h, 216h through groove,
117 movable plate,
118 Spring,
119 fixing pin (fixing member),
120 joints,
121 laser oscillator,
122 reflection mirror,
123 drive stage,
130 control unit,
131 controller,
L1 laser light,
M material,
X Short direction (of the metal separator unit 10),
Y (in the metal separator unit 10) longitudinal direction,
Z (Lamination direction of metal separator unit 10).

Claims

A holding unit that holds one thin plate member and another thin plate member in a stacked state;
And at least a joining portion that joins the annular joining portion provided in the one thin plate member and the annular joining portion provided in the other thin plate member,
The holding part is
A first end portion located along the joining portion of the one thin plate-like member and a first end portion located along the joining portion of the other thin plate-like member are held along the stacking direction. 1 holding part;
A second end portion located inward of the first end portion of the one thin plate member, and a second end portion located inward of the first end portion of the other thin plate member. A thin plate-shaped member joining apparatus comprising: a second holding unit that holds and holds the product along the stacking direction.
The first holding portion sandwiches the first end of the one thin plate member and the first end of the other thin plate member along the stacking direction,
The holding portion further includes a positioning member that contacts and positions the one thin plate-like member and the other thin plate-like member from a side that intersects the stacking direction,
The apparatus for joining thin plate members according to claim 1, wherein the positioning member is disposed so as to be able to approach and separate from a side surface of the one thin plate member and a side surface of the other thin plate member.
The first holding unit supports the first end of the one thin plate member and the first end of the other thin plate member from one side along the stacking direction,
The holding portion includes a position where the support portion supports the one thin plate member and the other thin plate member, and a position where the holding portion sandwiches the one thin plate member and the other thin plate member. The apparatus for joining thin plate members according to claim 1, further comprising an adjustment unit that makes the difference in the stacking direction.
The holding portion includes a central portion of the one thin plate member before the holding portion sandwiches the second end portion of the one thin plate member and the second end portion of the other thin plate member. The apparatus for joining thin plate members according to any one of claims 1 to 3, further comprising a pressing member that presses a central portion of the other thin plate member along the stacking direction.
The holding portion further includes a fixing member that temporarily fixes the one thin plate-like member and the other thin plate-like member through at least one of the first holding portion and the second holding portion. The apparatus for joining thin plate members according to any one of claims 1 to 4.
The joint portion irradiates the joint portion of the one thin plate member with the outer peripheral edge of the one thin plate member or the joint portion of the other thin plate member, and the other thin plate shape. 6. The apparatus for joining thin plate members according to claim 1, further comprising a laser oscillator that welds the joining portions of the members to each other.
The thin plate-like shape according to claim 6, wherein the holding unit further includes a discharge unit that discharges gas by discharging gas to dust generated from a joint portion with welding by the laser beam, or sucks and discharges the dust. Member joining device.
The thin plate-shaped member joining apparatus according to claim 6 or 7, wherein the holding portion is coated with a material that inhibits adhesion of dust generated from a joining portion with welding by the laser beam.
The thin plate according to any one of claims 1 to 8, wherein the holding portion holds the one thin plate member made of an anode side metal separator and the other thin plate member made of a cathode side metal separator. -Like member joining apparatus.
10. The apparatus for joining thin plate members according to claim 9, wherein the joining portion joins the joining part on the outer peripheral edge of the metal separator, the joining part on the inner periphery of the manifold hole, or the joining part in the active area.
A first end located along an annular joint site provided in one thin plate member and a first end located along an annular joint site provided in another thin plate member along the stacking direction. The second end positioned inward of the first end of the one thin plate member and the second end positioned inward of the first end of the other thin plate member. A holding step of holding and holding the portion along the stacking direction;
A method for joining thin film members, comprising: a joining step of joining at least the joining site of the one thin plate member and the joining site of the other thin plate member.