WO2015199637A1 - Blister packaging components - Google Patents

Blister packaging components Download PDF

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Publication number
WO2015199637A1
WO2015199637A1 PCT/US2014/041260 US2014041260W WO2015199637A1 WO 2015199637 A1 WO2015199637 A1 WO 2015199637A1 US 2014041260 W US2014041260 W US 2014041260W WO 2015199637 A1 WO2015199637 A1 WO 2015199637A1
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WO
WIPO (PCT)
Prior art keywords
tie
layer
component according
hdpe
iayer
Prior art date
Application number
PCT/US2014/041260
Other languages
French (fr)
Inventor
Ed L. HAEDT
Michael D. PRISCAL
Original Assignee
Perfecseal, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perfecseal, Inc. filed Critical Perfecseal, Inc.
Priority to PCT/US2014/041260 priority Critical patent/WO2015199637A1/en
Priority to EP14895844.0A priority patent/EP3152053A4/en
Publication of WO2015199637A1 publication Critical patent/WO2015199637A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/327—Layered products comprising a layer of synthetic resin comprising polyolefins comprising polyolefins obtained by a metallocene or single-site catalyst
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/724—Permeability to gases, adsorption
    • B32B2307/7242—Non-permeable
    • B32B2307/7246—Water vapor barrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/40—Closed containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00—Containers; Receptacles
    • B32B2439/80—Medical packaging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W90/00—Enabling technologies or technologies with a potential or indirect contribution to greenhouse gas [GHG] emissions mitigation
    • Y02W90/10—Bio-packaging, e.g. packing containers made from renewable resources or bio-plastics

Abstract

The present invention relates to blister components for blister packages formed from multilayer thermoplastic films. In one embodiment of the present invention, the thermoformed blister component comprises a first exterior layer of polyvinylchloride (PVC) or polyvinylidene chloride; one interior layer comprising a blend of a high density polyethylene, high density polyethylene nucleation additive and optionally, a hydrocarbon resin, or a high density polyethylene and has a thickness of between 50 m to 254 m (2 mil to 10 mil); and a second exterior layer comprising a material selected from the group consisting of polyvinylchloride, polyvinylidene chloride, cyclic olefin copolymer, polypropylene, high impact polystyrene, general purpose polystyrene, styrene block copolymer, polyethylene terephthalate, oriented polyethylene terephthalate, amorphous polyethylene terephthalate, glycol-modified polyethylene terephthalate and polylactic acid.

Description

BLISTER PACKAGING COMPONENTS
BACKGROUND OF THE INVENTION
The present invention relates generally to blister packaging and more particularly, to blister components for blister packages formed from multilayer thermoplastic films where a Sow moisture vapor transmission rate is desired.
Blister packaging is employed widely for commercial packaging of food products, personal care products, and human health products such as pharmaceuticals, and medical devices or precision instruments. The use of this type of packaging has become widespread mainly due to the ability in incorporate suitable moisture, dust, UV and/or gas barriers into the packages when such properties are desired for maintaining the product contained therein. For example, blister packaging is extensively used in the pharmaceutical industry for packaging of medicaments or the like in capsule, lozenge, or pill form because the integrity of the medicament can be maintained through the proper selection of materials used to form the packages.
For preparing blister packages or so-called push through packages, generally a thermoplastic film is first processed by vacuum forming or pneumatic forming so as to form blisters or cavities thereon, namely portions having a predetermined contour corresponding to each specific articl to be received therein. After the so-blistered film has been solidified, each blister is charged with each piece of the article to be packaged and a second or lidding film is then covered over each blister and sealed to the first film. The second lidding film is often a laminate material which can be ruptured by a simple finger-rupture or peeled off from the first film to allow access to a packaged item. Conventional materials used for forming the blistered film have included transparent plastics such as po!yvinySchSoride (PVC), polyvinylidene chloride (PVdC) and po!ychlorotrifluoroethylene (PCTFE), commonly referred to as ACLAR® (HoneyweH/AHied Signal), Packaging for pharmaceuticals or other moisture- sensitive artic!es require not only low moisture permeability but also other properties such as chemical inertness, clarity, rigidity, or uniform thickness. The use of poiyvinylchloride (PVC) and polyviny!idene chloride (PVdC) have been shown to have poor and/or insufficient moisture-proofing properties required by the pharmaceutical industry. While ACLAR® exhibits relatively low moisture vapor transmission, its use in blister packaging is inherently costly.
There is therefore a need in the art for improved blister packaging materials which provides sufficient moisture vapor barrier and chemical inertness properties and is aesthetically pleasing enough to present the products contained therein while being cost effective to be manufactured,
SUMMARY OF THE INVENTION
The present invention is directed to blister components for blister packages formed from a multilayer film. As used throughout this disclosure, the term "blister component" refers to muitilayer thermoplastic film or a roll of multilayer thermoplastic film both of which may be thermoformed, partially thermoformed or not thermoformed at ail. in one embodiment of the present invention, the sequence of layers in the muitilayer thermoplastic film of the blister component is palindromic. As used throughout this application, the term "palindromic" refers to a muitilayer film, the layers of which are substantially symmetrical. Non-limiting examples of palindromic films are film or sheet having the layer sequence of configurations: A/B/A or A/B/B/A or A/C/B/C/A or A/C/D/B/D/C/A or A/D/C/D/B/D/C/D/A, etc. An example of a layer sequence configuration of a non- palindromic film would be A/B/C or A/C/B/A. A palindromic or non-palindromic thermoplastic film may be formed using extrusion lamination methods generally well known in the art. For example, in one generic embodiment, the Ihermoformed blister component of the present invention may be characterized as palindromic which is coextruded by extrusion lamination techniques to produce a layer sequence configuration of A/B/A, In this embodiment, the ihermoformed blister component includes a film where laye A is an exterior layer comprising a poiyvinyichionde (PVC) or a po!yvinyiidene chloride (PVdC), and a layer B which is a central core layer comprising a biend of high densit polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE-Blend), or a high density polyethylene (HOPE) and has a thickness of between 50 pm to 406 pm (2 mil to 16 mil), in one preferred embodiment, each exterior layer comprising a po!yvinyichloride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 pm (5 mil), and more preferably, between 19 pm to 50 pm (0.75 mi! to 4 mil). in an alternative generic embodiment of the present invention, the ihermoformed blister component is a palindromic film which is formed by extrusion lamination and/or extrusion coating techniques to produce a layer sequence configuration of A C/B/C/A. In this embodiment, layer A is an exterior layer comprising a poiyvinyichionde (PVC) or a polyvinylidene chloride (PVdC), a layer B is a central core layer comprising a blend of high density polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE- Blend), or a high density polyethylene (HOPE) and has a thickness of between SO pm to 406 pm (2 mil to 16 mil), and C is a tie layer comprising a tie or an adhesive materia! bonding layers A and B together. In one preferred embodiment, each exterior layer comprising a polyvinySchloride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 pm (5 mil), and more preferably, between 9 pm to 50 pm (0,75 mil to 4 mil).
!n another generic embodiment, the ihermoformed blister component of the present invention may be characterized as a palindromic film which is formed by extrusion lamination and/or extrusion coating techniques to produce a layer sequence configuration of A B/D/B/A. In this embodiment, the therm oformed blister component includes a film where layer A is an exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC), a layer B is an interior layer comprising a blend of a high density polyethylene, a high density polyethylene nucSeation additive and optionally, a hydrocarbon resin (HDPE- B!end). or a high density polyethylene (HDPE) and has a thickness of between 38.1 pm to 190.5 pm (1.5 mil to 7.5 mil), layer D is a centra! core layer, in one preferred embodiment, core layer D comprises ethylene vinyl acetate copolymer (EVA) In one preferred embodiment, each exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 pm (5 mil), and more preferably, between 19 pm to 50 pm (0.75 mi! to 4 mil).,
[09] In another generic embodiment, the thermoformed blister component of the present invention may be characterized as a palindromic which is formed by extrusion lamination and/or extrusion coating techniques to produce a layer sequence configuration of A C/B/D/B/C/A. In this embodiment, the thermoformed blister component includes a layer A which is an exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC), a layer B which is an interior layer comprising a blend of a high density polyethylene, a high density polyethylene nucSeation additive and optionally, a hydrocarbon resin (HD - Blend), or a high density polyethylene (HDPE) and has a thickness of between 38.1 pm to 190.5 pm (1 ,5 mil to 7.5 mil), a layer C which is a tie layer comprising a tie or an adhesive material bonding layers A and B together, and a layer D which is a central core layer, in one preferred embodiment, core layer D comprises an ethylene vinyl acetate copolymer (EVA). In one preferred embodiment, each exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 pm (5 mil), and more preferably, between 19 pm to 50 pm (0,75 mil to 4 mil). in other embodiments of the present invention, the sequence of layers in the multilayer thermoplastic fiim of the blister component is non-pa!indromic.
For example, in one generic embodiment, the thermoformed blister component of the present invention may be characterized as a non-paiindromic fiim which is formed by extrusion lamination and/or extrusion coating techniques to produce a layer sequence configuration of A/B/E. In this embodiment, the thermoformed blister component includes a layer A which is a first exterior layer comprising a polyvinyichioride (PVC) or a po!yvinylidene chloride (PVdC), a layer B which is a central core layer comprising a blend of high density polyethylene, high density polyethylene mucieatton additive and optionally, a hydrocarbon resin (HDPE- Biend) or a high density polyethylene (HOPE) and has a thickness of between 50 μιη to 408 pm (2 mil to 16 mil}, and a layer E which is a second exterior layer comprising a material selected from the group consisting of cyclic oiefin copolymer (COC), po!ypropylene (PP), high impact polystyrene (HIPS), genera! purpose polystyrene (GPPS), stytene block copolymer (SBC), polyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), g!ycol-modified polyethylene terephthalate (PETG) and poSy!actic acid (PLA). in one preferred embodiment, the first exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 μπη (5 mil), and more preferably, between 19 prn to 50 Mm (0.75 mil to 4 mi!}. in an alternative generic embodiment of the present invention, th thermoformed blister component is a non-paiindromic fiim formed from extrusion iamination and/or extrusion coating methods to produce layer sequence having a layer configuration of A/C/8/C/E. In this embodiment, layer A is a first exterior layer comprising a polyvinyichioride (PVC) or a polyvinylidene chloride (PVdC), a layer B which is a central core layer comprising a blend of high density polyethylene, a high density polyethylene nucieation additive and/or a hydrocarbon resin (HD E- B!end): or a high density polyethylene (HOPE) and has a thickness of between 50 pm to 406 pm (2 mil to 18 mil}, a Iayer C which is a tie Iayer comprising a tie or an adhesive material bonding layers A and B, and layers B and E together, and a layer E which is a second exterior layer comprising a materia! selected from the group consisting of cyclic olefin copolymer (COG), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), glycoi- modified polyethylene terephthalate (PETG) and poiylactic acid (PLA). In one preferred embodiment, the first exterior layer comprising a poiyvinylchloride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 Mm (5 mil), and more preferably, between 19 pm to 50 pm (0,75 mil to 4 mil).
In another alternative generic embodiment of the present invention, the thermoformed blister component a non-palindromic film formed by extrusion lamination and/or extrusion coating techniques to produce a non-symmetrical film having a layer sequence configuration of A B/D/B/E. in this embodiment, layer A is a first exterior layer comprising a poiyvinylchloride (PVC) or a polyvinylidene chloride (PVdC), a Iayer B is an interior layer comprising a blend of high density polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE-B!end), or a high density polyethylene (HOPE) and has a thickness of between 38.1 pro to 190.5 pm (1.5 mil to 7,5 mil, a layer D which is a core layer, and a Iayer E which is a second exterior layer comprising a materia! selected from the group consisting of cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), glycol -modified polyethylene terephthalate (PETG) and poiylactic acid (PLA). In one embodiment, core Iayer D comprises an ethylene acetate copolymer (EVA). In one preferred embodiment, the first exterior iayer comprising a polyvinyichloride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less ihan 127 pm (5 mil), and more preferabiy, between 19 pm to 50 pm (0.75 mil to 4 mi!). in still another alternative generic embodiment of the present invention, the thermoformed blister component a non-palindromic fiim formed by extrusion lamination and/or extrusion coating methods to produce a non-symmetrical film having a layer sequence configuration of A/C/B/D/B/C/E. in this embodiment, layer A is a first exterior layer comprising a pofyvsnySchSoride (PVC) or a polyvinylidene chloride (PVdC), a layer 8 which is an interior layer comprising a blend of high density polyethylene, a high density polyethylene nuc!eation additive and optionally, a hydrocarbon resin (HDPE-B!end). or a high density polyethylene (HOPE) and has a thickness of between 38.1 pm to 190.5 pm (1.5 mi! to 7.5 mil, C is a tie layer comprising a tie or adhesive material bonding layers A and 8, and layers B and E together, a layer D which is a core layer, and a layer E which is a second exterior layer comprising a material selected from the group consisting of cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HiPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephthalaie (PET), oriented polyethylene terephthalaie (OPET), amorphous polyethylene terephthalaie (APET), g!ycol- modified polyethylene terephthalate (PETG) and polylactic acid (PLA). In one preferred embodiment, core layer D comprises an ethylene vinyl acetate copolymer (EVA), In one preferred embodiment, the first exterior layer comprising a polyvinyichloride (PVC) or a polyvinylidene chloride (PVdC) has a thickness of less than 127 pm (5 mil), and more preferably, between 19 pm to 50 pm (0.75 mil to 4 mil).
It should be understood that in the above-described generic embodiments, the thermoformed blister component may include additional film layers. The blisier packages of the present invention also include a lidding component which is heat-seaiabie to the first exterior layer A of the blister component in one preferred embodiment, the lidding component comprises a thermoplastic resin heat-seaSable to po!yvinylchloride (PVC) or polyviny!idene chloride (PVdC).
BRIEF DESCRIPTION OF THE DRAWINGS
Further features and advantages of the present invention will become apparent from the following detailed description, taken in combination with the appended drawings, in which:
FIG. 1 illustrates a schematic view of one embodiment of a blister package according to the present invention.
FIG. 2 illustrates an exploded view taken along line A-A of FIG. 1 depicting the blister and lidding components of the present invention,
FIG. 3a illustrates a cross-sectional view of one embodiment of a three-layer blister component according to the present invention.
FIG. 3b illustrates a cross-sectional view of an embodiment of another three- layer blisier component according to the present invention.
FIG. 4a illustrates a cross-sectional view of an embodiment of a five-layer blister component according to the present invention.
FIG. 4b illustrates a cross-sectional view of an embodiment of another five-layer blister component according to the present invention.
FIG. 4c illustrates a cross-sectional view of an embodiment of another five-iayer blister component according to the present invention.
FIG. 4d illustrates a cross-sectional view of an embodiment of another five-iayer blister component according to the present invention. F!G. 5a illustrates a cross-sectionai view of an embodiment of a seven-layer blister component according to the present invention.
FIG. 5b illustrates a cross-sectionai view of an embodiment of another seven- layer blister component according to the present invention,
FIG, 6 illustrates a cross-sectional view of one embodiment of a lidding component according to the present invention.
DETAILED DESCRIPTION OF THE INVENTION in accordance with the practice of the present invention, a representative blister package 10 as described herein is shown in FIGS. 1 and 2. Package 10 of the present invention comprises a thermoformed blister component 11 and a lidding component 12, the former provided with one or more thermoformed pockets 13 surrounded by sealed flange regions 14. Pocket 13 defines an individual compartment for receiving a product 15, such as a tablet, in accordance with an important aspect of the present invention, the thermoformed blister component 11 comprises a multilayer film. It will be appreciated that film of thermoformed blister component 11 may include any number of film layers and film laye compositions depending upon both functional and aesthetic requirements of the blister component, it is desirable that the multilayer thermoplastic film include one or more film layers which are barrier materials and substantially chemically insert when in contact with a product. The term "barrier" refers to a material that controls permeability of one or more elements through a film structure including moisture, chemicals, heat, odor and oxygen or other gases. As it relates to the present invention, a barrier material can be provided by a single film layer or multiple film layers acting individually or in concert with each other, respectively. The phrase "substantially chemically insert" refers to materials that generally are not reactive with the product with which it comes into contact with and does not Seech chemical ingredients Into the product with which it comes into contact. Preferably, thermoformed blister componeni 11 comprises a multilayer film which provides an average water vapor transmission rate of iess than 0.500 g/m2/day or less than 0.250 g/m2/day or iess than 150 g/m2/day or about 0.131 g/m2/day or about 0.1 10 g/m^/day at 100* F (37.8° C) and 90% relative humidity having a thickness of about 10 mi! (254 micron) before being thermoformed. The aforementioned features of the present invention may be achieved by a multilayer fiim comprising at ieast 3 or 4 or 5 or 8 or 7 or 8 or 9 or 10 or 1 1 or 12 or 13 or more layers.
THERMOFORfv ED BLISTER COMPONENT
As used herein, the phrase "high density polyethylene" or "HOPE" refers to homopo!ymers of ethylene that have densities of about 0.960 g/crn^ to about 0.970 g/cm3 as well as copolymers of ethylene and an a!pha-oiefin (such as 1 - butene or 1-hexene) that have densities of about 0.940 g/cm3 to about 0.958 g/cm3 In contrast, a low density poiyethyiene (LDPE) generally has a density of about 0.915 g/cm3 to about 0.930 g/cm3, HOPE is inclusive of polymers made with Ziegier or Phillips type catalysts and polymers made with single-site metailocene catalysts. A non-limiting example of high density polyethylene includes Alathon® IV16020 from Equistar Chemicals LP (Houston, Tex.). Other specific non-limiting examples of HOPE include Aiathoh® L5885 available from Equistar Chemicals LP (Houston, Tex.); ExxonMobil™ HOPE HD 7925.30 available from ExxonMobil Chemical Company (Houston, Tex.); and ExxonMobil™ HOPE HD 7845.30 available from ExxonMobil Chemical Company (Houston, Tex.).
As used herein, the phrase "nucieaiion additive" means a material that increases high density polyethylene crystallinity as a result of its incorporation into HOPE. Such nucieaiion additives typically provide better control over crystallization rates. Examples of nucieaiion additives include minerals such as chalk, talc, clay, kaolin, silicates and the like, and organic agents such as salts of aliphatic or aromatic carboxylic acids, aromatic salts, metallic salts of aromatic phosphorous compounds, quinaridones, and aromatic amides. Further examples include zinc g!yceroiate. calcium g!ycerolate, calcium hexahydrophtha!ate, zinc hexahydrophtha!ate, salts and the like, and mixtures thereof. In one embodiment, the nucieation additive comprises calcium hexahydrophthaiate. in one embodiment, the nucieation additive is present in each interior layer of HOPE from about 0.2% to about 3.5% by weight of the layer. As used herein, the phrase "hydrocarbon resin" refers to a product produced by polymerization from coal tar, petroleum, and turpentine feed stocks, as defined by ISO Standard 472, "Plastics - Vocabulary" incorporated by reference herein to the extent that it teaches hydrocarbon resins. The hydrocarbon resin may be present in an interior or core layer of high density polyethylene from about 3% to about 16% by weight of the layer. A hydrocarbon resin may comprise any of those hydrocarbon resins disclosed in U.S. Pat. No. 6,432,496, issued Aug. 13, 2002, or in US Patent Application 2008/0286547, published Nov. 20, 2008, both of which are incorporated in their entireties in this application by this reference. More specifically, as a non-limiting example, the hydrocarbon resin ma include petroleum resins, terpene resins, styrene resins, cyclopentadiene resins, saturated alicycSic resins or mixtures of such resins. Additionally, as a non- limiting example, the hydrocarbon resin may comprise hydrocarbon resin derived from the polymerization of olefin feeds rich in dicyclopentadiene (DCPD), from the polymerization of olefin feeds produced in the petroleum cracking process (such as crude C feed streams), from the polymerization of pure monomers (such as styrene, a-methylstyrene, 4-methylstyrene, viny!toluene or any combination of these or similar pure monomer feedstocks), from the polymerization of terpene olefins (such as a-pinene, β-pinene or d-limonene) or from a combination of such. The hydrocarbon resin may be fully or partially hydrogenated. Specific examples of hydrocarbon resins include but are not limited to Plastolyn® R1140 Hydrocarbon Resin available from Eastman Chemical Company (Kingsport, Tenn.}, Rega!ite* T1140 available from Eastman Chemical Compan (Kingsport, Tenn.}, Arkon® P-140 available from Arakawa Chemical Industries, Limited (Osaka, Japan) and Piccol te® S135 Polyterpene Resins available from Hercules Incorporated (Wilmington, Del.)
As used throughout this application, the term "polypropylene" refers to a homopoiymer or copolymer having a propyl or C-3 linkage between repeating units. A non-limiting example of a suitable propylene copolymer is Propylene 4170 available from Total Petrochemicals USA, Inc. (Houston, Tex.}. Other non- limiting examples of poly propylenes include Polypropylene 3287W2, which is available from Total Petrochemicals USA, Inc. (Houston, Tex.); and H02C-00 Polypropylene Homopoiymer, which is available from Ineos Olefins & Polymers USA (League City, Tex.).
As used throughout this application, the term 'polyester" refers to a homopoiymer or copolymer having an ester linkage between repeating units which may be formed, for example, b condensation polymerization reactions between a dicarboxytic acid and a diol. The ester linkage can be represented by the general formula: [0-R-OC(0)-R'-C(0)]n where R and Rf are the same or different alky! (or aryS) group and may be generally formed from the polymerization of dicarboxy!ic acid and diol monomers containing both carboxy!ic acid and hydroxy! moieties. The dicarboxytic acid (including the carboxylic acid moieties) may be linear or aliphatic (e.g., lactic acid, oxalic acid, maleic acid, succinic acid, giutaric acid, adipic acid, pimeSic acid, suberic acid, azeiaic acid, sebacic acid, and the like) or may be aromatic or aikyi substituted aromatic (e.g., various isomers of phthalic acid, such as paraphthaiic acid (or terephthaSic acid), isophthalic acid and naphthalic acid). Specific examples of a useful diol include but are not limited to ethylene glycol, propylene glycol, trimethylene glycol, 1 ,4-butane diol, neopentyi glycol, cyclohexane diol and the like. Polyesters may include a homopoiymer or copolymer of aiky!-aromatic esters including but not limited to polyethylene terephthalate (PET), amorphous polyethylene terephtha!ate (APET), crystalline polyethylene terephthalate (CPET), giycoi-modified polyethylene terephthalate (PETG) and polybutylene terephthalate; a copolymer of terephthalate and isophthaiate including but not limited to polyethylene terephthaiate/isophthalate copolymer; a homopolymer or copolymer of aliphatic esters including but not limited to poiyiactic acid (PLA); polyhydroxyaikonates including but not limited to polyhydroxypropionate, poly(3-hydroxybutyrate) (PH3B), poiy(3-hydroxyvalerate) (PH3V), poiy(4-hydroxybutyrate) (PH4B), poly(4-hydroxyvalerate) (PH4V), pofy(5-hydroxy valerate) (PH5V), poly(6-hydroxydodecanoate) (PH8D); and blends of any of these materials. A non-limiting example of PETG is Eastar™ Copolyester 6763, which is also available from Eastman Chemical Company (Kingsport, Tenn,}.
As used herein, the term "poiyiactic acid" is used synonymously throughout this disclosure to describe homopoiymers or copolymers having an ester linkage between monomer units and can be represented b the general formula: [— OCH(R)C(OHn where R^CHs. Poiyiactic acid may be fabricated by polymerizing lactic acid, which is mostly produced from by carbohydrate fermentation of corn. Poiyiactic acid may be also produced by polymerization of lactide which obtained by condensation of two lactic acid molecules. Poiyiactic acid has a glass transition temperature of ranges from 50-80° C while the melting temperature ranges from 130-180° C. Poiyiactic acid is known by those skilled in the art and fully disclosed in U.S. Pat, Nos, 5,698,322; 5,142,023; 5760,144; 5,593,778; 5,807,973: and 5.010,145, the entire disclosure of each of which is hereby incorporated by reference. Examples of commercially avaiiable poiyiactic acid are soid under the trademark NatureWorks™ PLA Polymer in grades 4031 ~D, 4032-D, and 4041 -D from CargiSI Dow LLC, Minneapolis, Minn., U.S.A.
As used throughout this application, the term "polystyrene" or "PS" refers to a homopolymer or copolymer having at least one styrene repeating linkage (such as benzene (i.e., CgHs) having an ethylene substituent) within the repeating backbone of the polymer. The styrene linkage can be represented by the genera! formula: [CH2-CH2 (CeHs)^. Polystyrene may be formed by any method known to those skilled in the art. Examples of styrenic poiymers include but are not limited to high impact polystyrene (HIPS), general purpose polystyrene (GPPS) and styrene block copolymer (SBC). HiPS is sometimes called rubber-modified polystyrene and is normally produced by copo!ymerizatson of styrene and a synthetic rubber. (See Wagner, ei al. , "Polystyrene," The Wiley Encyclopedia of Packaging Technology, Second Edition, 1997, pp. 768-771 (John Wiley & Sons, Inc., New York, New York), which is incorporated in its entirety in this application by this reference.) Examples of HIPS include but are not limited to impact Polystyrene 825E and Impact Polystyrene 945E, both of which are available from Total Petrochemicals USA, Snc; EB6025 Rubber Modified High impact Polystyrene, which is available from Chevron Phillips Company (The Woodlands, Texas); and 6210 High impact Polystyrene, which is available from !neos Nova LLC (Channahon, Illinois). GPPS is often called crystal polystyrene, as a reference to the clarity of the resin. Examples of GPPS include but are not limited to Crystal Polystyrene 524B and Crystal Polystyrene 525B both of which are available from Total Petrochemicals USA, Inc. Styrene block copolymers (SBC) include styrene butadiene copolymers (SB). The styrene-butadiene copoiymers that are suitable for packaging applications are those resinous block copoiymers that iypically contain a greater proportion of siyrene than butadiene and thai are predominantiy poiymodal with respect to molecular weight distribution. (See Hartsock, "Styrene-Butadiene Copolymers," The Wiley Encyclopedia of Packaging Technology, Second Edition, 1997, pp. 863-864 (John Wiley & Sons, Inc., New York, New York), which is incorporated in its entirety in this application by this reference.) A non-limiting example of SB is DK13 K-Resin® Styrene-Butadiene Copolymer, which is available from Chevron Phillips Chemical Company (The Woodlands, Texas). it should be understood that the phrase "tie layer material" may include, but not limited to, unmodified polyoiefins such as potyethyienes and ethylene viny! acetate copolymers, unmodified ester copoiymers such as ethylene acry!ate copolymers and ethyiene methacrylate copoiymers and unmodified ethyiene acid copoiymers such as ethyiene acrylic acid copolymers and blends thereof. Tie iayer materials may also include modified poiyoiefins including, but not limited to anhydride modified poiyethy!enes, maieic anhydride modified ethylene elastomers, anhydride modified ethyiene vinyl acetate copoiymers, modified ester copolymers such as anhydride modified ethylene acrylate copoiymers, modified ethylene acid copoiymers such as anhydride modified ethylene acryiic acid copolymers and blends thereof. Tie Iayer materials may further include a blend of an unmodified poiyolefin or unmodified ester copoiymer or unmodified ethylene acid copolymer and a modified poiyolefin or modified ester copoiymer or modified ethylene acid copoiymer. in one embodiment as depicted in FIG. 3a, thermoformed blister component 11 comprises a multilayer palindromic fiim 100a comprising at least a three-layer structure of a first exterior iayer 101a, a central core layer 102a and a second exterior iayer 103a, In this embodiment, first and second exterior layers 101a and 103a comprise the same materials selected from the group consisting of po!yvinyichioride (PVC) and polyvinylidene chloride (PVdC). In another embodiment represented in FIG. 3b, thermoformed blister component 11b comprises a multilayer non-palindromic fiim 100b comprising at least a three- layer structure of a first exterior Iayer 101b, a centra! core layer 102b and a second exterior layer 103b. The first and second exterior layers 101b and 103b comprise different materials where the first exterior Iayer 101b comprises a po!yvinylchioride (PVC) or a polyvinylidene chloride (PVdC), and the second exterior Iayer 103b comprises comprising a material selected from the group consisting of cyclic olefin copoiymer (COG), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), poiyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), giycoi- modified polyethylene terephthalate (PETG) and polylactic acid (PLA). In these embodimenis, the central core layer 102a and 102b, each comprises a blend of a high density polyethylene, a high density polyethylene nucieation additive and/or a hydrocarbon resin (HDPE-Blend) or a high density polyethylene (HDPE) and has a thickness of between 50 pm to 406 pm (2 mil to 16 mil).
[40] These three-layer embodiments described above ma include, but are not limited to the following iayer sequences and general Iayer compositions: PVC / HDPE- Blend / PVC; PVC / HDPE / PVC; PVdC / HDPE-Blend / PVdC; PVdC / HDPE / PVdC; PVC / HDPE-Blend COC; PVC / HDPE-Blend / PP; PVC / HDPE-Blend / HIPS; PVC / HDPE / HIPS; PVdC / HDPE-Blend / HIPS; PVdC / HDPE / PVdC; PVC / HDPE-Blend / GPPS; PVC / HDPE / GPPS; PVdC / HDPE-Blend / GPPS; PVdC / HDPE / GPPS; PVC / HDPE-Blend / SBC; PVC / HDPE / SBC; PVdC / HDPE-Blend / SBC; PVdC / HOPE / SBC; PVC / HDPE-Blend / PET; PVC / HDPE / PET; PVdC / HDPE-Blend / PET; PVdC / HDPE / PET; PVC / HDPE-Blend / OPET; PVC / HDPE / OPET; PVdC / HDPE-Blend / OPET; PVdC / HDPE / OPET; PVC / HDPE-Blend / APET; PVC / HDPE / APET; PVdC / HDPE- Blend / APET; PVdC HDPE / APET; PVC / HDPE-Blend / PETG; PVC / HDPE- Blend / PLA; PVdC / HDPE-Blend / COC; PVdC / HDPE-Blend / PP; PVdC / HDPE-Blend / PETG; PVdC / HDPE-Blend / PLA; PVdC / HDPE / COC; PVdC / HDPE / PP; PVdC / HDPE / PETG; and PVdC / HDPE / PLA,
[41] in another preferred embodiment, as depicted in F!G. 4a, thennoforrned blister component 11 comprises a multilayer palindromic film 200a comprising a five- layer structure of a first exterior layer 201a, a centra! core layer 202a, a second exterio layer 203a and two tie layers 204a and 205a, each positioned between an exterior layer and the central core layer, in this embodiment, first and second exterior layers 101a and 103a comprise the same materials selected from the group consisting of polyviny!chioride (PVC) and poiyviny!idene chloride (PVdC). The centra! core layer, 202a, comprises a biend of a high density polyethylene, a high density polyethylene nucleation additive and/or a hydrocarbon resin (HDPE- Biend), or a high density po!yethyiene (HDPE) and has a thickness of between 50 pm to 406 pm (2 mil to 18 mil). Each tie layer comprises a maieic anhydride modified ethylene elastomer. In another embodiment, thermoformed blister component 11 comprises a multilayer non-pa! indromic film 200b illustrated in F!G. 4b, In this embodiment, film 200b comprises the same fi!m sequence and iayer compositions as described for fi!m 200a in FIG. 4a, except for the second exterior iayer 203b comprises a different material than the first exterior iayer which is selected from the group consisting of cyclic olefin copolymer (COC), polypropylene (PP). high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene biock copolymer (SBC), polyethylene terephthaiate (PET), oriented polyethyiene terephthaiate (OPET), amorphous polyethylene terephthaiate (APET), giycol-modified polyethylene terephthaiate (PETG) and poly!actic acid (PLA). In another preferred embodiment, as depicted in FIG. 4c, thermoformed blister component 11 comprises a multilayer palindromic film 200c comprising a five- layer structure of a first exterior iayer 201c, a central core layer 202a, a second exterior Iayer 203c and two interior layers 204c and 205c, each positioned between an exterior layer and the central core Iayer. in this embodiment, first and second exterior layers 201c and 203c comprise the same materials selected from the group consisting of polyvinyichioride (PVC) and po!yvinyiidene chloride (PVdC). The centra! core layer 202c ma comprise any thermoplastic materia! and preferably, comprises an ethylene vinyi acetate copolymer. The two interior layers, 204c and 205c, each comprises a blend of a high density polyethylene, a high density polyethylene nucleation additive and/or hydrocarbon resin (HDPE- Blend), or a high density polyethylene (HDPE) and has a thickness of between 38,1 pm to 190,5 pm (1.5 mil to 7.5 mil). In another embodiment, thermoformed blister component 11 comprises a multilayer non-paiindromic film 200d illustrated in FIG. 4d. In this embodiment, film 20Od comprises the same film sequence and layer compositions as described for film 200c in FIG. 4c, except for the second exterior layer 203d comprises a different material than the first exterior layer which is selected from the group consisting of cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephtha!ate (PET), oriented polyethylene terephtha!ate (OPET), amorphous polyethylene terephthalaie (APET), gfycol-modified polyethylene terephthalate (PETG) and poly!actic acid (PLA).
These five-layer embodiments described above may include, but are not limited to the following layer sequences and general layer compositions: PVC / tie / HDPE-Biend / tie / PVC; PVC / tie / HDPE / tie / PVC; PVdC / tie / HDPE-Biend / tie / PVdC: PVdC / tie / HOPE / tie / PVdC; PVC / tie / HDPE-Biend / tie / COC; PVC / tie / HDPE-Biend / tie / PP; PVC / tie / HDPE-Biend / tie / HIPS; PVC / tie / HDPE / tie / HIPS; PVdC / tie / HDPE-B!end / tie / HIPS; PVdC / tie / HDPE / tie / HIPS: PVC / tie / HDPE-Biend / tie / GPPS; PVC / tie / HDPE / tie / GPPS; PVdC / tie / HDPE-Biend / tie / GPPS; PVdC / tie / HDPE / tie / GPPS; PVC / tie / HDPE-Biend / tie / SBC; PVC / tie / HDPE / tie / SBC; PVdC / tie / HDPE-B!end / tie / SBC; PVdC / tie / HDPE / tie / SBC; PVC / tie / HDPE-Biend / tie / PET; PVC / tie / HOPE / tie / PET; PVdC / tie / HDPE-Biend / fie / PET; PVdC / tie / HDPE / tie / PET; PVC / tie / HDPE-Biend / tie / OPET; PVC / tie / HDPE / tie / OPET; PVdC / tie / HDPE-Biend / tie / OPET; PVdC / tie / HDPE / tie / OPET; PVC / tie / HDPE-Biend / tie / APET; PVC / tie / HDPE / fie / APET; PVdC / tie / HDPE- Biend / tie / APET; PVdC / tie / HDPE / tie / APET ; PVC / tie / HDPE-Biend / tie / PETG; PVC / tie / HDPE-Biend / tie / PLA; PVdC / tie / HDPE-Biend / tie / COC; PVdC / tie / HDPE-Biend / tie / PP; PVdC / tie / HDPE-Biend / tie / PETG; PVdC / tie / HDPE-Biend / tie / PLA; PVdC / tie / HDPE / fie / COC; PVdC / tie / HDPE / tie / PP: PVdC / tie / HDPE / tie PETG; and PVdC / tie / HDPE / tie / PLA, Those skilled in the art will recognsze that a tie layer materia! may not be needed to bond a cyclic olefin copolymer (COC) to a high density polyethylene. Therefore, while the above exampies illustrate symmetrica! film structures having at least five layers, a tie layer between cyclic olefin copolymer (COC) and high density polyethylene may be omitted and thus, four-layer film structures can be formed as well.
In another preferred embodiment, as depicted in FIG. 5a, thermoformed blister component 11 comprises a multilayer palindromic film 300a comprising a seven- layer structure of a first exterior layer 301a, a centra! core layer 302a, a second exterior layer 303a and two interior layers 304a and 305a, each positioned between an exterior layer and the centra! core layer, and two tie layers 306a and 307a, each positioned between an exterior layer and the central core layer. The two interior layers 304a and 305a, each comprises a blend of a high density polyethylene, a high density polyethylene nucleation additive and/or hydrocarbon resin (HDPE-B!end), or a high density polyethylene (HOPE) and has a thickness of between 38.1 μηπ to 190.5 pm (1.5 mil to 7.5 mil). In this embodiment, first and second exterior layers 301a and 303a comprise the same materials selected from the group consisting of polyvinyich!oride (PVC) and poSyviny!idene chloride (PVdC). The central core layer 302c comprises any thermoplastic materia! and preferably, comprises an ethylene vinyl acetate copolymer. Each tie layer comprises a maieic anhydride modified ethylene elastomer. In another embodiment, thermoformed blister component 11 comprises a multilayer non- pa!indromic film 300b illustrated in FIG. 5a. In this embodiment, film 300b comprises the same film sequence and !ayer compositions as described for film 300a in FIG. 5a, except for the second exterior layer 303b comprises a different material than the first exterior layer which is selected from the group consisting of cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephtha!ate (PET), oriented polyethylene terephthaiate (OPET), amorphous polyethylene terephthaiate (APET), g!ycol-modified polyethylene terephthaiate (PETG) and poiyiactic acid (PLA). These seven-layer embodiments described above may include, but are not limited to the following layer sequences and general layer compositions: PVC / tie / HDPE-Blend / EVA / HDPE-Blend / tie / PVC; PVC / tie / HOPE / EVA / HOPE / tie / PVC: PVdC / tie / HDPE-Blend / EVA / HDPE-Blend / tie / PVdC; PVdC / tie / HD E / EVA / HOPE / tie / PVdC; PVC / tie / HDPE-BSend / EVA / HDPE-BSend / tie / COC; PVC / tie / HDPE-Blend / EVA / HDPE-Blend / tie / PP; PVC / tie / HDPE-B!end / EVA / HDPE-Blend / tie / HIPS; PVC / tie / HDPE / EVA / HDPE / tie / HIPS; PVdC / tie / HDPE-Blend / EVA / HDPE-Biend / tie / HIPS; PVdC / tie / HDPE / EVA / HOPE / tie / HIPS; PVC / tie / HDPE-Blend / EVA / HD E-BSend / tie / GPPS; PVC / tie / HDPE / EVA / HDPE / tie / GPPS; PVdC / tie / HDPE-BSend / EVA / HDPE-BSend / tie / GPPS; PVdC / tie / HDPE / EVA / HDPE / tie / GPPS; PVC / tie / HDPE-Blend / EVA / HDPE-BSend / tie / SBC; PVC / tie / HDPE / EVA / HDPE / tie / SBC; PVdC / tie / HDPE-BSend / EVA / HDPE-BSend / tie / SBC: PVdC / tie / HDPE / EVA / HDPE / tie / SBC; PVC / tie / HDPE-BSend / EVA / HDPE-Biend / tie / PET; PVC / tie / HDPE / EVA / HDPE / tie / PET: PVdC / tie / HDPE-Blend / EVA / HDPE-BSend / tie / PET: PVdC / tie / HDPE / EVA / HDPE / tie / PET; PVC / tie / HDPE-Biend / EVA / HDPE-Blend / tie / OPET; PVC / tie / HDPE / EVA / HDPE / tie / OPET; PVdC / tie / HDPE- BSend / EVA / HDPE-Blend / tie / OPET; PVdC / tie / HDPE / EVA / HDPE / tie / OPET; PVC / tie / HDPE-Biend / EVA / HDPE-Biend / tie / APET; PVC / tie / HDPE / EVA / HDPE / tie / APET; PVdC / tie / HDPE-Biend / EVA / HDPE-Blend / tie / APET; PVdC / tie / HDPE / EVA / HDPE / tie / APET; PVC / tie / HDPE- Biend / EVA / HDPE-Blend / tie / PETG; PVC / tie / HDPE-Blend / EVA / HDPE- Blend / tie / PLA; PVC / tie / HDPE / EVA / HDPE / tie / COC; PVC / tie / HDPE / EVA / HDPE / tie / PP; PVC / tie / HDPE / EVA / HDPE / tie / PETG; PVC / tie / HDPE / EVA / HDPE / tie / PLA; PVdC / tie / HDPE-Blend / EVA / HDPE-Blend / tie / COC; PVdC / tie / HDPE-Biend / EVA / HDPE-Biend / tie / PP; PVdC / tie / HDPE-Biend / EVA / HDPE-Blend / tie / PETG; PVdC / tie / H DP E -Blend / EVA /
HDPE-Blend / tie / PLA; PVdC / tie / HOPE / EVA / HOPE / tie / COC; PVdC / tie / HOPE / EVA / HOPE / tie / PP; PVdC / tie / HDPE / EVA / HOPE / tie / PETG; PVdC / tie / HDPE / EVA / HOPE / tie / PLA.
It should be understood that in the examples described above; when a !ayer comprising a blend of a high density polyethylene, a high density poiyethylene nuc!eation additive and/or hydrocarbon resin (HDPE-Blend), or a high density poiyethylene {HDPE) is in direct contact with a layer comprising cyclic olefin copolymer (COC), the tie layer may not be required to bond these materials together, and thus structures having fewer tie layers may be created. it should be understood that in the above-described generic embodiments, the therm oformed blister component may include additional film layers.
The total thickness of multilayer films of the thermoformed blister component 11 of the present invention is generally from about 12.7 pm (0.5 mil) to about 508 pm (20 mil), typically from about 50.8 pm (2 mil) to about 254 pm (10 mil), most typically from about 76.2 pm (3 mil) to about 203.2 pm (8 mil).
In accordance with the practice of the present invention, one embodiment of a iidding component 12 of the present invention is depicted in FIG. 5. In this embodiment, lidding component 12 comprises a laminate 400 having a first exterior layer 401 , and a second exterior layer 402. Preferably, first exterior layer 401 comprises a metal foil such as aluminum, and second exterior 402 comprises adhesiv material such as an acrylic coating which is heat seaiabie to poiyvinySchio ide (PVC) and poiyvinylidene chloride (PVdC).
The blister packages of the present invention can be manufactured using methods known in the art. Generally, the blister cavities are thermoformed from the blister components of the present invention in-line just prior to filling the cavities with a product to be packaged. The lidding component is then unwound from a roil and brought into contact with the formed and filled blister component such that the heat-sea! layer of the lidding component contacts the blister component. The lidding and blister components are heat sealed, typically using a heated platen. Some areas of the package may not be sealed to provide a starting point for peeling off the lidding component prior to removing the product. If the lidding component is not pre-printed, printing is generally done just before heat sealing. After heat-sealing, the individual blisters may be perforated using methods known is the art so thai they can removed at point of use.
The above description and the following examples illustrate certain embodiments of the present invention and are not to be interpreted as limiting. Selection of particular embodiments, combinations thereof, modifications, and adaptations of the various embodiments, conditions and parameters normally encountered in the art will be apparent to those skilled in the art and are deemed to be within the spirit and scope of the present invention.

Claims

What is claimed:
1. A biister component for a blister package, comprising: a multilayer thermoplastic film comprising: i. first exterior iayer comprising a poSyvinylchloride (PVC) or a polyviny!idene chloride (PVdC);
ii. a central core Iayer comprising a blend of a high density
polyethylene and a high density polyethylene nucleation additive; and
iii. a second exterior layer comprising a material selected from the grou consisting of poSyvinylchloride (PVC), polyvinyiidene chloride (PVdC), cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HIPS), genera! purpose polystyrene (GPPS), styrene block copolymer (SBC), polyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), giycoi-modified polyethylene terephthalate (PETG) and po!yiactsc acid (PLA),
2. A component according to claim 1 , wherein the central core layer comprises a hydrocarbon resin.
3. A blister component for a biister package, comprising: a multilayer thermoplastic film comprising: i. a first exterior Iayer comprising a polyvinySchioride or a polyvinyiidene chloride; is. a central core layer comprising a high density polyethylene and has a thickness of between 50 m to 4G8 pm (2 mil to 16 mil); and iii. a second exterior layer comprising a material selected from the group consisting of po!yvinylchloride (PVC), polyvinylidene chloride (PVdC), cyclic olefin copolymer {CQC}, polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPRS), styrene block copolymer (SBC), polyethylene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), gSycol-modified polyethylene terephthalate (PETG) and poiylactic acid (PLA).
4. A component according to claims 1 to 3, wherein the multilayer thermoplastic film comprises two interior layers each comprising a tie layer material.
5. A component according to claim 4, wherein each of the two interior layers are in direct contact an exterior layer.
6. A component according to claim 4, wherein each of the two interior layers are in direct contact the central core layer.
7. A component according to claim 4, wherein the two interior layers each comprise a maleic anhydride modified ethylene elastomer.
8. A component according to claims 1 to 3, wherein the central core layer has a thickness of at least 40% of the tota! thickness of the multilayer thermoplastic film
9, A component according to claims 1 to 3, wherein the central core layer has a thickness of at least 45% of the total thickness of the muitiiayer thermoplastic film.
A component according to claims 1 to 3, wherein the central core layer has a thickness of at least 50% of the total thickness of the multiiayer thermoplastic film.
11. A component according to claims 1 to 3, wherein the central core iayer has a thickness of at least 55% of the total thickness of the multilayer thermoplastic film.
A component according to claims 1 to 3, wherein the central core layer has a thickness of at least 60% of the total thickness of the muitiiayer thermoplastic film.
A component according to claims 1 to 3, wherein the central core layer has a thickness of at least 65% of the total thickness of the multiiayer thermoplastic film.
14. A component according to claims 1 to 3, wherein the central core iayer has a thickness of at least 75% of the total thickness of the muitiSayer thermoplastic fiim.
15. A component according to claims 1 to 3, wherein each exterior iayer has a thickness of less than 127 pm (5 mii),
16. A component according to ciaim 15, wherein each exterior layer has a thickness of between 19 pm to 50 prn (0.75 mii to 4 mil).
17. A blister component for a blister package, comprising; a multilayer thermoplastic fiim comprising: i. a first exterior iayer comprising a poiyvinylchloride (PVC) or a polyvinySidene chloride (PVdC); and
1 a first interior iayer comprising a biend of a high density poiyethyiene and a high density poiyethyiene nucieaiion additive; iii. a centra! core layer;
iv. a second interior iayer comprising a biend of a high density poiyethyiene and a high density polyethylene nucieaiion additive; and
v. a second exterior layer comprising a materia! selected from the grou consisting of poiyvinylchloride (PVC), polyvinylidene chloride (PVdC), cyclic olefin copolymer (COC), polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPPS), styrene block copolymer (SBC), poiyethyiene terephtha!ate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), giycol-modified polyethylene terephthalate (PETG) and poiyiactic acid (PLA).
18, A blister component according to claim 17, wherein the first and second interior layer each comprises a hydrocarbon resin.
19. A blister component for a blister package, comprising; a multilayer thermoplastic film comprising: i. a first exterior layer comprising a po!yvinyich Sonde (PVC) or a poSyvinySidene chloride (PVdC);
ii. a first interior layer comprising a high density polyethylene and having a thickness of between 38.1 pm to 190.5 pm (1.5 mil to 7.5 mil)
iii. a core layer;
iv. a second interior layer comprising a high density polyethylene and having a thickness of between 38.1 pro to 190.5 pm (1.5 mil to 7.5 mil); and
v. a second exterior layer comprising a material selected from the group consisting of poiyvinyichioride (PVC), polyvinylidene chloride (PVdC), cyclic olefin copolymer (COC); polypropylene (PP), high impact polystyrene (HIPS), general purpose polystyrene (GPRS), styrene block copolymer (SBC), poiyethy!ene terephthalate (PET), oriented polyethylene terephthalate (OPET), amorphous polyethylene terephthalate (APET), giycol-modified polyethylene terephthalate (PETG) and polylactic acid (PLA).
20. A component according to claims 17 to 19, wherein the muiti!ayer thermoplastic film comprises a first tie layer and a second tie iayer each comprising a tie iayer material; wherein the first tie layer is positioned between the first exterior iayer and the first interior iayer, and the second tie Iayer is positioned between the second exterior iayer and the second interior layer.
21. A component according to claims 17 to 19, wherein the first exterior layer has a thickness of less than 127 urn (5 mil), and more preferably, between 19 pm to 50 pm (0.75 mi! to 4 mil).
22. A component according to ciaim 21 , wherein the first exterior Iayer has a thickness between 19 pm to 50 pm (0.75 mil to 4 mil),
23. A component according to ciaim 20, wherein the first tie layer is in direct contact with both the first exterior layer and the first interior Iayer,
24. A component according to claim 20, wherein the second tie iayer is in direct contact with both the second exterior layer and the second interior layer.
25. A component according to claim 20, wherein the first tie layer and the second tie layer each comprise a rnaSeic anhydride modified ethylene elastomer.
26. A component according to claims 1 to 19, wherein the central core layer comprises a high densit polyethylene having a density of at ieast about 0.96 g/cm3
27. A component according to ciaims 1 to 19. wherein the cyclic olefin copolymer is formed from norbornene and ethylene monomers.
A component according to claims 1 to 19, wherein the cyclic olefin copoSymer has a heat deflection temperature under load (0.45 MPa) of about 75° C.
A component according to claims 1 to 19, wherein the cyclic olefin copolymer has a heat deflection temperature under ioad (0.45 MPa) of about 130° C.
A component according to claims 1 to 19, wherein the cyclic olefin copolymer has a heat deflection temperature under load (0,45 MPa) of about 150° C.
31. A component according to claims 1 to 19, wherein the cyclic olefin copoSymer has a heat deflection temperature under load (0,45 MPa) of about 170" C,
32. A component according to claims 1 to 19, wherein the multilayer thermoplastic film comprises at least 5 layers.
PCT/US2014/041260 2014-06-06 2014-06-06 Blister packaging components WO2015199637A1 (en)

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PCT/US2014/041260 WO2015199637A1 (en) 2014-06-06 2014-06-06 Blister packaging components
EP14895844.0A EP3152053A4 (en) 2014-06-06 2014-06-06 Blister packaging components

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US11260624B2 (en) 2015-12-29 2022-03-01 Danapak Flexibles A/S Method for providing an extreme chemical resistant film, a film and laminate obtainable therefrom
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