WO2015176004A1

WO2015176004A1 - Dental crown having a chip integrated inside open space and method of manufacture

Info

Publication number: WO2015176004A1
Application number: PCT/US2015/031194
Authority: WO
Inventors: Yunoh Jung
Original assignee: Yunoh Jung
Priority date: 2014-05-15
Filing date: 2015-05-15
Publication date: 2015-11-19

Abstract

A method for making a dental restoration (5) comprises forming a precursor restoration (5') from a first restorative material, forming an open space (9, 10) in an exterior of the first restorative material, disposing a second hardenable material (7) in the open space of the precursor restoration, positioning at least one component (101) inside the open space of the precursor restoration and into the second hardenable material, and curing or hardening the second hardenable material, defining a final restoration.

Description

Dental Crown Having a Chip Integrated Inside Open Space and Method of

Manufacture

BACKGROUND

Field of the Invention

The present invention relates generally to a dental crown having a chip integrated into open space of a dental crown and method of manufacture.

Related Art

Early detection of disease plays a crucial role in successful therapy. Early diagnosis and management reduces the severity and possible complications of the disease process. To overcome this challenge, lots of researches have been made to find molecular disease biomarkers that reveal a hidden lethal threat before the disease becomes complicated. Saliva, an important physiologic fluid, containing a highly complex mixture of substances, is rapidly gaining popularity as a diagnostic tool. Periodontal disease is a chronic disease of the oral cavity comprising a group of inflammatory conditions affecting the supporting structures of the dentition. In the field of periodontology, traditional clinical criteria are often insufficient for determining sites of active disease, for monitoring the response to therapy, or for measuring the degree of susceptibility to future disease progression. Saliva, as a mirror of oral and systemic health, is a valuable source for clinically relevant information because it contains biomarkers specific for the unique physiologic aspects of periodontal diseases. Saliva, an oral fluid that contains an abundance of proteins and genetic molecules and is readily accessible via a totally noninvasive approach, has long been recognized as the potential solution to these limitations. Saliva provides an easily available, noninvasive diagnostic medium for a rapidly widening range of diseases and clinical situations.

Periodontitis is initiated by an overgrowth of specific bacterial species found at the gingival margin and results in a destruction of the tooth supporting tissues, including the periodontal ligament and alveolar bone. The presence of gram-negative anaerobic bacteria, such as Bacteroides forsythus, Porphyromonas gingivalis, Prevotella intermedia,

Fusobacterium nucleatum, Treponema denticola, Actinobacillus and other bacteria species, in sub-gingival sites has been associated with the different forms of periodontitis. The mechanisms of tissue destruction in periodontal diseases are complex and involve, in part, different bacterial products of several bacteria species. Meanwhile, wearable sensors have recently received considerable interest owing to their promise for real-time monitoring of the wearer's health and fitness in a wide range of biomedical, sport and military scenarios. Until recently, most of the activity on wearable sensors has focused on monitoring vital signs from physical signals such as

electrocardiography and pulse oximetry, while wearable chemical sensors have received limited attention.

Recent efforts have led to wearable biosensors for detecting chemical biomarkers in human fluids that can be obtained noninvasively, e.g., tears, sweat or saliva. Of these fluids, saliva has been considered extremely attractive for such non-invasive monitoring, in part due to its continuous and convenient availability. Additionally, saliva has good correlation with blood concentrations of numerous analytes. Such correlation reflects the permeation of multiple constituents from blood to saliva via transcellular or paracellular paths.

Sialochemistry has thus been recognized as a useful non-invasive alternative to blood analysis for monitoring the hormonal, stress and metabolic states of individuals.

SUMMARY OF THE INVENTION

It has been recognized that it would be advantageous to develop a method and apparatus to identify and/or detect bacteria in a patient's mouth. In addition, it has been recognized that it would be advantageous to resist gum disease and bacteria causing gum disease. In addition, it has been recognized that it would be advantageous to monitor activity in a patient's mouth over a long period of time (e.g. lyr, 5yrs, 10 yrs). In addition, it has been recognized that it would be advantageous to provide a biosensor and/or related circuitry in a patient's mouth. In addition, it has been recognized that non- invasive wearable chemical sensors can yield useful insights into the overall health status and performance of individuals beyond physical parameters alone. In addition, it has been recognized that a crown with integrated biosensors could provide continuous, noninvasive health monitoring, allowing for improved patient comfort and safely detect oral diseases, HIV, cancers and diabetes through saliva, saving patients time and money on costly diagnostic procedures. In addition, it has been recognized that such a crown with integrated biosensors could also transmit wireless signals in real-time, making it practical for health care professionals to collect health data from patients without the need for office visits. Furthermore, it has been recognized that sensors integrated in the crown can monitor pH, glucose and various chemicals found in saliva to aid diagnosis of oral diseases, HIV, cancers and diabetes. Such wireless transmitters can send information from the device to software that allows healthcare professionals to analyze all collected data.

The invention provides a dental restoration, such as a crown or bridge, to receive and match a prepared tooth or an implant abutment. The dental restoration is formed of a first restorative material. The dental restoration has a restoration margin line corresponding with a margin line of the prepared tooth when cut, to receive the dental restoration or the implant abutment. The dental restoration has occlusal, mesial side, buccal, distal side, and lingual walls, with the buccal wall to be adjacent a patient's cheek, and the lingual wall to be adjacent a patient's tongue, the occlusal wall to face an opposing tooth, the mesial and the distal side walls each to face a different adjacent tooth. At least one open space is in an exterior of the first restorative material of the dental restoration. A second material, different than the first restorative material, is in the at least one open space of the dental restoration. At least one component, comprising an electronic component and/or a chemical component on a substrate is inside the at least one open space and in the second material.

The invention provides a method for making a dental restoration to receive and match a prepared tooth or an implant abutment, the method comprises:

a) forming a precursor restoration from a first restorative material outside of a patient's mouth to have occlusal, mesial side, buccal, distal side, and lingual walls, with the buccal wall configured to be adjacent a patient's cheek, and the lingual wall configured to be adjacent a patient's tongue, the occlusal wall configured to face an opposing tooth, the mesial and the distal side walls each configured to face a different adjacent tooth;

b) creating a restoration margin line in the first restorative material, corresponding with a margin line of the prepared tooth when cut, to receive the dental restoration or the implant abutment;

c) contouring the buccal wall to have substantially a desired final contour;

d) forming at least one open space in an exterior of the first restorative material; e) disposing a second hardenable material, different than the first restorative material, in the at least one open space of the precursor restoration;

f) positioning at least one component, comprising an electronic component and/or a chemical component on a substrate, inside the at least one open space of the precursor restoration and into the second hardenable material; and g) curing or hardening the second hardenable material while outside the patient's mouth, defining a final restoration.

Dental crown and methods of manufacture are provided. In one aspect, a method includes: positioning one or more components in predefined locations on substrate; providing hardenable second material inside the open space of a precursor crown; applying pressure on the one or more components to dispose inside the open space; embedding the one or more components on a substrate inside the open space by hardening the hardenable material. The method can also include: making a precursor crown with open space on or around at least one of the mesial and distal area; filling the open space with hardenable material; positioning one or more components on a substrate inside the open space of a precursor crown filled with the hardenable material; embedding the one or more components on a substrate inside the open space by hardening the hardenable material

BRIEF DESCRIPTION OF THE DRAWINGS

Additional features and advantages of the invention will be apparent from the detailed description which follows, taken in conjunction with the accompanying drawings, which together illustrate, by way of example, features of the invention; and, wherein:

FIG. la is an illustration of dental stone model representing the patient's overall teeth including the prepared tooth.

FIG. lb is side view of sectioned dental stone model representing the patient's overall teeth including the prepared tooth with a dental restoration, namely a crown, with an electronic component integrated inside an open space in accordance with an embodiment of the present invention.

FIG. 2a is a side view of the dental restoration, namely a crown, with the electronic component integrated inside the open space in accordance with an embodiment of the present invention.

FIG. 2b is a side view of the patient's mouth including the prepared tooth with the dental restoration, namely a crown, with the electronic component integrated inside the open space in accordance with an embodiment of the present invention.

FIG. 2c is a side view of a dental implant with an implant abutment and receiving a dental prosthesis or restoration thereon, namely a crown, in accordance with the invention; FIG. 2d is an exploded side view of the dental implant with the implant abutment receiving the dental prosthesis or restoration thereon of Fig. 2c;

FIG. 3 is an exploded side or buccal view of a precursor restoration, namely a precursor crown, with a dental die.

FIGs. 4a and 4b are top and bottom views, respectively, of the precursor restoration in accordance with an embodiment of the invention.

FIG. 5 is a cross-sectional side view of the dental restoration, namely a crown, with the electronic component integrated inside the open space, and with the electronic component integrated inside the open space and embedded in a hardened material, in accordance with an embodiment of the invention.

FIG. 6 is a cross-sectional side view of the dental restoration, namely a crown, with the electronic component integrated inside the open space, and with the electronic component integrated inside the open space and embedded in a hardened material, in accordance with an embodiment of the invention.

FIGs. 7a and 7b are cross-sectional schematic views of processes or method for filling the open space with hardenable material, positioning the electronic component inside the open space of a precursor restoration or crown, and embedding the electronic component by hardening the hardenable material.

FIG. 8 depicts a flow chart of a method for making a dental restoration in accordance with an example.

FIGs. 9, 10 and 1 1 depict exemplary flow charts of methods of manufacturing a dental restoration having a chip or electronic component integrated into a substrate in accordance with aspects described herein.

FIG. 12 is a schematic view of the electronic component in accordance with an embodiment of the present invention.

FIG. 13 is a schematic view of the dental restoration, namely a crown, in the patient's mouth, and communicating with a toothbrush and/or computing device, in accordance with an embodiment of the invention.

Reference will now be made to the exemplary embodiments illustrated, and specific language will be used herein to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended. DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Definitions

The term "component" is used herein broadly to refer to a chip, an integrated circuit, a sensor, a battery, an antenna, a transceiver, a digital memory, a biosensor, a chemical receptor on a substrate, or combinations thereof. Some components, such as the sensor or the digital memory, can be chips or integrated circuits. In one aspect, a portion of the component can be exposed, or can have an exposed portion, such as electrical contacts, sensor face, etc. In one aspect, the electronic component can be capable of communicating with a communications network, a computing device, or both. In one aspect, the component can comprise an electronic component. In another aspect, the component can comprise a chemical receptor on a substrate.

Direct restoration: a restoration made directly in the patient's mouth by the dentist, not by a dental technician outside of the mouth.

Indirect restoration: a restoration made outside of the patients mouth, usually in the dental laboratory.

Crown: an indirect dental restoration with mesial side, buccal, distal side, lingual and occlusal walls connected to form a concavity therein, and the concavity contacting a prepared tooth cut by a dentist, or an implant abutment. Inlays and onlays are not dental crowns since they do not have all five cap walls consisting of mesial side, buccal, distal side, lingual and occlusal walls. A bridge is a multiple tooth dental crown. The filling of material onto the human tooth (a "filling") is done directly inside the patient's mouth and is not a dental crown. The term crown is used herein to include bridge for simplicity of discussion. In addition, the terms dental prosthesis, dental restoration, final restoration, restoration crown, restoration bridge, crown and bridge are used interchangeably herein.

Precursor crown: refers to a crown made of a first material having an open space or pocket not filled with a second material, or a caries inhibiting material with caries inhibiting capabilities. A precursor crown becomes a final crown after it receives a second material or caries inhibiting material in the pockets or open spaces. A crown can be a precursor crown if it has not received a second material or caries inhibiting material. The terms precursor crown, precursor bridge and precursor restoration are used interchangeably herein. Mesial or mesial side: Situated toward the middle of the front of the jaw along the curve of the dental arch. The direction towards the anterior midline in a dental arch, as opposed to distal or distal side, which refers to the direction towards the last tooth in each quadrant. Each tooth can be described as having a mesial surface and, for posterior teeth, a mesiobuccal (MB) and a mesiolingual (ML) corner or cusp. Both mesiobuccal and mesiolingual are regarded as a part of the mesial area of a crown throughout the application of this invention.

Distal or distal side: Situated farthest from the middle and front of the jaw towards the throat. The opposite side of mesial side. The direction towards the last tooth in each quadrant of a dental arch, as opposed to mesial or mesial side, which refers to the direction towards the anterior midline. Each tooth can be described as having a distal surface and, for posterior teeth, a distobuccal (DB) and a distolingual (DL) corner or cusp. Both distobuccal and distolingual are regarded as a part of the distal area of a crown throughout the application of this invention.

Lingual side: a side of a crown the tongue touches in the closed bite position. The side of a tooth adjacent to (or the direction towards) the tongue, as opposed to buccal, labial, or facial which refer to the side of a tooth adjacent to (or the direction towards) the inside of the cheek or lips, respectively.

Buccal side: a side of a crown the cheek touches in the closed bite position. The opposite side of the lingual side. The side of a tooth that is adjacent to (or the direction towards) the inside of the cheek, as opposed to lingual or palatal, which refer to the side of a tooth adjacent to (or the direction towards) the tongue or palate, respectively. Although technically referring only to posterior teeth (where the cheeks are present instead of lips, use of this term may extend to all teeth, anterior and posterior), this term may be employed to describe the facial surface of (or directions in relation to) anterior teeth as well.

Labial: The side of a tooth that is adjacent to (or the direction towards) the inside of the lip, as opposed to lingual or palatal, which refer to the side of a tooth adjacent to (or the direction towards) the tongue or palate, respectively. Although technically referring only to anterior teeth (where the lips are present instead of cheeks), use of this term may extend to all teeth, anterior and posterior. Occlusal side: top surface of a crown. The surface of a crown that opposes the opposing arch. The occlusal wall of a crown contacts the other occlusal surface of the tooth of the opposing arch in closed bite position.

Open space: A 3 -dimensional and substantial pit, pocket, concavity, hole, undercut, dent, recessed area that can be on or around at least one of the mesial and/or distal areas of the crown, creating an incomplete mesial and/or distal contour, but at the same time creating the same or substantially the same or proportionately the same buccal contour when compared to the finished final crown. The open space can be a pocket formed as an indentation into the restoration or crown. The pocket or open space can be concave. In addition, the pocket or open space can have an undercut with a larger interior and a smaller opening thereto. The open space can be a hole extending through a wall of the restoration or crown from an exterior surface to a concavity therein that receives a prepared or cut tooth, or an implant abutment. The open space can extend into the otherwise occurring surface of the restoration or crown. A small open space can also be made on either the buccal area or lingual area or both.

Open space perimeter: when viewed from either the mesial or distal side of a crown, the perimeter of the open space of a crown means a circumferential and generally closed path around the open space. The open space perimeter can be wholly or entirely on or around the mesial and/or distal side wall.

Margin line: the "margin" 17 of a cut tooth 2b, model 2a or segmented die 4 or an implant abutment 2c (on implant 2d) is a line created after the tooth preparation, or manufactured on the implant abutment. The margin line of a cut tooth can exist either slightly over (supra-gingival), or along, or slightly below (sub-gingival) the gum line. The prosthetic (crown or bridge) margin line 18 is a line corresponding to the margin 17 line of a cut tooth. The margin line can extend circumferentially around the cut tooth, implant abutment and prosthetic.

Preparation, prep, cut(ting), grind(ing) of a tooth can be interchangeably used to mean grind away at least a portion of a tooth to make a restoration.

Hardenable, cureable, polymerization and related terms refer to a paste-like or liquid- like material being able to harden and form a solid. The term "monomer" refers to a liquid that can be hardened to form a polymer. The term "transceiver" is used herein to refer to a transmitter for transmitting a signal, a receiver for receiving a signal, or both a transmitter and a receiver. The transceiver can both send and receive, or can include a transmitter for transmitting a signal, and a receiver for receiving a signal.

As used herein, "a" or "an" means "at least one" or "one or more" unless otherwise indicated.

Description

Various aspects are now described with reference to the drawings, wherein like reference numerals are used to refer to like elements throughout. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a more thorough understanding of one or more aspects. It is evident, however, that such aspects can be practiced without these specific details. In other instances, structures and devices are shown in block diagram form in order to facilitate describing one or more aspects.

As illustrated in FIGs. 1- 13, a dental restoration 5 and method for making a dental restoration in an example implementation in accordance with the invention is shown. The dental restoration can be a crown or a bridge. The dental restoration receives and matches a prepared tooth 2b or an implant abutment 2c. The dental restoration 5 (e.g. a crown or a bridge) can carry a component 101, such as an electronic component and/or a chemical receptor on a substrate 102 (e.g. a chip, an integrated circuit, a sensor, a battery, an antenna, a transceiver, a digital memory, a biosensor, or combinations thereof). The dental restoration can position the component in the patient's mouth. The component can be used to monitor, sense, detect and/or report bacteria. In one aspect, the dental restoration can have one or more open space 9 and 10 in an exterior (or first restorative material) thereof, and with a second hardenable material disposed therein in which the component 101 is encapsulated.

In one aspect, the prepared tooth can be cut by the dentist using a burr of a cutting tool to create a geometry to receive the dental restoration. In one aspect, the dentist can cut the tooth to define the prepared tooth, and make an impression or scan of the prepared tooth (and adjacent teeth) upon which the dental restoration can be prepared by the dental lab. Thus, the dental restoration is created subsequent to the tooth being cut or prepared. In another aspect, the dentist can make an impression or scan of the tooth (and adjacent teeth), upon which the dental restoration and a cutting guide can be prepared by the dental lab. Thus, the dental restoration can be created prior to the tooth being cut or prepared. In another aspect, the implant abutment can replace the tooth and present a similar geometry as the cut tooth for receiving the dental restoration.

The dental restoration 5 can be formed of a first restorative material. In one aspect, the first restorative material can be inert, and can have a higher flexural strength or a higher temperature tolerance (than the second hardenable material). In one aspect, the first restorative material can comprise at least one of: dental porcelain, zirconia, glass ceramic, composite material, ceramic-composite hybrid material, resin composite, metal, CAD CAM restorative material, CAD CAM dental blocks; or combinations thereof. The dental restoration can be milled from a block of the first restorative material. A precursor restoration 5' can be created, and can be formed, and heat treated or heat hardened, to form the final dental restoration 5. In one aspect, the dental restoration 5 can be mostly formed of the first restorative material, such that the first restoration material forms greater than 80% of the restoration in one aspect, greater than 90% of the restoration in another aspect, and greater than 95% of the restoration in another aspect. The dental restoration can be solid, except for the concavity, and solid and formed of the first restoration material between the open space(s) and the concavity. In another aspect, the precursor restoration 5' can be entirely formed of the first restorative material, and can be solid except for the open space(s), and the concavity.

The dental restoration 5 (and precursor restoration 5') can have a restoration margin line 18 corresponding with a margin line 17 of the prepared tooth 2b or implant abutment. In addition, the dental restoration (and precursor restoration) can have occlusal 15, mesial side 1 1, buccal 14, distal side 12, and lingual 13 walls, with the buccal wall configured to be adjacent a patient's cheek, and the lingual wall configured to be adjacent a patient's tongue, the occlusal wall configured to face an opposing tooth, the mesial and the distal side walls each configured to face a different adjacent tooth. In one aspect, the dental restoration 5 (and precursor restoration 5') can have a concavity 16 formed opposite the occlusal wall 15 and between the walls to receive and match the prepared tooth 2b or the implant abutment. The buccal wall 14 can be contoured to have substantially a desired final contour, the same as the final contour of the final restoration. In one aspect, the dental restoration (and precursor restoration) can have at least one open space or pocket 9 and/or 10 in an exterior of the first restorative material or restoration or precursor restoration. In one aspect, the at least one open space or pocket at least one of the mesial side wall 1 1 or the distal side wall 12 to face an adjacent tooth 8. A second hardenable material 7, different than the first material, is disposed in the at least one open space 9 and/or 10 of the restoration or precursor restoration. At least one component 101, such as an electronic component and/or a chemical receptor on a substrate 102, is disposed inside the at least one open space 9 and/or 10 of the restoration or precursor restoration, and in the second hardenable material 7. In one aspect, the second hardenable material 7 can surround an outer perimeter of the at least one component 101, such as an electronic component and/or a chemical component on a substrate 102. The electronic component can also be disposed on a substrate or integrated into the substrate. At least a portion or a surface of the component can be exposed by the second hardenable material. In another aspect, the exterior of the first restorative material, an exterior of the second hardenable material 7, and an exposed surface of the at least one component 101 can be flush.

Referring to FIG. 8, a method 120 for making the dental restoration 5 comprises forming 124 a precursor restoration 5' from the first restorative material to have occlusal, mesial side, buccal, distal side, and lingual walls. In one aspect, the precursor restoration 5' can be formed while outside of a patient's mouth. In one aspect, a margin line information of the prepared tooth or the implant abutment can be received 128. For example, a tooth can be cut by the dentist from which an impression or scan is made to obtain the margin line information that can be sent to a dental lab. As another example, margin line information of an implant abutment can be obtained. A restoration margin line 18 is created 132 in the first restorative material of the precursor restoration 5' that corresponds with the margin line 15 of the prepared tooth 2b when cut, to receive the dental restoration or the implant abutment. In one aspect, the margin line 18 of the restoration can be created to match the margin line 17 of the cut tooth or implant abutment. In another aspect, the margin line 17 of the cut tooth or implant abutment can be cut to match the margin line 18 of the restoration, such as by using a cutting guide. The buccal wall is contoured 136 to have substantially a desired final contour. At least one open space 9 and/or 10 is formed 140 in an exterior of the first restorative material of the precursor crown. In one aspect, the precursor crown, with the margin line, buccal wall and open space, can be milled from a block of first restorative material. In one aspect, the at least one open space can be formed in at least one of the mesial side wall or the distal side wall. In one aspect, a concavity 16 can be formed 144 in the first restorative material of the precursor restoration opposite the occlusal wall and between the walls to receive. The concavity 16 can be sized and shaped to match and mate with the prepared tooth 2b or the implant abutment. (Although creating 312 a margin line, forming 144 a concavity, contouring 136 the buccal wall, and forming 140 the open space are show in sequence, they can be performed in any order, or even simultaneously, as indicated by 148, such as when being milled.)

In one aspect, the precursor restoration 5' can be heat hardened 152, defining a hardened precursor restoration. For example, the first restorative material can be or can include zirconia or a zirconia green body that can be milled, and then sintered. In another aspect, the precursor restoration 5' can be formed in a first restorative material that does not require sintering.

A second hardenable material 7, different than the first restorative material, is disposed 156 in the at least one open space 9 and/or 10 of the precursor restoration. Initially, the second hardenable material can be uncured or unhardened. For example, the second hardenable material initially can be flowable, malleable, deformable and/or displaceable. In one aspect, the second hardenable material can be disposed in the at least one open space of the precursor restoration, or hardened precursor restoration, while outside of the patient's mouth. In one aspect, the second hardenable material can be disposed in the at least one open space of the hardened precursor restoration after final heat hardening.

At least one component 101, such as an electronic component and/or a chemical component on a substrate 102, is positioned 160 inside the at least one open space 9 and/or 10 of the precursor restoration, and into the second hardenable material 7. The second hardenable material 7 can deform and/or displace about the component 101. In one aspect, the at least one component can be positioned in the second hardenable material while outside of the patient's mouth. The second hardenable material 7 is cured or hardened 164, defining a final restoration 5. In one aspect, the second hardenable material can be cured or hardened while outside the patient's mouth. Thus, the entire restoration can be formed outside of the patient's mouth. In one aspect, the final restoration 5 can be seated and secured 168 on the prepared tooth 2b or the implant abutment inside the patient's mouth.

In one aspect, the at least one component 101 (on the substrate 102) can be positioned in the second hardenable material 7 with the second hardenable material surrounding an outer perimeter of the at least one component (on the substrate). In another aspect, the at least one component 101 (on the substrate 102) can be positioned in the second hardenable material 7 with the exterior of the first restorative material, an exterior of the second hardenable material 7, and an exposed surface of the at least one component 101 being flush. In another aspect, the component can be positioned so that at least a portion or a surface of the component is exposed by the second hardenable material. Thus, saliva in the user's mouth can contact the component, such as an electronic sensor or a biosensor with a chemical receptor on a substrate.

In another aspect, the method can further include integrating 172 the at least one component 101 into the substrate 102 prior to positioning the at least one component on the substrate in the second hardenable material 7. In one aspect, an electronic component can be disposed on and integrated into the substrate. In another aspect, a chemical receptor can be disposed on or integrated into the substrate.

Functionality of active dental crowns, cost and performance efficiency of devices on the dental crowns can be importance. To facilitate functionality while maintaining low cost and superior performance, chips (or, integrated circuits) can be included in the dental crowns.

Chips are electronic circuits typically fabricated by lithography or patterned diffusion of trace elements into a substrate of semiconductor material.

Semiconductor device fabrication is a multi-step process used to create chips.

Fabrication can include lithographic and chemical processing (e.g., etching) during which electronic circuits are created on a wafer/substrate of semiconducting material. Silicon is typically employed for substrates, although other materials can be used for more specialized applications.

In typical device fabrication, chips are built on top of a single substrate. The substrate is generally formed of mono-crystalline cylindrical ingots up to 300 millimeters (mm) in diameter. These ingots are sliced into wafers about 0.75 mm thick and polished to obtain a regular and flat surface.

To produce a chip, deposition, removal, patterning and/or modification of electrical properties are usually involved. A first step, deposition, is a process by which material is grown, applied and/or otherwise provided on the substrate. Chemical vapor deposition, physical vapor deposition, electrochemical deposition, molecular beam epitaxy and/or atomic layer deposition can be employed for the deposition process. Next, the removal process involves removing material from the substrate via wet etching or dry etching processes and/or via chemical mechanical planarization. Next, the patterning process involves shaping or altering the existing shape of the materials deposited on the substrate. For example, lithography can be employed for patterning. In conventional lithography, the substrate can be coated with a photo resist. Selected portions of the substrate can then be exposed to short wavelength light to wash away the exposed portions. The photo resist is then removed via plasma ashing. Finally, modification of electrical properties includes doping processes (e.g., transistor sources and/or drains) and activating the implanted dopants.

Substrates are typically reduced in thickness before the substrate/wafer is scored and broken into individual die. Numerous types of materials can be employed for substrates. Thermoplastics are polymers that become moldable above a particular temperature and return to a solid state upon cooling. Most thermoplastics have a high molecular weight with chains that associate through intermolecular forces. As such, thermoplastics can be remolded.

A thermoplastic changes without an associated phase change at temperatures above its glass transition temperature and below its melting point. Within this temperature range, thermoplastics are typically rubbery due to alternating rigid crystalline and elastic amorphous regions. Common thermoplastics include, but are not limited to, Polytetrafluoroethylene (PTFE) (also referred to as TEFLON®) and Polyethylene terephthalate (PET).

Wire bonding is a method of welding a wire between a chip and mechanical carrier using heat, pressure and ultrasonic energy. In some cases, wire bonding is employed for making interconnections between a chip and a printed circuit board. Bond wires are typically aluminum, gold or copper, with copper being the preferred wire material because the wire diameter for copper can be smaller than that for gold and yet the performance for the copper wires is the same or similar to the performance for gold wires. Further, copper is preferred over aluminum in cases in which high current capacity is needed or in cases of complex system geometries.

The wire bonding can be used to attach a chip to a mechanical carrier. The wires lead to pins on the outside of the mechanical carriers, which can be attached to other circuitry in the overall system in which the chip is located.

Near the chip edges, the chips are typically individually patterned with metal pads that provide connections to the mechanical carriers. While it is advantageous to include chips in dental crowns, the chip is typically attached to the top of the surface of the substrate. The metal pad, then can lend additional height as the metal pad can be placed on top of the chip. The final product is a thick stack that includes the substrate, metal pad and chip.

As such, in aspects described herein, a dental crown is fabricated having a chip integrated into a substrate to reduce size of the stack. In some aspects, surfaces of the chip and substrate are continuous without gaps and height of the chip-substrate combination is advantageously reduced (relative to aspects wherein the chip is fabricated on the substrate and the metal pads also contribute further height to the stack). The chip-substrate combination can have a maximum height equal to height of the chip and the one or more connection pads on the chip in various aspects. These aspects advantageously reduce height of the stack and minimize area of the chip-substrate combination in the dental crown.

In one aspect, a method of making dental crown includes: making a precursor crown with open space (e.g. on or around at least one of the mesial and distal area); filling the open space with hardenable material; positioning one or more components on a substrate inside the open space of a precursor crown filled with the hardenable material; embedding the one or more components on a substrate inside the open space by hardening the hardenable material. In another aspect, a method of making dental crown includes: integrating a component into a polymer substrate; encapsulating the component integrated into the substrate into a first dental restorative material, wherein the encapsulating is performed after the integrating.

In another aspect, a method of making dental crown includes: positioning one or more components in predefined locations on substrate, wherein the one or more components are adapted to be embedded in an open space in the first material; providing a hardenable second material inside the open space of a precursor crown; applying pressure on the one or more components to dispose inside the open space; embedding the one or more components on a substrate inside the open space by hardening the hardenable material.

The aspects will now be described in greater detail with reference to the FIGS, la- 7b. FIGS, la-6 show exemplary non- limiting dental crown having a chip integrated into a dental crown in accordance with aspects described herein. Dental crown 5 can include a chip- substrate combination 101 encapsulated in polymer 102. The chip-substrate combination 101 can be a chip integrated into a substrate in some aspects. In various aspects, the chip can be configured to facilitate communication between the dental crown 5 and devices external to the dental crown 5 and/or to process information associated with outputs from one or more sensors (not shown) that can be provided on the dental crown 5. As used herein, the term "integrated" can mean the chip is embedded in the substrate such that the chip and substrate surfaces are continuous with no gaps.

While the aspects herein describe and illustrate a chip embedded in a substrate, in other aspects, any suitable other types of components can be embedded in the substrate by substituting the component for the chip. For example, sensors can be embedded in substrates employing the methods described herein.

FIG. 5 is a cut view of an exemplary non- limiting chip 101 positioned inside a polymerizable composite 7 in accordance with aspects described herein. As shown, the chip 10 lean be disposed on the composite 7. Downward pressure can be applied onto the chip 101. In some aspects, the pressure can be applied to lock the chip 101 into place in the open space 9, 10 corresponding to the locations of chips 101.

As shown, the composite 7 can surround the chip 101. Because the chip 101 is completely embedded into the composite 7, in various aspects, as shown, the chip 101 can be unable to be seen from a buccal view of the dental crown 5.

The chip 101 can be integrated into and/or embedded within the polymerizable composite 7 such that the surface from the chip to the composite is continuous with no gaps. The composite 7 can be provided around the perimeter of the chip 101, for example, as shown.

Although not shown, in some aspects, metal can be patterned on various locations on the chip-composite combination. The metal can be or include, but is not limited to, a metal line configured to connect the chip 101 with another component, an antenna or a sensor. In other aspects, the metal can be or include an antenna or sensor (or parts thereof).

FIGS. 9, 10 and 1 1 are illustrations of exemplary flow charts of methods of manufacturing a dental crown 5 having a chip 101 integrated into a polymerizable composite in accordance with aspects described herein.

Turning first to FIG. 9, and FIG 7a and 7b, method 200 can include positioning 206 one or more components in predefined locations on a dental crown. The components can be chips in some aspects. The chips can be configured to facilitate any number of functions, including, but not limited to, communication from the dental crown or processing of information associated with outputs from one or more sensors on the dental crown. In other aspects, other types of components (e.g., sensors) can be positioned in the predefined locations on the dental crown.

The precursor crown 5' can be made 202 to include open space 9, 10 sized to receive the components and maintain the components at the predefined locations. For example, the precursor crown 5' can be as shown in FIGS, lc and Id and include open space 9, 10 corresponding to the size and shape of the components in order to hold the components in predefined locations.

The hardenable material 7 can be provided 204 such that the surfaces between the components and the dental crown 5 are continuous without gaps. In various aspects, for example, the hardenable material can be polimarizable composite. Polimarizable composite can include any suitable number of biocompatible polymers including, but not limited to, polyacrylamide, siloxane-based hydrogel and/or fluorosiloxane -based hydrogel.

As shown in FIG. 7a, hardenable material 7 can be flowed around the sides of the components such that the polymer surrounds the sides of the components. In some aspects, each of the components can be surrounded with hardenable material. For example, the chip can be surrounded on n sides when the chip is an n-sided polygon (e.g., the chip can be surrounded on three sides if the chip is triangular in shape while being surrounded on four sides if the chip is rectangular, square or quadrilateral in shape).

The method 200 can include embedding 208 the one or more components in open space by hardening the hardenable material. As such, polymerizable composite can be a substantially solid form of the hardenable material. As shown in FIG. 7b, light-curing the polymarizable material can cause the hardenable polymer to harden into a solid mass forming a hardened composite into which the component is embedded.

Although not shown, fabrication can be performed including, but not limited to, patterning metal lines and/or other components on the chip and/or substrate. The metal pads and/or lines can be patterned on the chip, for example, to provide connections between the component embedded in the hardenable material and another component. Additionally, the component and hardenable material into which the component is integrated can be provided on or within a dental crown. For example, the component and the substrate can be encapsulated in a first restorative material.

Turning now to FIG. 10, the method 300 can include integrating 302 a component into a polymer substrate. In various aspects, the component can include, but is not limited to, a chip, a sensor or any number of other different types of components typically fabricated on top of a substrate.

Step 302 of method 300 can be described in greater detail with reference to FIG. 7a. The process can include providing the component on a first surface, the first surface being pre -treated with a non-stick coating and the component having a bottom surface proximate to the first surface. The non-stick coating can include, but is not limited to, TEFLON®, PTFE or the like. In some aspects, the first surface can be a hard silicon wafer, glass or any of a number of different types of metals that are substantially flat and can withstand high temperatures (e.g., steel). The first surface can be substantially flat with a molded portion sized to snugly receive the component and maintain the component in position at a predefined location.

Turning back to FIG. 10, the method 300 can include encapsulating 304 the component integrated into the polymer substrate into a first dental restorative material, wherein the encapsulating is performed after the integrating. The resultant dental crown can then have the polymer substrate (with integrated component) embedded in the second restorative hardenable material.

While the embodiments described include coating the first surface with a non-stick coating that can withstand temperature to which hardenable polymer can rise, in some aspects, hardenable polymer is not employed. Instead, a polymer that does not require high temperatures to become liquefied and that can withstand micro-fabrication processes (e.g., solvents, temperature cycles, ultra-high vacuum) can be employed. For example, some polymers are liquid or semi-liquid at room temperature and become a solid after applying heat or light-curing or after letting the polymer sit for a duration of time (e.g., sitting 48 hours at room temperature). Polydimethylsiloxane (PDMS) and silicone elastomers are examples. PDMS is a liquid at room temperature and can be hardened with either heat or allowing PDMS to sit at room temperature for 48 hours.

For example, turning to FIG. 1 1 , the method 400 can include positioning 402 one or more components in predefined locations on polymer substrate, wherein the one or more components are adapted to be embedded in an open space in the dental crown. For example, the components can be chips or sensors in various aspects. The method 400 can include providing 404 a hardenable second material inside the open space of a precursor crown. In various aspects, the liquid material can be a silicone elastomer or PDMS.

The method 400 can include applying 406 pressure on the one or more components. In some aspects, a non-stick coating can be applied to the polymer substrate. In these aspects, the non-stick coating can be any number of different types of non-stick coatings (e.g., anodized aluminum, PTFE, TEFLON®, ceramic-titanium, Ecolon).

The method 400 can include embedding 408 the one or more components in a substrate by hardening the hardenable material or allowing the hardenable material to sit for a predefined amount of time at a predefined temperature, and causing the hardenable material to harden. For example, the hardenable material can be allowed to sit for approximately 48 hours at room temperature (e.g., 77 degrees Fahrenheit).

The electronic component 101 can be capable of communicating with a

communications network, a computing device, or both. Referring to FIG. 12, the electronic component 101 can include a sensor 504 exposed to the patient's saliva, and capable of sensing or detecting biomarkers in the patient's saliva. The sensor can sense or detect other conditions, including by way of example, temperature, pH, glucose, etc., and combinations thereof. The sensor can produce signals indicative of the biomarkers (or other conditions). In addition, the electronic component can also include a wireless transceiver 508 or wireless antenna. The wireless transceiver or antenna can transmit the signals from the sensor (or the digital memory device or queue). In one aspect, the sensor and the wireless transceiver or antenna can be internally powered. For example, the electronic component can include a battery 512 or power source electrically coupled to the sensor and the wireless transceiver or antenna. In another aspect, the sensor and the wireless transceiver or antenna can be externally powered. For example, the electronic component can include an electrical or power coil. In another aspect, the electronic component can include a digital memory device 516 that can store or queue signals from the sensor. In another aspect, the electronic component can include a processor 520. In one aspect, the processor 520 can be electrically and operatively coupled to the sensor, the power source, the wireless transceiver, and the digital memory device. In another aspect, the processor 524 can include the sensor, the wireless transceiver, and the digital memory device, and can be electrically and operatively coupled to the battery power source. The electronic component 101 and/or processor 520 or 524 can further comprise at least one non-transitory machine readable storage medium (such as the digital memory device 516 or other memory) having instructions embodied thereon for receiving or queuing signals from the sensor, and/or wirelessly transmitting queued or received signals (such as to a computer, network, etc.). The instructions, when executed by the at least one processor, can perform the following: receiving or queuing signals from the sensor, and/or wirelessly transmitting queued or received signals.

Referring to FIG. 13, the electronic component 101 carried by the dental restoration 5, such as the crown, and disposed in the patient's mouth, can sense or detect biomarkers (or other conditions), and transmit signals indicative of the biosensors to a communication network, a computing device, or both. In one aspect, the signals produced by the electronic component 101 or sensor 504 can be received by a computing device. The computing device can be a cellular phone 530 or smart phone. The cellular phone 530 can have a transceiver or antenna capable of wireless communication with the wireless transceiver or antenna of the electronic component. The cellular phone 530 can have an app (or application) or computer program capable of providing an interface with the electronic component, such as receiving, storing, and/or displaying the signals indicative of the biomarkers (or other conditions). The cellular phone 530 can include a display, an input, a battery power source, a wireless transceiver, a digital memory device, and one or more processors. In one aspect, the processor can be electrically and operatively coupled to the power source, the wireless transceiver, and the digital memory device. In another aspect, the processor can include the wireless transceiver and/or the digital memory device, and can be electrically and operatively coupled to the display, the input and the battery power source. The cellular phone and/or processor can further comprise at least one non-transitory machine readable storage medium (such as the digital memory device or other memory) having instructions embodied thereon for receiving, storing, and/or displaying the signals indicative of the biomarkers (or other conditions). The instructions, when executed by the at least one processor, perform the following: receiving, storing, and/or displaying the signals indicative of the biomarkers (or other conditions).

In another aspect, the computing device can include an intraoral implement 580 with a handle on a proximal end, and a wireless interface 584 disposed on a distal end. For example, the intraoral implement can comprise a toothbrush. The intraoral implement can be periodically inserted into the patient's mouth, such as when brushing, to interface with the electronic component 101. Similar to the cellular phone, the intraoral implement can have a transceiver or antenna capable of wireless communication with the wireless transceiver or antenna of the electronic component to receive, store, and/or re-transmit the signals indicative of the biomarkers (or other conditions). The intraoral implement can include a battery or power source, a wireless transceiver, a digital memory device, and one or more processors. In one aspect, the processor can be electrically and operatively coupled to the power source, the wireless transceiver, and the digital memory device. In another aspect, the processor can include the wireless transceiver and/or the digital memory device, and can be electrically and operatively coupled to the battery or power source. The intraoral implement and/or processor can further comprise at least one non-transitory machine readable storage medium (such as the digital memory device or other memory) having instructions embodied thereon for receiving, storing, and/or re -transmitting the signals indicative of the biomarkers (or other conditions). The instructions, when executed by the at least one processor, perform the following: receiving, storing, and/or re -transmitting the signals indicative of the biomarkers (or other conditions). The signals can be re -transmitted to the cellular phone or other computing device or network.

Various techniques, or certain aspects or portions thereof, may take the form of program code (i.e., instructions) embodied in tangible media, such as floppy diskettes, compact disc-read-only memory (CD-ROMs), hard drives, non-transitory computer readable storage medium, or any other machine-readable storage medium wherein, when the program code is loaded into and executed by a machine, such as a computer, the machine becomes an apparatus for practicing the various techniques. Circuitry can include hardware, firmware, program code, executable code, computer instructions, and/or software. A non-transitory computer readable storage medium can be a computer readable storage medium that does not include signal. In the case of program code execution on programmable computers, the computing device may include a processor, a storage medium readable by the processor (including volatile and non- volatile memory and/or storage elements), at least one input device, and at least one output device. The volatile and non-volatile memory and/or storage elements may be a random-access memory (RAM), erasable programmable read only memory (EPROM), flash drive, optical drive, magnetic hard drive, solid state drive, or other medium for storing electronic data. The node and wireless device may also include a transceiver module (i.e., transceiver), a counter module (i.e., counter), a processing module (i.e., processor), and/or a clock module (i.e., clock) or timer module (i.e., timer). One or more programs that may implement or utilize the various techniques described herein may use an application programming interface (API), reusable controls, and the like. Such programs may be implemented in a high level procedural or object oriented programming language to communicate with a computer system. However, the program(s) may be implemented in assembly or machine language, if desired. In any case, the language may be a compiled or interpreted language, and combined with hardware implementations.

As used herein, the term processor can include general purpose processors, specialized processors such as VLSI, FPGAs, or other types of specialized processors, as well as base band processors used in transceivers to send, receive, and process wireless or wired communications .

While the forgoing examples are illustrative of the principles of the present invention in one or more particular applications, it will be apparent to those of ordinary skill in the art that numerous modifications in form, usage and details of implementation can be made without the exercise of inventive faculty, and without departing from the principles and concepts of the invention. Accordingly, it is not intended that the invention be limited, except as by the claims set forth below.

What is claimed is:

Claims

1. A method for making a dental restoration configured to receive and match a prepared tooth or an implant abutment, the method comprising:

c) contouring the buccal wall to have substantially a desired final contour; d) forming at least one open space in an exterior of the first restorative material;

e) disposing a second hardenable material, different than the first restorative material, in the at least one open space of the precursor restoration;

f) positioning at least one component, comprising an electronic component and/or a chemical component on a substrate, inside the at least one open space of the precursor restoration and into the second hardenable material; and

g) curing or hardening the second hardenable material while outside the patient's mouth, defining a final restoration.

2. The method in accordance with claim 1 , wherein positioning the at least one component further comprises:

positioning the at least one component in the second hardenable material with the second hardenable material surrounding an outer perimeter of the at least one component.

3. The method in accordance with claim 1 , wherein positioning the at least one component further comprises: positioning the at least one component in the second hardenable material with the exterior of the first restorative material, an exterior of the second hardenable material, and an exposed surface of the at least one component are flush.

4. The method in accordance with claim 1, further comprising:

forming a concavity in the first restorative material opposite the occlusal wall and between the walls to receive and match the prepared tooth or the implant abutment.

5. The method in accordance with claim 1, further comprising:

heat hardening the precursor restoration defining a hardened precursor restoration;

disposing the second hardenable material in the at least one open space of the hardened precursor restoration after final heat hardening.

6. The method in accordance with claim 1, wherein forming the at least one open space further comprises:

forming at least one open space in an exterior of at least one of the mesial side wall or the distal side wall.

7. The method in accordance with claim 1, wherein the at least one component comprises at least one of: a chip, an integrated circuit, a sensor, a battery, an antenna, a transceiver, a digital memory, or a chemical receptor on a substrate, or combinations thereof.

8. The method in accordance with claim 1, wherein the at least one component is capable of communicating with a communications network, a computing device, or both.

9. The method in accordance with claim 1, further comprising:

seating and securing the final restoration on the prepared tooth or the implant abutment inside the patient's mouth.

10. The method in accordance with claim 1, further comprising: integrating the at least one component into a substrate prior to positioning the at least one component on the substrate in the second hardenable material.

11. The method in accordance with claim 1, further comprising:

receiving a margin line information of the prepared tooth or the implant abutment.

12. A dental restoration device configured to receive and match a prepared tooth or an implant abutment, the device comprising:

a) a dental restoration formed of a first restorative material and having a restoration margin line corresponding with a margin line of the prepared tooth when cut, to receive the dental restoration or the implant abutment, and having occlusal, mesial side, buccal, distal side, and lingual walls, with the buccal wall configured to be adjacent a patient's cheek, and the lingual wall configured to be adjacent a patient's tongue, the occlusal wall configured to face an opposing tooth, the mesial and the distal side walls each configured to face a different adjacent tooth;

b) at least one open space in an exterior of the first restorative material;

c) a second material, different than the first restorative material, in the at least one open space; and

d) at least one component, comprising an electronic component and/or a chemical component on a substrate inside the at least one open space and in the second material.

13. The device in accordance with claim 12, wherein the at least one component comprises at least one of: a chip, an integrated circuit, a sensor, a battery, an antenna, a transceiver, a digital memory, or a chemical receptor on a substrate, or combinations thereof.

14. The device in accordance with claim 12, wherein the at least one component is capable of communicating with a communications network, a computing device, or both.