WO2015172841A1 - Antenne multicouche plane - Google Patents

Antenne multicouche plane Download PDF

Info

Publication number
WO2015172841A1
WO2015172841A1 PCT/EP2014/060071 EP2014060071W WO2015172841A1 WO 2015172841 A1 WO2015172841 A1 WO 2015172841A1 EP 2014060071 W EP2014060071 W EP 2014060071W WO 2015172841 A1 WO2015172841 A1 WO 2015172841A1
Authority
WO
WIPO (PCT)
Prior art keywords
pcb layer
antenna
power distribution
radiation
pcb
Prior art date
Application number
PCT/EP2014/060071
Other languages
English (en)
Inventor
Haiguang Chen
Linyuan ZANG
Per-Simon Kildal
Seyed Ali RAZAVI
Liangliang XIANG
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to PCT/EP2014/060071 priority Critical patent/WO2015172841A1/fr
Publication of WO2015172841A1 publication Critical patent/WO2015172841A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0075—Stripline fed arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array

Definitions

  • Implementations described herein relate generally to an antenna.
  • a planar multilayer antenna which may be included in a User Equipment (UE) transceiver or a point-to-point microwave transceiver.
  • UE User Equipment
  • a User Equipment also known as a mobile station, wire- less terminal and/or mobile terminal is enabled to communicate wirelessly in a wireless communication network, sometimes also referred to as a cellular radio system.
  • the communication may be made, e.g., between UEs, between a UE and a wire connected telephone and/or between a UE and a server via a Radio Access Network (RAN) and possibly one or more core networks.
  • RAN Radio Access Network
  • the wireless communication may comprise various communication services such as voice, messaging, packet data, video, broad ⁇ cast, etc.
  • the UE may further be referred to as mobile telephone, cell- ular telephone, computer tablet or laptop with wireless capa ⁇ bility, etc.
  • the UE in the present context may be, for
  • portable, pocket-storable, hand-held, computer-compr ⁇ ised, or vehicle-mounted mobile devices enabled to communi ⁇ cate voice and/or data, via the radio access network, with another entity, such as another UE or a server.
  • the UE is equipped with an antenna. Due to the overall demand for minimizing the size of the UEs, and due to the current design preferences, flat antennas are widely used today.
  • wireless transmission can be used instead of cable transmission, e.g. for situations when cable connections are not possible.
  • the radio network nodes are often connected to each other by optical fibre cables in order to exchange data within the network. If it is impossible, or expensive, to achieve a cable connection between the radio network nodes, a point-to- point microwave transmission link could be an attractive alternative to the cable connection.
  • the transceivers of the point-to-point microwave system is also equipped with an antenna.
  • the antenna can e.g. be located in an outdoor unit (ODU) , or can be located in an antenna module separate from the ODU.
  • the components of the transceivers may be implemented in indoor and/or outdoor units in the system.
  • the corporate power distribution network is a branched network of strip lines and power dividers that feed each radiating element of the arrays of radiating
  • the conventional microstrip antenna technology used for the corporate power distribution network is generally realized on printed circuit board (PCB) , and the PCB manufacture technology is well suited for mass production of compact lightweight microstrip antenna arrays being fed by such a corporate power distribution network, in particular since the components of the corporate power distribution network, i.e. the microstrip power dividers and connecting
  • microstrip/transmission lines can be miniaturized to fit on one PCB layer together with the microstrip antenna elements.
  • microstrip/transmission lines cannot be used, because they require relatively thick substrates, which is of course not desirable due to the demand for small-sized antennas. Also, when thick substrates are used, the microstrip power distribution network starts to radiate, and surface waves starts to propagate along the power distribution
  • the substrate thickness used is dependent on, and related to, the frequency of the signal to be transmitted by the antenna. If the thickness is increased such that the substrate is much thicker than needed for the transmitted frequency, the
  • microstrip/transmission lines of the power distribution network start working like antennas, thereby causing the unwanted radiation.
  • the coplanar waveguide is an alternative PCB-based
  • SIW substrate-integrated waveguide
  • post- wall waveguide post- wall waveguide
  • laminated waveguide substrate-integrated waveguide
  • Normal hollow rectangular waveguides can be used to realize a corporate distribution network. However, at such high
  • the hollow rectangular waveguides of the distribution network are formed by rectangular grooves of half height in each metal block, and that the hollow rectangular waveguides are formed when the two blocks are joined together with good precision in such a way that there are good
  • Such gap waveguides are formed between parallel metal plates or metallised plates.
  • propagation in the waveguide is controlled by means a texture in one or more of the plates. Propagation of waves between the parallel plates are prohibited in directions where the plate texture is periodic or quasi-periodic. This prohibition happens over a certain frequency band, which is defined as a stopband. In addition, controlled propagation of waves are enabled in directions where the texture is smooth, over the same certain frequency band.
  • the periodicity and smoothness of the texture is here related to the frequency of the
  • the texture of a plate can be made
  • the texture including the patches and via-holes can commonly be referred to, and will in this document be referred to, as a periodic mushroom surface.
  • the texture of a plate can be made smooth by usage of grooves, ridges and/or metal strips oriented in the direction of the intended propagation of the wave. The usage of these grooves, ridges and metal strips forms gap waveguides of three different types: groove gap waveguides, ridge gap waveguides, and microstrip gap waveguides, respectively, all according to PCT/EP2009/057743.
  • a suspended microstrip gap waveguide has also been presented.
  • the suspended microstrip gap waveguide includes metal
  • microstrip/transmission lines that are etched on
  • Transverse Electromagnetic Mode wave-mode of the waveguide is here formed in an air gap between the metal strip and the upper smooth metal plate, thereby resulting in a suspended microstrip gap waveguide.
  • This suspended microstrip gap waveguide can be made to have low dielectric and conductive losses .
  • the suspended microstrip gap waveguide is not easily compatible with normal PCB technology.
  • the periodic or quasi- periodic, texture metal pin surface could instead be realized by the above described mushrooms on a PCB.
  • this PCB then becomes one of two PCB layers needed to realize the microstrip power distribution network, i.e. increasing the number of PCB layers.
  • the use of two PCB layers has the disadvantage of adding to the size of the antenna. Also, there are a number of other problems with this technology. It is for example practically impossible to find a good wideband
  • connection from the conventional microstrip lines or waveguides to the suspended microstrip lines from underneath the suspended microstrip gap waveguide Therefore, other more space consuming connection solutions must be used.
  • microstrip gap waveguide with a stopband-texture made of mushrooms has also been realized on a single PCB .
  • This PCB- type gap waveguide is called a microstrip ridge gap waveguide, because the metal strip must have via-holes in the same way as the mushrooms, and because the via holes will make the metal strips work in the same way as a solid ridge waveguide.
  • the microstrip ridge gap waveguide has been demonstrated to work and to have low loss, but it is not yet known how to combine power distribution networks and an entire antenna system utilizing the microstrip ridge gap waveguide
  • the SIW technology is known as a PCB- based technology that has low conductive losses, but instead it has significant dielectric losses. These dielectric losses are caused by propagation inside the PCB dielectric material for the SIW technology. To reduce these dielectric losses by use of low loss dielectric materials is very expensive, due to the high prices for such dielectric materials, and is
  • planar antenna according to the characterizing portion of claim 1.
  • PCB Printed Circuit Board
  • a spacing layer arranged between said radiation PCB layer and said power distribution PCB layer, and including at least one spacer, wherein said at least one spacer has a thickness Tracer, is attached to said power distribution PCB layer, and is directly or indirectly attached to said radiation PCB layer, thereby creating an air gap adjoining said power distribution PCB layer and having an equal thickness T space r over said air gap, whereby at least one gap waveguide is provided in said air gap.
  • a general concept according to embodiments of the invention is to replace the commonly used microstrip technology, coplanar waveguides, and normal rectangular waveguides in high
  • the radiation PCB layer, the spacing layer and the power distribution PCB layer are arranged such that a fixed distance between the radiation PCB layer and the power distribution layer is securely
  • This arrangement of the layers of the antenna also provides for an air gap within the antenna, in which the gap waveguide is formed. Hereby, very low losses are achieved since the wave propagation takes place in the air of the air gap. At these high frequencies, air has similar properties as vacuum, and thus causes very little dielectric losses in the antenna.
  • the spacing layer of the antenna includes a first supporting plate being parallel to said radiation PCB layer and to said power distribution PCB layer, and being attached to said radiation PCB layer.
  • the spacing layer further includes said at least one spacer being attached indirectly to said radiation PCB layer by being attached to said first supporting plate, thereby forming said air gap of equal thickness T spacer between said first supporting plate and said power distribution PCB layer.
  • the one or more spacers provide an accurate height of the air gap, as well as low tolerance of the height of the air gap, which is very
  • the first supporting plate has several holes of nearly- rectangular cross-section, working as rectangular waveguide connections between each of the radiating elements of the radiation PCB layer and each of the ends of the power
  • the hereby created mechanically stable antenna is also easy and low cost to mass produce.
  • said at least one gap waveguide is formed by a surface texture of at least one of said first supporting plate and said power distribution PCB layer, and by said equal thickness air gap.
  • said at least one spacer is formed as a pin, is made of metal, is made of a metallised plastic material, has a round cross section, has a triangular cross section, has a rectangular cross section and/or has an
  • configurations for the one or more spacers provide respective production and/or assembly advantages.
  • said spacing layer includes said at least one spacer made of an adhesive, whereby said
  • This embodiment results in a very efficient and cost effective assembly process, since no screws or other fastening means need to be used.
  • the antenna is also mechanically stable.
  • the antenna according to the embodiment is also mechanically stabile, and can be made very small in size and at low cost, since the first supporting plate is omitted.
  • said least one gap waveguide is formed by a surface texture of at least one of said radiation PCB layer and said power distribution PCB layer, and by said equal thickness air gap.
  • the antenna has low dielectric losses.
  • said air gap has a thickness T space being less than 2 mm, and preferably less than 1 mm.
  • a very small-sized antenna is hereby achieved.
  • said antenna includes a second supporting plate made of metal or metallised plastic, said second supporting plate being attached to said power
  • the second supporting plate adds to the stability of the antenna.
  • the second supporting plate can be seen as a foundation for the antenna.
  • the rigid second support plate contributes to the mechanical stability of the antenna.
  • said power distribution PCB layer includes at least two arrays of via holes being positioned alongside and/or in at least one transmission line of said power distribution PCB layer.
  • the configuration of the transmission/strip lines and the via holes contributes to low insertion losses and low return losses for the antenna.
  • said at least one gap waveguide is formed within said air gap by a surface texture on said power distribution PCB layer facing said air gap.
  • said at least one gap waveguide is formed within said air gap by a surface texture on a surface of said radiation PCB layer facing said air gap.
  • the waveguide is formed between said parallel power distribution PCB layer and PCB radiation PCB layer.
  • the gap waveguide is a kind of transmission line.
  • a distance D v i a between any two neighbouring via holes is smaller than 2 mm.
  • To arrange the via holes closely together provides low insertion losses and low return losses for the antenna.
  • said antenna is a multilayer planar antenna, said layers being attached to each other by use of soldering and/or adhesives. Soldering and use of
  • a transceiver comprising an
  • Figure la is a block diagram illustrating a wireless communica ⁇ tion network according to some embodiments.
  • Figure lb is a block diagram illustrating a point-to-point microwave system according to some embodiments.
  • Figures 2a-b are block diagrams illustrating a User Equipment and transceivers, respectively, according to some embodiments .
  • Figures 3a-b show schematic side views of antennas according to some embodiments.
  • Figure 4 is a schematic top view of a radiating PCB according to an embodiment.
  • Figure 5 is a schematic top view of a first supporting plate according to an embodiment.
  • Figure 6a-b show a schematic top view and a front view, respectively, of spacers and a power distribution network PCB according to an embodiment.
  • Figure 7 is a schematic top view of a second supporting plate according to an embodiment.
  • FIG. la is a schematic illustration over a wireless communi ⁇ cation network 100 comprising a radio network node 110 and a User Equipment (UE) 120.
  • the wireless communication network 100 may at least partly be based on radio access technologies such as, e.g., 3GPP LTE, LTE-Advanced, Evolved Universal Terrestrial Radio Access Net ⁇ work (E-UTRAN) , Universal Mobile Telecommunications System (UMTS) , Global System for Mobile Communications (originally: Groupe Special Mobile) (GSM)/ Enhanced Data rate for GSM Evo ⁇ lution (GSM/EDGE) , Wideband Code Division Multiple Access (WCDMA) , Time Division Multiple Access (TDMA) networks, Frequ ⁇ ency Division Multiple Access (FDMA) networks, Orthogonal FDMA (OFDMA) networks, Single-Carrier FDMA (SC-FDMA) networks, Worldwide Interoperability for Microwave Access (WiMax) , or Ultra Mobile Broadband (UMB) , High Speed Packet
  • wireless communication network and “wireless communication system” may within the technological context of this disclosure sometimes be utilised interchange ⁇ ably.
  • the purpose of the illustration in Figure la is to provide a simplified, general overview of the wireless communication network 100 and the involved methods and nodes, such as the radio network node 110 and UE 120.
  • the illustrated wireless communication network 100 comprises the radio network node 110, which may send radio signals to be received by the UE 120.
  • the UE 120 may also send radio signals to be received by the radio network node 110.
  • the wireless communication network 100 may comprise any other number and/ or combination of radio network nodes 110 and/ or UEs 120.
  • the radio network node 110 may according to some embodiments be configured for downlink transmission and may be referred to, respectively, as e.g., a base station, NodeB, evolved Node Bs (eNB, or eNode B) , base transceiver station, Access Point Base Station, base station router, Radio Base Station (RBS), micro base station, pico base station, femto base station, Home eNodeB, sensor, beacon device, relay node, repeater or any other network node configured for communication with the UE 120 over a wireless interface, depending, e.g., of the radio access technology and/ or terminology used.
  • a base station NodeB, evolved Node Bs (eNB, or eNode B)
  • base transceiver station e.g., Access Point Base Station, base station router, Radio Base Station (RBS), micro base station, pico base station, femto base station, Home eNodeB, sensor, beacon device, relay node, repeater or any other network no
  • the UE 120 may correspondingly be represented by, e.g. a wire ⁇ less communication terminal, a mobile cellular phone, a Per- sonal Digital Assistant (PDA) , a wireless platform, a mobile station, a tablet computer, a portable communication device, a laptop, a computer, a wireless terminal acting as a relay, a relay node, a mobile relay, a Customer Premises Equipment (CPE) , a Fixed Wireless Access (FWA) nodes or any other kind of device configured to communicate wirelessly with the radio network node 110, according to different embodiments and diff ⁇ erent vocabulary.
  • PDA Per- sonal Digital Assistant
  • CPE Customer Premises Equipment
  • FWA Fixed Wireless Access
  • Figure lb is a schematic illustration over a point-to-point microwave system 100 comprising at least two transceivers 121a, 121b (four transceivers are shown in the non-limiting example in figure lb) communicating with each other.
  • the system 100 may thus provide point-to-point communication from one transceiver 121a to one other transceiver 121b, or provide point-to-multipoint communication from one transceiver 121a to multiple transceivers 121b.
  • the purpose of the microwave communication can e.g. be to provide an alternative to cable communication between the points 121a, 121b.
  • Figure lb The purpose of the illustration in Figure lb is to provide a simplified, general overview of the wireless communication network 100 and the transceivers 121a, 121b.
  • Figure 2a is a block diagram illustrating a User Equipment 120 in a wireless communication network 100.
  • the User Equipment is configured for performing wireless communication with a radio network node 110 by usage of one or more antenna streams.
  • the User Equipment comprises, or is connected to, one or more antennas 170.
  • the one or more antennas 170 may include multiple antenna arrays comprising a multitude of antenna ele ⁇ ments, such as e.g. 100 or more antenna elements.
  • the wireless communication network 100 may be based on 3GPP LTE in some embodiments. Further, the wireless communication system 100 may be based on FDD.
  • the radio network node 110 may comprise an eNodeB according to some embodiments.
  • the User Equipment 120 comprises a receiver 161, configured for receiving wireless signals. Also, the User Equipment 120 comprises a transmitter 162, configured for transmitting signals to be received by the radio network node 110.
  • the User equipment 120 comprises a processing circuit 150, being configured for controlling e.g. the receiver and/or the transmitter.
  • the processing circuit 150 may comprise, e.g., one or more instances of a Central Processing Unit (CPU) , a processing unit, a processing circuit, a processor, an Application Specific Integrated Circuit (ASIC) , a microprocessor, or other pro- cessing logic that may interpret and execute instructions.
  • CPU Central Processing Unit
  • ASIC Application Specific Integrated Circuit
  • the herein utilised expression "processing circuit” may thus represent a processing circuitry comprising a plurality of processing circuits, such as, e.g., any, some or all of the ones enumerated above.
  • the processing circuit 150 may further perform data processing functions for inputting, outputting, and processing of data comprising data buffering and device control functions, such as call processing control, user interface control, or the like .
  • the User Equipment 120 may comprise at least one memory 151, according to some embodiments.
  • the memory 151 may comprise a physical device utilised to store data or programs, i.e., sequences of instructions, on a temporary or permanent basis.
  • the memory 151 may comprise integrated circuits comprising silicon-based trans- istors. Further, the memory 151 may be volatile or non-vola ⁇ tile.
  • FIG. 2b is a block diagram illustrating two transceivers communicating with each other in a point-to-point microwave system.
  • Each of the transceivers 121a, 121b is configured for performing wireless communication with another transceiver 121a, 121b by usage of one or more antenna streams.
  • the transceivers 121a, 121b of the point-to-point microwave system essentially have the same configuration and hardware.
  • Each one of the transceivers 121a, 121b comprises, or is connected to, one or more antennas 170a, 170b.
  • the one or more antennas 170a, 170b may include multiple antenna arrays comprising a multitude of antenna elements.
  • Each one of the transceivers 121a, 121b comprises a receiver 161a, 161b, configured for receiving wireless signals. Also, each transceiver 121a, 121b comprises a transmitter 162a, 162b, configured for transmitting signals to be received by another transceiver 121a, 121b.
  • each transceiver 121a, 121b comprises a processing circuit 150a, 150b, being configured for controlling e.g. the receiver and/or the transmitter.
  • the processing units 150a, 150b comprise corresponding logic and functions as the processing unit 150 described in connection with figure 2a.
  • Each transceiver 121a, 121b may comprise at least one memory 151a, 151b corresponding to the memory 150 described in connection with figure 2a.
  • the antenna 170 is a planar
  • antenna which includes a radiation Printed Circuit Board
  • the radiation PCB layer is arranged for radiation of signals to be transmitted by the antenna 170 by use of at least one array of at least two radiating elements. Thus, a number of radiating elements being arranged in arrays are used for transmitting the signals from the antenna 170.
  • the antenna further includes a power distribution PCB layer arranged for providing each one of the radiating elements with power needed the transmission of the signals, i.e. with the power the radiating elements need for being able to radiate the signals.
  • the antenna further includes a spacing layer, which is
  • the spacing layer provides at least one gap waveguide in an air gap of the spacing layer.
  • the air gap is at least partly achieved by one or more spacers being provided between the radiation PCB layer and the power
  • These one or more spacers have a uniform thickness T space r and are attached to the power
  • the one or more spacers are also directly or indirectly attached to the radiation PCB layer. These direct and indirect attachments to the radiation PCB layer, and the spacing layer in general, are described more in detail below, in connection with further embodiments for the antenna 170. The attachment of the one or more spacers to the power
  • the spacers 321 should preferably be placed such that they do not disturb the performance of the power distribution PCB layer 330, as
  • the radiation PCB layer is given a form corresponding to the form of the power distribution PCB layer, and at least one gap waveguide is provided in the air gap.
  • the propagation in the air gap is controlled by a surface texture in the power distribution PCB layer.
  • the waves are prohibited from propagating in directions within the air gap where the surface texture is periodic or quasi-periodic, and it is enhanced in directions where the surface texture is smooth and form a the power distribution network.
  • the surface texture of the power distribution PCB layer can be achieved by via holes in the power
  • the antenna reduces dielectric losses present in prior art solutions by transferring the wave propagation from the dielectric material of the power
  • Air has very low losses at these frequencies, close to the losses of vacuum. Therefore, a low insertion loss is provided by the antenna.
  • the radiation PCB layer, the spacing layer and the power distribution PCB layer are arranged such that a fixed distance between the radiation PCB layer and the power distribution PCB layer is securely achieved, a small-sized, robust antenna, which is also suitable for mass production is provided.
  • the configuration of the antenna provide for mechanical stability for the radiation PCB layer, and thus also for the entire antenna, also for very small sizes of the antenna.
  • FIG. 3a schematically shows an antenna 170 according to an embodiment.
  • the antenna 170 is a planar antenna having
  • multiple layers including a radiation PCB layer 310, a power distribution PCB layer 330, and a spacing layer 320 arranged between the radiation PCB layer 310 and the power distribution PCB layer 330.
  • the radiation PCB layer 310 includes at least one array of at least two radiating elements 311, and is arranged for
  • a radiation PCB layer 310 is schematically
  • FIG 4 wherein four arrays of radiating elements 311, each array including four radiating elements 311, are shown in a top view of the radiation PCB layer 310.
  • a number of via holes 312 are also shown.
  • the via holes 312 here form a kind of essentially rectangular
  • the top surface is covered by copper or another suitable metal.
  • the copper/metal is then removed where the radiating elements 311 should be located such that each of the radiating elements 311 is formed by a small area of lacking surface metal.
  • the signal can then be radiated out from each of the radiating elements 311.
  • the via holes provides for a surface texture such that wave propagation along the surface and through the boxes/walls defined by the via holes 312 is mitigated/prohibited.
  • the power distribution PCB layer 330 is arranged for providing each one of the at least two radiating elements 311 with power needed for radiation of the signals from the User
  • the power distribution PCB layer 330 is illustrated in figures 6a-b and is described more in detail below .
  • the spacing layer 320 is arranged between the radiation PCB layer 310 and the power distribution PCB layer 330, and includes a first supporting plate 324, made of metal or metallised plastic and being attached to the radiation PCB layer 310, and at least one spacer 321.
  • the at least one spacer 321 has a thickness T space r and is attached to the first supporting plate 324 and to the power distribution PCB layer 330, thereby being indirectly attached to the radiation PCB layer 310 via the first supporting plate 324.
  • the first supporting plate 324 is schematically illustrated in figure 5 and is described more in detail below.
  • the at least one spacer 321 thereby forms an air gap 323 of equal thickness T space r over the air gap between the first supporting plate 324 and the power distribution PCB layer 330.
  • the air gap 323 thus adjoins, i.e. is located next to, the power distribution PCB layer 330 and has an equal thickness Tspacer over the air gap 323, thereby forming least one gap waveguide 322 in the air gap.
  • the radiating PCB layer 310 is given a form corresponding to the form of the
  • the power distribution PCB layer 330 by the combination of the form of the power distribution PCB layer 330, the first supporting plate 324, and the equal/uniform thickness T space r of the air gap 323.
  • the power distribution PCB layer 330, and the spacing layer 320 together provides for a radiating PCB layer 310 having the same, or corresponding, form as the power distribution PCB layer 330 form.
  • the spacers 321 should preferably be placed such that they do not disturb the performance of the power distribution PCB layer 330, as discussed below.
  • a second supporting plate 340 is also disclosed as attached to the power distribution PCB layer 330.
  • the second supporting plate 340 is described more in detail below.
  • the gap waveguides are here formed between parallel metal or metallised plates, i.e. between the bottom ground plane surface of the first supporting plate 324 and the top surface of the power distribution PCB layer 310.
  • the wave propagation is controlled by means a texture in one or more of the first supporting plate 324 and the power distribution PCB layer 310.
  • Propagation waves between the parallel plates are within a stopband prohibited from propagating in directions where the texture is periodic or quasi-periodic.
  • the propagation waves are also enhanced in directions where the texture is smooth.
  • the texture can be achieved by grooves, ridges, metal strips and/or via holes in the surfaces of the metal or metallised plates. Hereby, these grooves, ridges, metal strips, or via holes form different types of gap waveguides of three
  • the antenna 170 is thus a combination of several parts/layers, as is shown in figure 3a.
  • the top layer is the radiating PCB layer 310, which is supported by the first supporting metal or metallised plastic plate 324 of the spacing layer.
  • the power distribution network PCB is supported by the second supporting plate 340, which is another metal or metallised plastic plate.
  • the spacers 321 are pins. According to an implementation form, the spacers 321 are made of metal or metallised plastic material.
  • the antenna shown in figure 3a can be produced quickly and at a low cost.
  • the composition of the antenna 170 provides a robust radiating PCB layer 310.
  • the radiation PCB layer is securely supported by the power distribution layer 330 and the spacing layer 320, which results in an antenna, and especially in a radiation PCB layer 310, that is mechanically stable and does not bend, even though the radiation PCB layer 310 can be made very thin.
  • the combined use of the first supporting metal or metallised plastic plate 324 with some spacers 321 arranged between the radiating PCB layer 310 and the power distribution network PCB 330 provides a good mechanical surface level of both PCB layers.
  • the first supporting plate 324 and the at least one spacer 321 together creates a distance T PCB to PCB between the radiation PCB layer 310 and the power distribution PCB layer 330.
  • the distance T PCB to PCB between the radiation PCB layer 310 and the power distribution PCB layer 330 equals the thickness T space r of the air gap 323 plus a thickness of the first supporting plate
  • a robust radiation PCB layer 310 of suitable form is provided by the embodiment.
  • the hereby created antenna 170 is easy and low cost to mass produce.
  • the air gap 323 has a thickness Tspacer being less than 2 mm, and preferably less than 1 mm. This also means that the thickness T space r of the spacers 321 is less than 2 mm, and preferably less than 1 mm.
  • the height of this air gap i.e. the distance T spacer , is essential to the electrical performance of the gap waveguide and thus also for the performance of the antenna. The tolerance of the height should preferably be lower than +/-0.2 mm.
  • the first supporting plate 324 has a thickness T first p i a te being less than 30 mm, and preferably less than 20 mm.
  • radiation PCB layer 310 and the power distribution PCB layer 330 is less than 32 mm; T PCB to PCB ⁇ (2 mm + 30 mm) ; and
  • a small-sized antenna 170 is hereby achieved, which is very suitable for implementation in a User
  • Equipment/transceiver 120/121a, 121b as disclosed above.
  • the at least one gap waveguide 322 causes the waves to be guided through the at least one waveguide to propagate in the air gap 323, having equal thickness T space r over the air gap 323.
  • the first supporting plate 324 can, according to an
  • FIG. 3a and 5 schematically illustrated in a non-limiting example in figures 3a and 5, wherein four holes 325 are shown in figure 5.
  • the one or more holes 325 in the first supporting plate 324 are arranged through the first supporting plate 324, and may therefore provide an electrical connection between the
  • the one or more holes 325 through the first supporting plate 324 thus form waveguides through the first supporting plate 324, such that the radiation PCB layer 310 and the power distribution PCB layer 330 are electrically connected to each other.
  • the one or more holes 325 can e.g. have the form of rectangular slots, and may be arranged in arrays in the first supporting plate 324. Other forms of the slots are also possible. The geometrical size and relations for these slots depend on the operating frequency of the antenna such that the one or more holes can function as waveguides connecting the power distribution network PCB 330 with radiating PCB layer 310 by radio coupling.
  • FIG. 3b schematically shows an antenna 170 according to an embodiment.
  • the antenna 170 is a planar antenna having multiple layers including a radiation PCB layer 310, a power distribution PCB layer 330, and a spacing layer 320 arranged between the radiation PCB layer 310 and the power distribution PCB layer 330.
  • the radiation PCB layer 310 includes at least one array of at least two radiating elements 311, and is arranged for
  • the radiation PCB layer 310 is schematically illustrated in figure 4, as
  • the power distribution PCB layer 330 is arranged for providing each one of the at least two radiating elements 311 with power needed for radiation of the signals from the User
  • the power distribution PCB layer 330 is illustrated in figures 6a-b and is described more in detail below .
  • the spacing layer 320 is arranged between the radiation PCB layer 310 and the power distribution PCB layer 330.
  • spacing layer 320 includes at least one spacer 321, which is made of an adhesive.
  • each one of the one or more spacers 321 can made of one or more drops of glue or another suitable adhesive.
  • the at least one spacer 321 has a thickness T gpacer and is attached to the first supporting plate 324 and to the power distribution PCB layer 330, thereby being directly attached to the radiation PCB layer 310.
  • the at least one spacer 321 thereby forms an air gap 323 of equal thickness T spacer over the air gap between the radiation PCB layer 310 and the power distribution PCB layer 330.
  • the air gap 323 thus adjoins, i.e. is located next to, the power distribution PCB layer 330 and has an equal thickness T space r over the air gap 323, thereby forming least one gap waveguide 322 in the air gap.
  • the radiating PCB layer 310 is given a form
  • the radiation PCB layer 310 by assembly and attachment of the radiation PCB layer 310, the power distribution PCB layer 330, and the spacing layer 320 together provides for a radiating PCB layer 310 having a form corresponding to the form of the power
  • a second supporting plate 340 is also disclosed as attached to the power distribution PCB layer 330.
  • the second supporting plate 340 is described more in detail below.
  • the gap waveguides are here formed between the bottom ground plane surface of the radiation PCB layer 310 and the top surface of the power distribution PCB layer 310, in the air gap provided by the spacers. The wave propagation is
  • Propagation waves between the parallel plates are prohibited from propagating in directions where the texture is periodic or quasi-periodic and are enhanced/amplified in directions where the texture is smooth, as explained above.
  • the spacers 321 should preferably be spaced from each other such that they do not disturb the performance of the power distribution PCB layer 330. Typically, the spacers 321 should not be placed on top of the transmission/strip lines 332 shown and discussed below in connection with figures 6a-b.
  • the spacing layer 320 is here composed of the spacers 321 alone.
  • the spacer are here made of an adhesive, such as glue with low dielectric loss. The glue can be applied by simply dripping glue on the radiation PCB layer 310 and/or on the power distribution PCB 330 in the assembly process, which is very fast and cost effective, since no screws or other
  • the antenna shown in figure 3b can be produced very quickly and at a very low cost. Also, the composition of the antenna 170 provides a robust radiating PCB layer 310. A rigid
  • the spacing layer 320 is composed of the one or more spacers 321. Since one part of the spacing layer, i.e. the first supporting plate 324, can be omitted when the spacing layer 320 includes only the spacers 321, a very small-sized antenna is achieved by this embodiment.
  • the at least one spacer 321 is attached by an adhesive, such as glue, to both the radiation PCB layer 310 and to the power distribution PCB layer 330.
  • an adhesive such as glue
  • the spacing layer 320 in figure 3b is here created by one or more spacers 321 being fastened to the radiation PCB layer 310 and to the power distribution PCB layer 330 by usage of an adhesive.
  • glue to glue the spacers to both the radiation PCB layer 310 and to the power distribution PCB layer 330 lowers the assembly costs and shortens the assembly time for the antenna 170.
  • the layers of the antenna 170 shown in figure 3b, and their mutual relations to each other forms at least one gap
  • the at least one gap waveguide 322 causes the waves to be guided through the at least one waveguide to propagate in the air gap 323, having equal thickness T space r over the air gap 323, as is explained more above.
  • FIG. 6a schematically shows a top view of a non-limiting example of spacers 321 and a power distribution network PCB 330, which may be used for either of the embodiments shown in figures 3a-b.
  • Figure 6b schematically shows a front view of the spacers 321 and the power distribution network PCB 330.
  • the power distribution PCB layer 330 is provided with one or more transmission/strip lines 332.
  • the power distribution PCB layer 330 further includes at least two arrays of via holes 331 being positioned alongside and/or in at least one
  • the via holes 331 thus provide for that propagation waves are prevented from flowing in other directions than along the transmission/strip lines 332, as explained above, whereby an efficient power supply to the radiation PCB layer 310 is provided.
  • the via holes 331 are metallised holes lead through the power distribution PCB layer to its dielectric part.
  • the corporate power distribution network PCB 330 includes one or more power dividers, and these power dividers are connected by microstrip ridge gap waveguides being formed by the via holes 331, the transmission/strip lines 332, the air gap, and the ground plane of the bottom surface of the radiation PCB layer 310.
  • the power distribution network PCB 330 example shown in figures 6a-b further includes a common port 335, three
  • distribution network PCB 330 forms a 4 way divider of power being applied to the common port 335, since the power is divided by the three dividers 333 and is provided to the four sub-ports 334.
  • the embodiment can be generally used for essentially any number of sub-ports.
  • N-l dividers should be arranged in a branched structure, possibly a reduced or extended branched structure, of the
  • transmission/strip lines 332 corresponding to the one shown in figures 6a-b.
  • the corporate power distribution network PCB 330 includes one or more power dividers and these power dividers are connected by microstrip ridge gap waveguides.
  • a cross section of the spacers 321 can be in any suitable shape, such as round, triangle, rectangular, or even irregularly shaped.
  • spacers 321 in cylinder- shape, i.e. having a round cross section, are shown in Figures 6a-b.
  • the spacers 321 are placed to support the radiation PCB layer 310 and to maintain the form of the power distribution PCB layer 330.
  • the position/location of each spacer 321 and the relative distance between any two spacers 321 can be chosen essentially in any suitable way and is thus not
  • the spacers 321 should preferably be spaced from each other such that they do not disturb the performance of the power distribution PCB layer 330. Also, the spacers 321 should, according to an embodiment, be placed such that they are attached to the power
  • the transmission/strip lines 332 i.e. not on top of the transmission/strip lines 332.
  • the number and size of the spacer depend on the remaining space not being occupied by the transmission/strip lines 332. For instance, in case the transmission/strip lines 332 occupy a large space, the space left on the power distribution PCB layer 330 is small, wherefore a small number of the spacers in small volume are used, and vice versa.
  • the gap waveguide is formed between parallel layers in the air gap.
  • the wave propagation in the gap waveguide is controlled by the surface texture of the transmission/strip lines 332 of the power distribution PCB layer 330.
  • the smoothness of the surface texture of the transmission/strip lines 332 depends on the frequency of the transmitted signal.
  • the gap waveguide 322 is formed by a surface texture of the transmission/strip lines 332 within the uniform thickness air gap 323.
  • the gap waveguide 322 is formed within the uniform thickness air gap 323 by a surface texture on the surface of the transmission/strip lines 332 facing the uniform thickness air gap 323.
  • the gap waveguide 322 is formed by a surface texture of the transmission/strip lines 332, on the opposite side of the radiation PCB layer 310 within the uniform
  • the gap waveguide 322 is formed within the uniform thickness air gap 323 by a surface texture on the surface of the radiation PCB layer 310 facing the uniform thickness air gap 323.
  • the proposed configuration of the transmission/strip lines and the via holes of the power distribution network PCB 330 gives low insertion losses and low return losses for the antenna 170.
  • the via holes 331 should be arranged closely to each other, such that a distance D via between any two neighbouring via holes 331 is less than 2 mm; D V i a ⁇ 2 mm.
  • the distance D v i a to its closest neighbouring via hole should be less than 2 mm.
  • the power distribution network PCB 330 thus is provided with numerous PCB via holes 331 both on and along the
  • FIG. 7 is a top view of a second supporting plate 340, which may be used for either of the embodiments shown in figures 3a- b.
  • the second supporting plate 340 is made of metal or
  • the second support plate 340 is attached to the power distribution network PCB layer 330 on a side opposite from where the at least one spacer 321 is attached.
  • the second supporting plate 340 can, according to an
  • the one or more holes 325 are arranged through the second supporting plate 340, and may therefore provide an electrical interface for the entire antenna 170.
  • the one or more holes 345 through the second supporting plate 340 form one or more waveguides through the second supporting plate 340, such that an
  • the one or more holes 345 can e.g. have the form of rectangular slots but the one or more holes 345 can also have other forms. The geometrical size of these slots depends on the operating frequency of the signal to be
  • the second supporting plate 340 adds to the mechanical
  • the antenna 170 is a multilayer planar antenna.
  • the layers of the antenna i.e. the radiation PCB layer 310, the spacing layer 320, the power distribution PCB layer 330, and the second supporting plate 340 are, according to an embodiment, attached to each other by use of soldering and/or adhesives. Soldering and use of adhesives when assembling the layers of the antenna results in low-cost and quick assembly for the antenna 170.
  • the radiation PCB layer 310 and the power distribution PCB layer 330 have a flat form.
  • the radiation PCB layer 310, the power distribution PCB layer 330, and the spacing layer are parallel.
  • these layers may have an arced form or a waved form, while the uniform thickness air gap 323 is maintained by their parallel configuration.
  • the term “and/ or” comprises any and all comb ⁇ inations of one or more of the associated listed items.
  • the singular forms “a”, “an” and “the” are to be interpreted as “at least one”, thus also possibly comprising a plurality of entities of the same kind, unless expressly stated otherwise.
  • the terms “includes”, “comprises”, “including” and/ or “comprising”, specifies the presence of stated features, actions, integers, steps, operations, elements, and/ or components, but do not preclude the presence or addition of one or more other

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

L'invention concerne une antenne plane (170) qui comprend une couche (310) de carte de circuit imprimé (PCB) de rayonnement comprenant au moins un groupement d'au moins deux éléments rayonnants, ladite couche de PCB de rayonnement étant conçue pour le rayonnement de signaux devant être émis par ladite antenne. L'antenne comprend en outre une couche de PCB de distribution d'énergie (330) parallèle à ladite couche de PCB de rayonnement, conçue pour fournir à chacun desdits au moins deux éléments rayonnants l'énergie nécessaire pour ledit rayonnement desdits signaux. L'antenne comprend en outre une couche d'espacement (320) agencée entre ladite couche de PCB de rayonnement et ladite couche de PCB de distribution d'énergie, et comprenant au moins un élément d'espacement (321). Ainsi, un espace d'air est créé adjacent à ladite couche de PCB de distribution d'énergie et ayant une épaisseur Tspacer uniforme sur ledit espace d'air, moyennant quoi au moins un guide d'ondes à espace est produit dans ledit espace d'air.
PCT/EP2014/060071 2014-05-16 2014-05-16 Antenne multicouche plane WO2015172841A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/060071 WO2015172841A1 (fr) 2014-05-16 2014-05-16 Antenne multicouche plane

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/060071 WO2015172841A1 (fr) 2014-05-16 2014-05-16 Antenne multicouche plane

Publications (1)

Publication Number Publication Date
WO2015172841A1 true WO2015172841A1 (fr) 2015-11-19

Family

ID=50729517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2014/060071 WO2015172841A1 (fr) 2014-05-16 2014-05-16 Antenne multicouche plane

Country Status (1)

Country Link
WO (1) WO2015172841A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107275768A (zh) * 2017-06-02 2017-10-20 南京理工大学 基于微带脊型间隙波导不等功分馈电网络的低副瓣天线阵列
WO2018119839A1 (fr) * 2016-12-29 2018-07-05 Intel Corporation Dissipateur de chaleur à la masse pour refroidissement de module de mémoire à double rangée de connexions
CN108631066A (zh) * 2017-03-24 2018-10-09 日本电产株式会社 缝隙阵列天线和具有该缝隙阵列天线的雷达
CN109075443A (zh) * 2016-09-01 2018-12-21 韦弗有限责任公司 制造软件控制的天线的方法
CN114024129A (zh) * 2021-10-12 2022-02-08 中国电子科技集团公司第二十九研究所 一种平衡式微带串馈阵列天线

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829309A (en) * 1986-08-14 1989-05-09 Matsushita Electric Works, Ltd. Planar antenna
JPH02252304A (ja) * 1989-03-27 1990-10-11 Hitachi Chem Co Ltd 平面アンテナ
US5321411A (en) * 1990-01-26 1994-06-14 Matsushita Electric Works, Ltd. Planar antenna for linearly polarized waves

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4829309A (en) * 1986-08-14 1989-05-09 Matsushita Electric Works, Ltd. Planar antenna
JPH02252304A (ja) * 1989-03-27 1990-10-11 Hitachi Chem Co Ltd 平面アンテナ
US5321411A (en) * 1990-01-26 1994-06-14 Matsushita Electric Works, Ltd. Planar antenna for linearly polarized waves

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075443A (zh) * 2016-09-01 2018-12-21 韦弗有限责任公司 制造软件控制的天线的方法
WO2018119839A1 (fr) * 2016-12-29 2018-07-05 Intel Corporation Dissipateur de chaleur à la masse pour refroidissement de module de mémoire à double rangée de connexions
US10873145B2 (en) 2016-12-29 2020-12-22 Intel Corporation Ground heat sink for dual inline memory module cooling
CN108631066A (zh) * 2017-03-24 2018-10-09 日本电产株式会社 缝隙阵列天线和具有该缝隙阵列天线的雷达
CN107275768A (zh) * 2017-06-02 2017-10-20 南京理工大学 基于微带脊型间隙波导不等功分馈电网络的低副瓣天线阵列
CN114024129A (zh) * 2021-10-12 2022-02-08 中国电子科技集团公司第二十九研究所 一种平衡式微带串馈阵列天线

Similar Documents

Publication Publication Date Title
CN109088160B (zh) 天线系统及移动终端
US10804597B2 (en) Antenna system and communication terminal
US10135149B2 (en) Phased array for millimeter-wave mobile handsets and other devices
CN106537682B (zh) 在平行导电平面之间的间隙中的波导和传输线
KR102505800B1 (ko) 누설파 위상 어레이 안테나를 포함하는 무선 통신 장치
US9742070B2 (en) Open end antenna, antenna array, and related system and method
KR102589595B1 (ko) 편파-가변 위상 어레이 안테나를 포함하는 무선 통신 장치
WO2015172841A1 (fr) Antenne multicouche plane
CN108808214B (zh) 天线系统及移动终端
CN109449568A (zh) 毫米波阵列天线及移动终端
JP2014150526A (ja) アンテナアセンブリ及び該アンテナアセンブリを備える通信装置
CN107438919B (zh) 天线阵列组件、其构造方法及无线电终端
CN109786938B (zh) 移动终端
CN110783702A (zh) 天线模组及电子设备
US7091909B2 (en) Antenna unit adaptable to a wideband
JP6488342B2 (ja) アンテナシステム
CN110676580B (zh) 一种天线模组以及终端
CN103825093A (zh) 去耦合电路及天线装置
CN209056615U (zh) 用于移动终端的毫米波无源多波束阵列装置
CN113839199B (zh) 一种具有紧凑型天线对的移动终端
US20210005970A1 (en) Slot antenna apparatus, and method for adjusting amount of radio waves emitted from slot antenna apparatus
CN210744157U (zh) 一种应用于5g系统的高性能超宽带辐射单元
CN109742521B (zh) 一种双极化辐射单元和天线
CN210137004U (zh) 毫米波平面准八木天线单元、阵列天线以及相控阵天线
Deng et al. A Novel Omni-directional Antenna with Low Gain Variations for WiFi Communications

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14724101

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14724101

Country of ref document: EP

Kind code of ref document: A1