WO2015167095A1 - Plastic having copper-based compound deposited thereon and preparation method for same - Google Patents

Plastic having copper-based compound deposited thereon and preparation method for same Download PDF

Info

Publication number
WO2015167095A1
WO2015167095A1 PCT/KR2014/010940 KR2014010940W WO2015167095A1 WO 2015167095 A1 WO2015167095 A1 WO 2015167095A1 KR 2014010940 W KR2014010940 W KR 2014010940W WO 2015167095 A1 WO2015167095 A1 WO 2015167095A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic
copper
deposited
compound
based compound
Prior art date
Application number
PCT/KR2014/010940
Other languages
French (fr)
Korean (ko)
Inventor
백승우
Original Assignee
(주)비에스써포트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)비에스써포트 filed Critical (주)비에스써포트
Publication of WO2015167095A1 publication Critical patent/WO2015167095A1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process

Definitions

  • the present invention relates to a plastic and a method for manufacturing the same, and more particularly, to a plastic and a method for manufacturing the same, which provides antimicrobial properties by a conductive copper-based compound and enhances the durability of the deposited film.
  • Electromagnetic shielding method using the conductivity is a method of forming a conductive coating film on the surface of the plastic is used a lot.
  • Antimicrobial activity includes preventing germs from growing or sterilizing them.
  • plastics such as textile articles, tubes, trays, bowls, and machine parts, need to simultaneously implement conductivity and antibacterial properties.
  • plastic containers used in hospitals must meet the conductivity for shielding electromagnetic waves and the antibacterial properties for preventing infection of pathogens.
  • Korean Application No. 2012-7022202 improves the antistatic properties by applying a divalent cation and a phosphate ester salt of a Group 2 element metal.
  • Republic of Korea Application Nos. 2011-7014670, 2010-0101700, 2009-0098692 used organic salts having a fluorine group and a sulfonyl group to impart the conductivity of the plastic material.
  • Korean application No. 2009-7006733 a polymer compound having a PEO chain as a conductive base structure is added to increase the conductivity of a plastic material.
  • organic salts having a phosphate ester salt, a fluorine group, and a sulfonyl group can be easily applied to plastics and can easily improve conductivity.
  • the conductivity of the plastic container drops sharply. There is this.
  • container deformation occurs due to uneven crystallinity and crystal size for each part.
  • Korean Patent Registration No. 10-0987728 silver was deposited on the resin surface by sputtering or ion plating, and then the deposited silver was mixed to make antimicrobial yarn.
  • antimicrobial yarns were prepared by dyeing zinc sulfide nanoparticles and organic antibacterial agents.
  • the present invention has been made in an effort to provide a plastic and a method of manufacturing the same, in which a copper-based compound on which a coating film is formed, which provides conductivity and antimicrobial properties to a surface of the plastic and has a high coating film strength.
  • Plastics deposited with a copper-based compound for solving the problems of the present invention includes a plastic base material and a copper-based compound deposition film deposited on the surface of the plastic base material.
  • M may be any one selected from S, F, and Cl.
  • the compound may be copper sulfide.
  • a method of manufacturing a plastic on which a copper-based compound is deposited first prepares a plastic base material. Thereafter, a copper compound is deposited on the surface of the plastic base material.
  • the surface of the plastic may be treated with a conductive polymer emulsion solution containing a transition metal before the depositing step.
  • An aqueous dispersion coating liquid containing 0.01 to 3.0 wt% of colloidal transition metal fine particles and 0.01 to 5.0 wt% of at least one emulsion selected from a water-soluble polyester, a water-soluble urethane, and a water-soluble acrylic may be applied to the surface of the plastic.
  • the plastic on which the copper-based compound of the present invention is deposited and its manufacturing method by depositing a compound containing copper sulfide on the surface of the plastic, it has high conductivity, antimicrobial activity and coating film strength. Copper-based compound formed by the deposition is excellent in antibacterial, it can be applied to improve the antimicrobial properties of plastics.
  • 1 is an XRD graph showing the crystal structure of copper sulfide prepared by the present invention.
  • Figure 2 is a photograph of copper sulfide deposited on the plastic produced by the present invention.
  • the copper compound applied to the embodiment of the present invention is preferably copper sulfide (CuS).
  • Copper sulfide was synthesized by reacting copper sulfide (CuSO 4 ) with a salt selected from sulfide salts, fluoride salts, and chloride salts in an aqueous solution at a temperature of 10 to 80 ° C. in a molar ratio of 1: 1.
  • the chemical structure of the synthesized copper sulfide nanoparticles is in the form of Cu x S y and the synthesis conditions were limited so that the ratio of x / y is 0.8 ⁇ 1.5.
  • Examples of the sulfide salts that can be used in the present invention include sodium sulfide, iron sulfide, potassium sulfide, zinc sulfide, and the like, and examples of the fluoride salt include sodium fluoride, iron fluoride, potassium fluoride, and zinc fluoride.
  • Examples of the chloride salt include sodium chloride, iron chloride, potassium chloride, and zinc chloride.
  • the reaction temperature is 10 ° C. or less
  • the reaction temperature is 80 ° C. or higher
  • the reaction rate is too high
  • the density of crystals on the surface of the copper sulfide increases, and the concentration of copper increases, and the antimicrobial activity decreases.
  • the bonding ratio of x / y of the copper-based nanoparticles is 0.8 or less
  • the concentration of sulfur (S) becomes too high and the antibacterial property is good.
  • the copper sulfide has poor chemical stability. When it is 1.5 or more, the concentration of copper increases and the antimicrobial activity decreases.
  • a deposition target using the copper sulfide prepared in the above manner After making a deposition target using the copper sulfide prepared in the above manner, it is physically deposited on the surface of the plastic.
  • a conductive polymer emulsion solution containing a transition metal before deposition.
  • An aqueous dispersion coating solution containing 0.01 to 3.0 wt% of colloidal transition metal fine particles and 0.01 to 5.0 wt% of at least one emulsion selected from a water-soluble polyester, a water-soluble urethane, and a water-soluble acryl is applied to the surface of the plastic.
  • the dispersion coating liquid can increase the deposition strength.
  • the deposition is heated to maintain the vapor pressure of the metal 10 -2 ⁇ 10 -1 in a vacuum condition of 10 -5 ⁇ 10 -3 torr and copper sulfide is deposited to a thickness of 300 ⁇ 600 ⁇ on the plastic surface.
  • the deposition intensity of the deposition layer is preferably maintained at least 60g / 25mm or more.
  • Plastics can be both thermoplastic resins and thermosetting resins, of which thermoplastic resins which are advantageous for molding are more preferred.
  • the thermoplastic resin may mainly be polyethylene terephthalate, polylactic acid, polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polyvinyl chloride, polyurethane, silicone, or the like.
  • the thermosetting resin is preferably an epoxy resin or the like. Polyurethanes are more preferred because they are flexible, nontoxic, and have good chemical resistance.
  • the surface state of the coating film was observed under a microscope and the number of protrusions and undeposited films per 10 cm ⁇ 10 cm was evaluated to evaluate the presence or absence of protrusions on the surface of the coating film.
  • the thickness of the coated film was measured using SEM (sanning electron microscopy, JSM-6390A, JEOL, USA).
  • the coating film strength of the coating film was controlled by the film adhesion, and the adhesion strength was measured by using a pull down breaking tester (Pull Down Breaking Point Tester, Phpto Teohnioa, USA) with a load of 90 kg / sec.
  • the test bacteria were contacted with the specimens, and then allowed to stand and incubated at 25 ° C for 24 hours.
  • the antimicrobial activity is excellent when the number of bacteria is less than 10 7 , and is indicated by ⁇ . If the number of Escherichia coli (ATCC 25922) bacteria was more than 10 10 per mL and measurement was impossible, it was indicated as a side payment.
  • the conductivity of the plastic container was evaluated by measuring the surface resistance using an insulation resistance meter of Hewlett-Packard Co., Ltd. at 23 ° C., 60% relative humidity, and 500 V applied voltage.
  • the crystal structure of the deposited copper sulfide had a unique structure of copper sulfide as shown in FIG. 1.
  • sulfur did not have a crystal structure, and thus peaks did not appear, but copper showed peaks at 55 degrees, 65 degrees, 99 degrees, 125 degrees, and 137 degrees.
  • the fine particles were observed by X-ray powder diffraction (XRD, XD-3A, Shimadzu, Japan).
  • the coating film formed on the LDPE plastic was as shown in FIG.
  • the antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
  • Example 2 copper sulfide was deposited on the surface of PP plastic having a diameter of 1 cm and a length of 10 cm to form a coating film.
  • the antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
  • Example 2 copper sulfide was deposited on the surface of PET plastic having a diameter of 1 cm and a length of 10 cm to form a coating film.
  • the antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
  • Copper sulfide 0.1wt% was mixed with IPA (isopropyl alcohol), and stirred at room temperature for 1 hour to prepare a coating solution.
  • the coating solution was dip coated onto LDPE plastics having a diameter of 1 cm and a length of 10 cm.
  • the coated LDPE plastic was first dried at 50 ° C. for 1 hour and then subjected to secondary annealing at 400 ° C. for 30 minutes. At this time, the thickness of the coating film was about 500 kPa.
  • the antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
  • the antimicrobial, conductivity, surface state, and coating strength of the surface of LDPE having a diameter of 1 cm and a length of 10 cm without a copper sulfide coating film were measured as described above.
  • Table 1 compares the antimicrobial (dog / mL), conductivity ( ⁇ cm), surface state (dog / 100cm2) and coating strength (kg / cm2) of the plastics of Examples 1 to 3 and Comparative Examples 1 and 2 of the present invention. It is.
  • Examples 1-3 and Comparative Example 1 which formed the copper sulfide coating film by the vapor deposition method, the wet coating method, and the vapor deposition method were excellent in antimicrobial activity and electroconductivity.
  • the copper sulfide coating film was found to exhibit high antimicrobial activity and conductivity regardless of the coating method.
  • Comparative Example 2 without the copper sulfide coating film deteriorated antimicrobial so much that measurement was impossible.
  • the coating film strength was 100 kg / cm 2 or less, and the coating film strength of the deposition method was greater than 300 kg / cm 2 . If the coating film strength is less than 300 kg / cm 2 , it is difficult to apply to the plastic according to the embodiment of the present invention.
  • the surface state of the deposited film by the vapor deposition method was superior to the wet coating method.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)

Abstract

Provided is plastic having copper-based compound deposited thereon and a preparation method for same, the plastic having formed on the surface thereof a coating film that provides conductivity and antibacterial properties and has great film strength. Plastic has a compound deposited on the surface of plastic based material, the compound having the chemical structure of CuxMy (M is any one selected from groups 15-17 in the periodic table, and x/y=0.8-1.5).

Description

구리계 화합물이 증착된 플라스틱 및 그 제조방법Copper-deposited plastics and its manufacturing method
본 발명은 플라스틱 및 그 제조방법에 관한 것으로, 보다 상세하게는 도전성을 가진 구리계 화합물에 의해 항균성을 부여하고 증착된 피막의 내구성을 높인 플라스틱 및 그 제조방법에 관한 것이다.The present invention relates to a plastic and a method for manufacturing the same, and more particularly, to a plastic and a method for manufacturing the same, which provides antimicrobial properties by a conductive copper-based compound and enhances the durability of the deposited film.
최근 전자파 발생이 많은 고가 장비의 사용증가로 전자파 차폐특성과 제전특성이 우수한 플라스틱 용기의 개발이 요구되고 있다. 도전성을 이용한 전자파 차폐방법은 플라스틱의 표면에 도전성 코팅막을 형성하는 방법이 많이 사용되고 있다. 또한, 세균 감염을 방지하는 항균성도 동시에 갖춘 플라스틱의 활용이 증가하고 있다. 항균성은 세균이 자라나는 것을 방지하거나 세균을 멸균시키는 것을 포함한다. 섬유물품, 튜브, 트레이, 그릇, 기기 부품 등과 같이 다양한 형태의 플라스틱은 도전성 및 항균성을 동시에 구현할 필요가 있다. 예를 들어, 병원에서 사용되는 플라스틱 용기는 전자파 차폐를 위한 도전성과 병원균의 감염을 방지하기 위한 항균성을 충족해야 한다.Recently, the development of plastic containers having excellent electromagnetic shielding and antistatic properties has been required due to the increased use of expensive equipment that generates a lot of electromagnetic waves. Electromagnetic shielding method using the conductivity is a method of forming a conductive coating film on the surface of the plastic is used a lot. In addition, the use of plastics equipped with antimicrobial activity to prevent bacterial infection is increasing. Antimicrobial activity includes preventing germs from growing or sterilizing them. Various types of plastics, such as textile articles, tubes, trays, bowls, and machine parts, need to simultaneously implement conductivity and antibacterial properties. For example, plastic containers used in hospitals must meet the conductivity for shielding electromagnetic waves and the antibacterial properties for preventing infection of pathogens.
플라스틱의 도전성을 개선하기 위하여, 대한민국 출원 제2012-7022202호에서는 2족 원소 금속의 2가 양이온과 인산 에스테르염을 적용하여 제전성을 개선하였다. 또한, 대한민국 출원 제2011-7014670호, 제2010-0101700호, 제2009-0098692호에서는 플루오르기 및 술폰닐기를 갖는 유기염을 사용하여 플라스틱 소재의 도전성을 부여하였다. 대한민국 출원 제2009-7006733호에서는 PEO 사슬을 도전성 기본 구조로 하는 고분자 화합물을 첨가하여 플라스틱 소재의 도전성을 높였다. 그런데, 선행문헌과 같이, 인산 에스테르염, 플루오르기 및 술포닐기를 갖는 유기염 등은 플라스틱의 적용이 용이하고 도전성을 쉽게 개선시킬 수 있으나, 더운 물을 사용하는 경우 플라스틱 용기의 도전성이 급격히 떨어지는 단점이 있다. 또한, PEO 사슬을 갖는 도전성 고분자를 혼련하여 플라스틱 용기를 제조하는 경우, 부위별 불균일한 결정도와 결정크기로 인하여 용기 변형이 발생한다.In order to improve the conductivity of plastics, Korean Application No. 2012-7022202 improves the antistatic properties by applying a divalent cation and a phosphate ester salt of a Group 2 element metal. In addition, the Republic of Korea Application Nos. 2011-7014670, 2010-0101700, 2009-0098692 used organic salts having a fluorine group and a sulfonyl group to impart the conductivity of the plastic material. In Korean application No. 2009-7006733, a polymer compound having a PEO chain as a conductive base structure is added to increase the conductivity of a plastic material. However, as in the literature, organic salts having a phosphate ester salt, a fluorine group, and a sulfonyl group can be easily applied to plastics and can easily improve conductivity. However, when hot water is used, the conductivity of the plastic container drops sharply. There is this. In addition, in the case of manufacturing a plastic container by kneading a conductive polymer having a PEO chain, container deformation occurs due to uneven crystallinity and crystal size for each part.
플라스틱 항균성에 관한 선행문헌을 살펴보면, 대한민국 특허등록 제10-0559405호에서는 입자크기가 1~3㎛인 유황분말 10~20중량부를 수지와 혼련시켰으며, 대한민국 특허등록 제10-0766418호에서는 1~600nm의 은나노 분말과 이산화티탄을 수지와 혼련시켜 항균성이 우수한 플라스틱 제품을 제조하였다. 대한민국 특허등록 제10-0987728호에서는 수지표면에 스퍼터링 또는 이온 플레이팅 법을 이용하여 은을 증착한 다음 증착된 은을 혼합하여 항균사를 만들었다. 대한민국 특허등록 제10-1180117호에서는 황화아연 나노미립자와 유기항균제를 염착시켜 항균사를 제조하였다.Looking at the prior literature on plastic antimicrobial properties, Korean Patent Registration No. 10-0559405 No. 10-20 parts by weight of sulfur powder having a particle size of 1 ~ 3㎛ kneaded with resin, and Korean Patent Registration No. 10-0766418 No. 1 ~ A 600 nm silver nano powder and titanium dioxide were kneaded with a resin to prepare a plastic product having excellent antibacterial properties. In Korean Patent Registration No. 10-0987728, silver was deposited on the resin surface by sputtering or ion plating, and then the deposited silver was mixed to make antimicrobial yarn. In Korean Patent Registration No. 10-1180117, antimicrobial yarns were prepared by dyeing zinc sulfide nanoparticles and organic antibacterial agents.
그러나 선행문헌에 사용된 은과 황 성분의 항균성이 우수하다는 것은 알려져 있음에도 불구하고, 실용화에는 많은 한계가 있다. 은의 경우, 높은 항균성과 편이성이 있음에도 불구하고, 지나치게 공급가격이 높다. 황의 경우, 아직 환경적 유해성과 가공 난이성 등 아직 해결되지 않고 있다. 항균성을 부여하는 방법이 구체적으로 구현되지 못하고 있다. However, although it is known that the antibacterial properties of the silver and sulfur components used in the prior literature are excellent, there are many limitations in practical use. In the case of silver, although it has high antibacterial property and convenience, supply price is too high. In the case of sulfur, environmental hazards and processing difficulties have not been solved yet. How to give antimicrobial has not been specifically implemented.
본 발명이 해결하고자 하는 과제는 플라스틱의 표면에 도전성 및 항균성을 부여하고 도막강도가 높은 코팅막이 형성된 구리계 화합물이 증착된 플라스틱 및 그 제조방법을 제공하는 데 있다. SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a plastic and a method of manufacturing the same, in which a copper-based compound on which a coating film is formed, which provides conductivity and antimicrobial properties to a surface of the plastic and has a high coating film strength.
본 발명의 과제를 해결하기 위한 구리계 화합물이 증착된 플라스틱은 플라스틱 모재 및 상기 플라스틱 모재의 표면에 증착된 구리계 화합물 증착막을 포함한다. 이때, 상기 화합물의 화학구조는 CuxMy(M은 주기율표에서 15족 내지 17족 중에서 선택된 어느 하나, x/y=0.8∼1.5)이다. Plastics deposited with a copper-based compound for solving the problems of the present invention includes a plastic base material and a copper-based compound deposition film deposited on the surface of the plastic base material. In this case, the chemical structure of the compound is Cu x M y (M is any one selected from group 15 to 17 in the periodic table, x / y = 0.8 to 1.5).
본 발명의 플라스틱에 있어서, 상기 M은 S, F, Cl 중에서 선택된 어느 하나일 수 있다. 상기 화합물은 황화구리일 수 있다.In the plastic of the present invention, M may be any one selected from S, F, and Cl. The compound may be copper sulfide.
본 발명의 과제를 해결하기 위한 구리계 화합물이 증착된 플라스틱의 제조방법은 먼저 플라스틱 모재를 준비한다. 그후, 상기 플라스틱 모재의 표면에 구리계 화합물을 증착한다. 이때, 상기 화합물의 화학구조는 CuxMy(M은 주기율표에서 15족 내지 17족 중에서 선택된 어느 하나, x/y=0.8∼1.5)이다.In order to solve the problem of the present invention, a method of manufacturing a plastic on which a copper-based compound is deposited first prepares a plastic base material. Thereafter, a copper compound is deposited on the surface of the plastic base material. In this case, the chemical structure of the compound is Cu x M y (M is any one selected from group 15 to 17 in the periodic table, x / y = 0.8 to 1.5).
본 발명의 제조방법에 있어서, 상기 증착하는 단계 이전에 전이금속이 포함된 도전성 고분자 에멀젼 용액으로 상기 플라스틱의 표면을 처리할 수 있다. 상기 플라스틱의 표면에 콜로이드성 전이금속 미립자 0.01~3.0wt%와 수용성 폴리에스테르, 수용성 우레탄, 수용성 아크릴 중에서 선택된 적어도 1종의 에멀젼 0.01~5.0wt%를 함유하는 수분산 도포액을 도포할 수 있다. In the manufacturing method of the present invention, the surface of the plastic may be treated with a conductive polymer emulsion solution containing a transition metal before the depositing step. An aqueous dispersion coating liquid containing 0.01 to 3.0 wt% of colloidal transition metal fine particles and 0.01 to 5.0 wt% of at least one emulsion selected from a water-soluble polyester, a water-soluble urethane, and a water-soluble acrylic may be applied to the surface of the plastic.
본 발명의 구리계 화합물이 증착된 플라스틱 및 그 제조방법에 의하면, 플라스틱의 표면을 황화구리를 포함한 화합물을 증착함으로써, 높은 도전성, 항균성 및 도막강도를 가진다. 증착에 의해 형성된 구리계 화합물은 항균성이 우수하므로, 이를 적용하여 플라스틱의 항균성을 개선할 수 있다. According to the plastic on which the copper-based compound of the present invention is deposited and its manufacturing method, by depositing a compound containing copper sulfide on the surface of the plastic, it has high conductivity, antimicrobial activity and coating film strength. Copper-based compound formed by the deposition is excellent in antibacterial, it can be applied to improve the antimicrobial properties of plastics.
도 1은 본 발명에 의해 제조된 황화구리의 결정구조를 나타낸 XRD 그래프이다.1 is an XRD graph showing the crystal structure of copper sulfide prepared by the present invention.
도 2는 본 발명에 의해 제조된 플라스틱에 황화구리가 증착된 사진이다.Figure 2 is a photograph of copper sulfide deposited on the plastic produced by the present invention.
이하 첨부된 도면을 참조하면서 본 발명의 바람직한 실시예를 상세히 설명한다. 다음에서 설명되는 실시예는 여러 가지 다른 형태로 변형될 수 있으며, 본 발명의 범위가 아래에서 상술되는 실시예에 한정되는 것은 아니다. 본 발명의 실시예는 당 분야에서 통상의 지식을 가진 자에게 본 발명을 보다 완전하게 설명하기 위하여 제공되는 것이다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.
본 발명의 실시예에 적용되는 구리계 화합물은 황화구리(CuS)가 바람직하다. 황화구리는, 황화구리는, 수용액상에서 황산구리(CuSO4)와 황화염, 불소화염, 염화염 중에서 선택된 염을 1:1의 몰비로 10~80℃의 온도에서 반응시켜 합성하였다. 이때 합성된 황화구리 나노입자의 화학구조는 CuxSy의 형태이며 x/y의 비율이 0.8~1.5를 만족하도록 합성조건을 한정하였다. 본 발명에서 사용할 수 있는 황화염의 종류로는 황화나트륨, 황화철, 황화칼륨, 황화아연 등이 있으며 불소화염의 종류로는 불소화나트륨, 불소화철, 불소화칼륨, 불소화아연 등이 있다. 또 염화염의 종류로는 염화나트륨, 염화철, 염화칼륨, 염화아연 등이 있다. 이때, 황화나트륨과 황산구리를 사용하여 합성한 황화구리의 항균성이 가장 양호하였다.The copper compound applied to the embodiment of the present invention is preferably copper sulfide (CuS). Copper sulfide was synthesized by reacting copper sulfide (CuSO 4 ) with a salt selected from sulfide salts, fluoride salts, and chloride salts in an aqueous solution at a temperature of 10 to 80 ° C. in a molar ratio of 1: 1. At this time, the chemical structure of the synthesized copper sulfide nanoparticles is in the form of Cu x S y and the synthesis conditions were limited so that the ratio of x / y is 0.8 ~ 1.5. Examples of the sulfide salts that can be used in the present invention include sodium sulfide, iron sulfide, potassium sulfide, zinc sulfide, and the like, and examples of the fluoride salt include sodium fluoride, iron fluoride, potassium fluoride, and zinc fluoride. Examples of the chloride salt include sodium chloride, iron chloride, potassium chloride, and zinc chloride. At this time, the antibacterial activity of the copper sulfide synthesized using sodium sulfide and copper sulfate was the best.
반응온도가 10℃이하가 되면, 구리계 나노입자의 합성할 때, 황산구리와 염의 반응성이 떨어지나 항균성은 양호하다. 하지만, 황화구리를 생성하는 수율이 떨어진다. 반응온도가 80℃ 이상이 되면, 반응속도가 지나치게 높아져서, 황화구리 표면의 결정체의 밀도가 높아지고 구리의 농도가 증가하면서 항균성이 저하된다. 또한, 구리계 나노입자의 x/y의 결합비가 0.8 이하가 되면, 지나치게 황(S)의 농도가 높아져서 항균성은 양호하다. 하지만, 황화구리의 화학적 안정성이 떨어진다. 1.5 이상이 되면 구리의 농도가 증가하면서 항균성이 저하된다.When the reaction temperature is 10 ° C. or less, when synthesizing the copper-based nanoparticles, the reactivity of copper sulfate and salt is decreased, but the antibacterial property is good. However, the yield of producing copper sulfide is poor. When the reaction temperature is 80 ° C. or higher, the reaction rate is too high, the density of crystals on the surface of the copper sulfide increases, and the concentration of copper increases, and the antimicrobial activity decreases. In addition, when the bonding ratio of x / y of the copper-based nanoparticles is 0.8 or less, the concentration of sulfur (S) becomes too high and the antibacterial property is good. However, the copper sulfide has poor chemical stability. When it is 1.5 or more, the concentration of copper increases and the antimicrobial activity decreases.
위와 같은 방법으로 제조된 황화구리를 이용하여 증착용 타겟을 만든 후에, 물리적으로 플라스틱의 표면에 증착한다. 증착에서 도막강도를 높이기 위하여, 증착 전에 전이금속이 포함된 도전성 고분자 에멀젼 용액으로 플라스틱의 표면을 처리하는 것이 좋다. 플라스틱의 표면에 콜로이드성 전이금속 미립자 0.01~3.0wt%와 수용성 폴리에스테르, 수용성 우레탄, 수용성 아크릴 중에서 선택된 적어도 1종의 에멀젼 0.01~5.0wt%를 함유하는 수분산 도포액을 도포한다. 수분산 도포액은 증착강도를 높일 수 있다. 수분산 도포액의 잔류고형물이 0.001~0.1g/m2이 되도록 조절한다. 증착은 10-5~10-3torr의 진공조건에서 금속의 증기압 10-2~10-1이 유지되도록 가열하여 플라스틱 표면에 300~600Å의 두께로 황화구리가 증착한다. 증착층의 증착강도는 적어도 60g/25mm 이상 유지하는 것이 좋다.After making a deposition target using the copper sulfide prepared in the above manner, it is physically deposited on the surface of the plastic. In order to increase the coating strength in the deposition, it is preferable to treat the surface of the plastic with a conductive polymer emulsion solution containing a transition metal before deposition. An aqueous dispersion coating solution containing 0.01 to 3.0 wt% of colloidal transition metal fine particles and 0.01 to 5.0 wt% of at least one emulsion selected from a water-soluble polyester, a water-soluble urethane, and a water-soluble acryl is applied to the surface of the plastic. The dispersion coating liquid can increase the deposition strength. Adjust so that the residual solid of the aqueous dispersion coating solution is 0.001 ~ 0.1g / m 2 . The deposition is heated to maintain the vapor pressure of the metal 10 -2 ~ 10 -1 in a vacuum condition of 10 -5 ~ 10 -3 torr and copper sulfide is deposited to a thickness of 300 ~ 600Å on the plastic surface. The deposition intensity of the deposition layer is preferably maintained at least 60g / 25mm or more.
플라스틱은 열가소성 수지 및 열경화성 수지가 모두 가능하며, 이중에서 성형에 유리한 열가소성 수지가 보다 바람직하다. 열가소성 수지는 주로 폴리에틸렌텔레프탈레이트, 폴리락틱산, 폴리에틸렌, 폴리프로필렌, 폴리카보네이트, 폴리메틸메타아크릴레이트, 폴리비닐클로라이드, 폴리우레탄, 실리콘 등을 사용할 수 있다. 열경화성 수지는 에폭시 수지 등이 바람직하다. 폴리우레탄은 유연하고 무독하며 내약품성이 좋기 때문에 보다 바람직하다. Plastics can be both thermoplastic resins and thermosetting resins, of which thermoplastic resins which are advantageous for molding are more preferred. The thermoplastic resin may mainly be polyethylene terephthalate, polylactic acid, polyethylene, polypropylene, polycarbonate, polymethyl methacrylate, polyvinyl chloride, polyurethane, silicone, or the like. The thermosetting resin is preferably an epoxy resin or the like. Polyurethanes are more preferred because they are flexible, nontoxic, and have good chemical resistance.
이하 본 발명은 아래와 같은 실시예에 의거하여 보다 상세하게 설명하겠다. 단 아래의 실시예는 본 발명을 예시하기 위한 것이며 이에 한정하지 않는다. 본 발명의 실시예 및 비교예에서 제조된 플라스틱의 성능평가는 아래와 같은 방법으로 실시하였다. 이하에서는 상기 화합물 중에서 황화구리를 중심으로 설명하기로 한다.Hereinafter, the present invention will be described in more detail based on the following examples. However, the following examples are intended to illustrate the invention and are not limited thereto. Performance evaluation of the plastic produced in Examples and Comparative Examples of the present invention was carried out by the following method. Hereinafter, the copper sulfide will be mainly described among the compounds.
(1) 코팅막의 표면상태(1) Surface condition of coating film
코팅막 표면의 돌기 발생 유무 및 미증착 상태를 평가하기 위하여 코팅막의 표면상태를 현미경으로 관찰하였으며 10cm×10㎝의 면적당 관찰된 돌기 및 미증착 수를 관찰하여 평가하였다. The surface state of the coating film was observed under a microscope and the number of protrusions and undeposited films per 10 cm × 10 cm was evaluated to evaluate the presence or absence of protrusions on the surface of the coating film.
○: 1개 이하○: 1 or less
△: 2∼4개 △: 2 to 4
×: 5개 이상×: 5 or more
(2) 코팅막의 피막두께(2) Coating thickness of coating film
코팅된 피막의 두께는 SEM(sanning electron microscopy, JSM-6390A, JEOL 사, 미국)을 이용하여 측정하였다.The thickness of the coated film was measured using SEM (sanning electron microscopy, JSM-6390A, JEOL, USA).
(3) 코팅막의 도막강도(3) Coating film strength of coating film
코팅막의 도막강도는 도막밀착력으로 관리하며 밀착강도는 인장력 시험기 (Pull Down Breaking Point Tester, Phpto Teohnioa 사, 미국)를 사용하여 90 kg/sec의 하중으로 당길 때 측정되는 도막의 밀착강도를 측정하였다.The coating film strength of the coating film was controlled by the film adhesion, and the adhesion strength was measured by using a pull down breaking tester (Pull Down Breaking Point Tester, Phpto Teohnioa, USA) with a load of 90 kg / sec.
○: 300kg/cm2 이상 ○: 300 kg / cm 2 or more
△: 100~300kg/cm2 △: 100-300 kg / cm 2
×: 100kg/cm2 이하×: 100 kg / cm 2 or less
(4) 항균성(4) antibacterial
이스케리키아 콜라이(Escherichia Coli: ATCC 25922)를 균주로 사용하여 시험균액을 시편에 접촉시킨 다음, 25℃에서 24시간 정치, 배양시킨 후 균수를 세어서 시편의 항균성을 평가하였다. 항균성은 균수가 107보다 적으면 우수한 것으로, ○로 나타내었다. 이스케리키아 콜라이(Escherichia Coli: ATCC 25922) 균수가 mL 당 1010개 이상이어서 측정이 불가능하면 측불이라고 표시하였다.Using the Escherichia coli (ATCC 25922) as a strain, the test bacteria were contacted with the specimens, and then allowed to stand and incubated at 25 ° C for 24 hours. The antimicrobial activity is excellent when the number of bacteria is less than 10 7 , and is indicated by ○. If the number of Escherichia coli (ATCC 25922) bacteria was more than 10 10 per mL and measurement was impossible, it was indicated as a side payment.
(5) 도전성(5) conductivity
플라스틱 용기의 도전성은 23℃, 상대습도 60%, 인가전압 500 V의 조건에서 미국 휴렛-팩커드 사의 절연저항 측정기를 이용하여 표면저항을 측정하여 평가하였다.  The conductivity of the plastic container was evaluated by measuring the surface resistance using an insulation resistance meter of Hewlett-Packard Co., Ltd. at 23 ° C., 60% relative humidity, and 500 V applied voltage.
○: 102 Ω×㎝ 이상○: 10 2 Ω × cm or more
×: 102 Ω×㎝ 이하×: 10 2 Ω × cm or less
<실시예 1><Example 1>
CuSO4와 Na2S를 증류수에 각각 1 몰씩 넣고 30분 동안 교반시킨 다음, 50℃의 등온 반응기에 넣고 30분 동안 반응시켜 황화구리 미립자를 합성하여, 증착용 타켓을 제조하였다. 직경 1cm, 길이 10cm인 LDPE 플라스틱의 표면에 콜로이드성 전이금속 미립자 0.5wt%와 수용성 폴리에스테르의 에멀젼 1.0wt%를 함유하는 수분산 도포액을 도포하였다. 수분산 도포액의 잔류고형물이 0.05g/m2가 되도록 조절하였다. 그후, 증착용 타겟을 물리적으로 증발시켜 플라스틱 표면에 코팅막을 형성하였다. 증착된 황화구리의 두께는 400Å이었다. 1 mol each of CuSO 4 and Na 2 S was added to distilled water, stirred for 30 minutes, and then placed in an isothermal reactor at 50 ° C. for 30 minutes to synthesize copper sulfide fine particles, thereby preparing a deposition target. An aqueous dispersion coating liquid containing 0.5 wt% of colloidal transition metal fine particles and 1.0 wt% of an emulsion of water-soluble polyester was applied to the surface of an LDPE plastic having a diameter of 1 cm and a length of 10 cm. The residual solids of the aqueous dispersion coating solution were adjusted to 0.05 g / m 2 . Thereafter, the deposition target was physically evaporated to form a coating film on the plastic surface. The thickness of the deposited copper sulfide was 400 mm 3.
증착된 황화구리의 결정구조는 도 1에서와 같이 황화구리의 고유 구조를 가지고 있었다. 도 1에 의하면, 황은 결정구조가 없어서 피크가 나타나지 않았으나, 구리는 55도, 65도, 99도, 125도 및 137도에서 피크가 나타났다. 미립자의 관찰은 X-ray powder diffraction(XRD, XD-3A, Shimadzu, 일본)을 이용하였다. 또한, LDPE 플라스틱에 형성된 코팅막은 도 2와 같았다. 이렇게 하여 제조된 플라스틱의 항균성, 도전성, 표면상태 및 도막강도를 앞에서 제시한 대로 측정하였다.The crystal structure of the deposited copper sulfide had a unique structure of copper sulfide as shown in FIG. 1. According to FIG. 1, sulfur did not have a crystal structure, and thus peaks did not appear, but copper showed peaks at 55 degrees, 65 degrees, 99 degrees, 125 degrees, and 137 degrees. The fine particles were observed by X-ray powder diffraction (XRD, XD-3A, Shimadzu, Japan). In addition, the coating film formed on the LDPE plastic was as shown in FIG. The antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
<실시예 2><Example 2>
실시예 1에서와 같이 황화구리를 직경 1cm, 길이 10cm인 PP 플라스틱의 표면에 증착시켜 코팅막을 형성하였다. 이렇게 하여 제조된 플라스틱의 항균성, 도전성, 표면상태 및 도막강도를 앞에서 제시한 대로 측정하였다.As in Example 1, copper sulfide was deposited on the surface of PP plastic having a diameter of 1 cm and a length of 10 cm to form a coating film. The antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
<실시예 3><Example 3>
실시예 1에서와 같이 황화구리를 직경 1cm, 길이 10cm인 PET 플라스틱의 표면에 증착시켜 코팅막을 형성하였다. 이렇게 하여 제조된 플라스틱의 항균성, 도전성, 표면상태 및 도막강도를 앞에서 제시한 대로 측정하였다.As in Example 1, copper sulfide was deposited on the surface of PET plastic having a diameter of 1 cm and a length of 10 cm to form a coating film. The antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
<비교예 1>Comparative Example 1
IPA(이소프로필 알코올)에 황화구리 0.1wt%를 혼합하여, 상온에서 1시간 동안 교반하여 코팅용액을 제조하였다. 이 코팅용액을 이용하여 직경 1cm, 길이 10cm의 LDPE 플라스틱에 딥(dip) 코팅하였다. 코팅된 LDPE 플라스틱은 50℃에서 1시간동안 1차 건조한 다음, 400℃에서 30분 동안 2차 열처리(annealing)를 하였다. 이때, 코팅막의 두께는 대략 500Å이었다. 이렇게 하여 제조된 플라스틱의 항균성, 도전성, 표면상태 및 도막강도를 앞에서 제시한 대로 측정하였다.Copper sulfide 0.1wt% was mixed with IPA (isopropyl alcohol), and stirred at room temperature for 1 hour to prepare a coating solution. The coating solution was dip coated onto LDPE plastics having a diameter of 1 cm and a length of 10 cm. The coated LDPE plastic was first dried at 50 ° C. for 1 hour and then subjected to secondary annealing at 400 ° C. for 30 minutes. At this time, the thickness of the coating film was about 500 kPa. The antimicrobial, electrical conductivity, surface state and coating strength of the plastics thus prepared were measured as set forth above.
<비교예 2>Comparative Example 2
황화구리 코팅막이 형성되지 않은 직경 1cm, 길이 10cm인 LDPE의 표면의 항균성, 도전성, 표면상태 및 도막강도를 앞에서 제시한 대로 측정하였다.The antimicrobial, conductivity, surface state, and coating strength of the surface of LDPE having a diameter of 1 cm and a length of 10 cm without a copper sulfide coating film were measured as described above.
표 1은 본 발명의 실시예 1 내지 3 및 비교예 1 내지 2의 플라스틱의 항균성(개/mL), 도전성(Ωcm), 표면상태(개/100㎠) 및 도막강도(kg/㎠)를 비교한 것이다. Table 1 compares the antimicrobial (dog / mL), conductivity (Ωcm), surface state (dog / 100cm2) and coating strength (kg / cm2) of the plastics of Examples 1 to 3 and Comparative Examples 1 and 2 of the present invention. It is.
표 1
구 분 플라스틱 황화구리존재여부 코팅방법 물 성
항균성 도전성 표면상태 도막강도
실시예 1 LDPE 증착
2 PP 증착
3 PET 증착
비교예 1 LDPE 습식도포 × × ×
2 LDPE / / × × × ×
Table 1
division plastic Copper sulfide presence Coating method Properties
Antimicrobial activity Conductivity Surface condition Coating strength
Example One LDPE deposition
2 PP deposition
3 PET deposition
Comparative example One LDPE Wet coating × × ×
2 LDPE Of Of × × × ×
표 1에 의하면, 증착법, 습식도포법 및 증착법에 의해 황화구리 코팅막을 형성한 실시예 1 내지 3 및 비교예 1은 항균성 및 도전성이 우수하였다. 황화구리 코팅막은 코팅방식에 관계없이 높은 항균성 및 도전성을 나타내고 있음을 알 수 있었다. 이에 반해, 황화구리 코팅막이 없는 비교예 2는 측정이 불가능할 정도로 항균성이 매우 악화되었다. 그런데, 증착방식이 아닌 습식도포로 코팅하면, 도막강도가 100kg/cm2 이하의 값을 나타내었고, 증착방식의 도막강도는 300kg/cm2보다 컸다. 도막강도가 300kg/cm2보다 작으면, 본 발명의 실시예에 의한 플라스틱에 적용하기 어렵다. 또한, 증착법에 의한 증착막의 표면상태는 습식도포법에 비해 우수하였다.According to Table 1, Examples 1-3 and Comparative Example 1 which formed the copper sulfide coating film by the vapor deposition method, the wet coating method, and the vapor deposition method were excellent in antimicrobial activity and electroconductivity. The copper sulfide coating film was found to exhibit high antimicrobial activity and conductivity regardless of the coating method. On the contrary, Comparative Example 2 without the copper sulfide coating film deteriorated antimicrobial so much that measurement was impossible. However, when coated with a wet coating rather than a deposition method, the coating film strength was 100 kg / cm 2 or less, and the coating film strength of the deposition method was greater than 300 kg / cm 2 . If the coating film strength is less than 300 kg / cm 2 , it is difficult to apply to the plastic according to the embodiment of the present invention. In addition, the surface state of the deposited film by the vapor deposition method was superior to the wet coating method.
이상, 본 발명은 바람직한 실시예를 들어 상세하게 설명하였으나, 본 발명은 상기 실시예에 한정되지 않으며, 본 발명의 기술적 사상의 범위 내에서 당 분야에서 통상의 지식을 가진 자에 의하여 여러 가지 변형이 가능하다. As mentioned above, although the present invention has been described in detail with reference to preferred embodiments, the present invention is not limited to the above embodiments, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention. It is possible.

Claims (7)

  1. 플라스틱 모재; 및Plastic base material; And
    상기 플라스틱 모재의 표면에 증착된 구리계 화합물 증착막을 포함하고, It includes a copper-based compound deposition film deposited on the surface of the plastic base material,
    상기 화합물의 화학구조는 CuxMy(M은 주기율표에서 15족 내지 17족 중에서 선택된 어느 하나, x/y=0.8∼1.5)인 구리계 화합물이 증착된 플라스틱.The chemical structure of the compound is Cu x M y (M is any one selected from group 15 to 17 in the periodic table, x / y = 0.8 to 1.5) a plastic on which a copper-based compound is deposited.
  2. 제1항에 있어서, 상기 M은 S, F, Cl 중에서 선택된 어느 하나인 것을 특징으로 하는 구리계 화합물이 증착된 플라스틱.The method of claim 1, wherein the copper is a copper-based compound deposited plastic, characterized in that any one selected from S, F, Cl.
  3. 제1항에 있어서, 상기 화합물은 황화구리인 것을 특징으로 하는 구리계 화합물이 증착된 플라스틱.The plastic of claim 1, wherein the compound is copper sulfide.
  4. 플라스틱 모재를 준비하는 단계; 및Preparing a plastic base material; And
    상기 플라스틱 모재의 표면에 구리계 화합물을 증착하는 단계를 포함하고, Depositing a copper compound on the surface of the plastic base material;
    상기 화합물의 화학구조는 CuxMy(M은 주기율표에서 15족 내지 17족 중에서 선택된 어느 하나, x/y=0.8∼1.5)인 구리계 화합물이 증착된 플라스틱의 제조방법.The chemical structure of the compound is Cu x M y (M is any one selected from group 15 to 17 in the periodic table, x / y = 0.8 to 1.5) A method for producing a plastic on which a copper-based compound is deposited.
  5. 제4항에 있어서, 상기 증착하는 단계 이전에 전이금속이 포함된 도전성 고분자 에멀젼 용액으로 상기 플라스틱의 표면을 처리하는 것을 특징으로 하는 구리계 화합물이 증착된 플라스틱의 제조방법.The method of claim 4, wherein the surface of the plastic is treated with a conductive polymer emulsion solution containing a transition metal before the depositing step.
  6. 제4항에 있어서, 상기 플라스틱의 표면에 콜로이드성 전이금속 미립자 0.01~3.0wt%와 수용성 폴리에스테르, 수용성 우레탄, 수용성 아크릴 중에서 선택된 적어도 1종의 에멀젼 0.01~5.0wt%를 함유하는 수분산 도포액을 도포하는 것을 특징으로 하는 구리계 화합물이 증착된 플라스틱의 제조방법.The aqueous dispersion coating liquid according to claim 4, wherein the surface of the plastic contains 0.01 to 3.0 wt% of colloidal transition metal fine particles and 0.01 to 5.0 wt% of at least one emulsion selected from a water-soluble polyester, a water-soluble urethane, and a water-soluble acryl. Method for producing a plastic on which a copper-based compound is deposited, characterized in that the coating.
  7. 제4항에 있어서, 상기 플라스틱 모재는 폴리우레탄 수지 또는 실리콘 수지로 이루어지는 것을 특징으로 하는 구리계 화합물이 증착된 플라스틱의 제조방법.The method of claim 4, wherein the plastic base material is made of a polyurethane resin or a silicone resin.
PCT/KR2014/010940 2014-04-28 2014-11-14 Plastic having copper-based compound deposited thereon and preparation method for same WO2015167095A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0050541 2014-04-28
KR1020140050541A KR101564328B1 (en) 2014-04-28 2014-04-28 Plastic deposited with copper based compound and method of manufacturing the plastic

Publications (1)

Publication Number Publication Date
WO2015167095A1 true WO2015167095A1 (en) 2015-11-05

Family

ID=54358797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2014/010940 WO2015167095A1 (en) 2014-04-28 2014-11-14 Plastic having copper-based compound deposited thereon and preparation method for same

Country Status (2)

Country Link
KR (1) KR101564328B1 (en)
WO (1) WO2015167095A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0554733A (en) * 1991-08-23 1993-03-05 Idemitsu Kosan Co Ltd Manufacture of surface conductive transparent vapor deposition film coated body
KR20060025250A (en) * 2004-09-15 2006-03-21 한우석 High vaccum evaporation mathod at synthetic resins with a metal
KR20090102742A (en) * 2006-10-31 2009-09-30 존슨 앤드 존슨 비젼 케어, 인코포레이티드 Antimicrobial polymeric articles, processes to prepare them and methods of their use
KR20130099474A (en) * 2012-02-29 2013-09-06 주식회사 동양 Method for preparing electroconductive nylon or polyester fibers having copper sulfite layer, and electroconductive nylon or polyester fibers obtained therefrom

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0554733A (en) * 1991-08-23 1993-03-05 Idemitsu Kosan Co Ltd Manufacture of surface conductive transparent vapor deposition film coated body
KR20060025250A (en) * 2004-09-15 2006-03-21 한우석 High vaccum evaporation mathod at synthetic resins with a metal
KR20090102742A (en) * 2006-10-31 2009-09-30 존슨 앤드 존슨 비젼 케어, 인코포레이티드 Antimicrobial polymeric articles, processes to prepare them and methods of their use
KR20130099474A (en) * 2012-02-29 2013-09-06 주식회사 동양 Method for preparing electroconductive nylon or polyester fibers having copper sulfite layer, and electroconductive nylon or polyester fibers obtained therefrom

Also Published As

Publication number Publication date
KR101564328B1 (en) 2015-10-29

Similar Documents

Publication Publication Date Title
Karimzadeh et al. Carboxymethylcellulose/MOF-5/Graphene oxide bio-nanocomposite as antibacterial drug nanocarrier agent
Marini et al. Preparation and antibacterial activity of hybrid materials containing quaternary ammonium salts via sol–gel process
US6084040A (en) Scratch-resistant conductive coatings
US20180055975A1 (en) Method for Producing a Dispersion Containing Silver Nanoparticles and Use of a Mixture Containing Silver Nanoparticles as a Coating Agent
US11459699B2 (en) Antibacterial leather, preparation method and application thereof
US20200071541A1 (en) Tailorable surface topology for antifouling coatings
WO2007035027A1 (en) Adhesive sheet and manufacturing method thereof
US11560484B2 (en) Prevention of biofilm formation
CN104277415A (en) Long-acting antibacterial amino molding compound
US10548314B2 (en) Built-in antimicrobial plastic resins and methods for making the same
KR20150067466A (en) Antibiotic composition comprising surface-modified tetrapod ZnO and Preparation method thereof
Li et al. Waterborne polyurethane assembly multifunctional coating for hydrophobic and antibacterial fabrics
WO2015167095A1 (en) Plastic having copper-based compound deposited thereon and preparation method for same
Idumah Halloysite nanotubes assisted design of polymeric nanoarchitectures for multifarious applications–a review
Saraf et al. Polydopamine‐Enabled Biomimetic Surface Engineering of Materials: New Insights and Promising Applications
Erol et al. A new methacrylate polymer functionalized with fluoroarylketone prepared by hydrothermal method and its nanocomposites with SiO2: thermal, dielectric, and biocidal properties
WO2015141922A1 (en) Medical tube comprising copper-based compound
Porebska et al. Montmorillonite–triclosan hybrid as effective antibacterial additive with enhanced thermal stability for protection of plastic electrical components
KR100632359B1 (en) Polyurethane resin composition including polyhexamethyleneguanidine salt
US20180140749A1 (en) Medical tubes comprising copper-based compound
US10096397B2 (en) Plastic molded product comprising copper-based compound microparticles and preparation method therefor
KR20160053725A (en) The manufacturing method functionality elasticity profit masterbeach
JPS61136532A (en) Fibrous white electroconductive substance
KR101625906B1 (en) Artificial biomaterial using copper based compound
EP3154066B1 (en) Composition for forming conductive pattern and resin structure having conductive pattern

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14890473

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14890473

Country of ref document: EP

Kind code of ref document: A1