WO2015147367A1 - Heat shield cooling apparatus for ingot growing device using water-cooled tube - Google Patents
Heat shield cooling apparatus for ingot growing device using water-cooled tube Download PDFInfo
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- WO2015147367A1 WO2015147367A1 PCT/KR2014/003419 KR2014003419W WO2015147367A1 WO 2015147367 A1 WO2015147367 A1 WO 2015147367A1 KR 2014003419 W KR2014003419 W KR 2014003419W WO 2015147367 A1 WO2015147367 A1 WO 2015147367A1
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- water
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- heat shield
- shield member
- ingot
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/14—Heating of the melt or the crystallised materials
Definitions
- the present invention relates to a heat shield cooling device (heat shield) of the ingot growth apparatus using a water-cooled tube, in detail, the heat shield member is installed in the top of the crucible (hot zone) of the ingot growth apparatus in a double structure, the heat shield member By contacting the surface of the water cooling tube with the forced circulation of the cooling water to ensure that the heat shield member is cooled efficiently, the ingot pulling speed is shortened to increase the productivity (yield) significantly.
- ingot growth apparatus using Czochralski crystal growth method is a silicon ingot growth furnace (hereinafter referred to as a 'growth furnace'), for example, a crucible installed in a hot zone area.
- Solid raw materials such as polysilicon (or gallium arsenide) and impurities are introduced (supplied), heated and melted with an electrothermal heater to form a silicon melt, and then a single crystal seed is contacted with the silicon melt.
- a silicon ingot of a predetermined length and a predetermined diameter is obtained.
- a water cooling jacket may be installed around an ingot in order to efficiently radiate thermal energy radiated from a growing ingot, or a heat shield may be formed of a material having excellent cooling efficiency, or a heat shield.
- various methods and means such as mounting a cooling structure were devised, but they did not efficiently radiate the thermal energy radiated from the ingot, and most of them were not suitable for high temperature environments. Was leaking, or a number of other problems occurred.
- the ingot pulling speed is reduced by surface contacting a water cooling tube (or a water cooling jacket) through which cooling water is forced to circulate on the surface of the heat shield member installed on the crucible of the ingot growth apparatus, thereby greatly increasing productivity and yield. It is characterized by providing a heat shield member cooling device of an ingot growth apparatus using an improved water cooling tube.
- Another object of the present invention is characterized in that the heat shield member is configured in a dual structure to reduce the speed of pulling up the ingot and greatly improve productivity and yield.
- Another object of the present invention is characterized in that the heat shield member is efficiently cooled by contacting the upper surface of the heat shield member with the water cooling tube (or the water cooling jacket) through which the coolant is forcedly circulated.
- Another object of the present invention is to form a cross-sectional shape of the water cooling tube in the shape of a square, circle, ellipse, etc. in order to increase the contact area with the heat shield member, and also the shape of the contact portion of the heat shield member in contact with the water cooling tube. Characterized in that the tube shape.
- the heat shield member cooling apparatus of the ingot growth apparatus using the water cooling tube of the present invention may include a heat shield member installed on the crucible upper portion of the ingot growth apparatus, and a water cooling tube of the cooling apparatus in surface contact with the surface of the heat shield member and forced to circulate the cooling water. have.
- the heat shield member may be formed of only graphite (Graphite) having excellent heat resistance and heat conductivity, and constitutes an inner shield and an outer cover with graphite, and installs an insulator between the inner shield and the outer cover to form an ingot (S). It can also be configured to effectively release the high temperature thermal energy radiated from.
- Graphite graphite having excellent heat resistance and heat conductivity
- the insulation may be carbon felt.
- the water cooling tube of the cooling device may be installed on the lifting means of the heat shielding member to move up and down along the heat shielding member lifting means.
- the cooling device is in contact with the surface of the inner shield 41, for example, the upper surface 46 of the inner shield 41, or in the receiving groove 46a formed in the upper surface 46 of the inner shield 41; Outer circumference of the water cooling tube 21 of the circular tube structure formed with a hollow 23 to the surface contact, the circulation path 22 formed inside the water cooling tube 21 to circulate the cooling water (W), the water cooling tube 21 Fixing part 25 which protrudes to both sides, the support part 24 which is fitted and fixed to the lower end of both lifting bar 61, respectively, the connection member 26 which connects the fixing part 25 and the support part 24, both lifting bars Flow hole 67 formed in each of the longitudinal direction of the (61), the flexible pipe 50 connecting the lower and both sides of the water hole 67 and the circulation path 22, the water flow hole (67) of both lifting rods 61 Circulation pipes 34 and 38 connecting the upper portion, and the cooling means 35 and the circulation pump 36 is connected between the circulation pipes (34, 38).
- the flexible pipe may be connected to both side holes and the circulation path by a nipple.
- the circulation pipe may further include a temperature sensor for sensing the temperature of the cooling water (W) to control the cooling means.
- the cross-sectional shape of the water cooling tube may be either circular, elliptical, or square.
- the water cooling tube may further include a separator installed in each of the cooling water (W) inlet and outlet.
- the present invention comprises a heat shield member installed in the top of the crucible (Hot Zone) of the ingot growth apparatus in a double structure, and the heat shield member is cooled efficiently by contacting the surface of the heat shield member with the water cooling tube forced to circulate the cooling water ingot pulling speed Is shortened and productivity (yield) is greatly improved.
- the coolant (W) is forced to circulate by the circulation pump 36 to absorb the high heat of the inner shield 41 which is in surface contact
- the heat shield member 4 is further cooled by about 10 ⁇ 100 °C
- the ingot ( S) Productivity is greatly improved by reducing the increase time by 10 ⁇ 30%, and the overall process time including the increase time is also reduced by about 5 ⁇ 10%.
- the present invention has a simple structure, easy to manufacture, install and maintain, and can be operated at low cost.
- both ends of the connection member 26 of the water cooling tube 21 are connected to the fixing part 25 and the support part 24 by pins 27 and 28, respectively, so as to position (contact surface with the inner shield 41). There is an effect that a certain contact area with the inner shield 41 is achieved without departing.
- cooling device 20 of the present invention is installed in the heat shield member elevating means 6, there is an effect of raising or lowering together along the heat shield member 4 by the heat shield member elevating means 6.
- the cooling device 20 of the present invention is installed on the upper surface 46 of the inner shield 41 or accommodated in the receiving groove 46a, thus affecting the visibility of the diameter control device and not interfering with the growth of the ingot S. It works.
- the cooling device 20 of the present invention is located above the heat shielding member 4, the distance from the melt M is considerably spaced apart, thereby avoiding a high temperature environment. By being installed there is an effect that can prevent the contamination of the growing ingot.
- the water-cooled tube 21 of the present invention absorbs and releases heat energy radiated from the ingot S while the heat is generated by the cooling water W forced to circulate in contact with the inner shield 41 made of graphite. It is a very useful invention with the effect that the high ingot (S) cooling efficiency is greatly improved.
- FIG. 1 is a cross-sectional view of the cooling device shown as an example of the present invention.
- FIG. 2 is a cross-sectional view showing a heat shield member as an example of the present invention.
- FIG 3 is a plan cross-sectional view of the cooling device shown as an example of the present invention.
- FIG 4 is a cross-sectional view of a cooling device shown as an example of the present invention.
- FIG 5 is a cross-sectional view of the cooling water (W) circulation state of the cooling device shown as an example of the present invention.
- FIG. 6 is a cross-sectional plan view of a cooling water (W) circulation state of the cooling device according to another embodiment of the present invention.
- FIG. 7 is a cross-sectional view of a heat shield member as shown in an example of the present invention.
- FIG 8 is a cross-sectional view of the heat shield member in a raised state according to another embodiment of the present invention.
- FIG. 9 is a cross-sectional view of the water cooling tube receiving groove showing another example of the present invention.
- the ingot pulling speed is greatly shortened by surface contacting a water cooling tube through which cooling water is forced to circulate on the surface or upper surface of a heat shield installed on the crucible upper portion of the ingot growth apparatus.
- FIG. 1 is a configuration diagram of an ingot growth apparatus using a Czochralski crystal growth method as an example of the present invention.
- the crucible 1 is installed in a main chamber 2 and an upper portion of the main chamber 2.
- Figure 2 is a cross-sectional configuration of the heat shield member 4 of the present invention shown as an example, it is configured in a dual structure to effectively discharge the high temperature thermal energy radiated from the ingot (S).
- the heat shield member 4 may be formed of only graphite (Graphite) having excellent heat resistance and thermal conductivity, and constitutes an inner shield and an outer cover with graphite, and installs an insulator between the inner shield and the outer cover to form an ingot. It can also be configured to effectively release the high temperature thermal energy radiated from (S).
- Graphite graphite having excellent heat resistance and thermal conductivity
- the heat shield member 4 is formed of an inner shield 41 and an outer shield 42 made of graphite having excellent heat resistance and thermal conductivity, and the inner shield 41.
- Insulation material 43 such as carbon felt is coupled or filled between the outer cover and the outer cover 42, the high-temperature thermal energy radiated from the ingot (S) is effectively released, the ingot (S) in the upper and lower centers grow and Opening portions 44 and 45 are formed to be pulled up, and outward fixing portions 47 are formed at both sides of the upper portion, and are connected to the elevating rods 61 of the heat shield member elevating means 6 to be melted.
- the polysilicon is replenished or raised or lowered as needed.
- the heat shield member elevating means 6 includes an elevating port 31 formed on both sides of the dome chamber 3, a sealing member 32 installed in a vertical hole of the elevating port 31, and a sealing member 32.
- Lifting rod 31 coupled to move up and down, the ball bush 62 is installed on the upper end of the lifting rod 31, the ball screw 64 is fastened to the ball bush 62, the ball screw 64 And upper and lower shaft members 65 and 63 supporting the upper and lower ends of the upper and lower ends, respectively, the motor 66 fixed to the upper shaft member 65 and axially connected to the upper end of the ball screw 64, and the elevating rod 31.
- the heat shield member 4 is raised by the heat shield member elevating means 6 when melting or polysilicon is injected, and is lowered when the ingot grows.
- the water cooling tube 21 of the cooling device 20 is brought into contact with the inner shield 41 surface of the heat shield member 4, preferably the upper surface of the inner shield 41, thereby greatly improving the heat dissipation effect.
- the cooling device 20 is placed on the surface of the inner shield 41 of a circular structure, for example, the upper surface 46 of the inner shield 41, the surface contact, or indented in the upper surface 46 of the inner shield 41
- the water cooling tube 21 having a circular tube structure having a hollow 23 formed therein so as to be in surface contact with the receiving groove 46a formed therein, and a circulation path formed inside the water cooling tube 21 to allow the cooling water W to circulate.
- (22) a fixing portion (25) projecting on both sides of the outer periphery of the water cooling tube (21), a supporting portion (24) fitted and fixed to the lower end portions of both lifting rods (61), and a fixing portion (25) and a supporting portion.
- the cooling means 35 and the circulation pump 36 are connected between the flexible pipe 50 and the circulation pipes 34 and 38 connecting upper portions of the running holes 67 of both elevating rods 61, thus cooling water.
- W Since the forced circulation by the circulation pump 36 absorbs the high heat of the inner shield 41 which is in surface contact, the heat shield member 4 is further cooled by about 10 to 100 ° C., and the pulling time of the ingot S is 10 to 30. By reducing the%, productivity (yield) is greatly improved, and the overall process time including the increase time can be reduced by about 5 to 10%.
- the flexible pipe 50 may be connected to both side drains 67 and the circulation path 22 using nipples 51 and 53.
- the cooling water (W) circulation pipe 38 may further include a temperature sensor 37 for sensing the temperature of the cooling water (W) to control the cooling means (35).
- the temperature of the forced circulation cooling water W sensed by the temperature sensor 37 is input to the cooling means 35, and the cooling means 35 has a temperature value input from the temperature sensor 37 exceeding a set temperature value.
- the cooling operation is performed to maintain the water temperature of the forced cooling water (W) in the set temperature range.
- the cross-sectional shape of the water cooling tube 21 of the cooling device 20 may be configured in a circular, oval or polygonal shape as shown in Figs. 1, 4 and 7, the cross-sectional shape of the water cooling tube 21a as shown in FIG. It is preferable that the cooling efficiency is further improved by forming a rectangular shape to expand the contact area with the inner shield 41.
- FIG. 5 is a cross-sectional plan view of a state in which the cooling water (W) of the cooling device 20 is circulated
- FIG. 6 is a cross-sectional plan view of a cooling water (W) circulation state of the cooling device shown in another example of the present invention, and the cooling water (W) flows in.
- Separator plates are provided in predetermined sections of the portion (inflow portion) and the portion (outflow portion) to be discharged so that the cooling water (W) is reliably nutrientd when the water is circulated along the circulation path.
- the parts or parts constituting the cooling device 20 of the present invention have heat resistance to sufficiently withstand the ambient temperature.
- the cooling device 20 of the present invention is simple in construction, easy to manufacture, install and maintain, and can be operated at low cost.
- connection member 26 both ends of the connection member 26 are fixed parts 25 so as to achieve a reliable contact area with the inner shield 41 without departing from the position (the contact surface with the inner shield 41) of the water cooling tube 21. And pins 27 and 28 to the support 24, respectively.
- the water cooling tube 21 of the present invention cooling device 20 is placed on the inner surface of the upper surface 46 of the inner shield 41, or is accommodated in the receiving groove (46a), so that the heat shield member (4) by the lifting means It rises or falls together along the member 4, and also affects the visibility of the diameter control device during the ingot S growth and does not interfere.
- the cooling device 20 of the present invention is positioned above the heat shielding member 4, the distance from the melt M is considerably spaced apart, thereby avoiding a high temperature environment. By installing it, contamination of a growing ingot can be prevented.
- the cooling water circulation of the water cooling tube 5 and the water cooling tube 21 may be interlocked or simultaneously achieved.
- the water cooling tube 21 of the present invention is brought into contact with the inner shield 41 made of graphite (heat) is generated by the forced circulation cooling water (W), which is the effect of the absorption and release of heat energy radiated from the ingot (S) Raising the cooling efficiency of the ingot (S) is also improved.
- W forced circulation cooling water
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Abstract
The present invention relates to a heat shield cooling apparatus of an ingot growing device using a water-cooled tube, the apparatus comprising: a heat shield installed on the top of a crucible of an ingot growing device; and a water-cooled tube of a cooling apparatus which is in surface contact with the surface of the heat shield and in which a cooling water forcedly circulates, wherein the heat shield comprises: an inner shield and an outer cover which consist of graphite having excellent heat resistance and heat conductivity; and an insulation disposed between the inner shield and the outer cover, to thereby be able to efficiently emit the high-temperature heat energy radiated from the ingot (S) and reduce the ingot pulling speed such that the productivity (yield) can significantly increase.
Description
본 발명은 수냉튜브를 이용한 잉곳성장장치의 차열부재(Heat Shield) 냉각장치에 관한 것으로, 상세하게는 잉곳성장장치의 도가니 상부(Hot Zone)에 설치되는 차열부재를 이중구조로 구성하고, 차열부재 표면에 냉각수가 강제 순환되는 수냉튜브를 접촉시켜 차열부재가 효율적으로 냉각되게 함으로써 잉곳 인상속도가 단축되어 생산성(수율)이 크게 향상되도록 한 것이다.The present invention relates to a heat shield cooling device (heat shield) of the ingot growth apparatus using a water-cooled tube, in detail, the heat shield member is installed in the top of the crucible (hot zone) of the ingot growth apparatus in a double structure, the heat shield member By contacting the surface of the water cooling tube with the forced circulation of the cooling water to ensure that the heat shield member is cooled efficiently, the ingot pulling speed is shortened to increase the productivity (yield) significantly.
일반적으로 초크랄스키(Czochralski) 결정 성장법에 의한 잉곳(Ingot) 성장장치는, 실리콘 잉곳 성장로(이하 '성장로'라 함), 예컨대 핫죤(Hot Zone) 영역에 설치되는 도가니(Crucible)에 폴리 실리콘(또는 갈륨비소 등)과 불순물(Dopant) 등의 고체 원료를 투입(공급)하고 전열히터로 가열 및 용융시켜 실리콘 융액(Hot Melt)을 만든 다음, 단결정 시드(seed)를 실리콘 융액에 접촉시켜 서서히 인상시키면 소정 길이와 소정 직경의 실리콘 잉곳(Ingot)이 얻어진다.Generally, ingot growth apparatus using Czochralski crystal growth method is a silicon ingot growth furnace (hereinafter referred to as a 'growth furnace'), for example, a crucible installed in a hot zone area. Solid raw materials such as polysilicon (or gallium arsenide) and impurities are introduced (supplied), heated and melted with an electrothermal heater to form a silicon melt, and then a single crystal seed is contacted with the silicon melt. When it is pulled up gradually, a silicon ingot of a predetermined length and a predetermined diameter is obtained.
상기 실리콘 잉곳의 성장 공정을 살펴보면, 폴리 실리콘과 도펀트(Dopant)를 석영 도가니에 충전하는 스택킹(Stacking) → 성장로를 고진공으로 유지하는 진공(Vacuum) → 폴리 실리콘을 용융시키는 멜팅(Melting) → 멜트에 시드를 접촉시키는 딥핑(Dipping) → 결함이 발생하지 않도록 직경을 최대한 줄이면서 인상시키는 넥킹(Necking) → 잉곳의 직경을 성장시키는 숄더링(Shouldering) → 잉곳의 길이를 성장시키는 바디 그로스(Body Growth) → 잉곳의 직경을 감소시키는 테일링(Tailing) → 잉곳을 냉각시키는 쿨링(Cool Down) 등의 여러 공정을 거쳐 실리콘 잉곳(Ingot)이 성장된다.Looking at the growth process of the silicon ingot, stacking (filling) of polysilicon and dopant in a quartz crucible → vacuum (vacuum) to maintain the growth furnace at high vacuum → melting (melting) of polysilicon → Dipping the seed into contact with the melt → Necking to raise the diameter while reducing the diameter to avoid defects → Shouldering to grow the diameter of the ingot → Body gross to grow the length of the ingot Growth Ingot is grown through various processes such as tailing to reduce the diameter of the ingot and cooling down to cool the ingot.
한편, 초크랄스키(Czochralski) 결정 성장법으로 실리콘 단결정을 성장시킬 때 성장하는 잉곳의 냉각속도를 향상시킴으로써 생산성을 높이고 수율을 안정시키고자 하는 많은 시도가 있었다.On the other hand, there have been many attempts to increase the productivity and stabilize the yield by improving the cooling rate of the growing ingot when growing silicon single crystal by Czochralski crystal growth method.
예컨대, 성장 중인 잉곳으로 부터 복사되는 열에너지를 효율적으로 방출시키는 방법에 몰두하여 수냉자켓을 잉곳 주변에 설치하거나, 냉각효율이 우수한 재질로 차열부재(Heat Shield)를 구성하거나, 또는 차열부재(Heat Shield)에 냉각 구조물을 장착시키는 등의 다양한 방법이나 수단을 안출하였으나, 잉곳으로 부터 복사되는 열에너지를 효율적으로 방출시키지 못하기는 마찬가지 였으며, 대부분 고온 환경에 적합하지 않는 방법들이어서 오히려 잉곳이 오염되거나 냉각수가 누출되거나, 기타 여러 문제들이 발생하는 문제점이 있었다.For example, a water cooling jacket may be installed around an ingot in order to efficiently radiate thermal energy radiated from a growing ingot, or a heat shield may be formed of a material having excellent cooling efficiency, or a heat shield. However, various methods and means such as mounting a cooling structure were devised, but they did not efficiently radiate the thermal energy radiated from the ingot, and most of them were not suitable for high temperature environments. Was leaking, or a number of other problems occurred.
본 발명은, 잉곳성장장치의 도가니 상부에 설치되는 차열부재 표면에 냉각수가 강제 순환되는 수냉튜브(또는 수냉각 자켓)을 면접촉시켜 차열부재 냉각되도록 함으로써 잉곳 인상속도가 단축되어 생산성과 수율이 크게 향상되는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치를 제공함에 특징이 있다.According to the present invention, the ingot pulling speed is reduced by surface contacting a water cooling tube (or a water cooling jacket) through which cooling water is forced to circulate on the surface of the heat shield member installed on the crucible of the ingot growth apparatus, thereby greatly increasing productivity and yield. It is characterized by providing a heat shield member cooling device of an ingot growth apparatus using an improved water cooling tube.
본 발명의 다른 목적은 차열부재를 이중구조로 구성하여 잉곳 인상속도가 단축되고 생산성과 수율이 크게 향상되도록 함을 특징으로 한다. Another object of the present invention is characterized in that the heat shield member is configured in a dual structure to reduce the speed of pulling up the ingot and greatly improve productivity and yield.
본 발명의 다른 목적은 차열부재의 상부면에 냉각수가 강제 순환되는 수냉튜브(또는 수냉각 자켓)을 면접촉시켜 차열부재 효율적으로 냉각되도록 함을 특징으로 한다.Another object of the present invention is characterized in that the heat shield member is efficiently cooled by contacting the upper surface of the heat shield member with the water cooling tube (or the water cooling jacket) through which the coolant is forcedly circulated.
본 발명의 또 다른 목적은 차열부재와의 접촉면적을 크게 하기 위하여 수냉튜브의 단면 형상을 사각, 원, 타원, 기타의 모양으로 형성할 수 있으며 수냉튜브와 접촉되는 차열부재의 접촉 부분 형상도 수냉 튜브 모양에 맞게 형성함을 특징으로 한다.Another object of the present invention is to form a cross-sectional shape of the water cooling tube in the shape of a square, circle, ellipse, etc. in order to increase the contact area with the heat shield member, and also the shape of the contact portion of the heat shield member in contact with the water cooling tube. Characterized in that the tube shape.
본 발명 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치는, 잉곳성장장치의 도가니 상부에 설치되는 차열부재, 상기 차열부재 표면에 면접촉되고 냉각수가 강제 순환되는 냉각장치의 수냉튜브를 포함할 수 있다.The heat shield member cooling apparatus of the ingot growth apparatus using the water cooling tube of the present invention may include a heat shield member installed on the crucible upper portion of the ingot growth apparatus, and a water cooling tube of the cooling apparatus in surface contact with the surface of the heat shield member and forced to circulate the cooling water. have.
상기 차열부재는, 내열성과 열전도 특성이 우수한 그라파이트(Graphite) 만으로 형성될 수 있으며, 그라파이트(Graphite)로 인너쉴드 및 외부 커버를 구성하고, 인너쉴드와 외부 커버 사이에 단열재를 설치하여 잉곳(S)으로 부터 복사되는 고온의 열에너지를 효과적으로 방출시킬 수 있도록 구성할 수도 있다.The heat shield member may be formed of only graphite (Graphite) having excellent heat resistance and heat conductivity, and constitutes an inner shield and an outer cover with graphite, and installs an insulator between the inner shield and the outer cover to form an ingot (S). It can also be configured to effectively release the high temperature thermal energy radiated from.
상기 단열재는 카본펠트 일 수 있다.The insulation may be carbon felt.
상기 냉각 장치의 수냉튜브는, 차열부재의 승강 수단에 설치되어 차열부재 승강수단을 따라 승강하도록 구성할 수 있다.The water cooling tube of the cooling device may be installed on the lifting means of the heat shielding member to move up and down along the heat shielding member lifting means.
상기 냉각장치는, 인너쉴드(41)의 표면, 이를테면 인너쉴드(41)의 상부면(46)에 얹혀 면접촉되거나, 인너쉴드(41)의 상부면(46)에 형성된 수용홈(46a)에 면접촉하도록 중공(23)이 형성된 원형관 구조의 수냉튜브(21), 냉각수(W)가 순환할 수 있도록 수냉튜브(21) 내부에 형성되는 순환로(22), 수냉튜브(21)의 외주연 양측으로 돌출되는 고정부(25), 양측 승강봉(61)의 하단부에 각각 끼워져 고정되는 지지부(24), 고정부(25)와 지지부(24)를 연결하는 연결부재(26), 양측 승강봉(61)의 길이방향 내부에 각각 형성되는 유수공(67), 양측 유수공(67) 하부와 순환로(22)를 각각 연결하는 플렉시블관(50), 양측 승강봉(61)의 유수공(67) 상부를 연결하는 순환관(34)(38), 순환관(34)(38) 사이에 연결되는 냉각수단(35)과 순환펌프(36)를 포함할 수 있다.The cooling device is in contact with the surface of the inner shield 41, for example, the upper surface 46 of the inner shield 41, or in the receiving groove 46a formed in the upper surface 46 of the inner shield 41; Outer circumference of the water cooling tube 21 of the circular tube structure formed with a hollow 23 to the surface contact, the circulation path 22 formed inside the water cooling tube 21 to circulate the cooling water (W), the water cooling tube 21 Fixing part 25 which protrudes to both sides, the support part 24 which is fitted and fixed to the lower end of both lifting bar 61, respectively, the connection member 26 which connects the fixing part 25 and the support part 24, both lifting bars Flow hole 67 formed in each of the longitudinal direction of the (61), the flexible pipe 50 connecting the lower and both sides of the water hole 67 and the circulation path 22, the water flow hole (67) of both lifting rods 61 Circulation pipes 34 and 38 connecting the upper portion, and the cooling means 35 and the circulation pump 36 is connected between the circulation pipes (34, 38).
상기 플렉시블관은 니플에 의해 양측 유수공과 순환로에 연결될 수 있다.The flexible pipe may be connected to both side holes and the circulation path by a nipple.
상기 순환관에 냉각수(W)의 온도를 감지하여 냉각수단이 제어되게 하는 온도센서를 더 포함할 수 있다.The circulation pipe may further include a temperature sensor for sensing the temperature of the cooling water (W) to control the cooling means.
상기 수냉튜브의 단면 형상은 원형이거나 타원형이거나, 사각형 중 어느 하나일 수 있다.The cross-sectional shape of the water cooling tube may be either circular, elliptical, or square.
상기 수냉튜브의 냉각수(W) 유입부분과 유출부분에 각각 설치되는 격리판을 더 포함할 수 있다.The water cooling tube may further include a separator installed in each of the cooling water (W) inlet and outlet.
본 발명은 잉곳성장장치의 도가니 상부(Hot Zone)에 설치되는 차열부재를 이중구조로 구성하고, 차열부재 표면에 냉각수가 강제 순환되는 수냉튜브를 접촉시켜 차열부재가 효율적으로 냉각되게 함으로써 잉곳 인상속도가 단축되어 생산성(수율)이 크게 향상되는 효과가 있다.The present invention comprises a heat shield member installed in the top of the crucible (Hot Zone) of the ingot growth apparatus in a double structure, and the heat shield member is cooled efficiently by contacting the surface of the heat shield member with the water cooling tube forced to circulate the cooling water ingot pulling speed Is shortened and productivity (yield) is greatly improved.
본 발명은 냉각수(W)가 순환펌프(36)에 의해 강제순환되면서 면접촉하고 있는 인너쉴드(41)의 고열을 흡수하게 되므로 차열부재(4)가 10~100℃ 정도 더 냉각되며, 잉곳(S) 인상시간을 10~30% 줄일 수 있어서 생산성이 크게 향상되며, 인상시간을 포함한 전체 공정 시간 또한 약 5~10% 단축시킬 수 있는 효과가 있다.In the present invention, since the coolant (W) is forced to circulate by the circulation pump 36 to absorb the high heat of the inner shield 41 which is in surface contact, the heat shield member 4 is further cooled by about 10 ~ 100 ℃, the ingot ( S) Productivity is greatly improved by reducing the increase time by 10 ~ 30%, and the overall process time including the increase time is also reduced by about 5 ~ 10%.
본 발명은 구성이 간단하여 제작과 설치 및 유지보수 용이하고, 저렴한 비용으로 운용할 수 있는 효과가 있다.The present invention has a simple structure, easy to manufacture, install and maintain, and can be operated at low cost.
본 발명은 수냉튜브(21)의 연결부재(26) 양단이 고정부(25)와 지지부(24)에 핀(27)(28)으로 각각 연결되어 있어서 위치(인너쉴드(41)와의 접촉면)를 이탈하지 않으면서 인너쉴드(41)와의 확실한 접촉면적이 달성되는 효과가 있다.In the present invention, both ends of the connection member 26 of the water cooling tube 21 are connected to the fixing part 25 and the support part 24 by pins 27 and 28, respectively, so as to position (contact surface with the inner shield 41). There is an effect that a certain contact area with the inner shield 41 is achieved without departing.
본 발명 냉각장치(20)는 차열부재 승강수단(6)에 설치되므로 차열부재 승강수단(6)에 의해 차열부재(4)를 따라 같이 상승하거나 하강하는 효과가 있다.Since the cooling device 20 of the present invention is installed in the heat shield member elevating means 6, there is an effect of raising or lowering together along the heat shield member 4 by the heat shield member elevating means 6.
본 발명 냉각장치(20)는 인너쉴드(41) 상부면(46)에 얹혀 설치되거나 수용홈(46a)에 수용 설치되므로 잉곳(S) 성장시 직경 제어장치의 시야 확보에 영향을 주고 간섭하지 않는 효과가 있다.The cooling device 20 of the present invention is installed on the upper surface 46 of the inner shield 41 or accommodated in the receiving groove 46a, thus affecting the visibility of the diameter control device and not interfering with the growth of the ingot S. It works.
본 발명 냉각장치(20)는 차열부재(4) 상부에 위치하므로 멜트(M)와의 거리가 상당히 이격되어 있어서 고온환경을 피할 수 있고, 이에 따라 누수가능성이 거의 없으며, 수냉관(5) 바깥쪽에 설치됨으로써 성장하는 잉곳의 오염을 방지할 수 있는 효과가 있다.Since the cooling device 20 of the present invention is located above the heat shielding member 4, the distance from the melt M is considerably spaced apart, thereby avoiding a high temperature environment. By being installed there is an effect that can prevent the contamination of the growing ingot.
본 발명 수냉튜브(21)는 그라파이트(graphite)로 제작되는 인너쉴드(41)에 접촉되어 강제 순환하는 냉각수(W)에 의해 열방출이 일어나면서 잉곳(S)으로부터 복사되는 열에너지의 흡수 및 방출 효과가 높아 잉곳(S) 냉각 효율이 크게 향상되는 등의 효과가 있는 매우 유용한 발명이다.The water-cooled tube 21 of the present invention absorbs and releases heat energy radiated from the ingot S while the heat is generated by the cooling water W forced to circulate in contact with the inner shield 41 made of graphite. It is a very useful invention with the effect that the high ingot (S) cooling efficiency is greatly improved.
도 1 : 본 발명 일 예로 도시한 냉각장치의 단면 구성도.1 is a cross-sectional view of the cooling device shown as an example of the present invention.
도 2 : 본 발명 일 예로 도시한 차열부재 단면도.2 is a cross-sectional view showing a heat shield member as an example of the present invention.
도 3 : 본 발명 일 예로 도시한 냉각장치의 평단면도.3 is a plan cross-sectional view of the cooling device shown as an example of the present invention.
도 4 : 본 발명 일 예로 도시한 냉각장치의 횡단면도.4 is a cross-sectional view of a cooling device shown as an example of the present invention.
도 5 : 본 발명 일 예로 도시한 냉각장치의 냉각수(W) 순환 상태 평단면도.5 is a cross-sectional view of the cooling water (W) circulation state of the cooling device shown as an example of the present invention.
도 6 : 본 발명 다른 예로 도시한 냉각장치의 냉각수(W) 순환 상태 평단면도.6 is a cross-sectional plan view of a cooling water (W) circulation state of the cooling device according to another embodiment of the present invention.
도 7 : 본 발명 일 예로 도시한 차열부재 상승 상태 단면도.7 is a cross-sectional view of a heat shield member as shown in an example of the present invention.
도 8 : 본 발명 다른 예로 도시한 차열부재 상승 상태 단면도.8 is a cross-sectional view of the heat shield member in a raised state according to another embodiment of the present invention.
도 9 : 본 발명 다른 예로 도시한 수냉튜브 수용홈 단면도.9 is a cross-sectional view of the water cooling tube receiving groove showing another example of the present invention.
<부호의 설명><Description of the code>
(1)--도가니 (2)--메인챔버(1)-Crude (2)-Main Chamber
(3)--돔챔버 (4)--차열부재(3)-dome chamber (4)-heat shield
(5)--수냉관 (6)--차열부재 승강수단(5)-water cooling pipes (6)-heat shield member lifting means
(7)--전열히터 (8)--열쉴드(7)-Electric Heater (8)-Heat Shield
(9)--도가니 받침대 (10)--페데스탈(9) --The Crucible Pedestal (10)-Pedestal
(11)--구동축 (12)--구동수단(11)-drive shaft (12)-drive means
(13)--배기관 (14)--필터(13)-Exhaust Pipe (14)-Filter
(15)--진공펌프 (20)--냉각장치(15)-vacuum pump (20)-chiller
(21)(21a)--수냉튜브 (22)--순환로(21) (21a)-Water cooling tube (22)-Circulation furnace
(24)--지지부 (25)(47)--고정부(24)-support (25) (47)-government
(26)--연결부재 (27)(28)--핀(26)-connection member (27) (28)-pin
(31)--승강포트 (32)--실링부재(31)-lifting port (32)-sealing member
(34)(38)--순환관 (35)--냉각수단(34) (38)-Circulation tube (35)-Cooling means
(36)--순환펌프 (37)--온도센서(36)-Circulation pump (37)-Temperature sensor
(41)--인너쉴드 (42)--외부 커버(41)-Inner Shield (42)-Outer Cover
(43)--단열재 (44)(45)--개방부(43)-Insulation (44) (45)-Open
(46)--상부면 (46a)--수용홈(46)-Top Side (46a)-Receiving Groove
(48)--체결부재 (50)--플렉시블관(48)-Tightening member (50)-Flexible tube
(51)(53)--니플 (61)--승강봉(51) (53)-Nipple (61)-Heel Bar
(62)--볼부쉬 (64)--볼스크류(62)-Ballbush (64)-Ballscrew
(65)(63)--축부재 (66)--모터(65) (63)-Shaft Member (66)-Motor
(67)--유수공 (M)--멜트(67)-Water well (M)-Melt
(S)--잉곳 (W)--냉각수(S)-Ingot (W)-Coolant
이하, 본 발명의 바람직한 실시 예들을 첨부한 도면에 따라 상세히 설명하고자 한다. 본 발명의 실시 예들을 설명함에 있어 도면들 중 동일한 구성 요소들은 가능한 한 동일 부호로 기재하고, 관련된 공지구성이나 기능에 대한 구체적인 설명은 본 발명의 요지가 모호해지지 않도록 생략하며, 또한, 첨부된 도면에 표현된 사항들은 본 발명의 실시 예들을 쉽게 설명하기 위해 도식화된 도면으로 실제로 구현되는 형태와 상이할 수 있다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the embodiments of the present invention, the same components are denoted by the same reference numerals as much as possible, and detailed descriptions of related well-known structures and functions will be omitted so as not to obscure the subject matter of the present invention. The matters expressed in the following may be different from the form actually embodied in the schematic diagram for easily explaining the embodiments of the present invention.
본 발명은, 잉곳성장장치의 도가니 상부에 설치되는 차열부재(Heat Shield)의 표면이나 상부면에 냉각수가 강제 순환되는 수냉튜브를 면접촉시켜 차열부재가 냉각되도록 함으로써 잉곳 인상속도가 크게 단축된다.According to the present invention, the ingot pulling speed is greatly shortened by surface contacting a water cooling tube through which cooling water is forced to circulate on the surface or upper surface of a heat shield installed on the crucible upper portion of the ingot growth apparatus.
도 1은 본 발명 일 예로 도시한 초크랄스키(Czochralski) 결정 성장법에 의한 잉곳성장장치의 구성도로, 도가니(1)가 내부에 설치되는 메인챔버(2)와, 메인챔버(2) 상부에 설치되는 돔챔버(3)와, 돔챔버(3) 상부에 설치되는 풀챔버(도시안됨)와, 돔챔버(3)와 풀챔버를 상하로 이동시키는 승강수단(6)과, 실리콘 잉곳을 적정 속도로 인상시키는 인상수단(도시안됨)과, 도가니(1) 상부의 핫죤(Hot Zone)에 설치되는 차열부재(4) 및 수냉관(5)과, 차열부재(4)를 승강 이동시키는 차열부재 승강수단(6)과, 도가니(1) 바깥에 빙둘러 설치되는 전열히터(7)와, 전열히터(7) 바깥에 설치되는 열쉴드(8)와, 도가니 받침대(9) 저부에 설치되는 페데스탈(Pedestal)(10)과 구동축(11) 및 구동수단(12)과, 메인챔버(2) 하부의 배기관(13)에 설치되는 필터(14)와 진공펌프(15) 및 전원부와, 냉각장치와 제어기 등으로 구성되며, 본 발명에서는 내열성과 열전도 특성이 우수한 그라파이터(Graphite)를 이용하여 차열부재(4)를 이중구조로 구성함으로써 잉곳(S)으로 부터 복사되는 고온의 열에너지가 효과적으로 방출되며, 차열부재(4) 표면에 냉각수가 강제 순환되는 냉각장치(20)의 수냉튜브(21)를 설치하여 차열부재(4)가 보다 효율적으로 냉각되도록 함으로써 잉곳(S) 인상속도가 크게 단축되고 생산성(수율) 또한 크게 향상된다.FIG. 1 is a configuration diagram of an ingot growth apparatus using a Czochralski crystal growth method as an example of the present invention. The crucible 1 is installed in a main chamber 2 and an upper portion of the main chamber 2. The dome chamber (3) to be installed, the full chamber (not shown) installed above the dome chamber (3), the elevating means (6) for moving the dome chamber (3) and the full chamber up and down, and the silicon ingot Impression means (not shown) for pulling up at a speed, a heat shield member 4 and a water cooling tube 5 installed in a hot zone above the crucible 1, and a heat shield member for moving the heat shield member 4 up and down. Lifting means (6), heat transfer heater (7) installed in the outside of the crucible (1), heat shield (8) installed outside the heat transfer heater (7), pedestal installed on the bottom of the crucible pedestal (9) (Pedestal) 10, the drive shaft 11 and the drive means 12, the filter 14, the vacuum pump 15, the power supply unit, and the cooling unit installed in the exhaust pipe 13 below the main chamber (2) My In the present invention, by using a graphite (Graphite) excellent heat resistance and thermal conductivity properties in the present invention by configuring the heat shield member 4 in a double structure, the high temperature heat energy radiated from the ingot (S) is effectively released, By installing the water cooling tube 21 of the cooling device 20 in which the coolant is forced to circulate on the surface of the heat shield member 4, the heat shield member 4 is cooled more efficiently, and thus the pulling speed of the ingot S is greatly shortened and the productivity ( Yield) is also greatly improved.
도 2는 일 예로 도시한 본 발명 차열부재(4)의 단면 구성도로, 잉곳(S)으로 부터 복사되는 고온의 열에너지를 효과적으로 방출시킬 수 있도록 이중구조로 구성된다. Figure 2 is a cross-sectional configuration of the heat shield member 4 of the present invention shown as an example, it is configured in a dual structure to effectively discharge the high temperature thermal energy radiated from the ingot (S).
상기 차열부재(4)는, 내열성과 열전도 특성이 우수한 그라파이트(Graphite) 만으로 형성될 수 있으며, 그라파이트(Graphite)로 인너쉴드 및 외부 커버를 구성하고, 인너쉴드와 외부 커버 사이에 단열재를 설치하여 잉곳(S)으로 부터 복사되는 고온의 열에너지를 효과적으로 방출시킬 수 있도록 구성할 수도 있다.The heat shield member 4 may be formed of only graphite (Graphite) having excellent heat resistance and thermal conductivity, and constitutes an inner shield and an outer cover with graphite, and installs an insulator between the inner shield and the outer cover to form an ingot. It can also be configured to effectively release the high temperature thermal energy radiated from (S).
또한 상기 차열부재(4)는, 내열성과 열전도 특성이 우수한 그라파이터(Graphite)로 인너쉴드(inner shield)(41)와 외부 커버(outer shield)(42)가 구성되고, 상기 인너쉴드(41)와 외부 커버(42) 사이에 단열재(43), 이를테면 카본펠트가 결합되거나 충진된 구성으로, 잉곳(S)으로 부터 복사되는 고온의 열에너지가 효과적으로 방출되며, 상하부 중앙에는 잉곳(S)이 성장 및 인상될 수 있도록 개방부(44)(45)가 각각 형성되고, 상부 양측에는 외향 고정부(47)가 구성되어 차열부재 승강수단(6)의 승강봉(61)에 연결되어 멜팅(Melting)이나 폴리 실리콘을 보충하거나 필요에 의해 상승 또는 하강하게 된다. In addition, the heat shield member 4 is formed of an inner shield 41 and an outer shield 42 made of graphite having excellent heat resistance and thermal conductivity, and the inner shield 41. Insulation material 43, such as carbon felt is coupled or filled between the outer cover and the outer cover 42, the high-temperature thermal energy radiated from the ingot (S) is effectively released, the ingot (S) in the upper and lower centers grow and Opening portions 44 and 45 are formed to be pulled up, and outward fixing portions 47 are formed at both sides of the upper portion, and are connected to the elevating rods 61 of the heat shield member elevating means 6 to be melted. The polysilicon is replenished or raised or lowered as needed.
상기 차열부재 승강수단(6)은, 돔챔버(3) 양측 상부에 구성되는 승강포트(31)와, 승강포트(31)의 수직공에 설치되는 실링부재(32)와, 실링부재(32)에 승강 이동할 수 있도록 결합되는 승강봉(31)과, 승강봉(31)의 상단부에 설치되는 볼부쉬(62)와, 볼부쉬(62)에 체결되는 볼스크류(64)와, 볼스크류(64)의 상하단부를 각각 지지하는 상하부 축부재(65)(63)와, 상부 축부재(65)에 고정되고, 볼스크류(64)의 상단부에 축연결되는 모터(66)와, 승강봉(31) 하단부에 체결부재(48)로 고정되는 차열부재(5)의 고정부(47)로 구성되어 모터(66)의 정회전 또는 역회전 상태에 따라 볼스크류(64)가 정/역 회전하면 승강봉(31) 또한 상승 또는 하강하게 되므로, 승강봉(31) 하단부에 고정된 차열부재(4) 또한 상승 또는 하강 이동하게된다. 상기 상하부 축부재(65)(63)는 승강포트(31)의 상부면 또는 돔챔버(3) 일단에 고정되며, 실링부재(32)는 챔버 내부의 기밀(진공)을 유지하면서 승강봉(31)의 승강 이동을 안내하게 된다. The heat shield member elevating means 6 includes an elevating port 31 formed on both sides of the dome chamber 3, a sealing member 32 installed in a vertical hole of the elevating port 31, and a sealing member 32. Lifting rod 31 coupled to move up and down, the ball bush 62 is installed on the upper end of the lifting rod 31, the ball screw 64 is fastened to the ball bush 62, the ball screw 64 And upper and lower shaft members 65 and 63 supporting the upper and lower ends of the upper and lower ends, respectively, the motor 66 fixed to the upper shaft member 65 and axially connected to the upper end of the ball screw 64, and the elevating rod 31. It is composed of the fixing part 47 of the heat shield member 5 fixed to the lower end by the fastening member 48, the lifting rod when the ball screw 64 is rotated forward / reverse according to the forward or reverse rotation state of the motor 66 Since 31 is also raised or lowered, the heat shield member 4 fixed to the lower end of the elevating rod 31 is also moved up or down. The upper and lower shaft members 65 and 63 are fixed to the upper surface of the lifting port 31 or one end of the dome chamber 3, and the sealing member 32 maintains the airtightness (vacuum) inside the chamber. Will guide the lifting movement.
상기 차열부재(4)는 멜팅(Melting)이나 폴리실리콘을 투입할 때 차열부재 승강수단(6)에 의해 상승하게 되며, 잉곳이 성장할 때에는 하강하게 된다.The heat shield member 4 is raised by the heat shield member elevating means 6 when melting or polysilicon is injected, and is lowered when the ingot grows.
본 발명은 차열부재(4)의 인너쉴드(41) 표면, 바람직하게는 인너쉴드(41)의 상부면에 냉각장치(20)의 수냉튜브(21)가 접촉시켜 열방출 효과가 크게 향상된다.According to the present invention, the water cooling tube 21 of the cooling device 20 is brought into contact with the inner shield 41 surface of the heat shield member 4, preferably the upper surface of the inner shield 41, thereby greatly improving the heat dissipation effect.
상기 냉각장치(20)는, 원형구조의 인너쉴드(41) 표면, 예컨대 인너쉴드(41)의 상부면(46)에 얹혀 면접촉되거나, 또는 인너쉴드(41)의 상부면(46)에 요입 형성된 수용홈(46a)에 수용되어 면접촉될 수 있도록 중공(23)이 형성된 원형관 구조의 수냉튜브(21)와, 냉각수(W)가 순환할 수 있도록 수냉튜브(21) 내부에 형성되는 순환로(22)와, 수냉튜브(21)의 외주연 양측으로 돌출되는 고정부(25)와, 양측 승강봉(61)의 하단부에 각각 끼워져 고정되는 지지부(24)와, 고정부(25)와 지지부(24)를 연결하는 연결부재(26)와, 양측 승강봉(61)의 길이방향 내부에 각각 형성되는 유수공(67)과, 양측 유수공(67) 하부와 순환로(22)를 각각 연결하는 플렉시블관(50)과, 양측 승강봉(61)의 유수공(67) 상부를 연결하는 순환관(34)(38) 사이에는 냉각수단(35)과 순환펌프(36)가 연결되며, 따라서 냉각수(W)가 순환펌프(36)에 의해 강제순환되면서 면접촉하고 있는 인너쉴드(41)의 고열을 흡수하게 되므로 차열부재(4)가 10~100℃ 정도 더 냉각되며, 잉곳(S) 인상시간을 10~30% 줄일 수 있어서 생산성(수율)이 크게 향상되며, 인상시간을 포함한 전체 공정 시간 또한 약 5~10% 단축시킬 수 있게 된다.The cooling device 20 is placed on the surface of the inner shield 41 of a circular structure, for example, the upper surface 46 of the inner shield 41, the surface contact, or indented in the upper surface 46 of the inner shield 41 The water cooling tube 21 having a circular tube structure having a hollow 23 formed therein so as to be in surface contact with the receiving groove 46a formed therein, and a circulation path formed inside the water cooling tube 21 to allow the cooling water W to circulate. (22), a fixing portion (25) projecting on both sides of the outer periphery of the water cooling tube (21), a supporting portion (24) fitted and fixed to the lower end portions of both lifting rods (61), and a fixing portion (25) and a supporting portion. A connecting member 26 for connecting the 24, and a water hole 67 formed in each of the longitudinal direction of the elevating rods 61, and connecting the lower side of the both water holes 67 and the circulation path 22, respectively The cooling means 35 and the circulation pump 36 are connected between the flexible pipe 50 and the circulation pipes 34 and 38 connecting upper portions of the running holes 67 of both elevating rods 61, thus cooling water. (W) Since the forced circulation by the circulation pump 36 absorbs the high heat of the inner shield 41 which is in surface contact, the heat shield member 4 is further cooled by about 10 to 100 ° C., and the pulling time of the ingot S is 10 to 30. By reducing the%, productivity (yield) is greatly improved, and the overall process time including the increase time can be reduced by about 5 to 10%.
상기 플렉시블관(50)은 니플(51)(53)을 이용하여 양측 유수공(67)과 순환로(22)에 연결될 수 있다.The flexible pipe 50 may be connected to both side drains 67 and the circulation path 22 using nipples 51 and 53.
상기 냉각수(W) 순환관(38)에는 냉각수(W)의 온도를 감지하여 냉각수단(35)이 제어되게 하는 온도센서(37)를 더 포함할 수 있다.The cooling water (W) circulation pipe 38 may further include a temperature sensor 37 for sensing the temperature of the cooling water (W) to control the cooling means (35).
상기 온도센서(37)에 의해 감지된 강제 순환 냉각수(W)의 온도는 냉각수단(35)으로 입력되며, 냉각수단(35)은 온도센서(37)로부터 입력되는 온도값이 설정된 온도값을 초과하는 경우 냉각 동작하면서 강제 냉각수(W)의 수온을 설정온도 범위로 유지하게 된다.The temperature of the forced circulation cooling water W sensed by the temperature sensor 37 is input to the cooling means 35, and the cooling means 35 has a temperature value input from the temperature sensor 37 exceeding a set temperature value. When the cooling operation is performed to maintain the water temperature of the forced cooling water (W) in the set temperature range.
상기 냉각장치(20)의 수냉튜브(21)의 단면 형상은 도 1, 도 4, 도 7과 같이 원형이나 타원형이나 다각형 등으로 구성할 수 있으며, 도 8과 같이 수냉튜브(21a)의 단면 형상을 사각형상으로 구성하여 인너쉴드(41)와의 접촉면적을 확장함으로써 냉각효율이 보다 향상시키도록 함이 바람직하다.The cross-sectional shape of the water cooling tube 21 of the cooling device 20 may be configured in a circular, oval or polygonal shape as shown in Figs. 1, 4 and 7, the cross-sectional shape of the water cooling tube 21a as shown in FIG. It is preferable that the cooling efficiency is further improved by forming a rectangular shape to expand the contact area with the inner shield 41.
상기 냉각장치(20)의 수냉튜브(21)의 단면 형상이 원형, 타원형 다각형 등인 경우, 도 9에 예시한 바와 같이 수냉튜브(21)가 접촉하는 차열부재(4)의 상부면(46)에 같은 형상의 수용홈(46a)을 형성하여 수용되게 함으로써 인너쉴드(41)와의 접촉면적이 확장되어 냉각효율이 보다 향상된다.When the cross-sectional shape of the water cooling tube 21 of the cooling device 20 is circular, elliptical, polygonal or the like, as illustrated in FIG. 9, the upper surface 46 of the heat shield member 4 to which the water cooling tube 21 is in contact By forming the receiving groove 46a having the same shape and being accommodated, the contact area with the inner shield 41 is expanded to further improve the cooling efficiency.
도 5는 냉각장치(20)의 냉각수(W)가 순환하는 상태의 평단면도이고, 도 6은 본 발명 다른 예로 도시한 냉각장치의 냉각수(W) 순환 상태 평단면도로, 냉각수(W)가 유입되는 부분(유입부분)과 유출되는 부분(유출부분)의 소정 구간에 격리판을 각각 설치하여 냉각수(W)가 순환로를 따라 양분 순환될 때, 보다 확실하게 양분되도록 구성한 것이다.5 is a cross-sectional plan view of a state in which the cooling water (W) of the cooling device 20 is circulated, and FIG. 6 is a cross-sectional plan view of a cooling water (W) circulation state of the cooling device shown in another example of the present invention, and the cooling water (W) flows in. Separator plates are provided in predetermined sections of the portion (inflow portion) and the portion (outflow portion) to be discharged so that the cooling water (W) is reliably nutrientd when the water is circulated along the circulation path.
본 발명의 냉각장치(20)를 구성하는 부품이나 부분품들은 주변온도에 충분히 견딜수 있도록 내열성을 가진다.The parts or parts constituting the cooling device 20 of the present invention have heat resistance to sufficiently withstand the ambient temperature.
본 발명의 냉각장치(20)를 구성이 간단하여 제작과 설치 및 유지보수 용이하고, 저렴한 비용으로 운용할 수 있다. The cooling device 20 of the present invention is simple in construction, easy to manufacture, install and maintain, and can be operated at low cost.
본 발명에서 수냉튜브(21)가 위치(인너쉴드(41)와의 접촉면)를 이탈하지 않으면서 인너쉴드(41)와의 확실한 접촉면적을 달성하기 위하여 연결부재(26)의 양단은 고정부(25)와 지지부(24)에 핀(27)(28)으로 각각 연결될 수 있다.In the present invention, both ends of the connection member 26 are fixed parts 25 so as to achieve a reliable contact area with the inner shield 41 without departing from the position (the contact surface with the inner shield 41) of the water cooling tube 21. And pins 27 and 28 to the support 24, respectively.
본 발명 냉각장치(20)의 수냉튜브(21)는 인너쉴드(41) 상부면(46)에 얹혀 면접촉하거나, 수용홈(46a)에 수용되어 설치되므로 차열부재(4) 승강수단에 의해 차열부재(4)를 따라 같이 상승하거나 하강하게 되며, 또한 잉곳(S) 성장시 직경 제어장치의 시야 확보에 영향을 주고 간섭하지 않는다.The water cooling tube 21 of the present invention cooling device 20 is placed on the inner surface of the upper surface 46 of the inner shield 41, or is accommodated in the receiving groove (46a), so that the heat shield member (4) by the lifting means It rises or falls together along the member 4, and also affects the visibility of the diameter control device during the ingot S growth and does not interfere.
본 발명 냉각장치(20)는 차열부재(4) 상부에 위치하므로 멜트(M)와의 거리가 상당히 이격되어 있어서 고온환경을 피할 수 있고, 이에 따라 누수가능성이 거의없으며, 수냉관(5) 바깥쪽에 설치됨으로써 성장하는 잉곳의 오염을 방지할 수 있다.Since the cooling device 20 of the present invention is positioned above the heat shielding member 4, the distance from the melt M is considerably spaced apart, thereby avoiding a high temperature environment. By installing it, contamination of a growing ingot can be prevented.
본 발명에서 수냉관(5)과 수냉튜브(21)의 냉각수 순환을 연동, 또는 동시에 달성할 수 있다.In the present invention, the cooling water circulation of the water cooling tube 5 and the water cooling tube 21 may be interlocked or simultaneously achieved.
본 발명 수냉튜브(21)는 그라파이트(graphite)로 제작되는 인너쉴드(41)에 접촉하게 됨으로써 강제 순환 냉각수(W)에 의해 열방출이 일어나고 이는 잉곳(S)으로부터 복사되는 열에너지의 흡수 및 방출 효과를 높여 잉곳(S)의 냉각 효율도 향상된다.The water cooling tube 21 of the present invention is brought into contact with the inner shield 41 made of graphite (heat) is generated by the forced circulation cooling water (W), which is the effect of the absorption and release of heat energy radiated from the ingot (S) Raising the cooling efficiency of the ingot (S) is also improved.
이상과 같이 설명한 본 발명은 본 실시 예 및 첨부된 도면에 한정되는 것이 아니고, 본 발명의 기술적 사상을 벗어나지 않는 범위 내에서 여러 가지 치환, 변형 및 변경이 가능하며, 이는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 자명한 것이다.The present invention described above is not limited to the present embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention, and this is in the technical field to which the present invention belongs. It is self-evident for those of ordinary knowledge.
Claims (8)
- 잉곳성장장치의 도가니 상부에 설치되는 차열부재;A heat shield member installed above the crucible of the ingot growth apparatus;상기 차열부재 표면에 면접촉되고 냉각수가 강제 순환되는 냉각장치의 수냉튜브;A water cooling tube of the cooling apparatus in surface contact with the surface of the heat shielding member and forcibly circulating cooling water;를 포함하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.Heat shield member cooling device of the ingot growth apparatus using a water cooling tube comprising a.
- 청구항 1에 있어서:The method of claim 1:차열부재는,The heat shield member,내열성과 열전도 특성이 우수한 그라파이터(Graphite)로 인너쉴드와 외부 커버를 구성하고, 상기 인너쉴드와 외부 커버 사이에 단열재를 설치하여 잉곳(S)으로 부터 복사되는 고온의 열에너지를 효과적으로 방출시킬 수 있도록 함을 특징으로 하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.The inner shield and the outer cover are composed of graphite having excellent heat resistance and thermal conductivity, and an insulating material is installed between the inner shield and the outer cover to effectively discharge high-temperature heat energy radiated from the ingot S. Cooling member cooling device of the ingot growth apparatus using a water-cooled tube characterized in that.
- 청구항 2에 있어서:The method of claim 2 wherein:상기 단열재는 카본펠트 임을 특징으로 하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.The heat insulating member cooling device of the ingot growth apparatus using a water cooling tube, characterized in that the carbon felt.
- 청구항 1 또는 청구항 2에 있어서:The method according to claim 1 or 2, wherein:냉각장치의 수냉튜브는,The water cooling tube of the chiller,차열부재의 인너쉴드에 설치되어 차열부재 승강수단을 따라 승강하도록 함을 특징으로 하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.The heat shield member cooling device of the ingot growth apparatus using a water-cooled tube, characterized in that installed in the inner shield of the heat shield member to move up and down along the heat shield member lifting means.
- 청구항 1 또는 청구항 2에 있어서:The method according to claim 1 or 2, wherein:냉각장치는, Chiller,인너쉴드(41) 표면에 면접촉되도록 중공(23)이 형성된 원형관 구조의 수냉튜브(21);A water-cooled tube 21 having a circular tube structure in which a hollow 23 is formed to be in surface contact with the inner shield 41 surface;냉각수(W)가 순환할 수 있도록 수냉튜브(21) 내부에 형성되는 순환로(22);A circulation path 22 formed inside the water cooling tube 21 to allow the cooling water W to circulate;수냉튜브(21)의 외주연 양측으로 돌출되는 고정부(25);Fixing portion 25 protruding to both sides of the outer periphery of the water cooling tube 21;양측 승강봉(61)의 하단부에 각각 끼워져 고정되는 지지부(24);Support portions 24 are fitted to each of the lower end of the elevating bar (61) fixed;고정부(25)와 지지부(24)를 연결하는 연결부재(26);A connection member 26 connecting the fixing part 25 and the support part 24;양측 승강봉(61)의 길이방향 내부에 각각 형성되는 유수공(67);Flowing water holes 67 respectively formed in the longitudinal direction of both lifting bars 61;양측 유수공(67) 하부와 순환로(22)를 각각 연결하는 플렉시블관(50);Flexible pipes (50) connecting the lower both sides of the water hole (67) and the circulation path (22), respectively;양측 승강봉(61)의 유수공(67) 상부를 연결하는 순환관(34)(38);Circulation pipes 34 and 38 connecting upper portions of the flowing holes 67 of both elevating rods 61;순환관(34)(38) 사이에 연결되는 냉각수단(35)과 순환펌프(36);A cooling means 35 and a circulation pump 36 connected between the circulation pipes 34 and 38;를 포함하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.Heat shield member cooling device of the ingot growth apparatus using a water cooling tube comprising a.
- 청구항 5에 있어서:The method of claim 5:순환관에 냉각수(W)의 온도를 감지하여 냉각수단이 제어되게 하는 온도센서;A temperature sensor which senses the temperature of the cooling water W in the circulation pipe so that the cooling means is controlled;를 더 포함하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.Heat shield member cooling device of the ingot growth apparatus using a water cooling tube further comprising.
- 청구항 5에 있어서:The method of claim 5:수냉튜브의 단면 형상은 원형이거나 타원형이거나, 사각형 중 어느 하나임을 특징으로 하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.The cross-sectional shape of the water cooling tube is circular, elliptical, the heat shield member cooling device of the ingot growth apparatus using a water cooling tube, characterized in that any one.
- 청구항 5에 있어서:The method of claim 5:수냉튜브의 냉각수(W) 유입부분과 유출부분에 각각 설치되는 격리판;Separators are respectively installed in the inlet and outlet of the cooling water (W) of the water cooling tube;을 더 포함하는 수냉튜브를 이용한 잉곳성장장치의 차열부재 냉각장치.Heat shield member cooling device of the ingot growth apparatus using a water cooling tube further comprising.
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KR102043317B1 (en) * | 2018-06-14 | 2019-11-12 | (주)에스테크 | Elevating type cooling apparatus for silicon single crystal and silicon single crystal growth apparatus including the same |
CN114753110B (en) * | 2022-03-25 | 2023-09-08 | 安徽省宁国市天成科技发展有限公司 | Electric heating device |
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