WO2015143031A1 - Casque d'entrainement neurophysiologique - Google Patents

Casque d'entrainement neurophysiologique Download PDF

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Publication number
WO2015143031A1
WO2015143031A1 PCT/US2015/021248 US2015021248W WO2015143031A1 WO 2015143031 A1 WO2015143031 A1 WO 2015143031A1 US 2015021248 W US2015021248 W US 2015021248W WO 2015143031 A1 WO2015143031 A1 WO 2015143031A1
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WO
WIPO (PCT)
Prior art keywords
aperture
sensor
tension
mount
plate
Prior art date
Application number
PCT/US2015/021248
Other languages
English (en)
Inventor
Austin Miller
Dale DALKE
Daniel P. DOOLEY
Original Assignee
Neurotopia, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/218,560 external-priority patent/US20150182165A1/en
Application filed by Neurotopia, Inc. filed Critical Neurotopia, Inc.
Publication of WO2015143031A1 publication Critical patent/WO2015143031A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/04—Arrangements of multiple sensors of the same type
    • A61B2562/046—Arrangements of multiple sensors of the same type in a matrix array
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes

Definitions

  • the present invention relates to the field of sensors. More particularly; the present invention relates to neurophys ological training headsets for use in collecting brainwave data from subjects, and most, particularly to a
  • neurophysiologies training headset providing a continuously active tensioning mechanism.
  • a neurophysiologieaJ training headset includes at least a plurality of sensor assemblies each sensor assembly secured by a retention web. Each of the plurality of sensor assemblies are positioned in contact adjacent at a predetermined location about a cranium of a subject
  • the preferred neurophysiologies! training headset further includes a headphone secured to the retention web by an aitachnient member, in which the attachment member provides a continuously active tensioning mechanism.
  • the continuously active tensioning .mechanism promotes continuous force induced contact adjacency of each of the sensor assemblies with the cranium of the subject.
  • FIG. 1 is a top plan view of an. embodiment, exemplary of the inventive sensor probe assembly.
  • FIG. 2 is a view in elevation of an embodiment exemplary a conductive pin of the inventive sensor probe assembly of FIG. 1 .
  • FIG. 3 is a front side view in elevation of an embodiment exemplary of the
  • FIG, 4 is a front side view in elevation of an embodiment exemplary of the
  • inventive sensor probe assembly illustrative of a flexible, electrically conductive pin securement member and associated plurality of electrically conductive pins matted thereto, of an embodiment exemplary of the inventive sensor probe assembly of FIG. L
  • FIG. 5 is a top plan view of an alternate embodiment exemplary of the inventive sensor probe assembly
  • FIG, 6 is a vie w in front elevation of an alternate embodiment exemplary of an electrically conductive pin of the inventive sensor probe assembly of FIG.
  • FIG, 7 is a front, side view in elevation of an altemate embodiment exempiary of the inventive sensor probe assembly of FIG. 5.
  • FIG. 8 is a front side view in elevation of an alternate embodiment exemplary of the inventive sensor probe assembly illustrative of a . flexible, electrically conductive pin securement. member and associated plurality of electrically conductive pins matted thereto, of an embodiment exemplary of the inventive sensor probe assembly of FIG. 5.
  • FIG. is a front elevation view of an. embodiment exemplary of an electrically conductive pin of FIG. 6, showing a head portion, a tip portion, and a body portion disposed there between.
  • FIG, 10 is a front elevation vie w of an embodiment exemplar of an electrically conductive pin of FIG. 2, showing a head portion having a convex, shape, a tip portion, and a body portion disposed there between.
  • FIG, 11 is a front elevation view of an alternate embodiment exemplary of an electricall conductive pin of FIG, 2, showing a head portion, having a concave shape, a tip portion, and a body portion disposed there between
  • FIG, 12 is a front, elevation view of an embodiment exemplar of an. electrically conductive pin of FIG. 2» showing a head portion having a substantially flat top surface, a tip portion, and. a body portion disposed there between.
  • FIG. 13 is a partial cutaway front elevation view of an alternate tip configuration for any of the electrically conductive pins of FIGS. 9, 10, 1 1 , or 12 *
  • FIG. 14 is a cross-section, . partial cutaway front elevation view of an alternate tip configuration for any of the electrically conductive pins of FIGS. 9, .10, .1 .1 , or 12.
  • FIG, ⁇ 5 is a partial cutaway front elevation view of an alternative tip configuration for any of the electrically conductive pins of FIGS. 9, 10, 11 , or 12.
  • FIG. 1 is a partiai cutaway front elevation, view of an aiieniaie tip configuration for any of the electrically conductive pins of FIGS. 9, 10, 1 1 , or 12.
  • FIG. 17 is a flowchart of a method of producing an embodiment exemplary of the inventive sensor probe assembly of either FIG. 1. or FIG. 5.
  • FIG. 18 is a front elevation view in cross section of an embodiment exemplary of the present novel sensor assembly.
  • FIG. 19 is a bottom plan view of the novel sensor assembly of FIG. 18.
  • FIG. 20 is a front elevation view exploded view in cross section of the novel sensor assembly of FIG. 18.
  • FIG, 2.1 is a front elevation view in cross section of an. alternate embodiment
  • FIG. 22 is a side elevatio view in cross section of the alternate embodiment
  • FIG. 23 is a side elevation view in cross section of the alternate embodiment
  • FIG. 21 exemplary of the present novel sensor assembly of FIG. 21 , communicating with a brainwave processing system.
  • FIG, 24 is a schematic of a preferred signal, processing circui t of the embodiment exemplary of the present novel sensor assembly of either FIGS. 18, 21, or
  • FIG. 25 is flowchart of a method of using an embodiment exemplary of the
  • inventive sensor assembly of either FIGS, 18, 2.1 , or 23.
  • FIG. 26 is a cross section exploded view in elevation of an embodiment of a novel capacitance probe sensor assembly of the present invention.
  • FIG, 27 is a cross section view in elevation of the embodiment of the novel capacitance probe sensor assembly of FIG. 26.
  • FIG, 28 is a cross section partial exploded view in elevation of an alternate embodiment of a novo! capacitance probe sensor assembly of the present invent ion.
  • FIG. 29 is a cross section view in elevation of the embodiment of the novel capacitance probe sensor assembly of FIG. 28,
  • FIG, 30 is a partial exploded vie of an alternative embodiment, of a novel capacitance probe of the present invention.
  • FIG, 31 is a further cross section, partial exploded view in elevation of an
  • FIG. 32 is a cross section view in elevation of the embodiment of the novel capacitance probe sensor assembly of FIG. 3.1 ,
  • FIG. 33 is a cross section, partial exploded view of an alternate alternative
  • FIG. 34 is a cross section view in elevation of the embodiment of the novel capacitance probe sensor assembly of FIG. 33,
  • FIG. 35 is a cross section exploded front elevation view of a different alternate embodiment of the present capacitance probe sensor assembl in vention.
  • FIG. 36 is a parti l cutaway, cross section, front elevation view of the different al ternate embodiment of the present capacitance probe sensor assembly invention of FIG . 38,.
  • FIG. 37 is a side elevation view of a unique embodiment of a dry sensor system, which accommodates resistive as we l as capacitance sensing probes and includes a .retention web and supports a set of headphones.
  • FIG, 38 is a view in eleva tion, of an embodiment exemplary of novel
  • FIG, 3.9 is a view in elevation of a frame assembly of a retention web of the neiirophyskdogical training headset of FIG, 38.
  • FIG. 40 is a side view in el evation of the neurophysiologies! training headset of
  • FIG. 38, FIG, 4.1 is a side view in elevation, of a tension housing of the neurophysioiogieal training headset of FIG. 40.
  • FIG, 42 is a top plan view of of a cover plate of the tension housing of the
  • FIG. 43 is a bottom lan view of of an access cover of the tension .housing of the the neurophysioiogieal training headset of FIG. 38.
  • FIG, 44 is a top plan view of a shape retention member of art attachment .member of the the neurophysioiogieal training headset of FIG . 40,
  • FIG, 45 is a side perspective view of the shape retention member of FIG. 44, nested in a shape retention channel of the frame assembly of FIG. 39.
  • FIG. 46 i s a side perspective view of a mounting ' flange of the frame assembly of
  • FIG 39 is a diagrammatic representation of FIG 39.
  • FIG. 47 is a side view a guide plate of the tension housing of FIG. 41
  • FIG, 48 is a side view of a slide plate of a slide structure of FIG. 40.
  • FIG. 49 is a top pla view of the neurophysioiogieal tra ining headset of FIG. 40.
  • FIG, 50 is a top plan view of a sensor of the plurality of sensors of the
  • FIG. 51 is an alternate top plan view of a sensor of the plurality of sensors of the neurophysioiogieal training headset of FIG, 40.
  • FIG, 52 is an. additional, alternate top plan view of a sensor of the plurality of sensors of the .neurophysioiogieal training headset of FIG. 40.
  • FIG. 53 is a top plan, view of a mounting apertures for a sensor of the plurality of sensors of the neurophysioiogieal training headset of FIG. 40.
  • FIG. 54 is a top plan view of a sensor seeurenient cap for one of the plurality of sensors of the neurophysioiogieal training headset of FIG. 40.
  • FIG. 55 is a top plan view of a pliabie compliant member, which cooperates with sensor secu.rem.en t cap of FIG. 55 to provide six degrees of freedom for each of the plurality of sensors of the neurophysioiogieal training headset of FIG, 40.
  • FIG. 56 shows a functional block diagram of a .neurophysioiogieal training sysieni, constructed in accordance with various embodiments disclosed and claimed herein. etailed Description
  • a sensor probe assembly 10 of FIG. 1 (also referred to herein as assembly 10) of a first preferred embodiment, while useable for wide variety of bio-physiological sensing applications, it is particularly adapted for use as neurophysiologies! signal sensor component.
  • the assembly 10 of the first preferred embodiment, of FIG. 1 will be described in conjunction with the merits of the use of the sensor probe assembly 10 as a .neurophysiological signal sensor component.
  • the se nsor probe assembly 10 includes at least a conductive pin securement member 12, which hosts a plurality of conductive pins 14.
  • the plurality of conductive pins 14 are electrically conductive, and when in pressing contact with the conductive pin securement member 12, as shown by FIG. 3, form the sensor probe assembly 10 that yields a low impedance neurophysiological signal sensor component.
  • the conductive pins 14, include at least a head portion 16, a tip portion 18, and a body portion 20 disposed between the head portion 16 and the tip -portion 1 .
  • each, conductive pin 14 is formed from a .non-corrosive material, such as stainless steel, titanium, bronze, or a gold plating on a rigid substrate selected from a group including at least polymers and metals.
  • the head portion 16 has a diamete greater than the diameter of the body portion 20.
  • the conductive pin securement member 12 is preferably flexible and formed from a polymer.
  • the electrical conductivity of the conductive pin. securement member 12 is preferably attained by the inclusion of conductive particles embedded within the polymer.
  • conductive particles embedded within the polymer.
  • One such, combination is a carbon filed silicon sheet material provided by Stockweil Elastomeries, inc. of Philadelphia, Pennsyl vania,
  • conductive polymers may be formed from a plurality of polymer materials filled with conductive particles, the shape of which may be formed using well known manuiacturing techniques that include at least molding, extrusion dies and sliced to thickness. formed in sheets and: die cut; cut with hot wire equipment; high pressure water jets, or steel rule dies.
  • FIG. 5 shows an alternate embodiment of a sensor probe assembly 22, which is preferably formed from the conductive pin securernent member 12, and a plurality of alternate preferred conductive pins 24.
  • each alternate preferred conductive pin 24 includes a head portion 26, a tip portion 28, and a body portion 30, wherein the head portion 26 and the tip portion 28 have diameters substantially equal to the body portion 30.
  • conductive pins may have head, tip and body portion diameters different from one another.
  • the body portion may have a diameter greater than either the tip portion or head portion to accommodate insert molding of the conductive pins into a conductive pin securement member, it is further understood that the conductive pins may take on a profile that includes a bend in the body, tip, or head portion s, as opposed to the cylindrical configuration of any suitable cross section geometric shape of the conductive pins shown by FiG, 2 and
  • the conductive pins may be formed by a plurality of individual components, including without limitation a spring, or may be formed from a coded or other form of spring alone.
  • the alternate preferred conductive pins 24 are formed from a .non-corrosive material, such as stainless steel, titanium, bronze, or a precious metal plating on a rigid substrate selected from a group including at least polymers and metals,
  • FIG. 7 shows the conductive pins 24 protruding through each the top and bottom surfaces, 32 and 34 respectfully, to accommodate improved conducti ity of the alternate sensor probe assembly 22, with mating components
  • FIG. 8 shows thai the alternate sensor probe assembly 22 preferably retains the flexibility characteristics of sensor probe assembly 1 0 of FIG. 4,
  • FIGS, 9, .10, .1 .1 , and 12 show just, a few of a plurality of head
  • conductive pins suitable for use on conductive pins.
  • the particular configuration selected is a function of the device or component with which the conductive pins electrically cooperate.
  • a connector is used to interface with the sensor probe assembly, such as 10 or 22, the precise configuration will depend on the type and configuration of the pins associated with the connector, including . ' whether the pins are male or female pins.
  • FIGS 13* 14 (a cross section view), 15, and 16 show just a few of a plurality of tip configurations suitable for use on conductive pins.
  • the particular configuration selected is a function of the materials used to form the conductive pins, and the environment in which the conductive pin will be placed. Examples of the use environment include where on the cranium the sensor will be placed, whether hair is present, and the sensitivity of the subject to the dps of the
  • FIG. 17 shows a method 100, of making a sensor probe assembly; such as 1.0 o 22.
  • the method begins at start step 102, and proceeds to process step .104. where a flexible conductive pin securement material is provided (also referred to ' herein as a flexible, electrically conductive, polymer substrate).
  • a flexible, electrically conductive, pin securement member (such as 12) is formed from, the flexible, electrically conductive, polymer substrate.
  • a plurality of electrically conductive pins (such as 14) is provided.
  • each of the plurality of electrically conductive pins are affixed to the flexible, electrically conductive, pin securement member, and the process concludes at end process step 1 12 with the formation of a sensor probe assembly.
  • the sensor assembly 200 includes at least a sensor probe assembly .10, which provides a plurality of conductive pins 1 , and a compressible electrically conductive member 202, in electrical communication with the sensor probe assembly.
  • the compressible electrically conductive member 202 in electrical communication with the sensor probe assembly.
  • conducti ve member 202 is formed from a polyurefhane polymer filled with conducti ve particles, which are preferably carbon particles.
  • conducti ve particles which are preferably carbon particles.
  • One such combination is a low density black conductive Polyurethane open ceil flexible conductive foam material pro vided by Correct Products, inc. of Richardson, Texas.
  • conductive polymers may be ' formed from a plurality of polymer materials filled with conductive particles, the shape of which may be formed using well known manufacturing techniques that include at least molding, extrusion dies and sliced to thickness, formed in sheets and: die cut; cat with hoi wire equipment; high pressure water jets, or steel rule dies.
  • the embodiment of the novel, inventive, sensor assembly 200 includes at least a signal processing circuit 204, in electrical communication with the compressible electrically conductive member 202, and. a housing 206, confining the sensor probe assembly 10, the compressible electrically conductive member 202, and the signal processin circuit 204, to ' form the sensor assembly 200.
  • FIG. 19 shows the prefeired embodiment of the sensor assembly 200 to be of a continuous curvilinear configuration, however, those skilled in the aits will recognize that any geometric shape ma be presented by the sensor assembly 200.
  • the sensor probe assembly 1.0 is confined by the housing 206 in such a manner that the sensor probe assembly 10, can be replaced without the disassembly of the entire sensor assembly 200.
  • the sensor assembly 200 of FIG. 20 reveals a rigid conductive member 20S, and a plurality of standoffs 210, disposed between the signal processing circuit 204, and the electrically conductive member 202 (shown in its decompressed form).
  • the rigid conductive member 208 is in electrical interaction with a signal, conductor 2.12, and the signal conductor 2.12 is in
  • the housing 206, of FIG 18, preferably includes a component chamber 214, and a confinement cover 2.16
  • the component chamber 2.14 preferably includes a confinement cover retention feature 218. which interacts with a retention, member 220 of the confinement cover 21.6,
  • the confinement cover 236 "snaps" onto the component: chambe 214.
  • the component chamber 214 and the confinement cover 21 are formed from a shape retaining material that provides sufficient flexibility to allow the retention member 220 of the confinement cover 216 to pass by the confinement cover retention feature 21 8 of the component chamber 214, and then lock together the confinement cover 216 with the component chamber 214.
  • a shape retaining material that provides sufficient flexibility to allow the retention member 220 of the confinement cover 216 to pass by the confinement cover retention feature 21 8 of the component chamber 214, and then lock together the confinement cover 216 with the component chamber 214.
  • the confi ement cover 216 further includes at least a signal processing circuit retention feature 222 and a connector pi 224 supported by the signal processing circuit retention feature 222, while the component chamber 21.4 further include at least: a sensor probe assembly retention feature 226; a side wall 228 disposed between the confinement cover retention feature 218 and the sensor probe assembly retention feature 226: and a holding feature 230 provided by the side wall 228 and adjacent in the confinement cover retention feature 218.
  • the senor assembly 200 In the preferred embodiment of the sensor assembly 200, the
  • the compressible electrically conductive member 202 promotes an ability to change out the sensor probe assembly 10, without disturbing the interaction of the signal, processing circuit 204 and the rigid conductive member 208, or to change out the processing circuit. 204 and the rigid conductive member 208 without disturbing the sensor probe assembly 10.
  • the compressible electrically conductive member 202 explains to interact with the sensor probe assembly retention feature 226 thus maintaining the rigid conducti ve number 208 in pressing contact with standoffs 210.
  • the compressible electrically conductive member 202 explains to interact with the holding feature 230 to preclude the inadvertent removal, of the sensor probe assembly 10 from, communication with the sensor probes assembly retention feature 226.
  • the sensor probe assembly 10 As will, be recognized by skilled artisans, it is the collaborative effect of the pin or pins 14 of the sensor probe assembly 10 interacting with the cranium of the subject that promotes transference of brainwave signals of the subject to the signal processing circui t 204. To promote the conveyance of the brainwave signal, the sensor probe assembly 10 further provides a conductive pin seeurement member 12 cooperating in retention contact with the plurality of conductive pins 14,.
  • FIG 2.1 shows an alternate preferred embodiment of a novel, inventive, standalone sensor assembly 300.
  • the standalone sensor assembly 300 includes at least an electrically conducti e member 302 forming a first plate 304 of a capacitor 306, a dielectric material 308, adjacent the first plate 304, a second plate 310 of the capacitor 306 communicating with, the dielectric material 308, and a si nal processing circuit 312 in electrical communication with said dielectric material 308.
  • FIG, 21 further shows a housing 314 confining the first plate 304 of the capacitor 306, the dielectric material. 308, the second plate 31.0, arid the signal, processing circuit 3.12 to form the standalone sensor assembly 300.
  • FIG. 22 shows the standalone sensor assembly 300 further includes a communication port 31.6, useful for " transferring processed signals to an ex ernal, system for analysis, and that the housing 31.4 preferably includes a component chamber 318, and a confinement cover 320.
  • the component chamber 318 preferably includes a confinement cover retention feature 322, which interacts with a retention member 324 of the confinement cover 320.
  • the confinement cover 320 "snaps" onto the component chamber 31 .
  • the component chamber 18 and the confinement cover 320 are formed -from a shape retaining material, that provides sufficient flexibility to allow the retention member 324 of the confinement cover 320 to pass by the confinement cover retention feature 322 of the component chamber 318, and then lock together the confinement cover 320 with the component chamber 3.18.
  • a shape retaining material that provides sufficient flexibility to allow the retention member 324 of the confinement cover 320 to pass by the confinement cover retention feature 322 of the component chamber 318, and then lock together the confinement cover 320 with the component chamber 3.18.
  • the electrically conductive member 302 forming the first plate 304 of the capacitor 306 includes at least, but is not limited, to, a plurality of at least partially insulated pins 326, communicating with a conductive member 328, wherein, the conductive member is in direct, contact adjacency with the dielectric material 308 * in operation, the voltage potential is present between the first plate 304 and the second plate 310, which results in a charge build up, and it is the level of the charge build up that is processed by the signal processing circuit 3.12.
  • the plurality of at least partially insulated pins 326 each preferably have four degrees of freedom i.e.: yaw; pitch; roll; and z axis. The multiple degrees of freedom accommodates the topography differences in. the cranium of different subjects, to promote a subject, adaptable., alternate preferred embodiment of the novel, inventive, standalone sensor assembly 300.
  • FIG. 23 shows an alternative preferred embodiment of the novel, inventive, standalone sensor assembly 330, having a plurality of alternate conductive pins 332; however, the remaining components are substantially equal to the
  • a brainwave processing system 334 which may be, for example, an
  • Electroencephalography (EEG) 334 Electroencephalography (EEG) 334.
  • a preferred embodiment of the signal processing circuit 204 includes at. least, but is not limited to, a printed circuit member 400, and a processor 402, interacting with said printed circuit member 400, the processor recei ing signals from a sensor probe assembly, such as 200 of FIG. I 8, and eomm.umcaii.ng the signals to a brainwave processing system, such as 334 of .FIG. 23.
  • the preferred embodiment of the signal, processing circuit 204 further includes at least, but is not limited to, a differential amplifier 404, interacting with. the printed circuit .member 400, a reference signal 406 communicating with the differential amplifier 404, and a subject signal 408 provided by a sensor probe assembly, such as 200 of FIG. 1.8, when the sensor probe assembly 200 is in electrical contact with a cranium of a subject.
  • the differential amplifier 404 compares the reference signal 406 to the subject signal 408 and discards common signal patterns presented by said reference and subject signals, 404 and
  • the preferred, embodiment of the signal, processing circuit 204 includes at least, but is not limited to, an analog to digital converter with a digital signal processing core 412, interacting with, the differential amplifier 404 and processing the native brainwave signal 410, provided by the differential amplifier 404, and outputting a digital signal representative of the native brainwave signal, and an infinite impulse response filter 4.14, interacting with the analog to digital converter 41 , to serve as a band pass filter for said, digital signal,
  • the preferred embodiment of the signal processing circuit 204 shown in FIG, 24, includes at least, but is not limited to, a memory 41 , also referred to herein, as a buffer 416, communicating wiih ihe processor 402, and storing processed native brainwave signals, and a communication port 41 8 coimnunicating with the buffer 416, the communication port is preferably responsive to the processor 402 for communicating processed native brainwave signals to the brainwave processing system 334.
  • a memory 41 also referred to herein, as a buffer 416, communicating wiih ihe processor 402, and storing processed native brainwave signals
  • a communication port 41 8 coimnunicating with the buffer 416 the communication port is preferably responsive to the processor 402 for communicating processed native brainwave signals to the brainwave processing system 334.
  • FIG. 25 shows a method 500, of using a. signal processing circuit- such as 400, of FIG. 24, The method begins at start step 502, and proceeds to process step 504, where a brainwave reference signal (such as 406) of a subject is provided. At process step 506, a raw brainwave signal (such as 408) of the subject is captured. At process step 508, the signal profiles of the reference and raw brainwave signals are compared, and signal profiles common to both are removed, and at. process step 510, a native brainwave signa 1 (such as 10) is produced from the result of the removal of signal profiles common to both the reference and raw brain wave signals.
  • a brainwave reference signal such as 406
  • a raw brainwave signal such as 408
  • process step 512 where the native brainwave signal is converted to a digi tal band of frequency si gnal, and passed to an. IIR ban pass filter (such as 4 4) at process step 51 ,.
  • IIR ban pass filter such as 4 4
  • process step 516 an. absolute value of the digitized signal received from the i .R filter is determined by a processor
  • th IIR filter is programmable and responsive to the processor, and that multiple OR filters may be employed to capture a mul titude of discrete ban frequencies (typically having about a 5H2 spread, such as 1 to 1511z out of a signal having a frequency range of about 0.5Hz to 451 Iz) ), or the programmable IIR. filter may be programed to collect a certain, number of discrete, common frequency band samples, each sample obtained over a predetermined amount of time, and then reprogramed to obtain a number of different, discrete, common frequency band samples.
  • process step 518 the processor determines i f predetermined number of samples of the absolute value each discrete band frequency of interest, has been stored in a buffer (such as 416). If the number of captured desired samples has -not been met, the process reverts to process step 504, if the number of captured, desired samples has been met, the process proceeds to process step 520.
  • the processor determines an equivalent !RMS (root .mean square) value for each of the plurality of discrete band frequency, absolute value sets of sanipi.es, and those values are provided to a brainwave processing, system (such as 334) at process step 522.
  • a brainwave processing, system such as 33
  • the rigid conductive member 208 is in electrical Interaction with a signal conductor 212
  • the signal conductor 212 is in electrical communication wi th the signal processing circuit 204
  • These standoffs 210 are preferabl attached to the signal processing circuit 204, and function to provide a slight compressive load on the compressible compliance member 602.
  • the compressive load allows for decompression of the compressible compliance .member 602 while a sensor probe assembly 604 is being exchanged. This particular feature promotes stability of the rest of components within the housing 206, when the sensor probe assembly is absent from the remaining components of the sensor assembly 600,
  • the housing 206 preferably includes the component chamber 214, and the confinement cover 216.
  • the component chamber 214 preferably includes the confinement cover retention feature. 218 , which interacts with the retenti on member 220 of the confinement cover 216.
  • the confinement co ver 21 "'snaps" onto the component chamber 214,
  • the component chamber 214 and the confinement cover 216 are formed from, a shape retaining material that provides sufficient flexibility to allow the retention member 220 of the
  • confinement cover 216 to pass by the confinement cover retention feature 218 of the component chamber 214. and then lock together the confinement cover 2 6 with the component, chamber 214,
  • engineering materials suitable for this purpose including, but not limited to, metals, polymers, carbon fiber materials, and laminates.
  • the confinement cover 216 further includes at least the signal processing circuit, retention feature 222 and the connector pin 224 supported by the signal processing circuit retention feature 222, while the component chamber 2.14 further includes at least: the sensor probe assembly retention feature 226; the side wall 228 disposed between the confinement cover retention feature 218 and the sensor probe assembly retention feature 226; and the holding feature 230 provided by the aide wall 228 and adjacent the confinement, cover retention feature .218.
  • compressibility of the compressible compliance member 602 promotes an ability to change out the sensor probe assembly 604, without disturbing the interaction of the signal processing circuit 204 and the rigid conductive member 208, or to change out the processing circuit 204 and the rigid conductive member 208 without disturbing the sensor probe assembly 10.
  • the compressible compliance member 602 explains to interact with the sensor probe assembly retention feature 226 thus maintaining the rigid conductive number 208 In pressing contact with standoffs 21 .
  • the compressible compliance member 602 explains to interact with the holding feature 230 to preclude the inad vertent removal of the sensor probe assembly 604 from communication with the sensor probes assembly reten tion fea ture 226,
  • the sensor probe 604 is a capacitance sensor probe formed by at least a first conductive member, which in the present embodiment is a plurality of conductive pins 14; a conductive pin seeuremeut member 12 cooperating in retention, contact with the plurality of conductive pins 14; a dielectric materia l 606 In pressing contact with the plurality of conductive pins 14; and a second conducti ve member, which in the present embodiment is a rnetailie foil 608, in pressing contact with the dielectric material 606.
  • the plurality of conductive pins 14. form a first plate of a capacitor 610, wh le the conductive foil 608 forms a second plate of capacitor 6 ⁇ 0.
  • FIG 2? sh ws that the sensor probe assembly 61 , with the first conductive member (the plurality of conductive pins 14) of the capacitance sensor probe 604, is in electrical contact with a cranium 612 (shown in partial cutaway) of a subject, i this embodiment configuration, the brain waves of the subject- are conducted by the conductive pins 14 to the dielectric material 606.
  • FIG. 28 shows an alternate configuration of the capacitance sensor probe 604, which features dielectric material 614, which preferably coats the body portion 20 of each of the plurality of conductive pins 14 coating.
  • the dielectric material 614 is in electrical contact with the cranium 612 of the subject, making the cranium 612 the second plate of the capacitance sensor probe 604, and the collective heads 1 of the plurality of conductive pins 14 the first plate of the capacitor 610,
  • FIG 29 shows that the sensor assembly 600 with the first conductive member (the plurality of conductive pins 14 ⁇ of the capacitance sensor probe 604 is in electrical contact with a cranium 612 (shown in partial cutaway) of a subject, in this embodiment configuration, the brain waves of the subject are conducted by the conductive pins 14 to the dielectric material 606,
  • FIG 30 shows an alternate configuration of the capacitance sensor probe 604, which features dielectric material 61 , which preferabl coats the head portion .1 , and the bod portion 20 of each of the plurali ty of cond ucti ve pins 14 coating, leaving the tip portion. 18 uncoated, as shown by FIG 35.
  • the dielectric material 616 is in electrical contact with the metallic foil 608, making the combination of the cranium 612 and the tips 1 S of the plurality of conductive pins 14 the second plate of the capacitance sensor probe 604, and the metallic foil 608 the first plate of the capacitor 61.0.
  • a second metallic foil 618 in combination with conductive pins 14 and the metallic foi l 608 forms the first plate of the capacitor 610
  • the cranium 612 of the subject forms the second plate of the capacitor 610
  • FIGS. 35 and. 36 provide an lternate alternative preferred embodiment of a capacitance sensor assembly 620, which includes a capacitance probe assembly 622, communicating with the signal processing circuit 204.
  • the capacitance probe assembly 622 includes a first conductor 624 in direct electrical contact with a dielectric material 626, and a second conductor 628 in direct electrical contact with the dielectric material 626.
  • the capacitance probe assembly 622 further preferably includes a capacitance probe shield 630, which, provides a plurality of vent apertures 632 that assist in modulating the thermal en vironment surrounding a capacitance signal processing circuit 634.
  • FIG 36 shows the capacitance sensor assembly 620 preferably passes signals between the signal processing circuit 204 and the capacitance signal processing, circuit 634, as well as through a communication port. 316, useful for transferring processed signals to a brainwave processing system (such as 334 of FIG 24 ⁇ for analysis.
  • a component chamber 636 provides a plurality of attachment tangs 638 used to secure the capacitance probe assembly 622 .firmly positioned within the component chamber 636 of the capacitance sensor assembly 620, as shown by FIG 36.
  • the capacitance probe assembly 622 is offset from the signal processing circuit 204 by a compressible member 640. and communicates with the signal processing circuit 204 via an electrical connection assembly 642 of FIG 36,
  • FIG 37 shows a prefetred configuration of an in ventive standalone neurophysioiogic performance measurement and training system 720.
  • 720 which preferably includes at least four sensor assemblies 722, (wherein 720 is selected from sensor assemblies 200, 300, 330, 600, or 620) supported by a sensor assembly retention web 724, a preferred brainwave processing system 726 that includes a multi-channel user interface 728 electrically interacting with an electronic device 730, which is preferably a portable computing and communication device, and a ground reference 732 interacting with an ear 734 of a subject 736 and electricall interacting with the preferred brainwave processing system 726,.
  • a sensor assembly retention web 724 preferably includes at least four sensor assemblies 722, (wherein 720 is selected from sensor assemblies 200, 300, 330, 600, or 620) supported by a sensor assembly retention web 724, a preferred brainwave processing system 726 that includes a multi-channel user interface 728 electrically interacting with an electronic device 730, which is preferably a portable computing and
  • the sensor web assembly is formed to support each of the sensor assemblies 722, provide a communication buss between the brainwave processing system 726 and each of the sensor assemblies 722 and the ground reference 732, and facilitate a pressing contact interface between each of the sensor assemblies 722 and a cranium 738 of the subject 736 *
  • the sensor assemblies 722 may be of any type of ueurophysiologic monitoring sensor including, but not limited to, the dry sensor assembly, such as 300, or the capacitance probe sensor such as 600 or 620,
  • FIG. 37 further shows the neurophysiologic performance measurement and training system.
  • 720 preferably further includes a head phone set 740, secured to the sensor assembly retention we 724 by an attachment member 742, which preferably is an attachment clip 742.
  • FIG, 38 shows an embodiment exemplary of a no vel ueurophysiologicaS. training headset 800 (“headse t 800"), which includes a plural i ty of sensor assemblies 802 secured to a retention web 804. Each of the sensor assemblies 802 are configured to prov de contact with, the cranium 738 of the subject 736 (each of FIG. 37).
  • the headset 800 preferably further provides headphones 806 (also referred to as earphones 806) secured to the retention web 804 by an attachment member 808, and frame assembly 810 communicating wi th, each of the plurality of sensors 802.
  • FIG. 39 shows the frame assembly 810 provides a sensor mounting plate 812 corresponding to each of the plurality of sensor assemblies 802, and a shape retention bracket 814 secured to the frame assembl 810,
  • the shape retention bracket 814 providing a mounting aperture 816 for a preselected number of sensor assemblies of the plurality of sensor assemblies 802.
  • each of the preselec ted number of sensor assemblies 802 is disposed between the shape retention bracket 814 and their corresponding sensor mounting plates 81.2, while being confined within their corresponding mounting apertures 8.16,
  • FIG. 40 shows the preferred attachment member 808 features a support structure 81.8 that provides a shape retention, channel 820.
  • the shape retention channel 820 cooperates with a shape retention member 822.
  • FIG. 44 shows the shape retention member 822 in greater detail, while FIG. 45 shows the shape reie.n.tion channel 820 in greater detail
  • FIG. 40 further shows an. access cover 824, which provides access to a mounting flange 826 (shown ' by FIG. 46), of the attachment member 808.
  • a back side view of the access cover 824 is shown by FIG. 43.
  • FiG * 41 reveals a continuously acti ve tensioning mechanism 828, when the access cover 824 (of FIG * 40) is removed.
  • the continuously active tensioning rnechaf.ti.sm 828 includes a tension housing 830 secured to the mounting flange 826, a cover plate 832 providing securement apertures 834, which, are also shown by FIG * 42,
  • the securement apertures 834 accommodate attachment structures 836, which communicate with corresponding mount apertures 838 of a guide plate 840 as shown by FIG. 45.
  • FiG. 45 further shows the guide plate 840 provides elongated guid apertures 842.
  • the securement aperture 834 of the cover plate 832 correspond to the mount apertures 838
  • the mounting .flange 826 (of FiG. 46) is disposed between the securement apertures 834 and the mount aperture 842.
  • the mounting flange 826 provides access apertures 844 (of FIG. 46), corresponding to the mount apertures 838 and the securement aperture 834, which collectively facilitates use of the attachment structures 836 to secure the tension housing 830 (of FIG. 41) to the mounting flange 826 of FIG. 46.
  • FIG. 46 shows a slide plate 846 cooperating with the guide plate 840; -and an earphone mount 848 attached to the slide plate 846, while FIG. 47 shows linking hardware 850 connecting the slide plate 846 with said glide plate 840.
  • the linking hardware 850 protrudes through the elongated guide aperture 842 such that, the guide plate 840 is in sliding contact with and disposed between each the slide plate 846 and the earphone mount 848.
  • FiG.. 48 shows the guide plate 840 provides a boss 852, which serves as a constraint for a tension member 854,
  • a tension stay mount 856 communicates with, the slide plate 846 to secure the tension, member 854 in a fixed position relative to the slide plate 846,
  • the tension member 854 interacting with the boss 852, of the guide plate 840, of the tension housing 830, such that when, the earphone 806 is positioned in contact adjacency with the ear of the subject 736 (of FIG. 37).
  • the tension member 854 acting on tension housing 830 promotes continuou force induced contact adjacency of the sensor assemblies 802, with the cranium 738 (of FIG:, 37), of the subject 736.
  • FIG. 49 is a top plan view of the neurophysiologies! training headset 800, which includes the plurality of sensor assemblies 802 secured to the retention web 804, by way of the s hape retention bracket 8.14. Each of the sensor assemblies 802 are configured to provide contact with the cranium 738 of the subject 736 (each of FIG. 37).
  • FIG. 50 shows a plan, view of the sensor assembly 802, which includes at least a sensor housing 860 (of FIG. 38) that confines a sensor probe assembly, such as 10 of FiG. 1 , and a signal processing circuit, such as 204 of FIG. 18.
  • FIG. 50 further shows the shape retention bracket 814, provides the mounting aperture 81 , which encloses or surrounds the sensor assembly. Additionally shown, by FIG. 50, is a pliable compliant member 858 disposed within the mounting aperture 816, secured to the shape retention bracket 81 , and attached to the sensor housing 860, In.
  • the pliable compliant member 858 imparts a plurality of degrees of freedom of movement of the sensor assembly 802, the pliable complia member 858 maintains conformance of the conductive pins in conductive contact with the cranium of the subject.
  • a sensor housing 860 (housing 860) tha preferably includes a main body 862, and a sensor securement cap 864 commimicaiing with the main body 862, and in which the pliable compliant member 858 (also shown in FIG. 50), 3 ⁇ 4s further disposed between the main body 862 and the sensor securement cap 864,
  • a fastener 866 secures the securement cap 864 to the main body 862, and imparts a compressive load on the pliable compliant member 858 when the listener 866 is full engaged,
  • FIGS. 51 and 52 show the pliability pro vided by the pliable compliant member 858, enables the sensor assembly to move in the X-Y-Z axis, and well as roll, pitch, and ya w for an ability to provide a full six degrees of freedom of movement for the sensor assembly 802.
  • FIG. 53 shows the shape retention bracket 814 further provides a sensor mount flange 868 thai includes at least one sensor fastening aperture 870.
  • the sensor fastening aperture 870 facilitates passage of attachment structures 872 of FIG. 52, in a preferred embodiment, the pliable compliant member 856 of FIG. 52, is disposed between said sensor .mounting plate 812. of FIG, 39, and the sensor mount flange 868,
  • the mounting aperture 16 is enclosed by a sensor mount flange 868, pro vided by said shape retention bracket 814, and the sensor mounting plate 812 is provided by the frame assembl 81.0, of FIG. 39.
  • FIG. 55 shows (hat the pliable compliant member 856 provides a pass-through aperture 876, which accommodates passage of the fastener 866, of FIG. 52, such that the fastener 866 ma communicate with the main body 862, of FIG. 38.
  • FIG. 55 further shows that the pliable compl iant member 858 additionally provides access apertures 878, which accommodates passage of the attachment structures 872, of FIG. 52.
  • FIG. 56 shows a preferred embodiment of a neurophysiologieal training system 900, which preferabl includes the neurophysiologies! training headset 800, affixed to the cranium 738 of the subject 736, and interacting with a
  • the communication device 902 which, may communicate with a firs edge router 904 either directly, or through a cloud 906.
  • the first edge router 904 (also referred to as the first server 904) may communicate with a second edge router 908, either directly or via the cloud 906,
  • the second edge router 908 (also reierred to herein as the second server 908) preferably includes high performers data base and.
  • diagnostic software which analyzes neurophysiologieal data (also referred to as brain wave data ) of the subject " collected by the neurophysiologieal. training headset 800, and provides brain state status of the subject, based on an analysis of the collected neurophysiologieal data, to a computing device 910 for access by a brain training specialist.
  • neurophysiologieal data also referred to as brain wave data
  • training headset 800 provides brain state status of the subject, based on an analysis of the collected neurophysiologieal data, to a computing device 910 for access by a brain training specialist.
  • the neurophysiologieal training headset 800 interacts with the subject 736 and provides the sensor assembly 802, The sensor assembly 802 collects brainwave data of said subject 736, The communication device 904, cooperating with said neurophysiologieal training headset 800, the communication device 902 transmits the collected, brainwave data to the second server 908, via either the first server 904, or the cloud 906, interacting with the communication device, FIG. 56 further shows a computing device 910, linked with the second server 908, the computing device 10 analyzes the collected brainwave data, determines a brain training regimen based on the collected brainwave data and a high performance brainwave data base resident in the second server 908.
  • the computing device 910 downloads the determined brain training regimen to the communication device 902, monitors the subject's performance in executing said training regimen, adjusts the training regimen based on the monitored performance, and downloads the adjusted training regimen for use by the subject 736.
  • the communication device is located within the housing 860 of the sensor assembly 802.

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  • General Health & Medical Sciences (AREA)
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  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)

Abstract

De préférence, un mode de réalisation d'un casque d'entraînement neurophysiologique (800) comprend au moins une pluralité d'ensembles capteurs (722, 802), chaque ensemble capteur étant fixé par une bande de retenue (724, 804). Chacun de la pluralité d'ensembles capteurs est positionné en contact adjacent à un emplacement prédéterminé autour d'un crâne (612, 738) d'un sujet (736). Le casque d'entraînement neurophysiologique préféré comprend en outre un casque (806) fixé à la bande de retenue par un élément de fixation (742, 808), ledit l'élément de fixation présentant un mécanisme de serrage actif continu (828). Le mécanisme de serrage actif continu favorise une contiguïté de contact induite par une force continue de chacun des ensembles capteurs avec le crâne du sujet.
PCT/US2015/021248 2014-03-18 2015-03-18 Casque d'entrainement neurophysiologique WO2015143031A1 (fr)

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US14/218,560 US20150182165A1 (en) 2012-08-03 2014-03-18 Neurophysiological training headset

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3184043A1 (fr) * 2015-12-22 2017-06-28 IMEC vzw Capteur, système et agencement de support pour la mesure de l'activité d'un biosignal
US11786694B2 (en) 2019-05-24 2023-10-17 NeuroLight, Inc. Device, method, and app for facilitating sleep

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740812A (en) * 1996-01-25 1998-04-21 Mindwaves, Ltd. Apparatus for and method of providing brainwave biofeedback
US6154669A (en) * 1998-11-06 2000-11-28 Capita Systems, Inc. Headset for EEG measurements
US20090214060A1 (en) * 2008-02-13 2009-08-27 Neurosky, Inc. Audio headset with bio-signal sensors
US20120226127A1 (en) * 2009-11-04 2012-09-06 Koninklijke Philips Electronics N.V. Device for positioning electrodes on a user's scalp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5740812A (en) * 1996-01-25 1998-04-21 Mindwaves, Ltd. Apparatus for and method of providing brainwave biofeedback
US6154669A (en) * 1998-11-06 2000-11-28 Capita Systems, Inc. Headset for EEG measurements
US20090214060A1 (en) * 2008-02-13 2009-08-27 Neurosky, Inc. Audio headset with bio-signal sensors
US20120226127A1 (en) * 2009-11-04 2012-09-06 Koninklijke Philips Electronics N.V. Device for positioning electrodes on a user's scalp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3184043A1 (fr) * 2015-12-22 2017-06-28 IMEC vzw Capteur, système et agencement de support pour la mesure de l'activité d'un biosignal
US11786694B2 (en) 2019-05-24 2023-10-17 NeuroLight, Inc. Device, method, and app for facilitating sleep

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