WO2015139581A1 - Light emitting diode base and light source using same - Google Patents

Light emitting diode base and light source using same Download PDF

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Publication number
WO2015139581A1
WO2015139581A1 PCT/CN2015/074171 CN2015074171W WO2015139581A1 WO 2015139581 A1 WO2015139581 A1 WO 2015139581A1 CN 2015074171 W CN2015074171 W CN 2015074171W WO 2015139581 A1 WO2015139581 A1 WO 2015139581A1
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light
light emitting
emitting diode
led
led chip
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PCT/CN2015/074171
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French (fr)
Chinese (zh)
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林惠忠
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深圳市光之谷新材料科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil

Definitions

  • the present invention relates to the field of light emitting diodes, and more particularly to an LED base and a light source using the same.
  • LEDs Light emitting diodes
  • the illumination angle of the existing light source is close to 360 degrees, and the illumination angle is fixed, which is easy to glare and has low flexibility.
  • LED light emitting diode
  • the invention provides an LED base, the LED base comprising a plurality of setting areas, each of the setting areas comprising a light blocking surface and a bottom surface, wherein the bottom surface is for placing an LED chip.
  • the light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
  • the present invention also provides a light source, the light source comprising an LED base, the LED base comprising a plurality of setting areas, each of the setting areas comprising a light blocking surface and a bottom surface, wherein the bottom surface is for placing an LED chip, The light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
  • the beneficial effects of the present invention are that the light-blocking surface of the LED base and the light source of the present invention and the LED chip are located on the same side of the bottom surface to adjust the light-emitting angle of the LED chip, and according to the light-blocking surface and the bottom
  • the angle of the surface can adjust the illumination angle of the LED chip, eliminating the glare of the light, and the flexibility is high.
  • FIG. 1 is a schematic structural view of a light emitting diode base according to an embodiment of the invention.
  • FIG. 1 is a schematic structural view of a light emitting diode base according to an embodiment of the present invention.
  • a light emitting diode (LED) pedestal 1 includes a setting area 10 including a light blocking surface 101 and a bottom surface 102 for placing the LED chip 2 .
  • the light blocking surface 101 and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light emitting angle of the LED chip 2 located on the bottom surface 102.
  • the LED pedestal 1 includes a plurality of installation zones 10 (only three are shown), and the plurality of setup zones 10 are connected to each other.
  • the plurality of setting areas 10 are arranged in a stepped shape.
  • the angle between the light blocking surface 101 and the bottom surface 102 in each of the setting regions 10 is equal.
  • the light blocking surface 101 in each of the setting regions 10 is adjacent to the bottom surface 102 and perpendicular to each other.
  • the angle between the light blocking surface 101 and the bottom surface 102 can be adjusted to other according to the needs of the LED chip 2 illumination angle. angle.
  • the invention also discloses a light source using the LED base 1, wherein the light source comprises a light emitting diode (LED) pedestal 1, an LED chip 2 and a fluorescent glue 3.
  • the LED base 1 includes a setting area 10 including a light blocking surface 101 and a bottom surface 102, and the LED chip 2 is located on the bottom surface 102 of the setting area 10.
  • the light blocking surface 101 and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light emitting angle of the LED chip 2 located on the bottom surface 102.
  • the fluorescent glue 3 is used to seal the LED chip 2. Wherein, the fluorescent glue 3 does not completely cover the LED base 1 to accelerate the heat dissipation speed of the LED chip 2.
  • the light source comprises a plurality of LED chips 2, and the plurality of LED chips 2 are connected in series.
  • the fluorescent glue 3 is composed of a plurality of Mitsubishi columns, and two sides of each of the Mitsubishi columns overlap the light blocking surface 101 and the bottom surface 102, respectively.
  • the light-blocking surface 101 of the LED base and the light source of the present invention and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light-emitting angle of the LED chip 2 located on the bottom surface 102, and according to the angle between the bottom surface 102 and the light-blocking surface 101. Adjusting the illumination angle of the LED chip 2 eliminates the glare of the light and has high flexibility.
  • the light-shielding surface of the LED base and the light source of the present invention and the LED chip are located on the same side of the bottom surface to adjust the light-emitting angle of the LED chip, and the LED core can be adjusted according to the angle between the light-blocking surface and the bottom surface.
  • the angle of illumination of the film eliminates the glare of light and is highly flexible.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A light emitting diode LED base (1) comprises a setting area (10). The setting area (10) comprises a light blocking surface (101) and a bottom surface (102). The bottom surface (102) is used for the placement of an LED chip (2), and the light blocking surface (101) and the LED chip (2) are located on the same side of the bottom surface (102) to adjust the light emitting angle of the LED chip (2). Also provided is a light source comprising the LED base (1) described above. The light blocking surface (101) and the LED chip (2) are located on the same side of the bottom surface (102) to adjust the light emitting angle of the LED chip (2), and the light emitting angle of the LED chip (2) can be adjusted on the basis of an included angle between the light blocking surface (101) and the bottom surface (102), so that the trouble of blinding light is eliminated and high flexibility is achieved.

Description

一种发光二极管基座及使用其的光源Light-emitting diode base and light source using same 技术领域Technical field
本发明是关于发光二极管技术领域，且特别是关于一种发光二极管基座及使用其的光源。The present invention relates to the field of light emitting diodes, and more particularly to an LED base and a light source using the same.
背景技术Background technique
发光二极管(light emitting diode，LED)由于其节能、安全、使用寿命长等特点而被广泛的应用。Light emitting diodes (LEDs) are widely used due to their energy saving, safety and long service life.
现有的光源的发光角度接近360度，且发光角度固定，容易刺眼，灵活性低。The illumination angle of the existing light source is close to 360 degrees, and the illumination angle is fixed, which is easy to glare and has low flexibility.
因此，有必要提供改进的技术方案以克服现有技术中存在的以上技术问题。Therefore, it is necessary to provide an improved technical solution to overcome the above technical problems existing in the prior art.
发明内容Summary of the invention
本发明的目的是提供一种调整发光二极管(light emitting diode，LED)芯片发光角度，消除光线刺眼的困扰，且灵活性高的LED基座。It is an object of the present invention to provide an LED pedestal that adjusts the illuminating angle of a light emitting diode (LED) chip, eliminates the glare of light, and has high flexibility.
本发明提出一种LED基座，所述LED基座包括多个设置区，所述每个设置区包括挡光面及底面，所述底面用于放置LED芯片。其中，所述挡光面与所述LED芯片位于所述底面的同一侧，以调整所述LED芯片的发光角度。The invention provides an LED base, the LED base comprising a plurality of setting areas, each of the setting areas comprising a light blocking surface and a bottom surface, wherein the bottom surface is for placing an LED chip. Wherein, the light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
本发明还提供一种光源，所述光源包括LED基座，所述LED基座包括多个设置区，所述每个设置区包括挡光面及底面，所述底面用于放置LED芯片，所述挡光面与所述LED芯片位于所述底面的同一侧，以调整所述LED芯片的发光角度。The present invention also provides a light source, the light source comprising an LED base, the LED base comprising a plurality of setting areas, each of the setting areas comprising a light blocking surface and a bottom surface, wherein the bottom surface is for placing an LED chip, The light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
本发明的有益效果是，本发明的LED基座及光源的挡光面与LED芯片位于底面的同一侧，以调整LED芯片的发光角度，且根据挡光面与底 面的夹角可调整LED芯片的发光角度，消除了光线刺眼的困扰，且灵活性高。The beneficial effects of the present invention are that the light-blocking surface of the LED base and the light source of the present invention and the LED chip are located on the same side of the bottom surface to adjust the light-emitting angle of the LED chip, and according to the light-blocking surface and the bottom The angle of the surface can adjust the illumination angle of the LED chip, eliminating the glare of the light, and the flexibility is high.
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手端，而可依照说明书的内容予以实施，并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂，以下特举实施例，并配合附图，详细说明如下。The above description is only an overview of the technical solutions of the present invention, and can be implemented in accordance with the contents of the specification in order to make the technical hand of the present invention clearer, and the above and other objects, features and advantages of the present invention can be made more obvious. The following specific embodiments are described in detail below with reference to the accompanying drawings.
附图概述BRIEF abstract
图1为本发明一实施例的的发光二极管基座的结构示意图。FIG. 1 is a schematic structural view of a light emitting diode base according to an embodiment of the invention.
本发明的较佳实施方式Preferred embodiment of the invention
为更进一步阐述本发明为达成预定发明目的所采取的技术手端及功效，以下结合附图及较佳实施例，对依据本发明提出的发光二极管基座及使用其的光源的具体实施方式、结构、特征及其功效，详细说明如下：In order to further explain the technical hand and effect of the present invention for achieving the intended purpose of the invention, the specific embodiments of the light-emitting diode base and the light source using the same according to the present invention, with reference to the accompanying drawings and preferred embodiments, The structure, characteristics and efficacy are described in detail as follows:
图1为本发明的一实施例的发光二极管基座的结构示意图。如图1所示，发光二极管(light emitting diode，LED)基座1包括设置区10，设置区10包括挡光面101及底面102，底面102用于放置LED芯片2。其中，其中，挡光面101与LED芯片2位于底面102的同一侧，以调整位于底面102上的LED芯片2的发光角度。FIG. 1 is a schematic structural view of a light emitting diode base according to an embodiment of the present invention. As shown in FIG. 1 , a light emitting diode (LED) pedestal 1 includes a setting area 10 including a light blocking surface 101 and a bottom surface 102 for placing the LED chip 2 . Wherein, the light blocking surface 101 and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light emitting angle of the LED chip 2 located on the bottom surface 102.
在本发明的一实施方式中，LED基座1包括多个设置区10(图中仅仅示出三个)，多个设置区10相互连接。In an embodiment of the invention, the LED pedestal 1 includes a plurality of installation zones 10 (only three are shown), and the plurality of setup zones 10 are connected to each other.
在本发明的一实施方式中，多个设置区10呈阶梯形排列。In an embodiment of the invention, the plurality of setting areas 10 are arranged in a stepped shape.
在本发明的一实施方式中，每个设置区10中的挡光面101与底面102之间的夹角相等。In an embodiment of the invention, the angle between the light blocking surface 101 and the bottom surface 102 in each of the setting regions 10 is equal.
在本发明的一实施方式中，每个设置区10中的挡光面101与底面102相邻，且互相垂直。当然本领域的技术人员可以理解的是，挡光面101与底面102的夹角可以根据LED芯片2发光角度的需要调整为其它 角度。In an embodiment of the invention, the light blocking surface 101 in each of the setting regions 10 is adjacent to the bottom surface 102 and perpendicular to each other. Of course, those skilled in the art can understand that the angle between the light blocking surface 101 and the bottom surface 102 can be adjusted to other according to the needs of the LED chip 2 illumination angle. angle.
本发明还公开了一种使用上述LED基座1的光源，光源包括发光二极管(light emitting diode，LED)基座1、LED芯片2及荧光胶3。LED基座1包括设置区10，设置区10包括挡光面101及底面102，LED芯片2位于设置区10的底面102上。其中，挡光面101与LED芯片2位于底面102的同一侧，以调整位于底面102上的LED芯片2的发光角度。荧光胶3用于密封LED芯片2。其中，荧光胶3未完全覆盖LED基座1，以加快LED芯片2的散热速度。The invention also discloses a light source using the LED base 1, wherein the light source comprises a light emitting diode (LED) pedestal 1, an LED chip 2 and a fluorescent glue 3. The LED base 1 includes a setting area 10 including a light blocking surface 101 and a bottom surface 102, and the LED chip 2 is located on the bottom surface 102 of the setting area 10. The light blocking surface 101 and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light emitting angle of the LED chip 2 located on the bottom surface 102. The fluorescent glue 3 is used to seal the LED chip 2. Wherein, the fluorescent glue 3 does not completely cover the LED base 1 to accelerate the heat dissipation speed of the LED chip 2.
在本发明的一实施方式中，光源包括多个LED芯片2，多个LED芯片2串联在一起。In an embodiment of the invention, the light source comprises a plurality of LED chips 2, and the plurality of LED chips 2 are connected in series.
在本发明的一实施方式中，荧光胶3由多个三菱柱组成，且每个三菱柱的其中两面分别与挡光面101及底面102重叠。In an embodiment of the invention, the fluorescent glue 3 is composed of a plurality of Mitsubishi columns, and two sides of each of the Mitsubishi columns overlap the light blocking surface 101 and the bottom surface 102, respectively.
本发明的LED基座及光源的挡光面101与LED芯片2位于底面102的同一侧，以调整位于底面102上的LED芯片2的发光角度，且根据底面102与挡光面101夹角可调整LED芯片2的发光角度，消除了光线刺眼的困扰，且灵活性高。The light-blocking surface 101 of the LED base and the light source of the present invention and the LED chip 2 are located on the same side of the bottom surface 102 to adjust the light-emitting angle of the LED chip 2 located on the bottom surface 102, and according to the angle between the bottom surface 102 and the light-blocking surface 101. Adjusting the illumination angle of the LED chip 2 eliminates the glare of the light and has high flexibility.
以上，仅是本发明的实施例而已，并非对本发明作任何形式上的限制，虽然本发明已以实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。The above is only an embodiment of the present invention, and is not intended to limit the scope of the present invention. The present invention has been disclosed in the above embodiments, but is not intended to limit the present invention. In the scope of the present invention, the equivalents of the above-described technical contents may be modified or modified to equivalent changes, but the technical embodiments according to the present invention are not deviated from the technical solutions of the present invention. Any simple modifications, equivalent changes and modifications made by the invention are still within the scope of the technical solutions of the present invention.
工业实用性Industrial applicability
本发明的LED基座及光源的挡光面与LED芯片位于底面的同一侧，以调整LED芯片的发光角度，且根据挡光面与底面的夹角可调整LED芯The light-shielding surface of the LED base and the light source of the present invention and the LED chip are located on the same side of the bottom surface to adjust the light-emitting angle of the LED chip, and the LED core can be adjusted according to the angle between the light-blocking surface and the bottom surface.
片的发光角度，消除了光线刺眼的困扰，且灵活性高。 The angle of illumination of the film eliminates the glare of light and is highly flexible.

Claims (8)

  1. 一种发光二极管基座，其特征在于，所述发光二极管基座包括：An LED base is characterized in that: the LED base comprises:
    设置区，所述设置区包括：a setting area, the setting area includes:
    挡光面；及Light blocking surface; and
    底面，所述底面用于放置发光二极管芯片；a bottom surface, the bottom surface is for placing a light emitting diode chip;
    其中，所述挡光面与所述发光二极管芯片位于所述底面的同一侧，以调整所述发光二极管芯片的发光角度。The light blocking surface and the LED chip are located on the same side of the bottom surface to adjust an illumination angle of the LED chip.
  2. 如权利要求1所述的发光二极管基座，其特征在于，所述发光二极管基座包括多个设置区，所述多个设置区相互连接。The LED base of claim 1 wherein said LED base comprises a plurality of mounting regions, said plurality of mounting regions being interconnected.
  3. 如权利要求2所述的发光二极管基座，其特征在于，所述多个设置区呈阶梯形排列。The LED base of claim 2, wherein the plurality of setting regions are arranged in a stepped shape.
  4. 如权利要求3所述的发光二极管基座，其特征在于，所述设置区中的所述底面与所述挡光面的夹角均相等。The LED base according to claim 3, wherein an angle between the bottom surface and the light blocking surface in the setting area is equal.
  5. 如权利要求4所述的发光二极管基座，其特征在于，所述设置区中的所述底面与所述挡光面相互垂直。The LED base according to claim 4, wherein said bottom surface in said setting area is perpendicular to said light blocking surface.
  6. 一种光源，其特征在于，包含如权利要求1-5任一项所述的发光二极管基座。A light source comprising the light emitting diode pedestal of any of claims 1-5.
  7. 如权利要求6所述的光源，其特征在于，所述光源还包括：The light source of claim 6 wherein said light source further comprises:
    发光二极管芯片，所述发光二极管芯片位于所述设置区的底面上；及a light emitting diode chip, the light emitting diode chip is located on a bottom surface of the setting area; and
    荧光胶，所述荧光胶用于密封所述发光二极管芯片；a fluorescent glue for sealing the light emitting diode chip;
    其中，所述荧光胶未完全覆盖所述发光二极管基座。Wherein, the fluorescent glue does not completely cover the LED base.
  8. 如权利要求7所述的光源，其特征在于，所述光源包括多个发光二极管芯片，所述多个发光二极管芯片串联在一起。 The light source of claim 7 wherein said light source comprises a plurality of light emitting diode chips, said plurality of light emitting diode chips being connected in series.
PCT/CN2015/074171 2014-03-18 2015-03-13 Light emitting diode base and light source using same WO2015139581A1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2019115713A1 (en) * 2017-12-14 2019-06-20 Osram Opto Semiconductors Gmbh Method for producing a semiconductor component, and semiconductor component

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CN103904196A (en) * 2014-03-18 2014-07-02 深圳市光之谷新材料科技有限公司 LED base and light source with same

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