WO2015128188A3 - Modules de puce rfid de transpondeur - Google Patents

Modules de puce rfid de transpondeur Download PDF

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Publication number
WO2015128188A3
WO2015128188A3 PCT/EP2015/052843 EP2015052843W WO2015128188A3 WO 2015128188 A3 WO2015128188 A3 WO 2015128188A3 EP 2015052843 W EP2015052843 W EP 2015052843W WO 2015128188 A3 WO2015128188 A3 WO 2015128188A3
Authority
WO
WIPO (PCT)
Prior art keywords
planar antenna
transponder chip
module
module tape
rfid transponder
Prior art date
Application number
PCT/EP2015/052843
Other languages
English (en)
Other versions
WO2015128188A2 (fr
Inventor
David Finn
Mustafa Lotya
Darren Molloy
Original Assignee
Féinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/281,876 external-priority patent/US9272370B2/en
Priority claimed from US14/465,815 external-priority patent/US9475086B2/en
Priority claimed from US14/492,113 external-priority patent/US9798968B2/en
Priority claimed from US14/523,993 external-priority patent/US20150129665A1/en
Priority claimed from US14/551,376 external-priority patent/US9390364B2/en
Application filed by Féinics Amatech Teoranta filed Critical Féinics Amatech Teoranta
Priority to EP15704298.7A priority Critical patent/EP3111374B1/fr
Priority to EP20188881.5A priority patent/EP3751464A1/fr
Publication of WO2015128188A2 publication Critical patent/WO2015128188A2/fr
Publication of WO2015128188A3 publication Critical patent/WO2015128188A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07784—Antenna details the antenna being of the inductive type the inductive antenna consisting of a plurality of coils stacked on top of one another
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Support Of Aerials (AREA)

Abstract

L'antenne plane (PA, 1020) d'un module de puce de transpondeur (TCM, 1000) peut avoir une partie en forme de U (1022) de sorte qu'une extrémité externe (OE, 1020a) de l'antenne peut être positionnée à proximité d'une puce RFID (IC, 1008) disposée au niveau d'une zone centrale d'une bande de module (MT, 1002) pour le module de puce de transpondeur. Une bande de module (MT2, 522) peut être munie de plages de contact (CP, 528) sur un côté de celle-ci et d'un pont de connexion (CBR, 530) sur un autre côté de celle-ci, et peut être reliée à une bande de module (MT1, 502) ayant une antenne plane (PA, 506). Le métal d'une couche conductrice (CL, 404, 704) à l'intérieur d'un élément conducteur comme un cadre de couplage (CF, 424) ou une antenne plane (PA, 720) peut être découpé de façon à avoir plusieurs petits segments. Une feuille métallique peut être découpée de façon à présenter une métallisation côté contact, et reliée à une bande de module (MT, 902) ayant une antenne plane (PA, 920).
PCT/EP2015/052843 2014-02-27 2015-02-11 Modules de puce rfid de transpondeur WO2015128188A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP15704298.7A EP3111374B1 (fr) 2014-02-27 2015-02-11 Modules de puce rfid de transpondeur
EP20188881.5A EP3751464A1 (fr) 2014-02-27 2015-02-11 Modules de puces de transpondeur et leur procédé de fabrication

Applications Claiming Priority (36)

Application Number Priority Date Filing Date Title
US201461945689P 2014-02-27 2014-02-27
US61/945,689 2014-02-27
US14/281,876 2014-05-19
US14/281,876 US9272370B2 (en) 2010-08-12 2014-05-19 Laser ablating structures for antenna modules for dual interface smartcards
US201462023874P 2014-07-12 2014-07-12
US62/023,874 2014-07-12
US201462028302P 2014-07-23 2014-07-23
US62/028,302 2014-07-23
US201462035430P 2014-08-10 2014-08-10
US62/035,430 2014-08-10
US201462039562P 2014-08-20 2014-08-20
US62/039,562 2014-08-20
US14/465,815 2014-08-21
US14/465,815 US9475086B2 (en) 2013-01-18 2014-08-21 Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US201462044394P 2014-09-01 2014-09-01
US62/044,394 2014-09-01
US201462048373P 2014-09-10 2014-09-10
US62/048,373 2014-09-10
US14/492,113 2014-09-22
US14/492,113 US9798968B2 (en) 2013-01-18 2014-09-22 Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US201462061689P 2014-10-08 2014-10-08
US62/061,689 2014-10-08
US14/523,993 2014-10-27
US14/523,993 US20150129665A1 (en) 2013-11-13 2014-10-27 Connection bridges for dual interface transponder chip modules
US201462080332P 2014-11-16 2014-11-16
US62/080,332 2014-11-16
US14/551,376 US9390364B2 (en) 2011-08-08 2014-11-24 Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US14/551,376 2014-11-24
US201462088598P 2014-12-07 2014-12-07
US62/088,598 2014-12-07
US201462096559P 2014-12-24 2014-12-24
US62/096,559 2014-12-24
US201562102103P 2015-01-12 2015-01-12
US62/102,103 2015-01-12
US201562104759P 2015-01-18 2015-01-18
US62/104,759 2015-01-18

Publications (2)

Publication Number Publication Date
WO2015128188A2 WO2015128188A2 (fr) 2015-09-03
WO2015128188A3 true WO2015128188A3 (fr) 2015-12-23

Family

ID=52469839

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2015/052843 WO2015128188A2 (fr) 2014-02-27 2015-02-11 Modules de puce rfid de transpondeur

Country Status (1)

Country Link
WO (1) WO2015128188A2 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105283322B (zh) 2013-06-09 2020-01-14 苹果公司 激光成形特征部
RU167898U1 (ru) * 2016-06-29 2017-01-11 Акционерное общество "Пэй Ринг" Бесконтактная смарт-карта
EP3480737A4 (fr) 2016-06-29 2020-11-04 Joint-Stock Company "Pay-Ring" Carte de stockage de données sans contact
RU2639577C1 (ru) * 2016-10-13 2017-12-21 Акционерное общество "Пэй Ринг" Бесконтактная смарт-карта
US11200385B2 (en) * 2018-09-27 2021-12-14 Apple Inc. Electronic card having an electronic interface
EP3629244B1 (fr) * 2018-09-27 2023-01-11 Apple Inc. Carte électronique dotée d'une interface électronique
WO2020080977A1 (fr) * 2018-10-16 2020-04-23 Олег Умарович АЙБАЗОВ Module de paiement sans contact pour dispositif portable
RU189019U1 (ru) * 2018-10-16 2019-05-07 Олег Умарович Айбазов Модуль бесконтактной оплаты для носимого устройства
RU189039U1 (ru) * 2018-10-16 2019-05-07 Олег Умарович Айбазов Модуль бесконтактной оплаты для носимого устройства
US11571766B2 (en) 2018-12-10 2023-02-07 Apple Inc. Laser marking of an electronic device through a cover
US11299421B2 (en) 2019-05-13 2022-04-12 Apple Inc. Electronic device enclosure with a glass member having an internal encoded marking
CN112248491B (zh) * 2020-10-12 2022-04-22 东北电力大学 一种微流控芯片的复合加工装置
EP4002210A1 (fr) * 2020-11-12 2022-05-25 AdvanIDe Holdings Pte. Ltd. Incrustation de carte pour connexion directe ou technologie de couplage inductif
US11551050B2 (en) 2020-11-12 2023-01-10 Advanide Holdings Pte. Ltd. Card inlay for direct connection or inductive coupling technology
WO2023052804A1 (fr) * 2021-09-29 2023-04-06 Linxens Holding Circuit imprimé destiné à être intégré dans une carte à puce, carte à puce dotée d'un tel circuit imprimé et bande de bobine à bobine destinée à être utilisée dans un procédé de fabrication d'une carte à puce

Citations (11)

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Publication number Priority date Publication date Assignee Title
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
EP1225538A1 (fr) * 2000-05-12 2002-07-24 Dai Nippon Printing Co., Ltd. Support de donnees sans contact
US20050093678A1 (en) * 2003-11-04 2005-05-05 Forster Ian J. RFID tag with enhanced readability
EP2264645A1 (fr) * 2009-06-19 2010-12-22 Korea Minting, Security Printing & ID Card Operating Corp. Carte combinée et système de communication l'utilisant
EP2280449A1 (fr) * 2008-05-22 2011-02-02 Murata Manufacturing Co. Ltd. Dispositif ci sans fil et son procédé de fabrication
WO2011157693A1 (fr) * 2010-06-18 2011-12-22 Fci Circuit imprimé multi-couche souple et son procédé de fabrication
US20120038445A1 (en) * 2010-08-12 2012-02-16 Feinics Amatech Nominee Limited Rfid antenna modules and increasing coupling
EP2541471A1 (fr) * 2011-07-01 2013-01-02 Gemalto SA Dispositif portatif à contacts électriques évidés
US20130140370A1 (en) * 2010-08-12 2013-06-06 David Finn Rfid antenna modules and methods
US20130146670A1 (en) * 2011-12-13 2013-06-13 Infineon Technologies Ag Chip card contact array arrangement
WO2014016332A1 (fr) * 2012-07-25 2014-01-30 Linxens Holding Module électronique pour carte à puce et circuit imprimé pour la réalisation d'un tel module

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19632115C1 (de) * 1996-08-08 1997-12-11 Siemens Ag Kombinations-Chipmodul und Verfahren zur Herstellung eines Kombinations-Chipmoduls
EP1225538A1 (fr) * 2000-05-12 2002-07-24 Dai Nippon Printing Co., Ltd. Support de donnees sans contact
US20050093678A1 (en) * 2003-11-04 2005-05-05 Forster Ian J. RFID tag with enhanced readability
EP2280449A1 (fr) * 2008-05-22 2011-02-02 Murata Manufacturing Co. Ltd. Dispositif ci sans fil et son procédé de fabrication
EP2264645A1 (fr) * 2009-06-19 2010-12-22 Korea Minting, Security Printing & ID Card Operating Corp. Carte combinée et système de communication l'utilisant
WO2011157693A1 (fr) * 2010-06-18 2011-12-22 Fci Circuit imprimé multi-couche souple et son procédé de fabrication
US20120038445A1 (en) * 2010-08-12 2012-02-16 Feinics Amatech Nominee Limited Rfid antenna modules and increasing coupling
US20130140370A1 (en) * 2010-08-12 2013-06-06 David Finn Rfid antenna modules and methods
EP2541471A1 (fr) * 2011-07-01 2013-01-02 Gemalto SA Dispositif portatif à contacts électriques évidés
US20130146670A1 (en) * 2011-12-13 2013-06-13 Infineon Technologies Ag Chip card contact array arrangement
WO2014016332A1 (fr) * 2012-07-25 2014-01-30 Linxens Holding Module électronique pour carte à puce et circuit imprimé pour la réalisation d'un tel module

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