WO2015124079A1 - Pcb drilling path configuration method - Google Patents

Abstract

A PCB drilling path configuration method, comprising the steps: S1, obtaining the hole position design within a pre-divided galvanometric scanner grid, calculating the distances between each pair of hole positions within the galvanometric scanner grid and obtaining a distance matrix, and setting a starting hole position; S2, obtaining the hole position closest to the starting hole position and setting said hole position as the second hole position, and forming a starting path between the starting hole position and the second hole position; S3, searching the remaining hole positions and inserting the remaining hole positions in sequence into the current path; S4, calculating the path added corresponding to the hole position currently being inserted; S5, selecting the shortest path added, inserting the hole position corresponding to the shortest path added into the corresponding position in the path, and updating the path; S6, determining whether all hole positions have been inserted into the path; S7, if so, ending; if not, returning to step S3. The method can obtain the shortest drilling path and enhance the operation efficiency.

Description

Method for setting drilling path of PCB board

This application claims priority to Chinese Patent Application No. 201410056024.9, entitled "Drilling Path Setting Method for PCB Board", filed on February 19, 2014, the entire contents of which are incorporated by reference. In this application.

Technical field

The invention relates to a drilling path setting method, in particular to a path setting method for performing hole drilling on a PCB board.

Background technique

During the manufacturing process of the PCB board, the drilling process is included, that is, the PCB board is placed on the laser drilling machine, and the corresponding position of the PCB board is drilled by the device to facilitate subsequent use. At this stage, on the PCB board, the graphics within a galvanometer grid are cut in the order of graphics read, split, and edited. At the same time, these graphics may be divided into different layers, different parameters, and different focal points for cutting. So the order in which these holes are cut may have to be repeated several times. The order of one pass is not optimized enough, and the entire galvanometer pattern is repeatedly cut in multiple layers, and it is possible to cut a large part of the time on the galvanometer.

Summary of the invention

The technical problem to be solved by the present invention is to provide a drilling path setting method for a PCB board, which can obtain a short drilling path.

In order to solve the above technical problems, the present invention adopts the following technical solutions:

A method for setting a drilling path of a PCB board, comprising the following steps:

S1, obtaining a hole pattern in a galvanometer cell that has been divided on the PCB, calculating a distance between two holes in the galvanometer cell, obtaining a distance matrix, and setting a starting hole position;

S2, obtaining a hole position closest to the starting hole position and using the hole position as a second hole position, the initial hole position and the second hole position forming an initial path;

S3, searching for the remaining hole positions, and inserting the remaining hole positions into the current path one by one;

S4, calculating an extended path corresponding to the current insertion hole position;

S5, selecting the shortest extended path, inserting the corresponding hole position of the shortest extended path into the phase of the path Should be located, update the path;

S6, whether all the holes have been inserted into the path;

S7, if yes, the process ends; if not, the process returns to step S3.

In the step S1, when calculating the distance between the hole positions, it is calculated according to the formula sqrt((xi-xj)*(xi-xj)+(yi-yj)*(yi-yj)).

The invention selectively sets the path of the hole position in the galvanometer mirror to obtain a shorter drilling path, and cooperates with the equipment drilling, which can effectively reduce the operation time of the device and improve the working efficiency.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can obtain other drawings according to the provided drawings without any creative work.

1 is a schematic flow chart of the principle of the present invention;

2 is a schematic view showing a conventional drilling path setting effect of any PCB board;

Figure 3 is a schematic view showing the effect of the drilling path after setting according to the present invention;

4 is a schematic diagram of a path for setting a pattern hole on a PCB by a prior art method in a specific embodiment;

5 is an effect diagram of setting a path of a pattern hole on a PCB by the method provided by the present invention in a specific embodiment;

6 is another effect diagram of an effect diagram of setting a path of a pattern hole on a PCB by the method provided by the present invention in a specific embodiment;

FIG. 7 is another effect diagram of an effect diagram of setting a path of a pattern hole on a PCB by the method provided by the present invention in a specific embodiment; FIG.

FIG. 8 is a cutting and sorting method for each galvanometer grid on a PCB board according to the present invention.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention. Rather than all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the accompanying drawings.

The invention discloses a drilling path setting method for a PCB board, which comprises the following steps:

S1: Obtain a hole pattern in a galvanometer cell that has been divided on the PCB, calculate a distance between two holes in the galvanometer cell, obtain a distance matrix, and set a starting hole position. For a PCB board that has divided the drilling pattern into a galvanometer grid, the block is divided into multiple regions by using a block (magnet mirror), and the galvanometer cell to be cut first is selected, and the galvanometer is usually obtained. One of the most central holes in the grid serves as the starting hole. It can be calculated according to the formula sqrt((xi-xj)*(xi-xj)+(yi-yj)*(yi-yj)), calculate the distance between each hole position, and then record and save it. Can be directly queried, xi, yi is the coordinate value of the corresponding hole position.

S2: Obtain a hole position closest to the starting hole position and use the hole position as a second hole position, and the starting hole position forms an initial path with the second hole position.

S3, search for the remaining hole positions, and insert the remaining hole positions into the current path one by one. When the third hole position is searched, the third hole position is inserted into the initial path. Since the initial path has only two hole positions, the insertion position of the third hole position has only two cases, and the first insertion position is the insertion hole position. The other is the middle of the second hole position, and the other is the third hole position inserted behind the second hole position. The other holes in the back are inserted accordingly.

S4: Calculate the extended path corresponding to the current insertion hole position. The corresponding extended path of all the remaining hole positions inserted into the same position is calculated.

S5: Select the shortest extended path, insert the corresponding hole position of the shortest extended path into the corresponding position of the path, and update the path. From the calculation result of step S5, the shortest extended path is selected, and the position of the hole corresponding to the extended path and the position of the path are determined. The current path is updated when the hole is inserted into the corresponding position of the path.

S6, whether all the holes have been inserted into the path.

S7, if yes, complete the setting of the path and end; if not, return to step S3, continue the search, and perform processing according to steps 4 and 5.

For example, the selected starting hole position is the hole position i, and the closest to the hole position i is the second hole position j, the initial path can be marked as S={i, j}, and the initial path length T=D(i, j) There are 3 remaining holes, which are S, H and K respectively. When searching for the remaining hole positions, the hole position S, the hole position H and the hole position K are searched respectively, and then the hole position S is first inserted into the path S={i, j}, and has two insertion positions, respectively Between the hole position i and the hole position j, or after the hole position j, that is, S={i, S, j}, respectively, the corresponding extended path Dis=D(i, S)+D(S, j)-D(i,j); and S=={i,j,S}, the corresponding extended path Dis=D(j,S), and save the calculation result record. Then, the hole position H is inserted into the path S={i, j}, and has two insertion positions, which are inserted between the hole position i and the hole position j, respectively, or inserted in the hole position j, that is, S={ i, H, j}, the corresponding extended path Dih=D(i,H)+D(H,j)-D(i,j); and S=={i,j,H}, corresponding The range path Dih=D(j,H) saves the calculation result record. Then insert the hole position K into the path S={i, j}, and have two insertion positions, which are inserted between the hole position i and the hole position j, respectively, or inserted in the hole position j, that is, S={ i, K, j}, the corresponding extended path Dik=D(i, K)+D(K,j)-D(i,j); and S=={i,j,K}, corresponding The range path Dik=D(j, K) is saved and the calculation result record is saved. According to the above calculation result, the shortest extended path is selected, and then the hole position is inserted into the corresponding position of the path to form a new path.

If the hole position inserted for the first time is S, the shortest extended path is to insert the hole position S in the middle of the path, that is, the new path S={i, S, j}. At this time, there is no insertion path for the hole position H and the hole position K, and the search needs to be continued. At this time, the hole positions H and K are inserted into the path S={i, S, j}, and there are three insertion modes, namely in the i and Between S, S and j, and after j, then calculate the extended path of hole H and hole K in these three cases respectively, select the shortest extended path from it, and insert the corresponding hole into the corresponding position. Assume that the position after the hole K is inserted into j is the shortest extended path, that is, the path is updated to S={i, S, j, K}. At this time, only the last hole H has not been inserted. At this time, the hole H is inserted into the path S{i, S, j, K}, and the position of the extended path corresponding to the position is the shortest, and the shortest extended range is selected. The position corresponding to the path is inserted. The path insertion of the entire hole position is completed, and the path setting is completed.

When there are other numbers of holes, insert them as described above to obtain a shortest extended path, ensuring a shorter operating time.

As shown in FIG. 2, it is a schematic diagram of a conventional drilling path of a PCB to be drilled, and the total length of the path is 29569.024445 mm. The optimized drilling path in accordance with the method of the present invention, As shown in Figure 3, the total length of the path is shortened to 12281.674882.

Generally, when the galvanometer is divided, not all the holes are just inside the galvanometer grid, and some of the holes are on the boundary line of two or more adjacent galvanometer grids, so that the hole path setting is performed on the internal pattern of the galvanometer grid. There will be deviations. Therefore, based on the above method, the paper further optimizes the division of the galvanometer grid. See the following description for details.

Referring to FIG. 8, the galvanometer cell in step S1 is divided by the following method:

S11, reading a graphic on the PCB, and setting a block size and a starting point of the graphic;

S12, dividing the graphic according to the set block size, and determining whether any hole constituting the graphic on the PCB is located on a boundary of the adjacent galvanometer grid, and if so, adjusting each of the boundaries The size of the mirror is sized such that the aperture is located inside one of the galvanometer cells.

Through the above method, the hole or small independent figure constituting the figure belongs only to the inside of a single galvanometer cell, which improves the accuracy of setting the path of the hole.

In addition, for the relatively large connection pattern on the PCB, the following operations are performed: after the block is divided into blocks according to the set block size in step S12 of the above embodiments, the following judgment is also made: if the connection pattern is judged to be out of vibration The mirror range is used to independently interrupt the connection pattern.

At present, the cutting order of all the galvanometer grids is based on the center of the galvanometer grid as the sorting reference. However, for the non-uniform distribution of the holes in the galvanometer grid, the path obtained by this calculation method is not optimally cut. path. Therefore, the following optimizations are made for the galvanometer grid sorting of non-uniform patterns of hole distribution.

In a preferred embodiment, after step S12 in the foregoing embodiments, the following steps may be added:

S13. Calculate a centroid position of a graphic included in all the galvanometer cells, and determine the particle point closest to the starting point of the graphic, and use the galvanometer cell where the particle is located as a cutting start position galvanometer And obtaining a relative position distance between the centroids of each of the galvanometer cells, thereby obtaining a first distance matrix, and sorting each of the galvanometer cells according to a shortest path finding algorithm as a cutting of each of the galvanometer cells The centroid is determined according to the density of the holes in the inner pattern of the galvanometer grid, that is, the centroid is close to the position where the density of the holes is large. This completes the sorting of the graphics within all galvanometer cells.

Further, after the determination result in step S7 is YES, the following steps are also performed before the end:

S8. Perform path setting on the pattern in the next galvanometer cell according to the cutting order of the galvanometer cells formed in step S13, and form a cutting path of all the galvanometer cells into a total cutting path.

In this way, the graphics in all the galvanometer grids are sorted by the cutting path and the total cutting path is formed.

On the actual drilling platform, because of the process requirements, dense graphics may require X or Y direction priority. For example, when winding a roll to a roll, it is required to minimize the pulling back and forth in the Y direction, which requires preferential punching in the X direction. Therefore, the above embodiments can further advance as follows for different process requirements.

In the above embodiments, the X-direction weight parameter Weights_x1 and the Y-direction weight parameter Weights_y1 are further provided in the step S11, and the relative position distance between the centroids is further calculated and obtained according to the Weights_x and Weights_y1.

Of course, before the step S1, the X-direction weight parameter Weights_x2 and the Y-direction weight parameter Weights_y2 are further provided. In the step S1, when calculating the distance between the hole positions, the acquisition is further calculated according to the Weights_x2 and Weights_y2.

Among them, the values of Weights_x1 and Weights_x2 may be the same or different; similarly, the values of Weights_y1 and Weights_y2 may be the same or different. Weights_x1, Weights_x2, Weights_y1, and Weights_y2 have a value range of 0-2, and the initial default value can be set to 1.

It has been proved by experiments that the working state of the motor also has a certain influence on the path optimization.

Before calculating the distance between the hole positions in step S1, judging the working state of the motor, if the motor is in the interlocking working state, the distance between the hole positions is calculated by the formula D1=sqrt(dis_x*dis_x+dis_y*dis_y);

If the motor is in single-axis operation, the distance between the hole positions is calculated by the formula D2=abs(dis_x)+abs(dis_y);

If the motor is in the two-axis motion at constant speed, the distance between the holes is calculated by the formula D3=max(abs(dis_x), abs(dis_y));

Where dis_x=(xi-xj)*Weights_x2; dis_y=(yi-yj)*Weights_y2.

In the hole path setting of a specific PCB board, please refer to FIG. 4 to FIG. 7 . FIG. 4 is a schematic diagram of a path for setting a pattern hole on a PCB by a prior art method according to a specific embodiment; FIG. In a specific embodiment, the method for providing a graphic hole on a PCB is provided by the method provided by the present invention. An effect diagram of the path; wherein the hole spacing is calculated by the D1 formula, the galvanometer grid size is 35 mm*35 mm, and the values of Weights_x2 and Weights_y2 are both 1.0; FIG. 6 is a specific embodiment provided by the present invention. The method sets another effect diagram of the path of the graphic hole on the PCB; wherein the hole spacing is calculated by the D1 formula, the galvanometer grid size is 25*25, and the values of Weights_x2 and Weights_y2 are 1.0 and 1.2, respectively; Another effect diagram of an effect diagram of setting a path of a pattern hole on a PCB by the method provided by the present invention in a specific embodiment; wherein the pitch of the hole is calculated by the D2 formula, and the size of the galvanometer grid is 25 mm* The values of 25mm, Weights_x2 and Weights_y2 are 1.0 and 1.2, respectively.

As can be seen from Figure 4, the original pattern has two layers, each layer has different cutting parameters. In the actual cutting, some parameters can be switched in real time, and some parameters must be switched after one layer is completed. What is set here is that each layer of parameters is independent and cannot be switched in real time, so the entire cutting surface needs to be cut twice. As can be seen from Fig. 1, after the original data is directly imported, most of the paths in the sequential path are empty, which seriously affects the efficiency of cutting and drilling.

However, the paths acquired by the methods provided in the present invention (Figs. 5, 6, and 7) are optimized to varying degrees compared to the prior art.

It should be noted that the “printing” described herein means to use a laser drill or other methods to remove the material, that is, the printing hole is equivalent to the cutting hole, and the hole after the cutting may be a through hole or a blind hole, that is, Said, the meaning of "printing" in this article is the same as the basic meaning of "cutting".

The method for setting the path of the hole drilling on the PCB board provided by the present invention is described in detail above. The principles and embodiments of the present invention have been described herein with reference to specific examples, and the description of the above embodiments is only to assist in understanding the method of the present invention and its core idea. It should be noted that those skilled in the art can make various modifications and changes to the present invention without departing from the spirit and scope of the invention.

Claims (10)

1. A method for setting a drilling path of a PCB board, comprising the following steps:

   S1, obtaining a hole pattern in a galvanometer cell that has been divided on the PCB, calculating a distance between two holes in the galvanometer cell, obtaining a distance matrix, and setting a starting hole position;

   S2, obtaining a hole position closest to the starting hole position and using the hole position as a second hole position, the initial hole position and the second hole position forming an initial path;

   S3, searching for the remaining hole positions, and inserting the remaining hole positions into the current path one by one;

   S4, calculating an extended path corresponding to the current insertion hole position;

   S5, selecting a shortest extended path, inserting a corresponding hole position of the shortest extended path into a corresponding position of the path, and updating the path;

   S6, whether all the holes have been inserted into the path;

   S7, if yes, the process ends; if not, the process returns to step S3.
2. The drilling path setting method of a PCB board according to claim 1, wherein in the step S1, when calculating the distance between the hole positions, according to the formula sqrt((xi-xj)*(xi-xj) ) + (yi-yj) * (yi-yj)) is calculated.
3. The drilling path setting method of the PCB board according to claim 1, wherein the galvanometer mirror in the step S1 is divided by the following method:

   S11, reading a graphic on the PCB, and setting a block size and a starting point of the graphic;

   S12, dividing the graphic according to the set block size, and determining whether any hole constituting the graphic on the PCB is located on a boundary of the adjacent galvanometer grid, and if so, adjusting each of the boundaries The size of the mirror is sized such that the aperture is located inside one of the galvanometer cells.
4. The drilling path setting method of the PCB board according to claim 1, wherein after the block is segmented according to the set block size in step S12, the following judgment is also made: if the connection figure is judged to be exceeded The galvanometer range is used to independently interrupt the connection pattern.
5. The method for setting a drilling path of a PCB according to claim 1, wherein after step S12, the following steps are performed:

   S13. Calculate a centroid position of all the graphics included in the galvanometer cell, and determine the particle point closest to the starting point of the graphic, and use the galvanometer grid where the particle is located as the cutting start bit. And locating the relative position distance between the centroids of each of the galvanometer cells, thereby obtaining a first distance matrix, and sorting each of the galvanometer cells according to a shortest path obtaining algorithm, as each of the vibrations The cutting order of the mirrors; the centroid is determined according to the density of the holes in the inner pattern of the galvanometer grid.
6. The drilling path setting method of the PCB board according to claim 5, wherein after the determination result in step S7 is YES, the following steps are further performed before the end:

   S8. Perform path setting on the pattern in the next galvanometer cell according to the cutting order of the galvanometer cells formed in step S13, and form a cutting path of all the galvanometer cells into a total cutting path.
7. The drilling path setting method of the PCB board according to claim 5, wherein the step S11 is further provided with an X-direction weight parameter Weights_x1 and a Y-direction weight parameter Weights_y1, and a relative position between the centroids. The distance is further calculated based on the Weights_x and Weights_y1 calculations.
8. The drilling path setting method of the PCB board according to any one of claims 1 to 7, wherein the step S1 is further provided with an X-direction weight parameter Weights_x2 and a Y-direction weight parameter Weights_y2, the step In S1, when calculating the distance between the hole positions, the acquisition is further calculated according to the Weights_x2 and Weights_y2.
9. The method for setting a drilling path of a PCB board according to claim 8, wherein before the calculating the distance between the hole positions in step S1, determining the working state of the motor, if the motor is in the interlocking working state, the hole position The distance between the two is calculated by the formula sqrt(dis_x*dis_x+dis_y*dis_y);

   If the motor is in single-axis operation, the distance between the hole positions is calculated by the formula abs(dis_x)+abs(dis_y);

   If the motor is in the two-axis motion at constant speed, the distance between the holes is calculated by the formula max(abs(dis_x), abs(dis_y));

   Where dis_x=(xi-xj)*Weights_x2;

   Dis_y=(yi-yj)*Weights_y2.
10. The method for setting a drilling path of a PCB according to claim 8, wherein the value of Weights_x2 ranges from 0 to 2; and the range of Weights_y2 ranges from 0 to 2.

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