WO2015122574A1 - Method for manufacturing nfc antenna for portable terminal - Google Patents

Method for manufacturing nfc antenna for portable terminal Download PDF

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Publication number
WO2015122574A1
WO2015122574A1 PCT/KR2014/004783 KR2014004783W WO2015122574A1 WO 2015122574 A1 WO2015122574 A1 WO 2015122574A1 KR 2014004783 W KR2014004783 W KR 2014004783W WO 2015122574 A1 WO2015122574 A1 WO 2015122574A1
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WIPO (PCT)
Prior art keywords
forming
nfc antenna
case
circuit
plating layer
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PCT/KR2014/004783
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French (fr)
Korean (ko)
Inventor
박인성
장승준
이성형
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주식회사 유텍솔루션
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Publication of WO2015122574A1 publication Critical patent/WO2015122574A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/04—Screened antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna

Definitions

  • the present invention relates to a method for manufacturing an NFC antenna for a mobile terminal, and more particularly, to a method for manufacturing an NFC antenna for a mobile terminal capable of forming an NFC antenna directly on a case of a mobile terminal or a battery pack case for a mobile terminal.
  • NFC Near Field Communication
  • RFID radio frequency identification
  • Such NFC is widely used not only for payment but also for transmitting goods information or travel degree for visitors, traffic access control locks in supermarkets or general stores.
  • the conventional NFC antenna manufacturing method for a mobile terminal uses an NFC antenna having a loop-shaped circuit pattern formed on a separate substrate such as a flexible printed circuit board (FPCB). It is made by attaching to the case of the portable terminal or the case of the battery pack for the portable terminal, it is very inconvenient to attach the NFC antenna manufactured separately from the portable terminal to the portable terminal again, which makes the manufacturing process complicated. There is a problem that the manufacturing cost rises.
  • FPCB flexible printed circuit board
  • the present invention is to solve the above problems, a mobile terminal that can form the NFC antenna in the case of the portable terminal or the battery pack case for the portable terminal directly without the need to reattach the NFC antenna prepared separately to the portable terminal Provides a method for manufacturing NFC antenna for.
  • NFC antenna manufacturing method for a mobile terminal comprises a case preparation step of preparing a mobile terminal case or a battery pack case for a mobile terminal; Forming a hydrophobic film on the entire surface of the case by immersing the case in an aqueous hydrophobic material solution; Irradiating a laser to the NFC antenna circuit pattern region of the case after the hydrophobic film forming step to remove the hydrophobic film on the surface of the circuit pattern region and to roughen the surface roughness of the circuit pattern region; An NFC antenna circuit forming step of forming a circuit forming plating layer on the circuit pattern region by electroless plating after the laser irradiation step; And a ferrite sheet attaching step of attaching a ferrite sheet to the case to cover the circuit forming plating layer after the NFC antenna circuit forming step.
  • the case preparation step the step of injection molding the case so that a groove is formed in the NFC antenna terminal forming region of the case, the NFC antenna manufacturing method for a mobile terminal, before the NFC antenna circuit forming step In the groove may further include an NFC antenna terminal forming step of inserting the NFC antenna terminal forming pin into the groove.
  • the NFC antenna circuit forming step the first seed forming step of forming a paradium seed in the circuit pattern region; A circuit forming step of forming a circuit forming copper plating layer in the circuit pattern region after the first seed forming step; A second seed forming step of forming a paradium seed on the circuit forming copper plating layer after the circuit forming step; And a circuit protection layer forming step of forming a circuit protection nickel plating layer on the circuit forming copper plating layer on which the paradium seed is formed after the secondary seed forming step.
  • the case is immersed in a palladium aqueous solution having a palladium concentration of 60 to 200 ppm to form palladium seed in the circuit pattern region, and the secondary seed forming step is to dig the case. It is preferable to form a paradium seed in the said circuit formation copper plating layer by immersing in the aqueous paradium solution which consists of 20-40 ppm of radium concentrations.
  • the circuit forming step may include: forming a metal thin film plating layer on the circuit pattern region; After the metal thin film forming step, the soft etching step to fine-tune the edge of the metal thin film plating layer; And a copper plating layer forming step of forming the circuit forming copper plating layer on the metal thin film plating layer after the soft etching step.
  • the case is immersed in an aqueous copper sulfate solution for 10 to 20 minutes to form a metal thin film copper plating layer in the circuit pattern region, and the soft etching step is immersed in the soft etching solution for 20 to 40 seconds.
  • the edge of the metal thin copper plating layer is finely formed, and the copper plating layer forming step may be performed by immersing the case in copper sulfate aqueous solution for 180 to 240 minutes to form the circuit forming copper plating layer on the metal thin copper plating layer.
  • the method of manufacturing an NFC antenna for a mobile terminal may further include an ultrasonic degreasing step of removing dust generated in the laser irradiation step between the laser irradiation step and the NFC antenna circuit forming step.
  • an NFC antenna may be directly formed on a case of a mobile terminal or a battery pack case for a mobile terminal without the need to reattach the NFC antenna separately prepared to the portable terminal as in the prior art.
  • the manufacturing process for providing the NFC antenna in the mobile terminal can be simplified, thereby reducing the manufacturing cost.
  • FIG. 1 is a view schematically showing a method for manufacturing an NFC antenna for a mobile terminal according to the present invention
  • FIG. 2 is a photograph showing an example of an NFC antenna for a mobile terminal
  • FIG 3 is a photograph showing a state in which the NFC antenna circuit pattern is formed on the inner surface of the rear case of the mobile terminal by the manufacturing method according to the present invention.
  • FIG. 1 is a view schematically showing a method for manufacturing an NFC antenna for a mobile terminal according to the present invention.
  • the NFC antenna manufacturing method for a mobile terminal is a case preparation step (S10), hydrophobic film forming step (S20), laser irradiation step (S30), NFC antenna circuit forming step (S40), ferrite Sheet attaching step (S50) is included.
  • the case preparing step (S10) is a step of preparing a case which is a part of a mobile terminal to form an NFC antenna, the case is preferably a case forming the appearance of the case or the battery pack for a mobile terminal of the mobile terminal. Do.
  • the method of manufacturing an NFC antenna for a portable terminal relates to a method for directly forming an NFC (Near Field Communication) antenna, that is, an antenna for short range wireless communication, in a portable terminal. Therefore, there is a need for a part of the portable terminal to form the NFC antenna, the present invention uses a case of the appearance of the portable terminal or the case of the battery pack for the portable terminal as the part.
  • the NFC antenna is preferably formed on the inner side of the rear case forming the rear appearance of the mobile terminal.
  • the case is a part constituting a part of the portable terminal, the shape can be made in a complex and various, so the case is preferably manufactured by injection molding that can be easily mass-produced in a complex and various shapes.
  • the material of the case is a thermoplastic resin such as PC (Polycarbonate) resin, polyester resin, ABS (Acrylonitrile-Butadiene-Styrene) resin, PC / ABS resin mixture, polyamide resin, modified polyphenylene ether resin , Liquid crystal polymer, engineering plastic, PC / GF (Poly-carbonate + Glassfiber) and the like can be used.
  • the hydrophobic film forming step (S20) is a step of forming a hydrophobic film on the entire surface of the case by immersing the case in an aqueous hydrophobic material solution
  • the laser irradiation step (S30) after the hydrophobic film forming step (S20) NFC of the case Irradiating a laser to the antenna circuit pattern region to remove the hydrophobic film on the surface of the circuit pattern region and at the same time roughening the surface roughness of the circuit pattern region
  • the NFC antenna circuit forming step (S40) is the laser irradiation step (S30) Thereafter, forming a circuit forming plating layer in the circuit pattern region by electroless plating, and attaching the ferrite sheet (S50) covers the circuit forming plating layer after the NFC antenna circuit forming step (S40). In this step, a ferrite sheet is attached to the case.
  • NFC antenna manufacturing method for a mobile terminal in order to form an NFC antenna directly on the portable terminal without the need to attach the NFC antenna formed on a separate substrate to the portable terminal as in the prior art, a case which is a part of the portable terminal Directly forming the circuit forming plating layer to form the NFC antenna circuit by electroless plating (NFC antenna circuit forming step (S40)), for this purpose, the hydrophobic film forming step (S20) before the NFC antenna circuit forming step (S40) And the laser irradiation step (S30).
  • the circuit of the fine NFC antenna may be directly formed on the case surface using only electroless plating. Can be.
  • the electroless plating solution penetrates only the circuit pattern region to form a circuit forming plating layer only on the surface thereof, whereas the laser is not irradiated on the surface of the case and covered with a hydrophobic film. This is because the surface of the electroless plating solution does not penetrate and no plating layer is formed.
  • the hydrophobic film on the surface of the circuit pattern region is removed at the same time as the laser irradiation step (S30) and the surface roughness is roughened, even if the case is made of a plastic material which is difficult to electrolessly plate (generally a mobile terminal)
  • the portable terminal case or the battery pack case for the portable terminal, which is a part of the product, is made of a plastic material that is easily injection molded.)
  • a circuit forming plating layer can be formed in the circuit pattern region.
  • the aqueous solution of hydrophobic material may be a thioacetal compound aqueous solution, a polyfluorocarbon aqueous solution, an oxyethylated sorbitan monolaurate aqueous solution, or the like, and the ferrite sheet is a magnetic absorber for improving the operational reliability of the NFC antenna.
  • FIG. 2 is a photograph showing an example of an NFC antenna for a mobile terminal, and is a photograph schematically showing a state in which an NFC antenna is provided on an inner side surface of a rear case of the portable terminal.
  • the NFC antenna 1 when the NFC antenna 1 is provided on the inner side of the rear case 2 of the mobile terminal, when the rear case 2 is coupled to the mobile terminal, the NFC antenna 1 is coupled to the mobile terminal.
  • An NFC antenna terminal 4 is formed to allow the main body 3 of the portable terminal and the NFC antenna 1 to be electrically connected to each other.
  • Two NFC antenna terminals 4 are formed at one end and the other end of the NFC antenna circuit 5 having a loop circuit pattern.
  • the NFC antenna terminal 4 is formed from the ferrite sheet 7 so that the rear case 2 is easily contacted with the contact terminal 6 of the main body 3 of the mobile terminal when the rear case 2 is coupled to the main body 3 of the mobile terminal. It can be protruding.
  • the case preparation step (S10) is injection molding step of injection molding the case so that a groove is formed in the NFC antenna terminal forming region of the case Includes
  • NFC antenna manufacturing method for a mobile terminal according to the present invention may further comprise the NFC antenna terminal forming step of inserting the NFC antenna terminal forming pin into the groove. Then, the NFC antenna terminal can be easily formed in the case.
  • the terminal forming step is preferably performed between the hydrophobic film forming step (S20) and the NFC antenna circuit forming step (S40) to be made before the NFC antenna circuit forming step (S40). Then, in the NFC antenna circuit forming step (S40), since the electroless plating is performed while the terminal forming pin is inserted into the groove, the circuit forming plating layer formed during the electroless plating is inserted into the groove. It may also be formed on the forming pin. When the circuit forming plating layer is formed on the terminal forming pin during the electroless plating, the electrical connection between the NFC antenna terminal and the NFC antenna circuit can be made automatically, and the terminal forming pin inserted into the groove is formed in the circuit. It can be firmly fixed while being integral with the plating layer.
  • the method of manufacturing an NFC antenna for a mobile terminal according to the present invention is such that the terminal forming step may be simultaneously performed in the injection molding step, wherein the injection molding step is coupled to the NFC antenna terminal forming area of the case.
  • the NFC antenna circuit forming step S40 includes a first seed forming step, a circuit forming step, a second seed forming step, and a circuit protection layer forming step.
  • the first seed forming step is a step of forming a palladium (Pd) seed in the circuit pattern region
  • the circuit forming step is a circuit in the circuit pattern region where the palladium seed is formed after the first seed formation step Forming a copper plating layer
  • the secondary seed forming step is a step of forming a paradium seed in the copper plating layer after the circuit forming step
  • the circuit protection layer forming step is a second seed forming step, Forming a circuit protection nickel plating layer on the circuit forming copper plating layer on which the palladium seed is formed.
  • the first seed forming step is a step for facilitating the formation of an electroless copper plating layer for forming a circuit of the NFC antenna in the circuit pattern region. It can be made by immersion in an aqueous solution of radium or an aqueous solution of palladium chloride. As such, when the case irradiated with the laser only in the circuit pattern region is immersed in the palladium aqueous solution, palladium seed may be formed only in the circuit pattern region.
  • the secondary palladium seed forming step is to facilitate the formation of a circuit protection nickel plating layer on the circuit-forming copper plating layer, it may be made by immersing the case in which the palladium seed is formed in the copper plating layer in an electroless nickel plating solution. .
  • an electroless nickel plating layer is further formed on the circuit pattern region in which the electroless copper plating layer is formed so as to improve the conductivity and corrosion resistance of the copper plating layer forming the circuit of the NFC antenna so that the function as the NFC antenna can be made smoothly. It's a step. This may be made possible by the step of forming the secondary palladium seed between the circuit forming step and the circuit protection layer forming step.
  • the primary seed forming step is a step of physically forming a paradium seed on the surface roughened by laser irradiation, the palladium concentration of the aqueous solution of palladium in the primary seed forming step is made of 60 ⁇ 200ppm
  • the secondary seed forming step is a step of chemically forming a paradium seed in the copper plating layer, it is preferable that the palladium concentration of the aqueous solution of palladium in the secondary seed forming step is made of 20 ⁇ 40ppm.
  • the circuit forming step is a step of forming a copper plating layer forming a circuit of the NFC antenna, it may be made including a metal thin film forming step, soft etching step and copper plating layer forming step.
  • the metal thin film forming step is a step of forming a metal thin film plating layer in the circuit pattern region on which the palladium seed is formed
  • the soft etching step is a step of making a fine edge of the metal thin film plating layer after the metal thin film forming step
  • the circuit forming copper plating layer is formed on the metal thin plated layer having a fine edge.
  • the metal thin film forming step and the soft etching step may be further performed to form a fine NFC antenna circuit.
  • the metal thin film forming step may be performed by immersing the case where the paradium seed is formed only in the circuit pattern region in the copper sulfate aqueous solution for 10 to 20 minutes, and the soft etching step is 20 ⁇ 20 ⁇ the case in which the metal thin film copper plating layer is formed in the soft etching solution. It may be made by immersing for 40 seconds, the copper plating layer forming step may be made by immersing the case in which the edge of the metal thin film copper plating layer is fine in the copper sulfate aqueous solution for 180 to 240 minutes. In another embodiment, the metal thin film forming step may be immersed in an electroless nickel aqueous solution to form a metal thin nickel plated layer.
  • NFC antenna manufacturing method for a mobile terminal according to the present invention between the laser irradiation step (S30) and the NFC antenna circuit forming step 40, the ultrasonic degreasing step of removing dust generated in the laser irradiation step (S30). It may further include.
  • FIG 3 is a photograph showing a state in which the NFC antenna circuit pattern is formed on the inner surface of the rear case of the mobile terminal by the manufacturing method according to the present invention.
  • the method of manufacturing an NFC antenna for a portable terminal may directly form a terminal 4 and a circuit 5 constituting the NFC antenna 1 on a case 2 which is a part of the portable terminal.
  • the NFC antenna circuit (5) consisting of a fine loop circuit pattern can also be directly formed on the surface of the case (2).
  • the NFC antenna manufacturing method forms an NFC antenna on a case of a portable terminal or a battery pack case for a portable terminal directly without the need to reattach the NFC antenna prepared separately to the portable terminal.
  • the present invention may be modified in various forms. Therefore, the present invention is not limited to the embodiments disclosed in the present specification, and all forms changeable by those skilled in the art to which the present invention pertains will belong to the scope of the present invention.

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  • Computer Networks & Wireless Communication (AREA)
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Abstract

The present invention relates to a method for manufacturing an NFC antenna for a portable terminal and, particularly, to a method for manufacturing an NFC antenna for a portable terminal, capable of directly forming the NFC antenna on the case of the portable terminal or the battery pack case of the portable terminal. The method for manufacturing an NFC antenna for a portable terminal, according to the present invention, comprises: a case preparation step for preparing the case of the portable terminal or the battery pack case for the portable terminal; a hydrophobic film formation step for forming a hydrophobic film on the entire surface of the case by dipping the case into a hydrophobic material aqueous solution; a laser irradiation step for irradiating an NFC antenna circuit pattern region of the case with a laser after the hydrophobic film formation step so as to remove the hydrophobic film on the surface of the circuit pattern region and at the same time, roughen the surface of the circuit pattern region; an NFC antenna circuit formation step for forming a circuit formation plating layer in the circuit pattern region by electroless plating after the laser irradiation step; and a ferrite sheet attachment step for attaching a ferrite sheet to the case so as to cover the circuit formation plating layer after the NFC antenna circuit formation step.

Description

휴대단말기용 ＮＦＣ 안테나 제조방법Manufacturing method of NFC antenna for mobile terminal
본 발명은 휴대단말기용 NFC 안테나 제조방법에 관한 것으로서, 구체적으로는 휴대단말기의 케이스 또는 휴대단말기용 베터리팩 케이스에 직접 NFC 안테나를 형성시킬 수 있는 휴대단말기용 NFC 안테나 제조방법에 관한 것이다. The present invention relates to a method for manufacturing an NFC antenna for a mobile terminal, and more particularly, to a method for manufacturing an NFC antenna for a mobile terminal capable of forming an NFC antenna directly on a case of a mobile terminal or a battery pack case for a mobile terminal.
NFC(Near Field Communication)는 전자태그인 RFID(Radio Frequency Identification)의 하나로 13.56MHz의 주파수 대역을 사용하는 비접촉식 근거리 무선통신 모듈이다. 이러한 NFC는 결제뿐만 아니라 수퍼마켓이나 일반 상점에서 물품 정보나 방문객을 위한 여행 정도 전송, 교통출입통제 잠금장치 등에 광범위하게 활용된다.Near Field Communication (NFC) is a radio frequency identification (RFID), which is an electronic tag, and is a contactless short-range wireless communication module using a frequency band of 13.56 MHz. Such NFC is widely used not only for payment but also for transmitting goods information or travel degree for visitors, traffic access control locks in supermarkets or general stores.
근래에는 근거리 무선통신을 이용하여 단말기 간의 정보 교환, 결제, 티켓 예매, 검색 등의 기능을 가지는 스마트폰, 태블릿 PC 등의 휴대단말기가 확대되고 있으며, 그에 따라 휴대단말기용 NFC 안테나의 수요가 증가하고 있다. Recently, portable terminals such as smartphones and tablet PCs that have functions such as information exchange, payment, ticket reservation, and search between terminals using short-range wireless communication have been expanding. As a result, the demand for NFC antennas for portable terminals has increased. have.
특히, 최근에는 이러한 휴대단말기용 NFC 안테나에 대한 연구가 매우 활발히 진행되고 있으며, 그 대표적인 선행기술로는 한국등록특허공보 제10-1295404호(공고일자:2013.08.09.)의 "근거리 무선통신용 루프형 박막 안테나 및 그 제조방법", 한국등록특허공보 제10-1320873호(공고일자:2013.10.23.)의 "NFC 안테나 제조방법 및 이 제조방법으로 제조된 NFC 안테나", 한국등록특허공보 제10-1326111호(공고일자:2013.11.06.)의 "NFC 안테나와, NFC 안테나용 인쇄회로기판 및 그 제조방법", 한국등록특허공보 제10-1339018호(공고일자:2013.12.09.)의 "엔에프씨 안테나를 구비한 배터리팩" 등이 개시된다.In particular, in recent years, research on such an NFC antenna for a mobile terminal has been very active, and the representative prior art is a "short-range wireless communication loop" of Korean Patent Publication No. 10-1295404 (Date: 2013.08.09.) Type thin film antenna and its manufacturing method ", Korean Patent Publication No. 10-1320873 (published date: 2013.10.23.)" NFC antenna manufacturing method and NFC antenna manufactured by this manufacturing method ", Korea Patent Publication No. 10 "NFC Antenna, Printed Circuit Board for NFC Antenna and Manufacturing Method thereof" of Korean Patent No. 1-1326111 (Announcement Date: 2013.11.06.), And Korean Patent Publication No. 10-1339018 (Announcement Date: 2013.12.09.) Disclosed is a battery pack having an NFC antenna.
그러나, 상기 선행기술들에 기술되어 있는 바와 같이, 종래의 휴대단말기용 NFC 안테나 제조방법은 연성회로기판(FPCB, Flexible Printed Circuit Board) 등과 같은 별도의 기판에 루프형태의 회로패턴이 형성된 NFC 안테나를 휴대단말기의 케이스 또는 휴대단말기용 배터리팩의 케이스에 부착결합시킴으로써 이루어지는데, 이와 같이 휴대단말기와 별도로 제조된 NFC 안테나를 다시 휴대단말기에 부착결합시키는 것은 매우 불편한 일이며, 그로 인하여 제조공정이 복잡해지고 제조비용이 상승하는 문제가 있다.However, as described in the above-mentioned prior arts, the conventional NFC antenna manufacturing method for a mobile terminal uses an NFC antenna having a loop-shaped circuit pattern formed on a separate substrate such as a flexible printed circuit board (FPCB). It is made by attaching to the case of the portable terminal or the case of the battery pack for the portable terminal, it is very inconvenient to attach the NFC antenna manufactured separately from the portable terminal to the portable terminal again, which makes the manufacturing process complicated. There is a problem that the manufacturing cost rises.
본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서, 별도로 제조된 NFC 안테나를 휴대단말기에 다시 부착결합시킬 필요없이 직접 휴대단말기의 케이스 또는 휴대단말기용 베터리팩 케이스에 NFC 안테나를 형성시킬 수 있는 휴대단말기용 NFC 안테나 제조방법을 제공한다.The present invention is to solve the above problems, a mobile terminal that can form the NFC antenna in the case of the portable terminal or the battery pack case for the portable terminal directly without the need to reattach the NFC antenna prepared separately to the portable terminal Provides a method for manufacturing NFC antenna for.
본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 휴대단말기 케이스 또는 휴대단말기용 배터리팩 케이스를 준비하는 케이스준비 단계; 상기 케이스를 소수성(hydrophobic) 물질 수용액에 침지시켜 상기 케이스의 전체표면에 소수성막을 형성하는 소수성막형성 단계; 상기 소수성막형성 단계 이후, 상기 케이스의 NFC 안테나 회로패턴영역에 레이저를 조사하여 상기 회로패턴영역 표면의 소수성막을 제거함과 동시에 상기 회로패턴영역의 표면조도를 거칠게 하는 레이저조사 단계; 상기 레이저조사 단계 이후, 무전해도금(electroless plating)으로 상기 회로패턴영역에 회로형성도금층을 형성하는 NFC 안테나 회로형성 단계; 및 상기 NFC 안테나 회로형성 단계 이후, 상기 회로형성도금층을 덮도록 상기 케이스에 페라이트시트(Ferrite sheet)를 부착시키는 페라이트시트부착 단계;를 포함한다. NFC antenna manufacturing method for a mobile terminal according to the present invention comprises a case preparation step of preparing a mobile terminal case or a battery pack case for a mobile terminal; Forming a hydrophobic film on the entire surface of the case by immersing the case in an aqueous hydrophobic material solution; Irradiating a laser to the NFC antenna circuit pattern region of the case after the hydrophobic film forming step to remove the hydrophobic film on the surface of the circuit pattern region and to roughen the surface roughness of the circuit pattern region; An NFC antenna circuit forming step of forming a circuit forming plating layer on the circuit pattern region by electroless plating after the laser irradiation step; And a ferrite sheet attaching step of attaching a ferrite sheet to the case to cover the circuit forming plating layer after the NFC antenna circuit forming step.
바람직하게, 상기 케이스준비 단계는, 상기 케이스의 NFC 안테나 단자형성영역에 홈이 형성되도록 상기 케이스를 사출성형하는 단계를 포함하고, 상기 휴대단말기용 NFC 안테나 제조방법은, 상기 NFC 안테나 회로형성 단계 이전에, 상기 홈에 NFC 안테나 단자형성용 핀을 삽입결합시키는 NFC 안테나 단자형성 단계를 더 포함할 수 있다. Preferably, the case preparation step, the step of injection molding the case so that a groove is formed in the NFC antenna terminal forming region of the case, the NFC antenna manufacturing method for a mobile terminal, before the NFC antenna circuit forming step In the groove may further include an NFC antenna terminal forming step of inserting the NFC antenna terminal forming pin into the groove.
바람직하게, 상기 NFC 안테나 회로형성 단계는, 상기 회로패턴영역에 파라듐시드를 형성하는 1차 시드형성 단계; 상기 1차 시드형성 단계 이후, 상기 회로패턴영역에 회로형성 동도금층을 형성하는 회로형성 단계; 상기 회로형성 단계 이후, 상기 회로형성 동도금층에 파라듐시드를 형성하는 2차 시드형성 단계; 및 상기 2차 시드형성 단계 이후, 상기 파라듐시드가 형성된 회로형성 동도금층에 회로보호 니켈도금층을 형성하는 회로보호층 형성 단계;를 포함할 수 있다. Preferably, the NFC antenna circuit forming step, the first seed forming step of forming a paradium seed in the circuit pattern region; A circuit forming step of forming a circuit forming copper plating layer in the circuit pattern region after the first seed forming step; A second seed forming step of forming a paradium seed on the circuit forming copper plating layer after the circuit forming step; And a circuit protection layer forming step of forming a circuit protection nickel plating layer on the circuit forming copper plating layer on which the paradium seed is formed after the secondary seed forming step.
여기서, 상기 1차 시드형성 단계는 상기 케이스를 파라듐 농도가 60 ~ 200ppm으로 이루어지는 파라듐수용액에 침지시켜 상기 회로패턴영역에 파라듐시드를 형성하고, 상기 2차 시드형성 단계는 상기 케이스를 파라듐 농도가 20 ~ 40ppm으로 이루어지는 파라듐수용액에 침지시켜 상기 회로형성 동도금층에 파라듐시드를 형성하는 것이 바람직하다. Here, in the primary seed forming step, the case is immersed in a palladium aqueous solution having a palladium concentration of 60 to 200 ppm to form palladium seed in the circuit pattern region, and the secondary seed forming step is to dig the case. It is preferable to form a paradium seed in the said circuit formation copper plating layer by immersing in the aqueous paradium solution which consists of 20-40 ppm of radium concentrations.
또한, 상기 회로형성 단계는, 상기 회로패턴영역에 금속박막 도금층을 형성하는 금속박막형성 단계; 상기 금속박막형성 단계 이후, 상기 금속박막 도금층의 테두리를 미세하게 하는 소프트에칭 단계; 및 상기 소프트에칭 단계 이후, 상기 금속박막 도금층에 상기 회로형성 동도금층을 형성하는 동도금층형성 단계;를 포함하여 이루어지는 것이 바람직하다.The circuit forming step may include: forming a metal thin film plating layer on the circuit pattern region; After the metal thin film forming step, the soft etching step to fine-tune the edge of the metal thin film plating layer; And a copper plating layer forming step of forming the circuit forming copper plating layer on the metal thin film plating layer after the soft etching step.
또한, 상기 금속박막형성 단계는 상기 케이스를 황산구리수용액에 10 ~ 20분간 침지시켜 상기 회로패턴영역에 금속박막 동도금층을 형성하고, 상기 소프트에칭 단계는 상기 케이스를 소프트에칭액에 20 ~ 40초간 침지시켜 상기 금속박막 동도금층의 테두리를 미세하게 형성하고, 상기 동도금층형성 단계는 상기 케이스를 황산구리수용액에 180 ~ 240분간 침지시켜 상기 금속박막 동도금층에 상기 회로형성 동도금층을 형성하는 것이 바람직하다. In the forming of the metal thin film, the case is immersed in an aqueous copper sulfate solution for 10 to 20 minutes to form a metal thin film copper plating layer in the circuit pattern region, and the soft etching step is immersed in the soft etching solution for 20 to 40 seconds. The edge of the metal thin copper plating layer is finely formed, and the copper plating layer forming step may be performed by immersing the case in copper sulfate aqueous solution for 180 to 240 minutes to form the circuit forming copper plating layer on the metal thin copper plating layer.
한편, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 상기 레이저조사 단계와 상기 NFC 안테나 회로형성 단계 사이에, 상기 레이저조사 단계에서 발생한 분진을 제거하는 초음파탈지 단계를 더 포함할 수 있다.Meanwhile, the method of manufacturing an NFC antenna for a mobile terminal according to the present invention may further include an ultrasonic degreasing step of removing dust generated in the laser irradiation step between the laser irradiation step and the NFC antenna circuit forming step.
본 발명에 따른 휴대단말기용 NFC 안테나 제조방법에 의하면, 종래와 같이 별도로 제조된 NFC 안테나를 휴대단말기에 다시 부착결합시킬 필요없이 직접 휴대단말기의 케이스 또는 휴대단말기용 베터리팩 케이스에 NFC 안테나를 형성시킬 수 있어서, 휴대단말기에 NFC 안테나를 구비시키기 위한 제조공정이 간단해질 수 있으며, 그로 인하여 제조비용을 절감할 수 있는 효과가 있다. According to the method for manufacturing an NFC antenna for a mobile terminal according to the present invention, an NFC antenna may be directly formed on a case of a mobile terminal or a battery pack case for a mobile terminal without the need to reattach the NFC antenna separately prepared to the portable terminal as in the prior art. As a result, the manufacturing process for providing the NFC antenna in the mobile terminal can be simplified, thereby reducing the manufacturing cost.
본 발명에 따른 효과들은 이상에서 언급된 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 청구범위와 상세한 설명의 기재로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진자에게 명확하게 이해될 수 있을 것이다.Effects according to the present invention are not limited to the above-mentioned effects, and other effects not mentioned above will be clearly understood by those skilled in the art from the claims and the detailed description. Could be.
도 1은 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법을 개략적으로 나타내는 도면이고, 1 is a view schematically showing a method for manufacturing an NFC antenna for a mobile terminal according to the present invention,
도 2는 휴대단말기용 NFC 안테나의 일 예를 나타내는 사진이고,2 is a photograph showing an example of an NFC antenna for a mobile terminal,
도 3은 본 발명에 따른 제조방법에 의하여 휴대단말기의 뒷면 케이스의 내측면에 NFC 안테나 회로패턴이 형성된 상태를 나타내는 사진이다.3 is a photograph showing a state in which the NFC antenna circuit pattern is formed on the inner surface of the rear case of the mobile terminal by the manufacturing method according to the present invention.
이하, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법의 실시 예들에 대하여 상세히 설명한다. 다만 그 실시 예들은 다양한 형태로 변경가능하다 할 것이다. 따라서 본 발명은 본 명세서에서 개시된 실시 예들에 의해 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 변경 가능한 모든 형태의 실시 예들도 본 발명의 권리범위에 속한다 할 것이다.Hereinafter, embodiments of a method of manufacturing an NFC antenna for a mobile terminal according to the present invention will be described in detail. However, the embodiments may be changed in various forms. Accordingly, the present invention is not limited to the embodiments disclosed herein, and all forms of embodiments that can be modified by those skilled in the art may belong to the scope of the present invention.
도 1은 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법을 개략적으로 나타내는 도면이다. 1 is a view schematically showing a method for manufacturing an NFC antenna for a mobile terminal according to the present invention.
도 1을 참조하면, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 케이스준비 단계(S10), 소수성막형성 단계(S20), 레이저조사 단계(S30), NFC 안테나 회로형성 단계(S40), 페라이트시트부착 단계(S50)를 포함한다.Referring to Figure 1, the NFC antenna manufacturing method for a mobile terminal according to the present invention is a case preparation step (S10), hydrophobic film forming step (S20), laser irradiation step (S30), NFC antenna circuit forming step (S40), ferrite Sheet attaching step (S50) is included.
상기 케이스준비 단계(S10)는 NFC 안테나를 형성시킬 휴대단말기의 일 부품인 케이스를 준비하는 단계로서, 상기 케이스는 휴대단말기의 외관을 이루는 케이스 또는 휴대단말기용 배터리팩의 외관을 이루는 케이스인 것이 바람직하다. The case preparing step (S10) is a step of preparing a case which is a part of a mobile terminal to form an NFC antenna, the case is preferably a case forming the appearance of the case or the battery pack for a mobile terminal of the mobile terminal. Do.
본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 NFC(Near Field Communication) 안테나 즉, 근거리 무선통신용 안테나를 휴대단말기에 직접 형성시킬 수 있는 방법에 관한 것이다. 따라서, NFC 안테나를 형성시킬 휴대단말기의 일부품이 필요한데, 본 발명은 상기 일부품으로서 휴대단말기의 외관을 이루는 케이스 또는 휴대단말기용 배터리팩의 케이스를 사용한다. 특히, 상기 일부품이 휴대단말기의 외관을 이루는 케이스인 경우에는, NFC 안테나는 휴대단말기의 뒷면 외관을 이루는 뒷면 케이스의 내측면에 형성됨이 바람직하다. The method of manufacturing an NFC antenna for a portable terminal according to the present invention relates to a method for directly forming an NFC (Near Field Communication) antenna, that is, an antenna for short range wireless communication, in a portable terminal. Therefore, there is a need for a part of the portable terminal to form the NFC antenna, the present invention uses a case of the appearance of the portable terminal or the case of the battery pack for the portable terminal as the part. In particular, when the part is a case forming the appearance of the mobile terminal, the NFC antenna is preferably formed on the inner side of the rear case forming the rear appearance of the mobile terminal.
상기 케이스는 휴대단말기의 일부를 이루는 일 부품으로서, 그 형상은 복잡하고 다양하게 이루어질 수 있으며, 따라서 상기 케이스는 복잡하고 다양한 형상으로 쉽게 대량생산이 가능한 사출성형으로 제조됨이 바람직하다. 예를들어, 상기 케이스의 소재로는 PC(Polycarbonate)수지, 폴리에스테르수지, ABS(Acrylonitrile-Butadiene-Styrene)수지 등의 열가소성 수지, PC/ABS 수지 혼합물, 폴리아미드 수지, 변성 폴리페닐렌에테르수지, 액정폴리머, 엔지니어링플라스틱, PC/GF(Poly-carbonate+Glassfiber) 등이 사용될 수 있다. The case is a part constituting a part of the portable terminal, the shape can be made in a complex and various, so the case is preferably manufactured by injection molding that can be easily mass-produced in a complex and various shapes. For example, the material of the case is a thermoplastic resin such as PC (Polycarbonate) resin, polyester resin, ABS (Acrylonitrile-Butadiene-Styrene) resin, PC / ABS resin mixture, polyamide resin, modified polyphenylene ether resin , Liquid crystal polymer, engineering plastic, PC / GF (Poly-carbonate + Glassfiber) and the like can be used.
상기 소수성막형성 단계(S20)는 케이스를 소수성 물질 수용액에 침지시켜 케이스의 전체표면에 소수성막을 형성하는 단계이고, 상기 레이저조사 단계(S30)는 상기 소수성막형성 단계(S20) 이후, 케이스의 NFC 안테나 회로패턴영역에 레이저를 조사하여 상기 회로패턴영역 표면의 소수성막을 제거함과 동시에 상기 회로패턴영역의 표면조도를 거칠게 하는 단계이고, 상기 NFC 안테나 회로형성 단계(S40)는 상기 레이저조사 단계(S30) 이후, 무전해도금(electroless plating)으로 상기 회로패턴영역에 회로형성도금층을 형성하는 단계이고, 상기 페라이트시트부착 단계(S50)는 상기 NFC 안테나 회로형성 단계(S40) 이후, 상기 회로형성도금층을 덮도록 케이스에 페라이트 시트(Ferrite sheet)를 부착시키는 단계이다. The hydrophobic film forming step (S20) is a step of forming a hydrophobic film on the entire surface of the case by immersing the case in an aqueous hydrophobic material solution, the laser irradiation step (S30) after the hydrophobic film forming step (S20), NFC of the case Irradiating a laser to the antenna circuit pattern region to remove the hydrophobic film on the surface of the circuit pattern region and at the same time roughening the surface roughness of the circuit pattern region, the NFC antenna circuit forming step (S40) is the laser irradiation step (S30) Thereafter, forming a circuit forming plating layer in the circuit pattern region by electroless plating, and attaching the ferrite sheet (S50) covers the circuit forming plating layer after the NFC antenna circuit forming step (S40). In this step, a ferrite sheet is attached to the case.
본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 종래와 같이 별도의 기판에 형성된 NFC 안테나를 휴대단말기에 별도로 부착할 필요없이 휴대단말기에 직접 NFC 안테나를 형성시키기 위하여, 휴대단말기의 일부품인 케이스에 무전해도금으로 NFC 안테나 회로를 형성할 회로형성도금층을 직접 형성시키는 것이고(NFC 안테나 회로형성 단계(S40)), 이를 위해 상기 NFC 안테나 회로형성 단계(S40) 이전에 상기 소수성막형성 단계(S20)와 상기 레이저조사 단계(S30)를 행하는 것이다. NFC antenna manufacturing method for a mobile terminal according to the present invention in order to form an NFC antenna directly on the portable terminal without the need to attach the NFC antenna formed on a separate substrate to the portable terminal as in the prior art, a case which is a part of the portable terminal Directly forming the circuit forming plating layer to form the NFC antenna circuit by electroless plating (NFC antenna circuit forming step (S40)), for this purpose, the hydrophobic film forming step (S20) before the NFC antenna circuit forming step (S40) And the laser irradiation step (S30).
이와 같이, 상기 소수성막형성 단계(S20)와 상기 레이저조사 단계(S30) 이후에 상기 NFC 안테나 회로형성 단계(S40)를 행하게 되면, 무전해도금만으로 미세한 NFC 안테나의 회로를 케이스 표면에 직접 형성시킬 수 있다. As such, when the NFC antenna circuit forming step S40 is performed after the hydrophobic film forming step S20 and the laser irradiation step S30, the circuit of the fine NFC antenna may be directly formed on the case surface using only electroless plating. Can be.
이는 케이스 전체 표면에 소수성막을 형성하고(소수성막 형성 단계(S20)), 상기 전체표면에 소수성막이 형성된 케이스 표면 중 NFC 안테나 회로패턴영역에만 레이저를 조사한 후(레이저조사 단계(S30)) 무전해도금하게 되면(NFC 안테나 회로형성 단계(40)), 무전해도금 수용액이 상기 회로패턴영역에만 침투되어 그 표면에만 회로형성도금층이 형성되는 반면, 케이스 표면 중 레이저가 조사되지 않아 소수성막으로 덮여진 표면은 무전해도금 수용액이 침투되지 않아 도금층이 형성되지 않기 때문이다. This is performed by forming a hydrophobic film on the entire surface of the case (hydrophobic film forming step (S20)), and irradiating a laser only to the NFC antenna circuit pattern region of the case surface on which the hydrophobic film is formed on the entire surface (laser irradiation step (S30)). When it is inhibited (NFC antenna circuit forming step 40), the electroless plating solution penetrates only the circuit pattern region to form a circuit forming plating layer only on the surface thereof, whereas the laser is not irradiated on the surface of the case and covered with a hydrophobic film. This is because the surface of the electroless plating solution does not penetrate and no plating layer is formed.
나아가, 상기 레이저조사 단계(S30)에서 상기 회로패턴영역 표면의 소수성막을 제거함과 동시에 상기 표면의 조도(稠度)까지 거칠게 하면, 케이스가 무전해도금이 어려운 플라스틱 소재로 이루어지더라도(일반적으로 휴대단말기의 일부품을 이루는 휴대단말기 케이스 또는 휴대단말기용 배터리팩 케이스는 사출성형이 용이한 플라스틱 재질로 이루어진다) 상기 회로패턴영역에 회로형성도금층을 형성시킬 수 있게 된다.Furthermore, if the hydrophobic film on the surface of the circuit pattern region is removed at the same time as the laser irradiation step (S30) and the surface roughness is roughened, even if the case is made of a plastic material which is difficult to electrolessly plate (generally a mobile terminal) The portable terminal case or the battery pack case for the portable terminal, which is a part of the product, is made of a plastic material that is easily injection molded.) A circuit forming plating layer can be formed in the circuit pattern region.
상기 소수성(hydrophobic) 물질 수용액으로는 Thioacetal계 화합물 수용액, Polyfluorocarbon 수용액, Oxyethylated sorbitan monolaurate 수용액 등이 사용될 수 있으며, 상기 페라이트 시트(Ferrite sheet)는 자성 흡수체로서 NFC 안테나의 동작 신뢰성을 높이기 위한 것이다.The aqueous solution of hydrophobic material may be a thioacetal compound aqueous solution, a polyfluorocarbon aqueous solution, an oxyethylated sorbitan monolaurate aqueous solution, or the like, and the ferrite sheet is a magnetic absorber for improving the operational reliability of the NFC antenna.
도 2는 휴대단말기용 NFC 안테나의 일 예를 나타내는 사진으로서, NFC 안테나가 휴대단말기의 뒷면 케이스의 내측면에 구비된 상태를 개략적으로 나타내는 사진이다. 2 is a photograph showing an example of an NFC antenna for a mobile terminal, and is a photograph schematically showing a state in which an NFC antenna is provided on an inner side surface of a rear case of the portable terminal.
도 2에서 보이는 바와 같이, NFC 안테나(1)가 휴대단말기의 뒷면 케이스(2)의 내측면에 구비되는 경우에는, 상기 NFC 안테나(1)에는 뒷면 케이스(2)가 휴대단말기에 결합된 경우에 휴대단말기의 본체(3)와 NFC 안테나(1)가 전기적으로 연결하되도록 하기 위한 NFC 안테나 단자(4)가 형성된다. NFC 안테나 단자(4)는 대략 루프 회로패턴을 가지는 NFC 안테나 회로(5)의 일측 끝단과 타측 끝단에 각각 2개 형성된다. 이러한 NFC 안테나 단자(4)는 뒷면 케이스(2)가 휴대단말기의 본체(3)에 결합된 경우에 휴대단말기의 본체(3)의 접촉단자(6)와 용이하게 접촉되도록 페라이트 시트(7)로부터 돌출형성될 수 있다. As shown in FIG. 2, when the NFC antenna 1 is provided on the inner side of the rear case 2 of the mobile terminal, when the rear case 2 is coupled to the mobile terminal, the NFC antenna 1 is coupled to the mobile terminal. An NFC antenna terminal 4 is formed to allow the main body 3 of the portable terminal and the NFC antenna 1 to be electrically connected to each other. Two NFC antenna terminals 4 are formed at one end and the other end of the NFC antenna circuit 5 having a loop circuit pattern. The NFC antenna terminal 4 is formed from the ferrite sheet 7 so that the rear case 2 is easily contacted with the contact terminal 6 of the main body 3 of the mobile terminal when the rear case 2 is coupled to the main body 3 of the mobile terminal. It can be protruding.
본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 NFC 안테나 단자가 돌출형성되도록 하기 위하여, 상기 케이스준비 단계(S10)는 케이스의 NFC 안테나 단자형성영역에 홈이 형성되도록 케이스를 사출성형하는 사출성형 단계를 포함하고, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 상기 홈에 NFC 안테나 단자형성용 핀을 삽입결합시키는 NFC 안테나 단자형성 단계를 더 포함할 수 있다. 그러면, NFC 안테나 단자를 케이스에 쉽게 형성시킬 수 있다. NFC antenna manufacturing method for a mobile terminal according to the present invention in order to make the NFC antenna terminal protruding, the case preparation step (S10) is injection molding step of injection molding the case so that a groove is formed in the NFC antenna terminal forming region of the case Includes, NFC antenna manufacturing method for a mobile terminal according to the present invention may further comprise the NFC antenna terminal forming step of inserting the NFC antenna terminal forming pin into the groove. Then, the NFC antenna terminal can be easily formed in the case.
상기 단자형성 단계는 상기 NFC 안테나 회로형성 단계(S40) 이전에 이루어지도록 상기 소수성막형성 단계(S20)와 상기 NFC 안테나 회로형성 단계(S40) 사이에이루어지는 것이 바람직하다. 그러면, 상기 NFC 안테나 회로형성 단계(S40)에서는 홈에 단자형성용 핀이 삽입결합된 상태에서 무전해도금이 행해지게 되므로, 무전해도금시 형성되는 회로형성도금층은 홈에 삽입결합된 상태인 단자형성용 핀에도 형성될 수 있다. 그리고, 이와 같이 무전해도금시 단자형성용 핀에 회로형성도금층이 형성되면, NFC 안테나 단자와 NFC 안테나 회로의 전기적 연결이 자동적으로 이루어질 수 있으며, 나아가 홈에 삽입결합된 단자형성용 핀이 회로형성도금층과 일체로 되면서 견고하게 고정될 수 있다. The terminal forming step is preferably performed between the hydrophobic film forming step (S20) and the NFC antenna circuit forming step (S40) to be made before the NFC antenna circuit forming step (S40). Then, in the NFC antenna circuit forming step (S40), since the electroless plating is performed while the terminal forming pin is inserted into the groove, the circuit forming plating layer formed during the electroless plating is inserted into the groove. It may also be formed on the forming pin. When the circuit forming plating layer is formed on the terminal forming pin during the electroless plating, the electrical connection between the NFC antenna terminal and the NFC antenna circuit can be made automatically, and the terminal forming pin inserted into the groove is formed in the circuit. It can be firmly fixed while being integral with the plating layer.
다른 실시 예로, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 상기 사출성형 단계에서 상기 단자형성 단계가 동시에 이루어질 수 있도록, 상기 사출성형 단계는 단자형성용 핀이 케이스의 NFC 안테나 단자형성영역에 결합된 상태로 사출성형될 수 있다. 즉, 상기 단자형성용 핀은 인서트몰딩(insert molding)에 의해 케이스 사출성형시 상기 케이스에 일체로 결합될 수 있다. In another embodiment, the method of manufacturing an NFC antenna for a mobile terminal according to the present invention is such that the terminal forming step may be simultaneously performed in the injection molding step, wherein the injection molding step is coupled to the NFC antenna terminal forming area of the case. Can be injection molded. That is, the terminal forming pin may be integrally coupled to the case at the time of case injection molding by insert molding.
이하 상기 NFC 안테나 회로형성 단계(S40)에 대하여 상세히 설명한다. Hereinafter, the NFC antenna circuit forming step S40 will be described in detail.
상기 NFC 안테나 회로형성 단계(S40)는 1차 시드형성 단계, 회로형성 단계, 2차 시드형성 단계 및 회로보호층 형성 단계를 포함한다.The NFC antenna circuit forming step S40 includes a first seed forming step, a circuit forming step, a second seed forming step, and a circuit protection layer forming step.
상기 1차 시드형성 단계는 회로패턴영역에 파라듐(Pd) 시드(seed)를 형성하는 단계이고, 상기 회로형성 단계는 상기 1차 시드형성 단계 이후, 상기 파라듐 시드가 형성된 회로패턴영역에 회로형성 동도금층을 형성하는 단계이고, 상기 2차 시드형성 단계는 상기 회로형성 단계 이후, 상기 동도금층에 파라듐 시드를 형성하는 단계이고, 상기 회로보호층 형성 단계는 상기 2차 시드형성 단계 이후, 상기 파라듐 시드가 형성된 회로형성 동도금층에 회로보호 니켈도금층을 형성하는 단계이다. The first seed forming step is a step of forming a palladium (Pd) seed in the circuit pattern region, and the circuit forming step is a circuit in the circuit pattern region where the palladium seed is formed after the first seed formation step Forming a copper plating layer, wherein the secondary seed forming step is a step of forming a paradium seed in the copper plating layer after the circuit forming step, and the circuit protection layer forming step is a second seed forming step, Forming a circuit protection nickel plating layer on the circuit forming copper plating layer on which the palladium seed is formed.
상기 1차 시드형성 단계는 회로패턴영역에 NFC 안테나의 회로를 형성할 무전해동도금층의 형성을 용이하게 하기 위한 단계로서, 회로패턴영역에만 레이저가 조사된 케이스를 파라듐수용액 예를들어, 황산파라듐 수용액 또는 염화파라듐 수용액에 침지시킴으로써 이루어질 수 있다. 이와 같이 회로패턴영역에만 레이저가 조사된 케이스를 파라듐수용액에 침지시키면 상기 회로패턴영역에만 파라듐 시드가 형성될 수 있다. The first seed forming step is a step for facilitating the formation of an electroless copper plating layer for forming a circuit of the NFC antenna in the circuit pattern region. It can be made by immersion in an aqueous solution of radium or an aqueous solution of palladium chloride. As such, when the case irradiated with the laser only in the circuit pattern region is immersed in the palladium aqueous solution, palladium seed may be formed only in the circuit pattern region.
상기 2차 파라듐 시드 형성단계는 회로형성 동도금층에 회로보호 니켈도금층이 용이하게 형성되도록 하기 위한 단계로서, 상기 동도금층에 파라듐 시드가 형성된 케이스를 무전해니켈도금액에 침지시킴으로써 이루어질 수 있다. The secondary palladium seed forming step is to facilitate the formation of a circuit protection nickel plating layer on the circuit-forming copper plating layer, it may be made by immersing the case in which the palladium seed is formed in the copper plating layer in an electroless nickel plating solution. .
상기 회로보호층 형성 단계는 NFC 안테나의 회로를 형성하는 동도금층의 전도성 및 내식성을 향상시켜 NFC 안테나로서의 기능이 원활하게 이루어지도록 하기 위하여 무전해동도금층이 형성된 회로패턴영역에 무전해니켈도금층을 더 형성하는 단계이다. 이는 상기 회로형성 단계와 상기 회로보호층 형성 단계 사이에 상기 2차 파라듐 시드 형성단계가 행해짐으로써 가능해질 수 있다. In the forming of the circuit protection layer, an electroless nickel plating layer is further formed on the circuit pattern region in which the electroless copper plating layer is formed so as to improve the conductivity and corrosion resistance of the copper plating layer forming the circuit of the NFC antenna so that the function as the NFC antenna can be made smoothly. It's a step. This may be made possible by the step of forming the secondary palladium seed between the circuit forming step and the circuit protection layer forming step.
또한, 상기 1차 시드형성 단계는 레이저 조사에 의해 거칠어진 표면에 물리적으로 파라듐 시드를 형성시키는 단계로서, 상기 1차 시드형성 단계에서의 파라듐수용액의 파라듐 농도는 60 ~ 200ppm으로 이루어짐이 바람직하며, 상기 2차 시드형성 단계는 동도금층에 화학적으로 파라듐 시드를 형성시키는 단계로서, 상기 2차 시드형성 단계에서의 파라듐수용액의 파라듐 농도는 20 ~ 40ppm으로 이루어짐이 바람직하다. In addition, the primary seed forming step is a step of physically forming a paradium seed on the surface roughened by laser irradiation, the palladium concentration of the aqueous solution of palladium in the primary seed forming step is made of 60 ~ 200ppm Preferably, the secondary seed forming step is a step of chemically forming a paradium seed in the copper plating layer, it is preferable that the palladium concentration of the aqueous solution of palladium in the secondary seed forming step is made of 20 ~ 40ppm.
한편, 상기 회로형성 단계는 NFC 안테나의 회로를 형성하는 동도금층을 형성하는 단계로서, 금속박막형성 단계, 소프트에칭 단계 및 동도금층형성 단계를 포함하여 이루어질 수 있다.On the other hand, the circuit forming step is a step of forming a copper plating layer forming a circuit of the NFC antenna, it may be made including a metal thin film forming step, soft etching step and copper plating layer forming step.
상기 금속박막형성 단계는 상기 파라듐 시드가 형성된 회로패턴영역에 금속박막 도금층을 형성하는 단계이고, 상기 소프트에칭 단계는 상기 금속박막형성 단계 이후, 상기 금속박막 도금층의 테두리를 미세하게 하는 단계이고, 상기 동도금층형성 단계는 상기 소프트에칭 단계 이후, 상기 테두리가 미세해진 금속박막 도금층에 회로형성 동도금층을 형성하는 단계이다. The metal thin film forming step is a step of forming a metal thin film plating layer in the circuit pattern region on which the palladium seed is formed, the soft etching step is a step of making a fine edge of the metal thin film plating layer after the metal thin film forming step, In the copper plating layer forming step, after the soft etching step, the circuit forming copper plating layer is formed on the metal thin plated layer having a fine edge.
상기 회로형성 단계는 상기 회로형성 동도금층 형성 단계 이전에, 상기 금속박막 형성 단계와 상기 소프트에칭 단계를 더 행함으로써, 미세한 NFC 안테나 회로 형성이 가능해질 수 있다.In the circuit forming step, before the circuit forming copper plating layer forming step, the metal thin film forming step and the soft etching step may be further performed to form a fine NFC antenna circuit.
상기 금속박막형성 단계는 상기 회로패턴영역에만 파라듐시드가 형성된 케이스를 황산구리수용액에 10 ~ 20분간 침지시킴으로써 이루어질 수 있으며, 상기 소프트에칭 단계는 상기 금속박막 동도금층이 형성된 케이스를 소프트에칭액에 20 ~ 40초간 침지시킴으로써 이루어질 수 있으며, 상기 동도금층형성 단계는 상기 금속박막 동도금층의 테두리가 미세해진 케이스를 황산구리수용액에 180 ~ 240분간 침지시킴으로써 이루어질 수 있다. 다른 실시 예로, 상기 금속박막형성 단계는 무전해니켈수용액에 침지시켜 금속박막 니켈도금층이 형성되도록 할 수도 있다. The metal thin film forming step may be performed by immersing the case where the paradium seed is formed only in the circuit pattern region in the copper sulfate aqueous solution for 10 to 20 minutes, and the soft etching step is 20 ~ 20 ~ the case in which the metal thin film copper plating layer is formed in the soft etching solution. It may be made by immersing for 40 seconds, the copper plating layer forming step may be made by immersing the case in which the edge of the metal thin film copper plating layer is fine in the copper sulfate aqueous solution for 180 to 240 minutes. In another embodiment, the metal thin film forming step may be immersed in an electroless nickel aqueous solution to form a metal thin nickel plated layer.
한편, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 상기 레이저조사 단계(S30)와 상기 NFC 안테나 회로형성 단계(40) 사이에, 상기 레이저조사 단계(S30)에서 발생한 분진을 제거하는 초음파탈지 단계를 더 포함할 수 있다. On the other hand, NFC antenna manufacturing method for a mobile terminal according to the present invention between the laser irradiation step (S30) and the NFC antenna circuit forming step 40, the ultrasonic degreasing step of removing dust generated in the laser irradiation step (S30). It may further include.
도 3은 본 발명에 따른 제조방법에 의하여 휴대단말기의 뒷면 케이스의 내측면에 NFC 안테나 회로패턴이 형성된 상태를 나타내는 사진이다.3 is a photograph showing a state in which the NFC antenna circuit pattern is formed on the inner surface of the rear case of the mobile terminal by the manufacturing method according to the present invention.
도 3에서 보이는 바와 같이, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 NFC 안테나(1)를 이루는 단자(4)와 회로(5)를 휴대단말기의 일부품인 케이스(2)에 직접 형성할 수 있으며, 특히 미세한 루프회로 패턴으로 이루어지는 NFC 안테나 회로(5)도 케이스(2) 표면에 직접 형성이 가능하다. As shown in FIG. 3, the method of manufacturing an NFC antenna for a portable terminal according to the present invention may directly form a terminal 4 and a circuit 5 constituting the NFC antenna 1 on a case 2 which is a part of the portable terminal. In particular, the NFC antenna circuit (5) consisting of a fine loop circuit pattern can also be directly formed on the surface of the case (2).
이상에서 살펴본 바와 같이, 본 발명에 따른 휴대단말기용 NFC 안테나 제조방법은 별도로 제조된 NFC 안테나를 휴대단말기에 다시 부착결합시킬 필요없이 직접 휴대단말기의 케이스 또는 휴대단말기용 베터리팩 케이스에 NFC 안테나를 형성시킬 수 있는 방법에 관한 것으로서, 그 실시 형태는 다양한 형태로 변경가능하다 할 것이다. 따라서 본 발명은 본 명세서에서 개시된 실시 예에 의해 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 변경 가능한 모든 형태도 본 발명의 권리범위에 속한다 할 것이다. As described above, the NFC antenna manufacturing method according to the present invention forms an NFC antenna on a case of a portable terminal or a battery pack case for a portable terminal directly without the need to reattach the NFC antenna prepared separately to the portable terminal. The present invention may be modified in various forms. Therefore, the present invention is not limited to the embodiments disclosed in the present specification, and all forms changeable by those skilled in the art to which the present invention pertains will belong to the scope of the present invention.

Claims (8)

  1. 휴대단말기용 NFC(Near Field Communication) 안테나 제조방법에 있어서,In the NFC (Near Field Communication) antenna manufacturing method for a mobile terminal,
    휴대단말기 케이스 또는 휴대단말기용 배터리팩 케이스를 준비하는 케이스준비 단계;A case preparation step of preparing a mobile terminal case or a battery pack case for a mobile terminal;
    상기 케이스를 소수성(hydrophobic) 물질 수용액에 침지시켜 상기 케이스의 전체표면에 소수성막을 형성하는 소수성막형성 단계;Forming a hydrophobic film on the entire surface of the case by immersing the case in an aqueous hydrophobic material solution;
    상기 소수성막형성 단계 이후, 상기 케이스의 NFC 안테나 회로패턴영역에 레이저를 조사하여 상기 회로패턴영역 표면의 소수성막을 제거함과 동시에 상기 회로패턴영역의 표면조도를 거칠게 하는 레이저조사 단계;Irradiating a laser to the NFC antenna circuit pattern region of the case after the hydrophobic film forming step to remove the hydrophobic film on the surface of the circuit pattern region and to roughen the surface roughness of the circuit pattern region;
    상기 레이저조사 단계 이후, 무전해도금(electroless plating)으로 상기 회로패턴영역에 회로형성도금층을 형성하는 NFC 안테나 회로형성 단계; 및An NFC antenna circuit forming step of forming a circuit forming plating layer on the circuit pattern region by electroless plating after the laser irradiation step; And
    상기 NFC 안테나 회로형성 단계 이후, 상기 회로형성도금층을 덮도록 상기 케이스에 페라이트시트(Ferrite sheet)를 부착시키는 페라이트시트부착 단계;를 포함하는 휴대단말기용 NFC 안테나 제조방법.After the NFC antenna circuit forming step, attaching a ferrite sheet (Ferrite sheet) to the case to cover the circuit forming plating layer; NFC antenna manufacturing method for a mobile terminal comprising a.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 케이스준비 단계는, 상기 케이스의 NFC 안테나 단자형성영역에 홈이 형성되도록 상기 케이스를 사출성형하는 단계를 포함하고,The case preparation step includes the step of injection molding the case so that a groove is formed in the NFC antenna terminal forming region of the case,
    상기 휴대단말기용 NFC 안테나 제조방법은,NFC antenna manufacturing method for a mobile terminal,
    상기 NFC 안테나 회로형성 단계 이전에, 상기 홈에 NFC 안테나 단자형성용 핀을 삽입결합시키는 NFC 안테나 단자형성 단계를 더 포함하는 것을 특징으로 하는 휴대단말기용 NFC 안테나 제조방법.Before the NFC antenna circuit forming step, NFC antenna terminal forming method for inserting the NFC antenna terminal forming pin into the groove further comprising the NFC antenna manufacturing method for a mobile terminal.
  3. 제 1 항에 있어서,The method of claim 1,
    상기 케이스준비 단계는, 상기 케이스의 NFC 안테나 단자형성영역에 단자형성용 핀이 결합된 상태로 상기 케이스를 사출성형하는 단계를 포함하는 것을 특징으로 하는 휴대단말기용 NFC 안테나 제조방법. The case preparation step, NFC antenna manufacturing method for a mobile terminal comprising the step of injection molding the case with the terminal forming pin is coupled to the NFC antenna terminal forming region of the case.
  4. 제 1 항에 있어서,The method of claim 1,
    상기 NFC 안테나 회로형성 단계는, The NFC antenna circuit forming step,
    상기 회로패턴영역에 파라듐시드를 형성하는 1차 시드형성 단계;Forming a primary seed in the circuit pattern region;
    상기 1차 시드형성 단계 이후, 상기 회로패턴영역에 회로형성 동도금층을 형성하는 회로형성 단계; A circuit forming step of forming a circuit forming copper plating layer in the circuit pattern region after the first seed forming step;
    상기 회로형성 단계 이후, 상기 회로형성 동도금층에 파라듐시드를 형성하는 2차 시드형성 단계; 및A second seed forming step of forming a paradium seed on the circuit forming copper plating layer after the circuit forming step; And
    상기 2차 시드형성 단계 이후, 상기 파라듐시드가 형성된 회로형성 동도금층에 회로보호 니켈도금층을 형성하는 회로보호층 형성 단계;를 포함하는 휴대단말기용 NFC 안테나 제조방법.And a circuit protection layer forming step of forming a circuit protection nickel plating layer on the circuit forming copper plating layer on which the paradium seed is formed after the second seed formation step.
  5. 제 4 항에 있어서,The method of claim 4, wherein
    상기 1차 시드형성 단계는 상기 케이스를 파라듐 농도가 60 ~ 200ppm으로 이루어지는 파라듐수용액에 침지시켜 상기 회로패턴영역에 파라듐시드를 형성하고, In the primary seed forming step, the case is immersed in an aqueous palladium solution having a palladium concentration of 60 to 200 ppm to form a palladium seed in the circuit pattern region.
    상기 2차 시드형성 단계는 상기 케이스를 파라듐 농도가 20 ~ 40ppm으로 이루어지는 파라듐수용액에 침지시켜 상기 회로형성 동도금층에 파라듐시드를 형성하는 것을 특징으로 하는 휴대단말기용 NFC 안테나 제조방법.The secondary seed forming step is a method of manufacturing an NFC antenna for a mobile terminal, characterized in that to form a paradium seed in the circuit-forming copper plating layer by immersing the case in a palladium aqueous solution consisting of 20 ~ 40ppm palladium concentration.
  6. 제 4 항에 있어서,The method of claim 4, wherein
    상기 회로형성 단계는,The circuit forming step,
    상기 회로패턴영역에 금속박막 도금층을 형성하는 금속박막형성 단계;Forming a metal thin film plating layer in the circuit pattern region;
    상기 금속박막형성 단계 이후, 상기 금속박막 도금층의 테두리를 미세하게 하는 소프트에칭 단계; 및After the metal thin film forming step, the soft etching step to fine-tune the edge of the metal thin film plating layer; And
    상기 소프트에칭 단계 이후, 상기 금속박막 도금층에 상기 회로형성 동도금층을 형성하는 동도금층형성 단계;를 포함하는 휴대단말기용 NFC 안테나 제조방법.After the soft etching step, the copper plating layer forming step of forming the circuit-forming copper plating layer on the metal thin film plating layer; NFC antenna manufacturing method for a mobile terminal comprising a.
  7. 제 6 항에 있어서,The method of claim 6,
    상기 금속박막형성 단계는 상기 케이스를 황산구리수용액에 10 ~ 20분간 침지시켜 상기 회로패턴영역에 금속박막 동도금층을 형성하고, In the metal thin film forming step, the case is immersed in an aqueous copper sulfate solution for 10 to 20 minutes to form a metal thin film copper plating layer on the circuit pattern region.
    상기 소프트에칭 단계는 상기 케이스를 소프트에칭액에 20 ~ 40초간 침지시켜 상기 금속박막 동도금층의 테두리를 미세하게 형성하고,In the soft etching step, the case is immersed in the soft etching solution for 20 to 40 seconds to form a fine edge of the metal thin film copper plating layer,
    상기 동도금층형성 단계는 상기 케이스를 황산구리수용액에 180 ~ 240분간 침지시켜 상기 금속박막 동도금층에 상기 회로형성 동도금층을 형성하는 것을 특징으로 하는 휴대단말기용 NFC 안테나 제조방법.In the copper plating layer forming step, the case is immersed in the copper sulfate aqueous solution for 180 to 240 minutes to form the circuit-forming copper plating layer on the metal thin film copper plating layer, NFC antenna manufacturing method for a mobile terminal.
  8. 제 1 항에 있어서,The method of claim 1,
    상기 레이저조사 단계와 상기 NFC 안테나 회로형성 단계 사이에, 상기 레이저조사 단계에서 발생한 분진을 제거하는 초음파탈지 단계를 더 포함하는 것을 특징으로 하는 휴대단말기용 NFC 안테나 제조방법.Between the laser irradiation step and the NFC antenna circuit forming step, NFC antenna manufacturing method for a mobile terminal further comprising the step of removing the dust generated in the laser irradiation step.
PCT/KR2014/004783 2014-02-12 2014-05-28 Method for manufacturing nfc antenna for portable terminal WO2015122574A1 (en)

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