WO2015096693A1 - 一种用于逐层制造三维物体的扫描方法 - Google Patents

一种用于逐层制造三维物体的扫描方法 Download PDF

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Publication number
WO2015096693A1
WO2015096693A1 PCT/CN2014/094629 CN2014094629W WO2015096693A1 WO 2015096693 A1 WO2015096693 A1 WO 2015096693A1 CN 2014094629 W CN2014094629 W CN 2014094629W WO 2015096693 A1 WO2015096693 A1 WO 2015096693A1
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thin
area
thin wall
intersecting line
walled
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PCT/CN2014/094629
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English (en)
French (fr)
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许小曙
杨大风
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湖南华曙高科技有限责任公司
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Publication of WO2015096693A1 publication Critical patent/WO2015096693A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20—Direct sintering or melting
    • B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30—Process control
    • B22F10/36—Process control of energy beam parameters
    • B22F10/366—Scanning parameters, e.g. hatch distance or scanning strategy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40—Radiation means
    • B22F12/49—Scanners
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Definitions

  • the invention mainly relates to the field of layered manufacturing technology, and particularly relates to a three-dimensional object scanning method suitable for layer-by-layer manufacturing technology, that is, in the process of manufacturing a three-dimensional object layer by layer, each layer of the graphic area to be processed is divided into thin walls. Zones and non-thin walls, thus making a method of distinguishing scans.
  • Devices relating to "layer fabrication" in the prior art are known, for example, for devices such as stereolithography, laser sintering, and electron beam melting. These devices each include a holder for positioning an object relative to the working surface, a device for coating a material in liquid or powder form, a focused photon beam or a beam of particles.
  • a layer of liquid or powder form of material is applied to the work surface by means of a coating device and subsequently aligned by a high-energy photon beam or particle beam corresponding to each layer of the graphic area to be processed.
  • the coating position is scanned and causes hardening of the material at the scanning position. In this way, layer by layer is superimposed to make a three-dimensional object.
  • accuracy and efficiency are two performance indicators that measure the key to making a three-dimensional object.
  • the processing accuracy is high for each layer, which means that the machining hardening zone after processing has a high degree of fit to the graphic area of the desired prototype; the high production efficiency requirement means that it is shorter.
  • Scan and harden each layer in time In general, scanning jobs take up most of the time that each layer of 3D objects is produced.
  • the accuracy is highly dependent on the spot size and power of the photon beam or particle beam.
  • the photon beam or the particle beam is operated at the same or maximum scanning speed (generally, the maximum scanning speed is restricted by the system hardware conditions), and the higher the accuracy requirement, the more the reduction is required.
  • the maximum scanning speed is restricted by the system hardware conditions
  • Small fill scan spacing and spot size and power of the photon beam or particle beam then the number of scan fills is increased, thereby reducing the processing efficiency; the higher the efficiency requirement, the more the fill scan pitch and the photon beam or The spot size and power of the particle beam, then the prototype pattern to be scanned, the specific fill
  • the existing method is to select the same or maximum scanning speed throughout the process of manufacturing a three-dimensional object, and adopt the same scanning pitch and photon emission. Beam or particle beam power and spot diameter size parameters. In this way, the user can only perform scanning and sintering according to the fixed setting parameters of the system, and often the phenomenon that the processing precision is satisfied, but the production efficiency is low or the processing precision is insufficient, and the production efficiency is high.
  • the technical problem to be solved by the present invention is that, in view of the technical problems existing in the prior art, the present invention provides a scan for layer-by-layer manufacturing of three-dimensional objects, which is simple in principle, easy to implement, and capable of optimally configuring processing precision and processing efficiency. method.
  • the present invention adopts the following technical solutions:
  • a scanning method for manufacturing a three-dimensional object layer by layer comprising:
  • Step S11 dividing the coating area to be scanned into a thin-walled area and a non-thin-walled area according to the thin-walled threshold and the gap width of the contour of each layer of the three-dimensional object to be manufactured in the X and/or Y direction;
  • the thin-walled region is the coating region to be scanned having a contour gap width in the X and/or Y direction that is less than a threshold, and the non-thin wall region is the remaining scanning after the removal of the thin-walled region Coating area;
  • Step S12 performing a zone scan according to the thin wall area and the non-thin wall area obtained in the step S11; when scanning the non-thin wall area, selecting the first photon beam power or the first particle beam a power and a first spot diameter dimension; when scanning the thin-walled region, selecting a second photon beam power or a second particle beam power and a second spot diameter size; the first photon beam power is greater than the first The two-photon beam power, the first particle beam power being greater than the second particle beam power, the first spot diameter dimension being greater than the second spot diameter dimension.
  • step S11 specifically includes the following steps:
  • S115 sequentially compare, respectively, whether the length of each intersecting line segment of the M1 intersecting line segments is smaller than the thin wall threshold, and if the length of the compared intersecting line segments is less than the thin wall threshold, determine the compared intersecting line segments.
  • the area between the line intersecting the next line is the thin-walled area, and if the length of the intersected line segment being compared is not less than the thin-walled threshold, determining the area between the compared intersecting line segment and the next intersecting line segment is The non-thin walled area.
  • step S11 specifically includes:
  • step S11 specifically includes:
  • the preset scan pitch value is determined by the user according to the spot diameter size, scan power, and/or material density of the system.
  • the thin wall threshold is defined by the user according to the manufacturing precision required by the workpiece and the minimum spot diameter size of the system, and the value is greater than 1.5 times of the preset scanning pitch value.
  • step S12 specifically includes the following steps:
  • S122 For all thin-walled sections of the profile section, determine the scanning pitch and the scanning path according to the minimum spot diameter size and accuracy requirements of the system, and set the spot diameter size to the minimum spot diameter size of the system, and then determine the scanning speed, photon beam or The power parameter of the particle beam.
  • the scan power density of the thin-walled region is the same as the scan power density of the non-thin wall region.
  • the photon beam is a laser beam
  • the particle beam is a high energy electron beam
  • the scanning method is based on a layer manufacturing device, which is a stereolithography device, a laser sintering device, or an electron beam melting device;
  • the scanning material of the layer manufacturing device is a liquid photocurable resin, ceramic powder , paraffin powder, metal powder, or polymer powder.
  • the invention has the advantages that the scanning method for manufacturing a three-dimensional object layer by layer is simple and easy to implement, and is suitable for photon shooting on all devices for manufacturing three-dimensional objects layer by layer. Scanning of a beam or particle beam on a liquid or powder form of material.
  • the user can freely set the thin-walled threshold according to the processing requirements, and divide the cross-layer scanning and sintering profile into thin-walled and non-thin-walled areas, and then use different scanning parameters to scan different areas to maximize the balance.
  • a large or maximum fixed scanning speed is adopted for the non-thin wall region, and a fixed spot diameter size and a fixed photon beam or a particle beam power are set to ensure production efficiency;
  • the minimum system spot diameter size is used, and the parameters such as the scanning pitch, the scanning speed, and the power of the photon beam or the particle beam are adjusted at the same time, so that the thin-walled region obtains a power density consistent with the non-thin wall region,
  • the size of the spot diameter is reduced, and the scanning pitch is adjusted accordingly, thereby avoiding the situation that the processing area is overflowed due to scanning with a large spot size and a preset pitch, and the processing precision of the thin-walled area is ensured. This satisfies the requirements for the processing efficiency of the three-dimensional object and the precision of the workpiece processing.
  • FIG. 1 is a schematic flow chart of a scanning method for manufacturing a three-dimensional object layer by layer according to an embodiment of the present invention
  • FIG. 2 is a schematic flow chart of a first method for dividing a thin-walled area and a non-thin-walled area according to an embodiment of the present invention
  • FIG. 3 is a schematic flow chart of a second method for dividing a thin-walled area and a non-thin-walled area according to an embodiment of the present invention
  • FIG. 4 is a schematic flow chart of a third method for dividing a thin-walled area and a non-thin-walled area according to an embodiment of the present invention
  • FIG. 5 is a schematic flow chart of a fourth method for dividing a thin-walled region and a non-thin-walled region according to an embodiment of the present invention
  • FIG. 6 is a schematic flow chart of a method for scanning a thin-walled area according to an embodiment of the present invention.
  • FIG. 7 is a schematic flow chart of a method for scanning a non-thin wall region according to an embodiment of the present invention.
  • Figure 8 is a schematic view showing the working principle of the present invention in a specific application example
  • Figure 9 is a schematic illustration of a cross section of a layer of two three-dimensional objects in the Z-axis direction of the present invention in a specific application example.
  • Photon beam or particle beam 2. Three-dimensional object to be processed; 3. First area; 4. Paving mechanism; 5. Work surface; 6. Second area.
  • FIG. 1 is a schematic flow chart of a scanning method for manufacturing a three-dimensional object layer by layer according to the present invention. As shown in FIG. 1, the method includes the following steps:
  • Step S11 dividing the coating area to be scanned into a thin-walled area and a non-thin-walled area according to the thin-walled threshold and the gap width of the contour of each layer of the three-dimensional object to be manufactured in the X and/or Y direction;
  • the thin-walled region is the coating region to be scanned whose contour gap width is less than a threshold value in the X and/or Y direction, and the non-thin wall region is the remaining scan required after removing the thin-walled region Coating area:
  • the thin wall threshold is a threshold value of the gap width of the three-dimensional object cross-sectional contour.
  • Step S12 performing a zone scan according to the thin wall area and the non-thin wall area obtained in the step S11; when scanning the non-thin wall area, selecting the first photon beam power or the first particle beam a power and a first spot diameter dimension; when scanning the thin-walled region, selecting a second photon beam power or a second particle beam power and a second spot diameter size; the first photon beam power is greater than the first The two-photon beam power, the first particle beam power being greater than the second particle beam power, the first spot diameter dimension being greater than the second spot diameter dimension.
  • the scanning method for manufacturing a three-dimensional object layer by layer according to the invention is simple in principle and easy to implement, and is suitable for scanning of a photon beam or a particle beam on a liquid or powder form material on all devices for manufacturing a three-dimensional object layer by layer.
  • the user can freely set the thin-walled threshold according to the processing requirements, and divide the cross-layer scanning and sintering profile into thin-walled and non-thin-walled areas, and then use different scanning parameters to scan different areas to maximize the balance.
  • the present invention provides a first method of dividing a thin-walled region and a non-thin-walled region. It specifically includes the following steps:
  • step S115 sequentially compare, respectively, whether the length of each intersecting line segment of the M1 intersecting line segments is smaller than the thin wall threshold, and if the length of the compared intersecting line segments is smaller than the thin wall threshold, step S116 is performed, if compared The length of the intersecting line segment is not less than the thin wall threshold, and step S117 is performed.
  • the present invention provides a second division method of a thin-walled region and a non-thin-walled region. It specifically includes the following steps:
  • S113' intersects the workpiece contour section with a line whose pitch is a preset scanning pitch value and parallel to the Y-axis direction of the xy plane, and obtains M2 intersecting line segments in the Y-axis direction, and the M2 is an integer.
  • step S115' sequentially comparing whether the length of each of the intersecting line segments of the M2 intersecting line segments is smaller than the thin wall threshold, and if the length of the intersected intersecting line segments is smaller than the thin wall threshold, step S116' is performed; The length of the intersecting line segment being compared is not less than the thin wall threshold, and step S117' is performed.
  • the present invention provides a third division method of thin-walled regions and non-thin-walled regions. It specifically includes the following steps:
  • step S115 respectively comparing whether the length of each of the M3 intersecting line segments and the M4 intersecting line segments is smaller than the thin wall threshold, and when the length of the compared intersecting line segments is less than the thin wall threshold, Go to step S116":
  • non-thin wall area is the coating area to be scanned remaining after removing the thin wall area.
  • the present invention provides a fourth method of dividing a thin-walled region and a non-thin-walled region. It specifically includes the following steps:
  • the slice with the parallel xy plane is tangent to the workpiece data file to obtain N workpiece contour sections, and the spacing between adjacent two workpiece contour sections is a preset layer thickness, and the N is positive Integer.
  • step S115"' sequentially comparing whether the length of each of the intersection lines of the M3 intersecting line segments is smaller than the thin wall threshold, and if the length of the intersected line segments being compared is smaller than the thin wall threshold, step S116"' is performed. If the length of the intersected line segment being compared is not less than the thin wall threshold, perform steps S117".
  • step S117"' respectively comparing whether the length of each of the intersecting line segments of the M4 intersecting line segments is smaller than the thin wall threshold, and if the length of the intersecting line segments being compared is smaller than the thin wall threshold, step S116"' is performed. If the length of the intersected line segments being compared is not less than the thin wall threshold, step S118"' is performed.
  • the method for scanning the thin-walled area specifically includes the following steps:
  • the scanning pitch and the scanning path are determined according to the minimum spot size and accuracy requirements of the system.
  • S12a2 set the spot size to the minimum spot size of the system.
  • the system sends instructions to control the movement of the galvanometer motor and the emission power of the laser, and scans the layer by layer according to the set scan path.
  • the method for scanning the non-thin wall region specifically includes the following steps:
  • the scan path is determined according to the scan interval value and the scanning mode predetermined by the user.
  • the system sends instructions to control the movement of the galvanometer motor and the emission power of the laser, and scans the layer by layer according to the set scan path.
  • a scanning method for manufacturing a three-dimensional object layer by layer is used for a layer manufacturing apparatus.
  • the present invention is based on a layer-by-layer scanning of a three-dimensional object using a photon beam or a particle beam 1, that is, using a photon beam or a particle beam 1 to be shot on a workbench.
  • the powder to be processed by the paving mechanism 4 on the cross section of the three-dimensional object 2 is subjected to filling scanning sintering.
  • FIG. 9 is a schematic view showing a section of a layer of two three-dimensional objects in the Z-axis direction according to a specific application example of the present invention.
  • the object a and the object b have a joint surface which is required to have high precision and a high degree of fit, as shown by the first region 3 and the second region 6; the present invention is taken as an example to further explain the present invention.
  • the system intersects the contour cross section with a line whose pitch is the preset scanning pitch value ⁇ d and parallel to the X/Y axis direction of the xy plane, respectively, and N intersecting line segments in the X/Y axis direction are respectively obtained. Then, the thin wall threshold ⁇ W of the user-defined setting is read, and ⁇ W is compared with the length of each intersecting line segment in the X/Y axis direction on the cross section, respectively.
  • the convex region of the first region 3 in the X-axis direction of the cross section of the object a and the convex region in the second region 6 in the Y-axis direction are thin walls of the entire cross section.
  • the scanning pitch and the scanning path smaller than ⁇ d are determined according to the minimum spot diameter size and accuracy requirements of the system.
  • a smaller scanning speed is set under the premise of ensuring the scanning accuracy.
  • the spot diameter size is set to the system minimum spot diameter size.
  • the photon beam or particle beam power parameters are determined according to the scanning speed, the scanning pitch and the spot diameter size.
  • the scan path is determined according to the user preset scan pitch value ⁇ d and the scan mode. Then, set a fixed spot diameter size, a fixed scan speed, and a fixed photon beam or particle beam power parameter. Finally, the system sends instructions according to the set parameter values, controls the motion of the galvanometer motor and the emission power of the photon beam or the particle beam, and scans the layer by layer according to the set scan path.
  • the cross-section layer after firing, the convex region of the cross section of the object a in the first region 3 and the convex region in the second region 6 ensure the processing precision by adjusting the scanning parameters; the non-thin wall region is thinner than the thin wall
  • the parameters such as the scanning interval of the area increase the scanning sintering efficiency.
  • the recessed area of the object b section in the first area 3 and the recessed area in the second area 6 are larger than the intersecting line segment in the X/Y axis direction ⁇ W, so the sintering accuracy can be ensured without using the minimum spot diameter size and adjusting other parameters.
  • the scanning power density of the thin-walled region is the same as the scanning power density of the non-thin-walled region.
  • a laser beam can be selected for the photon beam, and a high energy electron beam can be selected for the particle beam.
  • the layer manufacturing apparatus may be a stereolithography apparatus, a laser sintering apparatus, an electron beam melting apparatus, or the like.
  • the material to be scanned may be a liquid material such as a liquid photocurable resin, a ceramic powder, a paraffin powder, a metal powder or a polymer powder, and a powder material.
  • the preset scan pitch value is determined by the user according to factors such as the spot diameter size of the system, the scanning power, the material density, and the like.
  • the thin wall threshold is set by the user according to the manufacturing precision required by the workpiece and the minimum spot diameter size of the system, and the value is generally greater than 1.5 times the preset scanning pitch value.
  • the scan parameter when the scan parameter is set, when the non-thin wall region is scanned, the first photon beam power or the first particle beam power and the first spot diameter size are selected; when the thin wall region is scanned, the second is selected. Photon beam power or second particle beam power and second spot diameter size; said first photon beam power being greater than said second photon beam power, said first particle beam power being greater than said second particle Beam power, the first spot diameter dimension being greater than the second spot diameter dimension.
  • the scanning speed is determined by the response frequency parameter of the galvanometer and the scanning accuracy; the scanning speed and the scanning pitch are ensured by the same as the power density of the photon beam or the particle beam of the non-thin wall region.
  • the power parameters of the photon beam or the particle beam are determined.

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Abstract

一种用于逐层制造三维物体的扫描方法，步骤为：（1）根据薄壁阈值以及待制造的三维物体的每层截面在X和/或Y方向上轮廓的间隙宽度，将需要扫描的涂层区域分为薄壁区与非薄壁区；（2）根据薄壁区和非薄壁区，进行分区扫描；当扫描非薄壁区时，选择第一光子射束功率或第一粒子射束功率和第一光斑直径尺寸；当扫描薄壁区时，选择第二光子射束功率或第二粒子射束功率和第二光斑直径尺寸。本方法在最大程度上均衡了逐层制造三维物体过程中所面临的效率和精度的制约问题，既保证了效率，也保证了加工零件的精度和表面质量。

Description

一种用于逐层制造三维物体的扫描方法
本申请要求于2013年12月25日提交中国专利局、申请号为201310725052.0、发明名称为“一种用于逐层制造三维物体的扫描方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明主要涉及到分层制造技术领域，特指一种适用于逐层制造技术的三维物体扫描方法，即在逐层制造三维物体的过程中，将每层待加工的图形区域分为薄壁区和非薄壁区，从而进行区分扫描的方法。
背景技术
现有技术中的涉及“层制造”的装置，例如已知用于立体平板印刷术(stereo lithography)、激光烧结(laser sintering)和电子束熔化(electron beam melting)等的装置。这些装置都包括一个用于相对于工作表面定位物体的支架、一个用于涂覆液态的或粉末形式的材料的装置、一个聚焦的光子射束或粒子射束。工作时，通过涂覆装置将一层一层液态的或粉末形式的材料涂覆在工作表面，并随后由高能量的光子射束或粒子射束对准与每层待加工的图形区域相对应的涂层位置进行扫描，并引起扫描位置的材料的硬化。这样，逐层叠加，制成三维物体。
在上述传统结构中，精度和效率是衡量装置制作三维物体关键的两个性能指标。在逐层制造过程中，就每层而言，加工精度要求高，就意味着加工后的扫描硬化区与期望原型的图形区的拟合度高；生产效率要求高，则表示在更短的时间内完成每层的扫描与硬化。一般情况下，扫描作业占据每层三维物体制作的大部分时间。除成型前后的数据处理、材料因素等之外，精度与光子射束或粒子射束的光斑直径尺寸和功率有很大关系。在保证成型物体致密性的前提下，光子射束或粒子射束以相同的或最大的扫描速度运行(一般地，最大扫描速度受到系统硬件条件的制约)，精度要求越高，则越需要减小填充扫描间距以及光子射束或粒子射束的光斑直径尺寸和功率，那么扫描填充的次数增多，从而降低了加工效率；效率要求越高，则越需要加大填充扫描间距以及光子射束或粒子射束的光斑直径尺寸和功率，那么待扫描加工的原型图形中，比填充 扫描间距窄的部位，也即轮廓间距比较薄的部位，有两种可能加工的结果。其一，丢弃，不加工；其二，执行扫描，成型后的物体在该部位的尺寸比原型的大，要求精密加工的制件或制件的关键部位达不到加工精度要求。因此，从一个层面来讲，精度和效率在一定程度上是相互制约的。
在传统的上述“层制造”装置上，针对某一种成型材料，现有的做法是，在整个制造三维物体的过程中，选择相同的或最大的扫描速度，采取相同的扫描间距、光子射束或粒子射束的功率和光斑直径尺寸参数。这样，用户只能根据系统固定的设置参数进行扫描烧结，往往出现满足加工精度，但生产效率低下或是加工精度不够，生产效率较高的现象。
发明内容
本发明要解决的技术问题就在于：针对现有技术存在的技术问题，本发明提供一种原理简单、易实现、可对加工精度和加工效率进行优化配置的用于逐层制造三维物体的扫描方法。
为解决上述技术问题，本发明采用以下技术方案：
一种用于逐层制造三维物体的扫描方法，包括：
步骤S11、根据薄壁阈值以及待制造的三维物体的每层截面在X和/或Y方向上轮廓的间隙宽度，将需要扫描的涂层区域分为薄壁区与非薄壁区；其中，所述薄壁区为在X和/或Y方向上的轮廓间隙宽度小于阈值的所述需要扫描的涂层区域，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域；
步骤S12、根据所述步骤S11得到的所述薄壁区和所述非薄壁区，进行分区扫描；当扫描所述非薄壁区时，选择第一光子射束功率或第一粒子射束功率和第一光斑直径尺寸；当扫描所述薄壁区时，选择第二光子射束功率或第二粒子射束功率和第二光斑直径尺寸；所述第一光子射束功率大于所述第二光子射束功率，所述第一粒子射束功率大于所述第二粒子射束功率，所述第一光斑直径尺寸大于所述第二光斑直径尺寸。
进一步地，所述步骤S11具体包括以下步骤：
S111、读入工件数据文件；
S112、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
S113、用间距为预设扫描间距值、且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M1条相交线段，所述M1为整数；
S114、读入用户自定义设置的薄壁阈值；
S115、依次分别比较所述M1条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，如果被比较的相交线段的长度不小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
进一步地，所述步骤S11具体包括：
S111’、读入工件数据文件；
S112’、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
S113’、用间距为预设扫描间距值、且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M2条相交线段，所述M2为整数；
S114’、读入用户自定义设置的薄壁阈值；
S115’、依次分别比较所述M2条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，如果被比较的相交线段的长度不小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
进一步地，所述步骤S11具体包括：
S111”、读入工件数据文件；
S112”、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
S113”、用间距为预设扫描间距值，且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M3条相交线段；用间距为预设扫描间距值，且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M4条相交线段；其中，所述M3和M4均为整数；
S114”、读入用户自定义设置的薄壁阈值；
S115”、依次分别比较所述M3条相交线段和所述M4条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，当被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域。
进一步地，所述预设扫描间距值由用户根据系统的光斑直径尺寸、扫描功率和/或材料密度确定。
进一步地，所述薄壁阈值由用户根据工件要求的制作精度和系统的最小光斑直径尺寸定义设置，取值大于预设扫描间距值的1.5倍以上。
进一步地，所述步骤S12具体包括以下步骤：
S121、对于轮廓截面的所有非薄壁区，根据用户预设的扫描间距值和扫描方式，确定扫描路径，然后，选择相同的扫描速度，设置相同的光斑直径尺寸和相同的光子射束或粒子射束的功率参数；
S122、对于轮廓截面的所有薄壁区，根据系统的最小光斑直径尺寸和精度要求，确定扫描间距和扫描路径，光斑直径尺寸设置为系统最小光斑直径尺寸，然后，确定扫描速度，光子射束或粒子射束的功率参数。
进一步地，所述薄壁区的扫描功率密度与非薄壁区的扫描功率密度相同。
进一步地，所述光子射束为激光射线，所述粒子射束为高能量电子束。
进一步地，所述扫描方法是基于层制造装置，所述层制造装置为立体平板印刷术装置、激光烧结装置或电子束熔化装置；所述层制造装置的扫描材料为液态光固化树脂、陶瓷粉末、石蜡粉末、金属粉末、或聚合物粉末。
与现有技术相比，本发明的优点在于：本发明的用于逐层制造三维物体的扫描方法，原理简单、易实现，适用于所有逐层制造三维物体的装置上光子射 束或粒子射束在液态的或粉末形式的材料上的扫描。用户可以根据加工要求自由设置薄壁阈值，将逐层扫描烧结的轮廓截面分为薄壁区和非薄壁区，进而采用不同的扫描参数对不同区域进行区分扫描，在最大程度上均衡了逐层制造三维物体的效率和精度。根据本发明的方法，对非薄壁区采用较大的或最大的固定扫描速度，设置固定的光斑直径尺寸和固定的光子射束或粒子射束的功率等参数，以保证生产效率；扫描非薄壁区时，采用最小系统光斑直径尺寸，并同时调整扫描间距、扫描速度和光子射束或粒子射束的功率等参数，使薄壁区获得与非薄壁区一致的功率密度，由于减小了光斑直径尺寸，并设置了与之相适应的扫描间距，从而避免了因采用较大光斑尺寸及预设间距扫描导致溢出应加工区域的情况，保证了薄壁区加工精度。这样满足了在整个逐层制作三维物体的加工效率以及制件加工精度的要求。
附图说明
图1是本发明实施例提供的用于逐层制造三维物体的扫描方法的流程示意图；
图2是本发明实施例提供的薄壁区和非薄壁区的第一种划分方法的流程示意图；
图3是本发明实施例提供的薄壁区和非薄壁区的第二种划分方法的流程示意图；
图4是本发明实施例提供的薄壁区和非薄壁区的第三种划分方法的流程示意图；
图5是本发明实施例提供的薄壁区和非薄壁区的第四种划分方法的流程示意图；
图6是本发明实施例提供的对薄壁区进行扫描的方法流程示意图；
图7是本发明实施例提供的对非薄壁区进行扫描的方法流程示意图；
图8是本发明在具体应用实例中的工作原理示意图；
图9是本发明在具体应用实例中两个三维物体在Z轴方向上某一层截面的示意图。
图例说明：
1、光子射束或粒子射束；2、待加工三维物体；3、第一区域；4、铺料机构；5、工作台面；6、第二区域。
具体实施方式
以下将结合说明书附图和具体实施例对本发明做进一步详细说明。
图1是本发明提供的用于逐层制造三维物体的扫描方法的流程示意图，如图1所示，该方法包括以下步骤：
步骤S11、根据薄壁阈值以及待制造的三维物体的每层截面在X和/或Y方向上轮廓的间隙宽度，将需要扫描的涂层区域分为薄壁区与非薄壁区；其中，所述薄壁区为在X和/或Y方向上轮廓间隙宽度小于阈值的所述需要扫描的涂层区域，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域：
需要说明的是，所述薄壁阈值即为三维物体截面轮廓的间隙宽度的阈值。
步骤S12、根据所述步骤S11得到的所述薄壁区和所述非薄壁区，进行分区扫描；当扫描所述非薄壁区时，选择第一光子射束功率或第一粒子射束功率和第一光斑直径尺寸；当扫描所述薄壁区时，选择第二光子射束功率或第二粒子射束功率和第二光斑直径尺寸；所述第一光子射束功率大于所述第二光子射束功率，所述第一粒子射束功率大于所述第二粒子射束功率，所述第一光斑直径尺寸大于所述第二光斑直径尺寸。
本发明的用于逐层制造三维物体的扫描方法，原理简单、易实现，适用于所有逐层制造三维物体的装置上光子射束或粒子射束在液态的或粉末形式的材料上的扫描。用户可以根据加工要求自由设置薄壁阈值，将逐层扫描烧结的轮廓截面分为薄壁区和非薄壁区，进而采用不同的扫描参数对不同区域进行区分扫描，在最大程度上均衡了逐层制造三维物体的效率和精度。
作为本发明的一个具体实施方式，如图2所示，本发明提供了薄壁区和非薄壁区的第一种划分方法。其具体包括以下步骤：
S111、读入工件数据文件。
S112、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数。
S113、用间距为预设扫描间距值、且平行于xy平面中X轴方向的直线与 所述工件轮廓截面相交，得到X轴方向上的M1条相交线段，所述M1为整数。
S114、读入用户自定义设置的薄壁阈值。
S115、依次分别比较所述M1条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，执行步骤S116，如果被比较的相交线段的长度不小于所述薄壁阈值，执行步骤S117。
S116、确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区。
S117、确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
作为本发明的一个具体实施方式，如图3所示，本发明提供了薄壁区和非薄壁区的第二种划分方法。其具体包括以下步骤：
S111’、读入工件数据文件。
S112’、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数。
S113’、用间距为预设扫描间距值、且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M2条相交线段，所述M2为整数。
S114’、读入用户自定义设置的薄壁阈值。
S115’、依次分别比较所述M2条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，执行步骤S116’；如果被比较的相交线段的长度不小于所述薄壁阈值，执行步骤S117’。
S116’、确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区。
S117’、确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
作为本发明的一个具体实施方式，如图4所示，本发明提供了薄壁区和非薄壁区的第三种划分方法。其具体包括以下步骤：
S111”、读入工件数据文件。
S112”、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数。
S113”、用间距为预设扫描间距值，且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M3条相交线段；用间距为预设扫描间距值，且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M4条相交线段；其中，所述M3和M4均为整数。
S114”、读入用户自定义设置的薄壁阈值。
S115”、依次分别比较所述M3条相交线段和所述M4条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，当被比较的相交线段的长度小于所述薄壁阈值，执行步骤S116”：
其中，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域。
S116”、确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区。
作为本发明的一个具体实施方式，如图5所示，本发明提供了薄壁区和非薄壁区的第四种划分方法。其具体包括以下步骤：
S111”’、读入工件数据文件。
S112”’、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数。
S113”’、用间距为预设扫描间距值，且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M3条相交线段；用间距为预设扫描间距值，且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M4条相交线段；其中，所述M3和M4均为整数。
S114”’、读入用户自定义设置的薄壁阈值。
S115”’、依次分别比较所述M3条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，执行步骤S116”’。如果被比较的相交线段的长度不小于所述薄壁阈值，执行步骤 S117”。
S116”’、确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区。
S117”’、依次分别比较所述M4条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，执行步骤S116”’，如果被比较的相交线段的长度不小于所述薄壁阈值，执行步骤S118”’。
S118”’、确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
在上述步骤S12中，如图6所示，对薄壁区进行扫描的方法具体包括以下步骤：
S12a1、对轮廓截面的薄壁区，根据系统的最小光斑尺寸和精度要求，确定扫描间距和扫描路径。
S12a2、将光斑尺寸设置为系统最小光斑尺寸。
S12a3、在保证功率密度的情况下，确定扫描速度、确定光子射束或粒子射束功率参数。
S12a4、系统发送指令，控制振镜电机运动和激光器的发射功率，按照设定的扫描路径逐层扫描烧结。
在上述步骤S12中，如图7所示，对非薄壁区进行扫描的方法具体包括以下步骤：
S12b1、对轮廓截面的非薄壁区，根据用户预定的扫描间距值和扫描方式，确定扫描路径。
S12b2、设置固定的光斑尺寸、固定的扫描速度和固定的光子射束或粒子射束功率参数。
S12b3、系统发送指令，控制振镜电机运动和激光器的发射功率，按照设定的扫描路径逐层扫描烧结。
作为本发明的一个具体实施例，本发明的一种用于逐层制造三维物体的扫描方法，用于层制造装置。如图8所示，本发明基于采用光子射束或粒子射束1对三维物体进行逐层扫描的方式，即利用光子射束或粒子射束1射在工作台 面5上，对待加工三维物体2截面上通过铺料机构4平铺的粉末进行填充扫描烧结。
如图9所示，为本发明在具体应用实例中两个三维物体在Z轴方向上某一层截面的示意图。图中，物体a与物体b有要求精度高、配合度高的结合面，如第一区域3和第二区域6所示；以上述物体为例，对本发明做进一步详细的说明。
针对该层截面，系统分别用间距为预设扫描间距值△d且平行于xy平面X/Y轴方向的直线与轮廓截面相交，分别得到X/Y轴方向上N条相交线段。然后，读入用户自定义设置的薄壁阈值△W，分别用△W与截面上X/Y轴方向上的每一条相交线段的长度相比较。假定△W>W1、△W>W2，那么物体a截面在X轴方向上第一区域3内的凸出区域和在Y轴方向上第二区域6内的凸出区域为整个截面的薄壁区，其他区域，包括物体b和物体a(除区域3内的凸出部分和区域6内的凸出部分外)在X/Y轴方向上的相交线段长度大于△W，则为非薄壁区。
针对所得到的不同的区域设置不同的扫描参数。
1)对物体a截面在第一区域3内的凸出区域和第二区域6内的凸出区域，根据系统的最小光斑直径尺寸和精度要求，确定小于△d的扫描间距和扫描路径。根据振镜的响应频率参数，在保证扫描精度的前提下，设置较小的扫描速度。光斑直径尺寸设置为系统最小光斑直径尺寸。在保证功率密度的情况下，根据扫描速度，扫描间距和光斑直径尺寸，确定光子射束或粒子射束功率参数。
2)对于其他非薄壁区域，根据用户预设扫描间距值△d和扫描方式，确定扫描路径。然后，设置固定的光斑直径尺寸，固定的扫描速度和固定的光子射束或粒子射束功率参数。最后系统根据设置的参数值发送指令，控制振镜电机运动和光子射束或粒子射束的发射功率，按照设定的扫描路径逐层扫描烧结。
烧制后的截面层，物体a截面在第一区域3内的凸出区域和第二区域6内的凸出区域由于调整了扫描参数，保证了加工精度；非薄壁区域，采用比薄壁区大的扫描间距等参数，提高了扫描烧结效率。物体b截面在第一区域3内的凹进区域和第二区域6内的凹进区域，由于在X/Y轴方向上的相交线段大于 △W，因此不需要采用最小光斑直径尺寸和调整其他参数也可以保证烧结精度。
在上述扫描方法中，薄壁区的扫描功率密度与非薄壁区的扫描功率密度相同。
在上述扫描方法中，光子射束可以选用激光射线，粒子射束可以选用高能量电子束。层制造装置可以选用立体平板印刷术装置、激光烧结装置、电子束熔化装置等。扫描的材料可以选用液态光固化树脂、陶瓷粉末、石蜡粉末、金属粉末、聚合物粉末等液态材料与粉末材料。
在上述扫描方法中，所述预设扫描间距值是由用户根据系统的光斑直径尺寸、扫描功率、材料密度等因素确定。
在上述扫描方法中，所述薄壁阈值由用户根据工件要求的制作精度和系统的最小光斑直径尺寸等因素自行定义设置，一般取值大于预设扫描间距值的1.5倍以上。
在上述扫描方法中，设置扫描参数时，当扫描非薄壁区时，选择第一光子射束功率或第一粒子射束功率和第一光斑直径尺寸；当扫描薄壁区时，选择第二光子射束功率或第二粒子射束功率和第二光斑直径尺寸；所述第一光子射束功率大于所述第二光子射束功率，所述第一粒子射束功率大于所述第二粒子射束功率，所述第一光斑直径尺寸大于所述第二光斑直径尺寸。
具体地，针对轮廓截面的非薄壁区，采用现有常见的做法，选用较大的光斑直径尺寸，扫描速度和光子射束或粒子射束功率扫描参数。针对轮廓截面的薄壁区，由振镜的响应频率参数和扫描精度共同确定扫描速度；在保证与非薄壁区光子射束或粒子射束功率密度一致的情况下，由扫描速度、扫描间距和光斑直径尺寸共同确定光子射束或粒子射束的功率参数。
以上仅是本发明的优选实施方式，本发明的保护范围并不仅局限于上述实施例，凡属于本发明思路下的技术方案均属于本发明的保护范围。应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理前提下的若干改进和润饰，应视为本发明的保护范围。

Claims (10)

  1. 一种用于逐层制造三维物体的扫描方法，其特征在于，包括：
    步骤S11、根据薄壁阈值以及待制造的三维物体的每层截面在X和/或Y方向上轮廓的间隙宽度，将需要扫描的涂层区域分为薄壁区与非薄壁区；其中，所述薄壁区为在X和/或Y方向上轮廓间隙宽度小于阈值的所述需要扫描的涂层区域，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域；
    步骤S12、根据所述步骤S11得到的所述薄壁区和所述非薄壁区，进行分区扫描；当扫描所述非薄壁区时，选择第一光子射束功率或第一粒子射束功率和第一光斑直径尺寸；当扫描所述薄壁区时，选择第二光子射束功率或第二粒子射束功率和第二光斑直径尺寸；所述第一光子射束功率大于所述第二光子射束功率，所述第一粒子射束功率大于所述第二粒子射束功率，所述第一光斑直径尺寸大于所述第二光斑直径尺寸。
  2. 根据权利要求1所述的方法，其特征在于，所述步骤S11具体包括以下步骤：
    S111、读入工件数据文件；
    S112、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
    S113、用间距为预设扫描间距值、且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M1条相交线段，所述M1为整数；
    S114、读入用户自定义设置的薄壁阈值；
    S115、依次分别比较所述M1条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，如果被比较的相交线段的长度不小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
  3. 根据权利要求1所述的方法，其特征在于，所述步骤S11具体包括：
    S111’、读入工件数据文件；
    S112’、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮 廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
    S113’、用间距为预设扫描间距值、且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M2条相交线段，所述M2为整数；
    S114’、读入用户自定义设置的薄壁阈值；
    S115’、依次分别比较所述M2条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，如果被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，如果被比较的相交线段的长度不小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述非薄壁区。
  4. 根据权利要求1所述的方法，其特征在于，所述步骤S11具体包括：
    S111”、读入工件数据文件；
    S112”、用平行xy平面的薄片与所述工件数据文件相切，得到N个工件轮廓截面，相邻两个所述工件轮廓截面的间距为预设的分层厚度，所述N为正整数；
    S113”、用间距为预设扫描间距值，且平行于xy平面中X轴方向的直线与所述工件轮廓截面相交，得到X轴方向上的M3条相交线段；用间距为预设扫描间距值，且平行于xy平面中Y轴方向的直线与所述工件轮廓截面相交，得到Y轴方向上的M4条相交线段；其中，所述M3和M4均为整数；
    S114”、读入用户自定义设置的薄壁阈值；
    S115”、依次分别比较所述M3条相交线段和所述M4条相交线段中的每一条相交线段的长度是否小于所述薄壁阈值，当被比较的相交线段的长度小于所述薄壁阈值，确定所述被比较的相交线段与下一条相交线段之间的区域为所述薄壁区，所述非薄壁区为去除所述薄壁区后剩余的所述需要扫描的涂层区域。
  5. 根据权利要求2-4任一项所述的方法，其特征在于，所述预设扫描间距值由用户根据系统的光斑直径尺寸、扫描功率和/或材料密度确定。
  6. 根据权利要求2-4任一项所述的方法，其特征在于，所述薄壁阈值由用户根据工件要求的制作精度和系统的最小光斑直径尺寸定义设置，取值大于预 设扫描间距值的1.5倍以上。
  7. 根据权利要求1-4任一项所述的方法，其特征在于，所述步骤S12具体包括以下步骤：
    S121、对于轮廓截面的所有非薄壁区，根据用户预设的扫描间距值和扫描方式，确定扫描路径，然后，选择相同的扫描速度，设置相同的光斑直径尺寸和相同的光子射束或粒子射束的功率参数；
    S122、对于轮廓截面的所有薄壁区，根据系统的最小光斑直径尺寸和精度要求，确定扫描间距和扫描路径，光斑直径尺寸设置为系统最小光斑直径尺寸，然后，确定扫描速度，光子射束或粒子射束的功率参数。
  8. 根据权利要求1～4中任意一项所述的方法，其特征在于，所述薄壁区的扫描功率密度与非薄壁区的扫描功率密度相同。
  9. 根据权利要求1～4中任意一项所述的方法，其特征在于，所述光子射束为激光射线，所述粒子射束为高能量电子束。
  10. 根据权利要求1～4中任意一项所述的方法，其特征在于，所述扫描方法是基于层制造装置，所述层制造装置为立体平板印刷术装置、激光烧结装置或电子束熔化装置；所述层制造装置的扫描材料为液态光固化树脂、陶瓷粉末、石蜡粉末、金属粉末、或聚合物粉末。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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EP3578363A1 (en) * 2018-06-07 2019-12-11 CL Schutzrechtsverwaltungs GmbH Method for operating an apparatus for additively manufacturing three-dimensional objects
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CN105195742B (zh) * 2015-11-03 2017-06-23 西安赛隆金属材料有限责任公司 一种高能束选区熔化成形的熔化路径设计方法
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CN105772721A (zh) * 2016-03-11 2016-07-20 周宏志 基于增材制造的光斑大小可变的扫描路径生成方法
CN105945281B (zh) * 2016-05-09 2019-04-12 华中科技大学 零件与模具的熔积成形加工制造方法
CN106042375A (zh) * 2016-05-27 2016-10-26 中北大学 用于增材制造的数字化喷射喷头
US10343388B2 (en) * 2016-09-16 2019-07-09 General Electric Company Methods and apparatus for thin-walled geometries for additive manufacturing
CN106392071A (zh) * 2016-09-18 2017-02-15 四川大学 一种用于提高粉床熔融成型增材制造效率和精度的方法
CN108127115A (zh) * 2016-11-30 2018-06-08 吴江中瑞机电科技有限公司 一种用于增材制造三维物体的激光扫描路径生成方法
EP3563203B1 (en) * 2017-03-31 2021-08-11 EOS GmbH Electro Optical Systems Control data for manufacturing one three-dimensional object by means of a layer-wise solidification of a building material
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DE102017213720A1 (de) * 2017-08-07 2019-02-07 Eos Gmbh Electro Optical Systems Optimiertes Segmentierungsverfahren
CN107671286B (zh) * 2017-09-26 2019-06-14 北京恒创增材制造技术研究院有限公司 一种提高金属3d打印速度的方法
CN108907190B (zh) * 2018-07-25 2020-07-31 沈阳精合数控科技开发有限公司 一种碗形薄壁零件的3d打印增材制造方法
CN110126266A (zh) * 2019-04-17 2019-08-16 湖南华曙高科技有限责任公司 一种三维物体制造方法
CN110508810B (zh) * 2019-08-31 2021-09-28 南京理工大学 基于薄壁特征识别的激光增材制造工艺路径规划方法
CN111347040A (zh) * 2019-12-15 2020-06-30 武汉光谷航天三江激光产业技术研究院有限公司 一种高精度、高效率的双光束复合激光选区熔化成形方法及装置
CN114166145B (zh) * 2021-11-30 2022-10-25 西安交通大学 基于热影响区加热顺序再规划的变形控制方法及系统
CN114713844B (zh) * 2022-04-14 2024-01-02 季华实验室 金属选区激光熔化成形方法及系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09206972A (ja) * 1996-01-31 1997-08-12 Toyota Motor Corp 立体モデルの造型方法
JP3873571B2 (ja) * 2000-03-28 2007-01-24 松下電工株式会社 光造形機用データ作成方法及びその装置
CN101689229A (zh) * 2007-07-11 2010-03-31 斯特拉塔西斯公司 用于构建具有薄壁区域的三维对象的方法
CN102229245A (zh) * 2011-04-27 2011-11-02 西安交通大学 一种使用变光斑工艺的光固化快速成型方法
CN103639411A (zh) * 2013-12-25 2014-03-19 湖南华曙高科技有限责任公司 一种用于逐层制造三维物体的扫描方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100340388C (zh) * 2006-03-03 2007-10-03 南京师范大学 制作三维物体和支撑的打印成型方法
DE102006055073A1 (de) * 2006-11-22 2008-05-29 Eos Gmbh Electro Optical Systems Vorrichtung und Verfahren zum schichtweisen Herstellen eines dreidimensionalen Objekts
DE102012202487A1 (de) * 2012-02-17 2013-08-22 Evonik Industries Ag Verfahren zum Aufschmelzen/Sintern von Pulverpartikeln zur schichtweisen Herstellung von dreidimensionalen Objekten

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09206972A (ja) * 1996-01-31 1997-08-12 Toyota Motor Corp 立体モデルの造型方法
JP3873571B2 (ja) * 2000-03-28 2007-01-24 松下電工株式会社 光造形機用データ作成方法及びその装置
CN101689229A (zh) * 2007-07-11 2010-03-31 斯特拉塔西斯公司 用于构建具有薄壁区域的三维对象的方法
CN102229245A (zh) * 2011-04-27 2011-11-02 西安交通大学 一种使用变光斑工艺的光固化快速成型方法
CN103639411A (zh) * 2013-12-25 2014-03-19 湖南华曙高科技有限责任公司 一种用于逐层制造三维物体的扫描方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106584838A (zh) * 2015-10-09 2017-04-26 三纬国际立体列印科技股份有限公司 立体打印方法以及立体打印装置
EP3578363A1 (en) * 2018-06-07 2019-12-11 CL Schutzrechtsverwaltungs GmbH Method for operating an apparatus for additively manufacturing three-dimensional objects
JP2020023161A (ja) * 2018-06-07 2020-02-13 コンセプト・レーザー・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング ３次元物体を付加製造する装置を動作させる方法
US11440262B2 (en) 2018-06-07 2022-09-13 Concept Laser Gmbh Method for operating an apparatus for additively manufacturing three-dimensional objects
CN112519208A (zh) * 2020-11-16 2021-03-19 杭州德迪智能科技有限公司 光固化3d打印方法
CN113369497A (zh) * 2021-06-10 2021-09-10 合肥工业大学 一种用于厚度变化较大零件的粉末床增材制造的分区方法
CN114985762A (zh) * 2022-05-25 2022-09-02 合肥中科重明科技有限公司 一种薄壁螺旋曲面AlMg10合金零件的成形工艺

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