WO2015051679A1 - Fil métallique pour la coupe de multifilaments et appareil pour sa fabrication - Google Patents
Fil métallique pour la coupe de multifilaments et appareil pour sa fabrication Download PDFInfo
- Publication number
- WO2015051679A1 WO2015051679A1 PCT/CN2014/085268 CN2014085268W WO2015051679A1 WO 2015051679 A1 WO2015051679 A1 WO 2015051679A1 CN 2014085268 W CN2014085268 W CN 2014085268W WO 2015051679 A1 WO2015051679 A1 WO 2015051679A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wire
- metal wire
- deformation
- cutting
- inner diameter
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 99
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 43
- 239000002184 metal Substances 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 230000007423 decrease Effects 0.000 claims abstract description 3
- 230000007246 mechanism Effects 0.000 claims description 54
- 238000004513 sizing Methods 0.000 claims description 18
- 238000005728 strengthening Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 239000003082 abrasive agent Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 230000001965 increasing effect Effects 0.000 abstract description 6
- 238000009828 non-uniform distribution Methods 0.000 abstract 5
- 235000019589 hardness Nutrition 0.000 abstract 4
- 238000000034 method Methods 0.000 description 11
- 229920003023 plastic Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229920000114 Corrugated plastic Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
Definitions
- This invention relates to a wire for multi-wire cutting, and more particularly to a wire for multi-wire cutting of hard materials such as crystalline silicon, silicon carbide, sapphire, crystal, etc., and a manufacturing apparatus therefor. Background technique
- the multi-wire cutting uses a wire as a carrier, and the wire carries a super-hard abrasive in a high-speed motion, and the high-hard material (such as crystalline silicon, silicon carbide, sapphire, crystal, etc.) is subjected to roll-cut grinding by the abrasive to realize cutting.
- This method has become the main production mode with the advantages of high cutting efficiency, small cutting kerf, less material loss, high cutting precision and good surface quality.
- the wire as the carrier carrying the abrasive, the stability during the cutting process and the ability to carry the abrasive play an extremely important role in cutting efficiency and product quality.
- the currently widely used wire is a circular structure with a smooth surface (straight wire), which has the outstanding advantage that the wire can uniformly carry the abrasive in the direction around which it is cut and fed, thereby providing a stable cutting surface quality.
- the surface area of the wire can be increased by increasing the diameter of the wire, thereby enhancing the ability of the wire to carry the abrasive to improve the cutting efficiency, at the expense of increasing the width of the kerf, resulting in material loss during the cutting process. Increase.
- the improvement of cutting efficiency can also be achieved by increasing the average particle size of the abrasive and the sharpness of the edges.
- the first is to try to make rough wire Increases the abrasive carrying capacity of the wire by increasing the roughness of the wire surface.
- JP2007 196312 proposes to spray an electrolyte onto the surface of a wire. The method causes the surface of the wire to have irregularities;
- W0 9/12670 proposes the concept of a micro-cavity wire, a soft surface wire, and a wire whose cross-section changes along the length;
- KR 2001 002689 describes a circular saw The wire forms a cavity on the circular saw wire by embossing.
- JP 2007 044841 proposes a substantially circular saw wire having a flat surface extending helically around the length of the saw wire, CN102380915A being essentially a natural extension of the above concept; US 2860862 is proposed to be pre-flattened
- the shape of the saw wire applies two helical deformations: first twisting the inner axis of the flat saw wire with a short lay length, and then twisting the saw wire with a longer lay length in a spiral shape.
- FR 750081 also describes spiral sawing wires with a circular or polygonal cross section.
- CN102205563A and CN102765141A are basically all natural extensions of the aforementioned ideas.
- JP 4057666 describes a metal saw wire, which is also twisted to make the straight wire into a spiral shape, and then stretched by a die. So far, the above efforts have not seen successful industrial implementation and application in the field of multi-wire cutting. The core reason is that the spiraling of the wire inevitably requires the twisting of the wire, thereby giving the metal ribbon a high twist. Internal stress, and the longer the wire, the higher the torsional internal stress, which leads to a strong self-winding tendency of the finished wire, which cannot be practically applied to multi-line cutting, which is prominent in the difficulty of completing a uniform long-distance winding take-up line. It is impossible or difficult to wire on the cutting line.
- JP 2004 276207 describes a single-wire or stranded wire having a spiral shape, and it is described that the single wire or stranded wire is guided through a pair of cogwheels to form a 'double-folded fold' in a single plane.
- the saw wire is first bent in the first direction, then the second bend is made in the second direction and opposite to the first direction (reverse bend), and then the strand is twisted and twisted
- the zigzag folds of length are superimposed on the long wave spiral.
- a significant drawback of this type of attempt is that the stranded structure results in a significant increase in the outer diameter of the utility envelope of the saw wire, resulting in unacceptable kerf widening and corresponding additional material loss.
- a third type of attempt has achieved a certain application success. It is a monofilament type metal saw wire disclosed by Ansel Mittal through Chinese patent CN100475398C, which performs wire on two or more planes.
- the bending thereby enhancing the ability of the wire to carry the abrasive to a certain extent, can achieve good results in some specific application environments.
- the disadvantage is that the bending of the saw wire is dominated by one plane, and the bending of other planes is gradually turned to the dominant plane during the cutting process, and finally a saw wire which is deformed substantially only in one plane is formed, thereby resulting in good cutting.
- the rate fluctuates.
- the bending structure due to the limited structural retention of the saw wire, in the case of a long cutting path, the bending structure has substantially or largely disappeared when the cutting line reaches the cutting end, resulting in a lower cutting yield than the cutting starting end. The yield has dropped significantly.
- Bekaert proposed a product concept equivalent to the second type (“spiral wire”) and the third type (“structural wire”) through CN102528940A.
- the basic principle is to be single.
- the wire is bent on the plane by means of a bite gear (or other deformation device), by twisting the wire (the plane around the axis of the wire is rotated to deform the device, or the plane of the deformation device is kept stationary but the same Rotate the receiving and unwinding shaft) to form a spiral wire, and then untwist the wire (rotate the plane of the deformation device opposite to the twisting direction, or keep the plane of the deforming device stationary but rotate in the same direction , release shaft) is partially or completely released due to twisting to the twisted wire of the wire Stress.
- the technical problem to be solved by the present invention is: to solve the common defects common to the conventional linear wire and the conventional structural wire. The closer the cutting tail is, the worse the ability of the wire to carry the abrasive, and the more serious the cutting yield is lowered. .
- the technical solution adopted by the present invention to solve the technical problem thereof is: a wire for multi-wire cutting, a) a plurality of protrusions are regularly distributed on the outer surface, and the apex of the protrusion is the highest point of the outer surface of the wire ;
- the apex of the protrusion is in contact with a circular or approximately circular inner surface of the virtual pipe, and the inner diameter of the virtual pipe is uniformly or uniformly changed;
- the inner diameter of the dummy pipe is less than 1.05 times the diameter of the wire bus bar, and the wire bus bar refers to a raw material for preparing the wire for multi-wire cutting;
- the surface hardness of the wire is regularly distributed, and both reach a local maximum at the apex of the wire protrusion or near the apex of the protrusion.
- the abrasive carrying capacity is enhanced, which is beneficial to improve the cutting efficiency and the cutting yield.
- the surface hardness is unevenly distributed, and the apex of the protrusion or the vicinity thereof is the highest in hardness and the wear resistance is the most. Strongly, the uneven distribution of the above outer diameter does not disappear because the metal wire wears along with the cutting process, thereby facilitating the maintenance of the yield uniformity from the cutting start end to the cutting end.
- the inner diameter of the dummy pipe is smaller than the diameter of the wire bus bar.
- the diameter of the wire for the multi-wire cutting is between 0.08-0. 60mm.
- the wire of the present invention is particularly suitable for multi-wire precision cutting which is sensitive to kerf loss.
- the diameter of the wire is generally preferably between 0.09 and 0.40 mm to minimize kerf loss.
- the axis between the apex of adjacent wire projections The distance is not more than 500 times the inner diameter of the virtual pipe.
- the surface of the wire is coated with a coating mainly composed of a resin material. Due to the heterogeneous nature of the wire, the bond to the wire is much faster than the straight wire.
- an inorganic filler is added to the resin material of the coating, and the inorganic filler includes diamond, silicon carbide, boron nitride, aluminum oxide, zirconium oxide, silicon nitride, carbonization.
- the inorganic filler includes diamond, silicon carbide, boron nitride, aluminum oxide, zirconium oxide, silicon nitride, carbonization.
- One or more of tungsten and graphite is significantly lower than that of the straight wire.
- the present invention relates to a wire for multi-wire cutting that can be used as an optimized bus for a fixed abrasive cutting line.
- the surface of the wire is compounded with a fixed cutting abrasive
- the fixed cutting abrasive comprises one or more of diamond, silicon carbide, boron nitride, aluminum oxide, zirconium oxide, silicon nitride or tungsten carbide.
- Hard material Fixed cutting abrasives have an average particle diameter between 5 ⁇ m and 100 ⁇ m.
- the above-mentioned apparatus for manufacturing a wire for multi-wire cutting comprising at least a wire reel, a pre-deformation mechanism for plastically deforming the wire bus bar, and a deformation strengthening mechanism for deforming the pre-deformed wire,
- the deformation strengthening mechanism is a cylindrical deformation drawing die, the cylindrical deformation
- the drawing die comprises at least a deformed tapered inlet and a cylindrical deformed sizing belt, and the inner diameter of the deformed tapered inlet is gradually reduced from the outside to the inside, and the inner diameter of the deformed sizing belt is consistent with the minimum inner diameter of the deformed tapered inlet, and the strain is fixed.
- the inner diameter of the wire is less than 1. 05 times the diameter of the wire.
- the pre-deformation mechanism includes an initial pre-deformation mechanism that deforms the wire busbar in one or more planes.
- the pre-deformation mechanism further includes a heterogeneous molding mechanism that plastically deforms the wire after the initial pre-deformation mechanism in the advancing direction of the wire and the direction of advancing.
- pre-deformation passing the straight wire busbar through the reel, and then entering the pre-deformation mechanism to perform pre-deformation processing of the wire at least once to process the pre-deformed wire containing plastic deformation;
- deformation strengthening pulling the driving wheel to pull the pre-deformed wire through the deformation strengthening mechanism, forming a wire with the invention by deforming the sizing belt;
- the wire is wound up through the wire tensioning system and the wire-receiving device.
- the invention has the beneficial effects that the abrasive carrying capacity is enhanced due to the uneven distribution of the outer diameter of the wire, which is advantageous for improving the cutting efficiency and the cutting yield, and at the same time, due to the uneven distribution of the surface hardness, and the apex of the protrusion or the vicinity thereof The highest hardness and the strongest wear resistance, the uneven distribution of the above outer diameter will not disappear because the metal wire wears along with the cutting process, thereby facilitating the maintenance of the yield consistency from the cutting start end to the cutting end.
- Figure 1 is a schematic view showing the structure of a wire bus bar before pre-deformation.
- Figure la is an axial view of the wire axis X of Figure 1.
- Figure lb is an axial view of the wire axis Y of Figure 1.
- Figure lc is an axial view of the wire axis Z of Figure 1, with black circles indicating the axis of the wire itself.
- Fig. 2 is a perspective view showing the structure of a pre-deformed wire in the first embodiment of the present invention.
- Figure 2a is an axial view of the wire axis X of Figure 2.
- Figure 2b is an axial view of the wire axis Y of Figure 2.
- Fig. 2c is an axial view of the axis Z of the wire of Fig. 2, the middle line of the figure being formed by projecting the axis of the wire itself.
- Fig. 3 is a perspective view showing the structure of the pre-deformed wire in the embodiment 2 of the present invention.
- Figure 3a is an axial view of the wire axis X of Figure 3.
- Figure 3b is an axial view of the wire axis Y of Figure 3.
- Figure 3c is an axial view of the wire axis Z of Figure 3, in which the center-like twisted line pattern is formed by the projection of the wire itself.
- FIG. 4 is a structural schematic view of the metal ribbon of FIG. 3 having an axial projection surface and a normal plane.
- Fig. 5 is a view showing the configuration of a wire manufacturing apparatus in the first embodiment of the present invention.
- Fig. 6 is a view showing the configuration of a wire manufacturing apparatus in a second embodiment of the present invention.
- Figure 7 is a schematic view showing the structure of a wire manufacturing apparatus in Embodiment 3 of the present invention.
- Fig. 8 is a view showing the structure of a cylindrical forming drawing die in the apparatus for producing a wire according to the present invention.
- Fig. 9 is a view showing the structure of a cylindrical deformation drawing die in the apparatus for manufacturing a wire according to the present invention.
- Figure 10 is a schematic view showing one of the structures of the finally prepared wire of the present invention.
- a wire for multi-wire cutting of the present invention is shown in Figure 10:
- the outer surface is regularly distributed with a plurality of protrusions 100, the apex of the protrusions 100 being the highest point of the outer surface of the wire;
- the apex of the protrusion 100 is in contact with a circular or approximately circular inner surface of the virtual pipe, and the inner diameter of the virtual pipe is uniformly or uniformly changed;
- the inner diameter of the dummy pipe is less than 1.05 times the diameter of the wire bus bar, and the wire bus bar refers to a raw material for preparing the wire lb for multi-wire cutting;
- the surface hardness of the wire is regularly distributed, and both reach a local maximum at the apex of the wire protrusion 100 or near the apex of the protrusion 100.
- the axial distance between the apexes of adjacent wire projections 100 is no more than 500 times the inner diameter of the virtual pipe.
- the present invention relates to a wire for multi-wire cutting that can be used as an optimized bus for a fixed abrasive cutting line.
- the surface of the wire is compounded with a fixed cutting abrasive
- the fixed cutting abrasive comprises one or more of diamond, silicon carbide, boron nitride, aluminum oxide, zirconium oxide, silicon nitride or tungsten carbide.
- Hard material Fixed cutting abrasives have an average particle diameter between 5 ⁇ m and 100 ⁇ m.
- the apparatus for manufacturing a wire for multi-wire cutting includes at least a reel 2, a pre-deformation mechanism 3 that plastically deforms a wire bus bar, and a deformation strengthening mechanism 4 that deforms the pre-deformed wire.
- the deformation strengthening mechanism 4 is a cylindrical deformation drawing die,
- the cylindrical deformation drawing die comprises at least a deformed tapered inlet 41 and a cylindrical deformed sizing belt 42.
- the inner diameter of the deformed tapered inlet 41 is gradually reduced from the outside to the inside, and the inner diameter of the deformed sizing belt 42 and the deformation cone are formed. 5 ⁇
- the inner diameter of the diameter of the wire is less than 1. 05 times.
- the method for producing a wire for multi-wire cutting of the present invention comprises the following steps:
- pre-deformation passing the straight wire busbar through the reel 2, and then entering the pre-deformation mechanism 3 to perform pre-deformation processing of the wire at least once, and processing a pre-deformed wire containing plastic deformation;
- deformation strengthening pulling the driving wheel 72 pulls the pre-deformed wire through the deformation strengthening mechanism 4, and forming the wire with the invention by deforming the sizing belt 42;
- the deformation-enhancing deformation strengthening mechanism 4 is a drawing driving wheel 72 for pulling the wire through the deformation strengthening mechanism to provide sufficient drawing tension, a wire-retracting constant tension system 5, and a wire take-up device 6;
- the deformation strengthening mechanism 4 is a cylindrical shape Deformation drawing die, as shown in FIG. 9, the cylindrical deformation drawing die includes a deformation tapered inlet 41 and a cylindrical deformation sizing belt 42, and the inner diameter of the deformed tapered inlet 41 is gradually reduced from the outside to the inside. 081 ⁇
- the inner diameter of the deformed sizing belt is 0. 081mm.
- the inner diameter of the deformed sizing belt is 0. 081mm.
- 2a, 2b and 2c are schematic views showing the structure of the straight metal bus bar in the present embodiment after passing through the pre-deformation mechanism 3.
- the deformation method of the pre-deformation mechanism 3 of this embodiment is as follows:
- the straight wire passes through the reel 2 in turn, and then enters the pre-deformation mechanism 3 to perform a pre-deformation process of the wire to process the wire la deformed in one plane, that is, the pre-deformation mechanism 3 includes only the initial pre-deformation mechanism 31.
- the wire la formed by the initial pre-deformation mechanism 31 has a plastic deformation portion 11, and as shown in Fig. 2, the plastic deformation portion 11 has a symmetrical uniform wave shape, and the outer diameter of the wire la is larger than the inner diameter of the deformation sizing tape 42. 01 ⁇ In this embodiment is 0. 13mm.
- the wire structure of the present invention includes various conditions for forming protrusions along the wire axis and/or the surrounding axis, and the protrusions may be evenly distributed or non-uniformly distributed.
- the pre-deformation mechanism 3 includes an initial pre-deformation mechanism 31 that deforms the wire bus bar in one plane or a plurality of planes, and further includes The heterogeneous molding mechanism 32 that plastically deforms the wire that has passed through the initial pre-deformation mechanism 31 in the advancing direction of the wire and the direction of advancing in the same direction.
- the heterogeneous molding mechanism 32 is a cylindrical forming drawing die, and the cylindrical forming drawing die includes at least a shaped tapered inlet 321 and a cylindrical shaped sizing tape 322, and the inner diameter of the shaped tapered inlet 321 is The outer diameter is gradually reduced, and the inner diameter of the molded sizing belt 322 coincides with the minimum inner diameter of the shaped tapered inlet 321 .
- the manufacturing method of the present embodiment is different from that of the first embodiment in that after the initial pre-deformation mechanism 31 is deformed, the heterogeneous molding mechanism 32 is also passed, and the pulling drive wheel 72 pulls the wire through the heterogeneous molding mechanism. 32. Due to the angle between the plurality of axes of rotation of the wire before the pre-deformation, and the constant tension of the wire reel 2 which continuously changes the direction of advancement of the wire, the deformed wire is in the advancing direction and surrounding The advancing direction encounters plastic deformation at the same time, and the corrugated plastic deformation portion of the unevenly deformed wire is twisted to form the wire la with the plastic deformation portion 11 as shown in FIG.
- the manufacturing apparatus of a wire according to the present embodiment is different from the first embodiment in that the pre-deformation mechanism 3 includes only the initial pre-deformation mechanism 31, and a mechanism for performing uneven deformation on two planes of the wire bus bar, The two planes are perpendicular to each other. Accordingly, the manufacturing method of the present embodiment is different from that of Embodiment 1 in the process of pre-deformation.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
L'invention concerne un fil métallique pour la coupe de multifilaments, présentant des diamètres externes d'une distribution non uniforme, les points du diamètre externe le plus large étant tous en contact avec une surface interne d'un canal virtuel circulaire ou quasiment circulaire et le diamètre interne du canal virtuel étant constant ou changeant de manière régulière de l'avant vers l'arrière. La dureté de la surface du fil métallique présente également une distribution non uniforme et toutes les duretés sur les points du diamètre externe le plus large du fil métallique sont proches d'une valeur maximale locale. Lorsque le fil métallique est utilisé pour la coupe abrasive libre, puisque les diamètres externes du fil métallique présentent une distribution non uniforme, la capacité pour supporter l'abrasif est augmentée, ce qui participe à l'amélioration de l'efficacité de la coupe et du rendement final de la coupe, car puisque la dureté de la surface présente également une distribution non uniforme, la capacité de résistance à l'usure du sommet élevé ou à proximité du sommet, provoquée par la dureté du niveau le plus élevé, est élevée. Les diamètres externes présentant une distribution non uniforme ne diminueront pas à cause de l'usure abrasive du fil métallique pendant le procédé de coupe, ce qui aide à maintenir une cohérence du rendement final du début de la coupe jusqu'à la queue de la coupe. Un appareil pour la fabrication du fil métallique est également décrit.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201310474219.0 | 2013-10-11 | ||
CN201310474219.0A CN104085051B (zh) | 2013-10-11 | 2013-10-11 | 一种用于多线切割的金属丝及其制造装置 |
Publications (1)
Publication Number | Publication Date |
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WO2015051679A1 true WO2015051679A1 (fr) | 2015-04-16 |
Family
ID=51632866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/CN2014/085268 WO2015051679A1 (fr) | 2013-10-11 | 2014-08-27 | Fil métallique pour la coupe de multifilaments et appareil pour sa fabrication |
Country Status (2)
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CN (1) | CN104085051B (fr) |
WO (1) | WO2015051679A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104085050B (zh) * | 2013-09-18 | 2015-12-02 | 凡登(常州)新型金属材料技术有限公司 | 用于游离磨料切割的金属丝及其制作装置和方法 |
CN107457926A (zh) * | 2017-09-03 | 2017-12-12 | 盛利维尔(中国)新材料技术股份有限公司 | 一种螺旋结构金刚线及其生产工艺 |
CN108588675A (zh) * | 2018-04-24 | 2018-09-28 | 苏州宏久航空防热材料科技有限公司 | 一种金刚石切割线及其制备方法 |
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JP2004276207A (ja) * | 2003-03-18 | 2004-10-07 | Kanai Hiroaki | マルチワイヤソー用ソーワイヤ |
JP2009148879A (ja) * | 2007-11-27 | 2009-07-09 | Nokodai Tlo Kk | ソーワイヤ、ソーワイヤの製造方法及び製造装置 |
CN102205563A (zh) * | 2011-05-25 | 2011-10-05 | 镇江耐丝新型材料有限公司 | 一种螺旋式波形切割金属丝及其制作方法和设备 |
CN102310489A (zh) * | 2011-08-09 | 2012-01-11 | 镇江耐丝新型材料有限公司 | 一种复合结构的切割丝、其制作方法和制作设备 |
CN102380915A (zh) * | 2011-11-21 | 2012-03-21 | 镇江耐丝新型材料有限公司 | 一种扭转形态的切割用金属丝及其制作装置和制作方法 |
CN203542876U (zh) * | 2013-10-11 | 2014-04-16 | 凡登(常州)新型金属材料技术有限公司 | 一种用于多线切割的金属丝及其制造装置 |
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JP5365602B2 (ja) * | 2010-10-08 | 2013-12-11 | 三星ダイヤモンド工業株式会社 | スクライビングホイール及びその製造方法 |
CN102652966A (zh) * | 2012-04-24 | 2012-09-05 | 苏闽(张家港)新型金属材料科技有限公司 | 带微小波纹切割钢丝的制备工艺 |
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2013
- 2013-10-11 CN CN201310474219.0A patent/CN104085051B/zh active Active
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2014
- 2014-08-27 WO PCT/CN2014/085268 patent/WO2015051679A1/fr active Application Filing
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