WO2015050238A1 - Liquid crystal display device - Google Patents

Liquid crystal display device Download PDF

Info

Publication number
WO2015050238A1
WO2015050238A1 PCT/JP2014/076484 JP2014076484W WO2015050238A1 WO 2015050238 A1 WO2015050238 A1 WO 2015050238A1 JP 2014076484 W JP2014076484 W JP 2014076484W WO 2015050238 A1 WO2015050238 A1 WO 2015050238A1
Authority
WO
WIPO (PCT)
Prior art keywords
support member
liquid crystal
heat sink
light guide
display device
Prior art date
Application number
PCT/JP2014/076484
Other languages
French (fr)
Japanese (ja)
Inventor
山本　美智雄
竹志 神山
啓太 伊藤
隆志 花尾
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Publication of WO2015050238A1 publication Critical patent/WO2015050238A1/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/0088—Positioning aspects of the light guide or other optical sheets in the package
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means

Definitions

  • the present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having an edge type backlight.
  • LCD TVs and monitors that use edge-type backlights tend to place more emphasis on design in high-value-added models.
  • cost reduction design is being promoted in which the luminance is secured by increasing the input power per LED chip and the number of LED chips is reduced. Accordingly, a structure for efficiently radiating the heat generated from the LED backlight is essential.
  • FIG. 1 shows a cross-sectional structure of a liquid crystal display device 510a according to the background art.
  • a backlight substrate 530 on which an LED chip 532 is mounted is disposed on the edge portion of the display panel 520.
  • the display panel 520 is configured by laminating an LCD panel 521, optical sheets 522 and 523, an LGP (light guide plate) 524, and a reflection sheet 525 from above.
  • a heat sink 540 (also referred to as a heat spreader or a heat radiating plate) is attached to the back surface of the backlight substrate 530, and the heat sink 540 extends to a lower portion of the reflection sheet 525.
  • a box-type backlight chassis 516 is attached to the outer side surface and the rear side of the heat sink 540.
  • a television power supply board 517 is attached to a predetermined area of the backlight chassis 516.
  • FIG. 2 shows a cross-sectional structure of another liquid crystal display device 510b according to the background art.
  • the backlight chassis 516 is changed from a box shape to a flat plate shape.
  • the heat sink 540 is disposed outside the backlight chassis 516. The distance from the optical sheets 522 and 523 can be secured, and the heat dissipation effect of the heat sink 540 itself is improved.
  • the liquid crystal display device 510a of FIG. 1 when the heat radiation from the LED chip 532 is increased, the heat conduction is large, and the display quality is deteriorated by causing thermal deformation (wrinkles) or the like in the region X of the optical sheets 522 and 523 adjacent to each other. There is a case. Thus, it is a trade-off between the heat dissipation of LED chip 532 and display quality, and another technique has been demanded. In the configuration of FIG. 2, a sufficient distance between the optical sheets 522 and 523 and the heat sink 540 can be secured. However, since the backlight chassis 516 has a flat plate shape, the strength of the entire casing is reduced, and angle components for reinforcement are required, resulting in problems such as an increase in cost. Was needed.
  • a heat sink that has been conventionally housed in a box-shaped housing (backlight chassis) is exposed to the outside of the housing to secure a distance from the optical sheet and to enhance the heat dissipation effect of the heat sink itself.
  • a response was proposed.
  • the case cannot be made into a box shape by itself because of the structure, and as a result, there is a problem that the strength of the whole case is lowered as compared with the conventional structure. In order to avoid this decrease in strength, reinforcing parts and the like are required, resulting in an increase in cost, and another technique is required.
  • FIG. 3 shows a cross-sectional structure of yet another liquid crystal display device 510c according to the background art.
  • a state in which a predetermined notch of the backlight chassis 516 is formed and there is no support structure by the heat sink 540 is shown.
  • the reflection sheet 525 may be depressed like a reflection sheet 525a indicated by a broken line in the drawing. In that case, there is a problem that light leakage occurs unless any countermeasure is taken.
  • the present invention has been made in view of the above situation, and an object thereof is to provide a technique for solving the above problems.
  • the present invention is attached to a display panel including a light guide member and a reflective sheet disposed on a back surface of the light guide member, an edge type backlight, and a substrate provided with a light source of the edge type backlight.
  • the heat sink has a surface facing the reflective sheet, and a support member made of resin between the facing surface of the heat sink and the reflective sheet.
  • the support member has a trapezoidal cross section, and has a hollow structure in which the bottom side of the trapezoidal side on the heat sink side is open, and the other bottom side abuts the reflective sheet substantially flush.
  • the support member may include an integrally formed claw-shaped fixing means for fixing to the heat sink.
  • the heat sink may have a region in contact with the backlight chassis. Further, the support member may include a reinforcing rib in the region of the hollow structure.
  • the support member may include a protruding structure that contacts the substrate.
  • an edge-type LED backlight display device structure composed of a light guide plate, an LED substrate, a heat sink for LED heat dissipation, and a BL chassis for fixing the heat sink, supports the light guide plate of the resin molding material in the vicinity of the heat source (LED chip). Parts are provided to ensure a spatial distance between the heat source and the optical sheet.
  • FIG. 4 shows a partial cross-sectional structure of the liquid crystal television 10 according to this embodiment.
  • the liquid crystal television 10 includes a display panel 20, a front cabinet 12, a rear cabinet 14, a P chassis 19 for holding the display panel 20, and an LED substrate 30 constituting an edge type LED backlight.
  • the display panel 20 has a general configuration, and includes an LCD panel 21, optical sheets 22 and 23, a light guide plate 24, and a reflection sheet 25 in order from the outside (upper side in the drawing).
  • a predetermined number of LED chips 32 are linearly arranged on the LED substrate 30 constituting the edge-type LED backlight (see FIG. 6).
  • the LED chip 32 is disposed so as to face the side end portion 24 a (edge portion) of the light guide plate 24.
  • the light emitted from the LED chip 32 enters the inside from the side end 24 a of the light guide plate 24, and the light traveling downward in the figure is reflected by the reflection sheet 25.
  • a heat sink 40 is attached to the back surface of the LED substrate 30 (the surface on which the LED chip 32 is not disposed).
  • the heat sink 40 has an L-shaped cross section as shown in the figure, and is arranged horizontally and displayed in the figure, with a board arrangement surface 42 arranged vertically in the figure and attached to the back surface of the LED board 30. It is comprised from the panel 20 (reflective sheet 25) and the supporting member arrangement
  • positioning surface 42 is set to the substantially same magnitude
  • the light guide plate support member 50 is disposed at a predetermined position in the space between the support member arrangement surface 44 and the reflection sheet 25, specifically, at a position below the outer edge of the display panel 20.
  • the light guide plate support member 50 will be described later with reference to FIG.
  • the substantially box-shaped backlight chassis 16 is attached to the lower side of the support member arrangement surface 44.
  • the support member arrangement surface 44 is attached to a surface corresponding to the box-shaped bottom surface.
  • a part of the P chassis 19 is arranged outside (on the right side in the figure) the board arrangement surface 42 attached to the back surface of the LED board 30, and the box-shaped side face of the backlight chassis 16 is further outside. Is provided. That is, from the back surface of the LED substrate 30, the substrate arrangement surface 42, the partial structure of the P chassis 19 and the side surface portion of the backlight chassis 16 are arranged so as to overlap each other.
  • FIG. 5 is a perspective view of the light guide plate support member 50.
  • FIG. 6 is a partial perspective view showing the light guide plate support member 50 attached to the backlight chassis 16.
  • 6A shows an end portion of the light guide plate support member 50
  • FIG. 6B is a cross-sectional view taken along line AA ′ of FIG. 6A
  • FIG. 6C is FIG. 6A.
  • FIG. FIG. 7 is a cross-sectional view showing the light guide plate support member 50 attached to the backlight chassis 16.
  • FIG. 7A is a cross-sectional view corresponding to FIG. 6B
  • FIG. 7B is a cross-sectional view corresponding to FIG. 6C.
  • the light guide plate support member 50 is a resin molded product having a substantially rectangular parallelepiped outer shape as shown in FIG. 5, for example, and has a certain strength.
  • the light guide plate support member 50 includes a support member base portion 52 that is substantially flush with the reflective sheet 25, and a locking claw 54 and a locking portion 58 that are fixing means to the heat sink 40 (FIG. 7 ( b)).
  • a locking portion 58 is formed on the LED substrate 30 side, and a locking claw 54 is formed on the opposite side.
  • the length of the support member base portion 52 is a length corresponding to the dimension of the display panel 20, specifically, substantially the same length as the width of the reflection sheet 25. Further, the support member base portion 52 is not a perfect rectangular parallelepiped, has a trapezoidal cross section, and is hollow with a predetermined rib structure inside. With such a structure, the strength of the light guide plate support member 50 is ensured and the amount of heat transfer from the heat sink 40 to the reflection sheet 25 is reduced. More specifically, the support strength with respect to the light guide plate 24 can be improved by making the cross section of the support member base portion 52 into a trapezoidal shape having a “C” shape as illustrated. Moreover, the heat insulation effect can be improved by making the light-guide plate support member 50 into a hollow structure. Furthermore, by adopting a reinforcing rib structure, the support strength for the light guide plate 24 can be sufficiently improved even if the support member base portion 52 has a hollow structure.
  • two locking claws 54 are formed in the vicinity of both ends in the longitudinal direction and one in the center.
  • the locking claw 54 is locked to a locking opening 46 formed on the support member arrangement surface 44 of the heat sink 40.
  • the backlight chassis 16 is formed with a predetermined opening 17a for allowing the backlight chassis 16 to be attached in the locked state.
  • an opening 56 is formed on the upper surface of the support member base portion 52, and the latching claw 54 extends therefrom, and the support member base portion. It extends to a position exceeding the lower surface of 52.
  • the extending tip has a claw shape facing outward.
  • the locking portions 58 are formed to extend from the lower surface of the support member base portion 52 by a predetermined number at predetermined positions.
  • the extending tip portion of the locking portion 58 faces outward, and is locked by a locking opening 47 formed on the support member arrangement surface 44.
  • the support member arrangement surface 44 is formed with a predetermined opening 17b that allows the backlight chassis 16 to be attached in the locked state.
  • the operator When attaching the light guide plate support member 50 to the heat sink 40, the operator fits the locking portion 58 into the locking opening 47 and causes the locking claw 54 to lock into the locking opening 46.
  • the light guide plate support member 50 is a resin molded product having sufficient rigidity, the light guide plate 24 can be stably supported. As a result, the optical axis of the light incident part of the LED chip 32 is stabilized, and the optical characteristics are improved. Moreover, since the light guide plate support member 50 is a resin molded product, the workability of attaching to the backlight chassis 16 is good. For example, when rubber or cushioning material is used, it is necessary to apply it with a double-sided tape or the like. However, in the case of the light guide plate support member 50 which is a resin molded part, hooks such as the locking claws 54 and the locking portions 58 are hooked.
  • the light guide plate support structure is formed in the shape of the heat sink 540 of the conventional liquid crystal television 510a or the like shown in FIG. 1 and the heat capacity of the heat sink 540 itself is increased and dissipated, as in this embodiment. Even if the thickness of the heat sink 40 is reduced and the heat capacity is reduced, the heat dissipation effect can be enhanced.
  • both heat dissipation and the fixing structure of the display panel 20 can be achieved well.
  • the backlight chassis 16 is temporarily expanded in a direction away from the display panel 20.
  • a diaphragm shape is provided so that the backlight chassis 16 is brought into contact with and supported by the display panel 20.
  • the front cabinet 12 may be formed of, for example, an aluminum material. Even in such a case, since the resin P chassis 19 is interposed between the heat sink 40 and the front cabinet 12, the front cabinet 12 may be It can prevent that the temperature of the cabinet 12 rises improperly.
  • the light guide plate support structure by the light guide plate support member 50 which is a resin molded member has low thermal conductivity, heat from a heat source (such as the LED chip 32) is not easily transmitted, and it is attached after the LED unit is attached.
  • the light guide plate support member 50 can be disposed in the immediate vicinity of the LED chip 32.
  • the LED substrate 30 can also be mechanically fixed, and dedicated screws and rivets for fixing the LED unit can be reduced. As a result, an effect of preventing light leakage due to deformation / dropping of the reflection sheet 25 entering between the light guide plate 24 and the light guide plate support member 50 is also obtained.
  • FIG. 9 is a rear view of the liquid crystal television 10 with the backlight chassis 16 exposed.
  • 9A shows the entire backlight chassis 16
  • FIG. 9B is an enlarged view showing the region C of FIG. 9A with a conventional structure
  • FIG. 9C shows FIG. It is the enlarged view which showed the area
  • FIG. 9B is substantially the same as the structure described above with reference to FIG.
  • the notch 517c of the backlight chassis 516 does not have the light guide plate support structure of the heat sink 540 due to the relationship of the LED power connector 36.
  • the light guide plate support member 50 closes the notch 17 c of the backlight chassis 16, so that light leakage due to the drop of the reflection sheet 25 does not occur.
  • FIG. 10 is a cross-sectional view showing the light guide plate support member 50 attached to the backlight chassis 16 according to this embodiment, which is a modification of the structure shown in FIG. 7 of the first embodiment.
  • 10A is a cross-sectional view of a modification corresponding to FIG. 6B
  • FIG. 10B is a cross-sectional view of a modification corresponding to FIG. 6C.
  • the light guide plate support member 50 has a substrate fixing protrusion forming portion 80.
  • the substrate fixing protrusion forming portion 80 extends from the side surface of the light guide plate support member 50 toward the LED substrate 30.
  • the tip of the substrate fixing protrusion forming portion 80 abuts on the LED substrate 30.
  • a buffer member may be disposed at a portion that contacts the LED substrate 30.
  • the present invention has been described based on the embodiments. This embodiment is an exemplification, and it is understood by those skilled in the art that various modifications can be made to combinations of the respective components and the like, and such modifications are within the scope of the present invention.
  • the LED chip 32 is exemplified as the light source of the backlight
  • the present invention can also be applied to a backlight using another type of light source (for example, a laser).
  • the light guide plate support member 50 may be disposed between the member and the heat sink 40.
  • the present invention is not limited to the liquid crystal television 10 having an edge type LED backlight.
  • a backlight of the liquid crystal television 10 for example, there is a structure in which one LED substrate 30 is arranged in the vertical direction or the horizontal direction on the back side of the display panel 20.
  • the light guide plate support member 50 is not limited to a resin molded member, and may be any material having a low thermal conductivity.
  • it may be wood or a composite material member. In the case of a composite material member, it is sufficient that at least a region in contact with the display panel 20 (the reflective sheet 40) has a low thermal conductivity.

Abstract

Proposed is a technique for minimizing increase of the cost and case strength of a liquid crystal display device having an edge backlight, while maintaining desired heat dissipation characteristics of the backlight and desired display quality. A liquid crystal television (10) is provided with: a display panel (20); a front cabinet (12); a rear cabinet (14); a P chassis (19) for holding the display panel (20); an LED substrate (30) that constitutes an edge LED backlight; a heat sink (40); a backlight chassis (16); and a light guide plate supporting member (50). The heat sink (40) is configured of a substrate arrangement surface (42) that is fitted to the back surface of the LED substrate (30) and a supporting member arrangement surface (44) that is at a predetermined distance from a reflective sheet (25). The light guide plate supporting member (50) is arranged at a predetermined position in the space between the supporting member arrangement surface (44) and the reflective sheet (25).

Description

液晶表示装置Liquid crystal display
　本発明は、液晶表示装置に係り、特にエッジ型バックライトを有する液晶表示装置に関する。 The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device having an edge type backlight.
　一般的に、エッジ型バックライト、特に光源にＬＥＤを用いるエッジ型バックライトを採用する液晶テレビやモニターにおいて、高付加価値機種では、よりデザインを重視する傾向にあり、薄型化、狭額縁化が進んでいる。また一方で、ＬＥＤチップ１個当たりの投入電力を増やすことで輝度を確保し、ＬＥＤチップ数を削減するコストダウン設計も進められている。これに伴い、ＬＥＤバックライトから発せられる熱を効率的に放熱する構造が必須となっている。 In general, LCD TVs and monitors that use edge-type backlights, especially edge-type backlights that use LEDs as the light source, tend to place more emphasis on design in high-value-added models. Progressing. On the other hand, cost reduction design is being promoted in which the luminance is secured by increasing the input power per LED chip and the number of LED chips is reduced. Accordingly, a structure for efficiently radiating the heat generated from the LED backlight is essential.
　図１は、背景技術に係る液晶表示装置５１０ａの断面構造を示している。ここでは、バックライトが配置される領域に着目して示している。表示パネル５２０のエッジ部分にＬＥＤチップ５３２が搭載されたバックライト基板５３０が配置されている。ここで、表示パネル５２０は上からＬＣＤパネル５２１、光学シート５２２、５２３、ＬＧＰ（導光板）５２４、反射シート５２５を積層して構成されている。そして、バックライト基板５３０の背面にはヒートシンク５４０（ヒートスプレッダー又は放熱板ともいう）が取り付けられており、ヒートシンク５４０は反射シート５２５の下側部分に延びている。そして、ヒートシンク５４０の外側側面と背面側に箱型のバックライトシャーシ５１６が取り付けられている。バックライトシャーシ５１６の所定の領域にテレビ用電源基板５１７が取り付けられている。 FIG. 1 shows a cross-sectional structure of a liquid crystal display device 510a according to the background art. Here, the area where the backlight is arranged is shown and focused. A backlight substrate 530 on which an LED chip 532 is mounted is disposed on the edge portion of the display panel 520. Here, the display panel 520 is configured by laminating an LCD panel 521, optical sheets 522 and 523, an LGP (light guide plate) 524, and a reflection sheet 525 from above. A heat sink 540 (also referred to as a heat spreader or a heat radiating plate) is attached to the back surface of the backlight substrate 530, and the heat sink 540 extends to a lower portion of the reflection sheet 525. A box-type backlight chassis 516 is attached to the outer side surface and the rear side of the heat sink 540. A television power supply board 517 is attached to a predetermined area of the backlight chassis 516.
　図２は、背景技術に係る別の液晶表示装置５１０ｂの断面構造を示している。この例では、バックライトシャーシ５１６が箱型形状から平板形状に変更されている。ヒートシンク５４０と光学シート５２２，５２３との距離を確保するために、ヒートシンク５４０はバックライトシャーシ５１６より外側に配置されている。光学シート５２２，５２３との距離は確保でき、かつ、ヒートシンク５４０自体の放熱効果が向上する。 FIG. 2 shows a cross-sectional structure of another liquid crystal display device 510b according to the background art. In this example, the backlight chassis 516 is changed from a box shape to a flat plate shape. In order to secure the distance between the heat sink 540 and the optical sheets 522 and 523, the heat sink 540 is disposed outside the backlight chassis 516. The distance from the optical sheets 522 and 523 can be secured, and the heat dissipation effect of the heat sink 540 itself is improved.
　このような技術として各種の技術が提案されている。例えば、構造的な強度を保持しつつ放熱性能を向上させることができ、かつコストを低減することができる照明装置及びそれを備えた画像表示装置を提供する技術がある（例えば、特許文献１参照）。具体的には、Ｔ字型の角柱フレーム（押出し成形、ネジ穴後加工）のコストが高い課題に対して、平板を曲げ加工（板金加工）して形成されたフレームを用いて、当該フレームを放熱部材および熱伝導性部材と接触させることによって、構造的な強度を保持しつつ放熱性能を向上させることができ、かつコストを低減することができる表示装置を実現している。また、薄型で、光源の発熱を充分に放熱可能な構造を提供することにより、薄型かつ大画面の液晶表示装置の実現を図った技術がある（例えば、特許文献２参照）。 Various technologies have been proposed as such technologies. For example, there is a technique for providing an illuminating device that can improve heat dissipation performance while maintaining structural strength, and that can reduce costs, and an image display device including the illuminating device (see, for example, Patent Document 1). ). Specifically, for the problem of high cost of a T-shaped prismatic frame (extrusion molding, post-screw hole processing), the frame is formed by bending a flat plate (sheet metal processing). By bringing the heat dissipation member and the heat conductive member into contact with each other, a display device capable of improving the heat dissipation performance while maintaining the structural strength and reducing the cost is realized. In addition, there is a technique for realizing a thin and large-screen liquid crystal display device by providing a thin structure that can sufficiently dissipate heat generated by a light source (see, for example, Patent Document 2).
特開２０１２－１４９４７号公報JP 2012-14947 A 特開２０１０－９７９２４号公報JP 2010-97924 A
　ところで、図１の液晶表示装置５１０ａでは、ＬＥＤチップ５３２からの放熱を高めると、熱伝導が大きく、近接する光学シート５２２、５２３の領域Ｘ等において熱変形（シワ）等を引き起こし表示品位が劣化する場合がある。このように、ＬＥＤチップ５３２の放熱と表示品位のトレードオフとなっており、別の技術が求められていた。図２の構成では、光学シート５２２、５２３とヒートシンク５４０との距離を十分に確保できる。しかし、バックライトシャーシ５１６が平板型になっているため、筐体全体の強度が低下してしまい、補強用アングル部品等が必要になり、コストの増加等の課題が生じてしまい、別の技術が必要とされていた。 By the way, in the liquid crystal display device 510a of FIG. 1, when the heat radiation from the LED chip 532 is increased, the heat conduction is large, and the display quality is deteriorated by causing thermal deformation (wrinkles) or the like in the region X of the optical sheets 522 and 523 adjacent to each other. There is a case. Thus, it is a trade-off between the heat dissipation of LED chip 532 and display quality, and another technique has been demanded. In the configuration of FIG. 2, a sufficient distance between the optical sheets 522 and 523 and the heat sink 540 can be secured. However, since the backlight chassis 516 has a flat plate shape, the strength of the entire casing is reduced, and angle components for reinforcement are required, resulting in problems such as an increase in cost. Was needed.
　これを回避する為にはヒートシンクを光学シートから離し十分な距離を確保することが理想である。しかし、現状では薄型・狭額縁化の制約の中で構造上、十分な距離を確保することが困難になっており対策技術が求められていた。 In order to avoid this, it is ideal to secure a sufficient distance by separating the heat sink from the optical sheet. However, at present, it is difficult to secure a sufficient distance due to the structure under the constraints of thinning and narrowing the frame, and a countermeasure technology is required.
　この対策の一つとして、従来、箱型の筺体（バックライトシャーシ）内に収まっていたヒートシンクを筺体外に露出させることで光学シートからの距離を確保し、尚且つヒートシンク自体の放熱効果を高める対応が提案されていた。しかし、この場合、構造上、筺体を単体で箱型にすることができなくなり、結果的に従来構造に比べ筺体全体の強度が低下するという課題があった。この強度低下を回避する為、補強部品等が必要になり、結果的にコスト上昇に繋がってしまい、別の技術が必要とされていた。 As one of the countermeasures, a heat sink that has been conventionally housed in a box-shaped housing (backlight chassis) is exposed to the outside of the housing to secure a distance from the optical sheet and to enhance the heat dissipation effect of the heat sink itself. A response was proposed. However, in this case, the case cannot be made into a box shape by itself because of the structure, and as a result, there is a problem that the strength of the whole case is lowered as compared with the conventional structure. In order to avoid this decrease in strength, reinforcing parts and the like are required, resulting in an increase in cost, and another technique is required.
　特許文献１に開示の技術では、熱変形（シワ）については考慮されておらず別の技術が必要であった。特許文献２に記載の技術では、導光板支持部材について柔軟性、弾性を持つ部材を採用しているが、その結果、入光部の光軸が不安定となるおそれがあり、安定し光学特性を得るため追加構造が必要であり、コスト等の観点から別の技術が必要とされていた。 In the technique disclosed in Patent Document 1, thermal deformation (wrinkle) is not considered and another technique is required. In the technique described in Patent Document 2, a member having flexibility and elasticity is adopted as the light guide plate support member. As a result, the optical axis of the light incident portion may become unstable, and stable optical characteristics are obtained. Therefore, an additional structure is required, and another technique is required from the viewpoint of cost and the like.
　図３は、背景技術に係るさらに別の液晶表示装置５１０ｃの断面構造を示している。ここでは、バックライトシャーシ５１６の所定の切り欠きが形成されヒートシンク５４０による支持構造が無い状態を示している。この場合、反射シート５２５は、図示の破線で示す反射シート５２５ａのように落ち込みが発生してしまうことがある。その場合、何ら対策を施さないと光漏れが発生してしまうという課題があった。 FIG. 3 shows a cross-sectional structure of yet another liquid crystal display device 510c according to the background art. Here, a state in which a predetermined notch of the backlight chassis 516 is formed and there is no support structure by the heat sink 540 is shown. In this case, the reflection sheet 525 may be depressed like a reflection sheet 525a indicated by a broken line in the drawing. In that case, there is a problem that light leakage occurs unless any countermeasure is taken.
　本発明は以上のような状況に鑑みなされたものであって、上記課題を解決する技術を提供することを目的とする。 The present invention has been made in view of the above situation, and an object thereof is to provide a technique for solving the above problems.
　本発明は、導光部材と前記導光部材の背面側の面に配置された反射シートとを備える表示パネルと、エッジ型バックライトと、前記エッジ型バックライトの光源が設けられた基板に取り付けられるヒートシンクとを備える液晶表示装置であって、前記ヒートシンクは、前記反射シートと対向する面を有し、前記ヒートシンクの前記対向する面と前記反射シートとの間に樹脂製の支持部材を有し、前記支持部材は、断面が台形であって、前記台形の前記ヒートシンク側の底辺側が開口の中空構造となっており、他方の底辺側が前記反射シートに略面一で当接する。
　前記支持部材は、前記ヒートシンクに固定するための一体成形されたツメ形状の固定手段を備えてもよい。
　また、前記ヒートシンクは、バックライトシャーシに接する領域を有してもよい。
　また、前記支持部材は、前記中空構造の領域に、補強用リブを備えてもよい。
　また、前記支持部材は、前記基板と当接する突起構造を備えてもよい。 The present invention is attached to a display panel including a light guide member and a reflective sheet disposed on a back surface of the light guide member, an edge type backlight, and a substrate provided with a light source of the edge type backlight. The heat sink has a surface facing the reflective sheet, and a support member made of resin between the facing surface of the heat sink and the reflective sheet. The support member has a trapezoidal cross section, and has a hollow structure in which the bottom side of the trapezoidal side on the heat sink side is open, and the other bottom side abuts the reflective sheet substantially flush.
The support member may include an integrally formed claw-shaped fixing means for fixing to the heat sink.
The heat sink may have a region in contact with the backlight chassis.
Further, the support member may include a reinforcing rib in the region of the hollow structure.
The support member may include a protruding structure that contacts the substrate.
　本発明によれば、エッジ型のバックライトを有する液晶表示装置において、バックライトの放熱特性、表示品位を所望に維持しつつ及び筐体強度及びコスト上昇を最小限に抑える技術を提案することができる。 According to the present invention, in a liquid crystal display device having an edge-type backlight, it is possible to propose a technique for minimizing an increase in housing strength and cost while maintaining desired heat dissipation characteristics and display quality of the backlight. it can.
背景技術に係る、液晶表示装置の一部断面構造を示す図である。It is a figure which shows the partial cross section structure of the liquid crystal display device based on background art. 背景技術に係る、液晶表示装置の一部断面構造を示す図である。It is a figure which shows the partial cross section structure of the liquid crystal display device based on background art. 背景技術に係る、液晶表示装置の一部断面構造を示す図である。It is a figure which shows the partial cross section structure of the liquid crystal display device based on background art. 第１の実施形態に係る、液晶テレビの一部断面構造を示す図である。It is a figure which shows the partial cross section structure of the liquid crystal television based on 1st Embodiment. 第１の実施形態に係る、導光板支持部材の斜視図である。It is a perspective view of the light-guide plate support member based on 1st Embodiment. 第１の実施形態に係る、バックライトシャーシへ取り付けた状態の導光板支持部材を示す一部斜視図である。It is a partial perspective view which shows the light-guide plate support member of the state attached to the backlight chassis based on 1st Embodiment. 第１の実施形態に係る、バックライトシャーシへ取り付けた状態の導光板支持部材を示す断面図である。It is sectional drawing which shows the light-guide plate support member of the state attached to the backlight chassis based on 1st Embodiment. 第１の実施形態に係る、液晶表示装置の一部断面構造を示す図である。It is a figure which shows the partial cross section structure of the liquid crystal display device based on 1st Embodiment. 第１の実施形態に係る、液晶テレビのバックライトシャーシを露出させた状態の背面図である。It is a rear view of the state which exposed the backlight chassis of the liquid crystal television based on 1st Embodiment. 第２の実施形態に係る、バックライトシャーシへ取り付けた状態の導光板支持部材を示す断面図である。It is sectional drawing which shows the light-guide plate support member of the state attached to the backlight chassis based on 2nd Embodiment.
　次に、本発明を実施するための形態（以下、単に「実施形態」という）を、図面を参照して具体的に説明する。 Next, modes for carrying out the present invention (hereinafter simply referred to as “embodiments”) will be specifically described with reference to the drawings.
　＜第１の実施形態＞
　本実施形態の概要は次の通りである。すなわち、導光板、ＬＥＤ基板、ＬＥＤ放熱用のヒートシンク、ヒートシンクを固定するＢＬシャーシから構成される、エッジ型ＬＥＤバックライト表示装置構造にて熱源（ＬＥＤチップ）の近傍に樹脂成型材の導光板支持部品を設け熱源と光学シートの空間距離を確保する。 <First Embodiment>
The outline of the present embodiment is as follows. In other words, an edge-type LED backlight display device structure composed of a light guide plate, an LED substrate, a heat sink for LED heat dissipation, and a BL chassis for fixing the heat sink, supports the light guide plate of the resin molding material in the vicinity of the heat source (LED chip). Parts are provided to ensure a spatial distance between the heat source and the optical sheet.
　図４は本実施形態に係る液晶テレビ１０の一部断面構造を示している。ここではエッジ型ＬＥＤバックライトが配置される領域の断面構造を示している。図示のように、液晶テレビ１０は、表示パネル２０と、フロントキャビネット１２と、リアキャビネット１４と、表示パネル２０を保持するためのＰシャーシ１９と、エッジ型ＬＥＤバックライトを構成するＬＥＤ基板３０と、ヒートシンク４０と、箱型のバックライトシャーシ１６と、導光板支持部材５０とを備える。 FIG. 4 shows a partial cross-sectional structure of the liquid crystal television 10 according to this embodiment. Here, a cross-sectional structure of a region where the edge type LED backlight is arranged is shown. As shown in the figure, the liquid crystal television 10 includes a display panel 20, a front cabinet 12, a rear cabinet 14, a P chassis 19 for holding the display panel 20, and an LED substrate 30 constituting an edge type LED backlight. A heat sink 40, a box-type backlight chassis 16, and a light guide plate support member 50.
　表示パネル２０は、一般的な構成となっており、外側（図では上側）から順に、ＬＣＤパネル２１、光学シート２２、２３、導光板２４及び反射シート２５とを備えている。 The display panel 20 has a general configuration, and includes an LCD panel 21, optical sheets 22 and 23, a light guide plate 24, and a reflection sheet 25 in order from the outside (upper side in the drawing).
　エッジ型ＬＥＤバックライトを構成するＬＥＤ基板３０には、ＬＥＤチップ３２が所定数直線状に配置されている（図６参照）。ここでは、ＬＥＤチップ３２は導光板２４の側端部２４ａ（エッジ部分）に対向するように配置されている。ＬＥＤチップ３２から出射した光は、導光板２４の側端部２４ａから内部に入射し、図下側に向かう光は反射シート２５で反射する。 A predetermined number of LED chips 32 are linearly arranged on the LED substrate 30 constituting the edge-type LED backlight (see FIG. 6). Here, the LED chip 32 is disposed so as to face the side end portion 24 a (edge portion) of the light guide plate 24. The light emitted from the LED chip 32 enters the inside from the side end 24 a of the light guide plate 24, and the light traveling downward in the figure is reflected by the reflection sheet 25.
　ＬＥＤ基板３０の背面（ＬＥＤチップ３２が配置されない側の面）にはヒートシンク４０が取り付けられている。具体的には、ヒートシンク４０は、図示のように断面Ｌ字形状を有しており、図示で垂直に配置されＬＥＤ基板３０の背面に取り付けられる基板配置面４２と、図示で水平に配置され表示パネル２０（反射シート２５）と所定間隔離間する支持部材配置面４４とから構成されている。ここで、基板配置面４２は、例えば、ＬＥＤ基板３０の基板面と略同一の大きさに設定されており、支持部材配置面４４は放熱に十分な面積に設定されている。 A heat sink 40 is attached to the back surface of the LED substrate 30 (the surface on which the LED chip 32 is not disposed). Specifically, the heat sink 40 has an L-shaped cross section as shown in the figure, and is arranged horizontally and displayed in the figure, with a board arrangement surface 42 arranged vertically in the figure and attached to the back surface of the LED board 30. It is comprised from the panel 20 (reflective sheet 25) and the supporting member arrangement | positioning surface 44 spaced apart by predetermined spacing. Here, the board | substrate arrangement | positioning surface 42 is set to the substantially same magnitude | size as the board | substrate surface of the LED board 30, for example, and the supporting member arrangement | positioning surface 44 is set to an area sufficient for heat dissipation.
　支持部材配置面４４と反射シート２５の間の空間の所定の位置、具体的には表示パネル２０の外縁下側の位置に、導光板支持部材５０が配置される。導光板支持部材５０については図５で後述する。 The light guide plate support member 50 is disposed at a predetermined position in the space between the support member arrangement surface 44 and the reflection sheet 25, specifically, at a position below the outer edge of the display panel 20. The light guide plate support member 50 will be described later with reference to FIG.
　支持部材配置面４４の下側には略箱形のバックライトシャーシ１６が取り付けられている。ここでは、箱形の底面に相当する面に支持部材配置面４４が取り付けられている。 The substantially box-shaped backlight chassis 16 is attached to the lower side of the support member arrangement surface 44. Here, the support member arrangement surface 44 is attached to a surface corresponding to the box-shaped bottom surface.
　また、ＬＥＤ基板３０の背面に取り付けられた基板配置面４２の外側（図では右側）には、Ｐシャーシ１９の一部構造が配置され、さらにその外側にはバックライトシャーシ１６の箱形の側面が設けられている。つまり、ＬＥＤ基板３０の背面から、基板配置面４２、Ｐシャーシ１９の一部構造及びバックライトシャーシ１６の側面部分が重なって配置されている。 In addition, a part of the P chassis 19 is arranged outside (on the right side in the figure) the board arrangement surface 42 attached to the back surface of the LED board 30, and the box-shaped side face of the backlight chassis 16 is further outside. Is provided. That is, from the back surface of the LED substrate 30, the substrate arrangement surface 42, the partial structure of the P chassis 19 and the side surface portion of the backlight chassis 16 are arranged so as to overlap each other.
　図５は導光板支持部材５０の斜視図である。また、図６はバックライトシャーシ１６へ取り付けた状態の導光板支持部材５０を示す一部斜視図である。図６（ａ）は導光板支持部材５０の端部部分を示しており、図６（ｂ）は図６（ａ）のＡ－Ａ’断面図、図６（ｃ）は図６（ａ）のＢ－Ｂ’断面図である。また、図７は、バックライトシャーシ１６へ取り付けた状態の導光板支持部材５０を示す断面図である。図７（ａ）は、図６（ｂ）に対応する断面図であり、図７（ｂ）は図６（ｃ）に対応する断面図である。 FIG. 5 is a perspective view of the light guide plate support member 50. FIG. 6 is a partial perspective view showing the light guide plate support member 50 attached to the backlight chassis 16. 6A shows an end portion of the light guide plate support member 50, FIG. 6B is a cross-sectional view taken along line AA ′ of FIG. 6A, and FIG. 6C is FIG. 6A. FIG. FIG. 7 is a cross-sectional view showing the light guide plate support member 50 attached to the backlight chassis 16. FIG. 7A is a cross-sectional view corresponding to FIG. 6B, and FIG. 7B is a cross-sectional view corresponding to FIG. 6C.
　導光板支持部材５０は、例えば図５に示すように、外形が略直方体の樹脂成形品であって、一定の強度を有する。具体的には、導光板支持部材５０は、反射シート２５と接する側が略面一の支持部材ベース部５２と、ヒートシンク４０への固定手段である係止爪５４及び係止部５８（図７（ｂ）参照）を備える。係止部５８がＬＥＤ基板３０側に形成され、対向する側に係止爪５４が形成されている。 The light guide plate support member 50 is a resin molded product having a substantially rectangular parallelepiped outer shape as shown in FIG. 5, for example, and has a certain strength. Specifically, the light guide plate support member 50 includes a support member base portion 52 that is substantially flush with the reflective sheet 25, and a locking claw 54 and a locking portion 58 that are fixing means to the heat sink 40 (FIG. 7 ( b)). A locking portion 58 is formed on the LED substrate 30 side, and a locking claw 54 is formed on the opposite side.
　支持部材ベース部５２の長さは、表示パネル２０の寸法に対応した長さ、具体的には、反射シート２５の幅と略同一の長さである。また、支持部材ベース部５２は、完全な直方体ではなく、断面が台形形状となっており、内部が所定のリブ構造を有する中空になっている。このような構造とすることで、導光板支持部材５０の強度確保とヒートシンク４０から反射シート２５への伝熱量の低減を図っている。より具体的には、支持部材ベース部５２の断面を図示のような「ハ字状」の台形形状とすることで、導光板２４に対する支持強度を向上させることができる。また、導光板支持部材５０を中空構造とすることで、断熱効果を向上させることができる。さらに、補強用のリブ構造を採用することで、支持部材ベース部５２が中空構造であっても導光板２４に対する支持強度を十分に向上させることができる。 The length of the support member base portion 52 is a length corresponding to the dimension of the display panel 20, specifically, substantially the same length as the width of the reflection sheet 25. Further, the support member base portion 52 is not a perfect rectangular parallelepiped, has a trapezoidal cross section, and is hollow with a predetermined rib structure inside. With such a structure, the strength of the light guide plate support member 50 is ensured and the amount of heat transfer from the heat sink 40 to the reflection sheet 25 is reduced. More specifically, the support strength with respect to the light guide plate 24 can be improved by making the cross section of the support member base portion 52 into a trapezoidal shape having a “C” shape as illustrated. Moreover, the heat insulation effect can be improved by making the light-guide plate support member 50 into a hollow structure. Furthermore, by adopting a reinforcing rib structure, the support strength for the light guide plate 24 can be sufficiently improved even if the support member base portion 52 has a hollow structure.
　係止爪５４は、図５に示すように、長手方向の両端部近傍に２つと、中央の１つ形成されている。係止爪５４は、ヒートシンク４０の支持部材配置面４４に形成された係止用開口４６に係止される。なお、バックライトシャーシ１６には、その係止した状態でバックライトシャーシ１６を取り付け可能とするための所定の開口１７ａが形成されている。なお、ここでは、係止爪５４が所定の撓み特性を有する構造とするために、支持部材ベース部５２の上面に開口５６が形成され、そこから係止爪５４が延出し、支持部材ベース部５２の下面を超える位置まで延出して形成されている。延出先端が外側向きのツメ形状となっている。 As shown in FIG. 5, two locking claws 54 are formed in the vicinity of both ends in the longitudinal direction and one in the center. The locking claw 54 is locked to a locking opening 46 formed on the support member arrangement surface 44 of the heat sink 40. The backlight chassis 16 is formed with a predetermined opening 17a for allowing the backlight chassis 16 to be attached in the locked state. Here, in order to make the latching claw 54 have a predetermined bending characteristic, an opening 56 is formed on the upper surface of the support member base portion 52, and the latching claw 54 extends therefrom, and the support member base portion. It extends to a position exceeding the lower surface of 52. The extending tip has a claw shape facing outward.
　係止部５８は、所定の位置に所定数だけ、支持部材ベース部５２の下面から延出して形成されている。係止部５８の延出先端部分は外向きになっており、支持部材配置面４４に形成された係止用開口４７に係止される。なお、支持部材配置面４４には、その係止した状態でバックライトシャーシ１６を取り付け可能とするための所定の開口１７ｂが形成されている。 The locking portions 58 are formed to extend from the lower surface of the support member base portion 52 by a predetermined number at predetermined positions. The extending tip portion of the locking portion 58 faces outward, and is locked by a locking opening 47 formed on the support member arrangement surface 44. The support member arrangement surface 44 is formed with a predetermined opening 17b that allows the backlight chassis 16 to be attached in the locked state.
　導光板支持部材５０をヒートシンク４０に取り付ける場合、作業者は、係止部５８を係止用開口４７に嵌め込み、つついて、係止爪５４を係止用開口４６に係止させる。 When attaching the light guide plate support member 50 to the heat sink 40, the operator fits the locking portion 58 into the locking opening 47 and causes the locking claw 54 to lock into the locking opening 46.
　以上、本実施形態によると、導光板支持部材５０は、十分な剛性を有する樹脂成形品であるので、導光板２４を安定して支えることができる。その結果、ＬＥＤチップ３２の光の入光部の光軸が安定し、光学特性が向上する。また、導光板支持部材５０が樹脂成形品であるので、バックライトシャーシ１６への取り付け作業性が良好である。例えば、ゴムやクッション材を使用した場合には両面テープ等で貼付け必要であるが、樹脂成形部品である導光板支持部材５０の場合には、係止爪５４や係止部５８等のツメ引っかけ構造で対応でき、また、部品形状が安定しているので取り扱が容易である。また、取り付け用の両面テープ等不要で部品コストを抑えることができる。なお、導光板支持部材５０の材料としてガラス入り材料を用いた場合、熱変形、熱膨張に対して良好な特性を確保できる。 As described above, according to the present embodiment, since the light guide plate support member 50 is a resin molded product having sufficient rigidity, the light guide plate 24 can be stably supported. As a result, the optical axis of the light incident part of the LED chip 32 is stabilized, and the optical characteristics are improved. Moreover, since the light guide plate support member 50 is a resin molded product, the workability of attaching to the backlight chassis 16 is good. For example, when rubber or cushioning material is used, it is necessary to apply it with a double-sided tape or the like. However, in the case of the light guide plate support member 50 which is a resin molded part, hooks such as the locking claws 54 and the locking portions 58 are hooked. It can be handled by the structure and is easy to handle because the part shape is stable. In addition, the cost of parts can be reduced because a double-sided adhesive tape is not required. In addition, when a glass-containing material is used as the material of the light guide plate support member 50, good characteristics can be secured against thermal deformation and thermal expansion.
　また、図１で示した従来の液晶テレビ５１０ａ等のヒートシンク５４０の形状にて導光板支持構造を形成し、ヒートシンク５４０自体の熱容量を高め放熱させていた場合と比較すると、本実施形態のようにヒートシンク４０の厚みを減らし、熱容量を減らしても、放熱効果を高めることができる。 Compared with the case where the light guide plate support structure is formed in the shape of the heat sink 540 of the conventional liquid crystal television 510a or the like shown in FIG. 1 and the heat capacity of the heat sink 540 itself is increased and dissipated, as in this embodiment. Even if the thickness of the heat sink 40 is reduced and the heat capacity is reduced, the heat dissipation effect can be enhanced.
　さらに、ＬＥＤチップ３２の放熱と光学シート２２、２３への熱ストレス軽減を両立させ、部材コストも下げるとこができる。例えば、図８に示す液晶テレビ１０の断面構造のように、バックライトシャーシ１６に所定の絞り構造を採用することで放熱と表示パネル２０の固定構造を良好に両立できる。例えば、導光板支持部材５０が配置される領域では、ＬＥＤ基板３０が近いことから熱の影響を最大限に考慮する必要がある。そこで、その領域の周囲では、一旦表示パネル２０から離間する方向にバックライトシャーシ１６を膨らませる構造とする。一方、熱源であるＬＥＤチップ３２（ＬＥＤ基板３０）から十分に離れた領域Ａでは、バックライトシャーシ１６を表示パネル２０に近づけ当接・支持するように絞り形状を設ける。 Furthermore, it is possible to achieve both heat dissipation of the LED chip 32 and reduction of thermal stress on the optical sheets 22 and 23 and reduce the member cost. For example, as in the cross-sectional structure of the liquid crystal television 10 shown in FIG. 8, by adopting a predetermined diaphragm structure for the backlight chassis 16, both heat dissipation and the fixing structure of the display panel 20 can be achieved well. For example, in the region where the light guide plate support member 50 is disposed, it is necessary to consider the influence of heat to the maximum because the LED substrate 30 is close. Therefore, around the area, the backlight chassis 16 is temporarily expanded in a direction away from the display panel 20. On the other hand, in a region A sufficiently separated from the LED chip 32 (LED substrate 30) that is a heat source, a diaphragm shape is provided so that the backlight chassis 16 is brought into contact with and supported by the display panel 20.
　また、バックライトシャーシ１６を従来のような鉄材でなくアルミニウム材とすることでヒートシンク４０からバックライトシャーシ１６への熱拡散の向上及び熱容量アップを図ることができる。また、フロントキャビネット１２が例えばアルミニウム材で形成されることがあるが、そのような場合であっても、樹脂製のＰシャーシ１９がヒートシンク４０とフロントキャビネット１２の間に介装されるので、フロントキャビネット１２の温度が不適切に上昇してしまうことを防止できる。 Further, by using the backlight chassis 16 as an aluminum material instead of a conventional iron material, the heat diffusion from the heat sink 40 to the backlight chassis 16 can be improved and the heat capacity can be increased. The front cabinet 12 may be formed of, for example, an aluminum material. Even in such a case, since the resin P chassis 19 is interposed between the heat sink 40 and the front cabinet 12, the front cabinet 12 may be It can prevent that the temperature of the cabinet 12 rises improperly.
　また、樹脂成形部材である導光板支持部材５０による導光板支持構造は、熱伝導率が低く熱源（ＬＥＤチップ３２等）からの熱が伝わりにくく、かつ、ＬＥＤユニット取り付け後に取り付ける事になる為、ＬＥＤチップ３２の直近に導光板支持部材５０を配置可能になる。その際、ＬＥＤ基板３０を抑える為の突起を設けることで、ＬＥＤ基板３０の機械固定を兼ねることができ、ＬＥＤユニット固定用の専用ビス、リベットを削減できる。また、その結果、導光板２４と導光板支持部材５０の間に入る反射シート２５の変形・落ち込みによる光漏れの防止効果も得られる。 Moreover, since the light guide plate support structure by the light guide plate support member 50 which is a resin molded member has low thermal conductivity, heat from a heat source (such as the LED chip 32) is not easily transmitted, and it is attached after the LED unit is attached. The light guide plate support member 50 can be disposed in the immediate vicinity of the LED chip 32. At this time, by providing a protrusion for restraining the LED substrate 30, the LED substrate 30 can also be mechanically fixed, and dedicated screws and rivets for fixing the LED unit can be reduced. As a result, an effect of preventing light leakage due to deformation / dropping of the reflection sheet 25 entering between the light guide plate 24 and the light guide plate support member 50 is also obtained.
　ここで光漏れの防止効果について図９を参照して詳細に説明する。図９は、液晶テレビ１０のバックライトシャーシ１６を露出させた状態の背面図である。図９（ａ）はバックライトシャーシ１６全体を示しており、図９（ｂ）は図９（ａ）の領域Ｃを従来構造で示した拡大図であり、図９（ｃ）は図９（ａ）の領域Ｃを本実施形態の構造で示した拡大図である。なお、図９（ｂ）は、図３で上述した構造と実質同じである。 Here, the effect of preventing light leakage will be described in detail with reference to FIG. FIG. 9 is a rear view of the liquid crystal television 10 with the backlight chassis 16 exposed. 9A shows the entire backlight chassis 16, FIG. 9B is an enlarged view showing the region C of FIG. 9A with a conventional structure, and FIG. 9C shows FIG. It is the enlarged view which showed the area | region C of a) with the structure of this embodiment. FIG. 9B is substantially the same as the structure described above with reference to FIG.
　図９（ｂ）に示すように、従来構造では、ＬＥＤ電源コネクタ３６の関係から、バックライトシャーシ５１６の切欠部５１７ｃにはヒートシンク５４０の導光板支持構造が無い。その結果、反射シート５２５の落ち込みによる光漏れが発生することがあった。光漏れが発生すると、光路が乱れて以上発光の原因となり、表示品位の低下に繋がっていた。しかし、図９（ｃ）に示すように、本実施形態では、導光板支持部材５０が、バックライトシャーシ１６の切欠部１７ｃを塞ぐため、反射シート２５の落ち込みによる光漏れは発生しない。 As shown in FIG. 9B, in the conventional structure, the notch 517c of the backlight chassis 516 does not have the light guide plate support structure of the heat sink 540 due to the relationship of the LED power connector 36. As a result, light leakage due to the drop of the reflection sheet 525 may occur. When light leakage occurs, the optical path is disturbed, causing light emission, leading to deterioration in display quality. However, as shown in FIG. 9C, in this embodiment, the light guide plate support member 50 closes the notch 17 c of the backlight chassis 16, so that light leakage due to the drop of the reflection sheet 25 does not occur.
　＜第２の実施形態＞
　図１０は、本実施形態に係る、バックライトシャーシ１６へ取り付けた状態の導光板支持部材５０を示す断面図であって、第１の実施形態の図７に示す構造の変形例である。すなわち、図１０（ａ）は、図６（ｂ）に対応する変形例の断面図であり、図１０（ｂ）は図６（ｃ）に対応する変形例の断面図である。 <Second Embodiment>
FIG. 10 is a cross-sectional view showing the light guide plate support member 50 attached to the backlight chassis 16 according to this embodiment, which is a modification of the structure shown in FIG. 7 of the first embodiment. 10A is a cross-sectional view of a modification corresponding to FIG. 6B, and FIG. 10B is a cross-sectional view of a modification corresponding to FIG. 6C.
　樹脂成形部材である導光板支持部材５０の近傍のＬＥＤ基板３０が、液晶テレビ１０に想定外の振動や落下によって、安定的な固定が出来なくなる懸念される。特に、液晶テレビ１０が大型サイズになるほど、その懸念が大きくなる。そこで本実施形態では、図示のように、導光板支持部材５０が基板固定用突起形成部８０を備える構造として。基板固定用突起形成部８０は、導光板支持部材５０の側面からＬＥＤ基板３０方向に延びる。基板固定用突起形成部８０の先端部は、ＬＥＤ基板３０に当接する。なお、ＬＥＤ基板３０に当接する部分に緩衝部材が配置されてもよい。 There is a concern that the LED substrate 30 in the vicinity of the light guide plate support member 50, which is a resin molded member, cannot be stably fixed to the liquid crystal television 10 due to unexpected vibration or dropping. In particular, the greater the size of the liquid crystal television 10, the greater the concern. Therefore, in the present embodiment, as shown in the drawing, the light guide plate support member 50 has a substrate fixing protrusion forming portion 80. The substrate fixing protrusion forming portion 80 extends from the side surface of the light guide plate support member 50 toward the LED substrate 30. The tip of the substrate fixing protrusion forming portion 80 abuts on the LED substrate 30. In addition, a buffer member may be disposed at a portion that contacts the LED substrate 30.
　このような基板固定用突起形成部８０を設ける構成とすることで、ＬＥＤ基板３０の機械的な固定をより効果的に確保できる。すなわち、振動や落下等によるＬＥＤ基板３０のズレや脱落を回避できる。その結果、ＬＥＤ基板３０の機械的固定に固定用専用ビスや、スペーサ、リベット等の別部品が不要となる。 By providing such a substrate fixing protrusion forming portion 80, mechanical fixing of the LED substrate 30 can be more effectively ensured. That is, it is possible to avoid the displacement and dropping of the LED substrate 30 due to vibration, dropping, or the like. As a result, separate parts such as fixing screws, spacers, and rivets are not necessary for mechanically fixing the LED substrate 30.
　以上、本発明を実施形態をもとに説明した。この実施形態は例示であり、それらの各構成要素の組み合わせ等にいろいろな変形例が可能なこと、またそうした変形例も本発明の範囲にあることは当業者に理解されるところである。例えば、バックライトの光源としてＬＥＤチップ３２を例示したが、他のタイプの光源（例えばレーザー等）を用いたバックライトについても適用可能である。 The present invention has been described based on the embodiments. This embodiment is an exemplification, and it is understood by those skilled in the art that various modifications can be made to combinations of the respective components and the like, and such modifications are within the scope of the present invention. For example, although the LED chip 32 is exemplified as the light source of the backlight, the present invention can also be applied to a backlight using another type of light source (for example, a laser).
　また、表示パネル２の最も背面に位置する構造として反射シート２５以外の部材が用いられる場合は、その部材とヒートシンク４０との間に導光板支持部材５０が配置されてもよい。また、エッジ型ＬＥＤバックライトを有する液晶テレビ１０に限る趣旨でもない。
液晶テレビ１０のバックライトとして、例えば表示パネル２０の背面側に縦方向又は横方向にＬＥＤ基板３０を１本配置する構造がある。また、導光板支持部材５０として樹脂成形部材に限らず、熱伝導率が低い材料であればよく、例えば、木材であってもよいし、複合材料部材であってもよい。複合材料部材である場合、少なくとも表示パネル２０（反射シート４０）と接する領域が熱伝導率が低い材料であればよい。 In addition, when a member other than the reflection sheet 25 is used as the structure located on the backmost side of the display panel 2, the light guide plate support member 50 may be disposed between the member and the heat sink 40. Further, the present invention is not limited to the liquid crystal television 10 having an edge type LED backlight.
As a backlight of the liquid crystal television 10, for example, there is a structure in which one LED substrate 30 is arranged in the vertical direction or the horizontal direction on the back side of the display panel 20. Further, the light guide plate support member 50 is not limited to a resin molded member, and may be any material having a low thermal conductivity. For example, it may be wood or a composite material member. In the case of a composite material member, it is sufficient that at least a region in contact with the display panel 20 (the reflective sheet 40) has a low thermal conductivity.
１０　液晶テレビ
１２　フロントキャビネット
１４　リアキャビネット
１６　バックライトシャーシ
１７ａ、１７ｂ　開口
１７ｃ　切欠部
１９　Ｐシャーシ
２０　表示パネル
２１　ＬＣＤパネル
２２、２３　光学シート
２４　導光板
２５　反射シート
３０　ＬＥＤ基板
３２　ＬＥＤチップ
３６　ＬＥＤ電源コネクタ
４０　ヒートシンク
４２　基板配置面
４４　支持部材配置面
４６、４７　係止用開口
５０　導光板支持部材（樹脂製の支持部材）
５２　支持部材ベース部
５４　係止爪（固定手段）
５６　開口
５８　係止部（固定手段）
８０　基板固定用突起形成部 DESCRIPTION OF SYMBOLS 10 LCD television 12 Front cabinet 14 Rear cabinet 16 Backlight chassis 17a, 17b Opening 17c Notch part 19 P chassis 20 Display panel 21 LCD panel 22, 23 Optical sheet 24 Light guide plate 25 Reflective sheet 30 LED board 32 LED chip 36 LED power supply connector 40 Heat Sink 42 Substrate Arrangement Surface 44 Support Member Arrangement Surface 46, 47 Locking Opening 50 Light Guide Plate Support Member (Resin Support Member)
52 support member base 54 locking claw (fixing means)
56 Opening 58 Locking part (fixing means)
80 Protrusion forming part for fixing substrate

Claims (5)

  1. 　導光部材と前記導光部材の背面側の面に配置された反射シートとを備える表示パネルと、エッジ型バックライトと、前記エッジ型バックライトの光源が設けられた基板に取り付けられるヒートシンクとを備える液晶表示装置であって、
    　前記ヒートシンクは、前記反射シートと対向する面を有し、
    　前記ヒートシンクの前記対向する面と前記反射シートとの間に樹脂製の支持部材を有し、
    　前記支持部材は、断面が台形であって、前記台形の前記ヒートシンク側の底辺側が開口の中空構造となっており、他方の底辺側が前記反射シートに略面一で当接する
    ことを特徴とする液晶表示装置。     A display panel comprising a light guide member and a reflective sheet disposed on the back surface of the light guide member, an edge type backlight, and a heat sink attached to a substrate provided with a light source of the edge type backlight A liquid crystal display device comprising:
    The heat sink has a surface facing the reflective sheet,
    Having a resin support member between the opposing surface of the heat sink and the reflective sheet;
    The support member has a trapezoidal cross section, and has a hollow structure in which the bottom side of the trapezoid on the heat sink side is open, and the other bottom side abuts the reflective sheet substantially flush with the liquid crystal. Display device.
  2. 　前記支持部材は、前記ヒートシンクに固定するための一体成形されたツメ形状の固定手段を備えることを特徴とする請求項１に記載の液晶表示装置。 2. The liquid crystal display device according to claim 1, wherein the support member includes an integrally formed claw-shaped fixing means for fixing to the heat sink.
  3. 　前記ヒートシンクは、バックライトシャーシに接する領域を有することを特徴とする請求項１または２に記載の液晶表示装置。 3. The liquid crystal display device according to claim 1, wherein the heat sink has a region in contact with the backlight chassis.
  4. 　前記支持部材は、前記中空構造の領域に、補強用リブを備えることを特徴とする請求項１から３のいずれかに記載の液晶表示装置。 4. The liquid crystal display device according to claim 1, wherein the support member includes a reinforcing rib in a region of the hollow structure.
  5. 　前記支持部材は、前記基板と当接する突起構造を備えることを特徴とする請求項１から４のいずれかに記載の液晶表示装置。 The liquid crystal display device according to any one of claims 1 to 4, wherein the support member includes a protrusion structure that contacts the substrate.
PCT/JP2014/076484 2013-10-04 2014-10-03 Liquid crystal display device WO2015050238A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2013-208723 2013-10-04
JP2013208723 2013-10-04
JP2014196444A JP2015092235A (en) 2013-10-04 2014-09-26 Liquid crystal display device
JP2014-196444 2014-09-26

Publications (1)

Publication Number Publication Date
WO2015050238A1 true WO2015050238A1 (en) 2015-04-09

Family

ID=52778821

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/076484 WO2015050238A1 (en) 2013-10-04 2014-10-03 Liquid crystal display device

Country Status (2)

Country Link
JP (1) JP2015092235A (en)
WO (1) WO2015050238A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105116591A (en) * 2015-09-29 2015-12-02 创维液晶器件(深圳)有限公司 Sidelight type liquid crystal display module structure
WO2018166035A1 (en) * 2017-03-17 2018-09-20 武汉华星光电技术有限公司 Backlight module and liquid display device
CN110278673A (en) * 2019-06-27 2019-09-24 联想(北京)有限公司 Electronic equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10754085B2 (en) 2017-01-05 2020-08-25 Sharp Kabushiki Kaisha Lighting device and display device
JP7083255B2 (en) 2018-02-07 2022-06-10 シャープ株式会社 Light emitting device, display device and board

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010072262A (en) * 2008-09-18 2010-04-02 Hitachi Ltd Liquid crystal display
JP2010097924A (en) * 2008-09-18 2010-04-30 Hitachi Ltd Liquid crystal display unit
JP2011249330A (en) * 2010-05-25 2011-12-08 Lg Innotek Co Ltd Backlight unit and display device having the same
JP2012146463A (en) * 2011-01-11 2012-08-02 Panasonic Corp Lighting fixture
JP2012208238A (en) * 2011-03-29 2012-10-25 Funai Electric Co Ltd Liquid crystal display module and liquid crystal display device
JP2013196931A (en) * 2012-03-21 2013-09-30 Sharp Corp Lighting device, display device, and television receiving apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012026162A1 (en) * 2010-08-24 2012-03-01 シャープ株式会社 Lighting apparatus, display apparatus, and television receiver apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010072262A (en) * 2008-09-18 2010-04-02 Hitachi Ltd Liquid crystal display
JP2010097924A (en) * 2008-09-18 2010-04-30 Hitachi Ltd Liquid crystal display unit
JP2011249330A (en) * 2010-05-25 2011-12-08 Lg Innotek Co Ltd Backlight unit and display device having the same
JP2012146463A (en) * 2011-01-11 2012-08-02 Panasonic Corp Lighting fixture
JP2012208238A (en) * 2011-03-29 2012-10-25 Funai Electric Co Ltd Liquid crystal display module and liquid crystal display device
JP2013196931A (en) * 2012-03-21 2013-09-30 Sharp Corp Lighting device, display device, and television receiving apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105116591A (en) * 2015-09-29 2015-12-02 创维液晶器件(深圳)有限公司 Sidelight type liquid crystal display module structure
WO2018166035A1 (en) * 2017-03-17 2018-09-20 武汉华星光电技术有限公司 Backlight module and liquid display device
CN110278673A (en) * 2019-06-27 2019-09-24 联想(北京)有限公司 Electronic equipment

Also Published As

Publication number Publication date
JP2015092235A (en) 2015-05-14

Similar Documents

Publication Publication Date Title
WO2015002017A1 (en) Illumination device, display device, and television receiving device
JP5564345B2 (en) Display device
WO2015050238A1 (en) Liquid crystal display device
WO2014024771A1 (en) Lighting apparatus, display apparatus, and television receiver
JP6140993B2 (en) Display device
WO2014034633A1 (en) Lighting apparatus, display apparatus, and television receiver
KR20100035624A (en) Liquid crystal display and television apparatus having the same
WO2012014601A1 (en) Illumination apparatus, display apparatus, and television receiver apparatus
JP2012138300A (en) Television and electronic equipment
WO2014021209A1 (en) Illumination device, display device, and tv reception device
WO2014073425A1 (en) Illumination device, display device, and television receiver device
JP6220458B2 (en) Light source device and liquid crystal display device
JP2013222029A (en) Display device and television receiving device
WO2013125456A1 (en) Display device and television reception device
US10114169B2 (en) Display device
JP2014077871A (en) Liquid crystal display device
WO2013121944A1 (en) Display device and television receiving device
JP6463883B2 (en) Display device
WO2014109301A1 (en) Illumination device, display device and tv receiver
JP2008129474A (en) Display device
JP6174799B2 (en) Display device and television receiver
JP2013196931A (en) Lighting device, display device, and television receiving apparatus
US20130100699A1 (en) Display device with heat dissipating structures and electronic device using the same
JP2008204842A (en) Backlight device
JP2014077927A (en) Television and electronic equipment

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14850806

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14850806

Country of ref document: EP

Kind code of ref document: A1