WO2014205900A1 - Semiconductor refrigeration electronic icepack - Google Patents
Semiconductor refrigeration electronic icepack Download PDFInfo
- Publication number
- WO2014205900A1 WO2014205900A1 PCT/CN2013/081464 CN2013081464W WO2014205900A1 WO 2014205900 A1 WO2014205900 A1 WO 2014205900A1 CN 2013081464 W CN2013081464 W CN 2013081464W WO 2014205900 A1 WO2014205900 A1 WO 2014205900A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- semiconductor
- source box
- refrigeration
- icepack
- Prior art date
Links
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F7/02—Compresses or poultices for effecting heating or cooling
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F7/007—Heating or cooling appliances for medical or therapeutic treatment of the human body characterised by electric heating
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F7/0085—Devices for generating hot or cold treatment fluids
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F2007/0054—Heating or cooling appliances for medical or therapeutic treatment of the human body with a closed fluid circuit, e.g. hot water
- A61F2007/0056—Heating or cooling appliances for medical or therapeutic treatment of the human body with a closed fluid circuit, e.g. hot water for cooling
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F7/007—Heating or cooling appliances for medical or therapeutic treatment of the human body characterised by electric heating
- A61F2007/0075—Heating or cooling appliances for medical or therapeutic treatment of the human body characterised by electric heating using a Peltier element, e.g. near the spot to be heated or cooled
- A61F2007/0076—Heating or cooling appliances for medical or therapeutic treatment of the human body characterised by electric heating using a Peltier element, e.g. near the spot to be heated or cooled remote from the spot to be heated or cooled
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61F—FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
- A61F7/00—Heating or cooling appliances for medical or therapeutic treatment of the human body
- A61F7/02—Compresses or poultices for effecting heating or cooling
- A61F2007/0225—Compresses or poultices for effecting heating or cooling connected to the body or a part thereof
- A61F2007/0231—Compresses or poultices for effecting heating or cooling connected to the body or a part thereof hook and loop-type fastener
Definitions
- the utility model relates to an auxiliary cooling device, in particular to an electronic ice bag.
- the purpose of the utility model is to provide a semiconductor refrigeration electronic ice bag capable of constant temperature and temperature reduction.
- a semiconductor refrigeration electronic ice bag comprising an ice bag body, a heat transfer liquid in the ice bag body, and an external moving cold source box, the moving cold source
- the inside of the box is divided into a heat dissipating area and a closed refrigerating area by a semiconductor refrigerating sheet and a connecting plate connected to both ends of the semiconductor refrigerating sheet, and a heat exchange water cooling head is arranged on the semiconductor refrigerating sheet of the refrigerating area, and the heat conducting liquid in the main body of the ice bag passes through the liquid inlet tube It is connected with the heat exchange water cooling head, and is connected with the heat exchange water cooling head through the liquid outlet pipe and the water pump, and is provided with a heat sink on the semiconductor refrigeration sheet in the heat dissipation zone, and a ventilation hole is arranged on the side wall of the moving cold source box corresponding to the heat dissipation zone.
- the semiconductor refrigeration chip and the water pump are provided with a power
- a fan is further disposed in the heat dissipation area, and a power connection line is disposed on the fan.
- the heat transfer liquid in the ice bag body is water.
- a matching telescopic Velcro strap is respectively arranged at both ends of the main body of the ice bag.
- the utility model has the following advantages: the portable cold source box is convenient to carry, and the semiconductor refrigeration sheet and the pump are energized to make the cold source box start working, so that the heat conductive liquid in the ice bag main body and the semiconductor refrigeration sheet in the cold source box are carried out. Heat exchange, thereby reducing the temperature of the electronic ice pack.
- Figure 1 is a schematic structural view of an embodiment of the present invention
- FIG. 2 is a schematic view showing the internal structure of a moving cold source box according to an embodiment of the present invention.
- a semiconductor refrigerating electronic ice bag includes an ice bag main body 1 and a matching telescopic Velcro strap 2 is respectively disposed at two ends of the ice bag main body 1 to be conveniently attached to a person's head or the like.
- a heat transfer liquid is disposed in the ice bag body 1, the heat transfer liquid is preferably liquid water, and an external moving cold source box 4 is further included.
- the moving cold source box 4 is internally connected by the semiconductor refrigeration sheet 7 and connected to the semiconductor refrigeration sheet 7.
- the connecting plate of the end is separated into a heat dissipating area and a closed refrigerating area, and a heat exchange water cooling head 5 is arranged on the semiconductor refrigerating sheet 7 of the refrigerating area, and the heat transfer liquid in the ice bag main body 1 is connected to the heat exchange water cooling head 5 through the liquid inlet pipe 3,
- the liquid discharge tube 31 and the water pump 9 are connected to the heat exchange water cooling head 5, and the heat sink 8 is disposed on the semiconductor refrigeration sheet 7 in the heat dissipation area, and the side wall of the moving cold source box 4 corresponding to the heat dissipation area is provided with a vent hole.
- the semiconductor refrigerating sheet 7 and the pump 9 are provided with a power connection line, and a fan 6 is further disposed in the heat dissipation area, and the fan 6 is provided with a power connection line, which can be better after the fan 6 is energized. Cooling effect, the power required to move the cold source box 4 Can be a vehicle power supply, power supply or a mobile, when using such a small limited, easier to use.
Abstract
A semiconductor refrigeration electronic icepack comprising an icepack main body (1). A thermally-conductive liquid is provided within the icepack main body (1). Also comprised is an external mobile refrigeration source box (4). The interior of the mobile refrigeration source box (4) is partitioned into a heat-dissipation area and an enclosed refrigeration area by a semiconductor refrigeration plate (7) and a connecting plate connected at two ends of the semiconductor refrigeration plate (7). A heat exchange water-cooling head (5) is arranged on the semiconductor refrigeration plate (7) at the refrigeration area. The thermally-conductive liquid in the icepack main body (1) is connected to the heat exchange water-cooling head (5) via a liquid inlet tube (3) and is connected to a water pump (9) and the heat exchange water-cooling head (5) via a liquid outlet tube (31). A heat sink (8) is arranged on the semiconductor refrigeration plate (7) at the heat-dissipation area. A ventilation hole (10) is provided on a sidewall of the mobile refrigeration source box (4) corresponding to the heat-dissipation area. The semiconductor refrigeration plate (7) and the water pump (9) are provided with a power supply connection cable. The mobile refrigeration source box (4) is convenient to carry. The semiconductor refrigeration plate (7) and the water pump (9) are powered up to allow the refrigeration source box to start working, thereby allowing the thermally-conductive liquid in the icepack main body (1) to exchange heat with the refrigeration plate (7) in the refrigeration source box, thus reducing the temperature of the electronic icepack.
Description
一种半导体制冷式电子冰袋 Semiconductor refrigeration electronic ice pack
技术领域 Technical field
本实用新型涉及一种辅助降温装置,尤其涉及一种电子冰袋。 The utility model relates to an auxiliary cooling device, in particular to an electronic ice bag.
背景技术 Background technique
目前生活中在应对发热发烧、跌打损伤、消暑及高温作业等情况使所用的降温方法大多为物理降温方法,包括:酒精擦拭降温,湿毛巾覆盖、冰块冷敷、退热贴等通过水变成气体吸收热量来达到降温的目的,而这些传统降温方式有以下弊端:①
随着湿毛巾的干湿程度,散热效果一直在变化,被动散热、散热效果不明显;②不能精确控制冷敷位置温度,容易造成伤处的二次伤害;③需要人为观察散热情况,及时更换散热毛巾等,不能做到实时维持温度。
At present, in the case of dealing with fever, fever, bruises, heat and high temperature work, most of the cooling methods used are physical cooling methods, including: alcohol wiping, wet towel covering, ice cold compress, antipyretic paste, etc. The gas absorbs heat to achieve the purpose of cooling, and these conventional cooling methods have the following drawbacks:
With the wet and dry degree of the wet towel, the heat dissipation effect has been changing, the passive heat dissipation and heat dissipation effect are not obvious; 2 can not accurately control the cold application position temperature, which is easy to cause secondary damage to the injury; 3 need to observe the heat dissipation situation and replace the heat dissipation in time. Towels, etc., cannot maintain the temperature in real time.
实用新型内容 Utility model content
本实用新型的目的在于提供一种能恒温且降温效果好的半导体制冷式电子冰袋。 The purpose of the utility model is to provide a semiconductor refrigeration electronic ice bag capable of constant temperature and temperature reduction.
为实现该目的,本实用新型采用了如下的技术方案:一种半导体制冷式电子冰袋,包括冰袋主体,在冰袋主体中设有导热液体,还包括外部的移动冷源箱,所述移动冷源箱内部由半导体制冷片和连接在半导体制冷片两端的连接板隔成散热区和封闭的制冷区,在制冷区的半导体制冷片上设有热交换水冷头,冰袋主体内的导热液体通过进液管与热交换水冷头连接,通过出液管和抽水泵与热交换水冷头连接,在散热区的半导体制冷片上设有散热片,与散热区相对应的移动冷源箱侧壁上设有通风孔,所述半导体制冷片和抽水泵设有电源连接线。
To achieve the object, the present invention adopts the following technical solution: a semiconductor refrigeration electronic ice bag, comprising an ice bag body, a heat transfer liquid in the ice bag body, and an external moving cold source box, the moving cold source The inside of the box is divided into a heat dissipating area and a closed refrigerating area by a semiconductor refrigerating sheet and a connecting plate connected to both ends of the semiconductor refrigerating sheet, and a heat exchange water cooling head is arranged on the semiconductor refrigerating sheet of the refrigerating area, and the heat conducting liquid in the main body of the ice bag passes through the liquid inlet tube It is connected with the heat exchange water cooling head, and is connected with the heat exchange water cooling head through the liquid outlet pipe and the water pump, and is provided with a heat sink on the semiconductor refrigeration sheet in the heat dissipation zone, and a ventilation hole is arranged on the side wall of the moving cold source box corresponding to the heat dissipation zone. The semiconductor refrigeration chip and the water pump are provided with a power connection line.
进一步地,所述散热区内还设有风扇,风扇上设有电源连接线。 Further, a fan is further disposed in the heat dissipation area, and a power connection line is disposed on the fan.
进一步地,所述冰袋主体内的导热液体为水。 Further, the heat transfer liquid in the ice bag body is water.
进一步地,在冰袋主体两端分别设有相配合的伸缩魔术贴绑带。 Further, a matching telescopic Velcro strap is respectively arranged at both ends of the main body of the ice bag.
本实用新型对比现有技术有如下优点:移动冷源箱携带方便,将半导体制冷片和抽水泵通电使得冷源箱开始工作,使冰袋主体内的导热液体与冷源箱中的半导体制冷片进行热交换,从而降低电子冰袋的温度。
Compared with the prior art, the utility model has the following advantages: the portable cold source box is convenient to carry, and the semiconductor refrigeration sheet and the pump are energized to make the cold source box start working, so that the heat conductive liquid in the ice bag main body and the semiconductor refrigeration sheet in the cold source box are carried out. Heat exchange, thereby reducing the temperature of the electronic ice pack.
附图说明 DRAWINGS
图1为本实用新型实施例的结构示意图; Figure 1 is a schematic structural view of an embodiment of the present invention;
图2为本实用新型实施例移动冷源箱的内部结构示意图。 2 is a schematic view showing the internal structure of a moving cold source box according to an embodiment of the present invention.
具体实施方式 detailed description
现参照附图,进一步详细说明本实用新型。 The present invention will now be described in further detail with reference to the accompanying drawings.
如图1、图2所示,一种半导体制冷式电子冰袋,包括冰袋主体1,在冰袋主体1两端分别设有相配合的伸缩魔术贴绑带2,方便绑在人的头上或其他部位,在冰袋主体1中设有导热液体,导热液体优选为液态水,还包括外部的移动冷源箱4,所述移动冷源箱4内部由半导体制冷片7和连接在半导体制冷片7两端的连接板隔成散热区和封闭的制冷区,在制冷区的半导体制冷片7上设有热交换水冷头5,冰袋主体1内的导热液体通过进液管3与热交换水冷头5连接,通过出液管31和抽水泵9与热交换水冷头5连接,在散热区的半导体制冷片7上设有散热片8,与散热区相对应的移动冷源箱4侧壁上设有通风孔10,所述半导体制冷片7和抽水泵9设有电源连接线,所述散热区内还设有风扇6,风扇6上设有电源连接线,将风扇6进行通电后可以起到更好的散热效果,移动冷源箱4所需的电源可以是车载电源,或者是移动电源,这样使用时候的限制小,使用更方便。
As shown in FIG. 1 and FIG. 2, a semiconductor refrigerating electronic ice bag includes an ice bag main body 1 and a matching telescopic Velcro strap 2 is respectively disposed at two ends of the ice bag main body 1 to be conveniently attached to a person's head or the like. a heat transfer liquid is disposed in the ice bag body 1, the heat transfer liquid is preferably liquid water, and an external moving cold source box 4 is further included. The moving cold source box 4 is internally connected by the semiconductor refrigeration sheet 7 and connected to the semiconductor refrigeration sheet 7. The connecting plate of the end is separated into a heat dissipating area and a closed refrigerating area, and a heat exchange water cooling head 5 is arranged on the semiconductor refrigerating sheet 7 of the refrigerating area, and the heat transfer liquid in the ice bag main body 1 is connected to the heat exchange water cooling head 5 through the liquid inlet pipe 3, The liquid discharge tube 31 and the water pump 9 are connected to the heat exchange water cooling head 5, and the heat sink 8 is disposed on the semiconductor refrigeration sheet 7 in the heat dissipation area, and the side wall of the moving cold source box 4 corresponding to the heat dissipation area is provided with a vent hole. 10, the semiconductor refrigerating sheet 7 and the pump 9 are provided with a power connection line, and a fan 6 is further disposed in the heat dissipation area, and the fan 6 is provided with a power connection line, which can be better after the fan 6 is energized. Cooling effect, the power required to move the cold source box 4 Can be a vehicle power supply, power supply or a mobile, when using such a small limited, easier to use.
以上所述的本实用新型实施方式,并不构成对本实用新型保护范围的限定。任何在本实用新型的精神和原则之内所作的修改、等同替换和改进等,均应包含在本实用新型的权利要求保护范围之内。
The embodiments of the present invention described above are not intended to limit the scope of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.
Claims (1)
1.
一种半导体制冷式电子冰袋,包括冰袋主体(1),其特征在于:在冰袋主体(1)中设有导热液体,还包括外部的移动冷源箱(4),所述移动冷源箱(4)内部由半导体制冷片(7)和连接在半导体制冷片(7)两端的连接板隔成散热区和封闭的制冷区,在制冷区的半导体制冷片(7)上设有热交换水冷头(5),冰袋主体(1)内的导热液体通过进液管(3)与热交换水冷头(5)连接,通过出液管(31)和抽水泵(9)与热交换水冷头(5)连接,在散热区的半导体制冷片(7)上设有散热片(8),与散热区相对应的移动冷源箱(4)侧壁上设有通风孔(10),所述半导体制冷片(7)和抽水泵(9)设有电源连接线。1.
A semiconductor refrigeration electronic ice bag comprising an ice bag body (1), characterized in that: a heat transfer liquid is arranged in the ice bag body (1), and an external moving cold source box (4) is further included, the moving cold source box ( 4) The internal semiconductor refrigerating sheet (7) and the connecting plate connected to both ends of the semiconductor refrigerating sheet (7) are separated into a heat dissipating area and a closed refrigerating area, and a heat exchange water-cooling head is arranged on the semiconductor refrigerating sheet (7) in the refrigerating area. (5) The heat transfer liquid in the main body (1) of the ice pack is connected to the heat exchange water cooling head (5) through the liquid inlet pipe (3), and the water exchange pipe (31) and the water pump (9) and the heat exchange water cooling head (5) a semiconductor chip (7) in the heat dissipation zone is provided with a heat sink (8), and a sidewall of the moving cold source box (4) corresponding to the heat dissipation zone is provided with a vent hole (10) for cooling the semiconductor The piece (7) and the pump (9) are provided with a power connection line.
2.
根据权利要求1所述的半导体制冷式电子冰袋,其特征在于:所述散热区内还设有风扇(6),风扇(6)上设有电源连接线。2.
The semiconductor refrigerating electronic ice pack according to claim 1, wherein a fan (6) is further disposed in the heat dissipation zone, and a power connection line is disposed on the fan (6).
3.
根据权利要求1或2所述的半导体制冷式电子冰袋,其特征在于:所述冰袋主体(1)内的导热液体为水。3.
The semiconductor refrigeration electronic ice pack according to claim 1 or 2, wherein the heat transfer liquid in the ice pack body (1) is water.
4.
根据权利要求1或2所述的半导体制冷式电子冰袋,其特征在于:在冰袋主体(1)两端分别设有相配合的伸缩魔术贴绑带(2)。4.
The semiconductor refrigerating electronic ice pack according to claim 1 or 2, wherein a matching telescopic Velcro strap (2) is provided at each of both ends of the ice pack main body (1).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320372824.2 | 2013-06-26 | ||
CN2013203728242U CN203354740U (en) | 2013-06-26 | 2013-06-26 | Semiconductor refrigeration type electronic ice bag |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014205900A1 true WO2014205900A1 (en) | 2014-12-31 |
Family
ID=49802575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2013/081464 WO2014205900A1 (en) | 2013-06-26 | 2013-08-14 | Semiconductor refrigeration electronic icepack |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN203354740U (en) |
WO (1) | WO2014205900A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110090121A (en) * | 2019-05-31 | 2019-08-06 | 张建平 | Thermostatic massage pad |
CN112276980A (en) * | 2020-11-06 | 2021-01-29 | 山东理工大学 | Cam-driven liquid medium micro-operation manipulator |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109674298A (en) * | 2019-02-18 | 2019-04-26 | 京东方科技集团股份有限公司 | A kind of atomising device and Multifunction flower vase |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962761A (en) * | 1987-02-24 | 1990-10-16 | Golden Theodore A | Thermal bandage |
CN201070419Y (en) * | 2007-09-13 | 2008-06-11 | 上海交通大学 | Portable craniocerebral cooling instrument |
CN201227352Y (en) * | 2008-07-04 | 2009-04-29 | 郑宝华 | Semiconductor medical children high-fever physical cooling device |
US7959657B1 (en) * | 2004-07-07 | 2011-06-14 | Harsy Douglas R | Portable thermal therapeutic apparatus and method |
CN102406524A (en) * | 2011-12-13 | 2012-04-11 | 上海理工大学 | Full-automatic medical temperature and voltage adjusting ice blanket |
-
2013
- 2013-06-26 CN CN2013203728242U patent/CN203354740U/en not_active Expired - Lifetime
- 2013-08-14 WO PCT/CN2013/081464 patent/WO2014205900A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4962761A (en) * | 1987-02-24 | 1990-10-16 | Golden Theodore A | Thermal bandage |
US7959657B1 (en) * | 2004-07-07 | 2011-06-14 | Harsy Douglas R | Portable thermal therapeutic apparatus and method |
CN201070419Y (en) * | 2007-09-13 | 2008-06-11 | 上海交通大学 | Portable craniocerebral cooling instrument |
CN201227352Y (en) * | 2008-07-04 | 2009-04-29 | 郑宝华 | Semiconductor medical children high-fever physical cooling device |
CN102406524A (en) * | 2011-12-13 | 2012-04-11 | 上海理工大学 | Full-automatic medical temperature and voltage adjusting ice blanket |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110090121A (en) * | 2019-05-31 | 2019-08-06 | 张建平 | Thermostatic massage pad |
CN112276980A (en) * | 2020-11-06 | 2021-01-29 | 山东理工大学 | Cam-driven liquid medium micro-operation manipulator |
CN112276980B (en) * | 2020-11-06 | 2023-03-24 | 山东理工大学 | Cam-driven liquid medium micro-operation manipulator |
Also Published As
Publication number | Publication date |
---|---|
CN203354740U (en) | 2013-12-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN201070419Y (en) | Portable craniocerebral cooling instrument | |
CN206363240U (en) | A kind of notebook computer water circulation radiator | |
WO2014205901A1 (en) | Single-body semiconductor refrigeration electronic icepack | |
CN204364209U (en) | A kind of wear-type electronic temperature-decreasing device | |
CN202077668U (en) | Automatic temperature-adjustable helmet | |
CN203424309U (en) | Semiconductor refrigeration type health care underpants | |
WO2014205900A1 (en) | Semiconductor refrigeration electronic icepack | |
CN205649576U (en) | Constant temperature cold compress heat sink | |
CN202843901U (en) | Head cooling device | |
CN109326417A (en) | A kind of extrapolation lead type transformer of good cooling effect | |
CN203753646U (en) | Portable low-temperature refrigerating device | |
WO2020038444A1 (en) | Portable air conditioner based on semiconductor refrigeration sheet | |
CN203576732U (en) | Integrated semiconductor solid-state electronic refrigeration ice bag | |
CN203576733U (en) | Semiconductor solid-state multi-layer integrated electronic ice bag | |
CN203885695U (en) | Constant-temperature physical fever reducing device | |
CN203354745U (en) | Integrated semiconductor refrigerating electronic ice cap | |
CN208509511U (en) | A kind of Medical Devices radiator | |
CN206478888U (en) | A kind of Portable semiconductor refrigerating or heating equipment | |
CN203354743U (en) | Semiconductor refrigeration type electronic ice cap | |
WO2017124749A1 (en) | Multi-functional shoe for heating and cooling | |
CN202085797U (en) | Sunstroke-resistant and cooling helmet | |
CN207460713U (en) | A kind of wall-attaching type efficient radiating apparatus | |
CN205492716U (en) | Belt | |
CN204744573U (en) | Portable men's health health care ware | |
CN207395225U (en) | Beauty instrument condensing unit |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 13888253 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 13888253 Country of ref document: EP Kind code of ref document: A1 |