WO2014205898A1

WO2014205898A1 - Pixel definition layer and manufacturing method therefor, display substrate and display device

Info

Publication number: WO2014205898A1
Application number: PCT/CN2013/081445
Authority: WO
Inventors: 侯文军; 刘则
Original assignee: 京东方科技集团股份有限公司
Priority date: 2013-06-28
Filing date: 2013-08-14
Publication date: 2014-12-31
Also published as: CN103367391A; CN103367391B

Abstract

Provided are a pixel definition layer and a manufacturing method therefor, a display substrate and a display device, which relate to the technical field of display and solve the problem of poor display due to the fact that a little printing ink spills over to adjacent pixel regions during existing ink-jet printing. Provided is a pixel definition layer. The pixel definition layer comprises a pattern of a pixel separation wall (15), and an upper surface of the pixel separation wall (15) has a depression.

Description

The present invention relates to the field of display technologies, and in particular, to a pixel defining layer, a method for fabricating the same, a display substrate, and a display device. Inkjet printing technology is one of the main technologies used in modern office printing. In recent years, researchers have begun to apply inkjet printing technology to the preparation of planar functional materials, such as preparing polymer conductive films, preparing color organic light-emitting diodes, and preparing. Thin film semiconductor devices and the like.

An organic light emitting diode (OLED) display substrate, as shown in FIG. 1, the OLED display substrate includes a base substrate 11, an anode electrode layer 12 disposed on the base substrate 11, The light-emitting function layer 13 and the cathode electrode layer 14. The display substrate includes a plurality of pixel areas 31 and non-pixel areas 32, as shown in FIG. In the manufacturing process, the anode electrode layer includes a plurality of pixel patterns corresponding to the pixel regions, and a light-emitting function layer is formed on the anode electrode layer by inkjet printing. However, due to the fluidity of the ink, in order to reduce the ink flow of the inkjet printing to the adjacent pixel pattern regions, a pixel defining layer including a pixel dividing wall is generally disposed in the non-pixel region between the pixel pattern regions, to form a plurality of In the space surrounding the pixel region, the ink-jet printed luminescent functional layer ink is applied to the surrounding space by inkjet printing, that is, ruthenium is applied on the surface of the anode electrode layer.

However, in the actual inkjet printing process, the ink of the inkjet printing may overflow a little, and it will overflow in the adjacent pixel area, resulting in poor display. Embodiments of the present invention provide a pixel defining layer and a manufacturing method thereof, a display substrate, and a display device, wherein the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall is recessed inward at an intermediate portion, and inkjet printing A small amount of ink overflows in the recesses that are recessed inwardly of the pixel dividing wall to prevent display failure due to overflow to adjacent pixel areas.

In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions:

Embodiments of the present invention provide a pixel defining layer, the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall has a recess.

Optionally, the depth of the recess accounts for 20% to 40% of the height of the pixel dividing wall. Embodiments of the present invention provide a method for fabricating a pixel defining layer, including:

Performing a patterned surface treatment on the substrate;

A pixel defining layer is formed on the substrate, the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall has a recess.

Optionally, the boiling point of the solvent in the solution forming the pixel defining layer is below 200 C. Optionally, forming a pixel defining layer on the substrate is formed by inkjet printing.

Optionally, the solvent of the ink-printing solution is dichloromethane, chloroform, tetrahydrofuran, chlorobenzene, toluene, o-dichlorobenzene, o-xylene, n-hexane, cyclohexanide, anisole, Perfluorofuran, N"N-dimethylformamide, N,N-dimethylacetamide or dimethyl sulfoxide.

Optionally, patterning the surface of the substrate including the pixel region and the non-pixel region to make the surface energy of the pixel region different from the surface energy of the non-pixel region;

The pixel dividing wall pattern is formed in a non-pixel area.

Optionally, the contact angle of the droplets in the pixel region and the contact angle in the non-pixel region differ by more than 30°.

Optionally, the patterning surface treatment of the pair of substrates is such that the surface energy of the pixel region on the substrate is different from the surface energy of the non-pixel region:

The substrate is subjected to self-assembly monolayer surface treatment to form a monomolecular layer in the pixel region.

Optionally, the self-assembled monolayer surface treatment is performed on the substrate, and forming a monomolecular layer in the pixel region is specifically:

The substrate is subjected to self-assembly monolayer surface treatment to form a monolayer on the surface of the substrate; and the monolayer of the non-pixel region is removed.

Optionally, the self-assembled monolayer surface treatment is performed on the substrate, and forming a monomolecular layer in the pixel region is specifically: processing the substrate by using a fluorinated silane in an inert gas environment, forming a silicon fluoride on the surface of the substrate Monolayer of germanium;

The non-pixel region on the substrate is irradiated with ultraviolet light by a mask to remove the silicon fluoride germanium monolayer in the non-pixel region.

Optionally, after forming the pixel separation wall in the non-pixel area, the method further includes:

The monolayer of the pixel region is removed.

Optionally, in an inert gas environment, the substrate is processed using silicon germanium fluoride on the substrate. Forming a monomolecular layer of fluorinated silane on the surface; irradiating the non-pixel region on the substrate with ultraviolet light by using a mask to remove the fluorinated silane monolayer in the non-pixel region, and then forming the pixel separation wall in the non-pixel region of the substrate Also included: Removes the fluorinated silane from the pixel area.

Optionally, the silicon fluoride buffer for removing the pixel region is specifically:

At least the pixel area is illuminated by ultraviolet light.

Optionally, the forming the pixel defining layer by using the ink on the substrate is specifically:

Forming a solution of the pixel dividing wall material in a non-pixel area by inkjet printing; after the solution printed on the substrate forms a coffee ring structure, the solution printed in the non-pixel area is cured, and the coffee ring structure is formed It is the depression.

Alternatively, the solution printed on the substrate forms the coffee ring structure in an environment of 2040 Torr. Embodiments of the present invention provide a display substrate including a pixel defining layer provided by an embodiment of the present invention.

The embodiment of the invention provides a display device, which comprises a display substrate provided by an embodiment of the invention.

A pixel defining layer and a manufacturing method thereof, including a pixel defining layer display device, the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall is recessed inward in the middle portion, such that In the process of inkjet printing, even if there is a small amount of overflow in the ink area of the pixel area, it is deposited in the groove of the pixel dividing wall, thereby avoiding overflow to the adjacent pixel unit, resulting in poor display effect. 1 is a schematic structural view of an OLED display substrate;

2 is a schematic top plan view of an OLED display substrate;

3 is a cross-sectional structural view of a display substrate according to an embodiment of the present invention;

4 is a schematic diagram of a method for fabricating a pixel defining layer according to an embodiment of the present invention; FIG. 5 is a schematic view showing a contact angle of a droplet on a substrate and a substrate;

FIG. 6 is a flow chart of a specific process for forming a pixel defining layer according to an embodiment of the present invention; FIG. 7 is a schematic diagram of forming a silicon germanide monolayer on a surface of a substrate according to an embodiment of the present invention. One is to form a fluorinated silane monolayer by using a mask pair Schematic diagram of the substrate subjected to ultraviolet light irradiation treatment;

FIG. 9 is a schematic diagram of forming a pixel separation wall on a non-pixel area on a substrate according to an embodiment of the present invention; FIG.

FIG. 10 is a flowchart of forming a pixel defining layer by inkjet printing according to an embodiment of the present invention;

11 - substrate; 12 - anode electrode layer; 13 - luminescent functional layer; 14 cathode electrode layer; 15-pixel dividing wall; 16 droplets; 21 silicon germanium monolayer; Pixel area, 32-non-pixel area. The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

Embodiments of the present invention provide a pixel defining layer, the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall has a recess. As shown in FIG. 3, the upper surface of the pixel dividing wall 15 is recessed inward at the intermediate portion to form a groove.

It should be noted that in all embodiments of the present invention, it is necessary to clarify the definitions of "layer" and "pattern", and the relationship between them. Wherein, "layer" refers to a film formed by deposition or other process on a substrate using a certain material, which includes a "pattern". For example, in the embodiment of the present invention, the pixel defining layer may be a film formed by inkjet printing, which includes a pixel dividing wall pattern. In the process of inkjet printing, printing is performed in a specified area, but due to the fluidity of the ink of the inkjet printing, the ink of the inkjet printing may overflow to other adjacent areas, so it is necessary to form a pixel around the area where the ink is printed. Separate the walls to prevent ink spills from inkjet printing. As shown in FIG. 1, the OLED display substrate includes: a substrate substrate II, an anode electrode layer 12 disposed on the substrate substrate 11, a light emitting function layer 13, and a cathode electrode layer 14. The display substrate includes a pixel area 31 and a non-pixel area 32, as shown in FIG. In the manufacturing process of the OLED display device, the anode electrode layer includes a plurality of pixel patterns, and the pixel pattern corresponds to the pixel region, and the method of inkjet printing forms a light-emitting function layer on the anode electrode layer, because the ink printed by the ink is certain The fluidity, in order to reduce the flow of the printed ink to the adjacent pixel pattern area, as shown in FIG. 3, between the pixel patterns (pixel areas 31), that is, the non-pixel areas 32 form a pixel definition including the pixel dividing wall 15. Layer, used to form more Each package encloses a space between the air and the space, and the ink-emitting ink function of the ink-jet ink is printed on the layer of ink, and the ink is sprayed through the inkjet ink. The bag surrounds the inner space of the space, that is, sprayed and sprayed on the surface of the surface of the anode and cathode electrode layers. . It should be noted that the illuminating light function layer can be included in the package:: empty hole injection into the layer, empty hole transfer transmission layer , an electro-optic light-emitting layer, and the like, and each of the layers may be formed by using a method of printing with ink. . The substrate board according to the embodiment of the present invention is a base substrate board before forming an image forming pixel division partition wall wall, which may be Therefore, the substrate substrate plate may be formed on the substrate substrate of the substrate substrate to have a plurality of thin film films or a layer structure. . The lining substrate substrate plate may be a glass glazing, a silicon silicon wafer, a sillimanite or the like. . As shown in FIG. 33, a positive anode electrode layer layer 1122 is formed on the substrate substrate board 11!, and the present invention is embodied in the present invention. In the example, the base substrate board described above is taken as an example for detailed description. .

The image pixel separation partition wall provided by the present invention is as shown in FIG. 33, and the upper surface surface thereof is divided in the middle intermediate portion. The recesses are recessed inwardly, and are formed into a recessed groove. . In this way, in the process of printing inkjet ink, the ink ink water sprayed and printed like the pixel area is even if there is a small amount of flow overflowing, It will also deposit in the concave groove groove like the pixel pixel partition wall wall, so as to avoid the flow-free overflow to the adjacent pixel of the adjacent pixel. Yuan,, the effect of creating a display effect is not bad. . Wherein, the ink water of the ink is a solution solution for forming a material material defining a fixed layer of the pixel. .

It should be noted that the description of the above-mentioned surface pixel mask of the partition wall wall having the concave depression "" is not true. The shape of the concave groove groove is formed in a limited manner, that is, the shape of the structure of the concave depression is formed into a plurality of various forms. For example, if it is possible to form a pixel-like partition wall wall which is formed first without a concave concave surface surface, and then passes through other other techniques to make it The upper surface of the surface of the partition wall like the pixel element partition wall faces the inwardly collapsed shape and forms a concave depression. For example, the image may be passed through the texture pattern. The craftsmanship is formed into a concave depression structure on the upper surface of the upper surface of the partition wall like a pixel element, or it may pass through the effect of the coffee ring, and the use of the image The evaporation of the evaporation surface of each surface surface of the partition wall of the pixel pixel is not uneven The uniform shape is formed into a concave depression structure, or directly printed directly (for example, such as 33DD printing technology, etc.) to form a structure having a concave depression structure Separate partition walls like pixatin. .

Optionally, the depth of the concave depression is 2200%% to 4400%% of the height of the pixel-separated partition wall. .

It should be noted that the illustrated pixel pixel separation partition wall may also be used for display display devices for forming other others. Its other structure. . For example, when the color-colored color film layer formed by the liquid crystal display device is formed in a liquid crystal display device, the film may be formed into the color film. Before the layer layer, on the base substrate board, the above-mentioned pixel pixel separation partition wall ((black black matrix matrix)) is formed on the base substrate, and then the pixel in the image is further described. The partition formed by the wall of the partition wall is surrounded by a space formed by red, green, green, and blue, which are different in color and color. Guarantee the pure purity of each color of each color. . For the type of type for the display device, and for the use of the pixel phantom separation wall for the formation of the shape is not the same as the same knot

The present invention provides a display substrate for a display, and includes a pixel display boundary defined by the embodiment of the present invention. Board. It should be noted that the display device may be a display device such as a liquid crystal display, an electronic paper, an OLED (Organic Light-Emitting Diode), a PLED (Polymer Light-Emitting Diode) display, or the like. A display product such as a TV, digital camera, mobile phone, tablet, etc., with any display product or component.

An embodiment of the present invention provides a method for fabricating a display device. As shown in FIG. 4, the method includes: Step S101: Performing a patterned surface treatment on a substrate.

Specifically, the substrate includes a pixel area and a non-pixel area, and the pair of substrates are patterned and surface-treated such that the surface energy of the pixel area on the substrate is different from the surface energy of the non-pixel area.

Step S102: Form a pixel defining layer on the substrate, the pixel defining layer includes a pixel dividing wall pattern, and an upper surface of the pixel dividing wall has a recess. Specifically, the pixel dividing wall pattern is formed in a non-pixel area, and as shown in FIG. 3, the upper surface of the pixel dividing wall 15 has a recess.

It should be noted that the expression “the upper surface of the pixel dividing wall has a depression” is not a limitation on the manner in which the groove is formed, that is, the structure of the recess is formed in various forms, for example, it may be Forming a pixel dividing wall without a concave surface, and then the other surface of the pixel dividing wall is inwardly atrophied to form a recessed structure, for example, a patterning process may be used to form a recessed structure on the upper surface of the pixel dividing wall, or by a coffee ring effect The recessed structure is formed by uneven evaporation of the surface of the pixel dividing wall, or directly printed (such as 3D printing technology) into a pixel dividing wall having a concave structure.

Preferably, forming the pixel defining layer on the substrate is formed by over inkjet printing. In the embodiment of the present invention, a pixel defining layer is formed by inkjet printing as an example for detailed description. However, there are various ways to form a pixel definition on a substrate, for example, it can also be formed by a 3D printing technique.

It should be noted that the surface energy of the substrate is the sum of the dispersion component and the polar component of the substrate surface, and the size and polarity of the surface energy of the substrate can be obtained by measuring the etching angle by the measuring instrument, and different regions on the substrate. The greater the difference in the erosion angle, the greater the difference in surface energy. In an embodiment of the invention, the inkjet printed droplets differ in the etch angle of the substrate pixel region from the etched angle of the ink-printed droplets in the substrate non-pixel region by more than 30°. The contact angle refers to the angle between the tangent of the gas-liquid interface at the intersection of gas, liquid and solid, and the intersection between the liquid and the solid-liquid boundary. As shown in Fig. 5, the droplets 16 printed on the substrate substrate , have a contact angle of θ. If 6 <90. , the solid surface is lyophilic, that is, the liquid is relatively easy to wet the solid, and the smaller the contact angle, the better the wettability; if 6 > 90 °, the solid form The surface is lyophobic, that is, the liquid does not easily wet the solid and easily moves on the surface; θ = 90°, which is the boundary line of wetness or not. It should be noted that the lyophobicity and lyophilicity are relative. When the surface energy on the substrate is different, a lyophile is relatively lyophobic. It should be noted that, in the embodiment of the present invention, the difference of the etching angle is not specifically limited. For example, in air, the contact angle of the droplet in the pixel region of the substrate and the contact angle of the droplet in the non-pixel region of the substrate may be different by 60° or In less than 30°, etc., in the embodiment of the invention, the surface of the substrate is processed such that the surface energy of the pixel region on the substrate is different from the surface energy of the non-pixel region, and the contact angle and droplet of the droplet (ink) in the pixel region of the substrate The contact angles in the non-pixel regions of the substrate differ by more than 30°, including 30° as an example for detailed description. It should be noted that the droplets generally used in the measurement of the contact angle are water. Of course, other solutions may be used. In the embodiment of the present invention, the droplets are preferably inkjet inks, that is, inkjet printed pixels. A solution that defines the material of the layer.

There are various methods for changing the surface energy of a substrate, such as self-assembled monolayer surface treatment, ultraviolet ozone cleaning, self-assembled multi-layer surface treatment, surface-deposited film, and the like. Among them, self-assembled monolayer surface treatment includes wet liquid phase self-assembly monolayer surface treatment and dry gas phase self-assembly monolayer surface treatment. For the method of changing the surface energy of the substrate, reference may be made to the prior art, which is not specifically limited in the embodiment of the present invention. Of course, when processing the substrate, the corresponding method can be adopted according to actual requirements.

It should be noted that, in the process of manufacturing, the manufacturing process temperature of the existing flexible substrate is severe, which severely limits the fabrication of the flexible substrate. The manufacturing method provided by the embodiment of the present invention does not need too high temperature, and thus can be used for Make a flexible substrate. The flexible substrate may be PET (polyethylene terephthalate), PI (polyimide) or the like.

Optionally, the substrate is patterned and surface-treated such that the surface energy of the pixel region on the substrate is different from the surface energy of the non-pixel region:

The substrate is subjected to self-assembly monolayer surface treatment to form a monomolecular layer in the pixel region of the substrate. Specifically, the self-assembled monolayer surface treatment is performed on the substrate, and forming the monomolecular layer in the pixel region of the substrate may be forming a monomolecular layer only in the pixel region of the substrate. For example, the non-pixel area on the substrate may be blocked by another device, and the monomolecular layer may be formed only in the pixel region. Alternatively, optionally, the self-assembled monolayer surface treatment is performed on the substrate, and forming a monomolecular layer in the pixel region of the substrate is specifically: The substrate is subjected to self-assembly monolayer surface treatment to form a monolayer on the surface of the substrate; and the monolayer of the non-pixel region is removed.

And after forming the monomolecular layer in the non-pixel region of the substrate by the above steps, after forming the pixel defining layer including the pixel dividing wall pattern on the substrate by the method of inkjet printing, the method further includes: removing the monomolecular layer of the pixel region. Since the monomolecular layer in the pixel region is disadvantageous for the spreading of the luminescent layer material, it is preferable to remove the monomolecular layer of the pixel region after forming the pixel defining layer including the pixel dividing wall pattern.

Specifically, the embodiment of the present invention is described in detail by using a self-assembled fluorinated silane monolayer and then forming a pixel separation wall by inkjet printing. As shown in FIG. 6, the method includes:

Step S201: The substrate is treated with silicon germanium fluoride in an inert gas atmosphere to form a monolayer of silicon fluoride germanium on the surface of the substrate.

Specifically, as shown in FIG. 7, a fluorinated silane monolayer is formed on the surface of the substrate, wherein the substrate includes a base substrate 11 and an anode electrode layer 12 disposed on the base substrate 11, the anode electrode layer including A plurality of pixel units, the single molecular layer simultaneously covering the surface of the pixel unit. It should be noted that a method for forming a fluorinated silane monolayer on the surface of the substrate may be a method of self-assembling a monolayer in a thousand gas phase. For example, the substrate may be treated with silicon fluoride vapor to form a fluorinated silane on the surface of the substrate. Molecular layer. It is also possible to use a wet-phase liquid phase self-assembled monolayer surface treatment. For example, the substrate can be immersed in a liquid of silicon fluoride, and a silicon fluoride germanium monolayer can be formed on the surface of the substrate.

Step S202: Using a mask to irradiate the non-pixel region on the substrate with ultraviolet light to remove the silicon germanium monolayer in the non-pixel region.

Specifically, as shown in FIG. 8, the mask 22 includes a light transmitting region and an opaque region, so that the opaque region of the mask covers the pixel region on the substrate, and the ultraviolet light is irradiated onto the substrate through the light transmitting region. Unless the pixel region is a silicon germanide monolayer. It should be noted that the ultraviolet light is generally irradiated by an ultraviolet ozone cleaner, and the light energy of the ultraviolet light during the irradiation can decompose the oxygen in the air to form ozone. Moreover, since the ozone also has a certain influence on the silicon germanide monolayer on the substrate, when the substrate is irradiated with ultraviolet light, it is preferable to make the mask close to the substrate, thereby ensuring that only non-pixels are removed by ultraviolet light irradiation. The silicon fluoride strontium monolayer in the region is not affected by the pixel region. Step S203, forming a pixel dividing wall in the non-pixel area of the substrate.

As shown in Fig. 9, a pixel dividing wall 15 is formed in a non-pixel area of the substrate by a method of inkjet printing.

Step S204, removing the silicon fluoride germanium monolayer in the pixel region.

Specifically, at least the pixel region is irradiated with ultraviolet light to remove the fluorinated silane monolayer of the pixel region, as shown in FIG. Specifically, the fluoropolymer monomolecular layer of the pixel region may be removed by irradiating only the pixel region with ultraviolet light using a mask. Of course, if the ultraviolet light irradiation has no other influence on the formed pixel partition wall and other film or layer structures on the substrate, the entire substrate may be irradiated with ultraviolet light to remove the fluorinated silane monolayer in the pixel region.

As shown in FIG. 10, in the above step S102 or step S203, forming a pixel defining layer including a pixel dividing wall pattern on the substrate by inkjet printing is specifically:

Step Si 02i, a method of forming a pixel dividing wall material in a non-pixel area by inkjet printing.

The solution forming the pixel dividing wall material may be a solution of an organic insulating material, which may be a solution formed by mixing an organic insulating material solute and an organic solvent. Wherein, the organic insulating material comprises: polyhexafluoropropylene, fluorinated parylene, fluorinated polysilyl ether, fluorinated polyimide, fluorinated polyamide, polyimide, polysiloxane, Polymethyl methacrylate, polybutyl methacrylate, cyclohexyl methacrylate, polystyrene, and the like. And the organic insulating material solution has a solvent boiling point of 200 C or less, including 200 Å. C, including: chloroform, chloroform, tetrahydrofuran, chlorobenzene, toluene, o-dichlorobenzene, o-xylene, n-hexyl, cyclohexane, anisole, perfluorofuran, N-dimethyl Formamide, N, N-dimethylacetamide, dimethyl sulfoxide, and the like. For example, the organic solvent may be toluene having a boiling point of about 10 C. In this way, the edge of the ink solution printed on the substrate is lower due to the lower vapor pressure of the solvent of the organic insulating material, and the volatilization rate is fast, so that the solution of the intermediate portion flows toward the edge, and finally the thickness of the film formed at the edge is higher than the middle portion, that is, The "coffee ring" effect causes the upper surface of the printed ink solution to be recessed inwardly at the intermediate portion, thereby forming a pixel dividing wall as shown in FIG.

Step S1022: After the solution to be printed on the substrate forms a coffee ring structure, the solution printed in the non-pixel area is cured, and the coffee ring structure forms the recess.

Alternatively, the solution printed on the substrate forms the coffee ring structure in an environment of 20-40 °C. Excellent Optionally, the coffee ring is formed by evaporation of a solvent at room temperature under normal temperature. Since the coffee ring is formed by evaporating the solvent, at a lower temperature, the evaporation of the solvent is slow, and the formed coffee ring is more pronounced, that is, in the pixel. The deeper the groove formed by the partition wall surface, the more solution is deposited in the groove. It should be noted that the curing process of the inkjet printing ink solution can be cured according to a specific inkjet printing ink solution selection method. In the embodiment of the present invention, the ink solution printed by the ink is taken as an example of the organic insulating material, and the solution of the organic insulating material is annealed to remove the solvent in the organic insulating material to cure the organic insulating material. It should be noted that the annealing and solidification treatment of the solution mainly changes the microstructure of the material. In the embodiment of the present invention, the organic insulating material is a polymer material, and the solvent is a small molecule solvent, and the two forming solutions form a pixel defining layer including a pixel dividing wall pattern on the substrate by inkjet printing. In the embodiment of the present invention, the solution of the organic insulating material is annealed to remove the small molecule solvent in the organic insulating material solution, and the pixel defining layer formed on the substrate including the pixel dividing wall pattern is a polymer organic insulating material.

The above is only the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any change or replacement that can be easily conceived by those skilled in the art within the technical scope of the present invention is All should be covered by the scope of the present invention. Accordingly, the scope of the invention should be determined by the scope of the appended claims.

Claims

1. A pixel defining layer, characterized in that the pixel defining layer includes a pixel dividing wall pattern, and the upper surface of the pixel dividing wall has a depression.

2. The pixel defining layer according to claim 1, wherein the depth of the depression accounts for 20% to 40% of the height of the pixel dividing wall.

3. A method for making a pixel definition layer, which is characterized by including:

Patterned surface treatment of substrates;

A pixel defining layer is formed on the substrate, the pixel defining layer includes a pixel dividing wall pattern, and the upper surface of the pixel dividing wall has a recess.

4. The production method according to claim 3, characterized in that,

Performing a patterned surface treatment on a substrate including a pixel area and a non-pixel area so that the surface energy of the pixel area is different from the surface energy of the non-pixel area;

The pixel partition wall pattern is formed in the non-pixel area.

5. The manufacturing method according to claim 3 or 4, wherein the pixel defining layer is formed on the substrate by inkjet printing.

6. The manufacturing method according to claim 5, wherein the boiling point of the solvent in the solution forming the pixel defining layer is below 200°C.

7. The production method according to claim 5, wherein the solvent of the inkjet printing solution is dichloromethane, chloroform, tetrahydrofuran, chlorobenzene, toluene, o-dichlorobenzene, o-xylene , n-hexane, cyclohexane, anisole, perfluorofuran, N'N-dimethylformamide, N, N-dimethylacetamide or dimethyl sulfoxide.

8. The production method according to claim 5, wherein the difference between the contact angle of the droplet in the pixel area and the contact angle in the non-pixel area is greater than 30°.

9. The manufacturing method according to claim 4, wherein the patterned surface treatment is performed on the substrate including the pixel area and the non-pixel area so that the surface energy of the pixel area on the substrate is consistent with that of the non-pixel area. The different sizes of surface energy are specifically:

The substrate is subjected to a self-assembled monolayer surface treatment to form a monolayer in the pixel area.

10. The manufacturing method according to claim 9, characterized in that, the substrate is subjected to a self-assembled monolayer surface treatment, and the formation of a monolayer in the pixel area is specifically:

Performing self-assembled monolayer surface treatment on the substrate to form a monolayer on the surface of the substrate;

Remove the monolayer of the non-pixel area.

11. According to the rights requirements! The manufacturing method described in 0 is characterized in that: performing a self-assembled monolayer surface treatment on the substrate, and forming a monolayer in the pixel area specifically includes: using silicon fluoride in an inert gas environment. The substrate is processed to form a monomolecular layer of silicon fluoride on the surface of the substrate;

A mask is used to irradiate the non-pixel area on the substrate with ultraviolet light to remove the silicon fluoride monolayer in the non-pixel area.

12. The production method according to claim 10 or 11, characterized in that, after forming the pixel separation wall in the non-pixel area, it further includes:

Remove the monolayer of the pixel area.

13. The manufacturing method according to claim 12, characterized in that, in an inert gas environment, the substrate is treated with fluorinated silane to form a monomolecular layer of fluorinated silane on the surface of the substrate; Use a mask to irradiate the non-pixel area on the substrate with ultraviolet light to remove the silicon fluoride monolayer in the non-pixel area, and then form the pixel in the non-pixel area of the substrate Behind the dividing wall, also includes:

Fluorinated silane is removed from the pixel area.

14. The manufacturing method according to claim 13, wherein the removal of fluorinated silane in the pixel area is specifically:

At least the pixel area is irradiated with ultraviolet light.

15. The manufacturing method according to claim 5, wherein the pixel defining layer is formed on the substrate by inkjet printing as follows:

Print the solution forming the pixel dividing wall material in the non-pixel area by inkjet printing;

After the solution printed on the substrate forms a coffee ring structure, the solution printed on the non-pixel area is cured, and the coffee ring structure is formed into the depression.

16. The production method according to claim 15, wherein the solution printed on the substrate forms the coffee ring structure in an environment of 20-40°C.

17. A display substrate, characterized in that the display substrate includes the pixel defining layer according to claim 1 or 2.

18. A display device, characterized in that the display device includes the display substrate according to claim 17.