WO2014203604A1

WO2014203604A1 - Endoscope imaging unit

Info

Publication number: WO2014203604A1
Application number: PCT/JP2014/060718
Authority: WO
Inventors: 優此村
Original assignee: オリンパス株式会社
Priority date: 2013-06-19
Filing date: 2014-04-15
Publication date: 2014-12-24

Abstract

An endoscope imaging unit comprises: an imaging optical unit which includes an objective optical part and an imaging element provided with an imaging face on which an optical image that passes through the objective optical part forms; an imaging circuit board which is disposed inside a tip component of an endoscope insertion part and is provided with an imaging element mounting area on which imaging elements of multiple imaging optical units are mounted, an electrical component mounting area on which multiple electrical components are mounted, and wirings that are arranged between the electrical component mounting area and the imaging element mounting area and connect the electrical components and the imaging elements, as well as a deformation part which is capable of bending deformation and torsional deformation; and a signal cable which includes a signal wire a distal end of which is connected to the imaging circuit board and is inserted through the insertion part.

Description

Endoscope imaging unit

The present invention relates to an endoscope imaging unit configured by mounting an imaging device on a substrate.

Endoscopes are used in the medical field and industrial field. The endoscope has an elongated insertion portion that is inserted into a portion to be examined.

The endoscope is provided with a direct-view type endoscope provided with an observation window for observing the front in the insertion direction at the distal end of the insertion part, or an observation window for observing a side perpendicular to the insertion direction, for example. There are side-viewing endoscopes and the like.

Further, Japanese Patent Laid-Open No. 5-341205 discloses a direct-viewing stereoscopic endoscope, and Japanese Patent Laid-Open No. 5-341210 discloses a side-viewing stereoscopic endoscope. Japanese Unexamined Patent Application Publication No. 2001-190492 discloses an endoscope that can obtain observation fields of view in a plurality of directions with a single insertion portion. Furthermore, Japanese Patent Application Laid-Open No. 2006-314469 shows a distal end portion of an endoscope provided with an object contact type and an ultra high magnification imaging unit and an imaging unit for normal observation.

Japanese Patent Application Laid-Open No. 2011-30640 discloses an endoscope that can be inserted through a narrow gap and has a wide field of view in a space beyond the gap. In this endoscope, an image pickup unit having an optical axis perpendicular to the outer surface is provided on the surface near the tip of the band plate-shaped insertion unit, and the band plate-shaped insertion unit is bent or twisted to light the image pickup unit. The viewing direction can be changed by changing the axial direction.

However, the Japanese Unexamined Patent Publication No. 5-341205, the Japanese Unexamined Patent Publication No. 5-341210, the Japanese Unexamined Patent Publication No. 2001-190492, the Japanese Unexamined Patent Publication No. 2006-314469, and the Japanese Special The endoscopes shown in Japanese Unexamined Patent Publication No. 2011-30640 are endoscopes configured exclusively for each purpose of use, and it has not been considered to share parts with each endoscope. .

Japanese Patent No. 4916595 discloses a common substrate that can be used for an imaging unit of a flexible endoscope and an imaging unit of a rigid endoscope.
However, the common substrate of the imaging unit disclosed in Japanese Patent No. 4916595 is a direct-view endoscope having a curved portion, a side-view endoscope having a curved portion, a direct-view stereoscopic endoscope, and a side-view stereoscopic endoscope. Difficult to use in common for various purposes such as mirrors, endoscopes capable of obtaining observation fields in multiple directions, and endoscopes capable of super high magnification observation and normal observation It is.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an endoscope imaging unit that can be used for endoscopes having different observation functions.

An imaging unit for an endoscope according to an aspect of the present invention includes an imaging optical unit including an objective optical unit, an imaging element including an imaging surface on which an optical image that has passed through the objective optical unit is formed, and a plurality of the imaging optical units An image sensor mounting area in which an image sensor of a unit is mounted, an electronic component mounting area in which a plurality of electronic components are mounted, and the electronic component and the imaging provided between the electronic component mounting area and the image sensor mounting area An imaging circuit board provided with wiring for connecting the elements, a deformable part capable of bending deformation and torsional deformation, disposed inside the distal end configuration part of the endoscope insertion part, and the distal end connected to the imaging circuit board And a signal cable including a signal line inserted through the insertion portion.

The figure explaining the composition of an endoscope Front view of the tip of the endoscope FIG. 3 is a cross-sectional view taken along the line Y3-Y3 of FIG. The figure explaining the one surface side of the imaging circuit board by which CMOS which comprises an imaging unit was mounted The figure explaining the other surface side of the imaging circuit board of FIG. 4A The figure explaining the 1st board | substrate part bent by the valley fold, and the 2nd board | substrate part of the bent state Front view of the distal end portion of an endoscope capable of performing direct-view observation and side-view observation that is lateral to the insertion direction FIG. 6B is a cross-sectional view taken along line Y6B-Y6B in FIG. 6A and illustrates the configuration of the hard tip portion. Front view of the distal end portion of a direct-viewing stereoscopic endoscope for stereoscopic observation of the front in the insertion direction FIG. 7B is a cross-sectional view taken along line Y7B-Y7B in FIG. 7A and illustrates the configuration of the distal end hard portion. Front view of the side surface of the distal end portion of a side-view type stereoscopic endoscope for stereoscopic observation of the side in the insertion direction FIG. 8B is a cross-sectional view taken along line Y8B-Y8B in FIG. 8A and illustrates the configuration of the hard tip portion. Front view of the distal end portion of the endoscope capable of observing the front in the insertion direction in which the front surface collides with the observation target and prevents the optical lens from being damaged. FIG. 9B is a cross-sectional view taken along line Y9B-Y9B in FIG. 9A and illustrates the configuration of the hard tip portion. The figure explaining other structures of an imaging circuit board It is a figure explaining another structure of an imaging circuit board, Comprising: (A) is a figure which shows the board | substrate from which the 1st 2nd board | substrate part protrudes from the front end side end surface of a 1st board | substrate part, (B) is a 1st board | substrate part. The figure which shows the board | substrate from which three board | substrate parts protrude from the front end side end surface of

Embodiments of the present invention will be described below with reference to the drawings.
An embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, an endoscope apparatus 1 includes an electronic endoscope (hereinafter abbreviated as an endoscope) 10 of the present invention and an apparatus main body 50.

The endoscope 10 includes a hard tip portion 11 and a flexible tube portion 12 having flexibility, and is configured in an elongated shape. The apparatus main body 50 has a flat rectangular parallelepiped shape, and a display unit 52 is provided on a main surface 51 which is one of the surfaces having the largest area. The endoscope 10 is a so-called insertion portion that extends from, for example, the upper side surface of the apparatus main body 50 in the drawing.

A bending portion 13 is provided on the distal end side of the flexible tube portion 12 of the endoscope 10. The bending portion 13 is provided so as to be connected to the proximal end side of the distal end portion 11, and is configured to be bent in two directions, for example, up and down.
On the main surface 51 of the apparatus main body 50, in addition to the power switch 53, various switches indicated by

reference numerals

54, 55, 56, and the like are provided. Reference numeral 54 is a bending operation switch, reference numeral 54u is an upper bending operation switch, and reference numeral 54d is a lower bending operation switch. The switch 55 is an image recording switch, for example, and the switch 56 is an image still switch, for example.

As shown in FIGS. 1 and 2, the distal end portion 11 is provided with, for example, a distal end surface 14 and an inclined surface 15. The front end surface 14 is provided with a direct-view observation window 16 for observing the front in the insertion direction and a direct-view illumination window 17 for illuminating the front in the insertion direction. On the other hand, the inclined surface 15 is provided with a perspective observation window 18 for observing the front upper direction in the insertion direction and a perspective illumination window 19 for illuminating the front upper direction in the insertion direction.
The

observation windows

16 and 18 and the

illumination windows

17 and 19 are optical members that serve as a cover member and a lens. The

observation windows

16 and 18 constitute an imaging optical system, and the

illumination windows

17 and 19 constitute an illumination optical system. To do.

The bending portion 13 includes a bending portion piece group (not shown) configured by rotatably connecting a distal bending piece, a plurality of vertical bending pieces, and a proximal bending piece. The tip bending piece 13f shown in FIG. 3 is the most advanced piece constituting the bending portion piece set. The distal bending piece 13f is integrally fixed to the outer peripheral step portion 21 provided at the proximal end portion of the hard distal end hard portion 20A that is the distal end constituting member constituting the distal end portion 11.

The bending portion 13 includes a mesh tube (not shown) that covers the bending portion piece set and a curved rubber (not shown) that further covers the mesh tube. The distal bending piece 13f is fixed with a distal end portion of an upper bending wire and a distal end portion of a lower bending wire (not shown) at predetermined positions. The upper bending wire and the lower bending wire are pulled and loosened in accordance with the operation of the

bending operation switches

54u and 54d.
The bending portion 13 may be configured to bend in four directions, up, down, left, and right.

The configuration of the tip portion 11 will be specifically described with reference to FIGS.
As shown in FIGS. 2 and 3, the tip portion 11 is configured to include a tip hard portion 20 </ b> A.
The distal end hard portion 20 </ b> A is a cylindrical member including the distal end surface 14 and the inclined surface 15 described above. The distal end surface 14 is the most distal plane of the endoscope 10 and is a plane orthogonal to the insertion portion longitudinal axis 10a. The inclined surface 15 is an inclined surface inclined at an angle θ1 with respect to the insertion portion longitudinal axis 10a. The angle θ1 is an angle that is appropriately set according to the observation application, that is, the purpose of use.

A direct-view observation hole 22 and a direct-view illumination hole 23 are formed on the tip surface 14. The direct-view observation hole 22 and the direct-view illumination hole 23 are through holes, and the central axes of these through holes are parallel to the insertion portion longitudinal axis 10a.

On the other hand, the inclined surface 15 is formed with a perspective observation hole 24 and a perspective illumination hole 25. The oblique observation hole 24 and the oblique illumination hole 25 are also through holes. The central axes of these through holes are parallel to an orthogonal line orthogonal to the inclined surface 15.

An imaging circuit board 8 constituting an endoscope imaging unit (hereinafter abbreviated as imaging unit) 3 is disposed in the internal space of the distal end hard portion 20A.
As shown in FIGS. 3 to 5, the imaging unit 3 mainly includes an imaging optical unit 7, an imaging circuit board 8, and a signal cable 9.
The imaging optical unit 7 includes an objective optical unit 4, an imaging optical unit 5, and, for example, a CMOS 6 that is an imaging element.

The objective optical unit 4 includes an objective lens frame 4a, one or a plurality of optical lenses 4b fixed to the objective lens frame 4a, and a diaphragm (not shown). In the present embodiment, the distal end surface of the objective lens frame 4a is disposed in contact with the proximal end surfaces of the

observation windows

16 and 18 to constitute an imaging optical system.

The imaging optical unit 5 includes an element frame 5a and a cover glass 5b fixed to the element frame 5a. An imaging surface of the CMOS 6 is integrally fixed to the base end surface of the cover glass 5b.
In the present embodiment, the element frame 5a is, for example, externally fitted to the objective lens frame 4a, and then fixed integrally with an adhesive or solder after performing focus adjustment.

The imaging circuit board 8 is a flexible board and is shaped as shown in FIGS. 4A and 4B. Specifically, the imaging circuit board 8 includes a first board portion 8A and a pair of second board portions 8B1 and 8B2.

The pair of second substrate portions 8B1 and 8B2 are provided so as to extend from both side portions of the front end side end surface 8c of the first substrate portion 8A. The second substrate portions 8B1 and 8B2 are elongated and band-shaped deformable portions, and are configured to be able to be bent and torsionally deformed with a predetermined width dimension and a predetermined length dimension.

As shown in FIG. 4A, the first substrate portion 8A of the imaging circuit board 8 includes, for example, an electronic component mounting region on one surface side, and a plurality of electronic components 8d such as resistors and capacitors are mounted thereon. On the other hand, as shown in FIG. 4B, an imaging element mounting region is provided on, for example, the other surface side of the extended end portions of the second substrate portions 8B1 and 8B2 of the imaging circuit substrate 8, and the CMOS 6 is mounted. The second substrate portions 8B1 and 8B2 are provided with wiring (not shown) for connecting the C-MOS 6 and the electronic component 8d.
The imaging surface 6a of the CMOS 6 is arranged in the same direction in the imaging element mounting area of the second substrate unit 8B1 and the imaging element mounting area of the second substrate unit 8B2.

Note that a plurality of contact portions (not shown) and a plurality of wirings (not shown) are provided on the front and back surfaces of the imaging circuit board 8. A plurality of signal lines and electric wires (not shown) inserted into the signal cable 9 are electrically connected to the respective contact portions. The base end of the signal line inserted through the signal cable 9 is connected to a signal processing unit in the apparatus main body 50, and the electric wire is connected to a power supply unit in the apparatus main body 50.

In addition, reference numeral 8E in FIG. 4A is a valley fold line. The valley fold line 8E is provided on the extended line of the long side facing the second substrate portions 8B1 and 8B2. According to this configuration, both side portions of the first substrate portion 8A are bent along the valley fold line 8E as shown in FIG.

By folding both side portions of the first substrate portion 8A along the valley fold line 8E, as shown in FIG. 5, one surface and the other surface of one second substrate portion 8B1 projecting from the end surface 8c of the first substrate portion 8A. The second substrate portion 8B2 faces one surface. The pair of elongated second substrate portions 8B1 and 8B2 can be bent as shown in the drawing, and can be twisted although not shown.
That is, the arrangement position of the objective optical unit 4 of the imaging optical unit 7 of the present embodiment is configured to be freely changeable by bending or twisting the second substrate units 8B1 and 8B2. .

Therefore, as shown in FIG. 3, the imaging optical device in which the CMOS 6 is mounted on one second substrate portion 8B1 at a predetermined position (hereinafter referred to as a predetermined position) of the direct-view observation hole 22 provided in the distal end hard portion 20A. The objective optical unit 4 of the unit 7 is bonded and fixed, and the objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on the other second substrate unit 8B2 is bonded and fixed at a predetermined position of the perspective observation hole 24. As a result, it is possible to configure the endoscope 10 capable of performing direct-view observation that is forward in the insertion direction and perspective observation that is forward in the insertion direction.

In the endoscope apparatus 1 including the endoscope 10, for example, the direct-view observation image and the perspective observation image are displayed on the display unit 52 of the apparatus main body 50 at the same time, for example, every half screen or directly. Alternately, or a direct-view observation image and a perspective observation image are selectively displayed.

The direct-view observation window 16 is fixed in a watertight manner at a predetermined position of the direct-view observation hole 22, and the perspective observation window 18 is fixed in a watertight manner at a predetermined position of the perspective observation hole 24. Further, the direct-view illumination window 17 is fixed in a watertight manner at a predetermined position of the direct-view illumination hole 23, and the perspective illumination window 19 is fixed in a watertight manner at a predetermined position of the oblique-view illumination hole 25.

The LED illumination 2 is fixed to a predetermined position of the oblique illumination hole 25 and a predetermined position of the oblique illumination hole 25, respectively. The LED illumination 2 includes one or a plurality of LEDs 2a provided on the substrate 2b, and wiring 2c connected to the substrate 2b. The wiring 2c is connected to a predetermined contact portion of the first substrate portion 8A.

On the other hand, the endoscope 10B is configured by bonding and fixing the objective optical unit 4 of the imaging optical unit 7 constituting the imaging unit 3 to the observation holes 22 and 24B of the distal end hard portion 20B shown in FIGS. 6A and 6B. Is done.
As shown in FIG. 6A and FIG. 6B, the distal end hard portion 20B is a cylindrical member including the distal end surface 14 and the side surface 15B described above. The side surface 15B is a plane parallel to the insertion portion longitudinal axis 10a and corresponds to, for example, the upward direction of the bending portion 13.

As shown in FIG. 6B, a side-view observation hole 24B and a side-view illumination hole 25B are formed on the side surface 15B. The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on one second substrate unit 8B1 is bonded and fixed to a predetermined position of the direct-view observation hole 22. The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on the other second substrate unit 8B2 is bonded and fixed to a predetermined position of the side-view observation hole 24B.
As a result, it is possible to configure the endoscope 10B capable of performing direct-view observation that is forward in the insertion direction and side-view observation that is lateral to the insertion direction.

The direct-view observation window 16 is fixed in a watertight manner at a predetermined position of the direct-view observation hole 22, and the side-view observation window 18B is fixed in a watertight manner at a predetermined position of the side-view observation hole 24B. The direct view illumination window 17 is fixed in a watertight manner at the position, and the side view illumination window 19B is fixed in a watertight manner at a predetermined position of the side view illumination hole 25B. The LED illumination 2 is fixed to a predetermined position of the side view illumination hole 25B and a predetermined position of the side view illumination hole 25B.

In the endoscope apparatus 1 including the endoscope 10B, for example, the direct-view observation image and the side-view observation image are displayed on the display unit 52 of the apparatus main body 50 at the same time, for example, every half screen or directly. The observation image is alternately displayed, or the direct-view observation image and the side-view observation image are selectively displayed.
Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.

Further, the endoscope 10C is fixed by bonding and fixing the objective optical unit 4 of the imaging optical unit 7 constituting the imaging unit 3 to the pair of direct-viewing observation holes 22C of the distal end hard portion 20C shown in FIGS. 7A and 7B. Composed.
As shown in FIGS. 7A and 7B, the distal end hard portion 20C is a cylindrical member provided with the above-described distal end surface. A pair of intuition observation holes 22C and, for example, a pair of direct view illumination holes 23C are formed on the distal end surface 14. In addition, the structure which provides only the hole 23C for direct view illumination may be sufficient.

The objective optical part 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on one second substrate part 8B1 is bonded and fixed to a predetermined position of the one direct-view observation hole 22C. The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on the other second substrate portion 8B2 is bonded and fixed to a predetermined position of the other direct-view observation hole 22C. As a result, it is possible to configure a direct-viewing stereoscopic endoscope 10 </ b> C for stereoscopic observation of the front in the insertion direction.

It should be noted that the direct-view observation window 16C is fixed in a watertight manner at a predetermined position of the pair of direct-view observation holes 22C, and the direct-view illumination window 17C is fixed in a watertight manner at a predetermined position of the pair of direct-view illumination holes 23C. An LED illumination (not shown) is fixed at a predetermined position of the direct viewing illumination hole 23C.

In the endoscope apparatus 1 including the endoscope 10 </ b> C, an endoscopic image that can be stereoscopically viewed is displayed on the display unit 52 of the apparatus body 50. Then, the user can observe the stereoscopically displayed endoscopic image displayed on the display unit 52 as a stereoscopic image by wearing 3D glasses (not shown). Note that the display unit may be a display panel that supports autostereoscopic viewing so that a stereoscopic image can be observed.
Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.

The objective optical unit 4 of the imaging optical unit 7 constituting the imaging unit 3 is bonded and fixed to the pair of side observation holes 24D of the distal end rigid portion 20D shown in FIG. 8A and FIG. Is configured.
As shown in FIGS. 8A and 8B, the distal end hard portion 20D is a cylindrical member including the above-described distal end surface 14 and side surface 15B. A pair of side observation holes 24D and, for example, a pair of side view illumination holes 25D are formed on the side surface 15B. In addition, the structure which provides only one hole 25D for side view illumination may be sufficient.

The objective optical part 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on one second substrate part 8B1 is bonded and fixed to a predetermined position of the one side-view observation hole 24D. The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on the other second substrate unit 8B2 is bonded and fixed to a predetermined position of the other side viewing side observation hole 24D. As a result, the side-view type stereoscopic endoscope 10D for stereoscopic observation of the side in the insertion direction orthogonal to the insertion direction can be configured.

The side-view observation windows 18D are fixed in a watertight manner at predetermined positions of the pair of side-view observation holes 24D, and the side-view illumination windows 19D are fixed in a watertight manner at predetermined positions of the pair of side-view illumination holes 25D. Has been. And LED illumination (not shown) is being fixed to the predetermined position of the hole 25D for side view illumination.

Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.

Further, the endoscope 10E is fixed by bonding and fixing the objective optical unit 4 of the imaging optical unit 7 constituting the imaging unit 3 to the pair of direct-viewing observation holes 22E of the distal end hard portion 20E shown in FIGS. 9A and 9B. Composed.
As shown in FIGS. 9A and 9B, the distal end hard portion 20E is a cylindrical member including a distal end surface 14 and a pair of inclined surfaces 14E1 and 14E2. The distal end surface 14 is orthogonal to the insertion portion longitudinal axis 10a, and the inclined surfaces 14E1 and 14E2 intersect the insertion portion longitudinal axis 10a at an angle θ2.

A direct viewing hole 22E and a direct viewing illumination hole 23E are formed in the pair of inclined surfaces 14E1 and 14E2, respectively.

The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on one second substrate unit 8B1 is bonded and fixed to a predetermined position of the one direct-view observation hole 22E. The objective optical unit 4 of the imaging optical unit 7 in which the CMOS 6 is mounted on the other second substrate unit 8B2 is bonded and fixed to a predetermined position of the other direct-view observation hole 22E.

The observation range of the endoscope 10E described above is a range indicated by a two-dot chain line in FIG. 9B, for example, a viewing angle of 160 degrees. This observation range is obtained by the first observation image range 7 a of one imaging optical unit 7 and the second observation image range 7 b of the other imaging optical unit 7.
In the present embodiment, a part of the first observation image range 7a and a part of the second observation image range 7b intersect with each other at a predetermined distance from the front end surface 14 in the insertion direction. The angle of view of the imaging optical unit 7 and the optical axis 7c of the imaging optical unit 7 are set.

The direct-view observation window 16E is fixed in a watertight manner at a predetermined position of the pair of direct-view observation holes 22E, and the direct-view illumination window 17E is fixed in a watertight manner at a predetermined position of the pair of direct-view illumination holes 23E. An LED illumination (not shown) is fixed at a predetermined position of the direct-view illumination hole 23E.

In the endoscope apparatus 1 including the endoscope 10E, the first observation image range 7a and the second observation image range 7b captured by the CMOS 6 of the pair of imaging optical units 7 are combined with the display unit 52 of the apparatus body 50, respectively. The combined image is displayed.
Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.

According to the endoscope 10E configured as described above, when the endoscope 10E is pushed forward toward the deep part, the composite image is displayed on the display unit 52, and good observation can be performed. In addition, when the endoscope 10E is pushed toward the deep part, the direct-view observation window 16E is provided on the inclined surfaces 14E1 and 14E2 even if the distal end surface 14 collides with the observation target part. For this reason, the trouble which the front end surface 14 collides with an observation object site | part, and the direct-viewing observation window 16E is damaged, and the trouble which breaks are eliminated.

As described above, the image pickup circuit board 8 is provided with a pair of second board portions 8B1 and 8B2 that are configured to be elongated and belt-like and bendable and torsionally deformable. Then, the CMOS 6 is mounted in each of the image sensor mounting regions provided at the extended end portions of the second substrate portions 8B1 and 8B2, and the imaging optical device including the C-MOS 6, the imaging optical unit 5, and the objective optical unit 4 on the imaging circuit substrate 8. The image pickup unit 3 is configured by providing the unit 7. And the objective optical part 4 of the imaging optical unit 7 is arrange | positioned in the two holes for observation formed in the front-end | tip

hard part

20A, 20B, 20C, 20D, 20E, respectively.

As a result, the endoscope 10 capable of performing direct-view observation that is forward in the insertion direction and perspective observation that is forward in the insertion direction, and direct-view observation that is forward in the insertion direction, by the one type of imaging unit 3 described above. Endoscope 10B capable of performing side-view observation that is lateral to the insertion direction, direct-view type stereoscopic endoscope 10C for stereoscopic viewing of the front in the insertion direction, and stereoscopic viewing of the side in the insertion direction Side view type stereoscopic endoscope 10D, an endoscope that can observe the front in the insertion direction that prevents damage to the optical lens and damage to the optical lens caused by the front end surface 14 colliding with the observation target. A mirror 10E and the like can be obtained.
That is, it is possible to share the imaging units 3 constituting the

endoscopes

10, 10B, 10C, 10D, and 10E.

In the above-described embodiment, the side surface 15B is a surface corresponding to the upward curve direction of the bending portion 13 parallel to the insertion portion longitudinal axis 10a. However, the side surface 15B is not limited to the surface corresponding to the bending upward direction of the bending portion 13, but corresponds to the surface corresponding to the downward direction of the bending portion 13, the surface corresponding to the right direction, or the left direction. It may be a surface to be used.

Further, in the above-described embodiment, the shape of the illumination window is a rectangular shape. However, the shape of the illumination window is not limited to a rectangular shape, and may be a circular shape, an elliptical shape, a polygonal shape such as a triangular shape, a rectangular shape, or the like.

In the above-described embodiment, the imaging circuit board 8 is a flexible board. However, as shown in FIG. 10, the imaging circuit board 8C may be configured by using the first board 8A as a rigid board and the pair of second boards 8B1 and 8B2 as flexible boards. That is, a configuration may be employed in which a pair of second substrate portions 8B1 and 8B2 configured by an elongated belt-shaped flexible substrate is electrically and mechanically connected to the first substrate portion 8A which is a rigid substrate.

In the above-described embodiment, the imaging circuit board 8 includes the first board part 8A and the pair of second board parts 8B1 and 8B2 protruding from the front end side end face 8c of the first board part 8A. However, the number of the second substrate portions protruding from the distal end side end surface 8c of the first substrate portion 8A is not limited to a pair, and as shown in FIG. 11A, the distal end side end surface 8c of the first substrate portion 8A. A plurality of, for example, three

second substrate portions

8E, 8F from the front end side surface 8c of the first substrate portion 8A as shown in FIG. The board | substrate 82 etc. from which 8G protrudes may be sufficient.
The CMOS 6 provided in the second substrate portion 8D of the substrate 81 shown in FIG. 11A is disposed in one observation hole formed in the distal end hard portion (not shown), and is a monocular direct-view endoscope. An imaging unit common to the side-view endoscope or the perspective endoscope is configured. On the other hand, the CMOS 6 provided on the

second substrate portions

8E, 8F, and 8G of the substrate 82 shown in FIG. 11B is arranged in three observation holes formed in the hard tip portion (not shown), An imaging unit common to an endoscope that performs direct-viewing observation and side-viewing observation or an endoscope that performs direct-viewing observation and side-viewing observation is configured.

The second substrate portion is not limited to the configuration protruding from the front end side end surface 8c of the first substrate portion 8A, and may be configured to protrude from the other end surface.

In the above-described embodiment, the objective optical unit 4 constituting the imaging optical unit 7 is bonded and fixed to the observation hole where the observation window is fixed. However, the objective optical unit 4 constituting the imaging optical unit 7 is fixed in a watertight manner in the observation hole, and the objective lens frame 4a of the objective optical unit 4 constituting the imaging optical unit 7 fixed in the observation hole is attached. The element frame 5a of the imaging optical unit 5 may be externally fitted and adjusted for focusing, and then the observation optical unit 7 may be provided in the observation hole by bonding and fixing.

In the above-described embodiment, the imaging optical system is configured by arranging the objective optical unit 4 in the observation hole. However, the position where the objective optical unit 4 is disposed is not limited to the hole, and may be configured such that the step surface shape is U-shaped or the step surface shape is disposed in a groove such as a concave shape. In other words, the configuration may be such that the observation optical unit 7 is arranged at the distal end hard portion by dividing the distal end hard portion into a plurality of members and combining the divided members.

In the above-described embodiment, the LED 2 is arranged in the illumination hole. However, a configuration in which the tip of the light guide fiber bundle is disposed in the illumination hole may be employed.

Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

This application is filed in Japanese Patent Application No. 2013-128838 filed in Japan on June 19, 2013 as a basis for claiming priority, and the above disclosure is disclosed in the present specification, claims, It shall be cited in the drawing.

Claims

An imaging optical unit including an objective optical unit, and an imaging element including an imaging surface on which an optical image passing through the objective optical unit is formed;
An image sensor mounting region in which an image sensor of the plurality of image pickup optical units is mounted, an electronic component mounting region in which a plurality of electronic components are mounted, and a space between the electronic component mounting region and the image sensor mounting region. An imaging circuit board provided with wiring for connecting the electronic component and the imaging device, provided with a deformable portion capable of bending deformation and torsional deformation, and disposed inside the distal end configuration portion of the endoscope insertion portion;
A signal cable including a signal line that is connected to the tip of the imaging circuit board and inserted through the insertion portion;
An imaging unit for an endoscope, comprising:
The imaging circuit board is:
A first substrate unit comprising the electronic component mounting region;
A second substrate part provided with an imaging element mounting region at an extended end part, which is constituted by an elongated and strip-like flexible board extending from the first substrate part;
The endoscope imaging unit according to claim 1, further comprising:
3. The endoscope imaging unit according to claim 2, wherein the second substrate unit extends from the first substrate unit in accordance with the number of objective optical units provided in the distal end component unit.
The endoscope imaging unit according to any one of claims 1 to 3, wherein the imaging circuit board is formed of a flexible board.
The distal end configuration part of the endoscope insertion part has a plurality of observation holes,
The endoscope imaging unit according to any one of claims 1 to 4, wherein the deforming portion is deformed so that the objective optical portion can be fixed to the plurality of observation holes.
The endoscope imaging unit according to claim 5, wherein one central axis of the plurality of observation holes is inclined with respect to the other central axis.
6. The endoscope imaging unit according to claim 5, wherein one central axis of the plurality of observation holes and the other central axis are formed in parallel.