WO2014201788A1 - 一种隐藏面激光冲击强化方法和装置 - Google Patents
一种隐藏面激光冲击强化方法和装置 Download PDFInfo
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- WO2014201788A1 WO2014201788A1 PCT/CN2013/085750 CN2013085750W WO2014201788A1 WO 2014201788 A1 WO2014201788 A1 WO 2014201788A1 CN 2013085750 W CN2013085750 W CN 2013085750W WO 2014201788 A1 WO2014201788 A1 WO 2014201788A1
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- Prior art keywords
- signal acquisition
- acquisition card
- laser
- hidden surface
- workpiece
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D10/00—Modifying the physical properties by methods other than heat treatment or deformation
- C21D10/005—Modifying the physical properties by methods other than heat treatment or deformation by laser shock processing
Definitions
- the present invention relates to the field of laser processing, and particularly to a method of laser impact enhancement of a concealed surface, and a device for realizing the method, which is suitable for surface strengthening of a workpiece having a hidden surface.
- a hidden surface laser shock strengthening method is characterized in that: adopting an approximate segment processing method, the control system adjusts the movement and rotation of the full mirror disposed inside the workpiece according to the signal of the signal acquisition card, so that the reflected laser beam is suitable
- the angle of incidence that is, the angle between the reflected laser beam and the normal of the area to be processed of the hidden surface, acts on the hidden surface to be processed, thereby achieving laser impact enhancement of the hidden surface; the incident angle ranges from 0° to -30°.
- a device for implementing the hidden surface laser shock peening method comprising a laser (1), a laser control device (2), a water tank (5), an absorption layer (6), a clamp (7), and a table (8) ), signal acquisition card I (9), signal acquisition card II (10), full mirror (11), feed device (12) and control mechanism (13); laser (1) is at the top, laser control device (2) is connected to laser (1), water tank (5) is located Directly below the laser, the full mirror (11), signal acquisition card I (9) and signal acquisition card II (10) are mounted on the fixture (7), and the fixture (7) is fed through the feed (12) and the table (8).
- the line of (10) is coplanar with the incident laser beam, and the distance between the signal acquisition card I (9) and the signal acquisition card II (10) is equal to the incident point of the incident laser beam on the full mirror (11) and signal acquisition.
- the distance between the cassettes (10); the feed device (12) enables 6 degrees of freedom movement of the clamp (7).
- the control mechanism (13) is capable of receiving signals of the signal acquisition card I (9) and the signal acquisition card II (10) and simultaneously controlling the worktable (8), the signal acquisition card I (9) and the signal acquisition card Exercise of II (10).
- the innovation of the invention lies in that the hidden surface contour is approximately divided into a plurality of small straight line segments, and each of the two connected small straight line segments is at an angle, and the laser shock strengthening process is performed along these small straight line segments, each After processing a small straight line segment, the full mirror rotates the appropriate angle and moves to the appropriate position to start processing the next small straight line segment, ensuring the incident angle of the reflected laser beam, that is, the angle between the reflected laser beam and the normal of the hidden surface to be processed.
- the range is 0° -30°.
- the laser control device is used to set the laser output to indicate the action of the low-energy laser beam, turn on the laser, and then adjust the position and angle of the full-mirror through the control system so that the reflected laser beam is perpendicular to the uppermost area of the workpiece to be processed.
- Point A and ensure that the signal acquisition card I and the signal acquisition card II are coplanar with the incident laser beam, the measurement direction of the signal acquisition card I and the signal acquisition card is parallel to the reflected laser beam, and the signal acquisition card I and the signal acquisition card II
- the distance between the incident laser beam and the incident laser beam on the full mirror and the signal acquisition cassette are both L.
- the signal acquisition card I and the signal acquisition card II correspond to the C point on the hidden surface, respectively.
- Point B
- the laser output control device sets the output pulse energy of the laser, the spot diameter D and the pulse width, turns on the laser, and starts laser shock strengthening of the workpiece.
- the control system adjusts the total anti-reflection according to the complete movement and rotation information of the saved full mirror. The movement of the mirror completes the processing from top to bottom;
- FIG. 1 is a schematic view showing laser shock enhancement of a hidden surface.
- FIG. 2 is a schematic diagram of a segmentation process.
- ⁇ 1 is the angle between the incident laser beam and the total mirror
- ⁇ 2 is the angle that the full mirror needs to rotate after the AB segment is processed
- ⁇ 3 is the processed AB segment obtained by the approximation method. The angle at which the full mirror is actually rotated.
- the laser 1 is located at the top; the laser control device 2 is connected to the laser 1; the water tank 5 is located directly below the laser; the workpiece 4 is located at the bottom of the water tank 5; the full mirror 11, the signal acquisition card I 9 and the signal acquisition cassette 10 are mounted
- the jig 7 is connected to the table 8 by the feeding device 12; the control system 13 is located outside the water tank 5, and is connected to the signal acquisition card 19, the signal acquisition card II 10 and the table 8 through signal lines.
- Embodiment 2 is a diagrammatic representation of Embodiment 1
- the angle of the full mirror 11 to be rotated ⁇ 1> is equal to 16.0° and the corresponding full mirror 11 is shifted down by a length H equal to 12.14 mm;
- the laser impact strengthening overlap rate is 50%, according to the formula ⁇ L m when the full mirror is moved down 9.54 mm
- the control system 13 adjusts the full mirror 11 according to the rotation angle 3 and the downward movement length H obtained in the previous step, and stores ⁇ 3 as a new 1 value, so that the full mirror 11 is rotated. After 16.0°, move down 12.14 mm and update 1 to 74.4°.
- the output pulse energy of the laser 1, the spot diameter/) and the pulse width are set, the laser 1 is turned on, the laser impact enhancement of the workpiece 4 is started, and the control system 13 completes the movement and rotation according to the saved full-reflection mirror 11.
- the information adjusts the movement of the full mirror 11 to complete the processing from top to bottom.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
一种隐藏面激光冲击强化的方法和装置,采用近似分段加工的方法,在获取整个隐藏面信息以后,制定连续激光冲击强化轨迹和工艺,控制系统根据信号采集卡(9,10)的信号调节设置在工件(4)内部的全反镜(11)的移动和转动,使反射激光束以合适的入射角,即反射激光束与隐藏面待加工区域法线的夹角,作用于隐藏面待加工区域,从而实现隐藏面激光冲击强化处理。本方法采用工件内部全反镜移动和转动,可以实现工件隐藏面的表面强化处理,显著提高工件的机械性能和疲劳寿命,适用于具有隐藏面工件的表面强化。
Description
一种隐藏面激光冲击强化方法和装置 技术领域
[0001] 本发明涉及激光加工领域, 特指一种隐藏面激光冲击强化的方法, 以及实现这种方 法的装置, 适用于具有隐藏面工件的表面强化。
背景技术
[0002] 激光冲击强化 (LSP: 又叫激光喷丸)是一种新型的材料表面强化技术, 利用强激光诱 导的冲击波力学效应对材料进行加工, 具有高压、 高能、 超快和超高应变率等特点。 其形成 的残余压应力层能有效地消除材料内部的应力集中和抑制裂纹的萌生和扩展, 能够显著提高 金属零件的疲劳寿命以及抗腐蚀和抗磨损能力。
[0003] 目前国内主要应用激光冲击强化处理工件的外表面, 如叶片、 齿轮等, 而对轴承以 及一些以隐藏面作为工作面的零件处理少有报道。 张永康等人申报的专利号为 200610096476.5 的中国专利, 名称为一种基于激光冲击波技术孔壁的强化方法和装置提出了 采用反射冲击波对工件孔壁的处理方法。 随后, 姜银方等人申报的专利号为 201010510712.X 的中国专利, 名称为一种紧固孔激光冲击强化的方法和装置也提出了类似 的针对于孔壁的处理方法。 但当工件隐藏面为曲面或孔径尺寸较大时, 以上两种方法均不适 用。 因为当工件隐藏面为曲面时, 很难制造出合适的反射锥使反射冲击波均匀作用于隐藏面, 而当孔径尺寸较大时, 反射冲击波容易扩散, 从而减弱孔壁激光冲击强化的效果。 解决隐藏 面处理的关键在于将激光束引入工件内部, 并且保证以合适的入射角作用于隐藏面待加工区 域。
发明内容
[0004] 本发明的目的在于提供一种隐藏面激光冲击强化方法和装置, 以强化工件隐藏面为 曲面或孔径尺寸较大时的隐藏面性能。
[0005] 为了解决经上技术问题, 本发明采用的技术方案如下:
一种隐藏面激光冲击强化方法, 其特征在于: 采用近似分段加工的方法, 控制系统根据信号 采集卡的信号调节设置在工件内部的全反镜的移动和转动, 使反射激光束以合适的入射角, 即反射激光束与隐藏面待加工区域法线的夹角, 作用于隐藏面待加工区域, 从而实现隐藏面 激光冲击强化; 所述入射角的范围为 0° -30° 。
[0006] 一种实施所述隐藏面激光冲击强化方法的装置, 包括激光器 (1 )、 激光器控制装置 (2)、 水箱 (5)、 吸收层 (6)、 夹具 (7)、 工作台 (8)、 信号采集卡 I (9)、 信号采集卡 II
( 10)、 全反镜 (11 )、 进给装置 (12) 和控制机构 (13 ); 激光器 (1 ) 位于最上方, 激光器 控制装置 (2) 与激光器 (1 ) 相连, 水箱 (5 ) 位于激光器正下方, 全反镜 (11 )、 信号采集 卡 I ( 9) 和信号采集卡 II ( 10) 安装在夹具 (7) 上, 夹具 (7) 通过进给装置 (12) 与工 作台 (8) 相连, 控制系统 (13 ) 位于水箱 (5 ) 夕卜, 通过信号线分别于信号采集卡 I (9)、 信号采集卡 Π ( 10) 以及工作台 (8) 相连; 其特征在于: 所述信号采集卡 I (9) 和信号采 集卡 II ( 10 ) 均位于全反镜 (11 ) 所在平面内, 并且信号采集卡 I ( 9 ) 和信号采集卡 II
( 10) 的连线与入射激光束共面, 同时信号采集卡 I ( 9) 与信号采集卡 II ( 10) 之间的距 离等于入射激光束在全反镜 (11 ) 上入射点与信号采集卡 Π ( 10) 之间的距离; 所述进给装 置 (12) 能实现夹具 (7) 的 6个自由度运动。
[0007] 所述的控制机构 (13 ) 能够接收信号采集卡 I (9) 和信号采集卡 II ( 10) 的信号并 同时控制工作台 (8 )、 信号采集卡 I (9) 和信号采集卡 II ( 10) 的运动。 本发明的创新之 处在于, 将隐藏面轮廓线近似分割成许多小直线段, 每两条相连的小直线段之间成一定角度, 激光冲击强化过程沿着这些小直线段分段进行, 每加工完一条小直线段, 全反镜旋转适当的 角度并移动到合适的位置开始加工下一条小直线段, 保证反射激光束的入射角, 即反射激光 束与隐藏面待加工区域法线夹角的范围为 0° -30° 。
[0008] 使用该装置的具体步骤为:
(1) 在工件隐藏面待加工区域涂上吸收层, 再将工件放入空的水箱中;
(2) 将全反镜、 信号采集卡 I和信号采集卡 II安装在夹具上, 保证信号采集卡 I和信号采 集卡 II均位于全反镜所在平面内, 接着将夹具、 进给装置和工作台连接好之后将整个工作台 部分固定在工件底部;
(3) 通过激光器控制装置设定激光器输出用于指示作用的低能量激光束, 打开激光器, 然 后通过控制系统调整全反镜的位置和角度, 使反射激光束垂直于工件最上方的待加工区域 A 点, 并且保证信号采集卡 I和信号采集卡 II与入射激光束共面, 信号采集卡 I和信号采集卡 Π的测量方向与反射激光束平行, 同时信号采集卡 I与信号采集卡 II之间的距离和入射激光 束在全反镜上入射点与信号采集卡 Π之间的距离均为 L, 此时信号采集卡 I和信号采集卡 II 所对应的分别为隐藏面上的 C点和 B点;
(4) 控制系统得到信号采集卡 I和信号采集卡 Π的数据 m和 m 以及全反镜与入射激光束 得到加工下一条小直线段时全反镜所要旋转的角度 以 及 相 应 的 全 反 镜 下 移 长 度
H = C ~~ - ~~ +ΗΊ^*{ sin ^聿 +CQSp*0I)) ·
2*cos51 ski^聿 '
(5) 设定全反镜下移步长为 ™ , D为光斑直径, 使激光冲击强化的搭接率为 50%,
4 当全反镜下移 ^ L 后即完成第一条小直线段 AB的加工, 然后控制系统按照上一步得到 的旋转角度 和下移长度 H调节全反镜, 并将 3作为新的 1值存入;
(6) 重复上面两步, 控制系统计算出整个激光冲击强化过程中全反镜完整的移动和转动信 息, 并保存, 然后将全反镜移动到初始位置, 即加工工件最上方待加工区域 A 点时全反镜 的位置;
(7) 往水箱中加入自来水, 水箱内液面超出工件上表面 5-10 mm;
(8) 通过激光器控制装置设定激光器的输出脉冲能量, 光斑直径 D以及脉冲宽度, 打开激 光器, 开始对工件进行激光冲击强化, 控制系统根据保存的全反镜完整的移动和转动信息调 节全反镜的运动, 完成从上到下的加工过程;
本发明的有益效果如下:
(1) 将激光冲击强化工艺应用于工件隐藏面处理, 拓展了激光冲击波先进工艺的应用范围;
(2) 通过全反镜的转动和移动实现近似分段加工, 根据获取整个隐藏面信息, 制定连续激 光冲击强化轨迹和工艺, 实现隐藏面激光冲击强化处理, 可以适用于多种不同隐藏面的工件;
(3) 本发明中反射激光束的入射角范围为 0° -30 ° , 有利于保证激光冲击强化的均匀性, 提高加工质量。
附图说明
[0009] 为了更清楚地说明本申请实施例或现有技术中的技术方案, 下面将对实施例或现有 技术描述中所需要使用的附图作简单地介绍。
[0010] 图 1所示为隐藏面激光冲击强化的示意图。
[0011] 图中: 1. 激光器, 2. 激光器控制装置, 3. 入射激光束, 4. 工件, 5. 水箱, 6. 吸收 层, 7. 夹具, 8. 工作台, 9. 信号采集卡 I, 10.信号采集卡 II, 11. 全反镜, 12. 进给装置, 13. 控制系统。
[0012] 图 2所示为分段加工原理图。
[0013] 图中: θ 1 为入射激光束与全反镜的夹角, Θ 2为加工完 AB段后全反镜理论上需要 转动的角度, Θ 3为采用近似方法得到的加工完 AB段后全反镜实际转动的角度。
具体实施方式
[0014] 下面结合附图进一步详细说明本发明的技术方案。
[0015] 实施例一:
一种隐藏面激光冲击强化的装置, 如图 1 所示, 包括: 激光器 1、 激光器控制装置 2、 水箱 5、 吸收层 6、 夹具 7、 工作台 8、 信号采集卡 1 9、 信号采集卡 11 10、 全反镜 11、 进给装置 12和控制机构 13。
[0016] 激光器 1位于最上方; 激光器控制装置 2与激光器 1相连; 水箱 5位于激光器正下 方; 工件 4位于水箱 5底部; 全反镜 11、 信号采集卡 I 9和信号采集卡 Π 10安装在夹具 7 上; 夹具 7通过进给装置 12与工作台 8相连; 控制系统 13位于水箱 5外, 通过信号线分别 于信号采集卡 1 9、 信号采集卡 II 10以及工作台 8相连。
[0017] 实施例二:
实施一种隐藏面激光冲击强化的方法的具体步骤为:
(1) 在工件 4隐藏面待加工区域涂上吸收层 6, 再将工件 4放入空的水箱 5中;
(2) 将全反镜 11、 信号采集卡 I 9 和信号采集卡 Π 10 安装在夹具上, 保证信号采集卡 I 9 和信号采集卡 Π 10均位于全反镜 11所在平面内, 接着将夹具 7、 进给装置 12和工作台 8连 接好之后将整个工作台部分固定在工件底部;
(3) 通过激光器控制装置 2 设定激光器输出用于指示作用的低能量激光束打开激光器 1, 然后通过控制系统 13调整全反镜 11的位置和角度, 使反射激光束垂直于工件 4最上方的待 加工区域并且保证信号采集卡 I 9和信号采集卡 II 10与入射激光束 3共面, 信号采集卡 I 9 和信号采集卡 Π 10 的测量方向与反射红外光平行, 同时信号采集卡 1 9 与信号采集卡 Π 10 之间的距离和入射激光束 3在全反镜 11上入射点与信号采集卡 II 10之间的距离均 为 10 mm;
(4) 控制系统得到信号采集卡 I 9和信号采集卡 II 10的数据 m等于 35.6 mm和 H2等于 38.4 mm.以及全反镜 11 与入射激光束 3 夹角 1 等于 58.4 ° , 然后根据公式 = ^ ^ ^ ll和 H 得到加
工下一条小直线段时全反镜 11所要旋转的角度 Θ 1>等于 16.0° 以及相应的全反镜 11下移 长度 H等于 12.14 mm ;
(5) 根据公式 ™ , D为光斑直径, 其值为 3 mm, 设定全反镜 11 下移步长为 1.22
4 mm, 使激光冲击强化的搭接率为 50%, 根据公式^ L m当全反镜下移 9.54 mm后即完成
第一条小直线段的加工, 然后控制系统 13按照上一步得到的旋转角度 3和下移长度 H调 节全反镜 11, 并将 Θ 3 作为新的 1 值存入, 使全反镜 11 旋转 16.0° 后再下移 12.14 mm, 更新 1为 74.4° ;
(6) 重复上面两步, 控制系统 13计算出整个激光冲击强化过程中全反镜 11完整的移动和 转动信息, 并保存, 然后将全反镜 11移动到初始位置, 即加工工件 4最上方待加工区域 A 点时全反镜 11的位置;
(7) 往水箱 5中加入自来水, 水箱 5内液面超出工件上表面 5-10 mm;
通过激光器控制装置 2设定激光器 1 的输出脉冲能量, 光斑直径/) 以及脉冲宽度, 打开激 光器 1, 开始对工件 4进行激光冲击强化, 控制系统 13根据保存的全反镜 11完整的移动和 转动信息调节全反镜 11的运动, 完成从上到下的加工过程。
Claims
1. 一种隐藏面激光冲击强化方法, 其特征在于: 采用近似分段加工的方法, 控制系统根据 信号采集卡的信号调节设置在工件内部的全反镜的移动和转动, 使反射激光束以合适的入射 角, 即反射激光束与隐藏面待加工区域法线的夹角, 作用于隐藏面待加工区域, 从而实现隐 藏面激光冲击强化; 所述入射角的范围为 0° -30° 。
2. —种实施权利要求 1 所述的隐藏面激光冲击强化方法的装置, 包括激光器 (1)、 激光器 控制装置 (2)、 水箱 (5)、 吸收层 (6)、 夹具 (7)、 工作台 (8)、 信号采集卡 I (9)、 信号 采集卡 II (10)、 全反镜 (11)、 进给装置 (12) 和控制机构 (13); 激光器 (1) 位于最上方, 激光器控制装置 (2) 与激光器 (1)相连, 水箱 (5) 位于激光器正下方, 全反镜 (11)、 信 号采集卡 I (9) 和信号采集卡 II (10) 安装在夹具 (7) 上, 夹具 (7) 通过进给装置 (12) 与工作台 (8) 相连, 控制系统 (13) 位于水箱 (5) 夕卜, 通过信号线分别于信号采集卡 I
(9)、 信号采集卡 II (10) 以及工作台 (8) 相连; 其特征在于: 所述信号采集卡 I (9) 和 信号采集卡 Π (10) 均位于全反镜 (11) 所在平面内, 并且信号釆集卡 I (9) 和信号采集 卡 II (10) 的连线与入射激光束共面, 同时信号采集卡 I (9) 与信号采集卡 II (10) 之间 的距离等于入射激光束在全反镜 (11) 上入射点与信号采集卡 II (10) 之间的距离; 所述进 给装置 (12) 能实现夹具 (7) 的 6个自由度运动。
3.一种如权利要求 2所述的隐藏面激光冲击强化装置, 其特征在于: 所述的控制机构 (13) 能够接收信号采集卡 I (9) 和信号采集卡 II (10) 的信号并同时控制工作台 (8)、 信号采 集卡 I (9) 和信号采集卡 Π do) 的运动。
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