WO2014191533A1 - Cooling module for data processing centre - Google Patents
Cooling module for data processing centre Download PDFInfo
- Publication number
- WO2014191533A1 WO2014191533A1 PCT/EP2014/061203 EP2014061203W WO2014191533A1 WO 2014191533 A1 WO2014191533 A1 WO 2014191533A1 EP 2014061203 W EP2014061203 W EP 2014061203W WO 2014191533 A1 WO2014191533 A1 WO 2014191533A1
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- WO
- WIPO (PCT)
- Prior art keywords
- data processing
- processing centre
- cooling module
- airflow
- centre according
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
- H05K7/1497—Rooms for data centers; Shipping containers therefor
Definitions
- the present invention relates to a compact cooling module for air conditioning in the inner space of a data processing centre (DPC), which proves particularly useful in modularly built DPCs.
- DPC data processing centre
- Data processing centres are made up of large rooms or buildings, inside of which a great number of pieces of electronic equipment are concentrated, for the purpose of processing the information of a given company or organization.
- this document shows a piece of portable cooling apparatus, made up of a front face, a back face and two lateral faces, delimited by a bottom face, upon which said apparatus is supported, as well as by a top face.
- This piece of apparatus is specially designed to be housed between two rows of racks and/or special cabinets with electronic equipment, such that the heat given off by the same is collected by the front and back faces.
- the heat absorbed passes through a chilling unit made up of two chilling coils arranged vertically, the chilled airflow exiting through the top face, with the help of a number of supply fans.
- the lateral faces are configured to receive a return airflow via a number of openings made in the same, such that said return flow enters parallel to the arrangement of the chilling unit.
- This type of modular cooling apparatus presents numerous drawbacks. To begin with, the same must be implemented such that it is arranged internally between racks and/or special cabinets, which determines the design of the entire room that must be adapted to the cooling system. As a result, such apparatus is not very versatile for use in expanding or remodelling existing DPCs and furthermore limits the useful maintenance space for said racks and/or special cabinets considerably. Likewise, an external airflow cannot be collected directly through the same, since it rather requires an additional installation, next to the DPC, the aim of which is to collect said external air and treat it prior to sending it to each one of the pieces of apparatus installed in the room via the appropriate ducts. This means that, in addition to occupying more implementation space, it also limits certain building possibilities, for example arranging the modular DPCs high up, one stacked on top of the other.
- the reduced size of the piece of apparatus also affects the correct operation thereof, since the movement of airflows inside the same is not the most suitable, even more so when the return airflow enters parallel to the chilling unit.
- the cooling module of the present invention overcomes the problems set forth above with its structural and functional configuration, which enables the same to be easily assembled and adapted to all kinds of building possibilities. It is presented as a piece of compact direct free cooling equipment, i.e., providing external air directly, without using ducts. It incorporates all of the basic elements required so as to operate correctly and only requires connection to the hydraulic, electric and control circuits of the DPC itself, which furthermore has the access required for the correct maintenance thereof.
- This configuration in turn enables an internal or external arrangement relative to the DPC, at the side or on top of the same, which is flexible to the arrangement of the racks and/or special cabinets, the lateral faces of which are free, so as to facilitate the modular assembly thereof, thus proving particularly suitable for use in modular DPCs. Description of the invention
- the cooling module for a data processing centre of the present invention comprises a portable support structure, made up of a front face, a back face and two lateral faces, delimited by a bottom module support face and a top face, inside of which there is:
- a recirculation chamber configured to receive a return airflow from an inner space of a data processing centre, via a return opening
- a chilling unit configured to chill a supply airflow coming from the recirculation chamber
- one or more supply fans configured to enable the circulation of the supply airflow via the chilling unit, pushing it towards the inner space via a supply opening.
- Said cooling unit is characterised in that the recirculation chamber is configured to directly receive an external airflow coming from a space external to the data processing centre, via a duct free intake opening, i.e. without other infrastructure or ducts being necessary to provide external air. It is presented as a cooling module, assembled modularly, which is particularly suitable for use in modular DPCs.
- the return opening is arranged on one of the front, bottom or top faces.
- the supply opening is arranged on one of the front or bottom faces, whilst the intake opening is arranged on one of the back or top faces.
- the lateral faces are therefore free and prove particularly useful in facilitating the lateral assembly of the modules, occupying the minimum amount of space possible.
- the faces of the cooling module have built in openings and/or enclosures, formed with the most appropriate materials, so as to guarantee that the same is rigid enough sealed tightly enough.
- the back face comprises: ⁇ hydraulic connections pertaining to the chilling unit; • electrical power and control connections; and
- cooling module is also presented as a piece of compact equipment, with all the basic elements required for the correct operation thereof being built in to it. These comprise or may comprise:
- the air filters are a basic element, which prevent dust and pollution from reaching the racks and/or special cabinets, containing the pieces of electronic equipment used to process the information. In order to provide greater security, they may be located in the prevision opening itself and/or before the chilling unit, filters of the G4 and F7 varieties, amongst others, being used, for example.
- the auxiliary adiabatic cooling system increases the humidity of the external air, chilling the air by means of adiabatic effect. This is achieved by means of atomizing water into small droplets, which evaporate spontaneously, absorbing some of the heat from said external air.
- a humidification system may be built in, inside the adiabatic cooling system itself, operating with traditional cooling and closed external airflow.
- All of the openings are preferably equipped with the corresponding passage grid, except in specific applications, for example, when supplying air via a raised floor, in air returns or extractions via a false or covered ceiling, etc.
- the cooling module is compatible with the most common cooling systems, i.e. cooling water (CW) or direct expansion (DX).
- the chilling units are chosen between water chilling coils and gas chilling coils. Table 1 illustrates a comparative example of both systems, for a specific 75kW cooling capacity case.
- the cooling module is specially designed to carry out direct free cooling (DFC) of the data processing centre.
- DFC direct free cooling
- a recirculation chamber which comprises:
- the chilling unit comprises a passive air-air exchanger, which has a first exchanger portion arranged in the first chamber and a second exchanger portion arranged in the second chamber.
- Said cooling module meanwhile comprises one or more intake fans, configured to enable the external airflow to circulate via the second exchanger portion and to expel the same towards the external space via an extraction opening. This prevents any risk of pollution and dirt in the DPC, without sacrificing the use of external air to reduce the installation's energy consumption.
- Figure 1 A is a plan view of the cooling module of the present invention.
- Figure IB is an elevation view along line A- A of figure 1 A.
- Figure 1C is a front view of figure 1A.
- Figure ID is a back view of figure 1 A.
- Figure 2A is a plan view in section along line C-C of figure 2B, for a first embodiment of the present invention.
- Figure 2B is an elevation view in section along line B-B of figure 2A.
- Figure 3A is a plan view in section along line E-E of figure 3B, for a second embodiment of the present invention.
- Figure 3B is an elevation view in section along line D-D of figure 3A.
- Figure 4A is a plan view in section along line G-G of figure 4B for a third embodiment of the present invention.
- Figure 4B is an elevation view in section along line F-F of figure 4A.
- Figure 5 A is a plan view in section along line I-I of figure 5B for a fourth embodiment of the present invention.
- Figure 5B is an elevation view in section along line H-H of figure 5A.
- FIGS 1A-1D represent different views of the cooling module (1) for a data processing centre of the present invention.
- said module comprises a portable support structure (10), made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom module (1) support face (14) and by a top face (15), inside which there is:
- a recirculation chamber (20) configured to receive a return airflow (2) coming from an inner space of a data processing centre, via a return opening (21);
- a chilling unit which may be a water chilling coil or a gas chilling coil, configured to chill a supply airflow (3) coming from the recirculation chamber (20);
- Said cooling module (1) is characterised in that the recirculation chamber (20) is configured to directly receive an external airflow (4) coming from a space external to the data processing centre, via a duct free intake opening (22).
- the return opening (21) is arranged on the front face (11).
- the supply opening (32) is also arranged on the front face (11), whilst the intake opening (22) is arranged on the back face (12).
- the lateral faces (13) remain free, proving particularly useful in facilitating the lateral assembly of the modules and occupying the minimum amount of space possible.
- the back face (12) comprises:
- cooling module (1) is also presented as a piece of compact equipment, with all the basic elements required for the correct operation thereof being built in to it, these comprising:
- FIGS 2A and 2B are two sectioned views, corresponding to a first embodiment of the present invention.
- four cooling modules (1) are built into a modularly built data processing centre in a modular way.
- the modules (1) are arranged laterally, assembled by their lateral faces (13), with the back face (12) thereof stuck to an inner end of the DPC, from which external air (4) is collected.
- the front face (11) is directed towards the racks and/or special cabinets inside the inner space of the DPC.
- the cooling modules (1) carry out direct free cooling of the DPC.
- FIG. 3 A and 3B are two sectioned views corresponding to a second embodiment of the present invention.
- the cooling modules (1) are configured to carry out indirect cooling, still directly receiving an external airflow (4) coming from a space external to the data processing centre. This is achieved using a recirculation chamber (20), comprising:
- a first chamber (20a) configured to receive the return airflow (2); and • a second chamber (20b), configured to receive the external airflow (4).
- the chilling unit (40) comprises a passive air-air exchanger, which has a first exchanger portion (40a) arranged in the first chamber (20a) and a second exchanger portion (40b) arranged in the second chamber (20b).
- Said cooling module (1) meanwhile comprises an intake fan (33), configured to enable the external airflow (4) to circulate via the second exchanger portion (40b) and to expel it towards the external space via an extraction opening (34).
- the supply is provided via a raised floor.
- FIGS 4A and 4B are two sectioned views corresponding to a third embodiment of the present invention.
- four cooling modules (1) are built into a modularly built data processing centre in a modular way.
- the modules (1) are arranged laterally, assembled by their lateral faces (13), with the front face (11) thereof stuck to an external end of the DPC, from which the supply air (3) is introduced.
- the cooling modules (1) carry out direct free cooling of the DPC.
- FIGS 5 A and 5B are two sectioned views, corresponding to a fourth embodiment of the present invention.
- the cooling modules (1) are configured to carry out indirect cooling, still directly receiving an external airflow (4) coming from a space external to the data processing centre.
- the cooling modules (1) have a built in modularly built data processing centre integrated in a modular way.
- the modules (1) are arranged laterally, assembled by their lateral faces (13), with their lower face (14) arranged on the ceiling of the of the DPC. Both the supply and return are carried out via the lower face (14).
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- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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Abstract
A cooling module for a data processing centre, comprising a portable support structure (10), inside which a recirculation chamber (20) is located, configured to receive a return airflow (2) coming from an inner space, via a return opening (21), a chilling unit (40) configured to chill a supply airflow (3) coming from the recirculation chamber (20) and one or more supply fans (31), configured to enable the circulation of supply airflow (3) via the chilling unit (40), pushing it towards the inner space via a supply opening (32). The recirculation chamber (20) is configured to directly receive an external airflow(4) coming from an external space, via a duct free intake opening (22).
Description
COOLING MODULE FOR DATA PROCESSING CENTRE
DESCRIPTION
Field of the invention
The present invention relates to a compact cooling module for air conditioning in the inner space of a data processing centre (DPC), which proves particularly useful in modularly built DPCs.
Background of the invention
Data processing centres (DPCs) are made up of large rooms or buildings, inside of which a great number of pieces of electronic equipment are concentrated, for the purpose of processing the information of a given company or organization.
The rising demand for new DPCs or increasingly more often, for expanding those already in place, has led to the creation of so-called modular data processing centres. They aim to make the same easier to build, speeding up their implementation and optimizing the available space as much as possible.
With reference to the current state of the art, it is possible to observe that the same modularity has not always been used when implementing a piece of basic operational infrastructure into this constructive modularity and more specifically, when implementing the air conditioning systems in the inner space of the DPC needed to absorb the vast amount of heat generated by the pieces of electronic equipment installed therein. Therefore, once the modular data processing centre has been constructed, pieces of conventional cooling equipment or cooling systems are usually installed. These do not facilitate the assembly thereof very much, if at all and do not optimize the available space, also presenting significant drawbacks in terms of expanding existing DPCs.
Document US2013/0107448A1 shows a piece of modular cooling apparatus for
DPCs, which aims to resolve some of the abovementioned problems. More specifically, this document shows a piece of portable cooling apparatus, made up of a front face, a back face and two lateral faces, delimited by a bottom face, upon which said apparatus is supported, as well as by a top face. This piece of apparatus is specially designed to be housed between two rows of racks and/or special cabinets with electronic equipment, such that the heat given off by the same is collected by the front and back faces. Once inside, the heat absorbed passes through a chilling unit made up of two chilling coils arranged vertically, the chilled airflow exiting through the top face, with the help of a number of supply fans. Meanwhile, the lateral faces are configured to receive a return airflow via a number of openings made in the same, such that said return flow enters
parallel to the arrangement of the chilling unit.
This type of modular cooling apparatus presents numerous drawbacks. To begin with, the same must be implemented such that it is arranged internally between racks and/or special cabinets, which determines the design of the entire room that must be adapted to the cooling system. As a result, such apparatus is not very versatile for use in expanding or remodelling existing DPCs and furthermore limits the useful maintenance space for said racks and/or special cabinets considerably. Likewise, an external airflow cannot be collected directly through the same, since it rather requires an additional installation, next to the DPC, the aim of which is to collect said external air and treat it prior to sending it to each one of the pieces of apparatus installed in the room via the appropriate ducts. This means that, in addition to occupying more implementation space, it also limits certain building possibilities, for example arranging the modular DPCs high up, one stacked on top of the other.
Other problems highlighted are more closely related to the structural and functional configuration of the piece of apparatus itself. Therefore, the arrangement of the main elements thereof relative to the faces thereof makes it really difficult to maintain. This means that, in addition to the internal arrangement between racks and/or special cabinets mentioned above, it does not leave space in which to access the same, other than the top face thereof, upon which the supply fans are located. Likewise, said arrangement between racks and/or special cabinets means it must be reduced in size, thus meaning that the piece of apparatus cannot incorporate all of the elements needed so as to operate correctly, leaving the pieces of hydraulic and/or cooling equipment, electrical power and control cabinets, auxiliary air conditioning elements (adiabatic cooling systems, electrical heat resistors, airflow regulation valves etc.), outside these pieces of equipment. The reduced size of the piece of apparatus also affects the correct operation thereof, since the movement of airflows inside the same is not the most suitable, even more so when the return airflow enters parallel to the chilling unit. These aspects call the true level of modularity of these pieces of apparatus into question.
The cooling module of the present invention overcomes the problems set forth above with its structural and functional configuration, which enables the same to be easily assembled and adapted to all kinds of building possibilities. It is presented as a piece of compact direct free cooling equipment, i.e., providing external air directly, without using ducts. It incorporates all of the basic elements required so as to operate correctly and only requires connection to the hydraulic, electric and control circuits of the DPC itself, which furthermore has the access required for the correct maintenance
thereof. This configuration in turn enables an internal or external arrangement relative to the DPC, at the side or on top of the same, which is flexible to the arrangement of the racks and/or special cabinets, the lateral faces of which are free, so as to facilitate the modular assembly thereof, thus proving particularly suitable for use in modular DPCs. Description of the invention
The cooling module for a data processing centre of the present invention comprises a portable support structure, made up of a front face, a back face and two lateral faces, delimited by a bottom module support face and a top face, inside of which there is:
· a recirculation chamber, configured to receive a return airflow from an inner space of a data processing centre, via a return opening;
• a chilling unit, configured to chill a supply airflow coming from the recirculation chamber; and
• one or more supply fans, configured to enable the circulation of the supply airflow via the chilling unit, pushing it towards the inner space via a supply opening.
Said cooling unit is characterised in that the recirculation chamber is configured to directly receive an external airflow coming from a space external to the data processing centre, via a duct free intake opening, i.e. without other infrastructure or ducts being necessary to provide external air. It is presented as a cooling module, assembled modularly, which is particularly suitable for use in modular DPCs.
This makes it possible to carry out direct free cooling (DFC) of the data processing centre.
In order to facilitate the modular assembly of the cooling module, the return opening is arranged on one of the front, bottom or top faces. In turn, the supply opening is arranged on one of the front or bottom faces, whilst the intake opening is arranged on one of the back or top faces. The lateral faces are therefore free and prove particularly useful in facilitating the lateral assembly of the modules, occupying the minimum amount of space possible. Likewise, the faces of the cooling module have built in openings and/or enclosures, formed with the most appropriate materials, so as to guarantee that the same is rigid enough sealed tightly enough.
Meanwhile, so as to facilitate the installation, subsequent maintenance tasks and habitual use of the cooling module, the majority of connections and pieces of equipment are concentrated on the back face of the same, since it is considered the most accessible, so as to facilitate the correct operation thereof. To this end, the back face comprises: · hydraulic connections pertaining to the chilling unit;
• electrical power and control connections; and
• an electrical power and control cabinet.
Likewise, the cooling module is also presented as a piece of compact equipment, with all the basic elements required for the correct operation thereof being built in to it. These comprise or may comprise:
• one or more air filters configured to receive a supply airflow;
• an auxiliary adiabatic cooling system, for instances in which an additional cold supply is required;
• an auxiliary electrical heat resistor, for instances in which an additional heat supply is required;
• a first return airflow regulation valve, which is next to the return opening; and/or
• a second external airflow regulation valve, which is next to the intake opening.
The air filters are a basic element, which prevent dust and pollution from reaching the racks and/or special cabinets, containing the pieces of electronic equipment used to process the information. In order to provide greater security, they may be located in the prevision opening itself and/or before the chilling unit, filters of the G4 and F7 varieties, amongst others, being used, for example.
The auxiliary adiabatic cooling system increases the humidity of the external air, chilling the air by means of adiabatic effect. This is achieved by means of atomizing water into small droplets, which evaporate spontaneously, absorbing some of the heat from said external air. In addition, a humidification system may be built in, inside the adiabatic cooling system itself, operating with traditional cooling and closed external airflow.
All of the openings are preferably equipped with the corresponding passage grid, except in specific applications, for example, when supplying air via a raised floor, in air returns or extractions via a false or covered ceiling, etc.
The cooling module is compatible with the most common cooling systems, i.e. cooling water (CW) or direct expansion (DX). The chilling units are chosen between water chilling coils and gas chilling coils. Table 1 illustrates a comparative example of both systems, for a specific 75kW cooling capacity case.
TABLE I
Setting DFC-CW DFC-DX
Cooling capacity (kW) 75 75
Module weight (kg) 850 800
Width (m) 1.25 1.25
In accordance with the configuration described, the cooling module is specially designed to carry out direct free cooling (DFC) of the data processing centre. This is of particular interest when reducing the high energy consumption usually linked to conditioning systems for air in the inner space of the DPCs.
Nevertheless, in accordance with a particular embodiment of the present invention, it is also possible to configure the cooling module to carry out indirect cooling, whilst still directly receiving an external airflow coming from a space external to the data processing centre. This is achieved using a recirculation chamber, which comprises:
• a first chamber configured to receive the return airflow; and
• a second chamber configured to receive the external airflow.
Said first and second chambers are separated from one another, in order to prevent cross contamination of the air between the return airflow and external airflow. Likewise, the chilling unit comprises a passive air-air exchanger, which has a first exchanger portion arranged in the first chamber and a second exchanger portion arranged in the second chamber. Said cooling module meanwhile comprises one or more intake fans, configured to enable the external airflow to circulate via the second exchanger portion and to expel the same towards the external space via an extraction opening. This prevents any risk of pollution and dirt in the DPC, without sacrificing the use of external air to reduce the installation's energy consumption.
Brief description of the drawings
What follows is a very brief description of a series of drawings that aid in better understanding the invention, which are expressly related to one embodiment of said
invention, presented by way of a non-limiting example of the same.
Figure 1 A is a plan view of the cooling module of the present invention.
Figure IB is an elevation view along line A- A of figure 1 A.
Figure 1C is a front view of figure 1A.
Figure ID is a back view of figure 1 A.
Figure 2A is a plan view in section along line C-C of figure 2B, for a first embodiment of the present invention.
Figure 2B is an elevation view in section along line B-B of figure 2A.
Figure 3A is a plan view in section along line E-E of figure 3B, for a second embodiment of the present invention.
Figure 3B is an elevation view in section along line D-D of figure 3A.
Figure 4A is a plan view in section along line G-G of figure 4B for a third embodiment of the present invention.
Figure 4B is an elevation view in section along line F-F of figure 4A.
Figure 5 A is a plan view in section along line I-I of figure 5B for a fourth embodiment of the present invention.
Figure 5B is an elevation view in section along line H-H of figure 5A.
Detailed description of the invention
Figures 1A-1D represent different views of the cooling module (1) for a data processing centre of the present invention. As can be seen, said module comprises a portable support structure (10), made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom module (1) support face (14) and by a top face (15), inside which there is:
• a recirculation chamber (20) configured to receive a return airflow (2) coming from an inner space of a data processing centre, via a return opening (21);
• a chilling unit (40), which may be a water chilling coil or a gas chilling coil, configured to chill a supply airflow (3) coming from the recirculation chamber (20); and
• two supply fans (31) configured to enable the supply airflow (3) to circulate via the chilling unit (40), pushing it towards the inner space via a supply opening (32).
Said cooling module (1) is characterised in that the recirculation chamber (20) is configured to directly receive an external airflow (4) coming from a space external to the data processing centre, via a duct free intake opening (22).
In order to facilitate the modular assembly of the cooling module (1), the return opening (21) is arranged on the front face (11). In turn, the supply opening (32) is also
arranged on the front face (11), whilst the intake opening (22) is arranged on the back face (12). In this way, the lateral faces (13) remain free, proving particularly useful in facilitating the lateral assembly of the modules and occupying the minimum amount of space possible.
At the same time, in order to facilitate the installation, subsequent maintenance tasks and habitual use of the cooling module (1), the majority of connections and pieces of equipment are concentrated on the back face (12) of the same, since it is considered the most accessible, in order to facilitate correct operation thereof. To this end, the back face (12) comprises:
· hydraulic connections (17) pertaining to the chilling unit (3);
• electrical power and control connections (18); and
• an electrical power and control cabinet (19).
Likewise, the cooling module (1) is also presented as a piece of compact equipment, with all the basic elements required for the correct operation thereof being built in to it, these comprising:
• an air filter (23) configured to receive the supply airflow (3);
• an auxiliary adiabatic cooling system (24);
• an auxiliary electrical heat resistor (25);
• a first return airflow (2) regulation valve (26), which is next to the return opening (21); and
• a second external airflow (4) regulation valve (27), which is next to the intake opening (22).
Figures 2A and 2B are two sectioned views, corresponding to a first embodiment of the present invention. As can be seen, four cooling modules (1) are built into a modularly built data processing centre in a modular way. The modules (1) are arranged laterally, assembled by their lateral faces (13), with the back face (12) thereof stuck to an inner end of the DPC, from which external air (4) is collected. The front face (11) is directed towards the racks and/or special cabinets inside the inner space of the DPC. As can been seen, the cooling modules (1) carry out direct free cooling of the DPC.
Figure 3 A and 3B are two sectioned views corresponding to a second embodiment of the present invention. In this case, the cooling modules (1) are configured to carry out indirect cooling, still directly receiving an external airflow (4) coming from a space external to the data processing centre. This is achieved using a recirculation chamber (20), comprising:
· a first chamber (20a) configured to receive the return airflow (2); and
• a second chamber (20b), configured to receive the external airflow (4).
Said first (20a) and second (20b) chambers are separated from one another, in order to prevent cross contamination of the air, between the return airflow (2) and the external airflow (4). Likewise, the chilling unit (40) comprises a passive air-air exchanger, which has a first exchanger portion (40a) arranged in the first chamber (20a) and a second exchanger portion (40b) arranged in the second chamber (20b). Said cooling module (1) meanwhile comprises an intake fan (33), configured to enable the external airflow (4) to circulate via the second exchanger portion (40b) and to expel it towards the external space via an extraction opening (34).
As can be seen, in this case, the supply is provided via a raised floor.
Figures 4A and 4B are two sectioned views corresponding to a third embodiment of the present invention. As can be seen, four cooling modules (1) are built into a modularly built data processing centre in a modular way. The modules (1) are arranged laterally, assembled by their lateral faces (13), with the front face (11) thereof stuck to an external end of the DPC, from which the supply air (3) is introduced. As can be seen, the cooling modules (1) carry out direct free cooling of the DPC.
Figures 5 A and 5B are two sectioned views, corresponding to a fourth embodiment of the present invention. In this case, the cooling modules (1) are configured to carry out indirect cooling, still directly receiving an external airflow (4) coming from a space external to the data processing centre. As can be seen, the cooling modules (1) have a built in modularly built data processing centre integrated in a modular way. The modules (1) are arranged laterally, assembled by their lateral faces (13), with their lower face (14) arranged on the ceiling of the of the DPC. Both the supply and return are carried out via the lower face (14).
Claims
1. - A cooling module for a data processing centre, comprising a portable support structure (10) made up of a front face (11), a back face (12) and two lateral faces (13), delimited by a bottom module (1) support face (14) and by a top face (15), inside of which there is:
• a recirculation chamber (20) configured to receive a return airflow (2) coming from an inner space of a data processing centre, via a return opening (21);
• a chilling unit (40) configured to chill a supply airflow (3) coming from the recirculation chamber (20); and
• one or more supply fans (31), configured to facilitate the circulation of the supply airflow (3) via the chilling unit (40), pushing it towards the inner space via a supply opening (32);
said module (1) being characterised in that the recirculation chamber (20) is configured to directly receive an external airflow (4) coming from a space external to the data processing centre, via a duct free intake opening (22).
2. - The cooling module for a data processing centre according to claim 1, characterised in that the return opening (21) is arranged on one of the front (11) or bottom faces (14) and in that the supply opening (32) is arranged on one of the front (11) or bottom (14) faces and in that the intake opening (22) is arranged on the back face (12), the lateral faces (13) remaining free.
3. - The cooling module for a data processing centre according to any of the claims 1 to 2, characterised in that the back face (12) comprises a maintenance access
(16).
4. - The cooling module for a data processing centre according to any of the claims 1 to 3, characterised in that the back face (12) comprises hydraulic connections (17) pertaining to the chilling unit (3).
5. - The cooling module for a data processing centre according to any of the claims 1 to 4, characterised in that the back face (12) comprises electrical power and control connections (18).
6. - The cooling module for a data processing centre according to any of the claims 1 to 5, characterised in that the back face (12) comprises an electrical power and control cabinet (19).
7. - The cooling module for a data processing centre according to any of the claims 1 to 6, characterised in that it comprises an air filter (23), configured to receive a supply airflow (3).
8. - The cooling module fora data processing centre according to any of the claims 1 to 7, characterised in that it comprises an auxiliary adiabatic cooling system
(24) .
9. - The cooling module for a data processing centre according to any of the claims 1 to 8, characterised in that it comprises an auxiliary electrical heat resistor
(25) .
10. - The cooling module for a data processing centre according to any of the claims 1 to 9, characterised in that it comprises a first return airflow (2) regulation valve (26), which is next to the return opening (21).
11. - The cooling module for a data processing centre according to any of the claims 1 to 10, characterised in that it comprises a second external airflow (4) regulation valve (27), which is next to the intake opening (22).
12. - The cooling module for a data processing centre according to any of the claims 1 to 11, characterised in that the recirculation chamber (20) comprises:
• a first chamber (20a) configured to receive the return airflow (2); and
• and a second chamber (20b) configured to receive the external airflow (4);
the first (20a) and second (20b) chambers being separated from one another, in order to prevent cross contamination of the air between the return airflow (2) and the external airflow (4).
13. - The cooling module for a data processing centre according to claim 12, characterised in that the chilling unit (40) comprises a passive air-air exchanger, which has a first exchanger portion (40a) arranged in the first chamber (20a) and a
second exchanger portion (40b) arranged in the second chamber (20b).
14. - The cooling module for a data processing centre, according to claim 13, characterised in that it comprises one or more intake fans (33), configured to enable to circulation of the external airflow (4) via the second exchanger portion (40b) and to expel the same towards the external space, via an extraction opening (34).
15. - The cooling module for a data processing centre according to any of the claims 1 to 12, characterised in that the chilling unit (3) is selected from a water chilling coil and a gas chilling coil.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ESP201330800 | 2013-05-31 | ||
ES201330800A ES2523805B1 (en) | 2013-05-31 | 2013-05-31 | Cooling module for data processing center |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014191533A1 true WO2014191533A1 (en) | 2014-12-04 |
Family
ID=50884904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2014/061203 WO2014191533A1 (en) | 2013-05-31 | 2014-05-29 | Cooling module for data processing centre |
Country Status (2)
Country | Link |
---|---|
ES (1) | ES2523805B1 (en) |
WO (1) | WO2014191533A1 (en) |
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EP3241418A4 (en) * | 2014-12-30 | 2018-07-18 | Dale Lefebvre | Data center heat removal systems and methods |
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CN109963447A (en) * | 2019-04-25 | 2019-07-02 | 魏新文 | A kind of electric power electric cabinet of dust-proof radiating |
Also Published As
Publication number | Publication date |
---|---|
ES2523805B1 (en) | 2015-09-29 |
ES2523805A1 (en) | 2014-12-01 |
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