WO2014189707A1

WO2014189707A1 - Optomechanical body, modular optomechanical device, optic module, modular optic device, kit and methods

Info

Publication number: WO2014189707A1
Application number: PCT/US2014/037765
Authority: WO
Inventors: Russell Allen ELMS; Wei RONG; Jacob W. STEINBRECHER; Michael Raymond STRONG
Original assignee: Dow Corning Corporation
Priority date: 2013-05-20
Filing date: 2014-05-13
Publication date: 2014-11-27
Also published as: TW201502566A

Abstract

An optomechanical body comprising a shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the optomechanical body. Also, a modular optomechanical device, an optic module, modular optic device, kit, and methods.

Description

OPTOMECHANICAL BODY, MODULAR OPTOMECHANICAL DEVICE, OPTIC MODULE, MODULAR OPTIC DEVICE, KIT AND METHODS

[0001] This invention comprises an optomechanical body, a modular optomechanical device, an optic module, a modular optic device, a kit, and ad rem methods.

[0002] We (the present inventors) have discovered or recognized technical problems with transmitting light across an interface between two directly touching plastic (organic polymer) or glass parts. Direct contact alone between opposing surfaces of such parts has defined an imperfect optical interface. That is, the opposing surfaces between directly contacting plastic or glass parts form an interacting region that has "dead spots" where little or no light is transmitted thereacross. These dead spots interfere with light conduction from one such part to another part via the interface. Even with close tolerances of the opposing surfaces, significant decreases in optical transmission occur across the interface between directly touching plastic or glass parts.

[0003] A silicone composition for producing transparent silicone materials and optical devices is described in US 2012/0065343 A1 . The silicone composition, and a cured product thereof, is useful in optical devices such as charged coupled devices (CCDs), light emitting diodes (LEDs), lightguides, optical cameras, photo-joiners, and waveguides. Processes for fabricating the optical devices include various molding techniques.

[0004] Our effort to solve the problem of increasing transmission of light across an interface between two touching parts has led to the technical solution described herein. We believe that our technical solution is not taught, disclosed, or suggested in the art.

BRIEF SUMMARY OF THE INVENTION

[0005] This invention comprises an optomechanical body and devices, kit and method using same, The devices include a modular optomechanical device comprising at least two optomechanical bodies; an optic module comprising the optomechanical body and at least one light element; a modular optic device comprising at least two optic modules, i.e., comprising at least two optomechanical bodies, at least one of which includes at least one light element; a kit comprising components of the modular optic device and instructions for assembling same; and ad rem methods of making and using the foregoing. Embodiments of the invention include:

[0006] An optomechanical body comprising a shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the joining portion of the optomechanical body when the optomechanical body is mechanically joined with a complementary joining portion of another optomechanical body.

[0007] A modular optomechanical device comprising first and second optomechanical bodies, wherein each of the first and second optomechanical bodies independently is as described above; wherein the first and second optomechanical bodies each have at least one complementary joining portion, wherein the first optomechanical body is mechanically joined and optically coupled to the second optomechanical body via their respective complementary joining portions.

[0008] An optic module comprising the optomechanical body and at least one light element disposed in operative contact with the housing portion of the optomechanical body.

[0009] A modular optic device comprising optically-and-mechanically-joined first and second optic modules, wherein the first optic module comprises a first optomechanical body and at least one light element, the first optomechanical body comprising a first shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the first optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the at least one joining portion of the first optomechanical body; wherein the second optic module comprises a second optomechanical body, the second optomechanical body comprising a shaped silicate glass, a shaped transparent organic polymer, or a second shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the second optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the at least one joining portion of the second optomechanical body with the exterior surface of the at least one joining portion of the first optomechanical body of the first optic module; and wherein at least one joining portion of the first optomechanical body of the first optic module is mechanically joined to at least one joining portion of the second optomechanical body of the second optic module and the exterior surface of the alt least one joining portion of the first optomechanical body opposes and contacts the exterior surface of the at least one joining portion of the second optomechanical body such that there is a mechanical joint and effective optical interface between the first and second optic modules.

[0010] A kit comprising the components of the modular optic device and instructions for assembling same to give the modular optic device.

[0011] A method of manufacturing the modular optomechanical device, the method comprising shaping a curable polyorganosiloxane composition to give a shaped curable polyorganosiloxane composition and curing the shaped curable polyorganosiloxane composition to give a shaped and cured product as the first optomechanical body; repeating the shaping and curing steps with a same or different curable polyorganosiloxane composition to give a shaped and cured product as the second optomechanical body, wherein the shape of the first and second optomechanical bodies may be the same or different and wherein the first optomechanical body has at least one joining means capable of forming a mechanical joint with a joining means of the second optomechanical body; and mechanically joining the first and second optomechanical bodies via the mechanical joint so as to effectively optically couple them and give the modular optomechanical device.

[0012] A modular optic device comprising optically-and-physically-joined first and second optic modules, wherein each of the first and second optomechanical bodies independently is as described above; and the shaped polyorganosiloxane of the optomechanical body of the first optic module is in physical contact with the shaped polyorganosiloxane of the optomechanical body of the second optic module such that such that there is an optophysical joint and effective optical interface between the first and second optic modules.

[0013] The method is useful preparing the modular optomechanical device. The optomechanical body is useful for preparing the optic module. A single optic module is useful as a lighting appliance for illuminating a surface or space. The modular optomechanical device, plurality of optic modules and the kit are useful for preparing the modular optic device. The modular optic device is useful as a modular lighting appliance for illuminating a surface or space. The invention may have additional uses, including those unrelated to lighting applications for illuminating a surface or space.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Embodiments of the invention and certain advantages may be illustrated and described by referring to the accompanying drawings.

[0015] Figure (Fig.) 1 a is a partial plan view of an embodiment of the optomechanical body.

[0016] Fig. 1 b is a partial plan view of another embodiment of the optomechanical body.

[0017] Fig. 1 c is a partial plan view of still another embodiment of the optomechanical body.

[0018] Fig. 2 is a plan view of still another embodiment of the optomechanical body.

[0019] Fig. 3 is a plan view of still another embodiment of the optomechanical body.

[0020] Fig. 4 is a perspective view of another embodiment of the optomechanical body.

[0021] Fig. 5 is a perspective view of an embodiment of the modular optomechanical device.

[0022] Fig. 6 is a perspective view of still another embodiment of the optomechanical body. [0023] Fig. 7 is a perspective view of still another embodiment of the optomechanical body.

[0024] Fig. 8 is a perspective view of another embodiment of the modular optomechanical device.

DETAILED DESCRIPTION OF THE INVENTION

[0025] The Brief Summary and Abstract are incorporated here by reference. The invention includes, but is not limited to, the embodiments summarized above. The invention also includes other embodiments described below and in the drawings.

[0026] The invention has technical and non-technical advantages. We found that the optomechanical body made of the shaped polyorganosiloxane has a mechanical joining portion that is capable of joining to a complementary joining portion(s) of one or more other optomechanical bodies so as to form the modular optomechanical device having a mechanical joint that effectively optically couples the optomechanical bodies together. When the modular optomechanical device further comprises at least one light element in operative contact with at least one optomechanical body, the resulting modular optic device of this invention having the effective optical coupling is obtained. The mechanical joining of the shaped polyorganosiloxane with another shaped polyorganosiloxane provides the effective optical coupling without the need of an intermediary layer of optical coupling agent, although if desired such an agent may be used to enhance such effective optical coupling in the modular devices. The mechanical joining of the shaped polyorganosiloxane works to form the effective optical coupling even when the shaped polyorganosiloxane is mechanically joined to the shaped silicate glass, alternatively the shaped transparent organic polymer in the modular devices. Further, the invention optomechanical bodies and optic modules of the modular devices will remain optically coupled to each other even when exposed to shaking or vibrating conditions. Further, the modular optomechanical device and modular optic device of this invention may be assembled by a method that lacks a step of applying and/or curing an adhesive between optic modules. The low surface energy and high wetting property of the shaped polyorganosiloxane, which in typical uses causes problems such as increased dust pick-up, may be partly responsible, along with the transparent or light transmitting characteristic of the shaped polyorganosiloxane, for the beneficial optical coupling by mechanical joining feature of the present invention. Unpredictably, the shaped polyorganosiloxane material enables optical coupling by mechanical joining means and without dead spots at the interface between the optomechanical bodies of the modular optomechanical device or between the optic modules of the modular optic device. [0027] Beneficially, the modular aspect of the modular optomechanical device and the modular optic device enables these modular bodies and devices to be designed in a wide variety of different shapes and sizes that are not possible by molding the modular bodies or devices as a single unit. For example, the modular devices can be made in sizes that are too large to be obtained in a single work piece from current extrusion or molding methods, and thus larger modular devices may be obtained while maintaining the effective optical coupling between their optomechanical bodies and optic modules. The modular devices may be made in virtually any size or length by fitting together a sufficient number of optomechanical bodies or optic modules. Also, the modular aspect of the modular devices enables different device designs to be made from any given set of components of the kit.

[0028] Certain aspects of this invention may independently solve additional problems and/or have other advantages.

[0029] As used herein the term "effective optical coupling" means a light transmitting through an interface lacking dead spots. Emit means to generate or give off from a source. Light means electromagnetic waves in the infrared, visible, or ultraviolet spectrum; alternatively infrared or visible spectrums; alternatively infrared and visible spectrums; alternatively visible or ultraviolet spectrums; alternatively visible and ultraviolet spectrums; alternatively at least the visible light spectrum.

[0030] The term "mechanical joining" means an interlocking and direct physical touching of two parts via a joining portion of one part and a complementary joining portion of the other part, wherein the joining portions of the parts interlock (as in a plug-and-receptacle mechanical joint) or wherein the joining portions of the parts are receptacles that directly touch each other and interlock via a commonly shared third part (as in a three-piece mechanical joint such as a 3-piece dovetail joint). The mechanical joints are described later. Mechanical joining excludes butt coupling (end-to-end non-mechanical contact facilitating optical coupling) and mechanical coupling, which is used to transfer work or kinetic energy between mechanically coupled parts. The "mechanical joint and effective optical interface" means a light-interacting region between two complementary-shaped, mechanically-joined devices that enables passage of light between the devices via the interacting region without dead spots in the interacting region. The "optophysical joint" means not mechanically joined but merely in either direct physical contact (e.g., as in a butt joint), indirect physical contact via an intermediary optical coupling agent disposed between that which are optophysically joined, or both the direct and indirect physical contact. [0031] Some invention embodiments and advantages may be illustrated in the accompanying drawings and/or described herein. In the Figure(s), like numerals indicate like parts throughout.

[0032] Fig. 1 a is a partial plan view of an embodiment of the optomechanical body. In Fig. 1 a, optomechanical body 10A comprises post joining portion 1 1 , housing portion 15, and post-shaped aperture joining portion 19. A middle portion of housing portion 15 has been omitted in this partial view. The length of housing portion 15 relative to joining portions 1 1 and 19 is similar to the relative length of housing portion 66 in Fig. 6. In Fig. 1 a, the post joining portion 1 1 and post-shaped aperture joining portion 19 are disposed vertically, but may be disposed horizontally or in-between vertical and horizontal.

[0033] Fig. 1 b is a partial plan view of another embodiment of the optomechanical body. In Fig. 1 b, optomechanical body 20 comprises arrowhead joining portion 21 , housing portion 25, and arrowhead-shaped aperture joining portion 29. A middle portion of housing portion 25 has been omitted. The length of housing portion 25 relative to joining portions 21 and 29 is similar to the relative length of housing portion 66 in Fig. 6. The arrowhead and arrowhead-shaped aperture joining portions 21 and 29 may be 2-dimensional, alternatively the arrowhead shape may be extended through 360 degrees to form an arrowhead plug and corresponding shaped aperture.

[0034] Fig. 1 c is a partial plan view of still another embodiment of the optomechanical body. In Fig. 1 c, optomechanical body 30 comprises button joining portion 31 , housing portion 35, and button-shaped aperture joining portion 39. Housing portion 35 is shown in partial view. A middle portion of housing portion 35 has been omitted. The length of housing portion 35 relative to joining portions 31 and 39 is similar to the relative length of housing portion 66 in Fig. 6. The button and button-shaped aperture joining portions 31 and 39 may be 2- dimensional, alternatively the button shape may be extended through 360 degrees to form a button plug and corresponding shaped aperture.

[0035] Fig. 2 is a plan view of still another embodiment of the optomechanical body. In Fig. 2, optomechanical body 40 comprises post joining portions 41 and 42, housing portion 45, and post-shaped aperture joining portions 48 and 49. Optomechanical body 40 may be used to intersect, in housing portion 45, two light beams entering optomechanical body 40 via any two of post joining portions 41 and 42 and post-shaped aperture joining portions 48 and 49, light beams which may then exit optomechanical body 40 via housing portion 45 and/or any two of post joining portions 41 and 42 and post-shaped aperture joining portions 48 and 49. [0036] Fig. 3 is a view of still another embodiment of the optomechanical body. In Fig. 3, optomechanical body 50 comprises post joining portions 51 and 52, housing portion 55, and post-shaped aperture joining portion 54. Optomechanical body 50 may be used to combine or merge, in housing portion 55, two light beams entering optomechanical body 50 via post joining portions 51 and 52 into a single light beam, which may then exit optomechanical body 50 via housing portion 55 and/or post-shaped aperture joining portion 54. Alternatively, optomechanical body 50 may be used to split, in housing portion 55, a single light beam entering optomechanical body 50 via post-shaped aperture joining portion 54 into two light beams, which may then independently exit optomechanical body 50 via post joining portions 51 and 52 and/or housing portion 55.

[0037] Fig. 4 is a perspective view of an embodiment of the optomechanical body. In Fig. 4, optomechanical body 10 comprises six recessed portions (not indicated) for receiving complementary-shaped light elements (not shown) and two opposing undercuts (not indicated) for slidably receiving a board assembly supporting a light element or light element subassembly (not shown). Optomechanical body 10 is the same as optomechanical body 10A (Fig. 1 a) except top surface (shown, not indicated) of optomechanical body 10A is flat, whereas top surface of optomechanical body 10 is rounded upward.

[0038] Fig. 5 is a perspective view of an embodiment of the modular optomechanical device. In Fig. 5, modular optomechanical device 100 comprises a sequence of five mechanically joined and optically coupled optomechanical bodies 10. Modular optomechanical device 100 may be converted to an embodiment of the modular optic device by configuring at least one of the optomechanical bodies 10 with a light element such as at least one encapsulated LED chip/substrate subassembly (not shown).

[0039] Fig. 6 is a perspective view of still another embodiment of the optomechanical body. In Fig. 6, optomechanical body 60 comprises ball joining portion 61 , housing portion 66, and socket joining portion 69. Housing portion 66 has been molded to have four sides: bottom surface 62, two angular side surfaces 64, and top surface 68. Each angular side surface 64 comprises a outwardly angled portion and a narrower vertically angled portion (not indicated). Optionally, a light emitting device (not shown) may be used in place of ball joining portion 61 or socket joining portion 69. Bottom surface 62 may function to receive light (i.e. be used, for light entry into housing 66), polished for reflectivity (total internal reflectivity (TIR)), or co-molded with a reflective material. Angular side surfaces 64 may be polished for reflectivity (TIR). Top surface 68 may be polished for reflectivity (TIR) or have light extraction surfaces or features disposed thereon. Top surface 68 is parallel to bottom surface 62. Optomechanical body 60 may be used to intersect, in housing portion 66, two light beams entering optomechanical body 60 via ball joining portion 61 and socket joining portion 69, light beams which may then exit optomechanical body 60 via housing portion 66 and/or any two of ball joining portion 61 and socket joining portion 69.

[0040] Fig. 7 is a perspective view of still another embodiment of the optomechanical body. In Fig. 7, optomechanical body 70 comprises ball joining portions 71 and 72, housing portion 75, and socket joining portions 78 and 79. Housing portion 75 has bottom surface 74 and top surface 76. Top surface 76 is parallel to bottom surface 74. Bottom surface 74 may function to receive light (i.e. be used, for light entry into housing 75), polished for reflectivity (TIR), or co-molded with a reflective material. Top surface 76 may be polished for reflectivity (TIR) or have light extraction surfaces or features disposed thereon.

[0041] Fig. 8 is a perspective view of another embodiment of the modular optomechanical device. In Fig. 8, modular optomechanical device 400 comprises two optomechanical bodies 60 and optomechanical body 70. One of the optomechanical bodies 60 is mechanically joined via its ball joining portion (61 , not indicated) to socket joining portion (78, not indicated) of optomechanical body 70 and the other of the optomechanical bodies 60 is mechanically joined via its socket joining portion (69, not indicated) to ball joining portion (72, not indicated) of optomechanical body 70. Seams 410 and 420 between the different ones of the optomechanical bodies 60 and the optomechanical body 70 virtually disappear to a naked eye observer and function as effective optical interfaces. Modular optomechanical device 400 may be converted to an embodiment of the modular optic device by configuring at least one of the optomechanical bodies 60 and 70 with a light element such as at least one encapsulated LED chip/substrate subassembly (not shown).

[0042] The modular optic device comprises at least two of the optic modules and the modular optomechanical device comprises at least two of the optomechanical bodies and lack light elements. For convenience, the modular optic device is described below in terms of optic modules, but the description is intended to also apply equally to the modular optomechanical device when the description is applied to the modular optomechanical device, "optic module" is replaced with "optomechanical body" and any reference to light elements is omitted to arrive at the description of the modular optomechanical device. For convenience, the modular optic device and modular optomechanical device may be referred to collectively herein as the modular devices.

[0043] The modular optic device may have a total of 2, alternatively at least 3, alternatively at least 4, alternatively at least 5, alternatively at least 6, alternatively at least 7, alternatively at least 10, alternatively at least 15, alternatively at least 20, alternatively at least 25, alternatively at least 50 optic modules. The total number of optic modules in the modular optic device may vary depending on, among other things, the intended use of the modular optic device, the intended size of the modular optic device, the size of the optic modules, The total number of optic modules may be at most 10,000, alternatively at most 1 ,000, alternatively at most 100 optic modules.

[0044] In the modular optic device at least one of the optic modules is the first optic module and at last one of the optic modules is the second optic module. The first and second optic modules may be the same, alternatively different. Each optomechanical body of the optic modules of the modular optic device independently may be the shaped polyorganosiloxane. When any two mechanically joined optomechanical bodies are both the shaped polyorganosiloxane, the shaped polyorganosiloxanes may be of the same or different compositions and/or same or different refractive indexes (Rl). Typically, when the Rls are different, they are matched to be within ± 1 .0, alternatively ± 0.5, alternatively ± 0.1 . In any two first and second mechanically joined optomechanical bodies wherein light is expected to travel from the first optomechanical body into the second optomechanical, in addition to the Rls being matched the Rl of the first optomechanical body may be less than or equal to the Rl of the second optomechanical body. Typically, any two mechanically joined optomechanical bodies are both the shaped polyorganosiloxane, the shaped polyorganosiloxanes are the same composition and the same refractive index. Alternatively, all optomechanical bodies but one independently may be the shaped polyorganosiloxane, and the one remaining optomechanical body may be the shaped silicate glass, alternatively the shaped transparent organic polymer. Alternatively, the optomechanical bodies of the optic modules of the modular optic device may be any combination of shaped polyorganosiloxanes and shaped silicate glass and/or the shaped transparent organic polymer.

[0045] In the modular optic device each of the optomechanical bodies of the optic modules independently may be linear or curved. The linear optomechanical bodies of the optic modules may be connected together to obtain an embodiment of the modular optic device that is a linear (l-shaped). Alternatively, the linear optomechanical bodies may be connected together to obtain an embodiment of the modular optic device that is A-shaped, E-shaped, F- shaped, H-shaped, K-shaped, L-shaped, M-shaped, N-shaped, T-shaped, V-shaped, W- shaped, X-shaped (or other star-shape), Y-shaped, Z-shaped, or other angular shape. The curved optomechanical bodies of the optic modules may be connected together to obtain an embodiment of the modular optic device that is C-shaped, J-shaped, O-shaped, ovoid, S- shaped, U-shaped, or other curved shape. Combinations of linear and curved optomechanical bodies may be connected together to obtain an embodiment of the modular optic device that is B-shaped, D-shaped, G-shaped, P-shaped, Q-shaped, R-shaped, or other combination shape.

[0046] In the modular optic device the optomechanical bodies of the optic modules are mechanically joined and optically coupled to each other in any order. Between any two optically coupled optic modules, the exterior surface of the at least one joining portion of the first optomechanical body opposes and contacts the exterior surface of the at least one joining portion of the second optomechanical body.

[0047] In the modular optic device the joining portions of any two mechanically joined optomechanical bodies of optically interconnected optic modules together comprise a mechanical joint. The mechanical joint may be any physical joining means wherein the optomechanical bodies of the optic modules share a common mechanical joint are in direct physical contact with each other, or the physical joining means may be supplemented with use of an intermediary optical coupling agent on their opposing surfaces.

[0048] The mechanical joint may comprise any number of pieces (but not intermediary links of mechanical couplings). Typically, the mechanical joint may be a three-piece joint, and more typically a two-piece joint. In the two-piece joint, a direct physical interlocking of two complementary fitting joining portions of two optomechanical bodies form the two-piece joint. The two-piece joint may be a plug-and-receptacle joint, a twist-lock joint, or a screw-and- screw hole joint. For example, the plug may be a ball and the receptacle may be a socket for together forming a ball-and-socket joint, the plug may be a post and the receptacle may be a post-shaped aperture for together forming a post joint, the plug may be a wedge and the receptacle may be a wedge-shaped aperture for together forming a wedge joint, the plug may be an arrowhead and the receptacle may be an arrowhead-shaped aperture for together forming an arrow joint, or the plug may be at least one prong and the receptacle may be a same number of slot-shaped apertures for together forming a prong-slot joint. Further, the plug or male portion may be sized slightly larger than the volume of the corresponding receptacle or female portion for improved mechanical joining and optical coupling of the plug-and-receptacle joint. The types of mechanical joints, however, are not limited to plug-and-receptacle type joints, and may alternatively be, for example, butt joints. Any one of the two-piece joints may further comprise the optical coupling agent. [0049] In the modular optic device having the three-piece joint, any three piece joint may be used as long as the participating joining portions of the optomechanical bodies are receptacles that are in direct physical contact with each other or via an optical coupling agent. In the three-piece joint two receptacle portions of two optomechanical bodies are directly contacted to each other to form a common opening, and a third part is disposed in the common opening formed by the two receptacle portions to interlock the two receptacle portions of two optomechanical bodies and give the three-piece mechanical joint. The third part of the three-piece joint is comprised of a shaped polyorganosiloxane of the same composition as the composition of the shaped polyorganosiloxane of the optomechanical body. An example of the three-piece joint is a joining portion of one optomechanical body defining a protruding member having a cylindrical aperture therethrough, another optomechanical body having a protruding member having a cylindrical aperture, wherein the protruding members are disposed to overlap each other in such a way that their apertures align to form a cylindrical common opening, and the third part is a cylindrical plug disposed in the cylindrical common opening thereby interlocking the protruding members of the optomechanical bodies together. Alternatively, their apertures may be slightly offset from one another so as to enable jamming of the cylindrical plug in the resulting offset common opening. Another example of the three-piece joint is a dove-tail joint comprising joining portions of two optomechanical bodies defining a same sized wedge-shaped receptacle therein, wherein the joining portions are butt coupled against each other so as to align the wedge-shaped receptacles and form a butterfly-shaped common opening, and the third part is a butterfly-shaped plug disposed in the butterfly-shaped common opening thereby interlocking the joining members of the optomechanical bodies together to give the dove-tail joint. Any one of the three-piece joints may further comprise the optical coupling agent.

[0050] The modular optic device may further comprise the optical coupling agent disposed in operative contact with the opposing exterior surfaces of the joining portions of the first and second optomechanical bodies of the first and second optic modules. The optical coupling agent may be a transparent polyorganosiloxane that is an elastomer, viscous fluid, or gel. The optical coupling agent may function to (a) further enhance transmission of light across the interface between the first and second optic modules, (b) adhere the opposing exterior surfaces of the joining portions of the optomechanical bodies to each other, or (c) both (a) and (b).

[0051] At least one, alternatively each of the optic modules of the modular optic device may independently comprise the ad rem optomechanical body and at least one light element. For purposes of the present description, the light element(s) are distinct from and in addition to the optomechanical body, although the optomechanical body may also perform a function of a light element during operation of the modular optic device.

[0052] In the optic module the light element(s) may be operatively contacted, connected, or attached directly or indirectly to the optomechanical body of the optic module. The light element(s) may be disposed at a discrete location on, against, under or in the optomechanical body. For example, the light element(s) may be disposed in, alternatively under, alternatively on, alternatively at an end, alternatively at a side of the optomechanical body of the optic module, alternatively in a combination of any two or more locations thereof.

[0053] In the optic module light elements may be selected and positioned to create areas in the housing portion of the optomechanical body of the optic module where light is modulated. Any type of light modulation may be performed by a given light element. For example, the light element be modulate light such as where light is reflected, refracted, diffused, focused, emitted, sensed, guided, filtered, split, absorbed, or a combination of any two of more modulations thereof. Each light element may independently and characteristically functions during operation of the optic module to emit, sense, guide, optically couple, split, or filter light. The light elements may produce light, focus light, diffuse light, reflect light, refract light, absorb light, or any combination thereof.

[0054] Examples of the light elements suitable for use in this invention are a charge coupled device (CCD), a lens, an optical camera, a photo-coupler, an optical waveguide, a lightguide, a light sensor, a light-reflecting coating, a mirror, a prism, or a light emitting device. The lens may be a flat lens, a curved lens, or a fresnel lens. Each optic module may comprise one or a plurality of light elements. The light element may be a light modulation element. The light modulation element may be a light extraction element for extracting light from the optic module at a predetermined location on the optomechanical body or a light redirection element for guiding light from the optic module to another optic module in light-receiving communication therewith.

[0055] At least one light element may be or comprise a light emitting device. At least one, alternatively each light emitting device may be a light emitting diode (LED). The LED may be packaged such as a high brightness (HB) packaged LED. A packaged LED may comprise at least one LED ("chip"); at least one substrate, each substrate for supporting a different LED; an encapsulant for encapsulating the LED on the substrate to give an encapsulated LED chip/substrate subassembly; a board for supporting the encapsulated LED chip/substrate subassembly; and the optomechanical body, disposed in operative connection to the board and spaced apart from the encapsulated LED chip/substrate subassembly by an air gap. The board and the encapsulated LED chip/substrate subassembly together form a board assembly. In the packaged LED, the optomechanical body may function as a lens. As a lens, the optomechanical body may be bowl-shaped and disposed open side up on the board of the board assembly for focusing light emitted from the LED into an upward directed beam. Alternatively, the bowl-shaped optomechanical body may be disposed open side down on the board of the board assembly for diffusing light emitted from the LED in an upward and outward direction.

[0056] The optomechanical body comprises the housing portion and the at least one joining portion. During operation of the modular optomechanical device, optic module or modular optic device containing same, the optomechanical body of the optic module may function to guide light therein. The light may originate from a light emitting device that is disposed in operative contact with, alternatively external from, the optomechanical body, modular optomechanical device, optic module, and/or modular optic device. Alternatively or additionally, the optomechanical body may function to optically couple a light element disposed in operative contact therewith to another optomechanical body or other optic module, or to another light element disposed in operative contact with the other optomechanical body of the other optic module (inside-out optical coupling). Alternatively or additionally, the optomechanical body may function to optically couple a light element disposed external from itself and its optic module to another light element disposed within itself (outside-in optical coupling). Alternatively or additionally, the optomechanical body may perform both inside-out and outside-in optical couplings.

[0057] The optomechanical body comprises the shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the optomechanical body. Light may be effectively transmitted from the housing portion through the joining portion of a first optomechanical body to a joining portion of a second optomechanical body via the effective optical interface of the mechanical joint, and from the joining portion into the housing portion of the second optomechanical body.

[0058] The optomechanical body may have any dimensions ranging from small sizes for miniaturized form factors to large sizes for large form factors. For example, the optomechanical body may independently have a height (z-direction) of from 0.01 millimeter (mm) to 20 mm, alternatively from 0.1 to 15 mm, alternatively from 1 to 10 mm. The optomechanical body typically has a length and width, alternatively a diameter. The optomechanical body may have a width of from 1 millimeter (mm) to 100 mm, alternatively from 2 to 50 mm, alternatively from 5 to 50 mm. The optomechanical body may have a height of from 0.1 to 3.0 times the width, alternatively from 0.2 to 2.0 times the width, alternatively from 0.5 to 1 .5 times the width. The optomechanical body may have a length, alternatively a diameter, of from 0.1 centimeter (cm) to 10 meters (m), alternatively from 1 cm to 6 m, alternatively from 2 cm to 1 m. The optomechanical body is not limited to those dimensions.

[0059] The optomechanical body may be a geometric shape such as linear (l-shaped), L- shaped, T-shaped, X-shaped, Y-shaped, +-shaped, curved (e.g., C-shaped or O-shaped) or other geometric shape, or an irregular shape. The optomechanical body is not limited to those shapes. Additional structural features may be designed in the optomechanical body. For example, the L-shaped optomechanical body may have the elbow-portion chamfered to reflect light around that corner. The T-shaped optomechanical body may be cut with a V-slot at the junction to direct light traveling through the trunk portion both to the left and right arm portions so as to exit the T-shaped optomechanical body at 90 degree angles to the trunk portion. Alternatively, the T-shaped optomechanical body may take in light via the left and right arm portions and combine them into a single beam that would exit the T-shaped optomechanical body via the trunk portion. The T-shaped optomechanical body may be used with red, green and blue LEDs so as to effectively become a light mixing chamber.

[0060] The optomechanical body may have any cross-sectional profile, or the outline looking end-on. Examples of different cross-sectional profiles may be seen by the optomechanical bodies of Figs. 4 and 6.

[0061] The exterior surface of the optomechanical body may be tacky. If desired, portions of the exterior surfaces of the housing portion of the optomechanical body may be made or converted to a non-tacky surface and/or may be coated with a coating or paint material. Alternatively or additionally, the exterior surface of the housing portion of the optomechanical body may be prepared to have a matt surface texture. The matt surface texture may be formed on the exterior surface of the housing portion of the optomechanical body by any suitable method such as using a mold having a complementary textured surface. Alternatively, an optically polished mold may be used. The housing portion of the optomechanical body may be prepared to have the matt surface directly or the matt surface may be added later. [0062] Alternatively or additionally, the optomechanical body may further comprise an exterior silicone layer disposed on at least the housing portion of the optomechanical body to give a coated optomechanical body. E.g., the coated optomechanical body may be prepared by a co-molding process to form a white reflecting silicone layer on the exterior surface of at least the housing portion of the optomechanical body. The white reflecting silicone layer may be used to increase mechanical stiffness of, increase flame resistance of, or enhance light output from the optic module comprising the coated optomechanical body. The exterior silicone layer may be co-molded to have complementary plug-and-receptacle joints with the optomechanical body. An optically polished mold may be used in the co-molding process.

[0063] The optomechanical body may comprise 1 joining portion, e.g., where the optomechanical body is intended for use in a optic module that may comprise an end unit in the modular optic device. When the optomechanical body is linear and comprises 1 joining portion at one end, the other end of the linear optomechanical body may be unfunctional, alternatively may have a light element (e.g., an end-located light emitting device). Alternatively, the optomechanical body may comprise 2 or more joining portions. For example, the optomechanical body may comprise 2, alternatively 3, alternatively 4, alternatively 5, alternatively 6 or more joining portions. Typically, the optomechanical body has at most 10, alternatively at most 6, alternatively at most 4 joining portions. Each joining portion independently may be the same or different as another joining portion in the same optomechanical body. For example, the optomechanical body may have 2 joining portions and each joining portion may be a plug for forming a plug-and-receptacle mechanical joint, alternatively each joining portion may be a receptacle for forming a plug-and-receptacle mechanical joint, alternatively one of the 2 joining portions may be a plug and the other joining portion may be the receptacle, both for forming a plug-and-receptacle mechanical joint, The joining portions in a same optomechanical body may be of the same size, alternatively of different sizes. The joining portions in a same optomechanical body may be of the same joint type (e.g., ball or socket of a ball-and-socket joint), alternatively of different joint types (e.g., one of the ball or socket of a ball-and-socket joint and another of the arrowhead or arrowhead receptacle type of an arrowhead-arrowhead receptacle joint). The joining portions in a same optomechanical body may be in the same plane, e.g., all disposed horizontally in an x-y plane, alternatively in different planes, which may, alternatively may not be perpendicular to each other.

[0064] In the optomechanical body, the joining portion may be a "3-dimensional" plug such as a ball portion for forming a ball-and-socket joint or a spherical void for forming the socket of a ball-and-socket joint. The 3-dimensional plug may be elliptical or triangular or another contoured shape and the receptacle may be a complementary shaped void. Alternatively, the joining portion may be more like a non-sliding 2-dimensional joint such as like a "jigsaw puzzle" type joint wherein the interlocking joining portions are flat.

[0065] The optomechanical body may be free of all polymers that are not polyorganosiloxanes.

[0066] The optomechanical body may be prepared using a non-curable or the curable polyorganosiloxane composition. For example, the optomechanical body may be prepared by a process comprising: shaping the curable polyorganosiloxane composition to give a shaped polyorganosiloxane composition; curing the shaped polyorganosiloxane composition to give a cured product comprising the shaped polyorganosiloxane. The optomechanical body comprises the cured product. The shaping step may comprise casting, extrusion, or a molding process such as injection molding, transfer molding, compression molding, cavity molding, or overmolding. The molding process uses a mold. The mold may be an optically polished mold.

[0067] A mandrel may be used to preserve a cavity during molding of the optomechanical body, and then the mandrel may be separated from optomechanical body. The mandrel may be used to mold the optomechanical body in the shape of a "fish bowl" type optic module.

[0068] Further, the shaped polyorganosiloxane may be formed by shaping the non-curable polyorganosiloxane composition or shaping and curing the curable polyorganosiloxane composition in such a way to include one or more optional structural features in the optomechanical body comprising the shaped polyorganosiloxane. Examples of optional structural features that may be formed on or in the optomechanical body are feet for supporting the optomechanical body offset from a surface against which the optomechanical body may be placed; mounting apertures for receiving a fastener such as an externally screw-threaded bolt or screw, rivet, cotter pin; one or more undercuts or grooves for slidably receiving a board assembly supporting the light element(s) or a subassembly comprising the light element(s); cavities, recesses or voids for housing light elements; or a combination of any two or more such optional structural features. For example, the optomechanical body may comprise a plurality of recessed portions and two opposing undercuts for slidably engaging the board assembly.

[0069] The shaped polyorganosiloxane may have been formed by molding or molding and curing as described herein (i.e., has been produced in a molded shape) and may be elastomeric (i.e., is viscoelastic) enough to form the plug-and-receptacle (male-female) type of mechanical joint. The shaped polyorganosiloxane may be self-wetable, which means having an ability to make intimate contact with another shaped polyorganosiloxane, and even other materials, especially a silicate glass (e.g., glass fiber optic element).

[0070] The composition of the shaped polyorganosiloxane of the optomechanical body is not particularly important so long as it allows transmission of light therethrough (i.e., is transparent) and efficiently across the interface between two mechanically joined optomechanical bodies via the mechanical joint and effective optical interface. The self- wetting attribute may further improve optical coupling in the mechanical joint by increasing the areal extent of intimate physical contact between mechanically joined modules.

[0071] The shaped polyorganosiloxane may be prepared from the polyorganosiloxane composition that is non-curable, alternatively curable. Thus, the shaped polyorganosiloxane may be an uncured material, alternatively a cured product. The cured product may be prepared by curing a shaped form of a curable organosiloxane polymer, oligomer, or monomer(s) precursor thereof. After curing, the cured product, and thus the shaped polyorganosiloxane, may be a thermoset. The curing to give the cured product as the shaped polyorganosiloxane may be performed in a mold such as an optically polished mold at ambient conditions (e.g., 20° C. to 40 ° C), typically for from 1 minute to several hours, e.g., for from 30 to 120 minutes Alternatively, the curing may be performed in the optically polished mold at an elevated temperature of from 50° C. to 200° C. (e.g., from 120° C. to 150° C, alternatively from 130° C. to 180° C, e.g., by holding the curable polyorganosiloxane composition for from 5 seconds to 10 minutes, alternatively from 10 seconds to 5 minutes, alternatively from 20 seconds to 2 minutes in a mold heated to such an elevated temperature).

[0072] Typically, the shaped polyorganosiloxane is a cured product of curing a shaped form of a curable polyorganosiloxane composition. The composition of the curable polyorganosiloxane composition is not particularly important so long as after the shaping and curing of it the resulting cured product as the shaped polyorganosiloxane allows light transmission therethrough and may form the mechanical joint and effective optical interface of the modular devices. The curable polyorganosiloxane composition may be condensation curable, alternatively free radical curable, alternatively hydrosilylation curable. The free radical-curable polyorganosiloxane composition may be a radiation-curable polyorganosiloxane composition, a light-curable polyorganosiloxane composition (e.g. UV light-curable), or a peroxide-curable polyorganosiloxane composition. The condensation curable polyorganosiloxane composition may be cured by exposure to water with or without a condensation catalyst (e.g., Sn catalyst). The curable polyorganosiloxane composition may be hydrosilylation curable and the cured product is a hydrosilylation cured shaped polyorganosiloxane.

[0073] The curable polyorganosiloxane composition useful in this invention may be illustrated by describing below the hydrosilylation-curable type of the curable polyorganosiloxane composition in greater detail. The composition of the hydrosilylation- curable polyorganosiloxane composition is not particularly important so long as after the shaping and curing of it the resulting cured product as the shaped polyorganosiloxane allows light transmission therethrough and may form the mechanical joint and effective optical interface of the modular devices. The shaped polyorganosiloxane prepared by curing the hydrosilylation-curable polyorganosiloxane composition may have been formed by molding as described later (i.e., has been produced in a molded shape) and may be elastomeric (i.e., is viscoelastic) enough to form the plug-and-receptacle type of mechanical joint, wherein the plug or male portion is sized slightly larger than the corresponding receptacle or female portion for improved mechanical joining and optical coupling. The types of mechanical joints of this cured product, however, are not limited to plug-and-receptacle type joints, and may alternatively be, for example, butt joints. This shaped polyorganosiloxane also may be self- wetable, and this may further improve optical coupling in the mechanical joint by increasing areal extent of physical contact between mechanically joined modules.

[0074] Examples of hydrosilylation-curable polyorganosiloxane compositions suitable for use in this invention are described in US 2012/0065343 A1 , US 201 1/0203664 A1 , or US 2006/0207646 A1 , such as for example in paragraphs [0023 to 0037; and 0048] of US 2006/0207646 A1 . In some embodiments, the hydrosilylation-curable polyorganosiloxane composition and the composition of the cured product thereof are as described for the cured silicone composition, and the composition of the cured product thereof, respectively, in US 2012/0065343 A1 .

[0075] For illustration, the hydrosilylation-curable polyorganosiloxane composition may comprise the following ingredients (A) to (D):

(A) a polymer combination comprising (A1 ) and (A2):

(A1 ) a low viscosity polydiorganosiloxane having an average of at least two aliphatically unsaturated organic groups per molecule and having a viscosity of up to 12,000 mPa-s, and (A2) a high viscosity polydiorganosiloxane having an average of at least two aliphatically unsaturated organic groups per molecule and having a viscosity of at least 45,000 mPa-s;

(B) a silicone resin having an average of at least two aliphatically unsaturated organic groups per molecule;

(C) a crosslinker having an average, per molecule, of at least two silicon bonded hydrogen atoms; and

(D) a hydrosilylation catalyst.

Ingredients (A) to (D) may be collectively referred to herein for convenience as "Composition (I)." The ingredients (A) to (C) and their amounts in the Composition (I) may be selected such that a ratio of a total amount of silicon bonded hydrogen atoms in the Composition (I) to a total amount of aliphatically unsaturated organic groups (e.g., vinyl groups) in the

Composition (I) (SiH/un saturated ratio, e.g., SiH/Vi ratio) ranges from 1 .2 to 1 .7, alternatively 1 .5, the cured product may have Shore A hardness of at least 30, tensile strength of at least at least 3 mPa-s, and elongation at break of at least 50%. The Shore A hardness, tensile strength, elongation at break, and viscosity may be determined by the ad rem methods described later. As used herein, "viscosity" means dynamic viscosity at 25° C.

[0076] Ingredient (A) of Composition (I) is the polymer combination of (A1 ) and (A2). The polymers comprise aliphatically unsaturated polydiorganosiloxanes that differ in viscosity. The polymer combination comprises: (A1 ) a low viscosity polydiorganosiloxane having an average of at least two aliphatically unsaturated organic groups per molecule and having a viscosity of up to 12,000 mPa-s, and (A2) a high viscosity polydiorganosiloxane having an average of at least two aliphatically unsaturated organic groups per molecule and having a viscosity of at least 45,000 mPa-s.

[0077] The aliphatically unsaturated organic groups in ingredient (A) of Composition (I) may be alkenyl exemplified by, but not limited to, vinyl, allyl, butenyl, pentenyl, and hexenyl; alternatively vinyl. The aliphatically unsaturated organic groups may be alkynyl groups exemplified by, but not limited to, ethynyl, propynyl, and butynyl. The aliphatically

unsaturated organic groups in ingredient (A) may be located at terminal, pendant, or both terminal and pendant positions of macromolecules of the polydiorganosiloxanes.

Alternatively, the aliphatically unsaturated organic groups in ingredient (A) may be located at terminal positions of the macromolecules.

[0078] The remaining silicon-bonded organic groups in the polydiorganosiloxanes of ingredient (A) of Composition (I) may be hydrocarbyl groups, which are substituted and unsubstituted monovalent hydrocarbon groups free aliphatic unsaturation. Unsubstituted hydrocarbyl groups are exemplified by alkyl groups such as methyl, ethyl, propyl, pentyl, octyl, undecyl, and octadecyl; cycloalkyl groups such as cyclohexyl; and aromatic groups such as ethylbenzyl, naphthyl, phenyl, tolyl, xylyl, benzyl, styryl, 1 -phenylethyl, and 2- phenylethyl, alternatively phenyl. Substituted hydrocarbyl groups are exemplified by halogenated alkyl groups such as chloromethyl, 3-chloropropyl, and 3,3,3-trifluoropropyl, fluoromethyl, 2-fluoropropyl, 3,3,3-trifluoropropyl, 4,4,4-trifluorobutyl, 4,4,4,3,3- pentafluorobutyl, 5,5,5,4,4, 3, 3-heptafluoropentyl, 6,6, 6,5,5,4,4,3, 3-nonafluorohexyl, and 8,8,8,7,7-pentafluorooctyl.

[0079] The polydiorganosiloxanes for ingredients (A1 ) and (A2) of Composition (I) each have an average per molecule of at least two aliphatically unsaturated organic groups. Ingredient (A1 ) can be a single polydiorganosiloxane or a combination comprising two or more polydiorganosiloxanes that differ in at least one of the following properties: structure, average molecular weight, siloxane units, and sequence. The viscosity of ingredient (A1 ) is up to 12,000 mPa-s. Alternatively, the viscosity of ingredient (A1 ) may range from 300 mPa-s to 12,000 mPa-s, alternatively 300 mPa-s to 2,500 mPa-s, and alternatively 300 mPa-s to 2,000 mPa-s. The amount of ingredient (A1 ) in the Composition (I) may range from 10% to 90%, alternatively 70% to 80%, based on the combined weight of ingredient (A).

[0080] Ingredient (A1 ) of Composition (I) may have general formula (I): R ₃SiO-(R² ₂SiO)_a- SiPt 3, where each R and each R² are independently selected from the group consisting of aliphatically unsaturated organic groups and monovalent organic groups such as the substituted and unsubstituted hydrocarbon groups described above, and subscript a is an integer having a value sufficient to provide ingredient (A) with a viscosity up to 12,000 mPa-s, wherein on average at least two of R and/or R² are unsaturated organic groups. Alternatively, formula (I) may be an σ,ω-dialkenyl-functional polydiorganosiloxane.

[0081] Ingredient (A2) of Composition (I) may be a single polydiorganosiloxane or a combination comprising two or more polydiorganosiloxanes that differ in at least one of the following properties: structure, weight or number average molecular weight, siloxane units, and unit sequence. The viscosity of ingredient (A2) is at least 45,000 mPa-s. Alternatively, the viscosity of ingredient (A2) may range from 45,000 to 65,000 mPa-s. The amount of ingredient (A2) in the Composition (I) may range from 10% to 90%, alternatively 20% to 30%, parts by weight based on the combined weight of the polymers in ingredient (A).

[0082] Ingredient (A2) of Composition (I) may have general formula (II): R³ ₃SiO-(R⁴ ₂SiO)_b- SiR³ ₃, where each R³ and each R⁴ are independently selected from the group consisting of aliphatically unsaturated organic groups and monovalent organic groups such as the substituted and unsubstituted hydrocarbon groups described above, and subscript b is an integer having a value sufficient to provide ingredient (A) with a viscosity of at least 45,000 mPa-s, alternatively 45,000 mPa-s to 65,000 mPa-s, with the proviso that on average at least two of R³ and/or R⁴ are unsaturated organic groups. Alternatively, formula (II) may be an σ,ω-dialkenyl-functional polydiorganosiloxane.

[0083] Ingredient (B) of Composition (I) is the silicone resin. The silicone resin useful herein contains an average of at least two aliphatically unsaturated organic groups per molecule. The amount of aliphatically unsaturated organic groups in the resin may be up to 3.0% based on the weight of the silicone resin. Alternatively, the amount of aliphatically unsaturated organic groups in the silicone resin may range from 1 .9% to 3.0%, alternatively 2.0% to 3.0%, alternatively 1 .5% to 3.0%, alternatively 1 .9% to 3.0%, and alternatively 1 .5% to 2.0% on the same basis. The silicone resin comprises monofunctional (M) units represented by R⁵ ₃SiOi_/2 and tetrafunctional (Q) units represented by Si0_4/2. R⁵ represents a monovalent organic group, which is a substituted or unsubstituted monovalent hydrocarbon group. The silicone resin is soluble in liquid hydrocarbons such as benzene, toluene, xylene, heptane and the like or in liquid organosilicon compounds such as low viscosity cyclic and linear polydiorganosiloxanes. Examples include the solvents described below.

[0084] In the R⁵ ₃SiOi_/2 unit of the silicone resin of ingredient (B) of Composition (I), R⁵ may be a monovalent unsubstituted hydrocarbon group, exemplified by alkyl groups such as methyl, ethyl, propyl, pentyl, octyl, undecyl, and octadecyl; alkenyl groups, such as vinyl, allyl, butenyl, pentenyl and hexenyl; cycloaliphatic radicals, such as cyclohexyl and cyclohexenylethyl; alkynyl groups such as, ethynyl, propynyl, and butynyl; cycloalkyl groups such as cyclopentyl and cyclohexyl; and aromatic groups such as ethylbenzyl, naphthyl, phenyl, tolyl, xylyl, benzyl, styryl, 1 -phenylethyl, and 2-phenylethyl, alternatively phenyl. Non- reactive substituents that can be present on R⁵ include but are not limited to halogen and cyano. Monovalent organic groups which are substituted hydrocarbon groups are

exemplified by, but not limited to halogenated alkyl groups such as chloromethyl, 3- chloropropyl, and 3,3,3-trifluoropropyl, fluoromethyl, 2-fluoropropyl, 3,3,3-trifluoropropyl, 4,4,4-trifluorobutyl, 4,4,4,3, 3-pentafluorobutyl, 5,5,5,4,4,3, 3-heptafluoropentyl,

6,6, 6,5,5,4,4,3, 3-nonafluorohexyl, and 8,8,8,7,7-pentafluorooctyl.

[0085] The silicone resin of ingredient (B) of Composition (I) may have a ratio of M units to Q units (M:Q ratio) ranging from 0.6:1 to 1 .1 :1 . The silicone resin may have a number average molecular weight ranging from 2,000 to 5,000, see U.S. Patent 6,124,407 for a description of suitable silicone resins and how to prepare them.

[0086] The silicone resin of ingredient (B) of Composition (I) can be prepared by any suitable method. Silicone resins of this type have reportedly been prepared by cohydrolysis of the corresponding silanes or by silica hydrosol capping methods known in the art. The silicone resin may be prepared by the silica hydrosol capping processes of Daudt, et at., U.S. Patent 2,676,182; of Rivers-Farrell et al., U.S. Patent 4,61 1 ,042; of Butler, U.S. Patent 4,774,310; and of Lee, et al., U.S. Patent 6,124,407.

[0087] The intermediates used to prepare the silicone resin of ingredient (B) of Composition (I) are typically triorganosilanes of the formula R⁵ ₃SiX', where R⁵ is as described above and X' represents a hydrolyzable group, and either a silane with four hydrolyzable groups, such as halogen, alkoxy or hydroxyl, or an alkali metal silicate such as sodium silicate.

[0088] The content of silicon-bonded hydroxyl groups (i.e., HOSi0_3/2 groups) in the silicone resin of ingredient (B) of Composition (I) be below 0.7 % of the total weight of the silicone resin, alternatively below 0.3 %. Silicon-bonded hydroxyl groups formed during preparation of the silicone resin may be converted to trihydrocarbylsiloxy groups or hydrolyzable groups by reacting the silicone resin with a silane, disiloxane or disilazane containing the

appropriate terminal group. Silanes containing hydrolyzable groups are typically added in excess of the quantity required to react with the silicon-bonded hydroxyl groups of the silicone resin.

[0089] The silicone resin of ingredient (B) of Composition (I) may be one silicone resin. Alternatively, the silicone resin may comprise two or more silicone resins, where the resins differ in at least one of the following properties: structure, hydroxyl and/or hydrolyzable group content, molecular weight, siloxane units, and sequence. The amount of silicone resin in the Composition (I) may vary depending on the type and amounts of polymers present, and the aliphatically unsaturated organic groups (e.g., vinyl) content of ingredients (A) and (B), however, the amount of silicone resin may range from 25 % to 40%, alternatively 26% to 38%, by weight of the Composition (I).

[0090] Ingredient (C) of Composition (I) is a crosslinker having an average, per molecule, of at least two silicon bonded hydrogen atoms. Ingredient (C) may comprise a

polyorganohydrogensiloxane. Ingredient (C) can be a single polyorganohydrogensiloxane or a combination comprising two or more polyorganohydrogensiloxanes that differ in at least one of the following properties: structure, viscosity, average molecular weight, siloxane units, and sequence. [0091] Ingredient (C) of Composition (I) may comprise a linear polyorganohydrogensiloxane of general formula (III): HR⁶ ₂SiO-(R⁶ ₂SiO)c-SiR⁶ ₂H, where each R⁶ is independently a hydrogen atom, or a monovalent organic group, which is a monovalent substituted or unsubstituted hydrocarbon group as exemplified above for R⁵, with the proviso that on average at least two R⁶ per molecule are hydrogen atoms, and subscript c is an integer with a value of 1 or more. Alternatively, at least three R⁶ per molecule are hydrogen atoms and c may range from 1 to 20, alternatively 1 to 10. Ingredient (C) may comprise a hydrogen terminated polydiorganosiloxane. Alternatively, ingredient (C) may comprise a

poly(dimethyl/methylhydrogen)siloxane copolymer.

[0092] Alternatively, ingredient (C) of Composition (I) may comprise a branched

polyorganohydrogensiloxane of unit formula (IV):

(R⁷Si03/₂)d(R⁷2Si02/₂)e(R⁷3SiOi/₂)f(Si0₄/₂)g(XO)h where X' is an alkoxy-functional group. Each R⁷ is independently a hydrogen atom or a monovalent organic group, which is a monovalent substituted or unsubstituted hydrocarbon group as exemplified above for R⁵, with the proviso that an average of at least two per molecule of R⁷ are hydrogen atoms. In formula (IV), the polyorganohydrogensiloxane contains an average of at least two silicon bonded hydrogen atoms per molecule, however, 0.1 mol% to 40 mol% of R⁷ may be hydrogen atoms.

[0093] In formula (IV), subscript d is a positive number, subscript e is 0 or a positive number, subscript f is 0 or a positive number, subscript g is 0 or a positive number, subscript h is 0 or a positive number, e/d has a value ranging from 0 to 10, f/e has a value ranging from 0 to 5, g/(d+e+f+g) has a value ranging from 0 to 0.3, and h/(d+e+f+g) has a value ranging from 0 to 0.4.

[0094] The amount of ingredient (C) of Composition (I) added is sufficient to provide the SiH/Vi ratio in the range described above.

[0095] Ingredient (D) of Composition (I) is a hydrosilylation catalyst. Ingredient (D) is added in an amount sufficient to promote curing of the Composition (I). However, the amount of ingredient (D) may range from 0.01 to 1 ,000 ppm, alternatively 0.01 to 100 ppm, and alternatively 0.01 to 50 ppm, alternatively 1 to 18 ppm, and alternatively 1 to 7 ppm, of platinum group metal based on the weight of the Composition (I).

[0096] Hydrosilylation catalysts suitable for use as ingredient (D) of Composition (I) are known in the art and commercially available. Ingredient (D) may comprise a platinum group metal selected from the group consisting of platinum, rhodium, ruthenium, palladium, osmium or iridium metal or organometallic compound thereof, and a combination thereof. Ingredient (D) is exemplified by platinum black, compounds such as chloroplatinic acid, chloroplatinic acid hexahydrate, a reaction product of chloroplatinic acid and a monohydric alcohol, platinum bis-(ethylacetoacetate), platinum bis- (acetylacetonate), platinum dichloride, and complexes of said compounds with olefins or low molecular weight organopolysiloxanes or platinum compounds microencapsulated in a matrix or core-shell type structure. Complexes of platinum with low molecular weight organopolysiloxanes include 1 ,3-diethenyl-1 ,1 ,3,3-tetramethyldisiloxane complexes with platinum. These complexes may be microencapsulated in a resin matrix. Alternatively, the catalyst may comprise 1 ,3-diethenyl-1 ,1 ,3,3-tetramethyldisiloxane complex with platinum. Examples of suitable hydrosilylation catalysts for ingredient (D) are described in, for example, U.S.

Patents 3,159,601 ; 3,220,972; 3,296,291 ; 3,419,593; 3,516,946; 3,814,730; 3,989,668; 4,784,879; 5,036,1 17; and 5,175,325 and EP 0 347 895 B. Microencapsulated

hydrosilylation catalysts and methods of preparing them are exemplified in U.S. Patent No. 4,766,176; and U.S. Patent No. 5,017,654.

[0097] The Composition (I) may further comprise one or more additional ingredients.

Suitable additional ingredients include, but are not limited to (E) a hydrosilylation reaction inhibitor, (F) a mold release agent, (G) an optically active agent, (H) a filler, (I) an adhesion promoter, (J) a heat stabilizer, (K) a flame retardant, (L) a reactive diluent, (M) a pigment, (N) a flame retarder, (O) an oxidation inhibitor, and a combination thereof.

[0098] Ingredient (E), when used in Composition (I), is a hydrosilylation reaction inhibitor. Suitable hydrosilylation reaction inhibitors are exemplified by acetylenic alcohols, cycloalkenylsiloxanes, ene-yne compounds, triazoles, phosphines; mercaptans; hydrazines; amines, and combinations thereof. Suitable acetylenic alcohols are exemplified by methyl butynol, ethynyl cyclohexanol, dimethyl hexynol, 3,5-dimethyl-1 -hexyn-3-ol, and a

combination thereof; cycloalkenylsiloxanes such as methylvinylcyclosiloxanes exemplified by 1 ,3,5,7-tetramethyl-1 ,3,5,7-tetravinylcyclotetrasiloxane, 1 ,3,5,7-tetramethyl-1 ,3,5,7- tetrahexenylcyclotetrasiloxane, and a combination thereof; ene-yne compounds such as 3- methyl-3-penten-1 -yne, 3,5-dimethyl-3-hexen-1 -yne; triazoles such as benzotriazole;

phosphines; mercaptans; hydrazines; amines such as tetramethyl ethylenediamine, dialkyl fumarates, dialkenyl fumarates, dialkoxyalkyl fumarates, maleates such as diallyl maleate, and a combination thereof. Suitable inhibitors are disclosed by, for example, U.S. Patents 3,445,420; 3,989,667; 4,584,361 ; and 5,036,1 17. Alternatively, ingredient (E) may comprise an organic acetylenic alcohol, a silylated acetylenic alcohol, or a combination thereof.

Examples of organic acetylenic alcohol inhibitors are disclosed, for example, in EP 0 764 703 A2 and U.S. Patent 5,449,802 and include 1 -butyn-3-ol, 1 -propyn-3-ol, 2-methyl-3- butyn-2-ol, 3-methyl-1 -butyn-3-ol, 3-methyl-1 -pentyn-3-ol, 3-phenyl-1 -butyn-3-ol, 4-ethyl-1 - octyn-3-ol, 3,5-dimethyl-1 -hexyn-3-ol, and 1 -ethynyl-1 -cyclohexanol. Alternatively, ingredient (E) in the Composition (I) may be a silylated acetylenic inhibitor. Without wishing to be bound by theory, it is thought that adding a silylated acetylenic inhibitor may reduce yellowing of the cured product prepared from the Composition (I) as compared to a cured product prepared from a hydrosilylation curable composition that does not contain a hydrosilylation reaction inhibitor or that contains an organic acetylenic alcohol inhibitor. The Composition (I) may be free of organic acetylenic alcohol inhibitors. "Free of organic acetylenic alcohol inhibitors" means that if any organic acetylenic alcohol is present in the Composition (I), the amount present is insufficient to reduce optical transparency of the cured product to < 95 % at a thickness of 2.0 mm or less at 400 nm wavelength after heating at 200° C. for 14 days.

[0099] Ingredient (E), when used in Composition (I), may be added in an amount ranging from 0.001 to 1 parts by weight based on the total weight of the Composition (I), alternatively 0.01 to 0.5 parts by weight. Suitable silylated acetylenic inhibitors for ingredient (E) may have general formula (V):

general formula (VI):

or a combination thereof;

where each R⁸ is independently a hydrogen atom or a monovalent organic group, and subscript n is 0, 1 , 2, or 3, subscript q is 0 to 10, and subscript r is 4 to 12. Alternatively n is 1 or 3. Alternatively, in general formula (V), n is 3. Alternatively, in general formula (VI), n is 1 . Alternatively q is 0. Alternatively, r is 5, 6, or 7, and alternatively r is 6. Examples of monovalent organic groups for R⁸ include an aliphatically unsaturated organic group, an aromatic group, or a monovalent organic group, which is a monovalent substituted or unsubstituted hydrocarbon group free of aromatics and free aliphatic unsaturation, as described above. R⁹ is a covalent bond or a divalent hydrocarbon group.

[00100] Silylated acetylenic inhibitors of ingredient (E), when used in Composition (I), are exemplified by (3-methyl-1 -butyn-3-oxy)trimethylsilane, ((1 ,1 -dimethyl-2- propynyl)oxy)trimethylsilane, bis(3-methyl-1 -butyn-3-oxy)dimethylsilane, bis(3-methyl-1 - butyn-3-oxy)silanemethylvinylsilane, bis((1 ,1 -dimethyl-2-propynyl)oxy)dimethylsilane, methyl(tris(1 ,1 -dimethyl-2-propynyloxy))silane, methyl(tris(3-methyl-1 -butyn-3-oxy))silane, (3-methyl-1 -butyn-3-oxy)dimethylphenylsilane, (3-methyl-1 -butyn-3- oxy)dimethylhexenylsilane, (3-methyl-1 -butyn-3-oxy)triethylsilane, bis(3-methyl-1 -butyn-3- oxy)methyltrifluoropropylsilane, (3,5-dimethyl-1 -hexyn-3-oxy)trimethylsilane, (3-phenyl-1 - butyn-3-oxy)diphenylmethylsilane, (3-phenyl-1 -butyn-3-oxy)dimethylphenylsilane, (3-phenyl- 1 -butyn-3-oxy)dimethylvinylsilane, (3-phenyl-1 -butyn-3-oxy)dimethylhexenylsilane,

(cyclohexyl-1 -ethyn-1 -oxy)dimethylhexenylsilane, (cyclohexyl-1 -ethyn-1 - oxy)dimethylvinylsilane, (cyclohexyl-1 -ethyn-1 -oxy)diphenylmethylsilane, (cyclohexyl-1 - ethyn-1 -oxy)trimethylsilane, and combinations thereof. Alternatively, ingredient (E) is exemplified by methyl(tris(1 ,1 -dimethyl-2-propynyloxy))silane, ((1 ,1 -dimethyl-2- propynyl)oxy)trimethylsilane, or a combination thereof.

[00101] The silylated acetylenic inhibitor of ingredient (E), when used in Composition (I), may be prepared by methods known in the art for silylating an alcohol such as reacting a chlorosilane of formula R⁶ _nSiCI₄-_n with an acetylenic alcohol of formula

the presence of an acid receptor. In these formulae, n, q, r, and R are as described above and R⁹ is a covalent bond or a divalent hydrocarbon group. Examples of silylated acetylenic inhibitors and methods for their preparation are disclosed, for example, in EP 0 764 703 A2 and U.S. Patent 5,449,802.

[00102] Ingredient (F), when used in Composition (I), is an optional mold release agent. Ingredient (F) may have general formula (VI): R ⁰ ₃SiO(R ⁰ ₂SiO)_i(R ⁰R SiO)_jSiR ⁰3, where each R ⁰ is independently a hydroxyl group or a monovalent organic group, and each R is independently a monovalent organic group unreactive with aliphatically unsaturated organic groups and silicon-bonded hydrogen atoms in the Composition (I), subscript i has a value of 0 or greater, subscript j has a value of 1 or greater with the proviso that i and j have may have values sufficient that the mold release agent has a viscosity of 50 to 3,000 mPa-s at molding process temperatures. Alternatively, each R ⁰ may independently be an alkyl group such as methyl, ethyl, propyl, or butyl or an alkoxy group such as methoxy, ethoxy, propoxy, or butoxy, and each R may independently be an aromatic group such as phenyl, tolyl, or xylyl. Alternatively each R ⁰ may be methyl and each R may be phenyl. Examples of suitable mold release agents include trimethylsiloxy-terminated

(dimethylsiloxane/phenylmethylsiloxane) copolymer having a viscosity of 100 to 500 mPa-s at 25 ^QC.

[00103] Alternatively, ingredient (F), when used in Composition (I), may comprise an σ,ω-dihydroxy-functional polydiorganosiloxane that may be added to the Composition (I) in an amount ranging from 0 % to 5 %, alternatively 0.25 % to 2 % based on the weight of the Composition (I). Ingredient (F) can be a single polydiorganosiloxane or a combination comprising two or more polydiorganosiloxanes that differ in at least one of the following properties: structure, viscosity, average molecular weight, siloxane units, and sequence. The viscosity of ingredient (F) is not critical and may range from 50 to 1 ,000 mPa-s at 25 ^QC. Ingredient (F) may contain at least one aromatic group per molecule, and the aromatic groups are as exemplified above. Ingredient (F) may contain at least 15 mol %, alternatively at least 30 mol % aromatic groups.

[00104] Ingredient (F), when used in Composition (I), may comprise an α,ω- dihydroxy-functional polydiorganosiloxane of general formula (VI'): HOR ² ₂SiO-(R ² ₂SiO)_k- SiR ² ₂OH, where each R ² is independently an aromatic group as exemplified above, or a monovalent substituted or unsubstituted hydrocarbon group free of aromatics and free aliphatic unsaturation as exemplified above, with the proviso that on average at least one R ² per molecule is an aromatic group, and subscript k is an integer with a value of 1 or more. Alternatively, at least one R ² per molecule is phenyl and k may range from 2 to 8.

Alternatively, an organic mold release agent could be used instead of the siloxanes described above.

[00105] Ingredient (G), when used in Composition (I), is an optically active agent. Examples of ingredient (G) include optical diffusants, phosphor powders, photonic crystals, quantum dots, carbon nanotubes, dyes such as fluorescent dyes or absorbing dyes, and combinations thereof. The exact amount of ingredient (G) depends on the specific optically active agent selected, however, ingredient (G) may be added in an amount ranging from 0% to 20%, alternatively 1 % to 10% based on the weight of the Composition (I). Ingredient (G) may be mixed with the Composition (I) or coated on a surface of the optical device prepared by curing the Composition (I) to a cured product.

[00106] Ingredient (H), when used in Composition (I), is a filler. Suitable fillers are known in the art and are commercially available. For example, ingredient (H) may comprise an inorganic filler such as silica, e.g., colloidal silica, fumed silica, quartz powder, titanium oxide, glass, alumina, zinc oxide, or a combination thereof. The filler may have an average particle diameter of 50 nanometers or less and does not lower the percent transmittance by scattering or absorption. Alternatively, ingredient (H) may comprise an organic filler such as poly(meth)acrylate resin particles. Ingredient (H) may be added in an amount ranging from 0% to 50%, alternatively 1 % to 5% based on the weight of the Composition (I).

[00107] The polydiorganosiloxanes of the Composition (I) may be based on polydimethylsiloxanes, some macromolecules of which may have SiH and/or aliphatically unsaturated (e.g., alkenyl, e.g., vinyl) functionality as described herein..

[00108] After the shaping and curing the hydrosilylation-curable polyorganosiloxane composition described above, the resulting cured product as the shaped polyorganosiloxane allows light transmission therethrough. The shaped polyorganosiloxane may be

mechanically joined to another such shaped polyorganosiloxane to form the mechanical joint and effective optical interface of the modular devices.

[00109] Any embodiment of the Composition (I) may be prepared by any convenient means, such as mixing all ingredients at ambient or elevated temperature. The Composition (I) may be prepared as a one-part composition or a multiple part composition. A one-part Composition (I) can be prepared by mixing ingredients (A), (B), (C), and (D) and any additional ingredients such as any one or more of optional ingredients (E) to (H), if present. If a one part Composition (I) will be prepared, pot life of the Composition (I) may be extended by adding ingredient (E) described above. If the Composition (I) will be used in a molding process (or overmolding process), such as that described herein, then ingredient (F) may be added. In a multiple part Composition (I), such as a two part Composition (I), ingredients (C) and (D) are stored in separate parts such as a base part and a curing agent part. For example, a base part may be prepared by mixing ingredients comprising: 60% to 75% ingredient (A), 25% to 40% ingredient (B), and 6 ppm ingredient (D). The base part may optionally further comprise 0.2 to 5 parts ingredient (F), (G), and/or (H), when used in Composition (I). A curing agent part may be prepared by mixing ingredients comprising: 50% to 70% ingredient (A), 20% to 37% ingredient (B), 7% to 16% by weight ingredient (C), and 0.001 to 1 % ingredient (E). The curing agent part may optionally further comprise 0.2 to 5 parts ingredient (F), (G), and/or (H), when used in Composition (I). The base part and the curing agent part may be stored in separate containers until just prior to use. Just prior to use, the base and curing agent parts are mixed together in a ratio of, for example, 1 to 10 parts base part per 1 part curing agent part.

[00110] Generally, the Composition (I) may be hydrosilylation cured at ambient temperature or with heating the Composition (I) at elevated temperature, for an ad rem time period, all as described earlier. Heating may accelerate the curing. The exact time and temperature for heating will vary depending on various factors including the amount of catalyst and the type and amount of inhibitor (ingredient (E)) present (if any), however hydrosilylation curing may be performed by heating the Composition (I) at the elevated temperature ranging from 50° C. to 200° C. for the amount of time ranging from 1 second to 10 minutes as described earlier. The shaped polyorganosiloxane of the optomechanical body may be prepared by shaping the Composition (I) to give a shaped form of the

Composition (I), and then hydrosilylation curing the shaped form of the Composition (I) as described above to give the shaped polyorganosiloxane of the optomechanical body.

[00111] The cured product of hydrosilylation curing the Composition (I), and thus the shaped polyorganosiloxane of the optomechanical body comprising same, may be prepared according to the method. The cured product, and thus the shaped polyorganosiloxane of the optomechanical body comprising same, has improved physical and/or mechanical properties over cured products of compositions known in the art. The cured product of the Composition (I) described herein may have a Shore A hardness of at least 30, alternatively Shore A hardness may range from 25 to 100, alternatively from 30 to 90, alternatively from 30 to 80; as measured by ASTM D2240 by the type A durometer. (ASTM D2240 for Shore A durometer corresponds to J IS K 6253 type-A that specifies testing methods for durometer hardness of plastics.) Alternatively, the cured product may have hardness up to 55, alternatively hardness may range from 30 to 55.

[00112] The cured product of hydrosilylation curing the Composition (I), and thus the shaped polyorganosiloxane of the optomechanical body comprising same, may have a tensile strength of at least 3 mPa-s, alternatively tensile strength may range from 3 mPa-s to 14 mPa-s as measured by ASTM D412. The cured product may have an elongation at break of at least 50%, alternatively elongation at break may range from 50% to 400%, alternatively from 100% to 350%, alternatively from 50% to 250%, also as measured by ASTM D412. The cured product may exhibit excellent thermo-optic stability, improved mechanical properties, weather resistance and heat resistance. Transmittance is measured on samples initially after cure, then the samples are heated at 150° C. for 1000 hours and transmittance is measured again using an ultraviolet-visible spectrophotometer with medium scanning speed, 1 nanometer slit width to measure yellowing.

[00113] Determining numerical property values: for purposes of the present invention and unless indicated otherwise, the numerical property values used herein may be determined by the following procedures.

[00114] Determining dynamic viscosity: for purposes of the present invention examples and unless indicated otherwise, use dynamic viscosity that is measured at 25° C. using a rotational viscometer such as a Brookfield Synchro-lectric viscometer or a Wells- Brookfield Cone/Plate viscometer. The results are generally reported in centipoise. This method is based on according to ASTM D1084-08 (Standard Test Methods for Viscosity of Adhesives) Method B for cup/spindle and ASTM D4287-00(2010) (Standard Test Method for High-Shear Viscosity Using a Cone/Plate Viscometer) for cone/plate.

[00115] Hardness (Shore A) was measured according to ASTM D2240 by the type A durometer. The shore A value was measured three times for each example, and the average was reported for hardness.

[00116] Determining kinematic viscosity: use test method ASTM-D445-1 1 a (Standard Test Method for Kinematic Viscosity of Transparent and Opaque Liquids (and Calculation of

Dynamic Viscosity)) at 25° C. expressed in cSt or mm²/s units.

[00117] Transmittance (of light) is measured on samples initially after cure, then the samples are heated at 150° C. for 1000 hours and transmittance is measured again using a ultraviolet-visible spectrophotometer with medium scanning speed, 1 nanometer slit width to measure yellowing. Alternatively, the light transmittance of at least 70 percent as determined by UV/Vis spectrophotometry using ASTM E424-71 (2007).

[00118] Tensile strength and elongation were measured according to ASTM D412.

The tensile strength test had a 10% variance. Each value was measured three times for each example, and the average was reported.

[00119] Determining weight percent (wt%): base weight percent of an ingredient of a composition, mixture, or the like on weights of ingredients added to prepare, and total weight of, the composition, mixture, or the like.

[00120] The invention is further illustrated by, and an invention embodiment may include any combinations of features and limitations of, the non-limiting examples thereof that follow. The concentrations of ingredients in the compositions/formulations of the examples are determined from the weights of ingredients added unless noted otherwise.

[00121] Examples (Ex.) 1 to 9: production of examples of Composition (I) and products of curing same. The following ingredients were used to prepare the compositions and cured products of Ex. 1 to 9. Polymer (A1 -1 ) was a dimethylvinylsiloxy-terminated polydimethylsiloxane with viscosity 2,000 mPa-s and 0.228% vinyl. Polymer (A1 -2) was a dimethylvinylsiloxy-terminated polydimethylsiloxane with a viscosity ranging from 7,000 mPa-s to 12,000 mPa-s and 0.1 1 to 0.23% vinyl. Polymer (A2) was a dimethylvinylsiloxy- terminated polydimethylsiloxane with viscosity ranging from 45,000 mPa-s to 65,000 mPa-s and 0.088% vinyl. Resin (B1 ) was a dimethylvinylated and trimethylated silica prepared by reaction of dimethylvinylchlorosilane and a reaction product of silicic acid, sodium salt, chlorotrimethylsilane, isopropyl alcohol, and water with a vinyl content of 1 .95%. Resin (B2) was a dimethylvinylated and trimethylated silica prepared by reaction of

dimethylvinylchlorosilane and a reaction product of silicic acid, sodium salt,

chlorotrimethylsilane, isopropyl alcohol, and water with a vinyl content of 3.17%. Crosslinker (C1 ) was trimethylsiloxy-terminated, poly(dimethyl/methylhydrogen)siloxane copolymer with of 5 mm²/s. Crosslinker (C2) was a dimethylhydrogensiloxy-modified silica with a viscosity of 23 mm²/s. Catalyst (D1 ) was a mixture containing 98 weight parts of a dimethylvinylsiloxy- terminated polydimethylsiloxane with a viscosity ranging from 300 to 600 mPa-s and a vinyl content ranging from 0.38% to 0.60%, 0.2 weight parts of 1 ,3 diethenyl 1 ,1 ,3.3.

tetramethyldisiloxane complex with platinum, and 1 weight part tetramethyl

tetravinyldisiloxane. Inhibitor (E1 ) was ethynyl cyclohexanol. Inhibitor (E2) was 3,5-dimethyl- 1 -hexyn-3-ol. The ad rem ingredients for each example were combined in different cups and mixed together with a dental mixer to give the Compositions (I) of Ex. 1 to 9 as shown below in Table 1 .

[00122] Table 1 : Examples of Compositions (I)

Ingredient

(parts or ppm) Ex. 1 Ex. 2 Ex. 3 Ex. 4 Ex. 5 Ex. 6 Ex. 7 Ex. 8 Ex. 9

Crosslinker

(C1 ) 4.8 0 0 6.5 0 0 0 7.1 6

Crosslinker

(C2) 0 3.7 4.6 0 5.3 4.9 6.3 0 0

Catalyst (D1 )

(ppm) 3 3 3 3 3 3 3 3 3

Inhibitor (E1 ) 0.01 0 0 0.01 0.01 0 0 0.01 0.01

Inhibitor (E2) 0 0.2 0.2 0 0 0.2 0.2 0 0

SiH/Vi ratio 1 .5 1 .5 1 .4 1 .5 1 .5 1 .5 1 .5 1 .5 1 .5

% Vi in Resin 2.0 2.0 1 .95 2.7 2.7 2.4 3.0 2.5 2.4

[00123] The resulting examples of Composition (I) in Table 1 were shaped and cured by injecting the compositions into optically polished molds, and holding the injected compositions in the molds at 130 ° C. to 180 ° C, typically for from 10 seconds to 5 minutes. The molds formed cured products of Ex. 1 to 9 by shaping and curing the ad rem

Compositions (I) in the shape of a tensile bar as described in ASTM D412 for measurement of tensile strength. Hardness and transmittance were measured on each tensile bar before the tensile strength testing. Hardness, tensile strength, elongation, and transmittance were measured as described above. The test results are shown below in Table 2.

[00124] Table 2: Test results of cured products of curing compositions of Table 1 .

[00125] Ex. (A1 ) to (A9) (prophetic): producing optomechanical bodies by shaping and curing the compositions of Ex. 1 to 9: In separate runs, each of the compositions of Ex. 1 to 9 is injected into an optically polished mold, and the respective injected compositions are held in the molds at 130⁰ C. to 180⁰ C. for from 10 seconds to 5 minutes to give the optomechanical bodies of Ex. (A1 ) to (A9), respectively. The optically polished mold is chosen such that ach of the optomechanical bodies of Ex. (A1 ) to (A7) has the linear l-shape with recessed portions and opposing undercuts as shown in Fig. 4; the optomechanical body of Ex. (A8) has the +-shape as shown in Fig. 6; and the optomechanical body of Ex. (A9) has the Y-shape as shown in Fig. 7.

[00126] Ex. (B1 ) to (B9) (prophetic): producing optic modules by adding at least one light element to the optomechanical bodies of Ex. (A1 ) to (A9): a board assembly supporting a different one of the following light elements: either an encapsulated LED chip/substrate subassembly, CCD, an optical camera, a photo-coupler, an optical waveguide, a lightguide, a light sensor, a light-reflecting coating, or a mirror is added to the optomechanical body of Ex. (A1 ) to (A9), respectively, to give the optic modules of Ex. (B1 ) to (B9) comprising the respective optomechanical body configured with the respective board assembly.

[00127] Ex. (C1 ) to (C7) (prophetic): producing modular optic devices by mechanically joining different combinations of the optic modules of Ex. (B1 ) to (B9) and optionally the optomechanical bodies of Ex. (A1 ) to (A9): The modular optic devices of Ex. (C1 ) to (C7) are prepared by mechanically joining the respective combinations of optic modules or optic modules and optomechanical bodies as follows:

[00128] Ex. (C1 ) = two mechanically joined optic modules (B1 ) to give the modular optic device (C1 ).

[00129] Ex. (C2) = three mechanically joined optic modules (B2) to give the modular optic device (C2).

[00130] Ex. (C3) = two optic modules (B3) mechanically joined to optomechanical body (A3) to give the modular optic device (C3).

[00131] Ex. (C4) = two optic modules (B4) mechanically joined to +-shaped optic module (B8) to give the modular optic device (C4) as shown in Fig. 8.

[00132] Ex. (C5) = three optic modules (B5) mechanically joined to Y-shaped optic module (B9) to give the modular optic device (C5).

[00133] Ex. (C6) = 20 optic modules (B6) mechanically joined together, and then one of the optic modules (B6) joined to optic module (B3) to give the modular optic device (C6).

[00134] Ex. (C7) = two optic modules (B7) and two optic modules (B1 ) mechanically joined to +-shaped optomechanical body (A8) to give the modular optic device (C7).

[00135] As used herein, "may" confers a choice, not an imperative. "Optionally" means is absent, alternatively is present. "Contacting" means bringing into physical contact. "Operative contact" comprises functionally effective touching, e.g., as for modifying, coating, adhering, sealing, or filling. The operative contact may be direct physical touching, alternatively indirect touching. All U.S. patent application publications and patents referenced herein, or a portion thereof if only the portion is referenced, are hereby incorporated herein by reference to the extent that incorporated subject matter does not conflict with the present description, which would control in any such conflict. All % are by weight unless otherwise noted. All "wt%" (weight percent) are, unless otherwise noted, based on total weight of all ingredients used to make the composition, which adds up to 100 wt%. Any Markush group comprising a genus and subgenus therein includes the subgenus in the genus, e.g., in "R is hydrocarbyl or alkenyl," R may be alkenyl, alternatively R may be hydrocarbyl, which includes, among other subgenuses, alkenyl. The term "silicone" includes linear, branched, or a mixture of linear and branched polyorganosiloxane macromolecules. The "light extraction" means getting light from one location to a surrounding location.

[00136] The below claims are incorporated by reference here, and the terms "claim" and "claims" are replaced by the term "aspect" or "aspects," respectively. Embodiments of the invention also include these resulting numbered aspects.

Claims

What is claimed is:

1 . An optomechanical body comprising a shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the joining portion of the optomechanical body when the optomechanical body is mechanically joined with a complementary joining portion of another optomechanical body.

2. The optomechanical body of claim 1 , wherein the shaped polyorganosiloxane defines the housing portion and at least two joining portions.

3. The optomechanical body of claim 1 or 2, wherein each joining portion independently is a plug or receptacle for forming a plug-and-receptacle joint or a receptacle for forming a 3-piece joint.

4. The optomechanical body of claim 3, wherein each joining portion independently is a plug or receptacle for forming a plug-and-receptacle joint and the plug is a ball and the receptacle is a socket for together forming a ball-and-socket joint, the plug is a post and the receptacle is a post-shaped aperture for together forming a post joint, the plug is a wedge and the receptacle is a wedge-shaped aperture for together forming a wedge joint, the plug is an arrowhead and the receptacle is an arrowhead- shaped aperture for together forming an arrow joint, or the plug is at least one prong and the receptacle is a same number of slot-shaped apertures for together forming a prong-slot joint.

5. The optomechanical body of any one preceding claim, wherein the optomechanical body defines at least one recessed portion for receiving a complementary-shaped light element, at least one undercut for slidably receiving a board assembly supporting a light element or light element subassembly, or both the at least one recessed portion and the at least one undercut.

6. A modular optomechanical device comprising first and second optomechanical

bodies, wherein each of the first and second optomechanical bodies independently is as according to any one of claims 1 to 5; wherein the first and second

optomechanical bodies each have at least one complementary joining portion, wherein the first optomechanical body is mechanically joined and optically coupled to the second optomechanical body via their respective complementary joining portions.

7. An optic module comprising the optomechanical body of any one preceding claim and at least one light element disposed in operative contact with the housing portion of the optomechanical body, wherein the at least one light element characteristically functions during operation of the optic module to emit, sense, guide, combine, optically couple, split, or filter light.

8. The optic module of claim 7 wherein the optomechanical body defines at least one recessed portion for receiving a complementary-shaped light element, at least one undercut for slidably receiving a board assembly supporting a light element or light element subassembly, or both the at least one recessed portion and the at least one undercut; and wherein the at least one light element is disposed within and in operative contact with the recessed portion of the housing portion of the

optomechanical body, or the board assembly is slidably engaged with the at least one undercut, or both the at least one light element is disposed within and in operative contact with the recessed portion of the housing portion of the

optomechanical body and the board assembly is slidably engaged with the at least one undercut .

9. The optic module of claim 7 or 8, wherein the at least one light element is a light emitting device, and the light emitting device is a light-emitting diode.

10. The optic module of any one of claims 7 to 9, further comprising a light modulation element for altering a pathway of light traveling in the optomechanical body.

1 1 . The optic module of claim 10, wherein the light modulation element is a light

extraction element for extracting light from the optic module at a predetermined location on the optomechanical body or a light redirection element for guiding light from the optic module to another optic module when the other optic module is disposed in light-receiving communication therewith.

12. The optic module of claim 10 or 1 1 , wherein the light modulation element is a light reflection element, light focusing element, light splitting element, or light diffusing element.

13. A modular optic device comprising optically-and-mechanically-joined first and second optic modules,

wherein the first optic module comprises a first optomechanical body and at least one light element, the first optomechanical body comprising a first shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the first optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the at least one joining portion of the first optomechanical body; wherein the second optic module comprises a second optomechanical body, the second optomechanical body comprising a silicate glass, a transparent organic polymer, or a second shaped polyorganosiloxane defining a housing portion and at least one joining portion, wherein the housing portion is for guiding light in the second optomechanical body and the joining portion is for forming a mechanical joint and effective optical interface at an exterior surface of the at least one joining portion of the second optomechanical body with the exterior surface of the at least one joining portion of the first optomechanical body of the first optic module; and

wherein at least one joining portion of the first optomechanical body of the first optic module is mechanically joined to at least one joining portion of the second optomechanical body of the second optic module and the exterior surface of the alt least one joining portion of the first optomechanical body opposes and contacts the exterior surface of the at least one joining portion of the second optomechanical body such that there is a mechanical joint and effective optical interface between the first and second optic modules.

14. The modular optic device of claim 13, wherein the second optic module further

comprises at least one light element disposed in operative contact with the second optomechanical body.

15. The modular optic device of claim 13 or 14, wherein the second optic module lacks a light emitting device.

16. The modular optic device of any one of claims 13 to 15, wherein the light element of the first optic module comprises at least one light emitting device for emitting light during operation of the modular optic device.

17. The modular optic device of any one of claims 13 to 16, wherein the second

optomechanical body comprises the second shaped polyorganosiloxane, which is the same as or different than the first shaped polyorganosiloxane.

18. The modular optic device of any one of claims claim 13 to 17 comprising a total of 3 or more optic modules, wherein the optomechanical body of each module comprises the first or second shaped polyorganosiloxane and wherein each optic module is mechanically-joined and optically-coupled to at least one other of the 3 or more optic modules via a mechanical joint and effective optical interface therebetween.

19. The modular optic device of any one of claims 13 to 16, wherein the second

optomechanical body comprises the silicate glass or the transparent organic polymer.

20. The modular optic device of any one of claims 13 to 19, further comprising an optical coupling agent disposed in operative contact with the opposing exterior surfaces of the joining portions of the first and second optomechanical bodies of the first and second optic modules.

21 . A kit comprising a plurality of optic modules and instructions for assembling same to give a modular optic device of any one of claims 13 to 20.

22. A method of manufacturing the modular optomechanical device of claim 6, the

method comprising shaping a curable polyorganosiloxane composition to give a shaped curable polyorganosiloxane composition and curing the shaped curable polyorganosiloxane composition to give a shaped and cured product as the first optomechanical body; repeating the shaping and curing steps with a same or different curable polyorganosiloxane composition to give a shaped and cured product as the second optomechanical body, wherein the shape of the first and second optomechanical bodies may be the same or different and wherein the first

optomechanical body has at least one joining means capable of forming a

mechanical joint with a joining means of the second optomechanical body; and mechanically joining the first and second optomechanical bodies via the mechanical joint so as to effectvely optically couple them and give the modular optomechanical device.

23. A modular optic device comprising optically-and-physically-joined first and second optic modules, wherein each of the first and second optomechanical bodies independently is as according to any one of claims 1 to 5; and the shaped

polyorganosiloxane of the optomechanical body of the first optic module is in physical contact with the shaped polyorganosiloxane of the optomechanical body of the second optic module such that such that there is an optophysical joint and effective optical interface between the first and second optic modules.