WO2014189228A1

WO2014189228A1 - Evaporation deposition apparatus

Info

Publication number: WO2014189228A1
Application number: PCT/KR2014/004331
Authority: WO
Inventors: Joo-In LEE; Jung-Hyung Kim; Yong-Shim YOO; ShinJae YOU; Yong-Hyeon Shin
Original assignee: Korea Research Institute Of Standards And Science
Priority date: 2013-05-21
Filing date: 2014-05-14
Publication date: 2014-11-27
Also published as: KR20140136671A; KR101486279B1; TW201502308A

Abstract

Provided is an evaporation deposition apparatus which includes an evaporation part providing an evaporation material through a connection path; a distribution part having a plurality of holes and injecting the evaporation material into a vacuum container through the holes; a dielectric part mounted in the vicinity of an opening of the vacuum container and disposed to protrude from the vacuum container and to cover the evaporation part and the distribution part; an induction coil covering the distribution part and the distribution part and inductively heating the evaporation part and the distribution part; and an alternating current (AC) power source supplying AC to the induction coil.

Description

EVAPORATION DEPOSITION APPARATUS

The present invention described herein generally relates to evaporation deposition apparatuses.

In vacuum evaporation deposition, a target material to be deposited is placed inside a high-vacuum chamber. The deposition target material is heated to evaporate its particles, and vapor is moved to form a thin film on a substrate.

An evaporation deposition apparatus includes a ceramic crucible and a heating unit to heat the crucible. Conventionally, the evaporation deposition apparatus performs bottom-up deposition to deposit a thin film on a substrate disposed on a top surface against the gravity by using evaporated vapor.

However, as substrate size increase, a substrate of a bottom-up deposition apparatus is warped. Accordingly, a top-down deposition apparatus or a lateral-flow deposition apparatus is required.

Conventionally, an organic light emitting diode (OLED) constituting an organic light emitting diode display includes a transparent substrate on which an anode is formed. A hole injection layer (HIL), a hole transport layer (HTL), an emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) are sequentially deposition on the anode. A cathode is formed on the electron transport layer (ETL).

Embodiments of the present invention provide a top-down large-sized evaporation deposition apparatus.

An evaporation deposition apparatus according to an embodiment of the present invention may include an evaporation part providing an evaporation material through a connection path; a distribution part having a plurality of holes and injecting the evaporation material into a vacuum container through the holes; a dielectric part mounted in the vicinity of an opening of the vacuum container and disposed to protrude from the vacuum container and to cover the evaporation part and the distribution part; an induction coil covering the evaporation part and the distribution part and inductively heating the evaporation part and the distribution part; and an alternating current (AC) power source supplying AC to the induction coil.

In an embodiment of the present invention, the evaporation part may include a cylindrical body part; the connection path extending to a top surface from a bottom surface of the body part; a storage space connected to the connection path and storing the evaporation material; a pipe-shaped protrusion in which the connection path is formed; a baffle lying on a top surface of the protrusion; an upper cover plate disposed on the baffle to seal the evaporation material into the storage space; and a fixing part disposed on the upper cover plate to be combined with the body part.

In an embodiment of the present invention, the baffle may include a cylindrical baffle support inserted into an outer circumferential surface of the protrusion; a baffle support plate disposed on a top surface of the baffle support and having a through-hole with an outer diameter smaller than an inner diameter of the body part and an inner diameter equal to or smaller than an inner diameter of the baffle support; and a baffle protrusion forming a path to be connected to the through-hole formed on a top surface of the baffle support plate.

In an embodiment of the present invention, the baffle may include a baffle pillar inserted into a top surface of the connection path; and a baffle support plate mounted on a top surface of the baffle pillar and having a trench extending from a bottom surface of the baffle pillar in a radius direction.

In an embodiment of the present invention, a diameter of the hole of the distribution part may decrease as latitude of a hemisphere increases.

In an embodiment of the present invention, the holes may be disposed at regular longitudinal intervals.

In an embodiment of the present invention, the evaporation part may further include a cavity connected to a lower portion of the connection path; a reflection plate disposed in the vicinity of a cavity inlet where the connection path and the cavity are joined and reflecting the evaporation material; and a cavity outlet disposed in an opposite direction to the cavity inlet. The evaporation material may be fed to the cavity through the connection path and the cavity inlet and may be injected through the cavity outlet.

In an embodiment of the present invention, the evaporation deposition apparatus may further include a reflection nozzle disposed to be connected to the cavity outlet. The reflection nozzle may be formed of a conductive material and may be inductively heated.

In an embodiment of the present invention, an equator plane of the distribution part may be mounted on a bottom surface of the evaporation part and the distribution part has a shape of hollow hemisphere, and the hole may be formed on a surface of the hemisphere.

In an embodiment of the present invention, the distribution part may have a disc shape, and a diameter of the hole with circular shape may increase as a radius in the center of the disc increases.

In an embodiment of the present invention, the distribution part may have a disc shape, the hole may be in the form of a washer cut in a radius direction, and an area of the hole may increase as a radius in the center of the disc increases.

In an embodiment of the present invention, the distribution part may have a disc shape, the hole may have a shape including two straight lines and one circular arc, and an intersection of the two straight lines may be disposed on a radius spaced apart from the center of the disc by a constant distance.

In an embodiment of the present invention, the evaporation deposition apparatus may further include an auxiliary evaporation part disposed over the evaporation part and including an auxiliary connection path; and a connection pipe connecting the auxiliary connection path to the connection path of the evaporation part. The auxiliary evaporation part feeds an auxiliary evaporation material through the auxiliary connection path exposed to a bottom surface.

In an embodiment of the present invention, the auxiliary evaporation part may include a cylindrical auxiliary body part; the auxiliary connection path extending to a top surface from a bottom surface of the auxiliary body part; an auxiliary storage space connected to the auxiliary connection path and storing an auxiliary evaporation material; a pipe-shaped auxiliary protrusion in which the auxiliary connection path is formed; an auxiliary baffle lying on a top surface of the auxiliary protrusion; an auxiliary upper cover plate disposed on the auxiliary baffle and sealing the auxiliary evaporation material into the storage space; and an auxiliary fixing part disposed on the auxiliary upper cover plate to be combined with the auxiliary body part.

In an embodiment of the present invention, the evaporation deposition apparatus may further include an auxiliary induction coil covering the dielectric part and inductively heating the auxiliary evaporation part; and an auxiliary AC power source supplying AC to the auxiliary induction coil.

In an embodiment of the present invention, the evaporation deposition apparatus may further include a gas pipe covering the auxiliary evaporation part to be in contact therewith.

As described so far, an evaporation deposition apparatus according to an embodiment of the present invention can provide a top-down large-area evaporation deposition apparatus.

The present invention will become more apparent in view of the attached drawings and accompanying detailed description. The embodiments depicted therein are provided by way of example, not by way of limitation, wherein like reference numerals refer to the same or similar elements. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating aspects of the present invention.

FIG. 1 is a cross-sectional view of an evaporation deposition apparatus according to an embodiment of the present invention.

FIG. 2A is a perspective view of a baffle of the evaporation deposition apparatus in FIG. 1, FIG. 2B is a cross-sectional view taken along a line I-I' in FIG. 2A, and FIG. 2C is a cross-sectional view taken along a line II-II' in FIG. 2A.

FIG. 3 is a perspective view of a distribution part of the evaporation deposition apparatus in FIG. 1.

FIG. 4 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 5 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 6A is a top plan view of a distribution part in FIG. 5, and FIG. 6B is a cross-sectional view taken along a line III-III' in FIG. 6A.

FIG. 7 is a top plan view of a distribution part according to another embodiment of the present invention.

FIG. 8 is a top plan view of a distribution part according to another embodiment of the present invention.

FIG. 9 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 10 is a perspective view of a baffle in FIG. 9.

FIG. 11 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 12 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

FIG. 13 illustrates an evaporation deposition apparatus according to another embodiment of the present invention.

Preferred embodiments of the present invention will be described below in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be constructed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

FIG. 1 is a cross-sectional view of an evaporation deposition apparatus 1000 according to an embodiment of the present invention.

FIG. 2A is a perspective view of a baffle of the evaporation deposition apparatus 100 in FIG. 1, FIG. 2B is a cross-sectional view taken along a line I-I' in FIG. 2A, and FIG. 2C is a cross-sectional view taken along a line II-II' in FIG. 2A.

FIG. 3 is a perspective view of a distribution part of the evaporation deposition apparatus 100 in FIG. 1.

Referring to FIG. 1, FIGS. 2A to 2C, and FIG. 3, the evaporation deposition apparatus 100 includes an evaporation part 120 providing an evaporation material 10 through a connection path 128, a distribution part 130 having a plurality of holes 132a to 132d and injecting the evaporation material 10 into a vacuum container 160 through the holes 132a to 132d, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 120 and the distribution part 130, an induction coil 140 covering the evaporation part 120 and the distribution part 130 and inductively heating the evaporation part 120 and the distribution part 130, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

The evaporation part 120 may include a cylindrical body part 120a, the connection path 128 extending to an upper portion from a lower portion of the body part 120a, a storage space 127 connected to the connection path 128 and storing the evaporation material 10, a pipe-shaped protrusion 129 in which the connection path 128 is formed, a baffle 126 lying on a top surface of the protrusion 129, an upper cover plate 124 disposed on the baffle 126 to seal the evaporation material 10 into the storage space 127, and a fixing part 122 disposed on the upper cover plate 124 to be combined with the body part 120a.

The body part 120a may have a cylindrical shape. A bottom surface of the body part 120a may be closed, and a top surface thereof may be opened and closed. The inside of the body part 120a may be form the storage space 127. The evaporation material 10 may be stored in the storage space 127. The body part 120a may be formed of a conductor and may be inductively heated. Thus, the evaporation material 10 may be heated to be evaporated.

The protrusion 129 protruding to a top surface of the storage space 127 may be disposed on a bottom surface of the storage space 127. The protrusion 129 may have a cylindrical pipe shape. The inside of the protrusion 129 may provide the connection path 128.

One end of the connection path 128 may be exposed to a top surface of the protrusion 129, and the other end thereof may be exposed to a bottom surface of the body part 120a. The connection path 128 may be a traveling path of an evaporated evaporation material.

The evaporation material 10 may be stored in the storage space 127. The evaporation material 10 may be an organic material used in an organic light emitting diode (OLED). Specifically, the organic material may include Tris(8-hydroxyquinolinato)aluminum(Al(C₉H₆NO)₃).

The baffle 126 may include a cylindrical baffle support 126d inserted into an outer circumferential surface of the protrusion 129, a baffle support plate 126e disposed on a top surface of the baffle support 126d and having a through-hole 126b with an outer diameter smaller than an inner diameter of the body part 120a and an inner diameter equal to or smaller than an inner diameter of the baffle support 126d, and a baffle protrusion 126a forming a path to be connected to the through-hole 126b formed on a top surface of the baffle support plate 126e.

The baffle support 126d may have a cylindrical shape, and an inner diameter of the baffle support 126d may be substantially equal to an outer diameter of the protrusion 129. The baffle support 126d may be inserted into an upper portion of the protrusion 129.

The baffle support plate 126e may have a disc shape, and the baffle support 126d may be connected to a bottom surface of the baffle support plate 126e. The support plate 126e may have a through-hole 126b formed in its center. A diameter of the through-hole 126b may be smaller than an outer diameter of the baffler support 126d. The diameter of the through-hole 126b may be smaller than an outer diameter of the protrusion 129 and larger than a diameter of the connection path 128.

The baffle protrusion 126a may be in the form of a washer cut in a radius direction. The evaporation material 10 may be provided over the baffle support plate 126e through the outside of the baffle support plate 126e. The evaporation material 10 may be fed to the through-hole 126b and the connection path 128 through an empty space 126c between the baffle protrusions 126a.

The upper cover plate 124 may have a disc shape and have an edge inclined at a constant angle. The inclined surface may be combined with an inclined portion formed at the body part 120a. Thus, the upper cover plate 124 may seal the body part 120a.

The fixing part 122 may have a disc shape and may include a coupling member such as a screw thread formed on its side surface. The coupling member may be coupled to a screw groove formed at the body part 120a. Thus, the fixing part 122 may pressurize the upper cover plate 124.

The distribution part 130 may be means for spatially uniformly distributing an evaporation material fed through the connection path 128. The distribution part 130 may be formed of a conductive material and may be inductively heated.

The distribution part 130 may have a plurality of holes 132a to 132d and may inject the evaporation material into the vacuum container 160 through the holes 132a to 132d. The distribution part 130 may have a hollow hemisphere shape. An equator plane of the distribution part 130 may be mounted on a bottom surface of the evaporation part 120. The hole may be formed on a hemispherical surface. The distribution part 130 may have a shape of a hat with a band tied therearound.

The hole may include a first hole 132a formed at a hemispherical pole and a second hole 132b formed along regularly spaced longitudes at a constant latitude. The hole may further include a third hole 132c formed along regularly spaced longitudes at a latitude lower than the latitude of the second hole 132b. The hole may further include a fourth hole 132d formed along regularly spaced longitudes at a latitude lower than the latitude of the third hole 132c. Diameters of the holes 132a to 132d may increase as their latitudes decrease. The minimum latitude at which the hole is formed may be 45 degrees.

Vapor injected through the hole of the distribution part 130 may form a thin film on a substrate 174. In addition, vapor reflected in the vicinity of the hole of the distribution part 130 may be resupplied to the connection path 128 by hemispherical characteristics. Thus, vapor may be stably provided in a constant form.

The dielectric part 110 may be disposed to cover the distribution part 130 and the evaporation part 120. The dielectric part 110 may be disposed on the opening 162 of the vacuum container 160, and the inside of the dielectric part 110 may be maintained in a vacuum state. For achieving this, an O-ring groove may be formed around the opening 162 of the vacuum container 160. An O-ring inserted into the O-ring groove may provide vacuum sealing between the vacuum container 160 and the dielectric part 110.

The dielectric part 110 may be formed of a dielectric material such as quartz, alumina, sapphire, and ceramic. The dielectric part 110 may have a bell-jar shape. The dielectric part 110 may have a cylindrical portion, and an inner diameter of the cylindrical portion may be greater than an outer diameter of the body part 120a.

An evaporation support 180 may be disposed inside the dielectric part 110. The evaporation support 180 may be disposed between the outside of the opening of the vacuum container 160 and the evaporation part 120. The evaporation support 180 may be made of a dielectric material.

The induction coil 140 may be disposed to cover the evaporation part 120 and the distribution part 130. The induction coil 140 may be disposed outside the dielectric part 110. The induction coil 140 may be disposed to cover the dielectric part 110. The induction coil 140 may inductively heat the evaporation part 120 and the distribution part 130 disposed inside the dielectric part 110. The induction coil 140 may be a solenoid-type coil. The induction coil 140 may be in the form of a pipe, and a coolant may flow within the induction coil. 140. The number of windings per length of the induction coil 140 may vary depending on positions. Accordingly, a temperature gradient of a heated portion may be provided. For example, a temperature of the distribution part 130 may be higher than that of the evaporation part 120.

The AC power source 150 supplies current to both ends of the induction coil 140. A frequency of the AC power source 150 may range from a few hundred hertz (Hz) to several megahertz (MHz).

The vacuum container 160 may include a substrate holder 172 and a substrate 174 mounted on the substrate holder 172. The substrate 174 may be a glass or plastic substrate including an organic light emitting diode (OLED).

The vacuum container 160 may be formed of a conductive material. The vacuum container 160 and the induction coil 140 may be spaced apart from each other by a predetermined distance or more to suppress loss caused by induction heating. The evaporation part 120 may deposit a thin film on the substrate 174 in a top-down manner.

FIG. 4 illustrates an evaporation deposition apparatus 200 according to another embodiment of the present invention.

Referring to FIG. 4, the evaporation deposition apparatus 200 includes an evaporation part 220 providing an evaporation material 20 through a connection path 228, a distribution part 130 having a plurality of holes and injecting the evaporation material 20 into a vacuum container 160 through the holes, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 220 and the distribution part 130, an induction coil 140 covering the evaporation part 220 and the distribution part 130 and inductively heating the evaporation part 220 and the distribution part 130, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

The evaporation part 220 may include a cylindrical body part 220a, the connection path 228 extending to an upper portion from an lower portion of the body part 220a, a storage space 227 connected to the connection path 228 and storing the evaporation material 20, a pipe-shaped protrusion 229 in which the connection path 228 is formed, a baffle 226 lying on a top surface of the protrusion 229, an upper cover plate 224 disposed on the baffle 226 to seal the evaporation material 20 into the storage space 227, and a fixing part 222 disposed on the upper cover plate 224 to be combined with the body part 220a.

The evaporation part 220 may include a cavity 221 connected to a lower portion of the connection path 228, a reflection plate 223 disposed in the vicinity of a cavity inlet where the connection path 228 and the cavity 221 are joined and reflecting the evaporation material 20, and a cavity outlet 221a disposed in an opposite direction to the cavity inlet. The evaporation material 20 may be fed to the cavity 221 through the connection path 228 and the cavity inlet and may be injected through the cavity outlet 221a.

The cavity 221 may have an integrating sphere shape. The cavity 221 and the body part 220a may be formed in one body. The cavity 221 may have an inner empty space. Vapor provided through the cavity inlet may be reflected two or more times to be injected in the form of a point light source through the cavity outlet 221a. The cavity inlet may be connected to the connection path 228. The reflection plate 223 may be disposed at the cavity inlet. The reflection plate 223 may prevent the vapor provided through the connection path 228 from being injected to the cavity outlet 221a. The reflection plate 223 may be formed of a conductor, and an inducted electric field passing through the body part 220a may inductively heat the reflection plate 223.

The distribution part 130 may spatially distribute the vapor injected through the cavity outlet 221a. The distribution part 130 may be inductively heated by the induction coil 140.

FIG. 5 illustrates an evaporation deposition apparatus 300 according to another embodiment of the present invention.

Referring to FIG. 5 and FIGS. 6A and 6B, the evaporation deposition apparatus 300 includes an evaporation part 220 providing an evaporation material 20 through a connection path 228, a distribution part 330 having a plurality of holes and injecting the evaporation material 20 into a vacuum container 160 through the holes, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 220 and the distribution part 330, an induction coil 140 covering the evaporation part 220 and the distribution part 130 and inductively heating the evaporation part 220 and the distribution part 330, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

The cavity 221 may have an integrating sphere shape. A reflection nozzle 390 may be disposed to be connected to the cavity outlet 221a. The reflection nozzle 390 may be formed of a conductive material and may be inductively heated by the induction coil 140. An inlet of the reflection nozzle 390 may be disposed to be connected to the cavity outlet 221a, and an outlet thereof may be disposed to face a substrate 174. The reflection nozzle 390 may have a predetermined tilt angle to have a predetermined solid angle to the vapor injected from the cavity outlet 221a. The tilt angle of the reflection nozzle 390 may be between 30 degrees and 60 degrees.

The distribution part 330 may spatially distribute vapor injected through the reflection nozzle 390. The distribution part 330 may be inductively heated by the induction coil 140.

The distribution part 330 may be disposed at an outlet of the reflection nozzle 390. The distribution part 330 may have a shape of a disc with a plurality of holes 332a to 332d. As a diameter increases in the center of the disc, diameters of the holes 332a to 332d may increase. Each of the holes 332a to 332d may be circular. The holes 332a to 332d may be arranged in a matrix. Each of the holes 332a to 332d may be tapered.

A first hole 332a may be disposed in the center of the distribution part 330. A second hole 332b may be disposed around the first hole 332a. A third hole 332c may be disposed outside the circumference along which the second hole 332b is disposed. A fourth hole 332d may be disposed outside the circumference along which the third hole 332c is disposed. A diameter b2 of the second hole 332b may be greater than a diameter b1 of the first hole 332a. A diameter b3 of the third hole 332c may be greater than the diameter b2 of the second hole 332b. A diameter b4 of the fourth hole 332d may be greater than the diameter b3 of the third hole 332c.

FIG. 7 is a top plan view of a distribution part 430 according to another embodiment of the present invention.

Referring to FIG. 7, the distribution part 430 may spatially distribute vapor injected through a connection path, a cavity outlet or a reflection nozzle. The distribution part 430 may be inductively heated by an induction coil.

The distribution 430 may have a disc shape, each of holes 432a to 432c may be in the form of a washer cut in a radius direction, and an area of each of the holes 432a to 432c may increase as a radius increases in the center of the disc.

The distribution part 430 may have a shape of a disc with a plurality of holes 432a to 432c. First holes 432a may be disposed at regular intervals in a direction from the center. Second holes 432b may be disposed around the first holes 432a. Third holes 432c may be disposed outside the circumference along which the second holes 432b are disposed. The first to third holes 432a to 432c may be arranged in a radius direction.

FIG. 8 is a top plan view of a distribution part 530 according to another embodiment of the present invention.

Referring to FIG. 8, the distribution part 530 may spatially distribute vapor injected through a connection path, a cavity outlet or a reflection nozzle. The distribution part 530 may be inductively heated by an induction coil.

The distribution part 530 may have a disc shape, and each of holes 532 may have a shape including two straight lines and one circular arc. The intersection of the two straight lines may be disposed on a radius spaced apart from the center of the disc by a constant distance. The holes 532 may be disposed at regular intervals in a direction of rotation on the basis of the center.

FIG. 9 illustrates an evaporation deposition apparatus 600 according to another embodiment of the present invention.

FIG. 10 is a perspective view of a baffle in FIG. 9.

Referring to FIGS. 9 and 10, the evaporation deposition apparatus 600 includes an evaporation part 220 providing an evaporation material 20 through a connection path 228, a distribution part 130 having a plurality of holes and injecting the evaporation material 20 into a vacuum container 160 through the holes, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 220 and the distribution part 130, an induction coil 140 covering the evaporation part 220 and the distribution part 130 and inductively heating the evaporation part 220 and the distribution part 130, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

The evaporation part 220 may include a cylindrical body part 220a, the connection path 228 extending to an upper portion from an lower portion of the body part 220a, a storage space 227 connected to the connection path 228 and storing the evaporation material 20, a pipe-shaped protrusion 229 in which the connection path 228 is formed, a baffle 626 lying on a top surface of the protrusion 229, an upper cover plate 224 disposed on the baffle 626 to seal the evaporation material 20 into the storage space 227, and a fixing part 222 disposed on the upper cover plate 224 to be combined with the body part 220a.

The baffle 626 may include a baffle pillar 626a inserted into a top surface of the connection path 228 and a baffle support plate 626b mounted on a top surface of the baffle pillar 626a and having a trench 626c extending from a bottom surface of the baffle pillar 626a in a radius direction. An evaporated evaporation material may be fed to the connection path 228 through the trench 626c.

The distribution part 130 may spatially distribute vapor injected through a connection path, a cavity outlet or a reflection nozzle. The distribution part 130 may be inductively heated by the induction coil 140.

The distribution part 130 may have a plurality of holes and may inject the evaporation material into the vacuum container 160 through the holes. The distribution part 130 may have a hollow hemispherical shape. An equator plane of the distribution part 130 may be mounted on a bottom surface of the evaporation part 220. The holes may be formed on the hemispherical surface.

FIG. 11 illustrates an evaporation deposition apparatus 700 according to another embodiment of the present invention.

Referring to FIG. 11, the evaporation deposition apparatus 700 includes an evaporation part 220 providing an evaporation material 20 through a connection path 228, a distribution part 130 having a plurality of holes and injecting the evaporation material 20 into a vacuum container 160 through the holes, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 220 and the distribution part 130, an induction coil 240 covering the evaporation part 220 and the distribution part 130 and inductively heating the evaporation part 220 and the distribution part 130, and an alternating current (AC) power source 250 supplying AC to the induction coil 240.

The evaporation deposition apparatus 700 may include an auxiliary evaporation part 720 disposed over the evaporation part 220 and including an auxiliary connection path 728 exposed to a bottom surface and a connection pipe 12 connecting the auxiliary connection path 728 to the connection path 228 of the evaporation part 220. The auxiliary evaporation part 720 may feed an auxiliary evaporation material 70 through the auxiliary connection path 728 exposed to a bottom surface.

The evaporation part 220 may include a cylindrical body part 220a, the connection path 228 extending to an upper portion from a lower portion of the body part 220a, a storage space 227 connected to the connection path 228 and storing the evaporation material 20, a pipe-shaped protrusion 229 in which the connection path 228 is formed, a baffle 226 lying on a top surface of the protrusion 229, an upper cover plate 224 disposed on the baffle 226 to seal the evaporation material 20 into the storage space 227, and a fixing part 222 disposed on the upper cover plate 224 to be combined with the body part 220a.

The auxiliary evaporation part 720 may include a cylindrical auxiliary body part 720a, the auxiliary connection path 728 extending to a top surface from a bottom surface of the auxiliary body part 720a, an auxiliary storage space 727 connected to the auxiliary connection path 728 and storing an auxiliary evaporation material 70, a pipe-shaped auxiliary protrusion 729 in which the auxiliary connection path 728 is formed, an auxiliary baffle 726 lying on a top surface of the auxiliary protrusion 729, an auxiliary upper cover plate 724 disposed on the auxiliary baffle 726 and sealing the auxiliary evaporation material 70 into the storage space 727, and an auxiliary fixing part 722 disposed on the auxiliary upper cover plate 724 to be combined with the auxiliary body part 720a.

A connection pipe 12 connecting the auxiliary connection path 728 to the connection path 228 of the evaporation part 220 may extend near the cavity inlet. Thus, the evaporation material 20 and the auxiliary evaporation material 70 may be fed to the cavity 221 through the reflection plate 223. The connection pipe 12 may penetrate the upper cover plate 224 and the fixing part 222.

The distribution part 130 may spatially distribute vapor injected through a connection path, a cavity outlet or a reflection nozzle. The distribution part 130 may be inductively heated by the induction coil 240.

An auxiliary induction coil 740 may cover the dielectric part 110 and the auxiliary evaporation part 720 and may inductively heat the auxiliary evaporation part 720. The auxiliary induction coil 740 may be in the form of a solenoid. An auxiliary AC power source 750 may supply AC to the auxiliary induction coil 740. A frequency of the auxiliary AC power source 750 and a frequency of the AC power source 250 may be different from each other to prevent their mutual interference.

FIG. 12 illustrates an evaporation deposition apparatus 800 according to another embodiment of the present invention.

Referring to FIG. 12, the evaporation deposition apparatus 800 includes an evaporation part 220 providing an evaporation material 20 through a connection path 228, a distribution part 130 having a plurality of holes and injecting the evaporation material 20 into a vacuum container 160 through the holes, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 220 and the distribution part 130, an induction coil 140 covering the distribution part 220 and the distribution part 130 and inductively heating the evaporation part 220 and the distribution part 130, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

An auxiliary evaporation part 820 is disposed over the evaporation part 220 and includes an auxiliary connection path 728. A connection pipe 12 connects the auxiliary connection path 728 of the auxiliary evaporation part 820 to the connection path 228 of the evaporation part 220.

The auxiliary evaporation part 820 may feed an auxiliary evaporation material 80 through the auxiliary connection path 828. A connection pipe 12 may be disposed to connect the connection path 828 of the auxiliary evaporation part 820 to the connection path 228 of the evaporation part 220.

The auxiliary evaporation part 820 may include a cylindrical auxiliary body part 820a, the auxiliary connection path 828 extending to a top surface from a bottom surface of the auxiliary body part 820a, an auxiliary storage space 827 connected to the auxiliary connection path 828 and storing an auxiliary evaporation material 80, a pipe-shaped auxiliary protrusion 829 in which the auxiliary connection path 828 is formed, an auxiliary baffle 826 lying on a top surface of the auxiliary protrusion 829, an auxiliary upper cover plate 824 disposed on the auxiliary baffle 826 and sealing the auxiliary evaporation material 80 into the storage space 827, and an auxiliary fixing part 822 disposed on the auxiliary upper cover plate 824 to be combined with the auxiliary body part 820a.

The auxiliary evaporation part 820 may include a gas pipe 14 covering an outer circumferential surface to be in contact therewith. A fluid may pass through the inside of the gas pipe 14 to independently adjust a temperature of the auxiliary evaporation part 820. The gas pipe 14 may extend to the outside of the dielectric part 110.

FIG. 13 illustrates an evaporation deposition apparatus 100a according to another embodiment of the present invention.

Referring to FIG. 13, the evaporation deposition apparatus 100a include an evaporation part 120 providing an evaporation material 10 through a connection path 128, a distribution part 130 having a plurality of holes 132a to 132d and injecting the evaporation material 10 into a vacuum container 160 through the holes 132a to 132d, a dielectric part 110 mounted in the vicinity of an opening 162 of the vacuum container 160 and disposed to protrude from the vacuum container 160 and to cover the evaporation part 120 and the distribution part 130, an induction coil 140 covering the evaporation part 120 and the distribution part 130 and inductively heating the evaporation part 120 and the distribution part 130, and an alternating current (AC) power source 150 supplying AC to the induction coil 140.

The induction coil 140 may be disposed inside the dielectric part 110 to cover the evaporation part 120 and the distribution part 130. The induction coil 140 may be spaced apart from the evaporation part 120 and the distribution part 130 or may include a dielectric outer cover to prevent electrical contact therewith.

Although the present invention has been described in connection with the embodiment of the present invention illustrated in the accompanying drawings, it is not limited thereto. It will be apparent to those skilled in the art that various substitutions, modifications and changes may be made without departing from the scope and spirit of the present invention.

Claims

An evaporation deposition apparatus comprising:

an evaporation part providing an evaporation material through a connection path;

a distribution part having a plurality of holes and injecting the evaporation material into a vacuum container through the holes;

a dielectric part mounted in the vicinity of an opening of the vacuum container and disposed to protrude from the vacuum container and to cover the evaporation part and the distribution part;

an induction coil covering the evaporation part and the distribution part and inductively heating the evaporation part and the distribution part; and

an alternating current (AC) power source supplying AC to the induction coil.
The evaporation deposition apparatus of claim 1, wherein the evaporation part comprises:

a cylindrical body part;

the connection path extending to a top surface from a bottom surface of the body part;

a storage space connected to the connection path and storing the evaporation material;

a pipe-shaped protrusion in which the connection path is formed;

a baffle lying on a top surface of the protrusion;

an upper cover plate disposed on the baffle to seal the evaporation material into the storage space; and

a fixing part disposed on the upper cover plate to be combined with the body part.
The evaporation deposition apparatus of claim 2, wherein the baffle comprises:

a cylindrical baffle support inserted into an outer circumferential surface of the protrusion;

a baffle support plate disposed on a top surface of the baffle support and having a through-hole with an outer diameter smaller than an inner diameter of the body part and an inner diameter equal to or smaller than an inner diameter of the baffle support; and

a baffle protrusion forming a path to be connected to the through-hole formed on a top surface of the baffle support plate.
The evaporation deposition apparatus of claim 2, wherein the baffle comprises:

a baffle pillar inserted into a top surface of the connection path; and

a baffle support plate mounted on a top surface of the baffle pillar and having a trench extending from a bottom surface of the baffle pillar in a radius direction.
The evaporation deposition apparatus of claim 1, wherein a diameter of the hole of the distribution part decreases as latitude of a hemisphere increases.
The evaporation deposition apparatus of claim 5, wherein the holes are disposed at regular longitudinal intervals.
The evaporation deposition apparatus of claim 1, wherein the evaporation part further comprises:

a cavity connected to a lower portion of the connection path;

a reflection plate disposed in the vicinity of a cavity inlet where the connection path and the cavity are joined and reflecting the evaporation material; and

a cavity outlet disposed in an opposite direction to the cavity inlet,

wherein the evaporation material is fed to the cavity through the connection path and the cavity inlet and is injected through the cavity outlet.
The evaporation deposition apparatus of claim 7, further comprising:

a reflection nozzle disposed to be connected to the cavity outlet,

wherein the reflection nozzle is formed of a conductive material and inductively heated.
The evaporation deposition apparatus of claim 1, wherein an equator plane of the distribution part is mounted on a bottom surface of the evaporation part and the distribution part has a shape of hollow hemisphere, and

wherein the hole is formed on a surface of the hemisphere.
The evaporation deposition apparatus of claim 1, wherein the distribution part has a disc shape, and a diameter of the hole with circular shape increases as a radius in the center of the disc e increases.
The evaporation deposition apparatus of claim 1, wherein the distribution part has a disc shape, the hole is in the form of a washer cut in a radius direction, and an area of the hole increases as a radius in the center of the disc increases.
The evaporation deposition apparatus of claim 1, wherein the distribution part has a disc shape;

wherein the hole has a shape including two straight lines and one circular arc; and

wherein an intersection of the two straight lines is disposed on a radius spaced apart from the center of the disc by a constant distance.
The evaporation deposition apparatus of claim 1, further comprising:

an auxiliary evaporation part disposed over the evaporation part and including an auxiliary connection path; and

a connection pipe connecting the auxiliary connection path to the connection path of the evaporation part,

wherein the auxiliary evaporation part feeds an auxiliary evaporation material through the auxiliary connection path exposed to a bottom surface.
The evaporation deposition apparatus of claim 1, wherein the auxiliary evaporation part comprises:

a cylindrical auxiliary body part;

the auxiliary connection path extending to a top surface from a bottom surface of the auxiliary body part;

an auxiliary storage space connected to the auxiliary connection path and storing an auxiliary evaporation material,

a pipe-shaped auxiliary protrusion in which the auxiliary connection path is formed;

an auxiliary baffle lying on a top surface of the auxiliary protrusion;

an auxiliary upper cover plate disposed on the auxiliary baffle and sealing the auxiliary evaporation material into the storage space; and

an auxiliary fixing part disposed on the auxiliary upper cover plate to be combined with the auxiliary body part.
The evaporation deposition apparatus of claim 13, further comprising:

an auxiliary induction coil covering the dielectric part and inductively heating the auxiliary evaporation part; and

an auxiliary AC power source supplying AC to the auxiliary induction coil.
The evaporation deposition apparatus of claim 13, further comprising:

a gas pipe covering the auxiliary evaporation part to be in contact therewith.