WO2014185543A1

WO2014185543A1 - Apparatus for mounting electronic component

Info

Publication number: WO2014185543A1
Application number: PCT/JP2014/063140
Authority: WO
Inventors: 佳久角田; 恒平池田; 冨田　秀司; 岸田　晃
Original assignee: 日清紡メカトロニクス株式会社
Priority date: 2013-05-17
Filing date: 2014-05-14
Publication date: 2014-11-20
Also published as: JP2014225586A; TW201513760A; CN105230137A

Abstract

Provided is an apparatus for mounting an electronic element, the apparatus being capable of suppressing the damage to the electronic element, the scattering of solder, and the damage to a substrate, and enabling soldering of the electronic element to a printed circuit board in a shorter amount of time than in the past. This apparatus (100) for mounting an electronic component (112) mounts an electronic element (108) on a printed circuit board (122) having a flexible substrate (122A) and a wiring pattern (122B) on the substrate, the apparatus for mounting an electronic component having: a supply device (102) for supplying solder (104) onto the wiring pattern (122B) of the printed circuit board (122); a placement device (106) for placing the electronic element (108) on the solder (104); and a laser (110) for directing light having a light-emission center wavelength within a range of 700-1100 nm from the back-surface (124) side of the printed circuit board toward the solder (104) on which the electronic element (108) is placed, the light passing through the substrate (122A) and reaching the wiring pattern (122B), heating the wiring pattern (122B) and causing the solder (104) to melt, and soldering the electronic element (108) to the printed circuit board (122).

Description

Electronic component mounting equipment

The present invention relates to an electronic element mounting apparatus, an electronic component manufacturing method, and a method of manufacturing LED lighting including steps of the manufacturing method for mounting an electronic element on a printed wiring board to manufacture an electronic component.

When an electronic element is mounted on a printed circuit board having a wiring pattern on the board and the printed circuit board to obtain an electronic component, a main method for soldering the electronic element to the printed wiring board is a reflow method. This is because electronic elements are mounted on the wiring pattern on the surface of the printed wiring board via solder, and then the printed wiring board is transported into a reflow furnace and hot air at a predetermined temperature is blown to the printed wiring board in the reflow furnace. By soldering, the solder paste is melted and the electronic element is soldered to the printed wiring board. The temperature in the reflow furnace is about 250 ° C. to 260 ° C.
The reflow method requires a high temperature as described above and heats not only the solder but also the entire substrate and the electronic element. For this reason, the substrate is distorted and the quality is affected, the electronic element is adversely affected by heat, or in the case of a long substrate, a long reflow furnace is required, and the installation space of the device becomes too wide. It was. As an adverse effect on the electronic element, if the electronic element is an LED element, the fluorescent agent in the LED element portion deteriorates when exposed to heat in a reflow furnace for a long time, and as a result, sufficient luminance cannot be obtained. There was also a problem.
Therefore, in recent years, attention has been given to a technique in which solder is locally heated by a laser to solder an electronic element to a printed wiring board.
First, as shown in FIG. 4, after the electronic element 408 is placed on the printed wiring board 422 via the solder 404, the solder 404 is directly irradiated with light from the surface side of the printed wiring board 422. A method is known in which solder is melted and an electronic element is soldered to a printed wiring board.
Patent Document 1 describes a method of irradiating light with a laser from the back side of a printed wiring board on which an electronic component is placed via solder, melting the solder, and soldering the electronic element to the printed wiring board. Has been. In this method, as shown in FIG. 5, an electronic element 508 is placed on a wiring pattern 522B of a printed wiring board 522 composed of a flexible substrate 522A mainly composed of polyimide resin and a wiring pattern 522B through solder 504. Then, light is irradiated from the back surface 524 side of the printed wiring board by a YAG laser or the like. In this method, the laser beam does not pass through the substrate 522A, and the substrate 522A absorbs the laser beam. As a result, the substrate 522A is heated, and the heat is transferred from the substrate 522A to the solder 504, thereby melting the solder.
Furthermore, in Patent Document 2, an opening is provided in the substrate, a conductive member and solder on the conductive member are disposed in the opening, and the conductive member is irradiated with light from the back surface side of the substrate. A method of heating solder indirectly through a conductive member is described.
JP 2001-111207 A JP 2006-278385 A

However, the conventional soldering method using a laser has the following problems. First, in the method shown in FIG. 4, since laser light is irradiated from the surface side of the printed wiring board, there is a possibility that the light hits the electronic element 408 and damages the electronic element. Further, since the solder is directly irradiated with laser light, the solvent component contained in the solder paste bumps and solder scatters, resulting in a problem that a large number of solder balls are formed on the substrate. In this case, a short circuit caused by a solder ball is not preferable because it adversely affects the performance of the electronic component.
In the method described in Patent Document 1, since the solder 504 is heated by heat transfer from the substrate 522A to the solder 504, the heating efficiency is low and the solder cannot be sufficiently heated, or the soldering is very time consuming. There was a problem that it took. Further, when the present inventors further studied this method, it was found that the light irradiation site of the substrate was damaged, such as melting or scorching. Further, this method cannot use a flexible substrate other than polyimide.
Furthermore, the method described in Patent Document 2 is not practical because an opening is provided in the substrate.
Therefore, although a suitable and practical technique for locally heating the solder with a laser and soldering the electronic element to the printed wiring board is required, it has not yet existed.
Therefore, in view of the above problems, the present invention can suppress electronic element damage, solder scattering, and substrate damage, and can solder an electronic element to a printed wiring board in a shorter time than before. An object of the present invention is to provide an electronic component mounting apparatus and an electronic component manufacturing method together with an LED illumination manufacturing method including the manufacturing method.

As a result of intensive studies by the inventor in order to achieve the above object, the light incident from the back surface of the printed wiring board directly heats the wiring pattern by irradiating laser light of a specific wavelength from the back surface of the printed wiring board. It has been found that a new solder heating mechanism can be realized and, as a result, the above object can be achieved, and the present invention has been completed. This invention is based on said knowledge and examination, The summary structure is as follows.
An electronic element mounting apparatus according to a first aspect of the present invention is an electronic element mounting apparatus for mounting an electronic element on a flexible printed circuit board and a printed wiring board having a wiring pattern on the printed circuit board. A supply device for supplying solder, a mounting device for mounting the electronic element on the solder, and a light having an emission center wavelength in a near-infrared light region toward the solder on which the electronic element is mounted Irradiating from the back side of the printed wiring board, and the light passes through the substrate to reach the wiring pattern, heats the wiring pattern, melts the solder, and The element is soldered to the printed wiring board.
According to the electronic device mounting apparatus of the first aspect of the invention, the electronic device is soldered to the printed wiring board in a shorter time than before, and the electronic device is prevented from being damaged, the solder is scattered, and the substrate is damaged. An element can be mounted. Moreover, since the reflow furnace is not used, the printed wiring board is not heated for a long time, so that an inexpensive material having no heat resistance can be used as the material of the printed wiring board.
According to a second aspect of the present invention, there is provided the electronic device mounting apparatus according to the first aspect, wherein a plurality of the supply device, the mounting device, or the laser are provided.
According to the electronic device mounting apparatus of the second invention, a plurality of solder supply devices, electronic device mounting devices, or soldering lasers are provided. Thus, the usage of the apparatus can be greatly expanded.
By providing a plurality of solder supply devices, it is possible to cope with mounting of various types of electronic elements. Since a plurality of supply devices are provided, if there are a plurality of electronic element mounting portions (soldering portions), it is possible to supply solder simultaneously.
Since a plurality of electronic element mounting devices are provided, when adjacent electronic elements are close to each other and cannot be mounted at the same time, the first electronic element is first mounted and then the substrate is run. The electronic element can be placed at an adjacent position by another placement device without being moved.
By providing a plurality of lasers, it is possible to cope with mounting of various types of electronic elements. Since a plurality of lasers are provided, if there are a plurality of electronic element mounting portions (soldering portions), it is possible to perform laser irradiation and soldering simultaneously.
According to the electronic element mounting apparatus of the second invention, a plurality of electronic elements are simultaneously mounted on the flexible substrate, and the plurality of solder supply devices and the plurality of lasers cooperate to mount the plurality of electronic elements. be able to. Therefore, the electronic element can be mounted on the flexible substrate at a much higher speed than conventional.
Further, by adding an axis moving device to the supply device, the mounting device, or the laser, it is possible to easily cope with the change or increase in the mounting location of the electronic element.
According to a third aspect of the present invention, there is provided the electronic device mounting apparatus according to the first or second aspect, wherein the transmittance of the substrate at the emission center wavelength of the light irradiated from the back surface of the printed wiring board is 20% or more. It is said.
According to the electronic device mounting apparatus of the third invention, the laser beam transmittance of the flexible substrate is 20% or more, and the laser beam transmitted through the substrate can be heated in a short time without damaging the electronic device. An electronic element can be mounted by soldering.
The electronic device mounting apparatus according to a fourth aspect of the present invention is the electronic device mounting apparatus according to any one of the first to third aspects, wherein the printed wiring board is stretched between a pair of reels, and the printed wiring board is moved between the reels. A plurality of the electronic elements are continuously mounted on the printed wiring board.
In the electronic device mounting apparatus according to the fourth aspect of the invention, when the solder is supplied by the supply device, the nozzle at the tip thereof is separated from the flexible substrate by a certain distance, so that the flexible substrate is continuously moved and moved. It comes out. Further, the effects of the first invention and the second invention are also synergistic, and the electronic element can be mounted on the substrate in a short time (high speed).
In addition, the flexible board wound around the reel is supplied while being pulled out, and the board on which the electronic elements have been mounted is wound around the reel for storage. The length can be about 1/10. Therefore, the electronic device mounting apparatus according to the fourth aspect of the present invention can mount electronic devices at a much higher speed and higher efficiency than the conventional one, and can further reduce the installation space.
In the case of an apparatus having a conventional configuration, when manufacturing a mounting board for a long LED lighting device, a reflow furnace is used. Therefore, in order to manufacture a long mounting board, a plurality of short mounting boards are used. It was manufactured by a method of manufacturing and electrically connecting them. However, since the mounting apparatus of the present invention uses a flexible substrate, any long mounting substrate can be manufactured. The mounting of electronic elements can be made highly efficient.
According to a fifth aspect of the present invention, there is provided the electronic device mounting apparatus according to any one of the first to fourth aspects, wherein the output of the laser is within a range of 15 to 250 W per irradiation spot having an irradiation diameter of 1 mm on the substrate surface of the laser. It is a feature.
According to the fifth aspect of the invention, the laser beam is within a range of 15 to 250 W per irradiation spot with a diameter of 1 mm on the surface of the substrate, can be soldered in a short time without heating the electronic element, and passes through the substrate. It is possible to mount the electronic element by soldering in a short time without heating and damaging the electronic element.
The electronic device mounting apparatus according to a sixth aspect of the present invention is characterized in that, in any one of the first to fifth aspects, the laser irradiation time is 1 second or less.
According to the sixth invention, the laser light irradiation time is 1 second or less, soldering is possible in a short time without heating the electronic element, and the electronic element can be mounted at high speed and high efficiency. it can.
According to a seventh aspect of the present invention, there is provided the electronic device mounting apparatus according to any one of the first to sixth aspects, wherein the electronic device is an LED device.
According to the electronic device mounting apparatus of the seventh aspect of the invention, the electronic device is an LED device, and a mounting substrate for an LED lighting device can be manufactured at high speed and high efficiency.
An electronic element mounting apparatus according to an eighth aspect of the present invention is the electronic device mounting apparatus according to the seventh aspect, wherein the flexible substrate is white.
According to the electronic device mounting apparatus of the eighth aspect of the invention, it is possible to manufacture an LED illumination device having a white flexible substrate and a high emission brightness of the LED illumination device at high speed and high efficiency.

FIG. 1 is a schematic diagram showing an electronic device mounting apparatus according to a first embodiment of the present invention.
FIG. 2 is an enlarged schematic view showing a portion to be soldered by laser irradiation in the apparatus shown in FIG.
FIG. 3 is a schematic perspective view of the LED illumination obtained by the LED illumination manufacturing method according to the present invention.
FIG. 4 is an enlarged schematic view showing a soldering portion by laser irradiation in a conventional electronic component mounting apparatus.
FIG. 5 is an enlarged schematic view showing a soldering portion by laser irradiation in another conventional electronic component mounting apparatus.
FIG. 6 is an explanatory diagram of a configuration of a supply device used in the electronic device mounting apparatus according to the second embodiment of the present invention.
FIG. 7 is an explanatory diagram of the configuration of the supply device used in the electronic device mounting apparatus according to the second embodiment of the present invention.
FIG. 8 is an explanatory diagram of the configuration of the mounting device used in the electronic device mounting apparatus according to the second embodiment of the present invention.
FIG. 9 is an explanatory diagram of the configuration of the mounting device used in the electronic device mounting apparatus according to the second embodiment of the present invention.
FIG. 10 is an explanatory diagram of a configuration of a laser used in the electronic device mounting apparatus according to the second embodiment of the present invention.
FIG. 11 is an explanatory diagram of a laser configuration used in the electronic device mounting apparatus according to the second embodiment of the present invention.

DESCRIPTION OF SYMBOLS 100 Electronic element mounting apparatus 102 Supply apparatus 104 Solder 106 Mounting apparatus 108 Electronic element 110 Laser 112 Electronic component 114 Inspection apparatus 116 Line 118 Reel (supply side)
120 reel (winding side)
122 printed wiring board 122A substrate 122B wiring pattern 124 back surface of printed wiring board 200 LED illumination 202 diffusion cover 204 LED
206 Substrate 208 Conductive adhesive 210 Aluminum base 212 Terminal 214 Terminal

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.

<1> Electronic Device Mounting Device An electronic device mounting device 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. The mounting apparatus 100 mounts an electronic element 108 on a printed wiring board 122 having a substrate 122A and a wiring pattern 122B on the substrate, and manufactures an electronic component 112. In this specification, in accordance with JISC5603 and IEC60914, the “printed wiring board” includes a substrate and a wiring pattern formed on the substrate, and does not include an electronic element to be mounted. The printed wiring board 122 is a flexible substrate. Details will be described later.
First, the mounting apparatus 100 includes a supply apparatus 102 that supplies the solder 104 onto the wiring pattern 122B of the printed wiring board. The supply device 102 is not particularly limited, but is preferably a non-contact dispenser. Although not shown in detail, the non-contact dispenser connects a tank for containing solder, a discharge nozzle for discharging the solder to the printed wiring board from a position separated from the printed wiring board, and a discharge nozzle from the tank. A connecting portion for supplying solder from the discharge nozzle to the discharge nozzle, and a control portion for controlling them. According to the supply device 102, a predetermined amount of solder can be supplied from a position separated from the printed wiring board. Therefore, compared with a device that supplies solder in a state where the printed wiring board and the discharge nozzle are in contact with each other, it is possible to suppress the take-out of the solder and to suppress time loss due to the vertical movement of the discharge head. Further, since the amount of discarded solder is small, it is preferable from the viewpoint of environment.
Next, the mounting apparatus 100 includes a mounting device 106 that mounts the electronic element 108 on the solder 104. The mounting device 106 is not particularly limited, and a conventionally known mounting device such as a chip mounter can be used.
Next, the mounting apparatus 100 includes a laser 110. As a characteristic configuration of the present invention, as shown in FIG. 2, the laser 110 emits light having a light emission center wavelength in the near infrared region toward the solder 104 on which the electronic element 108 is mounted. Irradiate from 124 side. The irradiated light passes through the substrate 122A and reaches the wiring pattern 122B, heats the wiring pattern 122B, and the solder 104 melts. Thus, the electronic element 108 is soldered to the printed wiring board 122. Here, the emitted light preferably has an emission center wavelength in the range of 800 nm to 1100 nm.
If a laser that emits light having a light emission center wavelength in a specific range from the back side of the printed wiring board is used as the mounting apparatus 100, by appropriately selecting the board on which the electronic element is mounted by the apparatus, Instead of melting the solder by heat transfer, a new solder heating mechanism is adopted that heats the solder more directly by heat transfer from the wiring pattern.
The laser 110 is not particularly limited as long as the emission center wavelength can be set in the above range, and a semiconductor laser having an emission center wavelength of 920 nm, an Nd-YAG laser of 1064 nm, or the like can be used. Here, in this specification, the “emission center wavelength” means a wavelength showing the highest light amount in the spectrum of light emitted from the laser. In addition, in this specification, “the back surface of the printed wiring board” means that the back surface of the pair of main surfaces of the printed wiring board when the surface on which the electronic element is mounted is the front surface, that is, the electronic device is mounted. It means the surface that does not.
The mounting apparatus 100 may have an inspection apparatus 114. For example, when an LED is used as the electronic element 108, an actual spot check device can be used.
Although the method for inserting the printed wiring board into the mounting apparatus is not particularly limited, as shown in FIG. 1, the printed wiring board 122 is stretched between a pair of

reels

118 and 120, and the printed wiring board 122 runs between both reels. A reel-to-reel system in which a plurality of electronic elements 108 are continuously mounted on the printed wiring board 122 while being moved can be employed. By adopting such a system, the overall length of the apparatus can be reduced to about one-tenth of that of the conventional apparatus, and the installation space for the mounting apparatus of the present invention can be greatly reduced. it can.
<2> Mounting method of electronic elements (Using mounting device)
Next, with reference to FIG. 1 and FIG. 2, the electronic element mounting method by the electronic element mounting apparatus of Example 1 of the present invention will be described. This mounting method includes a step of supplying the solder 104 onto the wiring pattern 122B of the printed wiring board 122, a step of placing the electronic element 108 on the solder 104, and a step toward the solder 104 on which the electronic element 108 is placed. Irradiating light having an emission center wavelength in the near-infrared region with a laser from the back surface 124 side of the printed wiring board 122, and the light passes through the substrate 122A and reaches the wiring pattern 122B. The wiring pattern 122B is heated to melt the solder 104, and the electronic element 108 is soldered to the printed wiring board 122.
Hereinafter, the technical significance of adopting the above characteristic steps of the present invention will be described with specific examples together with the effects. Detailed processes will be described later in the Examples, the present inventors, when irradiated with laser light having a light emission center wavelength in the near infrared region from the back side of the printed wiring board including a substrate made of a predetermined material, It has been found that the wiring pattern can be heated while suppressing damage to the substrate. By using this, the wiring pattern 122B is heated by the light transmitted through the substrate 122A, and heat is transferred from the wiring pattern 122B having good heat conduction efficiency to the solder 104, so that soldering can be performed in a shorter time than before. It becomes.
Furthermore, since the laser beam has a very high energy, there is a high probability that the solder 104 will be scattered if the laser beam is directly applied to the solder 104. In the present invention, near infrared light is emitted from the back side of the printed wiring board. By irradiating, since the wiring pattern 122B plays a role of a buffer material that prevents bumping of the solvent component in the solder 104, scattering of the solder 104 can be suppressed. And since it irradiates from the back surface side of a printed wiring board, an electronic element is not damaged.
In this mounting method, the light output from the laser and reaching the substrate mainly passes through the substrate and heats the wiring pattern. The other light is reflected from the back surface of the substrate or slightly absorbed by the substrate. That is, the present invention solders using light transmitted through the substrate, and does not directly use the heat transmitted from the substrate. For this reason, the mounting apparatus of the present invention places a very light burden on the board. Further, when transferring heat from the substrate, it is necessary to use a laser having a low energy density in order to reduce damage to the substrate during heating of the substrate. However, in the present invention, soldering is performed using a laser having a high energy density. be able to. Therefore, the mounting apparatus of the present invention can perform soldering in a shorter time compared to the prior art. Further, a material that is not so strong against heat that has not been considered for use as a mounting substrate until now can also be used as a mounting substrate for electronic devices.
The laser beam used in the present invention has an emission center wavelength in the near infrared region. If the emission center wavelength is shorter than the near infrared region, the substrate may be damaged. In addition, when the emission center wavelength is longer than the near-infrared region, the energy is very low, so it takes time to melt the solder, and the effect of the present invention that the soldering in a short time is possible is sufficiently exhibited. There is a risk that it will not be possible. From this viewpoint, the emission center wavelength is preferably in the range of 800 nm to 1100 nm.
In this mounting method, it is desirable that the transmittance of the substrate at the emission center wavelength of light irradiated from the back surface of the printed wiring board is high from the viewpoint of energy efficiency. Specifically, it is preferable to select a substrate having a transmittance of 20% or more at the light emission center wavelength. If the transmittance of the substrate is less than 20%, it may take time to melt the solder.
As a material for the substrate 122A, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or the like is preferable. Production volume is very large and inexpensive. A substrate containing PET and / or PEN is hydrolyzed by heat in the conventional reflow method, but according to the present invention, it can be used without being melted or being burnt.
In this mounting method, a flexible substrate having a predetermined thickness or less of a flexible material is used as the substrate 122A. Since the flexible substrate is vulnerable to heat, use in a reflow method or a method of heating a substrate as disclosed in Patent Document 1 is not practical. Since the load due to heat is small, a flexible substrate can be preferably used. By using a flexible substrate, the above-described reel-to-reel mounting device can be obtained. Thereby, productivity of an electronic component can be improved.
In this mounting apparatus and mounting method, the output of the laser can be made higher than in the conventional method in which soldering is performed by heat transfer from the substrate. The laser output should be low enough that solder does not scatter and high enough that soldering does not take too long. Specifically, it is preferably within the range of 15 to 250 W per irradiation spot with an irradiation diameter of 1 mm on the substrate surface of the laser. If it is smaller than 15 W, it takes time to melt the solder, and there is a possibility that the effect of the present invention that soldering in a short time is possible cannot be sufficiently exhibited. If it exceeds 250 W, the substrate may be damaged and solder may be scattered.
The irradiation diameter of the laser beam is desirably about the same as the size of the wiring pattern on the substrate surface. If the pattern size is 20% or less, the substrate may be damaged by excessive energy per unit area, and if it is 100% or more, the electronic device on the upper surface may be damaged.
In this mounting apparatus and mounting method, it is possible to perform soldering in a shorter time than the conventional method of soldering by heat transfer from the substrate. Specifically, the laser irradiation time should be 1 second or less. Can do. For this reason, productivity can be improved greatly.
In the present invention, the electronic element 108 is preferably an LED element. In this case, the soldering by the conventional reflow method cannot obtain a sufficient life as described above. However, according to the soldering according to the present invention, it is possible to manufacture an LED component having a longer life than the conventional one. it can. However, electronic devices to be mounted are not limited to LEDs, but include chip capacitors, chip resistors, CCD (charge coupled device) sensor parts, general semiconductor parts BGA (ball grid array), QFP (Quad Flat Package), CSP. (Chip size package) may be used.
<3> Manufacturing Method of LED Lighting Device Next, a manufacturing method of LED lighting using the mounting device of the present invention will be described. In addition to the steps in the above LED component manufacturing method, the LED lighting manufacturing method further includes a step of manufacturing the LED lighting from the LED component.
That is, the mounting method of the electronic element by the mounting apparatus of the present invention is very useful for manufacturing the fluorescent lamp type LED. In the case of the reflow method, the temperature distribution is uneven within a long reflow furnace, so that even if a printed wiring board of about 1.2 m is introduced into the reflow furnace, the substrate is distorted and the quality is affected. For this reason, for example, by mounting a plurality of LED elements on a short printed wiring board of about 30 cm to form an LED component of this length, and connecting the four LED components to a connector, the currently popular 1.2 m Produced long fluorescent lamp type LED lighting. This takes time and labor to connect, and causes problems such as half insertion of the connector and pin misalignment. However, according to the present invention, it is possible to manufacture LED components having a desired length by continuously mounting a plurality of LED elements on a printed wiring board having a desired length.
When the electronic element used for this invention is LED, it is preferable that a board | substrate is white. FIG. 3 is a schematic perspective view of the LED illumination obtained by the LED illumination manufacturing method according to the present invention. As shown in FIG. 3, in the LED lighting 200, the LED component 204 is fixed with a heat conductive adhesive 208 on the aluminum base 210 in the diffusion cover 202, and the heat generated from the LED component 204 is heat conduction. The heat is dissipated from the aluminum base 210 by being conducted to the aluminum base 210 through the adhesive 208. If the substrate 206 is white, it functions as a reflective film for light emitted from the LED component, so that the brightness can be improved.
<4> Evaluation of LED parts obtained by mounting apparatus of the present invention In order to further clarify the effects of the present invention, comparative evaluations in which experiments of Examples and Comparative Examples described below were conducted will be described.
<4-1> Manufacture of LED components A substrate made of PET was used in Example 1 (1), and a substrate made of PEN was used in Example 1 (2). First, a wiring pattern was formed on each substrate by etching a copper foil by a known method, and a printed wiring board was produced. Each of the substrates used in Examples 1 and 2 has a thickness of 50 μm and has flexibility.
Next, the LED elements were mounted while winding the substrate from one reel to the other reel by the reel-to-reel electronic element mounting apparatus of the present invention shown in FIG. Cream solder was supplied onto the wiring pattern on the printed wiring board using a non-contact jet dispenser (Musano Engineering Co., Ltd .: Jet Master). Next, the LED element was mounted on the cream solder using a mounter (Okuhara Electric Co., Ltd .: tabletop mounter). Next, by using a semiconductor laser having an emission center wavelength of 920 nm (manufactured by Hamamatsu Photonics Co., Ltd .: LD irradiation device 15W type), the laser output is adjusted to 12.5 W, the irradiation diameter on the substrate surface is 0.4 mm, and the printed wiring board The solder was applied by irradiating light toward the solder on which the LED element was placed from the back side of the substrate. The transmittance | permeability of the board | substrate in the light emission center wavelength in each test example was 75%, when it measured previously using the spectrometer (the Hamamatsu Photonics company make: model number C10082MD).
Under these conditions, in Examples 1 (1) and 1 (2), the irradiated light passes through the substrate and reaches the wiring pattern, the wiring pattern is heated to melt the solder, and the LED is used as a printed wiring board. It was possible to solder.
<4-2> Evaluation of Damage to Substrate The presence or absence of scratches on the substrate after mounting and scratches on the melt was visually evaluated. In Examples 1 (1) and 1 (2), no substrate damage was observed.
<4-3> Evaluation of time required for soldering The time until solder fillets were correctly formed was measured. In Examples 1 (1) and 1 (2), since soldering was possible by light transmitted through the substrate, soldering was possible in a very short time of 0.4 seconds.
<4-4> Evaluation of soldering When the presence or absence of solder balls due to bumping of solder was visually evaluated, no solder scattering occurred.
In any of the examples, since the laser was not irradiated from the front side of the printed wiring board, the LED was not damaged.

The electronic device mounting apparatus according to the second embodiment will be described with reference to FIGS. The present embodiment is a mounting apparatus for mounting and soldering a plurality of electronic elements when the traveling movement of the flexible substrate is stopped. Therefore, the mounting apparatus according to the second embodiment is configured by providing a plurality of supply apparatuses 102, mounting apparatuses 106, or lasers 110. In this embodiment, a case where two supply devices, two placement devices, and two lasers are provided will be described. However, this quantity is not limited to two and can be increased as appropriate.
The configuration of the solder supply apparatus 102 of this embodiment will be described with reference to FIG. FIG. 6A is a view of the flexible substrate as viewed from the traveling direction. FIG. 6B is a view as seen from a direction perpendicular to the traveling direction of the flexible substrate. The left side is the supply reel 118 side, and the right side is the take-up reel 120 side. As can be seen from FIG. 6B, two supply devices are arranged in the traveling direction of the substrate (A and B in the figure). If the pitch at which the two electronic elements are placed is the same as the position interval of the nozzle 102N at the tip of the supply device, the nozzles 102N of the two supply devices move down to a certain distance from the substrate and supply an appropriate amount of solder (dropping). ) Then, it moves in the arrow direction (X direction) in FIG. The nozzle A and the nozzle B are configured to move together.
When four electronic elements are mounted, as shown in FIG. 6 (c), solder for mounting two electronic elements is supplied, and then two supply devices run the substrate. It moves in the moving direction and supplies solder for mounting the remaining two electronic elements.
Further, when the mounting interval between the two electronic elements is different from the interval between the nozzles of the two supply devices, the solder A is supplied by operating the nozzles A and B of the supply device one by one as shown in FIG. In this case, as shown in FIG. 7, first, solder is supplied by operating the nozzle A in the order of FIGS. 7A and 7B to the mounting position of the first electronic element, and then FIG. The nozzle is moved in the X direction of a), operated in the order of FIGS. 7A and 7B, and the solder is supplied again by the nozzle A. Next, with respect to the mounting position of the second electronic element, the nozzle B is operated in the order of FIGS. 7C and 7D to supply solder, and then the nozzle is moved in the X direction of FIG. 6A. 7C and 7D, the solder is supplied again by the nozzle B.
Furthermore, each supply device can be configured to be independent and movable in the traveling movement direction (X direction) of the substrate and in a direction perpendicular to the traveling movement direction (Y direction).
The configuration of the electronic device mounting apparatus 106 according to this embodiment will be described with reference to FIG. FIG. 8A is a view of the flexible substrate as viewed from the traveling direction. FIG. 8B is a view as seen from a direction perpendicular to the traveling direction of the flexible substrate. The left side is the supply reel 118 side, and the right side is the take-up reel 120 side. As can be seen from FIG. 8B, two placement devices are arranged in the direction of travel of the substrate (A and B in the figure). If the pitch at which the two electronic elements are placed is the same as the position interval of the suction nozzle 106N at the tip of the placement device, the supply device places the electronic elements on the solder supplied to the substrate as it is. The suction nozzle A and the suction nozzle B are configured to move together.
Further, when the mounting interval between the two electronic elements is different from the spacing between the suction nozzles of the mounting device, the electronic elements are mounted one by one in the same manner as the operation of the nozzle of the supply device shown in FIG. In this case, the suction nozzles A and B of the placement device operate in the order of FIGS. 9A, 9B, 9C, and 9D, and two electronic elements are placed.
Further, the mounting device can be configured to be independent and movable in the traveling movement direction (X direction) of the substrate and in a direction perpendicular to the traveling movement direction (Y direction).
The configuration of the soldering laser 110 of this embodiment will be described with reference to FIG. Fig.10 (a) is the figure seen from the traveling direction of the flexible substrate. FIG. 10B is a view as seen from a direction perpendicular to the traveling direction of the flexible substrate. The left side is the supply reel 118 side, and the right side is the take-up reel 120 side. As can be seen from FIG. 10B, two lasers are arranged in the direction of travel of the substrate (A and B in the figure). If the pitch for mounting (soldering) two electronic elements is the same as the position interval of the laser 110, the two lasers are simultaneously irradiated with light to solder the electronic elements. Thereafter, the laser 110 moves in the direction of the arrow (X direction) in FIG. 10A and irradiates the laser beam at a predetermined position to perform soldering. Laser A and laser B are configured to move together.
When the mounting interval between the two electronic elements is different from the laser interval, the lasers A and B shown in FIG. 11 are operated one by one to mount (solder) the electronic elements. In this case, as shown in FIG. 11, first, the first electronic element is soldered by operating the laser A as shown in FIG. 11A, and then the laser in the X direction of FIG. 10A. To move the laser A again and solder the electronic element as shown in FIG. Next, the second electronic element is soldered by operating the laser B as shown in FIG. 11 (b) and irradiating the laser beam, and then moves the laser in the X direction of FIG. 10 (a). Then, as shown in FIG. 11B, the laser B is operated again to solder the electronic element.
In addition, each laser can be configured to be independent and movable in a traveling movement direction (X direction) of the substrate and a direction (Y direction) perpendicular to the traveling movement direction.
As described in the present embodiment, by arranging a plurality of supply devices, mounting devices, and lasers in the traveling movement direction of the substrate, the mounting device of the present invention can increase the occupation area without increasing the occupied area. When the traveling movement of the flexible substrate stops, a configuration in which a plurality of electronic elements are simultaneously mounted and mounted can be employed. Further, when the traveling movement of the flexible substrate stops, different types of electronic elements can be simultaneously mounted and mounted. Therefore, by using the mounting apparatus of the present invention, the efficiency of mounting the electronic element is remarkably improved, and the usage application of the mounting apparatus of the present invention is greatly expanded.

According to the present invention, the electronic device can be soldered to the printed wiring board in a shorter time than in the past by suppressing the damage of the electronic device, the scattering of the solder, and the damage of the substrate. Moreover, it is possible to provide a mounting apparatus and a method for manufacturing an electronic component capable of mounting various types of electronic elements, together with a method for manufacturing LED lighting including the manufacturing method.

Claims

An electronic element mounting apparatus for mounting an electronic element on a flexible substrate and a printed wiring board having a wiring pattern on the substrate,
A supply device for supplying solder onto the wiring pattern of the printed wiring board;
A mounting device for mounting the electronic element on the solder;
A laser that irradiates light having an emission center wavelength in a near infrared light region from the back side of the printed wiring board toward the solder on which the electronic element is mounted,
The light is transmitted through the substrate to reach the wiring pattern, the wiring pattern is heated to melt the solder, and the electronic element is soldered to the printed wiring board. Mounting device.
2. The electronic device mounting apparatus according to claim 1, wherein a plurality of the supply device, the mounting device, or the laser are provided.
The electronic device mounting apparatus according to claim 1 or 2, wherein the transmittance of the substrate at the emission center wavelength of light irradiated from the back surface of the printed wiring board is 20% or more.
The printed wiring board is stretched between a pair of reels, the printed wiring board is moved between both reels, and the plurality of electronic elements are continuously mounted on the printed wiring board. 4. The electronic device mounting apparatus according to any one of 3 above.
5. The electronic element mounting apparatus according to claim 1, wherein the output of the laser is within a range of 15 to 250 W per irradiation spot having an irradiation diameter of 1 mm on the laser substrate surface.
6. The electronic device mounting apparatus according to claim 1, wherein the laser irradiation time is 1 second or less.
The electronic device mounting apparatus according to any one of claims 1 to 6, wherein the electronic device is an LED device.
The electronic element mounting apparatus according to claim 7, wherein the substrate is white.