WO2014147823A1 - Power amplification device and communications device - Google Patents

Power amplification device and communications device Download PDF

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Publication number
WO2014147823A1
WO2014147823A1 PCT/JP2013/058320 JP2013058320W WO2014147823A1 WO 2014147823 A1 WO2014147823 A1 WO 2014147823A1 JP 2013058320 W JP2013058320 W JP 2013058320W WO 2014147823 A1 WO2014147823 A1 WO 2014147823A1
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WO
WIPO (PCT)
Prior art keywords
transmission line
printed circuit
circuit board
contact
transmission
Prior art date
Application number
PCT/JP2013/058320
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French (fr)
Japanese (ja)
Inventor
純貴 大竹
Original Assignee
日本電気株式会社
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Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to PCT/JP2013/058320 priority Critical patent/WO2014147823A1/en
Priority to PCT/JP2014/053986 priority patent/WO2014148188A1/en
Publication of WO2014147823A1 publication Critical patent/WO2014147823A1/en

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03F—AMPLIFIERS
    • H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H03F1/0205—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
    • H03F1/0288—Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0246—Termination of transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws

Definitions

  • the present invention relates to a power amplifying device, and more particularly, to a Doherty amplifier used in a communication device that performs transmission of a television broadcast or mobile communication.
  • a communication apparatus that performs television broadcast transmission or mobile communication is often provided with a highly efficient Doherty amplifier as a power amplification apparatus that performs signal amplification.
  • FIG. 1 is a block diagram showing a general configuration of a Doherty amplifier.
  • the RF signal that is an input signal input to the terminal 1 is distributed into two by the 90 ° hybrid coupler 2.
  • An input terminal different from the input terminal to which the RF signal is input in the 90 ° hybrid coupler 2 is grounded via the absorption resistor 3.
  • One of the RF signals distributed by the 90 ° hybrid coupler 2 is transmitted to the connection point 6 via the carrier amplifier 4 and the transmission line 5, and the other is transmitted to the connection point 6 via the peak amplifier 7.
  • the respective RF signals are synthesized at the connection point 6, and the synthesized RF signal is output from the terminal 9 via the transmission line 8.
  • the transmission line 8 is a transmission line having an electrical length of 1 ⁇ 4 wavelength of the RF signal input to the terminal 1. Further, the characteristic impedance of the transmission line 8 to the load connected to the terminal 9, when the load impedance seen from the terminal 9, Zout, ((Zout) 2/ 2) 1/2, as viewed from the connection point 6 The load impedance is Zout / 2.
  • the transmission line 5 is a transmission line having an electrical length of 1 ⁇ 4 wavelength of the RF signal input to the terminal 1. Further, the characteristic impedance of the transmission line 5 with respect to the load connected to the terminal 9 is Zout. When the peak amplifier 7 is off, the load impedance viewed from the output terminal of the carrier amplifier 4 is Zout ⁇ 2.
  • Patent Documents 1 and 2 describe amplifiers that can change the electrical length of a transmission line according to the frequency of an input signal.
  • the amplifier described in Patent Document 1 includes a transmission line having a plurality of microstrip lines and a plurality of RF switches that switch connection relations between the microstrip lines.
  • the RF switch is switched so that the length is 1 ⁇ 4 wavelength of the RF signal.
  • the amplifier described in Patent Document 2 includes a plurality of transmission lines having different electrical lengths, and a transmission line through which an input signal is actually transmitted according to the frequency of the input signal is any of the plurality of transmission lines. It has been switched to.
  • the electrical length of the transmission line can be set to 1 ⁇ 4 wavelength of the input signal. There is no need to prepare an amplifier.
  • An object of the present invention is to provide a power amplification device and a communication device that can finely adjust the electrical length of a transmission line while suppressing an increase in cost.
  • the power amplifying device includes a first printed circuit board on which the first transmission line and the second transmission line are formed on the same surface, a second printed circuit board on which the third transmission line is formed, The first printed circuit board and the second transmission line are adjusted so that the third transmission line is in contact with both the first transmission line and the second transmission line and the contact length of the contact is adjustable.
  • a communication device includes the above-described power amplification device.
  • the electrical length of the transmission line can be finely adjusted while suppressing an increase in cost.
  • FIG. 2 and 3 are perspective views showing the power amplifying device according to the first embodiment of the present invention. Specifically, FIG. 2 and FIG. 3 are perspective views showing a transmission line portion of the power amplifying device, and the configuration other than the transmission line portion has the same configuration as that shown in FIG.
  • FIG. 3 has two printed circuit boards 11 and 12. 2 shows the printed boards 11 and 12 fixed to each other, and FIG. 3 shows the printed boards 11 and 12 separately for easy viewing.
  • the printed circuit board 11 is an example of a first printed circuit board.
  • a transmission line 21 that is a first transmission line and a transmission line 22 that is a second transmission line are formed on the printed circuit board 11.
  • the transmission lines 21 and 22 are strip lines formed on the same surface of the printed board 11. In the present embodiment, the transmission lines 21 and 22 have a linear shape and face each other.
  • the printed circuit board 12 is an example of a second printed circuit board.
  • a transmission line 23 that is a third transmission line is formed on the printed circuit board 12.
  • the transmission line 23 has end portions 23A and 23B each having both ends in a linear shape, and the end portions 23A and 23B face each other like a U-shape or U-shape. Shall.
  • the power amplifying apparatus 10 connects the printed circuit boards 11 and 12 to each other so that the surface of the printed circuit board 11 on which the transmission lines 21 and 22 are formed and the surface of the printed circuit board 12 on which the transmission line 23 is formed are in close contact.
  • a fixing mechanism for fixing is provided.
  • the fixing mechanism of the present embodiment includes screw holes 31 and 32 provided in the printed circuit board 11, slits 41 and 42 provided in the printed circuit board 12, screws 51 inserted through the screw holes 31 and slit 41, screws And a screw 52 inserted through the hole 32 and the slit 42.
  • the screw holes 31 and 32 and the slits 41 and 42 are such that when the screws 51 and 52 are inserted, one of the end portions 23A and 23B of the transmission line 23 is in contact with the transmission line 21, and the other is in contact with the transmission line 22. It is provided at such a position.
  • the fixing mechanism is configured such that the end portion 23 ⁇ / b> A of the transmission line 23 is in contact with the transmission line 21 and the end portion 23 ⁇ / b> B is in contact with the transmission line 22.
  • the slits 41 and 42 are provided along the end portions 23A and 23B. Thereby, the contact length with which the transmission line 23 contacts the transmission lines 21 and 22 can be adjusted. In other words, the contact length at which the transmission line 23 contacts the transmission lines 21 and 22 can be adjusted by changing the positions of the slits 41 and 42 through which the screws 51 and 52 are inserted. Therefore, the length of the actual transmission line formed by the transmission lines 21 to 23 can be adjusted.
  • the characteristic impedance of the actual transmission line composed of the transmission lines 21 to 23 is that the impedance of the load connected to the output terminal of the power amplifying apparatus 10 is Zout. when used as a line 5, and Zout, when the actual transmission line is used as a transmission line 8, and 1/2 ((Zout) 2/2 ).
  • the screw holes 31 and 32 are provided in the printed board 11, and the slits 41 and 42 are provided in the printed board 12.
  • the screw holes 31 and 32 are provided in the printed board 12.
  • Slits 41 and 42 may be provided in the printed circuit board 11. In this case, the slits 41 and 42 are provided along the transmission lines 21 and 22.
  • a ground pattern 61 is formed on the surface of the printed circuit board 11 opposite to the surface on which the transmission line 21 and the transmission line 22 are formed, and the transmission line 23 of the printed circuit board 12 is formed.
  • a ground pattern 62 is formed on the surface opposite to the formed surface. The ground patterns 61 and 62 are electrically connected to each other via screws 51 and 52.
  • the screws 51 and 52 are loosened and the printed circuit board 12 is slid,
  • the contact length at which the transmission line 23 is in contact with the transmission lines 21 and 22 so that the electrical length of the actual transmission line formed by the transmission lines 21 to 23 becomes a quarter wavelength of the RF signal according to the frequency of the RF signal.
  • the electrical length of the actual transmission line can be adjusted by adjusting the contact length at which the transmission line 23 contacts the transmission lines 21 and 22. For this reason, it is possible to finely adjust the electrical length of the transmission line without providing many transmission lines.
  • FIG. 5 is a perspective view showing the configuration of the power amplifying apparatus of the present embodiment
  • FIG. 6 is a longitudinal sectional view showing the configuration of the power amplifying apparatus of the present embodiment.
  • the power amplifying apparatus 70 shown in FIGS. 5 and 6 is different from the power amplifying apparatus 10 shown in FIGS. 2 to 4 in that the ground patterns 61 and 62 are removed, and instead, from both the printed boards 11 and 12.
  • the difference is that a ground plane 71 is provided at a distant position.
  • the impedance of the transmission lines 21 to 23 is designed with the ground plane 71 as an actual ground.
  • the ground of the transmission lines 21 to 23 can be configured using the ground plane 71 separated from the printed boards 11 and 12 instead of on the printed boards 11 and 12, and the ground area can be increased. It becomes possible to do. Therefore, the operation can be further stabilized, and more electric power can be used.
  • FIG. 7 is a perspective view showing the configuration of the power amplifying apparatus of the present embodiment.
  • the power amplifying device 80 shown in FIG. 7 is different from the power amplifying device 10 shown in FIGS. 2 to 4 in that it has ground patterns formed on both surfaces of the printed boards 11 and 12.
  • the power amplifying device 80 shown in FIG. 7 is different from the power amplifying device 10 shown in FIGS. 2 to 4 in that ground patterns 81 to 84 are further provided.
  • the ground patterns 61 and 62 are formed as shown in FIG.
  • the ground patterns 81 and 82 are formed on the surface of the printed circuit board 11 on which the transmission lines 21 and 22 are formed.
  • the ground pattern 81 includes a region where the screw hole 31 is formed, and the ground pattern 82 includes a region where the screw hole 32 is formed. Thereby, the ground patterns 81 and 82 are electrically connected to the ground pattern 61 through the screw holes 31 and 32, respectively.
  • the ground patterns 83 and 84 are formed on the surface of the printed circuit board 12 on which the transmission line 23 is formed.
  • the ground pattern 83 includes a region where the slit 41 is formed, and the ground pattern 84 includes a region where the slit 42 is formed. Thereby, each of the ground patterns 83 and 84 is electrically connected to the ground pattern 62 via the slits 41 and 42.
  • the screw holes 31 and 32 and the slits 41 and 42 are used as through holes for conducting the ground patterns.
  • the through holes are separate from the screw holes 31 and 32 and the slits 41 and 42. It may be formed.
  • the ground region can be increased compared to the first embodiment, so that the operation can be further stabilized, and more power is required. Can be used.
  • a communication device provided with the power amplifying device 10, 70 or 80 is also an embodiment of the present invention.
  • the surface of the printed circuit board 11 opposite to the surface on which the transmission lines 21 and 22 are formed or the surface of the printed circuit board 12 opposite to the surface on which the transmission line 23 is formed is made of a metal piece or resin.
  • the transmission lines 21 and 22 and the transmission line 23 may be brought into stronger contact by pressing. In this case, the power amplifying devices 10, 70 and 80 can be used stably over a longer period.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Amplifiers (AREA)
  • Microwave Amplifiers (AREA)

Abstract

A power amplification device (10) comprising: a printed circuit board (11) having a transmission line (21) and a transmission line (22) formed on the same plane; a printed circuit board (12) having a transmission line (23) formed thereupon; and a fixing mechanism wherein the transmission line (23) comes in contact with both transmission lines (11, 12), and which fixes the printed circuit boards (11, 12) to each other such that the contact length of said contact is adjustable.

Description

電力増幅装置および通信装置Power amplification device and communication device
　本発明は、電力増幅装置に関し、特には、テレビ放送の送信や移動体通信を行う通信装置などに使用されるドハティアンプに関する。 The present invention relates to a power amplifying device, and more particularly, to a Doherty amplifier used in a communication device that performs transmission of a television broadcast or mobile communication.
　テレビ放送の送信や移動体通信を行う通信装置は、低消費電力を求められる場合、信号の増幅を行う電力増幅装置として、高効率なドハティアンプを備えていることが多い。 When a low power consumption is required, a communication apparatus that performs television broadcast transmission or mobile communication is often provided with a highly efficient Doherty amplifier as a power amplification apparatus that performs signal amplification.
　図１は、ドハティアンプの一般的な構成を示すブロック図である。 FIG. 1 is a block diagram showing a general configuration of a Doherty amplifier.
　図１に示すドハティアンプでは、端子１に入力された入力信号であるＲＦ信号は、９０°ハイブリッドカプラ２にて２つに分配される。なお、９０°ハイブリッドカプラ２におけるＲＦ信号が入力される入力端子とは別の入力端子は、吸収抵抗３を介して接地されている。 In the Doherty amplifier shown in FIG. 1, the RF signal that is an input signal input to the terminal 1 is distributed into two by the 90 ° hybrid coupler 2. An input terminal different from the input terminal to which the RF signal is input in the 90 ° hybrid coupler 2 is grounded via the absorption resistor 3.
　９０°ハイブリッドカプラ２にて分配されたＲＦ信号の一方は、キャリアアンプ４および伝送線路５を介して接続点６へ伝送され、他方は、ピークアンプ７を介して接続点６へ伝送される。各ＲＦ信号は接続点６で合成され、その合成されたＲＦ信号は伝送線路８を介して端子９から出力される。 One of the RF signals distributed by the 90 ° hybrid coupler 2 is transmitted to the connection point 6 via the carrier amplifier 4 and the transmission line 5, and the other is transmitted to the connection point 6 via the peak amplifier 7. The respective RF signals are synthesized at the connection point 6, and the synthesized RF signal is output from the terminal 9 via the transmission line 8.
　ここで、伝送線路８は、端子１に入力されるＲＦ信号の１／４波長の電気長を有する伝送線路である。また、端子９に接続される負荷に対する伝送線路８の特性インピーダンスは、端子９から見た負荷インピーダンスをＺｏｕｔとすると、（（Ｚｏｕｔ）２／２）１／２であり、接続点６から見た負荷インピーダンスがＺｏｕｔ／２となる。 Here, the transmission line 8 is a transmission line having an electrical length of ¼ wavelength of the RF signal input to the terminal 1. Further, the characteristic impedance of the transmission line 8 to the load connected to the terminal 9, when the load impedance seen from the terminal 9, Zout, ((Zout) 2/ 2) 1/2, as viewed from the connection point 6 The load impedance is Zout / 2.
　伝送線路５は、端子１に入力されるＲＦ信号の１／４波長の電気長を有する伝送線路である。また、端子９に接続される負荷に対する伝送線路５の特性インピーダンスはＺｏｕｔであり、ピークアンプ７がオフのときに、キャリアアンプ４の出力端子から見た負荷インピーダンスがＺｏｕｔ×２となる。 The transmission line 5 is a transmission line having an electrical length of ¼ wavelength of the RF signal input to the terminal 1. Further, the characteristic impedance of the transmission line 5 with respect to the load connected to the terminal 9 is Zout. When the peak amplifier 7 is off, the load impedance viewed from the output terminal of the carrier amplifier 4 is Zout × 2.
　上記のドハティアンプにおいて、端子１に入力されるＲＦ信号の周波数が変更された場合、伝送線路５および８の電気長がＲＦ信号の１／４波長からずれてしまう。その結果、キャリアアンプ４の出力端子およびピークアンプ７の出力端子から見た負荷インピーダンスが所望の値からずれてしまい、ドハティアンプの効率が低下するという問題が生じる。 In the above Doherty amplifier, when the frequency of the RF signal input to the terminal 1 is changed, the electrical lengths of the transmission lines 5 and 8 are deviated from the quarter wavelength of the RF signal. As a result, the load impedance viewed from the output terminal of the carrier amplifier 4 and the output terminal of the peak amplifier 7 deviates from a desired value, resulting in a problem that the efficiency of the Doherty amplifier is lowered.
　このため、効率の良いドハティアンプを使用するためには、ＲＦ信号の周波数ごとにドハティアンプを用意しなければならなかった。 For this reason, in order to use an efficient Doherty amplifier, it was necessary to prepare a Doherty amplifier for each frequency of the RF signal.
　これに対して特許文献１および２には、伝送線路の電気長を入力信号の周波数に応じて変更することが可能な増幅器が記載されている。 On the other hand, Patent Documents 1 and 2 describe amplifiers that can change the electrical length of a transmission line according to the frequency of an input signal.
　特許文献１に記載の増幅器は、複数のマイクロストリップ線路と、それらのマイクロストリップ線路の接続関係を切り替える複数のＲＦスイッチとを有する伝送線路を備え、ＲＦ信号の周波数に応じて、伝送線路の電気長がＲＦ信号の１／４波長となるように、ＲＦスイッチを切り替えている。 The amplifier described in Patent Document 1 includes a transmission line having a plurality of microstrip lines and a plurality of RF switches that switch connection relations between the microstrip lines. The RF switch is switched so that the length is ¼ wavelength of the RF signal.
　特許文献２に記載の増幅器は、それぞれ電気長の異なる複数の伝送線路を備え、入力信号の周波数に応じて、入力信号が実際に伝送される伝送線路を、上記の複数の伝送線路のいずれかに切り替えている。 The amplifier described in Patent Document 2 includes a plurality of transmission lines having different electrical lengths, and a transmission line through which an input signal is actually transmitted according to the frequency of the input signal is any of the plurality of transmission lines. It has been switched to.
　特許文献１および２に記載の増幅器では、入力信号の周波数が変更されても、伝送線路の電気長を入力信号の１／４波長とすることが可能になるため、ＲＦ信号の周波数ごとにドハティアンプを用意しなくてもよくなる。 In the amplifiers described in Patent Documents 1 and 2, even if the frequency of the input signal is changed, the electrical length of the transmission line can be set to ¼ wavelength of the input signal. There is no need to prepare an amplifier.
特開２００８－０１７０７２号公報JP 2008-017072 A 特開２００６－３４５３４１号公報JP 2006-345341 A
　しかしながら、特許文献１および２に記載の増幅器では、複数の伝送線路や複数のマイクロストリップ線路を切り替えることで、伝送線路の電気長を調整するものであるため、伝送線路の電気長を細やかに調整するためには、数多くの伝送線路、マイクロストリップ線およびＲＦスイッチといったものが必要となり、コストが増加してしまうという問題がある。 However, in the amplifiers described in Patent Documents 1 and 2, since the electrical length of the transmission line is adjusted by switching a plurality of transmission lines and a plurality of microstrip lines, the electrical length of the transmission line is finely adjusted. In order to do this, a large number of transmission lines, microstrip lines, and RF switches are required, which increases the cost.
　本発明は、コストの増加を抑制しながら、伝送線路の電気長を細やかに調整することが可能な電力増幅装置および通信装置を提供することを目的とする。 An object of the present invention is to provide a power amplification device and a communication device that can finely adjust the electrical length of a transmission line while suppressing an increase in cost.
　本発明による電力増幅装置は、第１の伝送線路および第２の伝送線路が同一の面に形成された第１のプリント基板と、第３の伝送線路が形成された第２のプリント基板と、前記第３の伝送線路が前記第１の伝送線路および前記第２の伝送線路の両方と接触し、当該接触する接触長さが調整可能なように、前記第１のプリント基板および前記第２のプリント基板を互いに固定する固定機構と、を備える。 The power amplifying device according to the present invention includes a first printed circuit board on which the first transmission line and the second transmission line are formed on the same surface, a second printed circuit board on which the third transmission line is formed, The first printed circuit board and the second transmission line are adjusted so that the third transmission line is in contact with both the first transmission line and the second transmission line and the contact length of the contact is adjustable. A fixing mechanism for fixing the printed circuit boards to each other.
　本発明による通信装置は、上記の電力増幅装置を備える。 A communication device according to the present invention includes the above-described power amplification device.
　本発明によれば、コストの増加を抑制しながら、伝送線路の電気長を細やかに調整することが可能になる。 According to the present invention, the electrical length of the transmission line can be finely adjusted while suppressing an increase in cost.
関連技術であるドハティアンプの構成を示す回路図である。It is a circuit diagram which shows the structure of Doherty amplifier which is related technology. 本発明の第１の実施形態の電力増幅装置の一状態を示す斜視図である。It is a perspective view which shows one state of the power amplification apparatus of the 1st Embodiment of this invention. 本発明の第１の実施形態の電力増幅装置の他状態を示す斜視図である。It is a perspective view which shows the other state of the power amplification apparatus of the 1st Embodiment of this invention. グランドパターンの一例を示す図である。It is a figure which shows an example of a ground pattern. 本発明の第２の実施形態の電力増幅装置の構成を示す斜視図である。It is a perspective view which shows the structure of the power amplification apparatus of the 2nd Embodiment of this invention. 本発明の第２の実施形態の電力増幅装置の構成を示す縦断面図である。It is a longitudinal cross-sectional view which shows the structure of the power amplification apparatus of the 2nd Embodiment of this invention. 本発明の第３の実施形態の電力増幅装置の構成を示す斜視図である。It is a perspective view which shows the structure of the power amplification apparatus of the 3rd Embodiment of this invention.
　以下、本発明の実施形態について図面を参照して説明する。なお、以下の説明では、同じ機能を有するものには同じ符号を付け、その説明を省略する場合がある。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, components having the same function may be denoted by the same reference numerals and description thereof may be omitted.
　図２および図３は、本発明の第１の実施形態の電力増幅装置を示す斜視図である。具体的には、図２および図３は、電力増幅装置の伝送線路部分を示す斜視図であり、伝送線路部分以外の構成は、図１に示した構成と同様な構成を有する。 2 and 3 are perspective views showing the power amplifying device according to the first embodiment of the present invention. Specifically, FIG. 2 and FIG. 3 are perspective views showing a transmission line portion of the power amplifying device, and the configuration other than the transmission line portion has the same configuration as that shown in FIG.
　図２および図３に示す電力増幅装置１０は、２つのプリント基板１１および１２を有している。なお、図２では、互いに固定されたプリント基板１１および１２が示されており、図３では、見やすくするために、プリント基板１１および１２が別々に示されている。 2 and FIG. 3 has two printed circuit boards 11 and 12. 2 shows the printed boards 11 and 12 fixed to each other, and FIG. 3 shows the printed boards 11 and 12 separately for easy viewing.
　プリント基板１１は、第１のプリント基板の一例である。プリント基板１１には、第１の伝送線路である伝送線路２１と、第２の伝送線路である伝送線路２２とが形成されている。伝送線路２１および２２は、プリント基板１１における同一の面に形成されたストリップラインである。本実施形態では、伝送線路２１および２２は、直線形状であり、対向している。 The printed circuit board 11 is an example of a first printed circuit board. A transmission line 21 that is a first transmission line and a transmission line 22 that is a second transmission line are formed on the printed circuit board 11. The transmission lines 21 and 22 are strip lines formed on the same surface of the printed board 11. In the present embodiment, the transmission lines 21 and 22 have a linear shape and face each other.
　プリント基板１２は、第２のプリント基板の一例である。プリント基板１２には、第３の伝送線路である伝送線路２３が形成されている。本実施形態では、伝送線路２３は、コの字型やＵの字型のように、両端のそれぞれを有する端部部分２３Ａおよび２３Ｂが直線形状を成し、端部部分２３Ａおよび２３Ｂが対向するものとする。 The printed circuit board 12 is an example of a second printed circuit board. A transmission line 23 that is a third transmission line is formed on the printed circuit board 12. In the present embodiment, the transmission line 23 has end portions 23A and 23B each having both ends in a linear shape, and the end portions 23A and 23B face each other like a U-shape or U-shape. Shall.
　また、電力増幅装置１０は、プリント基板１１における伝送線路２１および２２が形成された面と、プリント基板１２における伝送線路２３が形成された面とが密着するように、プリント基板１１および１２を互いに固定する固定機構を有している。 Further, the power amplifying apparatus 10 connects the printed circuit boards 11 and 12 to each other so that the surface of the printed circuit board 11 on which the transmission lines 21 and 22 are formed and the surface of the printed circuit board 12 on which the transmission line 23 is formed are in close contact. A fixing mechanism for fixing is provided.
　本実施形態の固定機構は、プリント基板１１に設けられたネジ穴３１および３２と、プリント基板１２に設けられたスリット４１および４２と、ネジ穴３１およびスリット４１に挿通されるネジ５１と、ネジ穴３２およびスリット４２に挿通されるネジ５２とを備える。 The fixing mechanism of the present embodiment includes screw holes 31 and 32 provided in the printed circuit board 11, slits 41 and 42 provided in the printed circuit board 12, screws 51 inserted through the screw holes 31 and slit 41, screws And a screw 52 inserted through the hole 32 and the slit 42.
　ネジ穴３１および３２とスリット４１および４２は、ネジ５１および５２が挿通された際に、伝送線路２３の端部部分２３Ａおよび２３Ｂの一方が伝送線路２１と接触し、他方が伝送線路２２と接触するような位置に設けられる。本実施形態では、固定機構は、伝送線路２３の端部部分２３Ａが伝送線路２１と接触し、端部部分２３Ｂが伝送線路２２と接触するように構成されている。これにより、固定機構によって互いに固定されたプリント基板１１および１２を有する電力増幅装置１０では、伝送線路２１～２３が一つの伝送線路（以下、実伝送線路と称する）を形成することになる。 The screw holes 31 and 32 and the slits 41 and 42 are such that when the screws 51 and 52 are inserted, one of the end portions 23A and 23B of the transmission line 23 is in contact with the transmission line 21, and the other is in contact with the transmission line 22. It is provided at such a position. In the present embodiment, the fixing mechanism is configured such that the end portion 23 </ b> A of the transmission line 23 is in contact with the transmission line 21 and the end portion 23 </ b> B is in contact with the transmission line 22. Thereby, in the power amplifying apparatus 10 having the printed boards 11 and 12 fixed to each other by the fixing mechanism, the transmission lines 21 to 23 form one transmission line (hereinafter referred to as an actual transmission line).
　また、スリット４１および４２は、端部部分２３Ａおよび２３Ｂに沿って設けられている。これにより、伝送線路２３が伝送線路２１および２２と接触する接触長さが調整可能になる。つまり、スリット４１および４２におけるネジ５１および５２を挿通される位置を変更することにより、伝送線路２３が伝送線路２１および２２と接触する接触長さを調整することができる。したがって、伝送線路２１～２３で形成される実伝送線路の長さを調整することが可能になる。 Further, the slits 41 and 42 are provided along the end portions 23A and 23B. Thereby, the contact length with which the transmission line 23 contacts the transmission lines 21 and 22 can be adjusted. In other words, the contact length at which the transmission line 23 contacts the transmission lines 21 and 22 can be adjusted by changing the positions of the slits 41 and 42 through which the screws 51 and 52 are inserted. Therefore, the length of the actual transmission line formed by the transmission lines 21 to 23 can be adjusted.
　なお、伝送線路２１～２３で構成される実伝送線路の特性インピーダンスは、電力増幅装置１０の出力端子と接続される負荷のインピーダンスがＺｏｕｔであるとすると、実伝送線路が図１で示した伝送線路５として使用される場合には、Ｚｏｕｔとし、実伝送線路が伝送線路８として使用される場合には、（（Ｚｏｕｔ）２／２）１／２とする。 Note that the characteristic impedance of the actual transmission line composed of the transmission lines 21 to 23 is that the impedance of the load connected to the output terminal of the power amplifying apparatus 10 is Zout. when used as a line 5, and Zout, when the actual transmission line is used as a transmission line 8, and 1/2 ((Zout) 2/2 ).
　また、図２および図３では、ネジ穴３１および３２はプリント基板１１に設けられ、スリット４１および４２がプリント基板１２に設けられていたが、ネジ穴３１および３２がプリント基板１２に設けられ、スリット４１および４２がプリント基板１１に設けられてもよい。この場合、スリット４１および４２は、伝送線路２１および２２に沿って設けられる。 2 and 3, the screw holes 31 and 32 are provided in the printed board 11, and the slits 41 and 42 are provided in the printed board 12. However, the screw holes 31 and 32 are provided in the printed board 12. Slits 41 and 42 may be provided in the printed circuit board 11. In this case, the slits 41 and 42 are provided along the transmission lines 21 and 22.
　さらに、図４に示すように、プリント基板１１の伝送線路２１と伝送線路２２が形成された面とは反対側の面には、グランドパターン６１が形成され、プリント基板１２の伝送線路２３が形成された面とは反対側の面には、グランドパターン６２が形成されている。グランドパターン６１および６２は、ネジ５１および５２を介して互いに導通している。 Further, as shown in FIG. 4, a ground pattern 61 is formed on the surface of the printed circuit board 11 opposite to the surface on which the transmission line 21 and the transmission line 22 are formed, and the transmission line 23 of the printed circuit board 12 is formed. A ground pattern 62 is formed on the surface opposite to the formed surface. The ground patterns 61 and 62 are electrically connected to each other via screws 51 and 52.
　以上のような電力増幅装置１０では、電力増幅装置１０に入力される入力信号であるＲＦ信号の周波数が変更された際には、ネジ５１および５２を緩め、プリント基板１２をスライドさせることで、ＲＦ信号の周波数に応じて、伝送線路２１～２３で形成される実伝送線路の電気長がＲＦ信号の１／４波長になるように、伝送線路２３が伝送線路２１および２２と接触する接触長さを調整することで、電力増幅装置１０の効率を向上させることが可能になる。 In the power amplifying device 10 as described above, when the frequency of the RF signal that is an input signal input to the power amplifying device 10 is changed, the screws 51 and 52 are loosened and the printed circuit board 12 is slid, The contact length at which the transmission line 23 is in contact with the transmission lines 21 and 22 so that the electrical length of the actual transmission line formed by the transmission lines 21 to 23 becomes a quarter wavelength of the RF signal according to the frequency of the RF signal. By adjusting the height, the efficiency of the power amplifying apparatus 10 can be improved.
　以上説明したように本実施形態によれば、伝送線路２３が伝送線路２１および２２と接触する接触長さを調整することで、実伝送線路の電気長を調整することが可能になる。このため、数多くの伝送線路などを設けなくても、伝送線路の電気長を細やかに調整することが可能になる。 As described above, according to the present embodiment, the electrical length of the actual transmission line can be adjusted by adjusting the contact length at which the transmission line 23 contacts the transmission lines 21 and 22. For this reason, it is possible to finely adjust the electrical length of the transmission line without providing many transmission lines.
　次に第２の実施形態について説明する。 Next, a second embodiment will be described.
　図５は、本実施形態の電力増幅装置の構成を示す斜視図であり、図６は、本実施形態の電力増幅装置の構成を示す縦断面図である。 FIG. 5 is a perspective view showing the configuration of the power amplifying apparatus of the present embodiment, and FIG. 6 is a longitudinal sectional view showing the configuration of the power amplifying apparatus of the present embodiment.
　図５および図６に示す電力増幅装置７０は、図２～図４に示した電力増幅装置１０と比べて、グランドパターン６１および６２が除かれ、その代わりに、プリント基板１１および１２の両方から離れた位置にグランドプレーン７１を備えている点が異なる。なお、伝送線路２１～２３のインピーダンスは、グランドプレーン７１が実際のグランドとして見立てて設計される。 The power amplifying apparatus 70 shown in FIGS. 5 and 6 is different from the power amplifying apparatus 10 shown in FIGS. 2 to 4 in that the ground patterns 61 and 62 are removed, and instead, from both the printed boards 11 and 12. The difference is that a ground plane 71 is provided at a distant position. The impedance of the transmission lines 21 to 23 is designed with the ground plane 71 as an actual ground.
　本実施形態によれば、伝送線路２１～２３のグランドがプリント基板１１および１２上ではなく、プリント基板１１および１２から離れたグランドプレーン７１を用いて構成することが可能になり、グランド領域を大きくすることが可能になる。したがって、より動作を安定化させることが可能になり、さらには、より大きな電力を使用することが可能になる。 According to the present embodiment, the ground of the transmission lines 21 to 23 can be configured using the ground plane 71 separated from the printed boards 11 and 12 instead of on the printed boards 11 and 12, and the ground area can be increased. It becomes possible to do. Therefore, the operation can be further stabilized, and more electric power can be used.
　次に第３の実施形態について説明する。 Next, a third embodiment will be described.
　図７は、本実施形態の電力増幅装置の構成を示す斜視図である。図７に示す電力増幅装置８０は、図２～図４に示した電力増幅装置１０と比べて、プリント基板１１および１２のそれぞれの両面に形成されたグランドパターンを有する点で異なる。具体的には、図７に示す電力増幅装置８０は、図２～図４に示した電力増幅装置１０と比べて、グランドパターン８１～８４をさらに備える点で異なる。なお、図面を見やすくするために図７には示していないが、グランドパターン６１および６２は図４で示したように形成されている。 FIG. 7 is a perspective view showing the configuration of the power amplifying apparatus of the present embodiment. The power amplifying device 80 shown in FIG. 7 is different from the power amplifying device 10 shown in FIGS. 2 to 4 in that it has ground patterns formed on both surfaces of the printed boards 11 and 12. Specifically, the power amplifying device 80 shown in FIG. 7 is different from the power amplifying device 10 shown in FIGS. 2 to 4 in that ground patterns 81 to 84 are further provided. Although not shown in FIG. 7 for easy viewing of the drawing, the ground patterns 61 and 62 are formed as shown in FIG.
　グランドパターン８１および８２は、プリント基板１１における伝送線路２１および２２が形成された面に形成される。グランドパターン８１は、ネジ穴３１が形成された領域を含み、グランドパターン８２は、ネジ穴３２が形成された領域を含む。これにより、グランドパターン８１および８２のそれぞれは、ネジ穴３１および３２を介してグランドパターン６１と導通される。 The ground patterns 81 and 82 are formed on the surface of the printed circuit board 11 on which the transmission lines 21 and 22 are formed. The ground pattern 81 includes a region where the screw hole 31 is formed, and the ground pattern 82 includes a region where the screw hole 32 is formed. Thereby, the ground patterns 81 and 82 are electrically connected to the ground pattern 61 through the screw holes 31 and 32, respectively.
　グランドパターン８３および８４は、プリント基板１２における伝送線路２３が形成された面に形成される。グランドパターン８３は、スリット４１が形成された領域を含み、グランドパターン８４は、スリット４２が形成された領域を含む。これにより、グランドパターン８３および８４のそれぞれは、スリット４１および４２を介してグランドパターン６２と導通される。 The ground patterns 83 and 84 are formed on the surface of the printed circuit board 12 on which the transmission line 23 is formed. The ground pattern 83 includes a region where the slit 41 is formed, and the ground pattern 84 includes a region where the slit 42 is formed. Thereby, each of the ground patterns 83 and 84 is electrically connected to the ground pattern 62 via the slits 41 and 42.
　なお、本実施形態では、ネジ穴３１および３２とスリット４１および４２を、グランドパターン同士を導通させるスルーホールとして用いていたが、スルーホールは、ネジ穴３１および３２とスリット４１および４２とは別に形成されてもよい。 In this embodiment, the screw holes 31 and 32 and the slits 41 and 42 are used as through holes for conducting the ground patterns. However, the through holes are separate from the screw holes 31 and 32 and the slits 41 and 42. It may be formed.
　以上説明したように本実施形態によれば、第１の実施形態と比べて、グランド領域を大きくすることが可能になるので、より動作を安定化させることが可能になり、さらにはより大きな電力を使用することが可能になる。 As described above, according to the present embodiment, the ground region can be increased compared to the first embodiment, so that the operation can be further stabilized, and more power is required. Can be used.
　以上説明した各実施形態において、図示した構成は単なる一例であって、本発明はその構成に限定されるものではない。 In each of the embodiments described above, the illustrated configuration is merely an example, and the present invention is not limited to the configuration.
　例えば、電力増幅装置１０、７０または８０を備えた通信装置も本発明の実施形態である。 For example, a communication device provided with the power amplifying device 10, 70 or 80 is also an embodiment of the present invention.
　また、プリント基板１１における伝送線路２１および２２が形成された面とは反対側の面、または、プリント基板１２における伝送線路２３が形成された面とは反対側の面を、金属片や樹脂で押圧することで、伝送線路２１および２２と伝送線路２３とをより強く接触させてもよい。この場合、電力増幅装置１０、７０および８０をより長期的に安定して使用することが可能になる。 Further, the surface of the printed circuit board 11 opposite to the surface on which the transmission lines 21 and 22 are formed or the surface of the printed circuit board 12 opposite to the surface on which the transmission line 23 is formed is made of a metal piece or resin. The transmission lines 21 and 22 and the transmission line 23 may be brought into stronger contact by pressing. In this case, the power amplifying devices 10, 70 and 80 can be used stably over a longer period.
　１０、７０、８０　　電力増幅装置
　１１、１２　　プリント基板
　２１～２３　　伝送線路
　３１、３２　　ネジ穴
　４１，４２　　スリット
　５１、５２　　ネジ
　６１、６２、８１～８４　　グランドパターン
　７１　　グランドプレーン 10, 70, 80 Power amplification device 11, 12 Printed circuit board 21-23 Transmission line 31, 32 Screw hole 41, 42 Slit 51, 52 Screw 61, 62, 81-84 Ground pattern 71 Ground plane

Claims (7)

  1. 　第１の伝送線路および第２の伝送線路が同一の面に形成された第１のプリント基板と、
    　第３の伝送線路が形成された第２のプリント基板と、
    　前記第３の伝送線路が前記第１の伝送線路および前記第２の伝送線路の両方と接触し、当該接触する接触長さが調整可能なように、前記第１のプリント基板および前記第２のプリント基板を互いに固定する固定機構と、を備えた電力増幅装置。     A first printed circuit board in which the first transmission line and the second transmission line are formed on the same surface;
    A second printed circuit board on which a third transmission line is formed;
    The first printed circuit board and the second transmission line are adjusted so that the third transmission line is in contact with both the first transmission line and the second transmission line and the contact length of the contact is adjustable. A power amplifying device comprising: a fixing mechanism that fixes the printed circuit boards to each other.
  2. 　前記第１の伝送線路および前記第２の伝送線路は、対向する直線形状の伝送線路であり、
    　前記第３の伝送線路は、両端のそれぞれを有する端部部分が直線形状を成し、各端部部分が対向する伝送線路であり、
    　前記固定機構は、前記端部部分の一方が前記第１の伝送線路と接触し、前記端部部分の他方が前記第２の伝送線路と接触するように、前記第１のプリント基板および前記第２のプリント基板を互いに固定する、請求項１に記載の電力増幅装置。     The first transmission line and the second transmission line are opposed linear transmission lines,
    The third transmission line is a transmission line in which end portions each having both ends form a linear shape and each end portion is opposed to each other,
    The fixing mechanism includes the first printed circuit board and the first printed circuit board so that one of the end portions is in contact with the first transmission line and the other of the end portions is in contact with the second transmission line. The power amplification device according to claim 1, wherein the two printed circuit boards are fixed to each other.
  3. 　前記固定機構は、
    　前記第１のプリント基板および前記第２のプリント基板の一方に設けられたネジ穴と、
    　前記第１のプリント基板および前記第２のプリント基板の他方に、前記第１の伝送線路および前記第２の伝送線路、または、前記端部部分に沿って設けられたスリットと、
    　前記ネジ穴および前記スリットに挿通されたネジと、を備える請求項２に記載の電力増幅装置。     The fixing mechanism is
    A screw hole provided in one of the first printed circuit board and the second printed circuit board;
    On the other of the first printed circuit board and the second printed circuit board, the first transmission line and the second transmission line, or a slit provided along the end portion,
    The power amplifying apparatus according to claim 2, further comprising a screw inserted through the screw hole and the slit.
  4. 　前記第１のプリント基板における前記第１の伝送線路および前記第２の伝送線路が形成された面とは反対側の面と、前記第２のプリント基板における前記第３の伝送線路が形成された面とは反対側の面とのそれぞれに形成されたグランドパターンをさらに備える請求項１ないし３のいずれか１項に記載の電力増幅装置。 The surface of the first printed circuit board opposite to the surface on which the first transmission line and the second transmission line are formed, and the third transmission line of the second printed circuit board are formed. The power amplification device according to any one of claims 1 to 3, further comprising a ground pattern formed on each of a surface opposite to the surface.
  5. 　前記第１のプリント基板および前記第２のプリント基板の両方から離れた位置に形成されたグランドプレーンをさらに備える請求項１ないし３のいずれか１項に記載の電力増幅装置。 The power amplifying apparatus according to any one of claims 1 to 3, further comprising a ground plane formed at a position away from both the first printed circuit board and the second printed circuit board.
  6. 　前記第１のプリント基板の両面と、前記第２のプリント基板の両面とに形成されたグランドパターンと、
    　前記第１のプリント基板および前記第２のプリント基板のそれぞれに形成されたスルーホールと、をさらに備え、
    　前記第１のプリント基板の両面に設けられたグランドパターンは、前記第１のプリント基板に設けられたスルーホールを介して互いに導通し、
    　前記第２のプリント基板の両面に設けられたグランドパターンは、前記第２のプリント基板に設けられたスルーホールを介して互いに導通される、請求項１ないし３のいずれか１項に記載の電力増幅装置。     A ground pattern formed on both surfaces of the first printed circuit board and both surfaces of the second printed circuit board;
    A through hole formed in each of the first printed circuit board and the second printed circuit board; and
    The ground patterns provided on both sides of the first printed circuit board are electrically connected to each other through through holes provided in the first printed circuit board.
    4. The power according to claim 1, wherein the ground patterns provided on both surfaces of the second printed circuit board are electrically connected to each other through through holes provided in the second printed circuit board. 5. Amplification equipment.
  7. 　請求項１ないし６のいずれか１項に記載の電力増幅装置を備えた通信装置。 A communication device comprising the power amplification device according to any one of claims 1 to 6.
PCT/JP2013/058320 2013-03-22 2013-03-22 Power amplification device and communications device WO2014147823A1 (en)

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
EP4255128A1 (en) * 2022-03-30 2023-10-04 Beijing Xiaomi Mobile Software Co., Ltd. Circuit board, circuit board assembly and electronic device

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JPS5133386B1 (en) * 1970-11-06 1976-09-18
JPH0514004A (en) * 1991-07-03 1993-01-22 Fujitsu Ltd Phase adjustment circuit

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JPS6083401A (en) * 1983-10-13 1985-05-11 Matsushita Electric Ind Co Ltd Microwave circuit

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JPS5133386B1 (en) * 1970-11-06 1976-09-18
JPH0514004A (en) * 1991-07-03 1993-01-22 Fujitsu Ltd Phase adjustment circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4255128A1 (en) * 2022-03-30 2023-10-04 Beijing Xiaomi Mobile Software Co., Ltd. Circuit board, circuit board assembly and electronic device
US12096559B2 (en) 2022-03-30 2024-09-17 Beijing Xiaomi Mobile Software Co., Ltd. Circuit board, circuit board assembly and electronic device

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